Pressure-bonding device and method for manufacturing display panel

Abstract

[Problem] To provide a pressure-bonding device that prevents deterioration of accuracy while achieving a reduction in takt time. [Solution] A pressure-bonding device according to one embodiment comprises a stage part on which a display panel is placed so that an edge portion protrudes. The pressure-bonding device is movable in the horizontal direction, the vertical direction, and the rotation direction, and further comprises a pressure-bonding head part for pressure-bonding an electronic component to the display panel. The pressure-bonding device further comprises a backup part that is opposed to a first pressure-bonding head part in the vertical direction, is movable in the horizontal direction, the vertical direction, and the rotation direction, and supports the edge portion of the display panel from a non-pressure-bonding surface side. The pressure-bonding device further comprises a control unit that performs control to move the backup part and the pressure-bonding head part. The control unit also performs control to adjust the orientation of the pressure-bonding head part and the backup part for holding the electronic component with respect to a corresponding electrode row on the display panel on the basis of information indicating a preset mounting position of the electronic component on the display panel.

Description

Pressure bonding device and display panel manufacturing method

[0001] FIELD An embodiment of the present invention relates to a pressure bonding apparatus and a method for manufacturing a display panel.

[0002] The manufacturing process for display panels such as liquid crystal panels and organic EL panels includes a process of mounting chip-type electronic components, such as driver ICs for driving the substrate, or film-type electronic components called COFs (chip-on-films) with driver ICs mounted on the substrate. Prior to this process, an anisotropic conductive member called an ACF (anisotropic conductive film) is attached to the terminals of the substrate to join the terminals of the substrate to the terminals of the electronic components. In other words, the driver ICs or COFs are mounted on the substrate via the ACFs.

[0003] Anisotropic Conducting Film (ACF) is a film-like material made of a thermosetting resin base material containing many small conductive particles, and is supplied as a tape-like material attached to a release tape (hereinafter also referred to as ACF tape) and attached to the terminals of a substrate. Such an ACF is pre-cut to match the dimensions of the driver IC or COF, and after being attached to the terminals of the substrate, the ACF attached to the terminals of the substrate and the ACF tape are separated by this cut when the release tape is removed from the substrate.

[0004] A known substrate processing apparatus for attaching ACFs to terminals of a substrate is disclosed, for example, in Patent Document 1. The substrate processing apparatus disclosed in Patent Document 1 aims to improve productivity by arranging adjacent units that attach ACFs to a single substrate and simultaneously attaching ACFs to different terminals of the same substrate in parallel. Patent Document 1 also discloses a large-scale substrate processing apparatus in which such substrate processing apparatuses are arranged adjacent to each other, thereby simultaneously attaching ACFs to multiple substrates in parallel.

[0005] International Publication No. 2011 / 001692

[0006] In the above-described pressure bonding device, when a driver IC is temporarily pressure bonded to a display panel to which an anisotropic conductive member has been attached, the transfer stage on which the driver IC is mounted is moved or rotated to align the driver IC.

[0007] However, in recent years, the display panel market has seen an increasing popularity of irregularly shaped display panels for use in vehicles, etc. Such display panels have a curved shape (curved portion) in part or a concave shape (notched portion) on the edge. There is a demand for a crimping device that can crimp driver ICs to portions of such display panels with different crimping angles and depths, such as the curved portion or notched portion.

[0008] Therefore, the embodiments of the present invention provide a pressure-bonding device and a display panel manufacturing method that can pressure-bond even display panels that have curved portions or notched portions on the edges.

[0009] According to an embodiment, the device comprises a stage section on which a display panel is placed so that the edge extends beyond the display panel; a crimping head section that is movable horizontally, vertically, and rotationally and crimps an electronic component onto the display panel; a backup section that is arranged vertically opposite the crimping head section, is movable horizontally, vertically, and rotationally and supports the edge of the display panel from the non-crimped side; and a control section that controls the movement of the backup section and the crimping head section, wherein the control section controls the adjustment of the orientation of the crimping head section and the backup section that hold the electronic component with respect to the corresponding electrode column on the display panel based on preset mounting position information of the electronic component on the display panel.

[0010] 1 is a diagram illustrating an example of a connection between a display panel to be crimped and an electronic component in the first embodiment; FIG. 2 is a diagram illustrating an example of a connection between an electrode row of a display panel and a terminal row of an electronic component in the first embodiment; FIG. 3 is a cross-sectional view illustrating a crimped portion of an ACF in a display panel and an electronic component in the first embodiment; FIG. 4 is a block diagram illustrating an example of a configuration of an OLB device in the first embodiment; FIG. 5 is a perspective view illustrating a schematic configuration of a temporary pressure bonding unit in the first embodiment; FIG. 6 is a diagram illustrating each drive unit of the temporary pressure bonding unit in the first embodiment; FIG. 7 is a block diagram of a control unit in the first embodiment; FIG. 8 is a plan view illustrating position recognition by a position recognition device in a display panel and an electronic component in the first embodiment; FIG. 9 is a diagram illustrating an imaging position of a display panel 1 and an operation of fine adjustment of a temporary pressure bonding head in the first embodiment; FIG. 10 is a diagram illustrating positioning of the temporary pressure bonding unit in the first embodiment; FIG. 11 is a diagram illustrating positioning of the temporary pressure bonding unit in the first embodiment; FIG. 12 is a diagram illustrating positioning of the temporary pressure bonding unit in the first embodiment; FIG. 13 is a diagram illustrating positioning of the temporary pressure bonding unit in the first embodiment; Fig. 10 is a schematic configuration diagram of a temporary pressure bonding unit in a second embodiment. Fig. 11 is a diagram illustrating a temporary pressure bonding position of a temporary pressure bonding head in a second embodiment. Fig. 12 is a diagram illustrating a positioning state of a temporary pressure bonding unit in a second embodiment. Fig. 13 is an example of a flowchart of temporary pressure bonding in a second embodiment.

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The present invention is not limited to these embodiments. The drawings are schematic or conceptual, and the proportions of the various parts are not necessarily the same as those in reality. In the specification and drawings, elements similar to those described above with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted as appropriate.

[0012] The X-axis, Y-axis, and Z-axis described below are axes that are perpendicular to one another, with the X-axis and Y-axis corresponding to the horizontal direction perpendicular to the direction of gravity, and the Z-axis corresponding to the vertical direction parallel to the direction of gravity. The +Z-axis corresponds to the upward direction, and the -Z-axis corresponds to the downward direction. The θ-axis corresponds to the rotation direction around the Z-axis.

[0013] (First embodiment) Fig. 1 shows an example of connection between a display panel 1 to be crimped in a first embodiment and an electronic component 2. Fig. 2 shows an example of connection between an electrode row ER of the display panel 1 and a terminal row TR of the electronic component 2 in the first embodiment, and shows an enlarged view of one crimping point on the display panel 1 and the electronic component 2.

[0014] 1 and 2, a display panel 1 and an electronic component 2 to be pressure-bonded according to this embodiment will be described. In this example, as shown in Figures 1(A) to 1(F), a case will be described in which a plurality of electronic components 2 are pressure-bonded along the edge of the display panel 1, but only one electronic component 2 may be pressure-bonded. Figure 1 shows an example in which a plurality of electronic components 2 are pressure-bonded to a relatively large display panel 1 used in a vehicle or the like.

[0015] Below, examples will be described in which the electronic components 2 are arranged along the edge of the display panel 1 in a collinear manner, as well as in which the electronic components 2 are arranged non-collinearly, such as when the electronic components 2 are arranged along an edge of the display panel 1 that includes a curved portion, when the electronic components 2 are arranged along an edge of the display panel 1 that includes a notch portion that is a rectangular cutout, and when the electronic components 2 are arranged along the edges of multiple sides of the display panel 1. Figures 1(A) to 1(F) show examples in which multiple electronic components 2 are arranged collinearly or non-collinearly.

[0016] 1A, 1B, and 1C show examples of pressure-bonding electronic components 2 along the edge of a display panel 1 that includes a curved portion, while Fig. 1D shows an example of pressure-bonding electronic components 2 along the edge of a display panel 1 that includes a notch portion. Fig. 1E shows an example of pressure-bonding electronic components 2 along the edges of multiple sides of the display panel 1. Fig. 1F shows an example of pressure-bonding electronic components 2 to a straight portion of the display panel 1.

[0017] 2, electrode rows ER, which are conductive portions, are provided at the edges of the display panel 1. Each electrode row ER is connected to a circuit within the display area via a signal line. A plurality of electrode rows ER are arranged side by side at a predetermined interval (pitch p).

[0018] 1A, the electronic component 2 is a component that is joined to the display panel 1 via an ACF 3. In the first embodiment, for example, a COF is used as the electronic component 2. The COF is a member in which a driver IC is mounted on a flexible sheet made of a flexible resin and printed wiring is formed on the flexible sheet.

[0019] As shown in FIG. 2 , one side of the electronic component 2 is provided with a terminal row TR, which is a conductive portion. The terminal row TR is a collection of terminals for electrically connecting to the electrode row ER of the display panel 1. Each terminal row TR is connected to, for example, a driver IC on the COF via a signal line. A plurality of terminal rows TR are arranged side by side at a predetermined interval (pitch p). The electrode row ER of the display panel 1 and the terminal row TR of the electronic component 2 have a predetermined correspondence relationship for connection with each other, and they must be crimped so that the positions of corresponding electrodes and terminals are aligned. For this reason, the electrode row ER and the terminal row TR have the same spacing. The width and spacing of the electrode row ER and the terminal row TR are set to ensure the conductivity of corresponding electrodes and terminals while also ensuring the insulation of other adjacent electrodes and terminals.

[0020] FIG. 3 is a cross-sectional view showing the pressure-bonded portion of the ACF 3 between the display panel 1 and the electronic component 2 in the first embodiment.

[0021] 3A, the ACF 3 is an anisotropic conductive member, and is a film formed by dispersing conductive particles 32 in a substrate 31. A thermosetting resin that hardens when heated is used as the substrate 31. After the electronic components 2 are aligned on the display panel 1, they are temporarily pressure-bonded to the display panel 1 via the ACF 3 at a pressure of about 10 to 100 N.

[0022] 3(B), in the main pressure bonding, the ACF 3 is sandwiched between the electronic component 2 and the display panel 1 and pressure-bonded with a pressure of about 200 to 1000 N, and the conductive particles 32 located between the electrode array ER and the terminal array TR are crushed by being sandwiched between the electrode array ER and the terminal array TR, thereby realizing conductivity in the thickness direction of the electrode array ER and the terminal array TR and insulation in the surface direction. Furthermore, the thermosetting resin of the base material 31 of the ACF 3 hardens when heated, bonding the electronic component 2 to the display panel 1. In other words, the thermocompression bonding realizes electrical connection between the terminal array TR and the electrode array ER and mechanical connection between the display panel 1 and the electronic component 2.

[0023] FIG. 4 is a block diagram showing an example of the configuration of an OLB (Outer Lead Bonding) device 10 according to the first embodiment.

[0024] The above-described attachment, pre-compression bonding, and final compression bonding of the ACF 3 are performed by an OLB apparatus 10 shown in Fig. 4. The OLB apparatus 10 includes an ACF attachment apparatus 20, a pre-compression bonding apparatus 40, and a final compression bonding apparatus 60. The OLB apparatus 10 is an example of an electronic component mounting apparatus.

[0025] The ACF application device 20 cuts the tape-like ACF 3 wound on a reel to a predetermined length and applies the ACF 3 to the electrode rows ER of the display panel 1. For example, the ACF application device 20 applies the cut ACF 3 by pressing it against the display panel 1. The display panel 1 to which the ACF 3 has been applied is transported to the temporary pressure-bonding device 40 by a transport device (not shown).

[0026] The temporary pressure-bonding device 40 temporarily bonds the electronic components 2 to the display panel 1. The temporary pressure-bonding device 40 aligns the display panel 1 and the electronic components 2, and then presses them together to temporarily bond them. This is the state shown in Fig. 3(A) above. The display panel 1 with the electronic components 2 temporarily bonded thereto is transported by a transport device (not shown) to the full-pressure-bonding device 60.

[0027] The final pressure bonding device 60 performs final pressure bonding on the display panel 1 and the electronic components 2. The display panel 1 and the electronic components 2 are heated and pressure bonded together at a higher temperature and pressure than in the temporary pressure bonding, completing the pressure bonding. This is the state shown in FIG. 3B above.

[0028] FIG. 5 is a perspective view showing a schematic configuration of the pre-press bonding unit 40a in the first embodiment.

[0029] As shown in FIG. 5, the pre-press bonding unit 40 a includes a pre-press bonding head 41 , a transfer stage 42 , a backup unit 43 and a position recognition device 44 .

[0030] The temporary pressure-bonding head 41 moves in the X, Y, Z, and θ directions to pressure-bond the held electronic component 2 to the display panel 1. The transport stage 42 holds and transports the display panel 1. The backup unit 43 moves in the X, Y, Z, and θ directions to support the edge of the display panel 1 that protrudes from the transport stage 42 from the underside (non-pressure-bonded surface side). The position recognition device 44 captures images to recognize the relative positions of the display panel 1 held on the transport stage 42 and the electronic component 2 held by the temporary pressure-bonding head 41. Here, the temporary pressure-bonding head 41 is an example of a pressure-bonding head or a first pressure-bonding head unit, the transport stage 42 is an example of a stage unit, and the backup unit 43 is an example of a backup unit or a first backup unit.

[0031] 5, for the purpose of explaining each component, the scales of the components of the temporary bonding unit 40a, including the temporary bonding head 41, the transport stage 42, the backup unit 43, and the position recognition device 44, are shown as being larger than the transport stage 42. For example, the temporary bonding head 41 has a width of about 50 mm in the X direction. The transport stage 42 is larger than the temporary bonding head 41, and its size is selected to match the display panel 1 to be temporarily bonded.

[0032] The pre-compression bonding head 41 includes a pressure tool 41a, a pre-compression bonding head drive mechanism 41b, and a heater (not shown). The pressure tool 41a receives the electronic component 2 transported by an electronic component supply mechanism (not shown), and suction-holds the electronic component 2 from its upper surface. The pre-compression bonding head drive mechanism 41b moves the pressure tool 41a in the X, Y, Z, and θ directions to align it with the pre-compression bonding position. The heater is built into the pressure tool 41a and heats the pressure tool 41a. The pre-compression bonding head 41 is operated under the control of the control unit 80.

[0033] The pre-press bonding head drive mechanism 41b includes an X-direction drive unit 51a, a Y-direction drive unit 51b, a Z-direction drive unit 51c, and a θ-drive unit 51d. The X-direction drive unit 51a moves the pressure tool 41a in the X-direction, which is one horizontal direction. The Y-direction drive unit 51b moves the pressure tool 41a in the Y-direction, which is a horizontal direction perpendicular to the X-direction. The Z-direction drive unit 51c moves the pressure tool 41a in the Z-direction, which is perpendicular to the horizontal direction. The θ-drive unit 51d rotates the pressure tool 41a within a horizontal plane.

[0034] For example, the X-direction drive unit 51a and the Y-direction drive unit 51b are combined so as to be stacked in this order, and move in the X and Y directions on a slide rail using a built-in ball screw and motor. The Z-direction drive unit 51c is attached to the Y-direction drive unit 51b, and moves in the Z direction using a built-in ball screw and motor. The θ drive unit 51d has a rotation axis centered in the Z direction, and rotates the pressure tool 41a using a servo motor connected to this rotation axis.

[0035] 5, the transfer stage 42 includes a mounting portion 42a and a transfer stage drive mechanism 42b. The display panel 1 is mounted on the mounting portion 42a. The transfer stage drive mechanism 42b moves the mounting portion 42a in the X and Y directions. The transfer stage 42 operates under the control of the control unit 80. When aligning the temporary pressure bonding head 41 and the backup unit 43, the transfer stage 42 is temporarily stopped from moving under the control of the control unit 80 and is fixed in place.

[0036] The transfer stage driving mechanism 42b includes an X-direction driving unit 52a and a Y-direction driving unit 52b. The X-direction driving unit 52a moves the mounting unit 42a in the X-direction, which is one horizontal direction. The Y-direction driving unit 52b moves the mounting unit 42a in the Y-direction, which is a horizontal direction perpendicular to the X-direction. The transfer stage driving mechanism 42b is a driving unit configured by combining the X-direction driving unit 52a and the Y-direction driving unit 52b, stacked in this order from the bottom up. Each of the X-direction driving unit 52a and the Y-direction driving unit 52b may be configured to be driven by a linear motor, for example, under the control of the control unit 80.

[0037] The mounting surface 42c of the mounting portion 42a on which the display panel 1 is placed is formed with a plurality of suction holes 42d for suction-holding the display panel 1. These suction holes 42d are primarily arranged in positions facing the image display area of ​​the display panel 1 when the display panel 1 is placed on the mounting surface 42c. For example, with the display panel 1 placed on the mounting surface 42c, air is sucked through the suction holes 42d, thereby suction-holding the display panel 1 to the mounting surface 42c. In this embodiment, the suction holes 42d are arranged in a matrix at equal intervals within the area of ​​the mounting surface 42c where the display panel 1 is placed (the area surrounded by a dotted line on the mounting surface 42c). Note that it is not necessary for the entire area of ​​the mounting surface 42c to be suction-held. As will be described later, the display panel 1 is placed on the placement portion 42a in a state where at least the side on which the electronic components 2 are mounted protrudes (overhangs) from the placement portion 42a.

[0038] For example, the mounting surface 42c may suction-hold an area of ​​approximately half or one-third of the length of the display panel 1 from the side of the mounting surface 42c where the temporary pressure-bonding head 41 is located. A suction mechanism (not shown) is connected to the suction holes 42d, and the mounting surface 42c uses this suction mechanism to suction-hold and release the display panel 1. Because the suction holes 42d suction-hold the display area of ​​the display panel 1, it is preferable to set the hole diameter small so as to prevent suction marks from being left on the display area. The hole diameter can be determined by experiment or the like, based on the relationship between the suction force required to secure the display panel 1 and the amount of deformation of the display panel 1 due to this suction, and the hole diameter can be set to prevent suction marks from being left. The mounting surface 42c may also be formed of a porous material, such as a vacuum chuck made of porous ceramics.

[0039] After the display panel 1 is placed on the transfer stage 42 by a transfer arm (described later), the transfer stage 42 is moved to a predetermined reference position by driving the X-direction drive unit 52a and the Y-direction drive unit 52b of the transfer stage drive mechanism 42b. This predetermined reference position may be set as the origin of the movable range of the transfer stage 42, the pre-bonding head 41, and the backup unit 43, for example. This may be a position that allows alignment with the pre-bonding position by the backup unit 43 and the pre-bonding head 41, and is set in advance in the control unit 80.

[0040] The pre-compression bonding unit 40a performs pre-compression bonding by sandwiching the edge of the display panel 1 between the backup unit 43 and the pre-compression bonding head 41. For this reason, the backup unit 43 is provided vertically opposite the pre-compression bonding head 41. The backup unit 43 is movable in the θ direction in addition to the X, Y, and Z directions under the control of the control unit 80, so that the orientation of the backup unit 43 can be changed and it can be moved to a position where the electronic component 2 is pre-compressed to the display panel 1.

[0041] The backup unit 43 includes a backup tool 43a, a support base 43b, and a backup unit drive mechanism 43c. The backup tool 43a is elongated in the X direction and supports the edge of the display panel 1 where the electrode arrays ER are formed from below. The support base 43b supports the backup tool 43a and is formed in a roughly rectangular parallelepiped shape. The backup unit drive mechanism 43c moves the support base 43b in the X, Y, Z, and θ directions to align it to the temporary pressure-bonding position. The backup unit 43 operates under the control of the control unit 80.

[0042] The backup tool 43a is made of, for example, stainless steel, and its upper end surface (support surface) that supports the edge of the display panel 1 is formed flat.

[0043] The backup unit drive mechanism 43c includes an X-direction drive unit 53a, a Y-direction drive unit 53b, a Z-direction drive unit 53c, and a θ-drive unit 53d. The X-direction drive unit 53a moves the support base 43b in the X-direction, which is one horizontal direction. The Y-direction drive unit 53b moves the support base 43b in the Y-direction, which is a horizontal direction perpendicular to the X-direction. The Z-direction drive unit 53c moves the support base 43b in the Z-direction, which is perpendicular to the horizontal direction. The θ-drive unit 53d rotates the support base 43b within a horizontal plane. The backup unit drive mechanism 43c is a drive unit configured by combining the X-direction drive unit 53a, the Y-direction drive unit 53b, the Z-direction drive unit 53c, and the θ-drive unit 53d stacked in this order from the bottom up. Each of the X-direction drive unit 53a and the Y-direction drive unit 53b may be driven by a linear motor under the control of the control unit 80, for example. The Z-direction driving unit 53c may be configured to be driven by, for example, an air cylinder or an electric actuator, and the θ-direction driving unit 53d may be configured to be driven by, for example, a servo motor.

[0044] FIG. 8 is a plan view showing how the position of the display panel 1 and the electronic component 2 is recognized by the position recognition device 44 in the first embodiment.

[0045] As shown in Figures 8(A) and 8(B), the display panel 1 is placed on the placement portion 42a in an overhanging state. Figure 8(A) shows an example in which the temporarily bonded portion of the display panel 1 includes a curved portion, while Figure 8(B) shows an example in which the temporarily bonded portion of the display panel 1 includes a notch portion, which is a rectangular cutout. Specifically, in Figure 8(A), an electrode array ER and a pair of alignment marks PM are provided on the curve of the display panel 1 at two of the two positions on both sides of the three bonded positions, while in Figure 8(B), an electrode array ER and a pair of alignment marks PM are provided on the notch portion of the display panel 1 at the center position of the three bonded positions.

[0046] Next, the above-mentioned position recognition device 44 will be described in detail using Figures 5 and 8A. In the figures, the X direction will be assumed to be the left-right direction. The display panel 1 has a plurality of electrode rows ER formed on its edges and a pair of alignment marks PM provided on both the left and right sides of each electrode row ER. The electronic component 2 has terminal rows TR arranged to correspond to the electrode rows ER and a pair of alignment marks WM provided on both the left and right sides of the terminal rows TR.

[0047] 5, the position recognition device 44 includes a first imaging unit 44a, a second imaging unit 44b, and a light irradiation unit 44d. The first and second imaging units 44a, 44b are individually attached to a support base 43b of the backup unit 43 via an X-direction drive unit 44e, facing upward near the end of the backup tool 43a. In this example, the first imaging unit 44a and the second imaging unit 44b move together in the X, Y, Z, and θ directions in accordance with the drive of the backup unit 43.

[0048] The pre-press bonding unit 40a calculates the predetermined mounting position and orientation of the display panel 1 positioned at a predetermined position using the control unit 80 from the recorded mounting position information, and moves the backup unit 43 to the calculated position in the required orientation. The mounting position information includes, for example, information on the position and orientation of the pre-press bonding unit 40a relative to the display panel 1, and the position, shape, and bonding position of the display panel 1. At this time, the target position is calculated and moved taking into account that the first imaging unit 44a and the second imaging unit 44b can capture images of the alignment marks PM of the display panel 1 and the alignment marks WM of the electronic components 2.

[0049] As with the backup unit 43, the pre-compression bonding unit 40a calculates the predetermined mounting position and orientation of the display panel 1 positioned at a predetermined position from the recorded mounting position information using the control unit 80, and moves the pre-compression bonding head 41 to the calculated position in the required orientation. At this time, the target position is calculated and moved taking into account that the first imaging unit 44a and the second imaging unit 44b can capture images of the alignment marks PM of the display panel 1 and the alignment marks WM of the electronic components 2. In other words, after the backup unit 43 has been positioned at the predetermined position in the predetermined orientation, the pre-compression bonding head 41 is moved and positioned to a position corresponding to the position of the backup unit 43. Therefore, the pre-compression bonding head 41 and the backup unit 43 are positioned so that they are aligned in the same direction in the X, Y, and θ directions.

[0050] After the backup unit 43 and the pre-compression bonding head 41 are positioned at a predetermined mounting position, the pre-compression bonding unit 40a causes the control unit 80 to capture images of one of the pair of alignment marks PM provided on the edge of the display panel 1 and one of the pair of alignment marks WM provided on the electronic component 2, so as to simultaneously capture these images within an imaging area 44a1 (shown by dashed lines in FIG. 8) from below the display panel 1. Furthermore, the second imaging unit 44b captures images of the other of the pair of alignment marks PM on the display panel 1 and the other of the pair of alignment marks WM, so as to simultaneously capture these images within an imaging area 44b1 (shown by dashed lines in FIG. 8) from below the display panel 1. After the first and second imaging units 44a, 44b have taken the images, the pre-press bonding unit 40a fine-tunes the pre-press bonding head 41 so that the positions of the alignment marks WM and PM overlap.

[0051] The backup unit 43 and the pre-press bonding head 41 may be moved individually or simultaneously.

[0052] The alignment marks PM and WM imaged by the first imaging unit 44a are examples of first alignment marks, and the alignment marks PM and WM imaged by the second imaging unit 44b are examples of second alignment marks. In the examples of Figures 8A and 8B, the first alignment marks are not aligned on the same line. Similarly, the second alignment marks are not aligned on the same line.

[0053] The first and second imaging units 44a and 44b capture images so that the alignment mark PM and the corresponding alignment mark WM of the electronic component 2 are included in half of their fields of view. The captured images are processed by an image processing unit 44c, and a correction amount for correcting the misalignment is calculated.

[0054] The pre-bonding unit 40a may also include a focal length adjustment unit 90 that adjusts the focal length of the alignment marks PM and WM when the first and second imaging units 44a, 44b simultaneously capture and image the alignment marks PM and WM. The focal length adjustment unit 90 may be, for example, a lens, and is provided on an optical path connecting the imaging units that image the alignment marks PM and the corresponding alignment marks WM on the Z axis. For example, the focal length adjustment unit 90 is provided on an optical path connecting the first imaging unit 44a that images one alignment mark PM and the corresponding alignment mark WM of a pair of alignment marks PM on the Z axis. The focal length adjustment unit 90 is also provided on an optical path connecting the second imaging unit 44b that images the other alignment mark PM and the corresponding alignment mark WM of a pair of alignment marks PM.

[0055] The first and second imaging units 44a, 44b capture still images of the alignment marks PM, WM, respectively, and include a camera 44f such as a CCD (Charge Coupled Device) camera, and a lens barrel unit 44g equipped with an optical unit such as a telecentric lens. The X-direction driving unit 44e enables the first and second imaging units 44a, 44b to move synchronously so as to increase or decrease the distance between them, and the arrangement distance between the first and second imaging units 44a, 44b can be changed in accordance with the distance between the left and right alignment marks PM, WM.

[0056] An image processing unit 44c in the control unit 80, which will be described later, receives an image signal from the camera 44f, recognizes images of the alignment marks PM of the display panel 1 and the alignment marks WM of the electronic components 2 from the captured images taken in the imaging areas 44a1 and 44b1, and detects data relating to the positions of the alignment marks PM and WM (hereinafter referred to as "position data"). Note that the image processing unit 44c may be implemented in the position recognition device 44.

[0057] The image processing unit 44c uses a known pattern matching process to recognize, in the captured image, images that have a matching rate equal to or higher than a threshold with a preset reference pattern for the alignment marks PM of the display panel 1 as the alignment marks PM of the display panel 1. The image processing unit 44c also recognizes, as the alignment marks WM of the electronic component 2, images that have a matching rate equal to or higher than a threshold with a reference pattern for the alignment marks WM of the electronic component 2. The image processing unit 44c then obtains position data for the recognized alignment marks PM and WM based on the camera coordinate system. The control unit 80 recognizes the positional relationship between the display panel 1 and the electronic component 2.

[0058] In this example, the pre-press bonding unit 40a is configured to capture images of the left and right alignment marks based on two imaging units, the first and second imaging units 44a and 44b, but the number of imaging units is not limited to this. For example, the pre-press bonding unit 40a may be equipped with only the first imaging unit 44a, and the first imaging unit 44a may be moved using the X-direction driving unit 44e to capture images of the left and right alignment marks.

[0059] The light irradiator 44d is disposed above the display panel 1 placed on the transfer stage 42 so as to be able to irradiate light directly downward. In this embodiment, a pair of light irradiators 44d are provided at the same interval as the arrangement interval of a pair of alignment marks PM on the display panel 1. The light irradiator 44d is provided integrally with the pre-press bonding head 41 using a support (not shown), but this is not limited thereto, and the light irradiator 44d may be supported on a frame or stand of the pre-press bonding device 40 via a support. When the alignment marks PM on the display panel 1 are imaged by the first and second imaging units 44a and 44b, the light irradiator 44d may be provided so as to irradiate light onto the alignment marks PM on the display panel 1 from the opposite side of the first and second imaging units 44a and 44b. Furthermore, a single elongated light irradiator 44d may be disposed, and the number of light irradiators is not limited.

[0060] 7 , the control unit 80 can be realized by installing a program for the control unit 80 in, for example, a PC (Programmable Controller). A CPU (Central Processing Unit) in the pre-press bonding device 40 executes the program for the control unit 80, thereby realizing the functions of a detection unit 81, a mechanism control unit 85, a setting unit 87, an input / output control unit 88, and a storage unit 86.

[0061] The mechanism control unit 85 controls the driving of each drive unit provided in the pre-compression bonding unit 40a. Specifically, the mechanism control unit 85 controls the driving of the X-direction drive unit 52a and the Y-direction drive unit 52b of the transfer stage drive mechanism 42b, thereby moving the transfer stage 42 to a reference position. The mechanism control unit 85 controls the fixing of the transfer stage 42 when aligning the backup unit 43 and the pre-compression bonding head 41.

[0062] The mechanism control unit 85 also controls the driving of the X-direction driving unit 53a, Y-direction driving unit 53b, Z-direction driving unit 53c, and θ-driving unit 53d of the backup unit driving mechanism 43c, thereby moving and positioning the backup unit 43. The mechanism control unit 85 also controls the driving of the X-direction driving unit 51a, Y-direction driving unit 51b, Z-direction driving unit 51c, and θ-driving unit 51d of the pre-compression bonding head driving mechanism 41b, thereby moving and positioning the pre-compression bonding head 41 to a position corresponding to the position of the backup unit 43.

[0063] Furthermore, the mechanism control unit 85 controls the operations of the first and second imaging units 44a and 44b to capture images of the alignment marks.

[0064] The image processing unit 44c recognizes the alignment marks PM and WM from the images captured by the first and second imaging units 44a and 44b, and obtains position data. The mechanism control unit 85 can also perform control to fine-tune the position of the pre-compression bonding head 41 using the position data of the alignment marks PM and WM.

[0065] The detection unit 81 detects contact between the display panel 1 and the electronic component 2 based on the position of the pre-compression bonding head 41. After this contact detection, the mechanism control unit 85 controls the heater to heat and move the heater downward in the Z direction by a predetermined pushing amount, and performs pre-compression bonding for a predetermined compression time.

[0066] The input / output control unit 88 is an interface that controls signal conversion and input / output between each drive unit to be controlled.

[0067] The storage unit 86 stores information necessary for control in this embodiment, such as position data, reference position, mounting position information, push-in amount, and crimping time, as well as setting information input by an operator.

[0068] The input unit 91 is an input means such as a switch, a touch panel, a keyboard, or a mouse that allows an operator to operate the pre-press bonding device 40 via the control unit 80. The operator can use the input unit 91 to input various pieces of information to be set in the storage unit 86.

[0069] The setting unit 87 is a processing unit that sets information in the storage unit 86 according to input. For example, the setting unit 87 stores information input from the input unit 91 as setting information in the storage unit.

[0070] The output unit 92 is an output means such as a display, a lamp, a meter, etc. that makes information for checking the status of the device visible to the operator. For example, the output unit 92 can display an input screen for information from the input unit 91.

[0071] For example, the input unit 91 and the output unit 92 may be a touch panel display. The shape and the crimped portions of the display panel 1 may be displayed on the display, and the portion in which the crimping process is in progress may be displayed by flashing, or the like, so as to be distinguishable from other crimped portions. Information such as the shape and the crimped portions of the display panel 1 may be stored in advance in the storage unit 86 via external communication or recording media, and this information may be loaded and displayed when the program is executed.

[0072] The control unit 80 includes a processor such as a CPU, a main storage device such as a RAM, an auxiliary storage device such as a HDD, etc. The control unit 80 is, for example, a computer such as a PC, and includes input devices such as a keyboard and a mouse, and an output device such as a display.

[0073] The control unit 80 may include, for example, multiple processors, which allows multiple operations to be performed in parallel.

[0074] In this embodiment, a program containing information necessary for processing is installed in the auxiliary storage device of the control unit 80. The data of this program is temporarily stored in the main storage device or is stored and saved in the auxiliary storage device.

[0075] Next, the operation of the pre-press bonding unit 40a in the first embodiment will be described with reference to FIGS.

[0076] In this first embodiment, the display panel 1 is transported to the mounting section 42a by the transport arm 70, and is placed on the mounting section 42a in an overhanging state, which is the initial state. The control section 80 then aligns the backup unit 43 and the pre-compression bonding head 41, and performs pre-compression bonding. An example of performing pre-compression bonding at the positions of the electrode rows ER1 to ER3 on the display panel 1 shown in Figures 10 to 13 will also be described.

[0077] In addition to the reference position, the description will be given on the assumption that data on the shape of the display panel 1 and the pressure-bonding positions corresponding to that shape, that is, mounting position information which is the position data of the electrode rows ER1 to ER3, is loaded into memory when the program of the control unit 80 is executed. Note that in this embodiment, the description will be given on the assumption that the pressure tool 41a is preheated.

[0078] First, the electronic component supply mechanism supplies the electronic component 2 to the pre-bonding head 41 (step 1). As shown in Figures 10(A) and 10(B) and Figures 11(A) and 11(B), the X-direction drive unit 52a and the Y-direction drive unit 52b of the transfer stage drive mechanism 42b are driven to move the transfer stage 42 to a reference position. After moving the transfer stage 42, the transfer stage 42 is temporarily fixed while aligning the backup unit 43 and the pre-bonding head 41 (step 2). In this embodiment, the reference position is the position where the dashed dotted lines, which are the origins of the movable ranges of the transfer stage 42, the pre-bonding head 41, and the backup unit 43, intersect.

[0079] 10A, the transfer stage 42 is moved so that the center of the electrode array ER1, which is the initial mounting position, coincides with the reference position. After moving to the reference position, the transfer stage 42 is fixed at the reference position with the display panel 1 placed thereon. The X-direction drive unit 53a, Y-direction drive unit 53b, Z-direction drive unit 53c, and θ drive unit 53d of the backup unit drive mechanism 43c are driven to position the backup unit 43 along the reference line, which is a dashed line extending in the X direction, at the position of the electrode array ER1 calculated based on mounting position information including the position, shape, and pressure-bonding position of the display panel 1 (step 3).

[0080] The pre-compression bonding head drive mechanism 41b also drives the X-direction drive unit 51a, Y-direction drive unit 51b, and Z-direction drive unit 51c to position the pre-compression bonding head 41 at the position of the electrode array ER1 calculated from the mounting position information, in an orientation along a reference line extending in the X direction. The backup unit 43 and pre-compression bonding head 41 are positioned so that they can simultaneously capture images of the alignment marks PM corresponding to the electrode array ER1 on the display panel 1 and the alignment marks WM on the electronic component 2. Specifically, the first imaging unit 44a and the second imaging unit 44b move the pre-compression bonding head 41 and the backup unit 43 to positions where they can capture images of the alignment marks corresponding to the electrode array ER1 on the display panel 1 and the alignment marks on the electronic component 2. The pre-compression bonding head 41 is positioned in the Z direction at a height that is different from the pre-compression position, provides a predetermined space with respect to the display panel 1, and does not interfere with the component supply mechanism's supply of the electronic component 2. The backup unit 43 and the temporary pressure bonding head 41 may be positioned simultaneously, or one of them may be positioned first.

[0081] Next, the first and second imaging units 44a and 44b are operated to capture images of the alignment marks PM corresponding to the electrode rows ER1 from below the display panel 1 (step S4). In step S2 or S3, the X-direction driving unit 44e may be moved to adjust the positions of the first and second imaging units 44a and 44b. The image processing unit 44c recognizes images of the alignment marks PM on the display panel 1 from the captured images and detects position data for the alignment marks PM corresponding to each electrode row. The image processing unit 44c calculates the misalignment of the display panel 1 from the position data for the alignment marks PM. For example, the image processing unit 44c calculates how far the alignment marks WM of the electronic component 2 need to be moved relative to the alignment marks PM on the display panel 1 so that they align in the X, Y, and θ directions.

[0082] As shown in FIGS. 9A and 11A, the first and second imaging units 44a and 44b capture images of the alignment marks PM at both ends of the electrode array ER1 located in the center of the display panel 1, which has a curved portion, and the corresponding alignment marks WM of the electronic component 2. Then, as shown in FIGS. 9B and 11B, the pre-bonding head 41 is driven to fine-tune the position of the pre-bonding head 41 in the X, Y, and θ directions according to the calculated correction amount (step 5). This aligns the pre-bonding head 41 in the X, Y, and θ directions. At this time, the backup unit 43 is driven to adjust the positions of the backup unit 43 in the X, Y, and θ directions, and then the backup unit 43 is positioned in the Z direction so that it contacts the display panel 1 (see FIG. 11C).

[0083] After the pre-pressing head 41 has been fine-tuned and positioned at the backup crimping position, the pre-pressing head 41 presses the electronic component 2 with a predetermined pressure to pre-press the electronic component 2 to the electrode array ER1, as shown in Figures 10(B) and 11(D) (step 6).

[0084] 10(C) and 12A, when pre-bonding electrode row ER2, pre-bonding unit 40a moves pre-bonding head 41 and backup unit 43 to a position and orientation corresponding to electrode row ER2 based on mounting position information, rather than transport stage 42. As shown in FIG. 10(C), pre-bonding head 41 and backup unit 43 move by rotating counterclockwise. Also, although not shown in this figure, after pre-bonding electrode row ER1, Z-direction drive unit 51c of pre-bonding head 41 is driven, and electronic component 2 is supplied from a supply arm of an electronic component supply mechanism (not shown) at a predetermined position in the Z direction (step 7).

[0085] 12A and 12B, the pre-compression bonding head 41 and the backup unit 43 move in the required orientation to a position based on the mounting position information. That is, the pre-compression bonding head 41 and the backup unit 43 move in the corresponding orientation to the vicinity of the electrode array ER2, which is the mounting position (Step 8). At this time, the pre-compression bonding head 41 and the backup unit 43 move to a position where the first imaging unit 44a and the second imaging unit 44b can capture images of the alignment marks PM corresponding to the electrode array ER2 of the display panel 1 and the alignment marks WM of the electronic component 2. The first imaging unit 44a and the second imaging unit 44b capture images of the alignment marks PM corresponding to the electrode array ER2 and the alignment marks WM of the electronic component 2 (Step 9). Once the imaging is complete, based on the images captured by the first imaging unit 44a and the second imaging unit 44b, the positions of the pre-press bonding head 41 in the X, Y and θ directions are fine-tuned (step 10), and the positions of the backup unit 43 in the X, Y and θ directions are adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so that it contacts the display panel 1 (see Figure 12 (C)).

[0086] After the position adjustment of the pre-bonding head 41 and the backup unit 43 is completed, the pre-bonding head 41 presses the electronic component 2 with a predetermined pressure to pre-bond the electronic component 2 to the electrode array ER2 (step 11).

[0087] Next, after the electrode row ER2 is pre-pressed, the Z-direction drive unit 51c of the pre-pressing head 41 is driven to supply the electronic component 2 from the supply arm of the electronic component supply mechanism (not shown) at a predetermined Z-direction position (step 12).

[0088] After the electronic component 2 is supplied to the pre-bonding head 41, as shown in FIGS. 13A and 13B, the pre-bonding head 41 and the backup unit 43 move to a position based on the mounting position information in the required orientation. That is, the pre-bonding head 41 and the backup unit 43 move to the vicinity of the electrode array ER3, which is the mounting position, in the corresponding orientation (step 13). As shown in FIG. 10D, the pre-bonding head 41 and the backup unit 43 rotate clockwise. At this time, the pre-bonding head 41 and the backup unit 43 move to a position where the first imaging unit 44a and the second imaging unit 44b can capture images of the alignment mark PM corresponding to the electrode array ER3 of the display panel 1 and the alignment mark WM of the electronic component 2. Images captured by the first imaging unit 44a and the second imaging unit 44b capture images of the alignment mark PM corresponding to the electrode array ER3 and the alignment mark WM of the electronic component 2 (step 14). Based on the images captured by the first imaging unit 44a and the second imaging unit 44b, the positions of the pre-pressing head 41 in the X, Y and θ directions are fine-tuned, and the positions of the backup unit 43 in the X, Y and θ directions are adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so as to come into contact with the display panel 1 (step S14).

[0089] After the position adjustment of the pre-bonding head 41 and the backup unit 43 is completed, as shown in FIG. 13(D), the pre-bonding head 41 presses the electronic component 2 against the electrode array ER3 with a predetermined pressure to perform pre-bonding (step S15).

[0090] Once the temporary pressure-bonding of the electronic components 2 to the electrode rows ER1 to ER3 of the display panel 1 is completed in the temporary pressure-bonding device 40, the display panel 1 is transported by a transport device (not shown) to the permanent pressure-bonding device 60. The display panel 1 is subjected to thermal pressure-bonding by the permanent pressure-bonding device 60 at a higher temperature and pressure than in the temporary pressure-bonding. This completes the pressure-bonding of the electronic components 2 to each electrode row of the display panel 1.

[0091] According to this embodiment, when performing pre-compression bonding, the pre-compression bonding device 40 moves the backup unit 43 and the pre-compression bonding head 41 to align the display panel 1 and the electronic component 2. As a result, even when pre-compression bonding the electronic component 2 to a curved portion or a notch portion of the display panel 1, it is possible to reduce the takt time and prevent deterioration in the accuracy of the pre-compression bonding position compared to when the transfer stage 42 is moved for alignment.

[0092] In particular, when the transfer stage is moved to align a curved portion or a notch portion of a relatively large display panel 1, such as a display panel 1 for a vehicle, it takes time for the vibrations caused by the movement of the display panel 1 to settle, and the temporary pressure bonding device 40 cannot perform temporary pressure bonding until that time has passed. Furthermore, the vibrations generated when the transfer stage is moved are considerable, and there is a risk of damaging the display panel 1. On the other hand, the temporary pressure bonding device 40 in this embodiment does not perform alignment using the transfer stage 42, so there is no need to wait for this time, and the takt time can be shortened.

[0093] Next, the positioning of the pre-press bonding unit 40a in a comparative example will be described with reference to FIG.

[0094] Figures 15(A) to 15(C) show an example of a comparative example in which a temporary pressure-bonding unit 40a is used to temporarily bond a display panel 1 having an electrode row ER1 on a curved portion. Figures 15(D) to 15(G) show an example of a comparative example in which a temporary pressure-bonding unit 40a is used to temporarily bond an electrode row ER2 on a display panel 1. Figures 15(H) to 15(K) show an example of a comparative example in which a temporary pressure-bonding unit 40a is used to temporarily bond an electrode row ER3 on a display panel 1. Figure 15(L) shows an example of a comparative example after temporary pressure-bonding by the temporary pressure-bonding unit 40a has been completed.

[0095] In the comparative example, the X and Y directions of the pre-bonding head 41 are fixed, and therefore the mechanism control unit 85 moves the conveying stage 42 in the X, Y, and θ directions in accordance with the shape of the display panel 1 to align it with the electronic component 2 and pre-bond the electrode rows ER1 to ER3 on the display panel 1. The following description is based on the assumption that the electronic component supply mechanism supplies the electronic component 2 to the pre-bonding head 41.

[0096] 15A and 15B, the mechanism control unit 85 moves the conveying stage 42 in the X direction, Y direction, and θ direction to align it with the electronic component 2 held by the pre-compression bonding head 41 and perform pre-compression bonding to the electrode array ER1 on the display panel 1. After the pre-compression bonding is completed, the mechanism control unit 85 temporarily retracts the conveying stage 42 from the bonding position, as shown in Fig. 15C. This allows the pre-compression bonding head 41 to receive the supply of the electronic component 2 via the supply arm of the electronic component supply mechanism.

[0097] 15(D) to 15(F), the mechanism control unit 85 similarly moves the conveyance stage 42 in the X direction, Y direction, and θ direction to align the electronic component 2 held by the pre-compression bonding head 41 and perform pre-compression bonding on the electrode array ER2 on the display panel 1. In this example, the mechanism control unit 85 rotates the conveyance stage 42 in the +θ direction to align the electrode array ER2. After the pre-compression bonding is completed, the mechanism control unit 85 temporarily retracts the conveyance stage 42 from the bonding position, as shown in FIG. 15(G). This allows the pre-compression bonding head 41 to receive the supply of the electronic component 2 via the supply arm of the electronic component supply mechanism.

[0098] 15(H) to 15(J), the mechanism control unit 85 similarly moves the conveyance stage 42 in the X direction, Y direction, and θ direction to align with the electronic component 2 held by the pre-compression bonding head 41 and perform pre-compression bonding to the electrode array ER2 on the display panel 1. This example shows the mechanism control unit 85 rotating the conveyance stage 42 in the −θ direction to align with the electrode array ER2. After pre-compression bonding is completed, as shown in FIG. 15(K), the mechanism control unit 85 temporarily retracts the conveyance stage 42 from the bonding position. As a result, the pre-compression bonding head 41 receives a supply of electronic components 2 via the supply arm of the electronic component supply mechanism.

[0099] After the temporary pressure bonding is completed, the mechanism control unit 85 moves the transfer stage 42 away so that the display panel 1 can be handed over to the full pressure bonding device 60 .

[0100] When the pre-bonding unit 40a moves the conveying stage 42 to align the mounting position of the electronic components 2 on the display panel 1, i.e., the position of the electrode array ER, with the pre-bonding head 41 and the backup unit 43, vibrations generated by complex movement of a large, heavy display panel 1 with overhangs, such as an irregularly shaped panel, require time to settle to a vibration tolerance, thereby lengthening the takt time. This waiting time tends to increase as the size of the display panel 1 increases. Furthermore, for a display panel 1 having a curved portion as shown in FIG. 8(A) or a display panel 1 having a notched portion as shown in FIG. 8(B), the movement of the conveying stage 42 becomes more complex and the movement distance becomes longer compared to simple linear movement. Furthermore, the movement of the conveying stage 42 as shown in FIG. 15 involves complex calculations of the movement position, which increases error and reduces positioning accuracy.

[0101] On the other hand, in the present embodiment, the pre-pressing unit 40a aligns and performs pre-pressing by moving the backup unit 43 and the pre-pressing head 41 while keeping the large and heavy conveying stage 42 fixed and not moving, thereby eliminating factors that cause vibration in the display panel 1, shortening the takt time, and preventing a deterioration in accuracy.

[0102] Furthermore, the temporary pressure bonding unit 40a in this embodiment may perform partial alignment by moving the conveying stage 42. For example, in the case of the display panel 1 shown in Fig. 1(A), the temporary pressure bonding head 41 and the backup unit 43 may be configured to move in the Y direction and the θ direction, and the conveying stage 42 may be configured to move in the X direction. Similarly, in the case of the display panel 1 shown in Fig. 1(B), the temporary pressure bonding head 41 and the backup unit 43 may be configured to move in the Y direction and the θ direction, and the conveying stage 42 may be configured to move in the X direction.

[0103] According to this embodiment, the temporary pressure bonding device 40 reduces the number of drive axes of the transport stage drive mechanism 42b and allows it to move only in the X and Y directions, thereby increasing the rigidity of the transport stage 42 and improving the stability of the placed display panel 1. This allows the temporary pressure bonding device 40 to prevent deterioration in the accuracy of temporary pressure bonding.

[0104] Furthermore, in this embodiment, the transfer stage driving mechanism 42b is shown as being movable only in the X and Y directions, but it may be configured to be movable in the X, Y, Z, and θ directions.

[0105] Furthermore, according to this embodiment, the fewer the drive axes of the conveyance stage 42, the easier it is to adjust the position, and the less accurate the alignment. Furthermore, by reducing the number of drive axes, i.e., the number of parts, the conveyance stage 42 reduces the weight load on each drive axis of the conveyance stage drive mechanism 42b, suppressing tilt of the entire conveyance stage 42, increasing deformation rigidity, and further reducing the cost of the pre-press bonding device 40.

[0106] Furthermore, according to this embodiment, the pre-compression bonding device 40 may be configured such that the pre-compression bonding head 41 and the backup unit 43 are responsible for movement in the Y direction and the θ direction, and the movement in the X direction is handled by the transport stage 42. In the case of movement between pitches of the electrode array ER, which is a relatively short distance, large vibrations are not generated because it is a simple one-way movement, and the takt time can be further shortened by moving the transport stage 42 in parallel with changing the orientation of the pre-compression bonding head 41 and the backup unit 43.

[0107] Furthermore, according to this embodiment, the pre-pressure bonding device 40 can perform pre-pressure bonding on electrode arrays ER that are arranged not only linearly but also non-linearly in accordance with the shape of the display panel 1, by moving the pre-pressure bonding head 41 in the X direction, Y direction, and θ direction under the control of the mechanism control unit 85, while the conveying stage 42 is fixed.

[0108] Second Embodiment FIG. 16 is a schematic diagram of a temporary pressure-bonding unit 40a according to a second embodiment.

[0109] In this embodiment, the temporary pressure bonding unit 40a is provided with a plurality of temporary pressure bonding heads 41 and backup units 43 for one transfer stage 42. In this figure, the temporary pressure bonding device 40 is provided with two sets of temporary pressure bonding heads 41 and backup units 43. In order to distinguish between the respective configurations, of the two sets of temporary pressure bonding heads 41 and backup units 43 provided in the X direction in the figure, the set on the +X direction side is represented as the temporary pressure bonding head 41' and backup unit 43'. The temporary pressure bonding head 41' is an example of a second pressure bonding head unit, and the backup unit 43' is an example of a second backup unit. The following mainly describes the differences from the first embodiment. In addition, the temporary pressure bonding heads 41 and 41' have a fixed range of movement and are designed not to interfere with each other.

[0110] For ease of explanation, the first imaging section 44a and the second imaging section 44b provided in the backup unit 43' will be referred to as a third imaging section 44a' and a fourth imaging section 44b', respectively.

[0111] The temporary pressure-bonding unit 40a in this embodiment is equipped with temporary pressure-bonding heads 41 and 41', and therefore can perform temporary pressure-bonding at two locations in parallel based on the control of the control unit 80. For example, in the case of a display panel 1 having curved portions on the left and right as shown in Fig. 17, the temporary pressure-bonding head 41 may be oriented in advance for right-curve mounting so as to be able to temporarily pressure-bond to the electrode array ER arranged on the curve in the -X direction, and the temporary pressure-bonding head 41' may be oriented in advance for left-curve mounting so as to be able to temporarily pressure-bond to the electrode array ER arranged on the curve in the +X direction.

[0112] As in the first embodiment, the pre-bonding head 41' includes a pressure tool 41a', a pre-bonding head drive mechanism 41b', and a heater (not shown).

[0113] The pre-press bonding head drive mechanism 41b' includes an X-direction drive unit 51a', a Y-direction drive unit 51b', a Z-direction drive unit 51c', and a θ-direction drive unit 51d'.

[0114] Similar to the first embodiment, the backup unit 43' includes a backup tool 43a', a support base 43b', and a backup unit drive mechanism 43c'.

[0115] The backup unit drive mechanism 43c' includes an X-direction drive section 53a', a Y-direction drive section 53b', a Z-direction drive section 53c', and a θ-direction drive section 53d'.

[0116] As in the first embodiment, the position recognition device 44' includes a third imaging unit 44a', a fourth imaging unit 44b', a light irradiation unit 44d', and an X-direction driving unit 44e'. The third imaging unit 44a' and the fourth imaging unit 44b' each include a camera 44f' and a lens barrel unit 44g'.

[0117] The configurations of the pre-bonding head drive mechanism 41 b, the transport stage drive mechanism 42 b, and the backup unit drive mechanism 43 c are merely examples and are not limited to the above-described structures. It is sufficient that the pre-bonding head 41 and the pre-bonding head 41 ′ are provided and pre-bonding is performed in parallel at two locations on one display panel 1.

[0118] The temporary pressure bonding device 40 may also include a focal length adjustment unit 90'. The focal length adjustment unit 90' is provided on the optical path connecting the third imaging unit 44a' that images one alignment mark PM and the corresponding alignment mark WM of a set of alignment marks PM on the Z axis. The focal length adjustment unit 90' is also provided on the optical path connecting the fourth imaging unit 44b' that images the other alignment mark PM and the corresponding alignment mark WM of the set of alignment marks PM.

[0119] The pre-press bonding head 41' and the backup unit 43' are moved by the control unit 80 controlling each driving unit, as in the first embodiment.

[0120] For example, the mechanism control unit 85 controls the driving of the X-direction driving unit 53a', Y-direction driving unit 53b', Z-direction driving unit 53c', and θ driving unit 53d' of the backup unit driving mechanism 43c', thereby moving the backup unit 43' for alignment. Also, the mechanism control unit 85 controls the driving of the X-direction driving unit 51a', Y-direction driving unit 51b', Z-direction driving unit 51c', and θ driving unit 51d' of the pre-compression bonding head driving mechanism 41b', thereby moving the pre-compression bonding head 41' to a position corresponding to the position of the backup unit 43' for alignment.

[0121] FIG. 17 is a diagram illustrating the pre-pressure bonding position of the pre-pressure bonding head 41 in the second embodiment.

[0122] In this example, the pre-compression bonding head 41 pre-compresses the electronic component 2 onto the electrode arrays ER1 and ER2. The pre-compression bonding head 41' pre-compresses the electronic component 2 onto the electrode array ER3. For example, while the pre-compression bonding head 41 is mounting the electronic component 2 onto the electrode array ER2 in the left curved portion, the mechanism control unit 85 moves these pre-compression bonding heads to a predetermined standby position so as to supply the electronic component 2 to the pre-compression bonding head 41'. For example, the predetermined standby position may be a home position, and is achieved by movement in the X and Y directions.

[0123] After the mounting of the electronic components 2 on the electrode row ER2 is completed, the mechanism control unit 85 retracts the pre-compression bonding head 41 in order to supply the electronic components 2 to the pre-compression bonding head 41. Thereafter, the mechanism control unit 85 moves the pre-compression bonding head 41′ to pre-compression bond the electronic components 2 to the electrode row ER3.

[0124] Furthermore, in preparation for pre-compression bonding of electronic components 2 to the central electrode row ER1, the mechanism control unit 85 may move the pre-compression bonding head 41 at the home position so that the X direction of the pre-compression bonding head 41 is parallel to the X direction of the electrode row ER1. After supplying electronic components 2 to the pre-compression bonding head 41', the mechanism control unit 85 moves the pre-compression bonding head 41 to pre-compression bond the electronic components 2 to the electrode row ER1. After all pre-compression bonding is completed, the next display panel 1 is supplied, and the pre-compression bonding of the display panel 1 is repeated.

[0125] Furthermore, instead of the pre-bonding head 41 repeatedly pre-bonding the electronic components 2 to the electrode row ER1 in the center, for example, the pre-bonding heads 41 and 41' may alternately pre-bond the electronic components 2 to the electrode row ER1.

[0126] If an electronic component supply mechanism is provided for each pre-bonding head, electronic components 2 can be supplied to each pre-bonding head simultaneously. This allows mounting of the left curved portion and the right curved portion simultaneously. Pre-bonding of electronic components 2 to the central electrode row ER2 may be performed by either pre-bonding head 41 or 41'.

[0127] The operation of pre-pressure bonding the electronic components 2 to the electrode rows ER1 to ER3 on the display panel 1 of the pre-pressure bonding unit 40a in the second embodiment will be described with reference to Figures 18 and 19. Note that the operation of pre-pressure bonding the electronic components 2 is performed in the order of ER2, ER3, and ER1, for example.

[0128] As in the first embodiment, the movement of each pre-bonding head is controlled by the mechanism control unit 85, and the dotted arrows indicate the trajectories of the movement of each pre-bonding head. The home positions of the pre-bonding heads 41 and 41′ are indicated as P and P′, respectively.

[0129] First, in step S11, the pre-bonding head 41 is at home position P, and an electronic component 2 is supplied to it by an electronic component supply mechanism (not shown). As shown in Fig. 18A, while the pre-bonding head 41 pre-bonds the electrode array ER2, the pre-bonding head 41' is made to wait at home position P'. Furthermore, while the pre-bonding head 41 is made to wait at a predetermined waiting position, the pre-bonding head 41 is directed toward the center of the electrode array ER1, which is in a direction parallel to the X direction.

[0130] In step S12, the mechanism control unit 85 drives the X-direction drive unit 52a and the Y-direction drive unit 52b of the transfer stage drive mechanism 42b to move the transfer stage 42 to the reference position.

[0131] In step S13, the pre-compression bonding head 41 and the backup unit 43 move in the X and Y directions in accordance with the orientation of the electrode array ER2, and are positioned at a position corresponding to the electrode array ER2. The orientation of the pre-compression bonding head 41 may be aligned in advance with the orientation of the electrode array ER2. After the positioning is completed, in step S14, the first imaging unit 44a and the second imaging unit 44b capture images of the alignment marks PM of the display panel 1 and the alignment marks WM of the electronic component 2 that correspond to the electrode array ER2.

[0132] In step S15, based on the images captured by the first imaging unit 44a and the second imaging unit 44b, the positions of the pre-pressing head 41 in the X direction, Y direction, and θ direction are fine-tuned, and the positions of the backup unit 43 in the X direction, Y direction, and θ direction are adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so that it comes into contact with the display panel 1.

[0133] In step S16, after the position adjustment of the pre-bonding head 41 and the backup unit 43 is completed, as shown in FIG. 18(A), the pre-bonding head 41 presses the electronic component 2 against the electrode array ER2 with a predetermined pressure to perform pre-bonding.

[0134] In step S17, in parallel with step S13, the pre-press bonding head 41' is positioned at the home position P'. In step S18, an electronic component 2 is supplied to the pre-press bonding head 41' by an electronic component supply mechanism (not shown).

[0135] In step S19, as shown in FIG. 18B, the temporary pressure bonding head 41' and the backup unit 43' are aligned with the electrode row ER3 and moved in the X and Y directions to be positioned over the electrode row ER3.

[0136] In step S20, the third imaging unit 44a' and the fourth imaging unit 44b' capture images of the alignment marks PM corresponding to the electrode rows ER2 of the display panel 1 and the alignment marks WM of the electronic components 2. In step S21, based on the images captured by the first imaging unit 44a and the second imaging unit 44b, the positions of the pre-compression bonding head 41' in the X, Y, and θ directions are fine-tuned, and the positions of the backup unit 43' in the X, Y, and θ directions are adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so as to come into contact with the display panel 1.

[0137] In step S22, after the positioning is completed and the position adjustment of the temporary pressure bonding head 41' and the backup unit 43' is completed, the temporary pressure bonding head 41' temporarily pressure bonds the electronic component 2 to the electrode array ER3 with a predetermined pressure, as shown in Figure 18 (B).

[0138] 18(B) , in step S23, in parallel with step S19, the pre-compression bonding head 41 pre-compresses the electronic component 2 onto the electrode array ER2, and then moves to the home position P. In step S24, an electronic component supply mechanism (not shown) supplies the electronic component 2 to the pre-compression bonding head 41. Also, in step S23 or step S24, the pre-compression bonding head 41 may be oriented toward the center so as to be parallel to the X direction of the electrode array ER1 while waiting, in preparation for pre-compression bonding the electronic component 2 onto the central electrode array ER1.

[0139] Although the pre-bonding of the electronic component 2 to the electrode row ER2 and the pre-bonding of the electronic component 2 to the electrode row ER3 are performed in this order, these pre-bonding operations may be performed simultaneously. This is not limited to this case, and the mechanism control unit 85 may perform pre-bonding by operating the pre-bonding heads 41 and 41′ in parallel.

[0140] 18(C), the pre-bonding head 41 and the backup unit 43 are moved from the home position P to the electrode array ER1 and positioned at the electrode array ER1. At this time, the orientations of the pre-bonding head 41 and the backup unit 43 are adjusted in the X and Y directions so as to correspond to the orientation of the electrode array ER1.

[0141] In step S26, the first imaging unit 44a and the second imaging unit 44b capture images of the alignment marks PM corresponding to the electrode rows ER2 of the display panel 1 and the alignment marks WM of the electronic component 2. In step S27, based on the images captured by the first imaging unit 44a and the second imaging unit 44b, the positions of the pre-press bonding head 41 in the X, Y, and θ directions are fine-tuned, and the positions of the backup unit 43 in the X, Y, and θ directions are adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so as to come into contact with the display panel 1.

[0142] In step S28, after the positioning is completed and the position adjustment of the temporary pressure bonding head 41 and the backup unit 43 is completed, the temporary pressure bonding head 41 temporarily pressure bonds the electronic component 2 to the electrode array ER1 with a predetermined pressure, as shown in Figure 18 (C).

[0143] Furthermore, in step S29, the temporary pressure bonding head 41' and the backup unit 43' are retracted from interference. In this example, after the orientation of the temporary pressure bonding head 41' and the backup unit 43' is returned, the temporary pressure bonding head 41' and the backup unit 43' are moved to the home position P'. At this time, the orientation of the temporary pressure bonding head 41' and the backup unit 43' may be aligned with the orientation of the electrode row at the next crimping position. After the temporary pressure bonding head 41' has moved, the electronic component supply mechanism supplies electronic components 2 to the temporary pressure bonding head 41'.

[0144] According to this embodiment, the pre-compression bonding device 40 is provided with a plurality of pre-compression bonding heads 41 and backup units 43 for one transfer stage 42. As a result, the pre-compression bonding device 40 can perform pre-compression bonding at a plurality of locations in parallel based on the control of the control unit 80, thereby improving the bonding efficiency and shortening the takt time. Furthermore, since the pre-compression bonding device 40 is provided with a plurality of pre-compression bonding heads 41, even if the display panel 1 is long in the X direction, for example, the takt time can be shortened by moving the plurality of pre-compression bonding heads 41 in the X direction and performing pre-compression bonding respectively, compared to the case of pre-compression bonding using a single pre-compression bonding head 41.

[0145] Furthermore, according to this embodiment, the temporary pressure bonding device 40 performs temporary pressure bonding on a continuous curved portion of the display panel 1 using the temporary pressure bonding head 41 or the temporary pressure bonding head 41', while the other temporary pressure bonding head can receive electronic components 2 from the electronic component supply mechanism, so that temporary pressure bonding can be performed at multiple locations in parallel. Furthermore, the temporary pressure bonding device 40 can perform temporary pressure bonding at multiple locations simultaneously even if the temporary pressure bonding locations on the display panel 1 include a continuous notched portion and a continuous non-notched portion.

[0146] In the above embodiment, the pre-crimping device 40 was mainly described as a crimping device, but the configurations of the backup unit 43 and pre-crimping head 41 described in the above embodiment can also be applied to the backup unit and head in the main crimping device 60.

[0147] The configurations of the pre-bonding head drive mechanism 41 b, the transfer stage drive mechanism 42 b, and the backup unit drive mechanism 43 c described in the above embodiment are merely examples and are not limited to the above-described structures. These structures may be any structures for moving the pre-bonding head 41, the transfer stage 42, and the backup unit 43, respectively.

[0148] For example, in the case of a display panel 1 for a vehicle that displays various vehicle information such as speed and fuel amount, it is expected that the type of electronic component 2 to be mounted will differ depending on the area that displays map image information, the area that displays speed information, etc.

[0149] In such a case, since the electronic component supply mechanism supplies multiple types of electronic components 2 in one mounting process of the display panel 1, the pre-press bonding unit 40a may be provided with supply units (e.g., trays) corresponding to the types of electronic components 2. Furthermore, the supply units may be of any size according to the size and type of the electronic components 2.

[0150] Furthermore, since the mounting method of the electronic components 2 on the display panel 1 may vary, such as COF or COG, the pre-compression bonding unit 40a may use a combination of techniques other than COF when mounting the electronic components 2. Furthermore, the ACF may be supplied by punching from a tape, for example.

[0151] That is, the temporary pressure bonding unit 40 a may also change the type of electronic component 2 according to the display area of ​​the display panel 1 , and may also be provided with various supply units for supplying these electronic components 2 .

[0152] Although several embodiments have been described above, these embodiments are presented only as examples and are not intended to limit the scope of the invention. The novel crimping device and the like described in this specification can be embodied in various other forms. Furthermore, various omissions, substitutions, modifications, and combinations can be made to the forms of the crimping device described in this specification without departing from the spirit of the invention. The appended claims and their equivalents are intended to include such forms and modifications that fall within the scope and spirit of the invention.

[0153] 1: Display panel 1, 2: Electronic component, 3: ACF, 10: OLB device, 20: ACF attachment device, 31: Base material, 32: Conductive particles, 40: Pre-compression bonding device, 41: Pre-compression bonding head, 41': Pre-compression bonding head, 41a: Pressure tool, 41a': Pressure tool, 41b: Pre-compression bonding head drive mechanism, 41b': Pre-compression bonding head drive mechanism, 42: Transport stage, 42a: Placement section, 42b: Transport stage drive mechanism, 42c: Placement surface, 42d: Suction hole, 43: Backup unit, 43': Backup unit, 43a: Backup tool, 43a': Backup tool, 43b: Support base, 43b': Support base, 43c: Backup unit drive mechanism, 43c': Backup unit drive mechanism, 44: Position recognition device, 44': position recognition device, 44a: first imaging unit, 44a': third imaging unit, 44a1: imaging area, 44b: second imaging unit, 44b': fourth imaging unit, 44b1: imaging area, 44c: image processing unit, 44d: light irradiation unit, 44d': light irradiation unit, 44e: X-direction drive unit, 44e': X-direction drive unit, 44f: camera, 44f': camera, 44g: lens barrel unit, 44g': lens barrel unit, 51a: X-direction drive unit, 51a': X-direction drive unit, 51b: Y-direction drive unit, 51b': Y-direction drive unit, 51c: Z-direction drive unit, 51c': Z-direction drive unit, 51d: θ drive unit, 51d': θ drive unit, 52a: X-direction drive unit, 52b: Y-direction drive unit, 53a: X-direction drive unit, 53a': X-direction drive unit, 53b: Y-direction drive unit, 53b': Y-direction drive unit, 53c: Z-direction drive unit, 53c': Z-direction drive unit, 53d: θ-drive unit, 53d': θ-drive unit, 60: main pressure bonding device, 70: transport arm, 80: control unit, 81: detection unit, 85: mechanism control unit, 86: storage unit, 87: setting unit, 88: input / output control unit, 90: focal length adjustment unit, 91: input unit, 92: output unit, 90: focal length adjustment unit, 91: input unit, 92: output unit, WM: alignment mark, PM: alignment mark, ER: electrode array, TR: terminal array

Claims

1. A crimping device comprising: a stage section on which a display panel is placed so that its edges protrude; a crimping head section that is movable horizontally, vertically and rotationally and crimps an electronic component onto the display panel; a backup section that is arranged vertically opposite the crimping head section and is movable horizontally, vertically and rotationally and supports the edge of the display panel from the non-crimped side; and a control section that controls the movement of the backup section and the crimping head section, wherein the control section controls the adjustment of the orientation of the crimping head section and the backup section that hold the electronic component with respect to a corresponding electrode column on the display panel, based on preset mounting position information of the electronic component on the display panel.

2. The crimping device according to claim 1, further comprising an imaging unit that images alignment marks of the electrode rows provided on the edge of the display panel, and wherein the control unit moves the backup unit to the crimping position after imaging the alignment marks.

3. The crimping device according to claim 2, characterized in that the control unit controls the crimping head unit and the backup unit to move simultaneously and position them at the imaging position.

4. A crimping device according to any one of claims 1 to 3, characterized in that the control unit further controls to fix the stage unit when the backup unit and the crimping head unit are moving.

5. The pressure bonding device according to claim 2, wherein the alignment marks are arranged on the same straight line along the edge of the display panel.

6. The crimping device according to claim 2, wherein the alignment marks are arranged in a non-colinear manner along the edge of the display panel.

7. The crimping device according to claim 1, characterized in that the crimping head unit comprises a plurality of crimping head units and the backup unit comprises a plurality of backup units, and the control unit performs control to adjust the orientations of the plurality of crimping head units and the plurality of backup units that hold the electronic components with respect to corresponding electrode rows on the display panel based on preset mounting position information of the electronic components on the display panel.

8. A method for manufacturing a display panel, comprising placing a display panel on a stage section so that the edges protrude, and controlling a crimping head section that moves horizontally, vertically and rotationally, and a backup section that is provided vertically opposite the crimping head section and moves horizontally, vertically and rotationally, to crimp an electronic component onto the display panel, wherein the control comprises controlling the orientations of the crimping head section and the backup section with respect to corresponding electrode columns on the display panel, based on preset mounting position information of the electronic component on the display panel.

Images