Cooling assembly
Patent Information
- Application Number
- PCT/EP2025/053498
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-07
- Filing Date
- 2025-02-11
- Publication Date
- 2025-10-02
AI Technical Summary
Existing liquid-cooled cooling systems for power electronics in vehicles face challenges in achieving uniform cooling across the entire surface while minimizing pressure losses and accommodating geometric restrictions at inlet and outlet openings, often requiring complex and expensive design measures.
A cooling arrangement with a base plate divided by a web into multiple cooling channels, featuring pin structures with varying densities and flow directions, and inlet/outlet regions designed as flat surfaces to minimize pressure loss and ensure uniform cooling.
The solution achieves very uniform cooling with minimal pressure loss across the entire surface, enhancing cooling performance and reducing turbulence, while allowing for efficient distribution and collection of the cooling medium.
Smart Images
Figure EP2025053498_02102025_PF_FP_ABST
Abstract
Description
[0001] Description
[0002] title
[0003] Cooling arrangement
[0004] State of the art
[0005] The present invention relates to a cooling arrangement with a liquid cooling medium for cooling in particular electrical and / or electronic components, in particular of a vehicle.
[0006] In the state of the art, liquid-cooled cooling systems are widely used as heat sinks, particularly for power electronics in vehicles. Such power electronics systems are often subject to high thermal stress and therefore generate heat that must be dissipated. One challenge with cooling systems is achieving the most uniform cooling possible across the entire surface of the cooling system facing the power electronics. Here, the liquid flow is often forced, for example, in a U-shape or some other type. In particular, the use of U-shaped or meandering channels in the cooling system leads to high pressure losses. Another challenge lies in the geometric restriction of the position of an inlet and / or outlet opening, which is usually specified by the customer of the component.However, this requires complex and expensive design measures from the manufacturer of cooling systems to ensure uniform cooling.
[0007] Disclosure of the invention
[0008] The cooling arrangement according to the invention, in particular for liquid cooling media, with the features of claim 1, has the advantage that efficient cooling of components subject to high thermal stress, in particular the power electronics of a vehicle, is possible. In particular, very uniform cooling of an entire surface can be ensured by the cooling arrangement. The cooling arrangement according to the invention exhibits only minimal pressure loss from an inlet area to an outlet area of the cooling arrangement.
[0009] This is achieved according to the invention in that the cooling arrangement comprises a base body with a base plate and at least one web. The web is arranged on the base plate and divides the base plate into a first cooling channel and a second cooling channel. The cooling arrangement further comprises a plurality of pin structures which are arranged in the first and second cooling channels, wherein the pin structures are preferably packed with different densities in the cooling channels and protrude from the base plate into the first and second cooling channels. An inlet region is provided on the base body at a first end of the base plate and an outlet region is provided at a second end of the base plate. The direction of flow through the first and second cooling channels is the same.
[0010] Thus, the cooling medium is distributed from the inlet area into the first and second cooling channels and collected again at the outlet area from the first and second cooling channels.
[0011] The subclaims show preferred developments of the invention.
[0012] Preferably, the inlet area on the base plate has no pin structures or other structures, so that the inlet area is designed as a free area, i.e., a flat surface. More preferably, the outlet area also has no pin structures, so that the outlet area is also designed as a free area, i.e., a flat surface. The free area enables a low-pressure-loss, uniform distribution of the cooling medium at the inlet area and a low-pressure-loss collection of the cooling medium at the outlet area.
[0013] The pin structures are preferably arranged in rows in a direction perpendicular to the flow direction. Adjacent rows are preferably offset from one another in the direction perpendicular to the flow direction. The distance between a pin structure and neighboring pin structures is preferably the same. Preferably, the diameter of a pin structure is larger than the minimum distance to a neighboring pin structure.
[0014] Further preferably, the inlet region and / or the outlet region has a boundary line running at an acute angle to the flow direction. The angle is preferably in a range of 40 to 50 degrees and is particularly preferably 45 degrees. This can improve the distribution and / or collection of the cooling medium to and from the cooling channels. Further preferably, the inlet region and / or the outlet region do not extend across the entire width of the base plate. This promotes uniform cooling, since pin structures can be arranged in the areas where the inlet region and the outlet region are not formed.
[0015] Preferably, the web begins at the first free area of the inlet area and ends at the second free area of the outlet area. Thus, the first and second cooling channels are defined in the flow direction from the inlet area to the outlet area.
[0016] According to a particularly preferred embodiment of the invention, the cooling arrangement further comprises a cover which completely covers the base body.
[0017] The base body preferably has a circumferentially closed edge that defines the base plate of the base body. The cover preferably rests on the circumferential edge and can be connected to the base body at the edge using known joining methods, such as welding, soldering, or the like, so that the cover and the base body are connected to each other in a fluid-tight manner.
[0018] Further preferably, the pin structures have a height such that there is a free space between a free end of the pin structures and the cover. The pin structures preferably all have the same height starting from the base plate in the direction of the cover, so that there is a flat free space between the cover and the pin structures. This makes it possible for cooling medium to flow through the free space between the cover and the free ends of the pin structures as well as through between the pin structures. The height of the free space is preferably selected such that the free space takes up a maximum of 25% of the height between the base plate and the cover. Preferably, the free space takes up 20% of the height between the base plate and the cover, and the pin structures take up 80% of the height.
[0019] Particularly preferably, the web contacts the cover in the assembled state so that no fluid exchange is possible between the individual channels in the area of the web.
[0020] The base body is preferably a die-cast aluminum component. The pin structures are preferably made of solid material.
[0021] More preferably, the base body has at least one support element, preferably a plurality of support elements, on the base plate. The support elements serve to support the cover and, on the other hand, the support elements enable additional components to be connected to the cooling arrangement, for example by means of screw connections, with screws or the like being screwed into the support elements. The support elements are preferably column-like elements made of solid material. Particularly preferably, the support elements are arranged in the region of the web. As a result, the support elements take up as little space as possible in the cooling channels. The support elements are also preferably arranged at the edge of the base body.
[0022] More preferably, the cover has an inlet and an outlet. The inlet is arranged above the inlet region of the base plate, and the outlet is arranged above the outlet region of the base plate. Preferably, the inlet region and the outlet region are designed perpendicular to the base plate, for example, as a nozzle or the like.
[0023] A cooling channel preferably has different pin structure regions, wherein the pin structures have different spacings. A cooling channel preferably has a first region with narrow spacings between the pin structures and a second region with wide spacings between the pin structures, which are wider than the narrow spacings of the first region. More preferably, a cooling channel has regions without pin structures. The regions without pin structures are particularly preferably adjacent and arranged in front of and behind a support element, since the support element, depending on its extent, in particular its diameter, can mean a narrowing of a cooling channel. The regions without pin structures can prevent pressure loss in these narrowed regions.
[0024] Particularly preferably, the cooling arrangement comprises exactly two webs and exactly three cooling channels. Further preferably, one of the cooling channels has an extension in which a base area of the cooling channel becomes wider. The widths of the cooling channels are preferably selected to be different.
[0025] According to a further preferred embodiment, the pin structures all have the same geometric shape. The pin structures preferably have a cylindrical main body and a hemispherical, free end. A flattened portion is preferably formed at the free end.
[0026] Further preferably, the base body of the cooling arrangement has walls on the side facing away from the cooling channels. The walls serve to attach components to the cooling arrangement, in particular to attach a printed circuit board assembly.
[0027] Furthermore, the present invention relates to a printed circuit board arrangement comprising a printed circuit board with heat-emitting components and a cooling arrangement according to the invention.
[0028] drawing
[0029] A preferred embodiment of the invention will be described in detail below with reference to the accompanying drawings. In the drawing:
[0030] Figure 1 is a schematic plan view of a base body of a
[0031] Cooling arrangement according to a preferred embodiment of the invention,
[0032] Figure 2 is a schematic plan view of a cover of the
[0033] Cooling arrangement, Figure 3 is a schematic sectional view along the line lll-lll of
[0034] Figure 1 ,
[0035] Figure 4 is a schematic perspective view of the base body
[0036] 2,
[0037] Figure 5 is a schematic, enlarged sectional view of the
[0038] Cooling arrangement of Figure 1 and
[0039] Figure 6 is a schematic, enlarged plan view of the base body of Figure 1 .
[0040] Preferred embodiment of the invention
[0041] A preferred embodiment of a cooling arrangement 1 is described in detail below with reference to the accompanying drawings, with reference to Figures 1 to 6.
[0042] As can be seen in particular from Figures 1, 2 and 3, the cooling arrangement 1 comprises two main components, namely a base body 2 and a cover 21.
[0043] The base body 2 can be seen in detail in Figure 1. The base body 2 comprises a base plate 20 on which three cooling channels are defined.
[0044] The base plate 20 has a circumferential edge 7 and two webs 3. The webs 3 run straight in the longitudinal direction of the base plate 20. A first cooling channel 11 is defined between the edge 7 and a first web. A second cooling channel 12 is defined between the two webs 3. A third cooling channel 13 is defined between a second web and the edge 7. The arrows A, B, C in the three cooling channels 11, 12, 13 define the flow direction through the three cooling channels. As can be seen from Figure 1, the flow direction is the same in all cooling channels.
[0045] The base body 2 further comprises a plurality of pin structures 4. The pin
[0046] Structures 4 are shown in detail in Figures 4 and 6. In this exemplary embodiment, the pin structures are all formed with the same geometric shape. A pin structure 4 has a cylindrical base body and a semicircular end at a free end of the pin structure. The free end of the pin structure has a flattened portion 40.
[0047] As can be seen from Figures 1 and 4, the pin structures are arranged in rows perpendicular to the flow direction A, B, and C in the three channels at different spacings. Adjacent rows of pin structures are offset from one another in the direction perpendicular to the flow direction. This results in a multitude of deflections of a liquid cooling medium flowing through the cooling arrangement 1.
[0048] For supplying the cooling medium, an inlet nozzle 50 (schematically shown in dashed lines in Figure 1) is provided in the cover. The inlet nozzle opens into an inlet area 5 on the base plate 20. An outlet area 6 is also provided on the base plate 20, above which an outlet nozzle 60 (schematically shown in Figure 1) is arranged in the cover.
[0049] As can be seen from Figure 1, the inlet region 5 and the outlet region 6 do not have pin structures, but are designed as flat, level regions without geometric structures. The area of the inlet region 5 is preferably the same size as the area of the outlet region 6.
[0050] As can further be seen from Figure 1, the inlet region 5 is not formed over the entire width of the cooling arrangement, but only at an inflow region to the third cooling channel 13 and partially at an inflow region to the second channel 12. The inlet region 5 has a boundary line 51 which is arranged at a first angle a to the flow direction of approximately 45 degrees.
[0051] The outlet region 6 is designed in a similar way and is also formed only in the region of the third cooling channel 13 and partially in the region of the second cooling channel 12, respectively at the outflow regions. The outlet region 6 also has a boundary line 61, which is formed at a second angle ß of approximately 45 degrees to the flow direction. The two boundary lines 51, 61 of the inlet region 5 and the outlet region 6, which run obliquely to the flow direction A, B, C, provide an improved, even distribution of the cooling medium into the cooling channels at the inlet region and an even collection of the cooling medium from the cooling channels at the outlet region. In particular, the oblique boundary lines 51, 61 enable a reduction in pressure loss in these regions and a stabilization of the flow, whereby turbulence can be further reduced.
[0052] As can be seen in particular from Figures 3 and 5, a total height H between the base plate 20 and the cover 21 is selected such that a first height H1 of the pin structures covers approximately 80% of the total height H. This means that 20% of the total height H remains free, which is indicated in Figure 5 by the area H2. This results in a free space 9 to the cover 21 above the pin structures 4. This makes it possible for cooling medium to flow in the cooling channels both through the pin structures arranged offset from one another and for cooling medium to flow in the free space 9 above the pin structures.
[0053] At the pin structures, the flow is accelerated toward the free space 9, enabling a very uniform, excellent cooling performance, especially on the side facing the free space. The component to be cooled is preferably arranged on the side with the free space 9.
[0054] Furthermore, support elements 8, preferably made of solid material, are arranged in the base body 2. The support elements 8 serve, on the one hand, to support the cover 21 and, on the other hand, they also enable components to be fixed to the outside of the cover or the cooling arrangement 1 to be fixed to a component to be cooled, for example, a printed circuit board assembly.
[0055] The support elements 8 are essentially cylindrical bodies made of solid material, which are preferably arranged in the region of the webs 3 (cf. Figure 1). Alternatively, the support elements 8 can also be arranged in the region of the edge 7, as shown on the first cooling channel 11. As a result, the support elements 8 take up as little installation space as possible in the cooling channels 11, 12, 13. As can be seen from Figure 1, however, a narrowing of the channel width of the cooling channels 11, 12, 13 nevertheless occurs at the support elements 8. On the first cooling channel 11, an area 43 without pin structures is therefore provided adjacent to the support element 8. This prevents a pressure loss or an excessive pressure loss from occurring when flowing through this constriction on the support element 8.
[0056] The first cooling channel 11 also includes regions with pin structures that differ in terms of their spacing from one another. Starting from an inflow area, there are four regions 41 with closely spaced pin structures and one region 42 with widely spaced pin structures. The respective regions within a cooling channel extend across the entire transverse direction of the cooling channel.
[0057] On the second cooling channel 12, two regions 42 with widely spaced pin structures 4 are provided. On the third cooling channel 13, only one region 42 with widely spaced pin structures is provided.
[0058] Furthermore, in the cooling channels, free-standing or at the edge 7, further support elements 80 with a cylindrical shape and a smaller diameter are provided for additional support of the cover 21 and / or as assembly aids / screw-in areas.
[0059] As can be further seen from Figure 1, rounded inlet areas 30 are provided at the inlet areas of the webs 3, which enables a flow-optimized flow and inflow into the cooling channels 11, 12, 13.
[0060] The webs 3 run straight from the inlet area 5 to the outlet area 6. The height of the webs 3 from the base plate is the same as the height of the surrounding edge 7.
[0061] The cover 21 can be connected to the base body using known methods, for example, welding. Thus, the cooling arrangement 1 forms an assembly that can be connected to a cooling medium supply at the inlet nozzle 50 and the outlet nozzle 60. As can also be seen from Figure 1, the third cooling channel 13 has an extension 13a. This extension 13a can be arranged in particular at positions where additional heat sources are present. Furthermore, the extension 13a further stiffens the entire cooling arrangement 1.
[0062] In the assembled state, the cover 21 preferably contacts both the webs 3 and the support elements 8 and 80.
[0063] Walls 10 are preferably provided on the base body 2 on the side facing away from the pin structures. The walls 10 serve as receiving areas for a printed circuit board assembly or another component. This facilitates the fixation of the cooling assembly 1 to the component to be cooled.
[0064] Thus, the cooling arrangement 1 according to the invention ensures uniform cooling across the entire width of the component and across the entire length of the cooling channels 11, 12, 13. The inlet region 5 and the outlet region 6, which are designed as flat, free surfaces without any structures, enable minimal pressure loss during inflow into and outflow from the cooling arrangement. Both the inflow and outflow processes can occur perpendicular (see Figure 1) to the flow direction A, B, C.
Claims
Claims 1 . Cooling arrangement arranged for flow with a liquid cooling medium, comprising - a base body (2) with a base plate (20), - a web (3) arranged on the base plate (20) and defining a first cooling channel (11) and a second cooling channel (12), the web (3) separating the first cooling channel (11) from the second cooling channel (12), - a plurality of pin structures (4) arranged in the first cooling channel (11) and in the second cooling channel (12), wherein pin structures (4) protrude from the base plate (20) into the first cooling channel (11) and the second cooling channel (12), respectively, - a plurality of pin structures (4) arranged in the first cooling channel (11) and in the second cooling channel (12), in particular at different distances, wherein the pin structures (4) protrude from the base plate (20) into the first cooling channel (11) and the second cooling channel (12), respectively, - an inlet area (5) at a first end of the base plate (20) and - an outlet area (6) at a second end of the base plate (20), - wherein a flow direction (A) through the first cooling channel (11) is the same as a flow direction (B) through the second cooling channel (12).
2. Cooling arrangement according to claim 1, wherein the inlet region (5) is a free region without pin structures and / or wherein the outlet region (6) is a free region without pin structures.
3. Cooling arrangement according to one of the preceding claims, wherein a plurality of pin structures (4) are arranged in a row in a direction perpendicular to the flow direction (A, B, C), wherein adjacent rows are arranged offset from one another transversely to the flow direction.
4. Cooling arrangement according to one of the preceding claims, wherein the inlet region (5) and / or the outlet region (6) has a boundary line (51, 52) running at an acute angle (α, β) to the flow direction (A, B, C).
5. Cooling arrangement according to one of the preceding claims, wherein the web (3) begins at the inlet region (5) and ends at the outlet region (6).
6. Cooling arrangement according to one of the preceding claims, further comprising a cover (21) which covers the base body (2).
7. Cooling arrangement according to one of the preceding claims, wherein the base body (2) has a circumferential edge (7), in particular designed to fix the cover (21).
8. Cooling arrangement according to claim 7, wherein a height H of the edge (7) is greater than a first height H1 of the pin structures (4), so that a free space (9) is present between the pin structures and the cover (21).
9. Cooling arrangement according to one of claims 6 to 8, wherein the web (3) contacts the cover (21).
10. Cooling arrangement according to one of the preceding claims, wherein the base body (2) has at least one support element (8, 80).
11. Cooling arrangement according to claim 10, wherein the support element (8, 80) is integrated into the web (3), or wherein the support element (8, 80) is integrated into the edge (7).
12. Cooling arrangement according to one of claims 6 to 11, wherein the cover (21) has an inlet (50) above the inlet region (5) and / or wherein the cover (21) has an outlet (60) above the outlet region (6).
13. Cooling arrangement according to one of the preceding claims, wherein in the first cooling channel (11) and / or in the second cooling channel (12) a first region (41) with close spacing of the pin structures and / or a second region (42) with wide spacing of the pin structures which are wider than the close spacing of the first region, and / or a third region (43) without pin structures.
14. Cooling arrangement according to one of the preceding claims, comprising exactly two webs (3) and three cooling channels (11, 12, 13).
15. Cooling arrangement according to one of the preceding claims, wherein the pin structures (4) all have the same geometric shape and / or wherein the pin structures (4) have a flattening (40) at a free end.
16. Cooling arrangement according to one of the preceding claims, wherein the base body (2) has walls (10) on the base plate (20) on the flat side facing away from the pin structures (4), in particular for receiving a printed circuit board arrangement.
17. Printed circuit board assembly comprising a cooling assembly (1) according to one of the preceding claims.