RFID chip module connector, method for manufacturing RFID tag, and sewing machine

Abstract

Proposed is an RFID chip module connector having a novel structure by which the efficiency of RFID tag manufacturing can be enhanced. One RFID chip module (1) comprises an IC chip (12), a core antenna (13) connected to the IC chip, and a base part (11) to which the IC chip and the core antenna are fixed. The RFID chip module connector (2) is formed by connecting a plurality of the chip modules (1) in a row, and the connection locations of each chip module can be separated. One of the chip modules (1) in the RFID chip module connector (2) is fixed on a base material (3) so as to correspond to one boost antenna (5), and the one chip module that is fixed is separated from the RFID chip module connector. In this manner, an RFID tag (6) is manufactured. The chip module can be fixed (sewn) and separated using a sewing machine.

Description

RFID chip module assembly and RFID tag manufacturing method, and sewing machine

[0001] The present invention relates to a manufacturing technology for RFID tags, and in particular to a novel RFID chip module assembly that functions as an intermediate material in the manufacturing process, a method for manufacturing RFID tags using the RFID chip module assembly, and a sewing machine that is configured to be able to use the RFID chip module assembly.

[0002]

[0003] As an example of a non-contact data transmitter / receiver, a radio frequency identification (RFID) tag made of conductive fabric is known. For example, Patent Documents 1 and 2 listed below disclose an RFID tag that is composed of a base fabric, a boost antenna formed by sewing conductive fabric to the base fabric, and a chip module disposed in the center of the boost antenna. In this RFID tag, the base member is made of fabric (base fabric), so that it can be used without any discomfort even when attached to an article of clothing.

[0003] The chip module includes an inlet with an IC chip and a core antenna arranged on a substrate, sealed with a resin material. The chip module is also formed in a button shape with multiple through-holes. This allows one chip module to be sewn to the base fabric through the through-holes using a technique similar to button sewing during the RFID tag manufacturing process. In both of the prior art technologies, the chip modules are individually manufactured as stand-alone chip modules and provided to the RFID tag manufacturing process.

[0004] Although the patent document below does not specifically disclose how the chip module itself is sewn onto the base fabric, because the chip module is button-shaped, it is conceivable that, if a sewing machine is used, it will be sewn onto the base fabric using a sewing machine dedicated to button attachment. In mass production processes in which buttons are sewn onto fabric or clothing by sewing, it is common to use a sewing machine dedicated to button attachment (for example, a single-thread chainstitch button attachment machine or a lockstitch button attachment machine) that is capable of quickly and accurately inserting the needle into the threading hole, and it is believed that such a sewing machine would be able to sew a button-shaped chip module onto the base fabric.

[0005] Patent No. 6640884 Patent No. 5912398

[0006] However, due to its configuration, a dedicated button-sewing sewing machine can sew on a button-shaped chip module alone, but cannot sew on the wire (conductive thread) that will become the boost antenna. Therefore, different types of sewing machines must be used to sew on the chip module and the boost antenna. As such, the button-shaped chip module and the wire that will become the boost antenna cannot be sewn on using a common device, and each must be sewn on using a different type of sewing machine, which increases the amount of equipment required and the number of steps. In other words, it was not possible to consistently use a common sewing machine for the processes from sewing the boost antenna to sewing the button-shaped chip module onto the base fabric.

[0007] In response to this problem, it is conceivable to add an attachment for sewing button-shaped chip modules to a general sewing machine so that the same sewing machine can be used to sew boost antennas onto base fabric and button-shaped chip modules using the attachment. However, even if such an attachment allows the use of a common sewing machine, considering the potential inconvenience caused by variations in the orientation of the core antennas in each chip module, it is difficult to achieve efficient RFID tag manufacturing through as much automation as possible. In other words, from the perspective of RFID tag reliability, it is desirable to ensure a predetermined distance between the boost antenna and the core antenna on the chip module. However, when sewing each chip module onto the base fabric, it is difficult to unify the orientation of each chip module to a predetermined preferred direction and ensure this predetermined distance. As a result, variations in the distance between the boost antenna and the core antenna of the chip module inevitably occur in each manufactured RFID tag product, making it difficult to ensure uniform reliability of the RFID tag products.

[0008] The present invention has been made in consideration of the above points, and aims to provide a new RFID chip module assembly that enables RFID tag manufacturing to be performed more efficiently. It also aims to provide a method for manufacturing RFID tags using the RFID chip module assembly, and to provide a sewing machine that is configured to be able to use the RFID chip module assembly.

[0009] The RFID chip module assembly of the present invention is configured such that each wireless communication chip module includes an IC chip, a core antenna connected to the IC chip, and a base to which the IC chip and core antenna are fixed, and multiple wireless communication chip modules are connected in a row, with the connection points of each chip module being detachable.

[0010] This RFID chip module assembly can be used as an intermediate material for manufacturing RFID tags. Because the connection points of each chip module in the RFID chip module assembly are separable, when manufacturing RFID tags, it is possible to separate a single chip module from the RFID chip module assembly and attach the single chip module to a substrate on which a boost antenna is disposed. Because the RFID chip module assembly is configured by connecting multiple wireless communication chip modules (RFID chip modules) in a row, the orientation of each chip module in the assembly is necessarily fixed, allowing the chip modules to be provided in a uniform, fixed orientation. Therefore, when attaching a chip module separated from the RFID chip module assembly to a substrate on which a boost antenna is disposed, it is extremely easy to uniformly set the positional relationship (relationships such as orientation and distance) between each chip module and the boost antenna to a preferred relationship.

[0011] By using the RFID chip module assembly of the present invention as an intermediate material in the manufacture of RFID tags, RFID tags can be easily manufactured while maintaining the desired distance between the boost antenna and the core antenna on the chip module, which has the excellent effect of ensuring the reliability of the manufactured RFID tag products across the board. This contributes to the efficient manufacture of reliable RFID tags.

[0012] The structure that allows the connection points of each chip module in the RFID chip module assembly to be separated may be any structure. For example, if at least the connection points of each chip module are made of a material that can be separated with a cutter, a single chip module can be separated from the RFID chip module assembly using an appropriate cutter. Alternatively, for example, if a breaking line structure such as a perforation is formed at the connection points of each chip module, a single chip module can be separated from the RFID chip module assembly by applying an appropriate external force to the breaking line structure.

[0013] According to another aspect, a method for manufacturing an RFID tag according to the present invention includes the steps of: preparing the RFID chip module assembly; preparing a substrate for an RFID tag; attaching one of the chip modules in the RFID chip module assembly to the substrate in correspondence with a section corresponding to one boost antenna and detaching the attached chip module from the RFID chip module assembly; and arranging the boost antenna on the substrate in correspondence with the section before or after the chip module attaching step, and providing an RFID tag with the chip module attached to the substrate in correspondence with the one boost antenna.

[0014] As described above, the RFID chip module assembly can be provided with each chip module oriented uniformly and fixed in a desired predetermined direction. Therefore, when each chip module in the RFID chip module assembly is associated with a boost antenna and attached to the substrate, RFID tags can be easily manufactured with the distance between the boost antenna and the core antenna of the chip module uniformly maintained within a desired predetermined distance. This provides the excellent advantage of ensuring the reliability of the manufactured RFID tag products. This contributes to the efficient manufacture of reliable RFID tags. Furthermore, the substrate may be the object to which the RFID tag is to be attached. In this case, the boost antenna and chip module can be directly attached to the object (i.e., the RFID tag can be directly formed on the object), which also contributes to the efficiency of RFID tag manufacturing and the RFID tag attachment process.

[0015] According to another aspect, the sewing machine of the present invention is characterized by including a feeding device for feeding the assembled RFID chip modules, the feeding device including a device for separating one RFID chip module from the assembled RFID chip module for sewing. This allows the sewing machine to be used to separate one RFID chip module from the assembled RFID chip module supplied by the feeding device and sew the RFID chip module onto a sewing object. Since the sewing machine can be used to sew a boost antenna onto a base material, as is well known, it is possible to use the same sewing machine to sew both the chip module and the boost antenna onto the base material, thereby further improving the efficiency of RFID tag production.

[0016] According to yet another aspect, the method for manufacturing an RFID tag of the present invention includes a chip module attaching step of using the sewing machine to sew one of the chip modules from the RFID chip module assembly supplied by the supply device onto a base material as a sewing object, in correspondence with a compartment of one boost antenna, and separating the sewn chip module from the RFID chip module assembly; and a step of using the sewing machine to sew the boost antenna onto the base material in correspondence with the compartment before or after the chip module attaching step, and providing the one chip module sewn onto the base material in correspondence with the one boost antenna as a single RFID tag.

[0017] This allows the chip module and boost antenna to be sewn onto the substrate using the same sewing machine, thereby improving the efficiency of RFID tag manufacturing. Furthermore, for the same reasons as above, it becomes easy to manufacture RFID tags while uniformly ensuring the distance between the boost antenna and the core antenna on the chip module within a desired predetermined distance, resulting in the excellent effect of uniformly ensuring the reliability of the manufactured RFID tag products. Accordingly, it is possible to improve the efficiency of RFID tag manufacturing while ensuring reliability. Furthermore, the substrate may be the object to which the RFID tag is to be sewn. In this case, it is possible to directly sew the boost antenna and chip module onto the object using the object as the substrate (i.e., it is possible to directly form the RFID tag on the object), which also improves the efficiency of RFID tag manufacturing and the RFID tag attachment process.

[0018] FIG. 1 is a plan view illustrating one RFID chip module constituting an RFID chip module assembly according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the RFID chip module shown in FIG. 1 taken along line A-A. FIG. 3 is a plan view illustrating an outline of an RFID chip module assembly according to an embodiment of the present invention. FIG. 4 is a plan view illustrating a detailed example of an RFID chip module assembly according to an embodiment of the present invention. FIG. 5 is a plan view illustrating another detailed example of an RFID chip module assembly according to an embodiment of the present invention. FIG. 6 is a plan view illustrating an example of an RFID tag manufactured using an RFID chip module assembly according to an embodiment of the present invention. FIG. 7 is a process diagram illustrating the steps of a method for manufacturing an RFID tag according to an embodiment of the present invention. FIG. 8 is an external view of a sewing machine according to an embodiment of the present invention. FIG. 9 is a schematic plan view illustrating an example of a piece of fabric (substrate) on which multiple RFID tag compartments are formed. FIG. 11 is a front view of a sewing machine according to another embodiment of the present invention.

[0019] RFID chip modules (wireless communication chip modules) themselves are well known, and Fig. 1 shows an example of such a well-known RFID chip module 1. One RFID chip module 1 includes an IC chip 12 that controls wireless communication, a core antenna 13 electrically connected to the IC chip 12, and a base 11 to which the IC chip 12 and core antenna 13 are fixed, with the IC chip 12 and core antenna 13 arranged at predetermined positions on the base 11, and corresponds to a well-known RFID inlay. As an example, as shown in Figs. 1 and 2, the well-known IC chip 12 for wireless communication control and the core antenna 13 made of a metal such as copper or aluminum are formed by vapor deposition or patterning on the base 11 made of a plastic such as polyimide, a glass-filled epoxy resin, or an electrical insulator such as silicone, and a protective material 14 such as rubber or silicone is further layered on top of them, thereby forming the RFID chip module 1. 2 shows an example in which the protective material 14 covers the upper side of the base 11 from above the IC chip 12 and the core antenna 13, but this is not limiting, and the entire base 11, including the upper and lower sides, may be covered by the protective material 14. Hereinafter, the RFID chip module (chip module for wireless communication) 1 will be abbreviated as chip module 1.

[0020] The chip module 1 shown in FIG. 1 and other figures has a circular appearance, with a through hole 15 formed approximately in the center. This through hole 15 can function as a needle hole when sewing the chip module 1 to a substrate (a sewing target), as described below. However, the chip module 1 may have any shape other than a circular appearance, and the through hole 15 may be formed in any position other than approximately the center. Furthermore, if sewing is not used to attach (fix) the chip module 1 to the substrate, the through hole 15 serving as a needle hole may be omitted. The shape of the core antenna 13 shown in FIG. 1 and other figures is merely an example, and may be any shape appropriate for the frequency band to be used for communication. In the example of FIG. 1, the core antenna 13 is formed in a shape capable of communication in the UHF band. The shape of the core antenna 13 is not limited to this, and may be formed in a ring shape, for example, to enable communication in the HF band.

[0021] FIG. 3 is a plan view showing an outline of an RFID chip module assembly according to one embodiment of the present invention. The RFID chip module assembly 2 according to the present invention is formed by connecting a plurality of chip modules 1 as described above in a row. FIG. 3 shows a row of multiple chip modules 1 connected in a row. FIG. 4 is a plan view showing a detailed example of the RFID chip module assembly 2, and it can be seen that the core antennas 13 in each chip module 1 are arranged so that they face the same direction. FIG. 5 is a plan view showing another detailed example of an RFID chip module assembly according to one embodiment of the present invention, and it can be seen that the core antennas 13 in each chip module 1 are also arranged so that they face the same direction. As can be seen from the figure, the orientation of each core antenna 13 in each chip module 1 in FIG. 5 is shifted by approximately 90 degrees from that shown in FIG. 4. The orientation of each core antenna 13 in each chip module 1 is not limited to that shown in FIG. 4 or FIG. 5 and can be arbitrarily modified. Essentially, it is preferable that the core antennas 13 in each chip module 1 are arranged so that they face the same direction.

[0022] The connection points of each chip module 1 in the RFID chip module assembly 2 are separable. As an example, as described above, the base 11 of each chip module 1 is made of a plastic such as polyimide, and the protective material 14 is made of rubber, silicone, or the like, both of which are made of materials that can be cut with an appropriate cutter (an appropriate physical cutting means such as a blade or a saw). Therefore, for example, in the process of manufacturing the RFID chip module assembly 2, a manufacturing method can be advantageously adopted in which the bases 11 for multiple chip modules 1 are formed in a connected state, the IC chips 12 and core antennas 13 are placed on each connected base 11, and the IC chips 12 and core antennas 13 are commonly coated with the protective material 14 from above, thereby integrally forming the RFID chip module assembly 2 with each chip module 1 connected in advance. In this case, by applying a cutting force with an appropriate cutter to the boundary (i.e., the connection point) of each chip module 1 in the integrally formed RFID chip module assembly 2, the material parts of the base 11 and the protective material 14 at the boundary (i.e., the connection point) are cut, thereby making it possible to separate the chip modules 1.

[0023] As a modified example of the connection structure of each chip module 1 in the RFID chip module assembly 2, it is not limited to the above-described integrally formed connection structure, but each individually formed chip module 1 may be connected by bonding with an adhesive or by melt-bonding. Even in this case, by applying a cutting force with an appropriate cutter to the boundary between each chip module 1 in the RFID chip module assembly 2 (i.e., the connection points formed by bonding or welding, etc.), it is possible to separate the chip modules 1 at the boundary. As a further modified example in this case, the material of the base 11 and / or the protective material 14 of each chip module 1 may be difficult to cut with a cutter, and at least the connection points between each chip module 1 may be formed from a material that can be cut with a cutter, etc.

[0024] The structure that enables the connection points of each chip module 1 in the RFID chip module assembly 2 to be separated is not limited to the structure that assumes cutting with a cutter as described above, and may be any structure. For example, a breaking line structure such as a perforation may be formed at the connection points of each chip module 1, and by applying an appropriate external force to the breaking line structure using a cutter or other external force applying means, one chip module 1 can be separated from the RFID chip module assembly 2.

[0025] The RFID chip module assembly 2 configured as described above can be used as an intermediate material for manufacturing RFID tags. In this case, the RFID chip module assembly 2 can be provided for manufacturing RFID tags by connecting a plurality of chip modules 1 in a row and winding the assembly around a reel. This allows the RFID chip module assembly 2 to be provided in a compact form, and allows the chip modules 1 to be efficiently separated from the RFID chip module assembly 2 by pulling it out from the reel.

[0026] 6 is a plan view showing an example of an RFID tag 6 manufactured using one chip module 1 separated from the RFID chip module assembly 2. One RFID tag 6 is made by fixing the chip module 1 in a predetermined arrangement on a substrate 3 on which a boost antenna 5 is arranged (fixed).

[0027] 7 is a process diagram outlining the procedure for manufacturing an RFID tag 6 using the RFID chip module assembly 2 according to the present invention. In step S1, the RFID chip module assembly 2 having the above-described configuration is prepared. This step S1 may include a step of manufacturing the RFID chip module assembly 2, but it may also be performed by simply obtaining a manufactured RFID chip module assembly 2 without including such a manufacturing step.

[0028] In step S2, a substrate 3 for the RFID tag 6 is prepared. For example, the substrate 3 is made of a suitable fabric. In step S3, a boost antenna 5 is arranged (fixed) on the substrate 3 in correspondence with a predetermined section corresponding to one boost antenna. As one example, step S3 can be performed by sewing a boost antenna 5 formed of conductive thread (or a flexible conductive linear material) onto the substrate 3 in a predetermined arrangement using an upper thread and a lower thread (which may be non-conductive thread). As another example, step S3 can be performed by embroidering (sewing) a predetermined pattern shape as the boost antenna 5 onto the substrate 3 using an upper thread and a lower thread made of conductive thread. As yet another example, step S3 can be performed by forming a boost antenna 5 made of a conductive material into a predetermined shape and fixing it to the substrate 3 (for example, by bonding with an adhesive).

[0029] In step S4 (chip module attachment step), one chip module 1 in the RFID chip module assembly 2 is fixed to the substrate 3 in correspondence with the section of one boost antenna 5, and the fixed chip module 1 is then separated from the RFID chip module assembly 2. As a result, one chip module 1 fixed to the substrate 3 in correspondence with one boost antenna 5 can be provided as an RFID tag 6 as shown in FIG. 6 . For example, if the substrate 3 is made of an appropriate fabric as described above, the chip module 1 can be fixed to the substrate 3 by sewing (embroidery). In this case, the through-holes 15 provided in the chip module 1 function as needle holes for sewing. FIG. 6 illustrates an example of sewing the chip module 1 with embroidery thread 4. Note that the chip module 1 can be fixed to the substrate 3 by other appropriate means (e.g., adhesive bonding) rather than by sewing.

[0030] As an example, step S2 may involve preparing a single, relatively wide substrate 3, and step S3 may involve arranging multiple boost antennas 5 on the substrate 3 in association with each section. In this case, step S4 involves affixing (e.g., sewing) each chip module 1 to the section corresponding to each boost antenna 5 arranged on the substrate 3. Furthermore, step S5, indicated by the dotted line in FIG. 7 , may be added as needed. In step S5, the single, wide substrate 3 is cut into sections, thereby providing a single RFID tag 6 in which one chip module 1 is affixed to the substrate 3 in association with one boost antenna 5. This allows for efficient production of a large number of RFID tags 6 such as those shown in FIG. 6 . Of course, steps S3 and S4 may be performed on a substrate 3 of a size required for a single RFID tag 6, in which case step S5 is unnecessary. Furthermore, the substrate 3 may be the object itself to which the RFID tag 6 is to be attached. In this case, the object can be used as the substrate 3 to which the boost antenna 5 and the chip module 1 can be directly attached (i.e., the RFID tag 6 can be formed directly on the object), and in this case too, step S5 is not required.

[0031] As a modified example, step S3 may be performed after step S4 rather than before. That is, the work of arranging (fixing) the boost antenna 5 and the chip module 1 on the substrate 3 (i.e., steps S3 and S4) may be performed in any order. As will be described later, it is efficient to perform steps S3 and S4 in the same work area (for example, using the same sewing machine), but this is not limiting, and a modification in which steps S3 and S4 are performed in different work areas (or factories) is also possible.

[0032] The present invention can be advantageously applied when RFID tags 6 are produced by sewing techniques. FIG. 8 shows a sewing machine according to an embodiment of the present invention, configured to produce RFID tags 6 by sewing techniques. FIG. 8 is an external perspective view showing an embodiment of the present invention in an embroidery sewing machine having four sewing machine heads. As is well known, a needle bar case 22 is provided corresponding to each sewing machine head, and a needle plate 23 is disposed below the needle bar of each sewing machine head. Also, as is well known, an embroidery frame 24, which stretches and supports the sewing workpiece, is configured to be driven in the lateral direction (X direction) and the front-to-back direction (Y direction) in accordance with sewing data. In this embodiment, the sewing workpiece stretched and supported by the embroidery frame 24 is fabric, serving as the substrate 3. Note that the number of sewing machine heads in a single sewing machine is not limited to four, and may be one or any number of heads.

[0033] The sewing machine shown in Figure 8 is equipped with a supply device as an attachment for supplying the RFID chip module assembly 2. This supply device includes a reel 25 around which the RFID chip module assembly 2, which is made up of a number of chip modules 1 connected in a row, is wound, and a feed unit 21 configured to feed the RFID chip module assembly 2 from the reel 25 to the needle base position of the corresponding sewing machine head and to detach one chip module 1 at the tip of the assembly in synchronization with the sewing operation. Therefore, the feed unit 21 (i.e., the supply device) includes a device (e.g., a cutter) for detaching one chip module 1 from the RFID chip module assembly 2 for sewing. The mechanism and control form for feeding and detaching such a supply device can be implemented by employing a mechanism similar to that of a sequin feed device known in the fields of sewing machines or embroidery machines. Therefore, detailed illustrations and descriptions of the supply devices (21 and 25) will be omitted in the specification and drawings of this application, and a known sequin supply device (for example, that disclosed in JP 2010-213858 A) will be used. That is, the supply devices (21 and 25) can be realized by replacing the sequin connected body in the known sequin supply device with the RFID chip module connected body 2 of the present invention and then using the mechanisms and control forms for feeding and cutting in the sequin supply device. As is well known, the needle bar case 22 in one sewing machine head can be slid sideways to select one of multiple sewing needles (colored threads) for sewing, and the supply unit 21 is installed in correspondence with a specific sewing needle in the needle bar case 22 (for example, the leftmost sewing needle).

[0034] The method for manufacturing an RFID tag as shown in FIG. 7 can be advantageously carried out using a sewing machine as shown in FIG. 8. In this case, step S1 shown in FIG. 7 involves loading a reel 25 on which a desired RFID chip module assembly 2 is wound into the sewing machine. Step S3 shown in FIG. 7 involves sewing a boost antenna 5 onto a substrate 3 as a sewing object using the sewing machine as shown in FIG. 8. In this case, sewing the boost antenna 5 onto the substrate 3 can be performed by a normal embroidery sewing operation without operating the feed unit 21 (i.e., the supply device). By performing successive sewing operations according to a predetermined stitching pattern, it is possible to embroider a pattern shape of a plurality of boost antennas 5 in different sections of the substrate 3 as a sewing object using upper and lower threads made of conductive thread.

[0035] 7, which is performed using the sewing machine shown in FIG. 8, involves setting the feed unit 21 (i.e., the supply device) to an operating state, sewing one (the tip) chip module 1 of the RFID chip module assembly 2 supplied by the feed unit 21 (i.e., the supply device) from the reel 25 onto the base material 3 in correspondence with one boost antenna 5, and then cutting off the sewn chip module 1 from the RFID chip module assembly 2 using a cutting device such as a cutter included in the feed unit 21. This cutting may be performed at any appropriate timing, such as approximately simultaneously with the sewing, immediately before, or immediately after the sewing. In this way, one chip module 1 sewn onto the base material 3 in correspondence with one boost antenna 5 is provided as a section of one RFID tag 6. This sewing can be performed continuously, so that each chip module 1 is sewn onto the section corresponding to each boost antenna 5 arranged on the base material 3 in a sequential and continuous manner. The feed unit 21 (i.e., the supply device) is set to an operating state by sliding the needle bar case 22 laterally to select and set a predetermined needle bar (sewing needle) in which the feed unit 21 is installed to the sewing position. Of course, as described above, the order of steps S3 and S4, which are performed using the sewing machine shown in Figure 8, may be reversed. In other words, step S3 may be performed either before or after step S4.

[0036] Thus, by performing the method according to the present invention using the sewing machine shown in FIG. 8 , it is possible to manufacture a substrate 3 made of a single wide piece of fabric on which multiple sections of RFID tags 6 are formed. For reference, an example of a single piece of fabric T (substrate 3) on which multiple sections of RFID tags 6 are formed is shown in FIG. Finally, by performing step S5, individually separated RFID tags 6 can be produced. That is, the substrate 3 made of a single piece of fabric T on which multiple sections of RFID tags 6 are formed as described above is removed from the embroidery frame 24, and the substrate 3 is cut into sections by an appropriate means, thereby providing individual separated RFID tags 6 each formed by sewing one chip module 1 to one boost antenna 5 onto the substrate 3. For example, the individual RFID tags 6 are cut along the dashed lines shown in FIG. 9 .

[0037] 8, a known string-like material guide device that supplies a string-like material and guides it to the needle base may be added to each sewing machine head, or a dedicated sewing machine head equipped with such a string-like material guide device may be added. In this case, a suitable conductive linear material (or conductive thread) may be used as the string-like material, and the conductive linear material may be guided so as to form a predetermined boost antenna shape on the base material 3, and the conductive linear material may be sewn onto the base material 3 by zigzag stitching, thereby allowing the desired boost antenna 5 to be arranged (fixed) on the base material 3.

[0038] Fig. 10 is a front view showing an example of a sewing machine additionally equipped with a dedicated sewing machine head equipped with such a string-like material guiding device. The sewing machine shown in Fig. 10 is provided with two sewing machine heads equipped with reels 25 and feed units 21 (supply devices) of RFID chip module linked bodies 2 as shown in Fig. 8, and next to each of them is provided a dedicated zigzag sewing machine head ZH equipped with a string-like material guiding device.

[0039] As described above, because the connection points of each chip module 1 in the RFID chip module assembly 2 are separable, when manufacturing an RFID tag, it is possible to separate one chip module 1 from the RFID chip module assembly 2 and secure (e.g., sew) that one chip module 1 to a base material 3 on which a boost antenna 5 is disposed. Here, because the RFID chip module assembly 2 has a structure in which a plurality of RFID chip modules 1 are connected in a row, the orientation of each chip module 1 in the assembly 2 is necessarily fixed, and therefore the chip modules 1 can be provided in a uniform, fixed orientation. Therefore, when a chip module 1 separated from the RFID chip module assembly 2 is secured (e.g., sewed) to a base material 3 on which a boost antenna 5 is disposed, it becomes extremely easy to uniformly set the positional relationship (relationships such as orientation and distance) between each chip module 1 and the boost antenna 5 to a preferred relationship. As a result, by using the RFID chip module assembly 2 of the present invention as an intermediate material during RFID tag manufacturing, RFID tags 6 can be easily manufactured while maintaining the desired predetermined distance between the boost antenna 5 and the core antenna 5 on the chip module 1 side, thereby achieving the excellent effect of ensuring the reliability of the manufactured RFID tag products. Accordingly, the efficiency of manufacturing RFID tags with ensured reliability can be improved. Therefore, the use of the RFID chip module assembly 2 of the present invention has the excellent effect of improving the efficiency of RFID tag manufacturing.

[0040] Furthermore, if a sewing machine is equipped with a supply device (feed unit 21 and reel 25) that supplies the RFID chip module assembly 2, the sewing machine can be used to separate one chip module 1 from the RFID chip module assembly 2 supplied by the supply device and sew the chip module 1 onto the sewing material. The same sewing machine can also be used to sew the boost antenna 5 onto the base material 3, making it possible to use the same sewing machine to sew the boost antenna 5 and chip module 1 onto the base material 3, thereby further improving the efficiency of RFID tag production.

Claims

1. An RFID chip module assembly in which a single wireless communication chip module includes an IC chip, a core antenna connected to the IC chip, and a base to which the IC chip and core antenna are fixed, and multiple such wireless communication chip modules are connected in a row, with the connection points of each chip module being detachable.

2. The RFID chip module assembly of claim 1, wherein the core antennas of each chip module are arranged in the same direction.

3. The RFID chip module assembly of claim 1, wherein the connection points of each chip module can be separated by cutting with a cutter.

4. The RFID chip module assembly of claim 1, wherein each chip module has a needle hole formed therein to allow passage of a sewing needle.

5. The RFID chip module assembly of claim 1, which is formed by winding a plurality of said wireless communication chip modules connected in a line around a reel.

6. The RFID chip module assembly of claim 1, wherein said base is made of an electrical insulator.

7. A method for manufacturing an RFID tag, comprising: a step of preparing an RFID chip module assembly according to any one of claims 1 to 6; a step of preparing a substrate for an RFID tag; a chip module attachment step of fixing one of the chip modules in the RFID chip module assembly to the substrate in correspondence with a section corresponding to one boost antenna and detaching the fixed one chip module from the RFID chip module assembly; and a step of arranging the boost antenna on the substrate in correspondence with the section before or after the chip module attachment step, and providing an RFID tag by fixing one chip module to the substrate in correspondence with one boost antenna.

8. The method for manufacturing an RFID tag according to claim 6, wherein the step of arranging the boost antennas comprises arranging a plurality of the boost antennas on the base material in correspondence with each section, and the step of attaching the chip modules comprises fixing each chip module to a section corresponding to each boost antenna arranged on the base material. The method for manufacturing an RFID tag according to claim 7.

9. The method for manufacturing an RFID tag according to claim 8, further comprising the step of providing one RFID tag by cutting the base material into the sections, with one chip module associated with one boost antenna and fixed onto the base material.

10. A sewing machine comprising a feeding device for feeding an RFID chip module assembly according to any one of claims 1 to 6, said feeding device including a device for separating one RFID chip module from said RFID chip module assembly for sewing.

11. A method for manufacturing an RFID tag, comprising: a chip module attaching step of using the sewing machine of claim 10 to sew one chip module from the RFID chip module assembly supplied by the supply device onto a base material as a sewing object, in association with a section of one boost antenna, and separating the sewn chip module from the RFID chip module assembly; and a step of using the sewing machine to sew the boost antenna onto the base material in association with the section before or after the chip module attaching step, thereby providing an RFID tag consisting of one chip module sewn onto the base material in association with the one boost antenna.

12. The method for manufacturing an RFID tag according to claim 11, wherein the step of sewing the boost antennas comprises sewing a plurality of the boost antennas onto the base material in correspondence with each section, and the step of attaching the chip modules comprises sewing each chip module to a section of the base material corresponding to each boost antenna.

13. The method for manufacturing an RFID tag according to claim 12, further comprising the step of providing one RFID tag by cutting the base material into the sections, and sewing one chip module onto the base material in correspondence with one boost antenna.

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