Display module and electronic device

Abstract

A display module and an electronic device are disclosed. In particular, the display module may comprise: a circuit board including a plurality of individual electrodes and a plurality of common electrodes having polarities opposite to those of the plurality of individual electrodes; a plurality of LEDs each including a plurality of semiconductor layers, a first pixel electrode connected to the plurality of individual electrodes, and a second pixel electrode disposed in a direction opposite to the first pixel electrode; an upper connection layer which is on the plurality of LEDs and connected to the second pixel electrode; and a plurality of connection elements connecting the upper connection layer to the common electrodes.

Description

Display modules and electronic devices

[0001] The present disclosure relates to a display module and an electronic device, and more particularly, to a display module in which the bonding area between an LED and a circuit board can be increased.

[0002] Recently, the technology for light-emitting diodes (LEDs) based on compound semiconductors such as GaN, GaAs, and GaP has been developing rapidly, and interest in LED display devices that utilize panel configuration technology that directly mounts (transfers) LEDs that emit light in the R (red), G (green), and B (blue) wavelength bands onto a circuit board is growing.

[0003] More specifically, miniaturization of LEDs is essential for high-quality image output from LED display devices. Therefore, significant development infrastructure is being invested to perfect ultra-small micro-LEDs measuring less than 100 micrometers. Furthermore, with the recent development of processes for precisely mounting ultra-small LEDs measuring tens of micrometers, optimized LED and module manufacturing technologies are now required.

[0004] Typically, conventional micro LED technologies utilize flip-chip type LEDs to electrically connect the LED to a circuit board. However, using the flip bonding method as in conventional technologies limits the bonding area for connection between the LED and the circuit board, as the two electrodes positioned at the bottom of the LED are connected to the electrodes on the circuit board. Furthermore, connecting the two electrodes positioned at the bottom of the LED to the electrodes on the circuit board increases the risk of shorting between adjacent electrodes, which can limit process margins and mass production capabilities. Furthermore, the limitations of conventional technologies, as described above, can become more pronounced as LEDs become smaller, and thus remain challenges that must be overcome for further miniaturization of LEDs.

[0005] A display module and an electronic device including the display module are provided, which can increase the bonding area between an LED and a circuit board.

[0006] According to one or more embodiments for achieving the above-described object, a display module includes a circuit board including a plurality of individual electrodes and a plurality of common electrodes having polarities opposite to the polarities of the plurality of individual electrodes, a plurality of semiconductor layers, a plurality of LEDs each including a first pixel electrode connected to the plurality of individual electrodes and a second pixel electrode arranged in an opposite direction to the first pixel electrode, an upper connection layer on the plurality of LEDs connected to the second pixel electrode, and a plurality of connection elements connecting the upper connection layer to the common electrode.

[0007] Meanwhile, the plurality of LEDs may include a red LED, a green LED, and a blue LED, and each of the plurality of individual electrodes may be configured to drive one of the red LED, the green LED, and the blue LED, and the plurality of common electrodes may be configured to drive the red LED, the green LED, and the blue LED.

[0008] Meanwhile, the display module is divided into a plurality of pixels, and each of the plurality of pixels may correspond to one of the red LED, the green LED, the blue LED, and the plurality of connecting elements.

[0009] Meanwhile, each of the plurality of individual electrodes is an anode, each of the plurality of common electrodes is a cathode, each of the plurality of LEDs includes a plurality of second pixel electrodes, and the plurality of second pixel electrodes can be arranged in different regions of the light-emitting surface of each of the plurality of LEDs.

[0010] Meanwhile, the plurality of semiconductor layers include an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer between the n-type semiconductor layer and the p-type semiconductor layer, wherein the p-type semiconductor layer is connected to the first pixel electrode, the n-type semiconductor layer is connected to the second pixel electrode, and the plurality of LEDs may further include a reflective layer around the light-emitting layer.

[0011] Meanwhile, each of the plurality of individual electrodes may be a cathode, each of the plurality of common electrodes may be an anode, the second pixel electrode of the red LED may include a metal, and the second pixel electrode of each of the green LED and the blue LED may include ITO (Indium Tin Oxide).

[0012] Meanwhile, the plurality of semiconductor layers include an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer between the n-type semiconductor layer and the p-type semiconductor layer, wherein the p-type semiconductor layer is connected to the second pixel electrode, the n-type semiconductor layer is connected to the first pixel electrode, and the plurality of LEDs may further include an insulating layer around the light-emitting layer.

[0013] Meanwhile, the display module may further include a lower connection layer on the circuit board, and the lower connection layer may include a plurality of conductive balls that connect the plurality of individual electrodes to the first pixel electrode and connect the plurality of common electrodes to the plurality of connection elements.

[0014] Meanwhile, the upper connection layer may be at least one of a first upper connection layer including ITO (Indium Tin Oxide) and a second upper connection layer including a transparent ACF (Anisotropic Conductive Film) and a glass substrate.

[0015] Meanwhile, the plurality of connecting elements may include at least one of a first connecting element including a semiconductor layer, an upper electrode on the upper side of the semiconductor layer connected to the upper connection layer, and a lower electrode on the lower side of the semiconductor layer connected to the common electrode, a second connecting element including a metal, and a third connecting element including a polymer coated with a metal.

[0016] According to one or more embodiments for achieving the above-described object, in an electronic device including a display module, the display module includes a circuit board including a plurality of individual electrodes and a plurality of common electrodes having polarities opposite to the polarities of the plurality of individual electrodes, a plurality of semiconductor layers, a plurality of LEDs each including a first pixel electrode connected to the plurality of individual electrodes and a second pixel electrode arranged in an opposite direction to the first pixel electrode, an upper connection layer on the plurality of LEDs connected to the second pixel electrode, and a plurality of connection elements connecting the upper connection layer to the common electrode.

[0017] Meanwhile, the plurality of LEDs may include a red LED, a green LED, and a blue LED, and each of the plurality of individual electrodes may be configured to drive one of the red LED, the green LED, and the blue LED, and the plurality of common electrodes may be configured to drive the red LED, the green LED, and the blue LED. Meanwhile, the display module may be divided into a plurality of pixels, and each of the plurality of pixels may correspond to one of the red LED, the green LED, the blue LED, and the plurality of connecting elements.

[0018] Meanwhile, each of the plurality of individual electrodes is an anode, each of the plurality of common electrodes is a cathode, each of the plurality of LEDs includes a plurality of second pixel electrodes, and the plurality of second pixel electrodes can be arranged in different regions of the light-emitting surface of each of the plurality of LEDs.

[0019] Meanwhile, the plurality of semiconductor layers include an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer between the n-type semiconductor layer and the p-type semiconductor layer, wherein the p-type semiconductor layer is connected to the first pixel electrode, the n-type semiconductor layer is connected to the second pixel electrode, and the plurality of LEDs may further include a reflective layer around the light-emitting layer.

[0020] Meanwhile, the plurality of individual electrodes may be cathodes, the plurality of common electrodes may be anodes, the second pixel electrode included in the red LED may be metal, and the second pixel electrode included in the green LED and the blue LED may be ITO (Indium Tin Oxide).

[0021] Meanwhile, the plurality of semiconductor layers may include an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer between the n-type semiconductor layer and the p-type semiconductor layer, wherein the p-type semiconductor layer is connected to the second pixel electrode, the n-type semiconductor layer is connected to the first pixel electrode, and the plurality of LEDs may further include an insulating layer disposed around the light-emitting layer.

[0022] Meanwhile, the display module may further include a lower connection layer disposed on the circuit board, and the lower connection layer may include a plurality of conductive balls that connect the plurality of individual electrodes to the first pixel electrode and connect the plurality of common electrodes to the plurality of connection elements.

[0023] Meanwhile, the upper connection layer may be at least one of a first upper connection layer including ITO and a second upper connection layer including a transparent ACF (Anisotropic Conductive Film) and a glass substrate.

[0024] Meanwhile, the plurality of connecting elements may include at least one of a first connecting element including a semiconductor layer, an upper electrode disposed on an upper portion of the semiconductor layer and connected to the upper connection layer, and a lower electrode disposed on a lower portion of the semiconductor layer and connected to the common electrode, a second connecting element including a metal, and a third connecting element including a polymer coated with a metal.

[0025] Other aspects, features and advantages of one or more embodiments according to the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0026] FIG. 1 is a drawing showing a portion of a display module according to one or more embodiments of the present disclosure;

[0027] Fig. 2 is an enlarged view showing a portion of the display module illustrated in Fig. 1;

[0028] FIG. 3 is a drawing showing a portion of a display module according to one or more embodiments of the present disclosure;

[0029] Fig. 4 is an enlarged view showing a portion of the display module illustrated in Fig. 3;

[0030] FIG. 5 is a drawing for explaining one or more embodiments related to the lower connection layer according to the present disclosure;

[0031] FIG. 6 is a drawing for explaining one or more embodiments related to the upper connection layer according to the present disclosure;

[0032] FIG. 7 is a drawing illustrating one or more embodiments related to a connecting element according to the present disclosure;

[0033] FIG. 8 is a drawing for explaining one or more embodiments related to the number and position of connecting elements according to the present disclosure, and

[0034] FIG. 9 is a drawing for explaining an electronic device including a display module according to the present disclosure.

[0035] The present embodiments may be modified and have various embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the scope to specific embodiments, but should be understood to encompass various modifications, equivalents, and / or alternatives of the embodiments of the present disclosure. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0036] In describing the present disclosure, if it is determined that a specific description of a related known function or configuration may unnecessarily obscure the gist of the present disclosure, a detailed description thereof will be omitted.

[0037] Additionally, the following embodiments may be modified in various other forms, and the scope of the technical concepts of the present disclosure is not limited to the following embodiments. Rather, these embodiments are provided to further faithfully and completely convey the technical concepts of the present disclosure to those skilled in the art.

[0038] The terminology used in this disclosure is for the purpose of describing specific embodiments only and is not intended to limit the scope of the rights. Singular expressions include plural expressions unless the context clearly dictates otherwise.

[0039] In this disclosure, expressions such as “has,” “can have,” “includes,” or “may include” indicate the presence of a corresponding feature (e.g., a component such as a number, function, operation, or part), and do not exclude the presence of additional features.

[0040] In this disclosure, expressions such as “A or B,” “at least one of A and / or B,” or “one or more of A or / and B” can include all possible combinations of the listed items. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” can all refer to instances where (1) A is included, (2) B is included, or (3) both A and B are included.

[0041] The expressions “first,” “second,” “first,” or “second,” etc., used in this disclosure can describe various components, regardless of order and / or importance, and are only used to distinguish one component from another, but do not limit the components.

[0042] When it is said that a component (e.g., a first component) is “(operatively or communicatively) coupled with / to” or “connected to” another component (e.g., a second component), it should be understood that said component may be directly coupled to said other component, or may be coupled via another component (e.g., a third component).

[0043] On the other hand, when it is said that a component (e.g., a first component) is "directly connected" or "directly connected" to another component (e.g., a second component), it can be understood that no other component (e.g., a third component) exists between said component and said other component.

[0044] The expression "configured to" as used in the present disclosure may be used interchangeably with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" may not necessarily mean only "specifically designed to" in terms of hardware.

[0045] Instead, in some contexts, the phrase "a device configured to" may mean that the device, in conjunction with other devices or components, is "capable of" performing A, B, and C. For example, the phrase "a processor configured (or set) to perform A, B, and C" may refer to a dedicated processor (e.g., an embedded processor) for performing those operations, or a general-purpose processor (e.g., a CPU or application processor) that can perform those operations by executing one or more software programs stored in a memory device.

[0046] In the embodiments, a 'module' or 'part' performs at least one function or operation, and may be implemented as hardware or software, or as a combination of hardware and software. Furthermore, a plurality of 'modules' or 'parts' may be integrated into at least one module and implemented as at least one processor, except for a 'module' or 'part' that needs to be implemented as a specific hardware.

[0047] The various elements and areas in the drawings are schematically drawn. Therefore, the technical concept of the present invention is not limited by the relative sizes or spacings drawn in the attached drawings.

[0048] Hereinafter, with reference to the attached drawings, embodiments according to the present disclosure will be described in detail so that a person having ordinary knowledge in the technical field to which the present disclosure pertains can easily implement the present disclosure.

[0049] FIG. 1 is a drawing showing a portion of a display module (100) according to one or more embodiments of the present disclosure. FIG. 2 is an enlarged drawing showing a portion of the display module (100) illustrated in FIG. 1. The following description will be made with reference to FIG. 1 and FIG. 2 together.

[0050] The 'display module (100)' according to the present disclosure refers to a configuration (or device) capable of displaying an image. In particular, the display module (100) can be included in an electronic device and display an image. When the display module (100) is included in an electronic device, the display module (100) can display an image under the control of a processor (300) included in the electronic device. An electronic device including a display module (100) will be described with reference to FIG. 9, and various embodiments related to the display module (100) will be described below.

[0051] The display module (100) may refer to the entire display panel included in an electronic device, and a plurality of display modules (100) may be combined to form a single display panel. That is, the display module (100) may be included not only in types of electronic devices such as digital TVs, monitors, tablet PCs, and smart phones, but also in types of electronic devices such as digital signage and video walls. However, there is no particular limitation on the type of electronic device to which the display module (100) according to the present disclosure is applied.

[0052] As illustrated in FIG. 1, the display module (100) may include a circuit board (110), a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) (Light Emitting Diode), a top contact layer (130), a connecting element (140), and a bottom contact layer (150).

[0053] Although FIG. 1 illustrates a structure including three LEDs and one connecting element (140), this is merely for the sake of simplicity of the drawing, and there are no particular limitations on the number of LEDs and connecting elements (140) included in the display module (100). Hereinafter, for the convenience of explanation, a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) will be described first.

[0054] 'A plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3))' can emit light under the control of a circuit board (110). Specifically, an LED refers to a device that emits light when voltage is applied in the forward direction, and the term 'LED' can mean an 'LED chip' in which a chip-scale packaging process for an LED has been completed.

[0055] Referring to FIG. 2, each of a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) according to the present disclosure may include a plurality of semiconductor layers and a plurality of pixel electrodes (e.g., a pixel electrode (122) and a pixel electrode (123)). In addition, the plurality of semiconductor layers may include an n-type semiconductor layer (121-3), a p-type semiconductor layer (121-1), and a light-emitting layer (121-2).

[0056] The n-type semiconductor layer (121-3) and the p-type semiconductor layer (121-1) can be implemented with a compound semiconductor of group III-V, group II-VI, etc. In particular, the n-type semiconductor layer (121-3) and the p-type semiconductor layer (121-1) can be implemented with a nitride semiconductor. For example, the n-type semiconductor layer (121-3) and the p-type semiconductor layer (121-1) can be an n-GaN semiconductor layer and a p-GaN semiconductor layer, respectively. However, the n-type semiconductor layer (121-3) and the p-type semiconductor layer (121-1) according to the present disclosure are not limited thereto, and can be formed of various materials according to various characteristics required for the LED.

[0057] An n-type semiconductor is a semiconductor in which free electrons are used as charge carriers, and can be made by doping with n-type dopants such as Si, Ge, Sn, and Te. A p-type semiconductor is a semiconductor in which holes are used as charge carriers, and can be made by doping with p-type dopants such as Mg, Zn, Ca, and Ba.

[0058] The light-emitting layer (121-2), the n-type semiconductor layer (121-3), and the p-type semiconductor layer (121-1) may be composed of various semiconductors having a band gap corresponding to a specific region within the spectrum. For example, a red LED (120-1) having an optical wavelength of 600-750 nm may include one or more layers based on an AlInGaP-based semiconductor. In addition, a blue LED (120-3) and a green LED (120-2) having optical wavelengths of 450-490 nm and 500-570 nm, respectively, may include one or more layers based on an AlInGaN-based semiconductor.

[0059] The light-emitting layer (121-2) is located between the n-type semiconductor layer (121-3) and the p-type semiconductor layer (121-1), and is a layer where electrons, which are carriers of the n-type semiconductor layer (121-3), and holes, which are carriers of the p-type semiconductor layer (121-1), meet. When electrons and holes meet in the light-emitting layer (121-2), a potential barrier is formed as the electrons and holes recombine. And when the electrons and holes overcome the potential barrier and transition to a lower energy level according to the applied voltage, light of a corresponding wavelength is emitted.

[0060] Here, the light-emitting layer (121-2) may have a multi-quantum well structure, but the present disclosure is not limited thereto, and the light-emitting layer (121-2) may have various structures such as a single quantum well or a quantum dot structure. When the light-emitting layer (121-2) is formed with a multi-quantum well structure, the well layer / barrier layer of the light-emitting layer (121-2) may be formed with a structure such as InGaN / GaN, InGaN / InGaN, or GaAs / AlGaAs, but the present disclosure is not limited to such structures. The number of quantum wells included in the light-emitting layer (121-2) is also not limited to a specific number.

[0061] The three LEDs illustrated in FIG. 1 each represent a red LED (120-1), a green LED (120-2), and a blue LED (120-3) included in one pixel. That is, the display module (100) can be divided into multiple pixels, and the red LED (120-1), the green LED (120-2), and the blue LED (120-3) can implement one pixel of the display module (100). However, there is no particular limitation on the number or arrangement method of LEDs per pixel according to the present disclosure.

[0062] 'A plurality of pixel electrodes (e.g., pixel electrodes (122) and pixel electrodes (123))' refers to electrodes included in each of a plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) to connect the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) to the circuit board (110). Specifically, a plurality of pixel electrodes (e.g., pixel electrodes (122) and pixel electrodes (123)) are connected to individual electrodes (e.g., individual electrodes 111) of a circuit board (110), a plurality of LEDs (e.g., red LEDs (120-1), green LEDs (120-2), and blue LEDs (120-3)) on an upper connection layer (130), so that the plurality of LEDs (e.g., red LEDs (120-1), green LEDs (120-2), and blue LEDs (120-3)) can be connected to the circuit board (110). In the present disclosure, the term 'pixel electrode' is a term to distinguish it from electrodes (i.e., individual electrodes (e.g., individual electrodes 111) and common electrodes (e.g., common electrodes 112)) disposed on the circuit board (110), and can be replaced with terms such as 'pixel electrode pad'.

[0063] A plurality of pixel electrodes (e.g., pixel electrodes (122) and pixel electrodes (123)) may be arranged on the upper and lower portions of the plurality of semiconductor layers and connected to the plurality of semiconductor layers, and may include a first pixel electrode (122) and a second pixel electrode (123). The 'first pixel electrode (122)' refers to a pixel electrode connected to a plurality of individual electrodes (e.g., individual electrodes 111) of a circuit board (110), and the 'second pixel electrode (123)' refers to an electrode arranged in an opposite direction to the first pixel electrode (122) and connected to an upper connection layer (130) arranged on a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)).

[0064] Referring to the example of FIG. 1, the first pixel electrode (122) may be disposed below a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and may be connected to a plurality of individual electrodes (e.g., individual electrodes 111) of the circuit board (110). The second pixel electrode (123) may be disposed above the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and may be connected to an upper connection layer (130) disposed on the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)). That is, a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) according to one or more embodiments of the present disclosure may be implemented as a vertical type in which a first pixel electrode (122) and a second pixel electrode (123) included in each of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) are respectively disposed above and below the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)). In addition, the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) may be implemented as micro LEDs in which both a horizontal and vertical length are 1 micrometer (㎛) or more and 100 ㎛ or less. However, there is no particular limitation on the size of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) according to the present disclosure.

[0065] The first pixel electrode (122) and the second pixel electrode (123) may be implemented as one or two or more. However, when a plurality of second pixel electrodes (123) are implemented, there is no particular limitation on the positions where the plurality of second pixel electrodes (123) are arranged. In addition, there is no particular limitation on the number of first pixel electrodes (122) and second pixel electrodes (123) included in one LED and the number of individual electrodes (e.g., individual electrodes 111) corresponding thereto.

[0066] The 'circuit board (110)' refers to a board including a driving circuit for driving a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and a plurality of driving electrodes (e.g., a driving electrode (111) and a driving electrode (112)). The term 'circuit board (110)' may be replaced with a term such as 'driving board'. The plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) may be arranged on the circuit board (110) and electrically connected to the driving circuit. The driving of the display module (100) may be performed in an active matrix manner or a passive matrix manner, and the driving circuit may be designed according to the driving manner. The circuit board (110) may include a glass substrate including a TFT (Thin-Film Transistor) substrate, a printed circuit board (PCB) (110), and metal wiring. It can be one of, but is not limited to, these.

[0067] The driving circuit may be connected to a plurality of driving electrodes (e.g., driving electrodes (111) and driving electrodes (112)) and may include a plurality of circuit elements such as switching elements. The switching elements are semiconductor elements that can control the driving of a plurality of LED elements (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) included in the display module (100), and serve as a kind of switch for individual pixels of the display device. For example, TFT may be used as the switching element.

[0068] 'A plurality of driving electrodes (e.g., driving electrodes (111) and driving electrodes (112)') refers to electrodes included in the circuit board (110) to connect a plurality of LEDs (e.g., red LEDs (120-1), green LEDs (120-2), and blue LEDs (120-3)) to the circuit board (110). The plurality of driving electrodes (e.g., driving electrodes (111) and driving electrodes (112)) may be formed on one surface of the circuit board (110) and connected to a driving circuit, and may be connected to a plurality of pixel electrodes (e.g., pixel electrodes (122) and pixel electrodes (123)) included in the plurality of LEDs (e.g., red LEDs (120-1), green LEDs (120-2), and blue LEDs (120-3)). That is, in the present disclosure, the term 'driving electrode' refers to electrodes included in a plurality of LEDs (e.g., red LEDs (120-1), green LEDs (120-2), and blue LEDs (120-3)). This is a term for specifying an electrode included in a circuit board (110) to distinguish it from a pixel electrode included in an LED (120-3), and can be replaced with terms such as 'driving electrode pad'. Depending on the method of explanation, a plurality of driving electrodes (e.g., driving electrodes (111) and driving electrodes (112)) and the circuit board (110) may be distinguished as separate configurations, and a plurality of driving electrodes (e.g., driving electrodes (111) and driving electrodes (112)) may be explained as being formed on the circuit board (110).

[0069] A plurality of driving electrodes (e.g., the driving electrodes (111) and (112) may include a plurality of individual electrodes (e.g., individual electrodes 111) and a plurality of common electrodes (e.g., common electrodes 112). Here, the 'individual electrodes (e.g., individual electrodes 111)' refer to driving electrodes individually connected to each of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)), and the 'common electrodes (e.g., common electrodes 112)' refer to driving electrodes commonly connected to two or more LEDs. Hereinafter, a description will be given on the assumption that the display module (100) includes a plurality of common electrodes (e.g., common electrodes 112), but depending on the embodiment, the common electrode (e.g., common electrodes 112) may be implemented as one.

[0070] The plurality of individual electrodes (e.g., individual electrodes 111) and the plurality of common electrodes (e.g., common electrode 112) may have opposite polarities. For example, the plurality of individual electrodes (e.g., individual electrodes 111) may be anodes and the plurality of common electrodes (e.g., common electrode 112) may be cathodes. Conversely, the plurality of individual electrodes (e.g., individual electrodes 111) may be cathodes and the plurality of common electrodes (e.g., common electrode 112) may be anodes.

[0071] For example, as illustrated in FIG. 1, when a plurality of LEDs include a red LED (120-1), a green LED (120-2), and a blue LED (120-3), each of the plurality of individual electrodes (e.g., individual electrodes 111) may be used to drive one of the red LED (120-1), the green LED (120-2), and the blue LED (120-3), and the plurality of common electrodes (e.g., common electrodes 112) may be used to drive the red LED (120-1), the green LED (120-2), and the blue LED (120-3).

[0072] The 'upper connection layer (130)' is disposed on top of a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)), and refers to a configuration for connecting the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and the circuit board (110). Specifically, the upper connection layer (130) may be disposed on the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and connected to the second pixel electrode (123). In addition, as described below, the upper connection layer (130) may be connected to a common electrode (e.g., a common electrode 112) through a plurality of connection elements (140). The upper contact layer may include a transparent electrode. That is, at least a portion of the upper connection layer (130) can be made transparent so that light can be emitted outside the display module (100).

[0073] For example, the upper connection layer (130) may be at least one of a first upper connection layer (130) including ITO (Indium Tin Oxide), a second upper connection layer (130) including a transparent ACF, and a glass substrate. One or more embodiments related to the upper connection layer (130) will be described in more detail with reference to FIG. 6.

[0074] The 'multiple connecting elements (140)' refers to elements for connecting the upper connection layer (130) to a common electrode (e.g., common electrode 112). The term 'connecting element (140)' may be replaced with a term such as 'connecting portion'. The upper portion of each of the plurality of connecting elements (140) is connected to the upper connection layer (130), and the upper connection layer (130) may be connected to the second pixel electrode (123) of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)). In addition, the lower portion of each of the plurality of connecting elements (140) may be connected to a common electrode (e.g., common electrode 112) of the circuit board (110). Accordingly, a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) can be connected to a common electrode (e.g., a common electrode 112) of a circuit board (110) through an upper connection layer (130) and a plurality of connection elements (140).

[0075] A plurality of connection elements (140) may be arranged throughout the display module (100). Therefore, the following description will assume that the display module (100) includes a plurality of connection elements (140), but depending on the embodiment, the connection element (140) may be implemented as one.

[0076] As described above, the display module (100) can be divided into a plurality of pixels, and each of the plurality of pixels can correspond to one of the red LED (120-1), the green LED (120-2), the blue LED (120-3), and the plurality of connecting elements (140). That is, FIG. 1 illustrates the red LED (120-1), the green LED (120-2), and the blue LED (120-3) included in each pixel, together with the connecting elements (140) used to drive the red LED (120-1), the green LED (120-2), and the blue LED (120-3).

[0077] As illustrated in Fig. 1, the connecting element (140) may have a cylindrical or square cylindrical shape and may therefore be referred to as a so-called 'stud'. However, there is no particular limitation on the shape of the connecting element (140).

[0078] The plurality of connecting elements (140) may include a first connecting element (140) including a semiconductor layer, an upper electrode disposed on an upper portion of the semiconductor layer and connected to an upper connection layer (130), and a lower electrode disposed on a lower portion of the semiconductor layer and connected to a common electrode (e.g., common electrode 112). Here, the semiconductor layer included in the plurality of connecting elements (140) may include at least one of GaN, GaP, GaAs, and Si. In addition, the plurality of connecting elements (140) may include at least one of a second connecting element (140) including a metal, and a third connecting element (140) including a metal-coated polymer. One or more embodiments related to the plurality of connecting elements (140) will be described in more detail with reference to FIG. 7.

[0079] The 'lower connection layer (150)' is arranged in an area including the lower portions of a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)), and refers to a configuration that connects the circuit board (110) to the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and the plurality of connection elements (140). The lower connection layer (150) may be arranged on the circuit board (110), and specifically, may be formed between an area of ​​the circuit board (110) where no driving electrode is arranged and the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)). Accordingly, the lower connection layer (150) can connect a plurality of individual electrodes (e.g., individual electrodes 111) included in the circuit board (110) and a plurality of first pixel electrodes (122) included in each of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)), and can connect a plurality of common electrodes (e.g., common electrode 112) included in the circuit board (110) and a plurality of connection elements (140).

[0080] Specifically, the lower connection layer (150) may be a film composed of an electrically conductive portion and an insulator portion. For example, the lower connection layer (150) may be a film referred to as an anisotropic conductive film (ACF), and may include a plurality of conductive balls (151) and an adhesive. However, the present disclosure is not limited thereto, and any configuration capable of connecting a circuit board (110) to a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and a plurality of connection elements (140) may correspond to the lower connection layer (150) according to the present disclosure.

[0081] A plurality of conductive balls (151) refers to fine-sized conductive particles dispersed within the lower connection layer (150). The plurality of conductive balls (151) can connect a plurality of individual electrodes (e.g., individual electrodes 111) to the first pixel electrode (122), connect a plurality of common electrodes (e.g., common electrodes 112) to a plurality of connection elements (140), and connect a plurality of common electrodes (e.g., common electrodes 112) to a plurality of connection elements (140). In FIGS. 1 and 2, a reference number is given to one conductive ball, but all conductive balls having the same configuration represent the same type.

[0082] For example, the plurality of conductive balls (151) may include at least one of a metal, a carbon nanotube, and a conductive polymer particle, and may have a diameter of 3 to 15 micrometers. The plurality of driving electrodes (e.g., the driving electrodes (111) and (112)) included in the circuit board (110) and the plurality of first pixel electrodes (122) included in each of the plurality of LEDs (e.g., the red LED (120-1), the green LED (120-2), and the blue LED (120-3)) may be electrically connected through at least one conductive ball among the plurality of conductive balls (151).

[0083] The adhesive may serve to secure the lower connection layer (150) to multiple areas. The adhesive may be a heat-curable adhesive, and may harden when heat and pressure are applied, thereby securing the lower connection layer (150) to multiple areas. Specifically, the adhesive may include an epoxy resin and a hardener that reacts with the epoxy resin to harden the adhesive. In addition, the lower connection layer (150) may further include auxiliary materials to control the curing speed of the lower connection layer (150) or to improve thermal conductivity.

[0084] As illustrated in FIG. 1, the lower connection layer (150) may be formed to be disposed on the circuit board (110) and fill in between a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)). However, the present invention is not limited thereto, and the lower connection layer (150) may also be disposed on a plurality of local areas spaced apart from each other on the circuit board (110). One or more embodiments related to the lower connection layer (150) will be described in more detail with reference to FIG. 5.

[0085] Hereinafter, the structure of the display module (100) as illustrated in FIGS. 1 and 2 will be described in more detail. First, it is assumed below that a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) are formed such that a p-type semiconductor layer (121-1) is disposed below a light-emitting layer (121-2) (i.e., in the opposite direction to the light-emitting surface), and an n-type semiconductor layer (121-3) is disposed above the light-emitting layer (121-2) (i.e., in the direction of the light-emitting surface).

[0086] Figures 1 and 2 illustrate embodiments in which a plurality of individual electrodes (e.g., individual electrodes 111) are anodes and a plurality of common electrodes (e.g., common electrodes 112) are cathodes. In this case, when a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) are arranged as in the examples of FIGS. 1 and 2, a plurality of individual electrodes (e.g., individual electrodes 111) as anodes may be connected to the p-type semiconductor layers (121-1) of each of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)), and a plurality of common electrodes (e.g., a common electrode 112) as cathodes may be connected to the n-type semiconductor layers (121-3) of each of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) through a plurality of connecting elements (140) and an upper connection layer (130). Additionally, the p-type semiconductor layer (121-1) can be connected to the first pixel electrode (122), and the n-type semiconductor layer (121-3) can be connected to the second pixel electrode (123).

[0087] The number of second pixel electrodes (123) included in each of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) may be one, and in this case, the second pixel electrode (123) may be arranged at the center of the upper surface of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)). On the other hand, as illustrated in FIGS. 1 and 2, the number of second pixel electrodes (123) included in each of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) may be plural. When there are multiple second pixel electrodes (123), the multiple second pixel electrodes (123) can be arranged in different regions of the light-emitting surfaces of each of the multiple LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)). This is to secure connectivity with the upper connection layer (130) without limiting the light-emitting surfaces of the multiple LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)).

[0088] More specifically, the second pixel electrodes (123) may be implemented in three numbers, and one of the three second pixel electrodes (123) may be disposed at the center of the upper surface of the LED, and the other two second pixel electrodes (123) may be disposed at the outer portion of the upper surface of the LED. Here, the outer portion may be an area corresponding to two non-adjacent vertices among the vertices of a square corresponding to the upper surface of the LED. In addition, when the second pixel electrodes (123) are disposed at the outer portion of the upper surface of the LED, the second pixel electrodes (123) may be formed to surround not only the upper surface but also a side portion near the outer portion. This is to ensure that when transferring a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) to a circuit board (110), even if some of the LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) are tilted in one direction, connection between some of the LEDs and the upper connection layer (130) can be made through at least one second pixel electrode (123).

[0089] Meanwhile, the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) may further include a reflective layer (124) on the sidewalls of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)). In particular, as illustrated in FIGS. 1 and 2, the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) may further include a reflective layer (124) disposed around the light-emitting layer (121-2). Here, the reflective layer (124) may serve to increase the light-emitting efficiency of the LED by reflecting light emitted from the light-emitting layer (121-2) of the LED toward the light-emitting surface of the LED element. For example, the reflective layer (124) may be formed as a metal reflector or a distributed-Bragg-reflector structure.

[0090] FIG. 3 is a drawing showing a portion of a display module (100) according to one or more embodiments of the present disclosure. FIG. 4 is an enlarged drawing showing a portion of the display module (100) illustrated in FIG. 3. Hereinafter, descriptions will be made with reference to FIGS. 3 and 4 together, but descriptions of content that overlaps with the content explained with reference to FIGS. 1 and 2 will be omitted.

[0091] FIGS. 1 and 2 illustrate embodiments in which a plurality of individual electrodes (e.g., individual electrodes 111) are anodes and a plurality of common electrodes (e.g., common electrodes 112) are cathodes, while FIGS. 3 and 4 illustrate embodiments in which a plurality of individual electrodes (e.g., individual electrodes 111) are cathodes and a plurality of common electrodes (e.g., common electrodes 112) are anodes. In this case, when a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) are arranged as shown in FIGS. 3 and 4, a plurality of individual electrodes (e.g., individual electrodes 111) as cathodes can be connected to the n-type semiconductor layers (121-3) of each of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)), and a plurality of common electrodes (e.g., a common electrode 112) as anodes can be connected to the p-type semiconductor layers (121-1) of each of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) through a plurality of connecting elements (140) and an upper connection layer (130). Additionally, the p-type semiconductor layer (121-1) can be connected to the second pixel electrode (123), and the n-type semiconductor layer (121-3) can be connected to the first pixel electrode (122).

[0092] In the embodiments of FIGS. 3 and 4, the second pixel electrode (123) included in the red LED (120-1) may be metal, and the second pixel electrodes (123) included in the green LED (120-2) and the blue LED (120-3) may be ITO. Due to the characteristics of the material, when ITO is used as an electrode connected to the p-type semiconductor layer (121-1) of the red LED (120-1), electrical characteristics suitable for driving the red LED (120-1) cannot be secured, so ITO cannot be used as the second pixel electrode (123), and therefore, metal can be used. On the other hand, even if ITO is used as an electrode connected to the p-type semiconductor layer (121-1) of the green LED (120-2) and the blue LED (120-3), electrical characteristics suitable for driving the green LED (120-2) and the blue LED (120-3) can be secured, so ITO can be used as the second pixel electrode (123).

[0093] The plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) may further include an insulating layer (125) on the sidewalls of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)). In particular, as illustrated in FIGS. 3 and 4, the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) may further include an insulating layer (125) disposed around the light-emitting layer (121-2). Here, the insulating layer (125) may stabilize the device characteristics of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)). For example, the insulating layer (125) may include a material with excellent electrical insulating properties, such as silicon dioxide (SiO2). In the embodiments of FIGS. 3 and 4, unlike the embodiments of FIGS. 1 and 2, a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) are mounted upside down, so that the periphery of the light-emitting layer (121-2) is adjacent to the light-emitting surface. Therefore, compared to the case where the reflective layer (124) is disposed around the light-emitting layer (121-2), disposing the insulating layer (125) around the light-emitting layer (121-2) may be effective in terms of light-emitting efficiency and stability of the device. In the above, an embodiment in which a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) further include a reflective layer (124) or an insulating layer (125) has been described, but it is to be understood that various configurations for improving the characteristics of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) may also be included in the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)).

[0094] Meanwhile, the above description assumes that all of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) included in the display panel are vertical-type LED elements, but the present disclosure is not limited thereto. For example, some of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) included in the display panel may be vertical-type LEDs, and others may be flip-chip-type LEDs.

[0095] In addition, even if all of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) are implemented as vertical type LEDs at the time of manufacturing the display module (100), after repair of a faulty LED, the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) included in the display panel can be implemented as a combination of vertical type and flip-chip type. For example, in the case where a failure occurs in some LEDs, the repair can be completed by removing the upper connection layer (130) above the LEDs where the failure occurred and then placing a flip-chip type LED in the adjacent area, thereby facilitating repair of the display module (100) even when an upper connection layer (130) such as ITO is placed on top of a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)).

[0096] Meanwhile, although the structures of FIGS. 1 and 2 and 3 and 4 have been separately described above, this is only for specifically describing embodiments according to the present disclosure, and the present disclosure is not limited to a specific embodiment. In other words, the present disclosure may correspond to a display module according to the present disclosure if it includes a circuit board including a plurality of individual electrodes and a plurality of common electrodes having polarities opposite to the plurality of individual electrodes, a plurality of LEDs each including a first pixel electrode connected to the plurality of semiconductor layers and the plurality of individual electrodes, and a second pixel electrode arranged in an opposite direction to the first pixel electrode, an upper connection layer arranged on the plurality of LEDs and connected to the second pixel electrode, and a plurality of connection elements for connecting the upper connection layer to the common electrode.

[0097] According to the various embodiments described above with reference to FIGS. 1, 2, 3, and 4, the bonding area between the LED and the circuit board (110) can be expanded, and the stability of the LED manufacturing process can be improved. Accordingly, the performance and stability of the ultra-small to ultra-small LED display module (100) can be improved.

[0098] Specifically, in the display module (100) according to the present disclosure, since one electrode disposed at the bottom of a vertical type LED is bonded to the circuit board (110), assuming that the bottom area of ​​the LED is the same, the bonding area can increase by at least twice as much as in the case where two electrodes disposed at the bottom of a flip-chip type LED are bonded to the circuit board (110). In addition, since the two electrodes are not disposed in the same direction, the stability of the process related to shifts that may occur during the transfer and bonding processes can be significantly improved. Furthermore, when a vertical type LED is used according to the present disclosure, unlike when a flip-chip type LED is used, a mesa hole is not formed, so the effective light-emitting area is expanded, and the light-emitting efficiency of the LED can relatively increase.

[0099] FIG. 5 is a drawing for explaining one or more embodiments related to the lower connection layer (150) according to the present disclosure.

[0100] In FIG. 5, only a part of the upper connection layer (130), one connection element (140), a part of the lower connection layer (150), and a part of the circuit board (110) according to the present disclosure are illustrated, but this is only for convenience of explanation, and various embodiments described with reference to FIG. 5 can be applied to the entire display module (100).

[0101] As described above, the lower connection layer (150) is arranged in an area including the lower portions of a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)), so as to connect a plurality of individual electrodes (e.g., individual electrodes 111) included in the circuit board (110) and a plurality of first pixel electrodes (122) included in each of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)), and can connect a plurality of common electrodes (e.g., common electrode 112) included in the circuit board (110) and a plurality of connection elements (140).

[0102] As illustrated in 510 of FIG. 5, the lower connection layer (150) is a film referred to as an anisotropic conductive film (ACF), which may include a plurality of conductive balls (151) and an adhesive. Specifically, the connection between the circuit board (110) and the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)), and the connection between the circuit board (110) and the plurality of connection elements (140) may be performed through the plurality of conductive balls (151), and the remaining area except for the area where the plurality of conductive balls (151) are formed may be filled with an adhesive (or an adhesive and a reinforcement material).

[0103] The adhesive of the lower connection layer (150) may be black in color or may be transparent. In particular, if the lower connection layer (150) is black, it is possible to reduce the occurrence of light interference between pixels or subpixels of the display module (100), i.e., cross-talk, by imparting a black color to the entire display module (100).

[0104] As illustrated in 520 of FIG. 5, the lower connection layer (150) may include a transparent ACF (150) and a BM (152) (black matrix). Specifically, the adhesive of the lower connection layer (150) may be transparent, and in this case, a BM (152) may be placed on top of the adhesive to prevent interference of light between pixels or sub-pixels of the display module (100).

[0105] As illustrated in 530 of FIG. 5, the lower connection layer (150) may include a metal layer and a molding. Specifically, the lower connection layer (150) may include a metal layer for connecting a plurality of individual electrodes (e.g., individual electrodes 111) and a plurality of first pixel electrodes (122), and a metal layer for connecting a plurality of common electrodes (e.g., common electrode 112) and a plurality of connection elements (140). That is, the connection between the circuit board (110) and the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)) and the connection between the circuit board (110) and the plurality of connection elements (140) may be performed through metallic bonding by the metal layer (153) rather than the plurality of conductive balls (151). For example, metal bonding can be implemented by techniques such as Eutectic bonding, soldering, die attach (dotting), conductive ink, etc. When the lower connection layer (150) includes a metal layer (153), the remaining area except for the area where the metal layer is disposed can be filled with a molding (or encapsulation) (154) to protect a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and provide safety of the display module (100).

[0106] Although various embodiments of the lower connection layer (150) have been described above with reference to FIG. 5, these are merely exemplary, and any configuration that can connect a circuit board (110) to a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and a plurality of connection elements (140) may correspond to the lower connection layer (150) according to the present disclosure, regardless of its type.

[0107] FIG. 6 is a drawing for explaining one or more embodiments related to the upper connection layer (130) according to the present disclosure.

[0108] As with FIG. 5, FIG. 6 illustrates only a portion of the upper connection layer (130), one connection element (140), a portion of the lower connection layer (150), and a portion of the circuit board (110) according to the present disclosure. However, this is merely for convenience of explanation, and the various embodiments described with reference to FIG. 6 can be applied to the entire display module (100).

[0109] As described above, the 'upper connection layer (130)' may be arranged on a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and connected to the second pixel electrode (123), and may be connected to a common electrode (e.g., a common electrode 112) through a plurality of connection elements (140). The upper contact layer may include a transparent electrode.

[0110] As illustrated in 610 as an example of FIG. 6, the upper connection layer (130) may be formed as a single layer covering the entire upper portion of the display module (100). In this case, the single layer may include ITO (Indium Tin Oxide). ITO is a transparent conductive oxide that has the property of conducting electricity while transmitting light, and thus can be used as a transparent electrode. In addition to ITO, materials that have both conductivity and light transmittance, such as carbon-based materials and carbon nanofibers, may be included in the upper connection layer (130).

[0111] As illustrated in 620 as an example of FIG. 6, the upper connection layer (130) may be in contact with a portion of the upper electrode of the connection element (140) (or LED). For example, the upper connection layer (130) may be patterned ITO so as to be formed only on a portion of the upper portion of the connection element (140) (or LED). In this case, since the upper connection layer (130) is connected to a plurality of LED elements (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) but does not cover the entire light-emitting surface, the light-emitting efficiency can be improved compared to a case where the entire light-emitting surface is covered.

[0112] As illustrated in 630 as an example of FIG. 6, the upper connection layer (130) may include an ACF (131) and a glass substrate (134). Specifically, the upper connection layer (130) may include the ACF (131) described in FIG. 5, and may be connected to a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and a plurality of connection elements (140) through a plurality of conductive balls (132) included in the ACF (131). In this case, the upper portion of the ACF (131) may be covered with a glass substrate (134), and the glass substrate (134) may be connected to the plurality of conductive balls (132) through the upper electrode (133).

[0113] Although various embodiments of the upper connection layer (130) have been described above with reference to FIG. 6, these are merely exemplary, and any configuration capable of connecting a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and a circuit board (110) may correspond to the upper connection layer (130) according to the present disclosure, regardless of its type.

[0114] FIG. 7 is a drawing for explaining one or more embodiments related to a connecting element (140) according to the present disclosure.

[0115] As with FIGS. 5 and 6, FIG. 7 illustrates only a portion of the upper connection layer (130), one connection element (140), a portion of the lower connection layer (150), and a portion of the circuit board (110) according to the present disclosure. However, this is merely for convenience of explanation, and the various embodiments described with reference to FIG. 7 can be applied to the entire display module (100).

[0116] As described above, the upper portion of each of the plurality of connecting elements (140) is connected to the upper connection layer (130), and the upper connection layer (130) can be connected to the second pixel electrode (123) of the plurality of LEDs (e.g., red LED (120-1), green LED (120-2), and blue LED (120-3)). In addition, the lower portion of each of the plurality of connecting elements (140) can be connected to a common electrode (e.g., common electrode 112) of the circuit board (110).

[0117] As illustrated in 710 as an example of FIG. 7, the plurality of connecting elements (140) may include a semiconductor layer (141), an upper electrode (142) disposed on the upper side of the semiconductor layer and connected to the upper connection layer (130), and a lower electrode (143) disposed on the lower side of the semiconductor layer and connected to a common electrode (e.g., common electrode 112). Here, the semiconductor layer included in the plurality of connecting elements (140) may include at least one of GaN, GaP, GaAs, and Si, but is not limited thereto.

[0118] As illustrated in 720 as an example of FIG. 7, the plurality of connecting elements (140) may be formed solely of metal. In this case, the metal may include at least one of highly conductive metals such as gold, silver, copper, aluminum, etc.

[0119] As illustrated in 730 as an example of FIG. 7, the plurality of connecting elements (140) may be formed of a polymer coated with a metal. In this case, the metal to be coated may be gold, and at least one of other highly conductive metals may also be coated.

[0120] As illustrated in 740 as an example of FIG. 7, a plurality of connecting elements (140) may be formed by dotting conductive ink. In this case, the dotting metal may be silver, and at least one of other highly conductive metals may also be doted.

[0121] Although various embodiments of the connection element (140) have been described above with reference to FIG. 7, these are merely exemplary, and any configuration capable of connecting the upper connection layer (130) to a common electrode (e.g., common electrode 112) may correspond to the connection element (140) according to the present disclosure, regardless of its type.

[0122] FIG. 8 is a drawing for explaining one or more embodiments related to the number and position of connecting elements (140) according to the present disclosure.

[0123] In FIGS. 1 and 3, various embodiments according to the present disclosure have been described on the premise that a red LED (120-1), a green LED (120-2), a blue LED (120-3), and one connecting element (140) correspond to one pixel. However, the connecting element (140) according to the present disclosure does not have to be arranged for each pixel.

[0124] Specifically, the number and positions of the plurality of connecting elements (140) can be determined based on the voltage drop when driving the display module (100). Here, the voltage drop can be determined based on the distance from the connecting elements (140) and the thickness of the ITO, which is the upper connection layer (130). For example, the farther the distance from the connecting elements (140) is to the pixel, the more driving can be restricted due to the voltage drop, and the thicker the ITO, the wider the range of pixels that can be protected against the voltage drop.

[0125] In addition, when determining the number and positions of the plurality of connecting elements (140), it is necessary to consider whether the pixels positioned at the outermost corners of the display module (100) can be driven normally depending on the voltage drop when driving the display module (100). In addition, the performance, process convenience, manufacturing cost, etc. of the display module (100) may be considered when determining the number and positions of the plurality of connecting elements (140).

[0126] Referring to the example of FIG. 8, a plurality of connecting elements (140) may be arranged one for every 4x4 pixels. Here, the area 80 represents a distance that the corresponding connecting element (140) can cover when driving the display module (100). That is, in the example of FIG. 8, since one connecting element (140) can cover pixels at a distance corresponding to the diagonal length of 4x4 pixels, a plurality of connecting elements (140) may be arranged one for every 4x4 pixels at the center thereof. However, FIG. 8 is merely an example, and the number and positions of the plurality of connecting elements (140) may be determined in various ways depending on the factors described above.

[0127] Meanwhile, in FIGS. 1 and 3, a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) are illustrated as being arranged in a row, but the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) may be arranged in various ways within each pixel, and there is no particular limitation on the positional relationship between the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and the connection element (140).

[0128] FIG. 9 is a drawing for explaining an electronic device including a display module (100) according to the present disclosure.

[0129] As illustrated in FIG. 9, an electronic device according to the present disclosure may include a display module (100), a memory (200), and a processor (300). However, the configurations illustrated in FIG. 15 are merely exemplary, and in implementing the present disclosure, in addition to the configuration illustrated in FIG. 15, new configurations such as a communication unit, an input unit, or an output unit may be added, or some configurations may be omitted.

[0130] The display module (100) refers to a configuration capable of displaying an image, and may have a structure according to various embodiments of FIGS. 1 to 8, in particular. Since the display module (100) has been described above with reference to FIGS. 1 to 13, a duplicate description of the same content will be omitted. That is, the various embodiments described above with reference to FIGS. 1 to 13 may also be applied to the display module (100) included in an electronic device.

[0131] The memory (200) may store at least one instruction for an electronic device. Furthermore, the memory (200) may store an operating system (OS) for operating the electronic device. Furthermore, the memory (200) may store various software programs or applications for operating the electronic device according to various embodiments of the present disclosure. Furthermore, the memory (200) may include a semiconductor memory (200) such as a flash memory (200), a magnetic storage medium such as a hard disk, or the like.

[0132] Specifically, the memory (200) may store various software modules for operating the electronic device according to various embodiments of the present disclosure, and the processor (300) may control the operation of the electronic device by executing the various software modules stored in the memory (200). That is, the memory (200) is accessed by the processor (300), and data reading / recording / modifying / deleting / updating, etc. may be performed by the processor (300).

[0133] In the present disclosure, the term memory (200) may be used to mean a memory (200), a ROM, a RAM in a processor (300), or a memory (200) card mounted on an electronic device.

[0134] In one or more embodiments, the memory (200) may store image data and instructions for displaying an image on the display module (100) based on the image data. In addition, various information necessary within the scope of achieving the purpose of the present disclosure may be stored in the memory (200), and the information stored in the memory (200) may be updated as received from an external device or input by a user.

[0135] The processor (300) controls the overall operation of the electronic device. Specifically, the processor (300) is connected to the configuration of the electronic device including the display module (100) and the memory (200), and can control the overall operation of the electronic device by executing at least one instruction stored in the memory (200) as described above.

[0136] The processor (300) may be implemented in various ways. For example, the processor (300) may be implemented as at least one of an application-specific integrated circuit, an embedded processor (300), a microprocessor (300), hardware control logic, a hardware finite state machine, and a digital signal processor (300). Meanwhile, the term "processor (300)" in the present disclosure may be used to mean a CPU, a GPU, an MPU, and the like.

[0137] In one or more embodiments, the processor (300) may control the display module (100) to display an image based on image data stored in the memory (200). Specifically, the processor (300) may include at least one timing controller that controls driving of a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) and a panel driver that controls driving of the display panel.

[0138] The timing controller can control the panel driver to control a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)). Specifically, the timing controller can adjust image data stored in the memory (200) into a signal required by the panel driver and transmit the adjusted signal to the panel driver, thereby allowing the panel driver to control the driving of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)).

[0139] The panel driver can control the driving of a plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) based on a signal received from the timing control. For example, the panel driver can include a plurality of driving ICs and a plurality of pixel driving circuits. In addition, the plurality of driving ICs can control the light emission of a plurality of light-emitting elements of the plurality of LEDs (e.g., a red LED (120-1), a green LED (120-2), and a blue LED (120-3)) connected to each of the plurality of pixel driving circuits by driving the plurality of pixel driving circuits.

[0140] Each of the components (e.g., modules or programs) according to the various embodiments of the present disclosure as described above may be composed of a single or multiple entities, and some of the sub-components described above may be omitted, or other sub-components may be further included in the various embodiments. Alternatively or additionally, some components (e.g., modules or programs) may be integrated into a single entity, which may perform the same or similar functions as those performed by each of the respective components prior to integration.

[0141] According to various embodiments, operations performed by a module, program or other component may be executed sequentially, in parallel, iteratively or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.

[0142] Although the preferred embodiments of the present disclosure have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the gist of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical idea or prospect of the present disclosure.

Claims

1. In the display module, A circuit board comprising a plurality of individual electrodes and a plurality of common electrodes having a polarity opposite to that of the plurality of individual electrodes; A plurality of LEDs each including a plurality of semiconductor layers, a first pixel electrode connected to the plurality of individual electrodes, and a second pixel electrode arranged in an opposite direction to the first pixel electrode; an upper connection layer on the plurality of LEDs connected to the second pixel electrode; and A display module comprising a plurality of connecting elements connecting the upper connection layer to the common electrode.

2. In paragraph 1, The above plurality of LEDs include a red LED, a green LED, and a blue LED, Each of the plurality of individual electrodes is configured to drive one of the red LED, the green LED, and the blue LED, A display module in which the plurality of common electrodes are configured to drive the red LED, the green LED, and the blue LED.

3. In paragraph 2, The above display module is divided into multiple pixels, A display module in which each of the plurality of pixels corresponds to one of the red LED, the green LED, the blue LED, and the plurality of connecting elements.

4. In paragraph 3, Each of the above plurality of individual electrodes is an anode, Each of the above plurality of common electrodes is a cathode, Each of the plurality of LEDs includes a plurality of second pixel electrodes, A display module in which the plurality of second pixel electrodes are respectively arranged in different regions of the light-emitting surface of each of the plurality of LEDs.

5. In paragraph 4, The above plurality of semiconductor layers are, It includes an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer between the n-type semiconductor layer and the p-type semiconductor layer, The above p-type semiconductor layer is connected to the first pixel electrode, The above n-type semiconductor layer is connected to the second pixel electrode, The above plurality of LEDs are, A display module further comprising a reflective layer surrounding the light-emitting layer.

6. In paragraph 3, Each of the above plurality of individual electrodes is a cathode, Each of the above plurality of common electrodes is an anode, The second pixel electrode of the red LED comprises a metal, The second pixel electrode of each of the green LED and the blue LED includes ITO (Indium Tin Oxide) and is a display module.

7. In paragraph 6, The above plurality of semiconductor layers are, It includes an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer between the n-type semiconductor layer and the p-type semiconductor layer, The above p-type semiconductor layer is connected to the second pixel electrode, The above n-type semiconductor layer is connected to the first pixel electrode, The above plurality of LEDs are, A display module further comprising an insulating layer surrounding the light-emitting layer.

8. In paragraph 1, The above display module, Further comprising a lower connection layer on the circuit board; The above lower connection layer is, A display module comprising a plurality of conductive balls connecting the plurality of individual electrodes to the first pixel electrode and connecting the plurality of common electrodes to the plurality of connecting elements.

9. In paragraph 1, The upper connection layer is, A display module comprising at least one of a first upper connection layer including ITO (Indium Tin Oxide) and a second upper connection layer including a transparent ACF (Anisotropic Conductive Film) and a glass substrate.

10. In paragraph 1, The above plurality of connecting elements are, A display module comprising at least one of a first connecting element including a semiconductor layer, an upper electrode on an upper portion of the semiconductor layer connected to the upper connection layer, and a lower electrode on a lower portion of the semiconductor layer connected to the common electrode, a second connecting element including a metal, and a third connecting element including a polymer coated with a metal.

11. In an electronic device including a display module, The above display module, A circuit board comprising a plurality of individual electrodes and a plurality of common electrodes having a polarity opposite to that of the plurality of individual electrodes; A plurality of LEDs each including a plurality of semiconductor layers, a first pixel electrode connected to the plurality of individual electrodes, and a second pixel electrode arranged in an opposite direction to the first pixel electrode; an upper connection layer on the plurality of LEDs connected to the second pixel electrode; and An electronic device comprising a plurality of connecting elements connecting the upper connection layer to the common electrode.

12. In paragraph 11, The above plurality of LEDs include a red LED, a green LED, and a blue LED, Each of the plurality of individual electrodes is configured to drive one of the red LED, the green LED, and the blue LED, An electronic device wherein the plurality of common electrodes are configured to drive the red LED, the green LED, and the blue LED.

13. In paragraph 12, The above display module is divided into multiple pixels, An electronic device in which each of the plurality of pixels corresponds to one of the red LED, the green LED, the blue LED, and the plurality of connecting elements.

14. In paragraph 13, Each of the above plurality of individual electrodes is an anode, Each of the above plurality of common electrodes is a cathode, Each of the plurality of LEDs includes a plurality of second pixel electrodes, An electronic device in which the plurality of second pixel electrodes are respectively arranged in different regions of the light-emitting surface of each of the plurality of LEDs.

15. In paragraph 14, The above plurality of semiconductor layers are, It includes an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer between the n-type semiconductor layer and the p-type semiconductor layer, The above p-type semiconductor layer is connected to the first pixel electrode, The above n-type semiconductor layer is connected to the second pixel electrode, The above plurality of LEDs are, An electronic device further comprising a reflective layer surrounding the light-emitting layer.

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