Circuit board assembly, sensor, thermal management system, and vehicle

Abstract

Disclosed in the present application are a circuit board assembly, a sensor, a thermal management system, and a vehicle. The circuit board assembly is used in the sensor, and the sensor is at least used for measuring the pressure of a medium. The circuit board assembly comprises: a circuit board and a pressure measurement element, wherein the circuit board is provided with a first surface and a second surface which are opposite each other, and the first surface is provided with a medium isolation area and a medium contact area; the pressure measurement element is arranged in the medium contact area; at least one electrical connection hole is formed in the circuit board, and the electrical connection hole is located in the medium isolation area; the electrical connection hole can be electrically connected to an electrical connection point of the first surface and an electrical connection point of the second surface; and the pressure measurement element is electrically connected to the electrical connection point of the second surface by means of the electrical connection hole.

Description

Circuit board assemblies, sensors, thermal management systems and vehicles

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 20, 2024, with application number 202410325637.1 and entitled “Circuit Board Assembly, Sensor, Thermal Management System and Vehicle,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of sensor technology, and in particular to a circuit board assembly, a sensor, a thermal management system, and a vehicle. Background Art

[0003] In related technologies, the pressure detection element is set on the circuit board. The pressure detection element needs to contact the medium to detect the pressure of the medium. However, medium leakage will affect the stability and reliability of the circuit board, thereby affecting the stability and reliability of the sensor, and even affecting the service life of the sensor. Summary of the Invention

[0004] The first purpose of this application is to provide a circuit board assembly for increasing service life and improving stability of signal transmission.

[0005] The second object of the present application is to provide a sensor comprising the above-mentioned circuit board assembly.

[0006] The third object of the present application is to provide a thermal management system, comprising the circuit board assembly or sensor described above.

[0007] The fourth objective of the present application is to provide a vehicle comprising the thermal management system described above.

[0008] According to the first aspect of the present application, a circuit board assembly is used for a sensor, which is at least used to detect the pressure of a medium. The circuit board assembly includes: a circuit board and a pressure detection element. The circuit board has a first surface and a second surface relative to each other, the first surface has a medium isolation area and a medium contact area, and the pressure detection element is arranged in the medium contact area; the circuit board is provided with at least one electrical connection hole, the electrical connection hole is located in the medium isolation area, and the electrical connection hole can electrically connect the electrical connection point of the first surface and the electrical connection point of the second surface, and the pressure detection element is electrically connected to the electrical connection point of the second surface through the electrical connection hole.

[0009] According to the circuit board assembly of the embodiment of the present application, a medium isolation area and a medium contact area are set on the side of the circuit board facing the medium to be measured. In this way, on the first hand, it can be ensured that the pressure detection element set in the medium contact area is in full contact with the medium to ensure the accuracy of pressure measurement; on the second hand, the medium contact area and the medium isolation area are not connected, which can effectively prevent the medium in the medium contact area from flowing to the medium isolation area, and prevent the medium from leaking from the electrical connection hole located in the medium isolation area, thereby increasing the safety and service life of the circuit board assembly, so that the detected pressure data is more accurate; on the third hand, by electrically connecting the electrical connection point on the first surface and the electrical connection point on the second surface through the electrical connection hole opened on the circuit board, the volume of the circuit board can be effectively reduced, while ensuring the consistency and stability of the product.

[0010] In some embodiments, the method further includes: a separator adapted to contact the circuit board to separate the first surface into the dielectric isolation area and the dielectric contact area.

[0011] In some embodiments, the separator is a sealing ring.

[0012] In some embodiments, the dielectric isolation region is located radially outward of the dielectric contact region.

[0013] In some embodiments, it further includes: a signal conditioning component, the signal conditioning component is arranged on the second surface of the circuit board, and the pressure detection element is electrically connected to the signal conditioning component through the electrical connection hole.

[0014] In some embodiments, the diameter of the electrical connection hole is D, the thickness of the circuit board is H, and D and H satisfy: 1 / 6H≤D≤1 / 3H.

[0015] In some embodiments, the diameter of the electrical connection hole is D, the minimum distance between the electrical connection hole and the edge of the circuit board is L, and D and L satisfy: D≤L≤2D.

[0016] In some embodiments, the number of the electrical connection holes is N, and N satisfies: N≥4.

[0017] In some embodiments, the circuit board is a ceramic circuit board.

[0018] According to the sensor of the second embodiment of the present application, it includes: a shell, a circuit board assembly, and a detection port is formed on the shell; the circuit board assembly is the circuit board assembly described in any one of the above embodiments, and the circuit board assembly is arranged in the shell, and the medium contact area of ​​the circuit board assembly is opposite to the detection port.

[0019] In some embodiments, it further includes: a support frame, the support frame is arranged in the shell, and the circuit board assembly is arranged on the support frame.

[0020] In some embodiments, a receiving groove is formed on the surface of the support frame on the side away from the detection port, and an avoidance opening is formed on the bottom wall of the receiving groove; the circuit board assembly is arranged in the receiving groove, and the pressure detection element is located at the avoidance opening.

[0021] In some embodiments, the sensor includes a sealing ring, which is located in the avoidance opening and between the circuit board assembly and the inner wall of the shell, and the medium contact area and the medium isolation area of ​​the circuit board assembly are separated by the sealing ring.

[0022] In some embodiments, the circuit board assembly is placed on the bottom wall of the receiving groove.

[0023] In some embodiments, at least one limiting rib is provided on the side wall of the accommodating groove, and the limiting rib is suitable for cooperating with the side wall of the circuit board assembly to limit the movement of the circuit board assembly within the plane where the circuit board assembly is located.

[0024] In some embodiments, a surface of the limiting rib facing the circuit board assembly includes a limiting surface, and the limiting surface is suitable for limiting cooperation with a side wall of the circuit board assembly.

[0025] In some embodiments, the surface of the limiting rib facing the circuit board assembly includes a guide surface, which is connected to the side of the limiting surface away from the detection port, and is used to guide the assembly of the circuit board assembly.

[0026] In some embodiments, at least one avoidance portion is provided on the bottom wall of the accommodating groove, and the avoidance portion is a recessed groove, a through hole, or an opening, and the avoidance portion is arranged opposite to the limiting rib.

[0027] In some embodiments, the avoidance portion is a recessed groove or a through hole, part of the limiting rib is located in the avoidance portion, and at least the side wall of the limiting rib facing the circuit board assembly is spaced apart from the corresponding side wall of the recessed groove.

[0028] In some embodiments, the avoidance portion is a sunken groove, and the limiting rib is connected to the bottom wall of the sunken groove.

[0029] In some embodiments, there are multiple limiting ribs, and the multiple limiting ribs are arranged at intervals along the circumference of the circuit board assembly.

[0030] In some embodiments, a grounding opening is formed on the bottom wall of the accommodating groove; a grounding spring is provided on the circuit board assembly, and the grounding spring fits in the grounding opening.

[0031] In some embodiments, the shell is formed with a pressure-stop groove, the pressure-stop groove is arranged on a side surface of the shell facing the circuit board assembly, the pressure-stop groove is arranged on the outer peripheral side of the detection port, and the support frame is stopped against the pressure-stop groove.

[0032] In some embodiments, the method further includes: a connector, wherein the connector is provided on the housing, the connector is located on a side of the circuit board assembly away from the detection port, and the circuit board assembly is electrically connected to the connector.

[0033] In some embodiments, an opening is formed on the housing, the opening is opposite to the detection port, and a portion of the connector passes through the opening and fits into the housing.

[0034] In some embodiments, at least one positioning hole is formed on one of the connector and the support frame, and at least one positioning post is provided on the other of the connector and the support frame, and the positioning post is fitted in the positioning hole.

[0035] In some embodiments, the connector and the support frame are snap-connected.

[0036] The thermal management system according to the third embodiment of the present application includes the sensor described in any one of the above embodiments or the circuit board assembly described in any one of the above embodiments.

[0037] The vehicle according to the fourth embodiment of the present application includes the thermal management system described in the above embodiment.

[0038] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application.

[0039] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work:

[0041] FIG1 is a schematic diagram of a sensor according to an embodiment of the present application.

[0042] FIG2 is a schematic diagram of a three-dimensional disassembled sensor according to an embodiment of the present application.

[0043] FIG3 is a schematic cross-sectional view of a sensor according to an embodiment of the present application.

[0044] FIG4 is a cross-sectional schematic diagram of a circuit board assembly and a support frame according to an embodiment of the present application.

[0045] FIG5 is a schematic top view of a circuit board assembly and a support frame according to an embodiment of the present application.

[0046] FIG6 is a schematic diagram of a circuit board assembly according to an embodiment of the present application.

[0047] FIG7 is a schematic diagram of a support frame according to an embodiment of the present application.

[0048] FIG8 is a schematic diagram of a temperature detection element and a protective cover according to an embodiment of the present application.

[0049] Figures and symbols: 100, sensor; 101, circuit board assembly; 102, grounding spring; 10, circuit board; 11, first surface; 111, medium contact area; 112, medium isolation area; 12, second surface; 13, electrical connection hole; 14, second connection spring; 15, electrical connection point; 20, pressure detection element; 21, signal conditioning component; 30, separator; 31, sealing ring; 40, housing; 41, detection port; 43, opening; 44, step surface; 441, pressure-stop groove; 50, support frame; 51, accommodating groove; 511, avoidance port; 512, limiting rib; 5121, limiting surface; 5122, guide surface; 513, sinking groove; 514, sinking groove angle; 52, positioning hole; 53, grounding port; 54, avoidance portion; 70. Connector; 71. Positioning post; 72. Connecting portion; 73. Fitting portion; 74. First connecting spring; 80. Temperature detection element; 81. Mounting seat; 82. Conductive sheet; 83. Temperature sensing element; 831. Contact sheet; 90. Protective cover; 91. Circulation channel. Specific embodiments

[0050] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0051] The embodiments of the present application are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The circuit board assembly 101 according to the embodiments of the present application is described below with reference to Figures 1 to 8. The circuit board assembly 101 is used in the sensor 100, and the sensor 100 is at least used to detect the pressure of the medium.

[0052] Specifically, as shown in Figures 1 to 4, the circuit board assembly 101 includes: a circuit board 10, a pressure detection element 20, the circuit board 10 has a first surface 11 and a second surface 12 relative to each other, the first surface 11 has a medium isolation area 112 and a medium contact area 111, the pressure detection element 20 is arranged in the medium contact area 111, and the medium to be measured pressure in the medium contact area 111 contacts the medium contact area 111. The pressure detection element 20 arranged in the medium contact area 111 can detect the pressure of the medium.

[0053] The circuit board 10 has at least one electrical connection hole 13 located in the dielectric isolation region 112. The electrical connection hole 13 can electrically connect an electrical connection point 15 on the first surface 11 to an electrical connection point 15 on the second surface 12. The electrical connection hole 13 extends through the circuit board 10 along its thickness, thereby electrically connecting the first surface 11 and the second surface 12 of the circuit board 10 along its thickness.

[0054] The pressure detection element 20 is electrically connected to the electrical connection hole 13 through the circuit engraved on the first surface 11, and is electrically connected to the electrical connection point 15 of the second surface 12 through the electrical connection hole 13. The second surface 12 can be connected to the connector 70, etc., thereby realizing signal transmission of the pressure detection element 20.

[0055] According to the circuit board assembly 101 of the embodiment of the present application, a medium isolation area 112 and a medium contact area 111 are set on the side of the circuit board 10 facing the medium to be measured. In this way, on the first hand, it can be ensured that the pressure detection element 20 set in the medium contact area 111 is in full contact with the medium to ensure the accuracy of pressure measurement; on the second hand, the medium contact area 111 is not connected to the medium isolation area 112, which can effectively prevent the medium in the medium contact area 111 from flowing to the medium isolation area 112, and prevent the medium from leaking from the electrical connection hole 13 located in the medium isolation area 112, thereby increasing the safety and service life of the circuit board assembly 101, so that the detected pressure data is more accurate; on the third hand, by electrically connecting the electrical connection point 15 of the first surface 11 and the electrical connection point 15 of the second surface 12 through the electrical connection hole 13 opened on the circuit board 10, the volume of the circuit board 10 can be effectively reduced, while ensuring the consistency and stability of the product.

[0056] It is understandable that the circuit board 10 may be a ceramic circuit board, and the electrical connection points 15 on the first surface 11 and the electrical connection points 15 on the second surface 12 are electrically connected by laser drilling holes in the ceramic circuit board and sintering silver on the inner walls of the holes.

[0057] In some embodiments, as shown in Figures 3 and 4, the circuit board assembly 101 further includes a separator 30, which is adapted to contact the circuit board 10 to separate the first surface 11 into a dielectric isolation region 112 and a dielectric contact region 111. The separator 30 is provided on the first surface 11 of the circuit board 10 to separate the first surface 11 of the circuit board 10 into the dielectric isolation region 112 and the dielectric contact region 111, which are not connected to each other, thereby effectively preventing the medium from flowing from the dielectric contact region 111 to the dielectric isolation region 112.

[0058] Optionally, the separator 30 is a sealing ring 31. The sealing ring 31 separates the first surface 11 of the circuit board 10 into a medium contact area 111 and a medium isolation area 112, thereby ensuring that the pressure sensing element 20 in the medium contact area 111 is in full contact with the medium to ensure pressure measurement accuracy, and preventing medium leakage to ensure sealing.

[0059] In some embodiments, as shown in FIG4 , the dielectric isolation region 112 is located radially outward of the dielectric contact region 111. Providing the dielectric contact region 111 radially inward of the dielectric isolation region 112 facilitates the arrangement and distribution of the dielectric contact region 111 and the dielectric isolation region 112 on the first surface 11, facilitates contact between the medium to be measured and the dielectric contact region 111, optimizes the structure and layout of the circuit board assembly 101, facilitates the integrated and miniaturized design of the circuit board assembly 101, and improves the sealing effect on the medium.

[0060] In some embodiments, the circuit board assembly 101 further includes: a signal conditioning component 21, the signal conditioning component 21 is provided on the second surface 12 of the circuit board 10, and the pressure detection element 20 is electrically connected to the signal conditioning component 21 through the electrical connection hole 13. The signal conditioning component 21 is electrically connected to the circuit board 10 on the second surface 12, and the signal conditioning component 21 and the pressure detection element 20 are electrically connected through the electrical connection hole 13 provided on the circuit board 10. Specifically, a conductive path is provided on the electrical connection hole 13, one end of the conductive path is electrically connected to the signal conditioning component 21, and the other end of the conductive path is electrically connected to the pressure detection element 20. The data detected by the pressure detection element 20 is transmitted to the signal conditioning component 21 through the conductive path and then output.

[0061] Further, referring to Figure 4, the aperture of the electrical connection hole 13 is D, and the thickness of the circuit board 10 is H, and D and H satisfy: 1 / 6H≤D≤1 / 3H. If D < 1 / 6H, the smaller aperture of the electrical connection hole 13 is not conducive to the arrangement of the electrical connection hole 13 and the stability of the electrical connection between the first surface 11 and the second surface 12; if D > 1 / 3H, the larger aperture of the electrical connection hole 13 occupies a larger area of ​​the circuit board 10, reducing the reliability of the circuit board 10 and being not conducive to the arrangement of components on the circuit board 10. For example, D = 1 / 5H. Thus, the range of the aperture of the electrical connection hole 13 relative to the thickness of the circuit board 10 is limited, so that the circuit board 10 has good reliability while facilitating the arrangement of components on the circuit board 10 and the stability of the electrical connection between the first surface 11 and the second surface 12.

[0062] In some embodiments, in conjunction with FIG. 4 , the diameter of the electrical connection hole 13 is D, and the minimum distance between the electrical connection hole 13 and the edge of the circuit board 10 is L, where D and L satisfy the following relationship: D ≤ L ≤ 2D. If L < D, the distance between the electrical connection hole 13 and the edge of the circuit board 10 is small, the structural stability of the circuit board 10 is poor, and the structure of the electrical connection hole 13 is relatively weak, resulting in poor stability in achieving electrical connection between the two surfaces of the circuit board 10 in the thickness direction. If L > 2D, the distance between the electrical connection hole 13 and the edge of the circuit board 10 is large, and the electrical connection hole 13 is too close to the center of the circuit board 10, which is not conducive to the placement of components on the circuit board 10. For example, L = 1.5D. Thus, the minimum distance between the electrical connection hole 13 and the edge of the circuit board 10 is defined so that the electrical connection hole 13 maintains an appropriate distance from the edge of the circuit board 10, ensuring the structural strength of the circuit board 10 while facilitating the placement of components on both sides of the circuit board 10.

[0063] Optionally, the number of the electrical connection holes 13 is N, and N satisfies: N≥4.

[0064] In some embodiments, the circuit board 10 is a ceramic circuit board 10. The ceramic circuit board 10 has good thermal conductivity, insulation, air tightness, and high temperature resistance, which can effectively improve the performance of the circuit board 10.

[0065] According to the sensor 100 of the embodiment of the second aspect of the present application, the sensor 100 includes: a housing 40 and a circuit board assembly 101 .

[0066] 2 and 3 , a detection port 41 is formed on the housing 40. A circuit board assembly 101, such as the circuit board assembly 101 described in any of the aforementioned embodiments, is disposed within the housing 40, with a medium contact area 111 of the circuit board assembly 101 facing the detection port 41. The detection port 41 is filled with a medium to be measured, with the medium contact area 111 facing the detection port 41. The pressure sensing element 20 cooperates with the detection port 41 to detect the pressure of the medium at the detection port 41.

[0067] According to the sensor 100 of the embodiment of the present application, a circuit board assembly 101 is set in the shell 40, and the pressure detection element 20 included in the circuit board assembly 101 is made relative to the detection port 41 to realize the detection of the medium pressure in the detection port 41. The medium contact area 111 is relative to the detection port 41 to facilitate the detection of the medium to be measured, improve the detection accuracy, and facilitate the setting of the pressure detection element 20.

[0068] In some embodiments, as shown in Figures 2 to 5, the sensor 100 further includes: a support frame 50, the support frame 50 is disposed in the housing 40, and the circuit board assembly 101 is disposed on the support frame 50. The support frame 50 cooperates with the housing 40, and the circuit board assembly 101 cooperates with the support frame 50 on the side of the support frame 50 away from the detection port 41. The support frame 50 is detachably connected to the housing 40. For example, a protrusion is formed on the outer peripheral side of the support frame 50, and a groove is formed on the housing 40 at a position opposite to the support frame 50. The protrusion and the groove cooperate to achieve the cooperation between the support frame 50 and the housing 40. Therefore, the provision of the support frame 50 facilitates the installation of the circuit board assembly 101, improves the efficiency and reliability of the installation of the circuit board assembly 101, and at the same time, since the housing 40 is usually a metal part, when the circuit board 10 is a ceramic circuit board, the provision of the support frame 50 can prevent the circuit board 10 from directly contacting the housing 40 to protect the circuit board 10.

[0069] Furthermore, in conjunction with Figures 3 and 7, a receiving groove 51 is formed on the surface of the side of the support frame 50 away from the detection port 41, and a avoidance opening 511 is formed on the bottom wall of the receiving groove 51; the circuit board assembly 101 is disposed in the receiving groove 51, and the pressure detection element 20 is located at the avoidance opening 511. The avoidance opening 511 is opposite to the detection port 41, and the end of the pressure detection element 20 away from the circuit board 10 is located at the avoidance opening 511 and contacts the medium to realize the detection of the medium. The circuit board 10 fits in the receiving groove 51 on the side of the support frame 50 away from the detection port 41. The receiving groove 51 can realize the installation of the circuit board 10, facilitate the limitation of the circuit board 10, and increase the stability of the installation of the circuit board 10.

[0070] In some embodiments, as shown in FIG3 , the sensor 100 includes a sealing ring 31 . The sealing ring 31 is located at the avoidance opening 511 . The sealing ring 31 is located between the circuit board assembly 101 and the inner wall of the housing 40 . The medium contact area 111 and the medium isolation area 112 of the circuit board assembly 101 are separated by the sealing ring 31 . The pressure sensing element 20 is provided on the first surface 11 of the circuit board 10 . The sealing ring 31 is provided between the first surface 11 of the circuit board 10 and the inner wall of the housing 40 along the thickness direction of the circuit board 10 , effectively preventing communication between the two areas and preventing the medium from flowing into the medium isolation area 112 . Therefore, the sealing ring 31 is provided between the circuit board assembly 101 and the inner wall of the housing 40 to clamp and limit the sealing ring 31 , thereby ensuring the sealing effect of the sealing ring 31 .

[0071] In some embodiments, the circuit board assembly 101 is placed on the bottom wall of the receiving groove 51. The bottom wall of the support frame 50 is recessed along the thickness direction of the circuit board 10 toward one side of the detection port 41 to form the receiving groove 51. The bottom wall is adjacent to the center of the shell 40 and penetrates to form an avoidance opening 511. The circuit board assembly 101 includes a circuit board 10 and a pressure detection element 20. The circuit board 10 is abutted against the bottom wall, and the pressure detection element 20 passes through the avoidance opening 511 and extends into the detection port 41. The sealing ring 31 is radially arranged between the pressure detection element 20 and the side wall of the avoidance opening 511. Thus, the circuit board assembly 101 is placed on the bottom wall, and the support frame 50 can form support and limit for the circuit board assembly 101, avoiding excessive squeezing of the sealing ring 31 by the circuit board assembly 101, and at the same time can realize radial limit of the circuit board assembly 101, reducing the axial volume of the sensor 100, so that the internal fit of the sensor 100 is tighter.

[0072] In some embodiments, as shown in FIG7 , at least one limiting rib 512 is provided on the side wall of the receiving groove 51. The limiting rib 512 is adapted to cooperate with the side wall of the circuit board assembly 101 to limit the movement of the circuit board assembly 101 within the plane where the circuit board assembly 101 is located. The limiting rib 512 is provided on the side wall of the receiving groove 51. When the circuit board assembly 101 is engaged with the support frame 50, the outer peripheral side of the circuit board 10 cooperates with the side wall of the receiving groove 51 to ensure that the support frame 50 limits the radial position of the circuit board assembly 101, further fixes the circuit board assembly 101, prevents the circuit board assembly 101 from being significantly offset or rotated during installation, and prevents the problem of unstable signal transmission. This improves the reliability of the installation of the circuit board assembly 101 and the coaxiality of the installation with the support frame 50.

[0073] 7 , the side surface of the limiting rib 512 facing the circuit board assembly 101 includes a limiting surface 5121, which is adapted to engage with the side wall of the circuit board assembly 101. That is, after the circuit board assembly 101 is assembled with the support frame 50, the limiting surface 5121 of the limiting rib 512 engages with the outer periphery of the circuit board 10 to limit the position of the circuit board assembly 101 and prevent the circuit board assembly 101 from shifting.

[0074] In some embodiments, in conjunction with Figure 7, the side surface of the limiting rib 512 facing the circuit board assembly 101 also includes a guide surface 5122. The guide surface 5122 is connected to the side of the limiting surface 5121 away from the detection port 41. The guide surface 5122 is used to guide the assembly of the circuit board assembly 101. The guide surface 5122 and the limiting surface 5121 are connected to each other along the central axis of the detection port 41. The end of the guide surface 5122 away from the limiting surface 5121 extends obliquely toward the side wall of the accommodating groove 51 along the central axis of the detection port 41. When the circuit board assembly 101 is assembled with the support frame 50, the circuit board assembly 101 passes through the guide surface 5122 and cooperates with the limiting surface 5121. Therefore, the provision of the guide surface 5122 facilitates the guidance of the circuit board assembly 101 during installation, thereby improving the accuracy and convenience of installation.

[0075] In some embodiments, as shown in FIG. 7 , at least one avoidance portion 54 is provided on the bottom wall of the accommodating groove 51 . The avoidance portion 54 is a sunken groove 513 or a through hole or an opening. The avoidance portion 54 is arranged opposite to the limiting rib 512 .

[0076] By setting the avoidance portion 54 opposite to the limiting rib 512, it is convenient to ensure that the limiting rib 512 and the bottom wall of the accommodating groove 51 do not contact the same point on the edge defined by the side wall of the circuit board 10 and the bottom wall of the circuit board 10 at the same time. In addition, it can facilitate the setting of the limiting rib 512 and improve the structural strength of the limiting rib 512.

[0077] It can be understood that the avoidance portion 54 can be a sink 513 or a through hole or an opening. The sink 513 is a groove with an upward opening as shown in Figure 7, the through hole can be a through hole passing through the bottom wall of the accommodating groove 51, and the opening can be a groove or notch with an opening facing other directions.

[0078] In some embodiments, as shown in FIG7 , the relief portion 54 is a recessed groove 513 or a through-hole, a portion of the limiting rib 512 is located within the relief portion 54, and at least the sidewall of the limiting rib 512 facing the circuit board assembly 101 is spaced apart from the corresponding sidewall of the relief portion 54. Specifically, as shown in FIG7 , the relief portion 54 is a recessed groove 513, a portion of the limiting rib 512 is located within the recessed groove 513, and at least the sidewall of the limiting rib 512 facing the circuit board assembly 101 is spaced apart from the corresponding sidewall of the recessed groove 513. For example, the guide surface 5122 and the limiting surface 5121 of the limiting rib 512 are both spaced apart from the side wall of the recess 513 adjacent to the avoidance opening 511. When the side wall of the circuit board 10 contacts the limiting surface 5121, the portion of the recess 513 corresponding to the edge defined by the side wall of the circuit board 10 and the bottom wall of the circuit board 10 is suspended. As a result, any point on the edge defined by the side wall of the circuit board 10 and the bottom wall of the circuit board 10 will not contact the limiting surface 5121 and the bottom wall of the accommodating groove 51 at the same time, thereby avoiding stress concentration between the support frame 50 and the circuit board 10 and increasing protection for the circuit board 10.

[0079] In some embodiments, as shown in FIG7 , the avoidance portion 54 is a recessed groove 513. Specifically, at least one recessed groove 513 is formed on the bottom wall of the receiving slot 51, and the limiting rib 512 is connected to the bottom wall of the recessed groove 513. Specifically, the portion of the receiving slot 51 adjacent to the limiting rib 512 is recessed toward the inspection port 41 to form the recessed groove 513. One end of the limiting rib 512 is connected to the bottom wall of the recessed groove 513, and the one end of the limiting rib 512 and the bottom wall of the recessed groove 513 define a recessed groove corner 514. The provision of the recessed groove 513 can prevent the corners of the circuit board 10 from contacting and colliding with the recessed groove corner 514 when the circuit board assembly 101 is mated with the receiving slot 51, thereby reducing the possibility of breakage and providing enhanced protection for the circuit board 10.

[0080] Optionally, there are multiple limiting ribs 512, which are spaced apart along the circumference of the circuit board assembly 101. Thus, the arrangement of the multiple limiting ribs 512 enables the circuit board assembly 101 to be limited in position on a plane, so that the circuit board assembly 101 remains in a central position, ensuring the reliability of the installation of the circuit board assembly 101 and the support frame 50, while also ensuring the stability of signal transmission of the circuit board assembly 101.

[0081] In some embodiments, as shown in Figures 6 and 7 , a grounding opening 53 is formed on the bottom wall of the receiving slot 51; a grounding spring 102 is provided on the circuit board assembly 101, which fits within the grounding opening 53. The grounding opening 53 extends through the bottom wall of the receiving slot 51 along the thickness of the circuit board 10. When the circuit board assembly 101 is mated with the support frame 50, the grounding spring 102 fits within the grounding opening 53, enhancing the safety of the circuit board assembly 101 and increasing the accuracy of the mounting orientation of the circuit board assembly 101 and the support frame 50.

[0082] In some embodiments, as shown in Figures 3 and 4 , the housing 40 is formed with a pressure-stop groove 441. The pressure-stop groove 441 is located on the side of the housing 40 facing the circuit board assembly 101 and is located on the outer periphery of the detection port 41. The support frame 50 abuts against the pressure-stop groove 441. Specifically, the housing 40 has a stepped surface 44 formed axially on the side facing the circuit board assembly 101. At least a portion of the stepped surface 44 is recessed axially away from the circuit board assembly 101 to form the pressure-stop groove 441. When the circuit board assembly 101 is installed, the sealing ring 31 is positioned between the circuit board 10 and the stepped surface 44, and the support frame 50 fits within the pressure-stop groove 441. The circuit board assembly 101 abuts the support frame 50, which in turn abuts the pressure-stop groove 441. The pressure-stop groove 441 serves to limit and secure the support frame 50, enabling it to better support the circuit board assembly 101. At the same time, excessive compression of the sealing ring 31 by the circuit board assembly 101 can be avoided, which can effectively prevent the failure of the sealing effect and increase the protection of the sealing ring 31.

[0083] In some embodiments, as shown in FIG3 , the sensor 100 further includes a connector 70 . The connector 70 is disposed on the housing 40 and is located on a side of the circuit board assembly 101 away from the detection port 41 . The circuit board assembly 101 is electrically connected to the connector 70 . For example, the connector 70 includes a first connecting spring 74 , which is electrically connected to the circuit board 10 . Data detected by the pressure sensing element 20 is transmitted to the signal conditioning component 21 via the electrical connection hole 13 . The signal conditioning component 21 is electrically connected to the first connecting spring 74 to output the pressure data. The connector 70 can be used to interface with external devices.

[0084] In some embodiments, an opening 43 is formed in the housing 40, and the opening 43 is opposite to the detection port 41. A portion of the connector 70 passes through the opening 43 and fits within the housing 40. The connector 70 includes a connecting portion 72 and a mating portion 73. The connecting portion 72 and the mating portion 73 are connected to each other. A first connecting spring 74 is provided on the connecting portion 72. The mating portion 73 is located at an end of the connecting portion 72 adjacent to the circuit board assembly 101. The connector 70 extends into the housing 40 through the opening 43 of the housing 40. The mating portion 73 abuts against the side wall of the housing 40, and the connecting portion 72 is located outside the housing 40. Therefore, the mating portion 73 partially fits within the housing 40, which simplifies the assembly structure of the connector 70 and the housing 40, improving assembly efficiency.

[0085] After assembling the circuit board assembly 101, connector 70, and housing 40, the edges of the opening 43 of the housing 40 are riveted to secure the connector 70 and circuit board assembly 101 in place and ensure that the sealing ring 31 is effectively sealed. RTV adhesive is also applied around the riveted edges to prevent external moisture from entering the housing 40 and damaging the circuit board assembly 101.

[0086] In some embodiments, as shown in FIG3 , at least one positioning hole 52 is formed on one of the connector 70 and the support frame 50, and at least one positioning post 71 is provided on the other of the connector 70 and the support frame 50. The positioning post 71 fits within the positioning hole 52. For example, the connector 70 is provided with a positioning post 71, which is located at the end of the connector 70 facing the circuit board assembly 101. The support frame 50 is provided with a positioning hole 52. When the connector 70 is mated with the housing 40, the positioning post 71 cooperates with the positioning hole 52 to achieve stable installation of the connector 70, which can effectively help the circuit board assembly 101 and the housing 40 to achieve precise assembly.

[0087] In some embodiments, the connector 70 and the support frame 50 are snap-fitted together, thereby making the installation of the connector 70 and the support frame 50 convenient and reliable.

[0088] Optionally, referring to Figures 3 and 8 , the sensor 100 further includes a temperature sensing element 80 , which is disposed within the detection port 41 and extends downwardly from the housing 40 to more quickly and accurately detect the medium temperature. The temperature sensing element 80 is connected to the circuit board 10 , and a protective cover 90 is disposed between the temperature sensing element 80 and the sidewall of the detection port 41 . The protective cover 90 fits within the detection port 41 , and a limiting portion is formed within the detection port 41 . The protective cover 90 cooperates with the limiting portion, and when the protective cover 90 and the limiting portion engage, the protective cover 90 is prevented from exiting the housing 40 .

[0089] 6 , the circuit board 10 is provided with a plurality of second connecting springs 14, which are disposed on both sides of the circuit board 10 in the thickness direction. Some of the second connecting springs 14 are used to electrically connect to the first connecting springs 74, while some of the second connecting springs 14 are electrically connected to the temperature sensing element 80. The temperature sensing element 80 is disposed in the medium contact area 111 to fully contact the medium and improve measurement accuracy.

[0090] The temperature sensing element 80 includes a mounting base 81, a conductive sheet 82, and a temperature sensing element 83. The temperature sensing element 83 includes two contacts 831, each electrically connected to the two conductive sheets 82. The conductive sheet 82 is electrically connected to the mounting base 81 at one end away from the temperature sensing element 83. The mounting base 81 is mounted on the circuit board assembly 101 and is electrically connected to the circuit board 10. The mounting base 81 and the temperature sensing element 83 form a closed circuit through the contacts 831 and the conductive sheet 82. An external signal can control the temperature sensing element 83's response to the medium temperature. At the same time, the temperature sensing element 83 can transmit the sensed temperature from the contacts 831 and the conductive sheet 82 to the mounting base 81 and then output it to the connector 70 for external equipment to obtain the temperature data.

[0091] A flow channel 91 is defined between the protective cover 90 and the housing 40 . The flow channel 91 connects the chamber where the pressure sensing element is located and the outside of the housing 40 , so that the medium to be measured outside the housing 40 can flow to the pressure sensing element to detect the medium pressure.

[0092] The thermal management system according to the third embodiment of the present application includes the sensor 100 of any one of the above embodiments or the circuit board assembly 101 of any one of the above embodiments.

[0093] According to the thermal management system of the embodiment of the present application, a medium contact area 111 and a medium isolation area 112 are set on the first surface 11 of the circuit board 10, so that the medium contact area 111 is opposite to the medium, and the pressure detection element 20 is set in the medium contact area 111 to facilitate contact with the medium to realize the detection of the medium pressure. The process is simpler and has good stability. The cost of the structure for pressure measurement is low, and the measurement accuracy is guaranteed, so that the thermal management system has more precise regulation, improves the reliability of the structural assembly of the internal electrical connection of the thermal management system, and the detection data is more accurate, and there are more application scenarios.

[0094] The vehicle according to the fourth embodiment of the present application includes the thermal management system in the above embodiment.

[0095] According to the vehicle of the embodiment of the present application, by adopting the above-mentioned thermal management system, the temperature of the corresponding equipment of the vehicle can be more conveniently and accurately controlled and detected.

[0096] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0097] In the description of the present application, "first feature" and "second feature" may include one or more of the features. In the description of the present application, "plurality" means two or more. In the description of the present application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. In the description of the present application, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.

[0098] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0099] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0100] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0101] In the claims, any reference signs placed between brackets shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in the claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present application may be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0102] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly for a sensor (100), wherein the sensor (100) is used at least to detect the pressure of a medium, wherein: The circuit board assembly (101) comprises: A circuit board (10) having a first surface (11) and a second surface (12) opposite to each other, the first surface (11) having a dielectric isolation region (112) and a dielectric contact region (111), a pressure detection element (20), wherein the pressure detection element (20) is disposed in the medium contact area (111); The circuit board (10) is provided with at least one electrical connection hole (13), the electrical connection hole (13) being located in the dielectric isolation area (112), and the electrical connection hole (13) being capable of electrically connecting an electrical connection point (15) on the first surface (11) and an electrical connection point (15) on the second surface (12). The pressure detection element (20) is electrically connected to the electrical connection point (15) of the second surface (12) through the electrical connection hole (13).

2. The circuit board assembly according to claim 1, wherein: Further including: A separator (30) is adapted to contact the circuit board (10) to separate the first surface (11) into the dielectric isolation area (112) and the dielectric contact area (111).

3. The circuit board assembly according to claim 2, wherein: The separator (30) is a sealing ring (31).

4. The circuit board assembly according to claim 2 or 3, wherein: The dielectric isolation region (112) is located radially outside the dielectric contact region (111).

5. The circuit board assembly according to any one of claims 1 to 4, wherein: Further including: A signal conditioning component (21) is provided on the second surface (12) of the circuit board (10), and the pressure detection element (20) is electrically connected to the signal conditioning component (21) through the electrical connection hole (13).

6. The circuit board assembly according to any one of claims 1 to 5, wherein: The diameter of the electrical connection hole (13) is D, the thickness of the circuit board (10) is H, and D and H satisfy the following relationship: 1 / 6H≤D≤1 / 3H.

7. The circuit board assembly according to any one of claims 1 to 6, wherein: The diameter of the electrical connection hole (13) is D, the minimum distance between the electrical connection hole (13) and the edge of the circuit board (10) is L, and D and L satisfy: D≤L≤2D.

8. The circuit board assembly according to any one of claims 1 to 7, wherein: The number of the electrical connection holes (13) is N, and N satisfies: N≥4.

9. The circuit board assembly according to any one of claims 1 to 8, wherein: The circuit board (10) is a ceramic circuit board.

10. A sensor, wherein: include: a housing (40), wherein a detection port (41) is formed on the housing (40); A circuit board assembly (101), wherein the circuit board assembly (101) is the circuit board assembly (101) according to any one of claims 1 to 9, the circuit board assembly (101) is arranged in the housing (40), and the medium contact area (111) of the circuit board assembly (101) is opposite to the detection port (41).

11. The sensor according to claim 10, wherein Also includes: A support frame (50), the support frame (50) is arranged in the housing (40), and the circuit board assembly (101) is arranged on the support frame (50).

12. The sensor according to claim 11, wherein A receiving groove (51) is formed on a surface of a side of the support frame (50) away from the detection port (41), and a relief opening (511) is formed on the bottom wall of the receiving groove (51); The circuit board assembly (101) is arranged in the accommodating groove (51), and the pressure detection element (20) is located at the avoidance opening (511).

13. The sensor according to claim 12, wherein The sensor (100) includes a sealing ring (31), the sealing ring (31) is located in the avoidance opening (511), the sealing ring (31) is located between the circuit board assembly (101) and the inner wall of the housing (40), and the medium contact area (111) and the medium isolation area (112) of the circuit board assembly (101) are separated by the sealing ring (31).

14. The sensor according to claim 12 or 13, wherein: The circuit board assembly (101) is placed on the bottom wall of the accommodating groove (51).

15. The sensor according to any one of claims 12 to 14, wherein: At least one limiting rib (512) is provided on the side wall of the accommodating groove (51), and the limiting rib (512) is suitable for cooperating with the side wall of the circuit board assembly (101) to limit the movement of the circuit board assembly (101) within the plane where the circuit board assembly (101) is located.

16. The sensor according to claim 15, wherein A surface of the limiting rib (512) facing the circuit board assembly (101) comprises a limiting surface (5121), and the limiting surface (5121) is suitable for limiting cooperation with a side wall of the circuit board assembly (101).

17. The sensor according to claim 16, wherein The surface of the limiting rib (512) facing the circuit board assembly (101) includes a guide surface (5122), the guide surface (5122) being connected to the side of the limiting surface (5121) away from the detection port (41), and the guide surface (5122) being used for guiding the assembly of the circuit board assembly (101).

18. The sensor according to any one of claims 15 to 17, wherein: At least one avoidance portion (54) is provided on the bottom wall of the accommodating groove (51), and the avoidance portion (54) is a sunken groove (513) or a through hole or an opening. The avoidance portion (54) is arranged opposite to the limiting rib (512).

19. The sensor according to claim 18, wherein The avoidance portion (54) is a sunken groove (513) or a through hole, a portion of the limiting rib (512) is located in the avoidance portion (54), and at least a side wall of the limiting rib (512) facing the circuit board assembly (101) is spaced apart from a corresponding side wall of the avoidance portion (54).

20. The sensor according to claim 19, wherein The avoidance portion (54) is a sunken groove (513), and the limiting rib (512) is connected to the bottom wall of the sunken groove (513).

21. The sensor (100) according to any one of claims 15 to 20, wherein: There are a plurality of the limiting ribs (512), and the plurality of limiting ribs (512) are arranged at intervals along the circumference of the circuit board assembly (101).

22. The sensor according to any one of claims 12 to 21, wherein: A grounding opening (53) is formed on the bottom wall of the accommodating groove (51); A grounding spring (102) is provided on the circuit board assembly (101), and the grounding spring (102) is fitted into the grounding opening (53).

23. The sensor according to any one of claims 11 to 22, wherein: The housing (40) is formed with a pressure-stop groove (441), the pressure-stop groove (441) being arranged on a side surface of the housing (40) facing the circuit board assembly (101), the pressure-stop groove (441) being arranged on the outer peripheral side of the detection port (41), and the support frame (50) being in contact with the pressure-stop groove (441).

24. The sensor according to any one of claims 11 to 23, wherein Further including: A connector (70) is provided on the housing (40), the connector (70) is located on a side of the circuit board assembly (101) away from the detection port (41), and the circuit board assembly (101) is electrically connected to the connector (70).

25. The sensor according to claim 24, wherein An opening (43) is formed on the housing (40), the opening (43) is opposite to the detection port (41), and a portion of the connector (70) passes through the opening (43) and fits into the housing (40).

26. The sensor according to claim 24 or 25, wherein At least one positioning hole (52) is formed on one of the connector (70) and the support frame (50), and at least one positioning column (71) is provided on the other of the connector (70) and the support frame (50), and the positioning column (71) is fitted in the positioning hole (52).

27. The sensor according to any one of claims 24 to 26, wherein: The connector (70) and the support frame (50) are snap-connected.

28. A thermal management system, wherein: The invention comprises a sensor (100) according to any one of claims 10-27 or a circuit board assembly (101) according to any one of claims 1-9.

29. A vehicle, wherein Includes the thermal management system of claim 28.

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