Electronic device and insulating upper cover

Abstract

An electronic device and an insulating upper cover, relating to the technical field of electrostatic protection of electronic devices. The electronic device comprises: an insulating cover plate of a display module; an insulating upper cover covering the edge of the insulating cover plate, wherein a first gap is formed between the edge of the insulating cover plate and the insulating upper cover; a grounding member at least partially located on a non-display side of the display module; and an electrostatic protection structure comprising a first conductive member and a second conductive member, wherein the resistivity of the second conductive member is greater than that of the first conductive member, the first conductive member is at least partially arranged in the first gap, the first conductive member is insulated from and spaced apart from the second conductive member, the second conductive member is electrically connected to the grounding member, or the first conductive member is electrically connected to the second conductive member, and the second conductive member is insulated from and spaced apart from the grounding member. According to the present application, by means of constraints of conductive members, the failure risk of a display module caused by secondary discharge can be reduced while the antenna performance is improved.

Description

Electronic equipment and insulating covers

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on February 29, 2024, with application number 202410235553.9, and priority to the Chinese patent application entitled “Electronic device and insulating cover”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electrostatic protection for electronic equipment, and in particular to an electronic device and an insulating upper cover. Background Art

[0003] Some display modules of electronic devices include flexible circuit boards, whose bending areas may be exposed flexible wiring layers. There are thousands of wirings on the flexible wiring layer that are associated with display driver chips and thin-film transistors. Therefore, the bending areas of flexible circuit boards are very susceptible to electrical influences. A direct hit by static electricity of the KV level can burn the chips and wiring, resulting in display function abnormalities such as a black screen or a distorted screen.

[0004] When using electronic devices such as mobile phones, friction and other actions will generate electrostatic discharge (ESD) on the surface of the electronic device. The ESD energy will enter the space between the frame and the display module through the gap between the plastic shell and the display module. At this time, the bending area of ​​the display module is completely exposed to the direct impact range of the ESD energy, which can easily cause damage to the bending area of ​​the display module and cause problems such as soft failure of the display module. Summary of the Invention

[0005] The present application provides an electronic device and an insulating upper cover, which can reduce the failure risk of a display module caused by secondary discharge while improving antenna performance by constraining conductive parts.

[0006] In a first aspect, the present application provides an electronic device, comprising: an insulating cover plate of a display module;

[0007] an insulating upper cover, which is arranged on the edge of the insulating cover plate, and a first gap is formed between the edge of the insulating cover plate and the insulating upper cover;

[0008] a grounding member, at least partially located on a non-display side of the display module;

[0009] An electrostatic protection structure includes a first conductive member and a second conductive member, the resistivity of the second conductive member is greater than the resistivity of the first conductive member, and the first conductive member is at least partially arranged in the first gap, wherein an insulating space is set between the first conductive member and the second conductive member, and the second conductive member is electrically connected to the grounding member, or the first conductive member and the second conductive member are electrically connected, and an insulating space is set between the second conductive member and the grounding member.

[0010] The embodiment of the present application limits the second conductive part to be made of a conductive material with a high resistivity, which can be a conductive material with a resistivity at least greater than that of the first conductive part. By setting the second gap, the second conductive part and the grounding part such as the conductive middle frame will not be electrically connected at a lower voltage, reducing the current generated by the grounding part due to antenna radiation energy (this current does not include the current generated when the second conductive part releases static electricity transmitted from the first gap to the grounding part) entering the second conductive part, which can slow down the metal loss of the first conductive part and the second conductive part, effectively reduce the impact of the conductive part on the antenna, and improve the performance of the antenna. In addition, when the second conductive part with a larger resistivity releases static electricity to the grounding part, a larger loop impedance can be formed, reducing the high-frequency component in the secondary discharge process and reducing the risk of soft failure. The embodiment of the present application prevents soft failure and other problems in electronic equipment while ensuring that the antenna has better Over-the-Air Technology (OTA) performance.

[0011] In one possible implementation, the resistivity of the second conductive member is greater than 0.00001Ωm. The second conductive member with a larger resistivity can generate a relatively small current when releasing static electricity to the grounding member, thereby reducing the high-frequency component in the secondary discharge process, and can reduce the metal loss of the second conductive member to a certain extent, thereby reducing the risk of ESD soft failure.

[0012] In a possible implementation, the material of the second conductive member includes at least one of graphite, carbon fiber, and silver paste, so as to prepare a second conductive member with a relatively large resistivity.

[0013] In one possible implementation, the resistivity of the first conductive member is less than 0.000001Ωm. The resistivity of the first conductive member is relatively small, and it can better absorb the ESD charge existing in the first gap and transfer it to the grounding member through the first conductive member and the second conductive member for grounding.

[0014] In one possible implementation, the insulating spacing between the second conductive member and the grounding member includes: a second gap between the second conductive member and the grounding member. By setting the second gap, an insulating gap can be formed between the second conductive member and the grounding member, and the insulating medium can be air filled in the gap. A secondary discharge structure is formed between the second conductive member and the grounding member through the second gap. The secondary discharge releases static electricity. The provision of the second conductive member will effectively reduce the impact of the conductive member on the antenna and improve the performance of the antenna. On the premise of ensuring that the antenna has better Over-the-Air Technology (OTA) performance, ESD soft failure and other problems in electronic equipment are prevented.

[0015] In one possible implementation, the insulating spacing between the second conductive member and the grounding member includes: an insulating member disposed between the second conductive member and the grounding member; when the voltage is low, the insulating member insulates the second conductive member and the grounding member; when the voltage increases to a certain level, the insulating member can be broken down, and the insulating member can electrically connect the second conductive member and the grounding member. In this solution, to ensure that electrostatic charge does not discharge into the flexure before and after breaking through the first insulating member, causing display malfunction, both the insulating member breakdown threshold voltage and the voltage from the second conductive member to the conductive middle frame ground plane must be less than N times the breakdown voltage between the second conductive member and the metal lead in the flexure, where N is an adjustment factor that can be between 1 / 3 and 1.

[0016] In one possible implementation, the resistivity of the insulating member is greater than 1000KΩm to form a low-voltage insulation and high-voltage breakdown structure. When the potential difference formed by the charge collected between the second conductive member and the grounding member reaches a large value, the ESD charge is released in a secondary discharge manner.

[0017] In a possible implementation, the material of the insulating member includes at least one of metal oxide, insulating glue, and non-linear conductive glue, so as to prepare an insulating member with relatively large resistivity.

[0018] In one possible implementation, the display module includes a flexible circuit board having a bending region, and the first conductive member is disposed on an inner side surface of the insulating cover, the inner side surface being the side surface of the insulating cover facing the bending region. The first conductive member is disposed on the inner side surface and can absorb electrostatic charge in the first gap. The first conductive member is disposed on the inner side surface of the insulating cover, and a certain distance is separated from the bending region. Electrostatic charge absorbed by the first conductive member is preferentially transferred to the second conductive member and the grounding member for grounding, rather than being transferred to the bending region, thereby protecting the bending region from the effects of electrostatic charge.

[0019] In one possible implementation, along the edge extension direction of the insulating cover plate, the length of the first conductive member is greater than or equal to the length of the bending zone, and the static electricity collected in the first gap can be adsorbed by the first conductive member as much as possible, and there will be no vacant area (referring to the space where the first conductive member is not set) that allows static electricity to be transferred to the bending zone, so as to prevent the bending zone from being affected by static electricity and causing soft failure and other faults as much as possible.

[0020] In one possible implementation, the width of the first conductive member is greater than or equal to 0.5 mm. This allows the first conductive member to be partially disposed within the first gap between the display module and the insulating upper cover, while the remaining portion extends from the first gap and is electrically connected to or insulated from the second conductive member near the side frame. Furthermore, the first conductive member may be a metal layer disposed on the inner side surface. The relatively large width allows the first conductive member to better adhere to the inner side surface and better absorb electrostatic charge in the first gap.

[0021] In one possible implementation, the second conductive member is disposed on the inner side surface, extending along the edge of the insulating cover plate, and has a length greater than or equal to 0.5 mm. By limiting the length of the second conductive member, the second conductive member can be better fitted to the inner side surface and better contacted with the silver paste, thereby improving the stability of the electrical connection.

[0022] In one possible implementation, the display module includes a flexible circuit board, wherein the flexible circuit board has a bending area, and the spacing between the bending area and the conductive structure is less than or equal to 5 mm, so that secondary discharge such as electrical breakdown is not likely to occur between the conductive structure and the bending area. Even if an insulating gap is set between the first conductive member and the second conductive member, and / or an insulating gap is set between the second conductive member and the conductive middle frame, secondary discharge occurs between the first conductive member and the second conductive member with the insulating gap, and secondary discharge occurs between the second conductive member and the conductive middle frame with the insulating gap, secondary discharge will not occur between the second conductive member and the bending area, and secondary discharge will not occur between the first conductive member and the bending area.

[0023] In a possible implementation, the number of the first conductive members is at least two, the number of the second conductive members is greater than or equal to the number of the first conductive members, and each first conductive member and at least one second conductive member are electrically connected or arranged with an insulated interval.

[0024] In one possible implementation, the number of the second conductive members is at least two, and the at least two second conductive members are arranged at intervals along the edge extension direction of the insulating cover plate. The resistivity of the at least two second conductive members is greater than the resistivity of the first conductive member. A larger number of second conductive members can better transfer the electrostatic charge adsorbed by the first conductive member to the grounding member for grounding.

[0025] In one possible implementation, the at least two first conductive members are spaced apart along the edge extension direction of the insulating cover plate, and the spacing distance between two adjacent first conductive members is less than 2 mm, so as to avoid the situation where the first conductive member cannot effectively pick up the electrostatic charge generated outside the electronic device when the electronic device is in use due to the gap being too large, thereby causing static electricity to directly enter the insulating upper cover and the conductive middle frame through the fourth gap to form a cavity structure, resulting in abnormal display function.

[0026] In one possible implementation, at least one of the first conductive member and the second conductive member is fitted on the inner wall of the insulating upper cover, the inner wall surface of the insulating upper cover provides an attachment position for the first conductive member and the second conductive member, and the first conductive member and the second conductive member are arranged on the inner wall surface of the insulating upper cover and will not be electrically connected to the bending area of ​​the display module. The first conductive member and the second conductive member transfer the charge of the first gap to the grounding member for grounding to prevent the bending area from being affected by static electricity.

[0027] In one possible implementation, the outer wall of at least one of the first and second conductive members is flush with the inner wall of the insulating cover. This flushness of the first conductive member and the inner wall prevents increased risk of interference with the display module due to the thickness of the first conductive member. The flushness of the second conductive member and the inner wall increases the breakdown distance from the bend zone, reducing the risk of ESD interference in the bend zone.

[0028] In one possible implementation, the grounding member includes a conductive middle frame, which has a bottom frame portion and a side portion connected to each other, the bottom frame portion is located on the non-display side of the display module, the side portion is located on the edge side of the display module, and the side portion includes an antenna radiator.

[0029] In a possible implementation, a projection of the antenna radiator along the shortest distance direction toward the display module at least partially overlaps with the second conductive member to reduce the impact on the OTA performance of the antenna.

[0030] In a possible implementation, the insulating upper cover includes a surrounding frame and a side frame located on one side of the surrounding frame, and the side frame extends from the surrounding frame toward the back side of the display module;

[0031] The first conductive member is arranged on the inner wall of the frame, and the side frame includes a first wall and a second wall. The first wall is arranged opposite to the display module, and the second wall is opposite to or in contact with the grounding member. Part of the second conductive member is located on the first wall, and the other part is located on the second wall.

[0032] In one possible implementation, the electronic device includes a rotating shaft, the number of the insulating covers is at least two, the display module includes a flexible screen, and the at least two insulating covers are unfolded or folded by the rotating shaft; the first gap is provided between the flexible screen and the at least two insulating covers; and the electrostatic protection structure is provided on the at least two insulating covers. The electronic device described in the embodiment of the present application can be a folding device, with at least two insulating covers connecting the flexible screen. The flexible screen can be folded when the two insulating covers are flipped relative to the rotating shaft, and there is a first gap between the insulating covers and the flexible screen to prevent interference between the flexible screen and the insulating covers when folding.

[0033] In a second aspect, the present application provides an insulating cover for enclosing the edge of an insulating cover plate of a display module, the insulating cover comprising a frame and a side frame located on one side of the frame, the side frame extending from the outer edge of the frame, the side frame and the frame forming a bent structure; a first conductive member is provided on the inner wall of the frame, a second conductive member is provided on the inner wall of the side frame, the second conductive member having a resistivity greater than that of the first conductive member, and the first conductive member and the second conductive member are electrically connected or insulated and spaced apart. The insulating cover of the embodiment of the present application can be used to be provided on the display side of an electronic device and enclose the edge of the display module, and a first conductive member and a second conductive member are provided on the inner side of the cover, and by setting the second gap, the second conductive member and a grounding member such as a conductive middle frame are not electrically connected at a low voltage, thereby reducing the current generated by the grounding member due to antenna radiation energy (this current does not include the current generated when the second conductive member releases static electricity transmitted from the first gap to the grounding member) from entering the second conductive member, thereby slowing down the metal loss of the first conductive member and the second conductive member, effectively reducing the impact of the conductive member on the antenna and improving the performance of the antenna. Furthermore, when the second conductive member with a higher resistivity releases static electricity to the grounding member, it creates a greater loop impedance, reducing the high-frequency components during the secondary discharge process and lowering the risk of soft failure. This embodiment of the present application prevents soft failures and other issues in electronic devices while ensuring the antenna has superior Over-the-Air (OTA) performance.

[0034] On the third aspect, the present application provides an electronic device, comprising: a first component; a grounding component; a first conductive component electrically connected to the first component; a second conductive component electrically connected to the grounding component, an insulating gap is set between the first conductive component and the second conductive component, and the resistivity of the second conductive component is greater than the resistivity of the first conductive component. In the embodiment of the present application, the second conductive component is made of a conductive material with a high resistivity, which can be a conductive material with a resistivity at least greater than that of the first conductive component. The first conductive component and the second conductive component are spaced apart, so that there is no direct electrical connection between the second conductive component and the grounding component such as the ground at a lower voltage. By optimizing the material of the tip protection structure between the first component and the grounding component, mainly optimizing the resistivity, and using a high resistivity material to make the second conductive component, the high-frequency component in the tip gap tripping process is reduced, and the product performance during the lightning strike is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG1 is a schematic diagram of a double-folding mobile phone in an unfolded state provided by an embodiment of the present application;

[0036] FIG2 is a schematic diagram of a flipped-over double-folding mobile phone provided in an embodiment of the present application;

[0037] FIG3 is a schematic diagram of a folded state of a double-folding mobile phone provided in an embodiment of the present application;

[0038] FIG4 is an exploded schematic diagram of an insulating upper cover, a display module, and a conductive middle frame provided in an embodiment of the present application;

[0039] FIG5 is a front view of an electronic device provided in an embodiment of the present application (the dotted line indicates the position of the bending area);

[0040] FIG6 is a partial cross-sectional view of an insulating upper cover, a display module, and a conductive middle frame provided in an embodiment of the present application;

[0041] 7 is a partial cross-sectional view of the insulating upper cover, the display module, the conductive middle frame, the first conductive member, and the second conductive member provided in an embodiment of the present application;

[0042] FIG8 is an exploded schematic diagram of a partial area of ​​the insulating upper cover and a display module provided in an embodiment of the present application;

[0043] FIG9 is a schematic diagram of a first insulating member provided in an embodiment of the present application;

[0044] FIG10 is a schematic diagram of the insulation interval between the first conductive member and the second conductive member provided in an embodiment of the present application;

[0045] FIG11 is a second schematic diagram of the insulation interval between the first conductive member and the second conductive member provided in an embodiment of the present application;

[0046] FIG12 is a schematic diagram of the positions of the first conductive member and the second conductive member on the insulating upper cover provided in an embodiment of the present application;

[0047] FIG13 is a schematic diagram of a plurality of first conductive members provided in an embodiment of the present application;

[0048] FIG14 is a cross-sectional view of a first conductive member, a second conductive member, and an insulating upper cover provided in an embodiment of the present application;

[0049] FIG15 is a schematic diagram of an antenna radiator provided in an embodiment of the present application;

[0050] FIG16 is a schematic diagram showing the connection between a display module and a circuit board provided in an embodiment of the present application;

[0051] FIG17 is a schematic diagram of a display driver chip provided in an embodiment of the present application;

[0052] FIG18 is a simplified schematic diagram of a possible protection solution for a power supply product provided in an embodiment of the present application;

[0053] FIG19 is a schematic diagram of ESD currents of Examples of the present application, Comparative Example A, and Comparative Example B provided in an embodiment of the present application;

[0054] FIG20 is a schematic top view of a conductive middle frame provided in an embodiment of the present application;

[0055] FIG21 is a schematic cross-sectional view of FIG20 of the present application;

[0056] FIG22 is a schematic cross-sectional view BB in FIG20 of the present application;

[0057] FIG23 is a schematic diagram of another bending zone structure provided in an embodiment of the present application. DETAILED DESCRIPTION

[0058] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0059] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of this application are explained and described below.

[0060] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0061] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0062] It should be understood that the term "and / or" as used herein is simply a term used to describe the existence of three possible relationships between related objects. For example, "A and / or B" can represent the existence of A alone, the existence of both A and B, and the existence of B alone. Furthermore, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0063] The word "if," as used herein, may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to the determination" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)," depending on the context.

[0064] It should be understood that the terms “first”, “second”, etc. used in this application are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0065] In the description of this application, the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting this application.

[0066] When used in this application, "within the range of...", unless it is specifically stated that the end value is not included, it is assumed that both end values ​​of the range are included. For example, in the range of 1 to 5, the two values ​​1 and 5 are included.

[0067] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, a conflicting connection or an integral connection; for ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. When a component is referred to as "connected" or "accessed" to other components, it should be understood that: the component is not only directly connected to or accessed to other components, but also another component may exist between the component and the other components. On the other hand, when a component is referred to as "directly connected" or "directly accessed" to other components, it should be understood that there is no component between them.

[0068] Electrostatic discharge (ESD) refers to the transfer of electrostatic charge between objects or surfaces with different electrostatic potentials. Mobile phones and other devices can experience electrostatic discharge (ESD) on the screen due to prolonged friction, especially friction against the screen, metal edges, or plastic surfaces. If static electricity is generated in a device and the charge is not transferred to a safe area, it can cause failure of sensitive components (such as the screen), resulting in damage and functional issues such as device malfunction.

[0069] Soft failures occur when static electricity, or other factors, affect the display module's flex zone. Static charges accumulate in circuit nodes within extremely short time intervals (picoseconds to nanoseconds). When the charge exceeds a certain level, stored data changes, causing system errors and, in some cases, display module failures such as a black screen. However, this damage to the circuitry is not permanent; the display module returns to normal after a power cycle. This phenomenon is called a soft failure.

[0070] It should be noted that the electrical connection described in this application refers to the ability for charge to flow between two components, the ability for the two components to be electrically connected in contact, the ability for a certain gap or insulating medium to form an electrical connection in the form of electrical breakdown, or the ability for indirect electrical connection to be achieved through other conductive components.

[0071] An embodiment of the present application provides an electronic device, which may be a terminal or other device, wherein the terminal provided may be a wearable device, an AR (augmented reality)\VR (virtual reality) device, a tablet computer, a laptop computer, an UMPC (ultra-mobile personal computer), a netbook, a PDA (personal digital assistant), or any other terminal, and the embodiments of the present application do not impose any restrictions on this.

[0072] This application provides an embodiment of an electronic device, taking a foldable mobile phone as an example. FIG1 shows a schematic diagram of a bi-fold mobile phone in an unfolded state, FIG2 shows a schematic diagram of a bi-fold mobile phone in a flipped state, and FIG3 shows a schematic diagram of a bi-fold mobile phone in a folded state. Specifically, the process of the mobile phone from the unfolded state to the folded state can be referred to the folding sequence of FIG1-FIG2-FIG3.

[0073] It should be noted that Figures 1, 2 and 3 only show one implementation method of the two side shells, and the display screen is located on the outer surface after folding, showing a folding phone with an external screen. In one embodiment, the folding phone can be a folding phone with an internal screen, and the folded display screen can be hidden inside the folded two shells. In one embodiment, the widths of the two shells of the folding phone can be the same or different. In one embodiment, the two shells of the folding phone can be of equal thickness or of unequal thickness. In one embodiment, the folding phone can also be a multi-folding phone such as a tri-folding phone, having three or more shells. The folding phones of the above-mentioned embodiments are all applicable to the electronic device described in this application. Figures 1, 2 and 3 only illustrate a folding method of a double-folding phone, and cannot limit the electronic device described in this application to only a double-folding phone.

[0074] 1 , the foldable terminal may include a housing 100 and a display module 200 . In this embodiment, the housing 100 is in a square plate shape, and the display module 200 may be located in a cavity enclosed by the housing 100 .

[0075] As shown in Figures 1, 2, and 3, the housing 100 may include a first housing 100a and a second housing 100b. The first housing 100a and the second housing 100b can be flipped relative to each other about a rotation axis 100c. The X direction in Figures 1 to 3 is parallel to the width of the second housing 100b, the Y direction is parallel to the length of the second housing 100b, and the Z direction is parallel to the thickness of the second housing 100b. The second housing 100b in Figures 1 to 3 can remain relatively stationary, while the first housing 100a can rotate relative to the second housing 100b along the rotation axis 100c. The display module 200 may be a flexible screen, and both the first housing 100a and the second housing 100b are connected to a display screen. After the first housing 100a flips from an unfolded state to a folded state relative to the second housing 100b, the display module 200 follows the housing 100 from an unfolded state to a folded state.

[0076] The housing 100 may include a rotation shaft 100c, through which the first housing 100a and the second housing 100b rotate relative to each other about an axis. The first housing 100a and the second housing 100b are rotatably connected along the rotation shaft 100c. The rotation shaft 100c can rotate relative to each other along an axis 131 to achieve the flipping, closing, and flipping of the first and second housings 100a, 100b. Specifically, the axis 131 in this embodiment refers to the flipping axis when the first and second housings 100a, 100b are flipped relative to each other.

[0077] Regardless of whether the first housing 100a and the second housing 100b are directly or indirectly connected, the axis 131 of relative rotation between the first housing 100a and the second housing 100b extends along the Y-axis in the figures, allowing the first housing 100a to be flipped relative to the second housing 100b along the axis 131. Referring to Figures 1 to 3 , the first housing 100a rotates counterclockwise relative to the second housing 100b along the Y-axis to transition the foldable phone from an unfolded state to a folded state.

[0078] The display module 200 is fixedly connected to the first shell 100a and the second shell 100b, respectively. Specifically, the display module 200 can be a flexible screen, and the display module 200 can rotate in response to the relative rotation of the first shell 100a and the second shell 100b. Figure 1 shows a schematic diagram of a bi-folding mobile phone in the unfolded state, in which the display module 200 is fully unfolded to form a large screen; Figure 2 shows a schematic diagram of a bi-folding mobile phone in the flipped state, in which the display module 200 rotates along with the shell; Figure 3 shows a schematic diagram of a bi-folding mobile phone in the folded state, in which the display module 200 is in a folded and collapsed state, with the display portion of the display module 200 folded in half. Specifically, the present application only shows an outward folding embodiment of a double-folding mobile phone. Referring to Figure 2, the first shell 100a can be folded relative to the second shell 100b, and the folded display module 200 is still on the outer surface of the mobile phone; when folded to the folded state of Figure 3, the display module 200 is folded to both sides of the Z direction and the opposite Z direction of the mobile phone, and display can be performed through part of the display module 200 on one side of the Z direction.

[0079] In one embodiment, it can also be an inward folding method (not shown in the figure), and the flexible screen can be folded and stored in the shell, and when the double-folding mobile phone is in a folded state, it can be displayed through another screen (when the mobile phone is in an unfolded state, the screen is located on the other side of the mobile phone relative to the flexible screen); for example, another display screen (not shown in the figure) is provided on the side of the first shell 100a opposite to the display module 200, and the size of the display screen can be the same as that of the first shell 100a, or slightly smaller than the size of the first shell 100a, and is fixed on the Z opposite side of the first shell 100a to display when the folding mobile phone is in a folded state.

[0080] In some possible embodiments, referring to the electronic devices shown in Figures 4, 5, and 6, a foldable mobile phone is used as an example. The electronic device may include: an insulating upper cover 110, a display module 200, a conductive middle frame 120, a battery cover, and a circuit board and corresponding components located inside the mobile phone. The insulating upper cover 110, the conductive middle frame 120, and the battery cover, etc., may constitute the housing 100 described in this embodiment. In a bi-fold mobile phone, the insulating upper cover 110, the conductive middle frame 120, and the battery cover may each be two, forming a first housing 100a and a second housing 100b, respectively. The first housing 100a may include the insulating upper cover 110, the conductive middle frame 120, and the battery cover, and the second housing 100b may include the insulating upper cover 110, the conductive middle frame 120, and the battery cover. The insulating upper cover 110 and the conductive middle frame 120 may enclose a cavity structure, and the display module 200 may be located within the cavity. The battery cover and the display module 200 may be located on the upper and lower sides of the conductive middle frame 120, respectively. The conductive middle frame 120 and the inner surface of the battery cover may form another cavity. In one embodiment, the cavity may contain devices such as a battery, a flexible circuit board, and a circuit board.

[0081] In one embodiment, as shown in FIG5 , a display module 200 includes a stacked insulating cover 210, a display module stack 220, and a flexible display layer 230. The insulating cover 210 may be a glass cover layer, and the display module stack 220 may include a stacked structure such as an optically clear adhesive (OCA) layer and a polarizer. The polarizer may be a structure such as a polarizer film (POL).

[0082] In one embodiment, in a packaging mode, as shown in Figure 7, the flexible display layer 230 can be a flexible touch layer (PANEL), including a flexible circuit board, etc.; the bending area 230a can be a bending structure formed by bending the flexible circuit board of the PANEL layer to connect the PANEL layer area and the chip in the Z reverse direction part of the display module stack 220.

[0083] In one embodiment, in another packaging mode, as shown in Figure 23, the flexible display layer 230 can be a flexible touch layer (PANEL), and a flexible circuit board is provided on one edge side of the PANEL layer. The flexible circuit board is connected to the PANEL layer, and the flexible circuit board is bent to the bottom of the PANEL layer to connect the PANEL layer and the chip.

[0084] In one embodiment, the bending region 230a described in the embodiments of this application refers to the curved area at the edge of the display module in the electronic device. The central bending portion of the display module, similar to the location of the hinge 100c in Figure 2, is slightly different from the bending region shown in the embodiments of this application. The bending of the hinge 100c is to achieve the foldable structure of the electronic device, while the bending region 230a is to increase the display area of ​​the display screen.

[0085] In one embodiment, as shown in FIG6 , when the electronic device is a foldable phone, since foldable phones require reciprocating folding, a movable connection is typically employed between the display module 200 and the housing 100. In one embodiment, a first gap 130a is provided between the display module 200 and the housing 100. In electronic devices with foldable functionality, such as foldable phones, to prevent interference between the housing 100 and the display module 200 during folding, for example, if the displacements of the housing 100 and the display module 200 differ or deviate during folding, the housing 100 may pull or squeeze the display module 200, potentially damaging the display module 200. In one embodiment, a first gap 130a is provided at the edges of the housing 100 and the insulating cover 210 to prevent interference with the housing 100 during bending. This gap is typically in the range of 0.05 mm to 0.2 mm, ensuring a smoother and safer folding of the display module 200. In this embodiment, the first gap 130a is located between the insulating upper cover 110 and the insulating cover plate 210. In this case, if the static electricity on the display module 200 is not grounded, it may enter the interior of the mobile phone through the gap between the display module 200 and the housing 100, causing damage to the mobile phone's circuit board, flexible circuit board, and display screen.

[0086] It should be noted that the first gap 130a indicated in the embodiment of the present application may refer to a non-sealed connection between the insulating upper cover 110 and the insulating cover plate 210, and may be a gap structure as shown in Figure 6, where the insulating upper cover 110 and the insulating cover plate 210 do not contact at the first gap 130a.

[0087] In one embodiment, the first gap 130a also includes a microscopic gap. Appearing to be in contact with the insulating cover 110 and the insulating cover plate 210 at the first gap 130a, the gap is not hermetically sealed. The first gap 130a prevents the passage of moisture, dust, and other substances, but allows electric charges to pass through the first gap 130a. In this embodiment, the primary function of the first gap 130a is to maintain a free state between the insulating cover plate and the insulating cover. This allows the flexible screen to bend without interference from the rigid insulating cover, thus preventing damage to the flexible screen due to stress during bending.

[0088] In one embodiment, as shown in Figures 5 and 6 , the circuit board of the display module 200 bends from the side proximal to the insulating upper cover 110 toward the side proximal to the conductive middle frame 120 to form a bend region 230a. This allows for narrower black borders on the sides of the display panel, thereby increasing the display area of ​​the display panel relative to the overall mobile phone panel. It should be noted that the bend region 230a is a portion of the flexible circuit board structure and is not part of the display layer. The bend region 230a can be formed by bending a non-display functional circuit board area, such as the edge of the display module 200. While the bend region 230a lacks display functionality, it contains flexible screen traces, such as the touchscreen trace layer of an OLED screen. When charge on the surface of the display module 200 enters the mobile phone through the first gap 130a and is transferred to the bend region 230a, it can cause display errors such as soft failures in the display module 200, impacting the display quality of the electronic device. It should be noted that the bending region 230a can be a curved extension of a conductive layer (PI conductive layer) based on polyimide (PI), and the curved extension can be connected to a circuit board. The bending region 230a can also be a flexible board spliced ​​between the PI conductive layer and the circuit board. The flexible board also has traces similar to those on the PI conductive layer and is susceptible to static electricity. The flexible display layer 230 can be a flexible trace layer (panel layer). The flexible display layer 230 of the display screen can bend to a certain extent at some locations on the edge, forming the bending region 230a. The bending region 230a is the curved area of ​​the flexible display layer 230 connecting the display module stack 220 and the circuit board.

[0089] It should be noted that, under the premise of ensuring that the shell 100 does not interfere with the display module 200 when the foldable mobile phone is folded, the shell 100 and the display module 200 can be fitted together. At this time, there is no obvious gap between the shell 100 and the display module 200, but static electricity can still enter the interior of the mobile phone from the fitting connection surface between the shell 100 and the display module 200, causing damage to the mobile phone's circuit board, flexible circuit board and display screen.

[0090] The embodiment of the present application provides an electronic device that can solve the above-mentioned problem, and the static electricity between the display module 200 and the insulating cover 110 will not affect the bending area 230a. Referring to Figures 1, 4, 5 and 7, the electronic device, taking a folding mobile phone as an example, can include a shell 100 and a display module 200. The shell 100 can be divided into a first shell 100a and a second shell 100b. The first shell 100a and the second shell 100b can be flipped relative to the rotation axis. The first shell 100a and the second shell 100b both include an insulating cover 110, which is enclosed at the edge of the display module 200, and a first gap 130a is provided between the insulating cover 110 and the display module 200. The first gap 130a can be located on the display direction side of the display module 200.

[0091] The electronic device also includes a conductive structure 300 and a grounding member. The grounding member can be a grounding structure within the electronic device, such as a conductive middle frame, a circuit board, and a conductive backplane. The grounding member is at least partially disposed on the back side of the display module 200, where the back side refers to the non-display side of the display module 200. In one embodiment, referring to Figures 4 and 7, the grounding member can be exemplified by the conductive middle frame 120 in a foldable mobile phone. The conductive middle frame 120 can be disposed on the back side (non-display side) of the display module 200, and the display module 200 can be fixed to the conductive middle frame 120. The conductive middle frame 120 can be located on the back side of the insulating upper cover 110 (the side opposite to the Z direction in Figure 7). The display module 200 bends from the side proximal to the insulating upper cover 110 toward the side proximal to the conductive middle frame 120 to form a bending region 230a of the flexible display layer, thereby achieving narrower black borders on the sides of the display panel and increasing the display area of ​​the display panel relative to the entire mobile phone panel. The bending area 230a can be formed by bending an area that does not have a display function, such as the edge of the display module 200. Although the bending area 230a does not have a display function, a wiring structure of a flexible screen is provided on the bending area 230a, such as a touch wiring layer of an OLED screen.

[0092] In one embodiment, the display module 200 and the insulating cover 110 are spaced apart in the X direction. Referring to FIG. 7 , the bend region 230a, the insulating cover 110, and the conductive middle frame 120 enclose a first cavity 230b. The first cavity 230b can separate the insulating cover 110 from the bend region 230a. The conductive structure 300 can be located within the first cavity 230b and electrically connect the first gap 130a and the conductive middle frame 120 to ground static electricity entering the first gap at the conductive middle frame 120, preventing static electricity from being transferred from the surface of the display module 200 to the bend region 230a and causing display failure of the display module 200.

[0093] The conductive structure 300 may include a first conductive member 310 and a second conductive member 320. The first conductive member 310 is used to absorb static electricity within the first gap 130a. The second conductive member 320 is electrically connected to the first conductive member 310. The first conductive member 310 absorbs static electricity in the first gap 130a into the second conductive member 320, and transmits the static electricity to the grounding member through the second conductive member 320 for grounding, thereby preventing the static electricity accumulated in the first gap 130a from being transmitted to the grounding member. In one embodiment, referring to FIG. 7 , the first conductive member 310 may be partially located within the first gap 130a, with another portion extending outside the first gap 130a, for example, protruding to the left side of the first gap 130a in FIG. 7 . The second conductive member 320 may be electrically connected to the first conductive member 310 outside the first gap 130a.

[0094] In one embodiment, referring to Figures 4, 7, and 8, Figure 8 is an exploded view of a portion of the insulating cover and the display module provided in an embodiment of the present application. The portion of the insulating cover shown in Figure 8 may be one of the three strips of the insulating cover shown in Figure 4, and the portion of the insulating cover and the bending region 230a are positioned relative to each other. The exploded view shown in Figure 8 shows the display module 200 shifted a distance in the X direction relative to the insulating cover 110 to form this exploded view. In the electronic device, the spacing between the bending region 230a and the side frame 1102 is not as large as shown in Figure 8. The insulating cover 110 may include a frame 1101 and side frames 1102. The frame 1101 is located on the display side of the display module 200 and forms a "C" shape (for a foldable phone) or a "U" shape (for a tablet phone). The side frames 1102 are located on one edge of the insulating cover 210 of the display module 200 and extend from the edge of the frame 1101 in the opposite Z direction. In one embodiment, the surrounding frame 1101 and the side frames 1102 can be two independent frames, and the two independent frames are fixedly connected by gluing or snapping. In one embodiment, the surrounding frame 1101 and the side frames 1102 can be an integrated structure, and the surrounding frame 1101 and the side frames 1102 can be two regions of the insulating cover 110. The XZ cross-sectional view of the insulating cover 110 can be an "L"-shaped structure, and the surrounding frame 1101 and the side frames 1102 form a bent structure.

[0095] In one embodiment, as shown in FIG7 , the first conductive member 310 can be located on the side of the enclosure 1101 along the anti-Z direction, with one end of the first conductive member 310 in the X direction extending within the first gap 130a. The end of the first conductive member 310 in the anti-X direction protrudes from the left side of the first gap 130a to be adjacent to the inner wall of the side frame 1102. The second conductive member 320 can be located on the side of the side frame 1102 in the X direction, with one end of the second conductive member 320 in the Z direction extending adjacent to the enclosure 1101 and electrically connected to the first conductive member 310. In this embodiment, the end of the first conductive member 310 in the anti-X direction and the end of the second conductive member 320 in the Z direction can contact each other, thereby achieving contact and electrical connection between the first conductive member 310 and the second conductive member 320.

[0096] In one embodiment, referring to FIG7 , an insulating gap is provided between the insulating upper cover 110 and the conductive middle frame 120. The insulating gap provided in the embodiment of the present application refers to an insulating structure provided between the insulating upper cover 110 and the conductive middle frame 120. The insulating structure may be a gap between the insulating upper cover 110 and the conductive middle frame 120, and the gap may be the second gap 130b shown in FIG7 . The side frame 1102 of the insulating upper cover 110 has a second wall 1102b opposite to the conductive middle frame 120 at the second gap 130b. One end of the second conductive member 320 in the reverse Z direction may be bent to fit against the second wall 1102b, so that one end of the second conductive member 320 in the reverse Z direction may be located within the second gap 130b. The second gap 130b is filled with air. In this solution, in order to ensure that the electrostatic charge will not discharge to the bending area 230a before and after the breakdown of the second gap 130b, causing abnormal display function, the breakdown threshold voltage of the second gap 130b (referring to the breakdown of the air or other medium in the second gap 130b) and the voltage from the second conductive member 320 to the conductive middle frame 120 ground plane both need to be less than N times the breakdown voltage between the second conductive member 320 and the metal lead of the bending area 230a, where N is an adjustment coefficient, which can take a value between 1 / 3 and 1.

[0097] When the electrostatic charge absorbed by the second conductive member 320 reaches a certain amount, so that the potential difference between the second conductive member 320 and the conductive middle frame 120 is sufficient to break through the second gap 130 b , the second conductive member 320 can transfer the electrostatic charge to the conductive middle frame 120 .

[0098] In one embodiment, as shown in FIG7 , the insulating upper cover 110 includes a frame 1101 and a side frame 1102 located on one side of the frame 1101. The side frame 1102 extends from the frame 1101 toward the back side of the display module 200, which can be referred to as the Z direction shown in FIG7 . The first conductive member 310 can be disposed on the inner wall of the frame 1101. The side frame 1102 includes a first wall 1102a and a second wall 1102b. The first wall 1102a is disposed opposite the display module 200 and can be located outside the edge of the display module 200. The second wall 1102b is opposite or in contact with the grounding member (see the conductive middle frame 120 shown in FIG7 ). The second conductive member 320 is partially located on the first wall 1102a and the other portion can be located on the second wall 1102b.

[0099] In one embodiment, referring to FIG. 7 , the dashed arrows in FIG. 7 illustrate a schematic diagram of the charge collected in the first gap 130a being transferred to the grounding member for grounding. The charge collected in the first gap 130a sequentially passes through the first conductive member 310 and the second conductive member 320 , and is transferred to the conductive middle frame 120 via a secondary discharge at the second conductive member 320 . This prevents the electrostatic charge collected in the first gap 130a from being transferred to the bend region 230a , preventing problems such as soft failures in the display module 200 and thereby improving the service life and user experience of the electronic device.

[0100] In one embodiment, the distance of the second gap 130b should be within a certain range, for example, less than 0.2 mm. When the amount of static electricity collected by the second conductive member 320 is small, the second conductive member 320 and the conductive middle frame 120 are disconnected, and the charge collected on the second conductive member 320 is not transferred to the conductive middle frame 120. Conversely, the current in the conductive middle frame 120 (for example, the conductive middle frame 120 is close to the antenna, causing the conductive middle frame 120 to induce a certain degree of current) will not be induced in the first conductive member 310 and the second conductive member 320. Therefore, when the first conductive member 310 and the second conductive member 320 do not conduct the static electricity collected by the first gap 130a, no current will be generated, thereby preventing metal loss in the first conductive member 310 and the second conductive member 320, which may lead to poor antenna performance.

[0101] The first conductive member 310 collects static electricity in the first gap 130a, which is then transferred from the first conductive member 310 to the second conductive member 320. When the static charge collected by the second conductive member 320 reaches a certain level and the potential difference between the second conductive member 320 and the conductive middle frame 120 reaches the breakdown voltage of the second gap 130b, the second gap 130b is electrically broken down. The static charge collected by the second conductive member 320 passes through the second gap 130b, resulting in a secondary discharge and entering the conductive middle frame 120. This secondary discharge can occur instantaneously. After the charge is transferred to the second conductive member 320, the second gap 130b returns to an insulating state, preventing the current on the conductive middle frame 120 from being transferred to the second conductive member 320.

[0102] In one embodiment, the first conductive member 310 can be made of a conductive material and have a relatively low resistivity. For example, the first conductive member 310 can be made of a material such as silver paste or copper. Small-particle silver powder is added to the silver paste, where small particle size refers to particles with a particle size in the micron range. The silver powder particles have a relatively high filling ratio in the silver paste, for example, in the range of 60% to 70%, or above 70%. The resistivity ρ1 of the first conductive member 310 can be less than 0.000001Ωm. The first conductive member 310 can be a silver paste layer printed on the inner wall surface of the insulating upper cover 110, or a copper layer fixed to the inner wall surface of the insulating upper cover 110 by a process such as gluing. The first conductive member 310 with a relatively low resistivity is more conducive to absorbing the electrostatic charge in the first gap 130a.

[0103] In one embodiment, the second conductive member 320 can be made of a conductive material, and the resistivity of the second conductive member 320 is relatively high, at least greater than the resistivity of the first conductive member 310. In one embodiment, the second conductive member 320 can be made of a high-resistivity conductive material, such as graphite or carbon fiber, and the resistivity ρ2 of the material can be greater than 0.00001 Ωm. The second conductive member 320 can be a metal layer formed by printing or etching the above-mentioned material and attached to the inner wall surface of the insulating cover 110.

[0104] In one embodiment, the resistivity of the second conductive member 320 may be less than 0.01 Ωm, so that the second conductive member 320 can transfer the electrostatic charge absorbed on the first conductive member 310 to the grounding member for grounding.

[0105] In one embodiment, an electronic device corresponding to the above embodiment can be placed on an ESD test platform for an ESD electrostatic test. The platform is the tabletop of a test table, which can be placed on a metal surface. The test tabletop is provided with a metal layer, and an insulating layer is provided above the metal layer. The insulating layer can be 0.5 mm thick. The electronic device to be tested is placed on the insulating layer, and static electricity is discharged into the gap between the electronic device using an electrostatic gun. The current flowing through the second conductive element is then measured.

[0106] Referring to Figure 19, Comparative Example A is: the first conductive part, the second conductive part and the conductive middle frame are in contact and electrically connected in sequence, and the first conductive part and the second conductive part can be made of the same low-resistivity material. Comparative Example B is: the first conductive part and the second conductive part are in contact and electrically connected, an insulating gap is set between the second conductive part and the conductive middle frame, and conduction is performed by secondary discharge, and the first conductive part and the second conductive part can be made of the same low-resistivity material. The scheme of the embodiment of the present application is: the first conductive part and the second conductive part are in contact and electrically connected, an insulating gap is set between the second conductive part and the conductive middle frame, and conduction is performed by secondary discharge, and the first conductive part is made of a low-resistivity material, and the second conductive part can be made of a high-resistivity material. As shown in Figure 19, in the ESD test, the peak current of the corresponding scheme of the embodiment of the present application is smaller than the peak current of Comparative Examples A and Comparative Example B.

[0107] In the embodiment of the present application, by limiting the second conductive member 320 to be made of a conductive material with a high resistivity, which can be a conductive material with a resistivity at least greater than that of the first conductive member 310, the second gap 130b is set so that the second conductive member 320 and the grounding member such as the conductive middle frame will not be electrically connected at a lower voltage, thereby reducing the current generated by the grounding member due to antenna radiation energy (this current does not include the current generated when the second conductive member 320 releases static electricity transmitted from the first gap 130a to the grounding member) entering the second conductive member 320, which can slow down the metal loss of the first conductive member 310 and the second conductive member 320, effectively reducing the impact of the conductive member on the antenna and improving the performance of the antenna. In addition, when the second conductive member 320 with a larger resistivity releases static electricity to the grounding member, a larger loop impedance can be formed, reducing the high-frequency component in the secondary discharge process and reducing the risk of ESD soft failure. The embodiment of the present application prevents ESD soft failure and other problems from occurring in electronic devices while ensuring that the antenna has better Over-the-Air Technology (OTA) performance.

[0108] In some possible embodiments, as shown in FIG9 , an insulating space is provided between the insulating upper cover 110 and the conductive middle frame 120 , wherein the insulating space setting described in the embodiment of the present application may also refer to a first insulating member 130 c being provided between the insulating upper cover 110 and the conductive middle frame 120 .

[0109] As shown in Figure 9, the side frame 1102 of the insulating upper cover 110 has a second wall 1102b on the side opposite to the conductive middle frame 120, and one end of the second conductive member 320 along the Z-opposite direction can be bent to fit on the second wall 1102b, so that the second conductive member 320 can be located between the insulating upper cover 110 and the conductive middle frame 120 at one end along the Z-opposite direction.

[0110] One side of the first insulating member 130c in the Z direction can be in contact with the second conductive member 320, and the side of the first insulating member 130c in the opposite Z direction can be in contact with the conductive middle frame 120. In this solution, to ensure that electrostatic charge does not discharge into the bend region 230a before and after breakdown of the first insulating member 130c, causing display malfunction, the breakdown threshold voltage of the first insulating member 130c and the voltage between the second conductive member 320 and the ground plane of the conductive middle frame 120 must both be less than N times the breakdown voltage between the second conductive member 320 and the metal lead in the bend region 230a, where N is an adjustment factor and can be between 1 / 3 and 1.

[0111] When the electrostatic charge absorbed by the second conductive member 320 reaches a certain amount, so that the potential difference between the second conductive member 320 and the conductive middle frame 120 is sufficient to break through the first insulating member 130 c , the second conductive member 320 can transfer the electrostatic charge to the conductive middle frame 120 .

[0112] In one embodiment, the first insulating member 130c may be an insulating medium such as an anodized layer or adhesive film, having a resistivity greater than 1000 kΩm. The anodized layer may be an anodized layer formed on the surface of a metal material through oxidation. The adhesive film may be an insulating adhesive. When the potential difference between the second conductive member 320 and the conductive middle frame 120 is small, the insulating adhesive exhibits insulating properties. When the potential difference between the second conductive member 320 and the conductive middle frame 120 increases to a certain level, the electrostatic charge adsorbed on the second conductive member 320 can break through the insulating adhesive and reach the conductive middle frame 120 for grounding. The adhesive film may also be a nonlinear conductive adhesive. Nonlinear conductive adhesive is a type of adhesive material with nonlinear conductive properties. When the potential difference between the two ends is low (for example, within 100V), the nonlinear conductive adhesive has a certain resistivity. The resistivity is large enough to insulate the second conductive member 320 from the conductive middle frame 120. When the potential difference between the two ends of the nonlinear conductive adhesive increases to a certain level (for example, greater than 100V), the resistivity of the nonlinear conductive adhesive drops sharply, allowing the second conductive member 320 to transfer the adsorbed electrostatic charge to the conductive middle frame 120 through the nonlinear conductive adhesive, thereby forming a secondary discharge release method.

[0113] In some possible embodiments, as shown in FIG10 , an insulating gap is provided between the first conductive member 310 and the second conductive member 320, for example, a third gap 130d is provided between the first conductive member 310 and the second conductive member 320. Specifically, the first conductive member 310 can be attached to the inner wall of the enclosure 1101, and the second conductive member 320 is separated from the first conductive member 310 by a third gap 130d at one end in the Z direction shown in FIG9 . It should be noted that there are multiple options for the spacing position of the first conductive member 310 and the second conductive member 320, for example, they can be at the inner side wall of the enclosure 1101, at the inner wall of the side frame 1102, or at the inner walls of both the enclosure 1101 and the side frame 1102, and can be designed according to the structure and position of the first conductive member 310 and the second conductive member 320. The first conductive member 310 and the second conductive member 320 are not directly or indirectly electrically connected. When the potential difference is low, the first conductive member 310 will not release electrostatic charge to the second conductive member 320. The design of the third gap 130d can be designed according to actual needs.

[0114] The second conductive member 320 is electrically connected to the conductive middle frame 120, where the electrical connection may include a contact electrical connection between the second conductive member 320 and the conductive middle frame 120. In one embodiment, a third conductive member 330 may be disposed between the second conductive member 320 and the conductive middle frame 120, with the upper and lower ends of the third conductive member 330 respectively contacting and electrically connecting with the second conductive member 320 and the conductive middle frame 120.

[0115] In one embodiment, the first conductive member 310 can be made of a conductive material and have a relatively low resistivity. For example, the first conductive member 310 can be made of a material such as silver paste or copper. Small-particle silver powder is added to the silver paste, where small particle size refers to particles with a particle size in the micron range. The silver powder particles have a relatively high filling ratio in the silver paste, for example, in the range of 60% to 70%, or above 70%. The resistivity ρ1 of the first conductive member 310 can be less than 0.000001Ωm. The first conductive member 310 can be a silver paste layer printed on the inner wall surface of the insulating upper cover 110, or a copper layer fixed to the inner wall surface of the insulating upper cover 110 by a process such as gluing. The first conductive member 310 with a relatively low resistivity is more conducive to absorbing the electrostatic charge in the first gap 130a.

[0116] In one embodiment, the second conductive member 320 can be made of a conductive material, and the resistivity of the second conductive member 320 is relatively high, at least greater than the resistivity of the first conductive member 310. In one embodiment, the second conductive member 320 can be made of a high-resistivity conductive material, such as graphite or carbon fiber, and the resistivity ρ2 of the material can be greater than 0.00001 Ωm. The second conductive member 320 can be a metal layer formed by printing or etching the above-mentioned material and attached to the inner wall surface of the insulating cover 110.

[0117] When the first conductive member 310 continuously absorbs the electrostatic charge of the first gap 130a, and the potential difference between the first conductive member 310 and the second conductive member 320 increases to a level that can break through the third gap 130d, the electrostatic charge absorbed by the first conductive member 310 can be transferred to the second conductive member 320 and then transferred to the conductive middle frame 120 through the second conductive member 320.

[0118] The third gap 130d is filled with air. In this solution, in order to ensure that the electrostatic charge will not discharge to the bending area 230a before and after the breakdown of the third gap 130d, causing abnormal display function, the breakdown threshold voltage of the third gap 130d (referring to the breakdown of the air or other medium in the third gap 130d) and the voltage from the first conductive member 310 to the conductive middle frame 120 ground plane both need to be less than N times the breakdown voltage between the first conductive member 310 and the metal lead in the bending area 230a, where N is an adjustment coefficient and can take a value between 1 / 3 and 1.

[0119] In this embodiment, the secondary trip point is set before the second conductive member 320 with high resistivity, and the current limiting effect of the second conductive member 320 will be better. Under the same size, the high-frequency suppression effect of the secondary trip will be better.

[0120] In one embodiment, as shown in FIG11 , an insulating space is provided between the first conductive member 310 and the second conductive member 320. For example, a second insulating member 130e may be provided between the first conductive member 310 and the second conductive member 320. Similar to the first insulating member 130c, both ends of the second insulating member 130e may be in contact with the first conductive member 310 and the second conductive member 320, respectively, or have a certain gap, which may be electrically broken through.

[0121] Among them, in this solution, in order to ensure that the electrostatic charge will not discharge to the bending area 230a before and after the breakdown of the second insulating part 130e, causing abnormal display function, the breakdown threshold voltage of the second insulating part 130e and the ground plane voltage from the first conductive part 310 to the conductive middle frame 120 need to be less than N times the breakdown voltage between the first conductive part 310 and the metal lead of the bending area 230a, where N is the adjustment coefficient, which can take a value between 1 / 3 and 1.

[0122] When the electrostatic charge adsorbed by the first conductive member 310 reaches a certain amount, so that the potential difference between the first conductive member 310 and the second conductive member 320 is sufficient to break through the second insulating member 130e, the first conductive member 310 can transfer the transmitted electrostatic charge to the second conductive member 320 and finally be grounded through the conductive middle frame 120.

[0123] In some possible embodiments, as shown in FIG7 , the display module 200 includes a flexible circuit board having a bending area 230a to achieve narrower black borders on the sides of the display panel, thereby increasing the display area of ​​the display panel relative to the entire mobile phone panel. The bending area 230a can be formed by bending the edge of the display module 200 or other areas that do not have a display function. Although the bending area 230a does not have a display function, the bending area 230a is provided with a wiring structure for a flexible screen, such as a touch wiring layer for an OLED screen. When the charge on the surface of the display module 200 enters the interior of the mobile phone through the first gap 130a and the static electricity is transferred to the position of the bending area 230a, it will cause the display module 200 to have display errors such as soft failure, affecting the display quality of the electronic device.

[0124] The insulating cover 110 has an inner side surface 111 on the inner side, the bending area 230a and the inner side surface 111 are arranged opposite each other, and the first conductive member 310 can be arranged on the inner side surface 111. Specifically, referring to FIG. 7 , the first conductive member 310 is located on the inner side surface 111 of the frame 1101.

[0125] In one embodiment, referring to Figures 4 and 8, Figure 8 illustrates an exploded view of a portion of the insulating cover and display module viewed from the back of the unfolded foldable phone. A bending zone 230a may be provided on the display module's side in the opposite direction of the X direction, on only one side in the X direction, or on both sides in the X direction and the opposite direction of the X direction, depending on the design requirements of the foldable phone. On the side with the bending zone 230a, such as the side in the opposite direction of the X direction shown in Figure 8, a first conductive member 310 is provided on the inner side 111 of the insulating cover 110.

[0126] In particular, along the extension direction of the inner side surface 111 where the first conductive member 310 is located (such as the direction of the Y-axis in FIG8 ), the length of the first conductive member 310 is greater than or equal to the length of the bending zone 230a. Referring to FIG8 , the length of the first conductive member 310 along the Y-axis is H1, and the length of the bending zone 230a along the Y-axis is H2. Length H1 is greater than or equal to length H2, so that the first conductive member 310 can cover the bending zone 230a in the length direction. Static electricity collected in the first gap 130a can be absorbed by the first conductive member 310 as much as possible, and there will be no vacant area (referring to the space where the first conductive member 310 is not provided) that allows static electricity to be transferred to the bending zone 230a. This prevents the bending zone 230a from being affected by static electricity and causing soft failures or other faults.

[0127] It should be noted that, as shown in FIG4 , the inner side surface of the insulating cover 110 is annular in structure, with inner side surfaces 111 provided on all four sides of the insulating cover 110. For example, FIG8 only shows the inner side surface 111 of the insulating cover 110 in FIG4 on the side opposite to the X direction. Similarly, the insulating cover 110 may have inner side surfaces 111 in the X direction, the opposite to the X direction, the Y direction, and one side opposite to the Y direction, for a total of four inner side surfaces 111. The inner side surface 111 on which the first conductive member 310 is located described in this embodiment may refer to the inner side surface 111 on the side opposite to the X direction in FIG8 .

[0128] In one embodiment, the first conductive member 310 can be partially bent onto the frame 1101 located on the Z-direction side in FIG8 and located on the inner side 111 of the frame 1101 on the Y-direction side. Alternatively, the two ends of the first conductive member 310 are respectively bent onto the frame 1101 on the Y-direction and the anti-Y-direction side in FIG8 . In one embodiment, the first conductive member 310 is provided on all four inner side surfaces 111 of the entire frame 1101, and the four inner side surfaces are respectively located in the X-direction, the anti-X-direction, the Y-direction, and the anti-Y-direction of the frame 1101. This allows the first conductive member 310 to absorb the charge collected in the entire first gap 130a (the first gap 130a is provided along the entire periphery of the display module 200) and transfer it to the conductive middle frame 120 through the second conductive member 320 for grounding. In one embodiment, the first conductive members 310 on the four inner side surfaces are electrically connected so that the static charge accumulated in the entire circle of the first gap 130a can be absorbed by the first conductive member 310, and only one second conductive member 320 is required to transfer the static electricity to the conductive middle frame 120 for grounding.

[0129] In one embodiment, referring to FIG8 , the width W1 of the first conductive member 310 is greater than or equal to 0.5 mm. The first conductive member 310 may be in the shape of an elongated strip. The width W1 of the first conductive member 310 may be the width extending along the X-direction in FIG8 . The width W1 of the first conductive member 310 is greater than or equal to 0.5 mm, and may be, for example, 1.0 mm or 1.5 mm. This allows the first conductive member 310 to be partially disposed within the first gap between the display module 200 and the insulating cover 110, while the remaining portion may extend from the first gap and be in electrical contact or insulated from the second conductive member 320 near the side frame 1102. Furthermore, the first conductive member 310 may be a metal layer disposed on the inner side surface 111. The relatively large width allows the first conductive member 310 to better adhere to the inner side surface 111 and better absorb electrostatic charge in the first gap.

[0130] In one embodiment, referring to FIG8 , the second conductive member 320 is disposed on the inner side surface 111. Specifically, the second conductive member 320 is disposed on the inner side surface 111 of the side frame 1102. Along the extension direction of the inner side surface 111, the length H3 of the second conductive member 320 is greater than or equal to 0.5 mm. The length H3 of the second conductive member 320 may be the length extending along the Y direction in FIG8 . The second conductive member 320 may be a metal layer disposed on the inner side surface 111. By limiting the length of the second conductive member 320 along the Y direction, the second conductive member 320 can be better fitted to the inner side surface 111, and the second conductive member 320 can better contact the silver paste, thereby improving the stability of the electrical connection. In one embodiment, as shown in FIG8 , the length H3 of the second conductive member 320 can be less than 10 mm, so that the length of the second conductive member 320 along the Y direction should not be too large. While ensuring that the second conductive member 320 can transfer electrostatic charge to the conductive middle frame 120 for grounding, strong electrostatic interference is prevented between the second conductive member 320 with a larger length and the bending area 230a.

[0131] In one embodiment, the display module 200 has a bending region 230a, and the spacing H4 between the bending region 230a and the conductive structure is less than or equal to 5mm. In one embodiment, the spacing can be the spacing between the closest positions of the bending region 230a and the conductive structure. Referring to FIG7 , the conductive structure 300 may include a first conductive member 310 and a second conductive member 320, the second conductive member 320 is closest to the bending region 230a, and the minimum distance H4 between the second conductive member 320 and the bending region 230a is less than or equal to 5mm. Taking into account factors such as product size optimization design, the equivalent breakdown distance H4 can be designed to be less than 5mm, for example, 2mm. On this basis, by designing the conductive structure of the first conductive member and the second conductive member shown in the above embodiments, by designing a secondary discharge structure, and by designing the resistivity of the second conductive member to be greater than that of the first conductive member, static electricity can be prevented from affecting the bending region 230a.

[0132] In some possible implementations, the number of second conductive members 320 may be one. In one embodiment, as shown in FIG12 , the number of second conductive members 320 may be at least two, with the at least two second conductive members 320 spaced apart along the edge of the display module 200, and the resistivity of the at least two second conductive members 320 greater than the resistivity of the first conductive member 310. Referring to FIG12 , this embodiment uses three second conductive members 320 as an example. The three second conductive members 320 may be spaced apart along the Y-axis, and all three second conductive members 320 are located between the display module and the insulating cover 110. The three second conductive members 320 may have the same shape, material, and size. The resistivity of the three second conductive members 320 may be greater than that of the first conductive member 310, and the resistivity of the three second conductive members 320 may be greater than 0.00001 Ωm.

[0133] In one embodiment, as shown in FIG13 , the number of first conductive members 310 is at least two, the number of second conductive members 320 is greater than or equal to the number of first conductive members 310, and the first conductive member 310 and at least one second conductive member 320 are electrically connected or insulated and spaced apart. In the embodiment of the present application, the length of the first conductive member 310 can be consistent with the length of one side of the electronic device. In addition to the aforementioned metal loss caused by the coupling current that affects the antenna performance, another effect is that the first conductive member couples with the antenna to form spurious signals, which leads to a pit in the antenna efficiency. In the embodiment of the present application, the longer first conductive member is interrupted and separated into multiple shorter first conductive members, which can control the frequency of the efficiency pit and can move the spurious frequency point out of the design frequency band by adjusting the position of the interruption point.

[0134] 13 , two first conductive members 310 may be disposed at opposing locations of the bending region 230a, and the two first conductive members 310 may be insulated by a fourth gap 130f. In one embodiment, the two first conductive members 310 may also be insulated by an insulating medium.

[0135] In which, each first conductive member 310 is electrically connected to at least one second conductive member 320 or forms an insulating interval arrangement, so that the electrostatic charge adsorbed by each first conductive member 310 can be transferred to the second conductive member 320 through its corresponding second conductive member 320, and finally grounded through the conductive middle frame.

[0136] In one embodiment, as shown in FIG. 13 , at least two first conductive members 310 are spaced apart, and a spacing distance H5 between two adjacent first conductive members 310 is less than 2 mm. This prevents the first conductive members 310 from being unable to effectively pick up electrostatic charges during ESD testing due to an excessively large gap, thereby causing static electricity to directly enter the insulating upper cover 110 and the conductive middle frame 120 through the fourth gap 130 f to form a cavity structure, thereby causing display function abnormalities.

[0137] In one embodiment, at least one of the first conductive member 310 and the second conductive member 320 is disposed on the inner wall of the insulating upper cover 110. Referring to Figures 7 and 8 , the first conductive member 310 and the second conductive member 320 can both be disposed on the inner wall of the insulating upper cover 110 and opposite to the bending region 230a.

[0138] In some possible embodiments, the outer wall of at least one of the first conductive member 310 and the second conductive member 320 is flush with the inner wall of the insulating cover 110. The flushness of the first conductive member 310 and the inner wall can avoid the increased risk of interference with the display module 200 due to the thickness of the first conductive member. The flushness of the second conductive member 320 and the inner wall can increase the breakdown distance from the bending area 230a, reducing the risk of ESD interference in the bending area 230a. Referring to Figure 14, the insulating cover 110 includes a frame 1101 and a side frame 1102. In one embodiment, the outer wall of at least one of the first conductive member 310 and the second conductive member 320 can protrude from the inner wall of the insulating cover 110. The outer wall of at least one of the first conductive member 310 and the second conductive member 320 can be recessed into the inner wall of the insulating cover 110.

[0139] In one embodiment, a groove may be provided on the inner side of the enclosure 1101, and the first conductive member 310 may be disposed in the corresponding groove, such that the outer wall surface of the first conductive member 310 on the side opposite to the Z direction is flush with the inner side surface 111 of the enclosure 1101 (the wall surface of the enclosure 1101 on the side opposite to the Z direction, refer to the dotted line in FIG14 ). In one embodiment, the groove may not be provided on the inner side surface 111 of the enclosure 1101, and the first conductive member 310 may be a metal layer sprayed or laminated on the inner side surface 111 of the enclosure 1101. However, since the first conductive member 310 is a metal layer and is relatively thin, it is structurally nearly flush with the inner side surface of the enclosure 1101, which also falls within the "flat" state described in the embodiments of the present application.

[0140] In one embodiment, a groove can be provided on the inner side of the side frame 1102, and the second conductive member 320 can be provided in the corresponding groove, so that the outer wall surface of the second conductive member 320 on one side in the X direction is flush with the inner side surface 111 of the side frame 1102 (the wall surface of the side frame 1102 on one side in the X direction, refer to the dotted line in Figure 14). In one embodiment, the groove can be omitted from the inner side surface 111 of the side frame 1102, and the second conductive member 320 can be a metal layer sprayed or laminated on the inner side surface 111 of the side frame 1102. However, since the second conductive member 320 is a metal layer and is relatively thin, it is structurally nearly flush with the inner side surface of the side frame 1102, which also falls within the "flat" state described in the embodiments of the present application.

[0141] In some possible embodiments, as shown in FIG15 , the grounding member may include a conductive middle frame 120 having a bottom frame portion 1201 and side portions 1202 connected thereto. The bottom frame portion 1201 and the side portions 1202 may be two components, connected to form a single unit by welding or gluing; alternatively, the conductive middle frame 120 may be a one-piece structure, and the bottom frame portion 1201 and the side portions 1202 may be two parts of the one-piece structure, connected at a corner. The bottom frame portion 1201 is located on the back side of the display module 200. The bottom frame portion 1201 may be located on the non-display side of the display module 200, i.e., the side opposite to the Z direction in FIG15 . The bottom frame portion 1201 may secure and support the display module 200 on the back side of the display module 200. The side portions 1202 are located on the edge of the display module 200, i.e., the side opposite to the X direction in FIG15 . It should be noted that FIG15 only shows a cross-sectional schematic diagram of a partial area in the electronic device. In the overall structure of the electronic device, the side portion 1202 can be located on the four sides of the display module 200 to better protect the side of the display module 200.

[0142] In one embodiment, the side portion 1202 may be located outside the side frame 1102 of the insulating cover 110 , that is, on the side opposite to the X direction shown in FIG. 15 , and a portion of the side frame 1102 is fixed between the side portion 1202 and the display module 200 .

[0143] In one embodiment, the side portion 1202 may be an antenna radiator 150 of an electronic device. The side portion 1202 may be made entirely of metal. The antenna pattern structure formed by interrupting the side portion 1202 constitutes the antenna radiator 150 .

[0144] In one embodiment, the projection of the antenna radiator 150 along the shortest distance toward the display module 200 at least partially overlaps with the second conductive member 320. For example, as shown in FIG15 , the linear projection of the antenna radiator 150 along the X direction (see the dashed arrow extending from the antenna radiator 150 in the X direction in FIG7 ) at least partially overlaps with the second conductive member 320.

[0145] In one embodiment, referring to Figures 15, 20, 21, and 22, Figure 20 shows a schematic top view of a conductive middle frame 120, wherein portions of a bottom frame portion 1201 and side portions 1202 of the conductive middle frame 120 are connected as an integral structure, for example, at corners and in the middle. A fifth gap 1203 is provided between portions of the side portions 1202 and the bottom frame portion 1201.

[0146] In one embodiment, referring to Figure 21, Figure 21 shows a schematic cross-sectional view taken along line AA in Figure 20. The bottom frame portion 1201 and the side portion 1202 in Figure 21 are connected to form a single unit, or are formed as a one-piece structure. The portion of the side portion 1202 covered by the dashed line in Figure 21 may be the antenna radiator 150 of the electronic device. In one embodiment, the structures shown in Figures 7, 9, 10, 11, and 15 are similar to the structure in Figure 21 and may serve as cross-sectional views taken along line AA in Figure 20.

[0147] In one embodiment, referring to FIG. 22 , FIG. 22 shows a BB cross-sectional schematic diagram in FIG. 20 , the bottom frame portion 1201 and the side portion 1202 in FIG. 22 are separate structures, and a fifth gap 1203 can be set between the side portion 1202 and the bottom frame portion 1201 .

[0148] In one embodiment, referring to Figure 20, one side portion 1202 of the conductive middle frame 120 can have three parts, namely a first side portion 1202a, a second side portion 1202b and a third side portion 1202c. The first side portion 1202a and the second side portion 1202b can be spaced apart, and the spaced apart position is connected to the fifth gap 1203; the second side portion 1202b and the third side portion 1202c can be spaced apart, and the spaced apart position is connected to the fifth gap 1203.

[0149] In one embodiment, in the embodiment of the present application, only the middle second side portion 1202b can be the antenna radiator 150, any one of the first side portion 1202a, the second side portion 1202b and the third side portion 1202c can be the antenna radiator 150, or any two of the first side portion 1202a, the second side portion 1202b and the third side portion 1202c can be combined to form the antenna radiator 150, or the first side portion 1202a, the second side portion 1202b and the third side portion 1202c can all be the antenna radiator 150.

[0150] In one embodiment, FIG22 merely illustrates an embodiment in which a fifth gap 1203 may be provided between the side portion 1202 and the bottom frame portion 1201. The fifth gap 1203 may be located to the right of the side portion 1202. In another embodiment, the relative positions of the side portion 1202 and the bottom frame portion 1201 may be varied. For example, the bottom frame portion 1201 may be located below the side portion 1202, and the fifth gap 1203 may be located below the side portion 1202. Both of these fall within the scope of protection defined in this application.

[0151] In one embodiment, the electronic device described in the embodiment of the present application can be an electronic device with a folding function, such as a folding mobile phone. Referring to Figures 2 and 8, the electronic device can include a rotating shaft 100c and at least two insulating covers 110. The rotating shaft 100c can be located between the two insulating covers 110 (Figure 8 only shows two insulating covers for example, and does not show the rotating shaft 100c between the two insulating covers). At least two insulating covers 110 are rotatably connected via the rotating shaft 100c; the display module 200 can include a flexible screen, which is respectively connected to at least two of the insulating covers 110. The entire flexible screen can be unfolded and attached to the two insulating covers 110. The flexible screen is used to fold and unfold relative to the rotating shaft 100c.

[0152] In some possible implementations, as shown in FIG16 , one end of the bending region 230a can be connected to the circuit board 500 via a board-to-board connector 400 after bending. The board-to-board connector 400 can be used for precise interconnection between the display module and the mainboard.

[0153] In one embodiment, referring to FIG. 16 , the circuit board 500 may be electrically connected to the conductive middle frame 120 via the fourth conductive member 600 .

[0154] In some possible embodiments, as shown in FIG17 , the flexible display layer 230 further includes an extension section 230c, which is a linear extension of the lower portion of the bending region 230a in the X direction. The extension section 230c can be integral with the bending region 230a. A display driver chip 700 is disposed on the side of the extension section 230c facing the conductive middle frame 120. The display driver chip 700 is used to provide display drive control signals to the flexible display layer 230.

[0155] The present application also provides an embodiment of an insulating upper cover, as shown in Figures 7 and 8. Similar to the scheme of the insulating upper cover in the embodiment of the above-mentioned electronic device, the insulating upper cover 110 shown in this embodiment can be enclosed at the edge of the display module 200, and a first gap 130a is provided between the insulating upper cover 110 and the display module 200. The first gap 130a can be located on the display direction side of the display module 200.

[0156] The insulating cover 110 may include a frame 1101 and a side frame 1102. The frame 1101 is located on the display side of the display module 200 and is enclosed in a "mouth" shape. The side frame 1102 is located on the edge of the display module 200 and is bent and extended from the frame 1101 to the side opposite to the Z direction. In one embodiment, the frame 1101 and the side frame 1102 can be two independent frames, and the two independent frames are fixedly connected by gluing or snapping. In one embodiment, the frame 1101 and the side frame 1102 can be an integrated structure. The frame 1101 and the side frame 1102 can be two regions of the insulating cover 110. The XZ cross-sectional view of the insulating cover 110 can be an "L"-shaped structure.

[0157] In one embodiment, as shown in FIG7 , the first conductive member 310 can be located on the side of the enclosure 1101 along the anti-Z direction, with one end of the first conductive member 310 in the X direction extending within the first gap 130a. The end of the first conductive member 310 in the anti-X direction protrudes from the left side of the first gap 130a to be adjacent to the inner wall of the side frame 1102. The second conductive member 320 can be located on the side of the side frame 1102 in the X direction, with one end of the second conductive member 320 in the Z direction extending adjacent to the enclosure 1101 and electrically connected to the first conductive member 310. In this embodiment, the end of the first conductive member 310 in the anti-X direction and the end of the second conductive member 320 in the Z direction can contact each other, thereby achieving contact and electrical connection between the first conductive member 310 and the second conductive member 320. In one embodiment, an insulating space may also be provided between the first conductive member 310 and the second conductive member 320. Specifically, reference may be made to the structures shown in FIG10 and FIG11. The first conductive member 310 and the second conductive member 320 may be provided with an insulating space through a third gap 130d or a second insulating member 130e. The specific structure and beneficial effects may refer to the relevant statements in the above-mentioned electronic device and will not be repeated here.

[0158] In one embodiment, the first conductive member 310 can be made of a conductive material and have a relatively low resistivity. For example, the first conductive member 310 can be made of a material such as silver paste or copper. Small-particle silver powder is added to the silver paste, where small particle size refers to particles with a particle size in the micron range. The silver powder particles have a relatively high filling ratio in the silver paste, for example, in the range of 60% to 70%, or above 70%. The resistivity ρ1 of the first conductive member 310 can be less than 0.000001Ωm. The first conductive member 310 can be a silver paste layer printed on the inner wall surface of the insulating upper cover 110, or a copper layer fixed to the inner wall surface of the insulating upper cover 110 by a process such as gluing. The first conductive member 310 with a relatively low resistivity is more conducive to absorbing the electrostatic charge in the first gap 130a.

[0159] In one embodiment, the second conductive member 320 can be made of a conductive material, and the resistivity of the second conductive member 320 is relatively high, at least greater than the resistivity of the first conductive member 310. In one embodiment, the second conductive member 320 can be made of a high-resistivity conductive material, such as graphite or carbon fiber, and the resistivity ρ2 of the material can be greater than 0.00001 Ωm. The second conductive member 320 can be a metal layer formed by printing or etching the above-mentioned material and attached to the inner wall surface of the insulating cover 110.

[0160] In one embodiment, the resistivity of the second conductive member 320 may be less than 0.01 Ωm, so that the second conductive member 320 can transfer the electrostatic charge absorbed on the first conductive member 310 to the grounding member for grounding.

[0161] The insulating upper cover described in the embodiment of the present application can be used to be set on the display side of the electronic device and enclosed at the edge of the display module, and a first conductive member and a second conductive member are set on the inner side of the upper cover. By setting the second gap, the second conductive member and the grounding member such as the conductive middle frame will not be electrically connected at a lower voltage, thereby reducing the current generated by the grounding member due to antenna radiation energy (this current does not include the current generated when the second conductive member releases static electricity transmitted from the first gap to the grounding member) entering the second conductive member, which can slow down the metal loss of the first conductive member and the second conductive member, effectively reduce the impact of the conductive member on the antenna, and improve the performance of the antenna. In addition, when the second conductive member with a larger resistivity releases static electricity to the grounding member, a larger loop impedance can be formed, reducing the high-frequency component in the secondary discharge process and reducing the risk of soft failure. The embodiment of the present application prevents soft failure and other problems in electronic devices while ensuring that the antenna has better Over-the-Air Technology (OTA) performance.

[0162] The present application also provides an electronic device, similar to the embodiments of the electronic devices described above. The electronic device can be a terminal product suspended metal structural member electrostatic discharge (e.g., a suspended decorative member of a mobile phone camera module) or an outdoor power supply product lightning residual voltage release structure. Referring to FIG18 , FIG18 shows a simplified schematic diagram of a possible protection scheme for a power supply product, including: a first component 410, a grounding member 420, a first conductive member 310, and a second conductive member 320. The first component 410 can be a PCB trace, which is susceptible to lightning strikes. To ensure that the chip 440 can operate normally under lightning strikes, a protective device 430 is usually added to the circuit. In addition, some products use a sharp protective structure such as the first conductive member 310 and the second conductive member 320 when processing the metal copper layer on the PCB. When struck by lightning, the potential difference between the first component 410 and the grounding member 420 (which can be the ground where the power supply is placed) is sufficient to break through the first conductive member 310 and the second conductive member 320, releasing the abnormally high voltage on the PCB trace by tripping the tip gap.

[0163] In one embodiment, the first component 410, the grounding component 420, the first conductive component 310, and the second conductive component 320 can all be disposed within a metal structure 460, which can be a metal housing. The first component 410 can be connected to an interface 450, which can be at least one of an electrical interface and a communication interface to provide power and communication information to the chip 440.

[0164] In this embodiment, the second conductive member 320 can be made of a conductive material, and the resistivity of the second conductive member 320 is relatively high, at least greater than the resistivity of the first conductive member 310. In one embodiment, the second conductive member 320 can be made of a high-resistivity conductive material, such as graphite or carbon fiber, and the resistivity ρ2 of the material can be greater than 0.00001 Ωm. The second conductive member 320 can be a pointed structure attached to the inner wall surface of the first component 410 by a process such as printing or etching.

[0165] In this embodiment of the application, the second conductive member 320 is made of a high-resistivity conductive material, which can be a conductive material with a resistivity at least greater than that of the first conductive member 310. The first and second conductive members 310 and 320 are spaced apart to prevent direct electrical connection between the second conductive member 320 and a grounding element, such as the ground, at low voltages. By optimizing the material of the tip protection structure between the first member and the grounding element, primarily optimizing resistivity, and using a high-resistivity material for the second conductive member, high-frequency components during tip gap tripping are reduced, improving product performance during lightning strikes.

[0166] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: include: Insulating cover plate for display module; an insulating upper cover, which is arranged on the edge of the insulating cover plate, and a first gap is formed between the edge of the insulating cover plate and the insulating upper cover; a grounding member, at least partially located on a non-display side of the display module; An electrostatic protection structure includes a first conductive member and a second conductive member, the resistivity of the second conductive member is greater than the resistivity of the first conductive member, and the first conductive member is at least partially arranged in the first gap, wherein an insulating space is set between the first conductive member and the second conductive member, and the second conductive member is electrically connected to the grounding member, or the first conductive member and the second conductive member are electrically connected, and an insulating space is set between the second conductive member and the grounding member.

2. The electronic device according to claim 1, wherein The resistivity of the second conductive member is greater than 0.00001Ωm.

3. The electronic device according to claim 1 or 2, characterized in that: The material of the second conductive member includes at least one of graphite, carbon fiber and silver paste.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The resistivity of the first conductive member is less than 0.000001Ωm.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The insulating spacing between the second conductive member and the grounding member includes: a second gap is provided between the second conductive member and the grounding member.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The insulating spacing between the second conductive member and the grounding member includes: an insulating member is provided between the second conductive member and the grounding member.

7. The electronic device according to claim 6, wherein: The resistivity of the insulating member is greater than 1000 KΩm.

8. The electronic device according to claim 6 or 7, characterized in that: The material of the insulating member includes at least one of metal oxide, insulating glue and non-linear conductive glue.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The display module includes a flexible circuit board having a bending area. The first conductive member is arranged on the inner side surface of the insulating upper cover. The inner side surface is a side surface of the insulating upper cover facing the bending area.

10. The electronic device according to claim 9, characterized in that Along the extending direction of the edge of the insulating cover plate, the length of the first conductive member is greater than or equal to the length of the bending area.

11. The electronic device according to claim 10, characterized in that The width of the first conductive member is greater than or equal to 0.5 mm.

12. The electronic device according to any one of claims 9 to 11, characterized in that: The second conductive member is arranged on the inner side surface and extends along the edge of the insulating cover plate. The length of the second conductive member is greater than or equal to 0.5 mm.

13. The electronic device according to any one of claims 1 to 12, characterized in that: The display module includes a flexible circuit board having a bending area, and a spacing between the bending area and the conductive structure is less than or equal to 5 mm.

14. The electronic device according to any one of claims 1 to 13, characterized in that: The number of the first conductive members is at least two, the number of the second conductive members is greater than or equal to the number of the first conductive members, and each of the first conductive members and at least one of the second conductive members are electrically connected or arranged with an insulated interval.

15. The electronic device according to any one of claims 1 to 14, characterized in that: The number of the second conductive members is at least two, and the at least two second conductive members are arranged at intervals along the edge extension direction of the insulating cover plate. The resistivity of the at least two second conductive members is greater than the resistivity of the first conductive member.

16. The electronic device according to claim 15, characterized in that The at least two first conductive members are spaced apart along an edge extension direction of the insulating cover plate, and a spacing distance between two adjacent first conductive members is less than 2 mm.

17. The electronic device according to any one of claims 1 to 16, characterized in that: At least one of the first conductive member and the second conductive member is disposed on the inner wall of the insulating upper cover.

18. The electronic device according to any one of claims 1 to 17, characterized in that: The grounding member includes a conductive middle frame, which has a bottom frame portion and a side portion connected to each other. The bottom frame portion is located on the non-display side of the display module, and the side portion is located on the edge side of the display module. The side portion includes an antenna radiator.

19. The electronic device according to claim 18, wherein: A projection of the antenna radiator along the shortest distance direction toward the display module at least partially overlaps with the second conductive member.

20. The electronic device according to any one of claims 1 to 19, characterized in that: The insulating upper cover includes a surrounding frame and a side frame located on one side of the surrounding frame, and the side frame extends from the surrounding frame to the back side of the display module; The first conductive member is arranged on the inner wall of the frame, and the side frame includes a first wall and a second wall. The first wall is arranged opposite to the display module, and the second wall is opposite to or in contact with the grounding member. Part of the second conductive member is located on the first wall, and the other part is located on the second wall.

21. The electronic device according to any one of claims 1 to 10, characterized in that: The electronic device includes a rotating shaft, the number of the insulating upper covers is at least two, the display module includes a flexible screen, and at least two of the insulating upper covers are unfolded or folded by the rotating shaft; The first gap is provided between the flexible screen and the at least two insulating upper covers; The electrostatic protection structure is provided on the at least two insulating upper covers.

22. An insulating upper cover, characterized in that: The insulating cover is used to enclose the edge of the display module, and the insulating cover includes a frame and a side frame located on one side of the frame, the side frame extends from the outer edge of the frame, and the side frame and the frame form a bent structure; A first conductive member is provided on the inner wall of the frame, and a second conductive member is provided on the inner wall of the side frame. The resistivity of the second conductive member is greater than that of the first conductive member. The first conductive member and the second conductive member are electrically connected or insulated from each other.

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