Environment-friendly smart card

Abstract

Provided in the present application is an environment-friendly smart card, comprising a card substrate and a chip module embedded in the card substrate, wherein the card substrate comprises a first substrate layer, a second substrate layer and a functional layer sandwiched between the first substrate layer and the second substrate layer, the functional layer comprising a base layer and a coil embedded in the base layer, the coil being connected to the chip module, and the functional layer being bonded to the first substrate layer and the second substrate layer by means of first adhesive layers; the chip module is bonded to the card substrate by means of a second adhesive layer; and the first substrate layer, the second substrate layer and the base layer are made of an environment-friendly material, the adhesive force of each of the first adhesive layers is greater than or equal to 0.5 N / mm, and the adhesive force of the second adhesive layer is greater than or equal to 0.5 N / mm2. In the present application, the first substrate layer, the second substrate layer and the base layer are made of an environment-friendly material, and the matching first adhesive layers and second adhesive layer are provided, such that the adhesive force of each of the first adhesive layers is greater than or equal to 0.5 N / mm, and the adhesive force of the second adhesive layer is greater than or equal to 0.5 N / mm2, thereby satisfying the bonding strength and also improving the environmental friendliness and reducing carbon emissions.

Description

Environment-friendly smart card TECHNICAL FIELD

[0001] The present application relates to the technical field of smart cards, and in particular to an environment-friendly smart card. BACKGROUND

[0002] A smart card is a medium that can be used to identify an individual and store information about the individual. Various smart cards, such as work cards, identity cards, various financial transaction cards, membership cards, and the like, have been widely used in people's lives.

[0003] Most of the existing smart card base materials are traditional PVC plastics that are not degradable. Burning will produce toxic gases such as hydrogen chloride (HCl), carbon monoxide (CO), carbon dioxide (CO2), and benzene ring-containing compounds, and will cause a great burden on the environment after being discarded. With the gradual improvement of the living standards of consumers, the demand of consumers for the environmental friendliness of smart card materials and their personalization is also increasing. Therefore, there is an urgent need for an environment-friendly smart card and a preparation method. SUMMARY

[0004] In view of the above technical problems, the present application provides an environment-friendly smart card, which is friendly to the environment and can reduce carbon emissions.

[0005] The present application provides an environment-friendly smart card, which comprises a card base and a chip module embedded in the card base. The card base comprises a first substrate layer, a second substrate layer, and a functional layer sandwiched between the first substrate layer and the second substrate layer. The functional layer comprises a base layer and a coil embedded in the base layer. The coil is connected to the chip module. The functional layer is adhered to the first substrate layer and the second substrate layer by a first adhesive layer. The chip module is adhered to the card base by a second adhesive layer. The materials of the first substrate layer, the second substrate layer, and the base layer are environment-friendly materials. The adhesive force of the first adhesive layer is greater than or equal to 0.5 N / mm, and the adhesive force of the second adhesive layer is greater than or equal to 0.5 N / mm. 2 .

[0006] According to an embodiment of the present application, the environment-friendly material includes, but is not limited to, one or more of polyethylene terephthalate-1,4-cyclohexane dimethanol, recycled polyethylene terephthalate-1,4-cyclohexane dimethanol, polylactic acid, and recycled polyvinyl chloride.

[0007] According to an embodiment of the present application, the first adhesive layer has the following raw material components in mass fraction: resin, 15%-25%; crosslinking agent, 5%-10%; photoinitiator, 1%-3%; solvent, 50%-70%; pigment, 5%-20%; and optional additives, 1%-5%.

[0008] According to an embodiment of the present application, the resin includes one or more of polyvinyl chloride resin and ester resin.

[0009] According to embodiments of the present application, the solvent includes one or more of toluene, ethyl acetate.

[0010] According to embodiments of the present application, the optional additive includes one or more of a leveling agent, a defoaming agent, a diluent, a thickening agent, an antioxidant.

[0011] According to embodiments of the present application, the crosslinking agent includes one or more of 2,5-dimethyl-2,5-di-tert-butylperoxyhexane, dicumyl peroxide, vinyltriethoxysilane.

[0012] According to embodiments of the present application, the material of the first substrate layer and the second substrate layer is polyethylene terephthalate-1,4-cyclohexane dimethanol or recycled polyethylene terephthalate-1,4-cyclohexane dimethanol, and the hot melt adhesive of the second adhesive layer is formed by PES-THA-CT1 hot melt adhesive; or,

[0013] The material of the first substrate layer and the second substrate layer is polylactic acid, and the second adhesive layer has the following raw material components in mass fraction:

[0014] Acrylate copolymer: 35%-65%; thermal stabilizer: 3%-7%; viscosity regulator: 15%-30%; pigment and other additives: 2%-5%.

[0015] According to embodiments of the present application, the material of the first substrate layer and the second substrate layer is recycled polyvinyl chloride.

[0016] According to embodiments of the present application, the first substrate layer includes a first substrate sheet, a first printed layer on a side of the first substrate sheet away from the functional layer, and a first film layer on a side of the first printed layer away from the functional layer; and / or, the second substrate layer includes a second substrate sheet, a second printed layer on a side of the second substrate sheet away from the functional layer, and a second film layer on a side of the second printed layer away from the functional layer.

[0017] According to embodiments of the present application, the first substrate layer further includes a first base white ink layer between the first printed layer and the first film layer.

[0018] The second substrate layer further includes a second base white ink layer between the second printed layer and the second film layer.

[0019] According to embodiments of the present application, the first substrate layer further includes a magnetic stripe disposed on a side of the second film layer away from the functional layer.

[0020] According to embodiments of the present application, a surface of at least one of the first substrate layer and the second substrate layer is provided with a three-dimensional graphic; and / or, the card base is in a regular or irregular shape.

[0021] The application provides an environment-friendly smart card, comprising a card base and a chip module embedded in the card base, the card base comprising a first substrate layer, a second substrate layer and a functional layer sandwiched between the first substrate layer and the second substrate layer, the functional layer comprising a base layer and a coil embedded in the base layer, the coil being connected with the chip module, and the functional layer being bonded with the first substrate layer and the second substrate layer through a first adhesive layer; the chip module is bonded with the card base through a second adhesive layer; the first substrate layer and the second substrate layer are made of environment-friendly materials, and the bonding strength of the first adhesive layer and the second adhesive layer is greater than or equal to 0.5 N / mm 2 In the application, the first substrate layer and the second substrate layer and the base layer are made of environment-friendly materials, and are matched with the first adhesive layer and the second adhesive layer, so that the bonding strength of the first adhesive layer is greater than or equal to 0.5 N / mm, and the bonding strength of the second adhesive layer is greater than or equal to 0.5 N / mm 2 , which meets the bonding strength and improves the environment-friendly degree and reduces carbon emissions. BRIEF DESCRIPTION OF DRAWINGS

[0022] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the application and, together with the specification, serve to explain the principles of the application. In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced below, and obviously, other drawings can also be obtained by those skilled in the art without creative labor.

[0023] Fig. 1 is a cross-sectional schematic view of an environment-friendly smart card according to an embodiment of the application;

[0024] Fig. 2 is a cross-sectional schematic view of an environment-friendly smart card according to another embodiment of the application;

[0025] Fig. 3 is a cross-sectional schematic view of an environment-friendly smart card according to another embodiment of the application;

[0026] Fig. 4 is a cross-sectional schematic view of an environment-friendly smart card according to another embodiment of the application.

[0027] The reference signs are: 10, card base; 20, chip module; 1, first substrate layer; 11, first substrate; 12, first printing layer; 13, first film layer; 14, first base white ink layer; 2, second substrate layer; 21, second substrate; 22, second printing layer; 23, second film layer; 24, second base white ink layer; 3, functional layer; 31, base layer; 32, coil; 4, first adhesive layer; 5, second adhesive layer.

[0028] The objectives, functional characteristics and advantages of the present application will be further described in conjunction with the embodiments with reference to the accompanying drawings. The above-described drawings have shown the specific embodiments of the present application, and will be described in more detail hereinafter. These drawings and the written description are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0029] The exemplary embodiments will be described in detail herein with reference to the accompanying drawings. The following description is presented in connection with the drawings so as to illustrate the present application. However, the present application is not intended to be limited to the embodiments disclosed herein, but is intended to include all modifications and equivalents thereof within the spirit and scope of the present application.

[0030] It should be noted that, in the present document, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element. Furthermore, components, features, elements with the same name in different embodiments of the present application can have the same meaning or different meanings, and the specific meaning thereof should be determined in the explanation of the specific embodiment or further in conjunction with the context of the specific embodiment.

[0031] It should be understood that although the terms first, second, third, etc. can be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another type of information. For example, without departing from the scope of the present document, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information.

[0032] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0033] The inventors of the present application have noticed that common smart cards are mostly made of PVC, which is not environmentally friendly. In order to improve environmental friendliness, the present application provides an environmentally friendly smart card, which is environmentally friendly and can reduce carbon emissions.

[0034] Referring to FIG. 1, the environmentally-friendly smart card provided by the embodiment of the present application comprises a card base 10 and a chip module 20 embedded in the card base 10. The card base 10 comprises a first substrate layer 1, a second substrate layer 2 and a functional layer 3 sandwiched between the first substrate layer 1 and the second substrate layer 2. The functional layer 3 comprises a base layer 31 and a coil 32 embedded in the base layer. The coil 32 is connected with the chip module 20. The functional layer 3 is adhered to the first substrate layer 1 and the second substrate layer 2 respectively by a first adhesive layer 4. The chip module 20 is adhered to the card base 10 by a second adhesive layer 5. The first substrate layer 1, the second substrate layer 2 and the base layer 31 are made of environmentally-friendly materials. The adhesive force of the first adhesive layer is greater than or equal to 0.5 N / mm. The adhesive force of the second adhesive layer is greater than or equal to 0.5 N / mm. 2 .

[0035] In the embodiment of the present application, the environmentally-friendly smart card is composed of the card base 10 and the chip module 20. The chip module 20 is embedded in the card base 10. The card base 10 is composed of the first substrate layer 1, the second substrate layer 2 and the functional layer 3. The functional layer 3 is sandwiched between the first substrate layer 1 and the second substrate layer 2. The chip module 20 is the core component of the environmentally-friendly smart card, which is used to store information and is protected by the card base 10.

[0036] The functional layer 3 is composed of the base layer 31 and the coil 32 embedded in the base layer 31. The base layer 31 protects the coil 32. The coil 32 is connected with the chip module 20.

[0037] The first substrate layer 1 and the second substrate layer 2 can be made of the same environmentally-friendly material or different environmentally-friendly materials. The present application does not make any limitation in this regard.

[0038] The chip module 20 is located in the first substrate layer 1 or the second substrate layer 2 in the card base, but not in the functional layer 3.

[0039] The first substrate layer 1 is adhered to the functional layer 3 by the first adhesive layer. The second substrate layer 2 is adhered to the functional layer 3 by the first adhesive layer. The adhesive force of the first adhesive layer is greater than or equal to 0.5 N / mm. In the present application, the first adhesive layer can be selected to match the environmentally-friendly materials of the first substrate layer 1 and the second substrate layer 2, so that the adhesive force of the first adhesive layer is greater than or equal to 0.5 N / mm, thereby improving the strength and service life of the environmentally-friendly smart card.

[0040] The chip module 20 is adhered to the card base 10 by the second adhesive layer 5. The adhesive force of the second adhesive layer is greater than or equal to 0.5 N / mm. 2 In the present application, the second adhesive layer 5 can be selected to match the environmentally-friendly materials, so that the adhesive force of the second adhesive layer is greater than or equal to 0.5 N / mm, thereby improving the strength and service life of the environmentally-friendly smart card. 2

[0041] ​The first adhesive layer 4 covers at least a partial area of the first substrate layer 1 projected on the functional layer 3; and the second adhesive layer 5 covers at least a partial area of the second substrate layer 2 projected on the functional layer 3.

[0042] In the present application, the first substrate layer 1, the second substrate layer 2 and the base layer 31 are made of environmentally friendly materials, and matched with the first adhesive layer 4 and the second adhesive layer 5, so that the bonding force of the first adhesive layer 4 is greater than or equal to 0.5 N / mm, and the bonding force of the second adhesive layer 5 is greater than or equal to 0.5 N / mm 2 , which meets the bonding strength and can improve the environmental friendliness and reduce carbon emissions.

[0043] In some embodiments, the environmentally friendly materials include, but are not limited to, one or more of poly(ethylene terephthalate-co-1,4-cylclohexylenedimethylene terephthalate) (PETG), recycled poly(ethylene terephthalate-co-1,4-cylclohexylenedimethylene terephthalate) (rPETG), polylactic acid (PLA), and recycled polyvinyl chloride (rPVC).

[0044] Poly(ethylene terephthalate-co-1,4-cylclohexylenedimethylene terephthalate) (PETG) is a non-crystalline copolyester with thermoplasticity, which can be reformed when heated after molding, so it can be recycled as rPETG for reuse, and can be used multiple times to reduce carbon emissions.

[0045] Polylactic acid (PLA), also known as poly(lactide), is a polyester polymerized from lactic acid. Polylactic acid has excellent biodegradability, compatibility and absorbability. Polylactic acid is a non-toxic and non-irritating synthetic polymer material, and its raw material is lactic acid, mainly from starch (such as corn, rice) fermentation, and can also be obtained from cellulose, kitchen waste or fish waste. PLA has a wide range of sources, and products made from it can be directly composted or incinerated after use, and ultimately completely reduced CO2 and H2O, meeting the requirements of sustainable development.

[0046] Recycled polyvinyl chloride (rPVC) is recycled polyvinyl chloride (PVC). Recycling PVC not only solves the environmental problem, but also relieves the pressure of this resource shortage.

[0047] Therefore, PETG, rPETG, PLA and rPVC can all be used as environmentally friendly materials for making the first substrate layer 1, the second substrate layer 2 and the base layer of the functional layer 3.

[0048] In some embodiments, the environmentally friendly material can also include one or more of polyhydroxyalkanoates, poly-3-hydroxybutyrate, polymethyl ethylene carbonate, polybutylene succinate, polycaprolactone, polybutylene adipate / terephthalate, polyethylene glycol, acrylate, and other degradable materials.

[0049] In some embodiments, the first adhesive layer has the following raw material components by mass fraction: resin, 15%-25%; aromatic solvent, 50%-70%; pigment, 5%-20%; and optional additives, 1%-5%.

[0050] In some embodiments, the first adhesive layer has the following raw material components by mass fraction: resin, 15%-25%; aromatic solvent, 50%-70%; pigment, 5%-20%; and optional additives, 1%-5%.

[0051] Preparation of raw materials: including selection and preparation of the above raw material components; formulation adjustment: mixing the various raw materials according to the above formulation ratio; stirring and adjustment: stirring and adjusting the mixed formulation to achieve the desired viscosity and flowability; filter screen filtration: filtering the adjusted glue through a filter screen to remove impurities and particles, thereby obtaining the first adhesive layer-forming glue to be used.

[0052] In some embodiments, the resin includes one or more of polyvinyl chloride resin, ethylene ester resin.

[0053] In some embodiments, the cross-linking agent includes one or more of 2,5-dimethyl-2,5-di-tert-butyl peroxide hexane, diisopropylbenzene peroxide, and vinyl triethoxysilane.

[0054] In some embodiments, the solvent includes one or more of toluene and ethyl acetate.

[0055] In some embodiments, the optional additives include one or more of leveling agents, defoamers, diluents, thickening agents, and antioxidants.

[0056] The optional additive is a diluent, or a thickening agent, or a mixture of a thickening agent and an antioxidant, and can be selected and added according to the performance requirements of the glue, which is not specifically limited in this application.

[0057] The diluent, thickening agent and antioxidant can be selected from commonly used substances in the art, which are not specifically limited herein.

[0058] In some embodiments, when the material of the first substrate layer 1 and the second substrate layer 2 is rPVC, the second adhesive layer 5 can be formed of the same hot melt adhesive as that used for ordinary PVC materials.

[0059] In some embodiments, when the material of the first substrate layer 1 and the second substrate layer 2 is rPETG or PETG, the hot melt adhesive of the second adhesive layer can be formed of PES-THA-CT1 hot melt adhesive. The inventors of the present application have found through a large number of experiments that rPETG and PETG are suitable for PES-THA-CT1 hot melt adhesive, and compared with the hot melt adhesive used for PVC, the hot melt adhesive has the characteristics of lower processing temperature, greater adhesion and better toughness, and the use on PETG can make the environmentally friendly smart card meet the relevant requirements of ISO on the adhesion of the chip of the chip card and complete testing.

[0060] PES-THA-CT1 has the following raw material components in mass fraction: EVA resin: 40%-50%, synthetic rubber: 10%-25%, stearic acid (stearate): 10%-25%, antioxidant: 1%-3%, additives, fillers or pigments: 5%.

[0061] In some embodiments, when the material of the first substrate layer and the second substrate layer is PLA, the second adhesive layer has the following raw material components in mass fraction:

[0062] Acrylate copolymer: 35%-65%; thermal stabilizer: 3%-7%; viscosity modifier: 15%-30%; pigments and other additives: 2%-5%.

[0063] Exemplarily, the thermal stabilizer includes 2,6-di-tert-butyl-4-methylphenol; the viscosity modifier includes one or more of acetone, toluene, and ethyl acetate.

[0064] When the material of the first protective layer 31 and the second protective layer 32 is PLA, the acrylate forming the second adhesive layer has the following main production steps:

[0065] Mix the acrylate copolymer and the solvent, heat to a certain temperature, and fully dissolve. Add the stabilizer and stir uniformly. Apply the mixture to the double-sided adhesive paper or other substrate. Place the coated substrate in an oven to dry and remove the solvent; combine the two substrates to form a second adhesive layer in the form of double-sided adhesive tape for use.

[0066] In some embodiments, the material of the first substrate layer 1 and the second substrate layer 2 is rPVC.

[0067] The rPVC has good strength, and the first substrate layer 1 and the second substrate layer 2 can be made of rPVC material, which can improve the environmental protection and the wear resistance of the environmentally friendly smart card.

[0068] Referring to FIG. 2, in some embodiments, the first substrate layer 1 includes a first substrate 11, a first printing layer 12, and a first film layer 13. The first substrate 11 is bonded to the functional layer 3 through a first adhesive layer. The first printing layer 12 is located on a side of the first substrate 11 away from the functional layer 3. The first film layer 13 is located on a side of the first printing layer 12 away from the functional layer 3.

[0069] The first substrate 11 is bonded to the functional layer 3 through a first adhesive layer. The first printing layer 12 is located on a side of the first substrate 11 away from the functional layer 3. The first film layer 13 is located on a side of the first printing layer 12 away from the functional layer 3.

[0070] The first substrate 11, the first printing layer 12, and the first film layer 13 can be made of the environmentally friendly material described above to improve the environmental protection. The first printing layer 12 can be used for printing patterns, and the first film layer 13 can be used for packaging.

[0071] In some embodiments, the second substrate layer 2 includes a second substrate 21, a second printing layer 22, and a second film layer 23. The second substrate 21 is bonded to the functional layer 3 through a first adhesive layer. The second printing layer 22 is located on a side of the second substrate 21 away from the functional layer 3. The second film layer 23 is located on a side of the second printing layer 22 away from the functional layer 3.

[0072] The second substrate 21, the second printing layer 22, and the second film layer 23 can be made of the environmentally friendly material described above to improve the environmental protection. The second printing layer 22 can be used for printing patterns, and the second film layer 23 can be used for packaging.

[0073] In some embodiments, when the first substrate layer 1 and the second substrate layer 2 are made of PLA, PETG, or rPETG, etc., the first substrate layer 1 and the second substrate layer 2 can be colored substrates. This can improve the observability and the recognizability.

[0074] Referring to FIG. 3, in some embodiments, the first substrate layer 1 further includes a first white ink layer 14, and the second substrate layer 2 further includes a second white ink layer 24. The first white ink layer 14 is located between the first printing layer 12 and the first film layer 13. The second white ink layer 24 is located between the second printing layer 22 and the second film layer 23.

[0075] For PLA, PETG, or rPETG, etc., it is difficult to print patterns on the first substrate 11 or the second substrate 21 by silk printing, mainly due to the following reasons:

[0076] The environmentally friendly material itself has poor printing adaptability. Direct printing may cause the printed patterns to be damaged due to the failure of the ink to be printed, and the poor adhesion of the ink may cause the patterns to be blurred. Printing a white ink layer can effectively solve this problem.

[0077] After the direct printing of eco-friendly materials, poor ink adhesion can result in weak peeling force between the surface layer film and the printed substrate after lamination, and even does not meet the requirements of relevant card organizations such as UnionPay, ISO, and CQM. This problem can be effectively solved by silk-screen printing white ink as a primer.

[0078] For colored eco-friendly materials, a white ink primer is needed to avoid interference of the colored material itself with the printed graphics, so as to better achieve the color effect desired by the customer.

[0079] To achieve better silk-screen printing results, the following method is used: first, print a white ink primer layer on the substrate as a white base layer, and then perform ordinary silk-screen printing to print the corresponding graphics.

[0080] The white ink primer used is mainly two types: one is solvent-based silk-screen white ink, and the other is UV-curable silk-screen white ink.

[0081] Solvent-based silk-screen white ink is a type of silk-screen ink based on organic solvents, and the composition ratio includes:

[0082] Resin: Resin is the main component of solvent-based silk-screen white ink, which is used to provide the viscosity, adhesion, and durability of the ink. Resin can be acrylic resin, polyester resin, alkyd resin, etc., accounting for 20%-25%.

[0083] Solvent: Solvent is used to dissolve the resin and adjust the flowability and drying speed of the ink. Common organic solvents include butanone, toluene, ethyl acetate, etc., accounting for 45%-50%.

[0084] Pigment: Pigment is used to provide the required color and hiding power of the ink. Organic or inorganic pigments such as titanium dioxide and carbon black are commonly used, accounting for 15%-25%.

[0085] Additives: Additives are used to improve the properties of the ink, such as leveling agents to improve the flatness of the coating, stabilizers to prevent sedimentation, etc., accounting for 5%-10%.

[0086] UV-curable silk-screen white ink is a type of silk-screen ink that uses ultraviolet radiation for rapid curing, and the composition ratio includes:

[0087] Resin: Acrylic resin, ketone carbonate resin, and acrylate resin are commonly used to provide curing properties and viscosity control of the ink, accounting for 40%-60%.

[0088] Photosensitizer: Photosensitizer is a key ingredient for rapid curing, which can absorb ultraviolet light and initiate chemical reactions. Common photosensitizers include benzoyl formate, acrylate photosensitizers, etc., accounting for 5%-10%.

[0089] Filler: Fillers are commonly used to adjust the rheological properties of the ink and increase the firmness of the coating. Common fillers include titanium dioxide, calcium carbonate, etc., accounting for 25%-35%.

[0090] Auxiliary agent: Common auxiliary agents include diluents, leveling agents, anti-adhesion agents, etc., used to adjust the viscosity, flowability and process performance of the ink, accounting for 3%-6%.

[0091] The main production process of both solvent-based silk screen white ink and UV-curable silk screen white ink:

[0092] Material preparation: Prepare the required raw materials such as resin, photosensitizer, filler and auxiliary agent, etc., and ensure that their quality and purity meet the requirements.

[0093] Formulation: Mix the resin, photosensitizer, filler and auxiliary agent, etc. in a certain order according to the predetermined formulation ratio. Stirring equipment can be used to mix the raw materials thoroughly.

[0094] Grinding and filtering: Grind and filter the mixed ink to remove impurities and improve the quality and stability of the ink.

[0095] Packaging and storage: Pack the prepared ink into appropriate containers and seal them for storage. The ink should be stored in a dry, light-proof and low-temperature environment to maintain its quality and performance.

[0096] Printing silk screen white ink can increase the anti-aging performance of the card. Compared with cards without printing silk screen white ink, the peeling force between the surface film layer and the printing substrate of cards with printed white ink is generally larger than that of cards without printed white ink after aging test.

[0097] In some embodiments, the first substrate layer 1 also includes a magnetic stripe, which is disposed on the side of the second film layer 23 away from the functional layer 3. The magnetic stripe is used for its function, which is usually used to record the cardholder's account number and other related data.

[0098] When the first substrate layer 1 is made of environmentally friendly materials such as rPVC, PETG, rPETG, etc., the magnetic stripe can share the same magnetic stripe as the PVC material in the prior art. When the first substrate layer 1 is made of PLA, a special PLA magnetic stripe can be used, and the hot melt adhesive composition used in the special PLA magnetic stripe is a hot melt adhesive rod, which mainly includes the following components:

[0099] Hot melt adhesive resin: Hot melt adhesive resin is the main component of hot melt adhesive, which is usually synthetic resin, such as polyethylene, polypropylene, polyester, etc. These resins have good bonding properties and plasticity, can quickly melt after heating, and form a solid bond after cooling and solidification, accounting for 40%-50%.

[0100] Filler: In order to improve the performance of hot melt adhesive, filler is often added in hot melt adhesive. Filler can increase the viscosity of hot melt adhesive, reduce cost, improve temperature resistance, etc. Common fillers include silica powder, talc powder, glass fiber, etc., accounting for 20%-35%.

[0101] Adhesion aid: In order to enhance the adhesion between hot melt adhesive and magnetic stripe, substrate, some adhesion aids are often used. These aids can improve the adhesion of hot melt adhesive, reduce surface tension, and increase its adhesion to different materials, accounting for about 10%-15%.

[0102] In some embodiments, the surface of at least one of the first substrate layer 1 and the second substrate layer 2 is provided with a three-dimensional graphic.

[0103] The three-dimensional graphic can be located on the surface of the first substrate 11 layer away from the functional layer 3, or on the surface of the second substrate 21 layer away from the functional layer 3, or can be provided through from one side to the other side of the first substrate 11 layer and the second substrate 21 layer. The three-dimensional graphic can be a pattern or a number, which can improve the identifiability of the environmentally friendly smart card.

[0104] The card base can be rectangular or other regular shape, please refer to Figure 4, in some embodiments, the two sides of the card base are provided with bevel. The bevel setting can improve the identifiability of the environmentally friendly smart card.

[0105] Embodiment 1

[0106] An environmentally friendly smart card, comprising: a card base and a chip module embedded in the card base, the card base comprising a first substrate layer, a second substrate layer and a functional layer sandwiched between the first substrate layer and the second substrate layer, the functional layer being adhered to the first substrate layer and the second substrate layer by a first adhesive layer; the functional layer comprising a base layer and a coil embedded in the base layer;

[0107] The materials of the first substrate layer, the second substrate layer, the first protective layer and the second protective layer are environmentally friendly material PLA;

[0108] The raw material components of the first adhesive layer are: polyvinyl chloride resin, 18%; crosslinking agent, hydrogen peroxide, 5%; photoinitiator, benzophenone, 2%; toluene solvent, 68%; pigment, 5%; defoamer, 1%; leveling agent, 1%.

[0109] The raw material components of the second adhesive layer are: polyacrylate resin, 50-60%; thickening agent, 3-5%; filler, 5-10%; antioxidant and ultraviolet light resistant agent, 1-3%; solvent, 25-35%.

[0110] The adhesion of the first adhesive layer is 0.8 N / mm, and the adhesion of the second adhesive layer is 0.9 N / mm 2 .

[0111] Embodiment 2

[0112] An environment-friendly smart card, comprising: a card base and a chip module embedded in the card base, the card base comprising a first substrate layer, a second substrate layer and a functional layer sandwiched between the first substrate layer and the second substrate layer, the functional layer being bonded to the first substrate layer and the second substrate layer by a first adhesive layer; the functional layer comprising a base layer and a coil embedded in the base layer;

[0113] The first substrate layer, the second substrate layer, the first protective layer and the second protective layer are made of environment-friendly recycled polyvinyl chloride.

[0114] The raw material components of the first adhesive layer include: ethylene ester resin, 22%; crosslinking agent 2,5-dimethyl-2,5 di-tert-butyl peroxide hexane, 8%; photoinitiator benzophenone 2%; ethyl acetate solvent, 61%; pigment, 5%; defoaming agent, 1%; leveling agent, 1%.

[0115] The raw material components of the second adhesive layer include: polyacrylate resin, 50-60%; thickening agent, 3-5%; filler, 5-10%; antioxidant and ultraviolet resistant agent, 1-3%; solvent, 25-35%.

[0116] The bonding force of the first adhesive layer is 1 N / mm, and the bonding force of the second adhesive layer is greater than 0.8 N / mm. 2 The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An environmentally friendly smart card, characterized in that, The application relates to a card and a chip module embedded in the card, the card comprises a first substrate layer, a second substrate layer and a functional layer sandwiched between the first substrate layer and the second substrate layer, the functional layer comprises a base layer and a coil embedded in the base layer, the coil is connected with the chip module, the functional layer is bonded with the first substrate layer and the second substrate layer through a first adhesive layer, and the chip module is bonded with the card through a second adhesive layer. The environment-friendly material comprises one or more of polyethylene terephthalate-1,4-cyclohexane dimethanol, recycled polyethylene terephthalate-1,4-cyclohexane dimethanol, polylactic acid and recycled polyvinyl chloride. The material of the first substrate layer, the second substrate layer and the base layer is an environmentally friendly material, the bonding force of the first adhesive layer is greater than or equal to 0.5 N / mm, and the bonding force of the second adhesive layer is greater than or equal to 0.5 N / mm 2 .

2. The environmentally friendly smart card of claim 1, wherein, The first adhesive layer comprises the following raw material components in mass fraction:

3. The environmentally friendly smart card of claim 1, wherein, Resin, 15%-25%; crosslinking agent, 5%-10%; photoinitiator, 1%-3%; solvent, 50%-70%; pigment, 5%-20%; and optional additive, 1%-5%. The resin comprises one or more of polyvinyl chloride resin and ethylene ester resin; and / or, 4. The environmentally friendly smart card of claim 3, wherein, The crosslinking agent comprises one or more of 2,5-dimethyl-2,5 di-tert-butyl peroxide hexane, diisopropylbenzene peroxide and vinyl triethoxysilane; and / or, The solvent comprises one or more of toluene and ethyl acetate; and / or, The optional additive comprises one or more of leveling agent, defoaming agent, diluent, thickening agent and antioxidant. The first substrate layer and the second substrate layer are made of polyethylene terephthalate-1,4-cyclohexane dimethanol or recycled polyethylene terephthalate-1,4-cyclohexane dimethanol, and the second adhesive layer is formed by PES-THA-CT1 hot melt adhesive; or, 5. The environmentally friendly smart card of claim 1, wherein, The first substrate layer and the second substrate layer are made of polylactic acid, and the second adhesive layer comprises the following raw material components in mass fraction: Acrylate copolymer, 35%-65%; heat stabilizer, 3%-7%; viscosity regulator, 15%-30%; pigment and other additives, 2%-5%. The first substrate layer and the second substrate layer are made of recycled polyvinyl chloride.

6. The environmentally friendly smart card of claim 1, wherein, The first substrate layer comprises a first substrate sheet bonded with the functional layer through the first adhesive layer, 7. The environmentally friendly smart card according to any one of claims 1 to 6, characterized in that, A first printing layer located on a side of the first substrate sheet away from the functional layer, and a first film layer located on a side of the first printing layer away from the functional layer; and / or, The second substrate layer comprises a second substrate sheet bonded with the functional layer through the first adhesive layer, a second printing layer located on a side of the second substrate sheet away from the functional layer, and a second film layer located on a side of the second printing layer away from the functional layer. The first substrate layer further comprises a first base white ink layer located between the first printing layer and the first film layer.

8. The environmentally friendly smart card of claim 7, wherein, The second substrate layer further comprises a second base white ink layer located between the second printing layer and the second film layer. The first substrate layer further comprises a magnetic strip arranged on a side of the second film layer away from the functional layer.

9. The environmentally friendly smart card of claim 7, wherein, ​ 10. The environmentally friendly smart card of claim 7, wherein, The surface of at least one of the first substrate layer and the second substrate layer is provided with stereoscopic graphics; and / or, The card base is in a regular or irregular shape.

Images