Rotary chuck with wafer lifting function

Abstract

Provided in the present invention is a rotary chuck with a wafer lifting function, comprising a chuck body which is penetrated by several lifting mechanisms and is provided with first gas passages therein. The lower end of each lifting mechanism corresponds to a first gas passage; by introducing gas into the first gas passages, the lifting mechanisms are lifted upwards, during which the upper end of each lifting mechanism protrudes beyond the upper end face of the chuck body; when no gas is introduced into the first gas passages, the lifting mechanisms return to the original positions. A transfer gripping mechanism in a process chamber is removed, and the lifting mechanisms capable of wafer lifting are added, such that, during handling of a wafer by existing transfer mechanisms, the generation of particulate matter due to the friction between parts, which may fall onto the surface of the wafer and contaminate the surface of the wafer, is prevented; in addition, the lifting mechanisms are mounted inside the rotary chuck, occupying less space while also reducing the cost.

Description

A rotary chuck with wafer lifting function Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, in particular to a rotary chuck with a wafer lifting function. Background Art

[0002] Wet cleaning equipment plays an irreplaceable role as a critical step in the semiconductor manufacturing process. Improper cleaning not only affects the cleanliness of the chip surface but also directly impacts the chip's electrical performance, crystal structure, interface properties, and stability. By removing impurities and contaminants, cleaning optimizes chip performance and improves the efficiency and reliability of electronic devices.

[0003] Wet cleaning equipment generally includes tank-type equipment and single-wafer cleaning equipment. Typically, when performing the wafer cleaning process in a single-wafer cleaning system, the wafer to be cleaned is transferred into the process chamber of the single-wafer cleaning system by a robotic arm. The robotic arm then transfers the wafer to a transfer clamping mechanism within the process chamber. The transfer clamping mechanism then descends to transfer the wafer to a chuck. Once the wafer is cleaned, the transfer clamping mechanism removes the wafer from the chuck. The robotic arm then removes the wafer from the transfer clamping mechanism and transfers it out of the cleaning system.

[0004] The transfer clamping mechanism has a complex transmission structure and must perform clamping movement directly above the chuck. During the movement of the transfer clamping mechanism, friction between components will produce small particles of contaminants, which can easily fall onto the wafer and contaminate the already cleaned wafer. Summary of the Invention

[0005] Based on the above records, the present invention provides a rotary chuck with a wafer lifting function, aiming to solve the technical problem in the prior art that wafers are easily contaminated when transferred using a transfer clamping mechanism.

[0006] A rotary chuck with a wafer lifting function comprises a chuck body, wherein the chuck body is provided with a plurality of lifting mechanisms and a first air passage is provided inside the chuck body;

[0007] The lower end of the lifting mechanism corresponds to a first air channel, and gas is introduced into the first air channel to lift the lifting mechanism upward. When the lifting mechanism is lifted, the upper end of the lifting mechanism is higher than the upper end surface of the chuck body. When gas is not introduced into the first air channel, the lifting mechanism returns to its original position.

[0008] Furthermore, it also includes a rotating main shaft and an outer cylinder sleeved on the rotating main shaft;

[0009] The upper end of the rotating spindle is connected to the chuck body;

[0010] The rotating main shaft is provided with an internal air passage and an annular groove;

[0011] A ventilation ring is provided at the annular groove, and an annular air chamber is formed between the annular groove and the ventilation ring, and the annular air chamber is connected to the internal air passage;

[0012] The gas input from the outside passes through the annular air chamber and the internal air channel in sequence and then enters the first air channel to lift the lifting mechanism.

[0013] Further, the lifting mechanism includes a lifting pin;

[0014] The lifting pin includes a first extension body, a second extension body and a third extension body connected in sequence;

[0015] The cross-sectional area of ​​the first extension body is smaller than the cross-sectional area of ​​the second extension body;

[0016] The cross-sectional area of ​​the second extension body is smaller than the cross-sectional area of ​​the third extension body;

[0017] The chuck body is provided with a stepped through hole, which is formed by connecting an upper hole and a lower hole, and the cross-sectional area of ​​the upper hole is smaller than the cross-sectional area of ​​the lower hole;

[0018] The cross-sectional area of ​​the upper hole is smaller than the cross-sectional area of ​​the second extension body;

[0019] The upper hole is for the first extension body to pass through, and the lower end surface of the third extension body corresponds to the first air channel.

[0020] Furthermore, the lifting mechanism also includes a sealing ring, which is sleeved on the third extension body to seal the first air passage.

[0021] Furthermore, the lifting mechanism further includes a spring coil, which is sleeved on the second extension body;

[0022] The spring coil is used to return the lifting mechanism to its original position when no gas is introduced into the first air passage.

[0023] Furthermore, the chuck body is provided with a number of raised support members for supporting the wafer;

[0024] The height of the protruding support relative to the upper end surface of the chuck body is lower than the maximum height of the upper end portion of the lifting mechanism relative to the upper end surface of the chuck body when the upper end portion is lifted.

[0025] Furthermore, the chuck body is provided with a plurality of stop pins for preventing the wafer from slipping.

[0026] Furthermore, the chuck body is provided with a plurality of air holes arranged in a ring, and the externally inputted gas passes through the air holes to clamp the wafer in a non-contact manner based on the Bernoulli principle.

[0027] Furthermore, a second air passage connected to the ventilation ring is provided inside the outer cylinder;

[0028] At least two gas pipelines are connected to the outside of the outer cylinder, and the gas pipelines are connected to the second gas channel; the gas input from the outside passes through the gas pipelines, the second gas channel, the annular air chamber, the internal gas channel in sequence, and then enters the first gas channel to lift the lifting mechanism.

[0029] The beneficial technical effect of the present invention is that the present invention arranges a lifting mechanism in the chuck. When the wafer is placed, the lifting mechanism is lifted, and the robot directly places the wafer on the lifting mechanism on the chuck. Then the lifting mechanism is lowered and the chuck carries the wafer for cleaning. When the wafer is taken away, the lifting mechanism rises to lift the wafer, and the robot directly takes away the wafer. After the wafer is taken away, the lifting mechanism is lowered. It can be seen that the present invention eliminates the transfer clamping mechanism in the process chamber and adds a lifting mechanism that can lift the wafer, avoiding the granular objects generated by the friction between the parts of the transfer mechanism during the process of taking and placing the wafer, falling onto the wafer surface and contaminating the wafer surface. At the same time, the lifting mechanism is installed inside the rotating chuck, which occupies little space and saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] 1-3 are schematic structural diagrams of a rotary chuck with a wafer lifting function provided by the present invention;

[0031] FIG4 is a schematic structural diagram of a lifting mechanism with a wafer lifting function provided by the present invention;

[0032] FIG5 is a schematic structural diagram of a stepped hole with a wafer lifting function provided by the present invention;

[0033] FIG6 is an enlarged view of the structure and limit surface marking of a stepped hole with a wafer lifting function provided by the present invention.

[0034] Among them, 1-chuck body; 11-first air channel; 12-air hole; 2-stop needle; 3-wafer; 4-lifting needle; 41-first extension body; 42-second extension body; 43-third extension body; 5-raised support member; 6-spring; 7-sealing ring; 8-outer cylinder; 81-second air channel; 9-rotating spindle, 91-internal air channel; 92-annular groove; 93-vent ring. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0037] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0038] 1-3 , the present invention provides a rotary chuck with a wafer lifting function, comprising a chuck body (1), wherein the chuck body (1) is provided with a plurality of lifting mechanisms and a first air passage (11) is provided inside;

[0039] The lower end of the lifting mechanism corresponds to a first air channel (11), and gas is introduced into the first air channel (11) to lift the lifting mechanism upward. When the lifting mechanism is lifted, the upper end of the lifting mechanism is higher than the upper end surface of the chuck body (1). When gas is not introduced into the first air channel (11), the lifting mechanism returns to its original position.

[0040] The present invention provides a lifting mechanism in the chuck body. When the wafer is placed, the lifting mechanism is lifted, and the robot directly places the wafer on the lifting mechanism on the chuck. Then the lifting mechanism is lowered and the chuck carries the wafer for cleaning. When the wafer is taken away, the lifting mechanism is raised to lift the wafer, and the robot directly takes the wafer away. After the wafer is taken away, the lifting mechanism is lowered. It can be seen that the present invention eliminates the transfer clamping mechanism in the process chamber and adds a lifting mechanism that can lift the wafer, which avoids granular objects generated by friction between parts of the transfer mechanism during the process of taking and placing wafers, falling onto the wafer surface and contaminating the wafer surface. At the same time, the lifting mechanism is installed inside the rotating chuck, which saves the capacity of the process chamber, simplifies the mechanism, improves the efficiency of the robot in taking and placing wafers, improves the reliability of the cleaning equipment, and saves costs.

[0041] Furthermore, the gas input into the first gas channel (11) is nitrogen.

[0042] Furthermore, it also includes a rotating main shaft (9) and an outer cylinder (8) sleeved on the rotating main shaft;

[0043] The upper end of the rotating main shaft (9) is connected to the chuck body (1);

[0044] The rotating main shaft (9) is provided with an internal air passage (91) and an annular groove (92), a ventilation ring (93) is provided corresponding to the annular groove (92), and an annular air chamber is formed between the annular groove (92) and the ventilation ring (93), and the annular air chamber is connected to the internal air passage (91);

[0045] The gas inputted from the outside passes through the annular air chamber and the internal air channel (91) in sequence and then enters the first air channel (11) to lift the lifting mechanism.

[0046] When the wafer is cleaned, the rotating spindle (9) drives the rotating chuck to rotate. When the wafer is taken or placed, the lifting mechanism is lifted by ventilation through the annular air chamber formed by the rotating spindle (9) and the internal air channel (91), thereby saving the capacity of the process chamber and simplifying the mechanism.

[0047] Referring to Figures 4-6, further, the lifting mechanism includes a lifting pin (4);

[0048] The lifting pin (4) comprises a first extension body (41), a second extension body (42) and a third extension body (43) which are connected in sequence;

[0049] The cross-sectional area of ​​the first extension body (41) is smaller than the cross-sectional area of ​​the second extension body (42);

[0050] The cross-sectional area of ​​the second extension body (42) is smaller than the cross-sectional area of ​​the third extension body (41);

[0051] The chuck body (1) is provided with a stepped through hole (12), which is formed by connecting an upper hole (121) and a lower hole (122), and the cross-sectional area of ​​the upper hole (121) is smaller than the cross-sectional area of ​​the lower hole (122);

[0052] The cross-sectional area of ​​the upper hole (121) is smaller than the cross-sectional area of ​​the second extension body (42);

[0053] The upper hole (121) is for the first extension body (41) to pass through, and the lower end surface of the third extension body (43) corresponds to the first air channel (11).

[0054] The first extension body (41) of the lifting pin (4) mainly passes through the upper hole (121) when gas is introduced and rises above the upper end surface of the chuck body (1) to support the wafer so that the robot can easily pick up and place the wafer.

[0055] A step is formed at the connection between the first extension body (41) and the second extension body (42), and the step constitutes an upper limit surface, that is, the second extension body (42) is limited and cannot continue to penetrate the upper hole (121), thereby limiting the lifting height of the lifting mechanism.

[0056] The lifting pin (4) is provided with a reset mechanism. The bottom of the lower hole (122) is connected to the first air channel (11). The bottom serves as a lower limit surface. After the ventilation in the first air channel is cut off, the reset mechanism resets the lifting pin (4). The lower end surface of the third extension body (43) is limited by the lower limit surface, limiting the lowest position of the lifting pin (4). Furthermore, the lifting mechanism also includes a sealing ring (7). The sealing ring (7) is sleeved on the third extension body (43) to seal the first air channel (11).

[0057] The sealing ring (7) plays a sealing role, preventing gas from leaking out from the stepped perforations and affecting the lifting effect.

[0058] Furthermore, the lifting mechanism also includes a spring coil (6), which is sleeved on the second extension body. That is, the reset mechanism is the spring coil (6).

[0059] The cross-sectional area of ​​the second extension body (42) is smaller than that of the third extension body (41), and the step formed by the upper hole (121) and the lower hole (122) can restrict the spring coil (6) on the second extension body (42), thereby achieving compression and reset of the spring.

[0060] A lifting mechanism composed of a lifting pin (4), a spring coil (6), and a sealing ring (7) is installed inside the chuck body (1) and is used for lifting the wafer (3). The spring coil (6) can reset the lifting mechanism after the air is cut off. The lifting mechanism replaces the previous transfer clamping mechanism, and the lifting mechanism is installed inside the rotary chuck. The lifting mechanism is lifted up by the gas. When lifting, the spring coil is compressed. When the air is cut off, the lifting pin is rebounded to its original position by the elastic force of the spring itself. The lower end face of the lifting pin is limited by the lower limit surface and will not continue to fall.

[0061] Furthermore, there are three jacking mechanisms, and the three jacking mechanisms form an equilateral triangle.

[0062] Furthermore, the chuck body (1) is provided with a plurality of protruding support members (5) for supporting the wafer;

[0063] The height of the raised support member (5) relative to the upper end surface of the chuck body (1) is lower than the maximum height of the upper end portion of the lifting mechanism relative to the upper end surface of the chuck body (1) when the upper end portion is lifted.

[0064] The raised support member (5) is used for contact-type support of the wafer.

[0065] Furthermore, the raised support members (5) are arranged in a ring, and the center of the ring formed by the raised support members (5) is concentric with the center of the equilateral triangle formed by the jacking mechanism. The ring formed by the raised support members (5) surrounds the jacking mechanism.

[0066] Furthermore, there are six evenly spaced raised support members (5) on the chuck body (1).

[0067] Furthermore, a plurality of blocking needles (2) for preventing the wafer from slipping are provided on the chuck body (1).

[0068] The blocking needle (2) plays the role of blocking the wafer and can also play the role of guiding when the lifting mechanism descends.

[0069] Furthermore, the needle blocks (2) are arranged in a ring shape.

[0070] Furthermore, there are 6 evenly spaced stop pins (2) on the chuck body (1).

[0071] Furthermore, the ring formed by the needle blocks (2) surrounds the ring formed by the raised support members (5).

[0072] Furthermore, a plurality of air holes (12) arranged in an annular pattern are provided on the chuck body (1), and externally inputted gas passes through the air holes (12) to clamp the wafer in a non-contact manner based on the Bernoulli principle.

[0073] When the wafer is cleaned, gas is introduced into the air hole, and the rotating spindle (9) rotates, so that non-contact contact between the wafer and the chuck is achieved based on the Bernoulli principle, and the wafer is cleaned with high quality.

[0074] Furthermore, a second air passage (81) connected to the ventilation ring (93) is provided inside the outer tube (8), and at least two air pipelines are connected to the outside of the outer tube (8), and the air pipelines are connected to the second air passage (81);

[0075] The gas inputted from the outside passes through the gas transmission pipeline, the second gas channel (81), the annular gas chamber, the internal gas channel (91) in sequence, and then enters the first gas channel (11) to lift the lifting mechanism.

[0076] Each lifting mechanism corresponds to a first air channel (11), and a second air channel (81) is provided inside the outer tube (8). The gas transported by the gas pipeline can enter the annular air chamber surrounded by the ventilation ring (93) and the annular groove (92) through the second air channel (81) inside the outer tube (8). The annular air chamber gathers the gas into the internal air channel of the rotating main shaft (9), and the gas is transported to the corresponding first air channel through the internal air channel.

[0077] Furthermore, the gas pipeline is equipped with a solenoid valve and a speed control valve. The solenoid valve acts as a switch to allow gas to flow in and out. The speed control valve is used to adjust the flow of input gas, thereby controlling the speed stability of the jacking mechanism. Too fast or too slow speeds will affect the use of the jacking mechanism.

[0078] When the robot needs to take or place a wafer, the lifting mechanism is in an ascending state, leaving space for the robot to take or place the wafer. The gas flows through the outer cylinder (8) and the rotating main shaft (9) through the electromagnetic valve and the speed control valve to reach the lifting mechanism, lifting the lifting mechanism. When the robot has placed the wafer and needs to perform a cleaning process on the wafer, the lifting mechanism needs to return to its original position and rely on the raised support to support the wafer. When the lifting mechanism returns to its original position, the electromagnetic valve works, and the spring of the lifting mechanism bounces the lifting needle to its original position. The wafer is now supported by the raised support and then the wafer cleaning process begins. During debugging, the rising speed and the falling speed of the lifting mechanism need to be adjusted.

[0079] The above description is only a preferred embodiment of the present invention and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A rotary chuck with wafer lifting function, characterized in that: It includes a chuck body, wherein the chuck body is provided with a plurality of lifting mechanisms and a first air passage is provided inside; The lower end of the lifting mechanism corresponds to the first air channel, and gas is introduced into the first air channel to lift the lifting mechanism upward. When the lifting mechanism is lifted, the upper end of the lifting mechanism is higher than the upper end surface of the chuck body. When gas is not introduced into the first air channel, the lifting mechanism returns to its original position.

2. A rotary chuck with wafer lifting function as claimed in claim 1, characterized in that: It also includes a rotating main shaft and an outer cylinder sleeved on the rotating main shaft; The upper end of the rotating spindle is connected to the chuck body; The rotating main shaft is provided with an internal air passage and an annular groove; A ventilation ring is provided at the annular groove, and an annular air chamber is formed between the annular groove and the ventilation ring, and the annular air chamber is connected to the internal air passage; The gas input from the outside passes through the annular air chamber and the internal air channel in sequence and then enters the first air channel to lift the lifting mechanism.

3. The rotary chuck with wafer lifting function according to claim 2, characterized in that: The lifting mechanism includes a lifting pin; The lifting pin includes a first extension body, a second extension body and a third extension body connected in sequence; The cross-sectional area of ​​the first extension body is smaller than the cross-sectional area of ​​the second extension body; The cross-sectional area of ​​the second extension body is smaller than the cross-sectional area of ​​the third extension body; The chuck body is provided with a stepped through hole, the stepped through hole is formed by connecting an upper hole and a lower hole, and the cross-sectional area of ​​the upper hole is smaller than the cross-sectional area of ​​the lower hole; The cross-sectional area of ​​the upper hole is smaller than the cross-sectional area of ​​the second extension body; The upper hole is for the first extension body to pass through, and the lower end surface of the third extension body corresponds to the first air channel.

4. The rotary chuck with wafer lifting function according to claim 3, characterized in that: The lifting mechanism further includes a sealing ring, which is sleeved on the third extension body to seal the first air passage.

5. The rotary chuck with wafer lifting function according to claim 3, characterized in that: The lifting mechanism further includes a spring coil, which is sleeved on the second extension body and is used to restore the lifting mechanism to its original position when no gas is introduced into the first air passage.

6. The rotary chuck with wafer lifting function according to claim 1, characterized in that: The chuck body is also provided with a plurality of protruding support members for supporting the wafer; The height of the protruding support relative to the upper end surface of the chuck body is lower than the maximum height of the upper end portion of the lifting mechanism relative to the upper end surface of the chuck body when the upper end portion is lifted.

7. The rotary chuck with wafer lifting function according to claim 1, characterized in that: The chuck body is also provided with a plurality of stop pins for preventing the wafer from sliding off.

8. The rotary chuck with wafer lifting function according to claim 1, characterized in that: The chuck body is also provided with a plurality of air holes arranged in a ring, and the externally inputted gas passes through the air holes to clamp the wafer in a non-contact manner based on the Bernoulli principle.

9. The rotary chuck with wafer lifting function according to claim 2, characterized in that: A second air passage connected to the vent ring is provided inside the outer cylinder; The outer tube is connected to at least two gas pipelines, and the gas pipelines are connected to the second air channel; The gas input from the outside passes through the gas transmission pipeline, the second gas channel, the annular gas chamber, the internal gas channel in sequence, and then enters the first gas channel to lift the lifting mechanism.

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