Optical module and optical communication device

Abstract

An optical module and an optical communication device. The optical module comprises a housing, and a substrate and devices which are located in the housing, wherein the substrate is fixedly connected to the housing, the plurality of devices are arranged on the substrate, and the devices engage with an inner wall of the housing to transfer operating heat on the device side to the housing side; and at least a housing portion where the housing engages with the devices is provided with a hollow cavity for containing a phase-change working medium, so as to form an integrated two-phase heat-exchange housing. In this way, the heat generated on the device side is conducted to the housing side, the phase-change working medium in the hollow cavity can be heated and vaporized, and then the gaseous working medium carrying heat fills the cavity and comes into contact with a low-temperature side wall face forming the hollow cavity so as to realize rapid condensation. On the basis of the integrated two-phase heat-exchange housing structure, the thermal conductivity efficiency of the housing can be improved, and the temperature equalization capability of the housing of the optical module is enhanced. Overall, the heat dissipation capability of the optical module can be effectively improved.

Description

Optical module and optical communication equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on February 26, 2024, with application number 202420358070.3 and invention name “An optical module and optical communication equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of optical communications, and in particular to an optical module and optical communication equipment. Background Art

[0003] With the rapid development of communication technology and the growing demand for cloud computing, the speed of optical modules is also constantly improving, and is gradually developing towards high power consumption and high density. Good heat dissipation capacity has become one of the important factors affecting the stable operation of optical modules.

[0004] In related technologies, optical modules primarily dissipate heat by contacting the module housing with an external heat sink, creating heat transfer to reduce or control the module housing temperature. Common optical module housing molding processes involve metal die-casting or machined parts. Limited by the intrinsic thermal conductivity of metal, the heat transfer capacity of the optical module housing has a physical limit, making it impossible to effectively transfer heat to the external heat sink (radiator). This causes the optical module to overheat, creating a bottleneck in the development of optical module power increases.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide an optical module and an optical communication device, which improve the heat dissipation capability of the optical module through structural optimization.

[0007] A first aspect of an embodiment of the present application provides an optical module, which includes a housing, a substrate and devices. The substrate and devices are located inside the substrate, which is fixedly connected to the housing. Multiple devices are arranged on the substrate, and the devices are engaged with the inner wall of the housing to exchange the working heat generated on the device side to the housing side; wherein, at least the shell portion where the housing is engaged with the device has a hollow cavity for accommodating a phase change working medium to form an integrated two-phase heat exchange shell.

[0008] During operation, heat generated by the device is transferred to the housing, where the phase-change fluid within the cavity is heated and vaporized. The heat-carrying gas fills the cavity, where it rapidly condenses upon contact with the cool sidewalls of the cavity, entering the next heat-evaporation cycle. This integrated two-phase heat exchange housing structure improves the housing's thermal conductivity and enhances the optical module's ability to maintain uniform temperature. Overall, this effectively enhances the module's heat dissipation capabilities.

[0009] Furthermore, compared to designs that employ a temperature-stabilizing reinforcement layer on the inner wall of the housing, the present embodiment utilizes an integrated two-phase heat exchange shell structure to improve temperature stabilization. This avoids introducing thermal resistance that could affect the actual heat dissipation capacity of the shell, and also prevents the temperature-stabilizing reinforcement layer from occupying internal space and affecting the optimal layout. Furthermore, without the need for welding, bonding, or press-fitting processes, the consistency of batch production is improved.

[0010] Exemplarily, the device is engaged with the inner wall of the upper shell of the optical module housing, and the upper shell of the housing has a hollow cavity. That is, the upper shell is the housing part where the optical module housing is engaged with the device.

[0011] In practical applications, the device can be joined to the inner wall of the housing through a thermal pad or thermal adhesive, so that a close contact is formed between the device and the housing, avoiding the presence of a joint air gap that affects the heat transfer efficiency.

[0012] Based on the first aspect, the present application also provides a first implementation method of the first aspect: a capillary structure is disposed within the hollow cavity, located on the inner surface of the cavity near the device. With this arrangement, as the liquid working fluid in the region of the cavity corresponding to the device is continuously heated, evaporates, and decreases, the capillary structure can rapidly draw the peripheral phase-change working fluid into the region of reduced liquid volume, fully utilizing the phase-change working fluid's ability to absorb latent heat upon vaporization, ensuring maximum heat exchange in this region and further enhancing the temperature uniformity of the optical module housing.

[0013] Illustratively, the capillary structure can be formed on a capillary structure layer, which is then fixed on the inner surface of the cavity near the device side. For example, but not limited to, the capillary structure layer is made of copper and fixed by welding.

[0014] In other exemplary embodiments, the capillary structure may be integrally formed with the inner surface of the cavity.

[0015] Based on the first aspect, or the first embodiment of the first aspect, the present application also provides a second embodiment of the first aspect: a support body is disposed within the hollow cavity, the support body being located between a wall of the hollow cavity proximal to the device and a wall of the hollow cavity distal to the device. This provides effective support between the two opposing walls, allowing the hollow cavity to maintain a volumetric size sufficient for circulating the working fluid, thereby satisfying the functional requirements of circulating the phase-change working fluid.

[0016] In practical applications, multiple supports are provided, each spaced apart within the cavity. This provides effective support within the cavity's width without affecting the flow of the phase-change fluid. This effectively prevents the cavity from collapsing due to forces generated by vacuuming and assembly line operations.

[0017] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, the embodiments of the present application further provide a third embodiment of the first aspect: the width range of the hollow cavity corresponds to the first device among the multiple devices. In actual applications, the power consumption of the first device can be higher than that of the other devices among the multiple devices, or the other devices among the multiple devices have lower heat dissipation requirements and do not need or cannot participate in heat conduction from the housing.

[0018] Thus, for multiple components connected to the housing, the integrated two-phase heat exchange housing rapidly dissipates heat for the first component, while avoiding other components with relatively low power consumption or that do not require rapid heat dissipation. In other words, tailored heat dissipation conditions are provided based on the functional requirements of different components, demonstrating strong adaptability.

[0019] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, the present application also provides a fourth embodiment of the first aspect: there are multiple hollow cavities, and the width range of the hollow cavities is set in a one-to-one correspondence with the devices. In this way, the volume of the cavity is configured according to the differentiated heat dissipation requirements of each device to meet the heat dissipation needs of different devices. For example, but not limited to, by reasonably controlling the volume of each hollow cavity and the configuration of the capillary structure, corresponding heat dissipation capabilities are provided for each device.

[0020] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, the present application also provides a fifth embodiment of the first aspect: there are multiple hollow cavities, with some of the hollow cavities having a width range corresponding to one device, and other hollow cavities having a width range corresponding to at least two devices. This configuration allows for more reasonable configuration of the hollow cavities, reducing process implementation costs while meeting the heat dissipation requirements of different devices.

[0021] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, the embodiment of the present application also provides a sixth embodiment of the first aspect: the inner wall of the housing where the device is joined has a boss, and the second device among the multiple devices is joined to the boss. Exemplarily, the height dimension of the second device is smaller than that of the other devices among the multiple devices. In this way, the boss protruding from the inner wall of the housing is used to establish a fitting relationship with the device. For devices of different heights and sizes arranged on the substrate, the boss can be used to join with the side of the housing to establish a reliable heat exchange path for the device to exchange heat. The heat on each device side can be exchanged to the housing side to the maximum extent, and good heat dissipation capacity is obtained through the integrated two-phase heat exchange shell structure.

[0022] In practical applications, the position and size of the boss structure are determined on the inner wall where the housing and the device meet to accommodate devices of different heights, giving it good adaptability.

[0023] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, the embodiments of the present application further provide a seventh embodiment of the first aspect: the shell portion having the hollow cavity includes an upper wall surface and a lower wall surface, and the upper wall surface and the lower wall surface enclose a hollow cavity. The structure is simple and reliable, and has good manufacturability.

[0024] Based on the seventh embodiment of the first aspect, the present application also provides an eighth embodiment of the first aspect: a first groove is provided on opposite sides of the lower wall and the upper wall, the hollow cavity is formed based on the first groove, and a capillary structure is provided at the bottom of the first groove. This structure is simple and easy to implement. The capillary structure can quickly draw the peripheral phase change medium to the area with reduced liquid volume, fully utilizing the phase change medium's ability to absorb latent heat during vaporization, thereby enhancing the temperature uniformity of the optical module housing.

[0025] Based on the eighth embodiment of the first aspect, the present application also provides a ninth embodiment of the first aspect: a second groove is provided on opposite sides of the upper wall and the lower wall, the second groove on the upper wall communicates with the first groove on the lower wall to form a hollow cavity, and a support body is provided at the bottom of the second groove, the support body abutting against the capillary structure at the bottom of the first groove. In this way, the upper wall is used to form a hollow cavity that meets the heat exchange requirements, and the provision of the support body forms an effective support, so that the hollow cavity maintains a volume size that can form a working medium circulation, meeting the functional requirements of the phase change working medium circulation flow.

[0026] Based on the seventh embodiment of the first aspect, or the eighth embodiment of the first aspect, or the ninth embodiment of the first aspect, the present application also provides a tenth embodiment of the first aspect: the upper wall and the lower wall are made of the same metal material. This can reasonably control processing costs, avoid assembly stress, and ensure product processing accuracy.

[0027] A second aspect of an embodiment of the present application provides an optical communication device, comprising a device chassis and a mainboard disposed within the device chassis, and further comprising the aforementioned optical module, the optical module being connected to the mainboard. In a specific application, the optical module can convert an electrical signal into an optical signal for output, or convert an optical signal into an electrical signal for output, or convert an electrical signal into an optical signal for output, or simultaneously convert an optical signal into an electrical signal for output.

[0028] Exemplarily, the optical communication device may be a server computer, a router, or a switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic diagram showing the principle of a typical optical module heat dissipation structure;

[0030] FIG2 is a schematic diagram showing the principle of another typical optical module heat dissipation structure;

[0031] FIG3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

[0032] FIG4 is a top view showing the positional relationship between the upper housing and the components shown in FIG3 ;

[0033] FIG5 is a side sectional view of the light cross block housing shown in FIG3;

[0034] FIG6 is a schematic structural diagram of an upper housing provided in an embodiment of the present application;

[0035] FIG7 is an exploded schematic diagram of the assembly of the upper housing shown in FIG6 ;

[0036] FIG8 is an exploded view of the upper housing shown in FIG6 formed at another angle;

[0037] FIG9 is a cross-sectional view AA in FIG6;

[0038] FIG10 is a temperature test simulation diagram obtained by testing the embodiment of the present application and the comparative example;

[0039] FIG11 is a schematic structural diagram of another optical module provided in an embodiment of the present application;

[0040] FIG12 is a top view showing the positional relationship between the upper housing and the components shown in FIG11 ;

[0041] FIG13 is a schematic structural diagram of another optical module provided in an embodiment of the present application;

[0042] FIG14 is a schematic structural diagram of an optical communication device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0043] The embodiments of the present application provide a heat dissipation structure for an optical module, which effectively enhances the heat dissipation capability of the optical module by improving the thermal conductivity of the module housing, thereby ensuring efficient and stable operation of the optical module and increasing the service life of the optical module.

[0044] In the prior art, optical modules are important components in the field of optical communications and include an electrical signal interface and an optical signal interface. The electrical signal interface is used to mate with a socket on a circuit board in a communication device, while the optical signal interface is used to connect to an optical fiber. In different application scenarios, the optical module can convert electrical signals input by the electrical signal interface into optical signals output by the optical signal interface, or convert optical signals input by the optical signal interface into electrical signals output by the electrical signal interface, or convert electrical signals input by the electrical signal interface into optical signals output by the optical signal interface, or convert optical signals input by the optical signal interface into electrical signals output by the electrical signal interface, or convert optical signals input by the optical signal interface into electrical signals output by the electrical signal interface.

[0045] In actual scenarios, the demand for high-bandwidth and high-speed data transmission is gradually increasing, and it is necessary to provide good heat dissipation capabilities for optical modules to ensure the stable operation of optical module components.

[0046] Please refer to Figure 1, which is a schematic diagram of the principle of a typical optical module heat dissipation structure. Inside the optical module, the components 50' (A / B / C) on the single board 10' are in contact with the optical module housing 30' through the thermal pad 20' respectively, and the upper part of the housing 30' is connected to the heat sink 40' by crimping; when the optical module is working, the components A / B / C generate heat, which is transferred to the housing 30' through the thermal pad 20', and then transferred from the housing 30' to the side of the heat sink 40' connected to it, and finally dissipated to the ambient heat sink. Based on this heat dissipation structure, the thermal conductivity of the housing 30' directly affects the heat exchange efficiency. The thermal conductivity of the housing 30' is low, and it cannot transfer heat to the heat sink 40' quickly and effectively, causing the components A / B / C to overheat and fail, resulting in damage to the module.

[0047] For example, if the optical module housing is made of die-cast aluminum or die-cast zinc, when the optical module power consumption is less than 10W, the thermal conductivity of the housing 30' can meet the heat dissipation requirements of components A / B / C, thereby ensuring stable and reliable operation of the optical module. For example, if the optical module housing is made of pure copper, when the optical module power consumption is less than 20W, the thermal conductivity of the housing 30' can meet the heat dissipation requirements of components A / B / C, thereby ensuring stable and reliable operation of the optical module. However, if the optical module power consumption exceeds 20W, traditional metal structural components cannot effectively transfer heat, posing a risk of device overheating.

[0048] In addition, due to the limitations of the product's single-board layout, the radiator cannot cover the housing area above device A shown in Figure 1, resulting in poor heat dissipation of device A. The housing also has a poor temperature uniformity effect, and the heat from the device cannot be effectively transferred to the high-efficiency heat dissipation area outside the single board, affecting the overall heat dissipation effect.

[0049] Please refer to Figure 2, which is a schematic diagram of the principle of another typical optical module heat dissipation structure. In order to improve the thermal conductivity of the optical module metal shell, a temperature-averaging strengthening layer 60' is fixed on the inner wall of the optical module shell 30', for example, by welding, bonding or pressing and embedding processes. The components 50' (A / B / C) are respectively fixed to the temperature-averaging strengthening layer 60' through the thermal pads 20'; when the optical module is working, the components A / B / C generate heat, which is transferred to the optical module shell 30' through the thermal pads 20' and the temperature-averaging strengthening layer 60' through a heat transfer path established. The thermal conductivity of the material of the temperature-averaging strengthening layer 60' is greater than the thermal conductivity of the shell material, which can improve the equivalent thermal conductivity of the optical module shell, thereby improving the heat transfer between the shell areas and improving the heat dissipation capacity of the optical module shell.

[0050] However, the use of welding, bonding or pressing and embedding processes will introduce contact or interface thermal resistance between the temperature-uniformizing layer 60′ and the shell 30′, thereby affecting the actual heat dissipation capacity of the shell 30′; at the same time, due to the characteristics of the welding, bonding or pressing and embedding processes, the consistency of batch products cannot be guaranteed.

[0051] Based on this, an embodiment of the present application provides an optical module comprising a housing, a substrate, and a device located within the housing. The substrate is fixedly connected to the housing, the device is disposed on the substrate, and the device engages with the inner wall of the housing to transfer heat generated by the device to the housing. At least the portion of the housing where the housing and the device engage has a hollow cavity for accommodating a phase-change medium, forming an integrated two-phase heat exchange housing.

[0052] This arrangement allows heat from the device to be transferred to the housing, where the phase-change fluid within the cavity is heated and vaporized. The heat-carrying gas fills the cavity and rapidly condenses on contact with the cold sidewalls of the cavity. After condensation, the liquid fluid falls back and enters the next heated vaporization cycle. This integrated two-phase heat exchange housing structure improves the housing's thermal conductivity and enhances the optical module's ability to maintain uniform temperature. Overall, it effectively enhances the module's heat dissipation capabilities.

[0053] Furthermore, compared to designs that employ a thermally-intensified layer on the inner wall of the housing, this embodiment utilizes an integrated two-phase heat exchange shell structure to enhance thermal uniformity. This prevents the introduction of thermal resistance that would affect the housing's actual heat dissipation capacity, and also eliminates the problem of the thermally-intensified layer occupying internal space and affecting the layout of the optical modules. Furthermore, without the need for welding, bonding, or press-fitting processes, the consistency of batch production is improved.

[0054] In order to better understand the technical solutions and technical effects of the present application, without loss of generality, a specific embodiment will be described in detail below with reference to the accompanying drawings and using the upper housing of the optical module as an integrated two-phase heat exchange housing structure.

[0055] Please refer to Figures 3, 4 and 5, where Figure 3 is a structural schematic diagram of an optical module provided in an embodiment of the present application, Figure 4 is a top view of the positional relationship between the upper shell and each component shown in Figure 3, and Figure 5 is a side sectional view of the optical cross block housing shown in Figure 3.

[0056] As shown in Figure 3, the housing 1 of the optical module 10 houses a substrate 2, on which multiple components 3 are mounted. Each component 3 can be the same or different types of energy-consuming and heat-generating devices, such as, but not limited to, optical chips. The specific device type and board layout can be determined based on the overall product design and are not limited in this embodiment. For ease of description, the figure illustrates three components 3 (Component A, Component B, and Component C).

[0057] The housing 1 comprises an upper shell 11, a lower shell 12, a left shell 13, and a right shell 14. The left shell 13 and the right shell 14 are positioned relative to each other between the upper shell 11 and the lower shell 12, forming an inner cavity for assembling the components within the optical module. Each component 3 is bonded to the inner wall of the upper shell 11 via a thermal pad 4 to form a close contact, avoiding any air gap that could affect the heat transfer efficiency between the component and the shell. In a specific implementation, the components 3 can also be bonded to the inner wall of the upper shell 11 using thermally conductive adhesive.

[0058] In a possible implementation, the device 3 can also be directly connected to the inner wall of the upper housing 11 (not shown in the figure), as long as the heat transfer efficiency between the two can be guaranteed. Of course, in other possible implementations, depending on the layout requirements of the optical module, the device 3 can also be connected to the lower housing 12, the left housing 13, or the right housing 14 (not shown in the figure), and the heat generated by the device during operation can also be transferred to the outer shell side. This is not limited in the present embodiment.

[0059] In this embodiment, the upper housing 11, as the portion of the housing that interfaces with the device 3, has a hollow cavity for accommodating the phase-change medium. Its inner wall interfaces with the device 3 for heat exchange, while its outer surface, remote from the device 3, connects to the heat sink 5 for contact heat exchange, dissipating heat to the ambient environment. See Figures 6 and 7 , where Figure 6 is a schematic diagram of the structure of an upper housing according to an embodiment of the present application, and Figure 7 is an exploded view of the upper housing assembly shown in Figure 6 .

[0060] The upper housing 11 includes an upper wall 111 and a lower wall 112. A first groove 1121 is defined on opposite sides of the lower wall 112 and the upper wall 111. The lower wall 112 and the upper wall 111 are assembled and fixed to form a hollow cavity a based on the first groove 1121. The shape of the first groove 1121 is not limited to that shown in FIG. 2 ; it should be understood that the location and shape of the first groove 1121 on the upper housing 11 can be determined based on factors such as external assembly relationships and the layout of components within the optical module.

[0061] The upper wall 111 and lower wall 112 can be formed using a process selected as needed, such as, but not limited to, die-casting, stamping, machining, or forging. After being formed separately, they are welded to form the complete upper housing 11. In this embodiment, the upper wall 111 and lower wall 112 can be made of the same metal material or different metal materials. Using the same material can effectively control processing costs, avoid assembly stress, and ensure product processing accuracy.

[0062] In a specific implementation, an injection port (not shown) can be provided on the upper shell 11. The location of this port can be selected based on the overall structural layout, for example, but not limited to, at the head or tail of the upper shell in the longitudinal direction. After the working fluid is injected through the port, vacuuming and sealing are performed accordingly to form an integrated two-phase heat exchange shell structure.

[0063] In other specific implementations, the groove forming the hollow cavity a can also be provided on the upper wall 111. In other words, the groove is provided on the opposite side of the upper wall 111 and the lower wall 112. Or, optionally, grooves can also be provided on both the upper wall 111 and the lower wall 112. Please also refer to Figure 8, which is an assembly explosion diagram formed at another angle of the upper shell shown in Figure 6. As shown in Figure 8, a second groove 1111 is provided on the upper wall 111. After assembly is completed, a hollow cavity for accommodating a two-phase working medium is formed based on the second groove 1111 on the upper wall 111 and the first groove 1121 on the lower wall 112.

[0064] The second groove 1111 on the upper wall 111 and the first groove 1121 on the lower wall 112 can have the same groove wall profile. After assembly, the groove wall profiles of the two grooves are substantially aligned, which can reduce the difficulty of the process. It is understood that in other possible implementations, the groove wall profiles of the second groove 1111 and the lower first groove 1121 may not be completely identical, as long as they are connected after assembly and form a hollow cavity capable of accommodating two-phase working fluid. This is not limited in the present embodiment.

[0065] In order to further improve the heat exchange capacity of the working medium in the hollow cavity, a capillary structure can be provided on the inner surface of the cavity near the device side of the hollow cavity. Please refer to Figures 7 and 9, wherein Figure 9 is the AA cross-sectional view in Figure 6.

[0066] As shown in Figure 7, the upper housing 11 also includes a capillary structure 113 disposed at the bottom of the first groove 1121, that is, the capillary structure 113 is formed on the bottom wall of the hollow cavity a. With this arrangement, as the liquid working medium in the area corresponding to the device 3 continues to evaporate and decrease due to heat, the capillary structure on the bottom wall of the hollow cavity a can quickly draw the peripheral phase change working medium into the area with reduced liquid volume, fully utilizing the overall heat exchange capacity of the phase change working medium, ensuring maximum heat exchange in this area, and further enhancing the temperature uniformity of the optical module housing.

[0067] In a specific implementation, the capillary structure 113 may be an independently processed capillary structure layer as shown in FIG7 , for example, but not limited to, using copper components of different forms and controlling the sintering temperature to form a layer structure of disordered capillary structures with different porosity and permeability, and then fixed to the bottom of the first groove 1121 of the lower wall 112. In other possible implementations, the capillary structure 113 may also be integrally formed at the bottom of the first groove 1121 of the lower wall 112. It should be understood that any method can be used as long as it can quickly draw the phase change medium to the area with reduced liquid volume, and this embodiment of the present application is not limited thereto.

[0068] Further optionally, in order to make the hollow cavity a maintain the volume size required for the working medium circulation, in a specific implementation, a support body 1112 can be provided in the hollow cavity a. As shown in Figures 8 and 9, a plurality of support bodies 1112 are provided on the upper wall surface 111 and are against the lower wall surface 112; specifically, the support body 1112 is provided at the bottom of the second groove 1111 on the upper wall surface 111 and is against the capillary structure 113 located in the first groove 1121. In other words, the support body 1112 is provided between the wall surface of the hollow cavity a on the side close to the device 3 and the wall surface away from the device 3. Within the width range of the hollow cavity a, each support body 1112 is arranged at intervals in the hollow cavity a, and forms an effective support without affecting the flow of the phase change working medium. The "width range" here refers to the outer contour of the hollow cavity on the shell body to establish a heat exchange area. In different scenarios, based on the setting of the support body 1112, the force generated by vacuuming and the force applied by the assembly line operation can form effective support to prevent the cavity from collapsing.

[0069] In the case where the device 3 is joined to other parts of the housing, such as the lower housing 12, the left housing 13, or the right housing 14, a hollow cavity (not shown) for accommodating the phase change medium can be provided in the corresponding part of the housing to similarly enhance the temperature uniformity of the optical module housing. This is not limited in the present embodiment.

[0070] In other possible implementations, the shell portion of the housing 1 that is not connected to the device 3 may also have a hollow cavity for accommodating the phase change medium, such as but not limited to the left shell or the right shell, to further improve the overall heat exchange capacity.

[0071] For the optical module housing described in Figure 3 of the present embodiment, a temperature uniformity test was conducted using a conventional die-cast zinc alloy housing as a comparative example. The test simulation is shown in Figure 10 . Figure 10 (a) shows a temperature uniformity test simulation of the die-cast zinc alloy housing, and Figure 10 (b) shows a temperature uniformity test simulation of the optical module housing described in Figure 3 .

[0072] As shown in the test data of Figure 10(a), the temperature of the die-cast zinc alloy shell increased by 56.3°C at the head and 73.6°C at the tail, with a head-to-tail temperature difference of 17.3°C. As shown in the test data of Figure 10(b), the shell temperature of the present application solution increased by 69°C at the head and 70.5°C at the tail, with a head-to-tail temperature difference of 1.5°C. The shell surface temperature difference is only about 1 / 10 of that of traditional die-cast zinc.

[0073] In addition, based on the optical module housing provided in the embodiment of the present application, two conventional die-cast zinc materials were used as two groups of comparative examples for device temperature testing. Five samples were tested using the optical module housing described in FIG3 for the first comparative example, and three samples were tested using the optical module housing described in FIG3 for the second comparative example. The power consumption of device A was 10.8W, the power consumption of device B was 4.8W, and the power consumption of device C was 2.75W, and the relevant tests were conducted at the same air volume and ambient temperature. The details are shown in Table 1 below:

[0074] Table 1:

[0075] The test air volume was 12 CFM (cubic feet per minute) and the ambient temperature was 25°C. The data in the table above shows that compared to the temperature of device C in the second comparative example, the device C temperature of sample #1 in group 2 increased by 0.6°C, and the device C temperature of sample #2 in group 2 increased by 1°C. The temperatures of the other samples were significantly lower than those of the corresponding comparative examples. Overall, the average measured device temperature gain was 5.43°C compared to the conventional die-cast housing comparative example.

[0076] In the aforementioned embodiment, as shown in FIG4 , the width of the hollow cavity a covers all devices 3 (device A, device B, and device C) attached to the upper housing 11. In other specific implementations, the width of the hollow cavity a can selectively cover some of the devices attached to the housing. Please refer to FIG11 and FIG12 , where FIG11 is a schematic structural diagram of another optical module provided in an embodiment of the present application, and FIG12 is a top view of the positional relationship between the upper housing and the various devices shown in FIG11 . In order to clearly illustrate the differences and connections between this embodiment and the aforementioned implementation scheme, components or structures with the same functions are indicated in the figures with the same reference numerals.

[0077] As shown in Figures 11 and 12, the power consumption of each device 3 within the housing 1 of the optical module 10 is different, and the heat generated during operation may also be different. For example, device B in the figure is a device with relatively low power consumption. Accordingly, the heat dissipation requirements of device B can be different from those of other devices (devices A and C). In this embodiment, the hollow cavity a provided on the upper housing 11 does not cover the area connected to device B within its width. In this way, for device B that does not need or cannot participate in the heat conduction of the housing, heat dissipation conditions that meet its functional requirements are provided.

[0078] For ease of description, device A and device C are defined as the first device. The width of the hollow cavity a corresponds to the arrangement of devices A and C. In a specific implementation, the hollow cavity a can be constructed with the outer shape shown in Figure 12, so that the phase change medium in the cavity avoids the area where the upper shell 11 and device B are connected. Alternatively, an isolation structure (not shown) can be provided in the hollow cavity a to similarly prevent the internal phase change medium from avoiding the area where the upper shell 11 and device B are connected.

[0079] In addition, in other specific implementations, in order to match the temperature specification differences of the components inside the module, multiple hollow cavities (not shown in the figure) can be formed on the housing. For example, a hollow cavity can be set one-to-one for each component A and component C shown in Figure 12, so as to configure the volume of the middle cavity according to the differentiated heat dissipation requirements of each component to meet the heat dissipation needs of different components. In other possible implementation schemes, a hollow cavity can also be configured for the bonding area with more than two components, that is, a middle cavity can provide heat dissipation for multiple components. This is not limited in the embodiments of the present application.

[0080] Furthermore, to accommodate the varying sizes of the components on substrate 2, the inner wall of upper housing 11, where it interfaces with component 3, can be provided with a boss structure to accommodate components of varying heights. See Figure 13 for a schematic diagram of the structure of another optical module provided in an embodiment of the present application. To clearly illustrate the differences and connections between this embodiment and the aforementioned embodiments, components or structures with the same functionality are indicated with the same reference numerals in the figures.

[0081] As shown in Figure 13, the components 3 within the housing 1 of the optical module 10 have different sizes. For example, component C in the figure is relatively short. In this embodiment, the upper housing 11 has a boss 114 at the junction with component C to facilitate engagement with the short component C.

[0082] For ease of description, device C is defined as the second device. The placement of boss 114 is determined by the size and specifications of the various devices mounted on substrate 2, establishing a reliable heat exchange path for the devices to be heat-dissipated. Furthermore, the inner wall of the housing provides a mating surface compatible with the surface of the device to be heat-dissipated, maximizing heat transfer from each device to the housing. This allows for excellent heat dissipation through the integrated two-phase heat exchange housing structure.

[0083] The present application also provides an optical communication device. See FIG14 , which is a schematic diagram of the structure of the optical communication device provided in the present application. As shown in the figure, the optical communication device 100 includes a device chassis 30 and a mainboard 20 disposed within the device chassis 30. It also includes an optical module 10. The optical module 10 is connected to the mainboard 20 via its electrical signal interface to convert electrical signals into optical signals for output, or to convert optical signals into electrical signals for output, or to convert electrical signals into optical signals for output, and to convert optical signals into electrical signals for output. The optical module can be the optical module described in FIG3 , FIG11 , and FIG13 .

[0084] The improved heat dissipation capability of this optical module provides a technical guarantee for meeting the power requirements of optical modules. In practical applications, this optical communication equipment can be products such as servers, routers, or switches, and is particularly suitable for high-power, highly integrated, and ultra-large-scale data center servers. It is certain that this optoelectronic component can transmit and receive optical signals and convert optical and electrical signals into each other, and can be widely used in the data communication field, including data centers, base stations, 5G, and network applications.

[0085] It should be understood that other functional components of the corresponding optical communication equipment are not the core invention of this application, so they will not be described in detail herein.

[0086] The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An optical module, characterized in that: comprising a housing, and a substrate and a device located in the housing; The substrate is fixedly connected to the shell, a plurality of the devices are arranged on the substrate, and the devices are engaged with the inner wall of the shell; wherein at least the shell portion where the shell and the devices are engaged has a hollow cavity for accommodating the phase change medium.

2. The optical module according to claim 1, wherein A capillary structure is provided in the hollow cavity, and the capillary structure is located on the inner surface of the cavity near the device side.

3. The optical module according to claim 2, wherein: A capillary structure layer is fixedly provided on the inner surface of the cavity, and the capillary structure is formed on the capillary structure layer; or, the capillary structure and the inner surface of the cavity are integrally formed.

4. The optical module according to claim 2, wherein: A support body is provided in the hollow cavity, and the support body is located between a wall surface of the hollow cavity close to the device and a wall surface away from the device.

5. The optical module according to claim 4, wherein: The supporting bodies are provided in plurality, and the plurality of supporting bodies are arranged in the hollow cavity at intervals.

6. The optical module according to any one of claims 1 to 5, characterized in that: The width range of the hollow cavity corresponds to the first device among the plurality of devices.

7. The optical module according to claim 6, wherein: The first device has higher power consumption than other devices in the plurality of devices.

8. The optical module according to any one of claims 1 to 5, characterized in that: There are multiple hollow cavities, and the width ranges of the hollow cavities are arranged in a one-to-one correspondence with the devices.

9. The optical module according to any one of claims 1 to 5, characterized in that: There are multiple hollow cavities, and the width range of some of the hollow cavities is set to correspond to one of the devices, and the width range of another part of the hollow cavities is set to correspond to at least two of the devices.

10. The optical module according to any one of claims 1 to 5, characterized in that: An inner wall of the housing engaging with the components has a boss, and a second component among the plurality of components engages with the boss.

11. The optical module according to claim 10, wherein: The height dimension of the second device is smaller than that of other devices in the plurality of devices.

12. The optical module according to any one of claims 1 to 5, characterized in that: The device is engaged with an inner wall of an upper shell of the housing, which has the hollow cavity.

13. The optical module according to claim 1, wherein: The shell portion having the hollow cavity includes an upper wall surface and a lower wall surface, and the upper wall surface and the lower wall surface enclose and form the hollow cavity.

14. The optical module according to claim 13, wherein: A first groove is provided on the opposite side of the lower wall surface and the upper wall surface. The hollow cavity is formed based on the first groove, and a capillary structure is provided at the bottom of the first groove.

15. The optical module according to claim 14, wherein: A second groove is provided on the opposite side of the upper wall surface and the lower wall surface. The second groove on the upper wall surface is connected to the first groove on the lower wall surface, and a support body is provided at the bottom of the second groove. The support body is against the capillary structure located at the bottom of the first groove.

16. The optical module according to any one of claims 13 to 15, characterized in that: The upper wall surface and the lower wall surface are made of the same metal material.

17. The optical module according to any one of claims 1 to 5, characterized in that: The device is coupled to the inner wall of the housing via a thermal pad.

18. An optical communication device, characterized in that: The optical module comprises a mainboard and the optical module according to any one of claims 1 to 17, wherein the optical module is arranged on the mainboard.

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