Display substrate and preparation method therefor, and display device

Abstract

A display substrate and a preparation method therefor, and a display device. The display substrate comprises sub-pixel regions (100) and non-sub-pixel regions (200). Each sub-pixel region (100) comprises a dielectric layer (11) disposed on a substrate (101), an organic structure layer (14) disposed on the side of the dielectric layer (11) away from the substrate (101), and a first electrode (41), a light-emitting functional layer (43) and a second electrode (42) disposed in sequence on the side of the organic structure layer (14) away from the substrate (101). Each non-sub-pixel region (200) comprises a dielectric layer (11) disposed on the substrate (101), an organic structure layer (14) disposed on the side of the dielectric layer (11) away from the substrate (101), and at least one isolation trench (31) disposed in the organic structure layer (14), the at least one isolation trench (31) being located on at least one side of a sub-pixel region (100). Each isolation trench (31) comprises a side surface (311), the slope angle of the side surface (311) of the isolation trench (31) being an acute angle. The orthographic projection of at least one of a light-emitting functional layer material (44) and a second electrode material (45) on the substrate (101) contains the orthographic projection of the isolation trench (31) on the substrate (101).

Description

Display substrate, preparation method thereof and display device TECHNICAL FIELD

[0001] The present document relates to, but is not limited to, the technical field of display, in particular to a display substrate, a preparation method thereof and a display device. BACKGROUND

[0002] With the development of display technology, the application of active matrix organic light emitting diode panel (AMOLED) as the next generation display technology is also becoming more and more important. The light emitting device of AMOLED is organic light emitting diode (OLED), which emits light when current flows through the light emitting device OLED under the driving of AMOLED driving circuit.

[0003] The trend of AMOLED expanding from small size mobile phones, watches and the like to medium size field is gradually obvious, especially the rapid growth of medium size demand such as tablets, notebooks and vehicle-mounted devices. Medium size AMOLED will derive more new forms and new scenes, but due to the existence of larger screen and high frame rate, the power consumption of AMOLED is increased.

[0004] SUMMARY

[0005] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0006] In one aspect, the present disclosure provides a display substrate, comprising a sub-pixel region and a non-sub-pixel region, the sub-pixel region comprising a dielectric layer disposed on a substrate in sequence, an organic structure layer disposed on a side of the dielectric layer away from the substrate, and a first electrode, a light emitting functional layer and a second electrode disposed on a side of the organic structure layer away from the substrate in sequence, the non-sub-pixel region comprising a dielectric layer disposed on a substrate, an organic structure layer disposed on a side of the dielectric layer away from the substrate, and at least one isolation groove disposed in the organic structure layer, the at least one isolation groove being located on at least one side of the sub-pixel region, the isolation groove comprising a side surface, an angle of slope of the side surface of the isolation groove being an acute angle, and a normal projection of at least one of the light emitting functional layer material and the second electrode material on the substrate containing a normal projection of the isolation groove on the substrate.

[0007] In an exemplary embodiment, the angle of slope is greater than or equal to 50 degrees and less than or equal to 80 degrees.

[0008] In an exemplary embodiment, the angle of slope is greater than or equal to 70 degrees and less than or equal to 80 degrees.

[0009] In an exemplary embodiment, the isolation groove extends from a surface of the organic structure layer away from the substrate toward the substrate, the isolation groove includes a bottom surface, the bottom surface of the isolation groove is in the organic structure layer, or the isolation groove penetrates the organic structure layer, and the bottom surface of the isolation groove is a surface of the medium layer away from the substrate.

[0010] In an exemplary embodiment, the isolation groove includes an inverted trapezoidal shape in a cross section perpendicular to the substrate.

[0011] In an exemplary embodiment, the isolation groove includes a strip shape in a direction parallel to the substrate.

[0012] In an exemplary embodiment, the isolation groove includes an L shape in a direction parallel to the substrate.

[0013] In an exemplary embodiment, the isolation groove includes a ring shape in a direction parallel to the substrate, and the isolation groove surrounds a periphery of the sub-pixel region.

[0014] In an exemplary embodiment, at least two isolation grooves are located on the same side of the sub-pixel region.

[0015] In an exemplary embodiment, a pixel definition layer is further included, the pixel definition layer is disposed on a side of the first electrode away from the substrate, the pixel definition layer includes a pixel opening, the pixel opening exposes at least part of the first electrode, and a normal projection of the pixel definition layer on the substrate does not overlap with the isolation groove.

[0016] In an exemplary embodiment, the isolation groove is located on one side of the pixel opening in a first direction, a length of the isolation groove in a second direction is greater than or equal to a length of the pixel opening in the second direction, the first direction and the second direction are both parallel to the substrate, and the first direction and the second direction intersect.

[0017] In an exemplary embodiment, the organic structure layer includes at least one organic medium layer.

[0018] In an exemplary embodiment, the organic structure layer includes a first organic medium layer disposed on a side of the medium layer away from the substrate, the isolation groove extends from a surface of the first organic medium layer away from the substrate toward the substrate, the isolation groove penetrates the first organic medium layer, and the isolation groove exposes a surface of the medium layer away from the substrate.

[0019] In an exemplary embodiment, the organic structure layer includes a first organic medium layer disposed on the side of the medium layer distal to the substrate, and a second organic medium layer disposed on the side of the first organic medium layer distal to the substrate, the isolation groove extends from the surface of the second organic medium layer distal to the substrate towards the substrate, the isolation groove penetrates the first organic medium layer and the second organic medium layer, and the isolation groove exposes the surface of the medium layer distal to the substrate; or, the isolation groove penetrates the second organic medium layer, and the isolation groove exposes the first organic medium layer.

[0020] In an exemplary embodiment, the organic structure layer includes a first organic medium layer disposed on the side of the medium layer distal to the substrate, a second organic medium layer disposed on the side of the first organic medium layer distal to the substrate, and a third organic medium layer disposed on the side of the second organic medium layer distal to the substrate, the isolation groove extends from the surface of the third organic medium layer distal to the substrate towards the substrate, the isolation groove penetrates the first organic medium layer, the second organic medium layer, and the third organic medium layer, and the isolation groove exposes the surface of the medium layer distal to the substrate; or, the isolation groove penetrates the third organic medium layer, and the isolation groove exposes the second organic medium layer; or, the isolation groove penetrates the third organic medium layer and the second organic medium layer, and the isolation groove exposes the first organic medium layer.

[0021] In an exemplary embodiment, the light-emitting functional layer material covers the isolation groove, and the thickness of the light-emitting functional layer material is less than the thickness of the light-emitting functional layer in the sub-pixel region.

[0022] In an exemplary embodiment, the ratio of the thickness of the light-emitting functional layer material to the thickness of the light-emitting functional layer in the sub-pixel region is greater than or equal to 1 / 4 and less than or equal to 1 / 2.

[0023] In an exemplary embodiment, the second electrode material covers the isolation groove, and the thickness of the second electrode material is less than the thickness of the second electrode in the sub-pixel region.

[0024] In an exemplary embodiment, the ratio of the thickness of the second electrode material to the thickness of the second electrode in the sub-pixel region is greater than or equal to 1 / 4 and less than or equal to 1 / 2.

[0025] In an exemplary embodiment, the first electrode and the projection of the isolation groove on the substrate do not overlap.

[0026] In an exemplary embodiment, the medium layer includes an organic material or an inorganic material.

[0027] In an exemplary embodiment, the light-emitting functional layer comprises at least one light-emitting layer, and at least one of a hole injection layer, a hole transport layer, an electron transport layer, and a charge generation layer.

[0028] In another aspect, the present disclosure also provides a display device comprising any of the foregoing display substrates.

[0029] In another aspect, the present disclosure also provides a method for manufacturing a display substrate, comprising:

[0030] forming a dielectric layer on the substrate;

[0031] forming an organic structure layer on the dielectric layer;

[0032] forming an isolation groove in the organic structure layer, the isolation groove comprising a side surface, and an angle of slope of the side surface of the isolation groove being an acute angle;

[0033] forming a first electrode on the organic structure layer, a normal projection of the first electrode on the substrate not overlapping a normal projection of the isolation groove on the substrate;

[0034] forming a light-emitting functional layer on the first electrode;

[0035] forming a second electrode on the light-emitting functional layer;

[0036] at least one of a normal projection of the light-emitting functional layer material and a normal projection of the second electrode material on the substrate comprises a normal projection of the isolation groove on the substrate.

[0037] In an exemplary embodiment, forming a light-emitting functional layer on the first electrode comprises:

[0038] forming a pixel definition layer on the first electrode, the pixel definition layer being provided with a pixel opening exposing at least part of the first electrode, and a normal projection of the pixel definition layer on the substrate not overlapping a normal projection of the isolation groove on the substrate;

[0039] forming a light-emitting functional layer on the pixel definition layer, the light-emitting functional layer being connected to the exposed first electrode.

[0040] In an exemplary embodiment, forming a pixel definition layer on the first electrode comprises:

[0041] depositing a layer of pixel definition film on the first electrode, and etching the pixel definition film by a patterning process to form a pixel definition layer, the pixel definition film on the isolation groove being etched away to expose an inner wall of the isolation groove.

[0042] In an exemplary embodiment, the etching depth of the pixel definition film is less than or equal to the sum of the thickness of the pixel definition layer and the thickness of the organic structure layer, and greater than or equal to the thickness of the pixel definition layer.

[0043] In an exemplary embodiment, the etching depth of the pixel definition film is less than or equal to 2 microns, and greater than or equal to 1 micron.

[0044] Other aspects can become apparent from the following detailed description when read in conjunction with the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0045] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and serve to explain the principles of the present disclosure, and should not be considered limiting of the present disclosure's scope.

[0046] FIG. 1 is a structural schematic diagram of a display device;

[0047] FIG. 2 is a planar structural schematic diagram of a display substrate;

[0048] FIG. 3 is a cross-sectional structural schematic diagram of a display device;

[0049] FIG. 4a is a planar structural schematic diagram of a display substrate according to an embodiment of the present disclosure;

[0050] FIG. 4b is a cross-sectional structural schematic diagram of a display substrate according to an embodiment of the present disclosure;

[0051] FIG. 5a is a cross-sectional structural schematic diagram of a light-emitting functional layer in a display substrate;

[0052] FIG. 5b is a cross-sectional structural schematic diagram of a light-emitting functional layer in a display substrate according to an embodiment of the present disclosure;

[0053] FIG. 6a is a cross-sectional structural schematic diagram of a second electrode in a display substrate;

[0054] FIG. 6b is a cross-sectional structural schematic diagram of a second electrode in a display substrate according to an embodiment of the present disclosure;

[0055] FIG. 7a is a simulation schematic diagram of the resistance of a second electrode material in a display substrate;

[0056] FIG. 7b is a simulation schematic diagram of the voltage drop of a second electrode material in a display substrate;

[0057] FIG. 8a is a simulation schematic diagram of the resistance of a second electrode material in a display substrate according to an embodiment of the present disclosure;

[0058] FIG. 8b is a simulation schematic diagram of the voltage drop of a second electrode material in a display substrate according to an embodiment of the present disclosure;

[0059] FIG. 9a is a schematic diagram of a display substrate after forming a dielectric layer in a preparation process according to an embodiment of the present disclosure;

[0060] Figure 9b is a schematic diagram showing the formation of the first organic dielectric layer during the substrate fabrication process according to an embodiment of the present disclosure;

[0061] Figure 9c is a schematic diagram showing the formation of isolation trenches during the substrate fabrication process according to an embodiment of this disclosure;

[0062] Figure 9d is a schematic diagram showing the first electrode formed during the substrate fabrication process according to an embodiment of this disclosure.

[0063] Figure 9e is a schematic diagram showing the pixel definition layer after being formed during the fabrication process of the display substrate according to an embodiment of the present disclosure;

[0064] Figure 9f is a schematic diagram showing the formation of the light-emitting functional layer during the fabrication process of the display substrate according to an embodiment of the present disclosure;

[0065] Figure 10 is a schematic cross-sectional view of another display substrate according to an embodiment of the present disclosure;

[0066] Figure 11 is a schematic cross-sectional view of another display substrate according to an embodiment of the present disclosure;

[0067] Figure 12a is a schematic diagram of the planar structure of another display substrate according to an embodiment of the present disclosure;

[0068] Figure 12b is a simulation diagram of the resistance of the second electrode material of the display substrate according to an embodiment of the present disclosure;

[0069] Figure 12c is a simulation diagram of the voltage drop of the second electrode material of the display substrate according to an embodiment of the present disclosure;

[0070] Figure 12d is a simulation schematic diagram of the resistance of the second electrode material of a display substrate;

[0071] Figure 12e is a simulation diagram of the voltage drop of the second electrode material of a display substrate;

[0072] Figure 13a is a schematic diagram of the planar structure of another display substrate according to an embodiment of the present disclosure;

[0073] Figure 13b is a simulation diagram of the resistance of the second electrode material of the display substrate according to an embodiment of the present disclosure;

[0074] Figure 13c is a simulation diagram of the voltage drop of the second electrode material of the display substrate according to an embodiment of the present disclosure;

[0075] Figure 14 is a schematic diagram of the planar structure of another display substrate according to an embodiment of the present disclosure;

[0076] Figure 15 is a schematic diagram of the planar structure of another display substrate according to an embodiment of the present disclosure;

[0077] Figure 16 is a schematic diagram of the planar structure of another display substrate according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0078] For the purpose of making the objects, technical solutions and advantages of the present disclosure clearer, below, the embodiments of the present disclosure will be described in detail with reference to the drawings. Note that the embodiments can be implemented in multiple different forms. It should be easily understood by those skilled in the art that the embodiments and the contents can be changed into various forms without departing from the spirit and the scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. The embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other on the premise of no conflict.

[0079] The scale of the drawings in the present disclosure can be used as a reference in the actual process, but is not limited thereto. For example, the width-length ratio of the channel, the thickness and the interval of each film layer, and the width and the interval of each signal line can be adjusted according to actual needs. The number of pixels in the display substrate and the number of sub-pixels in each pixel are also not limited to the number shown in the drawings. The drawings described in the present disclosure are only schematic structural diagrams, and one embodiment of the present disclosure is not limited to the shapes or values shown in the drawings.

[0080] In the present specification, ordinal numbers such as "first", "second", "third", and the like are set in order to avoid confusion of the components, and are not intended to be limited in terms of numbers.

[0081] In the present specification, for the purpose of convenience, words indicating the orientation or positional relationship such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are used to describe the positional relationship of the components with reference to the drawings, and are only for the purpose of facilitating the description of the present specification and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. The positional relationship of the components is appropriately changed according to the direction of describing each component. Therefore, it is not limited to the words described in the specification, and can be appropriately changed according to the situation.

[0082] In the present specification, unless explicitly specified and limited, the terms "mount", "connected", "connection" should be interpreted in a broad sense. For example, it can be fixedly connected, or removably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected via an intermediate member, or the communication inside two elements. The specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances for those skilled in the art.

[0083] In this specification, a transistor means an element including at least three terminals of a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between the drain electrode (a drain electrode terminal, a drain region, or a drain electrode) and the source electrode (a source electrode terminal, a source region, or a source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that, in this specification, the channel region means a region where current flows mainly.

[0084] In this specification, the first terminal can be a drain electrode and the second terminal can be a source electrode, or the first terminal can be a source electrode and the second terminal can be a drain electrode. The functions of the "source electrode" and the "drain electrode" are sometimes interchanged with each other in the case of using a transistor whose polarity is reversed or in the case where the direction of current flowing in a circuit is changed, and the like. Therefore, in this specification, the "source electrode" and the "drain electrode" can be interchanged with each other, and the "source terminal" and the "drain terminal" can be interchanged with each other.

[0085] In this specification, "electrically connected" includes the case where components are connected through an element having some function of electricity. The element having some function of electricity is not particularly limited as long as electric signals can be transmitted and received between components to be connected. Examples of the element having some function of electricity include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, and another element having some function.

[0086] In this specification, "parallel" means a state where an angle formed between two straight lines is greater than or equal to -10° and less than or equal to 10°, and thus includes a state where the angle is greater than or equal to -5° and less than or equal to 5°. In addition, "perpendicular" means a state where an angle formed between two straight lines is greater than or equal to 80° and less than or equal to 100°, and thus includes a state where the angle is greater than or equal to 85° and less than or equal to 95°.

[0087] In this specification, a "film" and a "layer" can be interchanged with each other. For example, a "conductive layer" can be replaced with a "conductive film". Similarly, an "insulating film" can be replaced with an "insulating layer".

[0088] In this specification, a triangle, a rectangle, a trapezoid, a pentagon, or a hexagon is not necessarily a strict one, can be an approximate triangle, rectangle, trapezoid, pentagon, or hexagon, and can have some small deformation due to a tolerance, can have a rounded corner, a rounded side, or a deformation, and the like.

[0089] In this specification, "about" means not strictly limited to a limit, and a value within a range of a process and a measurement error is allowed.

[0090] The present application discloses a display substrate and a manufacturing method thereof. The display substrate includes a sub-pixel region and a non-sub-pixel region. The sub-pixel region includes a dielectric layer, an organic structure layer, a first electrode, a light-emitting functional layer, and a second electrode. The non-sub-pixel region includes a dielectric layer, an organic structure layer, and at least one isolation groove. The at least one isolation groove is located on at least one side of the sub-pixel region. The slope angle of the side surface of the isolation groove is an acute angle. The normal projection of at least one of the light-emitting functional layer material and the second electrode material on the substrate contains the normal projection of the isolation groove on the substrate.

[0091] In order to improve the crosstalk between the multi-layer (Tandem) pixel structure and reduce the lateral leakage, an etching process is added in the process of forming the pixel definition layer to form an undercut structure, or an etching process is added after the pixel definition layer or the planarization layer is formed, and an inorganic material is used to form an undercut structure. The undercut region can isolate the cathode or the charge generation layer between adjacent sub-pixels, reduce the leakage between adjacent sub-pixels, and improve the crosstalk problem. However, the slope angle of the undercut structure formed in the process is difficult to control, the production cost is high, and it is not conducive to production. In addition, the undercut structure may cause part of the cathode or charge generation layer material to be not isolated due to process fluctuations, resulting in uneven brightness at low gray levels and damage to the anode.

[0092] The present disclosure provides a display substrate, including a sub-pixel region and a non-sub-pixel region, the sub-pixel region including a dielectric layer, an organic structure layer, a first electrode, a light-emitting functional layer, and a second electrode, the non-sub-pixel region including a dielectric layer, an organic structure layer, and at least one isolation groove in the organic structure layer, the at least one isolation groove being located on at least one side of the sub-pixel region, the isolation groove including a side surface, the slope angle of the side surface of the isolation groove being an acute angle, and the normal projection of at least one of the light-emitting functional layer material and the second electrode material on the substrate containing the normal projection of the isolation groove on the substrate.

[0093] In an example embodiment, the slope angle is greater than or equal to 50 degrees and less than or equal to 80 degrees.

[0094] In an example embodiment, the slope angle is greater than or equal to 70 degrees and less than or equal to 80 degrees.

[0095] In an exemplary embodiment, the isolation groove extends from the side surface of the organic structure layer away from the substrate toward the substrate, and includes a bottom surface, the bottom surface of the isolation groove being in the organic structure layer or the isolation groove penetrating the organic structure layer, the bottom surface of the isolation groove being a surface of the medium layer away from the substrate.

[0096] In an exemplary embodiment, the isolation groove includes an inverted trapezoid in a cross section perpendicular to the substrate.

[0097] In an exemplary embodiment, the isolation groove includes a bar shape in a direction parallel to the substrate.

[0098] In an exemplary embodiment, the isolation groove includes an L shape in a direction parallel to the substrate.

[0099] In an exemplary embodiment, the isolation groove includes a ring shape in a direction parallel to the substrate, the isolation groove surrounding the periphery of the sub-pixel region.

[0100] FIG. 1 is a structural schematic diagram of a display device. As shown in FIG. 1, the display device can include a timing controller, a data signal driver, a scan signal driver, and a pixel array, the pixel array can include a plurality of scan signal lines (S1 to Sm), a plurality of data signal lines (D1 to Dn), and a plurality of sub-pixels Pxij.

[0101] In an exemplary embodiment, the timing controller can provide a gray scale value and a control signal suitable for the specification of the data signal driver to the data signal driver, can provide a clock signal, a scan start signal, and the like suitable for the specification of the scan signal driver to the scan signal driver. The data signal driver can generate a data voltage to be provided to the data signal lines D1, D2, D3,..., and Dn using the gray scale value and the control signal received from the timing controller. For example, the data signal driver can sample the gray scale value using the clock signal, and apply a data voltage corresponding to the gray scale value to the data signal lines D1 to Dn in units of sub-pixel behavior, n can be a natural number. The scan signal driver can generate a scan signal to be provided to the scan signal lines S1, S2, S3,..., and Sm by receiving the clock signal, the scan start signal, and the like from the timing controller. For example, the scan signal driver can sequentially provide a scan signal having an on-level pulse to the scan signal lines S1 to Sm. For example, the scan signal driver can be configured in the form of a shift register, and can generate a scan signal in a manner of sequentially transferring a scan start signal provided in the form of an on-level pulse to a next stage circuit under the control of a clock signal, m can be a natural number. The sub-pixel array can include a plurality of pixel sub-PXij. Each pixel sub-PXij can be connected to a corresponding data signal line and a corresponding scan signal line, i and j can be natural numbers. The sub-pixel PXij can refer to a sub-pixel in which a transistor is connected to an i-th scan signal line and connected to a j-th data signal line.

[0102] FIG. 2 is a schematic diagram of a planar structure of a display device. As shown in FIG. 2, a display area of the display device can include a plurality of pixel units P arranged in a matrix manner, at least one of the plurality of pixel units P including a first sub-pixel P1 emitting first color light, a second sub-pixel P2 emitting second color light, and a third sub-pixel P3 emitting third color light, the first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3 each including a pixel driving circuit and a display light emitting device. The pixel driving circuit in the sub-pixel is connected to a scan signal line and a data signal line, respectively, and is configured to receive a data voltage transmitted by the data signal line under the control of the scan signal line, and output a corresponding current to the display light emitting device. The display light emitting device in the sub-pixel is connected to the pixel driving circuit in the sub-pixel, respectively, and is configured to emit light of a corresponding brightness in response to the current output by the pixel driving circuit in the sub-pixel.

[0103] In an example embodiment, the first sub-pixel P1 can be a red sub-pixel emitting red (R) light, the second sub-pixel P2 can be a blue sub-pixel emitting blue (B) light, and the third sub-pixel P3 can be a green sub-pixel emitting green (G) light. In an example embodiment, the shape of the sub-pixel can be any one or more of a triangle, a square, a rectangle, a diamond, a trapezoid, a parallelogram, a pentagon, a hexagon, and other polygons, and can be arranged in a horizontal side-by-side manner, a vertical side-by-side manner, an X shape, a cross shape, a pin shape, a square shape, a diamond shape, or a delta shape, without limitation in the present disclosure.

[0104] In an example embodiment, the pixel unit can include four sub-pixels, without limitation in the present disclosure.

[0105] FIG. 3 is a schematic diagram of a cross-sectional structure of a display device, illustrating a structure for realizing full color in a white light + color film manner. As shown in FIG. 3, the display device can include a substrate 101, a driving circuit layer 102 disposed on the substrate 101, a light-emitting structure layer 103 disposed on a side of the driving circuit layer 102 away from the substrate 101, a first encapsulation layer 104 disposed on a side of the light-emitting structure layer 103 away from the substrate 101, a color film structure layer 105 disposed on a side of the first encapsulation layer 104 away from the substrate 101, a second encapsulation layer 106 disposed on a side of the color film structure layer 105 away from the substrate 101, and a cover layer 107 disposed on a side of the second encapsulation layer 106 away from the substrate 101. In some possible implementation manners, the display device can include other film layers, without limitation in the present disclosure.

[0106] In an example embodiment, the substrate 101 can be a silicon substrate or a silicon-on-insulator (SOI) substrate. The driving circuit layer 102 can be prepared on the substrate 101 by a silicon semiconductor process (e.g., a CMOS process), and the driving circuit layer 102 can include a plurality of circuit units, which can at least include a pixel driving circuit. The pixel driving circuit can be connected with a scan signal line and a data signal line respectively, and can include a plurality of transistors and a storage capacitor. The transistor can include a control electrode G, a first electrode S, and a second electrode D, which can be connected with corresponding connection electrodes respectively through tungsten metal filled vias (i.e., tungsten vias, W-vias), and can be connected with other electrical structures (e.g., traces) through the connection electrodes.

[0107] In an example embodiment, the light-emitting structure layer 103 can include a plurality of light-emitting devices, which can at least include a first electrode (anode), a light-emitting functional layer, and a second electrode (cathode), the first electrode can be connected to the second electrode D of the transistor through the connecting electrode, the light-emitting functional layer is connected to the anode, the cathode is connected to the light-emitting functional layer, the cathode is connected to the cathode voltage line, and the light-emitting functional layer emits light under the driving of the anode and the cathode. In an example embodiment, the light-emitting functional layer can include at least one light-emitting layer (EML for short), and any one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL), and a charge generation layer (CGL). In an example embodiment, for a light-emitting device emitting white light, the light-emitting functional layers of all sub-pixels can be a common layer connected together.

[0108] In an example embodiment, the first encapsulation layer 104 and the second encapsulation layer 106 can adopt a thin film encapsulation (TFE for short) mode, which can prevent external water vapor from entering the light-emitting structure layer, and the cover layer 107 can be made of glass or a flexible plastic colorless polyimide.

[0109] In an example embodiment, the color filter structure layer 105 can include a black matrix (BM) and a color filter (CF), the positions of the color filters can correspond to the positions of the light-emitting devices, the black matrix can be located between adjacent color filters, and the color filters are configured to filter the white light emitted by the light-emitting devices into red (R) light, green (G) light, and blue (B) light, forming red sub-pixels, green sub-pixels, and blue sub-pixels.

[0110] In an example embodiment, a pixel unit can include four sub-pixels, which is not limited in the present disclosure.

[0111] The display substrate of the present disclosure is illustrated below through some example embodiments.

[0112] FIG. 4a is a schematic diagram of the planar structure of the display substrate according to an example embodiment of the present disclosure. In an example embodiment, as shown in FIG. 4a, in a direction parallel to the display substrate, the display substrate according to an example embodiment of the present disclosure includes a sub-pixel region 100 and a non-sub-pixel region 200 located on at least one side of the sub-pixel region 100, the sub-pixel region 100 is configured to emit light, and the non-sub-pixel region 200 does not emit light. The shape of the sub-pixel region 100 can include a rectangle, at least two sub-pixel regions 100 are arranged at intervals along a first direction D1, and at least part of the non-sub-pixel region 200 is located between adjacent sub-pixel regions 100.

[0113] In an example embodiment, the display substrate of the present disclosure further comprises an isolation groove 31, the shape of the isolation groove 31 comprises a strip shape extending along the second direction D2, the isolation groove 31 is located at least one side of the sub-pixel area 100, for example, the isolation groove 31 is located in the non-sub-pixel area 200 between adjacent sub-pixel areas 100, the isolation groove 31 is configured to increase the extension distance of at least one of the light-emitting functional layer material and the second electrode material of the sub-pixel area 100, increase the resistance of at least one of the light-emitting functional layer material and the second electrode material, cut off the leakage current of adjacent sub-pixel areas 100, and improve the pixel crosstalk. Wherein, the first direction D1 and the second direction D2 are both parallel to the substrate, and the first direction D1 and the second direction D2 intersect with each other, for example, the first direction D1 and the second direction D2 are perpendicular to each other.

[0114] In an example embodiment, the at least two sub-pixel areas 100 are arranged at intervals along the first direction D1, and the isolation groove 31 extending along the second direction D2 is arranged between adjacent sub-pixel areas 100 in the first direction D1, and the center line O of the isolation groove 31 in the second direction D2 is located at the center position between the edges of adjacent sub-pixel areas 100 in the second direction D2.

[0115] In an example embodiment, the display substrate of the present disclosure comprises a pixel definition layer, and the pixel definition layer is provided with a pixel opening 13, and the pixel opening 13 is located in the sub-pixel area 100, for example, the pixel opening 13 and the sub-pixel area 100 completely overlap in the orthographic projection on the plane where the display substrate is located. The length L1 of the isolation groove 31 in the second direction D2 is greater than or equal to the length L2 of the sub-pixel opening 13 in the second direction D2.

[0116] The display substrate of the present disclosure improves the effect of cutting off the leakage current of adjacent sub-pixel areas 100 by the length L1 of the isolation groove 31 in the second direction D2 being greater than or equal to the length L2 of the sub-pixel opening 13 in the second direction D2.

[0117] In an example embodiment, the display substrate of the present disclosure includes a first sub-pixel region, a second sub-pixel region, and a third sub-pixel region arranged at intervals. The first sub-pixel region can emit red (R) light, the second sub-pixel region can emit blue (B) light, and the third sub-pixel region can emit green (G) light. The first sub-pixel region is provided with a first isolation groove on one side in a first direction D1. The first isolation groove has a shape including a strip extending along a second direction D2. The length W1 of the first isolation groove in the second direction D2 is greater than or equal to the length W2 of a sub-pixel opening of the first sub-pixel region in the second direction D2. The second sub-pixel region is provided with a second isolation groove on one side in the first direction D1. The length W1' of the second isolation groove in the second direction D2 is greater than or equal to the length W2' of a sub-pixel opening of the second sub-pixel region in the second direction D2. The third sub-pixel region is provided with a third isolation groove on one side in the first direction D1. The length W1" of the third isolation groove in the second direction D2 is greater than or equal to the length W2" of a sub-pixel opening of the third sub-pixel region in the second direction D2.

[0118] FIG. 4b is a schematic diagram of a cross-sectional structure of the display substrate of the present disclosure. FIG. 4b can be a cross-sectional view of FIG. 4a in the A-A' direction. In an example embodiment, in a direction perpendicular to the display substrate, the display substrate of the present disclosure includes a driving circuit layer 102 disposed on a substrate 101, a dielectric layer 11 disposed on a side of the driving circuit layer 102 away from the substrate 101, an organic structure layer 14 disposed on a side of the dielectric layer 11 away from the substrate 101, a first electrode 41, a light-emitting functional layer 43, and a second electrode 42 disposed in sequence on a side of the organic structure layer 14 away from the substrate 101. The first electrode 41, the light-emitting functional layer 43, and the second electrode 42 are located in a sub-pixel region 100, and the first electrode 41, the light-emitting functional layer 43, and the second electrode 42 form a light-emitting device.

[0119] In an example embodiment, the display substrate of the present disclosure further includes an isolation groove 31 located in a non-sub-pixel region 200 between adjacent sub-pixel regions 100. The isolation groove 31 extends along a direction close to the substrate from a surface of the organic structure layer 14 away from the substrate. The isolation groove 31 includes a bottom surface 312 and a side surface 311 connected to an edge of the bottom surface 312. The bottom surface 312 of the isolation groove 31 is located in the organic structure layer 14, or the isolation groove 31 penetrates through the organic structure layer 14, and the bottom surface 312 of the isolation groove 31 is a surface of the dielectric layer 11 away from the substrate. The slope angle a of the side surface of the isolation groove is an acute angle. For example, the slope angle a is greater than or equal to 50 degrees and less than or equal to 80 degrees. For example, the slope angle a is greater than or equal to 70 degrees and less than or equal to 80 degrees.

[0120] In an example embodiment, the cross section of the isolation groove 31 in a direction perpendicular to the substrate is an inverted trapezoid.

[0121] The slope angle a of the side surface 311 of the isolation groove 31 is an acute angle, so that the isolation groove 31 does not form an undercut structure, so that the subsequently deposited light-emitting functional layer material and the second electrode material are not blocked at the isolation groove 31, the extension distance of the light-emitting functional layer material and the second electrode material is increased, the resistance of the light-emitting functional layer material and the second electrode material is increased, the leakage current is effectively blocked, the pixel crosstalk is improved, the production cost is reduced, the process structure is improved, the production capacity is optimized, and the product competitiveness is improved.

[0122] The slope angle a of the side surface 311 of the isolation groove 31 is greater than or equal to 50 degrees and less than or equal to 80 degrees, so that the light-emitting functional layer material and the second electrode material are not blocked at the isolation groove 31, the extension distance of the light-emitting functional layer material and the second electrode material is increased, for example, the extension distance of the light-emitting functional layer material and the second electrode material is increased by 50%, the resistance of the light-emitting functional layer material and the second electrode material is increased, the leakage current is effectively blocked, and the pixel crosstalk is improved. At the same time, the increase of the resistance of the light-emitting functional layer material and the second electrode material does not have a great influence on the power consumption of the display substrate, for example, compared with the display substrate without the isolation groove, the resistance of the light-emitting functional layer material and the second electrode material in the display substrate of the embodiment of the present disclosure is increased by less than or equal to 30%.

[0123] In an example embodiment, a normal projection of the first electrode 41 and the isolation groove 31 on the substrate does not overlap.

[0124] The display substrate of the embodiment of the present disclosure forms the first electrode 41 on the first organic medium layer 21, and the surface of the first organic medium layer 21 away from the substrate is relatively flat, so as to ensure the flatness of the first electrode 41 and avoid the occurrence of breakage and other adverse conditions of the first electrode 41.

[0125] In an example embodiment, a normal projection of at least one of the light-emitting functional layer material 44 and the second electrode material 45 on the substrate includes a normal projection of the isolation groove on the substrate, and at least one of the light-emitting functional layer material 44 and the second electrode material 45 is not blocked at the isolation groove. For example, the normal projection of the light-emitting functional layer material 44 and the second electrode material 45 on the substrate both include the normal projection of the isolation groove on the substrate.

[0126] In an example embodiment, the light-emitting functional layer material 44 covers the bottom surface 312 and the side surface 311 of the isolation groove 31, the light-emitting functional layer material 44 connects the light-emitting functional layer 43 of the adjacent sub-pixel area 100, and the light-emitting functional layer material 44 and the light-emitting functional layer 43 of the adjacent sub-pixel area 100 are made of the same material and are prepared by the same preparation process.

[0127] In an example embodiment, the thickness of the light-emitting functional layer material 44 is less than the thickness of the light-emitting functional layer 43 of the adjacent sub-pixel region 100. For example, the ratio of the thickness of the light-emitting functional layer material 44 to the thickness of the light-emitting functional layer 43 of the adjacent sub-pixel region 100 is greater than or equal to 1 / 4 and less than or equal to 1 / 2.

[0128] In an example embodiment, the second electrode material 45 covers the bottom surface 312 and the side surface 311 of the isolation groove 31, the second electrode material 45 connects the second electrodes 42 of the adjacent sub-pixel regions 100, and the second electrode material 45 and the second electrodes 42 of the adjacent sub-pixel regions 100 are made of the same material and are prepared by the same preparation process.

[0129] In an example embodiment, the thickness of the second electrode material 45 is less than the thickness of the second electrode 42 of the adjacent sub-pixel region 100. For example, the ratio of the thickness of the second electrode material 45 to the thickness of the second electrode 42 of the adjacent sub-pixel region 100 is greater than or equal to 1 / 4 and less than or equal to 1 / 2.

[0130] In an example embodiment, the organic structure layer 14 includes a first organic medium layer 21, the first organic medium layer 21 is arranged between the medium layer 11 and the first electrode 41, the surface of the first organic medium layer 21 close to the substrate directly contacts the medium layer 11, and the surface of the first organic medium layer 21 away from the substrate directly contacts the first electrode 41.

[0131] In an example embodiment, the isolation groove 31 extends along the side close to the substrate from the surface of the first organic medium layer 21 away from the substrate, penetrates the first organic medium layer 21, and exposes the surface of the medium layer 11 away from the substrate, and the bottom surface of the isolation groove 31 is the surface of the medium layer 11 away from the substrate; or the isolation groove 31 extends along the side close to the substrate from the surface of the first organic medium layer 21 away from the substrate, penetrates part of the first organic medium layer 21, and the isolation groove 31 does not expose the medium layer 11, and the bottom surface of the isolation groove 31 is located in the first organic medium layer 21.

[0132] In an example embodiment, the connection via in the first organic medium layer 21 and the isolation groove 31 do not overlap in the orthographic projection on the substrate.

[0133] In an example embodiment, the pixel definition layer 12 is arranged on the side of the first electrode 41 away from the substrate 101, the pixel definition layer 12 is provided with a pixel opening, the pixel opening exposes at least part of the first electrode 41, and the orthographic projection of the pixel definition layer 12 on the substrate and the orthographic projection of the bottom of the isolation groove 31 on the substrate do not overlap. The bottom of the isolation groove 31 is the side surface of the isolation groove 31 close to the substrate 101.

[0134] In an example embodiment, the distance between the edge of the orthogonal projection of the pixel definition layer 12 on the substrate 101 and the edge of the orthogonal projection of the bottom of the isolation groove 31 on the substrate is m, which can be the distance between the edge of the orthogonal projection of the pixel definition layer 12 on the substrate 101 and the edge of the orthogonal projection of the bottom of the isolation groove 31 on the substrate in the first direction D1, and m is greater than or equal to 0.4 microns and less than or equal to 4 microns.

[0135] The display substrate according to the embodiments of the present disclosure has the distance m between the edge of the orthogonal projection of the pixel definition layer 12 on the substrate 101 and the edge of the orthogonal projection of the bottom of the isolation groove 31 on the substrate greater than or equal to 0.4 microns and less than or equal to 4 microns, which increases the extension distance of the light-emitting functional layer material and the second electrode material, increases the resistance of the light-emitting functional layer material and the second electrode material, effectively blocks the leakage current, and improves the pixel crosstalk.

[0136] In an example embodiment, the width of the orthogonal projection of the bottom of the isolation groove 31 on the substrate is n, which can be the length of the orthogonal projection of the bottom of the isolation groove 31 on the substrate in the first direction D1, and 1 < n / m < 10.

[0137] The display substrate according to the embodiments of the present disclosure has the ratio of the width n of the orthogonal projection of the bottom of the isolation groove 31 on the substrate to the distance m between the edge of the orthogonal projection of the bottom of the isolation groove 31 on the substrate greater than 1 and less than 10, which increases the extension distance of the light-emitting functional layer material and the second electrode material, increases the resistance of the light-emitting functional layer material and the second electrode material, effectively blocks the leakage current, and improves the pixel crosstalk.

[0138] FIG. 5a is a schematic diagram of the cross-sectional structure of the light-emitting functional layer in a display substrate. In an example embodiment, as shown in FIG. 5a, the related art display substrate does not have an isolation groove, and the light-emitting functional layer material 44 between the adjacent sub-pixel regions 100 extends along the direction parallel to the substrate, connecting the light-emitting functional layer 42 of the adjacent sub-pixel regions 100. The resistance of the light-emitting functional layer 42 of the related art display substrate satisfies the following formula: R0=R1+R2+R3+R4=1 / W[(L1*R EL1 +L2*R EL2 +L3*R EL3 +L4*R EL4 )] =1 / W[(L1*R EL1 +1 / 2*(L2+L3)*(R EL2 +R EL3 )+L4*R EL4 )] =(L1*R EL1+ 1 / 2 * (L2+L3) * (R EL2 + R EL3 + L4 * R EL4 )

[0139] Wherein, R0 is the sum of the resistance of the light-emitting functional layer 42 of the adjacent sub-pixel area 100 and the light-emitting functional layer material 44 between the adjacent sub-pixel areas 100; R1 is the resistance of the light-emitting functional layer 42 of one of the adjacent sub-pixel areas 100; R4 is the resistance of the light-emitting functional layer 42 of the other of the adjacent sub-pixel areas 100; R2 and R3 are the resistance of the light-emitting functional layer material 44 between the adjacent sub-pixel areas 100; L1 is the length of the light-emitting functional layer 42 of one of the adjacent sub-pixel areas 100 in the first direction D1; L4 is the length of the light-emitting functional layer 42 of the other of the adjacent sub-pixel areas 100 in the first direction D1; L2 and L3 are the length of the light-emitting functional layer material 44 between the adjacent sub-pixel areas 100 in the first direction D1; W is the width of the light-emitting functional layer 42 and the light-emitting functional layer material 44, and is 1; d1 is the thickness of the light-emitting functional layer 42; and d2 is the thickness of the light-emitting functional layer material 44.

[0140] FIG. 5b is a schematic diagram of the cross-sectional structure of the light-emitting functional layer in the display substrate according to an embodiment of the present disclosure. In an exemplary embodiment, as shown in FIG. 5b, the resistance of the light-emitting functional layer 42 of the display substrate according to an embodiment of the present disclosure satisfies the following formula: Rt = R1 + R2 + R3 + R4 = 1 / W[(L1*R EL1 + L2*R EL2 + L3*R EL3 + L4*R EL4 )] = 1 / W[(L1*R EL1 + 1 / 2 * N * (L2+L3) / Cosa * (R EL2 + R EL3 + L4 * R EL4 )] = (L1*R EL1 + 1 / 2 * N * (L2+L3) / Cosa * (R EL2 + R EL3 + L4 * R EL4 ).

[0141] Wherein, Rt is the sum of the resistances of the light-emitting functional layer material 44 between the light-emitting functional layer 42 of the adjacent sub-pixel region 100 and the light-emitting functional layer material 44 between the adjacent sub-pixel regions 100; R1 is the resistance of the light-emitting functional layer 42 of one of the adjacent sub-pixel regions 100; R4 is the resistance of the light-emitting functional layer 42 of the other of the adjacent sub-pixel regions 100; R2 and R3 are the resistances of the light-emitting functional layer material 44 between the adjacent sub-pixel regions 100; L1 is the length of the light-emitting functional layer 42 of one of the adjacent sub-pixel regions 100 in the first direction D1; L4 is the length of the light-emitting functional layer 42 of the other of the adjacent sub-pixel regions 100 in the first direction D1; L2 and L3 are the lengths of the light-emitting functional layer material 44 between the adjacent sub-pixel regions 100 in the first direction D1; W is the width of the light-emitting functional layer 42 and the light-emitting functional layer material 44, and is 1; d1 is the thickness of the light-emitting functional layer 42; d2 is the thickness of the light-emitting functional layer material 44; N = d1 / d2, N > 1; and a is the slope angle of the side surface of the isolation groove. ΔR = Rt - R0 = 1 / 2*N*(L2+L3) / Cosa*(R EL2 +R EL3 )-1 / 2*(L2+L3)*(R EL2 +R EL3 ) = 1 / 2*[N*(L2+L3) / Cosa-(L2+L3)]*(R EL2 +R EL3 ), ΔR > 0.

[0142] In summary, compared with the display substrate shown in FIG. 5a, the display substrate shown in FIG. 5b has a reduced thickness of the light-emitting functional layer material 44 at the isolation groove and an increased length of the light-emitting functional layer material 44 in the first direction D1, and a large resistance is generated on the interface of the light-emitting functional layer material 44. In other unchanged cases, compared with the display substrate shown in FIG. 5a without the groove design, the resistance of the light-emitting functional layer material 44 is obviously increased.

[0143] The isolation groove in the display substrate of the embodiments of the present disclosure can increase the extension distance of the light-emitting functional layer material, increase the resistance of the light-emitting functional layer material, effectively cut off the leakage current, and improve the pixel crosstalk.

[0144] FIG. 6a is a schematic diagram of a cross-sectional structure of a second electrode in a display substrate. In an example embodiment, as shown in FIG. 6a, the display substrate of the related art does not have an isolation groove, and the second electrode material 45 between the adjacent sub-pixel regions 100 extends along the direction parallel to the substrate, connecting the second electrodes 42 of the adjacent sub-pixel regions 100. The resistance of the second electrode 42 of the display substrate of the related art satisfies the following formula: R0 = R1 + R2 + R3 + R4 = 1 / W[(L1+L2+L3+L4))R CTD1 ] = (L1+L2+L3+L4))R CTD1 .

[0145] R0 is the sum of the resistances of the light-emitting functional layer 42 of the adjacent sub-pixel region 100 and the light-emitting functional layer material 44 between the adjacent sub-pixel regions 100; R1 is the resistance of the light-emitting functional layer 42 of one of the adjacent sub-pixel regions 100; R4 is the resistance of the light-emitting functional layer 42 of the other of the adjacent sub-pixel regions 100; R2 and R3 are the resistances of the light-emitting functional layer material 44 between the adjacent sub-pixel regions 100; L1 is the length of the light-emitting functional layer 42 of one of the adjacent sub-pixel regions 100 in the first direction D1; L4 is the length of the light-emitting functional layer 42 of the other of the adjacent sub-pixel regions 100 in the first direction D1; L2 and L3 are the lengths of the light-emitting functional layer material 44 between the adjacent sub-pixel regions 100 in the first direction D1; and W is the width of the light-emitting functional layer 42 and the light-emitting functional layer material 44, and is 1.

[0146] FIG. 6b is a schematic diagram of a cross-sectional structure of a second electrode in a display substrate according to an embodiment of the present disclosure. In an exemplary embodiment, as shown in FIG. 6b, the resistance of the second electrode 42 of the display substrate according to the embodiment of the present disclosure satisfies the following formula: Rt = R1 + R2 + R3 + R4 = 1 / W[(L1 + 1 / 2*N*(L2 + L3) / Cosa)*R CTD1 +(L4 + 1 / 2*N*(L2 + L3) / Cosa)*R CTD1 )] = 1 / W[(L1 + N*(L2 + L3) / Cosa + L4)*R CTD1 )] = (L1 + N*(L2 + L3) / Cosa + L4)*R CTD1

[0147] wherein Rt is the sum of the resistances of the second electrode 42 of the adjacent sub-pixel region 100 and the second electrode material 45 between the adjacent sub-pixel regions 100; R1 is the resistance of the second electrode 42 of one of the adjacent sub-pixel regions 100; R4 is the resistance of the second electrode 42 of the other of the adjacent sub-pixel regions 100; R2 and R3 are the resistances of the second electrode material 45 between the adjacent sub-pixel regions 100; L1 is the length of the second electrode 42 of one of the adjacent sub-pixel regions 100 in the first direction D1; L4 is the length of the second electrode 42 of the other of the adjacent sub-pixel regions 100 in the first direction D1; L2 and L3 are the lengths of the second electrode material 45 between the adjacent sub-pixel regions 100 in the first direction D1; W is the width of the second electrode 42 and the second electrode material 45, and is 1; d1 is the thickness of the second electrode 42; d2 is the thickness of the second electrode material 45; N = d1 / d2, N > 1, a is the slope angle of the side surface of the isolation groove; R CTD2 + CTD3 = N*R CTD1 = N*R CTD4ΔR = Rt - R0 = (L1 + N * (L2 + L3) / Cosa + L4) * R CTD1 -(L1 + L2 + L3 + L4)R CTD1 ΔR = (N * (L2 + L3) / Cosa - (L2 + L3)) * R CTD1 > 0.

[0148] In summary, compared with the display substrate shown in FIG. 6a, the thickness of the second electrode material 45 at the isolation groove 31 is reduced, and the length in the first direction D1 is increased in the display substrate shown in FIG. 6b. A large resistance is generated on the interface of the second electrode material 45. Under other unchanged conditions, compared with the display substrate without the groove design shown in FIG. 6a, the second electrode material 45 is obviously increased.

[0149] The isolation groove in the display substrate of the embodiment of the present disclosure can increase the extension distance of the second electrode material, increase the resistance of the second electrode material, effectively cut off the leakage current, and improve the pixel crosstalk.

[0150] FIG. 7a is a simulation schematic diagram of the resistance of the second electrode material of a display substrate; and FIG. 7b is a simulation schematic diagram of the voltage drop of the second electrode material of a display substrate. Taking a 2x2 Pixel unit (2B in 1) display substrate as an example, the second electrode material between adjacent sub-pixel regions in the display substrate extends along the direction parallel to the substrate, connecting the second electrodes of adjacent sub-pixel regions. The second electrode material resistance and voltage drop simulation experiment is performed on the display substrate, as shown in FIG. 7a and FIG. 7b, the surface resistance of the second electrode material of the display substrate is 30.3Ω.

[0151] FIG. 8a is a simulation schematic diagram of the resistance of the second electrode material of a display substrate; and FIG. 8b is a simulation schematic diagram of the voltage drop of the second electrode material of a display substrate. Taking a 2x2 Pixel unit (2B in 1) display substrate as an example, the second electrode material resistance and voltage drop simulation experiment is performed on the display substrate, as shown in FIG. 8a and FIG. 8b, the surface resistance of the second electrode material of the display substrate is 33.84Ω. Compared with the second electrode material of the display substrate shown in FIG. 7a and FIG. 7b, the resistance of the second electrode material of the display substrate of the embodiment of the present disclosure is increased by about 11.68%, the extension length of the second electrode material is increased, and the power line voltage drop uniformity of the second electrode material is better.

[0152] The preparation process of the display substrate is exemplarily illustrated below. The "patterning process" in the present disclosure includes coating photoresist, mask exposure, development, etching, stripping photoresist and the like for metal material, inorganic material or transparent conductive material, and includes coating organic material, mask exposure and development and the like for organic material. The deposition can adopt any one or more of sputtering, evaporation, chemical vapor deposition, the coating can adopt any one or more of spraying, spin coating and inkjet printing, and the etching can adopt any one or more of dry etching and wet etching, which are not limited in the present disclosure. The "thin film" refers to a thin film of a certain material on a substrate by deposition, coating or other processes. If the "thin film" does not need a patterning process in the whole preparation process, the "thin film" can also be referred to as a "layer". If the "thin film" needs a patterning process in the whole preparation process, it is referred to as a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern". The "A and B are arranged in the same layer" in the present disclosure means that A and B are formed at the same time by the same patterning process. The "thickness" of the film layer is the size of the film layer in the direction perpendicular to the display substrate. In the exemplary embodiments of the present disclosure, "the orthographic projection of B is within the orthographic projection of A" or "the orthographic projection of A contains the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0153] In the exemplary embodiments, the preparation process of the display substrate can include the following operations.

[0154] (101) forming a medium layer.

[0155] In the exemplary embodiments, the forming of the medium layer can include: first forming a driving circuit layer 102 on the substrate 101; then, sequentially depositing a medium thin film on the driving circuit layer 102, and patterning the medium thin film by a patterning process to form the medium layer 11 arranged on the driving circuit layer 102, as shown in FIG. 9a.

[0156] In the exemplary embodiments, the driving circuit layer 102 can include a pixel driving circuit, the pixel driving circuit can include a transistor, the transistor can include a control electrode G, a first electrode S and a second electrode D, the control electrode G, the first electrode S and the second electrode D can be connected with corresponding connection electrodes respectively through tungsten metal filled vias (i.e. tungsten vias, W-via), and can be connected with other electrical structures (such as traces and the like) through the connection electrodes.

[0157] In an exemplary embodiment, the medium layer 11 can include an organic material, such as resin or the like. When the medium layer 11 is an organic material, the medium layer 11 can be referred to as a planarization layer. Alternatively, the medium layer 11 can include an inorganic material, such as silicon nitride (SiNx) or silicon oxide (SiOx) or the like. When the medium layer 11 is an inorganic material, the medium layer 11 can be referred to as a passivation layer.

[0158] (102) forming a first organic medium layer.

[0159] In an exemplary embodiment, forming the first organic medium layer can include: on the substrate on which the aforementioned pattern is formed, depositing a layer of first organic film on the medium layer 11, patterning the first organic film by a patterning process, and then, hardening the first organic film to form the first organic medium layer 21 disposed on the medium layer 11; and then, removing the scum, as shown in FIG. 9b.

[0160] In an exemplary embodiment, the first organic medium layer can include resin or the like.

[0161] (103) forming an isolation groove.

[0162] In an exemplary embodiment, forming the isolation groove can include: on the substrate on which the aforementioned pattern is formed, etching the first organic medium layer 21 using a half-tone or gray-tone mask plate to form the isolation groove 31 in the first organic medium layer 21, as shown in FIG. 9c.

[0163] In an exemplary embodiment, the isolation groove 31 is located in a non-sub-pixel region of the display substrate, and the isolation groove 31 can be located on at least one side of the sub-pixel region of the display substrate. The shape of the isolation groove 31 in a cross section perpendicular to the substrate direction includes an inverted trapezoid, the isolation groove 31 includes a side surface 311 and a bottom surface 312, the slope angle a of the side surface 311 is an acute angle, the isolation groove 31 extends along the direction close to the substrate from the surface of the first organic medium layer 21 away from the substrate, penetrates the first organic medium layer 21, and the bottom surface 312 of the isolation groove 31 is the surface of the medium layer 11 away from the substrate. The slope angle a is the included angle between the side surface 311 of the isolation groove 31 and the plane on which the substrate 101 is located.

[0164] In an exemplary embodiment, the slope angle a is greater than or equal to 50 degrees and less than or equal to 80 degrees. For example, the slope angle is greater than or equal to 70 degrees and less than or equal to 80 degrees.

[0165] In an exemplary embodiment, the length of the opening of the isolation groove 31 away from the substrate in the first direction D1 is 3 microns to 5 microns.

[0166] The preparation method of the display substrate provided in the embodiments of the present disclosure makes the slope angle a of the side surface 311 of the isolation groove 31 an acute angle, so that the isolation groove 31 does not form an undercut structure, thereby preventing the subsequently deposited light-emitting functional layer material and the second electrode material from being interrupted at the isolation groove 31, increasing the extension distance of the light-emitting functional layer material and the second electrode material, increasing the resistance of the light-emitting functional layer material and the second electrode material, effectively interrupting the leakage current, improving pixel crosstalk, reducing production cost, improving process structure and optimizing production capacity, and improving product competitiveness.

[0167] The preparation method of the display substrate provided in the embodiments of the present disclosure makes the slope angle a of the side surface 311 of the isolation groove 31 greater than or equal to 50 degrees and less than or equal to 80 degrees, thereby increasing the extension distance of the light-emitting functional layer material and the second electrode material, for example, increasing the extension distance of the light-emitting functional layer material and the second electrode material by 50%, effectively interrupting the leakage current, and improving pixel crosstalk.

[0168] In some embodiments, the isolation groove penetrates through part of the first organic medium layer, and a bottom surface of the isolation groove is located in the first organic medium layer.

[0169] (104) forming a first electrode.

[0170] In the example implementation, forming the first electrode can include: depositing a layer of first conductive film on the first organic medium layer 21 on the substrate on which the aforementioned pattern is formed, patterning the first conductive film by a patterning process, so that the first conductive film forms the first electrode 41 arranged on the first organic medium layer 21, and the first conductive film on the isolation groove 31 is etched and removed, thereby exposing the side surface and the bottom surface of the isolation groove 31, as shown in FIG. 9d.

[0171] In the example implementation, the first electrode 41 is located in a sub-pixel region of the display substrate, and a normal projection of the first electrode 41 and the isolation groove 31 on the substrate 101 does not overlap.

[0172] In the example implementation, in the process of patterning the first conductive film, the first conductive film remaining on the inner surface and the edge of the isolation groove 31 can be removed by increasing the exposure amount and adjusting the exposure time, thereby exposing the inner surface and the edge of the isolation groove 31.

[0173] The preparation method of the display substrate provided in the embodiments of the present disclosure forms the first electrode 41 on the first organic medium layer 21, and the surface of the first organic medium layer 21 away from the substrate is relatively flat, thereby ensuring the flatness of the first electrode 41 and avoiding the occurrence of adverse conditions such as breakage of the first electrode 41.

[0174] (105) forming a pixel definition layer.

[0175] In an example embodiment, forming the pixel definition layer comprises: depositing a layer of pixel definition film covering the first electrode 41 on the first organic medium layer 21 on the substrate on which the aforementioned pattern is formed, etching the pixel definition film by a patterning process, so that the pixel definition film forms the pixel definition layer 12 arranged on the first organic medium layer 21, the pixel definition layer 12 is provided with the pixel opening 13 exposing at least part of the first electrode 41, and the pixel definition film on the isolation groove 31 is etched and removed, exposing the inner surface of the isolation groove 31, as shown in FIG. 9e.

[0176] In an example embodiment, the orthographic projection of the pixel definition layer 12 and the isolation groove 31 on the substrate 101 does not overlap.

[0177] In an example embodiment, the etching depth of the pixel definition film is less than or equal to the sum of the thickness of the pixel definition layer 12 and the thickness of the first organic medium layer 21, and greater than or equal to the thickness of the pixel definition layer 12.

[0178] In an example embodiment, the etching depth of the pixel definition film is less than or equal to 2 microns, and greater than or equal to 1 micron.

[0179] The preparation method of the substrate according to the embodiments of the present disclosure can prevent over-etching of the pixel definition film and avoid etching the medium layer 11 by setting the etching depth of the pixel definition film to be less than or equal to the sum of the thickness of the pixel definition layer 12 and the thickness of the first organic medium layer 21, and greater than or equal to the thickness of the pixel definition layer 12.

[0180] (106) Forming a light-emitting functional layer.

[0181] In an example embodiment, forming the light-emitting functional layer comprises: depositing a light-emitting functional layer material on the side of the pixel definition layer 12 away from the substrate 101 on the substrate on which the aforementioned pattern is formed, at least part of the light-emitting functional layer material covering the first electrode 41 exposed by the pixel opening 13 and directly contacting the first electrode 41, to form the light-emitting functional layer 43; and at least part of the light-emitting functional layer material 44 covering the inner surface of the isolation groove 31, i.e., the orthographic projection of the light-emitting functional layer material 44 on the substrate contains the orthographic projection of the isolation groove 31 on the substrate, for example, the light-emitting functional layer material 44 covers the side surface and the bottom surface of the isolation groove 31, as shown in FIG. 9f.

[0182] In an example embodiment, the thickness of the light-emitting functional layer material 44 on the isolation groove 31 is less than the thickness of the light-emitting functional layer 43. For example, the ratio of the thickness of the light-emitting functional layer material to the thickness of the light-emitting functional layer 43 is greater than or equal to 1 / 4 and less than or equal to 1 / 2.

[0183] In an exemplary embodiment, the isolation groove 31 is located between adjacent sub-pixels, and the light-emitting functional layer material 44 on the isolation groove 31 connects the light-emitting functional layers 43 of the adjacent sub-pixels into one body.

[0184] (107) forming a second electrode.

[0185] In an exemplary embodiment, forming the second electrode includes: depositing a second electrode material on the side of the light-emitting functional layer 43 away from the substrate 101 on the substrate on which the aforementioned pattern is formed, at least part of the second electrode material covering the light-emitting functional layer 43 in the pixel opening 13 and directly contacting the light-emitting functional layer 43, to form a second electrode 42; at least part of the second electrode material 45 covering the isolation groove 31, i.e., the orthographic projection of the second electrode material 45 on the substrate contains the orthographic projection of the isolation groove 31 on the substrate, for example, the second electrode material 45 covers the side surface and bottom surface of the isolation groove 31 and directly contacts the light-emitting functional layer material 44 on the side surface and bottom surface of the isolation groove 31, as shown in FIG. 4b. Wherein the first electrode 41, the second electrode 42 and the light-emitting functional layer 43 arranged between the first electrode 41 and the second electrode 42 form a light-emitting device.

[0186] In an exemplary embodiment, the thickness of the second electrode material 45 on the isolation groove 31 is less than the thickness of the second electrode 42. For example, the ratio of the thickness of the second electrode material 45 to the thickness of the second electrode 42 is greater than or equal to 1 / 4 and less than or equal to 1 / 2.

[0187] In an exemplary embodiment, the isolation groove 31 is located between adjacent sub-pixels, and the second electrode material 45 on the isolation groove 31 connects the second electrodes 42 of the adjacent sub-pixels into one body.

[0188] In an exemplary embodiment, the light-emitting device can be a multi-layer light-emitting device. For example, the light-emitting functional layer 43 can include a first hole transport layer arranged on the first electrode 41, a second light-emitting layer arranged on the first hole transport layer, a first hole blocking layer arranged on the second light-emitting layer, a first electron transport layer arranged on the first hole blocking layer, a charge generation layer arranged on the first electron transport layer, a second hole transport layer arranged on the charge generation layer, a second light-emitting layer arranged on the second hole transport layer, a second hole blocking layer arranged on the second light-emitting layer, and a second electron transport layer arranged on the second hole blocking layer, the first hole transport layer directly contacting the first electrode 41, and the second electron transport layer directly contacting the second electrode 42.

[0189] In an exemplary embodiment, the light-emitting device can be a single-layer light-emitting device. For example, the light-emitting functional layer 43 can include an electron transport layer disposed on the first electrode 41, a light-emitting layer disposed on the electron transport layer, a hole blocking layer disposed on the light-emitting layer, and an electron transport layer disposed on the hole blocking layer.

[0190] The manufacturing method of the display substrate according to the embodiments of the present disclosure has a simple process and does not increase a new photolithography process, thereby reducing production cost.

[0191] FIG. 10 is a schematic view of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure. In an exemplary embodiment, in a direction perpendicular to the display substrate, as shown in FIG. 10, the structure of the display substrate according to the embodiment of the present disclosure is basically the same as that of the embodiment shown in FIG. 4b, except that the organic structure layer 14 of the display substrate according to the embodiment of the present disclosure includes a first organic medium layer 21 and a second organic medium layer 22 which are stacked, the first organic medium layer 21 is located close to the substrate, the surface of the first organic medium layer 21 close to the substrate directly contacts the medium layer 11, the second organic medium layer 22 is disposed away from the substrate from the first organic medium layer 21, the surface of the second organic medium layer 22 close to the substrate directly contacts the first organic medium layer 21, and the surface of the second organic medium layer 22 away from the substrate directly contacts the first electrode 41.

[0192] In an exemplary embodiment, the isolation groove 31 extends from the surface of the second organic medium layer 22 away from the substrate along the side close to the substrate, penetrates through the second organic medium layer 22 and the first organic medium layer 21, exposes the surface of the medium layer 11 away from the substrate, and the bottom surface of the isolation groove 31 is the surface of the medium layer 11 away from the substrate; or the isolation groove 31 extends from the surface of the second organic medium layer 22 away from the substrate along the side close to the substrate, penetrates through part of the second organic medium layer 22, exposes the surface of the first organic medium layer 21 away from the substrate, and the bottom surface of the isolation groove 31 is the surface of the first organic medium layer 21 away from the substrate.

[0193] In an exemplary embodiment, the orthogonal projection of the isolation groove 31 on the substrate does not overlap with the orthogonal projection of the connection via in the first organic medium layer 21 on the substrate, and does not overlap with the orthogonal projection of the connection via in the second organic medium layer 22 on the substrate.

[0194] FIG. 11 is a schematic view of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure. In an exemplary embodiment, in a direction perpendicular to the display substrate, the structure of the display substrate according to the embodiment of the present disclosure is substantially the same as that of the embodiment shown in FIG. 4b, except that the organic structure layer 14 of the display substrate according to the embodiment of the present disclosure includes a first organic medium layer 21, a second organic medium layer 22, and a third organic medium layer 23 which are stacked, the first organic medium layer 21 is located close to the substrate, the surface of the first organic medium layer 21 close to the substrate directly contacts the medium layer 11, the second organic medium layer 22 is located away from the substrate from the first organic medium layer 21, the surface of the second organic medium layer 22 close to the substrate directly contacts the first organic medium layer 21, the surface of the second organic medium layer 22 away from the substrate directly contacts the third organic medium layer 23, the third organic medium layer 23 is located away from the substrate from the second organic medium layer 22, the surface of the third organic medium layer 23 close to the substrate directly contacts the second organic medium layer 22, and the surface of the third organic medium layer 23 away from the substrate directly contacts the first electrode 41.

[0195] In an exemplary embodiment, the isolation groove 31 extends from the surface of the third organic medium layer 23 away from the substrate to the surface of the third organic medium layer 23 close to the substrate, penetrates through the third organic medium layer 23, the second organic medium layer 22, and the first organic medium layer 21, and exposes the surface of the medium layer 11 away from the substrate, and the bottom surface of the isolation groove 31 is the surface of the medium layer 11 away from the substrate; or the isolation groove 31 extends from the surface of the third organic medium layer 23 away from the substrate to the surface of the third organic medium layer 23 close to the substrate, penetrates through the third organic medium layer 23 and the second organic medium layer 22, and exposes the surface of the first organic medium layer 21 away from the substrate, and the bottom surface of the isolation groove 31 is the surface of the first organic medium layer 21 away from the substrate; or the isolation groove 31 extends from the surface of the third organic medium layer 23 away from the substrate to the surface of the third organic medium layer 23 close to the substrate, penetrates through the third organic medium layer 23, and exposes the surface of the second organic medium layer 22 away from the substrate, and the bottom surface of the isolation groove 31 is the surface of the second organic medium layer 22 away from the substrate.

[0196] In an exemplary embodiment, the isolation groove 31 does not overlap with the normal projection of the connection via in the first organic medium layer 21 on the substrate; does not overlap with the normal projection of the connection via in the second organic medium layer 22 on the substrate; and does not overlap with the normal projection of the connection via in the third organic medium layer 23 on the substrate.

[0197] FIG. 12a is a schematic diagram of a planar structure of another display substrate according to an embodiment of the present disclosure. In an exemplary embodiment, in a direction parallel to the display substrate, as shown in FIG. 12a, the structure of the display substrate according to the embodiment of the present disclosure is substantially the same as that of the embodiment shown in FIG. 4a, except that the shape of the isolation groove 31 of the display substrate according to the embodiment of the present disclosure in the direction parallel to the substrate includes an L shape, one edge of the isolation groove 31 is located on one side of the sub-pixel region 100 in the first direction D1, and the other edge of the isolation groove 31 is located on one side of the sub-pixel region 100 in the second direction D2.

[0198] FIG. 12b is a schematic diagram of simulation of the resistance of the second electrode material of a display substrate according to an embodiment of the present disclosure; and FIG. 12c is a schematic diagram of simulation of the voltage drop of the second electrode material of a display substrate according to an embodiment of the present disclosure. Taking a display substrate with a 2x2 Pixel unit (2B in 1) as an example, simulation experiments of the resistance and voltage drop of the second electrode of the display substrate according to the embodiment of the present disclosure are performed, as shown in FIG. 12b and FIG. 12c, the surface resistance of the second electrode material of the display substrate according to the embodiment of the present disclosure is 37.83Ω, which is about 24.83% higher than that of the second electrode material of the display substrate shown in FIG. 7a and FIG. 7b, the extension length of the second electrode material is increased, and the voltage drop uniformity of the power supply line of the second electrode is better.

[0199] FIG. 12d is a schematic diagram of simulation of the resistance of the second electrode material of a display substrate; and FIG. 12e is a schematic diagram of simulation of the voltage drop of the second electrode material of a display substrate. Taking a display substrate with a 2x2 Pixel unit (2B in 1) as an example, the L-shaped isolation groove of the display substrate forms an undercut structure, and the light-emitting functional layer material and the second electrode material are separated at the L-shaped isolation groove. Simulation experiments of the resistance and voltage drop of the light-emitting functional layer material and the second electrode material of the display substrate are performed, as shown in FIG. 12d and FIG. 12e, the separation of the light-emitting functional layer material and the second electrode material at the L-shaped isolation groove results in a substantial increase in the resistance of the light-emitting functional layer material and the second electrode material, and the resistance of the light-emitting functional layer material and the second electrode material is about 52.68Ω, and the voltage drop uniformity of the power supply line of the second electrode is poor.

[0200] FIG. 13a is a schematic diagram of a planar structure of another display substrate according to an embodiment of the present disclosure. In an exemplary embodiment, in a direction parallel to the display substrate, as shown in FIG. 13a, the structure of the display substrate according to the embodiment of the present disclosure is substantially the same as that of the embodiment shown in FIG. 4a, except that the shape of the isolation groove 31 of the display substrate according to the embodiment of the present disclosure in the direction parallel to the substrate includes a rectangular ring shape, and the isolation groove 31 is arranged around the periphery of the sub-pixel region 100.

[0201] FIG. 13b is a simulation diagram of the resistance of the second electrode material of the display substrate according to an embodiment of the present disclosure; and FIG. 13c is a simulation diagram of the voltage drop of the second electrode material of the display substrate according to an embodiment of the present disclosure. The resistance and voltage drop of the second electrode material of the display substrate according to an embodiment of the present disclosure are simulated by taking the display substrate with 2x2 Pixel units (2B in 1) as an example. As shown in FIG. 13b and FIG. 13c, the surface resistance of the second electrode material of the display substrate according to an embodiment of the present disclosure is 38.89Ω. Compared with the second electrode material of the display substrate shown in FIG. 7a and FIG. 7b, the resistance of the second electrode material of the display substrate according to an embodiment of the present disclosure is increased by about 28.34Ω. The extension length of the second electrode material is increased, and the voltage drop uniformity of the power supply line of the second electrode is better.

[0202] FIG. 14 is a schematic diagram of the planar structure of another display substrate according to an embodiment of the present disclosure. In an example embodiment, in the direction parallel to the display substrate, as shown in FIG. 14, the structure of the display substrate according to an embodiment of the present disclosure is basically the same as that shown in FIG. 4a, except that the shape of the isolation groove 31 of the display substrate according to an embodiment of the present disclosure in the direction parallel to the substrate includes a strip shape, and the sub-pixel region 100 is provided with two isolation grooves 31 arranged at intervals on one side in the first direction D1, both of which extend along the second direction D2, and the two isolation grooves 31 are arranged at intervals along the first direction D1.

[0203] FIG. 15 is a schematic diagram of the planar structure of another display substrate according to an embodiment of the present disclosure. In an example embodiment, in the direction parallel to the display substrate, as shown in FIG. 15, the structure of the display substrate according to an embodiment of the present disclosure is basically the same as that shown in FIG. 4a, except that the shape of the sub-pixel region 100 of the display substrate according to an embodiment of the present disclosure can include a circular shape, and the shape of the isolation groove 31 can include a ring shape, for example, a circular ring shape, and the isolation groove 31 is arranged around the periphery of the sub-pixel region 100. For example, the shape of the isolation groove 31 is a circular ring shape, and the isolation groove 31 is arranged with the same center as the sub-pixel region 100.

[0204] FIG. 16 is a schematic diagram of the planar structure of another display substrate according to an embodiment of the present disclosure. In an example embodiment, in the direction parallel to the display substrate, as shown in FIG. 15, the structure of the display substrate according to an embodiment of the present disclosure is basically the same as that shown in FIG. 4a, except that the shape of the sub-pixel region 100 of the display substrate according to an embodiment of the present disclosure includes a hexagonal shape, and the shape of the isolation groove 31 can include a ring shape, for example, a hexagonal shape, and the isolation groove 31 is arranged around the periphery of the sub-pixel region 100.

[0205] In an example embodiment, the display substrate according to the present disclosure includes first, second, and third sub-pixel regions 110, 120, and 130 arranged in a diamond pattern, each of the first, second, and third sub-pixel regions 110, 120, and 130 having a hexagonal shape, and a portion of an isolation groove 31 being shared between adjacent edges of the sub-pixel regions. For example, an edge of the first sub-pixel region 110 adjacent to the second sub-pixel region 120 shares an edge of the isolation groove 31 with an edge of the second sub-pixel region 120 adjacent to the first sub-pixel region 110. An edge of the first sub-pixel region 110 adjacent to the third sub-pixel region 130 shares an edge of the isolation groove 31 with an edge of the third sub-pixel region 130 adjacent to the first sub-pixel region 110. An edge of the second sub-pixel region 120 adjacent to the first sub-pixel region 110 shares an edge of the isolation groove 31 with an edge of the third sub-pixel region 130 adjacent to the first sub-pixel region 110.

[0206] In another aspect, the present disclosure provides a method for manufacturing a display substrate, including:

[0207] forming a dielectric layer on a substrate;

[0208] forming an organic structure layer on the dielectric layer;

[0209] forming an isolation groove in the organic structure layer, the isolation groove including a side surface, and an angle of slope of the side surface of the isolation groove being an acute angle;

[0210] forming a first electrode on the organic structure layer, a projection of the first electrode on the substrate not overlapping a projection of the isolation groove on the substrate;

[0211] forming a light-emitting functional layer on the first electrode;

[0212] forming a second electrode on the light-emitting functional layer;

[0213] at least one of a material of the light-emitting functional layer and a material of the second electrode includes a projection of the isolation groove on the substrate.

[0214] In an example embodiment, forming a light-emitting functional layer on the first electrode includes:

[0215] forming a pixel definition layer on the first electrode, the pixel definition layer including a pixel opening exposing at least a portion of the first electrode, and a projection of the pixel definition layer on the substrate not overlapping a projection of the isolation groove on the substrate;

[0216] Forming a light-emitting functional layer on the pixel definition layer, the light-emitting functional layer being connected with the exposed first electrode.

[0217] In an exemplary embodiment, forming the pixel definition layer on the first electrode comprises:

[0218] Depositing a layer of pixel definition film on the first electrode, etching the pixel definition film by a patterning process to form the pixel definition layer, the pixel definition film on the isolation groove being etched and removed to expose the inner wall of the isolation groove.

[0219] In an exemplary embodiment, the etching depth of the pixel definition film is less than or equal to the sum of the thickness of the pixel definition layer and the thickness of the organic structure layer, and greater than or equal to the thickness of the pixel definition layer.

[0220] In an exemplary embodiment, the etching depth of the pixel definition film is less than or equal to 2 microns, and greater than or equal to 1 micron.

[0221] The present disclosure also provides a display device comprising the aforementioned display substrate. The display device can be any product or component with display function, such as mobile phones, tablets, televisions, monitors, notebook computers, digital photo frames, navigation devices, etc., and the embodiments of the present disclosure are not limited thereto.

[0222] Although the embodiments of the present disclosure are as described above, the content described is only the embodiments adopted for the purpose of facilitating the understanding of the present disclosure, and is not intended to limit the present disclosure. Any person skilled in the art can make any modifications and changes in the form and details without departing from the spirit and scope of the present disclosure, but the patent protection scope of the present disclosure shall be subject to the scope defined by the appended claims.

Claims

1. A display substrate, comprising a sub-pixel region and a non-sub-pixel region, the sub-pixel region comprising a dielectric layer disposed on a substrate, an organic structure layer disposed on a side of the dielectric layer distal to the substrate, and a first electrode, a light-emitting functional layer and a second electrode disposed on a side of the organic structure layer distal to the substrate in sequence, the non-sub-pixel region comprising a dielectric layer disposed on a substrate, an organic structure layer disposed on a side of the dielectric layer distal to the substrate, and at least one isolation groove disposed in the organic structure layer, the at least one isolation groove being located on at least one side of the sub-pixel region, the isolation groove comprising a side surface, an angle of slope of the side surface of the isolation groove being an acute angle, a normal projection of at least one of the light-emitting functional layer material and the second electrode material on the substrate containing a normal projection of the isolation groove on the substrate. 2.The display substrate of claim 1, wherein, The angle of slope is greater than or equal to 50 degrees and less than or equal to 80 degrees. 3.The display substrate of claim 2, wherein, The angle of slope is greater than or equal to 70 degrees and less than or equal to 80 degrees. 4.The display substrate of claim 1, wherein, The isolation groove extends from a side surface of the organic structure layer distal to the substrate towards the substrate, the isolation groove comprising a bottom surface, the bottom surface of the isolation groove being located in the organic structure layer, or the isolation groove penetrating through the organic structure layer, the bottom surface of the isolation groove being a surface of the dielectric layer distal to the substrate. 5.The display substrate of claim 1, wherein, The isolation groove comprises an inverted trapezoid in a cross section perpendicular to the substrate. 6.The display substrate of claim 1, wherein, The isolation groove comprises a strip in a shape parallel to the substrate. 7.The display substrate of claim 1, wherein, The isolation groove comprises an L shape in a shape parallel to the substrate. 8.The display substrate of claim 1, wherein, The isolation groove comprises a ring in a shape parallel to the substrate, the isolation groove surrounding a periphery of the sub-pixel region. 9.The display substrate of claim 1, wherein, At least two isolation grooves are located on the same side of the sub-pixel region. 10.The display substrate of any one of claims 1 to 9, further comprising a pixel definition layer disposed on a side of the first electrode distal to the substrate, the pixel definition layer comprising a pixel opening exposing at least part of the first electrode, a normal projection of the pixel definition layer on the substrate not overlapping with a normal projection of the isolation groove on the substrate. 11.The display substrate of claim 10, wherein, The isolation groove is located on a side of the pixel opening in a first direction, a length of the isolation groove in a second direction being greater than or equal to a length of the pixel opening in the second direction, the first direction and the second direction both being parallel to the substrate, the first direction intersecting the second direction. 12.The display substrate of claim 10, wherein, A distance between an edge of a normal projection of the pixel definition layer on the substrate and an edge of a normal projection of a bottom of the isolation groove on the substrate is greater than or equal to 0.4 microns and less than or equal to 4 microns. 13.The display substrate of claim 10, wherein, A distance between an edge of a normal projection of the pixel definition layer on the substrate and an edge of a normal projection of a bottom of the isolation groove on the substrate is m, a width of a normal projection of the bottom of the isolation groove on the substrate is n, and 1 < n / m < 10.

14. The display substrate according to any one of claims 1 to 9, wherein The organic structure layer comprises at least one organic dielectric layer. 15.The display substrate of claim 12, wherein, The organic structure layer comprises a first organic medium layer arranged on the side of the medium layer away from the substrate, and the isolation groove extends from the surface of the side of the first organic medium layer away from the substrate towards the substrate, penetrates the first organic medium layer, and exposes the surface of the side of the medium layer away from the substrate. 16.The display substrate of claim 12, wherein, The organic structure layer comprises a first organic medium layer arranged on the side of the medium layer away from the substrate, and a second organic medium layer arranged on the side of the first organic medium layer away from the substrate, and the isolation groove extends from the surface of the side of the second organic medium layer away from the substrate towards the substrate, penetrates the first organic medium layer and the second organic medium layer, and exposes the surface of the side of the medium layer away from the substrate; or the isolation groove penetrates the second organic medium layer and exposes the first organic medium layer. 17.The display substrate of claim 12, wherein, The organic structure layer comprises a first organic medium layer arranged on the side of the medium layer away from the substrate, a second organic medium layer arranged on the side of the first organic medium layer away from the substrate, and a third organic medium layer arranged on the side of the second organic medium layer away from the substrate, and the isolation groove extends from the surface of the side of the third organic medium layer away from the substrate towards the substrate, penetrates the first organic medium layer, the second organic medium layer and the third organic medium layer, and exposes the surface of the side of the medium layer away from the substrate; or the isolation groove penetrates the third organic medium layer and exposes the second organic medium layer; or the isolation groove penetrates the third organic medium layer and the second organic medium layer and exposes the first organic medium layer.

18. The display substrate according to any one of claims 1 to 9, wherein The light-emitting functional layer material covers the isolation groove, and the thickness of the light-emitting functional layer material is less than the thickness of the light-emitting functional layer in the sub-pixel region.

19. The display substrate of claim 16, wherein, The ratio of the thickness of the light-emitting functional layer material to the thickness of the light-emitting functional layer in the sub-pixel region is greater than or equal to 1 / 4 and less than or equal to 1 / 2.

20. The display substrate according to any one of claims 1 to 9, wherein The second electrode material covers the isolation groove, and the thickness of the second electrode material is less than the thickness of the second electrode in the sub-pixel region. 21.The display substrate of claim 18, wherein, The ratio of the thickness of the second electrode material to the thickness of the second electrode in the sub-pixel region is greater than or equal to 1 / 4 and less than or equal to 1 / 2.

22. The display substrate according to any one of claims 1 to 9, wherein The orthogonal projection of the first electrode and the isolation groove on the substrate does not overlap.

23. The display substrate according to any one of claims 1 to 9, wherein The medium layer comprises an organic material or an inorganic material.

24. The display substrate according to any one of claims 1 to 9, wherein The light-emitting functional layer comprises at least one light-emitting layer, and at least one of a hole injection layer, a hole transport layer, an electron transport layer, and a charge generation layer.

25. A display device comprising: A display substrate comprising any one of the display substrates according to any one of claims 1 to 22.

26. A method for manufacturing a display substrate, comprising: forming a medium layer on a substrate; forming an organic structure layer on the medium layer; forming an isolation groove in the organic structure layer, the isolation groove comprising a side surface, and the slope angle of the side surface of the isolation groove being an acute angle; forming a first electrode on the organic structure layer, and the orthogonal projection of the first electrode and the isolation groove on the substrate does not overlap; and forming a second electrode on the first electrode. forming a light-emitting functional layer on the first electrode; forming a second electrode on the light-emitting functional layer; the orthographic projection of at least one of the light-emitting functional layer material and the second electrode material on the substrate contains the orthographic projection of the isolation groove on the substrate.

27. The method of producing a display substrate according to claim 24, wherein forming a light-emitting functional layer on the first electrode includes: forming a pixel definition layer on the first electrode, the pixel definition layer being provided with a pixel opening, the pixel opening exposing at least part of the first electrode, the orthographic projection of the pixel definition layer and the isolation groove on the substrate being non-overlapping; forming a light-emitting functional layer on the pixel definition layer, the light-emitting functional layer being connected with the exposed first electrode.

28. The method of producing a display substrate according to claim 25, wherein forming a pixel definition layer on the first electrode includes: depositing a layer of pixel definition film on the first electrode, and etching the pixel definition film by a patterning process to form a pixel definition layer, the pixel definition film on the isolation groove being etched and removed to expose the inner wall of the isolation groove.

29. The method of producing a display substrate according to claim 26, wherein The etching depth of the pixel definition film is less than or equal to the sum of the thickness of the pixel definition layer and the thickness of the organic structure layer, and greater than or equal to the thickness of the pixel definition layer.

30. The method of producing a display substrate according to claim 27, wherein The etching depth of the pixel definition film is less than or equal to 2 microns, and greater than or equal to 1 micron.

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