Energy storage power supply

Abstract

An energy storage power supply (100), comprising a housing (10), an inverter (20), a first heat sink (30), and a hydrogel layer (40). The housing (10) is provided with an opening (11); the inverter (20) is arranged in the housing (10); the first heat sink (30) is thermally coupled to the inverter (20); and the hydrogel layer (40) is thermally coupled to the first heat sink (30) and seals the opening (11).

Description

Energy storage power supply

[0001] Priority information

[0002] This application claims priority and benefits of patent application No. 2024102322107 filed with the State Intellectual Property Office of China on February 29, 2024, and the entire text of which is incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of energy storage power supplies, and more specifically, to an energy storage power supply. Background Art

[0004] The inverter of an energy storage power supply generates heat during operation, which requires heat dissipation. If air cooling is used for heat dissipation, the housing of the energy storage power supply must be open, which reduces the power supply's protection level. If natural heat dissipation is used, the housing can be made of thermally conductive metal and sealed to improve the power supply's protection level. However, the housing of the energy storage power supply can easily overheat during heat dissipation, posing a risk of burns to the user. Summary of the Invention

[0005] The embodiments of the present application provide an energy storage power supply.

[0006] The energy storage power supply according to the embodiment of the present application includes a housing, an inverter, a first heat sink, and a hydrogel layer. The housing has an opening; the inverter is disposed within the housing; the first heat sink is thermally coupled to the inverter; and the hydrogel layer is thermally coupled to the first heat sink and seals the opening.

[0007] In this way, the housing can be sealed except for the opening, and the opening is sealed with a hydrogel layer, thereby improving the protection level of the energy storage power supply. Heat generated by the inverter during operation can be dissipated from the opening to the outside through the first heat sink and the hydrogel layer, achieving natural heat dissipation. Furthermore, the first heat sink is thermally coupled to the inverter, and the hydrogel layer is directly disposed on and thermally coupled to the first heat sink. This improves thermal conductivity and quickly transfers heat generated by the inverter to the hydrogel layer, thereby improving heat dissipation efficiency.

[0008] In certain embodiments, the thermal conductivity of the housing is less than 3 watts per meter Kelvin.

[0009] In this way, by selecting a material with a thermal conductivity of less than 3 watts per meter Kelvin to make the casing, the casing of the energy storage power supply can be prevented from being overheated during the heat dissipation process, thereby preventing the user from being burned.

[0010] In certain embodiments, the hydrogel layer is disposed on a side of the first heat sink opposite to the inverter.

[0011] In this way, the heat generated by the inverter during operation can be dissipated to the outside through the first heat sink and the hydrogel layer, achieving natural heat dissipation.

[0012] In some embodiments, the housing includes a bottom plate, and the opening is formed in the bottom plate.

[0013] In this way, by opening the bottom plate of the housing, the interior of the energy storage power supply can be connected with the outside world, so that the heat generated by the inverter can be dissipated from the opening.

[0014] In some embodiments, the inverter includes a circuit board and a chip electronic device, the chip electronic device is arranged on the side of the circuit board opposite to the first heat sink, the circuit board is provided with a first through hole, and the chip electronic device is thermally coupled to the first heat sink through the first through hole.

[0015] In this way, by opening a first through hole on the circuit board and passing the chip electronic device included in the inverter through the first through hole to thermally couple with the first heat sink, the heat generated by the chip electronic device during operation can be transferred to the first heat sink, thereby improving the heat dissipation efficiency of the inverter.

[0016] In some embodiments, the inverter includes a transistor outline packaged electronic device, which is arranged on one side of the circuit board, and the first heat sink includes a folded edge corresponding to the transistor outline packaged electronic device, and the transistor outline packaged electronic device is thermally coupled to the folded edge.

[0017] In this way, by arranging the transistor-shaped packaged electronic device included in the inverter on the folded edge of the first heat sink, the heat generated by the transistor-shaped packaged electronic device during operation can be transferred to the first heat sink for dissipation, thereby improving the heat dissipation efficiency of the inverter.

[0018] In some embodiments, the energy storage power supply includes an insulating component, which is arranged between the circuit board and the first heat sink. The insulating component has a second through hole, and the chip electronic device is thermally coupled to the first heat sink through the second through hole.

[0019] In this way, by arranging the insulating component between the circuit board and the first heat sink, a short circuit between the electronic components can be prevented, and a second through hole is provided on the insulating component, so that the patch electronic component can pass through the second through hole to be thermally coupled with the first heat sink, so that the heat generated by the operation of the patch electronic component can be transferred to the first heat sink, thereby improving the heat dissipation efficiency of the inverter.

[0020] In some embodiments, a positioning column is formed on the side of the first heat sink facing away from the inverter, and a limiting groove is formed on the side of the hydrogel layer. The position of the limiting groove corresponds to the position of the positioning column, and the positioning column passes through the limiting groove to fix the hydrogel layer.

[0021] In this way, by fixing the hydrogel on the positioning column on the first radiator, the heat generated by the inverter can be transferred to the hydrogel through the first radiator. After the temperature of the hydrogel rises to the water loss point, the heat is dissipated to the outside through water evaporation.

[0022] In certain embodiments, the energy storage power supply includes louvers, which are detachably disposed at the openings. The hydrogel layer seals the louvers, and the first radiator exchanges heat with the outside through the louvers.

[0023] In this way, by providing the louvers at the openings on the housing, the first radiator can be connected to the outside, thereby improving the heat dissipation efficiency of the first radiator.

[0024] In some embodiments, the housing includes feet, the feet are used to support a support surface, and the louvers are spaced apart from the support surface.

[0025] In this way, by providing feet on the housing, a height difference is formed between the louver and the supporting surface (such as the ground), which can prevent the louver from directly contacting the liquid on the ground and prevent the liquid from entering the energy storage power supply through the louver.

[0026] In certain embodiments, the energy storage power supply includes a battery pack and a thermal insulation member, wherein the thermal insulation member is connected to the first heat sink and is used to isolate the inverter from the battery pack.

[0027] In this way, by providing a heat insulating member between the inverter and the battery pack, it is possible to prevent the heat generated by the inverter during operation from being transferred to the battery pack, thereby avoiding causing the battery pack to heat up and affecting the power generation efficiency of the battery pack.

[0028] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0030] FIG1 is a schematic structural diagram of an energy storage power supply according to certain embodiments of the present application;

[0031] FIG2 is an exploded schematic diagram of an energy storage power supply according to certain embodiments of the present application;

[0032] FIG3 is an exploded schematic diagram of an inverter and a first heat sink according to certain embodiments of the present application;

[0033] FIG4 is an exploded schematic diagram of an energy storage power supply according to certain embodiments of the present application. DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and are not to be construed as limiting the present invention. In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore are not to be construed as limiting the present invention. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise specifically defined.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, removable connections, or integral connections. They may refer to mechanical connections or electrical connections. They may refer to direct connections or indirect connections through an intermediary, and they may refer to internal communication between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0036] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0037] The disclosure herein provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described herein. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0038] Referring to Figures 1 and 2 , an embodiment of the present application provides an energy storage power supply 100. Energy storage power supply 100 includes a housing 10, an inverter 20, a first heat sink 30, and a hydrogel layer 40. Housing 10 defines an opening 11; inverter 20 is disposed within housing 10; first heat sink 30 is thermally coupled to inverter 20; and hydrogel layer 40 is thermally coupled to first heat sink 30 and seals opening 11.

[0039] Thus, with the exception of opening 11, the housing 10 can be sealed, and the hydrogel layer 40 is used to seal opening 11, thereby improving the protection level of the energy storage power supply 100. Heat generated by the inverter 20 during operation can be dissipated from opening 11 to the outside through the first heat sink 30 and the hydrogel layer 40, achieving natural heat dissipation. Furthermore, the first heat sink 30 is thermally coupled to the inverter 20, while the hydrogel layer 40 is directly disposed on and thermally coupled to the first heat sink 30. This improves thermal conductivity, rapidly transferring heat generated by the inverter 20 to the hydrogel layer 40, and further enhancing heat dissipation efficiency.

[0040] The energy storage power supply 100 is a device capable of storing electrical energy. It can be used as a mobile power source, and the inverter 20 provided within the energy storage power supply 100 can adjust the voltage to accommodate loads of varying voltages. During use, the energy storage power supply 100 generates a significant amount of heat within the power supply 100. This heat can cause the components within the power supply 100 to overheat, thereby affecting its operation and, in severe cases, damaging it. Therefore, a heat sink is required within the energy storage power supply 100 to reduce internal heat.

[0041] Specifically, the energy storage power supply 100 includes a housing 10, an inverter 20, a first heat sink 30 and a hydrogel layer 40. The housing 10 can be made of materials such as plastic, which can reduce the weight of the energy storage power supply 100. The housing 10 also includes a top plate 12, a side plate 13 and a bottom plate 14. The top plate 12, the side plate 13 and the bottom plate 14 can form a receiving cavity, and the inverter 20 and the first heat sink 30 can be arranged in the receiving cavity. The material of the top plate 12, the side plate 13 and the bottom plate 14 can be made of a plastic material, or made of a material with a thermal conductivity coefficient of less than 3 watts per meter Kelvin, such as ceramic, styrene board or polyurethane board. In this way, the weight of the energy storage power supply 100 can be reduced, thereby meeting the requirements of lightweight design, avoiding burns to users, and improving the safety of the energy storage power supply 100.

[0042] Among them, the top plate 12, the side plate 13 and the bottom plate 14 can be integrally formed by injection molding, so that the thickness of the top plate 12, the side plate 13 and the bottom plate 14 are uniform and the airtightness is good, while improving the production efficiency, or the top plate 12 and the side plate 13 can be integrally formed by injection molding at the same time to improve the uniformity and continuity of the shell 10.

[0043] An opening 11 is also formed on the housing 10, that is, an opening 11 is also provided on the bottom plate 14. By providing the opening 11 on the bottom plate 14 included in the housing 10, the interior of the energy storage power supply 100 can be connected to the outside world, so that the heat generated by the inverter 20 can be dissipated through the opening 11.

[0044] The inverter 20 can be used to convert the direct current generated by the battery pack 60 into alternating current, and can adjust the voltage of the alternating current to adapt to loads of different voltages.

[0045] The first heat sink 30 may be a heat sink that absorbs heat generated by the inverter 20 and dissipates the heat to reduce the heat of the inverter 20. The first heat sink 30 is formed with a U-shaped groove, so that the inverter 20 can be placed in the U-shaped groove, and the first heat sink 30 can be thermally coupled to the inverter 20.

[0046] For example, the first radiator 30 may be spaced apart from the inverter 20 , and the heat generated by the inverter 20 is transferred to the first radiator 30 through hot air flow, and the first radiator 30 dissipates the heat.

[0047] For another example, the first heat sink 30 and the inverter 20 may be arranged in contact with each other, and the heat generated by the inverter 20 is transferred to the first heat sink 30 by heat conduction, and the first heat sink 30 dissipates the heat.

[0048] The hydrogel layer 40 is disposed on the side of the first heat sink 30 opposite the inverter 20 and can be thermally coupled to the first heat sink 30. For example, the first heat sink 30 and the hydrogel layer 40 can be disposed in contact with each other, with heat from the first heat sink 30 being transferred to the hydrogel layer 40 via thermal conduction, where it dissipates the heat. The hydrogel layer 40 can also seal the opening 11 in the housing 10. As a result, heat generated by the inverter 20 that is transferred to the housing 10 can be absorbed by the hydrogel layer 40, accelerating heat dissipation.

[0049] Please refer to Figure 3. In some embodiments, the inverter 20 includes a circuit board 21 and a chip electronic device 22. The chip electronic device 22 is arranged on the side of the circuit board 21 opposite to the first heat sink 30. The circuit board 21 is provided with a first through hole 211. The chip electronic device 22 is thermally coupled to the first heat sink 30 through the first through hole 211.

[0050] In this way, by opening a first through hole 211 on the circuit board 21 and passing the chip electronic device 22 included in the inverter 20 through the first through hole 211 and thermally coupling it with the first heat sink 30, the heat generated by the chip electronic device 22 during operation can be transferred to the first heat sink 30, thereby improving the heat dissipation efficiency of the inverter 20.

[0051] Specifically, the inverter 20 includes a circuit board 21 and a chip electronic device 22. The circuit board 21 may be a printed circuit board (PCB), which can be used as a support for the chip electronic device 22 and a provider of electrical connections for the chip electronic device 22.

[0052] The chip electronic devices 22 include capacitors, inductors, transformers, and metal-oxide-semiconductor field-effect transistors (MOSFETs), etc., which can regulate and control direct current, that is, realize the conversion between direct current and alternating current.

[0053] The chip electronic device 22 is soldered on the circuit board 21, and the chip electronic device 22 is fixed on the side of the circuit board 21 opposite to the first heat sink 30, and by starting a first through hole 211 on the circuit board 21, the chip electronic device 22 can be thermally coupled with the first heat sink 30 through the first through hole 211.

[0054] For example, the first heat sink 30 may be spaced apart from the chip electronic device 22 , and the heat generated by the chip electronic device 22 is transferred to the first heat sink 30 through hot air flow, and the first heat sink 30 dissipates the heat.

[0055] For another example, the first heat sink 30 can be arranged in contact with the chip electronic device 22. The heat generated by the chip electronic device 22 is transferred to the first heat sink 30 by heat conduction, and the first heat sink 30 dissipates the heat.

[0056] Please refer to Figure 3. In some embodiments, the inverter 20 includes a transistor outline packaged electronic device 23, which is arranged on one side of the circuit board 21. The first heat sink 30 includes a folded edge 31 corresponding to the transistor outline packaged electronic device 23, and the transistor outline packaged electronic device 23 is thermally coupled to the folded edge 31.

[0057] In this way, by arranging the transistor-shaped packaged electronic device 23 included in the inverter 20 on the folded edge 31 of the first heat sink 30, the heat generated during the operation of the transistor-shaped packaged electronic device 23 can be transferred to the first heat sink 30 for dissipation, thereby improving the heat dissipation efficiency of the inverter 20.

[0058] Specifically, the inverter 20 also includes a transistor-shaped packaged electronic device 23, which includes a metal-oxide-semiconductor field-effect transistor (MOSFET), which is soldered on one side of the circuit board 21 through a transistor outline or butterfly package (TO).

[0059] The first heat sink 30 is further provided with a folded edge 31 , which can correspond to the transistor outline package electronic device 23 , so that the transistor outline package electronic device 23 can be thermally coupled to the folded edge 31 .

[0060] For example, the transistor outer shape packaged electronic device 23 can be spaced apart from the folded edge 31 , and the heat generated by the transistor outer shape packaged electronic device 23 is transferred to the folded edge 31 through hot air flow, and the folded edge 31 dissipates the heat.

[0061] For another example, the transistor outer shape packaged electronic device 23 can be arranged in contact with the folded edge 31. The heat generated by the transistor outer shape packaged electronic device 23 is transferred to the folded edge 31 through heat conduction, and the folded edge 31 dissipates the heat.

[0062] Referring to FIG. 3 , in some embodiments, the first heat sink 30 includes a heat dissipation fin 32 located on a side of the folded edge 31 opposite to the TOP electronic device 23 .

[0063] In this way, by providing the heat dissipation fins 32 on the first heat sink 30 , the heat dissipation area of ​​the first heat sink 30 can be increased, thereby improving the heat dissipation efficiency of the inverter 20 .

[0064] Specifically, the first heat sink 30 further includes heat dissipation fins 32 , and the heat dissipation fins 32 are made of a heat-conducting material with a high thermal conductivity coefficient, such as aluminum alloy, copper, or stainless steel.

[0065] The shape of the heat dissipation fins 32 can be rectangular, circular, or elliptical, etc., and there can be multiple heat dissipation fins 32, which is not limited here.

[0066] The heat dissipation fins 32 are arranged on the side of the folded edge 31 opposite to the transistor outer package electronic device 23, so that the heat generated by the transistor outer package electronic device 23 is transferred to the folded edge 31. The heat dissipation fins 32 can increase the heat dissipation area and improve the heat dissipation efficiency.

[0067] Referring to Figures 2 and 3, in some embodiments, the energy storage power supply 100 includes an insulating component 50, which is arranged between the circuit board 21 and the first heat sink 30. The insulating component 50 has a second through hole 51, and the patch electronic device 22 is thermally coupled to the first heat sink 30 through the second through hole 51.

[0068] In this way, by arranging the insulating component 50 between the circuit board 21 and the first heat sink 30, a short circuit between the electronic components can be prevented, and a second through hole 51 is provided on the insulating component 50, so that the patch electronic component 22 can pass through the second through hole 51 to be thermally coupled with the first heat sink 30, so that the heat generated by the operation of the patch electronic component 22 can be transferred to the first heat sink 30, thereby improving the heat dissipation efficiency of the inverter 20.

[0069] Specifically, the energy storage power supply 100 also includes an insulating component 50, which can be an insulating board made of insulating materials such as epoxy resin board, which can be used to isolate the electrical connection between the surface mount electronic devices 22 or the transistor packaged electronic devices 23 to prevent the circuit from short circuiting.

[0070] The insulating component 50 is disposed between the circuit board 21 and the first heat sink 30, and a second through hole 51 is defined in the insulating component 50. It should be noted that the second through hole 51 corresponds to the first through hole 211, so that the chip electronic device 22 is thermally coupled to the first heat sink 30 through the first through hole 211 and the second through hole 51.

[0071] Please refer to Figure 4. In some embodiments, a positioning column 33 is formed on the side of the first heat sink 30 facing away from the inverter 20, and a limiting groove 41 is formed on the side of the hydrogel layer 40. The position of the limiting groove 41 corresponds to the position of the positioning column 33. The positioning column 33 passes through the limiting groove 41 to fix the hydrogel layer 40.

[0072] In this way, by fixing the hydrogel on the positioning column 33 on the first heat sink 30, the heat generated by the inverter 20 can be transferred to the hydrogel layer 40 through the first heat sink 30. After the temperature of the hydrogel layer 40 rises to the water loss point, the heat is dissipated to the outside through water evaporation.

[0073] Specifically, since the heat dissipation area of ​​the first heat sink 30 is limited, the hydrogel layer 40 needs to be fixed on the first heat sink 30 to absorb the heat on the first heat sink 30 .

[0074] A positioning column 33 is formed on a side of the first heat sink 30 facing away from the inverter 20 . There may be a plurality of positioning columns 33 , and the positioning columns 33 can be evenly distributed around the hydrogel layer 40 according to the shape of the hydrogel layer 40 .

[0075] Limiting grooves 41 are formed on the side of the hydrogel layer 40 , the number of the limiting grooves 41 matches the number of the positioning posts 33 , and the positions of the limiting grooves 41 correspond to the positions of the positioning posts 33 , so that the positioning posts 33 can pass through the limiting grooves 41 to fix the hydrogel layer 40 .

[0076] Please refer to FIG. 4 . In some embodiments, the energy storage power supply 100 includes louvers 15 . The louvers 15 are detachably disposed at the opening 11 . The hydrogel layer 40 seals the louvers 15 . The first heat sink 30 exchanges heat with the outside through the louvers 15 .

[0077] In this way, by providing the louvers 15 on the housing 10 , the first heat sink 30 can be connected to the outside, thereby improving the heat dissipation efficiency of the first heat sink 30 .

[0078] Specifically, the energy storage power supply 100 further includes louvers 15 and a hydrogel layer 40. The louvers 15 are disposed at the opening 11 formed in the housing 10 and can be separately connected to the housing 10, thereby facilitating installation and removal of the louvers 15 from the housing 10. The hydrogel layer 40 is disposed between the louvers 15 and the first heat sink 30 and can be used to seal the louvers 15.

[0079] It should be noted that the hydrogel layer 40 can be a gel with a three-dimensional network cross-linked structure, which can be used to store water and facilitate heat exchange with the heat-conducting frame. In addition, the hydrogel layer 40 is a special gel state between liquid and solid, with a high water content. In addition, the specific heat capacity of the hydrogel layer 40 is substantially equal to that of water. Under the same mass and the same temperature increase, it can absorb more heat. The hydrogel layer 40 contains a large number of hydrophilic groups that can form hydrogen bonds with water molecules, which are used to absorb moisture from the external air to compensate for the moisture lost by heat dissipation, ensuring that the hydrogel layer 40 can circulate heat exchange.

[0080] The return water point temperature of the hydrogel layer 40 can be 35°C, or other temperature values, without specific limitation. When the temperature of the hydrogel layer 40 drops to the return water point temperature, the hydrogel layer 40 absorbs moisture from the external air to maintain internal balance, thereby ensuring the hydrogel layer 40 circulates and continuously dissipates heat from the energy storage power supply 100, thereby improving heat dissipation efficiency.

[0081] The dehydration point temperature of the hydrogel layer 40 can be 60°C, or other temperature values, without specific limitation. When the heat transferred by the first heat sink 30 reaches the dehydration point temperature of the hydrogel layer 40, the hydrogel layer 40 absorbs the heat through its internal moisture and discharges the heat as hot air through the opening 11 of the housing 10, thereby lowering the temperature of the first heat sink 30 and reducing the heat of the inverter 20.

[0082] Optionally, the hydrogel layer 40 should have an appropriate thickness to ensure the lightweight nature of the energy storage power supply 100 while improving its heat dissipation efficiency. The thickness of the hydrogel layer 40 can be calculated through thermal simulation. For example, the volume-to-energy ratio of the energy storage power supply 100 can be determined by analyzing the relationship between the thickness of the hydrogel layer 40 and the temperature of the electrical components, thereby determining the optimal thickness of the hydrogel layer 40. The thickness of the hydrogel layer 40 can be selected within a range of [0.8 mm, 2.5 mm].

[0083] For example, the thickness of the hydrogel layer 40 can be 0.8 mm, 0.9 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2.0 mm, 2.5 mm, or other values ​​between 0.8 mm and 2.5 mm. When the thickness of the hydrogel layer 40 is less than 0.8 mm, the hydrogel layer 40 is relatively thin, resulting in less heat absorption from evaporation of water in the hydrogel layer 40, making it difficult to meet heat dissipation requirements. When the thickness of the hydrogel layer 40 is greater than 2.5 mm, the hydrogel layer 40 is relatively thick, resulting in a greater weight of the hydrogel layer 40, thereby increasing the weight of the energy storage power supply 100.

[0084] Optionally, the water content of the hydrogel layer 40 is greater than 70% to ensure the heat exchange efficiency of the first heat sink 30, thereby improving the heat dissipation efficiency of the energy storage power supply 100. The upper limit of the water content of the hydrogel layer 40 can be determined based on empirical values ​​and is not specifically limited here. The water content of the hydrogel layer 40 can be greater than 70%. For example, the water content of the hydrogel layer 40 can be 71%, 73%, 74%, 75%, 78%, 80%, etc.

[0085] Referring to FIG. 1 , in some embodiments, the housing 10 includes feet 16 , which are used to support a support surface, and the louvers 15 are spaced apart from the support surface.

[0086] In this way, by providing the feet 16 on the housing 10, a height difference is formed between the louver 15 and the supporting surface (such as the ground), which can prevent the louver 15 from directly contacting the liquid on the ground and prevent the liquid from entering the energy storage power supply 100 through the louver.

[0087] Specifically, the housing 10 includes a foot 16, which is arranged on the side of the bottom plate 14 away from the accommodating cavity, so that the bottom plate 14 and the support surface are at a certain distance, so that the louver 15 can be spaced apart from the support surface. It should be noted that the support surface can be a plane where the foot 16 contacts the placement surface. For example, the support surface can be the ground, or a tabletop, or other placement surfaces, and no specific restrictions are made here. The foot 16 can be integrally formed by an injection molding process, which is simple to process and saves costs. As shown in the figure, the foot 16 can be a long cylindrical support, or a support of other shapes. It only needs to ensure that the bottom plate 14 and the support surface are spaced apart, and no specific restrictions are made here.

[0088] Please refer to FIG. 2 and FIG. 3 again. In some embodiments, the energy storage power supply 100 includes a battery pack 60 and a heat insulating member 70 . The heat insulating member 70 is connected to the first heat sink 30 to isolate the inverter 20 from the battery pack 60 .

[0089] In this way, by providing a heat insulating member 70 between the inverter 20 and the battery pack 60 , it is possible to prevent the heat generated by the inverter 20 during operation from being transmitted to the battery pack 60 , thereby avoiding causing the battery pack 60 to heat up and affecting the power generation efficiency of the battery pack 60 .

[0090] Specifically, the energy storage power supply 100 further includes a battery pack 60 and a thermal insulation member 70. The battery pack 60 is disposed within the housing 10 of the energy storage power supply 100 and is positioned adjacent to the top plate 12 of the housing 10. The other end of the battery pack 60 can be fixedly connected to the thermal insulation member 70, thereby enabling the thermal insulation member 70 to support the battery pack 60 to generate direct current.

[0091] The thermal insulator 70 is made of a low-thermal-conductivity insulating material. Its shape is compatible with the U-shaped groove of the first heat sink 30, covering the opening of the U-shaped groove. The thermal insulator 70 is positioned between the inverter 20 and the battery pack 60 and is connected to the hem 31 of the first heat sink 30. This prevents heat generated by the inverter 20 from being transferred to the battery pack 60 and affecting its power generation.

[0092] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that specific features, structures, materials, or characteristics described in conjunction with an embodiment or example are included in at least one embodiment or example of the present invention. In this specification, illustrative descriptions of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0093] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. An energy storage power supply, comprising: a housing, the housing being formed with an opening; an inverter, the inverter being disposed in the housing; a first heat sink thermally coupled to the inverter; A hydrogel layer is thermally coupled to the first heat sink and seals the opening.

2. The energy storage power source according to claim 1, wherein the thermal conductivity of the housing is less than 3 watts per meter Kelvin. 3 . The energy storage power supply according to claim 1 , wherein the hydrogel layer is provided on a side of the first heat sink opposite to the inverter. The energy storage power supply according to claim 1 , wherein the housing comprises a bottom plate, and the opening is provided in the bottom plate.

5. The energy storage power supply according to claim 1, wherein the inverter comprises a circuit board and a surface mount electronic device, the surface mount electronic device is arranged on a side of the circuit board opposite to the first heat sink, the circuit board is provided with a first through hole, and the surface mount electronic device is thermally coupled to the first heat sink through the first through hole.

6. The energy storage power supply according to claim 5, wherein the inverter includes a transistor outline packaged electronic device, the transistor outline packaged electronic device is arranged on one side of the circuit board, the first heat sink includes a folded edge corresponding to the transistor outline packaged electronic device, and the transistor outline packaged electronic device is thermally coupled to the folded edge.

7. The energy storage power supply according to claim 6, wherein the energy storage power supply includes an insulating component, the insulating component is arranged between the circuit board and the first heat sink, the insulating component is provided with a second through hole, and the surface mount electronic device is thermally coupled to the first heat sink through the second through hole.

8. The energy storage power supply according to claim 1, wherein a positioning column is formed on a side of the first heat sink facing away from the inverter, and a limiting groove is formed on the side of the hydrogel layer, the position of the limiting groove corresponds to the position of the positioning column, and the positioning column passes through the limiting groove to fix the hydrogel layer.

9. The energy storage power supply according to claim 1, wherein the energy storage power supply comprises louvers, the louvers are detachably arranged at the opening, the hydrogel layer seals the louvers, and the first radiator exchanges heat with the outside through the louvers. 10 . The energy storage power supply according to claim 9 , wherein the housing comprises feet, the feet are used to support a support surface, and the louvers are spaced apart from the support surface.

11. The energy storage power supply according to claim 1, wherein the energy storage power supply comprises a battery pack and a heat insulating member, wherein the heat insulating member is connected to the first heat sink and is used to isolate the inverter from the battery pack.

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