Heat dissipation test system and method, and apparatus, device and computer program product

Abstract

Provided in the present application are a heat dissipation test system and method, and an apparatus, a device and a computer program product. The heat dissipation test system comprises a heat dissipation apparatus and a plurality of heat production simulation apparatuses, wherein each heat production simulation apparatus is used for simulating a heat production component that requires heat dissipation in a server, the plurality of heat production simulation apparatuses are accommodated in the same box body, and actual heat dissipation components simulated by the plurality of heat production simulation apparatuses are not components in the same server; and the heat dissipation apparatus is used for performing cooling treatment on the plurality of heat production simulation apparatuses. In the heat dissipation test system, actual heat dissipation components that actually require heat dissipation in servers are simulated by the heat production simulation apparatuses, and since the heat production simulation apparatuses are not actual heat dissipation assemblies in the servers, even if a heat generation simulation apparatus is damaged during a test, damage to a server would not be caused, thereby alleviating the problem in the related art of high test cost being caused by server damage when a real server is used to test a liquid cooling cabinet.

Description

Thermal testing system, method, device, equipment and computer program product

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on and claims the priority of Chinese patent application with application number 202410402213.0 and application date April 3, 2024. The entire content of the Chinese patent application is hereby incorporated into this disclosure as a reference. Technical Field

[0003] The present application belongs to the field of infrastructure technology, and specifically relates to a heat dissipation testing system, method, device, equipment and computer program product. Background Art

[0004] Data centers are critical infrastructure and support for the development of the digital economy. The current boom in high-performance computing, coupled with the deepening of research in artificial intelligence (AI) and machine learning (ML), has led to a rapid increase in the heat dissipation required by data center servers. Traditional air cooling is increasingly unable to meet these needs, and research in server liquid cooling technology is gradually gaining a dominant position.

[0005] Cold plate liquid cooling is a rapidly developing server liquid cooling technology. It uses a liquid cooling cabinet to cool the server's main heat-generating components. Before using a liquid cooling cabinet, it must be tested to ensure effective cooling. In related technologies, testing a liquid cooling cabinet involves installing the server inside the cabinet. However, due to the high cost of servers, simply installing the server inside the cabinet for testing can lead to high costs due to server damage if the cooling effect is poor. Summary of the Invention

[0006] The present application proposes a heat dissipation testing system, method, device, equipment and computer program product, which can alleviate the technical problem of high testing costs existing in related technologies.

[0007] The first embodiment of the present application provides a heat dissipation testing system, including:

[0008] A heat dissipation device and multiple heat generation simulation devices, each of the heat generation simulation devices is used to simulate a heat-generating component in a server that needs to dissipate heat. The heat dissipation device and the multiple heat generation simulation devices are housed in the same housing, and the actual heat dissipation components simulated by the multiple heat generation simulation devices are not components in the same server.

[0009] The heat dissipation device is used to cool down the multiple heat generation simulation devices.

[0010] In one or more embodiments, each of the heat generation simulation devices comprises:

[0011] A liquid-cooling heat generation simulation device and a circulation pipeline connected to the liquid-cooling heat generation simulation device;

[0012] The heat dissipation device includes a liquid cooling cabinet connected to the circulation pipeline;

[0013] The liquid cooling cabinet delivers cooling liquid to each of the liquid cooling heat generation simulation devices through the circulation pipeline, and performs heat exchange with each of the liquid cooling heat generation simulation devices through the cooling liquid.

[0014] In one or more embodiments, the heat dissipation device includes:

[0015] Air cooling device;

[0016] Each of the heat generation simulation devices comprises:

[0017] An air-cooling heat generation simulation device is located within the blowing range of the air-cooling device.

[0018] In one or more embodiments, each of the liquid-cooling heat generation simulation devices includes:

[0019] Heat exchange components and heat generation components;

[0020] The heat exchange component is provided with a cavity, and the heating component is provided below the heat exchange component;

[0021] The cavity is connected to the circulation pipeline and is used to achieve heat exchange between the liquid flowing in the circulation pipeline and the heating component.

[0022] In one or more embodiments, the heat exchange assembly comprises:

[0023] Friction parts and friction adjustment devices;

[0024] The friction member is connected to the circulation pipeline and the friction regulating device respectively.

[0025] In one or more embodiments, the heat dissipation testing system further includes:

[0026] A telescopic device provided on the box of each of the liquid-cooled heat generation simulation devices;

[0027] The telescopic device is used to adapt to the specifications of each of the liquid-cooling heat-generating devices and fix each of the liquid-cooling heat-generating simulation devices on the box body.

[0028] In one or more embodiments, the heat dissipation testing system further includes:

[0029] A liquid cooling parameter acquisition device provided in the circulation pipeline;

[0030] The liquid cooling parameter acquisition device includes at least one of a pressure sensor, a temperature sensor and a flow sensor.

[0031] In one or more embodiments, the heat dissipation testing system further includes:

[0032] Friction adjustment control device;

[0033] The friction adjustment control device is connected to the friction adjustment device, and is used to determine the adjustment parameters of the friction adjustment device corresponding to each of the liquid-cooled heat production simulation devices based on the specification parameters of each of the liquid-cooled heat production simulation devices, and adjust the friction adjustment device corresponding to each of the liquid-cooled heat production simulation devices based on the adjustment parameters.

[0034] In one or more embodiments, the liquid cooling cabinet comprises:

[0035] A manifold connected to the circulation pipeline, used to evenly distribute the coolant transmitted in the circulation pipeline to each of the liquid-cooled heat generation simulation devices;

[0036] The heat dissipation test system further includes:

[0037] A liquid cooling control device connected to the liquid cooling parameter acquisition device;

[0038] The liquid cooling control device is used to obtain the flow rate of the coolant transmitted in the circulation pipeline for heat exchange with each of the liquid cooling heat production simulation devices through the liquid cooling parameter acquisition equipment, and obtain the flow uniformity test result of the manifold based on the flow rate; when the flow rates corresponding to each of the liquid cooling heat production simulation devices are the same, it is determined that the flow uniformity test result indicates that the flow uniformity test of the manifold has passed.

[0039] In one or more embodiments, the heat dissipation testing system further includes:

[0040] Air cooling control device and air cooling parameter acquisition equipment;

[0041] The air cooling control device is used to obtain the heat dissipation and temperature change parameters of the air cooling heat generation simulation device through the air cooling parameter acquisition equipment, and determine the heat dissipation effect of the air cooling device based on the heat dissipation and the temperature change.

[0042] A second embodiment of the present application provides a heat dissipation test method, which is performed by the heat dissipation test system including the manifold in the first aspect. The method includes:

[0043] The flow rate of the coolant transmitted in the circulation pipeline for heat exchange with each of the liquid-cooled heat generation simulation devices is obtained by the liquid-cooling parameter acquisition device;

[0044] Obtaining a flow uniformity test result of the manifold based on the flow rate;

[0045] Wherein, when the flow rates corresponding to the liquid-cooling heat generation simulation devices are the same, determining the flow uniformity test result indicates that the flow uniformity test of the manifold has passed.

[0046] A third aspect of the present application provides a liquid cooling test device, which is applied to the heat dissipation test system including the manifold in the first aspect. The device includes:

[0047] an acquisition module, configured to acquire, through the liquid cooling parameter acquisition device, the flow rate of the coolant transmitted in the circulation pipeline for heat exchange with each of the liquid cooling heat generation simulation devices;

[0048] A testing module, configured to obtain a flow uniformity test result of the manifold based on the flow rate;

[0049] Wherein, when the flow rates corresponding to the liquid-cooling heat generation simulation devices are the same, determining the flow uniformity test result indicates that the flow uniformity test of the manifold has passed.

[0050] A fourth aspect of the present application provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method described in the second aspect.

[0051] A fifth aspect of the present application provides a computer program product, comprising a computer-readable code. When the computer-readable code runs in a processor of an electronic device, the processor in the electronic device executes the method described in the second aspect.

[0052] The technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0053] In the embodiments of the present application, a heat generation simulation device is used in the heat dissipation testing system to simulate the actual heat dissipation components in the server that actually need to dissipate heat. Since the heat generation simulation device is not an actual heat dissipation component in the server, even if the heat generation simulation device is damaged during the test, the server will not be damaged. This alleviates the high testing cost caused by server damage when testing liquid-cooled cabinets using real servers in the related art. In addition, since the heat generation simulation device is only used to simulate the heat generation of the server, it generally does not have the computing processing power of the server. As a result, the heat generation simulation device has a relatively small size, allowing multiple heat generation simulation devices to be concentrated in the same box, reducing the test space occupied and the difficulty of assembling the heat dissipation testing system.

[0054] Additional aspects and advantages of the present application will be given in part in the description below and in part will become apparent from the description below or learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. Throughout the accompanying drawings, the same reference numerals are used to denote the same components.

[0056] In the attached figure:

[0057] FIG1 is a front view schematic diagram of a heat dissipation testing system provided in one embodiment of the present application;

[0058] FIG2 shows a schematic top view of a heat dissipation testing system provided in one embodiment of the present application;

[0059] FIG3 shows a schematic structural diagram of a heat dissipation testing system provided in an embodiment of the present application;

[0060] FIG4 is a schematic diagram showing a flow chart of a heat dissipation testing method provided in an embodiment of the present application;

[0061] FIG5 shows a schematic structural diagram of a liquid cooling test device provided in one embodiment of the present application;

[0062] FIG6 shows a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0063] FIG7 shows a schematic diagram of a storage medium provided in an embodiment of the present application. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0065] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0066] The term "and / or" in this application merely describes an associative relationship, indicating that three relationships may exist. For example, "A and / or B" may represent three situations: the existence of A alone, the existence of both A and B, and the existence of B alone. Furthermore, the term "at least one" in this application represents any combination of at least two of any one or more of a plurality of items. For example, "at least one of A, B, and C" may represent any one or more elements selected from the set consisting of A, B, and C.

[0067] A liquid-cooled cabinet typically consists of a CDU (Cooling Distribution Unit), a manifold (manifold), heat exchanger plates, and circulation piping. When the cabinet is operating, low-temperature coolant flows from the CDU and enters the manifold through the circulation piping. The manifold distributes the low-temperature liquid and sends it to the corresponding heat exchanger plates. There, the low-temperature coolant exchanges heat with the components requiring heat dissipation, turning it into high-temperature coolant. The high-temperature coolant then flows through the circulation piping, through the manifold, and returns to the CDU for heat exchange, becoming low-temperature coolant again.

[0068] In related technologies, when testing liquid-cooled cabinets, servers are installed in the cabinet. Multiple servers can be installed in the same cabinet, with the servers acting as the heat sink for the cabinet. However, if the cooling effect of the cabinet is poor, directly installing the server in the cabinet for testing may damage the server. Servers are generally expensive, so if a server fails during testing, the overall cost of the test will be increased.

[0069] In order to alleviate the problems existing in the related art, the embodiments of the present application provide a heat dissipation test system, method, device, server and computer program product. In the heat dissipation test system, a heat generation simulation device is used to simulate the actual heat dissipation components in the server that actually need to dissipate heat. Since the heat generation simulation device is not the actual heat dissipation component in the server, even if the heat generation simulation device is damaged during the test, it will not cause damage to the server, thereby alleviating the problem of high testing costs caused by server damage when using real servers to test liquid cooling cabinets in the related art. In addition, since the heat generation simulation device is only used to simulate the heat generation of the server, the heat generation simulation device usually does not have the computing processing power of the server, so the heat generation simulation device has a relatively small volume, so that multiple heat generation simulation devices are concentrated in the same box, reducing the occupancy of the test space and the difficulty of assembling the heat dissipation test system.

[0070] The following describes a heat dissipation testing system, method, device, server, and computer program product proposed according to embodiments of the present application in conjunction with the accompanying drawings.

[0071] As shown in Figures 1 to 3, the heat dissipation test system may include:

[0072] A heat dissipation device 11 and multiple heat generation simulation devices 12, each heat generation simulation device 12 is used to simulate a heat-generating component in a server that needs to dissipate heat. The heat dissipation device 11 and the multiple heat generation simulation devices 12 are housed in the same housing 13. The actual heat dissipation components simulated by the multiple heat generation simulation devices are not components in the same server.

[0073] The heat dissipation device 11 is used to cool down the plurality of heat generation simulation devices 12 .

[0074] In the solution provided by this embodiment, a heat generation simulation device is used in the heat dissipation testing system to simulate the actual heat dissipation components in the server that actually need to dissipate heat. Since the heat generation simulation device is not an actual heat dissipation component in the server, even if the heat generation simulation device is damaged during the test, it will not cause damage to the server. This alleviates the high testing costs caused by server damage when testing liquid-cooled cabinets using real servers in the related art. In addition, since the heat generation simulation device is only used to simulate the heat generation of the server, it generally does not have the computing power of the server. As a result, the heat generation simulation device has a relatively small size, allowing multiple heat generation simulation devices to be concentrated in the same box, reducing the test space occupied and the difficulty of assembling the heat dissipation testing system.

[0075] In one or more embodiments, as shown in FIG1-FIG3, each heat generation simulation device 12 includes:

[0076] A liquid cooling heat generation simulation device 121 and a circulation pipeline 122 connected to the liquid cooling heat generation simulation device 121;

[0077] The heat dissipation device 11 includes a liquid cooling cabinet 111 connected to a circulation pipeline 122;

[0078] The liquid cooling cabinet 111 delivers cooling liquid to each liquid cooling heat generation simulation device 121 through a circulation pipeline 122 , and performs heat exchange with each liquid cooling heat generation simulation device 121 through the cooling liquid.

[0079] In this embodiment, the liquid-cooling heat generation simulation device 121 is used to simulate an actual heat dissipation component in a server that uses cold plate liquid cooling technology. Typically, the actual heat dissipation component is the primary heat dissipation component in the server. The liquid-cooling heat generation simulation device 121 has the same heat generation power as the actual heat dissipation component it is simulating.

[0080] It should be understood that actual heat sinks are typically chips within servers. Since actual heat sinks are significantly less expensive than chips, when simulating actual heat sinks with a liquid-cooled heat generation simulator, only the heat generated by the actual heat sinks can be considered, without requiring the simulator to possess the computing power of chips. The computing power of a chip directly impacts its cost, and thus the cost of the server in which it is deployed. Therefore, compared to directly installing a liquid-cooled cabinet within a server for testing, using a liquid-cooled simulator to simulate actual heat sinks can significantly reduce testing costs. Damage to the simulator will not affect the expensive chips within the server where the actual heat sinks reside.

[0081] It should be understood that in actual applications, a set of liquid-cooling cabinets usually dissipates heat for the actual heat dissipation components in multiple servers at the same time. Therefore, in order to adapt to the actual operating environment of the liquid-cooling cabinet, this embodiment sets up multiple liquid-cooling heat generation simulation devices so that the liquid-cooling cabinet can dissipate heat for multiple liquid-cooling heat generation simulation devices, so that the test results obtained are closer to reality.

[0082] In this embodiment, during the process of the liquid-cooling cabinet performing heat dissipation processing on multiple liquid-cooling heat-generating simulation devices, the heat dissipation of each liquid-cooling heat-generating simulation device and other parameters that can characterize the heat dissipation effect of the liquid-cooling cabinet can be manually collected through working condition collection equipment such as temperature measuring equipment, thereby analyzing the heat dissipation effect of the liquid-cooling cabinet.

[0083] In one or more embodiments, as shown in FIG2 , which is a top view of a heat dissipation test system, each liquid cooling heat generation simulation device 121 includes:

[0084] Heat exchange component 1211 and heat generating component 1212;

[0085] The heat exchange component 1211 is provided with a cavity, and the heating component 1212 is provided below the heat exchange component 1211;

[0086] The cavity is connected to the circulation pipeline 122 to achieve heat exchange between the liquid flowing in the circulation pipeline 122 and the heating component 1212 .

[0087] In this embodiment, the cavity of the heat exchange component 1211 is connected to the circulation pipe 122, so that coolant flows through the heat exchange component 1211. Due to the low temperature of the coolant, heat exchange between the coolant and the heating component 1212 is completed in the cavity. The heating component 1212 transfers heat to the cooling element, the coolant absorbs the heat, and the heating element 1212 dissipates heat. The coolant temperature rises, while the temperature of the heating element 1212 decreases. The high-temperature coolant flows back to the liquid-cooled cabinet 111 through the circulation pipe 122, where it becomes low-temperature coolant and continues to dissipate heat from the liquid-cooled heat generation simulation device 121 through the circulation pipe 122.

[0088] In this embodiment, the heating component 1212 includes but is not limited to a heating block.

[0089] In one or more embodiments, as shown in FIG2 , the heat exchange component 1211 may include:

[0090] Friction member 12111 and friction adjustment device 12112;

[0091] The friction member 12111 is connected to the circulation pipeline 122 and the friction adjustment device 12112 respectively.

[0092] It should be noted that the arrows in Figures 1-3 represent subordinate relationships to help understanding. For example, the arrows between 12112, 1211 and 121 in Figure 2 indicate that the friction adjustment device 12112 belongs to the heat exchange component 1211, and the heat exchange component 1211 belongs to the liquid cooling heat generation simulation device 121.

[0093] In this embodiment, there is a cavity inside the friction resistance member 12111, which is used to circulate coolant and provide space for heat exchange between the coolant and the heating component 1212. A friction resistance adjustment device 12112 is provided inside the friction resistance member 12111. The friction resistance adjustment device 12112 can adjust the friction resistance of the friction resistance member 12111 according to demand, and thereby adjust the flow rate of coolant entering and exiting the friction resistance member.

[0094] The friction member 12111 is connected to the circulation pipeline 122, so that the coolant can enter the friction member 12111 to exchange heat with the heating component 1212. The low-temperature coolant is distributed by the Manifold included in the liquid-cooled cabinet 111 into the coolant supply pipe of the friction member 12111, enters the friction member 12111 to exchange heat with the heating component 1212 to become high-temperature coolant, and then returns to the Manifold through the coolant return pipe, and then enters the CDU through the circulation pipeline for heat exchange, becoming low-temperature coolant, completing the cycle.

[0095] In one or more embodiments, as shown in FIG3 , which shows a schematic structural diagram of a heat dissipation testing system, the heat dissipation testing system may further include:

[0096] A telescopic device 14 is provided on the housing of each liquid-cooled heat generation simulation device 121;

[0097] The telescopic device 14 is used to adapt to the specifications of each liquid-cooling heat generating device 121 and fix each liquid-cooling heat generating simulation device 121 on the box body 13 .

[0098] The retractable dimensions of the telescopic device 14 can be determined based on the specifications of the liquid cooling cabinet being tested. For example, the telescopic device can be configured to be retractable to 21 inches and 19 inches, thereby flexibly adapting to common 21-inch and 19-inch liquid cooling cabinets currently on the market.

[0099] In one or more embodiments, as shown in FIG1-FIG3 , the heat dissipation testing system further includes:

[0100] Liquid-cooled parameter acquisition equipment 15 provided in the circulation pipeline 122;

[0101] The liquid cooling parameter acquisition device 15 includes at least one of a pressure sensor, a temperature sensor, and a flow sensor.

[0102] In this embodiment, the liquid cooling parameter acquisition device 15 is used to acquire liquid cooling operating parameters. Liquid cooling operating parameters include, but are not limited to, the temperature and flow rate of the coolant transmitted in the circulation pipeline 122. Specifically, the pressure sensor is used to acquire the pressure of the coolant when it is transmitted in the circulation pipeline 122, the temperature sensor is used to acquire the temperature of the coolant transmitted in the circulation pipeline 122, and the flow sensor is used to acquire the flow rate of the coolant transmitted in the circulation pipeline 122. In application, after the liquid cooling parameter acquisition device acquires the liquid cooling operating parameters, it can directly display the liquid cooling operating parameters, which makes it convenient for staff to read the liquid cooling operating parameters and judge the liquid cooling effect of the liquid cooling cabinet 111 based on the liquid cooling operating parameters.

[0103] It should be understood that the circulation pipeline 122 may further include a liquid inlet pipeline and a liquid outlet pipeline. When a liquid cooling parameter acquisition device is installed on the circulation pipeline 122, a liquid cooling parameter acquisition device 15 may be installed on the liquid inlet pipeline and / or the liquid outlet pipeline at the same time, depending on monitoring needs. For example, a temperature sensor may be installed on both the liquid inlet pipeline and the liquid outlet pipeline. Another example is that a pressure sensor and a flow sensor may be installed on the liquid inlet pipeline.

[0104] In one or more embodiments, as shown in FIG1-FIG3 , the heat dissipation testing system further includes:

[0105] Friction adjustment control device 16;

[0106] The friction adjustment control device 16 is connected to the friction adjustment device 12112, and is used to determine the adjustment parameters of the friction adjustment device 12112 corresponding to each liquid-cooled heat production simulation device 121 based on the specification parameters of each liquid-cooled heat production simulation device 121, and adjust the friction adjustment device 12112 corresponding to each liquid-cooled heat production simulation device 121 based on the adjustment parameters.

[0107] In this embodiment, the specification parameters are used to describe the external dimensions of the liquid-cooled heat generation simulation device, and the rule parameters affect the heat dissipation requirements of the liquid-cooled heat generation simulation device. Generally, the larger the specification parameters, the higher the heat generation of the liquid-cooled heat generation simulation device, and the liquid-cooled heat generation simulation device requires a liquid-cooled cabinet with better heat dissipation effect. On the contrary, the smaller the specification parameters, the lower the heat generation of the liquid-cooled heat generation simulation device, and the liquid-cooled heat generation simulation device requires a lower heat dissipation effect of the liquid-cooled cabinet.

[0108] In this embodiment, the friction adjustment control device is pre-configured with a correspondence between specification parameters and adjustment parameters. After obtaining the specification parameters of the liquid-cooled heat generation simulation device, the adjustment parameters corresponding to the specification parameters can be obtained by querying the correspondence.

[0109] In this embodiment, the friction adjustment device affects the flow rate of the coolant flowing in the cavity within the friction member. After the friction adjustment device is adjusted, the flow rate of the coolant flowing in the friction member changes, thereby affecting the heat exchange effect of the friction member on the heat-generating component.

[0110] In one or more embodiments, as shown in FIG2 , the liquid cooling cabinet 111 includes:

[0111] The manifold 1111 connected to the circulation pipeline 122 is used to evenly distribute the cooling liquid transmitted in the circulation pipeline 122 to each liquid-cooled heat generation simulation device 121;

[0112] The thermal test system also includes:

[0113] A liquid cooling control device 17 connected to the liquid cooling parameter acquisition device 15;

[0114] The liquid cooling control device 17 is used to obtain the flow rate of the cooling liquid transmitted in the circulation pipeline 122 for heat exchange with each liquid cooling heat production simulation device 121 through the liquid cooling parameter acquisition equipment 15, and obtain the flow uniformity test result of the manifold 1111 based on the flow rate; when the flow rates corresponding to each liquid cooling heat production simulation device 121 are the same, it is determined that the flow uniformity test result indicates that the flow uniformity test of the manifold 1111 has passed.

[0115] It should be understood that the friction adjustment control device 16 and the liquid cooling control device 17 may be devices implemented by the same functional module or may be devices implemented by different functional modules, and this embodiment does not specifically limit this.

[0116] In this embodiment, the manifold 1111 is connected to each liquid-cooling heat generation simulation device 121 via a circulation pipeline 122. The manifold 1111 evenly distributes the coolant flowing in the circulation pipeline 122 based on the number of liquid-cooling heat generation simulation devices 121 and delivers the evenly distributed coolant to each cooling and heating simulation device 13 via the circulation pipeline 122. It should be understood that when the circulation pipeline 122 connects the manifold 1111 to each liquid-cooling heat generation simulation device 121, the circulation pipeline 122 may specifically include multiple circulation branches, each of which connects the manifold 1111 to a liquid-cooling heat generation simulation device. Furthermore, a liquid cooling parameter acquisition device 15 is provided on each circulation branch. It should be understood that since the manifold 1111 evenly distributes the coolant transmitted in the circulation pipeline 122, the flow rate of the coolant transmitted in each circulation branch after equalization should be the same. When the flow rates on each circulation branch collected by the liquid cooling parameter collection equipment set on the circulation branch are not exactly the same, it indicates that the manifold 1111 is not operating normally.

[0117] It should be noted that the specifications of each liquid-cooled heat production simulation device 121 are the same, so these liquid-cooled heat production simulation devices adjust the flow resistance of each liquid-cooled heat production simulation device to be the same through friction parts. Then, the cabinet device is operated and the flow value passing through each liquid-cooled heat production simulation device is read by the flow meter to determine the flow uniformity of Manifold.

[0118] In one or more embodiments, as shown in FIG1 to FIG3 , the heat dissipation device 11 includes:

[0119] Air cooling device 112;

[0120] Each of the heat generation simulation devices 12 includes:

[0121] The air-cooling heat generation simulation device 123 is located within the blowing range of the air-cooling device 112 .

[0122] In this embodiment, the air-cooled heat generation simulation device 123 is used to simulate a heat dissipation component in a server that uses air cooling technology for heat dissipation. Typically, the heat dissipation component is a heat dissipation component other than the actual heat dissipation component in the server. The cabinet of the heat dissipation test system is provided with a fixed position for securing the other heat dissipation component. A heating block of a certain power can be fixed to this fixed position to serve as the air-cooled heat generation simulation device 123, simulating the heat generation of other heat-generating components in addition to the main heat-generating components during actual server operation.

[0123] In this embodiment, air cooling device 112 includes, but is not limited to, a fan row. Air cooling device 112 can blow air to air-cooled heat generation simulation device 123, thereby simulating the heat dissipation of other heat-generating components within the server during operation in a cold plate liquid cooling system. During application, the air speed of air cooling device 112 can be adjusted according to different needs to suit the actual application scenario of air cooling device 112 and improve the testing effect of air cooling device 112.

[0124] In actual applications, a tester may manually detect the temperature change of the air-cooling heat generation simulation device 123 before and after turning on the air-cooling device 112 , and evaluate the heat dissipation effect of the air-cooling device 112 based on the temperature change.

[0125] In one or more embodiments, the heat dissipation testing system further includes:

[0126] Air cooling control device 18 and air cooling parameter acquisition equipment (not shown in the figure);

[0127] The air cooling control device 18 is used to obtain the heat dissipation and temperature change parameters of the air cooling heat generation simulation device 123 through the air cooling parameter acquisition equipment, and determine the heat dissipation effect of the air cooling device 112 based on the heat dissipation and temperature change.

[0128] In this embodiment, the air cooling control device 18, the friction adjustment control device 16, and the liquid cooling control device 17 can be devices implemented by the same functional module or devices implemented by different functional modules, and this embodiment does not specifically limit this.

[0129] In one or more embodiments, a row of space can be reserved within the cabinet near the manifold for flexible placement of fluid connectors and power outlets. The liquid cooling heat generation simulator, the manifold connection fluid connectors, and the power module can be flexibly positioned and customized to suit specific needs.

[0130] The following describes the implementation principle of the heat dissipation test system based on the heat dissipation test system shown in FIG1 to FIG3 .

[0131] The friction element on the liquid-cooled heat generation simulation device contains a cavity for transporting coolant and providing space for heat exchange between the coolant and the heat generating components. A friction adjustment device is installed inside the friction element to adjust the friction of the pipeline. This resistance can be adjusted according to demand, thereby adjusting the flow of coolant in and out of the friction element. The friction element is connected to a circulation pipeline for transporting coolant. The circulation pipeline includes an inlet pipeline and an outlet pipeline. Coolant can enter the friction element through the inlet pipeline to exchange heat with the heat generating components. Low-temperature coolant is distributed by the manifold and enters the inlet pipeline of the friction element. The friction element exchanges heat with the heat generating components and is converted into high-temperature coolant. The high-temperature coolant returns to the manifold through the outlet pipeline and then enters the CDU through the circulation pipeline for heat exchange, becoming low-temperature coolant, completing the cycle.

[0132] Based on the same inventive concept, an embodiment of the present application further provides a heat dissipation testing method, which is applied to the heat dissipation testing system in the aforementioned embodiment. As shown in FIG4 , FIG4 shows a flow chart of a heat dissipation testing method. The method may include the following steps:

[0133] Step 401: obtaining, by means of a liquid cooling parameter acquisition device, the flow rate of the coolant transmitted in the circulation pipeline for heat exchange with each liquid cooling heat generation simulation device;

[0134] Step 402: Obtain a flow uniformity test result of the manifold based on the flow rate;

[0135] Among them, when the flow rates corresponding to the various liquid-cooled heat generation simulation devices are the same, determining the flow uniformity test result indicates that the flow uniformity test of the manifold has passed.

[0136] The present application also provides a liquid cooling test device for executing the heat dissipation test method provided in any of the above embodiments. As shown in FIG5 , the device includes:

[0137] An acquisition module 51 is configured to acquire, through the liquid cooling parameter acquisition device, the flow rate of the coolant transmitted in the circulation pipeline for heat exchange with each of the liquid cooling heat generation simulation devices;

[0138] A testing module 52 is configured to obtain a flow uniformity test result of the manifold based on the flow rate;

[0139] Wherein, when the flow rates corresponding to the liquid-cooling heat generation simulation devices are the same, determining the flow uniformity test result indicates that the flow uniformity test of the manifold has passed.

[0140] The liquid cooling test device provided in the embodiment of the present application and the heat dissipation test method provided in the embodiment of the present application are based on the same inventive concept and have the same beneficial effects as the methods adopted, operated or implemented therein.

[0141] The present application also provides an electronic device for performing the above-mentioned heat dissipation test method. Please refer to Figure 6, which shows a schematic diagram of an electronic device provided by some embodiments of the present application. As shown in Figure 6, the electronic device 6 includes: a processor 600, a memory 601, a bus 602 and a communication interface 603, wherein the processor 600, the communication interface 603 and the memory 601 are connected via the bus 602; the memory 601 stores a computer program that can be run on the processor 600, and when the processor 600 runs the computer program, it executes the heat dissipation test method provided by any of the aforementioned embodiments of the present application.

[0142] The memory 601 may include high-speed random access memory (RAM) and may also include non-volatile memory, such as at least one disk storage. The communication connection between the device network element and at least one other network element is achieved through at least one communication interface 603 (which may be wired or wireless), and may use the Internet, a wide area network, a local area network, a metropolitan area network, etc.

[0143] Bus 602 may be an ISA bus, a PCI bus, or an EISA bus. The bus may be divided into an address bus, a data bus, a control bus, and the like. Memory 601 is used to store programs, and processor 600 executes the programs upon receiving execution instructions. The heat dissipation testing method disclosed in any of the aforementioned embodiments of the present application may be applied to processor 600 or implemented by processor 600.

[0144] The processor 600 may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method can be completed by hardware integrated logic circuits in the processor 600 or by software instructions. The above processor 600 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), an off-the-shelf field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in the embodiments of this application can be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium mature in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, etc. The storage medium is located in the memory 601 , and the processor 600 reads the information in the memory 601 and completes the steps of the above method in combination with its hardware.

[0145] The electronic device provided in the embodiment of the present application and the heat dissipation testing method provided in the embodiment of the present application are based on the same inventive concept and have the same beneficial effects as the methods adopted, operated or implemented therein.

[0146] An embodiment of the present application also provides a computer-readable storage medium corresponding to the heat dissipation test method provided in the aforementioned embodiment. Please refer to Figure 7, which shows that the computer-readable storage medium is a CD 30, on which a computer program (i.e., a program product) is stored. When the computer program is run by the processor, it will execute the heat dissipation test method provided in any of the aforementioned embodiments.

[0147] It should be noted that examples of the computer-readable storage medium may also include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other optical or magnetic storage media, which are not listed here one by one.

[0148] The computer-readable storage medium provided in the above-mentioned embodiments of the present application and the heat dissipation testing method provided in the embodiments of the present application are based on the same inventive concept and have the same beneficial effects as the methods adopted, run or implemented by the application programs stored therein.

[0149] An embodiment of the present application also provides a computer program product corresponding to the heat dissipation testing method provided in the aforementioned embodiment, including computer-readable code, or carried on a non-volatile computer-readable storage medium storing computer-readable code. When the computer-readable code runs in a processor of an electronic device, the processor in the electronic device executes the heat dissipation testing method provided in the aforementioned embodiment.

[0150] It should be noted that:

[0151] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known structures and technologies are not shown in detail so as not to obscure the understanding of this description.

[0152] Similarly, it should be understood that in order to streamline the present application and aid in understanding one or more of the various inventive aspects, in the above description of the exemplary embodiments of the present application, various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the following schematic diagram: the claimed application requires more features than the features expressly recited in each claim. Rather, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present application.

[0153] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims below, any of the claimed embodiments may be used in any combination.

[0154] The above description is merely a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation test system, comprising: A heat dissipation device and multiple heat generation simulation devices, each of the heat generation simulation devices is used to simulate a heat-generating component in a server that needs to dissipate heat. The heat dissipation device and the multiple heat generation simulation devices are housed in the same housing, and the actual heat dissipation components simulated by the multiple heat generation simulation devices are not components in the same server. The heat dissipation device is used to cool down the multiple heat generation simulation devices.

2. The heat dissipation test system according to claim 1, wherein: Each of the heat generation simulation devices comprises: A liquid-cooling heat generation simulation device and a circulation pipeline connected to the liquid-cooling heat generation simulation device; The heat dissipation device includes a liquid cooling cabinet connected to the circulation pipeline; The liquid cooling cabinet delivers cooling liquid to each of the liquid cooling heat generation simulation devices through the circulation pipeline, and performs heat exchange with each of the liquid cooling heat generation simulation devices through the cooling liquid.

3. The heat dissipation test system according to claim 1 or 2, wherein: The heat dissipation device comprises: Air cooling device; Each of the heat generation simulation devices comprises: An air-cooling heat generation simulation device is located within the blowing range of the air-cooling device.

4. The heat dissipation testing system according to claim 2, wherein: Each of the liquid cooling heat generation simulation devices comprises: Heat exchange components and heat generation components; The heat exchange component is provided with a cavity, and the heating component is provided below the heat exchange component; The cavity is connected to the circulation pipeline and is used to achieve heat exchange between the liquid flowing in the circulation pipeline and the heating component.

5. The heat dissipation testing system according to claim 4, wherein: The heat exchange component comprises: Friction parts and friction adjustment devices; The friction member is connected to the circulation pipeline and the friction regulating device respectively.

6. The heat dissipation testing system according to claim 2, wherein: The heat dissipation test system further includes: A telescopic device provided on the box of each of the liquid-cooled heat generation simulation devices; The telescopic device is used to adapt to the specifications of each of the liquid-cooling heat-generating devices and fix each of the liquid-cooling heat-generating simulation devices on the box body.

7. The heat dissipation testing system according to claim 2, wherein: The heat dissipation test system further includes: A liquid cooling parameter acquisition device provided in the circulation pipeline; The liquid cooling parameter acquisition device includes at least one of a pressure sensor, a temperature sensor and a flow sensor.

8. The heat dissipation testing system according to claim 5, wherein: The heat dissipation test system further includes: Friction adjustment control device; The friction adjustment control device is connected to the friction adjustment device, and is used to determine the adjustment parameters of the friction adjustment device corresponding to each of the liquid-cooled heat production simulation devices based on the specification parameters of each of the liquid-cooled heat production simulation devices, and adjust the friction adjustment device corresponding to each of the liquid-cooled heat production simulation devices based on the adjustment parameters.

9. The heat dissipation testing system according to claim 7, wherein: The liquid cooling cabinet comprises: A manifold connected to the circulation pipeline, used to evenly distribute the coolant transmitted in the circulation pipeline to each of the liquid-cooled heat generation simulation devices; The heat dissipation test system further includes: A liquid cooling control device connected to the liquid cooling parameter acquisition device; The liquid cooling control device is used to obtain the flow rate of the coolant transmitted in the circulation pipeline for heat exchange with each of the liquid cooling heat production simulation devices through the liquid cooling parameter acquisition equipment, and obtain the flow uniformity test result of the manifold based on the flow rate; when the flow rates corresponding to each of the liquid cooling heat production simulation devices are the same, it is determined that the flow uniformity test result indicates that the flow uniformity test of the manifold has passed.

10. The heat dissipation testing system according to claim 3, wherein: The heat dissipation test system further includes: Air cooling control device and air cooling parameter acquisition equipment; The air cooling control device is used to obtain the heat dissipation and temperature change parameters of the air cooling heat generation simulation device through the air cooling parameter acquisition equipment, and determine the heat dissipation effect of the air cooling device based on the heat dissipation and the temperature change.

11. A heat dissipation testing method, performed by the heat dissipation testing system according to claim 9, the method comprising: The flow rate of the coolant transmitted in the circulation pipeline for heat exchange with each of the liquid-cooled heat generation simulation devices is obtained by the liquid-cooling parameter acquisition device; Obtaining a flow uniformity test result of the manifold based on the flow rate; Wherein, when the flow rates corresponding to the liquid-cooling heat generation simulation devices are the same, determining the flow uniformity test result indicates that the flow uniformity test of the manifold has passed.

12. A liquid cooling test device, applied to the heat dissipation test system according to claim 9, the device comprising: an acquisition module, configured to acquire, through the liquid cooling parameter acquisition device, the flow rate of the coolant transmitted in the circulation pipeline for heat exchange with each of the liquid cooling heat generation simulation devices; A testing module, configured to obtain a flow uniformity test result of the manifold based on the flow rate; Wherein, when the flow rates corresponding to the liquid-cooling heat generation simulation devices are the same, determining the flow uniformity test result indicates that the flow uniformity test of the manifold has passed.

13. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method according to claim 11.

14. A computer program product comprising computer readable codes, wherein when the computer readable codes are executed in a processor of an electronic device, the processor in the electronic device executes the method according to claim 11.

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