Power module package including pin holders and electrical pins

Abstract

An insulated, compact, and high-voltage power module package is provided. The power module can include a substrate, a plurality of pin holders, at least one bare semiconductor die, and a housing. The substrate can include a conductive topside. The plurality of pin holders can be conductively coupled to the conductive topside of the substrate. Further, each of the plurality of pin holders can be configured to accept an electrical pin in an interference fit connection. The at least one bare semiconductor die can be conductively coupled to the conductive topside of the substrate. The housing can at least partially enclose each of the substrate, the plurality of pin holders, and the at least one bare semiconductor die.

Description

POWER MODULE PACKAGETECHNICAL FIELD

[0001] The present disclosure is directed to a power module package, and more particularly it is directed to an insulated, compact, and high-voltage power module package.BACKGROUND

[0002] Power module packages provide an assembly including the physical containment portion (i.e., the housing) and the power or electrical components (usually power semiconductor devices) within a single assembly. The power semiconductor devices, also referred to as dies, are usually soldered on a conductive substrate that is utilized to transfer the power as well as provide thermal dissipation and electrical insulation. Power module packages are desirable components because they are more reliable and include higher power density, compared to traditional singular power (discrete) semiconductors. Power module packages can be used for a variety of purposes, such as power conversion equipment for motor drives, welding equipment, and inverters for wind turbines, solar power panels, and electric vehicles (EVs), among other uses not specifically listed.

[0003] The manufacturers of power module packages aim to produce improved power module packages including compact packaging, improved electronic performance, and decreased manufacturing costs.SUMMARY

[0004] According to an aspect, the present disclosure is directed to a power module package. The power module can include a substrate, a plurality of pin holders, at least one bare semiconductor die, and a housing. The substrate can include a topside conductor. The plurality of pin holders can be conductively coupled to the topside conductor of the substrate. Each of the plurality of pin holders can be configured to accept an electrical pin in an interference fit connection. Each of the at least one baresemiconductor dies can be conductively coupled to the topside conductor of the substrate. The housing can at least partially enclose each of the substrate, the plurality of pin holders, and the at least one bare semiconductor die.

[0005] In one aspect, at least one passive electronic device can be conductively coupled to the topside conductor of the substrate, with the housing fully enclosing the at least one passive electronic device.

[0006] In one aspect, the at least one passive electronic device is at least one of a capacitor, a resistor, a thermistor, or a shunt.

[0007] In one aspect, the substrate further includes a metallic base layer and an intermediate layer positioned between the metallic base layer and the topside conductor.

[0008] In one aspect, the topside conductor is constructed from a metallic material such as copper; the metallic base layer is constructed from copper or aluminum; and the intermediate layer is an insulating layer constructed from alumina, ceramic, or other composite or polymeric materials.

[0009] In one aspect, each of the plurality of pin holders and the at least one bare semiconductor die are at least one of soldered, brazed, or sintered to the topside conductor of the substrate.

[0010] In one aspect, an axial end face of each of the plurality of pin holders extend through an outer surface of the housing.

[0011] In one aspect, a portion of the substrate extends through an outer surface of the housing.

[0012] In one aspect, the housing includes at least one aperture extending through the housing that is adapted to receive a fastener.

[0013] In one aspect, the at least one bare semiconductor die comprises a plurality of bare semiconductor dies each conductively coupled to the topside conductor of the substrate.

[0014] In one aspect, each of the plurality of pin holders include a wall defining a generally cylindrical axial opening extending fully therethrough; each of the electrical pins include a generally rectangular cross-section; and the interference fit is between the generally rectangular cross-section of the electrical pins and the wall of the generallycylindrical axial opening of the pin holders. The electrical pins could also have other polygonal cross-sections.

[0015] In one aspect, an inner diameter of the generally cylindrical axial opening of each of the plurality of pin holders is less than a diagonal distance between corners of the generally rectangular cross-section of each of the electrical pins.

[0016] In one aspect, the housing is constructed from an epoxy resin.

[0017] In one aspect, each of the plurality of pin holders comprise an electrically conductive sleeve terminal including a tubular shape and a generally cylindrical axial opening.

[0018] In one aspect, each of the plurality of pin holders are constructed from a copper alloy.

[0019] In one aspect, each of the plurality of pin holders include a collar at each axial end, the collars having a greater diameter than an intermediate region extending between the collars, and the collar at a first end of each of the plurality of pin holders is located at an outer surface of the housing.

[0020] In one aspect, the electrical pins connected to the pin holders are configured to be inserted through and coupled to a printed circuit board.

[0021] According to another aspect, the present disclosure is directed to a method of constructing a power module. The method can include providing a substrate including a topside conductor; at least one of soldering, brazing, or sintering at least one bare semiconductor die to the topside conductor of the substrate; at least one of soldering, brazing, or sintering a plurality of pin holders to the topside conductor of the substrate; molding a housing around the substrate, the at least one bare semiconductor die, and each of the plurality of pin holders, such that the housing at least partially encloses each of the substrate, the plurality of pin holders, and the at least one bare semiconductor die; and inserting and press-fitting an electrical pin into an axial end of at least some of the plurality of pin holders extending through an outer surface of the housing.

[0022] In one aspect, the method further includes at least one of soldering, brazing, or sintering a passive electronic device to the topside conductor of the substrate before molding the housing.

[0023] In one aspect, after molding the housing around the substrate, a portion of the substrate extends through the outer surface of the housing.

[0024] In one aspect, the molding is a double sided film assisted transfer molding process.

[0025] In one aspect, the housing is molded from an epoxy resin.BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The foregoing Summary as well as the following Detailed Description will be best understood when read in conjunction with the appended drawings, which illustrate a preferred embodiment of the disclosure. In the drawings:

[0027] FIG. 1 is a perspective view of an exemplary embodiment of a power module of the present disclosure.

[0028] FIG. 2A is a bottom view of the power module of FIG. 1.

[0029] FIG. 2B is a top view of the power module of FIG. 1.

[0030] FIG. 2C is a side view of the power module of FIG. 1.

[0031] FIG. 3 is a perspective view of a housing of the power module separated from a substrate of the power module.

[0032] FIG. 4 is a perspective view of the power module with the housing removed or hidden.

[0033] FIG. 5A is a side view of a first embodiment of the substrate of the power module with the housing removed or hidden.

[0034] FIG. 5B is a side view of a second embodiment of the substrate of the power module with the housing removed or hidden.

[0035] FIG. 6 is a perspective view of the power module including a plurality of pins.

[0036] FIG. 7 is a perspective view of the power module including a plurality of pins with the housing removed or hidden.

[0037] FIG. 8A is a cross-section view of the power module with the housing removed or hidden, taken along Section 8A-8A in FIG. 7.

[0038] FIG. 8B is a magnified detail view of a portion of a pin holder and a pin, as indicated in FIG. 8A.

[0039] FIG. 8C is a cross-section view of the pin holder and the pin, taken along Section 8C-8C in FIG. 8B.

[0040] FIG. 9A is a perspective view of the power module including pins having first ends inserted in the pin holders and second ends coupled to a printed circuit board.

[0041] FIG. 9B is a side view of the power module including pins coupled to the printed circuit board.

[0042] FIG. 10 is a flowchart illustrating the steps of a method of producing the power module of FIG. 1.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] Certain terminology is used in the following description for convenience only and is not limiting. The words “front”, “rear”, “upper”, and “lower” designate directions in the drawings to which reference is made. The words “inwardly” and “outwardly” refer to directions towards and away from parts referenced in the drawings. “Axially” refers to a direction along the axis of a shaft, pin, cylindrically shaped object, or other similar feature. A reference to a list of items that are cited as “at least one of a, b, or c” (where a, b, and c represent the items being listed) means any single one of the items a, b, or c, or combinations thereof are included. The words “generally” and “about” include deviations of + / - 10% of a noted value or from the path defined by an indicated shape. The terminology includes the words specifically noted above, derivatives thereof and words of similar import.

[0044] FIG. 1 is a perspective view of an exemplary embodiment of a power module10 of the present disclosure. FIG. 2A is a bottom view of the power module 10. FIG. 2B is a top view of the power module 10. FIG. 2C is a side view of the power module 10. FIG. 3 is a perspective view of the power module 10 with a housing 12 shown separated from a substrate 14 of the power module 10. FIGS. 1-3 will be discussed together.

[0045] As illustrated, in some examples, the power module 10 can have a generally rectangular shape and the power module 10 can have an overall relatively thinner height or thickness relative to the width and length of the power module 10. In other examples, the power module 10 can include a shape other than a generally rectangular shape. The power module 10 can include a housing 12 and a substrate 14. The housing12 can be the component of the power module 10 that is configured to at least partially encompass the other components of the power module 10, protecting the components from debris and other environmental hazards that can adversely affect the electrical components of the power module 10. In some examples, the housing 12 can generally be a sealed component, preventing dust, water, and other debris from entering the housing 12.

[0046] Further, in some examples, the housing 12 can be constructed, preferably cast or molded, from an epoxy resin, polymeric material, metallic material, or other comparable material, discussed further below. The housing 12 can include at least one aperture 16 extending fully through the housing 12. In the illustrated example, the housing 12 includes two apertures 16 extending through the housing 12. In other examples, the housing 12 can include more or less than two apertures 16 extending through the housing 12. Further, in an example including two apertures 16, one aperture 16 can be positioned near an end in the lengthwise direction of the housing 12 generally centered in the widthwise direction of the housing 12. The other of the two apertures 16 can be positioned at a same or similar location at an opposed end in the lengthwise direction of the housing 12. Each of the apertures 16 of the housing 12 can be configured to receive a fastener for securing the power module 10 to the desired external device or assembly. In some examples, the apertures 16 can be circular apertures, while in other examples the apertures 16 be non-circular apertures or through holes.

[0047] The substrate 14 can be positioned at least partially within the housing 12 of the power module 10, such that the housing 12 at least partially encloses the substrate 14. More specifically, the housing 12 can surround, cover, or encompass the top surface of the substrate 14 and all four side surfaces of the substrate 14, with respect to the orientation illustrated in FIG. 1. Further, as illustrated in FIG. 2A, the bottom surface 14A of the substrate 14 extends through an outer surface of the housing 12 or is otherwise exposed, such that the housing 12 does not surround, cover, or encompass the bottom surface 14A of the substrate 14. In some examples, as illustrated, the exposed bottom surface 14A of the substrate 14 can have an exposed rectangular shape positioned within the perimeter of the housing 12. In other examples, the exposedbottom surface 14A of the substrate 14 can have a shape other than rectangular. The exposed bottom surface 14A of the substrate 14 is configured for heat dissipation. In other words, the exposed bottom surface 14A is adapted to transfer heat away from the substrate 14, housing 12, and other components positioned within the housing 12.

[0048] Referring now to FIGS. 1, 2B, and 3, a plurality of pin holders 18 can be coupled to the substrate 14. Further, each of the plurality of pin holders 18 can be at least partially surrounded and enclosed by the housing 12. Specifically, an axial end face of each of the plurality of pin holders 18 can extend through the outer surface of the housing 12. More specifically, the axial end face of each of the plurality of pin holders 18 can extend through the top or upper surface of the housing 12, opposite the surface of the housing 12 in which the bottom surface 14A of the substrate 14 extends through. As such, the axial end face of each of the plurality of pin holders 18 can be exposed on the upper or topside of the housing 12, opposite the exposed bottom surface 14A of the substrate 14. Each of the plurality of pin holders 18 can be configured to accept an electrical pin, discussed further below.

[0049] FIG. 4 is a perspective view of the power module 10 with the housing 12 removed or hidden. Similar to the housing 12, in some examples, the substrate 14 can have a generally rectangular shape. In other examples, the substrate 14 can have another shape other than a generally rectangular shape. The substrate 14 can include a topside conductor 20 coupled to a top surface 14B of the substrate 14, with respect to the orientation illustrated in FIG. 4. The topside conductor 20 can be coupled to the substrate through a bonding process by diffusion or high temperature brazing bonding, among other options not specifically listed. The topside conductor 20 can be constructed from an electrically conductive material, such that the topside conductor 20 can conduct and allow the flow of an electrical current. In some examples, the topside conductor 20 can be constructed from copper, copper alloys, aluminum, or silver. In other examples, the topside conductor 20 can be constructed from a different electrically conductive material. As illustrated, the topside conductor 20 can be offset from and positioned within an outer perimeter of the top surface 14B of the substrate 14.

[0050] Each of the plurality of pin holders 18 can be conductively coupled to the topside conductor 20, such that electrical current can flow between each of the pluralityof pin holders 18 and the topside conductor 20. As such, each of the plurality of pin holders 18 are constructed from an electrically conductive material. In some examples, each of the plurality of pin holders 18 can be constructed from copper, copper alloys, aluminum, or silver. In other examples, each of the plurality of pin holders 18 can be constructed from a different electrically conductive material. Further, each of the plurality of pin holders 18 can be coupled to the topside conductor 20 through at least one of a soldering, brazing, or sintering metal-joining process. The pattern or location of the plurality of pin holders 18 can vary depending on the specific application or device utilizing the power module 10.

[0051] The power module 10 can further include at least one bare semiconductor die 22 conductively coupled to the topside conductor 20, such that electrical current can flow between the at least one bare semiconductor die 22 and the topside conductor 20. The at least one bare semiconductor die 22 can be conductively coupled to the topside conductor 20 through at least one of a soldering, brazing, or sintering metal-joining process. Further, in some examples, the at least one bare semiconductor die 22 can include a plurality of bare semiconductor dies 22 each conductively coupled to the topside conductor 20. In the illustrated example, the power module 10 includes four bare semiconductor dies 22 conductively coupled to the topside conductor 20. In other examples, the power module 10 can include more or less than four bare semiconductor dies 22 conductively coupled to the topside conductor 20. Each of the at least one bare semiconductor dies 22 can comprise a silicon, silicon carbide, or gallium nitride piece with electronic circuits formed on and / or in the silicon, silicon carbide, or gallium nitride piece. Further, these circuits can include transistors, resistors, capacitors, and other active or passive electronic components, depending on the intended application, with conductive paths or pads formed at least on a bottom surface thereof for connection with the topside conductor 20.

[0052] The power module 10 can further include at least one passive electronic device 24 conductively coupled to the topside conductor 20, such that electrical current can flow between the at least one passive electronic device 24 and the topside conductor 20. The at least one passive electronic device 24 can be conductively coupled to the topside conductor 20 through at least one of a soldering, brazing, or sintering metal-joining process. In some examples, the at least one passive electronic device 24 can be at least one of a capacitor, a resistor, a thermistor, or a shunt. The at least one passive electronic device 24 can be positioned within the housing 12, such that the housing 12 fully encloses the at least one passive electronic device 24. Likewise, the at least one bare semiconductor die 22 can be positioned within the housing 12, such that the housing 12 fully encloses the at least one bare semiconductor die 22.

[0053] FIG. 5A is a side view of a first embodiment of the substrate 14 of the power module 10 with the housing 12 removed or hidden. As discussed, each of the plurality of pin holders 18 and the at least one passive electronic device 24 can be coupled to an upper surface of the topside conductor 20, with reference to the orientation illustrated in FIG. 5A. The substrate 14 can also include a metallic base layer 26 and an intermediate layer 28 positioned between the metallic base layer 26 and the topside conductor 20. In the embodiment illustrated in FIG. 5A, the metallic base layer 26 can be a copper base layer and the intermediate layer 28 can be an electrically insulating, for example alumina, layer.

[0054] The first embodiment of the substrate 14 illustrated and discussed with reference to FIG. 5A can be referred to as a Direct Bond Copper (DBC) substrate, which includes a wafer structure made up of two copper layers separated by an insulating alumina or other insulating ceramic compound layer (intermediate layer 28). As illustrated, the insulating alumina layer (intermediate layer 28) includes a greater thickness than the topside conductor 20 and the metallic base layer 26, providing the necessary electrical insulation between the components. In addition, the metallic base layer 26 acts as a base while the topside conductor 20 is etched to realize the electrical connection between the components.

[0055] FIG. 5B is a side view of a second embodiment of the substrate 14 of the power module 10 with the housing 12 removed or hidden. As discussed, each of the plurality of pin holders 18 and the at least one passive electronic device 24 can be coupled to an upper surface of the topside conductor 20, with reference to the orientation illustrated in FIG. 5B. The substrate 14 can also include the metallic base layer 26 and the intermediate layer 28 positioned between the metallic base layer 26 and the topside conductor 20. In the embodiment illustrated in FIG. 5B, the metallic base layer 26 canbe a copper or aluminum base layer and the intermediate layer 28 can be a polymer layer.

[0056] The second embodiment of the substrate 14 illustrated and discussed with reference to FIG. 5B can be referred to as an Insulated Metal Substrate (IMS), which includes a wafer structure made up of a metallic base layer 26 (copper or aluminum), a dielectric insulating polymer (intermediate layer 28), and a copper topside conductor 20. In some examples, the dielectric insulating polymer can include a ceramic filler. The specific thickness of the intermediate layer 28 constructed from a dielectric insulating polymer can vary depending on the specific application. Similar to the first embodiment, the metallic base layer 26 of the second embodiment acts as a base while the topside conductor 20 is etched to realize the electrical connection between the components. Either of the first or second embodiment discussed above can be utilized in the power module 10 of the present disclosure.

[0057] FIG. 6 is a perspective view of the power module 10 including a plurality of electrical pins 30. FIG. 7 is a perspective view of the power module 10 including the plurality of electrical pins 30 with the housing 12 removed or hidden. As illustrated, each of the plurality of pin holders 18 can be configured to accept an electrical pin 30. More specifically, each of the plurality of pin holders 18 can be configured to accept an electrical pin 30 in an interference fit connection, discussed further below. As illustrated in FIGS. 6-7, every one of the plurality of pin holders 18 is adapted to receive and secure an electrical pin 30 of the plurality of electrical pins 30, such that each individual pin holder 18 is fitted with a single electrical pin 30. The end of each of the plurality of electrical pins 30 not fitted within a pin holder 18 is configured to be coupled to an electrical component, discussed further below.

[0058] FIG. 8A is a cross-section view of the power module 10 with the housing 12 removed or hidden, taken along Section 8A-8A in FIG. 7. FIG. 8B is a magnified detail view of a portion of the pin holder 18 and the electrical pin 30, as indicated in FIG. 8A. FIG. 8C is a cross-sectional view of the pin holder 18 and the electrical pin 30, taken along Section 8C-8C in FIG. 8B. FIGS. 8A-8C will be discussed together.

[0059] As illustrated, each of the plurality of pin holders 18 comprise an electrically conductive sleeve terminal including a tubular shape and a generallycylindrical axial opening 32. More specifically, each of the plurality of pin holders 18 can include a wall 34 defining the generally cylindrical axial opening 32 extending fully therethrough. Each of the plurality of pin holders 18 can include a collar 36 at each axial end of the pin holders 18. The collars 36 each have a greater diameter than an intermediate region 38 extending between the collars 36, and the generally cylindrical axial opening 32 has a smaller diameter than the diameter of the intermediate region 38. Further, the collar 36 at a first end of each of the plurality of pin holders 18 is located at or extends outwards from an outer surface of the housing 12, while the collar 36 at a second end of each of the plurality of pin holders 18 is located within the housing 12 and conductively coupled to the topside conductor 20.

[0060] As illustrated best in FIGS. 8B-8C, each of the plurality of pin holders 18 can be configured to accept an electrical pin 30 in an interference fit connection. Specifically, a first end of each of the plurality of electrical pins 30 configured to be inserted into the plurality of pin holders 18 include a generally rectangular cross- sectional shape, while the plurality of pin holders 18 each include a generally circular cross-sectional shaped cylindrical axial opening 32. As such, the interference fit occurs between the generally rectangular cross-section of the electrical pins 30 and the generally circular shaped wall 34 of the cylindrical axial opening 32 of the pin holders 18. To achieve the interference fit between the components, an inner diameter of the generally cylindrical axial opening 32 of each of the plurality of pin holders 18 is less than a diagonal distance between corners of the generally rectangular cross-section of each of the electrical pins 30. The electrical pins could have other polygonal crosssections as well as having external corners defining a diameter that is greater than a diameter of the generally circular cross-section of the pin holders 18.

[0061] Therefore, when each of the plurality of electrical pins 30 are pressed into each of the plurality of pin holders 18, the electrical pins 30 and / or the pin holders 18 slightly deform as the electrical pins 30 are being inserted, creating the interference fit that secures the electrical pins 30 within the pin holders 18. Although FIG. 8C does not illustrate the deformation of the electrical pins 30, it is to be understood that FIG. 8C illustrates the shape before deformation and that the electrical pins 30 and / or the pin holders 18 will deform while the electrical pins 30 are being inserted into the pin holders18. Further, it is to be understood that in some examples the pin holders 18 may deform while the electrical pins 30 are inserted, and the electrical pins 30 may maintain their shape, creating the interference fit. Further, it is to be understood that in some examples both the pin holders 18 and the electrical pins 30 may deform while the electrical pins 30 are inserted into the pin holders 18, creating the interference fit between the components. In any example, it is to be understood that an interference or friction fit is present between the pin holders 18 and the electrical pins 30, securing the components firmly together during operation and use of the power module 10.

[0062] FIG. 9A is a perspective view of the power module 10 including the electrical pins 30 coupled to a printed circuit board 40. FIG. 9B is a side view of the power module 10 including the electrical pins 30 coupled to the printed circuit board 40. FIGS. 9A-9B will be discussed together. As illustrated, when the power module 10 is in use, a first end of each of the electrical pins 30 can be coupled to the pin holders 18, and a second end of each of the electrical pins 30 can be configured to be inserted through and coupled to the printed circuit board 40. More specifically, each of the plurality of electrical pins 30 can be inserted through and coupled to an aperture or electrical connector of the printed circuit board 40, such that electric current can be transferred through the electrical pins 30 to the printed circuit board 40. As such, the electrical pins 30 can be utilized to transfer electric current for use by the printed circuit board 40, and the overall assembly or system that the printed circuit board 40 is assembled within. The power module 10 and the printed circuit board 40 can be utilized for a variety of purposes, such as power conversion equipment for motor drives, welding equipment, and inverters for wind turbines, solar power panels, and electric vehicles (EVs), among other uses not specifically listed.

[0063] FIG. 10 is a flowchart illustrating the steps of a method 100 for constructing or producing the power module 10 illustrated in FIGS. 1-9B. In the illustrated example, the method 100 includes steps 102 — 110, but it is to be understood that the method 100 can include more or less than steps 102 - 110 in other examples. In general, the method 100 describes a molded power module 10 with electrical pins 30 soldered on one side of the substrate 14, without the electrical pins 30 extending through on the other side of the substrate 14. The method 100 does not include soldering theelectrical pins 30 to the pin holders 18, as is done in prior power modules, but rather the electrical pins 30 are press-fit into the pin holders 18 after a molding process has occurred. Using film-assisted transfer molding technology, it is possible to mold the power module 10 while leaving the pin holders 18 open on one side or surface of the power module 10, and the substrate 14 exposed on the other side or surface of the power module 10. Then, after the molding and the curing process, the electrical pins 30 are inserted into the pin holders 18 to create the complete power module 10 package.

[0064] At step 102, the substrate 14 is provided and the substrate 14 includes the topside conductor 20. At step 104, the at least one bare semiconductor die 22 is at least one of soldered, brazed, or sintered to the topside conductor 20 of the substrate 14. At step 106, each of the plurality of pin holders 18 are at least one of soldered, brazed, or sintered to the topside conductor 20 of the substrate 14. At step 108, the housing 12 is molded around the substrate 14, the at least one bare semiconductor die 22, and each of the plurality of pin holders 18, such that the housing 12 at least partially encloses each of the substrate 14, the plurality of pin holders 18, and the at least one bare semiconductor die 22. More specifically, after molding the housing 12 around the substrate 14, a portion of the substrate 14 can extend through the outer surface of the housing 12, such as, for example, through the bottom surface of the housing 12. In some examples, the molding process can be a double sided film-assisted transfer molding process. Further, in some examples, the housing 12 can be molded from an epoxy resin. At step 110 of the method 100, at least some of the electrical pins 30 are inserted and press-fit into an axial end of at least some of the plurality of pin holders 18 extending through an outer surface of the housing 12.

[0065] Although not illustrated, in some examples, the method 100 can further include soldering, brazing, or sintering the passive electronic device 24 to the topside conductor 20 of the substrate 14 before molding the housing 12 and before soldering, brazing, or sintering the plurality of pin holders 18 to the topside conductor 20 of the substrate 14. Further, in such an example, at step 108 the housing 12 is molded around the substrate 14, the at least one bare semiconductor die 22, the (at least one) passive electronic device 24, and each of the plurality of pin holders 18, such that the housing 12 at least partially encloses each of the substrate 14, the plurality of pin holders 18,the at least one bare semiconductor die 22, and the (at least one) passive electronic device 24. In addition, in some examples, the method 100 can further include applying a post molding cure to the molded housing 12 including the substrate 14, the plurality of pin holders 18, the at least one bare semiconductor die 22, and the (at least one) passive electronic device 24. The post molding cure can be utilized to increase (speed up) the curing process and to optimize physical properties of the molded material.

[0066] As discussed, the method 100 includes steps 102 - 110, as disclosed above, but it is to be understood that the method 100 can include more or less than steps 102 - 110 in other examples. Further, the method 100 is a non-limiting example of a method that can be utilized for constructing or producing the power module 10 illustrated in FIGS. 1-9B. It will be appreciated by persons having ordinary skill in the art that other methods can be utilized to construct or produce the power module 10 illustrated in FIGS. 1-9B

[0067] The power module 10 of the present disclosure provides a new power package for high-voltage, molded power modules including insulated substrates. The power module 10 offers an advancement in terms of dimensions, reliability, pin configurability, and assembly robustness at a lower cost, compared to previous power module packages. More specifically, the power module 10 of the present disclosure reduces the size of power packages, maintains configurable pin arrangements with high reliability and robustness, and reduces production cost by utilizing film assisted transfer molding technology, compared to previous power module packages. The aforementioned are only a few of the advantages of the power module 10 of the present disclosure, and it will be appreciated by persons having ordinary skill in the art the many other advantages of the power module 10 not specifically disclosed.

[0068] Having thus described the present embodiments in detail, it is to be appreciated and will be apparent to those skilled in the art that many physical changes, only a few of which are exemplified in the detailed description of the disclosure, could be made without altering the inventive concepts and principles embodied therein. It is also to be appreciated that numerous embodiments incorporating only part of the preferred embodiment are possible which do not alter, with respect to those parts, the inventive concepts and principles embodied therein. The present embodiment andoptional configurations are therefore to be considered in all respects as exemplary and / or illustrative and not restrictive, the scope of the disclosure being indicated by the appended claims rather than by the foregoing description, and all alternate embodiments and changes to this embodiment which come within the meaning and range of equivalency of said claims are therefore to be embraced therein.

Claims

CLAIMSWhat is claimed is:

1. A power module comprising: a substrate including a topside conductor; a plurality of pin holders conductively coupled to the topside conductor of the substrate, each of the plurality of pin holders configured to accept an electrical pin in an interference fit connection; at least one bare semiconductor die conductively coupled to the topside conductor of the substrate; and a housing at least partially encloses each of the substrate, the plurality of pin holders, and the at least one bare semiconductor die.

2. The power module of claim 1, further comprising at least one passive electronic device conductively coupled to the topside conductor of the substrate, wherein the housing fully encloses the at least one passive electronic device.

3. The power module of claim 2, wherein the at least one passive electronic device is at least one of a capacitor, a resistor, a thermistor, or a shunt.

4. The power module of claim 1, wherein the substrate further includes a metallic base layer and an intermediate layer positioned between the metallic base layer and the topside conductor.

5. The power module of claim 4, wherein: the topside conductor is constructed from copper; the metallic base layer is constructed from copper or aluminum; and the intermediate layer is an insulating layer constructed from alumina or polymeric materials.

6. The power module of claim 1, wherein each of the plurality of pin holders and the at least one bare semiconductor die are at least one of soldered, brazed, or sintered to the topside conductor of the substrate.

7. The power module of claim 1, wherein an axial end face of each of the plurality of pin holders extends through an outer surface of the housing.

8. The power module of claim 1, wherein a portion of the substrate extends through an outer surface of the housing.

9. The power module of claim 1, wherein the housing includes at least one aperture extending through the housing that is adapted to receive a fastener.

10. The power module of claim 1, wherein the at least one bare semiconductor die comprises a plurality of bare semiconductor dies each conductively coupled to the topside conductor of the substrate.

11. The power module of claim 1, wherein: each of the plurality of pin holders include a wall defining a generally cylindrical axial opening extending fully therethrough; each of the electrical pins include a generally rectangular cross-section; and the interference fit is between the generally rectangular cross-section of the electrical pins and the wall of the generally cylindrical axial opening of the pin holders.

12. The power module of claim 11, wherein an inner diameter of the generally cylindrical axial opening of each of the plurality of pin holders is less than a diagonal distance between corners of the generally rectangular cross-section of each of the electrical pins.

13. The power module of claim 1, wherein the housing is constructed from an epoxy resin.

14. The power module of claim 1, wherein each of the plurality of pin holders comprise an electrically conductive sleeve terminal including a tubular shape and a generally cylindrical axial opening.

15. The power module of claim 1, wherein each of the plurality of pin holders are constructed from a copper alloy.

16. The power module of claim 1, wherein each of the plurality of pin holders include a collar at each axial end, the collars having a greater diameter than an intermediate region extending between the collars, and the collar at a first end of each of the plurality of pin holders is located at an outer surface of the housing.

17. The power module of claim 1, wherein the electrical pins connected to the pin holders are configured to be inserted through and coupled to a printed circuit board.

18. A method of constructing a power module, the method comprising: providing a substrate including a topside conductor; at least one of soldering, brazing, or sintering at least one bare semiconductor die to the topside conductor of the substrate; at least one of soldering, brazing, or sintering a plurality of pin holders to the topside conductor of the substrate; molding a housing around the substrate, the at least one bare semiconductor die, and each of the plurality of pin holders, such that the housing at least partially encloses each of the substrate, the plurality of pin holders, and the at least one bare semiconductor die; and inserting and press-fitting an electrical pin into an axial end of at least some of the plurality of pin holders that extend to an outer surface of the housing.

19. The method of claim 18, further comprising at least one of soldering, brazing, or sintering a passive electronic device to the topside conductor of the substrate before molding the housing.

20. The method of claim 18, wherein after molding the housing around the substrate, a portion of the substrate extends through the outer surface of the housing.

21. The method of claim 18, wherein the molding is a double sided film assisted transfer molding process.

22. The method of claim 1, wherein the housing is molded from an epoxy resin.

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