Method for manufacturing FMM, and FMM manufactured by using manufacturing method

Abstract

The present invention provides a method for manufacturing an FMM, the method comprising: step (a), electroplating Invar alloy sheets onto an object by means of electroplating; step (b), arraying and attaching the Invar alloy sheets on one side of a carrier film; step (c), forming a patterned photoresist on the upper surfaces of the Invar alloy sheets, etching the upper surface portion of the Invar alloy sheets by using an etching solution, and forming a first etched portion at a patterned portion; step (d), forming plugging ink on the upper surfaces of the Invar alloy sheets, and plugging the first etched portion; step (e), turning the Invar alloy sheets over along a vertical direction, and forming a photoresist on the upper surfaces of the Invar alloy sheets; and step (f), etching the upper surface portion of the Invar alloy sheets by using the etching solution, forming a second etched portion at the patterned portion, bringing the lower portion of the second etched portion into contact with the first etched portion to form pattern holes, and continuously performing step (c) to step (f) in a roll-to-roll manner in a state in which the Invar alloy sheets are arrayed and attached on the upper portion of the carrier film.

Description

Method for manufacturing FMM and FMM manufactured by the same TECHNICAL FIELD

[0001] The present invention relates to a method for manufacturing FMM and FMM manufactured by the same, and more particularly to a method for manufacturing FMM, which arranges an invar raw material manufactured in an electroplating manner in a carrier film and adheres it, and then performs an etching process on the invar raw material to manufacture a plurality of FMMs in a roll-to-roll manner, thereby satisfying uniform thickness and wide manufacturing width and low thermal expansion coefficient while simplifying the manufacturing process of FMM, and improving the productivity of mass production. BACKGROUND

[0002] An organic light-emitting diode (OLED) is a thin film light-emitting diode (LED) formed of a film of an organic compound that emits light in response to current. A conventional OLED display device is a display device in which fluorescent or phosphorescent organic compounds are electrically connected to emit light, and N×M organic light-emitting units can be driven to present an image.

[0003] Such an organic light-emitting unit is formed of a structure of an anode (ITO), an organic thin film, and a cathode (metal). The organic thin film is formed of a multi-layer structure including an emitting layer (EML), an electron transport layer (ETL), and a hole transport layer (HTL) to improve the balance of electrons and holes, improve light-emitting efficiency, and can include an additional electron injecting layer (EIL) and a hole injecting layer (HIL).

[0004] In such an organic electroluminescent device, in order to realize full colorization, it is necessary to pattern red (R), green (G), and blue (B) emitting layers, respectively, and in order to pattern such emitting layers, a high-precision metal mask (FMM) is used.

[0005] The high-precision metal mask mainly considers thermal expansion, etc., and uses invar (steel-nickel alloy).

[0006] A representative production method of Invar alloy (36% Ni - 64% Fe) or super Invar alloy (32% Ni - 63% Fe - 5% Co) for making a high-precision metal mask plate uses a cold rolling method, but in order to obtain a thin plate having a thickness of 50 μm or less in the cold rolling method, a multi-stage calendering process is required, and thus the process is long and complicated, and has a disadvantage of high manufacturing cost. Also, the calendered Invar alloy thin plate of 20 - 25 μm produced in the cold rolling method has a width limitation of a maximum of 250 mm, and it is difficult to apply to a large-area process material.

[0007] Due to these problems, the manufacturing cost of an OLED display device having a thickness of 25 μm or less increases, the process yield of a large-area OLED display device manufacturing decreases, resulting in an increase in cost, and thus the development of display technology is faced with difficulties.

[0008] Therefore, recently, a production method of Invar alloy for a high-precision metal mask plate is being developed using a mother material on which a mask pattern is formed to produce the Invar alloy by electroplating.

[0009] A conventional electroplating production method of Invar alloy for a high-precision metal mask plate using this electroplating method is configured in such a manner that an anode electrode plate and a mother material serving as a cathode are disposed to face each other in a mutually parallel state in an internal space of an electroplating bath, an electroplating solution (electrolyte) is supplied to the internal space of the electroplating bath, and then an anode power source and a cathode power source are connected to the anode electrode plate and the mother material, respectively, and current is applied thereto to form a plated layer (Invar alloy) on one surface of the mother material.

[0010] However, the Invar alloy for a high-precision metal mask plate manufactured by the electroplating method is produced from an additional Invar alloy thin plate in terms of process characteristics, and thus is not suitable for mass production of FMMs, and finally causes a problem of a decrease in mass productivity in the FMM manufacturing.

[0011] SUMMARY

[0012] PROBLEMS TO BE SOLVED BY THE INVENTION

[0013] The present invention has been made to solve the above-mentioned problems, and aims to provide a manufacturing method of FMMs, in which Invar alloy raw materials manufactured by electroplating are aligned on a carrier film and attached, and then etching processes are performed on the Invar alloy raw materials to produce a plurality of FMMs in a roll-to-roll manner, and thus a manufacturing process of the FMMs is simplified, a uniform thickness and a wide manufacturing width are satisfied, and a low coefficient of thermal expansion is satisfied, and mass productivity can be improved, and FMMs manufactured by the manufacturing method.

[0014] MEANS FOR SOLVING THE PROBLEMS

[0015] According to the present application, there is provided a method of manufacturing an FMM, characterized by comprising: step (a) of electroplating a constantan sheet to an object by electroplating; step (b) of aligning and attaching the constantan sheet to one side of a carrier film; step (c) of forming a partitioned photoresist on an upper surface of the constantan sheet disposed on the upper portion of the carrier film, etching the upper surface of the constantan sheet using an etching solution, and forming a first etching portion in the form of a circular arc groove at the partitioned portion; step (d) of forming a plug ink on the upper surface of the constantan sheet, and plugging the first etching portion in the form of a groove; step (e) of inverting the constantan sheet having the plug ink formed on the upper surface and the carrier film attached to the lower surface in the upward and downward directions, forming a partitioned photoresist on the upper surface of the constantan sheet; and step (f) of etching the upper surface of the constantan sheet using an etching solution, and forming a second etching portion in the form of a circular arc groove at the partitioned portion, the second etching portion being in contact with the first etching portion to form a pattern hole in the form of a through hole, the steps (c) to (f) being continuously performed in a roll-to-roll manner in a state in which the constantan sheet is aligned and attached to the upper portion of the carrier film.

[0016] Preferably, the present application is characterized in that, in the above step (b), the constantan sheet attached to one side of the carrier film is attached in two or more rows in parallel along the length direction of the carrier film.

[0017] Preferably, the present application is characterized in that the etching process is controlled such that the horizontal width of the above first etching portion constituting a front hole of the FMM is narrower than that of the second etching portion constituting a rear hole of the FMM.

[0018] On the other hand, according to another embodiment of the present application, there is provided an FMM manufactured by the method of manufacturing an FMM according to any one of the above features, characterized by comprising: a constantan sheet formed by electroplating; and a plurality of pattern holes in the form of a through hole in contact with the first etching portion formed on a front surface of the above constantan sheet and the second etching portion formed on a rear surface of the constantan sheet.

[0019] Preferably, the horizontal width of the above first etching portion constituting a front hole of the FMM is narrower than that of the second etching portion constituting a rear hole of the FMM, and the inner side of the pattern hole combined therewith is formed in an inclined manner.

[0020] Effects of the Invention

[0021] According to the present application, the following effects can be obtained: after aligning and attaching a constantan raw material manufactured by electroplating to a carrier film, a plurality of FMMs are manufactured in a roll-to-roll manner by performing an etching process on the constantan raw material, the manufacturing process of the FMM is simplified while satisfying uniform thickness and a wide manufacturing width and a low coefficient of thermal expansion, and mass productivity can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] FIG. 1 is a diagram for explaining a manufacturing method of an OLED using an FMM according to the related art.

[0023] FIG. 2 is a structural diagram of a plating apparatus according to an embodiment of the present application.

[0024] FIG. 3 is a diagram for explaining a carrier film attachment process of an Invar sheet according to an embodiment of the present application.

[0025] FIG. 4 is a diagram for explaining an FMM manufacturing process in a roll-to-roll manner according to an embodiment of the present application.

[0026] FIG. 5 is a diagram for explaining an etching process according to an embodiment of the present application.

[0027] EXPLANATION OF REFERENCE NUMERALS 30: FMM 61: first roller 62: second roller 63: vacuum chuck DETAILED DESCRIPTION

[0028] The present application can be variously changed and can have various embodiments, and a specific embodiment is illustrated in the drawings and is described in detail in the detailed description. However, it should be understood that the present application is not limited to the specific embodiments, but includes all changes, equivalent technical solutions, and even alternative technical solutions contained in the idea and technical scope of the present application. In the course of explaining each drawing, similar reference numerals are used for similar structural elements.

[0029] The terms of first, second, A, B, etc. can be used to explain various structural elements, but the above structural elements are not limited to the above terms. The above terms are used only for the purpose of distinguishing one structural element from another structural element. For example, the first structural element can be named as the second structural element without departing from the scope of the present application, and similarly, the second structural element can be named as the first structural element. And / or this term includes a combination of a plurality of related items or any one of a plurality of related items.

[0030] When referring to one structural element being "connected" or "coupled" to another structural element, it should be understood that it can be directly connected or coupled to the other structural element, but other structural elements can be interposed therebetween. In contrast, when referring to one structural element being "directly connected" or "directly coupled" to another structural element, it should be understood that no other structural element is interposed therebetween.

[0031] The terms used in the present application are used only to describe particular embodiments and do not limit the present application. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, it should be understood that the terms "include" or "have" or the like are used to designate the presence of features, numbers, steps, actions, structural elements, components or combinations thereof described in the specification, and do not preclude the presence or possibility of additional one or more other features, numbers, steps, actions, structural elements, components or combinations thereof.

[0032] Unless differently defined, all terms including technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application pertains. Terms as commonly used in a dictionary should be interpreted in accordance with the meaning as having in the context of the relevant art, not as an ideal or overly formal meaning, unless clearly defined in the present application.

[0033] Hereinafter, preferred embodiments according to the present application will be described in detail with reference to the accompanying drawings.

[0034] FIG. 1 is a diagram for explaining a manufacturing method of an OLED using an FMM according to the prior art.

[0035] Hereinafter, in each of the drawings related to the prior art and the embodiments of the present application, the size or thickness of a structural element is exaggerated (or thickened) or reduced (or thinned) for convenience of understanding or the like, or is simply represented, but should not be construed as limiting the scope of protection of the present application thereto.

[0036] Referring to FIG. 1, an OLED manufacturing apparatus for implementing a manufacturing method of an OLED using an FMM according to the prior art includes a magnet plate 10 housing magnets 11 and disposing a cooling water line 12, and a deposition source supply part 40 supplying an organic material source 41 from a lower portion of the magnet plate 10.

[0037] An object substrate 20 of glass or the like on which the organic material source 41 is deposited can be interposed between the magnet plate 10 and the deposition source supply part 40. An FMM 30 that deposits the organic material source 41 by different pixels can be disposed in close contact or in close proximity to the object substrate 20. The magnets 11 generate a magnetic field, and the FMM 30 can be brought into close contact with the object substrate 20 by an attractive force caused by the magnetic field.

[0038] The FMM 30 needs to be aligned before being brought into close contact with the object substrate 20. One or more masks can be combined with a frame 35. The frame 35 is fixedly disposed within the OLED manufacturing apparatus, and the mask can be combined with the frame 35 through an additional attachment or welding process.

[0039] The deposition source supply part 40 supplies the organic material source 41 to the left and right paths in a reciprocating manner, and the organic material source 41 supplied in the deposition source supply part 40 is deposited on one side of the object substrate 20 through the pattern hole 32 formed in the FMM 30. The organic material source 41 deposited through the pattern of the FMM 30 can function as the pixel 21 of the OLED.

[0040] In order to prevent uneven deposition of the pixel 21 caused by a shadow effect, the pattern hole 32 of the FMM 30 can be formed in a slanting manner (S) [or in a tapered manner (S)]. The organic material source 41 passing through the pattern hole 32 in a diagonal direction along the slanting surface can also form the pixel 21, and thus the overall thickness of the pixel 21 can be uniformly deposited.

[0041] The FMM 30 in FIG. 1 can perform a pixel deposition process on a large area of the object substrate 20.

[0042] A manufacturing method of such an FMM 30 is explained as follows.

[0043] FIG. 2 is a structural view of an electroplating apparatus according to an embodiment of the present application.

[0044] Referring to FIG. 2, the electroplating apparatus according to an embodiment of the present application can collectively include an electroplating solution supply part 52, an electrolyte supply part 53, and a gas supply part 54, so that an electroplating part 51 is movably provided in a tank part 56 having a predetermined accommodation space and internally configured with an object I, the object I is electroplated by supplying a current from a power supply part 55, and the electroplating solution, the electrolyte, and the inert gas for electroplating are supplied to the above-mentioned tank part 56 and the electroplating part 51.

[0045] First, the above-mentioned tank part 56 is formed to have a predetermined internal accommodation space, and the electroplating solution is accommodated therein. The upper surface of such a tank part 56 is open, so that the object I can be inserted and withdrawn in a horizontal direction, and has a height that allows the object I to be entirely inserted.

[0046] The plating solution is an electrolyte solution, and can be a material for the Invar alloy sheet 31 used as a mask. As an example, when an Invar alloy sheet as an iron-nickel alloy is formed into a plating layer, a mixed solution of a solution including Ni ions and a solution including Fe ions can be used as the plating solution. As another example, when a Super Invar alloy sheet as an iron-nickel-cobalt alloy is formed into a plating layer, a mixed solution of a solution including Ni ions, a solution including Fe ions, and a solution including Co ions can be used as the plating solution. The Invar alloy sheet or the Super Invar alloy sheet can be used as a high-precision metal mask (FMM) or a shadow mask when manufacturing an OLED, and can accurately guide an electron beam to a phosphor. Also, since the Invar alloy sheet or the Super Invar alloy sheet has a very low coefficient of thermal expansion (CTE), there is little concern that heat energy will cause the pattern shape of the mask to deform, and the Invar alloy sheet or the Super Invar alloy sheet is mainly used for manufacturing high-resolution OLEDs. Furthermore, the plating solution can be used without limitation for the plating layer of interest, and the content of manufacturing the Invar alloy sheet as the Invar alloy sheet 31 is assumed to be described as a main example in the present specification.

[0047] The plating solution supply part 52 can supply the plating solution to the plating part 51.

[0048] The plating solution supply part 52 has a storage space inside that can store the plating solution. This plating solution supply part 52 can be supplied with the plating solution from an external plating solution supply mechanism, and store the plating solution. The plating solution stored in the storage space is supplied to a supply nozzle (not shown) of the plating part 51 by a supply pump. Also, the plating solution supply part 52 is connected to the water tank part 56, and causes the plating solution stored in the water tank part 56 to flow back and be stored.

[0049] Finally, the plating solution supplied to the supply nozzle of the plating part 51 by the plating solution supply part 52 is sprayed to the object I, and the plating solution that has passed through the object I and flows downward by gravity is stored in the water tank part 56, and is recovered back to the connected plating solution supply part 52, and the plating solution is circulated as a whole. As such, the plating solution supply part 52 can recycle the plating solution because, when the plating solution is supplied by the gas supply part 54 described later, an inert gas is also supplied, the concentration of Fe ions in the plating solution is constantly maintained, and the generation of iron oxide in the plating solution is suppressed.

[0050] At this time, the plating solution supply part 52 can further include a filter or the like that removes impurities from the plating solution.

[0051] The electrolyte supply part 53 can supply an electrolyte solution to the plating part 51.

[0052] The electrolyte supply part 53 has a storage space inside which can store the electrolyte solution. This electrolyte supply part 53 can be supplied with the electrolyte solution from an external electrolyte solution supply mechanism and store it, and supply the electrolyte solution stored in the storage space to the plating part 51 by a supply pump. Also, this electrolyte supply part 53 is connected to the plating part 51, and makes the electrolyte solution in the plating part 51 flow back and be stored.

[0053] Finally, the electrolyte solution supplied to the plating part 51 by the electrolyte supply part 53 is recovered to the connected electrolyte supply part 53, and the electrolyte solution is circulated as a whole.

[0054] The gas supply part 54 can supply inert gas to the plating part 51.

[0055] The gas supply part 54 has a storage space inside which can store the inert gas. This gas supply part 54 can be supplied with the inert gas from an external inert gas supply mechanism and store it, and supply the inert gas stored in the storage space to the supply nozzle of the plating part 51 by a supply pump.

[0056] Finally, the inert gas supplied to the supply nozzle of the plating part 51 by the gas supply part 54 is ejected together with the plating solution supplied to the plating solution ejection part 56. In this process, the inert gas can maintain the gas supersaturation state in the plating solution, suppress the inflow of oxygen in the plating solution, constantly maintain the concentration of iron ions in the plating solution, and finally suppress the generation of iron oxide in the plating solution.

[0057] At this time, the inert gas is preferably N2 gas, but other inert gases that are low in reactivity and stable in chemical properties can also be used. In particular, when the inert gas is N2 gas, N2 gas of 99.99% or more filled as compressed nitrogen at a pressure of 120 kg / cm 2

[0058] This inert gas is ejected onto the plating solution, helps degassing of hydrogen gas generated and attached to the surface of the cathode part, maintains the nitrogen supersaturation state in the plating solution, and finally controls the inflow of oxygen generated in the insoluble anode and the inflow of oxygen in the atmosphere, preventing the generation of iron oxide.

[0059] Dissolved oxygen is oxygen in a molecular state dissolved in water or a solution, and is usually supplied using oxygen in the air. The amount of dissolved oxygen in water or a solution is affected by temperature and air pressure, and has the characteristic that the higher the temperature of the solution, the lower the amount of dissolved oxygen.

[0060] ​The power supply part 55 can supply current to the plating part 51. The power supply part 55 can form a plurality of channels, and the plurality of channels can form four or more channels. Also, the plurality of channels of the power supply part 55 can control the current value respectively. Thus, the power supply part 55 can differently design the size of the anode when necessary, or increase the number of channels to change, in order to reduce the plating deviation of the plating part 51.

[0061] The plating part 51 can form the plated invar alloy sheet 31 on one side of the high-precision metal mask plate base material. The invar alloy sheet 31 has a Ni eutectoid ratio of 36 to 38%, a low thermal expansion coefficient, a uniform thickness of 25 μm or less (more accurately, 3 to 20 μm), and a manufacturing width of 120 mm or more (more accurately, 1250 to 3000 mm).

[0062] The plating part 51 can be disposed on the inner upper side of the water tank part 56 and move in the horizontal direction along the water tank part 56. Also, the plating part 51 can be electrically connected to the power supply part 55 to be supplied with current. Also, the plating part 51 can be connected to the plating solution supply part 52 and the gas supply part 54 to be supplied with plating solution and inert gas, and connected to the electrolyte supply part 53 to be supplied with electrolyte solution.

[0063] On the other hand, when the invar alloy sheet 31 as an iron-nickel alloy is manufactured as a plating layer, the plating solution as a material of the plating layer can determine the plating thickness deviation and the aspect ratio between a large / small area, a via or a through hole (Thru Hole), and a ground (Ground) of the plated body according to an additive of several to several tens of ml.

[0064] The additive can be an accelerator (Accelerator, Brightener) such as SPS, MPSA, DPS, and thiourea as an organic compound, a suppressor (Suppressor, Carrier) such as PEG, gelatin, collagen, and the like as a polymer organic matter, and a leveler (Leveler) such as Janus Green B (JGB), PEI, HEC, and the like as a compound. Among them, the sulfur compound corresponding to the accelerator can be easily decomposed by oxygen generated in the anode part between plating.

[0065] Among them, the primary qualification of the invar alloy raw material for the high-precision metal mask plate (FMM) is a low thermal expansion coefficient (CTE). Also, in order to obtain the invar alloy having a low thermal expansion coefficient by plating, the coexistence ratio of Ni 2+ , Fe 2+ in the plating solution is very important.

[0066] Therefore, it is necessary to maintain the prescribed ratio as the ratio of the Ni-Fe alloy, i.e., 36% to 38% as the content of Ni, to be precipitated from the substrate, as the electroplating solution of the constantan alloy. In this case, in order to maintain the precipitation ratio in a prescribed state, it is necessary to constantly maintain and manage the concentrations of the Ni salt (Ni 2+ ) and the Fe salt (Fe 2+ ) in the electroplating solution.

[0067] Next, a method of manufacturing the FMM 30 using the constantan alloy sheet 31 electroplated on the object I of the electroplating apparatus by the above-described electroplating process will be described in detail.

[0068] FIG. 3 is a diagram for explaining a carrier film attachment process of the constantan alloy sheet according to an embodiment of the present application.

[0069] Referring to (a) of FIG. 3, the carrier film attachment process according to an embodiment of the present application can include a first roller 61, a second roller 62, and a vacuum chuck 63.

[0070] The first roller 61 is a device disposed in front of a process line, holds a cylindrical reel, and releases the carrier film 60 wound around the reel by rotating the carrier film 60 according to a work process flow.

[0071] The carrier film 60 can be a silicon-based carrier film, and the surface bonding strength is preferably in the range of 10 to 20 gf / cm 2 .

[0072] The second roller 62 re-winds the carrier film 60 released from the first roller 61 in a rolling manner.

[0073] The vacuum chuck 63 is disposed between the first roller 61 and the second roller 62.

[0074] The vacuum chuck 63 aligns and attaches the constantan alloy sheet 31 produced in the electroplating apparatus to one side of the carrier film 60.

[0075] The vacuum chuck 63 moves the object I on which the constantan alloy sheet 31 is electroplated on a pad, and transfers the constantan alloy sheet 31 formed on the object I to one side of the carrier film 60 between the first roller 61 and the second roller 62.

[0076] Since the bonding strength of the constantan alloy sheet 31 formed on the object I by the electroplating process is in the range of 2 to 5 gf / cm 2 , the constantan alloy sheet 31 can be easily transferred to the silicon-based carrier film 60 having the surface bonding strength in the range of 10 to 20 gf / cm 2 .

[0077] At this time, as shown in (b) of FIG. 3, the Invar alloy sheet 31 transferred to one side of the carrier film 60 can be attached in 2 or more columns side by side along the length direction of the carrier film 60. In this way, by the configuration of the Invar alloy sheet 31 attached to one carrier film 60 in multiple columns side by side and the etching process continuously performed on the carrier film 60 in a roll-to-roll manner, the manufacturing of the FMM 30 can obtain high productivity.

[0078] FIG. 4 is a diagram for explaining the roll-to-roll FMM manufacturing process according to the embodiment of the present application.

[0079] First, as shown in (a) of FIG. 4, in the state of the attached and combined Invar alloy sheet 31 and carrier film 60 as a result of the carrier film attachment process of the above-described Invar alloy sheet, a divided photoresist 33 is formed on the upper surface of the upper Invar alloy sheet 31 by a photo lithography process.

[0080] In more detail, the photosensitive photoresist 33 is attached to the upper surface of the Invar alloy sheet 31, and an exposure process is performed through a pattern mask. At this time, the photoresist 33 functions as a barrier film for the etching process of the subsequent process, and the photoresist 33 blocks light from contacting a specific portion through the pattern mask, thereby defining a portion to be etched. Then, a developing solution is sprayed, and the unexposed photoresist 33 attached to the portion to be etched is removed, thereby dividing the photoresist 33 on the upper surface of the Invar alloy sheet 31 to define the portion to be etched of the Invar alloy sheet 31.

[0081] Then, as shown in (b) of FIG. 4, the carrier film 60 is introduced into an etching apparatus, and an etching solution is sprayed from the upper side, thereby removing the photoresist 33 and etching the exposed portion of the upper surface of the Invar alloy sheet 31 using the etching solution, thereby forming a first etched portion E1 in the form of a circular-arc groove on the upper surface of the Invar alloy sheet 31.

[0082] At this time, the first etched portion E1 is not formed in the form of a hole but in the form of a circular-arc groove by the first etching.

[0083] In order to form the first etched portion E1 in the form of a groove, a small amount of etching solution is sprayed in the process. The etching apparatus can control the etching process by reducing the amount of etching solution or reducing the etching solution spraying time compared to the case of the through etching in the form of a hole.

[0084] The first etched portion E1 in the form of a groove becomes a rear hole of the FMM 30 to be completed later, and contacts the object substrate 20 on which the organic deposition source 41 is deposited.

[0085] After that, as shown in (d) of FIG. 4, a hole plugging ink 34 is formed on the upper surface of the inconel sheet 31 in which the first etching site E1 is formed.

[0086] The hole plugging ink 34 plugs the groove-shaped first etching site E1 and can be formed on the upper surface of the inconel sheet 31 by printing or coating.

[0087] After that, as shown in (e) of FIG. 4, the inconel sheet 31 in which the hole plugging ink 34 is formed on the upper surface and the carrier film 33 is attached to the lower surface is flipped in the up-and-down direction, and after the carrier film 33 on the upper surface is removed, a photoresist 33 is formed on the upper surface of the inconel sheet 31 on the upper side by a photolithography process. That is, the photoresist 33 on the upper surface of the inconel sheet 31 can divide the site of the inconel sheet 31 to be etched.

[0088] After that, as shown in (f) of FIG. 4, the carrier film 60 is introduced into an etching apparatus, and an etchant is sprayed from the upper side, and in this process, the photoresist 33 is removed, and the upper surface site of the exposed inconel sheet 31 is etched by the etchant, and a groove-shaped second etching site E2 in the form of a circular arc is formed on the upper surface of the inconel sheet 31.

[0089] In this case, the second etching site E2 is formed in the form of a through hole by the second etching, in which the lower part of the second etching site E2 is in contact with the first etching site E1. The pattern hole 32 formed in this way provides a path through which the organic material source 41 supplied from the deposition source supply part 40 can pass.

[0090] As such, in order to form the groove-shaped second etching site E2 larger than the first etching site E1, a larger amount of etchant than that of the first etching is sprayed in this process. The etching apparatus can increase the amount of etchant or increase the time of spraying the etchant to control the etching process in the process of forming the second etching site E2 compared to the process of forming the first etching site E1.

[0091] The groove-shaped second etching site E2 becomes the front hole of the FMM 30 to be completed later, and becomes a site that preferentially receives the organic material supplied from the deposition source supply part 40.

[0092] Basically, when the organic material is deposited, the organic material supplied from the deposition source supply part 40 passes through the pattern hole 32 in a bottom-up manner in which the organic material rises from the lower part to be deposited, and thus, as described above, the horizontal width of the first etching site E1 is smaller than that of the second etching site E2, and the accurate deposition of the organic material is more smoothly performed.

[0093] After that, the photoresist 33 formed on the upper surface of the inconel sheet 31 and the via ink 34 formed on the lower surface are removed, and the FMM 30 having a plurality of pattern holes 32 is formed (refer to (g) of FIG. 4).

[0094] FIG. 5 is a diagram for explaining an etching process according to an embodiment of the present application.

[0095] In the above description, the etching division is implemented as a first etching to form the first etching site El and a second etching to form the second etching site E2.

[0096] In contrast, a case where a housing having a pattern hole 32 of a through shape is formed by one etching is shown in (a) of FIG. 5.

[0097] Due to the isotropic etching characteristic of the wet etching, when a relatively deep pattern hole 32 is formed by one etching, the horizontal width of the etching site is widened, and the density of the pattern hole 32 as a whole is lowered, which is ultimately disadvantageous to realize a high-resolution OLED.

[0098] Also, in a case where isotropic etching is performed on the upper and lower surfaces of the inconel sheet 31 twice, the etching liquid sprayed at the time of the second etching is accumulated in or flows from the first etching site El, which causes over-etching of the first etching site El. In this case, the pattern hole 32 is formed in a non-uniform shape, which lowers the quality of the FMM 30.

[0099] In the present application, the second etching is performed in a state where the first etching site El is filled with the via ink 34 after the first etching, and thus the deformation of the first etching site El is fundamentally blocked during the second etching.

[0100] Also, the second etching site E2 having a wide horizontal width becomes a front hole of the FMM 30 and becomes a site that preferentially receives an organic material supplied from the deposition source supply part 40, and the first etching site El having a narrow horizontal width becomes a rear hole of the FMM 30 and is in contact with the object substrate 20 to which the deposition organic material source 41 is applied, and the inner side of the pattern hole 32 combined therewith is naturally inclined (or formed in a taper shape (S)).

[0101] As described above, the best mode is disclosed in the drawings and the specification. In this case, specific terms are used, but they are used only for the purpose of explaining the present application, and are not used to limit the meaning or to limit the scope of the present application recited in the claims. Therefore, it should be understood by those skilled in the art that various modifications and other embodiments can be made from the present application. Therefore, the true technical scope of the present application should be determined depending on the technical idea of the appended claims.

Claims

1. A method for manufacturing an FMM, characterized in that: include: Step (a), electroplating an Invar alloy sheet onto an object by electroplating; Step (b), arranging and attaching the Invar alloy sheets on one side of the carrier film; Step (c) forming a partitioned photoresist on the upper surface of the Invar alloy sheet disposed on the upper portion of the carrier film, and etching the upper surface portion of the Invar alloy sheet using an etching solution to form a first etched portion in the form of an arc groove in the partitioned portion; Step (d), forming a plugging ink on the upper surface of the Invar alloy sheet to plug the first etched portion in the form of a groove; Step (e), turning over the Invar alloy sheet with the plugging ink formed on the upper surface and the carrier film attached to the lower surface in the upside-down direction, and forming a divided photoresist on the upper surface of the Invar alloy sheet; and Step (f) etching the upper surface of the Invar alloy sheet using an etching solution to form a second etched portion in the form of an arc groove at the divided portion, wherein the lower portion of the second etched portion contacts the first etched portion to form a through-shaped pattern hole. With the Invar alloy sheets aligned and attached on the carrier film, steps (c) to (f) are continuously performed in a roll-to-roll manner.

2. The method for manufacturing an FMM according to claim 1, wherein: In step (b), the Invar sheets attached to one side of the carrier film are attached in two or more rows side by side along the longitudinal direction of the carrier film.

3. The method for manufacturing an FMM according to claim 1, wherein: The etching process is controlled so that the horizontal width of the first etching portion constituting the front hole of the FMM is narrower than that of the second etching portion constituting the rear hole of the FMM.

4. An FMM manufactured by the method for manufacturing an FMM according to any one of claims 1 to 3, characterized in that: include: Invar alloy sheet, formed by electroplating; as well as A plurality of pattern holes are formed by contacting a first etching portion formed on the front surface of the Invar alloy sheet and a second etching portion formed on the rear surface of the Invar alloy sheet and forming a through-hole shape.

5. The FMM according to claim 4, wherein: The horizontal width of the first etching portion constituting the front hole of the FMM is narrower than that of the second etching portion constituting the rear hole of the FMM, and is formed by the inner side of the pattern hole connected thereto being inclined.

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