Circuit board assembly and electronic device

Abstract

The present application relates to the technical field of electronic devices, and provides a circuit board assembly and an electronic device, used for solving the problem of increase of impedance of metal functional layers in existing circuit boards due to miniaturization of the circuit boards. The circuit board assembly provided by the present application comprises a circuit board, components and a structural part. The circuit board is provided with a first surface, and the first surface comprises a first area and a second area. The components are located in the first area, and the components are electrically connected to the circuit board. The structural part is located in the second area, the structural part comprises an inner core and an insulating layer, the inner core is electrically connected to the circuit board, and the insulating layer wraps the inner core. According to the circuit board assembly provided by the present application, while the size of the circuit board is not changed, the inner core of the structural part can reduce the impedance of a metal functional layer in the circuit board to a certain extent, thereby improving the electrical performance index of the metal functional layer. In addition, the insulating layer wrapping the inner core can prevent the inner core from being in direct contact with surrounding components to cause short circuits.

Description

Circuit board assemblies and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on March 28, 2024, with application number 202420657668.2 and invention name “Circuit Board Assembly and Electronic Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a circuit board assembly and an electronic device. Background Art

[0003] With the development of electronic devices, they are increasingly pursuing thinner, lighter, and smaller sizes. This reduction in size and weight relies primarily on reducing the volume of components within these devices. For example, the area and thickness of circuit boards within these devices are decreasing. This, in turn, reduces the area and thickness of the various metal functional layers within the circuit board (e.g., power supply layers, conductor layers, etc.), leading to an increase in the impedance of the circuit board. Summary of the Invention

[0004] Embodiments of the present application provide a circuit board assembly and an electronic device, which are used to solve the problem of increased impedance of the internal metal functional layer of existing circuit boards when the circuit boards are miniaturized.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a circuit board assembly, including a circuit board, components, and structural parts.

[0007] The circuit board has a first surface, which includes a first area and a second area. Components are located in the first area and are electrically connected to the circuit board. Structural components are located in the second area and include an inner core and an insulating layer. The inner core is electrically connected to the circuit board, and the insulating layer surrounds the inner core.

[0008] The circuit board assembly provided in the first aspect of the present application comprises a structural member disposed on a second region of the first surface of the circuit board, wherein the inner core of the structural member is electrically connected to the circuit board. The inner core of the structural member can be electrically connected to any metal functional layer (e.g., a power layer, a conductor layer, etc.) on the circuit board, which is equivalent to making the inner core of the structural member a part of the metal functional layer to which it is connected. The inner core of the structural member increases the area and thickness of the corresponding metal functional layer, thereby reducing the impedance of the metal functional layer in the circuit board to a certain extent while maintaining the volume of the circuit board, thereby improving the electrical performance of the metal functional layer. Furthermore, the insulating layer wrapped around the outer surface of the inner core can prevent the inner core from directly contacting surrounding components and causing a short circuit.

[0009] In combination with the first aspect, in one possible implementation, the second area is located between two adjacent components. Among them, the above-mentioned components can be active devices (such as CPU, GPU, LPDDR, etc.) or passive devices (such as resistors, capacitors, inductors, filters, etc.). In this way, it is equivalent to setting the structural parts in the blank area between adjacent components on the circuit board, thereby optimizing the impedance of the metal functional layer through the structural parts while also improving the surface utilization of the circuit board, which is conducive to the miniaturization of the circuit board.

[0010] In conjunction with the first aspect, in another possible implementation, the second region is located at the edge of the circuit board. This is equivalent to placing the structural component in a blank area at the edge of the circuit board where no components are located. This reduces the impedance of the metal functional layer in the circuit board while also increasing the surface utilization of the circuit board, thereby facilitating miniaturization of the circuit board.

[0011] In conjunction with the first aspect, in another possible implementation, the structural strength of the portion of the circuit board corresponding to the second region is less than the structural strength of the portion corresponding to the first region. This arrangement allows the structural member to reinforce the weaker portion of the circuit board. In other words, the structural member serves the dual purpose of both reducing impedance and providing structural reinforcement for the circuit board.

[0012] In conjunction with the first aspect, in another possible implementation, the component includes a first electronic device and a second electronic device, the first electronic device being disposed on a first surface, the second electronic device being disposed on a surface of the first electronic device remote from the first surface, the first electronic device being electrically connected to the circuit board, and the second electronic device being electrically connected to the first electronic device. A vertical projection of the second electronic device on the first surface covers at least a portion of a vertical projection of the structural component on the first surface.

[0013] After the second electronic device is connected to the first electronic device, a gap is created around the first electronic device between the second electronic device and the circuit board. This gap is relatively small, and most components are standard parts, which are much taller than the gap and cannot be placed in it. However, the height of the structural member can be adjusted as needed, so the structural member can be placed in the gap between the second electronic device and the circuit board. This eliminates the need for the structural member to occupy other areas on the circuit board where components could normally be placed, thereby improving the surface utilization of the circuit board and facilitating its miniaturization.

[0014] In conjunction with the first aspect, in another possible implementation, the first electronic component is a connector, the second electronic component is a flexible printed circuit board, and the other end of the flexible printed circuit board is used to connect to the electronic component. For example, the first electronic component may be the female socket of a board-to-board connector, and one end of the flexible printed circuit board is provided with the male socket of the connector. The electrical connection between the flexible printed circuit board and the printed circuit board is achieved by docking the male and female sockets.

[0015] In conjunction with the first aspect, in another possible implementation, multiple structural members are provided, and the multiple structural members are spaced apart around the first electronic device. This arrangement can fully utilize the gap formed around the first electronic device and between the second electronic device and the circuit board, and the multiple structural members can further reduce the impedance of the metal functional layer in the circuit board. The multiple structural members can be electrically connected to the same metal functional layer or to different metal functional layers.

[0016] In conjunction with the first aspect, in another possible implementation, the circuit board is provided with multiple openings extending through the thickness of the circuit board, with the second region located between two adjacent openings. In other words, the structural member is positioned within a narrow strip between two openings on the circuit board. This reduces the impedance of the metal functional layer in the circuit board while also enhancing the structural strength of the narrow strip, thereby reducing the risk of fracture in the narrow strip when subjected to impact or vibration, thereby ensuring the reliability and stability of the circuit board.

[0017] In conjunction with the first aspect, in another possible implementation, the circuit board assembly further includes a fastener, and the structural member is secured to the circuit board via the fastener. Thus, utilizing the fastener not only secures the structural member more securely but also simplifies the assembly process between the structural member and the circuit board (for example, the fastener is a screw, a screw hole is defined in the circuit board, and a through hole is defined in the structural member; one end of the screw is passed through the through hole and tightened into the screw hole to secure the structural member).

[0018] In combination with the first aspect, in another possible implementation, in a thickness direction of the circuit board, a height of the structural component is H, where H≤0.25 mm.

[0019] In conjunction with the first aspect, in another possible implementation, the height of the inner core in the thickness direction of the circuit board is h, where 0.15 mm ≤ h ≤ 0.2 mm. With this arrangement, when the structural member is positioned around the first electronic component in the gap formed between the second electronic component and the circuit board, the structural member can achieve a higher inner core thickness benefit. A thicker inner core is more conducive to reducing the impedance of the metal functional layer electrically connected thereto.

[0020] In combination with the first aspect, in another possible implementation, the inner core is made of copper.

[0021] In conjunction with the first aspect, in another possible implementation, the insulating layer is made of an EMC insulating material. This not only prevents the inner core from directly contacting surrounding components and causing a short circuit, but also provides good mechanical strength, providing support for the entire structure and thereby improving its impact resistance.

[0022] In a second aspect, the present application provides an electronic device, which includes a housing and the circuit board assembly provided in the first aspect above, wherein a receiving cavity is formed inside the housing, and the circuit board assembly is arranged in the receiving cavity.

[0023] It can be understood that the beneficial effects that can be achieved by the electronic device described in the second aspect and any possible implementation thereof provided above can refer to the beneficial effects in the first aspect and any possible implementation thereof, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application;

[0025] FIG2 is an exploded view of the structure of the electronic device in FIG1 ;

[0026] FIG3 is a front view of the components in FIG2 arranged on a circuit board;

[0027] FIG4 is a schematic cross-sectional view of the section AA in FIG3 ;

[0028] FIG5 is a front view of a circuit board assembly provided in an embodiment of the present application;

[0029] FIG6 is a schematic cross-sectional view at BB in FIG5 ;

[0030] FIG7 is a cross-sectional view of a structural member provided in an embodiment of the present application;

[0031] FIG8 is a cross-sectional view of another structural member provided in an embodiment of the present application;

[0032] FIG9 is a front view of another circuit board assembly provided in an embodiment of the present application;

[0033] FIG10 is a schematic cross-sectional view of a section CC in FIG9 ;

[0034] FIG11 is a front view of another circuit board assembly provided in an embodiment of the present application;

[0035] FIG12 is a schematic cross-sectional view at EE in FIG11 ;

[0036] FIG13 is a front view of another circuit board assembly provided in an embodiment of the present application;

[0037] FIG14 is a schematic cross-sectional view at FF in FIG13 ;

[0038] FIG15 is a schematic cross-sectional view of a portion GG in FIG13 ;

[0039] FIG16 is a front view of another circuit board assembly provided in an embodiment of the present application;

[0040] FIG17 is a schematic cross-sectional view of a portion JJ in FIG16 ;

[0041] FIG18 is a front view of another circuit board assembly provided in an embodiment of the present application;

[0042] FIG19 is a schematic cross-sectional view of a point KK in FIG18 ;

[0043] FIG20 is a front view of another circuit board assembly provided in an embodiment of the present application;

[0044] FIG21 is a partial enlarged view of point M in FIG20;

[0045] FIG22 is a schematic cross-sectional view at point NN in FIG21 ;

[0046] FIG23 is a front view of another circuit board assembly provided in an embodiment of the present application;

[0047] FIG24 is a partial enlarged view of point P in FIG23;

[0048] FIG25 is a schematic cross-sectional view of a point QQ in FIG23 ;

[0049] FIG26 is a schematic diagram of a manufacturing process flow of a structural component;

[0050] FIG27 is a second schematic diagram of a manufacturing process flow of a structural component;

[0051] FIG28 is a third schematic diagram of a manufacturing process flow of a structural component;

[0052] FIG29 is a fourth schematic diagram of a manufacturing process flow of a structural component;

[0053] FIG30 is a fifth schematic diagram of a manufacturing process flow of a structural component;

[0054] FIG31 is a schematic diagram of another manufacturing process flow of a structural member;

[0055] FIG32 is a second schematic diagram of a manufacturing process flow of another structural component;

[0056] FIG33 is a third schematic diagram of a manufacturing process flow of another structural component;

[0057] FIG34 is a fourth schematic diagram of a manufacturing process flow of another structural member;

[0058] FIG35 is a fifth schematic diagram of a manufacturing process flow of another structural member;

[0059] FIG36 is a sixth schematic diagram of a manufacturing process flow of another structural component;

[0060] FIG37 is a schematic diagram of a manufacturing process and installation process of another structural member;

[0061] FIG38 is a second schematic diagram of a manufacturing process and installation process of another structural component;

[0062] FIG39 is a third schematic diagram of a manufacturing process and installation process of another structural component;

[0063] FIG40 is a first schematic diagram of a manufacturing process and installation process of another structural member;

[0064] FIG41 is a second schematic diagram of a manufacturing process and installation process of another structural component;

[0065] FIG42 is a third schematic diagram of a manufacturing process and installation process of another structural component;

[0066] FIG43 is a fourth schematic diagram of a manufacturing process and installation process of another structural member;

[0067] FIG44 is a fifth schematic diagram of a manufacturing process and installation process of another structural member;

[0068] FIG45 is a sixth schematic diagram of the manufacturing process and installation process of another structural component.

[0069] Figure numerals: 01, electronic device; 10, display module; 11, transparent cover; 12, display screen; 20, housing; 21, battery cover; 22, frame; 23, middle plate; 30, camera module; 40, circuit board assembly; 41, circuit board; 411, substrate; 411a, first part; 411b, second part; 411c, third part; 411d, narrow strip part; 4111, first narrow strip part; 4112, second narrow strip part; 401, first surface; 401a, first area; 401b, second area; 4011, left second area; 4012, right second area; 4013, upper second area; 4014, lower second area; 412, metal functional layer; 4121, wire layer; 4122, power layer; 42, components; 42a, first component; 4 2b, second component; 42c, third component; 421, first electronic device; 422, second electronic device; 43, structural member; 43a, first structural member; 43b, second structural member; 43c, third structural member; 43d, fourth structural member; 43e, fifth structural member; 43f, sixth structural member; 431, inner core; 4311, solder joint; 432, insulating layer; 44, fastener; 44a, first fastener; 44b, second fastener; 50, camera decorative cover; 60, battery; 100, via; 200, opening; 200a, first opening; 200b, second opening; 200c, third opening; 300, through hole; 300a, first through hole; 300b, second through hole; 400, screw hole; 400a, first screw hole; 500, gap; 600, groove. DETAILED DESCRIPTION

[0070] In order to make the purpose, technical solutions and advantages of the application more clear, the present application is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0071] In the description of this application, it should be clarified that the terms "vertical," "transverse," "longitudinal," "front," "rear," "left," "right," "upper," "lower," and "horizontal," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used solely to facilitate the description of this application. They do not imply that the devices or components referred to must have specific orientations or positions, and therefore should not be construed as limiting this application. The term "quantity" should also not be construed as limiting this application.

[0072] In the description of this application, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; and direct or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0073] An embodiment of the present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other type of electronic device. For example, the electronic device may be a mobile phone, a tablet personal computer, a personal digital assistant (PDA), a monitor, a camera, a laptop computer, a wearable device, etc. For ease of description, the following examples are all based on the example of a mobile phone as the electronic device.

[0074] Please refer to Figures 1 and 2. Figure 1 is a schematic diagram of the overall structure of an electronic device 01 provided in an embodiment of the present application, and Figure 2 is an exploded view of the structure of electronic device 01 in Figure 1. As can be seen from the above, in this embodiment, electronic device 01 is a mobile phone and can have a substantially rectangular plate-like structure. Electronic device 01 can include a display module 10, a housing 20, a camera module 30, a camera decorative cover 50, a battery 60, and a circuit board 41.

[0075] It is understandable that FIG1 and FIG2 merely schematically illustrate some components included in the electronic device 01 , and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG1 and FIG2 .

[0076] The above-mentioned display module 10 is used to display images, videos, etc. The display module 10 may include a translucent cover plate 11 and a display screen 12 (English name: panel, also called a display panel), and the translucent cover plate 11 and the display screen 12 are stacked. The material of the translucent cover plate 11 includes but is not limited to glass. For example, the translucent cover plate 11 can adopt an ordinary translucent cover plate to protect the display screen to avoid damage to the display screen due to external force, and it can also play a dust-proof role. Alternatively, the translucent cover plate 11 can also adopt a translucent cover plate with a touch function, so that the electronic device 01 has a touch function, which makes it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the translucent cover plate 11.

[0077] Furthermore, the display screen 12 may be a flexible display screen or a rigid display screen. For example, the display screen 12 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen.

[0078] The housing 20 is used to protect the electronic components inside the electronic device 01. The housing 20 may include a battery cover 21 and a frame 22. The battery cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11 and is stacked with the light-transmitting cover plate 11 and the display screen 12. The frame 22 is located between the light-transmitting cover plate 11 and the battery cover 21. The battery cover 21 is fixed to the frame 22. For example, the battery cover 21 can be fixed to the frame 22 by bonding, threading, welding, snapping, etc. The light-transmitting cover plate 11 can be fixed to the frame 22 by gluing, so that the light-transmitting cover plate 11, the battery cover 21 and the frame 22 form a receiving cavity inside the electronic device 01. The display screen 12, the camera module 30, the battery 60 and the circuit board 41 are all arranged in the receiving cavity.

[0079] The camera module 30 is used to capture video or images and can implement auto focus (AF), making it suitable for a variety of shooting scenarios. The camera module 30 can be positioned near one side edge of the battery cover 21 as shown in FIG1 . Alternatively, the camera module 30 can be positioned in the middle of the upper portion of the battery cover 21 (not shown in the figure). Therefore, the specific position of the camera module 30 is not particularly limited in this application.

[0080] The camera decorative cover 50 is used to prevent foreign matter such as dust from outside from entering the interior of the electronic device 01 or the camera module 30 , and to prevent the camera module 30 from being scratched or hit by external objects.

[0081] The circuit board 41 is used to arrange the components 42 of the electronic device 10 and to achieve electrical connections between the components 42. Please refer to Figure 3, which is a front view (along the negative Z-axis) of the components 42 in Figure 2 arranged on the circuit board 41. The components 42 can be active devices (such as a central processing unit (CPU), a graphics processing unit (GPU), a low power double data rate memory (Low Power Double Data Rate SDRAM, LPDDR), a universal flash storage (UFS), etc.), or passive devices (such as resistors, capacitors, inductors, filters, etc.).

[0082] For ease of description below, an XYZ coordinate system is established, defining the width of circuit board 41 as the X-axis, the length of circuit board 41 as the Y-axis, and the thickness of circuit board 41 as the Z-axis. The thickness of circuit board 41 corresponds to the thickness of electronic device 01, the length of circuit board 41 can be the length of electronic device 01, and the width of circuit board 41 corresponds to the width of electronic device 01.

[0083] Please continue to refer to Figure 3 and Figure 4, which is a schematic cross-section (parallel to the XZ plane) at AA in Figure 3. The circuit board 41 may include a substrate 411 and multiple metal functional layers 412. The multiple metal functional layers 412 may include a wire layer 4121 and a power layer 4122. The substrate 411 has a first surface 401. The wire layer 4121 and the components 42 are both disposed on the first surface 401. The components 42 and the wire layer 4121 are electrically connected. The wire layer 4121 is used to transmit current and signals between the components 42. The power layer 4122 is disposed within the substrate 411 and is electrically connected to the battery 60. The active devices in the components 42 are electrically connected to the power layer 4122 through corresponding vias 100 on the substrate 411. The power layer 4122 is used to provide a stable power supply for the active devices.

[0084] It can be understood that the metal functional layer 412 can cover the entire cross-section of the substrate 411 parallel to the XY plane (for example, the power layer 4122), or it can cover a part of the cross-section of the substrate 411 parallel to the XY plane. Within the cross-section of the substrate 411 parallel to the XY plane, the metal functional layer 412 can also be a mesh structure (for example, the wire layer 4121).

[0085] As the electronic device 01 develops towards miniaturization and thinness, the area and thickness of the circuit board 41 in the electronic device 01 are getting smaller and smaller, which causes the area and thickness of various metal functional layers 412 on the circuit board 41 to also become smaller and smaller, thereby increasing the impedance of each metal functional layer 412.

[0086] In order to solve the above technical problems, an embodiment of the present application provides a circuit board assembly 40, please refer to Figures 5 and 6, Figure 5 is a front view (along the negative direction of the Z axis) of a circuit board assembly 40 provided in an embodiment of the present application, and Figure 6 is a schematic diagram of the cross-section at BB in Figure 5 (parallel to the XZ plane).

[0087] The circuit board assembly 40 includes a structural member 43, the circuit board 41, and the components 42. The circuit board 41 includes a substrate 411 and multiple metal functional layers 412. The multiple metal functional layers 412 may include a conductor layer 4121 and a power layer 4122. The substrate 411 has a first surface 401. The conductor layer 4121 and the components 42 are both disposed on the first surface 401, and the components 42 and the conductor layer 4121 are electrically connected. The power layer 4122 is disposed within the substrate 411. The active devices in the components 42 are electrically connected to the power layer 4122 through corresponding vias 100 in the substrate 411.

[0088] The first surface 401 includes a first region 401a and a second region 401b, and the aforementioned component 42 is located in the first region 401a. The structural member 43 is located in the second region 401b (the dotted box region in FIG5 , and all areas on the first surface 401 except the second region 401b belong to the first region 401a). The structural member 43 includes an inner core 431 and an insulating layer 432. The inner core 431 is electrically connected to one of the metal functional layers 412 of the circuit board 41 (for example, in FIG6 , the inner core 431 is electrically connected to the power supply layer 4122 through corresponding vias 100 on the substrate 411), and the insulating layer 432 wraps around the inner core 431.

[0089] It should be noted that the above-mentioned structural member 43 can be provided as one or more. When there are multiple structural members 43, the multiple structural members 43 can be electrically connected to the same metal functional layer 412, or the multiple structural members 43 can be electrically connected to different metal functional layers 412 respectively.

[0090] Correspondingly, one or more second regions 401b may be provided, and one or more structural members 43 may be provided in one second region 401b, which is not particularly limited in the present application.

[0091] Please refer to Figure 7, which is a cross-sectional view of a structural member 43 provided in an embodiment of the present application. In Figure 7, one side surface of the inner core 431 is completely exposed. During installation, this exposed surface is attached to the circuit board 41, and the inner core 431 is electrically connected to the corresponding metal functional layer 412 through this exposed surface. The remaining surface of the inner core 431 is covered by the insulating layer 432.

[0092] Alternatively, please refer to Figure 8, which is a cross-sectional view of another structural member 43 provided in an embodiment of the present application. In Figure 8, a raised solder joint 4311 can also be provided on the surface of the inner core 431 facing the substrate 411, and the insulating layer 432 completely wraps the portion of the inner core 431 other than the solder joint 4311. During installation, the inner core 431 is electrically connected to the corresponding metal functional layer 412 through the solder joint 4311. Of course, the inner core 431 can also be electrically connected to the corresponding metal functional layer 412 through other methods, which will not be repeated here.

[0093] The material of the inner core 431 can be a metal or non-metal with good conductivity, such as copper, aluminum, silver, graphite, etc.

[0094] The above-mentioned insulating layer 432 can be formed by one-time injection molding on the outer side of the inner core 431, or it can be an insulating film attached to the outer surface of the inner core 431, and this application does not make any special restrictions on this.

[0095] The material of the insulating layer 432 can be organic polymer materials such as EMC (Epoxy Molding Compound), PI (Polyimide), PTFE (Polytetrafluoroethylene), etc.

[0096] In this way, by arranging a structural component 43 on the second area 401b of the first surface 401 of the circuit board 41, and the inner core 431 of the structural component 43 is electrically connected to the circuit board 41, wherein the inner core 431 of the structural component 43 can be electrically connected to any metal functional layer 412 on the circuit board 41 (for example, the power layer 4122, the wire layer 4121, etc.), which is equivalent to making the inner core 431 of the structural component 43 a part of the metal functional layer 412 connected thereto, and utilizing the inner core 431 of the structural component 43 to increase the area and thickness of the corresponding metal functional layer 412, thereby, under the premise that the volume of the circuit board 41 remains unchanged, the impedance of the metal functional layer 412 on the circuit board 41 can be reduced to a certain extent, thereby improving the electrical performance indicators of the metal functional layer 412.

[0097] Furthermore, the insulating layer 432 wrapped around the inner core 431 prevents the inner core 431 from directly contacting the surrounding components 42 and causing a short circuit. When the insulating layer 432 is made of EMC insulation material, the insulating layer 432 made of EMC insulation material also has good mechanical strength, providing a certain degree of support for the entire structural member 43, thereby improving the impact resistance of the structural member 43.

[0098] For ease of understanding, the following descriptions are based on an example in which one surface of the inner core 431 is completely exposed and attached to the circuit board 41 , and the remaining surface of the inner core 431 is covered by the insulating layer 432 .

[0099] In some embodiments, please refer to Figures 9 and 10. Figure 9 is a front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application, and Figure 10 is a schematic diagram of the cross section at CC in Figure 9 (parallel to the XZ plane). There are multiple components 42, and the second area 401b can be located between two adjacent components 42. This arrangement is equivalent to arranging the structural member 43 in the blank area between adjacent components 42 on the substrate 411, thereby optimizing the impedance of the metal functional layer 412 through the structural member 43 while also improving the surface utilization of the substrate 411, which is conducive to the miniaturization of the circuit board 41.

[0100] For example, please continue to refer to Figures 9 and 10. There are three components 42, namely a first component 42a, a second component 42b, and a third component 42c. The first component 42a is a capacitor, the second component 42b is a GPU, and the third component 42c is a filter. In the illustrated orientation, the first component 42a, the second component 42b, and the third component 42c are spaced apart from left to right along the width of the circuit board 41 and are each electrically connected to the conductor layer 4121. Since the CPU is an active device, the second component 42b is also electrically connected to the power layer 4122 through corresponding vias 100 on the substrate 411.

[0101] Two structural members 43 are provided on the circuit board 41: a first structural member 43a and a second structural member 43b. The blank area between the first component 42a and the second component 42b is the left second area 4011, with the first structural member 43a disposed in the left second area 4011. The blank area between the second component 42b and the third component 42c is the right second area 4012, with the second structural member 43b disposed in the right second area 4012. The first structural member 43a and the second structural member 43b are each connected to the power layer 4122 via corresponding vias 100 in the substrate 411. Thus, two structural members 43 are provided in the blank areas between the three spaced-apart components 42, and both structural members 43 are electrically connected to the power layer 4122. This not only reduces the impedance of the power layer 4122 but also improves the utilization rate of the first surface 401 of the substrate 411.

[0102] In some embodiments, please refer to Figures 11 and 12. Figure 11 is a front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application, and Figure 12 is a schematic diagram of a cross section (parallel to the XZ plane) at EE in Figure 11. Among them, the second area 401b can also be located at the edge of the circuit board 41. In this way, it is equivalent to setting the structural member 43 in the blank area at the edge of the circuit board 41 where the components 42 are not set. Then, while using the structural member 43 to reduce the impedance of the metal functional layer 412 in the circuit board 41, it can also improve the surface utilization rate of the circuit board 41, which is conducive to the miniaturization of the circuit board 41.

[0103] For example, please continue to refer to Figures 11 and 12. The substrate 411 is rectangular, and the first area 401a where the components 42 are arranged occupies the middle position of the first surface 401 of the substrate 411. A blank area extending around the first area 401a is formed at the edge of the first surface 401. This blank area can serve as the second area 401b. An annular structural member 43 is arranged on the rectangular annular second area 401b. The structural member 43 extends around the first area 401a and is connected to the power layer 4122 through corresponding vias 100 on the substrate 411. This maximizes the use of the area of ​​the first surface 401 without occupying the space for arranging the components 42, while also reducing the impedance of the power layer 4122.

[0104] For another example, see Figure 13, which is a front view (along the negative Z-axis) of another circuit board assembly 40 provided in an embodiment of the present application. The substrate 411 is rectangular, and a first region 401a for mounting components 42 occupies the center of the first surface 401 of the substrate 411. A blank area extending around the edge of the first surface 401 is formed, which serves as a second region 401b. The second region 401b includes a left second region 4011 and a right second region 4012 parallel to the Y-axis, as well as an upper second region 4013 and a lower second region 4014 parallel to the X-axis.

[0105] The circuit board 41 includes four structural members 43: a first structural member 43a, a second structural member 43b, a third structural member 43c, and a fourth structural member 43d. Please continue to refer to Figure 13 and Figure 14, which is a schematic cross-sectional view (parallel to the XZ plane) taken at point FF in Figure 13. The first structural member 43a and the third structural member 43c are disposed in the left second region 4011 and the right second region 4012, respectively. Both the first structural member 43a and the third structural member 43c are electrically connected to the conductive layer 4121, thereby reducing the impedance of the conductive layer 4121.

[0106] Continuing with Figure 13 and in conjunction with Figure 15 , Figure 15 is a schematic cross-sectional view (parallel to the YZ plane) of point GG in Figure 13 . The second structural member 43b and the fourth structural member 43d are disposed in the upper second region 4013 and the lower second region 4014, respectively. The second structural member 43b and the fourth structural member 43d are electrically connected to the power layer 4122 through corresponding vias 100, thereby reducing the impedance of the power layer 4122.

[0107] Based on the above, the structural strength of the portion of circuit board 41 corresponding to second region 401b is lower than that of the portion corresponding to first region 401a. This arrangement allows structural member 43 to reinforce the weaker portion of circuit board 41. In other words, structural member 43 serves the dual purpose of "reducing impedance" and "structural reinforcement" for circuit board 41.

[0108] For example, referring to Figures 16 and 17, Figure 16 is a front view (along the negative Z-axis) of another circuit board assembly 40 provided in an embodiment of the present application, and Figure 17 is a schematic cross-sectional view (parallel to the XZ plane) taken at JJ in Figure 16. Specifically, one first region 401a is provided on the substrate 411, and two second regions 401b are provided. The two second regions 401b are respectively a left second region 4011 and a right second region 4012. In the illustrated orientation, the left second region 4011 and the right second region 4012 are located on the left and right sides of the first region 401a, respectively.

[0109] The portion of substrate 411 corresponding to first region 401a is first portion 411a, and has a thickness of D1. The portion of substrate 411 corresponding to left second region 4011 is second portion 411b, and has a thickness of D2. The portion of substrate 411 corresponding to right second region 4012 is third portion 411c, and has a thickness of D3.

[0110] As can be seen from Figure 17, D3 < D2 < D1. Since the density of the substrate 411 is uniform throughout, the strength of the second portion 411b and the third portion 411c are both less than that of the first portion 411a. In this case, two structural members 43 are provided on the substrate 411: a first structural member 43a and a second structural member 43b. The first structural member 43a is provided in the second region 4011 on the left side to provide structural reinforcement for the second portion 411b of the substrate 411. The second structural member 43b is provided in the second region 4012 on the right side to provide structural reinforcement for the third portion 411c of the substrate 411. The inner core 431 of the first structural member 43a and the inner core 431 of the second structural member 43b are electrically connected to the power layer 4122 through corresponding vias 100, thereby further reducing the impedance of the power layer 4122.

[0111] In some embodiments, please refer to Figures 18 and 19, Figure 18 is a front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application, and Figure 19 is a schematic diagram of the cross-section at KK in Figure 18 (parallel to the XZ plane).

[0112] Among them, there are three components 42 provided on the circuit board 41, namely a first component 42a, a second component 42b, and a third component 42c. The first component 42a, the second component 42b, and the third component 42c are respectively electrically connected to the conductive layer 4121. Among them, the first component 42a may include a first electronic device 421 and a second electronic device 422. The first electronic device 421 is provided on the first surface 401, and the second electronic device 422 is provided on the surface of the first electronic device 421 away from the first surface 401. The first electronic device 421 is electrically connected to the circuit board 41, and the second electronic device 422 is electrically connected to the first electronic device 421. The second component 42b is a capacitor, and the third component 42c is a general-purpose memory.

[0113] When the second electronic device 422 is connected to the first electronic device 421, a gap 500 is formed around the first electronic device 421 between the second electronic device 422 and the substrate 411. The height of the gap 500 is relatively small. However, since the component 42 is generally a standard part, its height is much greater than the height of the gap 500. For example, the first electronic device 421 is a board-to-board connector (BTB), the second electronic device 422 is a flexible printed circuit (FPC), and the component is a 0603 chip capacitor. A board-to-board connector is also provided at one end of the flexible circuit board, and the other end of the flexible circuit board is used to connect other electronic components (such as a camera module, a microphone, a receiver, etc.). When the board-to-board connector on the flexible circuit board is docked with the board-to-board connector on the substrate 411, the height of the gap 500 between the flexible circuit board and the substrate 411 is generally around 0.35 mm, while the thickness of the 0603 chip capacitor is generally 0.8 mm, which is much larger than 0.35 mm. This results in the 0603 chip capacitor (component 42) being unable to be arranged in the gap 500, thereby causing a waste of the area of ​​the first surface 401.

[0114] Since the structural member 43 is generally a non-standard component, its height can be arbitrarily set during manufacturing based on actual needs. Therefore, the structural member 43 can be positioned within the aforementioned gap 500, such that the vertical projection of the second electronic device 422 on the first surface 401 covers at least a portion of the vertical projection of the structural member 43 on the first surface 401. This prevents the structural member 43 from occupying areas on the substrate 411 where components 42 would normally be positioned. Furthermore, the area on the first surface 401 where components 42 would otherwise not be positioned is effectively utilized, thereby increasing the surface utilization of the substrate 411 and facilitating miniaturization of the circuit board 41.

[0115] For example, referring to Figures 18 and 19 , the first electronic device 421 is a female connector of a board-to-board connector, which is connected to the conductor layer 4121. The second electronic device 422 is a flexible circuit board. A male connector of the board-to-board connector is provided at one end of the flexible circuit board. Electrical connection between the flexible circuit board and the circuit board 41 is achieved by mating the male and female connectors. After the male and female connectors are mated, a gap 500 is formed between the flexible circuit board (second electronic device 422) and the substrate 411. In the orientation shown in Figure 19 , the second structural member 43b and the first structural member 43a are disposed within the gap 500, respectively located on the left and right sides of the first electronic device 421. The vertical projections of the first and second structural members 43a, 43b on the first surface 401 are completely covered by the vertical projections of the flexible circuit board (second electronic device 422) on the first surface 401. This fully utilizes the first surface 401 of the substrate 411, facilitating miniaturization of the circuit board 41.

[0116] With the development of packaging technology, after the male and female sockets of the connector are docked, the height d of the gap 500 between the flexible circuit board (the second electronic device 422) and the substrate 411 is gradually controlled to be less than or equal to 0.25 mm. Therefore, in order to ensure that the structural member 43 can be smoothly arranged in the gap 500, please continue to refer to Figure 19. In the thickness direction of the circuit board 41, the height H of the first structural member 43a must also be less than or equal to 0.25 mm, so as to avoid the first structural member 43a affecting the docking of the connector. For example, the height H of the first structural member 43a can be 0.25 mm, 0.2 mm, 0.15 mm, etc. At the same time, the heights of the remaining structural members 43 in the gap 500 must also meet the above requirements, which will not be repeated here.

[0117] Further, please continue to refer to Figure 19. In the thickness direction of the circuit board 41, the height of the inner core 431 of the first structural member 43a is h, where 0.15mm≤h≤0.2mm. With this arrangement, when the first structural member 43a is located in the gap 500 formed between the flexible circuit board (second electronic device 422) and the substrate 411 around the female seat (first electronic device 421), the first structural member 43a can achieve a higher thickness gain of the inner core 431. In a limited space, the greater the thickness of the inner core 431, the more conducive it is to reducing the impedance of the metal functional layer 412 electrically connected to it. For example, the height h of the inner core 431 of the first structural member 43a can be 0.2mm, 0.17mm, 0.15mm, etc. And when the height of the inner core 431 of the first structural member 43a takes the maximum value of 0.2mm, the maximum thickness of the insulating layer 432 of the first structural member 43a is 0.05mm. At the same time, the height of the inner core 431 of the remaining structural members 43 in the gap 500 must also meet the above requirements, which will not be repeated here.

[0118] In some embodiments, as shown in FIG18 , multiple structural members 43 may be provided, with the multiple structural members 43 spaced apart around the first electronic device 421. This arrangement can fully utilize the gap 500 formed between the second electronic device 422 and the substrate 411 around the first electronic device 421, and the multiple structural members 43 can further reduce the impedance of the metal functional layer 412 in the circuit board 41.

[0119] Among them, the multiple structural members 43 can be electrically connected to the same metal functional layer 412, or can be electrically connected to different metal functional layers 412 respectively, and this application does not make any special limitation on this.

[0120] For example, referring to Figures 18 and 19 , four structural members 43 are provided, namely a first structural member 43a, a second structural member 43b, a third structural member 43c, and a fourth structural member 43d. In the illustrated orientation, the first structural member 43a, the fourth structural member 43d, the second structural member 43b, and the third structural member 43c are sequentially arranged in a clockwise direction around the first electronic device 421 and are electrically connected to the power layer 4122 via corresponding vias 100. Furthermore, the vertical projections of the first structural member 43a, the second structural member 43b, the third structural member 43c, and the fourth structural member 43d on the first surface 401 are completely covered by the vertical projection of the second electronic device 422 on the first surface 401. This improves the utilization of the first surface 401 of the substrate 411 while further reducing the impedance of the power layer 4122.

[0121] Please refer to Figures 20, 21 and 22. Figure 20 is a front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application, Figure 21 is a partial enlarged view of point M in Figure 20, and Figure 22 is a schematic diagram of the cross section (parallel to the YZ plane) at point NN in Figure 21. In some cases, it is necessary to open a plurality of openings 200 that penetrate along the thickness direction on the circuit board 41 to avoid other electronic components (such as camera modules). This will cause a narrow strip portion 411d to be formed between two adjacent openings 200. Since the narrow strip portion 411d is relatively slender, the components 42 cannot be arranged normally here, and the structural strength of the narrow strip portion 411d is relatively low. When the circuit board 41 is impacted, it is very easy to break, thereby causing the metal functional layer 412 on the substrate 411 to break, resulting in failure of the circuit board 41.

[0122] Based on this, the embodiment of the present application disposes the second region 401b between two adjacent openings 200. In other words, the structural member 43 is disposed on the narrow strip portion 411d. This allows the structural member 43 to reduce the impedance of the metal functional layer 412 in the circuit board 41 while also enhancing the structural strength of the narrow strip portion 411d. This reduces the risk of the narrow strip portion 411d breaking when the circuit board 41 is subjected to impact or vibration, thereby ensuring the reliability and stability of the circuit board 41.

[0123] For example, referring to Figures 20 and 21, the circuit board assembly 40 in Figure 20 is equivalent to the circuit board assembly 40 in Figure 18, with three openings 200 defined on the substrate 411: a first opening 200a, a second opening 200b, and a third opening 200c. In the illustrated orientation, the first opening 200a, the second opening 200b, and the third opening 200c are spaced apart from each other from top to bottom. A first narrow strip 4111 is formed between the first opening 200a and the second opening 200b, and a second narrow strip 4112 is formed between the second opening 200b and the third opening 200c. The area of ​​the first surface 401 of the substrate 411 located on the first narrow strip 4111 is an upper second area 4013, and the area of ​​the first surface 401 of the substrate 411 located on the second narrow strip 4112 is a lower second area 4014.

[0124] Accordingly, as shown in Figures 21 and 22 , two additional structural members 43 are provided on the substrate 411: a fifth structural member 43e and a sixth structural member 43f. The fifth structural member 43e is provided in the upper second region 4013 to provide structural reinforcement for the first narrow strip portion 4111. The sixth structural member 43f is provided in the lower second region 4014 to provide structural reinforcement for the second narrow strip portion 4112. Furthermore, the fifth structural member 43e and the sixth structural member 43f are electrically connected to the power layer 4122 in the substrate 411 through corresponding vias 100 in the substrate 411, thereby further reducing the impedance of the power layer 4122.

[0125] At the same time, in the X-axis direction, the length of the fifth structural member 43e is greater than the length of the upper second region 4013, and both ends of the fifth structural member 43e extend to the first region 401a. In this case, the fifth structural member 43e spans the entire first narrow strip portion 4111. When the circuit board 41 is subjected to impact or vibration, the fifth structural member 43e not only reduces the risk of fracture in the middle of the first narrow strip portion 4111, but also reduces the risk of fracture at the connection between the ends of the first narrow strip portion 4111 and the portions corresponding to the first region 401a on the substrate 411.

[0126] Similarly, in the X-axis direction, the length of the sixth structure member 43f is greater than the length of the lower second region 4014, and both ends of the sixth structure member 43f extend to the first region 401a, which will not be repeated here.

[0127] In some embodiments, referring to Figures 23 and 24, Figure 23 is a front view (along the negative Z-axis) of another circuit board assembly 40 provided in an embodiment of the present application, and Figure 24 is a partial enlarged view of point P in Figure 23. Circuit board assembly 40 further includes fasteners 44, through which structural member 43 is secured to circuit board 41. Thus, fasteners 44 not only secure structural member 43 more securely but also simplify the assembly process between structural member 43 and circuit board 41.

[0128] For example, please continue to refer to Figures 23 and 24, and combine them with Figure 25, which is a schematic diagram of the cross-section (parallel to the XZ plane) at QQ in Figure 23. The circuit board assembly 40 in Figure 23 is equivalent to the circuit board assembly 40 in Figure 20 above, with two first fasteners 44a (both are screws) and two second fasteners 44b (both are screws) added. Among them, the two ends of the fifth structural member 43e are respectively provided with a first through hole 300a, and the substrate 411 is provided with a first screw hole 400a corresponding to the first through hole 300a. During assembly, it is only necessary to pass one end of the first fastener 44a through the first through hole 300a and tighten it in the first screw hole 400a to complete the fixation of the fifth structural member 43e.

[0129] Similarly, the sixth structural member 43f has second through-holes 300b at each end, and the base plate 411 has second screw holes (not shown in FIG. 25 ) corresponding to the second through-holes 300b. During assembly, the second fastener 44b is inserted into the second through-hole 300b at one end and then screwed into the second screw hole (not shown in this diagram) to secure the sixth structural member 43f.

[0130] The above embodiment provides examples for the specific structure of the structural member 43, the location and quantity of the structural member 43 on the circuit board 41. The manufacturing or installation process of the structural member 43 will be described below by example (for ease of understanding, the process flow diagram of each step provides a front view of the semi-finished product / finished product obtained after the step and a cross-sectional view of the corresponding position).

[0131] The following is a description of the manufacturing process flow of a structural component 43 (taking as an example a case where one side surface of the inner core 431 of the structural component 43 is completely exposed, the remaining surface of the inner core 431 is covered by the insulating layer 432, and the inner core 431 is copper and the insulating layer 432 is injection molded in one go):

[0132] The first step, as shown in FIG26 , is a schematic diagram of a manufacturing process flow of a structural member 43. A copper sheet of appropriate thickness and size is obtained by processing.

[0133] The second step is shown in Figure 27, which is a schematic diagram of the second manufacturing process for a structural component 43. According to the required dimensions of the structural component 43, a plurality of grooves 600 are etched into the surface of the copper sheet. The grooves 600 divide the copper sheet into a number of inner cores 431 corresponding to the number of structural components 43 (in Figure 27, the copper sheet is divided into 12 inner cores, arranged in a rectangular array of three rows and four columns), ensuring that the bottom of the copper sheet remains connected.

[0134] The third step is shown in FIG28 , which is a schematic diagram of a manufacturing process of a structural member 43. The etched copper sheet is injected with insulating material so that the sides and top of the copper sheet are covered with insulating material and the groove 600 is filled with insulating material.

[0135] The fourth step is shown in FIG29 , which is a fourth schematic diagram of a manufacturing process of a structural member 43 : the bottom of the injection-molded copper sheet is cut and thinned so that the bottom surface of each inner core 431 is flush with the bottom surface of the groove 600 .

[0136] In the fifth step, as shown in FIG30 , which is a schematic diagram of a manufacturing process of a structural component 43 , the copper sheet after the bottom thinning is cut along the groove 600 to obtain a plurality of finished structural components 43 .

[0137] The following is a description of the manufacturing process flow of another structural member 43 (taking as an example a structural member 43 having through holes 300 at both ends and fixed to a circuit board 41 by screws (fasteners 44). One side surface of the inner core 431 of the structural member 43 is completely exposed, and the remaining surface of the inner core 431 is covered by an insulating layer 432. The inner core 431 is copper, and the insulating layer 432 is injection molded in one go):

[0138] The first step, as shown in FIG31 , is a schematic diagram of the manufacturing process for another structural component 43 . A copper sheet of suitable thickness and size is obtained by processing. Then, a plurality of grooves 600 are etched into the surface of the copper sheet according to the desired dimensions of the structural component 43 . The grooves 600 divide the copper sheet into a number of inner cores 431 corresponding to the number of structural components 43 ( FIG31 shows the copper sheet divided into four inner cores, which are arranged parallel from left to right). The bottom of the copper sheet must remain connected.

[0139] The second step is shown in Figure 32, which is a second schematic diagram of the manufacturing process of another structural member 43. The etched copper sheet is drilled for the first time, and the diameter of the first drilled hole must be larger than the outer diameter of the screw.

[0140] In the third step, as shown in FIG33 , which is a schematic diagram of another manufacturing process flow of a structural member 43 , the copper sheet after the first drilling is injected with insulating material so that the sides and top of the copper sheet are covered with insulating material and the grooves 600 and the drilled holes are filled with insulating material.

[0141] The fourth step is shown in Figure 34, which is a fourth schematic diagram of the manufacturing process of another structural member 43. The copper sheet after injection molding is drilled a second time, and the diameter of the second drilling is equal to the diameter of the through hole 300 or the outer diameter of the screw.

[0142] The fifth step is shown in FIG35 , which is a fifth schematic diagram of the manufacturing process of another structural member 43 : the bottom of the copper sheet after the second drilling is cut and thinned so that the bottom surface of each inner core 431 is flush with the bottom surface of the groove 600 .

[0143] The sixth step is shown in FIG36 , which is a sixth schematic diagram of a manufacturing process of another structural component 43 : the copper sheet after the bottom thinning is cut along the groove 600 to obtain a plurality of finished structural components 43 .

[0144] The following is a description of the manufacturing process and installation process of another structural member 43 (taking as an example a case where one side of the inner core 431 of the structural member 43 is completely exposed, the remaining surface of the inner core 431 is covered by the insulating layer 432, and the inner core 431 is a copper sheet and the insulating layer 432 is a laminated insulating film):

[0145] The first step is shown in FIG37 , which is a schematic diagram of another manufacturing process and installation process of a structural member 43 : copper sheets and various components 42 are surface mounted on a circuit board 41 using SMT (Surface Mount Technology) technology.

[0146] In the second step, as shown in Figure 38, which is a second schematic diagram of the manufacturing process and installation process of another structural member 43, an insulating film of appropriate size is cut according to the size of the copper sheet, and the insulating film is attached to the copper sheet.

[0147] The third step, as shown in Figure 39, is a third schematic diagram of the manufacturing process and installation process for another structural component 43. A hot pressing process is used to press the insulating film onto the copper sheet already attached to the circuit board 41, ensuring that the insulating film tightly covers the outer surface of the copper sheet. The laminated insulating film is then heated to a curing temperature and held for a predetermined time to fully cure. This results in the finished structural component 43, and installation is complete.

[0148] The following is a description of the manufacturing process and installation process of another structural member 43 (taking as an example a structural member 43 having through holes 300 at both ends and fixed to a circuit board 41 by screws (fasteners 44). One side surface of the inner core 431 of the structural member 43 is completely exposed, and the remaining surface of the inner core 431 is covered by an insulating layer 432. The inner core 431 is a copper sheet, and the insulating layer 432 is a laminated insulating film):

[0149] The first step, as shown in FIG40 , is a schematic diagram of the manufacturing process and installation process of another structural member 43. Screw holes 400 are formed at both ends of the narrow strip 411d between the two openings 200 on the circuit board 41. The diameter of the screw holes 400 must be equal to the outer diameter of the screw.

[0150] The second step, as shown in Figure 41, is a second schematic diagram of the manufacturing process and installation process of another structural component 43. First holes are drilled at both ends of the copper sheet, ensuring that the diameter of the first drilled holes is larger than the outer diameter of the screws. The copper sheet and various components after the first drilling are then surface mounted on the circuit board 41 using the SMT process.

[0151] The third step is shown in Figure 42, which is a third schematic diagram of the manufacturing process and installation process of another structural member 43. According to the size of the copper sheet, an insulating film of appropriate size is cut and attached to the copper sheet.

[0152] The fourth step, as shown in Figure 43, is a fourth schematic diagram of the manufacturing process and installation flow for another structural component 43. A hot pressing process is used to laminate the insulating film and the copper sheet already attached to the circuit board 41, ensuring that the insulating film tightly covers the outer surface of the copper sheet and the inner wall of the first drilled hole. The laminated insulating film is then heated to a curing temperature and held for a predetermined time to fully cure.

[0153] The fourth step is shown in FIG44 , which is a fifth schematic diagram of the manufacturing process and installation flow of another structural component 43. A second hole is drilled through the cured insulating film at the location of the first drilled hole in the copper sheet to obtain the finished structural component 43. The diameter of the second drilled hole must be equal to the diameter of the through-hole 300 or the outer diameter of the screw. This ensures that the insulating film completely separates the screw from the inner wall of the copper sheet after the first drilled hole, thereby preventing a short circuit caused by contact between the screw and the copper sheet.

[0154] The fifth step is shown in Figure 45, which is a sixth schematic diagram of the manufacturing process and installation process of another structural member 43. The structural member 43 is fixed to the circuit board 41 with screws, and the installation is completed.

[0155] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0156] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A circuit board assembly, characterized in that: include: A circuit board having a first surface, wherein the first surface includes a first area and a second area; Components, the components are located in the first area and are electrically connected to the circuit board; A structural member is located in the second area, and includes an inner core and an insulating layer. The inner core is electrically connected to the circuit board, and the insulating layer is arranged outside the inner core.

2. The circuit board assembly according to claim 1, wherein: The circuit board includes a substrate and a metal functional layer, and the inner core is connected to the metal functional layer.

3. The circuit board assembly according to claim 2, wherein: The metal functional layer includes a wire layer and a power supply layer, and the inner core is connected to the wire layer or the power supply layer.

4. The circuit board assembly according to claim 3, wherein: The substrate is provided with a via hole, and the inner core is connected to the power layer through the via hole.

5. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The second region is located between two adjacent components.

6. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The second area is located at an edge of the circuit board.

7. The circuit board assembly according to any one of claims 1 to 6, wherein: The components include a first electronic component and a second electronic component, the first electronic component is arranged on the first surface, the second electronic component is arranged on a surface of the first electronic component away from the first surface, the first electronic component is electrically connected to the circuit board, and the second electronic component is electrically connected to the first electronic component; A vertical projection of the second electronic device on the first surface covers at least a portion of a vertical projection of the structural component on the first surface.

8. The circuit board assembly according to claim 7, wherein: The first electronic component is a connector, the second electronic component is a flexible circuit board, and the other end of the flexible circuit board is used to connect electronic components.

9. The circuit board assembly according to any one of claims 1 to 8, wherein: There are a plurality of the structural members, and the plurality of the structural members are arranged at intervals around the first electronic component.

10. The circuit board assembly according to any one of claims 1 to 9, characterized in that: The inner core is made of conductive material.

11. The circuit board assembly according to any one of claims 1 to 10, characterized in that: The material of the inner core is copper, aluminum, silver or graphite.

12. The circuit board assembly according to any one of claims 1 to 11, characterized in that: The insulating layer is made of organic polymer material.

13. The circuit board assembly according to any one of claims 1 to 12, characterized in that: The insulating layer is EMC insulating material.

14. The circuit board assembly according to any one of claims 1 to 13, characterized in that: The structural strength of the portion of the circuit board corresponding to the second area is smaller than the structural strength of the portion corresponding to the first area.

15. The circuit board assembly according to any one of claims 1 to 14, characterized in that: The circuit board is provided with a plurality of openings, the openings passing through the circuit board along the thickness direction of the circuit board, and the second area is located between two adjacent openings.

16. The circuit board assembly according to any one of claims 1 to 15, characterized in that: The circuit board assembly further includes a fastener, and the structural component is fixed to the circuit board by the fastener.

17. The circuit board assembly according to any one of claims 1 to 16, characterized in that: In the thickness direction of the circuit board, the height of the structural component is H, where H≤0.25 mm.

18. The circuit board assembly according to any one of claims 1 to 17, wherein: In the thickness direction of the circuit board, the height of the inner core is h, wherein 0.15 mm ≤ h ≤ 0.2 mm.

19. An electronic device, characterized in that: include: a housing, wherein a receiving cavity is formed inside the housing; The circuit board assembly is the circuit board assembly according to any one of claims 1 to 18, and the circuit board assembly is arranged in the accommodating cavity.

Images