Flexible circuit board and display device

Abstract

Embodiments of the present application disclose a flexible circuit board and a display device. A substrate has a first surface and a second surface which are opposite to each other; a plurality of bonding pads are arranged on the first surface, the plurality of bonding pads are arranged in rows along both a first direction and a second direction, and a gap space is formed between any two adjacent rows of bonding pads in the first direction; and a plurality of first traces are arranged on the second surface, an orthographic projection pattern of each first trace on the first surface is correspondingly formed in a gap space area, and the plurality of first traces are uniformly arranged in the first direction.

Description

Flexible circuit board and display device

[0001] This application claims priority to Chinese patent application No. 202410329590.6 filed on March 21, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Art

[0003] In the related art of laptop computers, the laptop computer includes a display screen, a flexible circuit board (FPC) bonded to the display screen in a bonding area, and a printed circuit board (PCB) bonded to the end of the FPC away from the display screen. Due to limited lateral space, the gold fingers on the FPC's end near the PCB need to be designed in two rows, one of which emerges from the back through vias. However, due to the uneven layout and inconsistent line widths on the back, the support strength of the back of the entire gold finger area varies significantly. When bonding, the area with weaker support strength will sink during the hot pressing process, resulting in poor bonding. SUMMARY OF THE INVENTION

[0004] The embodiments of the present application provide a flexible circuit board and a display device, which can reduce the risk of defects occurring during the binding of the flexible circuit board.

[0005] In one aspect, an embodiment of the present application provides a flexible circuit board, comprising:

[0006] A substrate having a first surface and a second surface opposite to each other;

[0007] a plurality of binding pads disposed on the first surface, the plurality of binding pads being arranged in rows along a first direction and a second direction, the first direction and the second direction intersecting, and a gap space being formed between any two adjacent rows of binding pads in the first direction;

[0008] A plurality of first routing lines are arranged on the second surface, an orthographic projection pattern of the first routing line on the first surface is correspondingly arranged in a gap space area, and the plurality of first routing lines are evenly arranged along the first direction.

[0009] On the other hand, an embodiment of the present application also provides a display device, which includes a display panel, a printed circuit board and a flexible circuit board as described in any one of the above embodiments, one end of the flexible circuit board is bound and connected to the display panel, and the binding pad at the other end of the flexible circuit board is bound and connected to the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG1 is a schematic cross-sectional view of a flexible circuit board provided in an embodiment of the present application;

[0011] FIG2 is a schematic top view of the flexible circuit board provided in an embodiment of the present application;

[0012] FIG3 is a bottom view of the flexible circuit board provided in an embodiment of the present application;

[0013] FIG4 is a schematic structural diagram of circuit connections in a flexible circuit board provided in an embodiment of the present application;

[0014] FIG5 is another bottom view schematic diagram of the flexible circuit board provided in an embodiment of the present application;

[0015] FIG6 is another bottom view of the flexible circuit board provided in an embodiment of the present application;

[0016] FIG7 is another bottom view of the flexible circuit board provided in an embodiment of the present application;

[0017] FIG8 is a schematic structural diagram of a display device provided in an embodiment of the present application. Modes for Carrying Out the Invention

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described here are only used to illustrate and explain the present application and are not used to limit the present application. In this application, the various embodiments can be combined with each other but will not be repeated one by one. In addition, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inner" and "outer" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as labels and do not impose numerical requirements or establish an order.

[0019] The embodiment of the present application provides a flexible circuit board, which includes:

[0020] A substrate having a first surface and a second surface opposite to each other;

[0021] a plurality of binding pads disposed on the first surface, the plurality of binding pads being arranged in rows along a first direction and a second direction, the first direction and the second direction intersecting, and a gap space being formed between any two adjacent rows of binding pads in the first direction;

[0022] A plurality of first routing lines are arranged on the second surface, an orthographic projection pattern of the first routing line on the first surface is correspondingly arranged in a gap space area, and the plurality of first routing lines are evenly arranged along the first direction.

[0023] Optionally, in some embodiments of the present application, the plurality of binding pads are arranged along the first direction and the second direction to form a binding pad as a whole, and in the second direction, the length of the first trace is greater than or equal to the length of the binding pad as a whole.

[0024] Optionally, in some embodiments of the present application, in the orthographic projection pattern of the flexible circuit board, the end portions of both ends of the first trace extend beyond the entire binding pad.

[0025] Optionally, in some embodiments of the present application, the first routing includes a signal routing and a non-signal routing, one of the signal routings is correspondingly connected to one of the binding pads, and the non-signal routing is insulated from the binding pad.

[0026] Optionally, in some embodiments of the present application, the width of the signal trace is equal to the width of the non-signal trace.

[0027] Optionally, in some embodiments of the present application, the width of the signal trace is different from the width of the non-signal trace.

[0028] Optionally, in some embodiments of the present application, the first trace is a signal trace, and each of the signal traces is correspondingly connected to each of the binding pads.

[0029] Optionally, in some embodiments of the present application, the flexible circuit board further includes a plurality of support lines arranged on the second surface, and in the first direction, the first traces and the support lines are alternately arranged, and a row of the binding pads' orthographic projection patterns on the second surface overlap with a row of the support lines' orthographic projection patterns on the second surface.

[0030] Optionally, in some embodiments of the present application, the binding pad includes a first pad and a second pad, a plurality of the first pads are arranged in a row along the first direction, a plurality of the second pads are arranged in another row along the first direction, the plurality of the second pads include signal pads and non-signal pads, and one of the signal pads is connected to one of the signal traces;

[0031] In the area of ​​at least two of the continuously arranged non-signal pads, at least two of the support lines are sequentially connected to form a sheet-shaped support portion.

[0032] Optionally, in some embodiments of the present application, orthographic projection patterns of the end portions of both ends of the support line on the second surface both exceed the orthographic projection pattern of the entire binding pad on the second surface.

[0033] Optionally, in some embodiments of the present application, in the first direction, the width of the support line is smaller than the width of the binding pad.

[0034] Optionally, in some embodiments of the present application, in the first direction, the width of the support line is equal to the width of the first routing line.

[0035] Optionally, in some embodiments of the present application, the flexible circuit board further includes a second trace and a third trace provided on the first surface, the binding pad includes a first pad and a second pad, a plurality of the first pads are arranged in a row along the first direction, and a plurality of the second pads are arranged in another row along the first direction, the second trace and the third trace are both located on a side of the first pad away from the second pad, the substrate is provided with a first via and a second via, the first via is located on a side of the second pad away from the first pad, and the second via is located on a side of the first pad away from the second pad;

[0036] The first pad is connected to the second routing line, one end of the signal routing line is connected to the second pad through the first via hole, and the other end of the signal routing line is connected to the third routing line through the second via hole.

[0037] Optionally, in some embodiments of the present application, a first trace is correspondingly arranged in each of the gap space areas.

[0038] Optionally, in some embodiments of the present application, in the first direction, the width of the gap space is greater than or equal to the width of the first trace.

[0039] Correspondingly, an embodiment of the present application also provides a display device, which includes a display panel, a printed circuit board and a flexible circuit board as described in any one of the above embodiments, one end of the flexible circuit board is bound and connected to the display panel, and the binding pad at the other end of the flexible circuit board is bound and connected to the printed circuit board.

[0040] The flexible printed circuit board of the present application embodiment has multiple first traces disposed on the second surface of the substrate. The orthographic projection pattern of the traces on the first surface corresponds to the gap space region, and the multiple first traces are evenly arranged along the first direction. The uniform arrangement of the multiple first traces on the back surface of the substrate improves the uniformity of the first trace layout, thereby increasing the uniformity of the support strength across the entire area of ​​the binding pad, thereby reducing the risk of poor binding.

[0041] The embodiments of the present application provide a flexible circuit board and a display device, which are described in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.

[0042] 1 to 3 , an embodiment of the present application provides a flexible circuit board 100 , which includes a substrate 11 , a plurality of binding pads 12 , and a plurality of first traces 13 .

[0043] The substrate 11 has a first surface c1 and a second surface c2 disposed opposite to each other.

[0044] A plurality of binding pads 12 are provided on the first surface c1. The plurality of binding pads 12 are arranged in rows along a first direction x and a second direction y. The second direction y intersects the first direction x. In the first direction x, a gap jx is formed between any two adjacent rows of binding pads 12.

[0045] A plurality of first traces 13 are disposed on the second surface c2. The orthographic projection pattern of a first trace 13 on the first surface c1 corresponds to a gap jx region. In other words, a first trace 13 is correspondingly disposed within a gap jx region. The plurality of first traces 13 are evenly arranged along the first direction x.

[0046] The flexible circuit board 100 of the present embodiment is provided with multiple first traces 13 on the second surface c2 of the substrate 11. The orthographic projection pattern of each first trace 13 on the first surface c1 corresponds to a gap space jx region. Specifically, each gap space jx region corresponds to a first trace 13, and the multiple first traces 13 are evenly arranged along the first direction x. The uniform arrangement of the multiple first traces 13 on the back surface of the substrate 11 improves the uniformity of the layout of the first traces 13, thereby improving the uniformity of the support strength across the entire area of ​​the binding pad 12 and reducing the risk of poor binding.

[0047] It should be understood that the plane where the binding pad 12 is located is the front side of the flexible circuit board 100 , the top view of the flexible circuit board 100 is the front side view of the flexible circuit board 100 , and the bottom view of the flexible circuit board 100 is the back side view of the flexible circuit board 100 .

[0048] Optionally, the first direction x is perpendicular to the second direction y. Of course, in some embodiments, the first direction x and the second direction y may also intersect at an angle.

[0049] Optionally, the binding pad 12 extends along the second direction y. The binding pad 12 is rectangular, and the long axis direction of the binding pad 12 is the second direction y.

[0050] Optionally, in an embodiment of the present application, each gap space jx is correspondingly provided with a first trace 13. Such a configuration not only improves the uniformity of the support strength of the entire area of ​​the binding pad 12, but also improves the support strength.

[0051] Of course, in some embodiments, a first trace 13 may be provided in at least one gap space jx. For example, a first trace 13 may be provided in every other gap space jx, that is, only one of two adjacent gap spaces jx may be provided with a first trace 13. Another example is that a first trace 13 may be provided in every two or three gap spaces jx.

[0052] Optionally, in one embodiment of the present application, in the first direction x, the width k1 of the gap space jx is equal to the width k2 of the first trace 13, so that the supporting area of ​​the entire binding pad bd is uniform, thereby improving the binding yield and the supporting strength.

[0053] Optionally, the width k2 of the first trace 13 is between 0.05 mm and 0.2 mm, for example, it can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm or 0.2 mm, etc.

[0054] In some embodiments, the width k1 of the gap space xj may also be greater than the width k2 of the first trace 13 .

[0055] Optionally, in an embodiment of the present application, a plurality of binding pads 12 are arranged into a binding pad assembly bd along the first direction x and the second direction y. In the second direction y, the length of the first trace 13 is greater than or equal to the length d1 of the binding pad assembly bd.

[0056] The orthographic projection patterns of the ends of both ends of the first trace 13 on the second surface c2 both extend beyond the orthographic projection pattern of the entire binding pad bd on the second surface c2 .

[0057] The ends of both ends of the first trace 13 extend beyond the entire binding pad bd, ensuring that the first trace 13 can support the entire binding pad bd in the second direction y, thereby preventing the upper and lower ends of the entire binding pad bd from being unsupported.

[0058] In one embodiment of the present application, the first traces 13 include signal traces 131 and non-signal traces 132. A signal trace 131 is connected to a corresponding binding pad 12. The non-signal trace 132 is insulated from the binding pad 12.

[0059] It should be understood that in this embodiment, the non-signal traces 132 are used to supplement the gap space jx, so that the supporting area of ​​the entire binding pad bd is uniform, thereby improving the binding yield.

[0060] Optionally, the width of the signal trace 131 is equal to the width of the non-signal trace 132 to further improve the uniformity of support.

[0061] Optionally, in some embodiments, the width of the signal trace 131 may be different from the width of the non-signal trace 132 . The signal trace 131 may have different line widths according to actual load requirements, and the line width of the non-signal trace 132 may not be restricted.

[0062] Optionally, the length of the signal trace 131 is greater than the length of the non-signal trace 132 to prevent the non-signal trace 132 from interfering with the end of the signal trace 131 and causing signal interference.

[0063] Optionally, the width k2 of the signal trace 131 and the non-signal trace 132 is between 0.05 mm and 0.2 mm, for example, it can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm or 0.2 mm, etc.

[0064] In the orthographic projection pattern of the flexible circuit board 100 , both ends of the non-signal trace 132 are semicircular, so that the ends of the non-signal trace 132 have no sharp edges, thereby reducing the impact of interference signals entering the non-signal trace 132 on the signal trace 131 .

[0065] Referring to Figures 2 and 4, in one embodiment of the present application, the flexible circuit board 100 further includes a second trace 14 and a third trace 15 disposed on the first surface c1. The binding pad 12 includes a first pad 121 and a second pad 122. A plurality of first pads 121 are arranged in a row along the first direction x. A plurality of second pads 122 are arranged in another row along the first direction x. The second trace 14 and the third trace 15 are both located on a side of the first pad 121 away from the second pad 122. The substrate 11 is provided with a first via g1 and a second via g2. The first via g1 is located on a side of the second pad 122 away from the first pad 121, and the second via g2 is located on a side of the first pad 121 away from the second pad 122.

[0066] The first pad 121 is connected to the second trace 14. One end of the signal trace 131 is connected to the second pad 122 through the first via g1, and the other end of the signal trace 131 is connected to the third trace 15 through the second via g2.

[0067] Optionally, in the first direction x, the second wirings 14 and the third wirings 15 are alternately arranged to improve space utilization.

[0068] Referring to Figures 2 and 5 , based on the above-described embodiments, in one embodiment of the present application, the flexible printed circuit board 100 further includes a plurality of support lines 16 disposed on the second surface c2. In the first direction x, the first traces 13 and the support lines 16 are alternately disposed. The orthographic projection pattern of a row of binding pads 12 on the second surface c2 overlaps the orthographic projection pattern of a support line 16 on the second surface c2.

[0069] The support wire 16 is overlapped with the binding pad 12, that is, the binding pad 12 is supported by the support wire 16, thereby improving the support uniformity of the entire binding pad bd and the support strength.

[0070] Optionally, in the first direction x, the first traces 13 and the support lines 16 are alternately and evenly arranged to further improve the support uniformity of the entire binding pad bd.

[0071] Optionally, the orthographic projection patterns of the ends of the support line 16 at both ends on the second surface c2 exceed the orthographic projection pattern of the binding pad as a whole bd on the second surface c2, so as to ensure that the support line 16 can support the entire binding pad as a whole bd in the second direction y, and avoid the situation where the upper and lower ends of the binding pad as a whole bd are not supported.

[0072] Optionally, in the first direction x, the width k3 of the support line 16 is smaller than the width k4 of the binding pad 12 , so as to prevent the support line 16 from being connected to the adjacent first trace 13 .

[0073] Optionally, the width k3 of the support line 16 is between 0.05 mm and 0.2 mm, for example, it can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm or 0.2 mm, etc.

[0074] Optionally, the support line 16 and the first wiring 13 are provided in the same layer and are manufactured using the same process. The support line 16 and the first wiring 13 are made of the same material, such as metal, metal alloy or other conductive material.

[0075] The support wire 16 is made of metal or metal alloy, which can improve the heat dissipation efficiency of the flexible circuit board 100 .

[0076] Optionally, in the first direction x, the width k3 of the support line 16 is equal to the width k2 of the first trace 13. Such a setting can improve the support uniformity of the entire binding pad bd.

[0077] Optionally, in some embodiments, the width k3 of the support line 16 is greater than or equal to the width k2 of the first trace 13, and one support line 16 is connected to one first trace 13. Such a setting not only improves the support strength, but also reduces the impedance of the first trace 13 and improves the heat dissipation efficiency of the first trace 13.

[0078] Optionally, the center line of the support line 16 coincides with the center line of the binding pad 12 , so that the support line 16 evenly supports the binding pad 12 .

[0079] In the orthographic projection pattern of the flexible circuit board 100 , both ends of the support line 16 are semicircular, so that the ends of the support line 16 have no sharp edges, thereby reducing the impact of interference signals entering the support line 16 on the signal trace 131 .

[0080] 2 and 6 , compared to the above embodiments, one embodiment of the present application differs in that the first traces 13 are signal traces, each of which is connected to a corresponding binding pad 12. In other words, all first traces 13 of this embodiment are signal traces, and no non-signal traces 132 are provided. Each first trace 13 is connected to a corresponding binding pad 12.

[0081] In this embodiment, all signal traces are evenly arranged in the entire binding pad bd area, and a first trace 13 is correspondingly arranged in a gap space jx area, so that the first trace 13 can not only realize the signal transmission function but also improve the support uniformity of the entire binding pad bd.

[0082] Optionally, the flexible circuit board 100 further includes a plurality of support lines 16 disposed on the second surface c2. In the first direction x, the first traces 13 and the support lines 16 are alternately disposed. The orthographic projection pattern of a row of binding pads 12 on the second surface c2 overlaps the orthographic projection pattern of a support line 16 on the second surface c2.

[0083] The support wire 16 is overlapped with the binding pad 12, that is, the binding pad 12 is supported by the support wire 16, thereby improving the support uniformity of the entire binding pad bd and the support strength.

[0084] Optionally, in the first direction x, the first traces 13 and the support lines 16 are alternately and evenly arranged to further improve the support uniformity of the entire binding pad bd.

[0085] Optionally, the orthographic projection patterns of the ends of the support line 16 at both ends on the second surface c2 exceed the orthographic projection pattern of the binding pad as a whole bd on the second surface c2, so as to ensure that the support line 16 can support the entire binding pad as a whole bd in the second direction y, and avoid the situation where the upper and lower ends of the binding pad as a whole bd are not supported.

[0086] Optionally, in the first direction x, the width k3 of the support line 16 is smaller than the width k4 of the binding pad 12 , so as to prevent the support line 16 from being connected to the adjacent first trace 13 .

[0087] Optionally, the support line 16 and the first wiring 13 are provided in the same layer and are manufactured using the same process. The support line 16 and the first wiring 13 are made of the same material, such as metal, metal alloy or other conductive material.

[0088] Optionally, in the first direction x, the width k3 of the support line 16 is equal to the width k2 of the first trace 13. Such a setting can improve the support uniformity of the entire binding pad bd.

[0089] Optionally, in some embodiments of the present application, the orthographic projection patterns of the ends of both ends of the support line 16 on the second surface c2 both exceed the orthographic projection pattern of the entire binding pad bd on the second surface c2.

[0090] Optionally, the center line of the support line 16 coincides with the center line of the binding pad 12 , so that the support line 16 evenly supports the binding pad 12 .

[0091] In the orthographic projection pattern of the flexible circuit board 100 , both ends of the support line 16 are semicircular, so that the ends of the support line 16 have no sharp edges, thereby reducing the impact of interference signals entering the support line 16 on the signal trace 131 .

[0092] Referring to FIG. 7 , based on the embodiment corresponding to FIG. 6 , the difference in the flexible circuit board 100 of the present embodiment is that the plurality of second pads 122 include signal pads 12 a and non-signal pads 12 b , and a signal pad 12 a is connected to a signal trace 13 .

[0093] In the region of at least two continuously arranged non-signal pads 12 b , at least two supporting lines 16 are sequentially connected to form a sheet-shaped supporting portion 17 .

[0094] It should be noted that the non-signal pad 12b is configured to not receive signals, that is, the non-signal pad 12b does not participate in signal transmission. The accompanying drawings of this embodiment illustrate three consecutive non-signal pads 12b as an example, but are not limited thereto. For example, two, four, five, or six consecutive non-signal pads 12b may be used.

[0095] The support portion 17 is used to support the area of ​​the non-signal pad 12 b , which can reduce the risk of binding and improve the support strength.

[0096] 8 , the present invention also provides a display device 1000, which includes a display panel PN, a printed circuit board PCB, and a flexible circuit board 100 according to any of the above embodiments. One end of the flexible circuit board 100 is bonded to the display panel PN, and a bonding pad 12 at the other end of the flexible circuit board 100 is bonded to the printed circuit board PCB.

[0097] It should be noted that the structure of the flexible circuit board 100 of the display device 1000 of this embodiment is similar to or the same as the structure of any of the flexible circuit boards 100 described above, and therefore will not be described in detail here.

[0098] The flexible circuit board 100 of the display device 1000 of the present embodiment has multiple first traces 13 disposed on the second surface c2 of the substrate 11. The orthographic projection pattern of each first trace 13 on the first surface c1 corresponds to a gap jx region. In other words, each gap jx region corresponds to a first trace 13 disposed therein. The multiple first traces 13 are evenly arranged along the first direction x. The uniform arrangement of the multiple first traces 13 on the back surface of the substrate 11 improves the uniformity of the layout of the first traces 13, thereby increasing the uniformity of the support strength provided to the entire binding pad bd region and reducing the risk of poor binding.

[0099] The above is a detailed introduction to a flexible circuit board and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A flexible circuit board, comprising: A substrate having a first surface and a second surface opposite to each other; a plurality of binding pads disposed on the first surface, the plurality of binding pads being arranged in rows along a first direction and a second direction, the first direction and the second direction intersecting, and a gap space being formed between any two adjacent rows of binding pads in the first direction; A plurality of first routing lines are arranged on the second surface, an orthographic projection pattern of the first routing line on the first surface is correspondingly arranged in a gap space area, and the plurality of first routing lines are evenly arranged along the first direction.

2. The flexible circuit board according to claim 1, wherein: The first routing lines include signal routing lines and non-signal routing lines. One signal routing line is connected to one binding pad, and the non-signal routing lines are insulated from the binding pad.

3. The flexible circuit board according to claim 2, wherein: The width of the signal trace is equal to the width of the non-signal trace.

4. The flexible circuit board according to claim 2, wherein: The width of the signal trace is different from the width of the non-signal trace.

5. The flexible circuit board according to claim 1, wherein The first trace is a signal trace, and each of the signal traces is correspondingly connected to one of the binding pads.

6. The flexible circuit board according to claim 5, wherein: The flexible circuit board also includes multiple support lines arranged on the second surface. In the first direction, the first lines and the support lines are arranged alternately, and the orthographic projection pattern of a row of the binding pads on the second surface overlaps with the orthographic projection pattern of a support line on the second surface.

7. The flexible circuit board according to claim 6, wherein: The binding pad includes a first pad and a second pad, a plurality of the first pads are arranged in a row along the first direction, a plurality of the second pads are arranged in another row along the first direction, the plurality of the second pads include signal pads and non-signal pads, and a signal pad is connected to a signal trace; In the area of ​​at least two of the continuously arranged non-signal pads, at least two of the support lines are sequentially connected to form a sheet-shaped support portion.

8. The flexible circuit board according to claim 6, wherein: The orthographic projection patterns of the end portions of both ends of the support line on the second surface both exceed the orthographic projection pattern of the entire binding pad on the second surface.

9. The flexible circuit board according to claim 6, wherein: In the first direction, the width of the support line is equal to the width of the first trace.

10. The flexible circuit board according to any one of claims 2 to 9, wherein: The flexible circuit board further includes a second trace and a third trace provided on the first surface, the binding pad includes a first pad and a second pad, a plurality of the first pads are arranged in a row along the first direction, and a plurality of the second pads are arranged in another row along the first direction, the second trace and the third trace are both located on a side of the first pad away from the second pad, and the substrate is provided with a first via and a second via, the first via is located on a side of the second pad away from the first pad, and the second via is located on a side of the first pad away from the second pad; The first pad is connected to the second routing line, one end of the signal routing line is connected to the second pad through the first via hole, and the other end of the signal routing line is connected to the third routing line through the second via hole.

11. The flexible circuit board according to any one of claims 1 to 9, wherein: A first wiring is correspondingly arranged in each of the gap space areas.

12. The flexible circuit board according to any one of claims 1 to 9, wherein: In the first direction, the width of the gap space is greater than or equal to the width of the first trace.

13. The flexible circuit board according to any one of claims 1 to 9, wherein: The plurality of binding pads are arranged along the first direction and the second direction to form a binding pad as a whole, and orthographic projection patterns of the ends of both ends of the first trace on the second surface both exceed the orthographic projection pattern of the binding pad as a whole on the second surface.

14. A display device comprising a display panel, a printed circuit board, and the flexible circuit board according to any one of claims 1 to 13, wherein one end of the flexible circuit board is bound and connected to the display panel, and the binding pad at the other end of the flexible circuit board is bound and connected to the printed circuit board.

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