Heat sink

Abstract

The present invention relates to a heat sink (1) comprising: a base part (20) having a first surface (21) that has a first region (26) provided with a groove part (25) and a second region (27) different from the first region (26), and a second surface (22) facing opposite from the first surface (21), the base part (20) being such that a heat-generating body (100) is thermally connected to the second surface (22); a heat transport member (31) accommodated in the groove part (25) provided to the first region (26); a cover part (41) covering at least a portion of the heat transport member (31), the cover part (41) being disposed facing opposite from the first region (26) and being a separate member from the base part (20); first heat-dissipating fins (10-1) erected on the cover part (41); and second heat-dissipating fins (10-2) erected on the second region (27).

Description

heat sink

[0001] The present invention relates to a heat sink having a base to which a heat generating element is thermally connected and heat dissipation fins, and more particularly to a heat sink in which a heat transfer member housed in the base is covered with a cover.

[0002] Heat sinks with heat dissipation fins on a base to which the heat generating elements are thermally connected are often used as a means for cooling heat generating elements such as electronic components installed in a given space. As various devices become more sophisticated, the amount of heat generated by the heat generating elements such as electronic components installed in the devices increases, making it increasingly important to improve the cooling performance of heat sinks.

[0003] To improve the cooling performance of a heat sink, it is necessary to improve the fin efficiency of the heat dissipation fins provided on the heat sink. Therefore, a heat pipe is provided along the planar direction of the base of the heat sink, and the heat pipe's heat transport function transports heat from the heat-generating element to the entire area of ​​the base where the heat dissipation fins are provided. By using the heat pipe to transport heat from the heat-generating element to the entire area of ​​the base where the heat dissipation fins are provided, the temperature of the base is uniformed, the thermal load is uniform across the entire heat dissipation fin, and the fin efficiency of the heat dissipation fins is improved.

[0004] When installing a heat pipe in the base of a heat sink, it is necessary to improve the thermal connection between the heat pipe and the heat dissipation fins. Therefore, a heat sink has been proposed in which the base and heat dissipation fins are integrally formed, the heat pipe is embedded in the base, a heat-generating electronic component is mounted in the base, the heat is diffused into the base using the heat transport capacity of the heat pipe, and the heat in the base is dissipated from the heat dissipation fins integrally formed with the base (Patent Document 1).

[0005] Patent document 1 describes how embedding a heat pipe in a base formed integrally with the heat dissipation fins and mounting heat-generating electronic components on the base promotes heat diffusion from the heat-generating electronic components throughout the base, preventing localized heat concentration on the base, and enabling effective heat dissipation by the heat dissipation fins formed integrally with the base.

[0006] On the other hand, since heat sinks are sometimes installed in small spaces, it is sometimes necessary to increase the fin area of ​​the heat dissipation fins by reducing the thickness of the base in order to improve the heat dissipation characteristics of the heat sink. However, in Patent Document 1, since the groove for embedding the heat pipe is formed in the base, which has a uniform overall thickness, it is not possible to reduce the thickness of the entire base, and improvement is needed in terms of increasing the fin area of ​​the heat dissipation fins.

[0007] For example, in recent years, due to the increasing volume of wireless communications, mobile phone base stations have been using circuit boards on which a large number of electronic components that generate relatively little heat, such as antennas and amplifiers, and a large number of electronic components that generate a large amount of heat, such as field programmable gate arrays (FPGAs), are arranged in a complex manner. To prevent interference between the numerous electronic components, a shield portion, which is a recess corresponding to the position and shape of the electronic components, is formed on the heat-receiving surface of the base portion of a heat sink, and the electronic components are housed in the shield portion, thereby shielding the electronic components mounted on the circuit board. When a shield portion is provided on the heat-receiving surface of the base portion of a heat sink, when a heat transfer member such as a heat pipe is provided on the base member, the heat transfer member must be positioned so as to avoid the shield portion along the surface direction of the base member.

[0008] However, in Patent Document 1, in which a heat pipe is embedded along a groove formed on the heat receiving surface of the base and a heat generating element is thermally connected to this heat pipe, if a shield is provided on the heat receiving surface of the base, the degree of freedom in arranging the heat transfer member such as the heat pipe is reduced, and it is not possible to uniformly heat the entire base, which is thermally connected to a large number of heat generating elements arranged in a complex manner. Therefore, in Patent Document 1, it is not possible to uniformly distribute the thermal load across the entire heat dissipation fin, and as a result, there is a problem in improving the heat dissipation characteristics of the heat sink.

[0009] Japanese Patent Application Laid-Open No. 2000-269676

[0010] In view of the above circumstances, the present invention aims to provide a heat sink that reduces the thickness of the base portion to increase the fin area of ​​the heat dissipation fins, while allowing for excellent freedom in the placement of the heat transfer member, thereby providing excellent temperature uniformity throughout the base portion.

[0011] The gist of the configuration of the present invention is as follows: [1] A heat sink comprising: a base portion having a first surface having a first region with a groove portion and a second region different from the first region, and a second surface opposite the first surface, wherein a heat generating element is thermally connected to the second surface; a heat transfer member accommodated in the groove portion provided in the first region; a cover portion which is a separate member from the base portion and covers at least a portion of the heat transfer member, and is disposed opposite the first region; a first heat dissipation fin provided upright on the cover portion; and a second heat dissipation fin provided upright on the second region. [2] The heat sink according to [1], wherein the cover portion is disposed opposite only the first region. [3] The heat sink according to [1] or [2], wherein the cover portion and the first heat dissipation fin are integrally molded. [4] The heat sink according to [1] or [2], wherein the base portion and the second heat dissipation fin are integrally molded. [5] The heat sink according to [1] or [2], wherein the cover portion and the first heat dissipation fin are separate bodies. [6] The heat sink according to [1] or [2], wherein the base portion and the second heat dissipation fin are separate bodies. [7] The heat sink according to [1] or [2], wherein the first region has a convex portion protruding in the thickness direction of the base portion, and the convex portion is provided with the groove portion. [8] The heat sink according to [7], wherein the height dimension of the first heat dissipation fin is smaller than the height dimension of the second heat dissipation fin. [9] The heat sink according to [1] or [2], wherein the first heat dissipation fin and the second heat dissipation fin are the same height.

[10] The heat sink according to [1] or [2], wherein the heat transfer member has a heat receiving portion thermally connected to the heat generating element.

[11] The heat sink according to [1] or [2], wherein the entire heat transfer member is embedded in the heat sink.

[12] The heat sink according to [1] or [2], wherein at least a part of the heat transfer member has an exposed portion that is exposed from the second surface, and the exposed portion is in direct contact with the heat generating element.

[13] The heat sink according to [1] or [2], wherein the heat transfer member extends along the extension direction of the base portion.

[14] The heat sink according to [1] or [2], wherein the heat transport member has a step portion bent in the thickness direction of the base.

[15] The heat sink according to

[12] , wherein the heat transport member has a step portion bent in the thickness direction of the base, and the step portion forms the exposed portion.

[16] The heat sink according to [1] or [2], wherein the heat transport member is a heat pipe.

[17] The heat sink according to

[16] , wherein the heat pipe is fixed to the groove by crimping.

[18] The heat sink according to

[16] , wherein the heat pipe has a flat portion that has been flattened.

[19] The heat sink according to

[16] , wherein the container of the heat pipe and the base are in direct contact.

[20] The heat sink according to

[16] , wherein grease is applied between the container of the heat pipe and the base.

[0012] In one aspect of the heat sink of the present invention, the heat sink comprises a base having a second surface to which a heat generating element is thermally connected, a heat exchanger provided on the first surface of the base, the heat dissipation fin having a first heat dissipation fin and a second heat dissipation fin, and a heat transfer member housed on the first surface of the base. In another aspect of the heat sink of the present invention, the base and the cover are separate members, so that a boundary is formed between the base and the cover. In another aspect of the heat sink of the present invention, the first heat dissipation fin is provided upright on the cover, so that the first heat dissipation fin is provided upright in a first region of the first surface of the base where the heat transfer member is housed, and the second heat dissipation fin is provided upright in a second region where the heat transfer member is not housed.

[0013] In addition, in an embodiment of the heat sink of the present invention, at least a portion of the heat transfer member housed in the groove portion provided in the first region is covered by the cover portion, so that the outer peripheral surface of at least a portion of the heat transfer member is not exposed from the first surface of the base portion.

[0014] According to an aspect of the present invention, a heat sink includes a first surface having a first region with a groove and a second region different from the first region, a base portion to which a heat generating element is thermally connected to the second surface, a heat transfer member accommodated in the groove in the first region, and second heat dissipation fins extending from the second region. Therefore, the thickness of the base portion is reduced at least in the second region where the heat transfer member is not accommodated, thereby increasing the fin area of ​​the second heat dissipation fins. Furthermore, according to an aspect of the present invention, the heat transfer member is accommodated in the groove in the first region of the first surface, so that even if a shield or the like is provided on the second surface to which the heat generating element is thermally connected, the heat transfer member does not need to be positioned along the surface of the base portion to avoid the shield or the like. This provides excellent flexibility in the positioning of the heat transfer member, resulting in excellent temperature uniformity throughout the base portion. As described above, according to the heat sink of the present invention, the fin area of ​​the heat dissipation fins can be increased even when the heat sink is installed in a small space, and the heat is uniformly distributed throughout the entire base. Furthermore, according to the heat sink of the present invention, the thickness of the base is reduced in the second region where the heat transfer member is not housed, thereby reducing the weight of the heat sink.

[0015] Therefore, according to the heat sink of the present invention, even when a large number of electronic components with various heat dissipation values ​​are thermally connected to the heat sink, the heat uniformity of the base of the heat sink can be maintained, and the heat transfer from the base to the heat dissipation fins is uniform throughout the heat dissipation fins, which facilitates heat transfer from the base to the heat dissipation fins and also uniforms the thermal load throughout the heat dissipation fins.As a result, even when a large number of electronic components with various heat dissipation values ​​are thermally connected to the heat sink, the heat dissipation characteristics of the heat sink are improved.

[0016] Furthermore, according to an aspect of the heat sink of the present invention, the second heat dissipation fin erected in the second region of the first surface of the base portion has reduced thermal resistance with the base portion, thereby reducing the thermal resistance between the base portion and the heat dissipation fin and improving the heat dissipation characteristics of the heat sink.

[0017] Furthermore, according to an aspect of the heat sink of the present invention, the cover portion is positioned opposite only the first region, thereby reliably reducing the thermal resistance between the base portion and the heat dissipation fins, thereby reliably improving the heat dissipation characteristics of the heat sink.

[0018] Furthermore, according to an aspect of the heat sink of the present invention, the cover portion and the first heat dissipation fin are integrally molded, thereby suppressing contact resistance between the cover portion and the first heat dissipation fin and improving thermal connectivity between the cover portion and the first heat dissipation fin.

[0019] Furthermore, according to an aspect of the heat sink of the present invention, the base portion and the second heat dissipation fins are integrally molded, thereby suppressing contact resistance between the base portion and the second heat dissipation fins and improving thermal connectivity between the base portion and the second heat dissipation fins.

[0020] According to another aspect of the heat sink of the present invention, the cover portion and the first heat dissipation fins are separate, allowing the first heat dissipation fins to be thin, thereby enabling the design of a thickness of the first heat dissipation fins optimal for required performance. Therefore, according to another aspect of the heat sink of the present invention, the fin pitch can be narrowed, thereby increasing the number of first heat dissipation fins or widening the space between the first heat dissipation fins to improve ventilation efficiency, thereby improving the heat dissipation characteristics of the heat sink. According to another aspect of the heat sink of the present invention, the cover portion and the first heat dissipation fins are separate, allowing the first heat dissipation fins to be designed to an optimal thickness by thinning the thickness of the first heat dissipation fins, thereby reducing the weight of the heat sink. According to another aspect of the heat sink of the present invention, the cover portion and the first heat dissipation fins are separate, allowing the thickness of the first heat dissipation fins to be optimized, thereby reliably ensuring a gap between the first heat dissipation fins and preventing an increase in pressure loss of cooling air supplied between the first heat dissipation fins, thereby improving the heat dissipation characteristics of the heat sink.

[0021] According to another aspect of the heat sink of the present invention, the base portion and the second heat dissipation fins are separate, allowing the second heat dissipation fins to be thin, thereby enabling the design of a thickness of the second heat dissipation fins optimal for required performance. Therefore, according to another aspect of the heat sink of the present invention, the fin pitch can be narrowed, thereby improving the heat dissipation characteristics of the heat sink by increasing the number of second heat dissipation fins or widening the space between the second heat dissipation fins to increase ventilation efficiency. According to another aspect of the heat sink of the present invention, the base portion and the second heat dissipation fins are separate, allowing the second heat dissipation fins to be designed to an optimal thickness by thinning the thickness of the second heat dissipation fins, thereby reducing the weight of the heat sink. According to another aspect of the heat sink of the present invention, the base portion and the second heat dissipation fins are separate, allowing the thickness of the second heat dissipation fins to be optimized, thereby ensuring a sufficient gap between the second heat dissipation fins and preventing an increase in pressure loss of cooling air supplied between the second heat dissipation fins, thereby improving the heat dissipation characteristics of the heat sink.

[0022] In addition, according to an aspect of the heat sink of the present invention, the first region has a protrusion protruding in the thickness direction of the base, and the groove is provided in the protrusion, so that the thickness of the base can be reduced in the second region where the heat transfer member is not accommodated, while ensuring a location in the base for accommodating the heat transfer member. Furthermore, since the first region has a protrusion protruding in the thickness direction of the base, and the groove is provided in the protrusion, the heat transfer function of the heat transfer member ensures uniform temperature distribution throughout the base, and ensures uniform heat transfer from the base to the entire heat dissipation fin.

[0023] Furthermore, according to the heat sink aspect of the present invention, the first heat dissipation fins are the same height as the second heat dissipation fins, which increases the fin area of ​​the first heat dissipation fins and the second heat dissipation fins and allows the heat sink to be smoothly installed even in a small space.

[0024] Furthermore, according to the heat sink aspect of the present invention, the heat transfer member is entirely embedded in the heat sink, which further improves the thermal connectivity of the heat transfer member in the heat sink.

[0025] Furthermore, according to an aspect of the heat sink of the present invention, at least a portion of the heat transfer member has an exposed portion exposed from the second surface, and the exposed portion comes into direct contact with the heat generating element, thereby further improving the thermal connectivity between the heat generating element and the heat transfer member, thereby further improving the heat dissipation characteristics of the heat sink.

[0026] Furthermore, according to an embodiment of the heat sink of the present invention, since the heat transfer member is a heat pipe, even if a large number of electronic components with various heat generation amounts are thermally connected to the heat sink, the thermal uniformity of the base portion of the heat sink can be maintained, and the thermal load across the entire heat dissipation fin can be reliably uniformed, thereby reliably improving the fin efficiency of the heat dissipation fin.

[0027] Furthermore, according to an aspect of the heat sink of the present invention, the heat pipe is fixed to the groove portion by crimping, thereby achieving stable fixing of the heat pipe to the base portion while improving the thermal connectivity between the heat pipe and the base portion.

[0028] 6 is a perspective view illustrating a heat sink according to a first embodiment of the present invention. FIG. 7 is a partially enlarged view illustrating a heat sink according to the first embodiment of the present invention. FIG. 8 is a perspective view illustrating the structure of a base portion of the heat sink according to the first embodiment of the present invention. FIG. 9 is an explanatory view illustrating the overall structure of the heat sink according to the first embodiment of the present invention. FIG. 10 is an explanatory view illustrating the arrangement of a heat transfer member of the heat sink according to the first embodiment of the present invention from a plan view. FIG. 11 is a bottom view of a state in which a heat generating element is thermally connected to the heat sink according to the first embodiment of the present invention. FIG. 12 is a side cross-sectional view of the heat sink according to the first embodiment of the present invention, taken along line A-A in FIG. 6. FIG. 13 is a perspective view from the bottom illustrating an example of how to use the heat sink according to the first embodiment of the present invention. FIG. 14 is a perspective view illustrating the structure of the base portion and heat transfer member of the heat sink according to the second embodiment of the present invention. FIG. 15 is a perspective view illustrating a heat sink according to a third embodiment of the present invention. FIG. 16 is a side cross-sectional view of a heat sink according to a fourth embodiment of the present invention. FIG. 17 is a side cross-sectional view of a heat sink according to a fifth embodiment of the present invention. FIG. 18 is a perspective view from the bottom illustrating a heat sink according to the fifth embodiment of the present invention. FIG. 19 is a side cross-sectional view of a heat sink according to a sixth embodiment of the present invention. FIG. 19 is an explanatory view of a heat pipe used in the heat sink according to the sixth embodiment of the present invention. FIG. 19 is a side cross-sectional view of a heat sink according to a seventh embodiment of the present invention. FIG. 12 is a side cross-sectional view of a heat sink according to an eighth embodiment of the present invention. FIG. 13 is a perspective view from the bottom illustrating a heat sink according to an eighth embodiment of the present invention. FIG. 14 is an explanatory diagram illustrating, from a plan view, the arrangement of heat transfer members of a heat sink according to a ninth embodiment of the present invention. FIG. 15 is an explanatory diagram illustrating, from a plan view, the arrangement of heat transfer members of a heat sink according to a tenth embodiment of the present invention. FIG. 16 is an explanatory diagram illustrating, from a plan view, the arrangement of heat dissipation fins of a heat sink according to an eleventh embodiment of the present invention. FIG. 17 is an explanatory diagram illustrating, from a plan view, the arrangement of heat dissipation fins of a heat sink according to a twelfth embodiment of the present invention. FIG. 18 is an explanatory diagram illustrating, from a plan view, the arrangement of heat dissipation fins of a heat sink according to a thirteenth embodiment of the present invention. FIG. 19 is a side cross-sectional view of a heat sink according to a fourteenth embodiment of the present invention. FIG. 19 is a side cross-sectional view illustrating another example of how to use the heat sink of the present invention.

[0029] A heat sink according to a first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view illustrating the heat sink according to the first embodiment of the present invention. FIG. 2 is a partially enlarged view illustrating the heat sink according to the first embodiment of the present invention. FIG. 3 is a perspective view illustrating the structure of the base of the heat sink according to the first embodiment of the present invention. FIG. 4 is an explanatory diagram illustrating the overall structure of the heat sink according to the first embodiment of the present invention. FIG. 5 is an explanatory diagram illustrating the arrangement of the heat transfer member of the heat sink according to the first embodiment of the present invention from a plan view. FIG. 6 is a bottom view of the heat sink according to the first embodiment of the present invention in a state where a heat generating element is thermally connected to the heat sink according to the first embodiment of the present invention. FIG. 7 is a side cross-sectional view of the heat sink according to the first embodiment of the present invention, taken along line A-A in FIG. 6.

[0030] 1 and 2 , the heat sink 1 according to the first embodiment includes a flat base portion 20 and a plurality of heat dissipation fins 10, 10, 10... provided on the surface of the base portion 20. The base portion 20 has a first surface 21 and a second surface 22 facing the first surface 21. A heating element 100 is thermally connected to the second surface 22 of the base portion 20. The plurality of heat dissipation fins 10, 10, 10... are provided upright on the first surface 21 of the base portion 20.

[0031] The base portion 20 is a plate-like portion having a first direction L1 and a second direction L2 perpendicular to the first direction L1. The shape of the base portion 20 is not particularly limited, but for convenience of explanation, the base portion 20 in the heat sink 1 has a rectangular shape in a plan view (as viewed from a position facing the heat dissipation fins 10). The heating element 100 abuts against the second surface 22 of the base portion 20, thereby thermally connecting the base portion 20 to the heating element 100. Therefore, the second surface 22 of the base portion 20 functions as a heat-receiving surface of the heat sink 1.

[0032] 3 and 4 , the first surface 21 of the base portion 20 has a first region 26 in which a groove 25 is provided, and a second region 27 that is different from the first region 26. The second region 27 differs from the first region 26 in that it does not have the groove 25. The groove 25 is a recess provided in the first surface 21 and extends in the extension direction of the first surface 21.

[0033] The heat sink 1 has a plurality of grooves 25, 25, 25... provided on the first surface 21. Each of the plurality of grooves 25, 25, 25... extends from one end to the other end in the second direction L2 of the base portion 20. The grooves 25 extend in the extension direction of the heat dissipation fins 10, which will be described later.

[0034] In the heat sink 1, the first region 26 has a convex portion 28 that protrudes in the thickness direction of the base portion 20, and a groove portion 25 is provided in the convex portion 28. More specifically, the groove portion 25 is provided in the flat top of the convex portion 28. In the heat sink 1, the multiple groove portions 25, 25, 25... each extend from one end to the other end of the base portion 20 in the second direction L2, and correspondingly, the multiple convex portions 28, 28, 28... extend from one end to the other end of the base portion 20 in the second direction L2. The convex portion 28 is integrally molded with the base portion 20. Therefore, the convex portion 28 is formed continuously with the first surface 21, and no boundary portion such as a joint, adhesive portion, or seam is formed between the convex portion 28 and the first surface 21.

[0035] As shown in FIGS. 1 to 4 and 6 , multiple heating elements 100, 100, 100... are thermally connected to the second surface 22 of the base portion 20, and therefore multiple protrusions 28 with grooves 25 are provided on the first surface 21 from one end to the other end of the base portion 20 in the first direction L1. The multiple protrusions 28 with grooves 25 are positioned in parallel at predetermined intervals. Also, as shown in FIG. 6 , the second surface 22 of the base portion 20, to which the multiple heating elements 100, 100, 100... are thermally connected, is provided with a recess 200 (i.e., a shield portion 200) for accommodating the heating elements that generate electromagnetic waves, etc. FIG. 6 illustrates the position of the shield portion 200 on the base portion 20 to which the multiple heating elements 100, 100, 100... are thermally connected.

[0036] On the other hand, no protrusions 28 are provided in the second region 27 of the first surface 21. As described above, the thickness of the base portion 20 differs between the first region 26 and the second region 27, and the thickness of the base portion 20 in the second region 27 is thinner than the thickness of the base portion 20 in the first region 26 by the amount corresponding to the absence of the protrusions 28.

[0037] 2 to 4 and 7, a heat transfer member 31 is housed in the groove 25 provided in the first region 26. A heat transfer member 31 is housed in each of the multiple grooves 25, 25, 25, .... In the heat sink 1, the entire longitudinal length of the heat transfer member 31 is housed in the groove 25. The inner surface of the groove 25 has a shape corresponding to the shape of the outer peripheral surface of the heat transfer member 31. As described above, the groove 25 is a portion for housing the heat transfer member 31 in the base portion 20. In the heat sink 1, the longitudinal shape of the heat transfer member 31 in a plan view is approximately linear, and therefore the longitudinal shape of the groove 25 in a plan view is also approximately linear.

[0038] The heat transfer member 31 is fixed by caulking to the groove 25. That is, stress is applied to the outer peripheral surface of the heat transfer member 31 from above, causing plastic deformation of the upper part of the outer peripheral surface of the heat transfer member 31, thereby fixing the heat transfer member 31 to the groove 25.

[0039] The convex portions 28, each having a groove 25, extend from one end to the other end of the base portion 20 in the second direction L2. Correspondingly, the heat transfer member 31 extends from one end to the other end of the base portion 20 in the second direction L2. Therefore, the heat transfer member 31 extends along the extending direction of the base portion 20. The heat transfer member 31 also extends in the extending direction of the heat dissipation fins 10. Correspondingly, the plurality of convex portions 28, each having a groove 25, are arranged in parallel at predetermined intervals from one end to the other end of the base portion 20 in the first direction L1. Correspondingly, the plurality of heat transfer members 31, 31, 31... are arranged in parallel at predetermined intervals from one end to the other end of the base portion 20 in the first direction L1. From the above, the plurality of heat transfer members 31, 31, 31... are arranged in parallel along the first direction L1 of the base portion 20 with the outer peripheral surfaces of the heat transfer members 31 facing each other.

[0040] In the heat sink 1, the cover portion 41 covers at least a portion of the heat transfer member 31 housed in the groove portion 25. More specifically, in the heat sink 1, the cover portion 41 covers the entire longitudinal direction of the heat transfer member 31 housed in the groove portion 25. The cover portion 41 is a separate member from the base portion 20, and is disposed opposite the first region 26. Because the base portion 20 and the cover portion 41 are separate members, a boundary portion is formed between the base portion 20 and the cover portion 41. Since the upper surface of the heat transfer member 31 housed in the groove portion 25 is covered by the cover portion 41, the heat transfer member 31 is protected from the external environment of the heat sink 1.

[0041] The inner surface 42 of the cover part 41 has a shape corresponding to the shape of the upper surface of the heat transfer member 31. Therefore, the inner surface 42 of the cover part 41 is in contact with the upper surface of the heat transfer member 31. The method of attaching the cover part 41 to the first region 26 is not particularly limited, and examples thereof include screw fastening, connection by crimping the groove part 25 and the cover part 41, and joining by soldering, adhesive, etc.

[0042] In the heat sink 1 , the cover portion 41 is disposed facing only the first region 26 , and the cover portion 41 is not disposed in the second region 27 .

[0043] In the heat sink 1, the entire longitudinal length of the heat transfer member 31 is housed in the groove 25, and the cover 41 covers the entire longitudinal length of the heat transfer member 31 housed in the groove 25, so that the entire heat transfer member 31 is embedded in the heat sink 1. Therefore, the outer surface of the heat transfer member 31 is not exposed from the base 20 or from the outer surface of the heat sink 1.

[0044] 5 , the heat transfer member 31 has a heat receiving portion 32 thermally connected to the heat generating element 100. The heat transfer member 31 also has a portion 34 other than the heat receiving portion 32. When the heat receiving portion 32 of the heat transfer member 31 receives heat from the heat generating element 100, the heat from the heat generating element 100 is conducted from the heat receiving portion 32 to the portion 34 other than the heat receiving portion 32 along the extension direction of the heat transfer member 31. When the heat transfer member 31 is thermally connected to a plurality of heat generating elements 100, 100, 100..., the portion thermally connected to the heat generating element 100 that generates the greatest amount of heat among the plurality of heat generating elements 100, 100, 100... functions as the heat receiving portion 32.

[0045] As shown in FIGS. 1 to 7 , the heat sink 1 is provided with a heat pipe 30 as a heat transfer member 31. The heat pipe 30 includes a tubular container 33 sealed at one end and the other end, a wick structure (not shown) having capillary force housed in the container 33, and a working fluid (not shown) such as water sealed in the internal space of the container 33. The container 33 is a tubular material with a sealed internal space. The internal space of the container 33 is depressurized by a degassing process. The heat pipe 30 has a heat receiving portion 32 that functions as an evaporator, and a portion 34 other than the heat receiving portion 32 that functions as a condenser. The container 33 and the base portion 20 of the heat pipe 30 are in direct contact with each other.

[0046] The shape of the container 33 in the direction perpendicular to the longitudinal direction (radial direction) is not particularly limited and may be semicircular, circular, elliptical, flat, rectangular, etc., but in the heat sink 1, the upper part of the outer peripheral surface of the heat transfer member 31 is plastically deformed so that the heat transfer member 31 is fixed to the groove portion 25, and therefore the upper surface of the container 33 has a flattened semicircular shape.

[0047] The material of the container 33 of the heat pipe 30 may be the same as or different from the material of the base portion 20. Examples of materials for the container 33 of the heat pipe 30 include copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, and stainless steel.

[0048] As shown in FIGS. 1 to 7 , a plurality of plate-shaped heat dissipation fins 10, 10, 10... are erected on a base portion 20. The heat dissipation fins 10 are erected on a first surface 21 of the base portion 20 at a predetermined angle with respect to the extending direction of the first surface 21. In the heat sink 1, the heat dissipation fins 10 are erected in a direction substantially perpendicular to the extending direction of the first surface 21. Each heat dissipation fin 10 extends from one end to the other end of the base portion 20 in the second direction L2. For convenience of explanation, in the heat sink 1, the heat dissipation fins 10 are illustrated as extending substantially linearly from one end to the other end of the base portion 20 in the second direction L2. Each heat dissipation fin 10 extends in a direction substantially parallel to the second direction L2 of the base portion 20 and substantially perpendicular to the first direction L1. The heat dissipation fins 10 are at substantially the same height from one end to the other end of the base portion 20 in the second direction L2.

[0049] A plurality of heat dissipation fins 10, 10, 10... are arranged in parallel at predetermined intervals on the first surface 21 of the base portion 20 to form a heat dissipation fin group 11. In the heat sink 1, the plurality of heat dissipation fins 10, 10, 10... are arranged in parallel from one end to the other end in the first direction L1 of the base portion 20 to form the heat dissipation fin group 11. The fin pitch of the plurality of heat dissipation fins 10, 10, 10... is not particularly limited, and in the heat sink 1, the plurality of heat dissipation fins 10, 10, 10... are arranged in parallel at approximately equal intervals throughout the entire heat dissipation fin group 11.

[0050] The heat dissipation fins 10 are not provided on the second surface 22 of the base portion 20. Therefore, the heat dissipation fins 10 are provided on one surface of the base portion 20. The heat dissipation fins 10 are thin, flat portions having a main surface 12 and side surfaces 13. The main surface 12 of the heat dissipation fins 10 mainly contributes to heat dissipation. The width of the side surfaces 13 constitutes the thickness of the heat dissipation fins 10.

[0051] The heat dissipation fins 10 include a first heat dissipation fin 10-1 erected on the cover portion 41 and a second heat dissipation fin 10-2 erected in the second region 27. A plurality of first heat dissipation fins 10-1, 10-1, 10-1... are arranged in parallel at predetermined intervals on the outer surface 43 of the cover portion 41. As described above, the first heat dissipation fin 10-1 is not erected directly on the first region 26 of the first surface 21, but is erected on the first region 26 of the first surface 21 via the cover portion 41.

[0052] Further, a plurality of second heat dissipation fins 10-2, 10-2, 10-2... are arranged in parallel at predetermined intervals on the second region 27 of the first surface 21. Since the cover portion 41 is not arranged in the second region 27, the second heat dissipation fins 10-2 are provided upright directly on the second region 27 of the first surface 21. As described above, the first heat dissipation fin 10-1 is provided upright in the first region 26 of the first surface 21 of the base portion 20 where the heat transfer member 31 is housed, and the second heat dissipation fin 10-2 is provided upright in the second region 27 where the heat transfer member 31 is not housed.

[0053] In the heat sink 1, the cover portion 41 and the first heat dissipation fins 10-1 are integrally molded. In other words, the cover portion 41 and the plurality of first heat dissipation fins 10-1, 10-1, 10-1... are combined together, so that the plurality of first heat dissipation fins 10-1, 10-1, 10-1... are not erected on the cover portion 41. Therefore, the cover portion 41 and the plurality of first heat dissipation fins 10-1, 10-1, 10-1... are an integral member, and no boundary such as a joint, adhesive, or seam is formed between the cover portion 41 and the plurality of first heat dissipation fins 10-1, 10-1, 10-1....

[0054] Since the cover portion 41 and the first heat dissipation fins 10-1 are integrally molded, the material of the first heat dissipation fins 10-1 is the same as the material of the cover portion 41. The material of the first heat dissipation fins 10-1 and the cover portion 41 is not particularly limited, and examples thereof include copper, copper alloy, aluminum, and aluminum alloy.

[0055] Furthermore, in the heat sink 1, the base portion 20 and the second heat dissipation fins 10-2 are integrally molded. In other words, the base portion 20 and the plurality of second heat dissipation fins 10-2, 10-2, 10-2... are combined together, and the plurality of second heat dissipation fins 10-2, 10-2, 10-2... are not erected on the base portion 20. Therefore, the base portion 20 and the plurality of second heat dissipation fins 10-2, 10-2, 10-2... are an integral member, and no boundary such as a joint, adhesive, or seam is formed between the base portion 20 and the plurality of second heat dissipation fins 10-2, 10-2, 10-2....

[0056] Because the base portion 20 and the second heat dissipation fins 10-2 are integrally molded, the material of the second heat dissipation fins 10-2 is the same as the material of the base portion 20. The material of the second heat dissipation fins 10-2 and the material of the base portion 20 are not particularly limited, and examples thereof include copper, copper alloy, aluminum, and aluminum alloy.

[0057] The height dimension of the first heat dissipation fin 10-1 erected on the cover portion 41 is smaller than the height dimension of the second heat dissipation fin 10-2 erected in the second region 27 of the first surface 21. As described above, the fin area of ​​the second heat dissipation fin 10-2 erected in the second region 27 of the first surface 21 is larger than the fin area of ​​the first heat dissipation fin 10-1 erected on the cover portion 41.

[0058] The first heat dissipation fins 10-1 erected on the cover portion 41 are the same height as the second heat dissipation fins 10-2 erected on the second region 27 of the first surface 21. As described above, the tips of the first heat dissipation fins 10-1 and the second heat dissipation fins 10-2 are positioned on approximately the same plane. Therefore, the height of the first heat dissipation fins 10-1 is smaller than the height of the second heat dissipation fins 10-2 by the thickness of the protrusions 28 and the cover portion 41.

[0059] Next, a description will be given of an example of how to use the heat sink 1. Fig. 8 is a perspective view from the bottom, illustrating an example of how to use the heat sink according to the first embodiment of the present invention.

[0060] As shown in Figures 7 and 8, by thermally connecting a large number of heat-generating elements 100, 100, 100... mounted on a substrate 101 and having various heat values ​​to the second surface 22 of the base portion 20 of the heat sink 1, the heat sink 1 can cool the large number of heat-generating elements 100, 100, 100.... Furthermore, the second surface 22, which is the heat-receiving surface of the base portion 20, is formed with a shield portion 200, which is a recess corresponding to the position and shape of the other heat-generating elements (not shown), in addition to the large number of heat-generating elements 100, 100, 100... thermally connected to the second surface 22 of the base portion 20. By accommodating the other heat-generating elements in the shield portion 200, the shield portion 200 electromagnetically shields the other heat-generating elements mounted on the substrate 101, different from the heat-generating elements 100 thermally connected to the second surface 22 of the base portion 20. The heat pipe 30 is arranged at a position corresponding to the position of the heat-generating elements 100 thermally connected to the second surface 22 of the base portion 20. Furthermore, the heat pipe 30 is disposed at a position in the thickness direction of the base portion 20 that can avoid the position of the shield portion 200 where other heat generating elements are housed.

[0061] When the numerous heat-generating elements 100, 100, 100..., which are the main cooling targets of the heat pipe 30, are thermally connected to the heat-receiving surface of the base portion 20, heat from the numerous heat-generating elements 100, 100, 100... is transferred to the base portion 20. At this time, the numerous heat-generating elements 100, 100, 100... have different heat values ​​depending on their functions, and the numerous heat-generating elements 100, 100, 100... are arranged in predetermined positions on the substrate 101 depending on their functions. Therefore, when heat from the numerous heat-generating elements 100, 100, 100... is transferred to the base portion 20, the amount of heat received differs depending on the position of the base portion 20. Meanwhile, the heat pipe 30 housed in the groove portion 25 of the first surface 21 has a heat-receiving portion 32 that is thermally connected to the heat-generating elements 100 via the base portion 20. Therefore, the heat pipe 30, by its heat transport function, transports heat from the heat-generating element 100 from the evaporator, which is the heat-receiving portion 32, to the condenser, which is the portion 34 other than the heat-receiving portion 32, and the heat transferred from the heat-generating element 100 to the base portion 20 is diffused throughout the entire base portion 20. The heat that has diffused through the base portion 20 is transferred from the base portion 20 to the first heat-dissipating fin 10-1 and the second heat-dissipating fin 10-2, and the heat transferred to the first heat-dissipating fin 10-1 and the second heat-dissipating fin 10-2 is released to the outside of the heat sink 1 by the heat exchange action of the first heat-dissipating fin 10-1 and the second heat-dissipating fin 10-2. In addition, when the substrate 101 extends along the direction of gravity, by installing the heat sink 1 so that the base portion 20 of the heat sink 1 extends along the direction of gravity and the first heat dissipation fin 10-1 and the second heat dissipation fin 10-2 extend along the direction of gravity, the cooling air that promotes the heat exchange action between the first heat dissipation fin 10-1 and the second heat dissipation fin 10-2 is generated from below to above in the direction of gravity by natural convection, for example, without using a forced cooling means such as a blower fan. Furthermore, if necessary, forced cooling means may be used to promote the heat exchange action between the first heat dissipation fin 10-1 and the second heat dissipation fin 10-2.

[0062] The substrate 101 is equipped with a large number of heating elements 100, 100, 100, ... each having a variety of heat output values, and other heating elements are mounted on the substrate 101, such as a substrate installed in a mobile phone base station. An example of a mobile phone base station is a base station attached to the top of a steel tower.

[0063] Next, an example of a manufacturing method for the heat sink 1 will be described. First, the base portion 20 and the second heat dissipation fins 10-2 are integrally molded using a mold corresponding to the shapes of the base portion 20 and the second heat dissipation fins 10-2, and then the cover portion 41 and the first heat dissipation fins 10-1 are integrally molded using a mold corresponding to the shapes of the cover portion 41 and the first heat dissipation fins 10-1. Next, the heat transfer member 31 (heat pipe 30 in the heat sink 1) is placed in the groove 25 provided in the first region 26 of the base portion 20 integrally molded with the second heat dissipation fins 10-2. Next, stress is applied from above to the outer peripheral surface of the heat transfer member 31, causing plastic deformation of the upper portion of the outer peripheral surface of the heat transfer member 31, thereby crimping and fixing the heat transfer member 31 to the groove 25. Next, the cover portion 41, which is integrally molded with the first heat dissipation fin 10-1, is attached so as to cover the upper surface of the heat transfer member 31 fixed in the groove portion 25, thereby obtaining the heat sink 1 in which the heat transfer member 31 is accommodated in the first region 26 of the first surface 21 of the base portion 20. Thereafter, a desired shield portion is formed on the second surface 22 of the base portion 20 as necessary.

[0064] The heat sink 1 has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which a heating element 100 is thermally connected on the second surface 22, a heat transfer member 31 housed in the groove portion 25 provided in the first region 26, and a second heat dissipation fin 10-2 standing upright in the second region 27.Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member 31 is not housed, thereby increasing the fin area of ​​the second heat dissipation fin 10-2. Furthermore, in the heat sink 1, the heat transfer member 31 is housed in the groove 25 provided in the first region 26 of the first surface 21. Therefore, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member 31 so as to avoid the shield portion 200 or the like along the surface direction of the base portion 20. This provides excellent freedom in arrangement of the heat transfer member 31, resulting in excellent heat uniformity throughout the base portion 20. As described above, the heat sink 1 can increase the fin area of ​​the heat dissipation fins 10 even when the heat sink 1 is installed in a narrow space, and also provides excellent heat uniformity throughout the base portion 20. Furthermore, as described above, the thickness of the base portion 20 is reduced in the second region 27 where the heat transfer member 31 is not housed, thereby reducing the weight of the heat sink 1.

[0065] Therefore, even if a large number of heat-generating bodies 100 with various heat generation amounts are thermally connected to the heat sink 1, the heat sink 1 can maintain uniform temperature distribution in the base portion 20 thereof, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As described above, the heat sink 1 facilitates heat transfer from the base portion 20 to the heat dissipation fins 10, and also uniforms the thermal load throughout the heat dissipation fin group 11. As a result, even if a large number of heat-generating bodies 100 with various heat generation amounts are thermally connected to the heat sink 1, the heat dissipation characteristics of the heat sink 1 are improved.

[0066] Furthermore, in the heat sink 1, the thickness of the cover portion 41 covering the upper surface of the heat transfer member 31 can be made thinner, so that the cover portion 41 protects the heat transfer member 31 from the external environment of the heat sink 1 while also increasing the fin area of ​​the first heat dissipation fin 10-1.

[0067] Furthermore, in the heat sink 1, the second heat dissipation fin 10-2 erected on the second region 27 of the first surface 21 of the base portion 20 has reduced thermal resistance with the base portion 20, so that the thermal resistance between the base portion 20 and the heat dissipation fin group 11 is reduced, thereby improving the heat dissipation characteristics of the heat sink 1.

[0068] Furthermore, in the heat sink 1, the cover portion 41 is positioned opposite only the first region 26 of the first surface 21, so that the thermal resistance between the base portion 20 and the heat dissipation fin group 11 is reliably reduced, thereby reliably improving the heat dissipation characteristics of the heat sink 1.

[0069] Furthermore, in the heat sink 1, the cover portion 41 and the first heat dissipation fin 10-1 are integrally molded, so that the contact resistance between the cover portion 41 and the first heat dissipation fin 10-1 is suppressed, improving the thermal connectivity between the cover portion 41 and the first heat dissipation fin 10-1.

[0070] Furthermore, in the heat sink 1, the base portion 20 and the second heat dissipation fins 10-2 are integrally molded, so that the contact resistance between the base portion 20 and the second heat dissipation fins 10-2 is suppressed, improving the thermal connectivity between the base portion 20 and the second heat dissipation fins 10-2.

[0071] Furthermore, in the heat sink 1, the first region 26 of the first surface 21 has a convex portion 28 that protrudes in the thickness direction of the base portion 20, and the convex portion 28 is provided with a groove 25, so that the thickness of the base portion 20 can be reduced in the second region 27 where the heat transfer member 31 is not accommodated, while a location for accommodating the heat transfer member 31 in the base portion 20 can be reliably secured. Furthermore, the first region 26 has a convex portion 28 that protrudes in the thickness direction of the base portion 20, and the convex portion 28 is provided with a groove 25, so that the heat transfer function of the heat transfer member 31 reliably uniformizes the temperature throughout the base portion 20, and reliably uniforms heat transfer from the base portion 20 throughout the heat dissipation fin group 11.

[0072] Furthermore, in the heat sink 1, the first heat dissipation fin 10-1 and the second heat dissipation fin 10-2 are the same height, so the fin area of ​​the first heat dissipation fin 10-1 and the second heat dissipation fin 10-2 can be increased and the heat sink 1 can be smoothly installed even in a small space.

[0073] Furthermore, in the heat sink 1, the entire heat transfer member 31 is embedded in the heat sink 1, which further improves the thermal connectivity of the heat transfer member 31 in the heat sink 1.

[0074] Furthermore, in the heat sink 1, since the heat transfer member 31 is a heat pipe 30, even if a large number of heat generating elements 100 with various heat generation amounts are thermally connected to the heat sink 1, the thermal uniformity of the base portion 20 of the heat sink 1 can be maintained, and the thermal load across the entire heat dissipation fin group 11 can be reliably uniformed, thereby reliably improving the fin efficiency of the heat dissipation fins 10.

[0075] Furthermore, in the heat sink 1, the heat pipe 30 is fixed to the groove portion 25 by crimping, so that the heat pipe 30 is fixed stably to the base portion 20 while improving the thermal connectivity between the heat pipe 30 and the base portion 20.

[0076] Next, a heat sink according to a second embodiment of the present invention will be described with reference to the drawings. The heat sink according to the second embodiment shares major components with the heat sink according to the first embodiment, so the same components as those in the heat sink according to the first embodiment will be described using the same reference numerals. Note that Fig. 9 is a perspective view illustrating the structure of the base and heat transfer member of the heat sink according to the second embodiment of the present invention.

[0077] In the heat sink 1 according to the first embodiment, the heat pipe 30 has a substantially linear shape in the longitudinal direction in a plan view, but instead, as shown in Fig. 9, in the heat sink 2 according to the second embodiment, the heat pipe 30, which is the heat transfer member 31, has a linear portion 35 and a curved portion 36 in the longitudinal direction in a plan view. In the heat sink 2, the groove portion 25 has a linear portion and a curved portion in the longitudinal direction in a plan view, corresponding to the heat transfer member 31 having a linear portion 35 and a curved portion 36 in the longitudinal direction in a plan view.

[0078] In this way, in the heat sink of the present invention, there is no need to position the heat transfer member 31 so as to avoid the shield portion 200, etc., provided on the second surface 22 to which the heating element 100 is thermally connected, in the surface direction of the base portion 20, and in order to maintain the thermal uniformity of the base portion 20, the shape of the heat transfer member 31 can be appropriately selected depending on the position of the heating element 100 and the heat generation amount of the heating element 100.

[0079] Next, a heat sink according to a third embodiment of the present invention will be described with reference to the drawings. The heat sink according to the third embodiment shares major components with the heat sinks according to the first and second embodiments, and therefore the same components as those of the heat sinks according to the first and second embodiments will be described using the same reference numerals. Note that Fig. 10 is a perspective view illustrating the heat sink according to the third embodiment of the present invention.

[0080] In the heat sink 1 according to the first embodiment, the cover portion 41 and the first heat dissipation fins 10-1 are integrally molded, and the base portion 20 and the second heat dissipation fins 10-2 are integrally molded. However, as shown in FIG. 10, in the heat sink 3 according to the third embodiment, the cover portion 41 and the first heat dissipation fins 10-1 are separate bodies, and the base portion 20 and the second heat dissipation fins 10-2 are separate bodies.

[0081] As described above, the cover portion 41 and the first heat dissipation fins 10-1 are separate members in the heat sink 3. That is, by combining the cover portion 41 and the plurality of first heat dissipation fins 10-1, 10-1, 10-1..., the plurality of first heat dissipation fins 10-1, 10-1, 10-1... are erected on the cover portion 41. Therefore, a boundary portion 14 such as a joint, adhesive portion, or seam is formed between the cover portion 41 and the plurality of first heat dissipation fins 10-1, 10-1, 10-1....

[0082] As described above, the base portion 20 and the second heat dissipation fins 10-2 are separate members in the heat sink 3. That is, by combining the base portion 20 and the plurality of second heat dissipation fins 10-2, 10-2, 10-2..., the plurality of second heat dissipation fins 10-2, 10-2, 10-2... are erected on the base portion 20. Therefore, a boundary portion 14 such as a joint, adhesive portion, or seam is formed between the base portion 20 and the plurality of second heat dissipation fins 10-2, 10-2, 10-2...

[0083] Methods for fixing the first heat dissipation fin 10-1 in an upright position on the cover portion 41 include, for example, soldering the base of the first heat dissipation fin 10-1 onto the cover portion 41, welding the base of the first heat dissipation fin 10-1 onto the cover portion 41 by laser welding or the like, inserting the base of the first heat dissipation fin 10-1 into a narrow groove formed on the outer surface of the cover portion 41, plastically deforming the narrow groove, and crimping the first heat dissipation fin 10-1 into the narrow groove of the cover portion 41, and so on.

[0084] Methods for fixing the second heat dissipation fin 10-2 in an upright position on the first surface 21 of the base portion 20 include, for example, soldering the base of the second heat dissipation fin 10-2 onto the first surface 21, welding the base of the second heat dissipation fin 10-2 onto the first surface 21 by laser welding or the like, inserting the base of the second heat dissipation fin 10-2 into a narrow groove formed on the first surface 21, plastically deforming the narrow groove, and crimping the second heat dissipation fin 10-2 into the narrow groove on the first surface 21, and so on.

[0085] Since the cover portion 41 and the first heat dissipation fin 10-1 are separate bodies, and the base portion 20 and the second heat dissipation fin 10-2 are separate bodies, the materials of the cover portion 41 and the first heat dissipation fin 10-1 may be the same or different, and the materials of the base portion 20 and the second heat dissipation fin 10-2 may be the same or different.

[0086] In the heat sink 3, the cover portion 41 and the first heat dissipation fins 10-1 are separate bodies, so the first heat dissipation fins 10-1 can be made thin, allowing the first heat dissipation fins 10-1 to be designed with a thickness that is optimal for the required performance. Therefore, in the heat sink 3, the fin pitch of the first heat dissipation fins 10-1 can be narrowed, so the heat dissipation characteristics of the heat sink 3 can be improved by increasing the number of first heat dissipation fins 10-1 or widening the space between the first heat dissipation fins 10-1 to increase ventilation efficiency. Furthermore, in the heat sink 3, the cover portion 41 and the first heat dissipation fins 10-1 are separate bodies, so the first heat dissipation fins 10-1 can be designed with an optimal thickness by thinning the thickness, allowing the heat sink 3 to be made lighter. Furthermore, in the heat sink 3, the cover portion 41 and the first heat dissipation fins 10-1 are separate bodies, and the thickness of the first heat dissipation fins 10-1 can be optimized, so that gaps between the first heat dissipation fins 10-1 can be reliably secured and an increase in pressure loss of the cooling air supplied between the first heat dissipation fins 10-1 can be prevented, resulting in improved heat dissipation characteristics of the heat sink 3.

[0087] Furthermore, in the heat sink 3, because the base portion 20 and the second heat dissipation fins 10-2 are separate bodies, the second heat dissipation fins 10-2 can be made thin, allowing the second heat dissipation fins 10-2 to be designed with a thickness that is optimal for the required performance. Therefore, in the heat sink 3, the fin pitch of the second heat dissipation fins 10-2 can be narrowed, so the heat dissipation characteristics of the heat sink 3 can be improved by increasing the number of second heat dissipation fins 10-2 or widening the space between the second heat dissipation fins 10-2 to increase ventilation efficiency. Furthermore, in the heat sink 3, because the base portion 20 and the second heat dissipation fins 10-2 are separate bodies, the second heat dissipation fins 10-2 can be designed with an optimal thickness by thinning the thickness of the second heat dissipation fins 10-2, allowing the heat sink 3 to be made lighter. Furthermore, in the heat sink 3, the base portion 20 and the second heat dissipation fins 10-2 are separate bodies, and the thickness of the second heat dissipation fins 10-2 can be optimized, so that gaps between the second heat dissipation fins 10-2 can be reliably secured and an increase in pressure loss of the cooling air supplied between the second heat dissipation fins 10-2 can be prevented, resulting in improved heat dissipation characteristics of the heat sink 3.

[0088] The heat sink 3 also has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which the heating element 100 is thermally connected on the second surface 22, a heat transfer member 31 housed in the groove portion 25, and a second heat dissipation fin 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member 31 is not housed, thereby increasing the fin area of ​​the second heat dissipation fin 10-2. Furthermore, in the heat sink 3, since the heat transfer member 31 is accommodated in the groove 25, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member 31 so as to avoid the shield portion 200 or the like in the surface direction of the base portion 20. This provides excellent freedom in arrangement of the heat transfer member 31, resulting in excellent heat uniformity throughout the base portion 20. As described above, the heat sink 3 also provides excellent heat uniformity throughout the base portion 20. Therefore, even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 3, the heat uniformity of the base portion 20 of the heat sink 3 can be maintained, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As a result, the heat dissipation characteristics of the heat sink 3 are improved even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 3. Furthermore, since the thickness of the cover portion 41 of the heat sink 3 can be reduced, the cover portion 41 protects the heat transfer member 31 from the external environment of the heat sink 3, while also increasing the fin area of ​​the first heat dissipation fin 10-1.

[0089] Next, a heat sink according to a fourth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the fourth embodiment shares major components with the heat sinks according to the first to third embodiments, and therefore the same components as those of the heat sinks according to the first to third embodiments will be described using the same reference numerals. Note that Figure 11 is a side cross-sectional view of the heat sink according to the fourth embodiment of the present invention.

[0090] In the heat sink 1 according to the first embodiment, the shape of the heat pipe 30 in the direction perpendicular to the longitudinal direction (radial direction) of the container 33 is semicircular. However, as shown in Fig. 11 , in the heat sink 4 according to the fourth embodiment, the shape of the heat pipe 30 in the direction perpendicular to the longitudinal direction (radial direction) of the container 33 is flattened. In the heat sink 4, the heat pipe 30 has a flattened portion. The heat pipe 30 of the heat sink 4 is a flattened heat pipe.

[0091] As described above, in the heat sink of the present invention, the radial shape of the container 33 of the heat pipe 30 is not particularly limited, and can be selected appropriately depending on the conditions of use of the heat sink, etc.

[0092] The heat sink 4 also has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which the heating element 100 is thermally connected on the second surface 22, a heat transfer member 31 housed in the groove portion 25, and a second heat dissipation fin 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member 31 is not housed, thereby increasing the fin area of ​​the second heat dissipation fin 10-2. Furthermore, since the heat sink 4 also has the heat transfer member 31 housed in the groove 25, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member 31 so as to avoid the shield portion 200 or the like in the surface direction of the base portion 20. This provides excellent freedom in arrangement of the heat transfer member 31, resulting in excellent heat uniformity throughout the base portion 20. As described above, the heat sink 4 also has excellent heat uniformity throughout the base portion 20. Therefore, even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 4, the heat uniformity of the base portion 20 of the heat sink 4 can be maintained, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As a result, the heat dissipation characteristics of the heat sink 4 are improved even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 4. Furthermore, since the thickness of the cover portion 41 of the heat sink 4 can be reduced, the cover portion 41 protects the heat transfer member 31 from the external environment of the heat sink 4, while also increasing the fin area of ​​the first heat dissipation fin 10-1.

[0093] Next, a heat sink according to a fifth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the fifth embodiment shares major components with the heat sinks according to the first to fourth embodiments, and therefore the same components as those of the heat sinks according to the first to fourth embodiments will be described using the same reference numerals. Note that Fig. 12 is a side cross-sectional view of the heat sink according to the fifth embodiment of the present invention. Fig. 13 is a perspective view from the bottom illustrating the heat sink according to the fifth embodiment of the present invention.

[0094] In the heat sinks 1, 2, 3, and 4 according to the first to fourth embodiments, a heat pipe 30 was used as the heat transfer member. Instead, as shown in Figures 12 and 13, in the heat sink 5 according to the fifth embodiment, a vapor chamber 50 is used as the heat transfer member.

[0095] The vapor chamber 50 includes a flat container 53 in which the peripheral edge of a laminate having one plate-like body and the other plate-like body is sealed, a wick structure (not shown) having capillary force housed in the container 53, and a working fluid (not shown) such as water sealed in the internal space of the container 53. The thin plate-shaped container 53 is a member whose internal space is sealed. The internal space of the container 53 is reduced in pressure by degassing. In the vapor chamber 50, the heat receiving portion functions as an evaporator, and the portion other than the heat receiving portion functions as a condenser.

[0096] The material of the container 53 of the vapor chamber 50 may be the same as or different from the material of the base portion 20. Examples of materials for the container 53 of the vapor chamber 50 include copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, and stainless steel.

[0097] Furthermore, in the heat sinks 1, 2, 3, and 4 according to the first to fourth embodiment examples, the heat pipe 30 was housed in a groove 25 provided in the protrusion 28, but instead, as shown in FIG. 12, the heat sink 5 does not have a protrusion 28, and the vapor chamber 50 is housed in a groove (recess) 25 formed on the first surface 21 of the base portion 20.

[0098] Furthermore, in the heat sinks 1, 2, 3, and 4 according to the first to fourth embodiment examples, the entire heat pipe 30, which is the heat transport member, is embedded in the heat sink. However, instead, as shown in Figures 12 and 13, in the heat sink 5, at least a portion of the vapor chamber 50 has an exposed portion 51 that is exposed from the second surface 22 of the base portion 20, and the exposed portion 51 is in direct contact with the heat generating element 100.

[0099] In the heat sink 5, the vapor chamber 50 has a protruding portion 52 that protrudes in the thickness direction of the base portion 20, and the protruding portion 52 forms an exposed portion 51. Specifically, the flat tip of the protruding portion 52 forms the exposed portion 51. In the heat sink 5, the protruding portion 52, which is a convex portion, is formed in a partial region of the container 53, and a partial region of the container 53 is exposed from the second surface 22 of the base portion 20. The interior of the protruding portion 52 is a space that communicates with the internal space of the container 53. The vapor chamber 50 may have one or more protruding portions 52; in the heat sink 5, multiple protruding portions 52 (two) are provided. Also, as shown in FIG. 13 , the second surface 22 to which the multiple heating elements 100, 100, 100... are thermally connected is provided with a shielding portion 200 for accommodating the heating elements that generate electromagnetic waves, etc. In FIG. 13 , the position of the shielding portion 200 is shown on the base portion 20 to which the multiple heating elements 100, 100, 100... are thermally connected.

[0100] The heat sink 5 also has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which the heating element 100 is thermally connected on the second surface 22, a vapor chamber 50 which is a heat transfer member housed in the groove portion 25, and second heat dissipation fins 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member is not housed, thereby increasing the fin area of ​​the second heat dissipation fins 10-2. Furthermore, since the heat sink 5 also accommodates the heat transfer member in the groove 25, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member so as to avoid the shield portion 200 or the like in the surface direction of the base portion 20. This provides excellent freedom in arranging the heat transfer member, resulting in excellent heat uniformity throughout the base portion 20. As described above, the heat sink 5 also provides excellent heat uniformity throughout the base portion 20. Therefore, even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 5, the heat uniformity of the base portion 20 of the heat sink 5 can be maintained, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As a result, the heat dissipation characteristics of the heat sink 5 are improved even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 5. Furthermore, since the thickness of the cover portion 41 of the heat sink 5 can be reduced, the cover portion 41 protects the heat transfer member from the external environment of the heat sink 5, while also increasing the fin area of ​​the first heat dissipation fins 10-1.

[0101] In particular, in the heat sink 5, at least a portion of the vapor chamber 50, which is a heat transfer member, has an exposed portion 51 exposed from the second surface 22, and the exposed portion 51 can be in direct contact with the heating element 100, thereby further improving the thermal connectivity between the heating element 100 and the vapor chamber 50, which is a heat transfer member, and further improving the heat dissipation characteristics of the heat sink 5.

[0102] Next, a heat sink according to a sixth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the sixth embodiment shares major components with the heat sinks according to the first to fifth embodiments, and therefore the same components as those of the heat sinks according to the first to fifth embodiments will be described using the same reference numerals. Note that Fig. 14 is a side cross-sectional view of the heat sink according to the sixth embodiment of the present invention. Fig. 15 is an explanatory diagram of a heat pipe used in the heat sink according to the sixth embodiment of the present invention.

[0103] In the heat sink 1 according to the first embodiment, the heat pipe 30 extends substantially linearly from one end to the other end in the second direction L2 along the extension direction of the first surface 21 of the base 20. Instead, as shown in FIGS. 14 and 15 , in the heat sink 6 according to the sixth embodiment, the heat pipe 70, which is a heat transfer member, has a step 62 bent in the thickness direction of the base 20. Furthermore, in the heat sink 6, the step 62 defines an exposed portion 61 of the heat pipe 70 that is exposed from the second surface 22 of the base 20. In the heat sink 6, the step 62 is formed in a central portion 73 in the longitudinal direction of the heat pipe 70. No step is formed between one end 71 and the other end 72 of the heat pipe 70, and the one end 71 and the other end 72 of the heat pipe 70 extend substantially linearly. Note that the heat sink 6 may have a configuration in which the step 62 does not define the exposed portion 61.

[0104] Furthermore, in addition to the convex portion 28 on the first surface 21, the heat sink 6 is further provided with a convex portion 60 on the second surface 22 of the base portion 20 that protrudes from the second surface 22 of the base portion 20 in the thickness direction of the base portion 20. One end 71 and the other end 72 of the heat pipe 70 are housed in grooves 25 formed in the convex portion 28 on the first surface 21, and a step portion 62 located in a central portion 73 in the longitudinal direction of the heat pipe 70 is housed in grooves 25 formed in the convex portion 60 on the second surface 22. As the heat pipe 70 moves from one end 71 to the central portion 73, the heat pipe 70 extends from the convex portion 28 on the first surface 21 to the convex portion 60 on the second surface 22. Furthermore, from the central portion 73 of the heat pipe 70 toward the other end portion 72, the heat pipe 70 extends from the convex portion 60 on the second surface 22 toward the convex portion 28 on the first surface 21. Therefore, the region of the central portion 73 of the heat pipe 70 has an exposed portion 61 that is exposed from the convex portion 60 on the second surface 22, and the exposed portion 61 comes into direct contact with the heating element 100.

[0105] The level of the step 62 can be appropriately selected depending on the height of the portion where one end 71 and the other end 72 of the heat pipe 70 are embedded relative to the second surface 22. Therefore, without providing the protrusion 60, the region of the central portion 73 of the heat pipe 70 may have an exposed portion 61 that is exposed from the second surface 22, and the exposed portion 61 may be in direct contact with the heating element 100.

[0106] The heat sink 6 is provided with a heat pipe 70 having an exposed portion 61 formed by a step portion 62, and a heat pipe 30 that is housed in the protrusion 28 of the first surface 21 and extends in a substantially straight line with no exposed portion formed therein. In the heat sink 6, the heat pipes 30, 70 are fixed to the groove portion 25 by plastically deforming the upper portion of their outer circumferential surfaces, and therefore the shapes of the heat pipes 30, 70 in the direction perpendicular to the longitudinal direction (radial direction) are both semicircular.

[0107] The heat sink 6 also has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which a heat generating element 100 is thermally connected on the second surface 22, heat pipes 30, 70 which are heat transfer members housed in the groove portion 25, and second heat dissipation fins 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member is not housed, thereby increasing the fin area of ​​the second heat dissipation fins 10-2. Furthermore, since the heat sink 6 also accommodates the heat transfer member in the groove 25, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member so as to avoid the shield portion 200 or the like in the surface direction of the base portion 20. This provides excellent flexibility in arranging the heat transfer member, resulting in excellent heat uniformity throughout the base portion 20. As described above, the heat sink 6 also provides excellent heat uniformity throughout the base portion 20. Therefore, even if a large number of heat generating elements 100 with various heat generating values ​​are thermally connected to the heat sink 6, the heat uniformity of the base portion 20 of the heat sink 6 can be maintained, and heat transfer from the base portion 20 is uniform throughout the multiple heat dissipation fins 10, 10, 10.... As a result, the heat dissipation characteristics of the heat sink 6 are improved even if a large number of heat generating elements 100 with various heat generating values ​​are thermally connected to the heat sink 6. Furthermore, since the thickness of the cover portion 41 of the heat sink 6 can be reduced, the cover portion 41 protects the heat transfer member from the external environment of the heat sink 6, while also increasing the fin area of ​​the first heat dissipation fins 10-1.

[0108] In particular, in the heat sink 6, a portion of the heat pipe 70 has an exposed portion 61 exposed from the second surface 22 of the base portion 20, and the exposed portion 61 is capable of direct contact with the heating element 100, thereby further improving the thermal connectivity between the heating element 100 and the heat pipe 70 and further improving the heat dissipation characteristics of the heat sink 6.

[0109] Next, a heat sink according to a seventh embodiment of the present invention will be described with reference to the drawings. The heat sink according to the seventh embodiment shares major components with the heat sinks according to the first to sixth embodiments, and therefore the same components as those of the heat sinks according to the first to sixth embodiments will be described using the same reference numerals. Note that Fig. 16 is a side cross-sectional view of the heat sink according to the seventh embodiment of the present invention.

[0110] In the heat sink 6 according to the sixth embodiment, the shape of the heat pipes 30, 70 in the direction perpendicular to the longitudinal direction (radial direction) was semicircular, but instead, as shown in Fig. 16, in the heat sink 7 according to the seventh embodiment, the heat pipe 70 having a step portion 62 at the central portion 73 in the longitudinal direction has a flat radial shape, and the heat pipe 30 having no step portion and extending in a substantially straight line has a flat radial shape. Therefore, both the heat pipes 30, 70 are flattened heat pipes in which the containers have been flattened.

[0111] As described above, in the heat sink of the present invention, the radial shape of the heat pipe 70 having the step portion 62 is not particularly limited, and can be selected appropriately depending on the conditions of use of the heat sink, etc.

[0112] Next, a heat sink according to an eighth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the eighth embodiment shares major components with the heat sinks according to the first to seventh embodiments, and therefore the same components as those of the heat sinks according to the first to seventh embodiments will be described using the same reference numerals. Note that Fig. 17 is a side cross-sectional view of the heat sink according to the eighth embodiment of the present invention. Fig. 18 is a perspective view from the bottom illustrating the heat sink according to the eighth embodiment of the present invention.

[0113] In the heat sink 5 according to the fifth embodiment, a portion of the vapor chamber 50 has a protruding portion 52 that protrudes in the thickness direction of the base portion 20, and the protruding portion 52 forms an exposed portion 51. However, in the heat sink 8 according to the eighth embodiment, as shown in Figures 17 and 18, the vapor chamber 50 does not have a protruding portion, and the entire vapor chamber 50 has a flat shape. Therefore, in the heat sink 8, the vapor chamber 50 does not have an exposed portion.

[0114] In the heat sink 8, the entire vapor chamber 50 is embedded in the heat sink 8. The heat sink 8 does not have a protrusion 28, and the vapor chamber 50 is housed in a groove (recess) 25 formed on the first surface 21 of the base portion 20. As described above, in the heat sink 8, the vapor chamber 50 is not in direct contact with the heating element 100. Also, as shown in FIG. 18 , a shield portion 200 for housing the heating element that generates electromagnetic waves is provided on the second surface 22 to which the multiple heating elements 100, 100, 100... are thermally connected. In FIG. 18 , the position of the shield portion 200 is shown on the base portion 20 to which the multiple heating elements 100, 100, 100... are thermally connected.

[0115] The heat sink 8 also has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which the heating element 100 is thermally connected on the second surface 22, a vapor chamber 50 which is a heat transfer member housed in the groove portion 25, and second heat dissipation fins 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member is not housed, thereby increasing the fin area of ​​the second heat dissipation fins 10-2. Furthermore, since the heat sink 8 also accommodates the heat transfer member in the groove 25, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member so as to avoid the shield portion 200 or the like in the surface direction of the base portion 20. This provides excellent freedom in arranging the heat transfer member, resulting in excellent temperature uniformity throughout the base portion 20. As described above, the heat sink 8 also provides excellent temperature uniformity throughout the base portion 20. Therefore, even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 8, the heat uniformity of the base portion 20 of the heat sink 8 can be maintained, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As a result, the heat dissipation characteristics of the heat sink 8 are improved even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 8. Furthermore, since the thickness of the cover portion 41 of the heat sink 8 can be reduced, the heat transfer member is protected from the external environment of the heat sink 8 by the cover portion 41, and the fin area of ​​the first heat dissipation fin 10-1 can also be increased.

[0116] Next, a heat sink according to a ninth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the ninth embodiment shares major components with the heat sinks according to the first to eighth embodiments, and therefore the same components as those of the heat sinks according to the first to eighth embodiments will be described using the same reference numerals. Note that Fig. 19 is an explanatory diagram illustrating the arrangement of the heat transfer members of the heat sink according to the ninth embodiment of the present invention from a plan view.

[0117] In the heat sink 1 according to the first embodiment, the heat transfer member 31 extends in the extension direction of the heat dissipation fins 10, but instead, as shown in Fig. 19, in the heat sink 9 according to the ninth embodiment, the heat transfer member 31, which has a substantially linear shape in the longitudinal direction, extends at a predetermined angle with respect to the extension direction of the heat dissipation fins 10. Therefore, in the heat sink 9, the heat transfer member 31 does not extend in a direction parallel to the extension direction of the heat dissipation fins 10.

[0118] The angle of the heat transfer member 31 relative to the extension direction of the heat dissipation fins 10 is not particularly limited, but in the heat sink 9, the heat transfer member 31 extends in a direction approximately perpendicular to the extension direction of the heat dissipation fins 10. In the heat sink 9, the heat transfer member 31 may also be, for example, a heat pipe 30. In the heat sink 9, a plurality of heat pipes 30, 30, 30... are arranged in parallel in a direction approximately perpendicular to the extension direction of the heat dissipation fins 10.

[0119] In this way, in the heat sink of the present invention, the arrangement of the heat transfer member 31 for uniformly heating the entire base portion 20 can be selected appropriately depending on the position of the heat generating element 100, etc.

[0120] The heat sink 9 also has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which the heating element 100 is thermally connected on the second surface 22, a heat transfer member 31 housed in the groove portion 25, and a second heat dissipation fin 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member 31 is not housed, thereby increasing the fin area of ​​the second heat dissipation fin 10-2. Furthermore, in the heat sink 9, since the heat transfer member 31 is accommodated in the groove 25, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member 31 so as to avoid the shield portion 200 or the like in the surface direction of the base portion 20. This provides excellent freedom in arrangement of the heat transfer member 31, and therefore excellent heat uniformity throughout the base portion 20. As described above, the heat sink 9 also provides excellent heat uniformity throughout the base portion 20. Therefore, even if a large number of heat generating elements 100 with various heat generation amounts are thermally connected to the heat sink 9, the heat uniformity of the base portion 20 of the heat sink 9 can be maintained, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As a result, the heat dissipation characteristics of the heat sink 9 are improved even if a large number of heat generating elements 100 with various heat generation amounts are thermally connected to the heat sink 9. Furthermore, since the thickness of the cover portion 41 of the heat sink 9 can be reduced, the cover portion 41 protects the heat transfer member 31 from the external environment of the heat sink 9, while also increasing the fin area of ​​the first heat dissipation fin 10-1.

[0121] Next, a heat sink according to a tenth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the tenth embodiment shares major components with the heat sinks according to the first to ninth embodiments, and therefore the same components as those in the heat sinks according to the first to ninth embodiments will be described using the same reference numerals. Note that Figure 20 is an explanatory diagram illustrating the arrangement of the heat transfer members of the heat sink according to the tenth embodiment of the present invention from a plan view.

[0122] In the heat sink 1 according to the first embodiment, the heat transfer member 31 extends in the extension direction of the heat dissipation fins 10, but instead, in the heat sink 80 according to the tenth embodiment, the shape of the heat transfer member 31 in the longitudinal direction has a curved portion, as shown in Fig. 20. The shape having a curved portion may be a U-shape, an L-shape, a U-shape, etc. when viewed from above, but is not particularly limited thereto. For the sake of convenience of explanation, the heat sink 80 has a U-shape when viewed from above.

[0123] In the heat sink 80, the heat transfer member 31 has a central portion 93 that extends substantially linearly in the extension direction of the heat dissipation fins 10, and one end portion 91 and the other end portion 92 that extend substantially linearly at a predetermined angle relative to the extension direction of the heat dissipation fins 10. In the heat sink 80, the one end portion 91 and the other end portion 92 of the heat transfer member 31 extend in a direction substantially perpendicular to the extension direction of the heat dissipation fins 10. In the heat sink 80, the heat transfer member 31 may also be, for example, a heat pipe 30. In the heat sink 80, a plurality of heat pipes 30, 30, 30... are arranged such that the central portions 93 face each other.

[0124] In this way, in the heat sink of the present invention, the shape of the heat transfer member 31 for uniformly heating the entire base portion 20 can be selected appropriately depending on the position of the heat generating element 100, etc.

[0125] The heat sink 80 also has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which the heating element 100 is thermally connected on the second surface 22, a heat transfer member 31 housed in the groove portion 25, and a second heat dissipation fin 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member 31 is not housed, thereby increasing the fin area of ​​the second heat dissipation fin 10-2. Furthermore, in the heat sink 80, since the heat transfer member 31 is accommodated in the groove 25, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member 31 so as to avoid the shield portion 200 or the like in the surface direction of the base portion 20. This provides excellent freedom in arrangement of the heat transfer member 31, resulting in excellent temperature uniformity throughout the base portion 20. As described above, the heat sink 80 also provides excellent temperature uniformity throughout the base portion 20. Therefore, even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 80, the heat uniformity of the base portion 20 of the heat sink 80 can be maintained, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As a result, the heat dissipation characteristics of the heat sink 80 are improved even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 80. Furthermore, since the thickness of the cover portion 41 of the heat sink 80 can be reduced, the cover portion 41 protects the heat transfer member 31 from the external environment of the heat sink 80, while also increasing the fin area of ​​the first heat dissipation fin 10-1.

[0126] Next, a heat sink according to an eleventh embodiment of the present invention will be described with reference to the drawings. The heat sink according to the eleventh embodiment shares major components with the heat sinks according to the first to tenth embodiments, and therefore the same components as those of the heat sinks according to the first to tenth embodiments will be described using the same reference numerals. Note that FIG. 21 is an explanatory diagram illustrating the arrangement of the heat dissipation fins of the heat sink according to the eleventh embodiment of the present invention from a plan view. Also, in FIG. 21, the heat transfer member and cover are omitted for the sake of convenience in explaining the arrangement of the heat dissipation fins.

[0127] In the heat sink 1 according to the first embodiment, each heat dissipation fin 10 extends substantially parallel to the second direction L2 of the base portion 20 and substantially perpendicular to the first direction L1. However, as shown in FIG. 21 , in a heat sink 81 according to the eleventh embodiment, each heat dissipation fin 10 extends obliquely to the second direction L2 of the base portion 20 and also obliquely to the first direction L1. In the heat sink 81, each heat dissipation fin 10 extends substantially linearly. In the heat sink 81, a plurality of heat dissipation fins 10 are arranged in parallel at predetermined intervals on the first surface 21 of the base portion 20. The plurality of heat dissipation fins 10 are also arranged in parallel at substantially equal intervals along the second direction L2. The plurality of heat dissipation fins 10 are also arranged in parallel along the first direction L1.

[0128] 21 , in the heat sink 81, the heat dissipation fins 10 are arranged so that they extend upward in the figure (e.g., extend from below to above in the direction of gravity) as they move outward from the base 20. Specifically, in FIG. 21 , the heat dissipation fins 10 arranged on the left side of the base 20 are arranged so that they extend upward in the figure (e.g., extend from below to above in the direction of gravity) as they move outward from the base 20 (to the left in FIG. 21 ). Furthermore, the heat dissipation fins 10 arranged on the right side of the base 20 are arranged so that they extend upward in the figure (e.g., extend from below to above in the direction of gravity) as they move outward from the base 20 (to the right in FIG. 21 ).

[0129] The angle of the extending direction of the heat dissipating fins 10 with respect to the first direction L1 of the base portion 20 is not particularly limited, but may be in the range of 40° to 70°, for example.

[0130] In the heat sink 81, for example, when cooling air is supplied from below to above in the direction of gravity along the second direction L2, the air flows outward over the first surface 21 of the base portion 20 in the first direction L1 of the base portion 20.

[0131] In this way, in the heat sink of the present invention, the extension direction of the heat dissipation fins 10 erected on the first surface 21 of the base portion 20 can be selected as appropriate in order to adjust the flow direction of the cooling air on the first surface 21.

[0132] Next, a heat sink according to a twelfth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the twelfth embodiment shares major components with the heat sinks according to the first to eleventh embodiments, and therefore the same components as those in the heat sinks according to the first to eleventh embodiments will be described using the same reference numerals. Note that FIG. 22 is an explanatory diagram illustrating the arrangement of the heat dissipation fins of the heat sink according to the twelfth embodiment of the present invention from a plan view. Also, in FIG. 22, the heat transfer member and cover are omitted for the sake of convenience in explaining the arrangement of the heat dissipation fins.

[0133] In the heat sink 81 according to the eleventh embodiment, the heat dissipation fins 10 are arranged to extend upward in the figure (for example, extending from below to above in the direction of gravity) as they move outward from the base 20, but instead, as shown in Fig. 22, in a heat sink 82 according to a twelfth embodiment of the present invention, the heat dissipation fins 10 are arranged to extend downward in the figure (for example, extending from above to below in the direction of gravity) as they move outward from the base 20. From the above, in the heat sink 82, like the heat sink 81 according to the eleventh embodiment described above, the heat dissipation fins 10 extend obliquely with respect to the second direction L2 of the base 20 and also obliquely with respect to the first direction L1.

[0134] 22, the heat dissipation fins 10 arranged on the left side of the base unit 20 are arranged to extend downward in the figure (for example, from above to below in the direction of gravity) as they move outward from the base unit 20 (to the left in FIG. 22). Also, the heat dissipation fins 10 arranged on the right side of the base unit 20 are arranged to extend downward in the figure (for example, from above to below in the direction of gravity) as they move outward from the base unit 20 (to the right in FIG. 22).

[0135] The angle of the extending direction of the heat dissipating fins 10 with respect to the first direction L1 of the base portion 20 is not particularly limited, but may be in the range of 40° to 70°, for example.

[0136] In the heat sink 82, for example, when cooling air is supplied from below to above in the direction of gravity along the second direction L2, the air flows inward on the first surface 21 of the base portion 20 in the first direction L1 of the base portion 20.

[0137] Next, a heat sink according to a thirteenth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the thirteenth embodiment shares major components with the heat sinks according to the first to twelfth embodiments, and therefore the same components as those of the heat sinks according to the first to twelfth embodiments will be described using the same reference numerals. Note that FIG. 23 is an explanatory diagram illustrating the arrangement of the heat dissipation fins of the heat sink according to the thirteenth embodiment of the present invention from a plan view. Also, in FIG. 23, the heat transfer member and cover are omitted for the sake of convenience in explaining the arrangement of the heat dissipation fins.

[0138] 23 , the heat sink 83 according to the thirteenth embodiment has diagonal heat dissipation fins 10 extending diagonally with respect to the second direction L2 of the base portion 20 and parallel heat dissipation fins 10 extending substantially parallel to the second direction L2 of the base portion 20 and substantially perpendicular to the first direction L1. In addition, the heat sink 83 has composite heat dissipation fins 10 that have parallel portions extending substantially parallel to the second direction L2 of the base portion 20 and diagonal portions extending diagonally with respect to the second direction L2 of the base portion 20.

[0139] In the heat sink 83, as shown in FIG. 23 , the heat dissipation fins 10 arranged on the upper side of the base 20 (e.g., above in the direction of gravity) are parallel, while the heat dissipation fins 10 arranged on the lower side of the base 20 (e.g., below in the direction of gravity) are oblique. Furthermore, the composite heat dissipation fins 10 have parallel portions located on the upper side of the base 20 (e.g., above in the direction of gravity) and oblique portions located on the lower side of the base 20 (e.g., below in the direction of gravity). The parallel portions of the multiple parallel heat dissipation fins 10, 10, 10... and the multiple composite heat dissipation fins 10, 10, 10... are arranged in parallel at a predetermined interval. The oblique heat dissipation fins 10, 10, 10... and the oblique portions of the multiple composite heat dissipation fins 10, 10, 10... are arranged in parallel at a predetermined interval.

[0140] In the heat sink 83, the oblique heat dissipation fins 10 and the oblique portions of the composite heat dissipation fins 10 arranged on the left side of the base 20 are arranged to extend downward in the figure (for example, extend from above to below in the direction of gravity) as they move outward (to the left in FIG. 23 ) from the base 20. Also, the oblique heat dissipation fins 10 and the oblique portions of the composite heat dissipation fins 10 arranged on the right side of the base 20 are arranged to extend downward in the figure (for example, extend from above to below in the direction of gravity) as they move outward (to the right in FIG. 23 ) from the base 20.

[0141] The angle of the extending direction of the inclined heat dissipation fins 10 and the inclined portions of the combined heat dissipation fins 10 relative to the first direction L1 of the base portion 20 is not particularly limited, but may be in the range of 40° to 70°, for example.

[0142] In the heat sink 83, for example, when cooling air is supplied from below to above in the direction of gravity along the second direction L2, the air flows inward in the first direction L1 of the base portion 20 on the first surface 21 of the base portion 20 on the below side of the base portion 20 (below in the direction of gravity), and flows along the second direction L2 on the first surface 21 of the base portion 20 on the above side of the base portion 20 (above in the direction of gravity).

[0143] Heat sinks 81, 82, and 83 also have a first surface 21 having a first region 26 in which a groove 25 is provided and a second region 27 in which the groove 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which a heating element 100 is thermally connected on the second surface 22, a heat transfer member 31 housed in the groove 25, and a second heat dissipation fin 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member 31 is not housed, thereby increasing the fin area of ​​the second heat dissipation fin 10-2. Furthermore, in the heat sinks 81, 82, and 83, the heat transfer member 31 is housed in the groove 25, so even if a shield 200 or the like is provided on the second surface 22 to which the heating element 100 is thermally connected, there is no need to position the heat transfer member 31 so as to avoid the shield 200 or the like in the surface direction of the base 20, and this provides excellent freedom in positioning the heat transfer member 31, resulting in excellent temperature uniformity throughout the base 20. From the above, the heat sinks 81, 82, and 83 also provide excellent temperature uniformity throughout the base 20. Therefore, even in the heat sinks 81, 82, and 83, even if a large number of heat generating elements 100 with various heat generation amounts are thermally connected to the heat sinks 81, 82, and 83, the heat uniformity of the base portion 20 of the heat sinks 81, 82, and 83 can be maintained, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As a result, even if a large number of heat generating elements 100 with various heat generation amounts are thermally connected to the heat sinks 81, 82, and 83, the heat dissipation characteristics of the heat sinks 81, 82, and 83 are improved. Furthermore, since the thickness of the cover portion 41 can be reduced in the heat sinks 81, 82, and 83, the cover portion 41 protects the heat transfer member 31 from the external environment of the heat sinks 81, 82, and 83, and the fin area of ​​the first heat dissipation fins 10-1 can also be increased.

[0144] Next, a heat sink according to a fourteenth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the fourteenth embodiment shares major components with the heat sinks according to the first to thirteenth embodiments, and therefore the same components as those of the heat sinks according to the first to thirteenth embodiments will be described using the same reference numerals. Note that Figure 24 is a side cross-sectional view of the heat sink according to the fourteenth embodiment of the present invention.

[0145] In the heat sink 1 according to the first embodiment, the heat transfer member 31 is entirely embedded in the heat sink 1, and the heat transfer member 31 is thermally connected to the heat generating element 100 via the base 20. Instead, as shown in FIG. 24 , in a heat sink 84 according to a fourteenth embodiment, the heat transfer member 31 is thermally connected to the heat generating element 100 via a block-shaped member 95 that is separate from the base 20. In the heat sink 84, the block-shaped member 95 is connected to a portion of the heat transfer member 31 that faces the heat generating element 100, and the block-shaped member 95 is further thermally connected to the heat generating element 100. As described above, in the heat sink 84, heat from the heat generating element 100 is transferred from the heat generating element 100 to the block-shaped member 95, and the heat transferred from the heat generating element 100 to the block-shaped member 95 is transferred from the block-shaped member 95 to the heat transfer member 31.

[0146] A block-shaped member 95 is connected to a portion of the heat transfer member 31 that faces the heat generating element 100, so that the entire heat transfer member 31 is embedded in the heat sink 84. The block-shaped member 95 is fitted into a recess 96 provided in the second surface 22 of the base portion 20, so that the block-shaped member 95 is thermally connected to the heat transfer member 31. If necessary, the block-shaped member 95 may be joined to the heat transfer member 31. Examples of joining methods include brazing and soldering.

[0147] The portion of the block-shaped member 95 that faces the heating element 100 is located on the same plane as the second surface 22 of the base portion 20. Therefore, an exposed portion 97 of the block-shaped member 95 that faces the heating element 100 and that protrudes from the base portion 20 is a flat portion that is located on the same plane as the second surface 22. The exposed portion 97 of the block-shaped member 95 comes into contact with the heating element 100, thereby thermally connecting the block-shaped member 95 to the heating element 100. Note that the block-shaped member 95 may have a protruding portion that protrudes from the second surface 22 of the base portion 20 in the thickness direction of the base portion 20. In other words, the portion of the block-shaped member 95 that faces the heating element 100 may protrude from the second surface 22 of the base portion 20, and the protruding portion of the block-shaped member 95 may come into contact with the heating element 100, thereby thermally connecting the block-shaped member 95 to the heating element 100.

[0148] The block-shaped member 95 may be a solid member having thermal conductivity. The material of the block-shaped member 95 may be, for example, a metal such as copper or a copper alloy. In the heat sink 84, the heat transfer member 31 may be, as in the above-described embodiments, a heat pipe 30.

[0149] The heat sink 84 also has a first surface 21 having a first region 26 in which a groove portion 25 is provided and a second region 27 in which the groove portion 25 is not provided, a second surface 22 opposite the first surface 21, a base portion 20 to which the heating element 100 is thermally connected on the second surface 22, a heat transfer member 31 housed in the groove portion 25, and a second heat dissipation fin 10-2 erected in the second region 27. Therefore, the thickness of the base portion 20 is reduced at least in the second region 27 in which the heat transfer member 31 is not housed, thereby increasing the fin area of ​​the second heat dissipation fin 10-2. Furthermore, in the heat sink 84, since the heat transfer member 31 is accommodated in the groove 25, even if a shield portion 200 or the like is provided on the second surface 22 to which the heat generating element 100 is thermally connected, it is not necessary to arrange the heat transfer member 31 so as to avoid the shield portion 200 or the like in the surface direction of the base portion 20. This provides excellent freedom in arrangement of the heat transfer member 31, and therefore excellent heat uniformity throughout the base portion 20. As described above, the heat sink 84 also provides excellent heat uniformity throughout the base portion 20. Therefore, even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 84, the heat uniformity of the base portion 20 of the heat sink 84 can be maintained, and heat transfer from the base portion 20 is uniform throughout the heat dissipation fin group 11. As a result, the heat dissipation characteristics of the heat sink 84 are improved even if a large number of heat generating elements 100 with various heat values ​​are thermally connected to the heat sink 84. Furthermore, since the thickness of the cover portion 41 of the heat sink 84 can be reduced, the cover portion 41 protects the heat transfer member 31 from the external environment of the heat sink 84, while also increasing the fin area of ​​the first heat dissipation fin 10-1.

[0150] Next, other embodiments of the heat sink of the present invention will be described. In the heat sinks of the above-described embodiments, the base portion has a rectangular shape in a plan view (as viewed from a position facing the heat dissipation fins). However, the shape of the base portion can be appropriately selected depending on the conditions of use of the heat sink, and may have a curved portion or a notched portion in a plan view. In addition, in the heat sinks of the above-described embodiments, the heat dissipation fins extend in a substantially linear manner from one end to the other end of the base portion in the second direction. However, the shape of the base portion in the second direction is not particularly limited, and the heat dissipation fins may instead have a curved portion. Furthermore, grease may be applied between the container and the base portion of the heat pipe to improve thermal conductivity.

[0151] Next, another example of how to use the heat sink of the present invention will be described. Here, the heat sink 1 according to the first embodiment will be used to describe another example of how to use the heat sink. Note that Fig. 25 is a side cross-sectional view illustrating another example of how to use the heat sink of the present invention.

[0152] 25 , another example of a method for using the heat sink of the present invention may be to house another heat-generating element 110 mounted on a first substrate surface 111 of a substrate 101 that is thermally connected to the heat sink 1 in a shield portion 200 provided on the second surface 22 of the base portion 20, and to cool a heat-generating element 100 mounted on a second substrate surface 112 opposite the first substrate surface 111, by the heat sink 1. Specifically, heat from the heat-generating element 100, which is the cooling target of the heat sink 1, is transferred to a heat pipe 30 having a stepped portion 62 housed in the base portion 20 of the heat sink 1 via an interposing member 120 made of a metal such as copper that is concave in side view. Furthermore, if necessary, a heat-transfer paste 121 containing silver or the like may be applied between the heat-generating element 100 and the interposing member 120. In addition, the heating element 100 mounted on the second substrate surface 112 and other heating elements 110 mounted on the second substrate surface 112 may be housed in a shield portion 211 provided in a shield case 210 attached to the second substrate surface 112.

[0153] The above structure using the interposition member 120 allows the heating element 100 mounted on the second substrate surface 112, which is not thermally connected to the heat sink 1, to be thermally connected to the heat sink 1, and also allows the portion of the second surface 22 of the base portion 20 corresponding to the heating element 100 to be a flat metal surface. Therefore, the shield portion 200, which is a recess, is not required in the portion of the second surface 22 of the base portion 20 corresponding to the heating element 100, and by forming the step portion 62 in the heat pipe 30, the heat pipe 30 can be brought closer to the heating element 100 along the thickness direction of the base portion 20 of the heat sink 1.

[0154] The heat sink of the present invention reduces the thickness of the base portion to increase the fin area of ​​the heat dissipation fins, while allowing for excellent freedom in the placement of the heat transfer member, making it excellent at uniformly heating the entire base portion.Therefore, it is particularly useful in fields such as mobile phone base stations, which use boards on which a large number of electronic components that generate a lot of heat are arranged in a complex manner.

[0155] 1, 2, 3, 4, 5, 6, 7, 8, 9 Heat sink 80, 81, 82, 83, 84 Heat sink 10 Heat dissipation fin 10-1 First heat dissipation fin 10-2 Second heat dissipation fin 20 Base portion 21 First surface 22 Second surface 25 Groove portion 26 First region 27 Second region 31 Heat transfer member 41 Cover portion

Claims

1. A heat sink comprising: a base portion having a first surface having a first region in which a groove portion is provided and a second region different from the first region, and a second surface opposite the first surface, with a heat generating element thermally connected to the second surface; a heat transfer member housed in the groove portion provided in the first region; a cover portion which is a separate member from the base portion and which covers at least a portion of the heat transfer member and is positioned opposite the first region; a first heat dissipation fin standing on the cover portion; and a second heat dissipation fin standing on the second region.

2. The heat sink according to claim 1, wherein the cover portion is disposed opposite only the first region.

3. The heat sink according to claim 1 or 2, wherein the cover portion and the first heat dissipation fins are integrally formed.

4. The heat sink according to claim 1 or 2, wherein the base portion and the second heat dissipation fins are integrally formed.

5. The heat sink according to claim 1 or 2, wherein the cover portion and the first heat dissipation fin are separate bodies.

6. The heat sink according to claim 1 or 2, wherein the base portion and the second heat dissipation fins are separate bodies.

7. A heat sink according to claim 1 or 2, wherein the first region has a protrusion protruding in the thickness direction of the base portion, and the groove is provided in the protrusion.

8. The heat sink according to claim 7, wherein the height dimension of said first heat dissipating fin is smaller than the height dimension of said second heat dissipating fin.

9. The heat sink according to claim 1 or 2, wherein the first heat dissipating fins and the second heat dissipating fins are aligned in height.

10. The heat sink according to claim 1 or 2, wherein the heat transfer member has a heat receiving portion thermally connected to the heat generating element.

11. The heat sink according to claim 1 or 2, wherein the heat transfer member is entirely embedded in the heat sink.

12. The heat sink according to claim 1 or 2, wherein at least a partial region of the heat transfer member has an exposed portion that is exposed from the second surface, and the exposed portion is in direct contact with the heat generating element.

13. The heat sink according to claim 1 or 2, wherein the heat transfer member extends along the extending direction of the base portion.

14. The heat sink according to claim 1 or 2, wherein the heat transfer member has a step portion bent in the thickness direction of the base portion.

15. The heat sink according to claim 12, wherein said heat transfer member has a step portion bent in the thickness direction of said base portion, said step portion forming said exposed portion.

16. The heat sink according to claim 1 or 2, wherein the heat transfer member is a heat pipe.

17. The heat sink according to claim 16, wherein the heat pipe is fixed to the groove by caulking.

18. The heat sink according to claim 16, wherein the heat pipe has a flattened portion.

19. The heat sink of claim 16, wherein the heat pipe container and the base are in direct contact.

20. The heat sink of claim 16, wherein grease is applied between the container and the base of the heat pipe.

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