Compositions containing a thermally conductive filler and a thermally expandable material

Abstract

Disclosed is a composition comprising a first component comprising a first compound comprising an isocyanate functional group and a second component comprising a hydroxy-containing compound. The composition also comprises a thermally expandable material and a thermally conductive filler in an amount of 50 percent by weight to 90 percent by weight based on total weight of the composition. Also disclosed are coatings formed from the compositions.

Description

COMPOSITIONS CONTAINING A THERMALLY CONDUCTIVE FILLER AND A THERMALLY EXPANDABLE MATERIALGOVERNMENT CONTRACT

[0001] This disclosure was made with Government support under Government Contract No. NCMS FY2019NMP-FREE LI BATTERIES PHASE III 202050 awarded by the GVSC. The United States Government may have certain rights in the subject matter disclosed herein.CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Application No. 63 / 557,985, filed on February 26, 2024, and U.S. Provisional Application No. 63 / 691,189, filed on September 5, 2024, both entitled “Compositions Containing Thermally Conductive Filler and Thermally Expandable Material,” and both incorporated by reference herein in their entirety.FIELD

[0003] Compositions comprising a thermally conductive filler and a thermally expandable material and uses thereof are disclosed.BACKGROUND

[0004] Thermal insulation allows for protection of the surrounding battery cells and housing at thermal runaway conditions. The present disclosure is directed toward compositions that are thermally conductive under normal operating conditions but thermally insulative under extreme conditions, such as at a temperature of at least 60°C.SUMMARY

[0005] Disclosed are compositions comprising: a first component comprising a first compound comprising an isocyanate functional group; a second component comprising a second compound comprising a hydroxy-containing compound; a thermally expandable material; and a thermally conductive filler.

[0006] Also disclosed are methods for treating a substrate comprising contacting a surface of the substrate with a composition disclosed herein.

[0007] Also disclosed are substrates comprising a coating formed on a surface thereof from a composition disclosed herein.

[0008] Also disclosed are batteries comprising a battery cell and a coating formed from a composition disclosed herein.

[0009] Also disclosed are vehicles comprising a battery disclosed herein.BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG. 1 is a schematic of a top-down view of cylindrical battery cells.

[0011] FIG. 2 is a schematic of an exploded isometric view of an array of prismatic battery cells.

[0012] FIG. 3 is a schematic of a front view of an array of pouch battery cells.

[0013] FIG. 4 is a schematic of an isometric view of cylindrical cells positioned in a battery module.

[0014] FIG. 5 is a schematic of an exploded perspective view of a battery pack comprising multiple battery cells.

[0015] FIG. 6 is a schematic of an isometric view of (A) a battery cell, (B) a battery module, and (C) a battery pack.

[0016] FIG. 7 is a schematic of a perspective view of a battery pack.

[0017] FIG. 8 is a schematic of a cell to battery pack configuration.

[0018] FIG. 9 is a schematic of an isometric cut-out view of a cell to chassis battery assembly.DETAILED DESCRIPTION

[0019] Disclosed herein is a composition comprising, or consisting essentially of, or consisting of: a first component comprising, or consisting essentially of, or consisting of, a first compound comprising an isocyanate functional group; a second component comprising, or consisting essentially of, or consisting of, a second compound comprising a hydroxy functional group; a thermally expandable material; and a thermally conductive filler.Compounds Comprising An Isocyanate Functional Group

[0020] The first component comprises a first compound comprising an isocyanate functional group(s). The isocyanate can be a monomer, a small molecule, or a polymer. The isocyanate-containing compound may comprise two or more isocyanate functional groups (-N=C=O).

[0021] Suitable monomeric isocyanate-containing compounds include p-tolyl isocyanate, hexyl isocyanate, phenyl isocyanate, isocyanate ethyl arylate, methacryloyloxyethyl isocyanate, 3-(triethyoxysilyl)propyl isocyanate.

[0022] Suitable isocyanate-containing compounds that may be used in the compositions described herein may comprise a polyisocyanate. For example, the polyisocyanate may comprise C2-C20 linear, branched, cyclic, aliphatic and / or aromatic poly isocyanates.

[0023] Aliphatic polyisocyanate-containing compounds may include alkylene isocyanates, such as: trimethylene diisocyanate; tetramethylene diisocyanate, such as 1,4- tetramethylene diisocyanate; pentamethylene diisocyanate, such as 1,5-pentamethylene diisocyanate and 2-methyl- 1,5-pentamethylene diisocyanate; hexamethylene diisocyanate (“HD I”), commercially available as Demodur XP 2617 (Covestro), such as 1,6-hexamethylene diisocyanate and 2,2,4- and 2,4,4-trimethylhexamethylene diisocyanate, or mixtures thereof; heptamethylene diisocyanate, such as 1,7-heptamethylene diisocyanate; propylene diisocyanate, such as 1,2-propylene diisocyanate; butylene diisocyanate, such as 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, and 1,4-butylene diisocyanate; ethylene diisocyanate; decamethylene diisocyanate, such as 1,10-decamethylene diisocyanate; ethylidene diisocyanate; and butylidene diisocyanate. Aliphatic polyisocyanates may also include cycloalkylene isocyanates, such as: cyclopentane diisocyanate, such as 1,3-cyclopentane diisocyanate; cyclohexane diisocyanate, such as 1,4-cyclohexane diisocyanate, 1,2-cyclohexane diisocyanate, isophorone diisocyanate (“IPDI”), methylene bis(4-cyclohexylisocyanate) (“HMDI”); and mixed aralkyl diisocyanates such as tetramethylxylyl diisocyanates, such as meta-tetramethylxylylene diisocyanate (commercially available as TMXDI® from Allnex SA). Dimers, trimers, oligomers, and polymers of the above-mentioned polyisocyanates also may be used as the cyclotrimer of 1,6 hexamethylene diisocyanate (also known as the isocyanate trimer of HDI, commercially available as Desmodur N3300 (Covestro)).

[0024] Aromatic polyisocyanate-containing compounds may include arylene isocyanates, such as: phenylene diisocyanate, such as m-phenylene diisocyanate, p-phenylene diisocyanate, and chlorophenylene 2,4-diisocyanate; naphthalene diisocyanate, such as 1,5-naphthalene diisocyanate and 1 ,4-naphthalene diisocyanate. Aromatic polyisocyanates may also include alkarylene isocyanates, such as: methylene-interrupted aromatic diisocyanates, such as 4,4'- diphenylene methane diisocyanate (“MDI”), and alkylated analogs such as 3,3'-dimethyl-4,4'- diphenylmethane diisocyanate, and polymeric methylenediphenyl diisocyanate; toluene diisocyanate (“TDI”), such as 2,4-tolylene or 2,6-tolylene diisocyanate, or mixtures thereof,bitoluene diisocyanate; and 4,4-toluidine diisocyanate; xylene diisocyanate; dianisidine diisocyanatc; xylylcnc diisocyanatc; and other alkylated benzene diisocyanatcs.

[0025] Polyisocyanates may also include: triisocyanates, such as triphenyl methane- 4,4',4"-triisocyanate, 1,3,5-triisocyanato benzene, and 2,4,6-triisocyanato toluene; tetraisocyanates, such as 4,4'-diphenyldimethyl methane-2,2',5,5'-tetraisocyanate; and polymerized polyisocyanates, such as tolylene diisocyanate dimers and trimers and the like.

[0026] The isocyanate-functional compound may comprise an isocyanate equivalent weight of at least 70 g / eq, such as at least 90 g / eq. The isocyanate-functional compound may comprise an isocyanate equivalent weight of less than 400 g / eq, such as no more than 300 g / eq. The isocyanate-functional compound may comprise an isocyanate equivalent weight of 70 g / eq to less than 400 g / eq, such as 90 g / eq to 300 g / eq.

[0027] The isocyanate-functional compound may comprise an isocyanate equivalent weight of at least 400 g / eq, such as at least 500 g / eq. The isocyanate-functional compound may comprise an isocyanate equivalent weight of no more than 3,000 g / eq, such as no more than 2,000 g / eq. The isocyanate-functional compound may comprise an isocyanate equivalent weight of 400 g / eq to 3,000 g / eq, such as 500 g / eq to 2,000 g / eq.

[0028] The isocyanate-functional compound may comprise an isocyanate functionality of at least 2, such as greater than 2, such as at least 2.1, such as at least 2.5, such as at least 3, such as at least 3.5, such as at least 4, such as at least 4.5, such as at least 5, such as at least 5.5, such as at least 6, such as at least 6.5, such as at least 7, such as at least 7.5, such as at least 8, such as at least 8.5, such as at least 9, such as no more than 10. The isocyanate-functional compound may comprise an isocyanate functionality of 2 to 10, such as 2.1 to 10, such as 2.5 to 10, such as 3 to 10, such as 3.5 to 10, such as 4 to 10, such as 4.5 to 10, such as 5 to 10, such as 5.5 to 10, such as 6 to 10, such as 6.5 to 10, such as 7 to 10, such as 7.5 to 10, such as 8 to 10, such as 8.5 to 10, such as 9 to 10.

[0029] The isocyanate compound may have at least one functional group in addition to the isocyanate functional group. Suitable additional functional groups include a silane functional group, a sulfide functional group, an epoxy functional group, and / or a (meth)acrylate functional group.Compounds Comprising Hydroxy-Containing Compounds

[0030] The second component comprises a second compound comprising a hydroxycontaining compound. The second molecule may be difunctional, or polyfunctional. For example, the hydroxy-containing compound may be a monofunctional alcohol, a diol, a triol, a tetraols, or a higher functional polyol. The second molecule may be a monomer, a small molecule, or a polymer.

[0031] Non-limiting examples of suitable polyols include but are not limited to polyether polyols, polyester polyols, polycaprolactone polyols, polycarbonate polyols, polyurethane polyols, poly vinyl alcohols, polymers containing hydroxy functional acrylates, polymers containing hydroxy functional methacrylates, polymers containing hydroxy functional allyls, hydroxyl functional polybutadienes, and mixtures thereof.

[0032] The polyols may be based on a polyether chain derived from ethylene glycol, propylene glycol, butylene glycol, hexylene glycol, and the reaction products of low molecular weight polyhydric alcohols with alkylene oxides, such as 1 ,2-propylene oxide, 1,2- or 2,3- butylene oxide, tetrahydrofuran or mixtures thereof, and are polymerized eventually with the aid of a starter molecule having two or more active hydrogen atoms, such as, for example, water, ammonia or compounds having two or more OH or NH groups, such as, for example, 1,2- ethanediol, 1,2- and 1,3 -propanediol, neopentylglycol, diethylene glycol, triethylene glycol, the isomeric dipropylene glycols and tripropylene glycols, the isomeric butanediols, pentanediols, hexanediols, heptanediols, octanediols, nonanediols, decanediols, undecanediols, 1,3- and 1,4- cyclohexanedimethanol, bisphenol A, hydrogenated bis-phenol A, 1,1,1 -trimethylolethane, 1,1,1- trimethylol-propane, glycerol, aniline, and mixtures of the aforementioned compounds. Commercially available polyether polyols include those sold under the trade name Pluracol®, Vomanol®, and Carpol® may be utilized. Likewise, particularly suitable are ethylene oxide-end capped polyoxypropylene diols or triols. The latter are special polyoxypropylene polyoxyethylene polyols which are obtained, for example, by alkoxylating straight polyoxypropylene polyols, after the polypropoxylation, with ethylene oxide, and which as a result contain primary hydroxyl groups.

[0033] The polyol may comprise a tetrahydrofuran-based polyol. The polytetrahydrofuran-based polyols may comprise diols terminated with primary hydroxyl groups. Commercially available polytetrahydrofuran-based polyols include those sold under the tradename Terathane®, such as Terathane® PTMEG 1000 which are blends of linear diols in which the hydroxyl groups arc separated by repeating tctramcthylcnc ether groups, available from Invista. In addition, polyols based on dimer diols sold under the trade names Pripol® available from Cargill, Incorporated, Solvermol™ and Empol®, available from BASF, or bio-based polyols, available from BioBased Technologies, may also be utilized.

[0034] The polyol may comprise a polycaprolactone-based polyol. The polycaprolactone-based polyols may comprise diols terminated with primary hydroxyl groups. Commercially available polycaprolactone-based polyols include those sold under the trade name Capa® from Ingevity, such as, for example, Capa 2054, Capa 2077A, Capa 2085, Capa 2205.

[0035] The hydroxy-containing compound may comprise a hydroxy-functionality of at least 1, such as at least 2, such as greater than 2, such as at least 2.1, such as at least 2.5, such as at least 3, such as at least 3.5, such as at least 4, such as at least 4.5, such as at least 5, such as at least 5.5, such as at least 6, such as at least 6.5, such as at least 7, such as at least 7.5, such as at least 8, such as at least 8.5, such as at least 9, such as no more than 10. The hydroxy-containing compound may comprise a hydroxy-functionality of 2 to 10, such as 2.1 to 10, such as 2.5 to 10, such as 3 to 10, such as 3.5 to 10, such as 4 to 10, such as 4.5 to 10, such as 5 to 10, such as 5.5 to 10, such as 6 to 10, such as 6.5 to 10, such as 7 to 10, such as 7.5 to 10, such as 8 to 10, such as 8.5 to 10, such as 9 to 10.

[0036] The hydroxy-containing compound may comprise a hydroxy equivalent weight of at least 70 g / eq, such as at least 90 g / eq. The hydroxy-containing compound may comprise a hydroxy equivalent weight of less than 400 g / eq, such as no more than 300 g / eq. The hydroxycontaining compound may comprise a hydroxy equivalent weight of 70 g / eq to less than 400 g / eq, such as 90 g / eq to 300 g / eq.

[0037] The hydroxy-containing compound may comprise a hydroxy equivalent weight of at least 400 g / eq, such as at least 500 g / eq. The hydroxy-containing compound may comprise a hydroxy equivalent weight of no more than 3,000 g / eq, such as no more than 2,000 g / eq. The hydroxy-containing compound may comprise a hydroxy equivalent weight of 400 g / eq to 3,000 g / eq, such as 500 g / eq to 2,000 g / eq.

[0038] The hydroxy-containing compound may have at least one functional group in addition to the hydroxy functional group. Suitable additional functional groups include mercaptofunctional groups, silane functional groups, phenolic functional groups, and / or amino functional groups.Thermally Conductive Filler

[0039] The compositions disclosed herein also may comprise a filler. The filler may comprise a thermally conductive, electrically insulative filler (referred to herein as “TC / EI filler” and described in more detail below) and / or a thermally conductive, electrically conductive filler (referred to herein as “TC / EC filler” and described in more detail below). The TC / EI and / or TC / EC (referred to collectively as “thermally conductive filler”) may be present in the first component, the second component and / or a third component. The thermally conductive filler may comprise an organic or inorganic material and may comprise particles of a single type of filler material or may comprise particles of two or more types of TC / EI filler and / or two or more types of TC / EC filler. That is, the filler may comprise a first TC / EI filler and may further comprise at least a second (i.e., a second, a third, a fourth, etc.) TC / EI filler in addition to the first TC / EI filler. Likewise, the filler may comprise a first TC / EC filler and may further comprise at least a second (i.e., a second, a third, a fourth, etc.) TC / EC filler in addition to the first TC / EC filler. As used herein with respect to types of filler, reference to “first,” “second”, etc. is for convenience only and does not refer to order of addition to the composition or the like.

[0040] Optionally, any of the filler may comprise a surface coating. The surface coating may comprise a silane an amino-silane, and / or or a polymer with multiple functional groups that can bind to or interact with the filler.

[0041] The filler may have a reported average particle size in at least one dimension of at least 0.01 pm, as reported by the manufacturer or measured as described below, such as at least 2 pm, such as at least 10 pm, and may have a reported average particle size in at least one dimension of no more than 500 pm as reported by the manufacturer or measured as described below, such as no more than 400 pm, such as no more than 300 pm, such as no more than 100 pm. The filler may have a reported average particle size in at least one dimension of 0.01 pm to 500 pm as reported by the manufacturer or measured as described below, such as 0.1 pm to 400 pm, such as 2 pm to 300 pm, such as 10 pm to 100 pm. Particle sizes may be measured by methods known to those skilled in the art, for example, using a scanning electron microscope (SEM), such as a Quanta 250 FEG SEM or an equivalent instrument. For example, powders may be dispersed on segments of carbon tape attached to aluminum stubs and coated with Au / Pdfor 20 seconds. Samples then may be analyzed in an SEM under high vacuum (accelerating voltage lOkV and spot size 3.0), measuring 30 particles from three different areas to provide an average particle size for each sample. One skilled in the art will recognize that there can be variations in this procedure that retain the essential elements of microscopic imaging and averaging of representative size.

[0042] The thermally conductive filler may comprise particles each having, for example, a platy, spherical, or acicular shape, and agglomerates thereof. As used herein, “platy” refers to a two-dimensional material having a substantially flat surface and that has a thickness in one direction that is less than 25% of the largest dimension.

[0043] The thermally conductive filler may have a thermal conductivity of at least 5 W / m K at 25°C measured according to ASTM D7984-21, such as at least 18 W / mK, such as at least 55 W / mK, and may have a thermal conductivity of no more than 3,000 W / m K at 25°C, such as no more than 1,400 W / m K, such as no more than 450 W / m K. The thermally conductive filler may have a thermal conductivity of 5 W / m K to 3,000 W / m K at 25°C, such as 18 W / m K to 1,400 W / mK, such as 55 W / m K to 450 W / mK.

[0044] The filler may be electrically insulative. The electrically insulative filler may have a volume resistivity of at least 1 Q-m (measured according to ASTM D257-19), such as at least 10 Q m, such as at least 100 Q m.

[0045] The filler may be electrically conductive. The electrically conductive filler may have a volume resistivity of less than 1 Q-m (measured according to ASTM D257-19), such as less than 0.1 Q-m.

[0046] Suitable TC / EI filler include boron nitride (for example, commercially available as CarboTherm from Saint-Gobain, as CoolFlow and PolarTherm from Momentive, and as hexagonal boron nitride powder available from Panadyne), silicon nitride, or aluminum nitride (for example, commercially available as aluminum nitride powder available from Micron Metals Inc., and as Toyalnite from Toyal), metal oxides such as Boehmite, Pseudo Boehmite, aluminum oxide (for example, commercially available as Microgrit from Micro Abrasives, as Nabalox from Nabaltec, as Aeroxide from Evonik, and as Alodur from Imerys), magnesium oxide, beryllium oxide, titanium oxide, zinc oxide, nickel oxide, copper oxide, or tin oxide, metal hydroxides such as aluminum hydroxide or magnesium hydroxide, arsenides such as boron arsenide, carbides such as silicon carbide, minerals such as agate and emery, ceramics such as ceramicmicrospheres (for example, commercially available from Zeeospheres Ceramics or 3M), and diamond. The filler can also be surface modified, such as PYROKISUMA 530 IK available from Kyowa Chemical Industry Co., Ltd. The thermally conductive filler may be used alone or in a combination of two or more. The TC / EI filler may also be ferromagnetic, ferrimagnetic, and / or superp ar amagnetic .

[0047] Suitable TC / EC filler includes metals such as silver, zinc, copper, gold, or metal coated hollow particles, carbon compounds such as graphite (such as Timrex commercially available from Imerys or ThermoCarb commercially available from Asbury Carbons), carbon black (such as Vulcan from commercially available from Cabot Corporation), carbon fibers (for example, commercially available as milled carbon fiber from Zoltek), graphene and grapheme carbon particles (for example, xGnP graphene nanoplatelets commercially available from XG Sciences, and / or for example, the graphenic carbon particles described below), carbonyl iron, copper (such as spheroidal powder commercially available from Sigma Aldrich), zinc (such as Ultrapure commercially available from Purity Zinc Metals and Zinc Dust XL and XLP available from US Zinc), and the like. Examples of “graphenic carbon particles” include carbon particles having structures comprising one or more layers of one-atom-thick planar sheets of sp2-bonded carbon atoms that are densely packed in a honeycomb crystal lattice. The average number of stacked layers may be less than 100, for example, less than 50. The average number of stacked layers may be 30 or less, such as 20 or less, such as 10 or less, such as 5 or less. The graphenic carbon particles may be substantially flat; however, at least a portion of the planar sheets may be substantially curved, curled, creased, or buckled. The particles typically do not have a spheroidal or equiaxed morphology. Suitable graphenic carbon particles are described in U.S. Publication No. 2012 / 0129980, at paragraphs

[0059] -

[0065] , the cited portion of which is incorporated herein by reference. Other suitable graphenic carbon particles are described in U.S. Pat. No. 9,562,175, at 6:6 to 9:52, the cited portion of which is incorporated herein by reference. As used herein, the term “substantially flat” means planar; “curved” or “curled” materials deviate from planarity by having a non-zero curvature; and “creased” or “buckled” indicates that at least a portion of the area is thicker than one sheet, such that the plane is doubled or folded upon itself. The TC / EC filler also may be ferromagnetic, ferrimagnetic, and / or supcrparamagnctic.

[0048] The composition may comprise the thermally conductive filler in an amount of 100 percent by volume based on total volume of filler, such as no more than 90 percent byvolume, such as no more than 80 percent hy volume. The composition may comprise the thermally conductive filler in an amount of at least 20 percent by volume based on total volume of filler, such as at least 50 percent by volume. The composition may comprise the thermally conductive filler in an amount of 20 percent to 90 percent by volume based on total volume of filler, such as 50 percent by volume to 80 percent by volume.

[0049] As discussed above, the thermally conductive filler may be present in the first component, the second component and / or the third component or higher component. The compositions disclosed herein may comprise the thermally conductive filler in an amount of at least 50 percent by weight based on total weight of the composition, such as at least 59 percent by weight. The compositions disclosed herein may comprise the thermally conductive filler in an amount of no more than 90 percent by weight based on total weight of the composition, such as no more than 84 percent by weight. The compositions disclosed herein may comprise the thermally conductive filler in an amount of 50 percent by weight to 90 percent by weight based on total weight of the composition, such as 59 percent by weight to 84 percent by weight.Thermally Expandable Material

[0050] The composition also comprises a thermally expandable material. The thermally expandable material may be present in the first component, the second component, and / or a third component. As used herein, the term “thermally expandable” means a pigment, filler, encapsulant, thermoplastic, inorganic powder, capsule, microcapsule, or the like that, upon heating, undergoes an increase in volume in at least one dimension.

[0051] Suitable examples of thermally expandable material may comprise inorganic salts and / or thermally expandable graphite, such as thermally expandable graphite available from ACS Material.

[0052] The thermally expandable material may comprise thermally expandable capsules. The thermally expandable capsules may comprise thermally expandable hollow capsules. The thermally expandable capsules may comprise a thermoplastic resin and / or a volatile material such as a volatile hydrocarbon and / or a volatile gas. The thermally expandable capsules may comprise a thermoplastic resin shell with a volatile material core. Suitable thermally expandable materials comprise Expancel available from Nouryon, Advancell available from Sekisui, and the like.

[0053] The thermally expandable material may have an average initial (i.e., preexpansion) particle size of at least 0.5 pm measured by methods known to those skilled in the art, such as laser diffraction or Low Angle Laser Light Scattering (LALLS), such as at least 1 m, such as at least 2 pm, such as at least 3 pm, such as at least 5 pm, such as at least 10 pm. The thermally expandable material may have an average initial particle size of no more than 100 pm measured by methods known to those skilled in the art, such as laser diffraction or Low Angle Laser Light Scattering (LALLS), such as no more than 80 pm, such as no more than 60 pm, such as no more than 50 pm. The thermally expandable material may have an average initial particle size of 0.5 pm to 100 pm measured by methods known to those skilled in the art, such as laser diffraction or Low Angle Laser Light Scattering (LALLS), such as 1 pm to 80 pm, such as 2 pm to 60 pm, such as 3 pm to 50 pm, such as 5 pm to 50 pm, such as 10 pm to 50 pm.

[0054] The thermally expandable material may have an expansion temperature of at least 60°C, such as at least 70°C, such as at least 80°C, such as at least 90°C, such as at least 100°C, such as at least 1 10°C, such as at least 120°C, such as at least 130°C, such as at least 140°C, such as at least 150°C, such as at least 160°C, such as at least 170°C, such as at least 180°C, such as at least 190°C, such as at least 200°C, such as no more than 250°C. As used herein, the term “expansion temperature,” when used with respect to the thermally expandable material, means the temperature at which the particle size begins to increase due to an increase in volume in at least one dimension. In the case of thermally expandable capsules, the increase in particle size may be, for example, the result of the volatile material beginning to expand while the thermoplastic resin shell softens. Expansion temperature may be achieved, for example, by heating the coating comprising the thermally expandable material and / or heating the substrate on which the coating is formed. The coating and / or the substrate may be heated by direct thermal exposure and / or, in substrates containing ferromagnetic, ferrimagnetic, and / or superparamagnetic materials or in coatings formed from compositions containing ferromagnetic, ferrimagnetic and / or superparamagnetic materials, by indirect heating through the application of a magnetic field resulting in ferromagnetic, ferrimagnetic, and / or superparamagnetic heating.

[0055] The composition may comprise the thermally expandable material in an amount of at least 0.5 percent by weight based on total weight of the composition, such as at least 1 percent by weight. The composition may comprise the thermally expandable material in an amount of no more than 20 percent by weight based on total weight of the composition, such asno more than 10 percent by weight, such as less than 10 percent by weight. The composition may comprise the thermally expandable material in an amount of 0.5 percent to 20 percent by weight based on total weight of the composition, such as 1 percent to 10 percent by weight.Non-Thermally Conductive Filler

[0056] The compositions disclosed herein also may comprise a non-thermally conductive, electrically insulative filler (referred to herein as “NTC / EI” filler). As used herein, the NTC / EI filler is in addition to the thermally expandable materials described above. The NTC / EI filler may be present in the first component, the second component and / or a third component. The NTC / EI filler may comprise an organic or inorganic material and may comprise particles of a single type of filler material or may comprise particles of two or more types of NTC / EI filler. That is, the composition may comprise a first NTC / EI filler and may further comprise at least a second (i.e., a second, a third, a fourth, etc.) NTC / EI filler in addition to the first NTC / EI filler.

[0057] The NTC / EI filler may comprise any of the surface coatings and may be the particle sizes described above with respect to the thermally conductive filler. The NTC / EI filler may comprise particles each having, for example, a platy, spherical, or acicular shape, and agglomerates thereof, as described above with respect to the thermally conductive filler.

[0058] The NTC / EI filler may have a thermal conductivity of less than 5 W / mK at 25°C (measured according to ASTM D7984-21), such no more than 3 W / m K, such as no more than 1 W / mK, such as no more than 0.1 W / mK, such as no more than 0.05 W / mK, such as 0.02 W / m K at 25°C to 5 W / m K at 25°C.

[0059] The NTC / EI filler may have a volume resistivity of at least 1 Q-m (measured according to ASTM D257-19), such as at least 10 Q m, such as at least 100 Q m.

[0060] Suitable NTC / EI fillers include but are not limited to mica, wollastonite, calcium carbonate, glass microspheres, clay, silicon dioxide, or combinations thereof.

[0061] As used herein, the term “mica” generally refers to sheet silicate (phyllosilicate) minerals. The mica may comprise muscovite mica. Muscovite mica comprises a phyllosilicate mineral of aluminum and potassium with the formula KAh(AlSi30io)(F,OH)2 or (KF lAhCh SiCh FhO). Exemplary non-limiting commercially available muscovite mica include products sold under the trade name DakotaPURE™, such as DakotaPURE™ 700, DakotaPURE™ 1500, DakotaPURE™ 2400, DakotaPURE™ 3000, DakotaPURE™ 3500 andDakotaPURE™ 4000, available from Pacer Minerals. Wollastonite comprises a calcium inosilicate mineral (CaSiO y) that may contain small amounts of iron, aluminum, magnesium, manganese, titanium and / or potassium. Non-limiting examples of commercially available wollastonite include NY AD 400 available from NYCO Minerals, Inc.

[0062] The calcium carbonate (CaCCh) may comprise a precipitated calcium carbonate or a ground calcium carbonate. The calcium carbonate may or may not be surface treated, such as treated with stearic acid, such as Socal® 312, commercially available from IMERYS. Nonlimiting examples of commercially available precipitated calcium carbonate include Ultra- Pflex®, Albafil®, and Albacar HO® available from Specialty Minerals and Winnofil® SPT available from Solvay. Non-limiting examples of commercially available ground calcium carbonate include Duramite™ available from IMERYS and Marblewhite® available from Specialty Minerals.

[0063] Useful clay minerals include a non-ionic platy filler such as talc, pyrophyllite, chlorite, vermiculite, or combinations thereof.

[0064] The glass microspheres may be hollow borosilicate glass. Non-limiting examples of commercially available glass microspheres include 3M Glass bubbles type VS, K series, and S series available from 3M.

[0065] The composition may comprise the non-thermally conductive filler in an amount of at least 10 percent by volume based on total volume of filler, such as at least 20 percent by volume. The composition may comprise the non-thermally conductive filler in an amount of no more than 80 percent by volume based on total volume of filler, such as no more than 50. The composition may comprise the non-thermally conductive filler in an amount of 10 percent by volume to 80 percent by volume based on total volume of filler, such as 20 percent by volume to 50 percent by volume.

[0066] As discussed above, the NTC / EI filler may be present in the first component, the second component and / or the third component or higher component. The compositions disclosed herein may comprise the NTC / EI filler in an amount of at least 0.5 percent by weight based on total weight of the composition, such as at least 1 percent by weight, such as at least 1.5 percent by weight. The compositions disclosed herein may comprise the NTC / EI filler in an amount of no more than 30 percent by weight based on total weight of the composition, such as no more than 20 percent by weight, such as no more than 10 percent by weight. Thecompositions disclosed herein may comprise the NTC / EI filler in an amount of up to 30 percent by weight based on total weight of the composition, such as 0.5 percent by weight to 30 percent by weight, such as 1 percent by weight to 20 percent by weight, such as 1.5 percent by weight to 10 percent by weight.Accelerators

[0067] The compositions disclosed herein may further comprise an accelerator for accelerating the reaction of the isocyanate-containing compound and the hydroxy containing compound. As used herein, the term “accelerator” means a substance that increases the rate or decreases the activation energy of a chemical reaction in comparison to the same reaction in the absence of the accelerator. An accelerator may be either a “catalyst” (that is, without itself undergoing any permanent chemical change) or may be “reactive” (that is, undergoing a permanent chemical change).

[0068] The accelerator may comprise a nitrogen-based catalyst. The accelerator may comprise a tertiary amine, an A-heterocyclic carbene, or an amidine / guanidine. Suitable accelerators that may be used in the present disclosure include A,A-dimethylcyclohexylamine, A,A-dimethylethanolamine, A-methyl morpholine, 2,2’ -dimorpholinodiethylether, dimethylaminoethoxy ethanol, triethylenediamine, bis(2-dimethylaminoethyl)ether, N,N,N’- trimethylaminoethylethanolamine, A,A,A’,A’-tetramethyl- 1 ,6-hexanediamine, 1,3,5- tris(dimethylaminopropyl)-hexahydro-s-triazine, 1 ,8-diazabicyclo[5.4.0]undec-7-ene, N-(3- aminopropyl)imidazole, 1 ,2-dimethylimidazole, l,5,7-triazabicyclo[4.4.0]dec-5-ene, or 7- methyl-l,5,7-triazabicyclo[4.4.0]dec-5-ene.

[0069] In some cases, the accelerator may be an organic acid, such as diphenyl phosphate, methanesulfonic acid, or triflic acid.

[0070] The accelerator may be an organometallic complex. Suitable organometallic complexes include titanates, such as tetrabutyl titanate or tetrapropyl titanate, tin compounds, such as dibutyltin dilaurate, dibutyltin diacetate, tin octoate, or dibutyl tin oxide, or other metal compounds, such as chelates of bismuth, zirconium, titanium, aluminum, or iron, such as zirconium acetylacetonate or iron acetylacetonate.

[0071] The compositions disclosed herein may comprise the accelerator in an amount of at least 0.01 percent by weight based on total weight of the composition, such as at least 0.1 percent by weight. The compositions disclosed herein may comprise the accelerator in anamount of no more than 5 percent by weight based on total weight of the composition, such as no more than 4 percent by weight. The compositions disclosed herein may comprise the accelerator in an amount of 0.01 percent by weight to 5 percent by weight based on total weight of the composition, such as 0.1 percent by weight to 4 percent by weight.Dispersants

[0072] The composition optionally may further comprise a dispersant. As used herein, the term “dispersant” refers to a substance that may be added to the composition to improve the separation of the thermally conductive filler particles by wetting the particles and breaking apart agglomerates.

[0073] Suitable dispersants for use in the composition include fatty acid, phosphoric acid esters, polyurethanes, polyamines, poly acrylates, polyalkoxylates, sulfonates, polyethers, and polyesters, or any combination thereof. Non-limiting examples of commercially available dispersants include ANTI-TERRA-U100, DISPERBYK-102, DISPERBYK-103, DISPERBYK- 111 , DISPERBYK-171 , DISPERBYK-2151 , DISPERBYK-2152, DISPERBYK-2059, DISPERBYK-2000, DISPERBYK-2117, and DISPERBYK-2118 available from BYK Company; and SOLSPERSE 24000SC, SOLSPERSE 16000 and SOLSPERSE 8000 hyperdispersants available from The Lubrizol Corporation, and Tegowet 270, Tegowet 500, TEOG® Dispers 670, and Tegowet 550 available from Evonik.

[0074] The composition may comprise a dispersant in an amount of at least 0.5 percent by weight based on total weight of the composition, such as at least 1 percent by weight. The composition may comprise a dispersant in an amount of no more than 10 percent by weight based on total weight of the composition, such as no more than 5 percent by weight. The composition may comprise a dispersant in an amount of 0.5 percent by weight to 10 percent by weight based on total weight of the composition, such as 1 percent by weight to 5 percent by weight.Additives

[0075] The composition may comprise an additive. The additive may be present in the first component, the second component and / or the third or higher components of the composition. Suitable examples of additives include a rheology modifier, a tackifier, a thermoplastic polymer, a UV stabilizer, a colorant, a tint, a plasticizer, an antioxidant, a pigment, a silane, a surfactant, a flame retardant, a corrosion inhibitor, an adhesion promoter (other thanthe isocyanate-containing compound and / or the hydroxy-containing compound described above), a moisture scavenger, a coupling agent, a potlife extender, or combinations thereof. As used herein, “coupling agent” refers to a compound which provides a chemical bond between two dissimilar materials, such as an inorganic and an organic. As used herein, “potlife extenders” are chemicals that allow components to be mixed together while extending the time to cure.

[0076] Compositions provided by the present disclosure can comprise a flame retardant or combination of flame retardants. Certain thermally conductive materials such as aluminum hydroxide and magnesium hydroxide, for example, also may be flame retardants; for purposes of calculating weight percentages herein, such materials are counted as thermally conductive materials. As used herein, “flame retardant” refers to a material that slows down or stops the spread of fire or reduces its intensity. Flame retardants may be available as a powder that may be mixed with a composition, a foam, or a gel. In examples, when the compositions disclosed herein include a flame retardant, such compositions may form a coating on a substrate surface and such coating may function as a flame retardant. A flame retardant can include a mineral, an organic compound, an organohalogen, an organophosphorous compound, or a combination thereof.

[0077] The composition may comprise the additive in an amount of at least 0.1 percent by weight based on total weight of the composition, such as at least 1 percent by weight. The composition may comprise the additive in an amount of no more than 20 percent by weight based on total weight of the composition, such as no more than 10 percent by weight. The composition may comprise the additive in an amount of 0.1 percent by weight to 20 percent by weight based on total weight of the composition, such as 1 percent by weight to 10 percent by weight.Compositions

[0078] The compositions disclosed herein may comprise the hydroxy-containing compound in an amount such that an equivalence ratio of hydroxide functional groups to isocyanate functional groups from the isocyanate-containing compound is at least 1:4, such as at least 1:3, such as at least 1:2. The compositions disclosed herein may comprise the hydroxycontaining compound in an amount such that an equivalence ratio of hydroxide functional groups to isocyanate functional groups from the isocyanate-containing compound is no more than 4:1, such as no more than 3:1, such as no more than 2:1. The compositions disclosed herein maycomprise the hydroxy-containing compound in an amount such that an equivalence ratio of hydroxide functional groups to isocyanate functional groups from the isocyanate-containing compound is 1:4 to 4:1, such as 1:3 to 3:1, such as 1:2 to 2:1.

[0079] The composition may comprise the isocyanate-containing compound and the hydroxy-containing compound in a total amount of at least 9.5 percent by weight based on total weight of the composition, such as at least 15 percent by weight. The composition may comprise the isocyanate-containing compound and the hydroxy-containing compound in a total amount of no more than 49.5 percent by weight based on total weight of the composition, such as no more than 40 percent by weight. The composition may comprise the isocyanate-containing compound and the hydroxy-containing compound in a total amount of 9.5 percent by weight to 49.5 percent by weight based on total weight of the composition, such as 15 percent by weight to 40 percent by weight.

[0080] The composition may be substantially free, or essentially free, or completely free, of solvent.

[0081] When the disclosed compositions are highly loaded compositions (i.e., contained thermally conductive filler in an amount of 50 percent by weight up to 90 percent by weight based on total weight of the composition in combination with thermally expandable material in an amount of at least 0.5 percent by weight based on total weight of the composition, such as less than 10 percent by weight), the compositions were found to be pumpable (i.e., each component having a viscosity of no more than 106Pa s at a shear stress of 1 Hz measured by an Anton Paar MCR 301 rotational rheometer at 25°C using a parallel plate with a diameter of 25 mm (1 mm gap)). This was a surprising result.

[0082] The compositions disclosed herein may be formulated, for example, as a coating composition such as an adhesive composition, a structural adhesive composition, a pottant composition, a foam, a pre-preg, a liquid shim composition, a sealant composition, or a gap filler composition.Methods and Cured Coatings

[0083] The compositions described above may be applied alone or as part of a system that can be deposited in different ways onto different substrates. Accordingly, disclosed herein are methods for treating a substrate comprising, or consisting essentially of, or consisting of, contacting a surface of the substrate with any of the compositions disclosed herein. “Contactinga surface of the substrate” encompasses contacting a surface of a substrate that has been treated with other coatings, as described herein. Optionally, the method may comprise mixing the first component and second component to form the composition. The composition can be applied to the surface of a substrate in different ways, non-limiting examples of which include by brushes, by rollers, as a film, as pellets, by trowels, by spatulas, by dipping, by spray guns, and by applicator guns to form a coating on the substrate surface.

[0084] After application to the substrate(s), the composition may be cured to form a thermally expandable coating prior to expansion of the thermally expandable material. For example, the composition may be allowed to cure at room temperature or slightly thermal conditions, and for any desired time (e.g., 2 weeks under ambient conditions) sufficient to cure the composition on the substrate(s) and / or the composition may be cured by baking and / or curing under thermal conditions, provided that the thermal conditions are lower than the expansion temperature of the thermally expandable material, such as at a temperature of 180°C or below, such as 130°C or below, such as 110°C or below, such as 100°C or below, such as 90°C or below, such as 80°C or below, such as 70°C or below, but greater than ambient, such as greater than 40°C, such as greater than 50°C, and for any desired time (e.g., from 5 minutes to 24 hours) sufficient to begin curing the composition on the substrate(s). In the case of PMF, the composition may be cured by thawing. Upon cure, the composition may form a coating on the substrate surface. The coating may be, for example, an adhesive, a structural adhesive, a pottant, a pre-preg, a liquid shim, a seal, or a gap filler. The composition may be cured to form an article, such as by additive manufacturing, such as three-dimensional (“3D”) printing as described below.

[0085] The method optionally may further comprise contacting a surface of a second substrate to the composition such that the composition is between the first substrate and the second substrate. For example, the composition may be applied to either one or both of the first and second substrates such that the composition is positioned between the first and the second substrates. In examples, the substrates may be aligned, and pressure and / or spacers may be added to control bond thickness.

[0086] The composition may be applied to cleaned or uncleaned (i.e. , including oil or oiled) substrate surfaces. The compositions disclosed herein may also be applied to a substratethat has been pretreated, coated with an electrodepositable coating, and / or coated with additional coatings such as a primer, basecoat, or topcoat.

[0087] Thermally expandable coatings disclosed herein may have a pre-expansion thermal conductivity of at least 0.5 W / m-K at 25°C measured according to ASTM D7984-21 using a modified transient plane source instrument, such as at least 1 W / m-K, such as at least 2 W / m K, such as at least 3 W / m-K, such as at least 4 W / m-K, such as at least 5 W / m-K. The preexpansion thermal conductivity of the thermally expandable coatings was not reduced by the addition of the thermally expandable material.

[0088] Thermally expandable coatings disclosed herein may have a decrease in thermal conductivity post-expansion (following exposure to at least the expansion temperature of the thermally expandable material) relative to pre-expansion thermal conductivity (measured at 25°C according to ASTM D7984-21 using a modified transient plane source instrument) of at least 10%, such as at least 25%, such as at least 50%, such as at least 75%, such as at least 95%, such as at least 96%, such as at least 97%, such as at least 98%, such as at least 99%.

[0089] Following exposure to thermal conditions (e.g., at least the expansion temperature of the thermally expandable material), the thermally expandable material may have an expansion volume ratio (i.e., post-expansion volume I pre-expansion volume) of greater than 1 when measured at 25°C and by methods known to those skilled in the art, such as SEM, laserdiffraction, or LALLS, such as at least 1.1, such as at least 1.2, such as at least 1.5, such as at least 2, such as at least 2.5, such as at least 3, such as at least 4, such as at least 5, such as at least 10, such as at least 20, such as at least 50, such as at least 75, such as at least 100, such as at least 125, such as at least 175, such as at least 200.

[0090] The thermally expandable coatings disclosed herein may have a post-expansion volume ratio of greater than 1, such as at least 1.1, such as at least 1.2, such as at least 1.5, such as at least 2, such as at least 3, such as at least 5, such as at least 10, such as at least 20, wherein the post-expansion volume ratio = post-expansion volume (measured at 25°C following exposure to at least the expansion temperature of the thermally expandable material) / pre-expansion volume (measured at 25°C prior to exposure to at least the expansion temperature of the thermally expandable material) and wherein volumes are measured using a caliper and the coating is cohesive / non-crumbling.

[0091] When the disclosed compositions are highly loaded compositions (i.e., contain thermally conductive filler in an amount of 50 percent by weight up to 90 percent by weight based on total weight of the composition in combination with thermally expandable material in an amount of at least 0.5 percent by weight based on total weight of the composition, such as less than 10 percent by weight), the compositions were found to be pumpable (i.e., each component having a viscosity of no more than 106Pa-s at a shear stress of 1 Hz measured by an Anton Paar MCR 301 rotational rheometer at 25 °C using a parallel plate with a diameter of 25 mm (1 mm gap)). This was a surprising result.

[0092] The combination of properties described above was surprising and unexpected.

[0093] Articles may be formed from one of the compositions disclosed herein and cured under ambient conditions or by exposure to an external energy source as described above. The articles may be formed through extrusion, casting, molding, additive manufacturing, such as 3D- printing, subtractive manufacturing, and / or machining.Additive Manufacturing

[0094] Compositions of the present disclosure may be applied or deposited using any suitable method, including those aforementioned. Alternatively, the composition may be casted, extruded, molded, or machined to form a part or a member in a cured state.

[0095] The compositions disclosed herein may be used in any suitable additive manufacturing technology, such as three-dimensional (3D) printing, extrusion, jetting, and binder jetting. Additive manufacturing refers to a process of producing a part or member by constructing it in layers, such as one layer at a time.

[0096] The present disclosure is also directed to the production of structural articles, such as by way of a non-limiting example, sound damping pads, print gaskets, or seals, using an additive manufacturing process, such as 3D printing. 3D printing refers to a computerized process, optionally including artificial intelligence modulation, by which materials are printed or deposited in successive layers to produce a 3D part or member, such as, by way of a non-limiting example, sound damping pads in a battery assembly. A 3D part or member may be produced by depositing successive portions or layers over a base of any spatial configuration and thereafter depositing additional portions or layers over the underlying deposited portion or layer and / or adjacent to the previously deposited portion or layer to produce the 3D printed part or member.

[0097] It will be appreciated that the configuration of the 3D printing process, including the selection of suitable deposition equipment, depends on factors such as the deposition volume, the viscosity of the composition and the complexity of the part being fabricated. Any suitable mixing, delivery, and 3D printing equipment as known to those skilled in the art, may be used. Compositions may be printed or deposited in any size and / or shape of droplets or extrudate, and in any patterns to produce the 3D structure.

[0098] Compositions as disclosed herein may be applied or deposited by any suitable 3D printing method as known to those skilled in the art. First and second components of 2K compositions may be mixed and then deposited, or the first and second components may be deposited separately, such as simultaneously and / or sequentially.

[0099] The first component and the second component may be premixed, i.e., mixed together, prior to application, and then deposited. The mixture may be reacted or thermoset when the material is deposited; the deposited reaction mixture may react after deposition and may also react with previously deposited portions and / or subsequently deposited portions of the article such as underlying layers or overlying layers of the article.

[0100] In a non-limiting example, the first and second components may be released from their individual storage containers and pushed, such as pumped through conduits, such as hoses, to a mixer, such as a static or dynamic mixer, wherein the composition may be mixed for a time sufficient to homogenize the composition, wherein the composition may then be released through an outlet. The outlet may be a deposition device, such as a printing head, and / or the materials may exit the mixing unit and be pushed, such as by a pump, through a conduit, such as a hose, to the printing head. The printing head may optionally be mounted on a 3D rotational robotic arm to allow delivery of 3D print compositions to any base in any spatial configuration and / or the base may be manipulated in any spatial configuration during the 3D printing process.

[0101] Alternatively, the first component and the second component may be deposited independently from different printing heads. The first component may be deposited from one printing head and the second component may be deposited from a second printing head. The first and second components may be deposited in any pattern such that the first and second components comprising any deposited layer can react together as well as react with underlying and / or overlying layers to produce the 3D printed part or member.

[0102] Methods provided by the present disclosure include printing the composition on a fabricated part. Methods provided by the present disclosure include directly printing parts.

[0103] Parts can be fabricated using the methods provided by the present disclosure. The entire part can be formed from one of the compositions disclosed herein, one or more portions of a pail can be formed from one of the compositions disclosed herein, one or more different portions of a part can be formed using the compositions disclosed herein, and / or one or more surfaces of a part can be formed from a composition provided by the present disclosure. In addition, internal regions of a part can be formed from a composition provided by the present disclosure.Dielectric Coatings and Dielectric Systems and Kits

[0104] Any of the substrates disclosed herein may comprise a dielectric coating in addition to the coating formed from any of the compositions described above. The substrate may comprise the dielectric coating on a first substrate surface and a second coating formed from any of the compositions described above on a second substrate surface. The second coating may be an adhesive, a structural adhesive, a seal, a gap filler, a pottant, a pre-preg, or a liquid shim.

[0105] Also disclosed herein are coating systems. The coating system may comprise: a dielectric coating composition; and any of the coating compositions. In a cured state, the dielectric coating composition may form a dielectric coating. In a cured state, the coating composition may form a coating such as an adhesive, a structural adhesive, a seal, a gap filler, a pottant, a pre-preg, or a liquid shim.

[0106] Also disclosed herein are coating kits. The coating kit may comprise: a dielectric coating composition; and any of the coating compositions disclosed. The kit optionally may comprise instructions for applying the dielectric composition to a first substrate surface and the coating composition to a second substrate surface.

[0107] As used herein with respect to dielectric coatings and thermally expandable coatings, and systems and kits comprising compositions for forming the same, the first substrate surface and the second substrate surface may be on a single substrate or may be on a first substrate and a second substrate, respectively.

[0108] The dielectric coating composition and the thermally expandable coating composition may form continuous or discontinuous coatings, provided that the coatings overlap to form a coating stack, e.g., a thermally expandable coating formed from the thermallyexpandable coating composition on a dielectric coating formed from the dielectric coating composition. Such a coating stack docs not preclude the possibility of coatings in addition to the dielectric coating and the second coating, wherein such additional coatings may or may not be positioned between the dielectric coating and the second coating. Optionally, the coating stack may be formed between two substrates.

[0109] Also disclosed herein are articles comprising, consisting essentially of, or consisting of, a dielectric coating on a first portion of a substrate surface, a coating, such as an adhesive, a structural adhesive, a seal, a gap filler, a pottant, a pre-preg, or a liquid shim, formed from any of the compositions disclosed herein in contact with the dielectric coating, and a second substrate comprising a surface adjacent to the coating.

[0110] As described in more detail below, the dielectric coating may be deposited from a powder dielectric coating composition or a liquid dielectric coating composition, such as, for example, a UV dielectric coating composition or an electrodepositable dielectric coating composition.

[0111] Additional coatings may be present between the surface, the dielectric coating and / or the coating.

[0112] The dielectric coating may comprise a dielectric strength of at least 50 kV / mm, such as at least 60 kV / mm. The dielectric coating may comprise a dielectric strength of no more than 120 kV / mm, such as no more than 100 kV / mm. The dielectric coating may comprise a dielectric strength of 50 kV / mm to 120 kV / mm, such as 60 kV / mm to 100 kV / mm. The dielectric strength may be measured using a Sefelec Dielectric Strength Tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) according to ASTM D149-09.

[0113] The dielectric coating may comprise a thermal conductivity of at least 0.3 W / K-m, such as at least 0.35 W / K-m. The dielectric coating may comprise a thermal conductivity of no more than 0.5 W / K-m, such as no more than 0.45 W / K-m. The dielectric coating may comprise a thermal conductivity of 0.3 W / K-m to 0.5 W / K-m, such as 0.35 W / K-m to 0.45 W / K-m. The thermal conductivity may be measured using a TIM Thermal Resistance and Conductivity Measurement Apparatus (model LW-9389) according to ASTM D5470-17 (steady-state methods).

[0114] The dielectric coating may comprise a dielectric breakdown of at least 12 kV / mm, such as at least 15 kV / mm, such as at least 20 kV / mm, such as at least 25 kV / mm, such as at least 30 kV / mm. The dielectric breakdown may be measured using a Sefelec Dielectric Strength Tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) according to ASTM D 149-09.

[0115] The dielectric coating can be applied at any desired dry film thickness. For example, the dry film thickness may be at least 50 microns, such as at least 75 microns, such as at least 100 microns. For example, the dry film thickness may be no more than 300 microns, such as no more than 250 microns, such as no more than 200 microns. The dry film thickness may be 50 microns to 300 microns, such as 75 microns to 250 microns, such as 100 microns to 200 microns, such as 100 microns to 220 microns. It is appreciated that, when multiple dielectric coating compositions are applied, each composition can be applied to separately provide any of the previously described dry film thicknesses. For instance, when two separate dielectric coating compositions are applied, each individual dielectric coating composition can be applied at any of the previously described dry film thicknesses.

[0116] The coating layer formed from any of the compositions disclosed herein may comprise a theimal conductivity of at least 0.7 W / K-m, such as at least 0.8 W / K-m, such as at least 0.9 W / K-m, such as at least 1.0 W / K-m, such as at least 1.5 W / K-m. The coating layer may comprise a thermal conductivity of no more than 2.5 W / K-m, such as no more than 2.0 W / K-m. The coating layer may comprise a thermal conductivity of 0.7 W / K-m to 2.5 W / K-m, such as 0.8 W / K-m to 2.5 W / K-m, such as 0.9 W / K-m to 2.5 W / K-m, such as 1.0 W / K-m to 2.5 W / K-m, such as 1.5 W / K-m to 2.5 W / K-m, such as 0.7 W / K-m to 2.0 W / K-m such as 0.8 W / K-m to 2.0 W / K-m, such as 0.9 W / K-m to 2.0 W / K-m, such as 1.0 W / K-m to 2.0 W / K-m, such as 1.5 W / K-m to 2.0 W / K-m. Thermal conductivity may be measured using a TIM Thermal Resistance and Conductivity Measurement Apparatus (model LW-9389) according to ASTM D5470-17 (steadystate methods).

[0117] The coating formed from any of the compositions disclosed herein may comprise a dielectric breakdown of at least 6 kV / mm, such as at least 10 kV / mm. The coating formed from any of the compositions disclosed herein may comprise a dielectric breakdown of no more than 20 kV / mm, such as no more than 17 kV / mm. The coating formed from any of the compositions disclosed herein may comprise a dielectric breakdown of 6 kV / mm to 20 kV / mm,such as 10 kV / mm to 17 kV / mm. The dielectric breakdown may be measured using a Sefelec Dielectric Strength Tester (RMG12AC-DC; voltage limit 12.0 kV DC, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) according to ASTM D 149-09.

[0118] The compositions disclosed herein may be applied by any methods disclosed herein to form the coating.Dielectric Coating Compositions

[0119] As previously stated, the dielectric coating may be formed from a dielectric coating composition. Any suitable dielectric coating composition known in the art may be used, such as a powder coating composition or a liquid coating composition, such as a UV cured coating composition or an electrodepositable dielectric coating composition.

[0120] The dielectric coating composition may comprise a binder comprising a filmforming resin. As used herein, “film-forming resin” refers to one or more monomers, oligomers, prepolymers and / or polymers, such as homopolymers and / or copolymers, that can form a coating upon reaction with a curing agent or crosslinker, upon evaporation of a solvent, and / or upon photo or thermal activation. The dielectric coating composition may comprise any suitable filmforming resin, including organic film-forming resins and / or inorganic film-forming resins, such as silicon-based film-forming resins. Examples of suitable film- forming resins include but are not limited to polyester, alkyd, urethane, isocyanate, polyurea, epoxy, acrylic, polyether, polysulfide, polyamine, polyamide, polyvinyl chloride, polyolefin, polyvinylidene fluoride, polyvinyl chloride, polyolefin, polysiloxane, amine-aldehydes, resinous polyols, phosphatized polyepoxides, phosphatized acrylic polymers, aminoplasts, or combinations thereof.

[0121] The dielectric coating composition may optionally comprise a curing agent and / or a crosslinker that is capable of crosslinking with the film-forming resin to cure the dielectric coating composition. Any suitable curing agent and / or crosslinker that is capable of crosslinking with the film-forming resin may be used. Examples of suitable curing agents include but are not limited to amines, aminoplasts, phenoplasts, polyisocyanates, including blocked isocyanates, polyepoxides, beta-hydroxyalkylamides, polyacids, organometallic acid-functional materials, polyamines, polyamides, polysulfides, polythiols, polyenes such as polyacrylates, polyols, polysilanes and the like, or combinations thereof.

[0122] The dielectric coating composition may optionally further comprise a colorant, a pigment, an additive, a flame retardant, and / or a filler. Suitable fillers that may be used in the dielectric coating composition include a TC / EI filler, a TC / EC filler, and / or an NTC / EI filler.

[0123] The dielectric coating composition may comprise a thermoset coating composition, wherein the coating composition is cured upon crosslinking of a film-forming resin and a curing agent and / or crosslinker. Alternatively, the dielectric coating composition may comprise a thermoplastic coating composition, wherein the coating composition comprises a film-forming resin that cures upon evaporation of water and / or solvent. Alternatively, the dielectric coating composition may comprise a thermoset or thermoplastic coating composition that cures upon exposure to actinic radiation, such as ultraviolet light.

[0124] As previously stated, the dielectric coating composition may comprise a liquid coating composition or a powder coating composition. As used herein, when referring to a dielectric coating composition, “liquid” means a material having a viscosity less than 100,000 Pa-s at 25°C as measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.5 mm, and a shear rate of 1 s’1.

[0125] Suitable liquid coating compositions include but are not limited to electrodepositable coating compositions, one-component coating compositions, and / or multicomponent coating compositions.

[0126] For example, the liquid dielectric coating composition may comprise an electrodepositable coating composition. The electrodepositable coating composition may comprise one or more cationic or anionic salt group-containing film-forming resins that may be deposited onto a metal or other conductive substrate under the influence of an applied electrical potential, i.e., by electrodeposition.

[0127] In other examples, the liquid dielectric coating composition may comprise a UV curable coating composition comprising film-forming resins capable of curing upon exposure to UV radiation. Any suitable UV curable film-forming resin may be used, such as free radical polymerizable resins containing ethylenic unsaturation or olefinic double bonds and / or filmforming resins that may react through a cationic photopolymerization mechanism. Examples of suitable UV curable coating compositions that may be used include but are not limited to the RAYCRON line of UV curable coatings, commercially available from PPG Industries, Inc.

[0128] Other suitable liquid dielectric coating compositions include but are not limited to the SPECTRACRON line of solvent-based coating compositions and the AQUACRON line of water-based coating compositions, all commercially available from PPG Industries, Inc. The liquid dielectric coating may also be applied as a two-component composition where the filmforming resins and the reactive curing agent and / or crosslinker are mixed just before application of the coating composition and may optionally cure under ambient conditions without any external energy source.

[0129] Alternatively, the dielectric coating composition may comprise a powder coating composition. “Powder coating composition” as used herein refers to any dielectric coating composition in the form of a co-reactable solid in particulate form which may be substantially free, essentially free, or completely free of water and / or solvent. Suitable film-forming resins useful in dielectric powder coating compositions include those discussed in PCT Publ. No. WO 2021 / 173941A1, pars.

[0006] to

[0042] ,

[0057] to

[0068] ,

[0088] to

[0105] and

[0128] to

[0139] , incorporated herein by reference. Non-limiting examples of suitable powder compositions that may be used in the present disclosure include the polyester-based ENVIROCRON line of powder coating compositions (commercially available from PPG Industries, Inc.), silicon modified polyester compositions, epoxy-polyester hybrid compositions, and / or UV curable powder compositions.

[0130] The dielectric coating composition may be applied to a substrate by any suitable method known in the art, including but not limited to electrodeposition, coil coating, spraying, such as electrostatic spraying, flow coating, spin coating, curtain coating, brushing, dipping, hot- melt extrusion, application of a free-standing film, and / or by a fluidized bed process. Once applied to the substrate, the dielectric coating composition may be cured by any method known in the ait, such as baking, induction heating, infrared heating, and / or exposure to actinic radiation such as UV.

[0131] The powder dielectric coating compositions can be applied by any means standard in the art, such as spraying, electrostatic spraying, a fluidized bed process, and the like. The powder dielectric coating compositions can also be applied in multiple applications over a substrate (a “multi-application process”). For instance, a first dielectric powder coating composition can be applied over at least a substrate surface. A second dielectric powder coating composition can be applied over the first dielectric powder coating composition. The firstdielectric powder coating composition can be cured before the second dielectric powder coating composition is applied. Alternatively, the first and second dielectric powder coating compositions can then be cured together at the same time.

[0132] It is appreciated that the dielectric powder coating composition can be cured with multiple types of heat sources such as both convection heating and infrared radiation. For example, the dielectric powder coating composition can be partially cured with convection heating or infrared radiation, and then completely cured with a different heat source chosen from convection heating and infrared radiation.

[0133] In some examples, the dielectric powder coating composition can be cured with heat, such as convection heating within a range of 120°C to 260°C, such as 160°C to 240°C, such as 180°C to 200°C, for 1 minute to 40 minutes. The dielectric powder coating composition can also be cured with infrared radiation in which peak metal temperatures can reach 200°C to 260°C in 10 seconds. The elevated heat ramping with infrared radiation allows for fast cure times. In some examples, the dielectric powder coating composition is cured with infrared radiation to heat the composition within a range of from 140°C to 180°C for 1 to 20 minutes.Uses of the Compositions and Coatings

[0134] The compositions disclosed herein may be used to form coatings having one or more of the following properties:(a) a pre-expansion thermal conductivity of at least 0.5 W / m-K at 25°C measured according to ASTM D7984-21 using a modified transient plane source instrument, such as at least 2 W / m.K;(b) a pre-expansion thermal conductivity that was not significantly reduced by the addition of thermally expandable material;(c) a decrease in thermal conductivity post-expansion relative to pre-expansion thermal conductivity of at least 10%, such as at least 25%;(d) a post-expansion volume ratio of greater than 1, such as at least 2, wherein volumes are measured using a caliper and the coating is cohesive / non-crumbling;(e) a vertical burning test rating of V0 (measured by the UL-94 vertical flame test procedure) (a rating of V0 means that (1) no burning combustion (flaming or glowing) is observed for more than 10 seconds after a flame is removed from first and second flame exposure, (2) no glowing combustion was observed for more than 30 seconds after a flame isremoved from second flame exposure, and (3) no dripping of any flame particles that result in igniting the surgical cotton is observed);(f) a pre-expansion tensile stress of at least 0.5 MPa measured according to ASTM D412-16, such as at least 0.6 MPa, such as at least 0.7 MPa;(g) a pre-expansion tensile strain of at least 5% measured according to ASTM D412, such as at least 6%; and / or(h) thermally expandable material having an expansion volume ratio of greater than 1 when measured at by SEM, such as at least 2, following exposure to at least the expansion temperature of the thermally expandable material.

[0135] The coating may be cohesive following exposure to the expansion temperature of the thermally expandable material.

[0136] The coating may be non-cohesive / crumbling following exposure to the expansion temperature of the thermally expandable material, which can be useful for removal of the coating from a substrate surface, such as removability of a battery cell from a battery pack.

[0137] The combination of properties described above was surprising and unexpected.Substrates

[0138] Compositions described herein may be coated or deposited on, or otherwise contacted with, any substrate or surface, such as, but not limited to metals or metal alloys, polymeric materials, such as plastics including filled and unfilled thermoplastic or thermoset materials, and / or composite materials. Other suitable substrates include, but are not limited to, glass or natural materials such as wood. Substrates may include two or more of any different materials in any combination, such as, but not limited to, two different metals, or a metal and a metal alloy, or a metal and a metal alloy and one or more composite materials.

[0139] Suitable substrates may include, but arc not limited to, both flexible and rigid metal substrates such as ferrous metals, aluminum, aluminum alloys, magnesium, titanium, copper, and other metal and alloy substrates. The ferrous metal substrates may include, for example, iron, steel, and alloys thereof. Non-limiting examples of useful steel materials include cold rolled steel, nickel plated cold rolled steel, galvanized (zinc coated) steel, electrogalvanized steel, stainless steel, pickled steel, zinc-iron alloy such as GALV ANNEAL, and combinations thereof. Aluminum alloys, such as those, for example, of the 1XXX, 2XXX, 3XXX, 4XXX, 5XXX, 6XXX, 7XXX, or 8XXX series as well as clad aluminum alloys and cast aluminumalloys, such as those, for example, of the A356, 1 XX.X, 2XX.X, 3XX.X, 4XX.X, 5XX.X, 6XX.X, 7XX.X, or 8XX.X scries also may be used as the substrate. The substrate also may comprise, for example, magnesium, such as magnesium alloys of the AZ31B, AZ91C, AM60B, or EV31A series, titanium and / or titanium alloys, such as those of grades 1-36 including H grade variants, copper and copper alloys, or other non-ferrous metals, as well as alloys of these materials. The substrate may comprise a composite material such as a plastic, fiberglass and / or carbon fiber composite.

[0140] It will also be understood that the substrate may comprise a bare substrate or the substrate may be pretreated or pre-coated, at least in part, with one or more layers. Suitable pretreatment solutions may include but are not limited to a zinc phosphate pretreatment solution such as, for example, those described in U.S. Pat. Nos. 4,793,867 (col. 3, In. 5 to col. 5, In.8; col. 5, In. 64 to col. 11, In. 50) and 5,588,989, col. 1, In. 65 to col. 10, In. 40), or a zirconium containing pretreatment solution such as, for example, those described in U.S. Pat. Nos.7,749,368 (col. 1, In. 55 to col. 14, In. 67) and 8,673,091 (col. 1, In. 53 to col. 18, In. 33) the cited portions of which are incorporated herein by reference.

[0141] The substrate may be in any form, such as, without limitation, a sheet, a foil, a laminate foil, a pad, a fabricated part, a component, or an article. Compositions comprising the materials disclosed herein may be used to coat a substrate, such as by depositing, applying or contacting the compositions to a substrate surface. The compositions, in an at least partially cured state, may be used in any form, such as but not limited to, a coating, a sealant, an adhesive, a pottant or an encapsulant, such as a solid or gel, a pad, such as a pad formed in-situ or a discrete pre-manufactured or pre-formed pad.

[0142] In examples, the substrate may be a multi-metal article. As used herein, the term “multi-metal article” refers to (1) an article that has at least one surface comprised of a first metal and at least one surface comprised of a second metal that is different from the first metal, (2) a first article that has at least one surface comprised of a first metal and a second article that has at least one surface comprised of a second metal that is different from the first metal, or (3) both (1) and (2).

[0143] The compositions disclosed herein are not limited and may be particularly suitable for use in various transportation applications including automotive applications, commercial transport applications, rail locomotive, marine applications and / or aerospaceapplications. Suitable substrates for use in the present disclosure include those that are used in the assembly of vehicular bodies (for example., without limitation, door, body panel, trunk deck lid, roof panel, hood, roof and / or stringers, rivets, landing gear components, and / or skins used on an aircraft), vehicular frames, vehicular parts, motorcycles, wheels, and industrial structures and components. As used herein, “vehicle” or variations thereof includes, but is not limited to, civilian vehicles, light and heavy commercial vehicles, civilian and military aircraft, and / or land vehicles such as cars, motorcycles, and / or trucks. The compositions disclosed herein also may be suitable for use in various industrial applications including appliances, personal electronic devices, circuit boards, and the like, or combinations thereof.

[0144] FIGS. 1 to 9 illustrate non-limiting examples of battery assembly components and constructions as well as non-limiting applications or use of compositions as disclosed herein in said battery assemblies. Although FIGS. 1 to 9 illustrate specific examples of cell shapes and cell arrangements, cells may be arranged in any configuration known to those skilled in the art. Additionally, the compositions disclosed herein, in an at least partially cured state, may be used to form pads, adhesives, coatings, pottants and the like, to provide thermal protection between battery cells, within battery modules and / or within battery packs. These materials may be used on any surface or in any space within such battery assemblies. For example, compositions disclosed herein also may be useful in battery assemblies including, but not limited to, cell to module (FIGS. 3, 4, 6B), module to pack (FIGS. 6C, 7), cell to pack (FIG. 8), and cell to chassis battery assemblies (FIG. 9). Such battery assemblies may be used in, but not limited to, any aforementioned application.

[0145] Battery assemblies may be any combination of one or more battery cells, the interconnects which provide electrical conductivity between them, as well as ancillary components such as, in non-limiting examples, control electronics and components that ensure the necessary structural mechanical and environmental requirements for the operation of a specific battery (for example, without limitation, cell interconnectors such as wires, battery pack enclosures including trays and lids, module enclosures, module frames and frame plates, module racking, cooling and heating components including cooling plates, cooling fins, and cooling tubes, electrical busbars, battery management systems, battery thermal management systems, chargers, inverters and converters).

[0146] Battery cells 10 are generally single unit energy storage containers that may be connected in series or in parallel. Battery cells may be any suitable size or shape known to those skilled in the ait, such as but not limited to, cylindrical (FIGS. 1, 4 and 9), prismatic (FIGS. 2, 5- 8) and / or pouch (FIG. 3). Battery cells 10 are enclosed to provide desired mechanical protection and environmental isolation of the cell. For example, cylindrical and prismatic cells may be encased in metal cans, cases, and lids, while pouch cells may be enclosed in multilayer laminate foils. Battery terminals 1 connect the electrodes inside the battery cell to the electrical circuit outside the battery cell, with one being a positive terminal and the other being a negative terminal. As illustrated in FIG. 4, battery cells 10 may be connected by interconnector wires 5 with other battery cells 10 in series or in parallel to enable an electric current to flow between cells 10.

[0147] As illustrated in FIGS. 3 and 4, battery cells 10 may be arranged in modules 100 comprising multiple cells 10 connected in series or in parallel. The modules 100 may include an at least partial enclosure of the arranged cells 10. Ancillary components, such as those aforementioned, may be included. Spaces of any dimensions may be located between the plurality of cells, ancillary components, base, and / or any interior surface of the module wall or other enclosure 120.

[0148] FIG. 1 illustrates a top-down view of cylindrical battery cells 10 having terminals 1. As shown, the cells are arranged in rows with either cooling tubes 3 or dielectric insulation paper (e-paper) 4 between them. As shown, materials, such as adhesive 6 and / or pottants 7 formed from the compositions disclosed herein in an at least partially cured state, may be positioned between the cells 10, cooling tubes 3 and / or e-paper 4. Optionally, e-paper 4 may be replaced by a coating formed from one of the compositions disclosed herein.

[0149] FIG. 2 illustrates an exploded isometric view of an array of prismatic battery cells 10. As shown, each prismatic cell 10 may comprise a top 11, a bottom, and walls 13 positioned between the top and bottom and each having a surface. As shown, materials, such as pads 8 formed from the compositions disclosed herein in an at least partially cured state, may be positioned between surfaces of cell walls 13 of adjacent cells 10.

[0150] FIG. 3 illustrates a cut-out front view of an array of pouch battery cells 10 in a module 100. The module walls 120 at least partially encase the cells 10. As shown, materials,such as pads 8 formed from the compositions disclosed herein in an at least partially cured state, may be positioned between surfaces of cells 10.

[0151] FIG. 4 illustrates an isometric view of cylindrical cells 10 in a battery module 100. Each cell may comprise a top 11, a bottom 12, and walls 13 positioned between the top and bottom and each having a surface. The top 11 and the bottom 12 may be oppositely charged terminals with one being a positive terminal 1 and the other being a negative terminal (not shown). The battery cells may be connected at their terminals by interconnectors such as wires 5 and the like to enable an electric current to flow between the electric cells. The module 100 or module walls 120 may form a space having a volume. The cells 10 may be positioned within the space to consume a portion of the volume. The material, such as a pottant 7 formed from the compositions disclosed herein, may be positioned within the space to consume at least a portion of the volume such that the material is adjacent to a surface of a cell wall 13 and / or an interior surface of at least one of the walls 120 of the module 100.

[0152] FIG. 5 illustrates an exploded perspective view of a battery module 100 comprised of one or more arrays of battery cells 10, a cooling fin 230, and a cooling plate 240. Materials, such as pads 8 formed from the compositions disclosed herein in an at least partially cured state, may be positioned between cells 10. Additional pads 8 may be positioned between the cells 10, the cooling fin 230, the cooling plate 240, and / or an interior surface of walls 120. Other pads 8 may be positioned adjacent to an exterior surface of the walls 120.

[0153] FIG. 6 illustrates an isometric view of a battery cell 10 (FIG. 6A) to battery module 100 (FIG. 6B) to battery pack 200 (FIG. 6C) battery assembly. The battery module 100 comprises a plurality of battery cells 10 and the battery pack 200 comprises a plurality of battery modules 100.

[0154] FIG. 7 illustrates a perspective view of a battery pack 200 cutout. The battery pack 200 includes a plurality of battery modules 100 and cells 10 within each module 100. The base of the battery pack 200 comprises a cooling plate 240. Materials, such as adhesives, 9 formed from the compositions disclosed herein in an at least partially cured state, may be positioned between the cooling plate 240 and interior surface of a wall of the battery pack 200. Materials, such as pads 8 formed from the compositions disclosed herein in an at least partially cured state, may be positioned between cells 10 within modules 100.

[0155] FIG. 8 illustrates an isometric view of a cell 10 to pack battery 200 assembly. Cells 10 are arranged within the pack 200 (without being in separate modules).

[0156] In other cases, the battery cells may be arranged on or within an article such as, but not limited to, a cell to chassis battery assembly, as illustrated in FIG. 9, wherein one or more cells is used to construct the battery assembly without prior assembly of the cells into modules and / or packs. FIG. 9 illustrates an isometric cut-out view of a cell to chassis battery assembly 300. Cells 10 are arranged on a base comprising the undercarriage 55 and supported by the vehicle frame 45 and under the vehicle interior floor 35.

[0157] Any battery assembly may further comprise a thermal management system comprising air or fluid circuits which may be liquid based (for example glycol solutions) or direct refrigerant based.Definitions

[0158] For purposes of this detailed description, it is to be understood that the disclosure may assume alternative variations and step sequences, except where expressly specified to the contrary.

[0159] The numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard variation found in their respective testing measurements.

[0160] Also, it should be understood that any numerical range recited herein is intended to include all sub-ranges subsumed therein. For example, a range of “1 to 10” is intended to include all sub-ranges between (and including) the recited minimum value of 1 and the recited maximum value of 10, that is, having a minimum value equal to or greater than 1 and a maximum value of equal to or less than 10.

[0161] As used herein, “including,” “containing” and like terms are understood in the context of this application to be synonymous with “comprising” and are therefore open-ended and do not exclude the presence of additional undescribed or unrecited elements, materials, ingredients or method steps. As used herein, “consisting of’ is understood in the context of this application to exclude the presence of any unspecified element, ingredient or method step. As used herein, “consisting essentially of’ is understood in the context of this application to include the specified elements, materials, ingredients or method steps “and those that do not materiallyaffect the basic and novel characteristic(s)” of what is being described. As used herein, open- ended terms include closed terms such as consisting essentially of and consisting of.

[0162] In addition, in this application, the use of “or” means “and / or” unless specifically stated otherwise, even though “and / or” may be explicitly used in certain instances.

[0163] As used herein, the terms “on,” “onto,” “applied on,” “applied onto,” “formed on,” “deposited on,” “deposited onto,” and the like mean formed, overlaid, deposited, or provided on, but not necessarily in contact with, a substrate surface. For example, a composition “applied onto” a substrate surface does not preclude the presence of one or more other intervening coating layers or films of the same or different composition located between the composition and the substrate surface.

[0164] As used herein, a “coating composition” refers to a composition, e.g., a solution, mixture, or a dispersion, that, is capable of producing a coating on a portion of a substrate surface.

[0165] “Coating” as used herein includes films, layers and the like.

[0166] As used herein, a “sealant composition” refers to a curable composition that, when cured, forms a seal.

[0167] As used herein, a “seal” refers to a cured coating that can provide a protective barrier against moisture, chemicals, and other environmental factors, preventing corrosion and extending the lifespan of components.

[0168] As used herein, an “adhesive composition” refers to a curable composition that, when cured, forms an adhesive or a structural adhesive.

[0169] As used herein, an “adhesive” refers to a cured coating that produces a loadbearing joint.

[0170] As used herein, a “structural adhesive” refers to a cured coating that produces a load-bearing joint having a lap shear strength of at least 5 MPa measured according to ASTM D 1002- 10 using an Instron 5567 machine in tensile mode with a pull rate of 1.3 mm per minute.

[0171] As used herein, a “gap filler composition” refers to a curable composition that, when cured, forms a gap filler.

[0172] As used herein, a “gap filler” refers to a coating that fills a gap.

[0173] As used herein, a “pottant composition” refers to a curable composition that, when cured, forms a pottant.

[0174] As used herein, a “pottant” refers to an encapsulant.

[0175] As used herein, a “pre-preg” refers to a composition pre-impregnating reinforcement fiber prior to cure.

[0176] As used herein, a “liquid shim composition” refers to a curable composition that, when cured, forms a liquid shim.

[0177] As used herein, a “liquid shim” refers to a coating that eliminates gaps between substrate surfaces.

[0178] As further defined herein, “ambient conditions” generally refer to room temperature (e.g. 23°C) and humidity conditions or temperature and humidity conditions that are typically found in the area in which the composition is applied to a substrate, e.g., at 10°C to 40°C and 5% to 80% relative humidity, while “slightly thermal” conditions are temperatures that are slightly above ambient conditions but are generally below the curing temperature for the composition (i.e., in other words, at temperatures and humidity conditions below which the reactive components will readily react and cure, e.g., > 40°C and less than 220°C at 20% to 80% relative humidity).

[0179] As used herein, the term “two-component” or “2K” refers to a composition in which at least a portion of the reactive components readily associate to form an interaction or react to form a bond (physically or chemically), i.e., cure, without activation from an external energy source, such as at ambient or slightly thermal conditions, when mixed. One of skill in the art understands that the two components of the composition are stored separately from each other and mixed just prior to application of the composition. Two-component compositions may optionally be heated or baked, as described below.

[0180] As used herein, the terms “cure,” “cured,” “curing,” means that the components that form the composition are crosslinked (i.e., interact and / or react) to form a coating or a bond. In the case of a 2K composition, the composition begins to cure when the components of the composition are mixed resulting in the reaction of the reactive functional groups of the components of the composition.

[0181] The term “curable,” as used in connection with a coating composition, means that the composition is able to be cured under ambient and / or slightly thermal conditions.

[0182] As used herein, the term “cohesive,” when used with respect to a coating, means the expanded coating (a coating that has been exposed to at least the expansion onset temperatureof the thermally expanded material) is held together as part of a single mass, i.e., the expanded coating docs not crumble.

[0183] As used herein, the term “non-cohesive,” when used with respect to a coating, means the expanded coating (a coating that has been exposed to at least the expansion onset temperature of the thermally expanded material) is not held together as part of the same mass, i.e., the expanded coating crumbles.

[0184] As used herein, “isocyanate equivalent weight” refers to the total weight of isocyanate-containing components divided by the molar equivalents of isocyanate functionality. The value may be determined from the isocyanate content as measured in accordance with ASTM D2572-19.

[0185] “Hydroxyl equivalent weight” refers to the total weight of hydroxyl-containing component divided by the molar equivalents of hydroxyl functionality, which may be determined, for example, in accordance with ASTM D4247-23.

[0186] As used herein, the term “monofunctional,” when used with respect to a particular functional group, refers to a molecule containing only one such functional.

[0187] As used herein, the term “difunctional,” when used with respect to a particular functional group, refers to a molecule containing two such functional groups.

[0188] As used herein, the term “polyfunctional,” when used with respect to a particular functional group, refers to a molecule containing more than two such functional groups.

[0189] As used herein, “Mn” refers to the number average molecular weight, for example the theoretical value as determined by Gel Permeation Chromatography using Waters 2695 separation module with a Waters 410 differential refractometer, polystyrene standards, using tetrahydrofuran as the eluent at a flow rate of 1 mL min-1and two PL Gel Mixed C columns for separation.

[0190] As used herein, “polymer” refers to oligomers, homopolymers, and copolymers.

[0191] As used herein, “small molecule” refers to a molecule that comprises discrete chemical structures, has a molecular’ weight of less than 400 g / mol and that is not a polymer (i.e., is not composed of repeating units). The molecular weight of a small molecule may be determined by mass spectrometry. Appropriate mass spectrometry methods for various types of small molecules are available in many references, such as Mass Spectrometry: A Textbook (3rdEdition, 2018, edited by Jurgen Gross).

[0192] As used herein, the term “thermally conductive filler” or “TC” filler means a pigment, filler, or inorganic powder that has a thermal conductivity of at least 5 W / m K at 25°C (measured according to ASTM D7984-21).

[0193] As used herein, the term “non-thermally conductive filler” or “NTC filler” means a pigment, filler, or inorganic powder that has a thermal conductivity of less than 5 W / m K at 25°C (measured according to ASTM D7984-21).

[0194] As used herein, the term “electrically insulative filler” or “El filler” means a pigment, filler, or inorganic powder that has a volume resistivity of at least 1 Q-m (measured according to ASTM D257-19).

[0195] As used herein, the term “electrically conductive filler” or “EC filler” means a pigment, filler, or inorganic powder that has a volume resistivity of less than 1 Q-m (measured according to ASTM D257-19).

[0196] As used herein, the term “solvent” refers to a molecule or a compound that is used to lower the viscosity of a resin, volatilizes under ambient conditions, and does not have a reactive functional group capable of reacting with molecules or compounds in a composition.

[0197] As used herein, the term “reactive diluent” refers to a molecule or a compound that is used to lower the viscosity of a resin but that has at least one functional group capable of reacting with molecules or compounds in a composition.

[0198] As used herein, the term “plasticizer” refers to a molecule or a compound that does not have a functional group capable of reacting with molecules or compounds in a composition, does not volatilize under ambient conditions, and that is added to the composition to decrease viscosity, decrease glass transition temperature (Tg), and imparl flexibility and that does not volatilize under ambient conditions.

[0199] As used herein, unless indicated otherwise, the term “substantially free” means that a particular- material is not purposefully added to a mixture or composition, respectively, and is present only as an impurity in a trace amount of less than 0.05% by weight based on a total weight of the mixture or composition, respectively. As used herein, unless indicated otherwise, the term “essentially free” means that a particular material is present only in an amount of less than 0.01% by weight based on a total weight of the mixture or composition, respectively. As used herein, unless indicated otherwise, the term “completely free” means that a mixture orcomposition, respectively, does not comprise a particular material, i.e., the mixture or composition comprises 0% by weight of such material.Aspects

[0200] In view of the foregoing description, the present disclosure relates to the following Aspects 1 to 71 without being limited thereto.

[0201] 1. A composition, comprising: a first component comprising a first compound comprising an isocyanate functional group; a second component comprising a second compound comprising a hydroxy -containing compound; a thermally expandable material; and a thermally conductive filler in an amount of 50 percent by weight to 90 percent by weight based on total weight of the composition.

[0202] 2. The composition of aspect 1, wherein:(a) the first compound comprises a monomer, a small molecule, and / or a polymer; and / or(b) the second compound comprises a monomer, a small molecule, and / or a polymer.

[0203] 3. The composition of aspect 1 or aspect 2, wherein the first compound comprises two or more isocyanate-functional groups.

[0204] 4. The composition of any of the preceding aspects, wherein the first compound comprises an isocyanate equivalent weight of at least 70 g / eq, such as at least 90 g / eq.

[0205] 5. The composition of any of the preceding aspects, wherein the first compound comprises an isocyanate equivalent weight of less than 400 g / eq, such as no more than 300 g / eq.

[0206] 6. The composition of any of the preceding aspects, wherein the first compound comprises an isocyanate equivalent weight of 70 g / eq to less than 400 g / eq, such as 90 g / eq to 300 g / eq.

[0207] 7. The composition of any of aspects 1 to 3, wherein the first compound comprises an isocyanate equivalent weight of at least 400 g / eq, such as at least 500 g / eq.

[0208] 8. The composition of any of aspects 1 to 3 and 7, wherein the first compound comprises an isocyanate equivalent weight of no more than 3,000 g / eq, such as no more than 2,000 g / eq.

[0209] 9. The composition of any of aspects 1 to 3, 7, and 8, wherein the first compound comprises an isocyanate equivalent weight of 400 g / eq to 3,000 g / eq, such as 500 g / eq to 2,000 g / eq.

[0210] 10. The composition of any of the preceding aspects, wherein the second compound comprises a hydroxy equivalent weight of at least 70 g / eq, such as at least 90 g / eq.

[0211] 11. The composition of any of the preceding aspects, wherein the second compound comprises a hydroxy equivalent weight of less than 400 g / eq, such as no more than 300 g / eq.

[0212] 12. The composition of any of the preceding aspects, wherein the second compound comprises a hydroxy equivalent weight of 70 g / eq to less than 400 g / eq, such as 90 g / eq to 300 g / eq.

[0213] 13. The composition of any of aspects 1 to 9, wherein the second compound comprises a hydroxy equivalent weight of at least 400 g / eq, such as at least 500 g / eq.

[0214] 14. The composition of any of aspects 1 to 9 and 13, wherein the second compound comprises a hydroxy equivalent weight of no more than 3,000 g / eq, such as no more than 2,000 g / eq.

[0215] 15. The composition of any of aspects 1 to 9, 13, and 14, wherein the second compound comprises a hydroxy equivalent weight of 400 g / eq to 3,000 g / eq, such as 500 g / eq to 2,000 g / eq.

[0216] 16. The composition of any of the preceding aspects, wherein the thermally conductive filler comprises a TC / EI filler and / or a TC / EC filler, and wherein the composition optionally further comprises an NTC / EI filler.

[0217] 17. The composition of aspect 16, comprising the thermally conductive filler in an amount of at least 20 percent by volume based on total volume of filler, such as at least 50 percent by volume.

[0218] 18. The composition of aspect 16 or aspect 17, comprising the thermally conductive filler in an amount of 100 percent by volume based on total volume of filler.

[0219] 19. The composition of any of aspect 16 or aspect 17, comprising the thermally conductive filler in an amount of no more than 90 percent by volume based on total filler volume, such as no more than 80 percent by volume.

[0220] 20. The composition of any of aspects 16, 17, or 19, comprising the thermally conductive filler in an amount of 20 percent by volume to 100 percent by volume based on total filler volume, such as 20 percent by volume to 90 percent by volume.

[0221] 21. The composition of any of aspects 16, 17, 19, or 20, comprising the thermally conductive filler in an amount of 50 percent by volume to 90 percent by volume based on total filler volume, such as 50 percent by volume to 80 percent by volume.

[0222] 22. The composition of any of the preceding aspects, comprising the thermally conductive filler in an amount of at least 59 percent by weight based on total weight of the composition.

[0223] 23. The composition of any of the preceding aspects, comprising the thermally conductive filler in an amount of no more than 84 percent by weight based on total weight of the composition.

[0224] 24. The composition of any of the preceding aspects, comprising the thermally conductive filler in an amount of 59 percent by weight to 84 percent by weight based on total weight of the composition.

[0225] 25. The composition of any of the preceding aspects, wherein the thermally expandable material comprises an inorganic salt, thermally expandable graphite, and / or a thermally expandable capsule, such as a thermally expandable capsule comprising a thermoplastic resin and / or a volatile material.

[0226] 26. The composition of any of the preceding aspects, wherein the thermally expandable material has an expansion temperature of at least 60°C, such as at least 90°C.

[0227] 27. The composition of any of the preceding aspects, wherein the thermally expandable material has an expansion temperature of no more than 250°C, such as 60°C to 250°C.

[0228] 28. The composition of any of the preceding aspects, comprising the thermally expandable material in an amount of at least 0.5 percent by weight based on total weight of the composition, such as at least 1 percent by weight.

[0229] 29. The composition of any of the preceding aspects, comprising the thermally expandable material in an amount of no more than 20 percent by weight based on total weight of the composition, such as no more than 10 percent by weight, such as less than 10 percent by weight.

[0230] 30. The composition of any of the preceding aspects, comprising the thermally expandable material in an amount of 0.5 percent by weight to 20 percent by weight based on total weight of the composition, such as 1 percent by weight to 10 percent by weight.

[0231] 31. The composition of any of the preceding aspects, further comprising an accelerator, a dispersant, and / or an additive.

[0232] 32. The composition of aspect 31, comprising the accelerator in an amount of at least 0.01 percent by weight based on total weight of the composition, such as at least 0.1 percent by weight.

[0233] 33. The composition of aspect 31 or aspect 32, comprising the accelerator in an amount of no more than 5 percent by weight based on total weight of the composition, such as no more than 4 percent by weight.

[0234] 34. The composition of any of aspects 31 to 33, comprising the accelerator in an amount of 0.01 percent by weight to 5 percent by weight based on total weight of the composition, such as 0.1 percent by weight to 4 percent by weight.

[0235] 35. The composition of any of aspects 31 to 34, comprising the dispersant in an amount of at least 0.5 percent by weight based on total weight of the composition, such as at least 1 percent by weight.

[0236] 36. The composition of any of aspects 31 to 35, comprising the dispersant in an amount of no more than 10 percent by weight based on total weight of the composition, such as no more than 5 percent by weight.

[0237] 37. The composition of any of aspects 31 to 36, comprising the dispersant in an amount of 0.5 percent by weight to 10 percent by weight based on total weight of the composition, such as 1 percent by weight to 5 percent by weight.

[0238] 38. The composition of any of aspects 31 to 37, comprising the additive in an amount of at least 0.1 percent by weight based on total weight of the composition, such as at least 1 percent by weight.

[0239] 39. The composition of any of aspects 31 to 38, comprising the additive in an amount of no more than 20 percent by weight based on total weight of the composition, such as no more than 10 percent by weight.

[0240] 40. The composition of any of aspects 31 to 39, comprising the additive in an amount of 0.1 percent by weight to 20 percent by weight based on total weight of the composition, such as 1 percent by weight to 10 percent by weight.

[0241] 41. The composition of any of the preceding aspects, wherein the isocyanate- containing compound and the hydroxy -containing compound are present in a total amount of at least 9.5 percent by weight based on total weight of the composition, such as at least 15 percent by weight.

[0242] 42. The composition of any of the preceding aspects, wherein the isocyanate- containing compound and the hydroxy-containing compound are present in a total amount of no more than 49.5 percent by weight based on total weight of the composition, such as no more than 40 percent by weight.

[0243] 43. The composition of any of the preceding aspects, wherein the isocyanate- containing compound and the hydroxy -containing compound are present in a total amount of 9.5 percent by weight to 49.5 percent by weight based on total weight of the composition, such as 15 percent by weight to 40 percent by weight.

[0244] 44. The composition of any of the preceding aspects, comprising the first compound and the second compound in an equivalence ratio of at least 1:4, such as at least 1:2.

[0245] 45. The composition of any of the preceding aspects, comprising the first compound and the second compound in an equivalence ratio of no more than 4:1, such as no more than 2:1.

[0246] 46. The composition of any of the preceding aspects, comprising the first compound and the second compound in an equivalence ratio of 1:4 to 4:1, such as 1:2 to 2:1.

[0247] 47. The composition of any of the preceding aspects, formulated as a coating composition such as an adhesive composition, a structural adhesive composition, a pottant composition, a foam, a pre-preg, a liquid shim composition, a sealant composition, or a gap filler composition.

[0248] 48. The composition of any of the preceding aspects, wherein the thermally expandable material has an expansion volume ratio of at least 5, such as at least 25.

[0249] 49. The composition of any of the preceding aspects, wherein the thermally expandable material has an expansion volume ratio of no more than 250.

[0250] 50. The composition of any of the preceding aspects, wherein the thermally expandable material has an expansion volume ratio of 5 to 250, such as 25 to 250.

[0251] 51. A substrate comprising a coating formed from the composition of any of the preceding aspects on a surface thereof.

[0252] 52. The substrate of aspect 51, further comprising a dielectric coating on the surface.

[0253] 53. The substrate of aspect 51 or aspect 52, wherein the substrate comprises a battery cell.

[0254] 54. A battery comprising the substrate of aspect 53, and optionally a battery component.

[0255] 55. A vehicle comprising the battery of aspect 54, such as a land vehicle and / or an aerospace vehicle.

[0256] 56. A method for treating a substrate comprising contacting a surface of the substrate with the composition of any of aspects 1 to 50.

[0257] 57. A use of the composition of any of aspects 1 to 50 for forming a coating having a prc-cxpansion thermal conductivity of at least 0.5 W / m-K at 25°C measured according to ASTM D7984-21 using a modified transient plane source instrument, such as at least 2 W / m.K.

[0258] 58. The use of aspect 57, wherein the coating has a decrease in thermal conductivity post-expansion relative to pre-expansion thermal conductivity of at least 10%, such as at least 25%.

[0259] 59. The use of aspect 57 or aspect 58, wherein the coating has a postexpansion volume ratio of greater than 1, such as at least 2, wherein volumes are measured using a caliper and the coating is cohesive / non-crumbling.

[0260] 60. The use of any of aspects 57 to 59, wherein the coating has a vertical burning test rating of V0 (measured by the UL-94 vertical flame test procedure).

[0261] 61. The use of any of aspects 57 to 60, wherein the coating has a preexpansion tensile stress of at least 0.5 MPa measured according to ASTM D412, such as at least 0.6 MPa, such as at least 0.7 MPa.

[0262] 62. The use of any of aspects 57 to 61, wherein the coating has a preexpansion tensile strain of at least 5% measured according to ASTM D412, such as at least 6%.

[0263] 63. The use of any of aspects 57 to 62, wherein the thermally expandable material has an expansion volume ratio of greater than 1 when measured at by SEM, such as at least 2, following exposure to at least the expansion temperature of the thermally expandable material.

[0264] 64. The use of any of aspects 57 to 63, wherein the coating has a preexpansion thermal conductivity that was not significantly reduced by the addition of thermally expandable material.

[0265] 65. The use of any of aspects 57 to 64, wherein the coating is cohesive following exposure to the expansion temperature of the thermally expandable material.

[0266] 66. The use of any of aspects 57 to 65, wherein the coating is non-cohesive and / or crumbling following exposure to the expansion temperature of the thermally expandable material.

[0267] 67. A system comprising: a dielectric coating composition for application to a surface of a substrate; and the composition of any of aspects 1 to 50 for application on the dielectric coating composition.

[0268] 68. A kit comprising: a dielectric coating composition for application to a surface of a substrate; and the composition of any of aspects 1 to 50 for application on the dielectric coating composition.

[0269] 69. The system or kit of aspect 67 or aspect 68, further comprising instructions for applying the dielectric coating composition and the composition.

[0270] 70. The system or kit of any of aspects 67 to 69, wherein the dielectric coating composition comprises: a binder comprising a film- forming resin such as a polyester, alkyl, urethane, isocyanate, polyurea, epoxy, acrylic, polyether, polysulfide, polyamine, polyamide, polyvinyl chloride, polyolefin, polyvinylidene fluoride, polyvinyl chloride, polyolefin, polysiloxane, aminealdehydes, resinous polyols, phosphatized polyepoxides, phosphatized acrylic polymers, aminoplasts, or combinations thereof; and / or a curing agent and / or crosslinker capable of crosslinking with the film-forming resin to cure the dielectric coating composition, such as an amine, aminoplast, phenoplast,polyisocyanate, including blocked isocyanate, polyepoxide, beta-hydroxyalkylamide, polyacid, organometallic acid-functional material, polyaminc, polyamide, polysulfidc, polythiol, polyene such as polyacrylate, polyol, polysilane and the like, or combinations thereof.

[0271] 71. The system or kit of any of aspects 67 to 70, wherein the dielectric coating composition comprises a powder coating composition and / or a liquid coating composition such as an electrodepositable coating composition, a UV-curable coating composition, and / or a solvent-based coating composition.

[0272] The following examples are intended to illustrate the disclosure and should not be construed as limiting the disclosure in any way.EXAMPLESSynthesis - Prepolymer A - TABLE 11DESMODUR W is commercially available from Covesro.2Dibutyl tin dilaurate is commercially available from Evonik Industries.3Pluracol P2010R is commercially available from BASF.

[0273] Part #1 was added to a 2000-mililiter, 4-necked round flask equipped with a motor driven stainless steel stir blade, a water-cooled condenser, a nitrogen blanket, and a heating mantle with a thermometer connected through a temperature feedback control device. Part #2 was then added to the flask. Then the reaction mixture was heated to 90°C. The reaction mixture was maintained at 90°C until the NCO equivalent weight was stalled. Then the reaction mixture was cooled to 40°C and poured into an appropriately sized container. The final NCO equivalent weight was 1119 g / eq which was determined by Titration and Mw was 10611 g / mol which was determined by Gel Permeation Chromatography (GPC).

[0274] As used herein, the “NCO equivalent weight” was determined by titration of a sample using a Metrohm 808 or 888 Titrando, using a sample 1 g per 420 g / eq of predicted NCO equivalent weight and dissolving the sample in 30mL of a solution comprised of 20 mL of dibutylamine and 980 mL of n-methyl pyrrolidone, followed by titration with 0.2 N HC1 solution in isopropanol titration agent.

[0275] The compositions described below were prepared according to the following procedures with all non-manual mixing performed using a Speedmixer DAC 600FVZ (commercially available from FlackTek, Inc.).

[0276] For Compositions 1 to 5, part A was prepared by combining all of the components listed under “Resins and dispersants” in the tabulated order. The materials were mixed on the DAC mixer for 1-2 minutes at 2000 rpm. The “Fillers” were then added, and the mixture was mixed for 1-2 minutes at 2000 rpm. The mixture was examined with a spatula and mixed manually. As necessary, the high-speed mixing was repeated to ensure uniformity. For part B, each component listed under “Resins, catalyst and dispersant” were added to a container separate from part A in the tabulated order. The material was mixed for 1-2 minutes at 2000 rpm. The “Fillers” were then added, and the mixture was mixed for 1-2 minutes at 2000 rpm. The mixture was examined with a spatula and mixed manually. As necessary, the high-speed mixing was repeated to ensure uniformity. At the application stage, pails A and B were combined and mixed at 2000 rpm for 1-2 minutes. The mixed parts A and B were pressed into sheets (3 mm thickness) using a Carver laboratory press (commercially available from Fred S. Carver. Inc.). The sheets were subsequently cured at ambient temperature for 7 days.

[0277] Samples of Compositions 1 to 5 for testing tensile strength were prepared by cutting the cured sheets into tensile samples (i.e., “dogbones”). The tensile properties were measured by ASTM D412-19 using an Instron model 3345.

[0278] Samples of Compositions 1 to 5 for testing thermal conductivity and thermal expansion were prepared by cutting out circular pieces (diameter ~33 mm). The dimensions of each sample were measured pre- and post-expansion using a caliper, and these metrics were used to determine the volume expansion ratio (AV). Thermal expansions were performed in an oven preheated to 120°C. Each sample was thermally expanded with a weight (weight 500 g and diameter 40 mm) to exert a pressure of 3.2 kPa.

[0279] Thermal conductivity of each sample of Compositions 1 to 5 was measured pre- and post-expansion using a TCi Thermal Conductivity Analyzer (commercially available from C-therm). Thermal conductivity samples were prepared via casting a sample into a mold to obtain a sample with at least 30 mm in diameter and 5 mm in height and allowing the composition to cure as described above. Thermal conductivity was then measured according to ASTM D7984-21 using a modified transient plane source MTPS instrument from C-Therm Technologies Ltd. on samples. If the thermal conductivity of the sample fell below the polymer material calibration method range, the foam materials method was used with no contact agent. Results are provided in Table 2.Table 2. Mechanical and Thermal Properties of Compositions 1 to 51cycloaliphatic diisocyanate available from Covestro AG2dicyclohexylmethane diisocyanate-terminated polyether prepolymer based on polypropylene glycol available from Covestro AG3aliphatic polyisocyanate (HDI trimer) available from Covestro AG4poly tetrahydrofuran polyol available from BASF5PPG polyether polyol available from BASF6trifunctional polyol available from BASF7polyester polyol available from Cargill

[0280] The results in Table 2 demonstrate that tensile strength is maintained upon addition of the thermally expandable material to the compositions disclosed herein. Additionally, the thermal conductivity of a coating formed from a composition comprising a thermally expandable material falls after a thermal event as a result of expansion. In contrast, compositions that do not contain thermally expandable material maintain the same thermal conductivity.

[0281] Whereas specific aspects of the disclosure have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limiting as to the scope of the disclosure which is to be given the full breadth of the claims appended and any and all equivalents thereof.

Claims

We claim:

1. A composition, comprising: a first component comprising a first compound comprising an isocyanate functional group; a second component comprising a second compound comprising a hydroxy -containing compound; a thermally expandable material; and a thermally conductive filler in an amount of 50 percent by weight to 90 percent by weight based on total weight of the composition.

2. The composition of claim 1, wherein the first compound comprises an isocyanate equivalent weight of 400 g / eq to 3,000 g / eq.

3. The composition of claim 1, wherein the first compound comprises an isocyanate equivalent weight of 70 g / eq to less than 400 g / eq.

4. The composition of any of the preceding claims, wherein the first compound comprises an isocyanate functionality of at least 2.

5. The composition of any of the preceding claims, wherein the second compound comprises a hydroxy equivalent weight of 400 g / eq to 3,000 g / eq.

6. The composition of any of claims 1 to 5, wherein the second compound comprises a hydroxy equivalent weight of 70 g / eq to less than 400 g / eq.

7. The composition of any of the preceding claims, comprising the thermally expandable material in an amount of 0.5 percent by weight to 20 percent by weight based on total weight of the composition.

8. The composition of any of claims 1 to 6, comprising the thermally expandable material in an amount of less than 10 percent by weight based on total weight of the composition.

9. The composition of any of the preceding claims, comprising the thermally conductive filler in an amount of 59 percent by weight to 84 percent by weight based on total weight of the composition.

10. The composition of any of the preceding claims, wherein the composition comprises the second compound in an amount such that an equivalence ratio of hydroxide functional groups to isocyanate functional groups of 1:4 to 4:1.

11. The composition of any of the preceding claims, comprising the isocyanate-containing compound and the hydroxy-containing compound in a total amount of 9.5 percent by weight to 49.5 percent by weight based on total weight of the composition.

12. A method for treating a substrate comprising: contacting a surface of the substrate with the composition of any of the preceding claims.

13. A substrate comprising a coating on a surface thereof, formed from the composition of any of claims 1 to 11.

14. The substrate of claim 13, further comprising a dielectric coating on the surface.

15. The substrate of claim 13 or claim 14, wherein the substrate comprises a battery cell.

16. A battery comprising the battery cell of claim 15, and optionally a battery component.

17. A vehicle comprising the battery of claim 16.

Images