Workpiece processing device and workpiece processing method

Abstract

This workpiece processing device for performing prescribed processing on a workpiece comprises: a pair of side clampers for clamping a pair of opposing side surfaces of the workpiece from lateral sides of the workpiece; a top clamper which is provided on at least one of the pair of side clampers and with which the upper surface of the workpiece is brought into contact; and an altitude measurement means for measuring the altitude of the top clamper.

Description

Work processing device and work processing method

[0001] The present disclosure relates to a work processing device and a work processing method that perform predetermined processing on a work.

[0002] Conventionally, a known workpiece processing apparatus for performing a predetermined process on a workpiece is, for example, a printing apparatus that contacts a mask with the top surface of a substrate (workpiece) and then prints a paste on the substrate through the mask. In such a workpiece processing apparatus (printing apparatus), a pair of side clampers clamps and positions the side surfaces of the workpiece (substrate). However, if the position of the workpiece relative to the side clampers is inaccurate or the workpiece is warped, the processing accuracy of the workpiece may be reduced. For this reason, conventionally, a top clamper is provided on the side clampers that contacts the top surface of the workpiece while the workpiece is clamped by the pair of side clampers, and the top clamper accurately positions the workpiece relative to the side clampers and can correct any warpage in the workpiece (e.g., Patent Documents 1 and 2 listed below).

[0003] JP 2011-20321 A International Publication No. 2020 / 261970

[0004] In the workpiece processing device having the above-described configuration, the operation of bringing the workpiece into contact with the top clamper is performed by lifting the workpiece from below the top clamper based on pre-stored workpiece thickness data. However, if the stored workpiece thickness data is incorrect and the workpiece is pushed up more than necessary, the top clamper may be forcibly pushed up by the base plate, causing it to deform relative to the side clampers, which may prevent it from performing its intended function.

[0005] Therefore, an object of the present disclosure is to provide a workpiece processing device and a workpiece processing method that can detect a state in which a top clamper provided on a side clamper has been pushed up and deformed by a workpiece.

[0006] The work processing device disclosed herein is a work processing device that performs a predetermined process on a work, and includes a pair of side clampers that clamp a pair of opposing side surfaces of the work from the sides of the work, a top clamper that is provided on at least one of the pair of side clampers and with which the top surface of the work comes into contact, and a height measuring means that measures the height of the top clamper.

[0007] The workpiece processing method disclosed herein is a workpiece processing method using a workpiece processing device equipped with a pair of side clampers that clamp a pair of opposing side surfaces of the workpiece from the sides of the workpiece, and a top clamper that is provided on at least one of the pair of side clampers and with which the top surface of the workpiece comes into contact, and includes a pre-contact height acquisition step of acquiring the height of the top clamper before the workpiece comes into contact as a pre-contact height, a contact step of bringing the workpiece into contact with the top clamper, a contact state height acquisition step of acquiring the height of the top clamper in a state in which it has come into contact with the workpiece in the contact step as a contact state height, and a deformation determination step of determining whether or not deformation has occurred in the top clamper by comparing the contact state height with the pre-contact height.

[0008] According to the present disclosure, it is possible to detect a state in which a top clamper provided on a side clamper is pushed up and deformed by a workpiece.

[0009] 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H ... 1A, 1B, and 1C are side views illustrating the operation of a printing apparatus according to an embodiment of the present disclosure; FIG. 1A is a front view of a portion of a substrate holding unit provided in a printing apparatus according to an embodiment of the present disclosure; FIG. 1B is a plan view illustrating measurement points set on a top clamper of a substrate holding unit provided in a printing apparatus according to an embodiment of the present disclosure; FIG. 1C is a flowchart illustrating the flow of a printing operation performed by a printing apparatus according to an embodiment of the present disclosure;

[0010] Hereinafter, with reference to the drawings as appropriate, a detailed description of embodiments specifically disclosing a work processing device and a work processing method according to the present disclosure will be provided. However, more detailed description than necessary may be omitted. For example, detailed descriptions of already well-known matters and redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

[0011] Fig. 1 is a plan view of a printing device 1 according to an embodiment of the present disclosure. Fig. 2 is a front view of the printing device 1 according to an embodiment of the present disclosure. Fig. 3 is a side view of the printing device 1 according to an embodiment of the present disclosure. Figs. 1, 2, and 3 show the printing device 1 according to an embodiment of the present disclosure.

[0012] The printing device 1 is a device that repeatedly performs a series of operations (printing operations) that include carrying in and positioning a substrate KB as a workpiece, printing a paste Pst such as solder paste on the substrate KB, and carrying it out. Here, the transport direction of the substrate KB (the left-right direction as seen from the worker OP) is defined as the X direction, the direction in a horizontal plane perpendicular to the X direction (the front-back direction as seen from the worker OP) is defined as the Y direction, and the up-down direction is defined as the Z direction.

[0013] The printing apparatus 1 includes a substrate holding unit 12 mounted on a base 11 via a unit movement mechanism 12M. An input conveyor 13A is provided upstream of the substrate holding unit 12 (to the left as seen by the operator OP), and an output conveyor 13B is provided downstream of the substrate holding unit 12 (to the right as seen by the operator OP).

[0014] A mask 14 is installed above the substrate holding unit 12, and a camera 15 and a laser displacement meter 16 are provided below the mask 14 so as to be movable in the XY plane (horizontal plane). A squeegee 17 is provided above the mask 14 so as to be movable in the Y direction. A control device 18 that controls the operation of the printing device 1 is provided within the base 11.

[0015] The unit moving mechanism 12M includes a Y table 12a provided on the base 11, an X table 12b provided on the Y table 12a, a Θ table 12c provided on the X table 12b, and a unit lifting / lowering unit 12d provided on the Θ table. The Y table 12a moves in the Y direction relative to the base 11 by operation of a Y drive motor M1. The X table 12b moves in the X direction relative to the Y table 12a by operation of an X drive motor M2. The Θ table 12c rotates in a horizontal plane relative to the X table 12b by operation of a built-in Θ drive motor M3. The unit lifting / lowering unit 12d is provided on the Θ table 12c and raises and lowers the substrate holding unit 12.

[0016] The substrate holding unit 12 includes a first lifting table 31 that is raised and lowered by the unit lifting section 12d, a lifter 32 provided on the first lifting table 31, a second lifting table 33 that is raised and lowered by the lifter 32, a lower support body 34 and two conveyor support members 35 provided on the second lifting table 33, and a pair of positioning conveyors 36 and a pair of side clampers 37 provided on the two conveyor support members 35. The second lifting table 33 can be raised and lowered relative to the first lifting table 31 by the lifter 32, whereby the lower support body 34 is raised and lowered relative to the first lifting table 31.

[0017] 3, the two conveyor support members 35 are provided at positions sandwiching the lower support body 34 of the first lift table 31 in the Y direction. A pair of positioning conveyors 36 are arranged opposite each other in the Y direction and attached to the inner surfaces (opposing surfaces) of the two conveyor support members 35. The positioning conveyors 36 transport the board KB in the X direction and position the board KB at a predetermined working position.

[0018] 4 is a partially exploded perspective view of a portion of the substrate holding unit 12 provided in the printing apparatus 1 according to an embodiment of the present disclosure. In FIGS. 1, 3, and 4, a pair of side clampers 37 are disposed opposite each other in the Y direction and are provided above each of the two conveyor support members 35. The pair of side clampers 37 are driven in the Y direction by the operation of side clamper driving units 37M attached to the two conveyor support members 35, and are moved in a direction toward each other (closing direction) and a direction away from each other (opening direction).

[0019] 1, the mask 14 is made of a rectangular plate-like member, and its four sides are supported by a frame 14W. Within the rectangular area surrounded by the frame 14W, a plurality of pattern holes 14H are provided corresponding to a plurality of electrodes DK provided on the substrate KB.

[0020] 1 and 2, an XY movement mechanism 38 is provided on the base 11. The XY movement mechanism 38 has a pair of fixed beams 38a extending in the Y direction, a moving beam 38b extending in the X direction, and a moving plate 38c. The pair of fixed beams 38a are arranged opposite each other in the X direction. Both ends of the moving beam 38b are supported by the pair of fixed beams 38a. The moving plate 38c is attached to the moving beam 38b. The moving beam 38b is movable in the Y direction along the pair of fixed beams 38a, and the moving plate 38c is movable in the X direction along the moving beam 38b.

[0021] 2 and 3, the camera 15 is attached to a moving plate 38c of the XY moving mechanism 38, and is moved in the XY plane (horizontal plane) by the XY moving mechanism 38. The laser displacement meter 16 is also attached to the moving plate 38c of the XY moving mechanism 38, and is moved in the XY plane together with the camera 15. In this way, in this embodiment, the laser displacement meter 16 is moved by the XY moving mechanism 38 that moves the camera 15.

[0022] The camera 15 captures images of both the lower and upper regions. The laser displacement meter 16 emits a laser beam downward and receives the reflected laser beam, and measures the height of the object that reflected the laser beam (height relative to the laser displacement meter 16) based on the difference between the emission angle and reception angle of the laser beam.

[0023] 2 and 3, the squeegee 17 is provided on a squeegee base 17B that extends in the X direction and is movable in the Y direction. There are two squeegees 17, which are arranged opposite each other in the Y direction. Each squeegee 17 is a spatula-shaped member that extends in the X direction, and is individually raised and lowered relative to the squeegee base 17B by a squeegee lifting cylinder 17M attached to the squeegee base 17B.

[0024] 4, a slide groove 37a is provided on the upper surface of each of the two side clampers 37, and a slider 41 is provided in the slide groove 37a so as to be movable in the Y direction. A top clamper 42 in the form of a thin plate extending along the XY plane is attached to the upper surface of each slider 41 by a plurality of screws 43.

[0025] Fig. 5 is a block diagram showing a control system of the printing apparatus 1 according to an embodiment of the present disclosure. Figs. 6(a) and 6(b) are perspective views of a portion of the substrate holding unit 23 included in the printing apparatus 1 according to an embodiment of the present disclosure. Each of the pair of top clampers 42 is movable in the Y direction by actuation of a top clamper drive unit 42M (Fig. 5) formed of a cylinder or the like provided on the side clamper 37. Each top clamper 42 can be positioned at a retracted position (Fig. 6(a)) in which it is retracted so as to fit within the upper surface area of ​​the side clamper 37 in plan view, or at a protruding position (Fig. 6(b)) in which it protrudes inward from the upper surface area of ​​the side clamper 37 in plan view.

[0026] 5, an operation control section 18a included in the control device 18 controls the operation of the unit moving mechanism 12M including the Y drive motor M1, X drive motor M2, Θ drive motor M3 and unit lifting section 12d, the operation of the substrate holding unit 12 including the lifter 32, positioning conveyor 36, side clamper drive section 37M and top clamper drive section 42M, and the operation of the carry-in conveyor 13A and carry-out conveyor 13B. The operation control section 18a also controls the operation of the camera 15, laser displacement meter 16 and XY movement mechanism 38, and the operation of the squeegee lifting cylinder 17M and squeegee base 17B.

[0027] 7(a) and 7(b) are front views illustrating the operation of the printing apparatus 1 according to an embodiment of the present disclosure. FIGS. 8(a), 8(b), 8(c), and 8(d) are side views illustrating the operation of the printing apparatus 1 according to an embodiment of the present disclosure. FIGS. 9(a), 9(b), and 9(c) are perspective views illustrating the operation of the board holding unit 12 included in the printing apparatus 1 according to an embodiment of the present disclosure. When the printing apparatus 1 configured as described above performs a printing operation, the carry-in conveyor 13A first operates to carry in a board KB supplied from the outside and transfers it to the positioning conveyor 36 (arrow A shown in FIG. 7(a)). The positioning conveyor 36 receives the board KB from the carry-in conveyor 13A and positions it in a predetermined position ( FIGS. 7(a) and 7(b)). Once the positioning conveyor 36 has positioned the substrate KB, the lifter 32 operates to raise the lower support 34 (arrow B1 shown in Figure 8(a)), and the lower support 34 lifts the substrate KB from the positioning conveyor 36 and positions it between a pair of side clampers 37 (Figures 8(a) and 9(a)).

[0028] When the substrate KB is positioned between the pair of side clampers 37, the side clamper driving unit 37M moves the pair of side clampers 37 in a direction in which they approach each other (closing direction) (arrow C1 shown in FIG. 8(b)). As a result, the pair of side surfaces of the substrate KB that face each other in the Y direction are clamped by the pair of side clampers 37 (FIG. 8(b)).

[0029] Once the substrate KB has been clamped by the pair of side clampers 37, the top clamper drive unit 42M moves the pair of top clampers 42 in directions that bring them closer to each other (arrow D1 shown in FIG. 8(c)). As a result, the pair of top clampers 42 each extend above the substrate KB from the side clampers 37 (FIGS. 8(c) and 9(b)).

[0030] When the pair of top clampers 42 each extend above the substrate KB, the lifter 32 is actuated to raise the lower support 34 and lift the substrate KB (arrow E in FIG. 8(d)). At this time, the substrate KB rises while both side surfaces facing each other in the Y direction (both side surfaces clamped by the side clampers 37) slide against the inner surfaces (side surfaces facing each other) of the pair of side clampers 37.

[0031] When the substrate KB has risen to a height where its upper surface contacts the pair of top clampers 42 from below, the lifter 32 stops raising the substrate KB (FIGS. 8(d) and 9(c)). As a result, both side surfaces of the substrate KB are clamped by the pair of side clampers 37, and the top and bottom surfaces are clamped by the lower support 34 and the pair of top clampers 42, completing the holding operation of the substrate KB by the substrate holding unit 12.

[0032] 10(a), 10(b), and 10(c) are side views illustrating the operation of a printing apparatus according to an embodiment of the present disclosure. Once both side surfaces and the top and bottom surfaces of the substrate KB are clamped as described above, the camera 15 is advanced to the region between the substrate KB and the mask 14 by the XY movement mechanism 38. The camera 15 advanced to the region between the substrate KB and the mask 14 captures images of the substrate-side positioning marks (not shown) provided on the substrate KB and the mask-side positioning marks (not shown) provided on the mask 14 (FIG. 10(a)).

[0033] After the camera 15 captures the images of the substrate-side positioning marks and the mask-side positioning marks, the control device 18 activates the unit moving mechanism 12M to move the substrate KB held by the substrate holding unit 12 in the horizontal plane so that the substrate-side positioning marks and the mask-side positioning marks coincide with each other in a plan view. Once the substrate-side positioning marks and the mask-side positioning marks coincide with each other in a plan view, the unit lifting section 12d lifts the entire substrate holding unit 12 (arrow F1 shown in FIG. 10(b)) to bring the substrate KB into contact with the underside of the mask 14 (FIG. 10(b)). Once the substrate KB has come into contact with the mask 14, the squeegee lifting cylinder 17M lowers one of the squeegees 17, bringing the lower end of the squeegee 17 into contact with the upper surface of the mask 14, and then the squeegee base 17B (i.e., the squeegee 17) is moved in the Y direction (arrow G shown in FIG. 10(c)). The paste Pst supplied onto the mask 14 is scraped up by the movement of the squeegee 17, and when it is filled into the pattern holes 14H of the mask 14, the paste Pst is applied to the electrodes DK of the substrate KB.

[0034] 11(a), 11(b), and 11(c) are side views illustrating the operation of the printing apparatus 1 according to an embodiment of the present disclosure. After the paste application process of applying the paste Pst to the electrodes DK of the substrate KB is completed as described above, the unit lifting section 12d is actuated to lower the entire substrate holding unit 12 (arrow F2 in FIG. 11(a)), separating the substrate KB from the mask 14 (plate release) (FIG. 11(a)). During this plate release, the substrate KB is subjected to a force due to the vacuum suction force between the mask 14, which had been in close contact with the substrate KB, in a direction that causes it to be pulled upward (pull up) from between the pair of side clampers 37. However, because the top clamper 42 extending from the side clampers 37 is interposed between the substrate KB and the mask 14, the substrate KB is easily separated from the mask 14 and is difficult to remove from the side clampers 37.

[0035] Once the substrate KB has been separated from the mask 14 and plate separation is complete, the side clamper drive unit 37M is actuated to move the pair of side clampers 37 in the separating direction (arrow C2 shown in FIG. 11(b)). Then, once the pair of side clampers 37 have moved in the separating direction, the lifter 32 is actuated to lower the substrate KB, and both ends of the substrate KB are lowered onto the pair of positioning conveyors 36 (arrow B2 shown in FIG. 11(c)). Once the substrate KB has descended onto the positioning conveyors 36, the top clamper drive unit 42M is actuated to move the pair of top clampers 42 in the direction separating them (opening direction) (arrow D2 shown in FIG. 11(c)), and the pair of top clampers 42 are positioned in storage positions where they fit within the side clampers 37 in a plan view (FIG. 11(c)).

[0036] Once the pair of top clampers 42 are each positioned in their storage positions, the unit movement mechanism 12M is activated to adjust the position of the board holding unit 12, thereby aligning the orientation of the positioning conveyor 36 with the orientation of the carry-out conveyor 13B. Then, once the orientation of the positioning conveyor 36 matches the orientation of the carry-out conveyor 13B, the positioning conveyor 36 is activated to transfer the board KB to the carry-out conveyor 13B. The carry-out conveyor 13B receives the board KB from the positioning conveyor 36 and carries the board KB to the outside. This completes the printing operation for one board KB.

[0037] In this series of printing operations, data on the thickness of the substrate KB to be processed is stored in advance in a memory unit 18b (FIG. 5) provided in the control device 18. When the operation control unit 18a operates the lifter 32 (to lift the substrate KB) to bring the substrate KB into contact with the top clamper 42 that protrudes from the side clamper 37, the operation control unit 18a determines the amount of lift of the substrate KB based on the data on the thickness of the substrate KB stored in the memory unit 18b, and stops the operation of the lifter 32 (lifting of the substrate KB) when the height of the upper surface of the substrate KB matches the height of the top clamper 42. Therefore, the amount of lift of the substrate KB when bringing the substrate KB into contact with the pair of top clampers 42 becomes smaller the thicker the substrate KB is, and becomes larger the thinner the substrate KB is.

[0038] 12(a) and 12(b) are front views of a portion of the substrate holding unit 12 included in the printing apparatus 1 according to an embodiment of the present disclosure. If the thickness data of the substrate KB stored in the memory unit 18b is accurate and the actual thickness of the substrate KB being processed matches the stored thickness data, the operation of the lifter 32 (lifting of the substrate KB) is stopped just when the top surface of the substrate KB comes into contact with the bottom surface of the top clamper 42 ( FIG. 12(a) ). However, if the thickness data of the substrate KB stored in the control device 18 is inaccurate and the actual thickness of the substrate KB being processed is smaller than the thickness data stored in the memory unit 18b, the operation of the lifter 32 (lifting of the substrate KB) continues even after the top surface of the substrate KB comes into contact with the bottom surface of the top clamper 42, causing the top clamper 42 to be pushed up by the substrate KB ( FIG. 12(b) ).

[0039] If the top clamper 42 is pushed up by the substrate KB, the data on the thickness of the substrate KB stored in the memory unit 18b will be incorrect, and the data will need to be corrected (this data correction is performed separately by the operator OP). In this embodiment, the height of the top clamper 42 is measured before and after the substrate KB is brought into contact with the top clamper 42 projecting from the side clamper 37, and based on the measurement results, it is possible to detect whether the top clamper 42 has been pushed up by the substrate KB, as will be explained below.

[0040] 13 is a plan view showing measurement points Q set on the top clampers 42 of the substrate holding unit 12 included in the printing apparatus 1 according to an embodiment of the present disclosure. In this embodiment, as shown in FIG. 13 , a plurality of measurement points Q are set on the top surface of each of the pair of top clampers 42 (on the top surfaces of the portions that protrude from the side clampers 37 when the top clampers 42 are extended from the side clampers 37) in a line in the longitudinal direction (X direction) of the top clampers 42. Here, three measurement points Q(n) (n = 1, 2, 3) are set on the top clamper 42 on the front side as seen by the operator OP, and three measurement points Q(n) (n = 4, 5, 6) are set on the top clamper 42 on the back side as seen by the operator OP.

[0041] 13, in this embodiment, three measurement points Q are set on each top clamper 42, but this is just an example and the number is not limited thereto. However, it is preferable that at least one measurement point Q on the top clamper 42 is located at the center in the longitudinal direction (X direction) of the top clamper 42, and it is also preferable that one measurement point Q is located at each end in the longitudinal direction of the top clamper 42. Therefore, it is desirable that at least three measurement points Q are set on each top clamper 42.

[0042] FIG. 14 is a flowchart illustrating the flow of a printing operation performed by the printing apparatus 1 according to an embodiment of the present disclosure. FIG. 15 is a perspective view illustrating the laser displacement meter 16 provided in the printing apparatus 1 according to an embodiment of the present disclosure measuring the height of measurement points Q set on the top clamper 42. The flowchart in FIG. 14 illustrates the flow of a workpiece processing procedure (workpiece processing method) performed by the printing apparatus 1, including the printing operation described above. In this workpiece processing, the printing apparatus 1 (controller 18) first acquires "pre-contact height" data for the top clamper 42 by measuring the height of each measurement point on the top clamper 42 before the lifter 32 contacts the board KB from below with the laser displacement meter 16 (step ST1: pre-contact height acquisition process). Specifically, the laser displacement meter 16 is used to measure the heights of the three measurement points Q(n) (n = 1, 2, 3) set on the front top clamper 42 and the three measurement points Q(n) (n = 4, 5, 6) set on the rear top clamper 42 ( FIG. 15 ). The order in which the heights of the multiple (three) measurement points Q are measured may be arbitrary, but it is preferable to measure from one side to the other in the longitudinal direction (X direction) of the top clamper 42, or from the center to one end in the longitudinal direction and then to the other end.

[0043] The control device 18 measures the heights of the three measurement points Q(1), Q(2), and Q(3) set on the top clamper 42 on the front side as seen from the operator OP, and the heights of the three measurement points Q(4), Q(5), and Q(6) set on the top clamper 42 on the back side as seen from the operator OP, and then determines height data for each top clamper 42. The height data may be the three height values ​​acquired for each measurement point Q, or may be a single height determined by a method such as the maximum value of the heights measured at each of the three measurement points Q, the average value of the heights of the three measurement points Q, or the average value of values ​​obtained by multiplying the heights of the three measurement points Q by weights corresponding to their locations on the top clamper 42 (for example, a greater weight may be applied to the center of the top clamper 42 than to the ends).

[0044] In step ST1, after the pre-contact heights of each of the pair of top clampers 42 have been acquired, the lifter 32 raises the substrate KB to bring the substrate KB into contact with the top clampers 42 (step ST2, contact step). The height of the top clampers 42 in contact with the substrate KB is then measured, and this height is acquired as the "contact state height" of the top clampers 42 (step ST3, contact state height acquisition step). The specific procedure for acquiring the "contact state height" is the same as in step ST1. That is, after measuring the heights of the three measurement points Q(1), Q(2), and Q(3) set on the top clamper 42 on the front side as seen from the operator OP and the three measurement points Q(4), Q(5), and Q(6) set on the top clamper 42 on the back side as seen from the operator OP, height data for each top clamper 42 is determined using the same determination method as in step ST1.

[0045] After the contact state height is acquired in step ST3, the judgment unit 18c (FIG. 5) compares the acquired contact state height with the pre-contact height acquired in step ST1 to determine whether or not the top clamper 42 has been deformed by contact with the substrate KB (step ST4, deformation judgment step). Specifically, the judgment unit 18c compares the height data determined in step ST1 with the height data determined in step ST3 for each top clamper 42, and if the height data for the contact state height is substantially the same as the height data for the pre-contact height (when the heights of each of the multiple measurement points Q are used as height data, and all of the heights of the multiple measurement points Q are substantially the same before and after contact), it determines that no deformation has occurred in the top clamper 42. On the other hand, if the height data for the contact state height is not the same as the height data for the pre-contact height (when the heights of each of the multiple measurement points Q are used as height data, and any one of the heights of the multiple measurement points Q is different before and after contact), it determines that deformation has occurred in the top clamper 42. Here, whether the two compared height data are "almost the same" can be determined, for example, based on whether the difference obtained by comparing the two height data is equal to or less than a predetermined threshold value determined according to the method for determining the height data of the top clamper 42 described above.

[0046] If the determination unit 18c determines in step ST4 that no deformation has occurred in either of the pair of top clampers 42, the operation control unit 18a performs a paste application operation as a predetermined process on the substrate KB clamped by the pair of side clampers 37 (step ST5, a process execution step). The procedure for executing the paste application operation is as described above.

[0047] On the other hand, if the determination unit 18c determines that deformation has occurred in at least one of the pair of top clampers 42, the operation control unit 18a issues an alarm using a display device such as a touch panel TP (FIGS. 1 and 5) provided in the printing device 1 as an alarm issuing means (step ST6, alarm issuing process).Then, without performing the paste application work as the predetermined process on the substrate KB, the operation control unit 18a separates the substrate KB from the top clamper 42 (step ST7, separation process).After the substrate KB has been separated from the top clamper 42, the control device 18 measures the height of the top clamper 42 separated from the substrate KB using the laser displacement meter 16 and acquires this as the "post-separation height" of the top clamper 42 (step ST8, post-separation height acquisition process).

[0048] After acquiring the post-separation height in step ST8, the operation control unit 18a compares the acquired post-separation height with the pre-contact height acquired in step ST1, and determines in the determination unit 18c whether or not plastic deformation (including a predetermined amount or more of residual strain; the same applies below) has occurred in the top clamper 42 due to contact with the substrate KB (step ST9: plastic deformation determination step).As a result, if the determination unit 18c determines that the post-separation height and the pre-contact height are substantially the same and that no plastic deformation has occurred in either of the pair of top clampers 42, the operation control unit 18a notifies the operator OP of this (that no plastic deformation has occurred in the top clamper 42) via the touch panel TP (step ST10).

[0049] On the other hand, if the post-separation height and the pre-contact height do not match and the determination unit 18c determines that plastic deformation has occurred in at least one of the pair of top clampers 42, the operation control unit 18a notifies the operator OP of this (that plastic deformation has occurred in the top clamper 42) through the touch panel TP (step ST11). The operator OP, having received the notification that plastic deformation has occurred in the top clamper 42, takes appropriate measures, such as replacing the top clamper 42 with a new one. Note that if it is determined in the deformation determination step of step ST4 that deformation has occurred in the top clamper 42, or if it is determined in the plastic deformation determination step of step ST9 that plastic deformation has occurred in the top clamper 42, a display step may be executed by the display device or the like (for example, during the alarm generation step of step ST6 or the notification of step ST11) to prompt the operator OP to correct the thickness data of the substrate KB stored in the memory unit 18b.

[0050] As described above, the printing apparatus 1 in this embodiment is equipped with a pair of side clampers 37 that clamp a pair of opposing side surfaces of the workpiece substrate KB from the sides of the substrate KB, a top clamper 42 that is attached to the pair of side clampers 37 and comes into contact with the upper surface of the substrate KB, and is also equipped with a laser displacement meter 16 as height measuring means that measures the height of the top clamper 42. The laser displacement meter 16 acquires the height of the top clamper 42 before the substrate KB comes into contact as a pre-contact height, and acquires the height of the top clamper 42 when the substrate KB is in contact as a contact state height, and by comparing the contact state height with the pre-contact height, it is possible to determine whether or not the top clamper 42 has been deformed by the substrate KB coming into contact with it.

[0051] Therefore, according to the printing device 1 in this embodiment, it is possible to detect the state in which the top clamper 42 provided on the side clamper 37 is pushed up and deformed by the substrate KB, and the position of the workpiece (substrate KB) relative to the pair of side clampers 37 can be made accurate, thereby improving the processing accuracy (printing accuracy) in the printing work of the printing device 1, which is a work processing device.

[0052] Furthermore, the workpiece processing method by the printing apparatus 1 in this embodiment includes a pre-contact height acquisition process (step ST1) for acquiring the height of the top clamper 42 before the workpiece, i.e., the substrate KB, comes into contact with it as a pre-contact height; a contact process (step ST2) for bringing the substrate KB into contact with the top clamper 42; a contact state height acquisition process (step ST3) for acquiring the height of the top clamper 42 in a state in which it is in contact with the substrate KB in the contact process as a contact state height; and a deformation determination process (step ST4) for determining whether or not deformation has occurred in the top clamper due to contact with the workpiece by comparing the contact state height acquired in the contact state height acquisition process with the pre-contact height acquired in the pre-contact height acquisition process.

[0053] Furthermore, the method further includes an alarm issuing step (step ST6) for issuing an alarm if it is determined in the deformation determination step of step ST4 that deformation has occurred in the top clamper 42; a separation step (step ST7) for separating the substrate KB from the top clamper 42 without performing a predetermined process (paste application work) on the substrate KB if it is determined in the deformation determination step that deformation has occurred in the top clamper 42; a post-separation height acquisition step (step ST8) for acquiring the height of the top clamper 42 in a state where it has been separated from the substrate KB in the separation step as the post-separation height; and a plastic deformation determination step (step ST9) for determining whether or not plastic deformation has occurred in the top clamper 42 by comparing the post-separation height acquired in the post-separation height acquisition step with the pre-contact height acquired in the pre-contact height acquisition step.

[0054] In the case where the top clamper 42 is configured to be retractable and extendable relative to the side clampers 37, as in the printing apparatus 1 of this embodiment, the laser displacement meter 16 may measure the pre-contact height with the top clamper 42 retracted in the side clampers 37. In this case, the above-mentioned step ST1 is performed with the top clamper 42 retracted in the side clampers 37, and the top clamper 42 extends from the side clampers 37 before step ST2.

[0055] FIG. 16 is a plan view showing measurement points Q set on the top clamper 42 and measurement points Q set on the side clampers 37 of the substrate holding unit 12 included in the printing apparatus 1 according to an embodiment of the present disclosure. Furthermore, in the printing apparatus 1 according to the present embodiment, it is also possible to measure the height of the top clamper 42 as a difference from the side clamper 37. In this case, for example, as shown in FIG. 16 , three measurement points C(n) (n=1, 2, 3) corresponding to the three measurement points Q(n) (n=1, 2, 3) on the front top clamper 42 are set on the side clamper 37 on the front side as seen from the operator OP, and three measurement points C(n) (n=4, 5, 6) corresponding to the three measurement points Q(n) (n=4, 5, 6) on the rear top clamper 42 are set on the side clamper 37 on the rear side as seen from the operator OP. In this case, the measurement points C(n) on the side clamper 37 side are set at positions aligned in the Y direction with the measurement points Q(n) on the top clamper 42 side.

[0056] When measuring the height of measurement point Q(n) (n=1, 2, ..., 6) on the top clamper 42, measurement point C(n) (n=1, 2, ..., 6) on the side clamper 37 is also measured. Once the heights of measurement point Q(n) (n=1, 2, ..., 6) and measurement point C(n) (n=1, 2, ..., 6) are obtained, the difference Δ(n) = Q(n) - C(n) (n=1, 2, ..., 6) between these measurement points with the same number (n) is calculated, and the calculated Δ(n) (n=1, 2, ..., 6) is used as the height of measurement point Q(n) (n=1, 2, ..., 6). In this case, height Δ(n) (n=1, 2, ..., 6) is the relative height of measurement point Q(n) (n=1, 2, ..., 6) with respect to measurement point C(n) (n=1, 2, ..., 6). In this way, even when the height of measurement point Q(n) (n = 1, 2, ..., 6) on the top clamper 42 is measured as a relative height from the corresponding measurement point C(n) (n = 1, 2, ..., 6) on the side clamper 37, the same effect as in the case described above can be obtained.

[0057] It is preferable to measure the height (presence or absence of deformation) of the top clamper 42 described above immediately after the power to the printing apparatus 1 is turned on (i.e., at the start of production), as well as after the start of production, every time several boards KB are printed. Furthermore, it is also preferable to measure the height when the type of board KB being produced changes, when a certain time interval has passed during production, when a deterioration in print quality is detected by an inspection device that is arranged downstream of the printing apparatus 1 and inspects boards KB after printing is completed, when the lot of boards KB is changed, etc.

[0058] If it is determined in the above-mentioned step ST4 (deformation determination step) that the top clamper 42 is deformed, but it is subsequently determined in step ST9 (plastic deformation determination step) that the top clamper 42 is not plastically deformed (i.e., if the deformation is within the range of the elastic deformation of the top clamper 42), it is possible to proceed directly to step ST5 and perform the paste application work. However, even if proceeding to the paste application work in this way, if deformation of the top clamper 42 occurs frequently or if the above-mentioned inspection device detects a printing defect error, it is preferable to stop the operation of the printing apparatus 1 and inspect the top clamper 42 without proceeding to the paste application work.

[0059] As described above, the printing apparatus 1 (workpiece processing method) of this embodiment is provided with the laser displacement meter 16 as height measuring means for measuring the height of the top clamper 42, and it is possible to determine whether or not the top clamper 42 has been deformed based on the height of the top clamper 42 before and after contact with the board KB measured by the laser displacement meter 16. Therefore, if the top clamper 42 has been pushed up by the board KB and is in a deformed state, this can be detected, and the position of the workpiece (board KB) relative to the pair of side clampers 37 can be made accurate, thereby improving the processing accuracy (printing accuracy) in the printing operation of the printing apparatus 1, which is a workpiece processing apparatus.

[0060] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above and can be modified in various ways, etc. For example, in the above-described embodiments, the top clamper 42 is configured to be retractable and extendable relative to the side clampers 37. However, even if the top clamper 42 is configured to be fixed relative to the side clampers 37, the above-described effects can be obtained by applying the present disclosure.

[0061] Furthermore, in the above-described embodiment, the laser displacement meter 16, which serves as height detection means, is moved by the XY movement mechanism 38 that moves the camera 15. However, the laser displacement meter 16 may be attached to the squeegee base 17B that moves the squeegee 17 and may be configured to move in the X direction relative to the squeegee base 17B. In such a configuration, the laser displacement meter 16 can be moved within the XY plane (horizontal plane) by moving the squeegee base 17B in the Y direction and moving the laser displacement meter 16 itself in the X direction relative to the squeegee base 17B. Alternatively, a dedicated XY movement mechanism may be provided for the laser displacement meter 16, and the laser displacement meter 16 may be moved within the XY plane by the dedicated XY movement mechanism. Alternatively, the laser displacement meter 16 may be provided in a cleaning mechanism that cleans the underside of the mask 14.

[0062] Furthermore, in the above-described embodiment, if the top clamper 42 is replaced with a new one because plastic deformation of the top clamper 42 is recognized, the heights of a plurality of measurement points Q(n) (n = 1, 2, ..., 6) may be measured in advance in the new state (i.e., a state in which no plastic deformation has occurred), and the height of the measured measurement point Q(n) may be used as a reference, and the difference δ(n) (n = 1, 2, ..., 6) from that height may be used as the height of the measurement point Q(n) (n = 1, 2, ..., 6).

[0063] Furthermore, in the above-described embodiment, the top clamper 42 is provided on both of the pair of side clampers 37, but it is sufficient that the top clamper 42 is provided on at least one of the pair of side clampers 37. Furthermore, in the above-described embodiment, the pair of side clampers 37 are each configured to be driven by two side clamper driving units 37M, but the present disclosure is not limited to this. For example, one side clamper 37 may be fixed in position, and only the other side clamper 37 may be movable. Furthermore, in the above-described embodiment, the height measuring means for measuring the height of the top clamper 42 is the laser displacement meter 16, but the height measuring means is not limited to the laser displacement meter 16 and may be another means, such as the camera 15 provided in the printing apparatus 1.

[0064] Furthermore, in the above-described embodiment, the predetermined process performed by the printing apparatus 1 as a workpiece processing apparatus is a paste application process in which a mask 14 is brought into contact with the upper surface of the substrate KB as a workpiece, and then a paste Pst is applied to the upper surface of the substrate KB through the mask 14. However, the predetermined process may also be a component mounting process in which components are mounted on the upper surface of the substrate KB as a workpiece. In this case, the workpiece processing apparatus is a component mounting apparatus. Furthermore, other processing apparatuses that perform various processes on the substrate KB may also be referred to as workpiece processing apparatuses. Furthermore, in the above-described embodiment, the left side is the upstream side and the right side is the downstream side as viewed from the operator OP, but the right side may also be the upstream side and the left side is the downstream side as viewed from the operator OP.

[0065] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components of the various embodiments described above may be combined in any manner without departing from the spirit of the invention.

[0066] To provide a workpiece processing device and a workpiece processing method capable of detecting a state in which a top clamper provided on a side clamper is pushed up by a workpiece and deformed.

[0067] DESCRIPTION OF SYMBOLS 1 Printing device (workpiece processing device) 12a Y table 12b X table 12c Θ table 14 Mask 15 Camera 16 Laser displacement meter (height measuring means) 18c Determination unit 31 First lifting table 33 Second lifting table 37 Side clamper 42 Top clamper TP Touch panel (alarm issuing means) M2 X drive motor M1 Y drive motor M3 Θ drive motor KB Substrate (workpiece) Pst Paste

Claims

1. A work processing device that performs a predetermined process on a workpiece, comprising: a pair of side clampers that clamp a pair of opposing side surfaces of the workpiece from the sides of the workpiece; a top clamper that is provided on at least one of the pair of side clampers and that comes into contact with the top surface of the workpiece; and height measuring means that measures the height of the top clamper.

2. The work processing device according to claim 1, further comprising a determination unit that determines whether or not deformation has occurred in the top clamper based on the height of the top clamper measured by the height measurement means.

3. A work processing device as described in claim 2, wherein the height measuring means acquires the height of the top clamper before the workpiece comes into contact as a pre-contact height, and acquires the height of the top clamper in a state in which the workpiece is in contact as a contact state height, and the determination unit determines whether or not deformation has occurred in the top clamper by comparing the contact state height with the pre-contact height.

4. The work processing device according to claim 2, further comprising an alarm issuing means for issuing an alarm when the determining unit determines that deformation has occurred in the top clamper.

5. A work processing device as described in claim 3, wherein, when the judgment unit judges that deformation has occurred in the top clamper, the height measurement means acquires the height of the top clamper in a state in which the workpiece is separated as a post-separation height, and the judgment unit judges whether plastic deformation has occurred in the top clamper by comparing the post-separation height with the pre-contact height.

6. The work processing device according to claim 1, wherein the height measuring means comprises a laser displacement meter or a camera.

7. A work processing device as set forth in claim 3, wherein the top clamper is retractable and extendable relative to at least one of the pair of side clampers, and the height measuring means measures the pre-contact height when the top clamper is retracted into at least one of the pair of side clampers.

8. The workpiece processing device according to claim 1, wherein the predetermined processing is a paste application operation in which a mask is brought into contact with the upper surface of the substrate as the workpiece, and then paste is applied to the upper surface of the substrate through the mask.

9. A workpiece processing method using a workpiece processing device equipped with a pair of side clampers that clamp a pair of opposing side surfaces of the workpiece from the sides of the workpiece, and a top clamper that is provided on at least one of the pair of side clampers and with which the top surface of the workpiece comes into contact, the workpiece processing method comprising: a pre-contact height acquisition step of acquiring the height of the top clamper before the workpiece comes into contact as a pre-contact height; a contact step of bringing the workpiece into contact with the top clamper; a contact state height acquisition step of acquiring the height of the top clamper in a state in which it has come into contact with the workpiece in the contact step as a contact state height; and a deformation determination step of determining whether or not deformation has occurred in the top clamper by comparing the contact state height with the pre-contact height.

10. A workpiece processing method according to claim 9, further comprising an alarm issuing step of issuing an alarm when it is determined in the deformation determining step that deformation has occurred in the top clamper.

11. A workpiece processing method according to claim 9, further comprising: a separation step of separating the workpiece from the top clamper without performing workpiece processing on the workpiece when it is determined in the deformation determination step that deformation has occurred in the top clamper; a post-separation height acquisition step of acquiring the height of the top clamper in a state where it has been separated from the workpiece in the separation step as a post-separation height; and a plastic deformation determination step of determining whether or not plastic deformation has occurred in the top clamper by comparing the post-separation height with the pre-contact height.

12. A workpiece processing method as set forth in claim 9, further comprising a display step of prompting a user to correct the data on the thickness of the substrate serving as the workpiece stored in the memory unit using a display device when it is determined in the deformation determination step that deformation has occurred in the top clamper.

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