Light-emitting device

Abstract

The present invention relates to a light-emitting device. The light-emitting device according to an embodiment of the present invention comprises: a substrate; a light-emitting member disposed on the substrate; a wavelength conversion member disposed on the light-emitting member; an optical member disposed on the wavelength conversion member; and a barrier member disposed on the substrate so as to cover side surfaces of the light-emitting member, the wavelength conversion member, and the optical member. The optical member can include an optical base and an optical pattern including protrusions and recessions formed on at least one surface of the optical base.

Description

Light-emitting device

[0001] The present invention relates to a light-emitting device.

[0002] Light-emitting diodes (LEDs) are semiconductor devices that emit light through the recombination of electrons and holes. They are currently used in a variety of fields, including displays, automotive lamps, and general lighting. Because of their long lifespan, low power consumption, and fast response times, LEDs are widely used in automotive lamps, display devices, and other applications. For example, LEDs are also used in head-mounted displays (HMDs), and their excellent light directivity has led to their widespread application in automotive headlamps.

[0003] For devices requiring precise control of light irradiance, such as headlamps and head-mounted displays (HMDs), the light irradiance area needs to be segmented. Furthermore, for precise control of light irradiance, light-emitting devices, such as individual light-emitting diodes or chips or packages containing individual light-emitting diodes, need to have a narrow beam angle.

[0004] The problem to be solved by the present invention is to provide a light-emitting device having a narrower beam angle than a light-emitting diode.

[0005] In addition, the problem to be solved by the present invention is to provide a light-emitting device having not only a narrow beam angle but also high brightness or high illuminance.

[0006] In addition, the problem to be solved by the present invention is to provide a light-emitting device having uniform brightness.

[0007] The problem to be solved by the present invention is to provide a light-emitting device having uniform brightness within the beam angle by reducing the brightness deviation between the center and the periphery of the beam angle.

[0008] The problem to be solved by the present invention is to provide a light-emitting device with improved chromatic aberration.

[0009] The problem to be solved by the present invention is to provide a light-emitting device with improved reliability by improving adhesive strength.

[0010] According to an embodiment of the present invention, a light emitting device is provided, which includes a substrate, a light emitting member disposed on the substrate, a wavelength conversion member disposed on the light emitting member, an optical member disposed on the wavelength conversion member, and a barrier member disposed on the substrate and covering side surfaces of the light emitting member, the wavelength conversion member, and the optical member. The optical member may include an optical base and an optical pattern formed by protrusions and depressions formed on at least one surface of the optical base.

[0011] The above optical pattern can be formed on the upper surface of the optical base.

[0012] The above optical pattern can be formed on the lower surface of the optical base.

[0013] The above optical pattern can be formed on the upper and lower surfaces of the optical base.

[0014] The optical pattern may include a first optical pattern and a second optical pattern. The first optical pattern may be formed on an upper surface of the optical base, and the second optical pattern may be formed on an upper surface of the first optical pattern. The first optical pattern and the second optical pattern may include at least one different material from each other.

[0015] The first optical pattern and the second optical pattern may have different slopes on their sides with respect to the cross-section.

[0016] The optical base and the first optical pattern may be formed of the same material and may be integral.

[0017] The above optical pattern may be formed of a plane having different slopes on each side relative to the cross-section.

[0018] An adhesive member may be formed between at least one of the light-emitting member and the wavelength conversion material and between the wavelength conversion material and the optical member.

[0019] The upper surface of the above barrier member may be positioned on the same line as the upper surface of the optical base.

[0020] The upper surface of the above barrier member may be positioned higher than the optical pattern.

[0021] The upper surface of the above barrier member may have a height that increases from the outside to the inside of the barrier member.

[0022] The above barrier member can cover the outer surface of the optical pattern adjacent to the upper surface edge of the optical base.

[0023] The above barrier member may include a light reflective material.

[0024] The light-emitting member may include a growth substrate formed to face the wavelength conversion member. The refractive index may decrease in the order of the growth substrate of the light-emitting member, the wavelength conversion member, and the optical member.

[0025] The light-emitting device may have a light-emitting angle smaller than that of the light-emitting member.

[0026] The beam angle of the above light emitting device may be 60 to 100 degrees.

[0027] According to another embodiment of the present invention, a light emitting device is provided, including a substrate, a light emitting member disposed on the substrate, a wavelength conversion member disposed on the light emitting member, an optical member disposed on the wavelength conversion member, and a barrier member. The barrier member may be disposed on the substrate to cover side surfaces of the light emitting member, the wavelength conversion member, and the optical member. The optical member may include a first optical member and a second optical member disposed on the first optical member. The second optical member may include a second optical base disposed on the first optical member, and an optical pattern formed on an upper surface of the second optical base.

[0028] The first optical member and the second optical member may include at least one different material.

[0029] According to another embodiment of the present invention, a vehicle lamp is provided, comprising a main body, a lamp mounted on at least one surface of the main body, a plurality of light-emitting members arranged in the lamp, a wavelength conversion member formed to cover an upper surface of at least one of the light-emitting members, and an optical member including an optical pattern formed of protrusions and depressions formed on at least one surface. Each of the plurality of light-emitting members can be independently driven.

[0030] A light emitting device according to an embodiment of the present invention can narrow the light direction angle to enable precise light irradiation.

[0031] In addition, the light emitting device according to an embodiment of the present invention can improve brightness by narrowing the beam angle.

[0032] FIG. 1 is a cross-sectional view schematically illustrating a light-emitting device according to a first embodiment of the present invention.

[0033] Figure 2 is an experimental result for confirming changes in the orientation angle and brightness of a light-emitting device according to the structure of the optical pattern of the optical member of the present invention.

[0034] Figure 3 is an optical spectrum of a light emitting device according to the optical pattern structure of the optical member of the present invention.

[0035] Figure 4 is a graph of the orientation angle characteristics showing the light emission pattern according to the optical pattern structure of the optical member of the present invention.

[0036] Figures 5 to 7 are exemplary diagrams showing a method for manufacturing a light-emitting device according to the first embodiment of the present invention.

[0037] FIGS. 8 to 10 are exemplary diagrams showing another manufacturing method of a light-emitting device according to the first embodiment of the present invention.

[0038] Fig. 11 is a cross-sectional view illustrating a light-emitting device according to a second embodiment of the present invention.

[0039] Fig. 12 is a schematic cross-sectional view illustrating a light-emitting device according to a third embodiment of the present invention.

[0040] Fig. 13 is a schematic cross-sectional view illustrating a light-emitting device according to a fourth embodiment of the present invention.

[0041] Fig. 14 is a schematic cross-sectional view illustrating a light-emitting device according to a fifth embodiment of the present invention.

[0042] Fig. 15 is a schematic cross-sectional view illustrating a light-emitting device according to a sixth embodiment of the present invention.

[0043] Fig. 16 is a schematic cross-sectional view illustrating a light-emitting device according to a seventh embodiment of the present invention.

[0044] Fig. 17 is a schematic cross-sectional view illustrating a light-emitting device according to the eighth embodiment of the present invention.

[0045] Fig. 18 is a schematic cross-sectional view illustrating a light-emitting device according to a ninth embodiment of the present invention.

[0046] Fig. 19 is an exemplary diagram of a vehicle to which a light-emitting device according to an embodiment of the present invention is applied.

[0047] In the following description, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, the terms "embodiment" and "implementation" are interchangeable to refer to non-limiting examples of devices or methods that utilize one or more of the inventive concepts disclosed herein. However, it will be apparent that various embodiments may be practiced without utilizing these specific details or using one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, while the various embodiments may vary from one another, they are not necessarily exclusive. For example, specific features, configurations, and characteristics of an embodiment may be utilized or implemented in other embodiments without departing from the scope of the inventive concepts.

[0048] Unless otherwise specified, the illustrated embodiments should be understood to provide exemplary features of varying details of some ways in which the concepts of the present invention may be practically implemented. Therefore, unless otherwise specified, the features, components, modules, layers, membranes, panels, regions, and / or aspects (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be differently combined, separated, interchanged, and / or rearranged without departing from the scope of the concepts of the present invention.

[0049] The use of cross-hatching and / or shading in the accompanying drawings is generally provided to clarify boundaries between adjacent elements. As such, the presence or absence of cross-hatching or shading, unless expressly stated, does not imply or indicate any preference or requirement for any particular material, material properties, dimensions, proportions, commonality between the illustrated elements, and / or any other features, properties, or characteristics of the elements. Furthermore, in the accompanying drawings, the dimensions and relative sizes of elements may be exaggerated for clarity and / or illustrative purposes. When embodiments are implemented differently, certain process sequences may be performed differently from the illustrated sequence. For example, two consecutively illustrated processes may be performed substantially simultaneously or in a reverse order from the illustrated sequence. Furthermore, like reference numerals designate like elements.

[0050] When an element, such as a layer, is referred to as being "on," "connected to," or "joined to" another element or layer, the element may be directly on, connected to, or joined to the other element or layer, or there may be intervening elements or layers present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly joined to" another element or layer, there are no intervening elements or layers present. For this purpose, the term "connected" may refer to physical, electrical, and / or fluidic connections, with or without intervening elements. Furthermore, the DR1-axis, DR2-axis, and DR3-axis are not limited to the three axes of a Cartesian coordinate system, such as the x, y, and z-axes, and may be interpreted in a broader sense. For example, the DR1-axis, DR2-axis, and DR3-axis may be perpendicular to one another, or may represent different directions that are not perpendicular to one another. For purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0051] Although the terms "first," "second," and the like may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be referred to as the second element without departing from the teachings of the present disclosure.

[0052] Spatially relative terms such as "beneath," "beneath," "directly beneath," "lower," "above," "upper," "above," "higher than," "side" (as in, for example, a "side wall"), and the like may be used for descriptive purposes and thereby to describe the relationship of one element to other element(s) as depicted in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the drawings. For example, if the device in the drawings were turned over, an element described as "beneath" or "beneath" another element or feature would then be oriented "above" the other element or feature. Therefore, the exemplary term "beneath" can encompass both orientations above and below. Furthermore, the device can be oriented differently (e.g., rotated 90° or oriented in other orientations), and thus the spatially relative descriptors used herein can also be interpreted accordingly.

[0053] The terminology used herein is for the purpose of describing particular embodiments and is not limiting. The singular forms "a," "an," and "the" as used herein also include the plural forms unless the context clearly dictates otherwise. Furthermore, the terms "comprises," "comprising," "includes," and / or "comprising" as used herein specify the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, the terms "substantially," "about," and other similar terms as used herein are used as terms of approximation rather than degrees, and as such, are used to describe inherent deviations from measured, calculated, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0054] Various embodiments are described below with reference to cross-sectional and / or exploded illustrations, which are schematic illustrations of idealized embodiments and / or intermediate structures. As such, variations from the shapes of the illustrated drawings may be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein should not necessarily be construed as limited to the shapes of specific illustrated regions, but should be construed to include, for example, deviations in shape resulting from manufacturing. In this way, the regions depicted in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of the device, and as such, are not necessarily intended to have a limiting meaning.

[0055] As is conventional in the art, some embodiments may be illustrated and described in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, wiring circuits, memory elements, and wiring connections formed using semiconductor-based or other manufacturing techniques. When the blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and optionally may be driven by firmware and / or software. Furthermore, each block, unit, and / or module may be implemented by dedicated hardware, or by a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed processors and associated circuitry) for performing other functions. Additionally, the blocks, units, and / or modules of some embodiments may be physically separated into two or more interacting and individual blocks, units, and / or modules without departing from the scope of the present invention. Additionally, the blocks, units, and / or modules of some embodiments may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the present invention.

[0056] Unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries, such as terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealistic or overly formal sense unless explicitly defined herein.

[0057] Hereinafter, the light emitting device of the present invention will be described in detail through drawings.

[0058] FIG. 1 is a cross-sectional view schematically illustrating a light-emitting device according to a first embodiment of the present invention.

[0059] Referring to FIG. 1, a light-emitting device (100) according to the first embodiment may include a substrate (110), a light-emitting member (120), a wavelength conversion member (130), an optical member (140), and a barrier member (150).

[0060] The substrate (110) may include a substrate base (111) and a conductive pattern (112).

[0061] The substrate base (111) may be formed of at least one material selected from the group consisting of phenol, epoxy, polyimide, and ceramic. That is, the substrate base (111) may be formed of an insulating material. In addition, the substrate base (111) may include a metal layer and an insulating layer formed on the surface of the metal layer. For example, the insulating layer may be an insulating resin or an oxide. That is, the substrate base (111) may be formed in a structure that is insulated from the conductive pattern (112). In addition, the substrate base (111) is not limited to the materials and structures described above, and may be formed to have various materials or structures that are insulated from the conductive pattern (112).

[0062] The conductive pattern (112) may be formed on the upper and lower portions of the substrate base (111). In addition, the conductive pattern (112) may be further formed on the inside or side of the substrate base (111) to electrically connect the conductive pattern (112) formed on the upper portion of the substrate base (111) with the conductive pattern (112) formed on the lower portion of the substrate base (111). The conductive pattern (112) may be formed of any material having conductivity. For example, the conductive pattern (112) may be formed of copper.

[0063] The conductive pattern (112) of the substrate (110) is electrically connected to the light-emitting member (120), and the substrate (110) can supply power to the light-emitting member (120) through the conductive pattern (112).

[0064] The light-emitting member (120) can generate and emit light by receiving power applied from the substrate (110). According to the present embodiment, the light-emitting member (120) can include a light-emitting structure (121) and a growth substrate (122).

[0065] The light-emitting structure (121) receives power and generates light. For example, the light-emitting structure (121) may include a first semiconductor layer, a second semiconductor layer, and an active layer.

[0066] The first semiconductor layer can be formed of a compound semiconductor of group IIIⅤ, group IIⅥ, etc. For example, the first semiconductor layer can be an n-type semiconductor layer doped with an n-type dopant.

[0067] The second semiconductor layer can be formed of a compound semiconductor of group IIIⅤ, group IIⅥ, etc. For example, the second semiconductor layer can be a p-type semiconductor layer doped with a p-type dopant.

[0068] Here, the first semiconductor layer is an n-type semiconductor layer and the second semiconductor layer is a p-type semiconductor layer as an example, but conversely, the first semiconductor layer may be a p-type semiconductor layer and the second semiconductor layer may be an n-type semiconductor layer.

[0069] The active layer can be formed between the first semiconductor layer and the second semiconductor layer.

[0070] The active layer is a layer where electrons injected through the first semiconductor layer and holes injected through the second semiconductor layer recombine, and light can be generated through the recombination of electrons and holes. Alternatively, the active layer can generate light through the recombination of holes injected through the first semiconductor layer and electrons injected through the second semiconductor layer.

[0071] The active layer can be formed in any one of a single well structure, a multi-well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, or a quantum wire structure.

[0072] Light generated in the active layer can be emitted to the outside of the light-emitting structure (121) through the side and upper surfaces of the light-emitting structure (121). In addition, light generated in the active layer can be emitted to the outside of the light-emitting structure (121) through the lower surface of the light-emitting structure (121).

[0073] The type of light generated may vary depending on the type of composition forming the first semiconductor layer, the second semiconductor layer, and the active layer. For example, the light-emitting structure (121) may generate and emit blue light or ultraviolet light. The type of light emitted from the light-emitting structure (121) is not limited to blue light and ultraviolet light, and may emit light of various wavelengths.

[0074] The growth substrate (122) may be a substrate for growing a semiconductor layer. For example, the growth substrate (122) may be formed of a material selected from among sapphire (Al2O3), SiC, GaAs, GaN, ZnO, Si, GaP, InP, and Ge.

[0075] The light-emitting member (120) can be electrically connected to the conductive pattern (112) of the substrate (110) through the semiconductor layers via electrodes.

[0076] According to an embodiment of the present invention, the light-emitting member (120) may be a light-emitting diode chip. In addition, the light-emitting member (120) may have a structure in which an electrode electrically connected to the first semiconductor layer and an electrode electrically connected to the second semiconductor layer are positioned in the same direction. For example, the light-emitting member (120) may be a light-emitting diode chip having a flip-chip structure.

[0077] A wavelength conversion member (130) may be formed on the upper portion of the light-emitting member (120).

[0078] The wavelength conversion member (130) may include a light-transmitting portion and a wavelength conversion material dispersed within the light-transmitting portion. The light-transmitting portion may be formed of a material through which light of the light-emitting member (120) is transmitted. For example, the light-transmitting portion may be formed of a polymer resin such as a silicone resin and a ceramic such as glass or alumina. In addition, the light-transmitting portion may have a transmittance of 70% or more. Therefore, the wavelength conversion member (130) or the light-transmitting portion of the wavelength conversion member (130) may absorb less light emitted from the light-emitting member (120), thereby improving the light-emitting efficiency of the light-emitting device (100). In addition, the refractive index of the light-transmitting portion may be 1.3 to 2. At this time, by adjusting the refractive index of the light-transmitting portion, the optical path can be adjusted, and accordingly, the beam angle can be adjusted and the brightness or illuminance can be increased. The wavelength conversion material may be any material that excites light emitted from the light-emitting member (120) and emits excited light, such as a phosphor or a quantum dot.

[0079] For example, the wavelength conversion member (130) may be PIS (phosphor in silicone) in which a phosphor is dispersed in a silicone resin, PIG (phosphor in glass) in which a phosphor is dispersed in glass, or PIC (phosphor in ceramic) in which a phosphor is dispersed in a ceramic. In addition, the wavelength conversion member (130) may be in the form of a film with an average thickness tolerance of about 10%. As the thickness of the wavelength conversion member (230) increases, the travel length of the light may also increase. That is, as the thickness deviation of the wavelength conversion member (230) increases, the travel length deviation of the light passing through the wavelength conversion member (230) also increases. As the travel length of the light within the wavelength conversion member (230) increases, the wavelength conversion rate may also increase, and as the travel length decreases, the wavelength conversion rate may also decrease. Therefore, as the thickness deviation of the wavelength conversion member (230) decreases, the difference between the light travel path and the wavelength conversion rate decreases, thereby reducing chromatic aberration and increasing color purity.

[0080] The optical member (140) can be formed on top of the wavelength conversion member (130).

[0081] The optical member (140) may be formed of a material that transmits light. For example, the optical member (140) may be formed of a material that transmits light, such as sapphire, glass, silicone resin, alumina, or urethane. The optical member (140) may have a transmittance of 70% or more. Therefore, the optical member (140) may absorb less light generated from the light-emitting member (120), thereby improving the light-emitting efficiency of the light-emitting device (100). In addition, the refractive index of the optical member (140) may be 1.4 to 2. The optical member (140) having a refractive index can change the path of light, thereby narrowing the beam angle and improving brightness or illuminance.

[0082] According to an embodiment of the present invention, the optical member (140) may have an optical pattern (145) formed on at least one of the upper and lower surfaces. That is, the optical member (140) has the optical pattern (145) formed on the upper surface, which is the light-emitting surface. Referring to FIG. 1, the optical member (140) of the present embodiment may include an optical base (141) and an optical pattern (145) formed on the upper surface of the optical base (141).

[0083] For example, the optical pattern (145) may be formed of a plurality of structures having one vertex at the top, such as pyramids such as triangular pyramids, square pyramids, and pentagonal pyramids, and cones. When the optical pattern (145) has a vertex, the narrower the internal angle at the vertex, the narrower the light-direction angle of the light-emitting device (100). In addition, the narrower the light-direction angle of the light-emitting device (100), the higher the brightness of the light-emitting device (100).

[0084] Additionally, the optical pattern (145) may be formed of a plurality of structures having a planar upper surface, such as a truncated cone, a truncated pyramid, a cylinder, or a prism.

[0085] The optical pattern (145) can adjust the angle of orientation of the light emitting device (100) by adjusting the structure of the inner angles of the vertices of the structure and the upper and side surfaces which are light emission surfaces.

[0086] The plurality of structures forming the optical pattern (145) may be formed continuously and connected to each other, or may be formed to be spaced apart from each other by a certain distance. In addition, the optical pattern (145) can improve the uniformity of the brightness or illuminance of the light-emitting device (100) by adjusting the interval between the plurality of structures.

[0087] The optical pattern (145) of the optical member (140) can be formed by performing a dry etching or wet etching process on the optical member (140). In addition, the optical member (140) or the optical pattern (145) on which the optical pattern (145) is formed can be formed by at least one of an injection process, a stamping process, a molding process, an imprint process, and a photo process.

[0088] According to an embodiment of the present invention, the upper surface of the optical base (141), which is the upper surface of the optical member (140), and the optical pattern (145) formed on the upper surface of the optical base (141) are the emission surfaces of the light emitting device (100).

[0089] According to the present embodiment, the optical pattern (145) of the optical member (140) can narrow the light directivity angle. That is, when the optical pattern (145) is formed on the optical member (140), the light directivity angle of the light emitting device (100) can be reduced compared to when the optical pattern (145) is not formed on the optical member (140). In addition, the optical pattern (145) can reduce total reflection of light passing through the exit surface of the light emitting device (100), thereby increasing the amount of light and improving light efficiency.

[0090] Additionally, according to the present embodiment, the light emitting device (100) may have at least one of the light emitting member (120), the wavelength conversion member (130), and the optical member (140) having different refractive indices. For example, the light emitting member (120), the wavelength conversion member (130), and the optical member (140) may have different refractive indices from adjacent components.

[0091] Furthermore, the refractive index may decrease in the order of the light-emitting member (120), the wavelength conversion member (130), and the optical member (140). That is, as light passes through the growth substrate (122) of the light-emitting member (120), the wavelength conversion member (130), and the optical member (140), it passes through a region where the refractive index gradually decreases. At this time, since the refractive index decreases in the order of the light-emitting member (120), the wavelength conversion member (130), and the optical member (140), the light loss due to Fresnel reflection at their interfaces also decreases. That is, the light-emitting device (100) according to the present embodiment is formed so that the refractive index decreases in the direction in which light travels, thereby reducing the light loss due to Fresnel reflection, thereby improving the light extraction efficiency.

[0092] Alternatively, the materials forming the light-emitting member (120), the wavelength conversion member (130), and the optical member (140) may be selected so that high-refractive-index components and low-refractive-index components are alternately arranged. For example, the light-emitting member (120) may have a refractive index of 1.7 or more, the wavelength conversion member (130) adjacent to the light-emitting member (120) may have a refractive index of 1.4 to 1.6, and the optical member (140) adjacent to the wavelength conversion member (130) may have a refractive index of 1.5 to 1.8. When the components having a high refractive index and the components having a low refractive index are alternately arranged, light incident at a specific range of angles may be transmitted or totally reflected by each component. Therefore, the wavelength conversion member (130) may control the direction of light propagation through the Bragg reflection effect, thereby controlling the beam angle of the light-emitting device (100) and increasing light extraction efficiency.

[0093] FIGS. 2 to 4 show experimental results regarding the orientation angle and brightness of a light-emitting device according to an embodiment of the present invention. More specifically, FIGS. 2 to 4 show experimental results according to structural changes in the optical member (140) and optical pattern (145) of the light-emitting device (100) of FIG. 1.

[0094] Fig. 2 is an experimental result for confirming the change in the directivity angle and brightness of a light-emitting device according to the structure of the optical pattern (145) of the optical member (140) of the present invention. Fig. 3 is an optical spectrum of a light-emitting device according to the structure of the optical pattern (145) of the optical member (140) of the present invention. In addition, Fig. 4 is a graph of directivity angle characteristics showing a light-emitting pattern according to the structure of the optical pattern (145) of the optical member (140) of the present invention.

[0095] The control group is a light-emitting device in which no optical member is formed, and experimental groups 1 to 3 are light-emitting devices in which an optical member (140) having an optical pattern (145) is formed.

[0096] Referring to Fig. 2, experimental groups 1 to 3, which include an optical member (140) having an optical pattern (145) formed thereon, all have a smaller light directivity angle than the control group. In addition, experimental groups 1 and 2 have increased brightness compared to the control group. That is, the optical member (140) having an optical pattern (145) formed thereon can reduce the directivity angle of a light-emitting device and increase brightness.

[0097] Comparing experimental groups 1 and 2, as the height of the optical pattern (145) increases, the light beam angle narrows and the brightness increases. In addition, comparing experimental groups 2 and 3, as the diameter of the optical pattern (145) decreases, the light beam angle decreases and the brightness increases. That is, through experimental groups 1 to 3, as the internal angle formed by the two sides connected to the vertex based on the cross-section of the optical pattern (145) decreases, the light beam angle of the light emitting device can decrease and the brightness can increase.

[0098] Additionally, experimental group 1 had the narrowest beam angle compared to the other experimental groups. Experimental group 1 had a beam angle of approximately 80 degrees and its brightness was approximately 20% higher than that of the control group. Experimental group 1, with a beam angle of approximately 80 degrees, could increase brightness by approximately 20% compared to the control group.

[0099] If the height of the optical pattern (145) is too low, the effect of narrowing the beam angle of the light emitting device (100) is reduced. In addition, if the height of the optical pattern (145) is too high, the optical path increases, so that the light trapped within the optical member (140) increases, and accordingly, the optical loss increases, which may reduce the brightness of the light emitting device (100). Therefore, the optical pattern (145) of the present embodiment may be 0.5% to 10% of the height of the optical base (141).

[0100] When the optical pattern (145) has one vertex, the relationship between the orientation angle y and the interior angle x at the vertex is as shown in Equation 1 below.

[0101] [Formula 1]

[0102] 50.3073ln(x)-121.5 ≤ y ≤ 61.4867ln(x)-148.5

[0103] Here, x can be between 30 and 80 degrees.

[0104] According to an embodiment of the present invention, as the height of the optical pattern (145) increases, the directivity angle narrows, and as the diameter of the optical pattern (145) decreases, the directivity angle narrows.

[0105] The relationship between the orientation angle y and the height a of the optical pattern (145) is as shown in Equation 2 below.

[0106] [Formula 2]

[0107] 1.44a 2 -19.08a+108.9 ≤ y ≤ 1.76a 2 -23.32a+133.1

[0108] In addition, the relationship between the orientation angle y and the diameter b of the optical pattern (145) is as shown in Equation 3 below.

[0109] [Formula 3]

[0110] -0.036b 2 -2.34b+76.5 ≤ y ≤ -0.044b 2 -2.86b+93.5

[0111] Here, y can be between 40 and 120 degrees.

[0112] If the thickness of the optical member (140) according to the embodiment of the present invention of FIG. 1 is too thin, the effect of narrowing the beam angle of the light emitting device is reduced. In addition, if the thickness of the optical member (140) is too thick, the amount of light trapped and lost within the optical member (140) increases due to the increase in the optical path, which may reduce the brightness of the light emitting device (100). For example, the thickness of the optical member (140) may be 0.5 times the thickness of the light emitting member (120) to 1.5 times the thickness of the light emitting member (120).

[0113] The barrier member (150) can be formed on the substrate (110) to cover the side surfaces of the light-emitting member (120), the wavelength conversion member (130), and the optical member (140).

[0114] At this time, the inner wall of the barrier member (150) can be in close contact with the side surface of the optical member (140). In FIG. 1, the side surface of the optical member (140) is flat, but the side surface of the optical member (140) may have a curved structure or a structure with a rough structure. At this time, the inner wall of the barrier member (150) may have a structure corresponding to the side surface structure of the optical member (140) with which it is in close contact.

[0115] The barrier member (150) may be formed of an insulating material. For example, the barrier member (150) may be formed of an insulating resin or ceramic, such as a silicone resin, a polyimide resin, a urethane resin, a polymer resin, etc. In the present embodiment, the barrier member (150) may include a material having a light reflecting function. For example, the light reflecting material may be TiO2, Ba2Ti9O 20 , BaSO4, SiO2, CaCO3, ZnO, CaCO3, etc. can be various light reflecting materials.

[0116] The barrier member (150) can reflect light emitted from the side surfaces of the light-emitting member (120), the wavelength conversion member (130), and the optical member (140) so that the light is emitted to the outside of the light-emitting device (100) through the upper surface of the optical member (140) and the optical pattern (145). For example, the barrier member (150) can have a reflectivity of 70% or more. Additionally, the barrier member (150) can have a transmittance of less than 30%.

[0117] Comparison of light intensity between control and experimental groups Control group Experimental group 1 Experimental group 2 Experimental group 3 Total area 128115113117 -30 degrees to 30 degrees area 70797169 Total area compared to -30 degrees to 30 degrees area 55%69%62%59% Total area compared to control group 100%89%88%91% -30 degrees to 30 degrees area compared to control group -112%100%98%

[0118] Referring to Table 1 and Fig. 3, the area at the -30 to 30 degree orientation angle relative to the total area is larger in experimental groups 1 and 2 than in the control group. In addition, the area at the -30 to 30 degree orientation angle is also larger in experimental groups 1 and 2 than in the control group. That is, the light quantity at the -30 to 30 degree orientation angle is larger in experimental groups 1 and 2 than in the control group. Fig. 4 is a graph of orientation angle characteristics showing a light emission pattern according to the optical pattern (145) structure of the optical member (140) of the present invention. Here, the x-axis is the orientation angle of experimental groups 1 to 3, and the y-axis is the relative light quantity compared to the control group.

[0119] Referring to Fig. 4, the relative light intensity at an aiming angle of -30 degrees to 30 degrees is 85% to 140% for both experimental groups 1 and 3. In particular, in the case of experimental group 1, the relative light intensity at 0 degrees is 120% or more.

[0120] In this way, through Table 1, FIG. 3 and FIG. 4, it is confirmed that the optical member (140) on which the optical pattern (145) is formed can narrow the beam angle and increase the amount of light within the beam angle range, thereby improving brightness.

[0121] In this way, the light emitting device (100) of the present embodiment can narrow the beam angle by using not only the barrier member (150) but also the optical pattern (145). That is, the light emitting device (100) can have a beam angle narrower than the light emitting device (120) due to the barrier member (150) and the optical pattern (145). For example, when the light emitting diode chip, which is the light emitting device (120), has a beam angle of about 120 degrees, the light emitting device (100) of the present embodiment can have a beam angle of about 60 to 100 degrees. Furthermore, the light emitting device (100) can have a beam angle of about 70 to 80 degrees.

[0122] In addition, the light emitting device (100) of the present embodiment can improve brightness by concentrating light within a predetermined range as the light direction angle decreases.

[0123] While describing various embodiments, descriptions of components that overlap with previous embodiments will be omitted or briefly described. For example, descriptions of materials, structures, effects, etc. of components with the same name will be omitted or briefly described. Therefore, for detailed descriptions of components that are omitted or briefly described, refer to the descriptions of previous embodiments.

[0124] Figures 5 to 7 are exemplary diagrams showing a method for manufacturing a light-emitting device according to the first embodiment of the present invention.

[0125] Referring to FIG. 5, a light-emitting member (120), a wavelength conversion member (130), and a first barrier member (151) are formed on a substrate (110).

[0126] First, a light-emitting member (120) and a wavelength conversion member (130) can be formed to be sequentially laminated on a substrate (110). Thereafter, a first barrier member (151) is formed to cover the light-emitting member (120) and the wavelength conversion member (130). At this time, the first barrier member (151) covers the side surfaces of the light-emitting member (120) and the wavelength conversion member (130), but does not cover the upper portion of the wavelength conversion member (130). That is, the upper surface of the first barrier member (151) and the upper surface of the wavelength conversion member (130) are positioned at the same height.

[0127] Referring to FIG. 6, an optical member (140) can be formed on the upper surface of a wavelength conversion member (130).

[0128] The optical member (140) may be formed separately, including an optical pattern (145). That is, the optical member (140) formed separately may be mounted on the upper surface of the wavelength conversion member (130). Alternatively, an optical material may be formed on the upper surface of the wavelength conversion member (130), and then the optical material may be patterned to form an optical member (140) including an optical pattern (145).

[0129] Referring to Fig. 7, a second barrier member (152) can be formed on a first barrier member (151). The second barrier member (152) can be formed to cover the side surface of the optical member (140) and have the upper surface exposed to the outside.

[0130] In this embodiment, the first barrier member (151) and the second barrier member (152) correspond to the barrier member (150) described in FIG. 1.

[0131] The first barrier member (151) and the second barrier member (152) may include the same material. When the first barrier member (151) and the second barrier member (152) are formed of the same material or include the same material, the high adhesive strength between the same materials prevents external substances such as moisture and dust from penetrating into the interior of the light-emitting device (100), thereby improving the reliability of the light-emitting device (100).

[0132] In Fig. 7, the outer surfaces of the first barrier member (151) and the second barrier member (152) are positioned on the same vertical line. However, the present embodiment is not limited thereto. The first barrier member (151) and the second barrier member (152) are formed so that at least a portion of the outer surfaces are positioned on different vertical lines, thereby controlling the path of light emitted from the outer surfaces. Accordingly, the first barrier member (151) and the second barrier member (152) can control the path of light that is not reflected but transmitted and emitted to the side, thereby controlling the directivity angle of the light emitting device (100).

[0133] FIGS. 8 to 10 are exemplary diagrams showing another manufacturing method of a light-emitting device according to the first embodiment of the present invention.

[0134] Referring to FIG. 8, a light-emitting member (120) and a wavelength conversion member (130) can be formed to be sequentially laminated on a substrate (110).

[0135] Referring to FIG. 9, an optical member (140) having an optical pattern (145) formed on a wavelength conversion member (130) can be formed. The optical member (140) may be formed separately, including the optical pattern (145). That is, the optical member (140) formed separately can be mounted on the upper surface of the wavelength conversion member (130). Alternatively, an optical material may be formed on the upper surface of the wavelength conversion member (130), and then the optical material may be patterned to form an optical member (140) including an optical pattern (145).

[0136] Referring to Fig. 10, a barrier member (150) can be formed on a substrate (110). At this time, the barrier member (150) covers the side surfaces of the light-emitting member (120), the wavelength conversion member (130), and the optical member (140), and the upper surface of the optical member (140) can be formed to be exposed to the outside.

[0137] In the manufacturing method of the light-emitting device (100) of FIGS. 5 to 10, when forming each component, an adhesive member made of a light-transmitting adhesive material may be formed between the components as needed. For example, the light-transmitting adhesive material may be used for bonding the light-emitting member (120) and the wavelength conversion member (130) or for bonding the wavelength conversion member (130) and the optical member (140). The light-transmitting adhesive material may be a thermosetting resin such as silicone, epoxy, or urethane, or an ultraviolet-curable resin. In addition, the light-transmitting adhesive material may have a transmittance of 50% or more. Therefore, the light-transmitting adhesive material can minimize a decrease in the luminous efficiency of the light-emitting device (100) and increase the adhesive strength between the components forming the light-emitting device (100), thereby improving the reliability of the light-emitting device (100).

[0138] Alternatively, the adhesive member may be omitted from the light-emitting device (100). When the adhesive member is not formed, the light path is shorter than when the adhesive member is formed, so that light absorption occurring inside the light-emitting device (100) is reduced, thereby improving the light extraction efficiency of the light-emitting device (100).

[0139] Fig. 11 is a cross-sectional view illustrating a light-emitting device according to a second embodiment of the present invention.

[0140] Referring to FIG. 11, a light-emitting device (200) according to the second embodiment may include a substrate (110), a light-emitting member (120), a wavelength conversion member (130), an optical member (140), and a barrier member (150).

[0141] In addition, the light emitting device (200) according to the second embodiment may have an adhesive member (260) interposed between the light emitting member (120) and the wavelength conversion member (130), and an adhesive member (260) interposed between the wavelength conversion member (130) and the barrier member (150).

[0142] Depending on the material of the wavelength conversion member (130), the wavelength conversion member (130) may have weak adhesive strength with the light-emitting member (120) or the optical member (140). For example, if the wavelength conversion member (130) is PIS, the adhesive strength may be improved through a curing process. However, if the wavelength conversion member (130) is PIG or PIC, the adhesive strength with the light-emitting member (120) and the optical member (140) may be low, and thus additional adhesive strength may be required as needed.

[0143] The adhesive member (260) can improve the adhesive strength between the wavelength conversion member (130) and the light-emitting member (120) and the adhesive strength between the wavelength conversion member (130) and the optical member (140). For example, the adhesive member (260) can be a thermosetting resin such as silicone, epoxy, or urethane, or an ultraviolet-curable resin.

[0144] In the embodiment of the present invention, the adhesive member (260) is formed between the light-emitting member (120) and the wavelength conversion member (130) and between the wavelength conversion member (130) and the optical member (140), respectively, but the present invention is not limited thereto. The adhesive member (260) may be formed only between the light-emitting member (120) and the wavelength conversion member (130) and between the wavelength conversion member (130) and the optical member (140), as needed.

[0145] According to the present embodiment, the adhesive member (260) can improve the reliability of the light-emitting device (200) by improving the adhesive strength between the light-emitting member (120) and the wavelength conversion member (130) and the adhesive strength between the wavelength conversion member (130) and the optical member (140).

[0146] Fig. 12 is a schematic cross-sectional view illustrating a light-emitting device according to a third embodiment of the present invention.

[0147] Referring to FIG. 12, a light-emitting device (300) according to the third embodiment may include a substrate (110), a light-emitting member (320), a wavelength conversion member (330), an optical member (140), and a barrier member (150).

[0148] The light-emitting device (300) according to the present embodiment has a structure of a light-emitting member (320) that is different from the structure of a light-emitting member (120) of the light-emitting device (100 in FIG. 1) according to the first embodiment.

[0149] In the light-emitting device (300) of the present embodiment, a light-emitting member (320) has a substrate pattern (323) formed on the upper surface of a growth substrate (322). Here, the upper surface of the growth substrate (322) is a surface facing the wavelength conversion member (330), and may be an emission surface or a part of an emission surface of the light-emitting member (320).

[0150] The substrate pattern (323) formed on the growth substrate (322) has a structure in which a plurality of protrusions are arranged. The exit surface of the light-emitting member (320) has various angles due to the substrate pattern (323). That is, the total reflection of light passing through the growth substrate (322) can be reduced by the interfaces at various angles. Therefore, the total reflection of light at the exit surface of the light-emitting member (320) can be reduced by the substrate pattern (323) of the growth substrate (322), and the amount of light incident on the wavelength conversion member (330) can be increased.

[0151] According to the present embodiment, a pattern may also be formed on the lower surface of the wavelength conversion member (330) that is in contact with the upper surface of the growth substrate (322). As illustrated in FIG. 12, a pattern may be formed on the lower surface of the wavelength conversion member (330) that is interlocked with the substrate pattern (323) of the growth substrate (322). If an adhesive member (260 in FIG. 11) is formed between the growth substrate (322) and the wavelength conversion member (330), a pattern by the circuit pattern of the growth substrate (322) may be formed on the lower surface of the adhesive member.

[0152] Referring to FIG. 12, the substrate pattern (323) of the light-emitting member (320) and the substrate pattern (323) of the optical member (140) may be arranged to be misaligned with each other. For example, the central axes of at least one of the protrusions forming the substrate pattern (323) and the protrusions forming the optical pattern (145) located thereon may be misaligned with each other. Such a structure can change the optical path within the light-emitting device (300) in various ways. That is, the light passes through the exit surface of the light-emitting member (320) and is refracted in various directions by the substrate pattern (323) to reach the exit surface of the optical member (140) at various angles, thereby reducing total reflection at the exit surface of the optical member (140). Therefore, the light emitting device (300) according to an embodiment of the present invention can improve light efficiency by reducing total reflection at the emission surface of the light emitting device (300) through a structure in which the substrate pattern (323) and the optical pattern (145) are arranged in an alternating manner.

[0153] In Fig. 12, the substrate pattern (323) formed on the upper surface of the growth substrate (322) has a structure in which a plurality of irregularities are regularly arranged, but the embodiment of the present invention is not limited thereto. The substrate pattern (323) of the growth substrate (322) may also have a structure in which a plurality of irregularities are arranged with irregular structures and intervals.

[0154] Fig. 13 is a schematic cross-sectional view illustrating a light-emitting device according to a fourth embodiment of the present invention.

[0155] Referring to FIG. 13, a light-emitting device (400) according to the fourth embodiment may include a substrate (110), a light-emitting member (120), a wavelength conversion member (130), an optical member (440), and a barrier member (150).

[0156] The structure of the optical member (440) of the light-emitting device (400) according to the present embodiment is different from the structure of the optical member (140) of the light-emitting device (100 in FIG. 1) according to the first embodiment.

[0157] In the light-emitting device (400) of the present embodiment, an optical pattern (445) of an optical member (440) is formed on the lower surface of the optical member (440). Here, the lower surface of the optical member (440) including the optical pattern (445) is the incident surface of the optical member (440) onto which light is incident.

[0158] According to an embodiment of the present invention, light emitted from the wavelength conversion member (130) is incident through the incident surface of the optical member (440) on which the optical pattern (445) of the optical member (440) is formed. At this time, the total reflection of the light on the incident surface of the optical member (440) is reduced by the optical pattern (445), so that the light efficiency of the light emitting device (400) can be improved. In addition, when the light passes through the optical pattern (445), the direction in which the light travels can be narrowed instead of spread out by the angle of the incident pattern through which it passes. Therefore, the light emitting device (400) of the present embodiment can reduce the beam angle by the optical member (440) on which the optical pattern (445) is formed on the lower surface on which the light is incident, and accordingly, the brightness can also be improved.

[0159] Referring to Fig. 13, in the present embodiment, the optical pattern (445) is formed of curved protrusions. However, the present embodiment is not limited to the optical pattern (445) including a curved structure. In the present embodiment, the optical pattern (445) may be formed of protrusions having a triangular cross-section, as in the previous embodiment. In addition, the optical pattern (445) of the light-emitting device (400) of embodiments other than the present embodiment may also be formed of curved protrusions.

[0160] According to the present embodiment, when the adhesive member (260) is not interposed, the bonding area between the optical member (440) and the wavelength conversion member (130) can be improved by the optical pattern (445) formed on the lower surface of the optical member (440). Accordingly, the adhesive force between the optical member (440) and the wavelength conversion member (130) increases, thereby improving the reliability of the light emitting device (400).

[0161] In addition, the light emitting device (400) of the present embodiment may have an adhesive member (260) interposed between the wavelength conversion member (130) and the optical member (440) as needed. At this time, the adhesive area between the optical member (440) and the adhesive member (260) may be increased by the optical pattern (445), thereby improving the adhesive strength.

[0162] Fig. 14 is a schematic cross-sectional view illustrating a light-emitting device according to a fifth embodiment of the present invention.

[0163] Referring to FIG. 14, a light-emitting device (500) according to the fifth embodiment may include a substrate (110), a light-emitting member (120), a wavelength conversion member (130), an optical member (540), and a barrier member (150).

[0164] The structure of the optical member (540) of the light-emitting device (500) according to the present embodiment is different from the structure of the optical member (140) of the light-emitting device (100 in FIG. 1) according to the first embodiment.

[0165] In the light-emitting device (500) of the present embodiment, the optical pattern (445) of the optical member (540) is formed on both the upper and lower surfaces of the optical member (540). Here, the lower surface of the optical member (540) including the optical pattern (445) is an incident surface of the optical member (540), and the upper surface of the optical member (540) including the optical pattern (445) is an emission surface of the optical member (540) from which light is emitted and an emission surface of the light-emitting device (500).

[0166] Additionally, in Fig. 14, the optical pattern (445) is made up of curved protrusions, but the optical pattern (445) may also be made up of protrusions with a triangular cross-section, as in Fig. 1.

[0167] The light emitting device (500) of the present embodiment can increase the adhesive strength between the optical member (540) and the adhesive member (260) or wavelength conversion member (130) located thereunder, and can reduce the light directivity of the light emitting device (500) and increase the brightness of the light emitting device (500) by the lower surface of the optical member (540) on which the optical pattern (445) is formed, similar to the light emitting device (400) of the fourth embodiment of FIG. 13. In addition, the light emitting device (500) of the present embodiment can reduce the light directivity of the light emitting device (500) and increase the brightness of the light emitting device (500) by the upper surface of the optical member (540) on which the optical pattern (445) is formed. That is, the light emitting device (500) according to the present embodiment can reduce the light directivity angles at the incident surface and the emission surface of the optical member (540), respectively, and can increase the brightness accordingly.

[0168] Fig. 15 is a schematic cross-sectional view illustrating a light-emitting device according to a sixth embodiment of the present invention.

[0169] Referring to FIG. 15, a light-emitting device (600) according to the sixth embodiment may include a substrate (110), a light-emitting member (120), a wavelength conversion member (130), an optical member (140), and a barrier member (650).

[0170] The structure of the barrier member (650) of the light-emitting device (600) according to the present embodiment is different from the structure of the barrier member (150) of the light-emitting device (100 in FIG. 1) according to the first embodiment.

[0171] Referring to FIG. 1, in the light-emitting device (100 in FIG. 1) according to the first embodiment, the upper surface of the barrier member (150) is positioned on the same line as the upper surface of the optical base (141) of the optical member (140). However, the barrier member (650) of the light-emitting device (600) of the present embodiment may be formed so that its upper surface is positioned higher than the upper surface of the optical member (140). That is, the upper surface of the barrier member (650) of the present embodiment may be positioned higher than the optical pattern (145). That is, the upper surface of the barrier member (650) may be positioned higher than the vertices of the protrusions forming the optical pattern (145).

[0172] In Fig. 15, the upper surface of the barrier member (650) is higher than the optical pattern (145), but the present embodiment is not limited thereto. The barrier member (650) may be formed so that the upper surface is positioned lower than the optical pattern (145) but higher than the optical base (141).

[0173] Additionally, the barrier member (650) of the present embodiment may have an inner surface spaced apart from the outer surface of the optical pattern (145) as illustrated in FIG. 15.

[0174] By means of this structure, light emitted through the outer surface of the optical pattern (145) can be reflected from the inner surface of the barrier member (650). Light reflected from the inner surface of the barrier member (650) can be emitted upward from the inner region of the barrier member (650).

[0175] Therefore, the light emitting device (600) according to the present embodiment can prevent light from being emitted in an outward direction from the outer surface of the optical pattern (145), thereby reducing the angle of incidence and, accordingly, increasing the brightness.

[0176] Fig. 16 is a schematic cross-sectional view illustrating a light-emitting device according to a seventh embodiment of the present invention.

[0177] Referring to FIG. 16, a light-emitting device (700) according to the seventh embodiment may include a substrate (110), a light-emitting member (120), a wavelength conversion member (130), an optical member (140), and a barrier member (750).

[0178] The structure of the barrier member (750) of the light-emitting device (700) according to the present embodiment is different from the structure of the barrier member (150) of the light-emitting device (100 in FIG. 1) according to the first embodiment.

[0179] The barrier member (750) of the present embodiment has a structure in which the height of the upper surface is not constant but changes. Referring to FIG. 16, the height of the upper surface of the barrier member (750) may increase from the outside to the inside. In addition, one end of the barrier member (750) may be formed to cover at least a portion of the side surface of the optical pattern (145) of the optical member (140). Here, one end of the upper surface of the barrier member (750) is a portion located on the inside of the barrier member (750) and in contact with the optical member (140). At this time, the barrier member (750) may be formed to cover the outer surface of the optical pattern (145) adjacent to the edge of the upper surface of the optical base (141). That is, the barrier member (750) may cover the outer surfaces of the protrusions and depressions forming the optical pattern (145) that are adjacent to the edge of the upper surface of the optical member (140). The optical member (140) may be formed to cover the entire outer surface of the optical pattern (145) and contact the vertex of the optical pattern (145). Alternatively, the optical member (140) may be formed to cover a portion of the outer surface of the optical pattern (145) and have one upper surface positioned lower than the vertex of the optical pattern (145).

[0180] By means of this structure, light emitted through the outer surface of the optical pattern (145) can be reflected by the barrier member (750). That is, the barrier member (750) covering the outer surface of the optical pattern (145) can prevent light from being emitted laterally through the outer surface of the optical pattern (145).

[0181] Therefore, the light emitting device (700) according to the present embodiment can prevent light from being emitted in an outward direction from the outer surface of the optical pattern (145), thereby reducing the angle of incidence and thereby increasing the brightness.

[0182] Fig. 17 is a schematic cross-sectional view illustrating a light-emitting device according to the eighth embodiment of the present invention.

[0183] Referring to FIG. 17, a light-emitting device (800) according to the eighth embodiment may include a substrate (110), a light-emitting member (120), a wavelength conversion member (130), an optical member (840), and a barrier member (150).

[0184] The structure of the optical member (840) of the light-emitting device (800) according to the present embodiment is different from the structure of the optical member (140) of the light-emitting device (100 in FIG. 1) according to the first embodiment.

[0185] According to the present embodiment, the optical member (840) may include a first optical member (843) and a second optical member (847). The first optical member (843) may be formed on an upper portion of the wavelength conversion member (130), and the second optical member (847) may be formed on an upper portion of the first optical member (843). The first optical member (843) may be formed of an optical base on which an optical pattern is not formed. In addition, an optical pattern (846) may be formed on the second optical member (847). That is, the second optical member (847) may include a second optical base (845) and an optical pattern (846) formed on an upper surface of the second optical base (845).

[0186] The first optical member (843) and the second optical member (847) may be formed of a light-transmitting material such as sapphire, silicone resin, glass, ceramic, alumina, or urethane. In addition, the first optical member (843) and the second optical member (847) may be formed of different materials. In this case, the angle of orientation of the light-emitting device (800) can be narrowed through the difference in refractive index due to the difference in materials of the first optical member (843) and the second optical member (847).

[0187] For example, the first optical member (843) may be formed of silicone resin and the second optical member (847) may be formed of glass. Alternatively, the first optical member (843) may be formed of glass and the second optical member (847) may be formed of silicone resin.

[0188] As another example, the first optical member (843) and the second optical member (847) may be formed of the same material, but may have different refractive indices due to differences in the internal materials they additionally include. One of the first optical member (843) and the second optical member (847) may further include an internal material such as a wavelength conversion material or a diffusion material. Alternatively, the first optical member (843) and the second optical member (847) may include different internal materials. For example, one of the first optical member (843) and the second optical member (847) may include a wavelength conversion material, and the other may include a diffusion material. Alternatively, the first optical member (843) and the second optical member (847) may include wavelength conversion materials of different types or having different optical spectra. More specifically, the first optical member (843) may include a green phosphor or a yellow phosphor, and the second optical member (847) may include a red phosphor.

[0189] Additionally, the second optical member (847) may be formed to have a thinner thickness than the first optical member (843). By forming the second optical member (847) to have a thinner thickness than the first optical member (843), light loss due to light absorption in the second optical member (847) can be reduced, thereby improving the light quantity of the light-emitting device (800).

[0190] In the present embodiment, the optical pattern (846) is formed only on the upper surface of the second optical member (847), but the present embodiment is not limited thereto. The optical pattern (846) may be further formed on at least one of the lower surface of the second optical member (847), the upper surface of the first optical member (843), and the lower surface of the first optical member (843).

[0191] The light emitting devices (100, 200, 300, 400, 500, 600, 700) described through FIGS. 1, 11, and 17 have a structure in which the optical pattern has a side surface that is formed as a single plane based on the cross-section. More specifically, the side surface of the protrusions and depressions forming the optical pattern is formed as a single plane. However, the structure of the optical pattern is not limited thereto. The optical pattern can have various structures by applying various etching factors such as the number of etching processes, the selectivity, and the type of etching material. For example, the optical pattern may be formed of protrusions and depressions in which one side surface is formed as planes having different slopes.

[0192] Fig. 18 is a schematic cross-sectional view illustrating a light-emitting device according to a ninth embodiment of the present invention.

[0193] Referring to FIG. 18, a light-emitting device (900) according to the ninth embodiment may include a substrate (110), a light-emitting member (120), a wavelength conversion member (130), an optical member (940), and a barrier member (150).

[0194] The light emitting device (900) according to the present embodiment has a structure of an optical member (940) that is different from the structure of an optical member (140) of the light emitting device (100 in FIG. 1) according to the first embodiment.

[0195] According to the present embodiment, the optical member (940) includes an optical base (941) and an optical pattern (947) formed on the upper portion of the optical base (941). In addition, the optical pattern (947) of the optical member (940) may include a first optical pattern (945) and a second optical pattern (946).

[0196] The first optical pattern (945) is formed of the same material as the optical base (941). In addition, the first optical pattern (945) is integral with the optical base (941). That is, the first optical pattern (945) may be formed by etching a portion of the upper surface of the optical base (941).

[0197] The second optical pattern (946) is formed on top of the first optical pattern (945). The second optical pattern (946) may be formed of a different material from the first optical pattern (945) and the optical base (941).

[0198] The optical pattern (947) of the present embodiment may be formed through an etching process after forming a second optical base on the upper portion of the first optical base. At this time, the first optical base and the second optical base may be formed of different materials. Through the etching process, a portion of the upper portion of the first optical base located below the second optical base may also be etched. The portion of the second optical base that remains after being etched may become the second optical pattern (946). In addition, the upper portion of the first optical base that remains after being etched may become the first optical pattern (945). In addition, the portion of the first optical base located below the first optical pattern (945) may become the optical base (941) of the optical member (940) of the present embodiment.

[0199] According to the present embodiment, since the first optical base and the second optical base are made of different materials, different shapes of the first optical pattern (945) and the second optical pattern (946) can be formed by various factors such as the etching profile and the etching rate during the etching process. For example, as illustrated in FIG. 18, the first optical pattern (945) and the second optical pattern (946) can be formed so that their side surfaces have different slopes. For example, as illustrated in FIG. 18, the side surface of the second optical pattern (946) can have a smaller slope with respect to the upper surface of the optical base (941) than the side surface of the first optical pattern (945).

[0200] In this way, the light emitting device described through various embodiments of the present invention can narrow the light beam angle by means of a patterned emission surface, thereby enabling precise light control of a lighting device and a display device. In addition, the light emitting device can improve brightness by emitting light with a narrow beam angle. For example, the light emitting device of the present embodiment can be applied to a device that requires a narrow beam angle and high brightness for a certain area, such as a headlamp of an automobile that requires a narrow beam angle. In addition, the light emitting device of the present embodiment with a narrow beam angle and high brightness can provide a user with a clear picture quality even when the display is close to the eyes when applied to an HMD (Head Mounted Display).

[0201] Fig. 19 is an exemplary diagram of a vehicle to which a light-emitting device according to an embodiment of the present invention is applied.

[0202] Referring to FIG. 19, the vehicle (1000) includes a main body (1100) and a lamp (1200) mounted on the main body. The lamp (1200) requires light-emitting area control for direction indication or projection area adjustment. Accordingly, at least one light-emitting device among the light-emitting devices (100 to 900) of the present embodiment described with reference to FIGS. 1 to 18 can be used as a light source for the lamp (1200).

[0203] According to the present embodiment, a plurality of light-emitting devices may be arranged in the lamp (1200). In addition, the lamp (1200) may control the plurality of light-emitting devices to operate individually. Accordingly, the lamp (1200) can easily adjust the light-emitting area or projection area by independently controlling the plurality of light-emitting devices having narrow beam angles.

[0204] In the present embodiment, the light emitting device includes all wavelength conversion members, but the present invention is not limited thereto. That is, the light emitting device may include a light-transmitting member from which the wavelength conversion material is omitted instead of the wavelength conversion member. In addition, when a plurality of light emitting devices such as a lamp are provided, at least one of the light emitting devices may include a light-transmitting member from which the wavelength conversion material is removed instead of the wavelength conversion member. That is, according to the present embodiment, a lamp including a plurality of light emitting devices may include a structure in which a plurality of light emitting members are arranged and a structure in which the wavelength conversion members cover at least a portion of the plurality of light emitting members arranged.

[0205] As described above, the detailed description of the present invention has been made by way of embodiments with reference to the attached drawings. However, the above-described embodiments have only been described as preferred examples of the present invention, and therefore, the present invention should not be understood as being limited to the above-described embodiments, and the scope of the rights of the present invention should be understood by the claims described below and their equivalent concepts.

Claims

1. Substrate; A light-emitting member disposed on the above substrate; A wavelength conversion member disposed on the above light-emitting member; an optical member disposed on the wavelength conversion member; and A barrier member disposed on the substrate and covering side surfaces of the light-emitting member, the wavelength conversion member, and the optical member; A light emitting device comprising an optical base and an optical pattern formed of protrusions on at least one surface of the optical base, wherein the optical member is a light emitting device.

2. In claim 1, The above optical pattern is a light emitting device formed on the upper surface of the optical base.

3. In claim 1, The above optical pattern is a light emitting device formed on the lower surface of the optical base.

4. In claim 1, The optical member includes a first optical member and a second optical member disposed on the first optical member, The first optical member and the second optical member include at least one different material, A light emitting device in which the optical pattern is formed on the upper surface of the second optical base of the second optical member.

5. In claim 1, The above optical pattern includes a first optical pattern and a second optical pattern, The first optical pattern is formed on the upper surface of the optical base, and the second optical pattern is formed on the upper surface of the first optical pattern. A light emitting device in which the first optical pattern and the second optical pattern are formed of different materials.

6. In claim 5, A light emitting device in which the first optical pattern and the second optical pattern have different slopes on the sides based on the cross-section.

7. In claim 5, A light emitting device in which the optical base and the first optical pattern are formed of the same material and are integral.

8. In claim 1, The above optical pattern is a light emitting device composed of a plane having different slopes on each side based on the cross-section.

9. In claim 1, A light-emitting device in which an adhesive member is formed between the light-emitting member and the wavelength conversion material and between the wavelength conversion material and the optical member.

10. In claim 1, A light emitting device in which the upper surface of the above barrier member is positioned on the same line as the upper surface of the above optical base.

11. In claim 1, A light emitting device in which the upper surface of the above barrier member is positioned higher than the above optical pattern.

12. In claim 1, A light emitting device in which the upper surface of the above barrier member increases in height from the outside to the inside of the above barrier member.

13. In claim 12, The above barrier member is a light emitting device that covers the outer surface of the optical pattern adjacent to the upper surface edge of the optical base.

14. In claim 1, The above barrier member is a light-emitting device including a light-reflecting material.

15. In claim 1, The above light-emitting member includes a growth substrate formed to face the wavelength conversion member, A light emitting device in which the refractive index decreases in the order of the growth substrate of the light emitting member, the wavelength conversion member, and the optical member.

16. In claim 1, A light emitting device in which the light emitting device has a smaller angle of focus than the light emitting member.

17. In claim 1, A light emitting device having a light emitting angle of 60 to 100 degrees.

18. Substrate; A light-emitting member disposed on the above substrate; A wavelength conversion member disposed on the above light-emitting member; an optical member disposed on the wavelength conversion member; and A barrier member disposed on the substrate and covering side surfaces of the light-emitting member, the wavelength conversion member, and the optical member; The optical member includes a first optical member and a second optical member disposed on the first optical member, A light emitting device in which the second optical member includes a second optical base disposed on the first optical member and an optical pattern formed on an upper surface of the second optical base.

19. In claim 18, A light emitting device wherein the first optical member and the second optical member include at least one different material.

20. Body; A lamp mounted on at least one side of the above body; The above lamp comprises a plurality of arranged light-emitting elements; A wavelength conversion member formed to cover at least one upper surface of the above light-emitting members; and an optical member including an optical pattern formed of protrusions formed on at least one surface; A vehicle lamp in which the plurality of light-emitting members are each independently driven.

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