Power supply apparatus and computing device

Abstract

Embodiments of the present application relate to the technical field of computing devices, and provide a power supply apparatus and a computing device. The power supply apparatus comprises a backplane, a plurality of power modules, a liquid cooling module, and a power output module. The plurality of power modules are located on a first surface of the backplane, and each power module comprises a first liquid inlet and a first liquid outlet. The liquid cooling module is located on a second surface of the backplane, and comprises a liquid inlet pipe and a liquid outlet pipe. The backplane is provided with through-holes. The liquid inlet pipe comprises second liquid inlets, and the second liquid inlets pass through the through-holes to plug-connect to the first liquid inlets. The liquid outlet pipe comprises second liquid outlets, and the second liquid outlets pass through the through-holes to plug-connect to the first liquid outlets. The power output module is located on the second surface. An end of the power output module is electrically connected to the backplane, and another end of the power output module is used for supplying power to computing nodes. The power supply apparatus provided in the embodiments of the present application achieves improved heat dissipation performance and has a compact size.

Description

Power supply device and computing device

[0001] The present application claims priority to the Chinese patent application No. 202410451390.8, filed on April 15, 2024, and entitled "Power supply device and computing device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of computing device, and more particularly, to a power supply device and a computing device. BACKGROUND

[0003] With the development of big data, cloud computing and AI (Artificial intelligence), the power consumption of computing devices is becoming larger and larger.

[0004] The computing device is powered by a power supply device, which includes a plurality of power modules and a backboard. The plurality of power modules are plugged on the backboard. The power module includes an input filter module, a power change module and an output filter module, etc. The input filter module, the power change module and the output filter module all include high-power electronic components. These components have a large amount of heat dissipation, and the electronic components need to be cooled. In the related art, a cooling fan is provided in the power module to cool the components in the power module.

[0005] The cooling fan has poor cooling effect and makes the power supply device large in size. SUMMARY

[0006] Embodiments of the present application provide a power supply device and a computing device. The power supply device is cooled by a liquid cooling module, which has good cooling effect and can reduce the size of the power supply device.

[0007] In a first aspect, embodiments of the present application provide a power supply device, comprising: a backboard, a plurality of power modules, a liquid cooling module and a power supply output module, the backboard comprising a first plate surface and a second plate surface opposite to each other along a first direction, the plurality of power modules being located on the first plate surface, each power module having a first liquid inlet and a first liquid outlet; the liquid cooling module being located on the second plate surface, the liquid cooling module comprising a liquid inlet pipe and a liquid outlet pipe; the backboard having a plurality of through holes, the liquid inlet pipe having a plurality of second liquid inlets, the second liquid inlets penetrating through the through holes of the backboard to be plugged with the first liquid inlets; the liquid outlet pipe having a plurality of second liquid outlets, the second liquid outlets penetrating through the through holes of the backboard to be plugged with the first liquid outlets; the power supply output module being located on one side of the second plate surface, one end of the power supply output module being electrically connected with the backboard, the other end of the power supply output module extending across the liquid cooling module along the first direction for powering a computing node.

[0008] The power supply device provided by the embodiments of the present application is provided with a power module, a backboard, a liquid cooling module and a power supply output module. The backboard comprises a first plate surface and a second plate surface opposite to each other along a first direction, and a plurality of power modules are arranged on the first plate surface. Each power module is provided with a first liquid inlet and a first liquid outlet. The liquid cooling module is used to provide cooling liquid for the plurality of power modules. The cooling liquid is circulated to dissipate heat from the power modules, so that the heat dissipation effect of the power modules can be improved and the volume of the power modules can be reduced, thereby reducing the volume of the power supply device. The liquid cooling module is arranged on the second plate surface. The liquid cooling module comprises a liquid inlet pipe and a liquid outlet pipe. The backboard is provided with a plurality of through holes. The liquid inlet pipe is provided with a plurality of second liquid inlets. The second liquid inlets pass through the through holes of the backboard to be connected with the first liquid inlets. The liquid outlet pipe is provided with a plurality of second liquid outlets. The second liquid outlets pass through the through holes of the backboard to be connected with the first liquid outlets. The plurality of power modules are simultaneously provided with cooling liquid through the liquid inlet pipe. The cooling liquid in the plurality of power modules is collected through the liquid outlet pipe. The number of pipelines on the second plate surface of the backboard can be reduced, thereby reducing the volume occupied by the liquid cooling module in the power supply device, so as to reduce the volume of the power supply device. The power supply output module is arranged on one side of the second plate surface. One end of the power supply output module is electrically connected with the backboard. The other end of the power supply output module extends across the liquid cooling module along the first direction to supply power to the computing node. Thus, the volume of the power supply device can be further reduced.

[0009] In a possible implementation, the power supply device provided by the embodiments of the present application is provided with a liquid inlet pipe and a liquid outlet pipe which can be attached to the second plate surface, that is, there is no gap or a very small gap between the liquid inlet pipe and the liquid outlet pipe and the second plate surface. Thus, the structure of the power supply device is more compact, and the volume of the power supply device is further reduced.

[0010] In a possible implementation, the power supply device provided by the embodiments of the present application is provided with a liquid inlet pipe and a liquid outlet pipe which can be attached to the second plate surface, that is, there is no gap or a very small gap between the liquid inlet pipe and the liquid outlet pipe and the second plate surface. Thus, the structure of the power supply device is more compact, and the volume of the power supply device is further reduced.

[0011] In a possible implementation, the power supply device provided by the embodiment of the present application further includes a first mounting rack and a second mounting rack, the first mounting rack and the second mounting rack are located at two ends of the liquid cooling module along the second direction, the first mounting rack is configured to connect the liquid inlet main pipe, the liquid inlet pipe and the liquid outlet pipe at one end along the second direction, and the second mounting rack is configured to connect the liquid outlet main pipe, the liquid outlet pipe and the liquid inlet pipe at the other end along the second direction. According to the arrangement mode of the liquid inlet pipe, the liquid outlet pipe, the liquid inlet main pipe and the liquid outlet main pipe, the first mounting rack and the second mounting rack are arranged at two ends of the liquid cooling module along the second direction, and the first mounting rack is configured to connect the liquid inlet main pipe, the first end of the liquid inlet pipe and the fourth end of the liquid outlet pipe, and the second mounting rack is configured to connect the liquid outlet main pipe, the third end of the liquid outlet pipe and the second end of the liquid inlet pipe, so that the structure stability of the liquid cooling module is high and the structure of the liquid cooling module is compact.

[0012] In a possible implementation, the power supply device provided by the embodiment of the present application includes a power supply assembly and a grounding assembly, the power supply assembly includes a power supply adapter copper bar and a power supply lead-out copper bar, and the grounding assembly includes a grounding adapter copper bar and a grounding lead-out copper bar; the grounding adapter copper bar and the power supply adapter copper bar are arranged on the second plate surface and are electrically connected with the back plate, the power supply adapter copper bar and the grounding adapter copper bar are oppositely arranged along the third direction, so as to avoid increasing the size of the power supply device along the third direction due to the arrangement of the power supply adapter copper bar and the power supply adapter copper bar; the power supply adapter copper bar extends across the liquid cooling module along the first direction to be electrically connected with the power supply lead-out copper bar, so as to avoid the interference between the power supply assembly and the liquid cooling module and reduce the sum of the sizes of the power supply assembly and the liquid cooling module along the first direction; and the grounding adapter copper bar extends across the liquid cooling module along the first direction to be electrically connected with the grounding lead-out copper bar, so as to avoid the interference between the grounding assembly and the liquid cooling module and reduce the sum of the sizes of the grounding assembly and the liquid cooling module along the first direction.

[0013] In a possible implementation, the power supply device provided by the embodiment of the present application includes a plurality of power supply adapter copper bars, the plurality of power supply adapter copper bars are arranged along the second direction, and the power supply lead-out copper bar extends along the second direction so that each power supply adapter copper bar is electrically connected with the power supply lead-out copper bar; and the grounding adapter copper bar includes a plurality of grounding adapter copper bars, the plurality of grounding adapter copper bars are arranged along the second direction, and the grounding lead-out copper bar extends along the second direction so that each grounding adapter copper bar is electrically connected with the grounding lead-out copper bar. By arranging a plurality of power supply adapter copper bars, the volume of a single power supply adapter copper bar can be small, so that the stress generated in the back plate due to the deformation of the power supply adapter copper bar can be reduced; and by arranging a plurality of grounding adapter copper bars, the volume of a single grounding adapter copper bar can be small, so that the stress generated in the back plate due to the deformation of the grounding adapter copper bar can be reduced.

[0014] In a possible implementation, the power supply device provided by the embodiment of the present application includes a first bending part, the first bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe, a second bending part, the second bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe. In this way, the liquid cooling module can also bear part of the weight of the power supply assembly and the grounding assembly, avoiding that the weight of the power supply assembly and the grounding assembly is all loaded on the back plate, so that the deformation amount of the back plate can be further reduced.

[0015] In a possible implementation, the power supply device provided by the embodiment of the present application includes a first bending part, the first bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe, a second bending part, the second bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe. In this way, the liquid cooling module can also bear part of the weight of the power supply assembly and the grounding assembly, avoiding that the weight of the power supply assembly and the grounding assembly is all loaded on the back plate, so that the deformation amount of the back plate can be further reduced.

[0016] In a possible implementation, the power supply device provided by the embodiment of the present application includes a first bending part, the first bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe, a second bending part, the second bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe. In this way, the liquid cooling module can also bear part of the weight of the power supply assembly and the grounding assembly, avoiding that the weight of the power supply assembly and the grounding assembly is all loaded on the back plate, so that the deformation amount of the back plate can be further reduced.

[0017] In a possible implementation, the power supply device provided by the embodiment of the present application includes a first bending part, the first bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe, a second bending part, the second bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe. In this way, the liquid cooling module can also bear part of the weight of the power supply assembly and the grounding assembly, avoiding that the weight of the power supply assembly and the grounding assembly is all loaded on the back plate, so that the deformation amount of the back plate can be further reduced.

[0018] In a possible implementation, the power supply device provided by the embodiment of the present application includes a first bending part, the first bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe, a second bending part, the second bending part is connected with the liquid inlet pipe and / or the liquid outlet pipe. In this way, the liquid cooling module can also bear part of the weight of the power supply assembly and the grounding assembly, avoiding that the weight of the power supply assembly and the grounding assembly is all loaded on the back plate, so that the deformation amount of the back plate can be further reduced. BRIEF DESCRIPTION OF DRAWINGS

[0019] FIG. 1 is a structural schematic diagram of a data center provided by the embodiment of the present application;

[0020] FIG. 2 is a structural schematic diagram of a computing device provided by the embodiment of the present application;

[0021] Fig. 3 is a structural schematic diagram of a power supply device according to an embodiment of the present application;

[0022] Fig. 4 is a view of Fig. 3 from another angle;

[0023] Fig. 5 is an exploded schematic diagram of a power supply device according to an embodiment of the present application;

[0024] Fig. 6 is a view of Fig. 5 from another angle;

[0025] Fig. 7 is a structural schematic diagram of a liquid cooling module in a power supply device according to an embodiment of the present application;

[0026] Fig. 8 is a view of Fig. 7 from another angle;

[0027] Fig. 9 is an exploded schematic diagram of a liquid cooling module in a power supply device according to an embodiment of the present application;

[0028] Fig. 10 is a schematic diagram of an arrangement of liquid inlet and outlet pipes in a power supply device according to an embodiment of the present application;

[0029] Fig. 11 is a second exploded schematic diagram of a power supply device according to an embodiment of the present application;

[0030] Fig. 12 is a second structural schematic diagram of a power supply device according to an embodiment of the present application;

[0031] Fig. 13 is a third exploded schematic diagram of a power supply device according to an embodiment of the present application.

[0032] Explanation of reference signs: 10, computing device; 100, power supply device; 110, power supply module; 111, first liquid inlet; 112, first liquid outlet; 113, third connector; 120, back plate; 120a, first plate surface; 120b, second plate surface; 121, through hole; 122, fourth connector; 123, positioning pin; 124, connecting seat; 125, seventh connector; 130, liquid cooling module; 131, liquid inlet pipe; 131a, first end; 131b, second end; 1311, second liquid inlet; 1312, second insulating member; 132, liquid outlet pipe; 132a, third end; 132b, fourth end; 1321, second liquid outlet; 133, liquid inlet main pipe; 1331, main liquid inlet; 134, liquid outlet main pipe; 1341, main liquid outlet; 135, liquid inlet unit; 136, liquid outlet unit; 137, first mounting rack; 1371, first mounting plate; 1372, second mounting plate; 1373, first handle; 138, second mounting rack; 1381, third mounting plate; 1382, fourth mounting plate; 1383, second handle; 140, power supply output module; 141, power supply assembly; 1411, power supply adapter copper bar; 1412, power supply lead-out copper bar; 1412a, first bending part; 1412b, first insulating member; 1413, power supply lug; 142, grounding assembly; 1421, grounding adapter copper bar; 1422, grounding lead-out copper bar; 1422a, second bending part; 1423, grounding lug; 143, insulating sleeve; 150, first fastener; 160, power supply input module; 161, adapter plate; 162, fifth connector; 163, sixth connector; 164, cable; 200, cabinet body; 210, front panel; 220, rear panel; 300, computing node; 310, second connector; 400, copper bar group; 410, power supply copper bar; 420, grounding copper bar; 20, computer room; 1000, data center; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0033] The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application. The embodiments of the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0034] FIG. 1 is a structural schematic diagram of a data center provided by the embodiments of the present application.

[0035] Referring to FIG. 1, the data center 1000 is a facility for installing computing devices and related components, such as telecommunication and storage systems. The data center 1000 provided by the embodiments of the present application can include a machine room 20 and at least one computing device 10 arranged in the machine room 20. It can be understood that the machine room 20 can be a closed room, or a room open on one side or multiple sides. The machine room 20 can be a temporary room built, such as a tent room, a board room, etc., or a permanent room built.

[0036] The machine room 20 can be provided with only one computing device 10, or multiple computing devices 10. When the machine room 20 is provided with multiple computing devices 10, the computing devices 10 can be the same, partially the same, or all different. The computing device 10 can be a desktop server, a blade server, a rack server, a high-density server, or an entire-cabinet server.

[0037] The entire-cabinet server is widely used in the fields of cloud computing, high-performance computer clusters (HPC), big data, and artificial intelligence, etc. due to its high space utilization.

[0038] Hereinafter, the structure of the computing device will be described by taking the entire-cabinet server as an example.

[0039] FIG. 2 is a structural schematic diagram of the computing device provided by the embodiments of the present application.

[0040] Referring to FIG. 2, the computing device 10 includes a power supply device 100, a cabinet 200, and multiple computing nodes 300. The power supply device 100 and the multiple computing nodes 300 are located in the cabinet 200, and the power supply device 100 is used to supply power to the computing nodes 300.

[0041] Specifically, the cabinet 200 has a cuboid structure, and the cabinet 200 includes a first direction X, a second direction Y, and a third direction Z. The cabinet 200 is used to support and accommodate the power supply device 100 and the multiple computing nodes 300. The multiple computing nodes 300 are arranged at intervals along the third direction Z, and the power supply device 100 is arranged above the computing nodes 300 along the third direction Z.

[0042] The power supply device 100 includes multiple power supply modules 110 and a backboard 120. The multiple power supply modules 110 are plugged on the backboard 120 and electrically connected with the backboard 120.

[0043] The computing device 10 further comprises a copper bar group 400 extending along a third direction Z in the cabinet body, one end of the copper bar group 400 being electrically connected with the backboard 120, and a plurality of first connectors (not shown in the figure) being arranged on the copper bar group 400 at intervals, the computing node 300 being provided with a plurality of second connectors 310, and the plurality of second connectors 310 being plugged with the first connectors one by one. It should be noted that the copper bar group 400 comprises a power supply copper bar 410 and a grounding copper bar 420.

[0044] The power supply module comprises an input filter module, a power change module and an output filter module. The input filter module, the power change module and the output filter module all comprise high-power electronic components, and the heat dissipation of these components is large, and the electronic components need to be cooled. In the related art, a cooling fan is arranged in the power supply module to cool the components in the power supply module. With the increasing heat dissipation of the power supply module, the volume of the cooling fan in the power supply module is also increasing, so that the volume of the power supply device is also increasing. In addition, the cooling effect of the cooling fan is poor and the noise of the cooling fan is also large when cooling.

[0045] Therefore, the embodiment of the present application provides a power supply device and a computing device. The power supply device is cooled by a liquid cooling module, and the cooling effect of the liquid cooling module is good, and the volume of the power supply device can be reduced by cooling through the liquid cooling module.

[0046] FIG. 3 is a structural schematic diagram of the power supply device according to an embodiment of the present application; FIG. 4 is a view of another angle of FIG. 3; FIG. 5 is an exploded schematic diagram of the power supply device according to an embodiment of the present application; and FIG. 6 is a view of another angle of FIG. 5. In FIG. 4, the power supply module is omitted; and in FIGS. 5 and 6, only the structure of one end of the power supply module 110 connected with the backboard 120 is shown.

[0047] Referring to FIGS. 3-6, the power supply device 100 further includes a liquid cooling module 130 and a power supply output module 140. The backboard 120 includes a first plate surface 120a and a second plate surface 120b opposite to each other along a first direction X. The plurality of power supply modules 110 are located on the first plate surface 120a, and each power supply module 110 has a first liquid inlet 111 and a first liquid outlet 112. The liquid cooling module 130 is located on the second plate surface 120b, and includes a liquid inlet pipe 131 and a liquid outlet pipe 132. The backboard 120 has a plurality of through holes 121. The liquid inlet pipe 131 has a plurality of second liquid inlets 1311, and the second liquid inlets 1311 pass through the through holes 121 of the backboard 120 to be plugged with the first liquid inlets 111. The liquid outlet pipe 132 has a plurality of second liquid outlets 1321, and the second liquid outlets 1321 pass through the through holes 121 of the backboard 120 to be plugged with the first liquid outlets 112. The power supply output module 140 is located on one side of the second plate surface 120b, and one end of the power supply output module 140 is electrically connected with the backboard 120, and the other end of the power supply output module 140 extends across the liquid cooling module 130 along the first direction X to supply power to the computing node 300.

[0048] Specifically, referring to FIG. 2, the cabinet 200 can include a front panel 210 and a rear panel 220 opposite to each other along the first direction X. The backboard 120 can be arranged close to the rear panel 220 and parallel to the rear panel 220. One side of the backboard 120 facing the front panel 210 is the first plate surface 120a of the backboard 120, and the other side of the backboard 120 facing the rear panel 220 is the second plate surface 120b.

[0049] The power supply device 100 can be provided with a plurality of power supply modules 110. The plurality of power supply modules 110 are uniformly and spacedly arranged on the first plate surface 120a of the backboard 120. The power supply modules 110 are arranged in rows along a second direction Y and in columns along a third direction Z, and are arranged in rows and columns on the backboard 120. In FIGS. 3-5, the plug-in areas of eighteen power supply modules 110 in two rows and nine columns are shown on the backboard 120, and one power supply module 110 is schematically shown.

[0050] Referring to FIGS. 3 and 5, the power supply module 110 has a third connector 113, and each plug-in area of the backboard 120 has a fourth connector 122. The third connector 113 and the fourth connector 122 are plugged one by one to fix the power supply module 110 on the backboard 120 and electrically connect the power supply module 110 with the backboard 120.

[0051] Please continue to see Figure 3 and Figure 5, in a possible implementation, the back plate 120 is also provided with a guide pin 123, the power module 110 has a corresponding guide sleeve (not marked in the figure), the length of the guide pin 123 extending out of the first plate surface 120a is greater than the fourth connector 122, when the third connector 113 and the fourth connector 122 are inserted, the guide pin 123 first extends into the guide sleeve, so as to facilitate the alignment of the third connector 113 and the fourth connector 122 when inserted.

[0052] Please continue to see Figure 6, the power module 110 uses liquid cooling to dissipate heat, the power module 110 has a first liquid inlet 111 and a first liquid outlet 112, the cooling liquid enters the power module 110 from the first liquid inlet 111, and after absorbing the heat of the electrical components in the power module 110, it flows out from the first liquid outlet 112.

[0053] The power module 110 can use immersion liquid cooling, spray liquid cooling and cold plate liquid cooling. Immersion liquid cooling is to immerse the heating electronic components in the coolant (cooling liquid), and rely on the circulation of liquid to take away the heat. When using immersion liquid cooling, the electronic components are in direct contact with the cooling liquid in all directions, so the immersion liquid cooling has better heat dissipation effect. Spray liquid cooling is to spray the cooling liquid on the electronic components through the spray head. Compared with immersion liquid cooling, spray liquid cooling is more economical in cooling liquid. Cold plate liquid cooling is to paste the cold plate on the surface of the electronic components to take away the heat of the electronic components. Among them, when using immersion liquid cooling, the power module 110 has no other device for heat dissipation except the cooling liquid, so the volume of the power module 110 is small. The volume of the spray head in immersion liquid cooling and the cold plate in cold plate liquid cooling is much smaller than that of the heat dissipation fan, so the volume of the power module 110 is small. In addition, the heat dissipation effect of liquid cooling is better than that of air cooling.

[0054] The liquid cooling module 130 is used to provide cooling liquid for the plurality of power modules 110, and the liquid cooling module 130 is arranged on the second plate surface 120b of the back plate 120. The back plate 120 can be fixed on the pipe wall of the liquid inlet pipe 131 or the liquid outlet pipe 132 by fasteners. The liquid inlet pipe 131 can extend along the second direction Y to simultaneously provide cooling liquid for the plurality of power modules 110 arranged in a row along the second direction Y. Specifically, the liquid inlet pipe 131 has a plurality of second liquid inlets 1311 arranged at intervals, and the second liquid inlets 1311 are respectively aligned with the first liquid inlets 111 in different power modules 110 in the same row. The back plate 120 has a through hole 121 for the second liquid inlets 1311 to pass through, and the second liquid inlets 1311 all pass through the through hole 121 to correspondingly insert with the first liquid inlets 111 in different power modules 110. The cooling liquid enters from the liquid inlet pipe 131, flows through the second liquid inlets 1311 and the first liquid inlets 111 in turn, and is distributed to the plurality of power modules 110.

[0055] The outflow pipe 132 can extend along the second direction Y to converge the cooling liquid flowing out of the plurality of power modules 110 arranged in a row along the second direction Y. Specifically, the outflow pipe 132 has a plurality of second outflow openings 1321 arranged at intervals, and the second outflow openings 1321 are respectively aligned with the first outflow openings 112 in different power modules 110 in the same row. The back plate 120 has a through hole 121 through which the second outflow openings 1321 pass, and the second outflow openings 1321 all pass through the through hole to be respectively plugged with the first outflow openings 112 in different power modules 110. The cooling liquid flowing out of different power modules 110 flows through the first outflow openings 112 and the second outflow openings 1321 in turn to converge into the outflow pipe 132.

[0056] By simultaneously providing the plurality of power modules 110 with cooling liquid through the inflow pipe 131 and converging the cooling liquid in the plurality of power modules 110 through the outflow pipe 132, the number of pipelines on the second plate surface 120b of the back plate 120 can be reduced, so that the volume occupied by the liquid cooling module 130 in the power supply device 100 can be reduced, thereby reducing the volume of the power supply device 100.

[0057] In a possible implementation, the inflow pipe 131 and the outflow pipe 132 can be attached to the second plate surface 120b, that is, there is no gap or a very small gap between the inflow pipe 131 and the outflow pipe 132 and the second plate surface 120b, thereby making the structure of the power supply device 100 more compact and further reducing the volume of the power supply device 100.

[0058] The power supply output module 140 is located on one side of the second plate surface 120b, one end of the power supply output module 140 is electrically connected to the back plate 120, and the other end of the power supply output module 140 extends across the liquid cooling module 130 along the first direction X to be electrically connected to the copper bar group 400 and supply power to the computing node 300 through the copper bar group 400. Since the power supply output module 140 extends across the liquid cooling module 130 and is electrically connected to the copper bar group 400, the sum of the dimensions of the power supply output module 140 and the liquid cooling module 130 along the first direction X is small, thereby further reducing the volume of the power supply device 100.

[0059] The power supply device 100 provided by the embodiment of the present application is configured by the power supply module 110, the backboard 120, the liquid cooling module 130 and the power supply output module 140. The backboard 120 comprises a first plate surface 120a and a second plate surface 120b opposite to each other along a first direction X. The plurality of power supply modules 110 are located on the first plate surface 120a. Each power supply module 110 is provided with a first liquid inlet 111 and a first liquid outlet 112. The liquid cooling module 130 is configured to supply cooling liquid to the plurality of power supply modules 110. The cooling liquid is circulated to dissipate heat from the power supply modules 110, which can improve the heat dissipation effect of the power supply modules 110 and reduce the volume of the power supply modules 110, thereby reducing the volume of the power supply device 100. The liquid cooling module 130 is located on the second plate surface 120b. The liquid cooling module 130 comprises a liquid inlet pipe 131 and a liquid outlet pipe 132. The liquid inlet pipe 131 and the liquid outlet pipe 132 are both attached to the second plate surface 120b. The backboard 120 is provided with a plurality of through holes 121. The liquid inlet pipe 131 is provided with a plurality of second liquid inlets 1311. The second liquid inlets 1311 pass through the through holes 121 of the backboard 120 to be connected to the first liquid inlets 111. The liquid outlet pipe 132 is provided with a plurality of second liquid outlets 1321. The second liquid outlets 1321 pass through the through holes 121 of the backboard 120 to be connected to the first liquid outlets 112. The plurality of power supply modules 110 are simultaneously supplied with cooling liquid by the liquid inlet pipe 131. The cooling liquid in the plurality of power supply modules 110 is collected by the liquid outlet pipe 132. The number of pipelines on the second plate surface 120b of the backboard 120 can be reduced, thereby reducing the volume occupied by the liquid cooling module 130 in the power supply device 100, and reducing the volume of the power supply device 100. The power supply output module 140 is located on one side of the second plate surface 120b. One end of the power supply output module 140 is electrically connected to the backboard 120. The other end of the power supply output module 140 extends across the liquid cooling module 130 to supply power to the computing node 300. Thus, the volume of the power supply device 100 can be further reduced.

[0060] Next, the specific arrangement of the liquid inlet pipe 131 and the liquid outlet pipe 132 will be described.

[0061] FIG. 7 is a structural schematic diagram of the liquid cooling module in the power supply device provided by the embodiment of the present application; FIG. 8 is a view from another angle of FIG. 7; FIG. 9 is an exploded schematic diagram of the liquid cooling module in the power supply device provided by the embodiment of the present application; and FIG. 10 is a schematic diagram of the arrangement of the liquid inlet pipe and the liquid outlet pipe in the power supply device provided by the embodiment of the present application.

[0062] Referring to FIGS. 7-10, the liquid cooling module 130 further includes an inlet manifold 133 and an outlet manifold 134, the inlet manifold 133 and the outlet manifold 134 are oppositely arranged along the second direction Y, and the inlet manifold 133 and the outlet manifold 134 both extend along the third direction Z, the inlet pipes 131 and the outlet pipes 132 both extend along the second direction Y, each inlet pipe 131 is connected with the inlet manifold 133, and each outlet pipe 132 is connected with the outlet manifold 134.

[0063] The inlet pipes 131 and the outlet pipes 132 both extend along the second direction Y, therefore, the number of the inlet pipes 131 and the number of the outlet pipes 132 are both same as the number of rows of the power modules 110 on the back plate 120. In FIGS. 7-9, two inlet pipes 131 and two outlet pipes 132 are schematically shown. The liquid cooling module 130 further includes the inlet manifold 133 to facilitate the distribution of the cooling liquid into the plurality of inlet pipes 131. The liquid cooling module 130 further includes the outlet manifold 134 to facilitate the collection of the cooling liquid from the plurality of outlet pipes 132.

[0064] Please continue to refer to FIGS. 7-10, the inlet manifold 133 and the outlet manifold 134 can be oppositely arranged along the second direction on the second plate surface 120b side, the distance between the inlet manifold 133 and the outlet manifold 134 can be close to the size of the back plate 120 along the second direction Y, to avoid increasing the size of the power supply device 100 along the second direction Y due to the arrangement of the inlet manifold 133 and the outlet manifold 134.

[0065] The inlet manifold 133 extends along the third direction Z, the plurality of inlet pipes 131 are arranged on the inlet manifold 133 in intervals and each inlet pipe 131 extends along the second direction Y, in a possible implementation, the first end 131a of each inlet pipe 131 is in communication with the inlet manifold 133, the plurality of inlet pipes 131 and the inlet manifold 133 form a “tree branch type” inlet unit 135, and the second end 131b of the inlet pipe 131 is a branch end of the inlet unit 135.

[0066] The outlet manifold 134 extends along the third direction Z, the plurality of outlet pipes 132 are arranged on the outlet manifold 134 in intervals and each outlet pipe 132 extends along the second direction Y, in a possible implementation, the third end 132a of each outlet pipe 132 is in communication with the outlet manifold 134, the plurality of outlet pipes 132 and the outlet manifold 134 form a “tree branch type” outlet unit 136, and the fourth end 132b of the outlet pipe 132 is a branch end of the outlet unit 136.

[0067] The liquid cooling module 130 further comprises a total liquid inlet 1331 and a total liquid outlet 1341, the total liquid inlet 1331 is communicated with one of the liquid inlet pipe 131 or the liquid inlet total pipe 133, and the total liquid outlet 1341 is communicated with one of the liquid outlet pipe 132 or the liquid outlet total pipe 134. The total liquid inlet 1331 and the total liquid outlet 1341 are used to communicate with a liquid supply device in the computing device 10. The cooling liquid in the liquid supply device enters the liquid cooling module 130 from the total liquid inlet 1331, takes away the heat in the power supply device 100, and then flows out from the total liquid outlet 1341 to return to the liquid supply device.

[0068] When installing the liquid cooling module 130, the second end 131b of the plurality of liquid inlet pipes 131 in the liquid inlet unit 135 can be directed towards the fourth end 132b of the plurality of liquid outlet pipes 132 in the liquid outlet unit 136, and the liquid inlet pipe 131 and the liquid outlet pipe 132 are staggered along the third direction; then the liquid inlet unit 135 and the liquid outlet unit 136 are moved towards each other until the second liquid inlet 1311 on the liquid inlet pipe 131 is aligned with the first liquid inlet 111 on the power module 110 one by one, and the second liquid outlet 1321 on the liquid outlet pipe 132 is aligned with the first liquid outlet 112 on the power module 110 one by one. At this time, the second end 131b of the liquid inlet pipe 131 is close to the liquid outlet total pipe 134, the fourth end 132b of the liquid outlet pipe 132 is close to the liquid inlet total pipe 133, and the liquid inlet pipe 131 and the liquid outlet pipe 132 form a plug-in structure.

[0069] By locating the liquid inlet total pipe 133 and the liquid outlet total pipe 134 at opposite ends of the back plate 120 along the second direction Y, and making the liquid inlet pipe 131 and the liquid outlet pipe 132 form a plug-in structure, the installation process of the liquid cooling module 130 can be simple and the liquid cooling module 130 can be arranged more neatly on the second plate surface 120 of the back plate 120, thereby occupying a smaller space.

[0070] Please continue to refer to FIGS. 7-9, the liquid cooling module 130 further comprises a first mounting bracket 137 and a second mounting bracket 138, the first mounting bracket 137 and the second mounting bracket 138 are located at both ends of the liquid cooling module 130 along the second direction Y, the first mounting bracket 137 is used to connect the liquid inlet total pipe 133, the liquid inlet pipe 131 and the liquid outlet pipe 132 at one end of the second direction Y; the second mounting bracket 138 is used to connect the liquid outlet total pipe 134, the liquid outlet pipe 132 and the liquid inlet pipe 131 at the other end of the second direction Y.

[0071] The first mounting frame 137 comprises a first mounting plate 1371 and a second mounting plate 1372, the first mounting plate 1371 has a dimension along the third direction close to a dimension of the liquid inlet manifold 133 along the third direction Z, the second mounting plate 1372 is connected with the first mounting plate 1371, and a plurality of second mounting plates 1372 are arranged on the first mounting plate 1371 in the third direction Z and are spaced apart from each other; in FIG. 9, two second mounting plates 1372 are shown.

[0072] The first mounting plate 1371 is attached to the side wall of the liquid inlet manifold 133 and is connected with the side wall of the liquid inlet manifold 133 by fasteners. The second mounting plate 1372 is attached to the first end 131a of the liquid inlet pipe 131 and the fourth end 132b of the liquid outlet pipe 132 and is connected with the first end 131a of the liquid inlet pipe 131 and the fourth end 132b of the liquid outlet pipe 132 by fasteners. By connecting the liquid inlet manifold 133 and the first end 131a of the liquid inlet pipe 131 through the first mounting frame 137, the connection between the liquid inlet pipe 131 and the liquid inlet manifold 133 can be more reliable, and by fixing the fourth end 132b of the liquid outlet pipe 132 to the liquid inlet manifold 133 through the first mounting frame 137, deformation of the fourth end 132b of the liquid outlet pipe 132 due to suspension can be avoided.

[0073] The second mounting frame 138 comprises a third mounting plate 1381 and a fourth mounting plate 1382, the third mounting plate 1381 has a dimension along the third direction close to a dimension of the liquid outlet manifold 134 along the third direction Z, the fourth mounting plate 1382 is connected with the third mounting plate 1381, and a plurality of fourth mounting plates 1382 are arranged on the third mounting plate 1381 in the third direction Z and are spaced apart from each other; in FIG. 9, two fourth mounting plates 1382 are shown.

[0074] The third mounting plate 1381 is attached to the side wall of the liquid outlet manifold 134 and is connected with the side wall of the liquid outlet manifold 134 by fasteners. The fourth mounting plate 1382 is attached to the third end 132a of the liquid outlet pipe 132 and the second end 131b of the liquid inlet pipe 131 and is connected with the third end 132a of the liquid outlet pipe 132 and the second end 131b of the liquid inlet pipe 131 by fasteners. By connecting the liquid outlet manifold 134 and the third end 132a of the liquid outlet pipe 132 through the second mounting frame 138, the connection between the liquid outlet pipe 132 and the liquid outlet manifold 134 can be more reliable, and by fixing the second end 131b of the liquid inlet pipe 131 to the liquid outlet manifold 134 through the second mounting frame 138, deformation of the second end 131b of the liquid inlet pipe 131 due to suspension can be avoided.

[0075] The first mounting frame 137 is further provided with a first handle 1373, the second mounting frame 138 is further provided with a second handle 1383, and the first handle 1373 and the second handle 1383 can facilitate an operator to hold.

[0076] According to the arrangement of the liquid inlet pipe 131, the liquid outlet pipe 132, the liquid inlet main pipe 133 and the liquid outlet main pipe 134, the first mounting frame 137 and the second mounting frame 138 are arranged at two ends of the liquid cooling module 130 along the second direction Y, and the first mounting frame 137 is connected with the liquid inlet main pipe 133, the first end 131a of the liquid inlet pipe 131 and the fourth end 132b of the liquid outlet pipe 132, and the second mounting frame 138 is connected with the liquid outlet main pipe 134, the third end 132a of the liquid outlet pipe 132 and the second end 131b of the liquid inlet pipe 131, so that the structure stability of the liquid cooling module 130 is high and the structure of the liquid cooling module 130 is compact.

[0077] FIG. 11 is an exploded schematic view of the power supply device according to an embodiment of the present application, in which the liquid cooling module 130 is mounted on the back plate 120, and the power supply output module 140 is detached from the back plate 120, so as to clearly show the specific relative positions of the liquid cooling module 130 and the power supply output module 140, and in addition, the power supply module 110 is omitted in FIG. 11.

[0078] Referring to FIGS. 4, 6 and 11, the power supply output module 140 includes a power supply assembly 141 and a grounding assembly 142, the power supply assembly 141 includes a power supply adapter copper bar 1411 and a power supply lead-out copper bar 1412, and the grounding assembly 142 includes a grounding adapter copper bar 1421 and a grounding lead-out copper bar 1422, the grounding adapter copper bar 1421 and the power supply adapter copper bar 1411 are arranged on the second plate surface 120b and are electrically connected with the back plate 120, and the power supply adapter copper bar 1411 and the grounding adapter copper bar 1421 are oppositely arranged along the third direction Z; the power supply adapter copper bar 1411 extends across the liquid cooling module 130 along the first direction X to be electrically connected with the power supply lead-out copper bar 1412; and the grounding adapter copper bar 1421 extends across the liquid cooling module 130 along the first direction X to be electrically connected with the grounding lead-out copper bar 1422.

[0079] The voltage of the external power supply can be 220v or 380v, the electric energy of the external power supply is electrically connected with the plurality of power supply modules 110 via the back plate 120, is converted into a voltage adapted to the required voltage of the computing node 300 in the computing device 10 by the power supply module 110, and is then output by the power supply output module 140. The power supply output module 140 includes the power supply assembly 141 and the grounding assembly 142, the power supply assembly 141 is electrically connected with the power supply copper bar 410, and the grounding assembly 142 is electrically connected with the grounding copper bar 420, so as to form a loop for supplying power to the computing node 300.

[0080] The second plate surface 120b of the back plate 120 is provided with a connecting seat 124, and the power supply adapter copper bar 1411 and the grounding adapter copper bar 1421 can be connected on the connecting seat 124 by fasteners and are electrically connected with the back plate 120 by the connecting seat 124.

[0081] The power supply adapter copper bars 1411 and the ground adapter copper bars 1421 can be arranged opposite to each other along the third direction Z on the second side of the back plate 120, and the distance between the power supply adapter copper bars 1411 and the ground adapter copper bars 1421 can be close to the size of the back plate 120 along the third direction Z, so as to avoid increasing the size of the power supply device 100 along the third direction Z due to the arrangement of the power supply adapter copper bars 1411 and the power supply adapter copper bars 1411.

[0082] The size of the power supply adapter copper bars 1411 along the first direction X is greater than the pipe diameter of the liquid inlet pipe 131, one end of the power supply adapter copper bars 1411 is connected to the back plate 120 through the connecting seat 124, and the other end of the power supply adapter copper bars 1411 extends across the liquid inlet pipe 131 along the first direction X, so as to be connected to the power supply lead-out copper bars 1412. In this way, the power supply assembly 141 and the liquid cooling module 130 can be prevented from interfering with each other, and the sum of the sizes of the power supply assembly 141 and the liquid cooling module 130 along the first direction X can be reduced.

[0083] The size of the ground adapter copper bars 1421 along the first direction X is greater than the pipe diameter of the liquid inlet pipe 131, one end of the ground adapter copper bars 1421 is connected to the back plate 120, and the other end of the ground adapter copper bars 1421 extends across the liquid inlet pipe 131 along the first direction X, so as to be connected to the ground lead-out copper bars 1422. In this way, the ground assembly 142 and the liquid cooling module 130 can be prevented from interfering with each other, and the sum of the sizes of the ground assembly 142 and the liquid cooling module 130 along the first direction X can be reduced.

[0084] Please continue to refer to FIGS. 4, 6 and 11, the number of the power supply adapter copper bars 1411 is multiple, the multiple power supply adapter copper bars 1411 are arranged along the second direction Y, and the power supply lead-out copper bars 1412 extend along the second direction Y so that each of the power supply adapter copper bars 1411 is electrically connected to the power supply lead-out copper bars 1412.

[0085] The power supply adapter copper bars 1411 are connected to the back plate 120, and when the power supply adapter copper bars 1411 are deformed, stress is generated inside the back plate 120. By arranging multiple power supply adapter copper bars 1411 along the second direction Y, the volume of each of the power supply adapter copper bars 1411 can be small, so that the stress generated inside the back plate 120 due to the deformation of the power supply adapter copper bars 1411 can be reduced. The ends of the multiple power supply adapter copper bars 1411 away from the back plate 120 can be electrically connected through the power supply lead-out copper bars 1412 extending along the second direction Y.

[0086] The number of the ground adapter copper bars 1421 is multiple, the multiple ground adapter copper bars 1421 are arranged along the second direction Y, and the ground lead-out copper bars 1422 extend along the second direction Y so that each of the ground adapter copper bars 1421 is electrically connected to the ground lead-out copper bars 1422.

[0087] The ground transition copper bars 1421 are connected with the back plate 120. When the ground transition copper bars 1421 are deformed, stress is generated inside the back plate 120. By arranging a plurality of ground transition copper bars 1421 arranged along the second direction Y, the volume of a single ground transition copper bar 1421 can be small, thereby reducing the stress generated inside the back plate 120 due to the deformation of the ground transition copper bars 1421. The end of the plurality of ground transition copper bars 1421 away from the back plate 120 can be electrically connected through the ground lead-out copper bars 1422 extending along the second direction Y.

[0088] Please continue to refer to FIG. 11. In a possible implementation, the power supply lead-out copper bars 1412 include first bending portions 1412a connected with the liquid inlet pipe 131 and / or the liquid outlet pipe 132, and the ground lead-out copper bars 1422 include second bending portions 1422a connected with the liquid inlet pipe 131 and / or the liquid outlet pipe 132.

[0089] The power supply lead-out copper bars 1412 have first bending portions 1412a bent towards the liquid inlet pipe 131 (or the liquid outlet pipe 132, and hereinafter the liquid inlet pipe 131 is taken as an example for description). The first bending portions 1412a can be fixed on the liquid inlet pipe 131 through fasteners. By connecting the power supply lead-out copper bars 1412 with the liquid inlet pipe 131, the liquid cooling module 130 can also carry part of the weight of the power supply assembly 141, avoiding the weight of the power supply assembly 141 being entirely loaded on the back plate 120, thereby further reducing the deformation amount of the back plate 120.

[0090] The ground lead-out copper bars 1422 have second bending portions 1422a bent towards the liquid inlet pipe 131. The second bending portions 1422a can be fixed on the liquid inlet pipe 131 through fasteners. By connecting the ground lead-out copper bars 1422 with the liquid inlet pipe 131, the liquid cooling module 130 can also carry part of the weight of the ground assembly 142, avoiding the weight of the ground assembly 142 being entirely loaded on the back plate 120, thereby further reducing the deformation amount of the back plate 120.

[0091] Currents are generated in the power supply lead-out copper bars 1412 and the ground lead-out copper bars 1422. When the power supply lead-out copper bars 1412 and the ground lead-out copper bars 1422 are connected with the liquid inlet pipe 131, insulation needs to be ensured between the power supply lead-out copper bars 1412 and the liquid inlet pipe 131 and between the ground lead-out copper bars 1422 and the liquid inlet pipe 131.

[0092] Please continue to see FIG. 11, in a possible implementation, the first bending part 1412a and the second bending part 1422a are embedded with the first insulation 1412b, and the pipe wall of the inlet pipe 131 and / or the outlet pipe 132 is embedded with the second insulation 1312. The power supply device 100 further comprises a first fastener 150, which is threaded through the first insulation 1412b and the second insulation 1312.

[0093] Take the first bending part 1412a as an example. The first bending part 1412a has a through hole, the first insulation 1412b is embedded in the mounting hole, the pipe wall of the inlet pipe 131 is provided with a blind hole, and the second insulation 1312 is embedded in the blind hole. When connecting the first bending part 1412a with the inlet pipe 131, the first fastener 150 is threaded through the first insulation 1412b and the second insulation 1312 in turn to connect the first bending part 1412a and the inlet pipe 131, so that the insulation between the power supply lead-out copper bar 1412 and the inlet pipe 131 can be ensured when connecting the power supply lead-out copper bar 1412 and the inlet pipe 131.

[0094] Please continue to see FIG. 11, it should be noted that the power supply adapter copper bar 1411 and the grounding adapter copper bar 1421 can also contact the inlet pipe 131, therefore, an insulation sleeve 143 can be arranged on the side of the power supply adapter copper bar 1411 and the grounding adapter copper bar 1421 to avoid the contact between the power supply adapter copper bar 1411 and the grounding adapter copper bar 1421 and the inlet pipe 131.

[0095] Please continue to see FIG. 6 and FIG. 11, the power supply assembly 141 further comprises a power supply lug 1413, one end of the power supply lug 1413 is connected with the power supply lead-out copper bar 1412, and the other end of the power supply lug 1413 is used for electrically connecting with the computing node 300; the grounding assembly 142 further comprises a grounding lug 1423, one end of the grounding lug 1423 is connected with the grounding lead-out copper bar 1422, and the other end of the grounding lug 1423 is used for electrically connecting with the computing node 300.

[0096] The power supply lug 1413 extends from the power supply lead-out copper bar 1412 along the first direction X to facilitate the electrical connection with the power supply copper bar 410 in the computing device 10. The grounding lug 1423 extends from the grounding lead-out copper bar 1422 along the first direction X to facilitate the electrical connection with the grounding copper bar 420 in the computing device 10. Thus, a loop for supplying power to the computing node 300 can be formed. The size of the power supply lug 1413 and the grounding lug 1423 along the first direction X can be flexibly set according to the distance between the power supply device 100 and the copper bar group 400, so that the layout of the power supply device 100 and the copper bar group 400 in the computing device 10 is more flexible.

[0097] Fig. 12 is a schematic structural view of the power supply device according to an embodiment of the present application; and Fig. 13 is an exploded schematic view of the power supply device according to an embodiment of the present application.

[0098] Referring to Figs. 12 and 13, the power supply device 100 further comprises a power supply input module 160, which comprises an adapter board 161 connected with the power supply outgoing copper bar 1412 and the grounding outgoing copper bar 1422.

[0099] The power supply input module 160 is configured to transmit the electric energy from the external power supply to the backboard 120. Specifically, the power supply input module 160 comprises the adapter board 161, and a fifth connector 162 and a sixth connector 163 arranged on opposite sides of the adapter board 161, and the fifth connector 162 and the sixth connector 163 are electrically connected through internal wires of the adapter board 161. The fifth connector 162 is configured to be electrically connected with the external power supply. The power supply input module 160 can comprise a plurality of fifth connectors 162. In Figs. 12 and 13, six fifth connectors 162 are shown, and six external power supplies can be provided and connected with the six fifth connectors 162 respectively. In Figs. 12 and 13, two sixth connectors 163 are shown. Three of the fifth connectors 162 can be electrically connected with one of the sixth connectors 163 through the internal wires of the adapter board 161, and the other three of the fifth connectors 162 can be electrically connected with the other sixth connector 163 through the internal wires of the adapter board 161. The two sixth connectors 163 can be in a backup relationship.

[0100] The backboard 120 is provided with two seventh connectors 125, and the two seventh connectors 125 are electrically connected with the two sixth connectors 163 respectively. The external power supply and the backboard 120 are electrically connected through the fifth connector 162, the adapter board 161, the sixth connector 163 and the seventh connector 125, so as to provide electric energy for the power module 110 on the backboard 120.

[0101] The adapter board 161 can be mounted on the power supply outgoing copper bar 1412 and the grounding outgoing copper bar 1422 through fasteners. It should be noted that the adapter board 161 is mechanically connected with the power supply outgoing copper bar 1412 and the grounding outgoing copper bar 1422, and is electrically isolated from the power supply outgoing copper bar 1412 and the grounding outgoing copper bar 1422.

[0102] By mounting the adapter board 161 on the power supply outgoing copper bar 1412 and the grounding outgoing copper bar 1422, no additional components are needed to fix the adapter board 161, so that the structure of the power supply device 100 can be simplified.

[0103] Please continue to refer to FIG. 12 and FIG. 13, the power supply input module 160 further comprises a cable 164, one end of the cable 164 is electrically connected with the sixth connector 163 on the adapter plate 161, and the other end of the cable 164 is electrically connected with the seventh connector 125 on the back plate 120. By electrically connecting the back plate 120 and the adapter plate 161 through the cable 164, the length of the cable 164 can be flexibly adjusted according to the distance between the back plate 120 and the adapter plate 161.

[0104] Next, the assembly process of the power supply device 100 is described.

[0105] The liquid inlet pipe 131, the liquid outlet pipe 132, the liquid inlet main pipe 133 and the liquid outlet main pipe 134 are installed together through the first mounting bracket 137 and the second mounting bracket 138 to form the liquid cooling module 130.

[0106] The back plate 120 is fixed on the liquid cooling module 130 through the fastener.

[0107] The power supply adapter copper bar 1411 and the power supply lead-out copper bar 1412 are assembled to form the power supply assembly 141, and the grounding adapter copper bar 1421 and the grounding lead-out copper bar 1422 are assembled to form the grounding assembly.

[0108] The power supply adapter copper bar 1411 and the grounding adapter copper bar 1421 are connected with the back plate 120, and the power supply lead-out copper bar 1412 and the grounding lead-out copper bar 1422 are connected with the pipe wall of the liquid inlet pipe 131 (or the liquid outlet pipe 132).

[0109] The adapter plate 161 is connected with the power supply adapter copper bar 1411 and the grounding adapter copper bar 1421, and the sixth connector 163 is electrically connected with the seventh connector 125 through the cable 164.

[0110] The plurality of power supply modules 120 are inserted on the back plate 120, and thus the assembly of the power supply device 100 is completed. The power supply device 100 has a compact structure and a small volume.

[0111] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms “mounting”, “connecting”, “connecting” should be understood in a broad sense, for example, it can be fixedly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0112] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the embodiments of the present application are described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power supply device characterized by comprising: The backboard, a plurality of power modules, a liquid cooling module and a power output module, the backboard includes a first plate surface and a second plate surface opposite along a first direction, a plurality of the power modules are located on the first plate surface, each of the power modules has a first liquid inlet and a first liquid outlet; the liquid cooling module is located on the second plate surface, the liquid cooling module includes a liquid inlet pipe and a liquid outlet pipe; The backboard has a plurality of through holes, the liquid inlet pipe has a plurality of second liquid inlets, the second liquid inlets pass through the through holes on the backboard to be inserted with the first liquid inlet; the liquid outlet pipe has a plurality of second liquid outlets, the second liquid outlets pass through the through holes on the backboard to be inserted with the first liquid outlet; The power output module is located on one side of the second plate surface, one end of the power output module is electrically connected with the backboard, the other end of the power output module extends across the liquid cooling module along the first direction to supply power to the computing node.

2. The power supply device according to claim 1, characterized by The liquid cooling module further includes a liquid inlet main pipe and a liquid outlet main pipe, the liquid inlet main pipe and the liquid outlet main pipe are oppositely arranged along a second direction, and the liquid inlet main pipe and the liquid outlet main pipe both extend along a third direction; The number of the liquid inlet pipe and the liquid outlet pipe is a plurality, and the liquid inlet pipe and the liquid outlet pipe both extend along the second direction, each of the liquid inlet pipe is connected with the liquid inlet main pipe; each of the liquid outlet pipe is connected with the liquid outlet main pipe, wherein the first direction, the second direction and the third direction have an included angle between each other.

3. The power supply device according to claim 2, characterized by The liquid cooling module further includes a first mounting rack and a second mounting rack, the first mounting rack and the second mounting rack are located at both ends of the liquid cooling module along the second direction, the first mounting rack is used for connecting the liquid inlet main pipe, the liquid inlet pipe and the liquid outlet pipe at one end of the second direction; the second mounting rack is used for connecting the liquid outlet main pipe, the liquid outlet pipe and the liquid inlet pipe at the other end of the second direction.

4. The power supply device according to claim 2 or 3, characterized by, The power output module includes a power supply assembly and a grounding assembly, the power supply assembly includes a power supply adapter copper bar and a power supply lead-out copper bar, the grounding assembly includes a grounding adapter copper bar and a grounding lead-out copper bar; The grounding adapter copper bar and the power supply adapter copper bar are both arranged on the second plate surface and are both electrically connected with the backboard, the power supply adapter copper bar is oppositely arranged with the grounding adapter copper bar along the third direction; The power supply adapter copper bar extends across the liquid cooling module along the first direction to be electrically connected with the power supply lead-out copper bar; The grounding adapter copper bar extends across the liquid cooling module along the first direction to be electrically connected with the grounding lead-out copper bar.

5. The power supply device according to claim 4, wherein The number of the power supply adapter copper bar is a plurality, a plurality of the power supply adapter copper bars are arranged along the second direction, the power supply lead-out copper bar extends along the second direction to make each of the power supply adapter copper bars be electrically connected with the power supply lead-out copper bar; The number of the grounding adapter copper bar is a plurality, a plurality of the grounding adapter copper bars are arranged along the second direction, the grounding lead-out copper bar extends along the second direction to make each of the grounding adapter copper bars be electrically connected with the grounding lead-out copper bar.

6. The power supply device according to claim 5, wherein The power supply outgoing copper bar comprises a first bending part connected with the liquid inlet pipe and / or the liquid outlet pipe, and the grounding outgoing copper bar comprises a second bending part connected with the liquid inlet pipe and / or the liquid outlet pipe.

7. The power supply device of claim 6, wherein The first bending part and the second bending part are embedded with a first insulation part, the liquid inlet pipe and / or the liquid outlet pipe are embedded with a second insulation part, and the power supply device further comprises a first fastener penetrating the first insulation part and the second insulation part.

8. The power supply device of claim 4, wherein, The power supply assembly further comprises a power supply lug, one end of the power supply lug being connected with the power supply outgoing copper bar, and the other end of the power supply lug being used for electrically connecting with a computing node; the grounding assembly further comprises a grounding lug, one end of the grounding lug being connected with the grounding outgoing copper bar, and the other end of the grounding lug being used for electrically connecting with a computing node.

9. The power supply device of claim 4, wherein, The power supply device further comprises a power supply input module, the power supply input module comprising an adapter plate and a cable, the adapter plate being connected with the power supply outgoing copper bar and the grounding outgoing copper bar; one end of the cable being electrically connected with the adapter plate, and the other end of the cable being electrically connected with the backboard.

10. A computing device, comprising: The cabinet comprises a cabinet body, a plurality of computing nodes and a power supply device as claimed in any one of claims 1 to 9, the power supply device and the plurality of computing nodes being located in the cabinet body, and the power supply device being used for supplying power to the computing nodes.

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