Display module, display device, and display module preparation method

Abstract

Provided in the present application are a display module, a display device, and a display module preparation method. The display module comprises a display panel, an optical adhesive layer and an encapsulation adhesive, wherein the display panel comprises a main body portion, which is provided with a light-emitting structure. The optical adhesive layer is arranged on one side of the main body portion; the encapsulation adhesive comprises a first encapsulation portion arranged on one side of the main body portion; in a direction parallel to a plane where the main body portion is located, the distance between the first encapsulation portion and the optical adhesive layer is less than a first threshold value; and in the direction of thickness of the main body portion, the first encapsulation portion does not overlap with the optical adhesive layer. In the embodiments of the present application, the positional reliability between the first encapsulation portion and the optical adhesive layer can be improved, thereby reducing the risks of the first encapsulation portion and the optical adhesive layer overlapping in the direction of thickness and bubbles then being created, and also reducing the risk of a strength problem caused by a relatively large gap formed between the first encapsulation portion and the optical adhesive layer in the direction parallel to the plane where the main body portion is located, such that the reliability of the display module and a subsequently formed display device is improved.

Description

Display module, display device and preparation method of display module

[0001] Cross-reference to Related Applications

[0002] This application claims priority to Chinese Patent Application No. 202410434791.2, filed on April 10, 2024, entitled “Display module, display device and preparation method of display module”, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to the technical field of display devices, and in particular to a display module, a display device and a preparation method of the display module. BACKGROUND

[0004] With the development of display technology, display devices (such as mobile phones, tablets, wearable wristbands or televisions, etc.) have been widely used, and users' requirements for display devices have also gradually increased. How to further improve the use reliability of display devices has become one of the research directions of major manufacturers.

[0005] SUMMARY

[0006] The embodiments of the present application provide a display module, a display device and a preparation method of the display module, which can improve the reliability of the display device.

[0007] In a first aspect, the embodiments of the present application provide a display module, which comprises a display panel, an optical adhesive layer and an encapsulation adhesive. The display panel comprises a main body portion, and the main body portion is provided with a light-emitting structure. The optical adhesive layer is arranged on one side of the main body portion. The encapsulation adhesive comprises a first encapsulation portion arranged on one side of the main body portion. In a direction parallel to a plane in which the main body portion is located, the distance between the first encapsulation portion and the optical adhesive layer is less than a first threshold value, and in a thickness direction of the main body portion, the first encapsulation portion and the optical adhesive layer are not arranged in overlapping manner.

[0008] In a second aspect, based on the same inventive concept, the embodiments of the present application provide a display device, which comprises the display module according to any one of the preceding embodiments.

[0009] In a third aspect, based on the same inventive concept, the embodiments of the present application provide a preparation method of a display module, which comprises:

[0010] providing a preliminary-state display panel, the preliminary-state display panel comprising a main body portion;

[0011] forming an optical adhesive layer on one side of the main body portion;

[0012] The encapsulation glue is formed on one side of the initial-state display panel, and the encapsulation glue includes a first encapsulation part arranged on the main body part. In a direction parallel to a plane in which the main body part is located, a distance between the first encapsulation part and the optical glue layer is less than a first threshold value, and in a thickness direction of the main body part, the first encapsulation part and the optical glue layer are not arranged in overlap.

[0013] The display module, the display device and the preparation method of the display module provided in the embodiments of the present application can improve the positional reliability between the first encapsulation part and the optical glue layer, reduce the risk of overlap and bubble generation of the two in the thickness direction, reduce the risk of large gap generation of the two in the direction parallel to the plane in which the main body part is located and causing strength problems, and improve the reliability of the display module and the display device formed subsequently. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced. For those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0015] FIG. 1 is a schematic diagram of a cross-sectional structure of a display module in the related art;

[0016] FIG. 2 is a schematic diagram of a cross-sectional structure of another display module in the related art;

[0017] FIG. 3 is a schematic diagram of a cross-sectional structure of a display module provided in the embodiments of the present application;

[0018] FIG. 4 is a schematic diagram of a cross-sectional structure of another display module provided in the embodiments of the present application;

[0019] FIG. 5 is a schematic diagram of a cross-sectional structure of still another display module provided in the embodiments of the present application;

[0020] FIG. 6 is a schematic diagram of a cross-sectional structure of still another display module provided in the embodiments of the present application;

[0021] FIG. 7 is a schematic diagram of a cross-sectional structure of still another display module provided in the embodiments of the present application;

[0022] FIG. 8 is a schematic diagram of a structure of a display device provided in the embodiments of the present application;

[0023] FIG. 9 is a flowchart of a preparation method of a display module provided in the embodiments of the present application;

[0024] FIGS. 10a to 10c are schematic diagrams of process structures of a preparation method of a display module provided in the embodiments of the present application;

[0025] FIG. 11 is a flowchart of a preparation method of still another display module provided in the embodiments of the present application;

[0026] FIG. 12 is a process structure diagram of a preparation method of a display module according to an embodiment of the present application;

[0027] FIG. 13 is a flow chart of a preparation method of a display module according to an embodiment of the present application;

[0028] FIG. 14 is a process structure diagram of a preparation method of a display module according to an embodiment of the present application;

[0029] FIG. 15 is a flow chart of a preparation method of a display module according to an embodiment of the present application;

[0030] FIG. 16a and FIG. 16b are process structure diagrams of a preparation method of a display module according to an embodiment of the present application;

[0031] FIG. 17 is a flow chart of a preparation method of a display module according to an embodiment of the present application;

[0032] FIG. 18 is a process structure diagram of a preparation method of a display module according to an embodiment of the present application;

[0033] FIG. 19 is a process structure diagram of a preparation method of a display module according to an embodiment of the present application;

[0034] FIG. 20 is a flow chart of a preparation method of a display module according to an embodiment of the present application;

[0035] FIG. 21 is a process structure diagram of a preparation method of a display module according to an embodiment of the present application.

[0036] Label description: 100, display module; 200, display device; 10, display panel; 11, main body part; 111, light emitting structure; 12, bending part; 13, binding part; 131, conductive part; 14, support layer; 15, composite glue layer; 20, optical glue layer; 30, encapsulation glue; 31, first encapsulation part; 32, second encapsulation part; 33, third encapsulation part; 40, cover plate; 50, polarizing layer; 60, sacrifice layer; 10', initial state display panel; 20', optical glue structure; 30', encapsulation glue structure; A1, first area; A2, second area; K, gap space; M1, first surface; M2, second surface; E1, first edge; E2, second edge. DETAILED DESCRIPTION

[0037] In order to make the purposes, technical solutions, and advantages of the present application clearer, further understood, and easier to appreciate, the following will further describe the present application in detail with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. The present application can be implemented without some of the specific details by those skilled in the art. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0038] It should be noted that, in this document, the terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0039] Various modifications and changes can be made to the present application without departing from the spirit or scope of the present application, which will be apparent to those skilled in the art. Therefore, the present application is intended to cover the modifications and variations of the present application falling within the scope of the corresponding claims (claimed technical solutions) and their equivalents. It should be noted that the embodiments provided by the present application can be combined with each other without contradiction.

[0040] An optical adhesive layer and an encapsulation adhesive layer are usually provided in a display device. In addition to the bonding function, the optical adhesive layer can also improve the display effect and reduce reflection. The encapsulation adhesive layer is arranged at the frame position of the display device to prevent the invasion of sweat and grease into the inside of the display device.

[0041] As shown in FIGS. 1 and 2, in the related art, the encapsulation adhesive structure 30' is prone to have an attachment error with the optical adhesive structure 20' due to poor self-coating precision, large fluctuation, and the like. Specifically, as shown in FIG. 1, if the encapsulation adhesive structure 30' has a coating size smaller than a preset size, a large gap space between the encapsulation adhesive structure 30' and the optical adhesive structure 20' is prone to occur, which can cause the support capability of the display device at the position to be reduced, thereby causing the problem of low local strength of the display device.

[0042] Or as shown in FIG. 2, if the encapsulation adhesive structure 30' has a coating size greater than the preset size, the optical adhesive structure 20' is easily attached to the top of the encapsulation adhesive structure 30', so that the encapsulation adhesive structure 30' and the optical adhesive structure 20' cannot be completely attached at the junction position, thereby causing bubbles to be generated, which is not conducive to the reliability of the display device.

[0043] In view of this, in a first aspect, referring to FIG. 3, an embodiment of the present application provides a display module 100, which includes a display panel 10, an optical adhesive layer 20, and an encapsulation adhesive 30. The display panel 10 includes a main body portion 11, and the main body portion 11 is provided with a light emitting structure 111. The optical adhesive layer 20 is arranged on one side of the main body portion 11. The encapsulation adhesive 30 includes a first encapsulation portion 31 arranged on one side of the main body portion 11. In a direction parallel to the plane in which the main body portion 11 is located, the distance between the first encapsulation portion 31 and the optical adhesive layer 20 is less than a first threshold value, and in a thickness direction Y of the main body portion 11, the first encapsulation portion 31 and the optical adhesive layer 20 are not arranged in overlap.

[0044] The display module 100 is used to form a display device subsequently. According to actual needs, the display device can include all structures in the display module 100, or the display device can only include part of the structures in the display module 100, that is, in the process of preparing the display device, part of the film layer structures in the display module 100 can be selectively removed.

[0045] The display panel 10 is a functional component in the display module 100 for realizing a display effect. The display panel 10 at least includes the main body portion 11, and the light emitting structure 111 capable of realizing a light emitting function is arranged in the main body portion 11. Further, the main body portion 11 can include a first area A1 and a second area A2 surrounding the first area A1, and the light emitting structure 111 is arranged in the first area A1. Optionally, the main body portion 11 is further provided with a pixel circuit and a driving circuit. The pixel circuit is arranged in the first area A1 and is electrically connected with the light emitting structure 111, and the driving circuit can be arranged in the second area A2 or the first area A1.

[0046] The main body portion 11 can include a plurality of different film layers arranged in a stack. The specific film layer structure composition of the main body portion 11 is not limited in the embodiments of the present application. For example, the main body portion 11 includes an array layer and a light emitting layer arranged in a stack, the pixel circuit and the driving circuit can be arranged in the array layer, and the light emitting structure 111 can be arranged in the light emitting layer. FIG. 3 does not show all the structures in the main body portion 11, but only shows part of the structures in the main body portion 11.

[0047] In addition, the display panel 10 can be provided with other structures as needed in addition to the main body portion 11. The specific composition of the display panel 10 is also not limited in the embodiments of the present application.

[0048] The optical adhesive layer 20 is arranged on one side of the main body 11. For example, the optical adhesive layer 20 can be arranged on the light-emitting surface side of the light-emitting structure 111. Further, the optical adhesive layer 20 can be arranged to cover the first area A1 of the main body 11. The encapsulation adhesive 30 includes a first encapsulation portion 31, which is also arranged on one side of the main body 11. Further, the first encapsulation portion 31 can be arranged to correspond to the second area A2 of the main body 11. According to different structures of the display panel 10, the encapsulation layer can include other encapsulation portions in addition to the first encapsulation portion 31, which is not limited in the embodiments of the present application.

[0049] In the related art, a large gap space is easily generated between the encapsulation adhesive structure and the optical adhesive structure in the display device, which affects the local support strength of the display device. Or the optical adhesive structure part can be attached above the encapsulation adhesive structure and generate bubbles, which affects the use reliability of the display device.

[0050] Unlike the related art, the embodiments of the present application limit the size of the first encapsulation portion 31 and the optical adhesive layer 20 and the positional relationship therebetween, so as to improve the use reliability of the display device. Specifically, on the one hand, in the direction parallel to the plane in which the main body 11 is located, the distance between the first encapsulation portion 31 and the optical adhesive layer 20 is less than a first threshold value. The “first threshold value” mentioned here can be a specific parameter value preset according to actual needs. Further, if there is a gap between the first encapsulation portion 31 and the optical adhesive layer 20, since the size of the gap is less than the first threshold value, that is, the size of the gap is small, the existence of the gap has little effect on the support effect of the display device, and the display device can still provide sufficient support at the gap and its vicinity, meeting the support needs of the display device. On the other hand, in the thickness direction Y of the main body 11, the first encapsulation portion 31 and the optical adhesive layer 20 are not overlapped, that is, the first encapsulation portion 31 will not be attached to the side of the optical adhesive layer 20 away from the main body 11, so as to reduce the risk of generating bubbles therebetween.

[0051] In summary, in the embodiments of the present application, by limiting the size and relative positional relationship between the first encapsulation portion 31 and the optical adhesive layer 20, the positional reliability between the first encapsulation portion 31 and the optical adhesive layer 20 can be improved, the risk of overlap and bubble generation in the thickness direction Y is reduced, and the risk of large gap generation in the direction parallel to the plane in which the main body 11 is located is reduced, thereby improving the reliability of the display module 100 and the subsequently formed display device.

[0052] It should be noted that the specific size relationship between the first encapsulation part 31 and the optical adhesive layer 20 is not limited in the embodiments of the present application, and the thickness of the first encapsulation part 31 can be greater than, equal to, or less than the thickness of the optical adhesive layer 20. Further, the thickness of the first encapsulation part 31 at different positions can be equal or different, and the thickness of the optical adhesive layer 20 at different positions can be equal or different.

[0053] In addition, the display module 100 can further include other structures in addition to the display panel 10, the optical adhesive layer 20, and the encapsulation adhesive 30, and the specific composition of the display module 100 is not limited in the embodiments of the present application. Optionally, the display module 100 can further include a support layer 14 and a composite adhesive layer 15, and the support layer 14 and the composite adhesive layer 15 are located on the side of the main body part 11 away from the optical adhesive layer 20. The number of the support layer 14 can be one or more. For example, the support layer 14 is provided with two, and the two support layers 14 are arranged on both sides of the composite adhesive layer 15 along the thickness direction Y.

[0054] The support layer 14 can support and bear the main body part 11, and reduce the risk of excessive deformation of the main body part 11 in the subsequent use process. Optionally, the support layer 14 can include a metal material, for example, the support layer 14 can include a steel sheet or other structure with large structural strength.

[0055] The specific size range of the first threshold is not limited in the embodiments of the present application. Optionally, the first threshold can be 10 μm.

[0056] In some embodiments, referring to FIG. 3, the first encapsulation part 31 includes a first surface M1 away from the main body part 11, and the optical adhesive layer 20 includes a second surface M2 away from the main body part 11. The first surface M1 is located on the side of the second surface M2 close to the main body part 11, or the first surface M1 is flush with the second surface M2.

[0057] The first surface M1 and the second surface M2 are surfaces of the first encapsulation part 31 and the optical adhesive layer 20 away from the main body part 11, respectively. In FIG. 3, the first surface M1 and the second surface M2 are upper surfaces of the first encapsulation part 31 and the optical adhesive layer 20, respectively. Since the thickness of the first encapsulation part 31 at different positions can be the same or different, the first surface M1 can be a planar structure or a regular or irregular surface structure such as a curved surface. Similarly, since the thickness of the optical adhesive layer 20 at different positions can be the same or different, the second surface M2 can be a planar structure or a regular or irregular surface structure such as a curved surface.

[0058] Further, the first surface M1 can be located on the side of the second surface M2 close to the body portion 11, that is, the maximum thickness of the optical adhesive layer 20 is greater than the maximum thickness of the first packaging portion 31. Alternatively, the first surface M1 can be arranged flush with the second surface M2. Here, the term "flush arrangement" means that the first surface M1 and the second surface M2 can jointly form a continuous planar structure. For example, the edge thickness of the first surface M1 close to the second surface M2 can be the same as the edge thickness of the second surface M2 close to the first surface M1. When the first packaging portion 31 and the optical adhesive layer 20 are arranged in a direction parallel to the plane of the body portion 11, the first surface M1 and the second surface M2 can jointly form a continuous planar structure.

[0059] In the embodiments of the present application, the thickness of the first packaging portion 31 is controlled so that the first surface M1 is located on the side of the second surface M2 close to the body portion 11, or the first surface M1 is flush with the second surface M2. That is, in a direction parallel to the thickness direction Y and directed from the body portion 11 to the optical adhesive layer 20, the first packaging portion 31 does not protrude beyond the optical adhesive layer 20. Therefore, during the preparation of other film layers after the encapsulation adhesive 30, the risk of physical interference between the first packaging portion 31 and other film layer structures is reduced, the preparation difficulty of the display module 100 is reduced, and the corresponding preparation yield of the display module 100 is improved.

[0060] In some embodiments, referring to FIG. 4, the display module 100 further includes a cover plate 40 arranged on the side of the optical adhesive layer 20 away from the body portion 11. In the thickness direction Y, the cover plate 40 overlaps the first packaging portion 31. Here, the term "overlapping arrangement" means that in any plane perpendicular to the thickness direction Y, the corresponding orthographic projection of the cover plate 40 and the corresponding orthographic projection of the first packaging portion 31 have an overlapping region.

[0061] The optical adhesive layer 20, the first packaging portion 31, and the cover plate 40 are located on the same side of the body portion 11. The cover plate 40 covers the optical adhesive layer 20 and overlaps the first packaging portion 31 in the thickness direction Y. The presence of the cover plate 40 can protect the optical adhesive layer 20, the first packaging portion 31, and the body portion 11, and reduce the adverse effects of external impact, scratches, fingerprints, and the like on the internal structure of the display module 100, thereby improving the use reliability of the display module 100.

[0062] It should be noted that in the thickness direction Y, the cover plate 40 can cover the first packaging portion 31, or the cover plate 40 can only overlap part of the structure of the first packaging portion 31. The other part of the structure of the first packaging portion 31 can be located outside the cover plate 40 in the thickness direction Y.

[0063] In the preparation process of the display module 100, the cover plate 40 is formed after the encapsulation adhesive 30, and in the thickness direction Y, the cover plate 40 is arranged to overlap the first encapsulation part 31. On this basis, in order to reduce the influence of the first encapsulation part 31 on the preparation process of the cover plate 40, the size of the first encapsulation part 31 is limited in the embodiment of the application, so that in the direction parallel to the thickness direction Y and directed from the main body part 11 to the optical adhesive layer 20, the first encapsulation part 31 does not exceed the optical adhesive layer 20, thereby reducing the risk of physical interference between the first encapsulation part 31 and the cover plate 40, and improving the preparation yield of the display module 100.

[0064] In some embodiments, referring to FIG. 5, the first encapsulation part 31 includes a first edge E1 and a second edge E2 opposite in the first direction X, the first edge E1 is located on the side of the second edge E2 close to the optical adhesive layer 20, and the first direction X intersects the thickness direction Y. In the direction from the second edge E2 to the first edge E1, the size of the first encapsulation part 31 in the thickness direction Y shows a gradually decreasing trend.

[0065] The first direction X is a direction parallel to the plane in which the main body part 11 is located, and optionally, the first direction X is perpendicular to the thickness direction Y. The first encapsulation part 31 has a first edge E1 and a second edge E2 opposite in the first direction X, the first edge E1 is closer to the optical adhesive layer 20 than the second edge E2, and optionally, the first edge E1 can be arranged to be attached to the optical adhesive layer 20.

[0066] In the preparation process of the encapsulation adhesive 30, at the place where the encapsulation adhesive 30 and the optical adhesive layer 20 are in interface contact, that is, at the position of the first edge E1, the thickness of the encapsulation adhesive 30 at the first edge E1 is relatively increased due to the siphon effect. On this basis, if the coating thickness of the encapsulation adhesive 30 itself at the first edge E1 is too large, it is easy to cause the first encapsulation part 31 to be partially formed on the side of the optical adhesive layer 20 away from the main body part, thereby easily interfering with the cover plate 40 formed in the subsequent preparation process, and affecting the overall preparation process of the display module 100.

[0067] In view of this, the thickness of the first encapsulation part 31 in the encapsulation adhesive 30 is adjusted in the embodiment of the application, and in the direction from the second edge E2 to the first edge E1, the size of the first encapsulation part 31 in the thickness direction Y shows a gradually decreasing trend. That is, the closer to the optical adhesive layer 20, the smaller the thickness of the first encapsulation part 31. In this way, the coating amount of the first encapsulation part 31 at the first edge E1 can be reduced, thereby reducing the risk of the first encapsulation part 31 being partially formed on the side of the optical adhesive layer 20 away from the main body part, and further reducing the risk of physical interference between the first encapsulation part 31 and the cover plate 40, thereby meeting the formation needs of the cover plate 40 and improving the preparation yield of the display module 100.

[0068] In some embodiments, as shown in FIG. 4 and FIG. 5, the optical adhesive layer 20 is attached to the main body 11; or, as shown in FIG. 6, the display module 100 further comprises a polarizing layer 50 arranged between the optical adhesive layer 20 and the main body 11, and the first encapsulation portion 31 is attached to the polarizing layer 50.

[0069] The scheme of the embodiments of the present application can be applied to various types of display modules 100, in particular, to display modules 100 with a polarizing layer 50, or to display modules 100 without a polarizing layer 50.

[0070] For example, in the case of a display module 100 without a polarizing layer 50, the optical adhesive layer 20 is attached to the main body 11 in the thickness direction Y, which helps to achieve the overall thinning of the display module 100. Or, for example, in the case of a display module 100 with a polarizing layer 50, the optical adhesive layer 20 is located on the side of the polarizing layer 50 away from the main body 11, and the presence of the polarizing layer 50 can eliminate or reduce light reflection and refraction.

[0071] In summary, according to different actual needs, the embodiments of the present application can be applied to display modules 100 with or without a polarizing layer 50, and have strong flexibility and practicality.

[0072] In some embodiments, as shown in FIG. 3 to FIG. 6, the display panel 10 comprises a bending portion 12 connected to the main body 11, and a binding portion 13 connected to the bending portion 12, the binding portion 13 is bent to the side of the main body 11 away from the optical adhesive layer 20 through the bending portion 12. The encapsulation adhesive 30 comprises a second encapsulation portion 32 arranged on one side of the bending portion 12, and a third encapsulation portion 33 arranged on the side of the binding portion 13 away from the main body 11, and the two ends of the second encapsulation portion 32 are respectively connected to the first encapsulation portion 31 and the third encapsulation portion 33.

[0073] The display panel 10 can comprise the main body 11, the bending portion 12 and the binding portion 13, the light emitting structure 111 is arranged in the main body 11, the main body 11 is a component of the display panel 10 that can achieve display effect, and in general, the side of the main body 11 away from the binding portion 13 is the light emitting side of the main body 11, which is used to display specific pictures or videos to the user.

[0074] The binding portion 13 and the main body 11 are arranged in the thickness direction Y, and are connected through the bending portion 12. On this basis, as can be seen from the drawings, the support layer 14 and the composite adhesive layer 15 can be arranged between the main body 11 and the binding portion 13 to fix and support the binding portion 13 and the main body 11.

[0075] Optionally, the binding portion 13 can be provided with a driving chip. The driving chip can include various types, such as a display driving chip and a touch driving chip. The display driving chip is used to store image data and generate driving voltage, and can also improve the picture quality through customized algorithms. The touch driving chip mainly realizes touch signal processing and is a necessary component of a display device with touch function. Of course, the display driving chip and the touch driving chip can also be integrally arranged on the binding portion 13.

[0076] For the display panel 10 in this structure, the packaging adhesive 30 includes not only the first packaging portion 31, but also a second packaging portion 32 corresponding to the bending portion 12 and a third packaging portion 33 corresponding to the binding portion 13. The first packaging portion 31, the second packaging portion 32 and the third packaging portion 33 are sequentially connected and arranged, and can respectively encapsulate and protect the main body portion 11, the bending portion 12 and the binding portion 13, thereby helping to improve the use reliability and service life of the display module 100.

[0077] In some embodiments, as shown in FIGS. 5 and 6, the display module 100 further includes a conductive portion 131 arranged on the side of the binding portion 13 away from the main body portion 11, the third packaging portion 33 includes a conductive material, and the conductive portion 131 is arranged in close contact with the third packaging portion 33.

[0078] The binding portion 13 is provided with the conductive portion 131, and the conductive portion 131 is provided with a conductive structure for meeting the use needs of the display module 100. For example, the conductive portion 131 can include a metal wiring structure and a circuit board structure. The conductive portion 131 is located on the side of the binding portion 13 away from the main body portion 11. As can be seen from the drawings, the conductive portion 131 and the third packaging portion 33 are located on the same side of the binding portion 13 in the thickness direction Y.

[0079] On this basis, the conductive portion 131 and the third packaging portion 33 are arranged in close contact, and the third packaging portion 33 is provided with a conductive material, so that the third packaging portion 33 can help the conductive portion 131 to steal part of the static electricity, thereby reducing the risk of abnormal accumulation of electric charges at the conductive portion 131 and improving the use reliability of the display module 100.

[0080] It should be noted that the third packaging portion 33 includes a conductive material, and the first packaging portion 31 and the second packaging portion 32 can include the same material as the third packaging portion 33 or different materials, which is not limited in the embodiments of the present application. Optionally, the first packaging portion 31, the second packaging portion 32 and the third packaging portion 33 include the same material and are integrally formed, which can simplify the preparation difficulty of the packaging adhesive 30 and further improve the conductive capacity of the packaging adhesive 30.

[0081] In addition, the present application does not limit the specific positional relationship between the third encapsulation portion 33 and the conductive portion 131, as long as the third encapsulation portion 33 and the conductive portion 131 can be attached. For example, the third encapsulation portion 33 and the conductive portion 131 can be attached in the first direction X, or the third encapsulation portion 33 can be partially located on the side of the conductive portion 131 away from the binding portion 13, or the third encapsulation portion 33 can be partially located on the side of the conductive portion 131 facing the binding portion 13.

[0082] In some embodiments, referring to FIG. 7, the third encapsulation portion 33 is at least partially located between the conductive portion 131 and the binding portion 13, that is, in the thickness direction Y, the third encapsulation portion 33 is partially located on the side of the conductive portion 131 facing the binding portion 13.

[0083] In the present application, by at least partially arranging the third encapsulation portion 33 between the conductive portion 131 and the binding portion 13, the contact area between the third encapsulation portion 33 and the conductive portion 131 is increased, thereby improving the charge transfer capability between the two, further reducing the risk of abnormal accumulation of charges at the conductive portion 131, and improving the use reliability of the display module 100.

[0084] It should be noted that since the conductive portion 131 and the binding portion 13 are located on the backlight side of the main body portion 11, even if the third encapsulation portion 33 is partially located between the conductive portion 131 and the binding portion 13, resulting in a difference in thickness at the local position, it will not affect the subsequent assembly of the display device.

[0085] In some embodiments, as shown in FIG. 7, the third encapsulation portion 33 includes a third edge E3 and a fourth edge E4 opposite in the first direction X, the third edge E3 is connected to the second encapsulation portion 32, and the conductive portion 131 is partially arranged on the side of the fourth edge E4 away from the third edge E3, the first direction X intersects the thickness direction Y. Among them, in the direction from the third edge E3 to the fourth edge E4, the size of the third encapsulation portion 33 in the thickness direction Y gradually decreases.

[0086] The second edge E2 on the first encapsulation portion 31 and the third edge E3 on the third encapsulation portion 33 are respectively connected to different ends of the second encapsulation portion 32. As known from the foregoing, the third encapsulation portion 33 can be partially located between the conductive portion 131 and the binding portion 13, thereby improving the charge transfer capability between the two. On this basis, the thickness of the third encapsulation portion 33 is adjusted to improve the attachment reliability between the third encapsulation portion 33 and the conductive portion 131.

[0087] Specifically, the conductive part 131 is formed after the encapsulation adhesive 30, if the direction from the third edge E3 to the fourth edge E4, the third encapsulation part 33 keeps the same size in the thickness direction Y, that is, the thickness of the third encapsulation part 33 at each position is consistent, which will cause the third encapsulation part 33 still has a large thickness size at the fourth edge E4, so that the part of the conductive part 131 located on the side of the third encapsulation part 33 away from the bonding part 13 is prone to warping due to the excessive thickness of the third encapsulation part 33, thereby affecting the bonding reliability between the third encapsulation part 33 and the conductive part 131.

[0088] In the embodiment of the present application, the thickness of the third encapsulation part 33 gradually decreases in the direction from the third edge E3 to the fourth edge E4, that is, the closer to the fourth edge E4, the smaller the thickness size of the third encapsulation part 33. This design can reduce the risk of warping of the conductive part 131 at the fourth edge E4, so that the part of the conductive part 131 located on the side of the third encapsulation part 33 away from the bonding part 13 can extend along the surface of the third encapsulation part 33 away from the bonding part 13, thereby improving the bonding reliability between the third bonding part 13 and the conductive part 131, and improving the charge transfer capability between the two, and improving the use reliability of the display module 100.

[0089] In some embodiments, as shown in FIG. 7, the display module 100 further includes a cover plate 40 disposed on the side of the optical adhesive layer 20 away from the main body part 11, and the cover plate 40 covers the encapsulation adhesive 30 in the thickness direction Y. That is, in any plane perpendicular to the thickness direction Y, the orthographic projection of the encapsulation adhesive 30 is located within the orthographic projection of the cover plate 40.

[0090] The cover plate 40 is usually a rigid structure, and the encapsulation adhesive 30 is usually a flexible structure. In order to improve the structural reliability of the display module 100, the cover plate 40 is arranged to cover the encapsulation adhesive 30 in the thickness direction Y in the embodiment of the present application, so that the cover plate 40 can protect the encapsulation adhesive 30, thereby reducing the adverse effects of external impact or scratches on the encapsulation adhesive 30, and improving the structural reliability of the encapsulation adhesive 30.

[0091] Further, in some optional embodiments, the cover plate 40 covers both the encapsulation adhesive 30 and the optical adhesive layer 20 in the thickness direction Y. In this way, the cover plate 40 can protect both the encapsulation adhesive 30 and the optical adhesive layer 20, further improving the reliability of the display module 100.

[0092] In a second aspect, referring to FIG. 8, the present application provides a display device 200, which includes the display module 100 in any of the above embodiments.

[0093] It should be noted that the display device 200 provided by the embodiments of the present application has the beneficial effects of the display module 100 in any of the foregoing embodiments, and specific descriptions are made with reference to the foregoing descriptions of the beneficial effects of the display module 100, which will not be repeated herein.

[0094] In a third aspect, with reference to FIGS. 9 and 10, the embodiments of the present application provide a preparation method of a display module, comprising:

[0095] S100: providing a primary-state display panel.

[0096] Referring to FIG. 10a, in step S100, the primary-state display panel 10' is used to form a display panel subsequently, and the primary-state display panel 10' at least comprises a main body 11, and a light emitting structure 111 capable of realizing a light emitting function is arranged in the main body 11. Further, the main body 11 can comprise a first area A1 and a second area A2 surrounding the first area A1, and the light emitting structure 111 is arranged in the first area A1. Optionally, the main body 11 further comprises a pixel circuit and a driving circuit, the pixel circuit is arranged in the first area A1 and electrically connected with the light emitting structure 111, and the driving circuit is arranged in the second area A2.

[0097] The main body 11 can comprise a plurality of different film layers arranged in a stack, and the specific film layer structure and composition manner of the main body 11 are not limited by the embodiments of the present application. For example, the main body 11 comprises an array layer and a light emitting layer arranged in a stack, the pixel circuit and the driving circuit can be arranged in the array layer, and the light emitting structure 111 can be arranged in the light emitting layer. It should be noted that FIG. 10a does not show all the structures in the main body 11, but only shows part of the structures in the main body 11.

[0098] In addition, the primary-state display panel 10' can further comprise other structures according to needs in addition to the main body 11, and the specific composition manner of the primary-state display panel 10' is also not limited by the embodiments of the present application.

[0099] S110: forming an optical adhesive layer on one side of the main body.

[0100] Referring to FIG. 10b, in step S110, the optical adhesive layer 20 is arranged on one side of the main body 11, for example, the optical adhesive layer 20 can be arranged on one side of the light emitting surface of the light emitting structure 111. Further, the optical adhesive layer 20 can cover the first area A1 of the main body 11.

[0101] S120: forming an encapsulation adhesive on one side of the primary-state display panel.

[0102] Referring to FIG. 10c, in step S120, the encapsulation adhesive 30 includes a first encapsulation portion 31 disposed on the main body portion 11, and a distance between the first encapsulation portion 31 and the optical adhesive layer 20 in a direction parallel to a plane on which the main body portion 11 is located is less than a first threshold value, and the first encapsulation portion 31 and the optical adhesive layer 20 are not overlapped in the thickness direction Y of the main body portion 11.

[0103] In the related art, the encapsulation adhesive structure is usually formed before the optical adhesive structure, and due to the influence of factors such as coating accuracy, a large gap space between the encapsulation adhesive structure and the optical adhesive structure in the display device is prone to occur, which affects the local support strength of the display device. Or the optical adhesive structure part may be attached above the encapsulation adhesive structure, and bubbles are generated, which affects the use reliability of the display device.

[0104] In the embodiments of the present application, the encapsulation adhesive 30 can be prepared after the optical adhesive layer 20, so that in the preparation process of the encapsulation adhesive 30, the first encapsulation portion 31 formed on the main body portion 11 can be coated along the edge of the optical adhesive layer 20, and the existence of the optical adhesive layer 20 can play a role in limiting and positioning the formation of the first encapsulation portion 31, so that the first encapsulation portion 31 and the optical adhesive layer 20 can be arranged without overlapping in the thickness direction Y of the main body portion 11. That is, the optical adhesive layer 20 will not be attached above the first encapsulation portion 31, thereby reducing the risk of bubbles between the two.

[0105] In addition, in this preparation method, the distance between the first encapsulation portion 31 and the optical adhesive layer 20 in the direction parallel to the plane on which the main body portion 11 is located can be less than the first threshold value. The "first threshold value" mentioned here can be a specific range value preset according to actual needs. Specifically, if there is a gap between the first encapsulation portion 31 and the optical adhesive layer 20, since the size of the gap is less than the first threshold value, that is, the size of the gap is small, the existence of the gap has little effect on the support effect of the display device, and the display device can still provide sufficient support at the gap and its vicinity, meeting the support needs of the display device. In other words, in the embodiments of the present application, even if there is a certain gap between the first encapsulation portion 31 and the optical adhesive layer 20, since the size of the gap is small, it has little effect on the overall strength of the display module.

[0106] In summary, in the embodiment of the present application, the preparation process of the packaging glue 30 is adjusted after the optical glue layer 20, so that the first packaging part 31 formed on the main body part 11 can be coated along the edge of the optical glue layer 20 during the preparation of the packaging glue 30. In this way, the positional reliability between the first packaging part 31 and the optical glue layer 20 can be improved, the risk of the two overlapping in the thickness direction Y and generating bubbles can be reduced, and the risk of the two generating a large gap in the direction parallel to the plane of the main body part 11 and causing strength problems can be reduced, thereby improving the reliability of the display module and the display device formed subsequently.

[0107] It should be noted that according to different structures of the display panel 10, the packaging layer can include other packaging parts in addition to the first packaging part 31, and the embodiment of the present application does not limit this.

[0108] In some embodiments, as shown in FIG. 10c, the initial-state display panel 10' further includes a bending part 12 and a binding part 13, and the main body part 11 and the binding part 13 are connected to both sides of the bending part 12 along the first direction X intersecting the thickness direction Y of the main body part 11.

[0109] The initial-state display panel 10' at least includes three parts of the main body part 11, the binding part 13 and the bending part 12. The main body part 11 is a component that can realize a display effect in the display panel 10, the binding part 13 can be provided with a driving chip and other structures to meet the various functional needs of the display module 100, and the bending part 12 is used to realize the connection between the main body part 11 and the binding part 13.

[0110] In the initial-state display panel 10', the main body part 11, the bending part 12 and the binding part 13 are sequentially connected along the first direction, so that when steps S110 and S120 are performed, the main body part 11, the bending part 12 and the binding part 13 can be placed on the same flat structure at the same time, and then the preparation of the packaging glue 30 and the optical glue layer 20 is performed. This helps to reduce the preparation difficulty and can improve the preparation accuracy.

[0111] Further, please refer to FIGS. 11 and 12, the preparation method further includes:

[0112] S130: folding the binding part 13 to the side of the main body part 11 away from the optical glue layer 20 through the bending part 12.

[0113] As shown in FIG. 12, in step S130, the initial-state display panel can be changed into the display panel 10, in which the binding part 13 and the main body part 11 are spaced apart in the thickness direction Y and connected through the bending part 12. This design helps to reduce the frame size of the display module and improve the display effect of the display device formed finally.

[0114] In some embodiments, as shown in FIG. 10c, in step S120, the encapsulation adhesive 30 further comprises a second encapsulation portion 32 arranged on one side of the bending portion 12, and a third encapsulation portion 33 arranged on one side of the binding portion 13.

[0115] As can be seen from the drawings, the first encapsulation portion 31, the second encapsulation portion 32 and the third encapsulation portion 33 are sequentially arranged, and all are arranged on the same side of the initial-state display panel 10'. The first encapsulation portion 31, the second encapsulation portion 32 and the third encapsulation portion 33 can respectively encapsulate and protect the main body portion 11, the bending portion 12 and the binding portion 13, thereby helping to improve the use reliability and service life of the display module 100.

[0116] Further, referring to FIGS. 13 and 14, before step S130, the method further comprises:

[0117] S140: forming a conductive portion on one side of the binding portion.

[0118] As shown in FIG. 14, in step S140, the binding portion 13 is provided with a conductive portion 131, and the conductive portion 131 is provided with a conductive structure to meet the use needs of the display module 100. As can be seen from the drawings, the conductive portion 131 and the third encapsulation portion 33 are located on the same side of the binding portion 13 in the thickness direction Y. Further, the conductive portion 131 and the third encapsulation portion 33 are arranged in abutment, and in the thickness direction Y, the conductive portion 131 and the third encapsulation portion 33 are arranged in overlap.

[0119] In the embodiments of the present application, the conductive portion 131 is formed after the encapsulation adhesive 30, and on this basis, by arranging the third encapsulation portion 33 at least partially between the conductive portion 131 and the binding portion 13, the contact area between the third encapsulation portion 33 and the conductive portion 131 is increased, the charge transfer capacity between the two is improved, the risk of abnormal accumulation of charges at the conductive portion 131 is reduced, and the use reliability of the display module 100 is improved.

[0120] In some embodiments, as shown in FIG. 14, the third encapsulation portion 33 comprises a third edge E3 and a fourth edge E4 opposite in the first direction X, the third edge E3 is connected to the second encapsulation portion 32, and the conductive portion 131 is partially arranged on the side of the fourth edge E4 away from the third edge E3, and the first direction X intersects the thickness direction Y. In the direction from the third edge E3 to the fourth edge E4, the size of the third encapsulation portion 33 in the thickness direction Y gradually decreases.

[0121] As can be seen from the foregoing, the third encapsulation portion 33 can be partially located between the conductive portion 131 and the bonding portion 13, so as to improve the charge transmission capability between the two. On this basis, the thickness of the third encapsulation portion 33 is adjusted in the embodiments of the present application, so as to improve the bonding reliability between the third encapsulation portion 33 and the conductive portion 131.

[0122] Specifically, the conductive portion 131 is formed after the encapsulation glue 30, and the thickness of the third encapsulation portion 33 in the direction from the third edge E3 to the fourth edge E4 remains unchanged, that is, the thickness of the third encapsulation portion 33 at each position remains consistent. This will cause the third encapsulation portion 33 to still have a large thickness at the fourth edge E4, so that the part of the conductive portion 131 located on the side of the third encapsulation portion 33 away from the bonding portion 13 is prone to warping due to the excessive thickness of the third encapsulation portion 33, thereby affecting the bonding reliability between the third encapsulation portion 33 and the conductive portion 131.

[0123] In the embodiments of the present application, the coating mode of the encapsulation glue 30 at the third encapsulation portion 33 is adjusted, so that the thickness of the third encapsulation portion 33 gradually decreases in the direction from the third edge E3 to the fourth edge E4, that is, the closer to the fourth edge E4, the smaller the thickness of the third encapsulation portion 33. This design can reduce the risk of warping of the conductive portion 131 at the fourth edge E4, so that the part of the conductive portion 131 located on the side of the third encapsulation portion 33 away from the bonding portion 13 can extend obliquely along the surface of the third encapsulation portion 33 away from the bonding portion 13, so as to improve the bonding reliability between the third bonding portion 13 and the conductive portion 131, thereby improving the charge transmission capability between the two and improving the use reliability of the display module 100.

[0124] In some embodiments, referring to FIGS. 15 and 16, before step S120, the method further comprises:

[0125] S150: forming a sacrificial layer on the side of the optical glue layer away from the main body portion.

[0126] Referring to FIG. 16a, in step S150, the sacrificial layer 60 at least partially protrudes from the optical glue layer in the first direction X to form a gap space K with the main body portion 11 in the thickness direction Y, and the first direction X intersects the thickness direction Y. Optionally, the first direction X is perpendicular to the thickness direction Y.

[0127] The presence of the sacrificial layer 60 is used to cooperatively define a gap space K with the main body part 11 for accommodating the encapsulation adhesive 30, so as to limit the thickness dimension of the first encapsulation part 31. Specifically, referring to FIG. 16b, in step S120, the first encapsulation part 31 at least partially flows into the gap space K. The portion of the first encapsulation part 31 located in the gap space K can be arranged to conform to the optical adhesive layer 20 in the first direction X, and its dimension in the thickness direction Y is limited by the sacrificial layer 60.

[0128] On this basis, since the sacrificial layer 60 is located on the side of the optical adhesive layer 20 away from the main body part 11 and is arranged in contact with the optical adhesive layer 20, the portion of the first encapsulation part 31 located in the gap space K is limited by the presence of the sacrificial layer 60 and will not exceed the surface of the optical adhesive layer 20 away from the main body part 11 in the thickness direction Y, thereby reducing the risk of the first encapsulation part 31 flowing to the side of the optical adhesive layer 20 away from the main body part 11 during preparation, and improving the preparation accuracy of the encapsulation adhesive 30.

[0129] Further, after the preparation of the encapsulation adhesive 30 is completed, i.e. after step S120, the preparation method further comprises:

[0130] S160: removing the sacrificial layer.

[0131] In step S160, by removing the sacrificial layer 60, the sacrificial layer 60 will not exist in the finally formed display module 100 and display device, so as to reduce the influence of the sacrificial layer 60 on the thickness dimension of the display module 100 and display device, and facilitate the light and thin design.

[0132] It should be noted that, of course, in other embodiments, according to different actual needs, step S160 can also not be provided, i.e. the sacrificial layer 60 is not removed, so that the sacrificial layer 60 exists in the formed display module and display device.

[0133] In some embodiments, referring to FIG. 10c, the first encapsulation part 31 comprises a first surface M1 away from the main body part 11, and the optical adhesive layer 20 comprises a second surface M2 away from the main body part 11. The first surface M1 is located on the side of the second surface M2 close to the main body part 11, or the first surface M1 is flush with the second surface M2.

[0134] The first surface M1 and the second surface M2 are surfaces of the first packaging portion 31 and the optical adhesive layer 20 away from the body portion 11, and in FIG. 10c, the first surface M1 and the second surface M2 are upper surfaces of the first packaging portion 31 and the optical adhesive layer 20. Since the thickness of the first packaging portion 31 can be the same or different at different positions, the first surface M1 can be a planar structure or a regular or irregular surface structure such as a curved surface. Similarly, since the thickness of the optical adhesive layer 20 can be the same or different at different positions, the second surface M2 can be a planar structure or a regular or irregular surface structure such as a curved surface.

[0135] Further, the first surface M1 can be located on the side of the second surface M2 close to the body portion 11, i.e., the maximum thickness of the optical adhesive layer 20 is greater than the maximum thickness of the first packaging portion 31. Alternatively, the first surface M1 and the second surface M2 are arranged flush, and "flush arrangement" referred to herein means that the first surface M1 and the second surface M2 can jointly form a continuous surface structure, for example, the edge thickness of the first surface M1 close to the second surface M2 can be the same as the edge thickness of the second surface M2 close to the first surface M1, and when the first packaging portion 31 and the optical adhesive layer 20 are arranged flush in a direction parallel to the plane of the body portion 11, the first surface M1 and the second surface M2 can jointly form a continuous surface structure.

[0136] In the embodiments of the present application, by adjusting the coating mode of the packaging adhesive 30 at the first packaging portion 31, the thickness of the first packaging portion 31 is controlled, so that the first surface M1 is located on the side of the second surface M2 close to the body portion 11, or the first surface M1 is flush with the second surface M2. That is, in the direction parallel to the thickness direction Y and directed from the body portion 11 to the optical adhesive layer 20, the first packaging portion 31 does not exceed the optical adhesive layer 20. Further, in the preparation process of other film layers after the packaging adhesive 30, the risk of physical interference between the first packaging portion 31 and other film layer structures is reduced, the preparation difficulty of the display module is reduced, and the corresponding preparation yield of the display module is improved.

[0137] In some embodiments, referring to FIGS. 17 and 18, the preparation method further includes:

[0138] S170: forming a cover plate on the side of the packaging adhesive away from the initial-state display panel.

[0139] As shown in FIG. 18, in step S170, the cover plate 40 is arranged to overlap the first encapsulation portion 31 in the thickness direction Y. The optical adhesive layer 20, the first encapsulation portion 31, and the cover plate 40 are located on the same side of the main body portion 11, and the cover plate 40 covers the optical adhesive layer 20 and is arranged to overlap the first encapsulation portion 31 in the thickness direction Y. The presence of the cover plate 40 can protect the optical adhesive layer 20, the first encapsulation portion 31, the main body portion 11, and the like, reduce the adverse effects of external impact, scratches, fingerprints, and the like on the internal structure of the formed display module 100, and improve the use reliability of the display module 100.

[0140] It should be noted that, in the thickness direction Y, the cover plate 40 can be arranged to cover the first encapsulation portion 31, or the cover plate 40 can only overlap part of the structure of the first encapsulation portion 31, and other parts of the structure of the first encapsulation portion 31 can be located outside the cover plate 40 in the thickness direction Y. In addition, the order of preparation of step S170 is not limited by the embodiments of the present application, and exemplarily, in some other embodiments, the cover plate 40 can also be formed on the display panel after step S130.

[0141] In the process of preparing the display module 100, the cover plate 40 is formed after the encapsulation adhesive 30, and in the thickness direction Y, the cover plate 40 is arranged to overlap the first encapsulation portion 31. On this basis, in order to reduce the influence of the first encapsulation portion 31 on the preparation process of the cover plate 40, the size of the first encapsulation portion 31 is limited in the embodiments of the present application, so that in the direction parallel to the thickness direction Y and directed from the main body portion 11 to the optical adhesive layer 20, the first encapsulation portion 31 does not exceed the optical adhesive layer 20, thereby reducing the risk of physical interference between the first encapsulation portion 31 and the cover plate 40 and improving the yield of the display module 100.

[0142] In some embodiments, referring to FIG. 19, the first encapsulation portion 31 includes a first edge E1 and a second edge E2 opposite in the first direction X, the first edge E1 is located on the side of the second edge E2 closer to the optical adhesive layer 20, and the first direction X intersects the thickness direction Y. In the direction from the second edge E2 to the first edge E1, the size of the first encapsulation portion 31 in the thickness direction Y gradually decreases.

[0143] The first encapsulation portion 31 has a first edge E1 and a second edge E2 opposite in the first direction X, and the first edge E1 is closer to the optical adhesive layer 20 than the second edge E2. Optionally, the first edge E1 can be arranged to be attached to the optical adhesive layer 20.

[0144] In the preparation process of the encapsulation glue 30, the interface contact occurs between the encapsulation glue 30 and the optical glue layer 20, that is, at the position of the first edge E1. Due to the siphon effect, the thickness of the encapsulation glue 30 at the first edge E1 is relatively increased. On this basis, if the coating thickness of the encapsulation glue 30 at the first edge E1 is relatively large, the first encapsulation part 31 is likely to be formed on the side of the optical glue layer 20 away from the body part, thereby being likely to interfere with the cover plate 40 formed in the subsequent preparation process, and affecting the overall preparation process of the display module 100.

[0145] In view of this, the embodiments of the present application adjust the coating mode of the encapsulation glue 30, thereby adjusting the thickness size of the first encapsulation part 31 in the encapsulation glue 30. In the direction from the second edge E2 to the first edge E1, the size of the first encapsulation part 31 in the thickness direction Y gradually decreases. That is, the closer to the optical glue layer 20, the smaller the thickness of the first encapsulation part 31. In this way, the coating amount of the first encapsulation part 31 at the first edge E1 can be reduced, thereby reducing the risk that the first encapsulation part 31 is partially formed on the side of the optical glue layer 20 away from the body part, and further reducing the risk of physical interference between the first encapsulation part 31 and the cover plate 40, thereby meeting the formation needs of the cover plate 40 and improving the preparation yield of the display module 100.

[0146] In some embodiments, the optical glue layer 20 is attached to the body part 11; or, referring to FIGS. 20 and 21, before step S110, the method further includes: S180, forming a polarizing layer on the side of the body part.

[0147] The scheme of the embodiments of the present application can be applied to various types of display modules 100. Specifically, it can be applied to a display module 100 provided with a polarizing layer 50, or can also be applied to a display module 100 without a polarizing layer 50.

[0148] Taking a display module 100 without a polarizing layer 50 as an example, in this case, the optical glue layer 20 is attached to the body part 11 in the thickness direction Y, which helps to realize the overall thinning of the display module 100. On this basis, since the preparation process of the encapsulation glue 30 is arranged after the formation of the optical glue layer 20 in the embodiments of the present application, the existence of the optical glue layer 20 can limit and position the formation of the first encapsulation part 31, thereby improving the preparation precision of the first encapsulation part 31 and the structural reliability of the display module 100.

[0149] Alternatively, taking the display module 100 provided with the polarizing layer 50 as an example, in this case, the optical adhesive layer 20 is located on the side of the polarizing layer 50 away from the main body 11, and the presence of the polarizing layer 50 can eliminate or reduce the reflection and refraction of light. On this basis, the display module 100 is first prepared to form the polarizing layer 50, then the optical adhesive layer 20 is formed, and finally the encapsulation adhesive 30 is formed. During the preparation of the encapsulation adhesive 30, the polarizing layer 50 and the optical adhesive layer 20 can jointly limit the positioning of the formation of the first encapsulation part 31, thereby improving the preparation precision of the first encapsulation part 31 and the structural reliability of the display module 100.

[0150] In summary, according to different actual needs, the embodiments of the present application can be applied to the display module 100 with or without the polarizing layer 50, and have strong flexibility and practicality. And by adjusting the preparation process of the encapsulation adhesive 30 after the optical adhesive layer 20, the positional reliability between the first encapsulation part 31 and the optical adhesive layer 20 can be improved, thereby improving the structural reliability of the display module 100.

[0151] Although the embodiments disclosed in the present application are as above, the content described is only the embodiment adopted for the convenience of understanding the present application, and is not intended to limit the present application. Any person skilled in the art can make any modification and change in the form and details without departing from the spirit and scope of the present application, and the protection scope of the present application shall be subject to the scope defined by the appended claims.

[0152] The above is only a specific embodiment of the present application, and those skilled in the art can clearly understand that, for the convenience and brevity of description, the above-described replacement of other connection modes and the like can refer to the corresponding process in the foregoing method embodiment, which will not be described here. It should be understood that the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements shall be covered within the protection scope of the present application.

Claims

1. A display module, comprising: The display panel includes a main body, wherein the main body is provided with a light-emitting structure; An optical adhesive layer is provided on one side of the main body; The packaging glue includes a first packaging part arranged on one side of the main body. In a direction parallel to the plane where the main body is located, the distance between the first packaging part and the optical adhesive layer is less than a first threshold, and in the thickness direction of the main body, the first packaging part and the optical adhesive layer are not overlapped.

2. The display module according to claim 1, wherein: The first packaging portion includes a first surface facing away from the main body portion, and the optical adhesive layer includes a second surface facing away from the main body portion; Wherein, the first surface is located on a side of the second surface close to the main body; or, the first surface is flush with the second surface. 3 . The display module according to claim 2 , further comprising a cover plate disposed on a side of the optical adhesive layer away from the main body, wherein the cover plate overlaps the first packaging portion in the thickness direction.

4. The display module according to claim 2, wherein: The first packaging portion includes a first edge and a second edge opposite to each other in a first direction, the first edge is located on a side of the second edge close to the optical adhesive layer, and the first direction intersects the thickness direction; In the direction from the second edge to the first edge, the size of the first packaging portion in the thickness direction tends to gradually decrease.

5. The display module according to claim 1, wherein: The optical adhesive layer is bonded to the main body; or The display module further includes a polarizing layer disposed between the optical adhesive layer and the main body, and the first packaging portion is bonded to the polarizing layer.

6. The display module according to claim 1, wherein: The display panel includes a bending portion connected to the main body, and a binding portion connected to the bending portion, wherein the binding portion is bent through the bending portion to a side of the main body away from the optical adhesive layer; The packaging glue includes a second packaging part arranged on one side of the bending part, and a third packaging part arranged on a side of the binding part away from the main body part. Both ends of the second packaging part are respectively connected to the first packaging part and the third packaging part. 7 . The display module according to claim 6 , further comprising a conductive portion disposed on a side of the binding portion away from the main body portion, the third packaging portion comprises a conductive material, and the conductive portion is bonded to the third packaging portion.

8. The display module according to claim 7, wherein: The third packaging portion is at least partially located between the conductive portion and the binding portion.

9. The display module according to claim 8, wherein: The third packaging portion includes a third edge and a fourth edge opposite to each other in a first direction, the third edge is connected to the second packaging portion, the conductive portion is partially provided on a side of the fourth edge away from the third edge, and the first direction intersects the thickness direction; Wherein, in a direction from the third edge to the fourth edge, the size of the third packaging portion in the thickness direction tends to gradually decrease. 10 . The display module according to claim 6 , further comprising a cover plate disposed on a side of the optical adhesive layer away from the main body, wherein the cover plate covers the packaging adhesive in the thickness direction.

11. A display device comprising the display module according to any one of claims 1 to 10.

12. A method for preparing a display module, comprising: Providing an initial display panel, the initial display panel comprising a main body; forming an optical adhesive layer on one side of the main body; A packaging glue is formed on one side of the initial display panel, and the packaging glue includes a first packaging portion arranged on the main body portion. In a direction parallel to the plane where the main body portion is located, the distance between the first packaging portion and the optical adhesive layer is less than a first threshold, and in a thickness direction of the main body portion, the first packaging portion and the optical adhesive layer do not overlap.

13. The preparation method according to claim 12, wherein The initial display panel further includes a bending portion and a binding portion, wherein the main body and the binding portion are connected to two sides of the bending portion along a first direction, and the first direction intersects with a thickness direction of the main body; The preparation method further includes: bending the binding portion to a side of the main body away from the optical adhesive layer through the bending portion, so that the initial display panel is transformed into a display panel.

14. The preparation method according to claim 13, wherein In the packaging glue formed on one side of the initial display panel, the packaging glue further includes a second packaging portion provided on one side of the bending portion, and a third packaging portion provided on one side of the binding portion; The step of bending the binding portion by the bending portion to a side of the main body facing away from the optical adhesive layer further comprises: A conductive portion is formed on one side of the binding portion, the conductive portion is bonded to the third packaging portion, and in the thickness direction, the conductive portion and the third packaging portion are overlapped.

15. The preparation method according to claim 14, wherein The third packaging portion includes a third edge and a fourth edge opposite to each other in a first direction, the third edge is connected to the second packaging portion, the conductive portion is partially provided on a side of the fourth edge away from the third edge, and the first direction intersects the thickness direction; Wherein, in a direction from the third edge to the fourth edge, the size of the third packaging portion in the thickness direction tends to gradually decrease.

16. The preparation method according to claim 12, wherein Before forming the encapsulation glue on one side of the initial display panel, the method further includes: forming a sacrificial layer on a side of the optical adhesive layer away from the main body, wherein the sacrificial layer at least partially extends beyond the optical adhesive layer in a first direction to form a gap space between the sacrificial layer and the main body, wherein the first direction intersects the thickness direction; In the packaging glue formed on one side of the initial display panel, at least a portion of the first packaging portion flows into the gap space; After forming the packaging glue on one side of the initial display panel, the method further includes: The sacrificial layer is removed.

17. The preparation method according to claim 12, wherein The first packaging portion includes a first surface facing away from the main body portion, and the optical adhesive layer includes a second surface facing away from the main body portion; Wherein, the first surface is located on a side of the second surface close to the main body; or, the first surface is flush with the second surface.

18. The preparation method according to claim 17, wherein The first packaging portion includes a first edge and a second edge opposite to each other in a first direction, the first edge is located on a side of the second edge close to the optical adhesive layer, and the first direction intersects the thickness direction; In the direction from the second edge to the first edge, the size of the first packaging portion in the thickness direction tends to gradually decrease.

19. The preparation method according to claim 12, wherein The optical adhesive layer is bonded to the main body; or, before forming the optical adhesive layer on one side of the main body, the method further includes: A polarizing layer is formed on one side of the main body.

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