Photoelectric element encapsulation film, and photoelectric cell, photoelectric element encapsulation apparatus and encapsulation method using same

Abstract

The photoelectric element encapsulation film comprises: a release film; a conductive adhesive layer spaced apart from and bonded to the release film; a conductive film bonded to the conductive adhesive layer; a thermo-compression film inserted into a separation space in a laminate of the conductive adhesive layer and the conductive film; and a barrier film bonded to the thermo-compression film and the conductive film.

Description

Photoelectric element encapsulation film, and photoelectric cell using the same, photoelectric element encapsulation device and encapsulation method

[0001] The present invention relates to a photoelectric device. More specifically, the present invention relates to a photoelectric device encapsulation film, a photoelectric cell using the film, a photoelectric device encapsulation device, and a method for encapsulating the film.

[0002] A photovoltaic device, such as a solar cell, is a photovoltaic device that converts solar energy into electrical energy.

[0003] Photovoltaic devices can be broadly categorized into inorganic and organic photovoltaic devices, with organic photovoltaic devices being the most common. Organic photovoltaic devices, such as organic solar cells, contain organic materials such as organic semiconductors. Organic materials are easily degraded by oxygen and moisture, making it essential to seal them from the external environment. This sealing process utilizes a roll-to-roll printing process, bonding a barrier film to a photovoltaic device film, such as a PV (photovoltaic) device.

[0004] However, in the process of bonding a barrier film to a photovoltaic film, forming a bus bar, the common electrode, in a continuous process is difficult using a roll-to-roll printing process, posing productivity challenges. Furthermore, performing a separate, discontinuous process to form the bus bar increases the risk of exposure of the organic material to oxygen or moisture, potentially leading to durability issues.

[0005] The purpose of the present invention is to prevent exposure of organic materials to oxygen or moisture by eliminating the need to separately perform a process of forming a bus bar in a process of bonding a barrier film to a photoelectric element film.

[0006] The purpose of the present invention is to maximize the effect of shielding oxygen (air) or moisture by strengthening the connection between the bus bar and the substrate electrode (lower electrode or transparent electrode).

[0007] The photoelectric element encapsulation film of the present invention for achieving this purpose includes a release film, a conductive adhesive layer, a conductive film, a heat-compression film, a barrier film, etc.

[0008] The release film protects the conductive adhesive layer, heat-compression film, etc. that is bonded to the upper portion, and may be, for example, a silicone release layer formed on a polyimide film.

[0009] The challenging adhesive layer simultaneously implements adhesive and conductive functions, and can be spaced and bonded on a release film.

[0010] The conductive film is a conductor through which electricity flows and can be bonded to a conductive adhesive layer.

[0011] The thermocompression film is used to protect the photoelectric element and can be inserted (bonded) into the gap between the conductive adhesive layer and the laminate of the conductive film.

[0012] A barrier film protects a photoelectric element from external moisture or oxygen (air), and can be bonded to a thermocompression film and a conductive film.

[0013] In the photoelectric element encapsulation film of the present invention, the conductive adhesive layer includes conductive particles and can have a thickness of 5 to 100 μm and an adhesive strength of 0.1 N / 25 mm or more.

[0014] In the photoelectric element encapsulation film of the present invention, the conductive film may be a bus bar that connects a plurality of photoelectric elements connected in series in parallel.

[0015] The photoelectric cell according to the present invention may include a photoelectric element encapsulation film, a photoelectric element, a transparent electrode, a substrate, etc.

[0016] The photoelectric element encapsulation film may be the photoelectric element encapsulation film described above.

[0017] A photovoltaic device is a device that converts solar energy into electrical energy, and can be embedded in a thermally compressed film of a photovoltaic device encapsulation film.

[0018] The transparent electrode functions as the lower electrode of the photovoltaic device and can be bonded to the lower portion of the photovoltaic device.

[0019] The substrate can be bonded to the lower portion of the transparent electrode and support a transparent electrode bonded to the upper portion.

[0020] In the photoelectric cell of the present invention, the substrate may have flexibility.

[0021] In the photovoltaic cell according to the present invention, the photovoltaic element may be an inverted structure organic solar cell. The inverted structure organic solar cell may include an electron transport layer bonded to a transparent electrode, a photoactive layer bonded to the electron transport layer, a hole transport layer bonded to the photoactive layer, and an upper electrode bonded to the hole transport layer.

[0022] In the photoelectric cell of the present invention, the photoelectric elements may be configured in a plurality of series-connected configurations.

[0023] The photoelectric element encapsulation device according to the present invention may include an encapsulation film unwinding roll, a first guide roll, a second guide roll, an element film unwinding roll, a third guide roll, a pair of nip rolls, a pressing roll, etc.

[0024] The bagging film winding roll can wind the photoelectric element bagging film described above.

[0025] The first guide roll can change the moving direction of the release film by peeling the release film from the moving photoelectric element encapsulation film.

[0026] The second guide roll can change the direction of movement of the photoelectric element encapsulation film from which the release film has been peeled off.

[0027] The photovoltaic film extrusion roll can extrude a photovoltaic film including a substrate, a transparent electrode bonded to the substrate, and a photovoltaic element bonded to the transparent electrode.

[0028] The third guide roll can change the direction of movement of the photoelectric element film.

[0029] A pair of nip rolls can change the direction of movement while contacting the moving photoelectric element sealing film and the photoelectric element film.

[0030] The compression roll can press the photoelectric element sealing film and the photoelectric element film that are moved in close contact to insert the photoelectric element into the thermal compression film.

[0031] The photoelectric element packaging device of the present invention may include a release film winding roll for winding a peeled release film.

[0032] In the photoelectric element packaging device of the present invention, the compression roll may be a thermal compression roll that applies pressure and heat simultaneously.

[0033] The photoelectric element sealing device of the present invention may include a photoelectric element sealing film and a compression film winding roll that winds up a compression film in which the photoelectric element film is compressed.

[0034] The photoelectric element encapsulation method according to the present invention may include a step of preparing a photoelectric element encapsulation film, a step of preparing a photoelectric element film, a step of bonding the photoelectric element encapsulation film to the photoelectric element film, etc.

[0035] The steps for preparing a photoelectric element encapsulation film can prepare the photoelectric element encapsulation film described above.

[0036] The step of preparing a photovoltaic device film can prepare a photovoltaic device film including a substrate, a transparent electrode bonded to the substrate, and a photovoltaic device bonded to the transparent electrode.

[0037] The step of bonding the photoelectric element encapsulation film to the photoelectric element film may include moving the photoelectric element encapsulation film while removing the release film from one side, moving the photoelectric element film from the other side, and then bonding the photoelectric element encapsulation film to the photoelectric element film while inserting the photoelectric element into the thermal compression film of the photoelectric element encapsulation film by thermal compression.

[0038] In the photoelectric element encapsulation method of the present invention, the step of bonding the photoelectric element encapsulation film to the photoelectric element film may include the step of removing a release film from the photoelectric element encapsulation film using a first guide roll, the step of changing the moving direction of the photoelectric element encapsulation film using a second guide roll, the step of changing the moving direction of the photoelectric element film using a third guide roll, the step of changing the moving direction while bringing the photoelectric element encapsulation film and the photoelectric element film into close contact using a pair of nip rolls, and the step of thermally compressing the photoelectric element encapsulation film and the photoelectric element film that are in close contact using a thermal compression roll.

[0039] The present invention comprises a barrier film and a bus bar integrally formed on a sealing film and bonding this to a photoelectric element film in a roll-to-roll manner. This eliminates the need for a separate process of forming a bus bar when sealing a photoelectric element in a roll-to-roll manner, thereby simplifying the process and improving productivity.

[0040] The present invention can maximize the shielding effect of oxygen (air) or moisture by forming a strong electrical / hermetic connection between a bus bar and a transparent electrode (lower electrode) through a conductive adhesive layer.

[0041] Figure 1 is a cross-sectional view of a photoelectric element sealing film according to the present invention and a photoelectric cell manufactured using the same.

[0042] Figure 2 illustrates a device and method for encapsulating a photoelectric element using a photoelectric element encapsulation film according to the present invention.

[0043] Hereinafter, the present invention will be described in detail with reference to the attached drawings.

[0044] Figure 1 is a cross-sectional view of a photoelectric element sealing film according to the present invention and a photoelectric cell manufactured using the same.

[0045] As shown in (a) of Fig. 1, the photoelectric element encapsulation film (10) according to the present invention may include a release film (11), a conductive adhesive layer (12), a conductive film (13), a thermal compression film (14), a barrier film (15), etc.

[0046] The heteromorphic film (11) protects the conductive adhesive layer (12) and the heat-compressed film (14) that are bonded to the upper portion, and can be bonded to the lower portion thereof.

[0047] The release film (11) may be, for example, a polyimide film formed with a silicone release layer (adhesive layer). The silicone release layer may be a composition for forming a silicone release layer containing a silicone resin. The silicone resin is a curable silicone resin and may include addition type, condensation type, ultraviolet curing type, electron beam curing type, etc. The silicone resin may also be a modified silicone resin modified by graft polymerization with an organic resin such as a urethane resin, epoxy resin, or alkyd resin. The composition for forming a silicone release layer may further include a curing agent. Any curing agent capable of curing a silicone resin may be used, for example, an isocyanate curing agent, an epoxy curing agent, or a metal curing agent. The composition for forming a silicone release layer may further include a catalyst, an adhesion enhancing agent, etc., as needed.

[0048] The challenging adhesive layer (12) simultaneously implements adhesive and conductive functions and can be spaced and bonded on a release film.

[0049] The conductive adhesive layer (12) can be composed of a naturally curable conductive paste composition including conductive particles (filler), a binder containing a catechol-based compound and a laccase enzyme, and a solvent that disperses the conductive particles and is miscible with the binder. The conductive particles can be micro- or nano-sized conductive metal powders such as silver (Ag), copper (Cu), and nickel (Ni).

[0050] The conductive adhesive layer (12) may have a thickness of 5 to 100 μm and an adhesive strength of 0.1 N / 25 mm or more. If the conductive adhesive layer (12) has a thickness of less than 5 μm, the content of conductive particles is limited, making it difficult to function as a contact electrode. If the thickness exceeds 100 μm, the contact distance may become longer, which may increase resistance. If the conductive adhesive layer (12) has an adhesive strength of less than 0.1 N / 25 mm, it may be easy to peel off, making sufficient electrode contact difficult.

[0051] The conductive film (13) is a conductor through which electricity flows and can be bonded to the conductive adhesive layer (12).

[0052] The conductive film (13) can be composed of a conductive metal, such as silver (Ag), a silver alloy, copper (Cu), a copper alloy, etc., and in addition, a single conductive metal, such as gold (Au), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), tungsten (W), titanium (Ti), tantalum (Ta), iron (Fe), cobalt (Co), nickel (Ni), zinc (Zn), tellurium (Te), vanadium (V), niobium (Nb), molybdenum (Mo), or an alloy of these metals (e.g., silver-palladium-copper (APC)), can be used. The conductive film (13) can be composed in the form of nanowires, meshes, etc. to increase transparency.

[0053] The challenge film (13) may be a bus bar that connects a plurality of photoelectric elements connected in series in parallel.

[0054] The thermal compression film (14) is used to protect the photoelectric element (23) and can be inserted (bonded) into the gap between the laminate of the conductive adhesive layer (12) and the conductive film (13).

[0055] The heat-compression film (14) can use a hot melt adhesive. The hot melt adhesive is solid at room temperature and can exhibit adhesive properties while flowing when heated.

[0056] Hot melt adhesives may be based on an amorphous resin, such as an acrylic resin. The acrylic resin may be based on a resin formed by polymerizing a single acrylate monomer (acrylic homopolymer (homoacrylic polymer)).

[0057] The heat-compression film (14) can be used as one that exhibits adhesiveness by flowing at 30 to 200°C, preferably at 40 to 180°C, and more preferably at 50 to 150°C.

[0058] The barrier film (15) protects the photoelectric element (23) from external moisture or oxygen (air), covers at least the thermal compression film (14), and can also be formed on the upper surface of the conductive film (13) as needed.

[0059] The barrier film (15) can use a hot melt type EVA (Ethylene-vinyl Acetate copolymer) film. EVA is a material jointly developed by NASA and DuPont as a material for solar cells used in artificial satellites, and is currently used as a standard for solar cell encapsulation materials.

[0060] The barrier film (15) can be used without limitation as long as it is a material capable of blocking moisture and oxygen other than EVA, for example, TPU (Thermoplastic Poly Urethane), PVB (Polyvinyl Butyral), Silicon / PU (Polyurethane), etc. can be used.

[0061] As shown in (b) of Fig. 1, the photoelectric element film (20) according to the present invention may include a substrate (21), a transparent electrode (22), a photoelectric element (23), etc.

[0062] The substrate (21) supports a transparent electrode (22) that is coupled to the upper portion, and can be coupled to the lower portion of the transparent electrode (22).

[0063] It may be desirable for the substrate (21) to be composed of a flexible material that is flexible and capable of changing shape. Examples of the flexible material include polymer films such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polypropylene (PP), polyimide (PI), polyethylene sulfonate (PES), polyoxymethylene (POM), polyether ether ketone (PEEK), polyether sulfone (PES), polyether imide (PEI), acrylonitrile styrene copolymer (AS resin), acrylonitrile butadiene styrene copolymer (ABS resin), triacetyl cellulose (TAC), and polyarylate (PAR). Among these, it may be desirable to use PET, which is flexible, has high chemical stability, mechanical strength, and transparency, and is easy to change into various shapes.

[0064] The transparent electrode (22) is the lower electrode of the photoelectric element (23) and can be coupled to the lower portion of the photoelectric element (23).

[0065] The transparent electrode (22) may use a light-transmitting material, such as a metal oxide such as ITO (Indium Tin Oxide), FTO (Fluorinated Tin Oxide), IZO (Indium Zinc Oxide), AZO (Aluminum doped Zinc Oxide), ATO (Antimony Tin Oxide), or AgO, to allow light passing through the substrate (21) to reach the photoactive layer, or may use a transparent conductor such as a silver (Ag) nanowire or a silver (Ag) mesh.

[0066] In the case of an inverted structure organic solar cell, the transparent electrode (22) can function as a cathode (-) that receives electrons generated in the photoactive layer and transmits them to an external circuit.

[0067] The photovoltaic element (23) is an element that converts solar energy into electrical energy, and in the case of an inverted structure organic solar cell, it may include an electron transport layer bonded to a transparent electrode (22), a photoactive layer bonded to the electron transport layer, a hole transport layer bonded to the photoactive layer, and an upper electrode bonded to the hole transport layer.

[0068] The electron transport layer can usually be made of an inorganic oxide with a large work function, such as zinc oxide (ZnO), titanium dioxide (TiO2), tin dioxide (SnO2), or cesium carbonate (Cs2CO3).

[0069] In the case of small molecules, the photoactive layer can be used by stacking a donor and an acceptor, and in the case of high molecules, the donor and acceptor can be dissolved in a solvent such as chlorobenzene or dichlorobenzene (1,2-di(ethenyl)benzene), mixed, and then formed into a single thin film.

[0070] The photoactive layer can be composed of a high-efficiency ternary blend organic material, such as PM6:Y6:PCBM60. Here, PM6 can function as a donor, and Y6 and PCBM60 can function as acceptors. The weight ratio of donor:acceptor can be, for example, 1:05 to 1:4.

[0071] The photoactive layer can be formed by vacuum deposition, solution processing, etc. Solution processing methods include spin coating, slot die coating, ink jet printing, and screen printing.

[0072] The hole transport layer can use organic, inorganic, or organic-inorganic composite materials. For example, PEDOT:PSS (Poly(3,4-ethylenedioxythiophene:poly(styrenesulfonate)), MoO3, WO3, V2O5, NiO, etc. can be used.

[0073] The hole transport layer can be formed by a method such as vacuum deposition.

[0074] The upper electrode functions as an anode (+), collecting holes and transmitting them to an external circuit, and can be made of a conductive metal such as copper (Cu), silver (Ag), gold (Au), tungsten (W), nickel (Ni), or titanium (Ti).

[0075] The upper electrode can be formed by a method such as vacuum deposition, electron beam deposition, sputtering, ion plating, or chemical deposition, or can be formed by applying a paste for forming an electrode including a conductive metal and then heat treating it.

[0076] As shown in (b) of Fig. 1, a plurality of photoelectric elements (23) can be connected to transparent electrodes (22) to form a series connection to form one sub-photoelectric cell.

[0077] As shown in (c) of FIG. 1, the photoelectric cell according to the present invention is a photoelectric element compression film (30) formed by thermally compressing a photoelectric element sealing film (10) to the photoelectric element film (20) described above, and includes the photoelectric element sealing film (10) and the photoelectric element film (20) described above.

[0078] As illustrated in (c) of Fig. 1, when the photoelectric element encapsulation film (10) is thermo-compression-bonded on top of the photoelectric element film (20), a plurality of photoelectric elements (23) can be compressed and embedded (inserted) in the thermo-compression film (14). In this case, the plurality of photoelectric elements (23) are connected in series to form a sub-photoelectric cell, and both ends of the sub-photoelectric cell are connected to the conductive film (13) via the transparent electrode (22) and the conductive adhesive layer (12). Here, the conductive film (13) can function as a bus bar that connects a plurality of sub-photoelectric cells in parallel. When a plurality of sub-photoelectric cells are connected to the conductive film (13) that functions as a bus bar, one photoelectric cell can be formed.

[0079] Figure 2 illustrates a device and method for encapsulating a photoelectric element using a photoelectric element encapsulation film according to the present invention.

[0080] As illustrated in FIG. 2, the photoelectric element sealing device according to the present invention may include a sealing film unwinding roll (110), an element film unwinding roll (120), a first guide roll (210), a second guide roll (220), a third guide roll (230), a pair of nip rolls (310, 320), a pressing roll (400), etc.

[0081] The bagging film unwinding roll (110) unwinds (unwound and supplies) the photoelectric element bagging film (10) described above while rotating in a wound state, and can be configured in a cylindrical shape.

[0082] The bag film unwinding roll (110) may include a rotating shaft, a motor, a brake, etc. The rotating shaft is coupled to the interior of the bag film unwinding roll (110) and rotates about its axis. The motor rotates the rotating shaft. The brake may be selectively or quantitatively coupled to the rotating shaft to prevent the rotating shaft from rotating or to control the rotation speed.

[0083] The photoelectric element film unwinding roll (120) is configured in a cylindrical shape to unwind (unwind and supply) the photoelectric element film (20) described above while rotating in a wound state.

[0084] The element film unwinding roll (120) may include a rotating shaft, a motor, a brake, etc., identical to or similar to the bag film unwinding roll (110). The rotating shaft is coupled to the interior of the element film unwinding roll (120) and rotates. The motor rotates the rotating shaft. The brake may be selectively or quantitatively coupled to the rotating shaft to prevent the rotating shaft from rotating or to control the rotation speed.

[0085] The first guide roll (210) peels off the release film (11) from the moving photoelectric element sealing film (10) and then changes the moving direction of the release film (11), and can function as a guide span that guides the movement of the photoelectric element sealing film (10) and supports it at a certain position.

[0086] The first guide roll (210) can be composed of aluminum (Al) as a basic material, to which magnesium (Mg) and silicon (Si) are added. For example, aluminum (Al) can be subjected to age hardening treatment by adding 0.83 wt% magnesium (Mg) and 0.45 wt% silicon (Si), and can be used with a yield strength of 70 kg / mm2 and a shear strength of 80 kg / mm2.

[0087] The first guide roll (210) can be configured in the shape of a solid cylinder, a hollow cylinder, etc.

[0088] The second guide roll (220) changes the direction of movement of the photoelectric element sealing film (10) from which the release film (11) is peeled off, and can function as a guide span that guides the movement of the photoelectric element sealing film (10) and supports it at a certain position.

[0089] The second guide roll (220) may be composed of a material that is the same as or similar to the first guide roll (210), with aluminum (Al) as the basic material and magnesium (Mg) and silicon (Si) added thereto.

[0090] The second guide roll (220) can be configured in the shape of a solid cylinder, a hollow cylinder, or the like, identical to or similar to the first guide roll (210).

[0091] The third guide roll (230) changes the direction of movement of the photoelectric element film (20), and can function as a guide span that guides the movement of the photoelectric element film (20) and supports it at a certain position.

[0092] The third guide roll (230) can be composed of a material that is the same as or similar to the first and second guide rolls (210, 220), with aluminum (Al) as the basic material and magnesium (Mg) and silicon (Si) added thereto.

[0093] The third guide roll (230) can be configured in the shape of a solid cylinder, a hollow cylinder, or the like, identical to or similar to the first and second guide rolls (210, 220).

[0094] A pair of nip rolls (310, 320) can change the direction of movement while bringing the moving photoelectric element sealing film (10) and the photoelectric element film (20) into close contact.

[0095] A pair of nip rolls (310, 320) may be arranged vertically and interlocked with each other or may be configured as a pair of rolls spaced apart at a certain interval.

[0096] The compression roll (400) can compress the photoelectric element sealing film (10) and the photoelectric element film (20) that are moved in close contact to insert (combine) the photoelectric element (23) into the thermal compression film (14).

[0097] The compression roll (400) may be a thermal compression roll that applies both pressure and heat. In this case, the heating unit may be bonded to the inside or surface of the compression roll (400). The heating unit may be composed of a filament (heat wire), etc.

[0098] The compression roll (400) may be composed of a pair of rolls that are in close contact with each other or are spaced apart from each other by a small gap. The compression roll (400) may also be composed of multiple pairs of rolls that are spaced apart from each other horizontally.

[0099] The compression roll (400) can also compress the photoelectric element sealing film (10) and the photoelectric element film (20) while changing the direction of movement up and down, as shown in FIG. 2.

[0100] The photoelectric element packaging device of the present invention may include a heteromorphic film winding roll (500).

[0101] The film release roll (500) is used to release the peeled film (11), and may include a rotating shaft, a motor, a brake, etc. The rotating shaft is coupled to the interior of the film release roll (500) and rotates along its axis. The motor rotates the rotating shaft. The brake may be selectively or quantitatively coupled to the rotating shaft to prevent the rotating shaft from rotating along its axis or to control the rotation speed.

[0102] The photoelectric element packaging device of the present invention may include a compression film winding roll (not shown).

[0103] The compression film take-up roll is used to take up a compression film (30) in which a photoelectric element sealing film (10) and a photoelectric element film (20) are compressed, and may include a rotating shaft, a motor, a brake, etc. The rotating shaft is coupled to the inside of the compression film take-up roll and rotates along its axis. The motor rotates the rotating shaft. The brake can be selectively or quantitatively coupled to the rotating shaft to prevent the axial rotation of the rotating shaft or control the rotation speed.

[0104] The photoelectric element encapsulation method using the photoelectric element encapsulation device illustrated in Fig. 2 may include a step of preparing a photoelectric element encapsulation film, a step of preparing a photoelectric element film, and a step of bonding the photoelectric element encapsulation film to the photoelectric element film.

[0105] The step of preparing a photoelectric element sealing film (10) can prepare the photoelectric element sealing film (10) described above. The photoelectric element sealing film (10) can be prepared in a state of being wound on a sealing film unwinding roll (110).

[0106] The step of preparing a photoelectric element film (20) can prepare the photoelectric element film (20) described above. The photoelectric element film (20) can be prepared in a state of being wound on a film winding roll (120).

[0107] The step of bonding the photoelectric element sealing film (10) to the photoelectric element film (20) can be performed by moving the photoelectric element sealing film (10) on one side and moving the photoelectric element film (20) on the other side.

[0108] On one side, after the photoelectric element sealing film (10) is unwound from the sealing film unwinding roll (110), the release film (11) can be removed using the first guide roll (210) during the moving process. The first guide roll (210) can continue to move the remaining photoelectric element sealing film (10) from which the release film (11) has been removed in the existing moving direction or another moving direction. The moving photoelectric element sealing film (10) can have its moving direction changed toward a pair of nip rolls (310, 320) by the second guide roll (220).

[0109] On the other side, after the photoelectric element film (20) is unwound from the element film unwinding roll (120), the moving direction of the photoelectric element film (20) can be changed to the direction of a pair of nip rolls (310, 320) using the third guide roll (230).

[0110] The step of bonding the photoelectric element sealing film (10) to the photoelectric element film (20) can be performed by bringing the moving photoelectric element sealing film (10) and the photoelectric element film (20) into close contact using a pair of nip rolls (310, 320). Here, the pair of nip rolls (310, 320) can change the moving direction to the direction of the pressing roll (400) after bringing the photoelectric element sealing film (10) and the photoelectric element film (20) into close contact.

[0111] The step of bonding the photoelectric element sealing film (10) to the photoelectric element film (20) can be performed by thermally compressing the photoelectric element sealing film (10) and the photoelectric element film (20) so that the photoelectric element (23) of the photoelectric element film (20) can be inserted into the thermally compressing film (14) of the photoelectric element sealing film (10).

[0112] Afterwards, the compressed compression film (30) can be wound using a compression film winding roll (not shown).

[0113] The present invention has been described in detail with several embodiments, which are intended to illustrate the invention. Those skilled in the art will readily appreciate the potential for modifications and variations to these embodiments. However, the scope of the present invention is defined by the claims below, and therefore, such modifications and variations are construed as falling within the scope of the present invention.

[0114] [Explanation of symbols]

[0115] 10: Photoelectric element encapsulation film

[0116] 11: Heterogeneous film

[0117] 12: Challenge adhesive layer

[0118] 13: Challenge Film

[0119] 14: Heat-pressed film

[0120] 15: Barrier film

[0121] 20: Photoelectric element film

[0122] 21: Description

[0123] 22: Transparent electrode (lower electrode)

[0124] 23: Photoelectric element

[0125] 30: Photoelectric cell (photoelectric element pressing film)

[0126] 110: Sealing film roll

[0127] 120: Small film winding roll

[0128] 210~230: 1st~3rd guide rolls

[0129] 310,320: Nip Roll

[0130] 400: Compression roll

[0131] 500: Film winding roll

Claims

1. Heterogeneous film; A conductive adhesive layer that is spaced apart and bonded on the above-mentioned heteromorphic film; A conductive film bonded to the above-mentioned conductive adhesive layer; A heat-compressed film inserted into the space between the laminate of the above-mentioned conductive adhesive layer and the conductive film; and A photoelectric element encapsulation film comprising a barrier film bonded to the above-mentioned thermally compressed film and a conductive film.

2. In the first paragraph, the conductive adhesive layer A photoelectric element encapsulation film containing a challenging particle, having a thickness of 5 to 100 μm and an adhesive strength of 0.1 N / 25 mm or more.

3. In the first paragraph, the conductive film Bus-bar, photoelectric element encapsulation film.

4. A photoelectric element encapsulation film according to any one of paragraphs 1 to 3; A photoelectric element embedded in the above thermocompression film; A transparent electrode coupled to the lower portion of the photoelectric element; A photoelectric cell comprising a substrate bonded to the lower portion of the transparent electrode.

5. In paragraph 4, the description is A photoelectric cell that is flexible.

6. In the fifth paragraph, the photoelectric element An electron transport layer bonded to the transparent electrode; A photoactive layer bonded to the electron transport layer; a hole transport layer bonded to the photoactive layer; and A photovoltaic cell, which is an inverted structure organic solar cell including an upper electrode bonded to the hole transport layer.

7. In the 6th paragraph, the photoelectric element Photoelectric cells, connected in series in large numbers.

8. A sealing film unwinding roll for unwinding a photoelectric element sealing film including a release film, a conductive adhesive layer spaced apart and bonded on the release film, a conductive film bonded on the conductive adhesive layer, a heat-compression film inserted into a spaced space between a laminate of the conductive adhesive layer and the conductive film, and a barrier film bonded on the heat-compression film and the conductive film; A first guide roll for peeling the release film from the moving photoelectric element sealing film and changing the moving direction of the release film; A second guide roll that changes the direction of movement of the photoelectric element sealing film from which the above-mentioned heteromorphic film is peeled off; A photoelectric element film unwinding roll comprising a substrate, a transparent electrode bonded to the substrate, and a photoelectric element bonded to the transparent electrode; A third guide roll for changing the direction of movement of the photoelectric element film; A pair of nip rolls that change the direction of movement while contacting the moving photoelectric element sealing film and the photoelectric element film; A photoelectric element encapsulation device comprising a photoelectric element encapsulation film that moves in close contact with the photoelectric element and a compression roll that compresses the photoelectric element film to insert the photoelectric element into the thermal compression film.

9. In paragraph 8, A photoelectric element encapsulation device including a release film winding roll for winding the above-mentioned peeled release film.

10. In the 8th paragraph, the compression roll A photoelectric element encapsulation device that applies pressure and heat simultaneously through a thermal compression roll.

11. In any one of paragraphs 8 to 10, A photoelectric element encapsulation device comprising a compressed photoelectric element encapsulation film and a compression film winding roll for winding the photoelectric element film.

12. A step of preparing a photoelectric element encapsulation film including a release film, a conductive adhesive layer spaced apart and bonded on the release film, a conductive film bonded on the conductive adhesive layer, a thermocompression film inserted into a spaced space between a laminate of the conductive adhesive layer and the conductive film, and a barrier film bonded on the thermocompression film and the conductive film; A step of preparing a photoelectric element film including a substrate, a transparent electrode bonded to the substrate, and a photoelectric element bonded to the transparent electrode; A method for encapsulating a photoelectric element, comprising the steps of moving the photoelectric element encapsulating film while removing the release film from one side, moving the photoelectric element film from the other side, and then bonding the photoelectric element encapsulating film to the photoelectric element film while inserting the photoelectric element into the thermal compression film of the photoelectric element encapsulating film.

13. In the 12th paragraph, the step of bonding the photoelectric element sealing film to the photoelectric element film is A step of removing the release film from the photoelectric element sealing film using a first guide roll; A step of changing the direction of movement of the photoelectric element sealing film using a second guide roll; A step of changing the moving direction of the photoelectric element film using a third guide roll; A step of changing the direction of movement while bringing the photoelectric element sealing film and the photoelectric element film into close contact using a pair of nip rolls; A photoelectric element encapsulation method comprising a step of thermally compressing the photoelectric element encapsulation film and the photoelectric element film, which are tightly bonded using a thermal compression roll.

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