Housing component, electronic device including housing component, and method for manufacturing housing component

Abstract

Various embodiments of the present disclosure may comprise: a metal member including an oxide film having pores formed therein; a dye disposed in the pores; and a sealing layer positioned on the oxide film. The oxide film having the pores formed therein may be formed on the metal member through an anodizing process. The sealing layer may provide a housing component that includes particles containing barium (Ba). In addition, according to various embodiments, a housing component, an electronic device including the housing component, and a method for manufacturing the housing component may be provided.

Description

Housing components, electronic devices including housing components, and methods for manufacturing housing components

[0001] Various embodiments of the present disclosure relate to a housing component, an electronic device including the housing component, and a method of manufacturing the housing component.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can now embody not only communication functions but also entertainment features like gaming, multimedia functions like music and video playback, communication and security functions for mobile banking, and even calendar management and electronic wallet functions. These electronic devices are becoming smaller and thinner for easier portability. Meanwhile, active research is also underway to create aesthetically pleasing exterior designs for electronic devices.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] According to one embodiment of the present disclosure, a housing component may include a metal member including an oxide film having pores formed therein; a dye disposed within the pores; and a sealing layer positioned on the oxide film, wherein the oxide film having pores is formed on the metal member through an anodizing process, and the sealing layer includes particles containing barium (Ba).

[0005] According to one embodiment of the present disclosure, a method for manufacturing a housing part can be provided, comprising: an anodizing process for forming an oxide film having pores formed on a metal member; a dye application process for applying a dye to at least a portion of the metal member including the pores; a pretreatment sealing process for forming a pretreatment sealing layer containing barium particles on the oxide film; and a sealing process for forming a sealing layer on the pretreatment sealing layer, whereby barium particles included in the pretreatment sealing layer are mixed into a material forming the sealing layer.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a partial perspective view of an electronic device including a housing component according to one embodiment of the present disclosure.

[0012] FIG. 6 is a schematic diagram illustrating the structure of a housing component according to one embodiment of the present disclosure.

[0013] FIG. 7 is a schematic diagram illustrating the structure of a housing component according to one embodiment of the present disclosure.

[0014] FIG. 8 is a graph showing a light resistance evaluation for a sealing layer that does not include barium or a barium compound and a sealing layer that includes barium or a barium compound, according to one embodiment of the present disclosure.

[0015] FIG. 9 is a drawing for explaining ultraviolet verification results according to various materials according to one embodiment of the present disclosure.

[0016] FIG. 10 is a flowchart illustrating a method for manufacturing a housing component according to one embodiment of the present disclosure.

[0017] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0018] Critical reliability factors that must be met for the exterior of a portable electronic device, i.e., at least a portion of the housing (hereinafter referred to as "housing component"), include durability (or sturdiness) and light resistance (the property of the exterior material not to discolor under ultraviolet rays). It is known that the durability of the housing component can be secured by performing a sealing process after anodizing the surface of the housing component. To improve light resistance, a sealing process using nano germanium or a manufacturing method that applies a chemical / physical UV blocker together with a dye has been used to improve the light resistance of the metal case. However, for example, the method using nano germanium or the method applying a chemical / physical UV blocker can be expensive for mass production, and the method applying a chemical / physical UV blocker together with a dye requires adding a UV blocker to each dye bath, which can lead to difficulties in concentration control and / or process management. Therefore, there is a continuing need for improved manufacturing methods that are easy to manage in terms of cost and / or management.

[0019] According to one embodiment of the present disclosure, a housing and an electronic device including the housing can be provided, manufactured by performing pre-sealing with a pre-sealing agent containing particles containing barium (Ba). In addition, a method for manufacturing a housing including pre-sealing with a pre-sealing agent containing particles containing barium (Ba) can be provided.

[0020] According to one embodiment of the present disclosure, pre-sealing can be performed using a pre-sealing sealant containing particles containing barium (Ba), thereby improving the quality of the seal and securing the robustness of the oxide film. This enables the implementation of a discoloration-free metal exterior material. Furthermore, the method of performing pre-sealing according to the present disclosure can have advantageous effects in terms of cost and management.

[0021] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0022] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0045] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0046] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0047] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0049] Referring to FIGS. 2 and 3 , an electronic device (200) according to one embodiment may include a housing (210) including a front surface (210A), a back surface (210B), and a side surface (210C) surrounding a space between the front surface (210A) and the back surface (210B). In another embodiment (not shown), the housing (210) may refer to a structure forming a portion of the front surface (210A) of FIG. 2 , the back surface (210B) of FIG. 3 , and the side surface (210C). For example, the housing (210) may include a front plate (202) and a back plate (211). According to one embodiment, at least a portion of the front surface (210A) may be formed by a substantially transparent front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate). The back surface (210B) may be formed by the back plate (211). The rear plate (211) may be formed of, for example, glass, ceramic, polymer, metal (e.g., titanium (Ti), stainless steel (STS), aluminum (Al), and / or magnesium (Mg)), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or a polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as glass, aluminum, or ceramic). In other embodiments, the front surface (210A) and / or the front plate (202) may be interpreted as a part of the display (220).

[0050] According to one embodiment, the electronic device (200) may include at least one of a display (220), an audio module (203, 207, 214) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (205, 206) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), and a connector hole (208, 209) (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the connector hole (209)) or may additionally include other components. According to one embodiment, the display (220) may be visually exposed, for example, through a substantial portion of the front plate (202).

[0051] In one embodiment, the surface (or front plate (202)) of the housing (210) may include a screen display area formed by visually exposing the display (220). As an example, the screen display area may include the front surface (210A).

[0052] According to one embodiment, the electronic device (200) may include a recess or opening formed in a portion of a screen display area (e.g., the front surface (210A)) of the display (220), and may include at least one of an audio module (214), a sensor module (not shown), a light-emitting element (not shown), and a camera module (205) aligned with the recess or opening. In another embodiment (not shown), at least one of an audio module (214), a sensor module (not shown), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (not shown) may be included on a back surface of the screen display area of ​​the display (220).

[0053] According to one embodiment, the display (220) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0054] According to one embodiment, the audio module (203, 207, 214) may include, for example, a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0055] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (200) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a front surface (210A) of the housing (210). The sensor module (not shown) may include a third sensor module (not shown) (e.g., an HRM sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on a rear surface (210B) of the housing (210). In some embodiments (not shown), the fingerprint sensor may be disposed on the rear surface (210B) as well as the front surface (210A) (e.g., the display (220)) of the housing (210). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown).

[0056] In one embodiment, the camera modules (205, 206) may include, for example, a front camera module (205) disposed on the front (210A) of the electronic device (200), a rear camera module (206) disposed on the rear (210B), and / or a flash (204). The camera modules (205, 206) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (204) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0057] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as soft keys, on the display (220). In one embodiment, at least a portion of the key input devices (217) may be disposed on the side bezel structure (218).

[0058] According to one embodiment, a light-emitting element (not shown) may be disposed, for example, on the front surface (210A) of the housing (210). The light-emitting element (not shown) may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element (not shown) may provide, for example, a light source that is linked to the operation of the front camera module (205). The light-emitting element (not shown) may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0059] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate, for example, a connector for transmitting and receiving power and / or data with an external electronic device (e.g., a USB connector) or a connector for transmitting and receiving audio signals with an external electronic device (e.g., an earphone jack), and / or a second connector hole (209) that can accommodate a storage device (e.g., a subscriber identification module (SIM) card). According to one embodiment, the first connector hole (208) and / or the second connector hole (209) may be omitted.

[0060] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0061] Referring to FIG. 4, the electronic device (200) (e.g., the electronic device (200) of FIGS. 2 to 3) may include at least one of a front plate (222) (e.g., the front plate (202) of FIG. 2), a display (220) (e.g., the display (220) of FIG. 2), a bracket (232) (e.g., a front support member), a printed circuit board (240), a battery (250), a rear case (260) (e.g., a rear support member), an antenna (270), and a rear plate (280) (e.g., the rear plate (211) of FIG. 3). According to one embodiment, the electronic device (200) may omit at least one of the components (e.g., the rear case (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2 or FIG. 3, and any overlapping description will be omitted below.

[0062] According to one embodiment, the bracket (232) may be disposed inside the electronic device (200) and connected to the side bezel structure (231), or may be formed integrally with the side bezel structure (231). The bracket (232) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The bracket (232) may accommodate a display (220) on one side and a printed circuit board (240) on the other side. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1).

[0063] According to one embodiment, the battery (250) is a device for supplying power to at least one component (e.g., a camera module (212)) of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

[0064] According to one embodiment, the rear case (260) may be positioned between the printed circuit board (240) and the antenna (270). For example, the rear case (260) may include one surface to which at least one of the printed circuit board (240) or the battery (250) is coupled, and the other surface to which the antenna (270) is coupled.

[0065] In one embodiment, the antenna (270) may be disposed between the rear plate (280) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. For example, the antenna (270) may include a coil for wireless charging. In one embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (231) and / or the bracket (232).

[0066] According to one embodiment, the electronic device (200) may include a camera module (212) disposed within a housing (e.g., the housing (210) of FIG. 2). According to one embodiment, the camera module (212) may be a rear camera module (e.g., the camera module (212) of FIG. 3) disposed on a bracket (232) and capable of acquiring an image of a subject located at the rear (e.g., in the -Z direction) of the electronic device (200). According to one embodiment, at least a portion of the camera module (212) may be exposed to the outside of the electronic device (200) through an opening (282) formed in the rear plate (280).

[0067] The electronic device (200) disclosed in FIGS. 2 to 4 has a bar type or plate type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device may be a rollable electronic device or a foldable electronic device. The term "rollable electronic device" may refer to an electronic device in which a display (e.g., the display (220) of FIG. 4) is capable of bending deformation, such that at least a portion thereof can be wound or rolled, or can be stored inside a housing (e.g., the housing (210) of FIG. 2). Depending on the user's needs, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside.

[0068] FIG. 5 is a partial perspective view of an electronic device including a housing according to one embodiment of the present disclosure. FIG. 6 is a schematic diagram illustrating the structure of a housing according to one embodiment of the present disclosure. FIG. 7 is a schematic diagram illustrating the structure of a housing according to one embodiment of the present disclosure.

[0069] Referring to FIGS. 5, 6, and / or 7, an electronic device (300) (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2 to 4) may include a housing component (310). According to one embodiment, the housing component (310) may form at least a portion of the exterior of the electronic device (300). For example, the housing component (310) of FIGS. 5, 6, and / or 7 may be identical to all or part of the configuration of the housing (210) of FIG. 2, the rear plate (211) of FIG. 3, and / or the side bezel structure (231) of FIG. 4.

[0070] According to one embodiment of the present disclosure, the housing component (310) may include a metal member (320), a dye (330), and / or a sealing layer (350).

[0071] In one embodiment, the housing component (310) may include a metal member (320). The metal member (320) may be a material on which an oxide film (321) may be formed using an anodizing process. The metal member (320) of the housing component (310) may include a material on which an oxide film (321) may be formed on at least a portion of a surface. For example, the metal member (320) may include at least one of aluminum, magnesium, zinc, or titanium. The metal member (320) may not include steel or stainless steel. In one embodiment, the shape of the housing component (310) and / or the metal member (320) may be designed using a cutting process and / or a polishing process.

[0072] According to one embodiment, the metal member (320) may include an oxide film (321). According to one embodiment, the oxide film (321) may be referred to as an 'oxide coating' or an 'oxide layer'. Alternatively, the oxide film (321) may be referred to as a portion of the oxidized metal member (320) among the metal member (320). According to one embodiment, the oxide film (321) may be formed using an anodic oxidation process. The thickness of the oxidized metal member (320) may be increased using the anodic oxidation process. The abrasion resistance, corrosion resistance, and / or aesthetic properties of the metal member (320) may be improved due to the oxide film (321).

[0073] According to one embodiment, the oxide film (321) may include pores (323) (or air gaps). For example, the oxide film (321) may have a porous surface. The pores (323) may be referred to as a plurality of grooves or a plurality of recesses formed in the oxide film (321). For example, the pores (323) may be grooves formed in a cylindrical shape in the oxide film (321). However, it should be noted that the shape of the pores (323) may vary and is not limited to a specific shape. In addition, when there are a plurality of pores (323), the sizes and shapes of the pores (323) included in the plurality of pores (323) may also vary.

[0074] According to one embodiment, the housing component (310) may include a dye (330). The dye (330) may provide a color to the housing component (310) and / or the electronic device (300). For example, the color of the housing component (310) may be realized by the housing component (310) reflecting light of a predetermined wavelength band. The dye (330) may reflect light of a designated wavelength depending on its type. A specific color of the housing component (310) may be realized by the dye (330) included in the housing component (310).

[0075] In one embodiment, the dye (330) can be colored on the metal member (320). In one embodiment, the dye (330) can be colored by being deposited on the oxide film (321) of the metal member (320). For example, the pores (323) can accommodate the dye (330). The size of the particles of the dye (330) can be smaller than the size of the pores (323) of the oxide film (321), and thus, the particles of the dye (330) can be located within the pores (323) of the oxide film (321). For example, the pores (323) can have a relatively positive charge, and the particles of the dye (330) can have a negative charge. The pores (323) can adsorb particles of the dye (330) having a negative polarity.

[0076] The dye (330) is a water-soluble dye, and according to one embodiment, may include a natural dye. For example, the dye (330) may be a pigment obtained from plants, animals, or minerals. For example, the dye (330) of the present disclosure may be a dyed substance obtained by extracting natural materials using a salt extraction method, a hot water extraction method, a juice extraction method, and / or an alkaline extraction method. According to one embodiment, by using a natural dye, human safety may be increased and environmental pollution problems may be reduced. Natural dyes may provide aesthetics different from synthetic dyes by containing secondary ingredients. However, the present invention is not limited thereto, and the dye (330) may include a synthetic dye instead of a natural dye, or a dye that is a mixture of a natural dye and a synthetic dye. In this way, the dye may be applicable to all without limitation in type or color.

[0077] In one embodiment, a dye containing an azo group may be used as a dye. Dyes containing an azo group within their molecular structure can be advantageous in that they exhibit excellent discoloration-prevention effects. The azo group has a structure in which a nitrogen atom is bonded to a benzene ring, and when exposed to ultraviolet light, the azo group may change into a different structure due to the light, resulting in a color change. Examples of colors containing the azo group include blue, red, yellow, and orange.

[0078] For example, the evaluation of the light resistance test when using a synthetic dye will be described below through the example of FIG. 8.

[0079] The dye (330) can be covered by the sealing layer (350) while being accommodated within the pores (323) of the oxide film (321). As the dye (330) is protected by the sealing layer (350), the ingress of water or foreign substances into the dye (330) can be reduced and / or prevented, and the dye (330) can be protected from external physical / chemical impacts. In addition, discoloration of the dye (330) due to external exposure can also be reduced and / or prevented.

[0080] Referring to FIG. 6, a housing component (310) according to one embodiment of the present disclosure may include a pre-sealing layer (340). The pre-sealing layer (340) may be a layer that exists in the housing component (310) before the sealing layer (350) is formed, and may be a layer that exists substantially integrally with the sealing layer (350) after the sealing layer (350) is formed. According to one embodiment, the pre-sealing layer (340) may be a layer that exists temporarily before the sealing layer (350) is formed. Referring to FIG. 7, after the sealing layer (350) is formed, the pre-sealing layer (340) may be mixed with the sealing layer (350) without being distinguished from the sealing layer (350).

[0081] The pretreatment sealing layer (340) may include particles containing barium. The particles containing barium may include a barium compound. The particles containing barium may include a barium compound such as barium chloride (BaCl2), barium sulfide (BaS), barium carbonate (BaCO3), barium oxide (BaO), and / or barium silicate (BaSiO3). In addition to the above-described embodiments, any material that dissociates in water and generates divalent Ba ions when in an aqueous solution may be used as the applicable barium compound.

[0082] The particles containing barium can act as a catalyst to help form a denser and higher quality sealing layer (350). For example, when aluminum is used as the metal member (320), the surface of the oxide film (321) is made of Al2O3 after the anodizing process, and the sealing layer (350) has a chemical structure of Al-OOH, so that a hard layer without forming pores can be formed on the surface of the oxide film (321). The particles containing barium can act as a catalyst in the chemical reaction between the oxide film (321) and the sealing layer (350). For example, the material used in the process of forming the sealing layer (350) can generally include water and hydrogen atoms. That is, the sealing process can be performed using water and hydrogen atoms. In the process in which the surface of an oxide film having a chemical structure of Al2O3 is formed into a sealing layer having a chemical structure of Al-OOH through a sealing process, particles containing barium formed in the pretreatment sealing layer through a pretreatment process can act as a catalyst. The particles containing barium included in the pretreatment sealing layer (340) can remain in the sealing layer (350) after the sealing layer (350) is formed.

[0083] The sealing layer (350) according to the present disclosure is provided after forming the pretreatment sealing layer (340), and the sealing layer (350) provided after forming the pretreatment sealing layer (340) can have a relatively high quality compared to a case in which only the sealing layer (350) is formed without forming the pretreatment sealing layer (340). Here, the relatively high quality of the sealing layer (350) can mean that it has good light resistance (e.g., a property in which the color of the exterior material does not change due to ultraviolet rays). According to one embodiment, the molecular structure of the dye (330) can be changed by light (e.g., ultraviolet rays) (L). As the molecular structure of the dye (330) is changed, the wavelength reflected and / or absorbed by the dye (330) is changed, and the color of the housing component (310) can be changed. For example, photochromism can occur.

[0084] The sealing layer (350) formed after forming the pretreatment sealing layer (340) has a relatively high UV blocking rate compared to the sealing layer (350) formed alone in terms of UV blocking effectiveness, and thus can reduce and / or prevent discoloration of the dye (330) located on the back surface of the sealing layer (350). For example, ultraviolet rays may include UVA having a wavelength of about 315 nm to about 400 nm and UVB having a wavelength of about 280 nm to about 315 nm, and the sealing layer (350) formed after forming the pretreatment sealing layer (340) including particles containing barium may have excellent light resistance to both UVA and UVB.

[0085] In one embodiment, the sealing layer (350) may be referred to as a part of the metal member (320). For example, the sealing layer (350) may be formed using a sealing process and may be a part of the metal member (320) that closes the pore (323). The sealing layer (350) may cover at least a part of the pore (323). In one embodiment, the sealing layer (350) may be a part of the metal member (320) formed by expanding at least a part of the surface of the oxide film (321). In one embodiment, the oxygen concentration of the sealing layer (350) may be higher than the oxygen concentration of the metal member (320). In one embodiment, the sealing layer (350) may be formed on the housing component (310) based on a hydration sealing process, a metal salt sealing process, an organic sealing process, and / or a sealing process using painting.

[0086] The sealing layer (350) formed after forming the pretreatment sealing layer (340) can reduce and / or prevent changes in the molecular structure of the dye (330). In one embodiment, when the dye (330) is a natural dye, the natural dye may have unstable properties compared to synthetic dyes. For example, the natural dye may be easily discolored by ultraviolet rays. The sealing layer (350) formed after forming the pretreatment sealing layer (340) can reduce and / or prevent discoloration of the natural dye. Even when applying a synthetic dye including an organic dye as well as a natural dye, discoloration can be reduced and / or prevented by using the sealing layer (350) formed after forming the pretreatment sealing layer (340).

[0087] In one embodiment, the particles containing barium may be applied only to the pre-treatment sealing layer (340) and may not be included in the dye coloring process. When the particles containing barium are mixed with the dye, the solution containing the particles containing barium may have difficulty maintaining a neutral pH and may affect the coloring, so it may be advantageous not to apply them in the dye coloring process. However, if coloring is intentionally desired through a solution containing particles containing barium, it may be possible to use some of the particles containing barium in the dye coloring process as well.

[0088] FIG. 8 is a graph showing a light resistance evaluation for a sealing layer that does not include particles containing barium and a sealing layer that includes particles containing barium, according to one embodiment of the present disclosure.

[0089] A method for evaluating light resistance uses a method of testing discoloration of a dye due to ultraviolet rays. That is, a UV verification technique is used for a housing component (e.g., a housing component (310) of FIG. 7). FIG. 8 is a drawing for explaining the results of the UV verification. For example, FIG. 8 can illustrate the results of the UV verification for a housing component (310) in which two colors (black and violet) of organic dyes are colored on an oxide film (e.g., an oxide film (321) of FIG. 7), a pretreatment sealing layer including particles containing barium (e.g., a pretreatment sealing layer (340) of FIG. 6) is formed, and then a sealing layer (350) is formed.

[0090] According to one embodiment, the degree of discoloration of a housing component (e.g., housing component (310) of FIG. 7) may be determined based on the presence or absence of particles containing barium. The UV verification result of FIG. 8 may be a result obtained by irradiating a UVA ultraviolet lamp with a wavelength of about 340 nm under specified experimental conditions (e.g., at a temperature of 50 degrees and for 40 hours). In addition, the UV verification result of FIG. 8 may be a result obtained by forming a pretreatment sealing layer using an aqueous solution of barium chloride (BaCl2) dissolved in water at a concentration of 30% under specified conditions (e.g., at a temperature of 25 degrees and for 10 minutes) as particles containing barium.

[0091] The degree of discoloration can be determined by the CIE chromaticity calculation formula. The CIE chromaticity calculation formula is a calculation formula defined to approximate the color discrimination area of ​​the human eye in the color space of CIE LAB, and for example, the CIE chromaticity calculation formula may be the CIEDE2000 calculation formula. The chromaticity value (ㅿE) can be determined by using the correction of the median coefficient and / or parametric coefficient based on the difference in brightness, the difference in saturation, and the difference in hue. According to one embodiment, the chromaticity value (ㅿE) may mean the difference between the color before ultraviolet irradiation and the color after ultraviolet irradiation.

[0092] Referring to FIG. 8, the degree of discoloration of the housing component (310) when including particles containing barium may be lower than the degree of discoloration of the housing component (310) when not including particles containing barium. For example, referring to FIG. 8, when not including particles containing barium, the color difference value (ㅿE) of the housing component using black dye may be about 8.5, and the color difference value (ㅿE) of the housing component using violet dye may be about 4.2. When the color difference value (ㅿE) is less than about 3.0, it may be difficult for the user to distinguish the color change. That is, when the color difference value (ㅿE) is less than about 3.0, the user may recognize that there is no discoloration. Therefore, when the color difference value (ㅿE) for the housing component (310) is less than about 3.0 in the UV verification result, it can be determined that there is no discoloration. For example, in the UV verification result, if the color difference value (ㅿE) for the housing part (310) is 3.0 or more, it can be determined as a defective product according to the light fastness evaluation, and if it is less than 3.0, it can be determined as a good product according to the light fastness evaluation. Referring to FIG. 8, in the case of including particles containing barium, the color difference value (ㅿE) of the housing part using a black dye may be 1.7, and the color difference value (ㅿE) of the housing part using a violet dye may be 2.9. Through the result of FIG. 8, it can be confirmed that the light fastness is increased through the fact that the color difference value (ㅿE) of the housing part using the black dye and the violet dye is less than 3.0 when particles containing barium are used. The types of dyes used in the UV verification result are exemplary, and even when other dyes are applied, it is possible to increase the light fastness by using particles containing barium.

[0093] Based on the UV verification results of the above-described Figure 8, the concentration of barium or barium compound can be applied at 1% to 30%.

[0094] FIG. 9 is a drawing for explaining ultraviolet verification results according to various materials according to one embodiment of the present disclosure.

[0095] As a material for forming the sealing layer (350), water and hydrogen atoms can generally be used. According to one embodiment, the material for forming the sealing layer may further include nickel (or a nickel compound) and zirconium (or a zirconium compound). Nickel (or a nickel compound) and / or zirconium (or a zirconium compound) may further be included as a material for improving the quality of the sealing layer (350).

[0096] According to the present disclosure, for forming a sealing layer (350) to which nickel or zirconium is applied, by performing a pre-treatment sealing process including particles containing barium, alternatively or additionally, it is possible to secure higher light resistance than the light resistance of a sealing layer (350) to which nickel or zirconium is simply applied. FIG. 9 may be a table showing the results of such ultraviolet verification.

[0097] Referring to FIG. 9, for example, the color difference value (ㅿE) of the housing part when irradiated with ultraviolet rays can be shown for each example in which nickel (Ni) or a nickel compound aqueous solution, zirconium (Zr) or a zirconium compound aqueous solution, and barium (Ba) or a barium compound aqueous solution of the same concentration are applied as the material of the pretreatment sealing layer (340). When nickel (Ni) is used, it can be confirmed that the color difference value before / after ultraviolet irradiation is 4.36, and when zirconium (Nr) is used, the color difference value before / after ultraviolet irradiation is 3.86. In contrast, when barium (Ba) is used, it can be confirmed that the color difference value is 1.21. Here, for example, in the case where the color difference value (ㅿE) for the housing part (310) is 3.0 or more in the UV verification result, it can be determined as a defective product according to the light fastness evaluation, and when it is less than 3.0, it can be determined as a good product according to the light fastness evaluation, and accordingly, it can be confirmed that a housing part (e.g., the housing part (310) of FIG. 7) having good light fastness can be provided when barium is used compared to when nickel and zirconium are used. Even with reference to the image of FIG. 9, it can be seen that when nickel and zirconium are used, a change in color difference is confirmed with the naked eye by the user, but in the case of barium, a change in color difference is not confirmed with the naked eye by the user.

[0098] According to the present disclosure, by providing a housing component (310) containing 0.01 atom % or more of barium or a barium compound, it is possible to provide advantageous effects of significantly reduced cost compared to the prior art without discoloration. The concentration of the barium or barium compound may be derived by analyzing a cross-section of the housing component (310) through SEM (scanning electron microscopy) / EDS (energy dispersive spectrometer) analysis. When a housing component (310) that does not contain barium or a barium compound as in the present disclosure is applied, the barium (Ba) component may not be detected within the oxide film during SEM / EDS analysis.

[0099] FIG. 10 is a flowchart illustrating a method for manufacturing a housing component according to one embodiment of the present disclosure.

[0100] Referring to FIG. 10, a method for manufacturing a housing part (1000) may include a process for processing a shape of a metal member (1010), a process for degreasing a metal member (1020), an anodizing process for forming an oxide film on the metal member (1030), a process for applying a dye to the oxide film (1040), a process for forming a pretreatment sealing layer (1050), and / or a process for forming a sealing layer on the metal member (1060).

[0101] The method (1000) for manufacturing the housing component of FIG. 10 may be a process for manufacturing the housing (300) described in FIGS. 5, 6, and 7. For example, the metal member, oxide film, dye, pretreatment sealing layer, and sealing layer described in FIG. 10 may be all or part of the same configuration as the metal member (320), oxide film (321), dye (330), pretreatment sealing layer (340), and sealing layer (350) of FIGS. 6 and / or 7.

[0102] According to one embodiment, the process (1010) for machining a shape of a metal member may be a process for machining a shape of a metal (e.g., aluminum, magnesium, zinc, and / or titanium). For example, the process for machining a shape of a metal member may include a pressing, casting, and / or cutting process. The process for machining a shape of a metal member may include a polishing and / or surface roughening process.

[0103] In one embodiment, the process (1020) for degreasing a metal member may be a surface treatment process for the metal member. In one embodiment, the process (1020) for degreasing a metal member may remove foreign substances generated in the process (1010) for machining a shape of the metal member (e.g., cutting oil used in the machining process and / or polish used in the polishing process). In one embodiment, the process (1020) for degreasing a metal member may remove an oxide film of the metal member that has oxidized in the air. For example, the process (1020) for degreasing a metal member may remove an oxide film of the metal member and / or foreign substances attached to the metal member using an organic solvent method, a surfactant method, or an acid degreasing method. The organic solvent method may be a surface treatment method using benzene and ethylene. The surfactant method may be a surface treatment method using a neutral detergent and / or a synthetic detergent. The acid degreasing method may be a surface treatment method using sulfuric acid and / or nitric acid.

[0104] According to one embodiment, the anodizing process (1030) for forming an oxide film on the metal member is a process in which the metal member is immersed in an electrolyte solvent and then an electric current is applied to form an oxide film on the surface of the metal member. In one embodiment, the electrolyte solvent may include at least one of sulfuric acid, oxalic acid, oxalic acid, and chromic acid. The voltage used for applying the electric current may be about 5 to 100 V. The process time of the anodizing process (1030) may be about 10 minutes to 3 hours. The process temperature of the anodizing process (1030) may be about 0 to 50 degrees. According to one embodiment, the oxide film generated in the anodizing process (1030) (e.g., the oxide film (321) of FIG. 6) may include at least one pore (e.g., the pore (323) of FIG. 6).

[0105] According to one embodiment, the process of processing the shape of a metal member (1010), the process of degreasing the metal member (1020), and / or the process of forming an oxide film on the metal member (1030) may be referred to as a process of preparing a metal member on which an oxide film is formed.

[0106] In one embodiment, at least a portion of the process for preparing the metal member may be performed in conjunction with a process (1040) for applying a dye to the oxide film. In one embodiment, the process (1040) for applying a dye to the oxide film may be referred to as a coloring process. For example, the process (1040) for applying a dye to the oxide film may be a process for applying a dye (e.g., a water-soluble dye, such as a natural dye and / or a mixed dye including an organic dye) to pores formed in the oxide film (e.g., pores (323) in FIG. 6 ).

[0107] In one embodiment, the process (1040) of applying a dye to the oxide film can implement the color of the oxide film using an immersion method. For example, the process (1040) of applying a dye to the oxide film can be implemented by preparing a coloring bath containing a dye dissolved in a solution, placing the metal member on which the oxide film is formed into the coloring bath, and immersing it in the solution. The color of the housing can be implemented by the dye diffused and adsorbed into the oxide film. In the process (1040) of applying a dye to the oxide film, a coloring bath containing dyes of various colors can be used, and in this case, the process (1040) of applying a dye to the oxide film can be performed repeatedly multiple times.

[0108] According to an embodiment of the present disclosure, a process (1050) for forming a pre-sealing layer including particles containing barium may be included. By forming the pre-sealing layer prior to forming the sealing layer on the oxide film (1060), the surface quality of the oxide film can be further improved during the sealing layer formation process.

[0109] Water and hydrogen atoms can be used as materials for the sealing layer (1060). By adding particles containing barium in the pretreatment sealing layer formation step, the pores of the oxide film can be filled more densely in the formation step of the sealing layer (1060). The particles containing barium can act as a catalyst for the material of the sealing layer including water and oxygen atoms.

[0110] In conventional techniques, discoloration was prevented by performing a sealing process immediately after the dyeing process, or by adding a UV blocker to the dye and then performing the sealing process. However, in the present disclosure, instead of the above process, a pretreatment sealing process (1050) is performed using a pretreatment sealing solution containing particles containing barium, thereby improving the sealing quality and strengthening the oxide film. Consequently, not only the durability of the housing surface but also its light resistance can be secured.

[0111] According to one embodiment, the process (1060) of forming a sealing layer on the metal member may be a process of closing the pores of the oxide film. Although the process (1060) of forming a pretreatment sealing layer alone partially closes the pores of the oxide film, the process (1060) of forming a sealing layer may be included to ensure reliability of the film. For example, by the process (1060) of forming a sealing layer, all pores of the oxide film are closed, physical impact on the dye located within the pores is reduced and / or prevented, and discoloration due to ultraviolet rays can also be reduced and / or prevented.

[0112] According to one embodiment, the process (1060) of forming a sealing layer on the metal member may be a metal salt treatment method, a non-metal salt treatment method, or a water sealing treatment method using water and water vapor.

[0113] According to one embodiment, the method for manufacturing a housing (1000) may include a process for forming a sealing layer on the metal member (1060), followed by a dissolution process for removing a metal salt or a hot water washing process for washing foreign substances.

[0114] There is a growing demand for design enhancements to enhance the aesthetics of electronic devices. For example, electronic devices may include housings that utilize dyes to create a variety of colors. However, dyes can discolor under ultraviolet light. Conventional manufacturing methods for preventing dye discoloration can be costly or require relatively complex processes, which can hinder mass production. For example, using nano-germanium or adding UV blockers can be expensive, and using UV blockers along with dyes can complicate the process, as the UV blockers must be added to each dye bath. In contrast, the present disclosure utilizes particles containing barium, which can result in lower costs and can be advantageous in terms of process management, as barium or a barium compound only needs to be included in a single bath used in the pretreatment sealing process.

[0115] According to one embodiment of the present disclosure, a housing component (210, 310) may be provided, which includes a metal member (320) including an oxide film (321) having pores (323) formed therein; a dye (330) disposed within the pores; and a sealing layer (350) positioned on the oxide film, wherein the oxide film having the pores formed therein is formed on the metal member through an anodizing process, and the sealing layer (350) includes particles containing barium (Ba).

[0116] In one embodiment, the barium-containing particles disposed on the oxide film through a pretreatment process can be mixed into a material forming a sealing layer.

[0117] In one embodiment, the material forming the sealing layer may include water and hydrogen atoms.

[0118] According to one embodiment, the sealing layer (350) may include particles containing at least 0.01 atom% or more of barium.

[0119] According to one embodiment, the sealing layer (350) may further include nickel and / or zirconium.

[0120] In one embodiment, the metal member may include aluminum, magnesium, zinc or titanium.

[0121] In one embodiment, the particles containing barium may include barium chloride (BaCl2), barium sulfide (BaS), barium carbonate (BaCO3), barium oxide (BaO), and / or barium silicate (BaSiO3).

[0122] In one embodiment, the particles containing barium may comprise a material that generates divalent Ba ions in an aqueous solution.

[0123] In one embodiment, the oxide film forms at least a portion of the surface of the metal member, and the pores may be a plurality of grooves formed in the oxide film.

[0124] In one embodiment, the sealing layer may be configured to close the pore, and the sealing layer may be configured to cover the dye contained in the pore.

[0125] In one embodiment, the oxygen concentration of the sealing layer may be higher than the oxygen concentration of the oxide film.

[0126] In one embodiment, the dye may include a natural dye and / or an organic dye.

[0127] According to one embodiment, an electronic device including the housing component described above can be provided.

[0128] According to one embodiment of the present disclosure, a method for manufacturing a housing part can be provided, including: an anodizing process for forming an oxide film having pores formed on a metal member; a dye application process for applying a dye to at least a portion of the metal member including the pores; a pretreatment sealing process for forming a pretreatment sealing layer including particles containing barium on the oxide film; and a sealing process for forming a sealing layer on the pretreatment sealing layer, whereby particles containing barium included in the pretreatment sealing layer are mixed into a material forming the sealing layer.

[0129] According to one embodiment, the sealing process can form a sealing layer on the oxide film using water and hydrogen atoms.

[0130] According to one embodiment, the metal member preparation process may include a processing process for processing the shape of the metal member before the anodizing process; and a degreasing process for degreasing the metal member.

[0131] In one embodiment, the metal member may include aluminum, magnesium, zinc or titanium.

[0132] In one embodiment, the particles containing barium may include barium chloride (BaCl2), barium sulfide (BaS), barium carbonate (BaCO3), barium oxide (BaO), and / or barium silicate (BaSiO3).

[0133] In one embodiment, the particles containing barium may comprise a material that generates divalent Ba ions in an aqueous solution.

[0134] In one embodiment, the dye may include a natural dye and / or an organic dye.

[0135] The housing component of the present disclosure described above, the electronic device including the housing component, and the method for manufacturing the housing component are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

Claims

1. In the housing parts (210, 310), A metal member (320) including an oxide film (321) in which a gap (323) is formed; A dye (330) placed within the above gap; and Including a sealing layer (350) located on top of the above oxide film, The oxide film in which the above pores are formed is formed on the metal member through an anodizing process, The above sealing layer (350) is a housing component including particles containing barium (Ba).

2. In paragraph 1, A housing component in which the particles containing barium are placed on the oxide film through a pretreatment process and mixed with a material forming a sealing layer.

3. In paragraph 1, The material forming the above sealing layer is a housing component containing water and hydrogen atoms.

4. In any one of paragraphs 1 to 3, The above sealing layer (350) is a housing component including particles containing at least 0.01 atom% or more of barium.

5. In any one of paragraphs 1 to 4, The above sealing layer (350) is a housing part further comprising nickel and / or zirconium.

6. In any one of paragraphs 1 to 5, The above metal member is a housing part comprising aluminum, magnesium, zinc or titanium.

7. In any one of paragraphs 1 to 6, The above barium-containing particles are housing components including barium chloride (BaCl2), barium sulfide (BaS), barium carbonate (BaCO3), barium oxide (BaO), and / or barium silicate (BaSiO3).

8. In any one of paragraphs 1 to 7, The above barium-containing particles are a housing component comprising a substance that generates divalent Ba ions in an aqueous solution.

9. In any one of paragraphs 1 to 8, The above oxide film forms at least a portion of the surface of the metal member, The above-mentioned gap is a housing part having a plurality of grooves formed in the above-mentioned oxide film.

10. In any one of paragraphs 1 to 9, The above sealing layer closes the above gap, The above sealing layer is a housing part configured to cover the dye contained in the above gap.

11. In any one of paragraphs 1 to 10, A housing component in which the oxygen concentration of the above-mentioned sealing layer is higher than the oxygen concentration of the above-mentioned oxide film.

12. In any one of paragraphs 1 to 11, The above dye is a housing component containing a natural dye and / or an organic dye.

13. An electronic device comprising a housing component according to any one of claims 1 to 12.

14. In a method for manufacturing a housing part, an anodizing process for forming an oxide film with pores on a metal member; A dye application process for applying a dye to at least a portion of a metal member including the above-described void; A pretreatment sealing process for forming a pretreatment sealing layer including particles containing barium on the above oxide film; and A method for manufacturing a housing part, comprising a sealing process in which particles containing barium included in the pretreatment sealing layer are mixed into a material forming the sealing layer by forming a sealing layer on the pretreatment sealing layer.

15. In paragraph 14, Before the above anodizing process A machining process for machining the shape of a metal part; and A method for manufacturing a housing part, comprising a degreasing process for degreasing a metal member.

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