Antenna module

Abstract

The present invention provides an antenna module in which a first radiation pattern of a first antenna base is formed as a cross-sectional pattern, and both ends of the first radiation pattern are connected to a terminal pattern via a connection base to reduce the manufacturing costs of the antenna module.

Description

antenna module

[0001] The present invention relates to an antenna module comprising two or more antennas that resonate with signals of different frequency bands.

[0002] Beyond basic calling functions, mobile devices are increasingly embracing essential features like short-range communication and wireless charging. Accordingly, mobile devices are increasingly equipped with antennas for short-range communication and wireless charging.

[0003] Because mobile devices have limited mounting space, it's difficult to mount multiple independent antennas. Therefore, to minimize mounting space, antenna modules combining two or more antennas are being mounted on mobile devices. For example, mobile devices are equipped with antenna modules that combine a near-field communication (NFC) antenna and a wireless power conversion (WPC) antenna for wireless charging.

[0004] As competition among mobile terminal manufacturers has intensified recently, they are developing various technologies to reduce costs and are demanding that antenna manufacturers develop antenna modules that can maintain antenna performance while reducing costs.

[0005] The matters described in the background art above are intended to help understand the background of the invention and may include matters that are not publicly disclosed prior art.

[0006] The present invention has been proposed in consideration of the above circumstances, and aims to provide an antenna module in which a first radiation pattern of a first antenna substrate is configured as a cross-sectional pattern, and both ends of the first radiation pattern are connected to a terminal pattern through a connecting substrate.

[0007] In order to achieve the above object, an antenna module according to an embodiment of the present invention includes a first antenna substrate having a first radiation pattern resonating with a signal of a first frequency band, a first terminal pattern and a second terminal pattern spaced apart from each other, an insulating substrate arranged on the first antenna substrate, a first connection substrate arranged on the insulating substrate and connecting a first end of the first radiation pattern exposed by the insulating substrate to the first terminal pattern, and a second connection substrate arranged on the insulating substrate but spaced apart from the first connection substrate and connecting a second end of the first radiation pattern exposed through the insulating substrate to the second terminal pattern.

[0008] The first antenna substrate may include a first base substrate having a first side and a second side, and having a first radiation pattern, a first terminal pattern, and a second terminal pattern formed on the first side, a first connection pattern disposed on the first side of the first base substrate and having a first end connected to the first terminal pattern, a second connection pattern disposed on the first side of the first base substrate and having a first end connected to the second terminal pattern, a first bonding pattern disposed on the first side of the first base substrate and being connected to the first end of the first radiation pattern, a second bonding pattern disposed on the first side of the first base substrate and being connected to the second end of the first bonding pattern, a third bonding pattern disposed on the first side of the first base substrate and being connected to the second end of the first radiation pattern, and a fourth bonding pattern disposed on the first side of the first base substrate and being connected to the second end of the second bonding pattern.

[0009] The insulating substrate is formed by printing an insulating material on the first surface of the first base substrate, and can be formed in an area including an area overlapping the first bonding pattern, the second bonding pattern, the third bonding pattern, and the fourth bonding pattern.

[0010] The insulating material may be formed with a first hole that penetrates the insulating material in an area overlapping with the first bonding pattern and exposes the first bonding pattern, a second hole that penetrates the insulating material in an area overlapping with the second bonding pattern and exposes the second bonding pattern, a third hole that penetrates the insulating material in an area overlapping with the third bonding pattern and exposes the third bonding pattern, and a fourth hole that penetrates the insulating material in an area overlapping with the fourth bonding pattern and exposes the fourth bonding pattern.

[0011] The first connecting member is formed by printing a conductive material on the surface of the insulating member, and can be connected to a first bonding pattern exposed through a first hole of the insulating member and a second bonding pattern exposed through a second hole of the insulating member.

[0012] The second connecting member is formed by printing a conductive material on the surface of the insulating member, and can be connected to a third bonding pattern exposed through a third hole of the insulating member and a fourth bonding pattern exposed through a fourth hole of the insulating member.

[0013] The first antenna substrate may further include a third terminal pattern disposed on a first surface of the first base substrate and a third connection pattern disposed on the first surface of the first base substrate, the first end of which is connected to the third terminal pattern and disposed to pass between the first bonding pattern and the second bonding pattern.

[0014] The first antenna substrate may further include a fourth terminal pattern disposed on a first surface of the first base substrate and a fourth connection pattern disposed on the first surface of the first base substrate, the first end of which is connected to the fourth terminal pattern, and the fourth connection pattern disposed to face the third connection pattern with the first connection pattern and the second connection pattern interposed therebetween.

[0015] An antenna module according to an embodiment of the present invention further includes a second antenna substrate having a second antenna resonating with a signal of a second frequency band different from the first frequency band, wherein the first antenna substrate further includes a fifth bonding pattern connected to a second end of a third bonding pattern and a sixth bonding pattern connected to a second end of a fourth bonding pattern, wherein a first end of the second antenna may be connected to the fourth bonding pattern, and a second end of the second antenna may be connected to the fifth bonding pattern.

[0016] In order to achieve the above object, an antenna module according to another embodiment of the present invention includes a first antenna substrate having a first radiation pattern resonating with a signal of a first frequency band, a first terminal pattern and a second terminal pattern spaced apart from each other, a first connection substrate arranged on the first antenna substrate and connecting a first end of the first radiation pattern to the first terminal pattern, a second connection substrate arranged on the first antenna substrate but spaced apart from the first connection substrate and connecting a second end of the first radiation pattern to the second terminal pattern, and an insulating substrate arranged on surfaces of the first antenna substrate, the first connection substrate, and the second connection substrate.

[0017] The first antenna substrate has a first side and a second side, and a first base substrate having a first radiation pattern, a first terminal pattern, and a second terminal pattern formed on the first side, a first connection pattern disposed on the first side of the first base substrate and having a first end connected to the first terminal pattern, a second connection pattern disposed on the first side of the first base substrate and having a first end connected to the second terminal pattern, a first bonding pattern disposed on the first side of the first base substrate and having a first end connected to the first radiation pattern, a second bonding pattern disposed on the first side of the first base substrate and having a second end connected to the first connection pattern, a third bonding pattern disposed on the first side of the first base substrate and having a second end connected to the first radiation pattern, a fourth bonding pattern disposed on the first side of the first base substrate and having a second end connected to the second connection pattern, and a coverlay disposed on the first side of the first base substrate and having the first radiation pattern, the first terminal pattern, the second terminal pattern, the first bonding pattern to the fourth bonding pattern. May include.

[0018] The coverlay may be formed with a plurality of first holes that penetrate the coverlay in an area overlapping the first terminal pattern and the second terminal pattern to expose the first terminal pattern and the second terminal pattern, a second hole that penetrates the coverlay in an area overlapping the first bonding pattern to expose the first bonding pattern, a third hole that penetrates the coverlay in an area overlapping the second bonding pattern to expose the second bonding pattern, a fourth hole that penetrates the coverlay in an area overlapping the third bonding pattern to expose the third bonding pattern, and a fifth hole that penetrates the coverlay in an area overlapping the fourth bonding pattern to expose the fourth bonding pattern.

[0019] The first connecting member is formed by printing a conductive material on the surface of the coverlay, and can be connected to the first bonding pattern exposed through the second hole of the coverlay and the second bonding pattern exposed through the third hole of the coverlay.

[0020] The second connecting member is formed by printing a conductive material on the surface of the coverlay, and can be connected to the third bonding pattern exposed through the fourth hole of the coverlay and the fourth bonding pattern exposed through the fifth hole of the coverlay.

[0021] The first antenna substrate may further include a third terminal pattern disposed on a first surface of the first base substrate, a fourth terminal pattern disposed on the first surface of the first base substrate, a third connection pattern disposed on the first surface of the first base substrate, having a first end connected to the third terminal pattern and disposed to pass between the first connection pattern and the second connection pattern, a fourth connection pattern disposed on the first surface of the first base substrate, having a first end connected to the fourth terminal pattern, and disposed to face the third connection pattern with the first connection pattern and the second connection pattern interposed therebetween, a fifth connection pattern connected to a second end of the third connection pattern, and a sixth connection pattern connected to a second end of the fourth connection pattern.

[0022] A second antenna substrate further includes a second antenna that resonates with a signal of a second frequency band different from the first frequency band, and a coverlay further includes a sixth hole that penetrates the coverlay in an area overlapping with the fifth bonding pattern to expose the fifth bonding pattern, and a seventh hole that penetrates the coverlay in an area overlapping with the sixth bonding pattern to expose the sixth bonding pattern, and a first end of the second antenna may be connected to the fifth bonding pattern exposed through the sixth hole of the coverlay, and a second end of the second antenna may be connected to the sixth bonding pattern exposed through the seventh hole of the coverlay.

[0023] According to the present invention, the antenna module has the effect of reducing the manufacturing cost of the antenna module compared to a general antenna module composed of a double-sided printed circuit board by configuring the first antenna substrate as a single-sided printed circuit board.

[0024] In addition, the antenna module has the effect of simplifying the pattern of the first antenna substrate compared to a conventional antenna module that uses a double-sided pattern in the first antenna substrate by configuring the first radiation pattern of the first antenna substrate as a cross-sectional pattern and connecting both ends of the first radiation pattern to the terminal pattern through a connecting substrate.

[0025] In addition, the antenna module has the effect of reducing the manufacturing cost compared to a conventional antenna module that uses a double-sided pattern in the first antenna substrate by simplifying the pattern of the first antenna substrate by configuring the first radiation pattern of the first antenna substrate as a cross-sectional pattern and connecting both ends of the first radiation pattern to the terminal pattern through a connecting substrate.

[0026] FIG. 1 is a drawing for explaining an antenna module according to a first embodiment of the present invention.

[0027] Fig. 2 is a drawing for explaining the first antenna substrate of Fig. 1.

[0028] Figure 3 is a drawing for explaining the insulating material of Figure 1.

[0029] Figure 4 is a drawing for explaining the connection description of Figure 1.

[0030] Fig. 5 is a cross-sectional view of a portion of the first antenna substrate of Fig. 1 where a connection material is arranged.

[0031] FIG. 6 and FIG. 7 are drawings for explaining the second antenna substrate of FIG. 1.

[0032] FIG. 8 is a drawing for explaining an antenna module according to a second embodiment of the present invention.

[0033] FIG. 9 and FIG. 10 are drawings for explaining the first antenna substrate of FIG. 8.

[0034] Fig. 11 is a drawing for explaining the connection description of Fig. 8.

[0035] Fig. 12 is a drawing for explaining the insulating material of Fig. 8.

[0036] Fig. 13 is a cross-sectional view of a portion of the first antenna substrate of Fig. 8 where a connection substrate is arranged.

[0037] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0038] These examples are provided to more fully illustrate the present invention to those skilled in the art. The following examples may be modified in various ways, and the scope of the present invention is not limited to the examples described below. Rather, these examples are provided to further faithfully and completely convey the spirit of the present invention.

[0039] The terminology used herein is used to describe specific embodiments and is not intended to limit the present invention. In addition, the singular form in this specification may include the plural form unless the context clearly indicates otherwise. It should be understood that the terms "comprise," "include," and "have" in this application are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof of the invention, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0040] In the description of the embodiments, when each layer (film), region, pattern or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad or pattern, "on" and "under" include both being formed "directly" or "indirectly" via another layer. In addition, the reference for above or below each layer is, in principle, based on the drawing.

[0041] The drawings are intended solely to facilitate understanding of the invention and should not be construed as limiting the scope of the invention. Furthermore, relative thicknesses, lengths, and sizes in the drawings may be exaggerated for convenience and clarity of explanation.

[0042] Referring to FIG. 1, an antenna module according to a first embodiment of the present invention is configured to include a first antenna substrate (100), an insulating substrate (220), a first connection substrate (240), a second connection substrate (260), and a second antenna substrate (300).

[0043] The first antenna substrate (100) is configured to operate as an antenna resonating in a first frequency band. As an example, the first antenna substrate (100) operates as an antenna resonating in a near field communication (NFC) frequency band.

[0044] Referring to FIG. 2, the first antenna substrate (100) is configured to include a first base substrate (100), a first radiation pattern (120), a plurality of terminal patterns (132, 134, 136, 138), a plurality of bonding patterns (141 to 146), and a plurality of connection patterns (152, 154, 156, 158).

[0045] The first base substrate (100) is a plate-shaped substrate having a first side and a second side opposite the first side. A radiation area (A) and a terminal area (B) can be defined on the first side of the first base substrate (100).

[0046] As an example, the first base substrate (100) is a printed circuit board having a first radiation pattern (120), a plurality of terminal patterns (132, 134, 136, 138), a plurality of bonding patterns (141 to 146), and a plurality of connection patterns (152, 154, 156, 158) printed on the first surface.

[0047] The first radiation pattern (120) is arranged on the first surface of the first base substrate (100). The first radiation pattern (120) is arranged in the radiation area (A) of the first base substrate (100). The first radiation pattern (120) may be a loop pattern formed in a loop shape that winds on the first surface of the first base substrate (100).

[0048] A first end of the first radiation pattern (120) is positioned in an outer region of the loop formed by the first radiation pattern (120) and is electrically connected to a first bonding pattern (141). A second end of the first radiation pattern (120) is positioned in an inner region of the loop formed by the first radiation pattern (120) and is electrically connected to a third bonding pattern (143).

[0049] In this way, the antenna module according to an embodiment of the present invention can reduce the manufacturing cost of the antenna module compared to a general antenna module composed of a double-sided printed circuit board by configuring the first antenna substrate (100) as a single-sided printed circuit board.

[0050] The first terminal pattern (132) is arranged on the first surface of the first base substrate (100). The first terminal pattern (132) is arranged in the terminal area (B) of the first base substrate (100). The first terminal pattern (132) is electrically connected to the first end of the first connection pattern (152) to be described later.

[0051] The second terminal pattern (134) is arranged on the first surface of the first base substrate (100). The second terminal pattern (134) is arranged in the terminal area (B) of the first base substrate (100), but is arranged so as to be spaced apart from the first terminal pattern (132) by a predetermined distance. The second terminal pattern (134) is electrically connected to the first end of the second connection pattern (154).

[0052] The third terminal pattern (136) is arranged on the first surface of the first base substrate (100). The third terminal pattern (136) is arranged in the terminal area (B) of the first base substrate (100), and is arranged to face the second terminal pattern (134) with the first terminal pattern (132) interposed therebetween. The third terminal pattern (136) is electrically connected to the first end of the third connection pattern (156) to be described later.

[0053] The fourth terminal pattern (138) is arranged on the first surface of the first base substrate (100). The fourth terminal pattern (138) is arranged in the terminal area (B) of the first base substrate (100), and is arranged to face the first terminal pattern (132) with the second terminal pattern (134) interposed therebetween. The fourth terminal pattern (138) is electrically connected to the first end of the fourth connection pattern (158) to be described later.

[0054] The first bonding pattern (141) is arranged on the first surface of the first base substrate (100). The first bonding pattern (141) is arranged in the radiation area (A) of the first base substrate (100), but is arranged in an outer area of ​​the loop formed by the first radiation pattern (120). The first bonding pattern (141) is electrically connected to the first end of the first radiation pattern (120).

[0055] The second bonding pattern (142) is arranged on the first surface of the first base substrate (100), but is arranged in the radiation area (A) of the first base substrate (100). The second bonding pattern (142) is electrically connected to the second end of the first connection pattern (152).

[0056] The first bonding pattern (141) and the second bonding pattern (142) are patterns to which the first connecting material (240) is bonded to electrically connect the first end of the first radiation pattern (120) to the first terminal pattern (132).

[0057] The third bonding pattern (143) is arranged on the first surface of the first base substrate (100). The third bonding pattern (143) is arranged in the radiation area (A) of the first base substrate (100), but is arranged in the inner area of ​​the loop formed by the first radiation pattern (120). The third bonding pattern (143) is electrically connected to the second end of the first radiation pattern (120).

[0058] The fourth bonding pattern (144) is arranged on the first surface of the first base substrate (100), but is arranged in the radiation area (A) of the first base substrate (100). The fourth bonding pattern (144) is arranged to be spaced apart from the second bonding pattern (142) and is electrically connected to the second end of the second connection pattern (154).

[0059] The third bonding pattern (143) and the fourth bonding pattern (144) are patterns in which the second connecting material (260) is bonded to electrically connect the second end of the first radiation pattern (120) to the second terminal pattern (134).

[0060] The fifth bonding pattern (145) is arranged on the first surface of the first base substrate (100), but is arranged in the radiation area (A) of the first base substrate (100). The fifth bonding pattern (145) is arranged to be spaced apart from the second bonding pattern (142) and the fourth bonding pattern (144), and is electrically connected to the second end of the third connection pattern (156).

[0061] The sixth bonding pattern (146) is arranged on the first surface of the first base substrate (100), and is arranged in the radiation area (A) of the first base substrate (100). The sixth bonding pattern (146) is arranged to be spaced apart from the second bonding pattern (142), the fourth bonding pattern (144), and the fifth bonding pattern (145), and is electrically connected to the second end of the fourth connection pattern (158).

[0062] The fifth bonding pattern (145) and the sixth bonding pattern (146) are patterns for electrically connecting both ends of the radiation pattern of the second antenna substrate (300) to the third terminal pattern (136) and the fourth terminal pattern (138), respectively.

[0063] A first connection pattern (152) is disposed on a first surface of a first base substrate (100). The first connection pattern (152) is disposed in a terminal region (B) of the first base substrate (100). The first connection pattern (152) is a conductive pattern that electrically connects the first terminal pattern (132) and the second bonding pattern (142). A first end of the first connection pattern (152) is electrically connected to the first terminal pattern (132), and a second end of the first connection pattern (152) is electrically connected to the second bonding pattern (142).

[0064] The second connection pattern (154) is arranged on the first surface of the first base substrate (100). The second connection pattern (154) is arranged in the terminal region (B) of the first base substrate (100). The second connection pattern (154) is a conductive pattern that electrically connects the second terminal pattern (134) and the fourth bonding pattern (144). The first end of the second connection pattern (154) is electrically connected to the second terminal pattern (134), and the second end of the second connection pattern (154) is electrically connected to the fourth bonding pattern (144).

[0065] The third connection pattern (156) is arranged on the first surface of the first base substrate (100). The third connection pattern (156) is arranged in the terminal region (B) of the first base substrate (100). The third connection pattern (156) is a conductive pattern that electrically connects the third terminal pattern (136) and the fifth bonding pattern (145). A first end of the third connection pattern (156) is electrically connected to the third terminal pattern (136), and a second end of the third connection pattern (156) is electrically connected to the fifth bonding pattern (145).

[0066] The fourth connection pattern (158) is arranged on the first surface of the first base substrate (100). The fourth connection pattern (158) is arranged in the terminal region (B) of the first base substrate (100). The fourth connection pattern (158) is a conductive pattern that electrically connects the fourth terminal pattern (138) and the sixth bonding pattern (146). A first end of the fourth connection pattern (158) is electrically connected to the fourth terminal pattern (138), and a second end of the fourth connection pattern (158) is electrically connected to the sixth bonding pattern (146).

[0067] Referring to FIG. 3, an insulating material (220) is formed on the first surface of the first antenna material (100) so as to cover a portion of the first antenna material (100). The insulating material (220) is formed so as to cover an area including the first bonding pattern (141) to the fourth bonding pattern (144).

[0068] The insulating substrate (220) can be formed by printing an insulating material on the first surface of the first antenna substrate (100). The insulating substrate (220) can be formed of an insulating sheet and attached / bonded to the first surface of the first antenna substrate (100).

[0069] A plurality of holes may be formed in the insulating material (220) to expose the bonding pattern. A plurality of holes having a diameter capable of exposing at least a portion of the first surface (upper surface) of the bonding pattern may be formed in the insulating material (220).

[0070] For example, a first hole (222) exposing a first bonding pattern (141), a second hole (224) exposing a second bonding pattern (142), a third hole (226) exposing a third bonding pattern (143), and a fourth hole (228) exposing a fourth bonding pattern (144) are formed in the insulating material (220).

[0071] Referring to FIGS. 4 and 5, the first connecting member (240) is formed on the surface of the insulating member (220) and electrically connects the first bonding pattern (141) and the second bonding pattern (142). As the first connecting member (240) electrically connects the first bonding pattern (141) and the second bonding pattern (142), the first end of the first radiation pattern (120) is electrically connected to the first terminal pattern (132).

[0072] The second connecting material (260) is formed on the surface of the insulating material (220) and electrically connects the third bonding pattern (143) and the fourth bonding pattern (144). As the second connecting material (260) electrically connects the third bonding pattern (143) and the fourth bonding pattern (144), the second end of the first radiation pattern (120) is electrically connected to the second terminal pattern (134).

[0073] The first connecting substrate (240) and the second connecting substrate (260) may be formed by printing a conductive material on the surface of the insulating substrate (220). The first connecting substrate (240) and the second connecting substrate (260) may be formed of a conductive sheet and may be configured to be attached / bonded to the surface of the insulating substrate (220) to electrically connect the bonding patterns.

[0074] In this way, the antenna module according to the first embodiment of the present invention configures the first radiation pattern (120) of the first antenna substrate (100) as a cross-sectional pattern, and connects both ends of the first radiation pattern (120) to a terminal pattern through a connecting substrate, thereby simplifying the pattern of the first antenna substrate (100) compared to a conventional antenna module that uses a double-sided pattern on the first antenna substrate (100).

[0075] In addition, the antenna module according to the first embodiment of the present invention configures the first radiation pattern (120) of the first antenna substrate (100) as a cross-sectional pattern, and connects both ends of the first radiation pattern (120) to a terminal pattern through a connecting substrate, thereby simplifying the pattern of the first antenna substrate (100), thereby reducing the manufacturing cost compared to a conventional antenna module that uses a double-sided pattern on the first antenna substrate (100).

[0076] The second antenna substrate (300) is configured to operate as an antenna that resonates in a second frequency band different from the first frequency band. As an example, the second antenna substrate (300) operates as an antenna that resonates in a wireless power transmission (WPC) frequency band.

[0077] Referring to FIGS. 6 and 7, the second antenna substrate (300) is configured to include a second base substrate (310), a second radiation pattern (320), and a plurality of bonding patterns (330, 340).

[0078] The second base substrate (310) is a plate-shaped substrate having a first side and a second side. As an example, the second base substrate (310) is a circular printed circuit board.

[0079] The second base substrate (310) may have a pattern area (C) and a bonding area (D) defined. The pattern area (C) is an area where the second radiation pattern (320) is formed. The bonding area (D) is an area protruding outward from the pattern area (C) and is an area that overlaps the first antenna substrate (100) when bonding the first antenna substrate (100) and the second antenna substrate (300).

[0080] The second radiation pattern (320) is formed on the first surface and the second surface of the second base substrate (310). The second radiation pattern (320) may include a loop pattern formed on the first surface of the second base substrate (310) and a loop pattern formed on the second surface of the second base substrate (310). The two loop patterns are electrically connected through a via hole to form the second radiation pattern (320) and are configured to resonate with a signal of a second frequency band. In this case, the second frequency band is, for example, a wireless power transmission (WPC) frequency band.

[0081] The seventh bonding pattern (330) is composed of two patterns formed on the first and second surfaces of the second base substrate (310). The seventh bonding pattern (330) is arranged in the bonding area (D) of the second base substrate (310), but is arranged so as to be spaced apart from the eighth bonding pattern (340). The seventh bonding pattern (330) is electrically connected to the first end of the second radiation pattern (320).

[0082] The eighth bonding pattern (340) is composed of two patterns formed on the first and second surfaces of the second base substrate (310). The eighth bonding pattern (340) is arranged in the bonding area (D) of the second base substrate (310), but is arranged so as to be spaced apart from the seventh bonding pattern (330). The eighth bonding pattern (340) is electrically connected to the second end of the second radiation pattern (320).

[0083] The second antenna substrate (300) is placed on the first surface of the first antenna substrate (100). The second antenna substrate (300) is placed so that the bonding area (D) overlaps with the first antenna substrate (100) and is bonded to the first antenna.

[0084] When the first antenna substrate (100) and the second antenna substrate (300) are bonded, the seventh bonding pattern (330) is bonded to the fifth bonding pattern (145) of the first antenna substrate (100). The eighth bonding pattern (340) is bonded to the sixth bonding pattern (146) of the first antenna substrate (100).

[0085] Accordingly, the first end of the second radiation pattern (320) is electrically connected to the third terminal pattern (136) through the seventh bonding pattern (330), the fifth bonding pattern (145), and the third connection pattern (156). The second end of the second radiation pattern (320) is electrically connected to the fourth terminal pattern (138) through the eighth bonding pattern (340), the sixth bonding pattern (146), and the fourth connection pattern (158).

[0086] Referring to FIG. 8, an antenna module according to a second embodiment of the present invention is configured to include a first antenna substrate, a first connection substrate, a second connection substrate, an insulating substrate, and a second antenna substrate.

[0087] The antenna module according to the second embodiment of the present invention differs from the antenna module of the first embodiment in the arrangement order (location) of the connecting substrates (520, 540) and the insulating substrate due to the addition of a coverlay to the first antenna substrate. Here, the second antenna substrate is the same as that of the first embodiment described above, and thus a detailed description thereof is omitted.

[0088] The first antenna substrate (100) is configured to operate as an antenna resonating in a first frequency band. As an example, the first antenna substrate (100) operates as an antenna resonating in a near field communication (NFC) frequency band.

[0089] Referring to FIGS. 9 and 10, the first antenna substrate is configured to include a first base substrate, a first radiation pattern, a plurality of terminal patterns (432, 434, 436, 438), a plurality of bonding patterns (441 to 446), a plurality of connection patterns (452, 454, 456, 458), and a coverlay (460).

[0090] The first base substrate (400) is a plate-shaped substrate having a first surface and a second surface opposite the first surface. A radiation region and a terminal region may be defined on the first surface of the first base substrate (400).

[0091] As an example, the first base substrate (400) is a printed circuit board having a first radiation pattern (420), a plurality of terminal patterns (432, 434, 436, 438), a plurality of bonding patterns (441 to 146), and a plurality of connection patterns (452, 454, 456, 458) printed on the first surface.

[0092] The first radiation pattern (420) is arranged on the first surface of the first base substrate (400). The first radiation pattern (420) is arranged in the radiation area of ​​the first base substrate (400). The first radiation pattern (420) may be a loop pattern formed in a loop shape that winds on the first surface of the first base substrate (400).

[0093] A first end of the first radiation pattern (420) is positioned in an outer region of the loop formed by the first radiation pattern (420) and is electrically connected to a first bonding pattern (441). A second end of the first radiation pattern (420) is positioned in an inner region of the loop formed by the first radiation pattern (420) and is electrically connected to a third bonding pattern (443).

[0094] In this way, the antenna module according to an embodiment of the present invention can reduce the manufacturing cost of the antenna module compared to a general antenna module composed of a double-sided printed circuit board by configuring the first antenna substrate (400) as a single-sided printed circuit board.

[0095] The first terminal pattern (432) is arranged on the first surface of the first base substrate (400). The first terminal pattern (432) is arranged in the terminal area of ​​the first base substrate (400). The first terminal pattern (432) is electrically connected to the first end of the first connection pattern (452) to be described later.

[0096] The second terminal pattern (434) is arranged on the first surface of the first base substrate (400). The second terminal pattern (434) is arranged in the terminal area of ​​the first base substrate (400), but is arranged so as to be spaced apart from the first terminal pattern (432) by a predetermined distance. The second terminal pattern (434) is electrically connected to the first end of the second connection pattern (454).

[0097] The third terminal pattern (436) is arranged on the first surface of the first base substrate (400). The third terminal pattern (436) is arranged in the terminal area of ​​the first base substrate (400), and is arranged to face the second terminal pattern (434) with the first terminal pattern (432) interposed therebetween. The third terminal pattern (436) is electrically connected to the first end of the third connection pattern (456) to be described later.

[0098] The fourth terminal pattern (438) is arranged on the first surface of the first base substrate (400). The fourth terminal pattern (438) is arranged in the terminal area of ​​the first base substrate (400), and is arranged to face the first terminal pattern (432) with the second terminal pattern (434) interposed therebetween. The fourth terminal pattern (438) is electrically connected to the first end of the fourth connection pattern (458) to be described later.

[0099] The first bonding pattern (441) is arranged on the first surface of the first base substrate (400). The first bonding pattern (441) is arranged in the radiation area of ​​the first base substrate (400), but is arranged in the outer area of ​​the loop formed by the first radiation pattern (420). The first bonding pattern (441) is electrically connected to the first end of the first radiation pattern (420).

[0100] The second bonding pattern (442) is arranged on the first surface of the first base substrate (400), but is arranged in the radiating area of ​​the first base substrate (400). The second bonding pattern (442) is electrically connected to the second end of the first connection pattern (452).

[0101] The first bonding pattern (441) and the second bonding pattern (442) are patterns to which the first connecting material (240) is bonded to electrically connect the first end of the first radiation pattern (420) to the first terminal pattern (432).

[0102] The third bonding pattern (443) is arranged on the first surface of the first base substrate (400). The third bonding pattern (443) is arranged in the radiation area of ​​the first base substrate (400), but is arranged in the inner area of ​​the loop formed by the first radiation pattern (420). The third bonding pattern (443) is electrically connected to the second end of the first radiation pattern (420).

[0103] The fourth bonding pattern (444) is arranged on the first surface of the first base substrate (400), but is arranged in the radiating area of ​​the first base substrate (400). The fourth bonding pattern (444) is arranged to be spaced apart from the second bonding pattern (442) and is electrically connected to the second end of the second connection pattern (454).

[0104] The third bonding pattern (443) and the fourth bonding pattern (444) are patterns in which the second connecting material (260) is bonded to electrically connect the second end of the first radiation pattern (420) to the second terminal pattern (434).

[0105] The fifth bonding pattern (445) is arranged on the first surface of the first base substrate (400), but is arranged in the radiation area of ​​the first base substrate (400). The fifth bonding pattern (445) is arranged to be spaced apart from the second bonding pattern (442) and the fourth bonding pattern (444), and is electrically connected to the second end of the third connection pattern (456).

[0106] The sixth bonding pattern (446) is arranged on the first surface of the first base substrate (400), but is arranged in the radiation area of ​​the first base substrate (400). The sixth bonding pattern (446) is arranged to be spaced apart from the second bonding pattern (442), the fourth bonding pattern (444), and the fifth bonding pattern (445), and is electrically connected to the second end of the fourth connection pattern (458).

[0107] The fifth bonding pattern (445) and the sixth bonding pattern (446) are patterns for electrically connecting both ends of the radiation pattern of the second antenna substrate (300) to the third terminal pattern (436) and the fourth terminal pattern (438), respectively.

[0108] A first connection pattern (452) is disposed on a first surface of a first base substrate (400). The first connection pattern (452) is disposed in a terminal region of the first base substrate (400). The first connection pattern (452) is a conductive pattern that electrically connects the first terminal pattern (432) and the second bonding pattern (442). A first end of the first connection pattern (452) is electrically connected to the first terminal pattern (432), and a second end of the first connection pattern (452) is electrically connected to the second bonding pattern (442).

[0109] The second connection pattern (454) is arranged on the first surface of the first base substrate (400). The second connection pattern (454) is arranged in the terminal region of the first base substrate (400). The second connection pattern (454) is a conductive pattern that electrically connects the second terminal pattern (434) and the fourth bonding pattern (444). The first end of the second connection pattern (454) is electrically connected to the second terminal pattern (434), and the second end of the second connection pattern (454) is electrically connected to the fourth bonding pattern (444).

[0110] A third connection pattern (456) is disposed on a first surface of a first base substrate (400). The third connection pattern (456) is disposed in a terminal region of the first base substrate (400). The third connection pattern (456) is a conductive pattern that electrically connects the third terminal pattern (436) and the fifth bonding pattern (445). A first end of the third connection pattern (456) is electrically connected to the third terminal pattern (436), and a second end of the third connection pattern (456) is electrically connected to the fifth bonding pattern (445).

[0111] The fourth connection pattern (458) is arranged on the first surface of the first base substrate (400). The fourth connection pattern (458) is arranged in the terminal region of the first base substrate (400). The fourth connection pattern (458) is a conductive pattern that electrically connects the fourth terminal pattern (438) and the sixth bonding pattern (446). A first end of the fourth connection pattern (458) is electrically connected to the fourth terminal pattern (438), and a second end of the fourth connection pattern (458) is electrically connected to the sixth bonding pattern (446).

[0112] A coverlay (460) is disposed on a first surface of a first base substrate. The coverlay (460) is disposed on a first radiation pattern (420), a plurality of terminal patterns (432, 434, 436, 438), a plurality of bonding patterns (441 to 446), and a plurality of connection patterns (452, 454, 456, 458) formed on the first surface of the first base substrate (410).

[0113] A plurality of holes (461 to 467) are formed in the coverlay (460) to expose a plurality of terminal patterns (432, 434, 436, 438) and a plurality of bonding patterns (441 to 446).

[0114] A plurality of first holes (461) are formed through the coverlay (460) and are formed in an area overlapping with a plurality of terminal patterns (432, 434, 436, 438). A second hole (462) is formed through the coverlay (460) and is formed in an area overlapping with the first bonding pattern (441). A third hole (463) is formed through the coverlay (460) and is formed in an area overlapping with the second bonding pattern (442). A fourth hole (464) is formed through the coverlay (460) and is formed in an area overlapping with the third bonding pattern (443). A fifth hole (465) is formed through the coverlay (460) and is formed in an area overlapping with the fourth bonding pattern (444). The sixth hole (466) is formed by penetrating the coverlay (460), but is formed in an area overlapping the fifth bonding pattern (445).

[0115] As the coverlay (460) is arranged on the first surface of the first base substrate (410), the plurality of terminal patterns (432 to 438) are each exposed through the plurality of first holes (461). The first bonding pattern (441) is exposed through the second hole (462). The second bonding pattern (442) is exposed through the third hole (463). The third bonding pattern (443) is exposed through the fourth hole (464). The fourth bonding pattern (444) is exposed through the fifth hole (465). The fifth bonding pattern (445) is exposed through the sixth hole (466). The fifth bonding pattern (446) is exposed through the seventh hole (467).

[0116] Referring to FIG. 11, a first connecting member (520) is formed on the surface of a coverlay (460) and electrically connects the first bonding pattern (441) and the second bonding pattern (442). As the first connecting member (520) electrically connects the first bonding pattern (441) and the second bonding pattern (442), a first end of the first radiation pattern (420) is electrically connected to the first terminal pattern (432).

[0117] The second connecting material (540) is formed on the surface of the coverlay (460) and electrically connects the third bonding pattern (443) and the fourth bonding pattern (444). As the second connecting material (540) electrically connects the third bonding pattern (443) and the fourth bonding pattern (444), the second end of the first radiation pattern (420) is electrically connected to the second terminal pattern (434).

[0118] The first connecting substrate (520) and the second connecting substrate (540) may be formed by printing a conductive material on the surface of the coverlay (460). The first connecting substrate (520) and the second connecting substrate (540) may be formed of a conductive sheet and may be configured to be attached / bonded to the surface of the coverlay (460) to electrically connect the bonding patterns.

[0119] Referring to FIG. 12, an insulating material (560) is formed on the surface of the coverlay (460) to cover a portion of the coverlay (460). The insulating material (560) is formed to cover an area including the first connecting material (520) and the second connecting material (540).

[0120] The insulating substrate (560) can be formed by printing an insulating material on the surface of the coverlay (460). The insulating substrate (560) can be composed of an insulating sheet and attached / bonded to the surface of the coverlay (460).

[0121] Referring to FIG. 13, connecting materials (520, 540) are formed on the surface of the coverlay (460) and electrically connect the bonding patterns (441, 443, 442, 444) exposed through the holes (462, 464, 463, 465) of the coverlay (460). Accordingly, both ends of the first radiation pattern (420) are electrically connected to the first terminal pattern (432) and the second terminal pattern (434), respectively, to operate as an antenna resonating in the first frequency band.

[0122] In this way, the antenna module according to the second embodiment of the present invention can simplify the pattern of the first antenna substrate (100) by configuring the first radiation pattern (120) of the first antenna substrate (100) as a cross-sectional pattern and connecting both ends of the first radiation pattern (120) to a terminal pattern through a connecting substrate, compared to a conventional antenna module that uses a double-sided pattern in the first antenna substrate (100).

[0123] In addition, the antenna module according to the second embodiment of the present invention configures the first radiation pattern (120) of the first antenna substrate (100) as a cross-sectional pattern, and connects both ends of the first radiation pattern (120) to a terminal pattern through a connecting substrate, thereby simplifying the pattern of the first antenna substrate (100), thereby reducing the manufacturing cost compared to a conventional antenna module that uses a double-sided pattern on the first antenna substrate (100).

[0124] The above description is merely an illustrative illustration of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A first antenna substrate having a first radiation pattern resonating with a signal of a first frequency band, a first terminal pattern spaced apart from each other, and a second terminal pattern; An insulating material disposed on the first antenna substrate; A first connecting material disposed on the insulating material and connecting a first end of the first radiation pattern exposed by the insulating material to the first terminal pattern; and An antenna module comprising a second connecting member arranged on the insulating member and spaced apart from the first connecting member, the second end of the first radiation pattern exposed through the insulating member connecting the second end to the second terminal pattern.

2. In paragraph 1, The above first antenna substrate is, A first base substrate having a first side and a second side, and having the first radiation pattern, the first terminal pattern, and the second terminal pattern formed on the first side; A first connection pattern disposed on a first surface of the first base substrate and having a first end connected to the first terminal pattern; A second connection pattern disposed on the first surface of the first base substrate and having a first end connected to the second terminal pattern; A first bonding pattern disposed on a first surface of the first base substrate and connected to a first end of the first radiation pattern; A second bonding pattern disposed on the first surface of the first base substrate and connected to the second end of the first connection pattern; A third bonding pattern disposed on the first surface of the first base substrate and connected to the second end of the first radiation pattern; and An antenna module comprising a fourth bonding pattern disposed on a first surface of the first base substrate and connected to a second end of the second bonding pattern.

3. In paragraph 2, An antenna module in which the insulating material is formed by printing an insulating material on the first surface of the first base material, and is formed in an area including an area overlapping the first bonding pattern, the second bonding pattern, the third bonding pattern, and the fourth bonding pattern.

4. In paragraph 2, In the above insulating material, A first hole penetrating the insulating material in an area overlapping the first bonding pattern to expose the first bonding pattern; A second hole penetrating the insulating material in an area overlapping the second bonding pattern to expose the second bonding pattern; A third hole penetrating the insulating material in an area overlapping the third bonding pattern to expose the third bonding pattern; and An antenna module having a fourth hole formed through the insulating material in an area overlapping the fourth bonding pattern to expose the fourth bonding pattern.

5. In paragraph 2, The above first connecting device is, An antenna module formed by printing a conductive material on the surface of the insulating material, and connected to the first bonding pattern exposed through the first hole of the insulating material and the second bonding pattern exposed through the second hole of the insulating material.

6. In paragraph 2, The above second connecting device is, An antenna module formed by printing a conductive material on the surface of the insulating substrate, and connected to the third bonding pattern exposed through the third hole of the insulating substrate and the fourth bonding pattern exposed through the fourth hole of the insulating substrate.

7. In paragraph 2, The above first antenna substrate is, A third terminal pattern arranged on the first surface of the first base substrate; and An antenna module further comprising a third connection pattern disposed on a first surface of the first base substrate, the first end of which is connected to the third terminal pattern, and disposed to pass between the first bonding pattern and the second bonding pattern.

8. In paragraph 7, The above first antenna substrate is, A fourth terminal pattern arranged on the first surface of the first base substrate; and An antenna module further comprising a fourth connection pattern disposed on a first surface of the first base substrate, the first end of which is connected to the fourth terminal pattern, and disposed to face the third connection pattern with the first connection pattern and the second connection pattern interposed therebetween.

9. In paragraph 8, Further comprising a second antenna substrate having a second antenna resonating with a signal of a second frequency band different from the first frequency band, The above first antenna substrate is, A fifth bonding pattern connected to the second end of the third bonding pattern; and Further comprising a sixth bonding pattern connected to the second end of the fourth bonding pattern, The first end of the second antenna is connected to the fourth bonding pattern, An antenna module in which the second end of the second antenna is connected to the fifth bonding pattern.

10. A first antenna substrate having a first radiation pattern resonating with a signal of a first frequency band, a first terminal pattern spaced apart from each other, and a second terminal pattern; A first connecting material disposed on the first antenna substrate and connecting a first end of the first radiation pattern to the first terminal pattern; A second connecting material disposed on the first antenna substrate and spaced apart from the first connecting material, and connecting the second end of the first radiation pattern to the second terminal pattern; and An antenna module comprising an insulating material disposed on the surface of the first antenna material, the first connection material, and the second connection material.

11. In paragraph 10, The above first antenna substrate is, A first base substrate having a first side and a second side, and having the first radiation pattern, the first terminal pattern, and the second terminal pattern formed on the first side; A first connection pattern disposed on a first surface of the first base substrate and having a first end connected to the first terminal pattern; A second connection pattern disposed on the first surface of the first base substrate and having a first end connected to the second terminal pattern; A first bonding pattern disposed on a first surface of the first base substrate and connected to a first end of the first radiation pattern; A second bonding pattern disposed on the first surface of the first base substrate and connected to the second end of the first connection pattern; A third bonding pattern disposed on the first surface of the first base substrate and connected to the second end of the first radiation pattern; A fourth bonding pattern disposed on the first surface of the first base substrate and connected to the second end of the second connection pattern; and An antenna module comprising a coverlay disposed on a first surface of the first base substrate and disposed on the first radiation pattern, the first terminal pattern, the second terminal pattern, and the first to fourth bonding patterns.

12. In paragraph 11, In the above coverlay, A plurality of first holes penetrating the coverlay in an area overlapping the first terminal pattern and the second terminal pattern to expose the first terminal pattern and the second terminal pattern; A second hole penetrating the coverlay in an area overlapping the first bonding pattern to expose the first bonding pattern; A third hole penetrating the coverlay in an area overlapping the second bonding pattern to expose the second bonding pattern; A fourth hole penetrating the coverlay in an area overlapping the third bonding pattern to expose the third bonding pattern; and An antenna module having a fifth hole formed through the coverlay in an area overlapping the fourth bonding pattern to expose the fourth bonding pattern.

13. In paragraph 12, The above first connecting device is, An antenna module formed by printing a conductive material on the surface of the coverlay, and connected to the first bonding pattern exposed through the second hole of the coverlay and the second bonding pattern exposed through the third hole of the coverlay.

14. In paragraph 12, The above second connecting device is, An antenna module formed by printing a conductive material on the surface of the coverlay, and connected to the third bonding pattern exposed through the fourth hole of the coverlay and the fourth bonding pattern exposed through the fifth hole of the coverlay.

15. In paragraph 11, The above first antenna substrate is, A third terminal pattern arranged on the first surface of the first base substrate; A fourth terminal pattern arranged on the first surface of the first base substrate; A third connection pattern disposed on the first surface of the first base substrate, the first end of which is connected to the third terminal pattern, and disposed so as to pass between the first bonding pattern and the second bonding pattern; A fourth connection pattern disposed on the first surface of the first base substrate, the first end of which is connected to the fourth terminal pattern, and is disposed to face the third connection pattern with the first connection pattern and the second connection pattern interposed therebetween; A fifth bonding pattern connected to the second end of the third bonding pattern; and An antenna module further comprising a sixth bonding pattern connected to the second end of the fourth bonding pattern.

16. In paragraph 15, Further comprising a second antenna substrate having a second antenna resonating with a signal of a second frequency band different from the first frequency band, In the above coverlay, A sixth hole penetrating the coverlay in an area overlapping the fifth bonding pattern to expose the fifth bonding pattern; and A seventh hole is further formed to penetrate the coverlay and expose the sixth bonding pattern in an area overlapping the sixth bonding pattern, An antenna module in which the first end of the second antenna is connected to the fifth bonding pattern exposed through the sixth hole of the coverlay, and the second end of the second antenna is connected to the sixth bonding pattern exposed through the seventh hole of the coverlay.

Images