Pressure bonding device

Abstract

[Problem] To provide a pressure bonding device prevents product failure while shortening takt time. [Solution] A pressure bonding device according to an embodiment comprises a stage part on which a display panel is placed so that an edge portion thereof protrudes. The pressure bonding device furthermore comprises a plurality of pressure heads that are capable of moving in a first direction, a second direction, and a third direction that intersect each other on the placement surface of the stage part, the plurality of pressure heads heating and pressure-bonding a plurality of electronic components that are arranged along the edge portion of the display panel. The pressure bonding device furthermore comprises a backup unit that is provided so as to face the plurality of pressure heads in the third direction, supports the edge portion of the display panel from below in the third direction, and performs heating. The pressure bonding device furthermore comprises a control unit that controls the plurality of pressure heads. Furthermore, on the basis of mounting position information pertaining to the plurality of electronic components arranged on the display panel, the control unit performs control to align the plurality of pressure heads with the positions where the plurality of electronic components are arranged and to pressure-bond the plurality of electronic components collectively.

Description

Crimping Device

[0001] SUMMARY OF THE INVENTION An embodiment of the present invention relates to a crimping device.

[0002] In liquid crystal display devices such as liquid crystal monitors and liquid crystal televisions, a technique called COF (Chip on Film or Chip on Flexible) is used to mount a driver IC for the liquid crystal in the display panel, in which the driver IC is mounted on a film-like wiring circuit board containing polyimide.

[0003] When mounting a driver IC on a liquid crystal display device, a temporary pressure-bonding device temporarily presses the driver IC onto the edge of a display panel to which a tape-shaped anisotropic conductive material called an ACF (Anisotropic Conducting Film) has been attached, and then a final pressure-bonding device performs final pressure-bonding of the driver IC at high temperature and high pressure.

[0004] Patent No. 5324769

[0005] In the above-described pressure bonding apparatus, when the temporarily pressure-bonded electronic component is pressure-bonded to the display panel, the transfer stage on which the display panel is mounted is moved or rotated to determine the pressure bonding position.

[0006] However, when using a single pressure head to bond multiple electronic components with different bonding angles and depths, such as curved or notched portions of a display panel, moving the transfer stage for alignment increases takt time. Furthermore, supporting the display panel from below with a heated backup unit hardens the anisotropic conductive material before the bonding, making it difficult for the particles to be crushed, which can lead to product defects.

[0007] Therefore, an embodiment of the present invention provides a crimping device that reduces takt time while preventing product defects.

[0008] According to an embodiment, the crimping device includes a stage unit on which a display panel is placed so that its edges extend beyond the display panel. The crimping device further includes a plurality of pressure head units that are movable in a first direction and a second direction intersecting each other on the placement surface of the stage unit and in a third direction intersecting the first and second directions, and that heat and crimp a plurality of electronic components arranged along the edge of the display panel. The crimping device further includes a backup unit that is disposed opposite the plurality of pressure head units in the third direction and that supports and heats the edge of the display panel from below in the third direction. The crimping device further includes a control unit that controls the plurality of pressure head units. The control unit further controls the positioning of the plurality of pressure head units to the positions where the plurality of electronic components are to be arranged, based on mounting position information of the plurality of electronic components arranged on the display panel, and crimps the plurality of electronic components together.

[0009] 1 is a diagram illustrating an example of a connection between a display panel to be crimped and an electronic component in the first embodiment; FIG. 2 is a diagram illustrating an example of a connection between an electrode row of a display panel and a terminal row of an electronic component in the first embodiment; FIG. 3 is a cross-sectional view illustrating a crimped portion of an ACF in a display panel and an electronic component in the first embodiment; FIG. 4 is a block diagram illustrating an example of a configuration of an OLB device in the first embodiment; FIG. 5 is a block diagram illustrating an example of a configuration of a full-crimping device in the first embodiment; FIG. 6 is a perspective view illustrating a schematic configuration of a full-crimping unit in the first embodiment; FIG. 7 is another diagram illustrating a schematic configuration of a full-crimping unit in the first embodiment; FIG. 8 is an example of a pressure member in the first embodiment; FIG. 9 is a plan view illustrating a schematic configuration of a display panel whose position is recognized by a position recognition device in the first embodiment; FIG. 10 is a diagram illustrating how a pressure head is positioned in the first embodiment; FIG. 11 is a block diagram of a control unit in the first embodiment; FIG. 12 is an example of a flowchart of full-crimping in the first embodiment; FIG. 13 is another diagram illustrating how a pressure head is positioned in the first embodiment; FIG. 14 is a diagram illustrating a schematic configuration of a full-crimping unit in the second embodiment; FIG. 15 is an example of a pressure member in the second embodiment; FIG. 16 is an example of an attachment of a pressure member in the second embodiment; FIG. 17 is a diagram illustrating how a pressure head is positioned in the second embodiment. 10 is a plan view showing a schematic configuration of a display panel whose position is recognized by a position recognition device in a third embodiment. FIG. 11 is an example of a flowchart of main pressure bonding in a third embodiment.

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The present invention is not limited to these embodiments. The drawings are schematic or conceptual, and the proportions of the various parts are not necessarily the same as those in reality. In the specification and drawings, elements similar to those described above with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted as appropriate.

[0011] Furthermore, the X-axis, Y-axis, and Z-axis described below represent axes that are perpendicular to one another, with the X-direction and Y-direction intersecting each other and corresponding to a lateral direction (horizontal direction) perpendicular to the direction of gravity, and the Z-direction corresponding to a longitudinal direction (vertical direction) intersecting the X-direction and Y-direction. The +Z-direction corresponds to the upward direction, and the -Z-direction corresponds to the downward direction. The θ-direction corresponds to the rotation direction around the Z-axis as the rotation axis. The X-direction is an example of a first direction, the Y-direction is an example of a second direction, and the Z-direction is an example of a third direction.

[0012] (First embodiment) Fig. 1 shows an example of connection between a display panel 1 to be crimped in a first embodiment and an electronic component 2. Fig. 2 shows an example of connection between an electrode row ER of the display panel 1 and a terminal row TR of the electronic component 2 in the first embodiment, and shows an enlarged view of one crimping point on the display panel 1 and the electronic component 2.

[0013] 1 and 2, a display panel 1 and an electronic component 2 to be pressure-bonded in this embodiment will be described. In this example, as shown in Figures 1(A) to 1(F), a case will be described in which a plurality of electronic components 2 are pressure-bonded along the edges of a plurality of differently shaped display panels 1, but only one electronic component 2 may be pressure-bonded. Figure 1 shows an example in which a plurality of electronic components 2 are pressure-bonded to a relatively large display panel 1 used in a vehicle or the like.

[0014] Below, examples will be described in which the electronic components 2 are arranged along the edge of the display panel 1 in a collinear manner, as well as in which the electronic components 2 are arranged non-collinearly, such as when the electronic components 2 are arranged along the edge of the display panel 1 that includes a curved portion, when the electronic components 2 are arranged along the edge of the display panel 1 that includes a notch portion that is a rectangular cutout, and when the electronic components 2 are arranged along the edges of multiple sides of the display panel 1. Figures 1(A) to 1(F) show examples in which multiple electronic components 2 are arranged collinearly or non-collinearly, or when multiple electronic components 2 are arranged in a mixed manner in a collinear or non-collinear manner.

[0015] 1A, 1B, and 1C show examples of pressure-bonding electronic components 2 along the edge of a display panel 1 that includes a curved portion, while Fig. 1D shows an example of pressure-bonding electronic components 2 along the edge of a display panel 1 that includes a notch portion. Fig. 1E shows an example of pressure-bonding electronic components 2 along the edges of multiple sides of the display panel 1. Fig. 1F shows an example of pressure-bonding electronic components 2 to a straight portion of the display panel 1.

[0016] As shown in Fig. 2, an electrode array ER, which is a conductive portion, is provided at the edge of the display panel 1. The electrode array ER is provided at a predetermined location on the edge of the display panel 1. Note that one or more electrode arrays ER are provided on the edge of the display panel 1. Each electrode array ER is connected to a circuit within the display area via a signal line. In the electrode array ER, multiple electrodes are arranged side by side at a predetermined interval (pitch p).

[0017] 1A, the electronic component 2 is a component that performs electronic processing and is joined to the display panel 1 via the ACF 3. In the first embodiment, for example, a COF is used as the electronic component 2. The COF is a member in which a driver IC is mounted on a flexible sheet made of a flexible resin and printed wiring is formed on the flexible sheet.

[0018] As shown in FIG. 2 , one side of the electronic component 2 is provided with a terminal row TR, which is a conductive portion. The terminal row TR is a collection of terminals for electrically connecting to the electrode row ER of the display panel 1. Each terminal row TR is connected to, for example, a driver IC on the COF via a signal line. The terminal row TR has multiple terminals arranged side by side at a predetermined interval (pitch p). The electrode row ER of the display panel 1 and the terminal row TR of the electronic component 2 have a predetermined correspondence relationship for connection with each other, and they must be crimped so that the positions of corresponding electrodes and terminals are aligned. For this reason, the electrode row ER and the terminal row TR have the same spacing. The width and spacing of the electrode row ER and the terminal row TR are set to ensure the conductivity of corresponding electrodes and terminals while also ensuring the insulation of other adjacent electrodes and terminals.

[0019] FIG. 3 is a cross-sectional view showing the pressure-bonded portion of the ACF 3 between the display panel 1 and the electronic component 2 in the first embodiment.

[0020] 3A, the ACF 3 is an anisotropic conductive member, and is a film formed by dispersing conductive particles 32 in a substrate 31. A thermosetting resin that hardens when heated is used as the substrate 31. After the electronic components 2 are aligned on the display panel 1, they are temporarily pressure-bonded to the display panel 1 via the ACF 3 at a pressure of about 10 to 30 N.

[0021] 3(B), in the main pressure bonding, the ACF 3 is sandwiched between the electronic component 2 and the display panel 1 and pressure-bonded with a pressure of about 200 to 500 N, and the conductive particles 32 located between the electrode array ER and the terminal array TR are crushed by being sandwiched between the electrode array ER and the terminal array TR, thereby realizing conductivity in the thickness direction of the electrode array ER and the terminal array TR and insulation in the surface direction. Furthermore, the thermosetting resin of the base material 31 of the ACF 3 hardens when heated, bonding the electronic component 2 to the display panel 1. In other words, the thermocompression bonding realizes electrical connection between the terminal array TR and the electrode array ER and mechanical connection between the display panel 1 and the electronic component 2.

[0022] FIG. 4 is a block diagram showing an example of the configuration of an OLB (Outer Lead Bonding) device 10 according to the first embodiment.

[0023] The above-described attachment, pre-compression bonding, and final compression bonding of the ACF 3 are performed by an OLB apparatus 10 shown in Fig. 4. The OLB apparatus 10 includes an ACF attachment apparatus 20, a pre-compression bonding apparatus 40, and a final compression bonding apparatus 60. The OLB apparatus 10 is an example of an electronic component mounting apparatus.

[0024] The ACF application device 20 cuts the reel-shaped ACF 3 to a predetermined length and applies the ACF 3 to the electrode rows ER of the display panel 1. For example, the ACF application device 20 applies the ACF 3 by pressing it against the display panel 1. The display panel 1 to which the ACF 3 has been applied is transported to the temporary pressure bonding device 40 by a transport device (not shown).

[0025] The temporary pressure-bonding device 40 temporarily bonds the electronic components 2 to the display panel 1. As shown in Fig. 3A, the temporary pressure-bonding device 40 presses the display panel 1 and the electronic components 2 to temporarily bond them together. The display panel 1 with the electronic components 2 temporarily bonded to it is transported to the full-pressure-bonding device 60.

[0026] The final pressure bonding device 60 performs final pressure bonding on the display panel 1 and the electronic components 2 that have been temporarily pressure bonded by the temporary pressure bonding device 40. As shown in Fig. 3(B) , the display panel 1 and the electronic components 2 are heated and pressure bonded at a higher temperature and pressure than in the temporary pressure bonding.

[0027] In the final bonding, in order to prevent the ACF 3 attached to electronic components 2 other than the electronic component 2 to be bonded (for example, electronic components 2 adjacent to the electronic component 2 to be bonded) from hardening due to heat conduction from a backup section (described later), it is desirable to perform the final bonding of multiple electronic components together at the same temperature. The final bonding device of the present invention will be described below.

[0028] FIG. 5 is a block diagram showing an example of the configuration of the full-pressure bonding device 60 in the first embodiment.

[0029] 5 , the final pressure bonding apparatus 60 includes a final pressure bonding unit 60a and a control unit 80. The final pressure bonding unit 60a has various drive units, which are controlled by the control unit 80. The final pressure bonding of the display panel 1 and the electronic component 2 is achieved based on the control of the control unit 80.

[0030] Next, the configuration of the final pressure bonding unit 60a in the first embodiment will be described with reference to FIGS. 6 to 9. FIG. 6 shows a schematic configuration of the final pressure bonding unit 60a in the first embodiment. FIG. 7(A) is a perspective view showing the schematic configuration of the final pressure bonding unit 60a, and FIG. 7(B) is a view of FIG. 7(A) as viewed from the X direction. FIG. 8(A) is an enlarged perspective view of the pressure member 51, and FIG. 8(B) is a view of the pressure member 51 as viewed from the -Z direction, which corresponds to the pressure bonding surface side. FIG. 9 is a plan view showing a schematic configuration of the display panel 1 whose position is recognized by the position recognition device 57 in the first embodiment. In the following example, the reference position is described as being set as the origin of the movable range of the transfer stage 70, pressure head 50, pressure bonding tool 51a, and backup unit 54, for example.

[0031] The main pressure bonding unit 60 a includes a plurality of pressure heads 50 , a backup unit 54 , a transfer stage 70 , a position recognition device 57 , a supply reel 58 , and a take-up reel 59 .

[0032] In this embodiment, the main pressure bonding unit 60a is equipped with four pressure heads 50, but the number of pressure heads 50 is not limited to this and may be any number n (n is an integer greater than or equal to 1) according to the size, shape, etc. of the display panel 1 to be pressure bonded.

[0033] In addition, in this embodiment, the position recognition device 57 includes two imaging units, but the number of imaging units included in the position recognition device 57 is not limited to this. The number of imaging units can be any number as long as the imaging units have a structure that allows them to recognize the alignment marks PM provided on the display panel 1, and may be, for example, one or three or more.

[0034] The pressure head 50 includes a pressure member 51, a heating unit 52, and a pressure adjustment unit 53. The final pressure bonding unit 60a includes a plurality of pressure heads 50 aligned in the same line in the X direction so that a plurality of electronic components 2 on the display panel 1 can be final pressure bonded at once.

[0035] The pressure members 51 are members that press the electronic components 2 against the display panel 1. Each pressure member 51 has a crimping tool 51a at its tip, which has a crimping surface for the electronic components 2. As shown in FIG. 7B , each pressure member 51 has a crimping tool 51a that moves in the Y and θ directions under the control of the control unit 80. For example, a slide rail may be provided on the pressure member 51, the crimping tool 51a may be placed on the rail, and the crimping tool 51a may be moved in the Y direction by a motor or actuator. The pressure member 51 may also be configured to rotate in the θ direction. For example, a rotation mechanism (such as a motor) may be attached to the pressure member 51. This allows the pressure member 51 to move in the θ direction together with the crimping tool 51a. Note that the structures of the pressure members 51 and the crimping tool 51a are not limited to this example and may be any structure that allows movement in the Y and θ directions.

[0036] The home position of the crimping tool 51a is a position coaxial with the center of the rotation axis. This home position is also at the same coordinate position as the Y coordinate of the reference position. The crimping tool 51a moves in the Y direction and the θ direction with respect to the reference position.

[0037] As shown in Figures 8(A) and 8(B), the pressure member 51 is configured to rotate in the θ direction, and the crimping tool 51a is configured to slide in the Y direction. For example, to achieve movement in the Y direction, the crimping tool 51a may be configured to move on a slide rail, as shown in Figure 8(B). In this example, the crimping tool 51a has a rectangular prism shape. The crimping tool 51a has a length in both the X and Y directions that is longer than the electronic component 2 to be crimped.

[0038] The heating unit 52 is a member that heats the pressure member 51. The heating unit 52 is built into the pressure member 51. The heating unit 52 uses, for example, a heater that generates heat when a voltage is applied. The heater is embedded in the pressure member 51 at the back of the crimping tool 51a.

[0039] The pressure adjusting unit 53 causes the pressing member 51, heated by the heating unit 52, to press the electronic component 2 with a pressure necessary to ensure conductivity by the ACF 3. Note that the "pressure necessary to ensure conductivity" is a pressure at which the conductive particles 32 are crushed and conductivity is obtained between the electrode array ER of the display panel 1 and the terminal array TR of the electronic component 2.

[0040] The pressure adjustment unit 53 has a pressure cylinder 55 and a Z-direction drive mechanism 56. The pressure cylinder 55 is a device that applies pressure to the pressure member 51. In this embodiment, the pressure cylinder 55 is a source of pressure required to ensure conductivity. For example, an air cylinder that generates pressure by the action of compressed air is used as the pressure cylinder 55. Alternatively, a motor-driven electric cylinder may be used as the pressure cylinder 55. The pressure cylinder 55 has an actuating rod 55a that applies pressure by linear motion. The actuating rod 55a is moved forward and backward in the Z direction, which is the pressing direction, by the pressure cylinder 55. The pressure cylinder 55 is also provided with a pressure sensor (not shown) that detects the pressure applied to the electronic component 2.

[0041] The actuating rod 55a is connected to the pressure member 51 via a lifting block 55b. The lifting block 55b is a rectangular parallelepiped member that moves up and down as the actuating rod 55a moves back and forth, thereby lifting and lowering the pressure member 51.

[0042] The Z-direction driving mechanism 56, together with the pressure cylinder 55, drives the pressure member 51 in the Z direction, which is the direction in which the pressure member 51 approaches and moves away from the electronic component 2. The Z-direction driving mechanism 56 has a pressure control unit 56a, a supply source 56b, and a Z-direction guide rail 56c. For example, the supply source 56b is a compressor that supplies compressed air, and the air pressure is controlled by the pressure control unit 56a. The pressure control unit 56a is also controlled by the control unit 80.

[0043] The Z-direction guide rail 56c extends in the Z direction and supports the pressure cylinder 55 and the lift block 55b so that the lift block 55b can slide.

[0044] The X-direction drive mechanism 61 extends in the X direction and supports each pressure head 50 so that it can slide. In this example, the operator manually moves each pressure head 50 in the X direction and fixes it at any position. For example, the operator can determine the fixing position of the pressure head 50 to match the bonding position of the electronic component 2 when the transfer stage 70 is positioned at a reference position described below. Furthermore, when bonding a different type of display panel 1, the operator can change the fixing position of the pressure head 50 to match the bonding position of the electronic component 2 of that display panel 1. The X-direction drive mechanism 61 may be a linear drive mechanism driven by a motor, a ball screw, or the like, and the linear drive mechanism may be controlled by the control unit 80 to move each pressure head 50.

[0045] The backup unit 54 includes a backup tool 54a and a support base 54b.

[0046] The support base 54b is a fixed member without a drive mechanism, and supports the backup tool 54a. The support base 54b is equipped with a heating unit 54c. The backup tool 54a is provided in a direction facing the multiple crimping tools 51a in the vertical direction and extends in the X direction, that is, the direction in which the electronic components 2 are arranged on the display panel 1. The backup tool 54a has a flat receiving surface facing the pressure surface of the crimping tool 51a. The X direction of the backup tool 54a is longer than the X direction length of the display panel 1, and the Y direction length is longer than the Y direction length of the crimping position of the electronic components 2 to be crimped collectively. In other words, the X and Y directions of the backup tool 54a are long enough to crimp the electronic components 2 collectively.

[0047] The heating unit 54c is a member built into the backup unit 54 and heats the backup tool 54a. The heating unit 54c uses, for example, a heater that generates heat when a voltage is applied. A plurality of heating units 54c are embedded at equal intervals in the back of the backup tool 54a, for example.

[0048] The transfer stage 70 is a device that supports the display panel 1. The transfer stage 70 includes a stage 71 and a transfer stage driving mechanism 72.

[0049] The stage 71 is a flat platform that horizontally supports the display panel 1. Although not shown, the stage 71 has a plurality of holes that are connected to a vacuum source and are configured to be able to suction-hold the display panel 1. The transfer stage driving mechanism 72 is a device that supports the stage 71 so that it can move freely in the X, Y, Z, and θ directions.

[0050] The transfer stage 70 receives the display panel 1 with the electronic components 2 temporarily bonded to it via the ACF 3 from the temporary bonding device 40, and moves the display panel 1 so that it is within the imaging range of the position recognition device 57. After the permanent bonding is completed, the transfer stage 70 delivers the display panel 1 to a discharge position. The transfer stage drive mechanism 72 operates under the control of the control unit 80.

[0051] The position recognition device 57 includes a first imaging unit 57a and a second imaging unit 57b (described later). For example, as shown in FIG. 9A or 9B, a pair of imaging units 57a and 57b are provided at the same interval as a pair of alignment marks provided at predetermined locations on the display panel 1. In FIG. 9A, a pre-marked alignment mark PM is disposed between the electronic components 2. In FIG. 9B, pre-marked alignment marks PM are provided on both sides of the display panel 1. In this example, each imaging unit is attached to a support base 54b. Alternatively, each imaging unit does not have to be attached to the support base 54b. Each imaging unit may be configured to capture an image of the display panel 1 from above the display panel 1. The position recognition device 57 may also include a light emitting unit (not shown). For example, a pair of light emitting units may be provided at the same interval as the pair of alignment marks PM provided on both sides of the display panel 1, similar to the position recognition device 57. The light irradiation unit may be provided integrally with the pressure head 50 using a support (not shown).

[0052] Furthermore, each imaging unit may be provided with an X-direction driving unit and a Y-direction driving unit, and may be configured so that the imaging position can be changed under the control of the control unit 80 in accordance with the position of the alignment mark PM of the display panel 1. For example, the X-direction driving unit and the Y-direction driving unit are attached between the support base 54b and the imaging unit so as to be slidable in the X and Y directions, respectively.

[0053] The supply reel 58 is a mechanism for supplying the cushion sheet 8 between the crimping tool 51a and the backup tool 54a. The take-up reel 59 takes up and collects the cushion sheet 8 supplied from the supply reel 58. That is, as shown in Fig. 6, the supply reel 58 and the take-up reel 59 are configured to supply the cushion sheet 8 between the crimping tool 51a and the backup tool 54a with a predetermined tension.

[0054] When the electronic components 2 are heated and compressed during the main compression bonding, some of the melted ACF 3 may protrude from the electronic components 2 before hardening and adhere to the tip of the pressure head 50. If the ACF 3 adheres to the tip of the pressure head 50, this may result in poor compression, making it impossible to apply pressure uniformly to the electronic components 2, or the ACF 3 adhering to the tip may transfer to other electronic components 2 and cause contamination, which is undesirable.

[0055] Therefore, when final bonding of electronic component 2, final bonding unit 60a interposes cushion sheet 8 made of a heat-resistant material such as silicone resin or fluororesin between electronic component 2 and the crimping tool. This prevents the molten anisotropic conductive material from adhering to the crimping tool when final bonding unit 60a applies pressure and heat to electronic component 2. Once used, cushion sheet 8 is taken up by take-up reel 59 and collected. At this time, a new cushion sheet is supplied from supply reel 58.

[0056] Next, the configuration of the control unit 80 will be described as shown in Fig. 11. The control unit 80 is, for example, a PC (Personal Computer) in which a program for the control unit 80 is installed. A CPU (Central Processing Unit) in the present crimping device 60 executes the program of the control unit 80, thereby realizing the functions of a mechanism control unit 81, an image processing unit 82, a detection unit 83, a setting unit 84, a storage unit 85, and an input / output control unit 86. The storage unit 85 is constructed, for example, on an auxiliary storage device on an HDD (Hard Disc Drive).

[0057] The mechanism control unit 81 controls the driving of each driving unit. Specifically, the mechanism control unit 81 drives the transport stage driving mechanism 72 to move the stage 71 to a reference position. The mechanism control unit 81 may also control the stage 71 to be fixed when aligning the pressure heads 50. Furthermore, if the number of electronic components 2 to be subjected to main pressure bonding is smaller than the number of pressure heads 50, the mechanism control unit 81 may temporarily stop the operation of unnecessary pressure heads 50.

[0058] The mechanism control unit 81 also controls the driving of the pressure member 51 of the pressure head 50 and the Z-direction driving mechanism 56 to perform alignment. If the X-direction driving mechanism 61 is driven by a motor or the like, the mechanism control unit 81 also controls the driving of the X-direction driving mechanism 61 to perform alignment (since the pressure head 50 may be moved in the X direction by manual driving or by driving by a motor or the like, the X-direction driving mechanism 61 is shown by a dashed line in this block diagram).

[0059] Furthermore, the mechanism control unit 81 controls the operations of the first and second imaging units 57a and 57b to capture images of the alignment marks PM.

[0060] The image processing unit 82 recognizes the alignment marks PM from the images captured by the first and second imaging units 57 a, 57 b and calculates the amount of correction. Using a known pattern matching process, the image processing unit 82 recognizes, as the alignment marks PM of the display panel 1, images in the captured images that have a matching rate equal to or higher than a threshold value with a preset reference pattern of the alignment marks PM of the display panel 1. The image processing unit 82 calculates position data of the recognized alignment marks PM based on the camera coordinate system and calculates the amount of correction using this position data and pre-stored mounting position information of the display panel 1.

[0061] In this example, the final bonding unit 60a is configured to capture images of the left and right alignment marks based on two imaging units, the first and second imaging units 57a and 57b, but the number of imaging units is not limited to this. For example, the final bonding unit 60a may be configured to include only the first imaging unit 57a, and the image processing unit 82 may be configured to recognize the positional relationship of the display panel 1 based on one alignment mark PM provided on the display panel 1.

[0062] The detection unit 83 detects contact between the display panel 1 and the electronic component 2 based on the position of the pressure head 50 in the Z direction. After this contact detection, the mechanism control unit 81 controls the heating units 52 and 54c to heat and move them downward in the Z direction by a predetermined pushing amount, and performs main pressure bonding for a predetermined heat and pressure bonding time.

[0063] The mechanism control unit 81 also controls the supply reel 58 and the take-up reel 59 , and after the main pressure bonding, sends out a new take-up reel from the supply reel 58 and sends out the used cushion sheet 8 to the take-up reel 59 .

[0064] The input / output control unit 86 is an interface that controls signal conversion and input / output between each drive unit to be controlled.

[0065] The storage unit 85 stores information necessary for control in this embodiment. The storage unit 85 stores, for example, position data of the display panel 1, mounting position information of the electronic components 2 to be bonded, the reference position, the push-in amount, the thermocompression bonding time, and setting information input by the operator. The position data of the display panel 1 and the mounting position information of the electronic components 2 to be bonded may be stored in the storage unit 85 in advance and used, or the mounting position information calculated by the pre-compression bonding device 40 may be received by the main-compression bonding device 60 and stored in the storage unit 85.

[0066] The input unit 91 is an input means such as a switch, a touch panel, a keyboard, or a mouse that allows an operator to operate the pre-press bonding device 40 via the control unit 80. The operator can use the input unit 91 to input various pieces of information to be set in the storage unit 85.

[0067] The setting unit 84 is a processing unit that sets information in the storage unit 85 according to input. For example, the setting unit 84 stores information input from the input unit 91 as setting information in the storage unit.

[0068] The output unit 92 is an output means such as a display, a lamp, a meter, etc. that makes information for checking the status of the device visible to the operator. For example, the output unit 92 can display an input screen for information from the input unit 91.

[0069] Next, the operation of the main crimping unit 60a in the first embodiment will be described.

[0070] First, the electronic component 2 is placed on the stage 71 by a transfer arm 90 having a drive unit in the X and Y directions, with the electronic component 2 being temporarily pressure-bonded to the display panel 1. The display panel 1 is placed on the stage 71 so that it protrudes from the edge of the stage 71.

[0071] After the display panel 1 is placed on the stage 71 by the transport arm 90, the final compression bonding unit 60a moves each pressure head 50 to a position calculated based on the mounting position information of the electronic component 2. The final compression bonding unit 60a also drives the transport stage driving mechanism 72 to move the stage 71 to a reference position. Instead of moving the stage 71 to the reference position, the final compression bonding unit 60a may use the imaging unit to move the alignment mark to a range where it can be imaged.

[0072] After moving the transfer stage 70 to the reference position, the final bonding unit 60a operates the position recognition device 57 to capture an image of the alignment mark PM on the display panel 1. The control unit 80 uses image processing to recognize misalignment of the alignment mark from the captured image, compares it with the mounting position information, and calculates a correction amount to correct this misalignment. The final bonding unit 60a fine-tunes the position of the transfer stage 70 using the pre-stored mounting position information and correction amount. For example, the final bonding unit 60a fine-tunes the position of the transfer stage 70 so that the central bonding position of the display panel 1 corresponds to the reference position. After fine-tuning the position of the transfer stage 70, the final bonding unit 60a moves the pressure member 51 and the crimping tool 51a to position it in the required position relative to the electronic component 2. This completes the alignment.

[0073] After the alignment is complete, the final pressure bonding unit 60a lowers the pressure head 50 and performs final pressure bonding at a predetermined pressure. After the final pressure bonding is complete, the final pressure bonding unit 60a raises the pressure head 50 and takes up the cushion sheet 8 using the take-up reel 59. The final pressure bonding unit 60a then moves the display panel 1 to the discharge position of the final pressure bonding device 60.

[0074] Next, as shown in FIG. 10, the positioning operation of the pressure head 50 in the first embodiment will be described.

[0075] FIG. 10 shows an example of performing full-pressure bonding on three electronic components 2 arranged in a curve on a display panel 1 at the same time. FIG. 10(A) shows an example of positioning the pressure head 50, FIG. 10(B) shows an example of moving the transfer stage 70 to a position within the imaging range of the electronic components 2, FIG. 10(C) shows an example of moving the transfer stage 70 to the bonding position while taking into account a correction amount, and FIG. 10(D) shows an example of retracting the transfer stage after bonding is complete. The intersection of the dashed lines in the figure represents the reference position. In this example, of the three electronic components 2 on the display panel 1, the central one is electronic component 2a, the one on the -X direction is electronic component 2b, and the one on the +X direction is electronic component 2c.

[0076] In cases where the final pressure bonding device 60 receives mounting position information of the electronic components 2 pre-bonded to the display panel 1 from the temporary pressure bonding device 40, or where the final pressure bonding unit 60a stores the mounting position information of the electronic components 2 in advance, it is preferable to position the pressure heads 50 in advance before the display panel 1 is transported. In FIG. 10A , each pressure head 50 is moved to a position calculated based on the mounting position information of the electronic components 2. At this time, each pressure head 50 is positioned at the pressure bonding position so that the center of the central electronic component 2a coincides with the reference position. As shown in FIG. 9B , in the case of an electronic component 2 having a notch in the center, each pressure head 50 may be positioned at the pressure bonding position so that the center of the electronic component 2 coincides with the reference position.

[0077] When each pressure head 50 is positioned at the pressure bonding position, as shown in FIG. 10B, the transfer stage 70 is moved to a position where an image of the alignment mark PM can be captured.

[0078] After the transfer stage 70 has moved, the control unit 80 calculates the amount of correction based on the imaging results of the first and second imaging units 57 a and 57 b, and fine-tunes the position of the transfer stage 70 based on the calculated amount of correction and the mounting position information of the electronic component 2.

[0079] Once the fine adjustment of the transfer stage 70 is complete, as shown in FIG. 10(C), the pressure member 51 of each pressure head 50 is moved in the θ direction, or the crimping tool 51a is moved in the Y direction, to position it in the orientation required for crimping. In FIG. 10(C), the pressure member 51 and the crimping tool 51a are moved for the pressure heads 50 corresponding to the electronic components 2b and 2c. This movement is performed using the mounting position information and correction amount for the electronic components 2. The upper part of FIG. 10(C) shows the orientation of each pressure member 51 and the crimping tool 51a. After the alignment of each pressure head 50 with the electronic component 2 is completed, each pressure head 50 moves in the Z direction to crimp the electronic component 2 with a predetermined pressure. This completes the final crimping by the final crimping device 60.

[0080] When the final pressure bonding of the electronic component 2 is completed, the transfer stage 70 moves the display panel 1 to the discharge position of the final pressure bonding device 60, as shown in FIG. 10(D).

[0081] Furthermore, if the mounting position information of the electronic components 2 is not used, it is conceivable that the control unit 80 calculates the position data of each crimping location (in this example, three electronic components 2) using the imaging results of the first and second imaging units 57 a and 57 b. In this case, the control unit 80 may align the pressure head 50 based on the calculated position data.

[0082] In this embodiment, the control unit 80 includes a processor such as a CPU, a main storage device such as a RAM, an auxiliary storage device such as an HDD, a network interface such as a LAN (Local Area Network) board, device interfaces such as a memory slot and a memory port, and a bus that connects these devices to each other. The control unit 80 is, for example, a computer such as a PC, and includes input units such as a keyboard and a mouse, and an output unit such as a display.

[0083] The control unit 80 may include, for example, multiple processors, which allows multiple operations to be performed in parallel.

[0084] In this embodiment, a program for causing a computer to execute information processing by the control unit 80 is installed in an auxiliary storage device. The control unit 80 loads this program into the main storage device and executes it using a processor. This enables the functions of each block shown in FIG. 12 to be realized within the control unit 80, enabling the above-described alignment of the pressure head 50 and the main pressure bonding operation. Note that data generated by this information processing is temporarily held in the main storage device or stored and saved in the auxiliary storage device.

[0085] This program can be installed, for example, by attaching an external device on which the program is recorded to a device interface and storing the program from the external device in an auxiliary storage device. Examples of external devices include computer-readable recording media and recording devices that incorporate such recording media. Examples of recording media include CD-ROMs (Compact Disk Read Only Memory), CD-Rs (Compact Disk Recordable), flexible disks, DVD-ROMs (Digital Versatile Disk Read Only Memory), and DVD-Rs (Digital Versatile Disk Recordable), and an example of a recording device is a HDD. Furthermore, this program can be installed, for example, by downloading the program via a network interface.

[0086] Next, the main pressure bonding in the first embodiment will be described with reference to a flowchart shown in FIG.

[0087] In this embodiment, the control unit 80 performs the main pressure bonding operation, assuming that the initial state is one in which the display panel 1 is placed on the stage 71 by the transport arm 90 so that the edges of the display panel 1 extend beyond the stage 71, and the pressure head 50 is moved to a position calculated from the mounting position information of the electronic components 2. In this embodiment, the pressure head 50 is assumed to have been manually moved to a predetermined position in advance by the X-direction drive mechanism 61. The reference position, the position data of the display panel 1, and the mounting position information of the electronic components 2 are assumed to be loaded into memory when the program of the control unit 80 is executed. The pressure head 50 is assumed to be numbered 1 to n (n is an integer equal to or greater than 1) and numbered.

[0088] In step S1, the transfer stage driving mechanism 72 is driven to move the transfer stage 70 to a reference position (see FIG. 10A). In step S2, the mechanism control unit 81 operates the first imaging unit 57a and the second imaging unit 57b to move the alignment mark PM on the display panel 1 to a range where the alignment mark PM can be imaged, and then images the alignment mark PM on the display panel 1 (see FIG. 10B).

[0089] In step S3, the image processing unit 82 performs image processing on the images captured by the first imaging unit 57a and the second imaging unit 57b to recognize the alignment mark PM. The image processing unit 82 obtains position data for the recognized alignment mark PM based on the camera coordinates. The image processing unit 82 compares this recognized position data with mounting position information for the electronic component 2 to calculate a correction amount for correcting misalignment with the alignment mark. In step S4, the mechanism control unit 81 uses the mounting position information and correction amount for the electronic component 2 to move the transfer stage 70 in the X, Y, and θ directions to perform fine position adjustment. Furthermore, the mechanism control unit 81 also uses the mounting position information and correction amount for the electronic component 2 to drive the drive mechanisms of the first to nth pressure heads in parallel to align the corresponding electronic component 2 in the required orientation.

[0090] In step S5, after aligning each pressure head 50, the mechanism control unit 81 lowers the pressure heads 50. The detection unit 83 detects contact between the pressure bonding tool 51a and the display panel 1, and after detecting contact, heats the heating units 52 and 54c. The mechanism control unit 81 presses the electronic component 2 with the pressure bonding tool 51a at a predetermined pressure for a predetermined heat and pressure bonding time, thereby performing final pressure bonding. After final pressure bonding is completed, the mechanism control unit 81 raises the pressure heads 50 and winds up the cushion sheet 8 using the take-up reel 59. In step S6, the mechanism control unit 81 controls the final pressure bonding unit 60a to move the display panel 1 to the discharge position of the final pressure bonding device 60.

[0091] FIG. 13 is another diagram illustrating the positioning of the pressure head 50 in the first embodiment.

[0092] These figures show the positioning of the transfer stage 70 and pressure head 50 to the electronic components 2a, 2b, and 2c arranged on the display panel 1. The lower figures in these figures show the main compression bonding unit 60a as seen from the +Z direction, and the upper figures show the main compression bonding unit 60a as seen from the -X direction.

[0093] 13(A) to 13(D), the description of the portions that are the same as those in FIG. 10(A) to 10(D) will be omitted. Unlike FIG. 10, at the stage of FIG. 13(B), the pressure member 51 is moved in the θ direction or the crimping tool 51a is moved in the Y direction based on the images captured by the first imaging unit 57a and the second imaging unit 57b.

[0094] The upper part of Fig. 13(A) shows the operation of the pressure head 50 moving to the reference position. The upper part of Fig. 13(B) shows the operation of the transfer stage 70 moving to the reference position. Alternatively, the transfer stage 70 may move to a position where an image of the alignment mark PM of the display panel 1 on the stage 71 can be captured. The upper part of Fig. 13(C) shows the operation of the pressure head 50 performing the final pressure bonding. The upper part of Fig. 13(D) shows the operation of the display panel 1 moving to the discharge position of the final pressure bonding device 60 after the completion of the final pressure bonding.

[0095] In the above-described full-crimping device 60, the configuration has been described in which the crimping tool 51a moves in the Y direction in the full-crimping unit 60a. Instead of immobilizing the crimping tool 51a, the pressure head 50 may be provided with a Y-direction drive mechanism that moves an upper portion of the pressure head 50, such as a pressure cylinder 55 and an actuation rod 55a, in the Y direction. By immobilizing the tip of the crimping tool 51a, the pressure head 50 can increase the rigidity of the crimping tool 51a.

[0096] Furthermore, the Y-direction drive mechanism and the θ-direction drive mechanism of the pressure bonding tool 51 a described above may be used not only in the full pressure bonding device 60 but also in the pre-press bonding device 40 .

[0097] According to this embodiment, the final compression bonding device 60 includes a plurality of pressure heads 50, and the pressure heads 50 move in the Y direction, which is the direction in which they move toward and away from the display panel 1 held on the conveying stage 70, and in the θ direction, which is the axis of the vertical direction. As a result, even when the electronic components 2 are arranged along the edge of the display panel 1 in a collinear or non-collinear manner, the final compression bonding device 60 can perform final compression bonding all at once in accordance with the shape of the display panel 1 without moving the conveying stage 70, thereby shortening the takt time.

[0098] The pressure head 50 is equipped with a plurality of pressure members 51, each of which operates under the control of the control unit 80, and is capable of heat-pressure bonding electronic components 2 that are arranged in the same line or in a non-single line along the edge of the display panel 1, or electronic components 2 that are arranged in a mixed manner in the same line and in a non-single line along the edge of the display panel 1. The pressure members 51 are equipped with movable pressure-bonding tools 51a at their tips, and these members can move in the Y and θ directions to pressurize electronic components 2 that are arranged in a non-single line along the edge of the display panel 1, such as a display panel 1 that includes a notch or curved portion on the edge.

[0099] When the full-compression bonding unit 60a is aligned by moving the conveying stage 70, time is required for the vibrations of the display panel 1 that occur during the movement to settle, and the takt time is correspondingly longer. This time tends to become longer as the size of the display panel 1 increases. Furthermore, in the case of a display panel 1 having a curved portion as shown in FIG. 9(A) or a display panel 1 having a notched portion as shown in FIG. 9(B), the movement of the conveying stage 70 becomes more complex and the movement distance becomes longer compared to simple linear movement, and the displacement of the display panel 1 caused by this movement also becomes larger.

[0100] Furthermore, since the main crimping unit 60a heats the backup tool 54a to perform the main crimping, when the conveying stage 70 is moved and aligned and then the main crimping is performed at each location, the ACF 3 attached to the electronic component 2 located near the electronic component 2 to be crimped may harden due to heat conduction from the backup tool 54a.

[0101] On the other hand, the final bonding unit 60a in this embodiment moves each pressure head 50 in accordance with the shape of the display panel 1 to collectively final bond a plurality of electronic components 2. Therefore, there is no risk that the ACF 3 attached to electronic components 2 located near the electronic components 2 to be bonded will harden due to heat conduction from the backup tool 54a.

[0102] Furthermore, in the present embodiment, the final bonding unit 60a moves the pressure head 50 while the conveying stage 70 is fixed and not moved, and aligns it with the electronic component 2 to perform final bonding, thereby eliminating factors that cause vibration in the display panel 1 and shortening the takt time. Compared to performing final bonding at one location at a time, the final bonding device 60 can prevent the ACF 3 attached to electronic components 2 located near the electronic component 2 to be bonded by the backup tool 54a from hardening, thereby preventing product defects.

[0103] Second Embodiment FIG. 14 is a diagram showing a schematic configuration of a main crimping unit 60a in a second embodiment.

[0104] In this embodiment, the main pressure bonding unit 60a is provided with a Y-direction drive mechanism that moves the upper part of the pressure head 50 (in this example, the pressure cylinder 55 and the actuation rod 55a) in the Y direction, and the pressure head 50 moves in the Y direction under the control of the control unit 80. This Y-direction drive mechanism can be realized by, for example, a linear motion mechanism composed of a motor, a ball screw, etc., so as to push the pressure head 50 in the Y direction.

[0105] Furthermore, the pressure head 50 is capable of replacing the crimping tool 51a with one having a different tip position and angle.

[0106] Next, as shown in FIG. 15, an example of a pressure member 51 according to a second embodiment will be described.

[0107] Fig. 15(A) is an enlarged perspective view of a pressure member 51 in which a crimping tool 51a is arranged in the center, Fig. 15(B) is a view of the pressure member 51 in Fig. 15(A) as viewed from the -Z direction, which is the crimping surface side, Fig. 15(C) is a view of the pressure member 51 as viewed from the -Z direction, which is the crimping surface side, in which the crimping tool 51a is arranged in a position tilted at 45 degrees from the Z direction, and Fig. 15(D) is a view of the pressure member 51 as viewed from the -Z direction, which is the crimping surface side, in which the crimping tool 51a is arranged in a position off-center in the Y direction.

[0108] For example, when an electronic component 2 is placed in a notch portion of a display panel 1 as shown in FIG. 1D , the pressure head 50 can employ a pressure member 51 having the shape shown in FIG. 15B or FIG. 15D . For example, a pressure member 51 having a different depth as shown in FIG. 15D may be employed for crimping an electronic component 2 placed in a notch portion. Furthermore, when an electronic component 2 is placed at a rotation angle in the θ direction, such as when an electronic component 2 is placed in a curved portion of a display panel 1 as shown in FIGS. 1A to 1C , the pressure head 50 can employ a pressure member 51 having the shape shown in FIG. 15C . For example, a pressure member 51 having a different angle as shown in FIG. 15D may be employed for crimping an electronic component 2 placed in a curved portion. For example, the pressure member 51 can be replaced by an operator when the crimping device 60 is stopped. In this example, the pressure member 51 can be replaced by fastening a screw into a screw hole 51b provided in the pressure member 51.

[0109] FIG. 16 shows an example of how the pressure member 51 is attached in the second embodiment.

[0110] In this example, four pressure heads 50 are used with pressure members 51 having the shape shown in Fig. 15(D). Of the four pressure heads 50, the circled pressure head 50 has a crimping tool 51a attached to it rotated by 180 degrees (i.e., the crimping tool 51a is positioned so that it approaches the display panel 1). By changing the attachment direction by 180 degrees in this way, it is possible to use only one type of pressure member 51 to perform final crimping of the display panel 1 having electronic components 2 arranged in the notch portion.

[0111] Next, the positioning of the pressure head in the second embodiment will be described with reference to FIG.

[0112] FIG. 17 shows an example in which three electronic components 2 arranged on a display panel 1 are subjected to full-pressure bonding simultaneously. In the second embodiment, the display panel 1 has the central electronic component 2 positioned in a notch portion of the display panel 1. FIG. 17(A) shows the operation of positioning the pressure head 50, FIG. 17(B) shows the operation of moving the transfer stage 70 to a position within the imaging range of the electronic components 2, FIG. 17(C) shows the operation of moving the transfer stage 70 to the bonding position while taking into account the correction amount, and FIG. 17(D) shows the operation of retracting the transfer stage after bonding is complete. The intersections of the dashed lines in the figure represent reference positions. In this example, of the three electronic components 2 on the display panel 1, the central one is electronic component 2a, the one on the -X direction is electronic component 2b, and the one on the +X direction is electronic component 2c.

[0113] In cases where the final pressure bonding device 60 has received mounting position information of the electronic components 2 pre-bonded to the display panel 1 from the preliminary pressure bonding device 40, or where the final pressure bonding unit 60a has stored the mounting position information in advance, it is preferable to position the pressure heads 50 in advance before the display panel 1 is transported. In Fig. 17(A) , the control unit 80 moves each pressure head 50 to a position calculated based on the mounting position information of the electronic components 2. At this time, the control unit 80 positions each pressure head 50 at the pressure bonding position so that the centers of the electronic components 2b and 2c on both sides coincide with the reference position.

[0114] In FIG. 17B, the transfer stage 70 moves to a position where the alignment mark PM can be imaged.

[0115] 17C, the control unit 80 calculates the amount of correction based on the imaging results of the first and second imaging units 57 a and 57 b. The control unit 80 also fine-tunes the position of the transfer stage 70 using the amount of correction and the mounting position information.

[0116] 17C, the pressure heads 50 are moved in the Y direction, and each pressure head 50 is aligned to correspond to the electronic component 2. In this example, the pressure head 50 corresponding to the electronic component 2a is moved. This movement is performed using the mounting position information and the correction amount. After the alignment of the pressure heads with the electronic component 2 is completed in this way, the final compression bonding is performed by the final compression bonding device 60.

[0117] In FIG. 17D , the control unit 80 moves the transfer stage 70 to move the display panel 1 to the discharge position of the main pressure bonding device 60 .

[0118] The configuration of the control unit 80 and the flowchart in this embodiment can be the same as those in the first embodiment, and therefore a description thereof will be omitted.

[0119] The final crimping unit 60a can achieve final crimping of the electronic component 2 at the notch portion by using the pressure member 51 having the shape shown in Fig. 15(B) or 15(D). Furthermore, the final crimping unit 60a can achieve final crimping of the electronic component 2 that is arranged with a rotation angle in the θ direction, such as a curve of the pressure head 50, by using the pressure member 51 having the shape shown in Fig. 15(C).

[0120] The final pressure bonding unit 60a may use a combination of multiple pressure heads 50 and pressure members 51 of different shapes. Furthermore, the final pressure bonding unit 60a may include a pressure head 50 that does not control movement in the Y direction, depending on the shape of the display panel 1, during alignment.

[0121] 15(B) to 15(D) are merely examples, and the shape of the pressure member 51 is not limited to these. The pressure bonding tool 51 a may be provided at any position relative to the pressure bonding surface depending on the shape of the display panel 1 and the arrangement of the electronic components 2.

[0122] According to this embodiment, the full-compression bonding device 60 has a pressure head 50 that moves in the Y direction, and the pressure head 50 is equipped with a pressure member 51 that can be replaced with various shapes. As a result, the full-compression bonding device 60 can fully compress electronic components 2 that are arranged non-linearly along the edge of the display panel 1 all at once without moving the conveying stage 70. Furthermore, the full-compression bonding device 60 can reduce the number of drive units of the pressure head 50 and increase rigidity compared to the first embodiment.

[0123] Third Embodiment FIG. 18 is a plan view showing a schematic configuration of a display panel according to a third embodiment.

[0124] In this embodiment, the final pressure bonding device 60 performs final pressure bonding on multiple display panels 1 in parallel. In the following example, an example in which the final pressure bonding device 60 performs final pressure bonding on two display panels 1 will be described with reference to FIG. 19 . For ease of explanation, the display panel 1 on the left side of the figure will be referred to as display panel 1, and the display panel 1 on the right side will be referred to as display panel 1′. In this example, the display panel 1 and the display panel 1′ are each transported to a reference position with electronic components 2 pre-pressed at two points on their curved portions. In this example, the position data for the display panel 1 and the display panel 1′ used to align the pressure head 50 with the electronic components 2 will be described as having been stored in advance in the storage unit 85.

[0125] In this embodiment, the permanent pressure bonding unit 60a includes a first imaging unit 57a, a second imaging unit 57b, a third imaging unit 57c, and a fourth imaging unit 57d as position recognition devices. Other configurations may be the same as those in the first and second embodiments. In this example, the permanent pressure bonding unit 60a includes four imaging units to capture images of the two alignment marks PM on both sides of the curves of each of the display panels 1 and 1′. However, the number of position recognition devices is not limited to this example. For example, the permanent pressure bonding unit 60a may include any number of position recognition devices for capturing images of each of the display panels 1 and 1′, such as capturing images using a single imaging unit.

[0126] In this embodiment, the main crimping unit 60a will be described as to a flow in which the main crimping unit 60a simultaneously performs main crimping on four crimping locations using up to the fourth pressure head among the first to nth pressure heads.

[0127] First, in step S11, the transfer stage driving mechanism 72 drives the transfer stage 70 to a position where the alignment mark PM on the display panel 1 can be imaged by the first imaging unit 57a, the second imaging unit 57b, the third imaging unit 57c, and the fourth imaging unit 57d. After the transfer stage 70 has moved to a position where the alignment mark PM on the display panel 1 can be imaged, the transfer stage 70 is temporarily fixed during alignment. In step S12, the alignment mark PM on the display panel 1 is imaged by the first imaging unit 57a and the second imaging unit 57b. In parallel, the alignment mark PM on the display panel 1' is imaged by the third imaging unit 57c and the fourth imaging unit 57d.

[0128] In step S13, the image processing unit 82 performs image processing on the images captured by the first imaging unit 57a and the second imaging unit 57b to recognize the alignment marks PM. The image processing unit 82 calculates position data of the recognized alignment marks PM based on the camera coordinate system. The image processing unit 82 also performs image processing on the images captured by the third imaging unit 57c and the fourth imaging unit 57d to recognize the alignment marks PM. The image processing unit 82 calculates position data of the recognized alignment marks PM based on the camera coordinate system and calculates a correction amount using this recognized position data and mounting position information of the electronic components 2 on the display panel 1'. The correction amount is calculated using this recognized position data and mounting position information of the electronic components 2 on the display panel 1. In step S14, the transfer stage 70 is moved using the mounting position information of the electronic components 2 and the calculated correction amount to perform alignment. In this example, of the first to fourth pressure heads arranged in order from the left of the main pressure bonding unit 60a, the first and second pressure heads align the display panel 1, and the third and fourth pressure heads align the display panel 1'.

[0129] In step S15, after the alignment of each pressure head 50 is completed, the pressure head 50 is lowered. The detection unit 83 detects contact between the pressure bonding tool 51a and the display panel 1, and after contact is detected, the heating units 52 and 54c are heated. The pressure bonding tool 51a presses the electronic component 2 with a predetermined pressure for a predetermined heat and pressure bonding time to perform final pressure bonding. After final pressure bonding is completed, the pressure head 50 is raised and the cushion sheet 8 is taken up by the take-up reel 59. In step S16, the transfer stage 70 is moved to move the display panel 1 to the discharge position of the final pressure bonding device 60.

[0130] According to this embodiment, the final compression bonding device 60 controls the multiple pressure heads 50 by the control unit 80 and performs final compression bonding of multiple display panels 1 in parallel. As a result, the final compression bonding device 60 can collectively final-compression bond the electronic components 2 arranged on the display panels 1 and 1' without moving the transfer stage 70, thereby further shortening the takt time.

[0131] Although several embodiments have been described above, these embodiments are presented only as examples and are not intended to limit the scope of the invention. The novel crimping device and the like described in this specification can be embodied in various other forms. Furthermore, various omissions, substitutions, and modifications can be made to the forms of the crimping device described in this specification without departing from the spirit of the invention. The appended claims and their equivalents are intended to include such forms and modifications that fall within the scope and spirit of the invention.

[0132] 1: Display panel 1, 1': Display panel 2: Electronic component, 3: ACF, 8: Cushion sheet, 10: OLB device, 20: ACF application device, 31: Base material, 32: Conductive particles, 40: Pre-compression bonding device, 50: Pressure head, 51: Pressure member, 51a: Compression bonding tool, 51b: Screw hole, 52: Heating unit, 53: Pressure adjustment unit, 54: Backup unit, 54a: Backup tool, 54b: Support base, 54c: Heating unit, 55: Pressure cylinder, 55a: Actuating rod, 55b: Lifting block, 56: Z-direction drive mechanism, 56a: Pressure control unit, 56b: Supply source, 56c: Z-direction guide rail, 57: Position recognition device, 57a: First imaging unit, 57b: Second imaging unit, 57c: Third imaging unit, 57d: fourth imaging section, 58: supply reel, 59: take-up reel, 60: final pressure bonding device, 60a: final pressure bonding unit, 61: X-direction driving mechanism, 70: transport stage, 71: stage, 72: transport stage driving mechanism, 80: control section, 81: mechanism control section, 82: image processing section, 83: detection section, 84: setting section, 85: memory section, 86: input / output control section, 91: input section, 92: output section, PM: alignment mark, ER: electrode array, TR: terminal array

Claims

1. A crimping device comprising: a stage section on which a display panel is placed so that its edges extend beyond the display panel; a plurality of pressure head sections that are movable on the placement surface of the stage section in a first direction and a second direction that intersect with each other and in a third direction that intersects with the first and second directions, and that heat and crimp a plurality of electronic components arranged along the edge of the display panel; a backup section that is provided opposite the plurality of pressure head sections in the third direction, and that supports and heats the edge of the display panel from below in the third direction; and a control section that controls the plurality of pressure head sections, wherein the control section aligns the plurality of pressure head sections with the positions at which the plurality of electronic components are to be arranged based on mounting position information of the plurality of electronic components arranged on the display panel, and controls the crimping of the plurality of electronic components collectively.

2. The crimping device described in claim 1, characterized in that the control unit controls the alignment of the multiple pressure head units to positions where the multiple electronic components are to be placed, using a correction amount calculated from the mounting position information of the electronic components and the deviation from the display panel placed on the stage unit.

3. The crimping device according to claim 1, wherein a crimping tool included in the pressure head and having a crimping surface for crimping the electronic component at its tip moves in the second direction.

4. The crimping device according to claim 3, characterized in that a pressure member included in the pressure head unit, which presses the electronic component against the display panel and has the crimping tool at its tip, further moves in a rotational direction around the third direction as an axis.

5. The crimping device according to claim 3, wherein the crimping position or crimping angle of the crimping tool can be changed by replacing it.

6. The crimping device described in claim 1, characterized in that the control unit controls the alignment of the multiple pressure head units to the positions where the multiple electronic components are placed based on mounting position information of the multiple electronic components placed on the multiple display panels.

7. A crimping device according to any one of claims 1 to 6, characterized in that the control unit further controls the stage unit to be fixed when aligning the multiple pressure head units.

8. A crimping device as described in any one of claims 1 to 6, characterized in that the plurality of electronic components are arranged along the edge of the display panel in a mixture of collinear and non-collinear arrangements.

9. A crimping device according to any one of claims 1 to 6, characterized in that the electronic components are arranged in a non-colinear manner along the edge of the display panel.

Images