Carrier and vacuum coating device

Abstract

A carrier, comprising: a tray for bearing a substrate to be coated, and a frame (100) for bearing the tray. The frame (100) comprises: two guide rail strips (110), which are arranged in parallel; a plurality of ribs (120), which are connected to the two guide rail strips (110) and are crisscrossed to form a gridded structure; and at least one conductive member (130), which is arranged on the bottom or side of the ribs (120), the bottom of the conductive member (130) being lower than the bottom of the ribs (120).

Description

Carrier plate and vacuum coating device Technical Field

[0001] The utility model relates to the technical field of vacuum coating equipment, in particular to a carrier plate and a vacuum coating device. Background Art

[0002] Plate-type plasma-enhanced chemical vapor deposition (PECVD) vacuum coating lines utilize dynamic carrier motion and static coating. The coating line typically consists of a loading chamber, preheating chamber, process chamber, and unloading chamber. The carrier is driven by rollers through the loading and preheating chambers before arriving in the process chamber. Power is supplied to generate plasma discharge for coating. Both the loading and preheating chambers have upper and lower heating plates, while the process chamber has a lower, retractable heating plate. The plate-type PECVD process chamber consists of two electrodes, one above and one below. The retractable heating plate serves as the lower electrode. The silicon or glass wafer to be coated is placed on the carrier and conveyed by rollers through the heating chamber, heating the carrier and wafer until they reach a desired temperature before entering the process chamber. Once the carrier enters the process chamber, the retractable heating plate lifts the carrier, releasing it from the conveyor rollers. The bottom of the carrier's four-sided frame contacts the heating plate. This contact forms the lower electrode, which, together with the upper electrode, completes a circuit. A certain pressure of process gas is introduced into the process chamber. After the RF power is applied, a plasma glow discharge is generated between the upper and lower electrodes. The process gas is dissociated and then deposited onto the silicon wafer for coating. Poor contact between the bottom of the carbon fiber frame surrounding the carrier and the surface of the lifting hot plate creates gaps, seriously affecting conductivity. When high-power RF power is applied, a large current flows between the carrier and the hot plate, resulting in poor contact and reduced conductivity, which can easily cause an arc between the carrier frame and the hot plate. The instantaneous heat generated by the arc can severely damage the carbon fiber carrier and the hot plate, shortening their lifespans and significantly impacting product quality. Utility Model Content

[0003] One purpose of the first aspect of the present invention is to provide a carrier plate to solve the problem in the prior art that poor contact between the carrier plate and the lower hot plate generates arc discharge and causes damage to the frame and the hot plate.

[0004] An object of the second aspect of the present invention is to provide a vacuum coating device comprising the above-mentioned carrier plate.

[0005] In particular, the present invention further provides a carrier plate, comprising a tray for carrying a substrate to be plated and a frame for carrying the tray, wherein the frame comprises:

[0006] Two guide rails, the two guide rails are arranged parallel to each other;

[0007] A plurality of ribs, which are interconnected with the two guide rails and crisscrossed to form a grid structure; and

[0008] At least one conductive member is disposed at the bottom or side of the rib, and the bottom of the conductive member is lower than the bottom of the rib.

[0009] Optionally, the plurality of ribs include a plurality of first ribs parallel to the guide rails and a plurality of second ribs perpendicular to the guide rails;

[0010] At least one of the conductive members is disposed at the bottom of the first rib and / or the second rib.

[0011] Optionally, a groove is provided at the bottom of the first rib and / or the second rib on which the conductive member is provided, and the conductive member is a strip-shaped structure and is provided in the groove.

[0012] Optionally, the plurality of ribs include a plurality of first ribs parallel to the guide rails and a plurality of second ribs perpendicular to the guide rails;

[0013] At least one of the conductive members is arranged on a side of the first rib and / or the second rib.

[0014] Optionally, the conductive member is fixed to the rib by screws or rivets.

[0015] Optionally, the conductive member is an angle code, which is arranged on the side of the connection between the first rib and the second rib, and the angle code includes a first connection portion connected to the first rib and a second connection portion connected to the second rib.

[0016] Optionally, the bottom of the conductive member is flush with the bottom of the guide rails on both sides.

[0017] In particular, the present invention further provides a vacuum coating device, which includes any one of the carrier plates described above.

[0018] This solution provides a carrier plate, which may include a frame, and the frame may include two guide rails, multiple ribs, and at least one conductive member. The multiple ribs may be interconnected with the two guide rails to form a grid-like structure. At least one conductive member is disposed on the side or bottom of the ribs, with the bottom of the conductive member lower than the bottom of the ribs. This allows the conductive member on the frame to contact the hot plate when the carrier plate is mounted on the hot plate, significantly increasing the conductivity between the frame and the hot plate. This reduces arc discharge between the frame and the hot plate when high-power radio frequency current is fed in, thereby improving product quality and the service life of the hot plate and frame.

[0019] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0021] FIG1 is a bottom view of a frame according to a specific embodiment of the present invention;

[0022] FIG2 is a partial schematic diagram of a frame according to a specific embodiment of the present invention;

[0023] FIG3 is a partial cross-sectional schematic diagram according to a specific embodiment of the present invention;

[0024] FIG4 is a bottom view of a frame according to another specific embodiment of the present invention;

[0025] FIG5 is a partial schematic diagram of a frame according to another specific embodiment of the present invention;

[0026] FIG6 is a partial cross-sectional schematic diagram of a frame according to a specific embodiment of the present invention;

[0027] FIG7 is a partial schematic diagram of a frame according to another specific embodiment of the present invention.

[0028] Description of reference numerals:

[0029] 100 - frame; 110 - guide rail; 120 - rib; 121 - first rib; 122 - second rib; 123 - groove; 130 - conductive member; 131 - first connecting portion; 132 - second connecting portion. DETAILED DESCRIPTION

[0030] In the description of this embodiment, it should be understood that the terms "length", "width", "height", "up", "down", "left", "right", "vertical", "horizontal", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] Figure 1 is a top view of a frame according to a specific embodiment of the present invention; Figure 2 is a partial schematic diagram of the frame of a carrier according to a specific embodiment of the present invention. As a specific embodiment of the present invention, as shown in Figures 1 and 2, Figure 2 is also a partial schematic diagram of the frame viewed from a bottom-up perspective. This embodiment provides a carrier, which includes a tray for supporting substrates to be plated and a frame 100 for supporting the tray. The frame 100 includes two guide rails 110, multiple ribs 120, and at least one conductive member 130. The two guide rails 110 are arranged parallel to each other. The multiple ribs 120 and the two guide rails 110 are interconnected and crisscrossed to form a grid-like structure. It should be noted that a single rib can be a complete single bar or a single bar formed from multiple segments on a straight line. At least one conductive member 130 is disposed at the bottom or side of the multiple ribs 120, with the bottom of the conductive member 130 being lower than the bottom of the ribs 120.

[0032] Specifically, this embodiment provides a carrier, which may include a frame 100, and the frame 100 may include two guide rails 110, multiple ribs 120 and at least one conductive member 130. The multiple ribs 120 may be interconnected with the two guide rails 110 and crisscrossed to form a grid structure. The conductive member 130 is arranged on the side or bottom of the rib 120, and the bottom of the conductive member 130 is lower than the bottom of the rib 120, so that when the frame 100 is installed on the hot plate, the conductive member 130 on the frame 100 contacts the hot plate, greatly increasing the conductivity between the frame and the hot plate. When high-power radio frequency current is fed in, arc discharge between the frame 100 and the hot plate is reduced, thereby improving product quality and the service life of the hot plate and the frame 100.

[0033] Specifically, the multiple ribs 120 of this embodiment may include multiple first ribs 121 parallel to the guide rails 110 and multiple second ribs 122 perpendicular to the guide rails 110. As shown in Figure 1, the two horizontally arranged components at the top and bottom of the figure are guide rails 110. The intermediate horizontal ribs are all first ribs 121. All longitudinal ribs are second ribs 122. The guide rails 110, the first ribs 121, and the second ribs 122 are interconnected to form a grid-like structure. Because the guide rails 110 function as guide rails, their thickness must be greater than that of the ribs 120. As a result, the plane where the bottoms of the guide rails 110 of the frame 100 are located is lower than the plane where the bottoms of the ribs 120 are located. When the frame 100 is placed on the hot plate, the bottoms of the ribs 120, except for the guide rails 110, are all suspended. Therefore, it is necessary to provide conductive members 130 at the bottoms of the ribs 120 to ensure contact between the ribs 120 and the hot plate to prevent arc discharge.

[0034] As a specific embodiment of the present invention, at least one conductive member 130 of this embodiment is disposed at the bottom of each first rib 121 and each second rib 122 .

[0035] Specifically, the conductive member 130 in this embodiment is disposed at the bottom of each first rib 121 and each second rib 122 so that each first rib 121 and each second rib 122 can contact the bottom hot plate through the conductive member 130 , thereby reducing arc discharge.

[0036] As another specific embodiment of the present invention, the conductive member 130 is disposed at the bottom of the two second ribs 122 located at the outermost sides.

[0037] In this embodiment, since the guide bar 110 is in direct contact with the hot plate, the conductivity can be increased. After adding a conductive member 130 at the bottom of the outermost second rib 122, the outermost circle formed by the guide bar 110 and the outermost second rib 122 can be conductive. Because the first rib 121, the second rib 122 and the guide bar 110 are crisscrossed and connected, the arc discharge between the frame 100 and the hot plate can also be reduced.

[0038] As another specific embodiment of the present invention, as shown in FIG1 and FIG2 , the conductive member 130 is disposed at the bottom of the two outermost second ribs 122 and the bottom of the two second ribs 122 adjacent to the outermost position.

[0039] In this embodiment, conductive members 130 are provided on the outermost second rib 122 and the bottom of the second rib 122 adjacent to the outermost second rib 122. Similar to the above embodiment, the conductivity can be increased and the arc discharge between the frame 100 and the hot plate can be reduced.

[0040] Of course, as a preferred embodiment, it is most appropriate to arrange the conductive members 130 at the bottom of all ribs, which has the best conductivity. However, only arranging the conductive members 130 at the bottom of the second ribs 122 on the outside is simple in process and low in cost.

[0041] Figure 3 is a partial cross-sectional schematic diagram of a specific embodiment of the present invention. Specifically, the conductive member 130 in this embodiment can be a strip-shaped structure. Specifically, the conductive member 130 in this embodiment can be a conductive metal wire or a conductive metal sheet, and the bottom of the conductive member 130 is preferably formed into a flat structure to increase the contact area. The conductive member 130 in this embodiment is preferably an aluminum wire (as shown in Figure 3) or an aluminum sheet. When the conductive member 130 is positioned at the bottom of the rib, it protrudes from the bottom of the rib by 0.1-1 mm.

[0042] Specifically, the conductive member 130 of this embodiment can be a long strip structure that matches the length of the rib where the conductive member 130 is required. In other embodiments, the conductive member 130 can also be provided in sections, that is, the conductive member 130 is arranged at intervals at the rib 120 where the conductive member 130 is required.

[0043] As a specific embodiment of the present invention, when the conductive member 130 is provided, a groove 123 is provided at the bottom of the first rib 121 and / or the second rib 122 on which the conductive member 130 is provided, and the conductive member 130 is provided in the groove 123. The groove 123 of this embodiment can be a dovetail groove, or a groove-shaped structure with an opening size smaller than the bottom size similar to a dovetail groove. When the conductive member 130 is provided, the conductive member 130 is clamped in the groove 123 and protrudes from the notch. As shown in Figure 3, the cross-section of the conductive member 130 is circular, and the bottom protrudes from the notch of the groove 123, and the bottom of the conductive member 130 is flush with the bottom of the guide bar 110, thereby ensuring contact and conductivity between the frame 100 and the hot plate and avoiding arc discharge.

[0044] Figure 4 is a bottom view of a frame according to another specific embodiment of the present invention. Figure 5 is a partial schematic diagram of a frame according to another specific embodiment of the present invention. As a specific embodiment of the present invention, the conductive member 130 of this embodiment is disposed on the side of each first rib 121 and / or second rib 122. In other words, the conductive member 130 can be disposed on the side of the first rib 121, the side of the second rib 122, or both the first rib 121 and the second rib 122.

[0045] Specifically, the conductive member 130 of this embodiment is a conductive block, and the conductive member 130 is fixed to the rib by using screws or rivets.

[0046] As one specific embodiment, as shown in FIG. 4 and FIG. 5 , the conductive member 130 of this embodiment is only disposed on the side of the second rib 122 .

[0047] Figure 6 is a partial schematic cross-sectional view of a frame according to another specific embodiment of the present invention. As shown in Figure 6, a conductive member 130 is connected to the second rib 122 via fasteners, and the conductive member 130 protrudes from the bottom of the second rib 122. Preferably, the bottom of the conductive member 130 in this embodiment is flush with the bottom of the guide rail 110, ensuring contact and electrical conductivity between the frame 100 and the hot plate, and preventing arc discharge.

[0048] Specifically, in this embodiment, the conductive member 130 may be an angle bracket, and the material of the angle bracket may be any conductive metal material, preferably an aluminum angle bracket.

[0049] Specifically, when the conductive members 130 are angle brackets, since the first and second ribs 121 and 122 form a cross-shaped intersection except for the outermost positions, one or two conductive members 130 can be provided on the sides of the T-shaped intersection, and one to four conductive members 130 can be provided on the sides of the cross-shaped intersection. The specific number of conductive members 130 can be set according to actual conditions.

[0050] As another specific embodiment of the present invention, the conductive member 130 of this embodiment is disposed on the side of the connection position between the two second ribs 122 located at the outermost sides and all the first ribs 121 .

[0051] In this embodiment, since the bottoms of the upper and lower guide rails 110 are lower than the bottoms of the ribs 120 , conductive members 130 may be provided at the outermost second ribs 122 to increase the conductivity between the frame 100 and the heat plate.

[0052] As another specific embodiment of the present invention, the conductive member 130 of this embodiment is arranged on the side where the two second ribs 122 located at the outermost side are connected to all the first ribs 121, and is arranged on the side where the two second ribs 122 adjacent to the outermost side are connected to all the first ribs 121.

[0053] This embodiment is consistent with the above embodiment in which the conductive member 130 is provided at the bottom of the rib 120 . The conductive member 130 is provided on the side of the outermost side and adjacent to the outermost second rib 122 to increase the conductivity between the frame 100 and the hot plate.

[0054] Similarly, it is the most preferred solution to arrange the conductive members 130 at the intersections of all the first ribs 121 and the second ribs 122, thereby achieving the best conductivity of the frame 100 and the hot plate. The arrangement of the conductive members 130 at the outermost or adjacent second ribs 122 can reduce the number of steps and cost.

[0055] Figure 7 is a partial schematic diagram of a frame according to another specific embodiment of the present invention. As a specific embodiment of the present invention, when the conductive member 130 provided on the side at the connection position in this embodiment is an angle code, the angle code may include a first connection portion 131 connected to the first rib 121 and a second connection portion 132 connected to the second rib 122, and the material of the angle code is a conductive metal material. The first connection portion 131 is connected to the first rib 121 by screws, and the second connection portion 132 is connected to the second rib 122 by screws. In addition to having a conductive function, the conductive member 130 of this embodiment can also increase the stability of the connection between the first rib 121 and the second rib 122.

[0056] As a specific embodiment of the present invention, the bottom of the conductive member 130 protrudes from the plane of the bottoms of the first and second ribs 121, 122. Preferably, the aluminum angle bracket of this embodiment protrudes from the plane of the bottoms of the first and second ribs 121, 122 by 1-3 mm. Similarly, the bottom of the angle bracket can be flush with the bottom of the guide rail 110, ensuring contact and electrical conductivity between the frame 100 and the hot plate, preventing arcing.

[0057] As a specific embodiment of the present invention, in this embodiment, the conductive member 130 can be disposed at the bottom of the first rib 121 and / or the second rib 122, and also at the side of the connection between the first rib 121 and the second rib 122. That is, the frame 100 can be provided with a groove 123 at the bottom of the rib and then a conductive wire can be fixed in the groove 123, and angle brackets or conductive blocks can be provided at the side of the rib. This design improves the conductivity between the frame 100 and the hot plate, enhances the stability of the frame, prevents arcing during use, and improves product quality.

[0058] As a specific embodiment of the present invention, this embodiment further provides a vacuum coating device, which may include the carrier plate described above.

[0059] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention can be directly determined or deduced from the contents disclosed herein without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A carrier plate comprising a tray for carrying a substrate to be plated and a frame for carrying the tray, characterized in that: The framework includes: Two guide rails, the two guide rails are arranged parallel to each other; A plurality of ribs, which are interconnected with the two guide rails and crisscrossed to form a grid structure; and At least one conductive member is disposed at the bottom or side of the rib, and the bottom of the conductive member is lower than the bottom of the rib.

2. The carrier board according to claim 1, characterized in that The plurality of ribs include a plurality of first ribs parallel to the guide rails and a plurality of second ribs perpendicular to the guide rails; At least one of the conductive members is disposed at the bottom of the first rib and / or the second rib.

3. The carrier board according to claim 2, characterized in that: A groove is provided at the bottom of the first rib and / or the second rib on which the conductive member is provided. The conductive member is a strip-shaped structure and is provided in the groove.

4. The carrier board according to claim 1, characterized in that: The plurality of ribs include a plurality of first ribs parallel to the guide rails and a plurality of second ribs perpendicular to the guide rails; At least one of the conductive members is arranged on a side of the first rib and / or the second rib.

5. The carrier board according to claim 4, characterized in that: The conductive member is fixed on the rib by means of screws or rivets.

6. The carrier board according to claim 4, characterized in that The conductive member is an angle bracket, which is arranged on the side of the connection between the first rib and the second rib. The angle bracket includes a first connection portion connected to the first rib and a second connection portion connected to the second rib.

7. The carrier according to any one of claims 1 to 6, characterized in that: The bottom of the conductive member is flush with the bottoms of the guide rails on both sides.

8. A vacuum coating device, characterized in that: The invention comprises the carrier board according to any one of claims 1 to 7.

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