Apparatus for bonding a component with improved tool holder contamination protection

Abstract

The invention relates to an apparatus 100 for bonding a component 600 to or on one or more substrates, wherein the apparatus comprises a tool holder 400 and a component tool 500, wherein the apparatus provides at least one gas curtain 750 which is at least partially enclosed by at least one recess 520 which is formed in edge regions between the tool holder 400 and the component tool 500; and wherein, in use, the at least one gas curtain 750 is arranged so as to reduce a degree of depositing of contamination 850 on one or more portions of the tool holder contact surface 450, 450' by providing at least one gas flow path from an inner portion of each tool contact surface to an outer edge.

Description

[0001] Besi Switzerland AG

[0002] Hinterbergstr. 32a

[0003] CH - 6312 Steinhausen, Switzerland

[0004] Device for bonding a component with improved tool holder contamination protection

[0005] Technical area

[0006] The present invention relates to a device for bonding a component, for example a chip, and one or more substrates.

[0007] State of the art

[0008] Generally, chip bonding tools are coupled with suitably configured tool holders that utilize techniques such as vacuum fixation, magnets, clamping force, or a combination thereof. Furthermore, methods and devices for reducing deposits or mitigating contamination on the bondhead during component bonding to substrates are known, for example, from WO 2012 / 165313 A1 or EP 3 098 837 A2.

[0009] However, contamination of the tool holders and / or tools can cause various problems, including sticking of the tool to the holder, reduced accuracy due to non-flat contact surfaces, leaks in vacuum coupling channels, reduced heat transfer between the heaters in the tool holder and the tool, and any combination thereof. The level of contamination can be even more problematic during processes such as thermocompression bonding or other chip assembly processes that require higher temperatures and / or pressures.

[0010] Object of the invention

[0011] The object of the invention is to provide improved contamination protection when bonding components to substrates.

[0012] Solution to the problem and brief description of the invention

[0013] The present disclosure provides an apparatus for bonding a component to or on one or more substrates, the apparatus comprising a tool holder having a tool holder contact surface for receiving a component tool. The tool holder further comprises at least one gas outlet, hereinafter referred to as a tool holder gas outlet, which provides a gas flow from the central region of the tool holder contact surface to the edge regions between the tool holder and the component tool. The apparatus also comprises at least one gas curtain flowing away from the edge regions and partially enclosed by recesses formed in the tool holder and in the component tool. The gas curtain reduces the deposition of contaminants on the tool holder contact surface.

[0014] To solve the problem of contamination, an improved contamination shield is disclosed for protecting at least a portion of the contact surface between a tool and a tool holder, optionally comprising a heating device. This shield prevents process residues and byproducts, such as flux, from condensing, depositing, or vaporizing on the contact surface. This is achieved by providing one or more gas curtains at one or more edge regions of the contact surface, thereby creating a substantial gas outflow. Nitrogen or another suitable gas may be used for the gas outflow, which is preferably maintained at a substantially constant flow rate during use.In chip bonding processes such as thermocompression bonding, the process area can become contaminated with process residues, such as flux, which can deposit on the contact surface through vapor condensation and / or particle deposition. These residues can enter the contact area between the tool and tool holder due to vacuum coupling and / or capillary force. According to this disclosure, one or more gas curtains are provided around the contact area by introducing a gas flow, for example, nitrogen, into a relatively small gap around the contact area. This gas flows outward, thereby reducing the risk of processing residues reaching the contact surface. Advantageously, the device can be configured to process components in an environment comprising inert gases, for example, by bonding.This environment can be provided in one or more chambers. Preferably, one or more suitably arranged exhaust systems can be used to further control the gas flow. The disclosed device can effectively reduce contaminants, for example, flux vapor in thermal processes, flux vapor in thermocompression processes, particles in cleanroom processes, or any combination thereof.

[0015] Embodiments of the invention are associated with various advantages and / or technical effects and are described with reference to the following embodiments.

[0016] Embodiments of an apparatus for bonding a component to or onto one or more substrates comprise a tool holder and a component tool, wherein the apparatus, in use, provides at least one gas curtain 750 at least partially enclosed by at least one recess 520 formed in edge regions between the tool holder and the component tool; and wherein, in use, the at least one gas curtain is arranged to reduce a deposition level of contamination on one or more portions of the tool holder contact surface by providing at least one gas flow path from an inner portion of each tool contact surface to an outer edge.

[0017] Embodiments of an apparatus for bonding a component to or onto one or more substrates comprise a bondhead for releasably receiving the component, which bondhead is arranged to be insertable into a bonding position with the component. Embodiments of an apparatus further comprise a tool holder having a tool holder contact surface for receiving a component tool, wherein the component tool, preferably in use, comprises a tool mounting surface arranged to be receivable by the tool holder contact surface. The tool holder further comprises at least one tool holder gas outlet arranged to provide, in use, at least one gas flow from a central portion of the tool holder contact surface to one or more edge regions of the tool holder contact surface between the tool holder and the component tool.The tool holder is further arranged to provide, in use, at least one gas curtain flowing away from the one or more edge regions of the tool holder contact surface, and wherein the at least one gas curtain is, in use, at least partially enclosed by at least one recess formed in the edge regions between the tool holder and the component tool, and wherein the at least one gas curtain is arranged, in use, to reduce a deposition level of contamination on one or more regions of the tool holder contact surface. The device enables improved bonding between a component and one or more substrates by reducing the deposition of contamination on the tool holder contact surface. This helps maintain a clean and efficient bonding process.

[0018] Optionally, in embodiments of a device, the at least one gas flow comprises an inert gas, nitrogen, argon, helium, neon, carbon dioxide, air, oil-free air, or any combination thereof. The presence of at least one gas flow comprising an inert gas further enhances the bonding process. The inert gas helps create a controlled environment that reduces the risk of chemical reactions with the process residues or byproducts that could promote deposits and / or condensation.

[0019] Optionally, in embodiments of a device in use, the at least one gas curtain is at least partially enclosed by at least one recess formed in an edge region of the tool holder contact surface and / or in an edge region of the tool attachment surface. The use of at least one recess contributes to enclosing the gas curtain and provides a more focused and directed gas flow. This improves the efficiency of the gas curtain by reducing contamination deposits and ensuring that the gas flow is used effectively.

[0020] The tool holder with a tool holder contact surface provides a secure and stable platform for receiving a component tool in embodiments of a device. This ensures more precise alignment and positioning of the component tool, thus providing more accurate and consistent bonding between components and substrates.

[0021] In a further development, embodiments of a device are particularly suitable for handling components, for example in the form of a semiconductor die, a semiconductor package, a chip, an integrated circuit, another substrate, or any combination thereof. For example, a component in the form of a combination of a semiconductor die or chips applied to a substrate, wherein the combination is to be bonded to another substrate. The suitability for accommodating various components enables versatile use in various applications.

[0022] In a further development, embodiments of a device further comprise, in use, an average spacing between the tool holder contact surface and the tool fastening surface in the vicinity of the at least one recess in a peripheral region of 0.5 mm or less.

[0023] Optionally, embodiments of an apparatus include a tool holder arranged to retain the component tool using a degree of vacuum, one or more magnets, a degree of clamping force, or any combination thereof.

[0024] Optionally, embodiments of a device include one arranged to, in use, increase the temperature of at least a portion of the bonding surface of a component. This enables effective bonding and ensures strong adhesion between the component and other materials. The device enables a controlled temperature increase that prevents overheating or thermal damage to the component. This provides improved integrity and increased reliability of the bonded structure. The device's potential temperature increase can be selectively applied to specific areas of the component to enable localized heating and bonding. This increases precision and minimizes unnecessary heat exposure.

[0025] Embodiments of a device comprise at least one heating device, which is preferably incorporated into the tool holder by insertion, for example, by means of a replaceable insert, or mechanically firmly connected, or preferably in the form of a sintered ceramic component integrally integrated with a heater, and is arranged such that, during use, it increases the temperature of at least part of the component tool. This eliminates the need for separate heating devices and simplifies the overall design of the system.

[0026] Optionally, in embodiments of a device, the device itself is arranged to exert a bonding pressure on at least a portion of a bonding surface of the component during use. Optionally, the component tool comprises a component mounting surface for receiving the component.

[0027] Further advantages and features of the invention will become apparent from the following figures, namely:

[0028] FIG. 1 A shows a simplified and schematic cross-section of an edge region of a bondhead comprising a tool holder with a tool holder contact surface for receiving a component tool;

[0029] FIG. 1 B shows a simplified and schematic cross-section of an edge region of a tool holder and a component tool after fastening the component tool to the tool holder;

[0030] FIG. 2 shows a bottom view of a tool holder after the component tool has been attached to the tool holder; and

[0031] FIG. 3 shows a perspective view of a tool holder before and / or after attachment of the component tool to the tool holder.

[0032] Detailed description of the invention

[0033] The term "bond surface" is used below to describe a component surface that bonds to the substrate when heated and / or subjected to mechanical pressure. The term "deposition level" refers to the amount of contamination deposited on the toolholder contact surface.

[0034] The term "vacuum level" refers to the pressure difference between the inside of the tool holder and the outside of the tool holder.

[0035] The term "bond position" may refer to a bond position where the device is connected to the substrate.

[0036] The term "bonding pressure" is used below to refer to pressure applied by a device for bonding a component to or on one or more substrates.

[0037] In the figures, a first axis 910, a second axis 920, and a third axis 930 are illustrated to facilitate a person skilled in the art in comparing the various views and parts. The first axis 910 is substantially perpendicular to the second axis 920, and the third axis 930 is substantially perpendicular to both the first axis 910 and the second axis 920.

[0038] It may be convenient to view the first axis 910 in an X direction, the second axis 920 in a Y direction, and the third axis 930 in a Z direction.

[0039] Typically, in use, the first axis 910 and the second axis 920 are substantially horizontal, and the third axis 930 is substantially vertical in use. To clarify the description of the various components, parts are shown in these conventional orientations in the figures. In addition, some relative terms, such as top, side, and bottom, have been used at the same time to conform to this convention. Nevertheless, the apparatus described in this disclosure may be designed and arranged by one skilled in the art to operate in various deviations from these conventional orientations and nominal coordinate axes. FIG. 1A shows a simplified and schematic cross-section of a peripheral portion of a bondhead 150 including a tool holder 400 having a tool holder contact surface 450, 450' for receiving a component tool 500.The bondhead 150 is part of an apparatus 100 for bonding a component 600 to or on one or more substrates. The bondhead 150 is configured to be releasably attached to the component 600 and located in a bonding position with the component 600. The cross-section in FIG. 1A represents a plane including the first axis 910 and the third axis 930, with the third axis 930 having a positive bottom-to-top direction and the first axis 910 having a positive left-to-right direction. The second axis 920 has a positive direction outside the drawing.

[0040] In the illustrated example, the bondhead 150 includes at least one optional heater 420 arranged such that the heater 420, in this example, forms the tool holder contact surface 450' itself to increase a temperature of at least a portion of the component tool (500) in use.

[0041] The tool holder 400 comprises at least one tool holder gas inlet 700, which can be supplied with at least one gas. The tool holder gas inlet 700 is connected to at least one tool holder gas outlet 720, which makes at least a portion of the gas introduced into the tool holder gas inlet 700 available to the component tool 500. The component tool 500 comprises at least one tool gas inlet 740, which receives at least a portion of the gas introduced from the tool holder gas outlet 720.

[0042] FIG. 1 A shows an edge region of the tool holder 400 and an edge region of the component tool 500 separated from each other along the third axis 930 by a significant distance, which may be prior to attaching the component tool 500 to the tool holder 400 and / or after excluding the component tool 500 from the tool holder 400.

[0043] In FIG. 1A, the component tool 500 includes a tool mounting surface 550 with at least one recess 520 in the edge region. The recess 520 is connected to the tool gas inlet 740 and enables gas flow from a central portion of the tool holder contact surface 450, 450' to one or more edge regions of the tool holder contact surface 450, 450'. The component tool 500 also includes a component mounting surface 560 for receiving a component 600.

[0044] FIG. 1B shows the same edge region of the tool holder 400 and the same edge region of the component tool 500 after the component tool 500 has been attached to the tool holder 400 in preparation for bonding. The cross-section in FIG. 1B represents a plane including the first axis 910 and the third axis 930, with the third axis 930 having a positive bottom-to-top direction and the first axis 910 having a positive left-to-right direction. The second axis 920 has a positive direction outside the drawing.

[0045] In FIG. 1B, the bondhead 150 is designed to receive gas at the toolholder gas inlet 700 and provide the gas to the gas inlet of the component tool 500, hereinafter referred to as the tool gas inlet 740, via the toolholder gas outlet 720. The bondhead 150 is also configured to generate a gas flow from a central region of the toolholder contact surface 450 to one or more edge regions of the toolholder contact surface 450 between the toolholder 400 and the component tool 500. The bondhead 150 also generates at least one gas curtain 750 flowing from the edge regions of the toolholder contact surface 450, 450'. The gas curtain 750 is partially enclosed by at least one recess 520 formed in edge regions between the tool holder 400 and the component tool 500. The gas curtain 750 reduces the deposition of contaminants 850 on the tool holder contact surface 450, 450'.Additionally, FIG. 1B shows the component tool 500 after attaching a component 600 to the component tool 500.

[0046] FIG. 2 shows a bottom view of one embodiment of a tool holder 400, such as that shown in FIG. 1B, after the component tool 500 has been attached to the tool holder 400 in preparation for bonding. FIG. 2 also shows the at least one optional heater 420 to which the component tool 500 is attached. FIG. 2 illustrates the entire tool holder 400, including the central regions and all edge regions. In FIG. 2, the component mounting surface 560 faces the viewer. The component tool 500 is illustrated in a plane including the first axis 910 and the second axis 920. The first axis 910 has a positive bottom-to-top direction, and the second axis 920 has a positive left-to-right direction. The third axis 930 has a positive direction in the drawing.

[0047] In the example shown in FIG. 2, the at least one gas curtain 750 is indicated by an arrow. The at least one gas curtain 750 is arranged to effectively provide protection against contamination 850 on each side of the component tool 500 over a large portion of the circumference between the tool holder 400 and the component tool 500. Optionally, the at least one gas curtain on each side of the component tool 500 can provide protection against contamination 850 over the entire circumference between the tool holder 400 and the component tool 500.

[0048] In the example shown in FIG. 2, channels 545 for conducting an applied vacuum are also visible on the component mounting surface 560. With the vacuum applied, removably removable components 600 (not shown) can be attached to the component mounting surface 560. Four connecting channels 530 are visible in the channels 545. The position and number of the connecting channels depend on the design of the channels 545, so that additional connecting channels 530 are also possible for additional support, for example, in the corners.

[0049] FIG. 3 shows a perspective view of the top side of an embodiment of a tool holder 400, as is also indicated in FIG. 1A, for example, before and / or after fastening a component tool 500 to the tool holder 400. FIG. 3 shows a tool holder 400 that can be subjected to a suitable degree of vacuum for holding a component tool, including the central regions not provided with reference symbols and only arising from the context, and all edge regions that arise when receiving a component tool 500 (not shown). For holding the component tool 500 by means of a suitable degree of vacuum, the channels 540 that can be subjected to vacuum are embedded in the tool fastening surface 550. These channels 540 can run on different levels within the tool holder 400 and are connected to one another and to a vacuum source (not shown) by connecting channels 530.

[0050] In FIG. 3, the tool fastening surface 550 faces the viewer. The component tool 500 is shown in a plane that includes the first axis 910 and the second axis 920. The first axis 910 has a positive direction from bottom-left to top-right, and the second axis 920 has a positive direction from bottom-right to top-left. The third axis 930 has a positive direction from top to bottom. On each of the sides, which in this embodiment are arranged in pairs parallel to one another in a square relationship, a tool gas inlet 740 is shown. In the circumferential edge region of the tool holder 400, the

[0051] Tool mounting surface to see running recess 520.

[0052] In summary, FIGS. 1A to 3 show embodiments of an apparatus 100 for bonding a component 600 to or on one or more substrates, or parts of embodiments of such an apparatus, wherein the apparatuses preferably comprise a tool holder 400 and a component tool 500, and the apparatuses each provide at least one gas curtain 750 at least partially enclosed by at least one recess 520 formed in edge regions between the tool holder 400 and the component tool 500; and wherein, in use, the at least one gas curtain 750 is arranged to reduce a deposition level of contamination 850 on one or more portions of the tool holder contact surface 450, 450', providing at least one gas flow path from an inner portion of each tool contact surface to an outer periphery.

[0053] List of reference symbols

[0054] No. Short description

[0055] 100 device

[0056] 150 bondhead

[0057] 400 tool holders

[0058] 420 heater

[0059] 450 tool holder contact surface

[0060] 500 component tools

[0061] 520 recess

[0062] 530 connecting channel

[0063] 540 channel

[0064] 545 channel

[0065] 550 tool mounting surface

[0066] 560 component mounting surface

[0067] 600 components

[0068] 700 tool holder gas inlet

[0069] 720 Tool holder gas outlet

[0070] 740 Tool gas inlet

[0071] 750 gas curtain

[0072] 850 Contamination

[0073] 910 first axis (X)

[0074] 920 second axis (Y)

[0075] 930 third axis (z)

Claims

Patent claims 1 . Device (100) for bonding a component (600) to or on one or more substrates, the device (100) comprising: • a bonding head (150) for releasably receiving the component (600) and arranged to be insertable into a bonding position with the component (600); • a tool holder (400) having a tool holder contact surface (450) for receiving a component tool (500); and wherein the component tool (500) comprises a tool mounting surface (550) arranged to be receivable by the tool holder contact surface (450); wherein the tool holder (400) further comprises at least one gas outlet (720) arranged to provide, in use, at least one gas flow (700) from a central portion of the tool holder contact surface (450) to one or more edge regions of the tool holder contact surface (450) between the tool holder (400) and the component tool (500); and wherein the tool holder (400) is further arranged to provide, in use, at least one gas curtain (750) flowing away from the one or more edge regions of the tool holder contact surface (450);wherein, in use, the at least one gas curtain (750) is at least partially enclosed by at least one recess (520) formed in edge regions between the tool holder (400) and the component tool (500); and wherein, in use, the at least one gas curtain (750) is arranged to reduce a deposition level of contamination (850) on one or more portions of the tool holder contact surface (450); 2. Device according to one of the preceding claims, wherein the at least one gas stream comprises an inert gas, nitrogen, argon, helium, neon, carbon dioxide, air, oil-free air or a combination thereof.

3. Device according to one of the preceding claims, wherein in use the at least one gas curtain (750) is at least partially enclosed by at least one recess (520) formed in an edge region of the tool holder contact surface (450).

4. Device according to one of the preceding claims, wherein in use the at least one gas curtain (750) is at least partially enclosed by at least one recess (520) formed in an edge region of the tool fastening surface (550).

5. Device according to one of the preceding claims, wherein in use the at least one gas curtain (750) is at least partially enclosed by at least one recess (520) formed in an edge region of the tool mounting surface (550) and at least partially enclosed by at least one corresponding recess formed in an edge region of the tool holder contact surface (450).

6. The device of any preceding claim, wherein the component is a semiconductor die, a semiconductor package, a chip, an integrated circuit, another substrate, or any combination thereof.

7. Device according to one of the preceding claims, wherein in use an average distance between the tool holder contact surface (450) and the tool fastening surface (550) in the vicinity of the at least one recess (520) formed in an edge region is 0.5 mm or less.

8. Apparatus according to any one of the preceding claims, wherein the tool holder is arranged to hold the component tool (500) using a degree of vacuum, one or more magnets, a degree of clamping force, or any combination thereof.

9. Apparatus according to any one of the preceding claims, wherein the apparatus is arranged to increase, in use, a temperature of at least a portion of a bonding surface of the component (600).

10. Apparatus according to any one of the preceding claims, wherein at least one heating device (420) is included in the tool holder (400) and is arranged to increase a temperature of at least a portion of the component tool (500) in use.

11. Apparatus according to any preceding claim, wherein the apparatus (100) is arranged to apply, in use, a bonding pressure to at least a portion of a bonding surface of the component (600).

12. Device (100) according to one of the preceding claims, wherein the component tool (500) comprises a component mounting surface (560) for receiving the component (600).

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