Laser machining head and laser machining apparatus

Abstract

Disclosed in the present invention are a laser machining head (10) and a laser machining apparatus (20). The laser machining head (10) comprises a first laser emitter (100), a second laser emitter (200), a mirror assembly (400) and a galvanometer assembly (500). The first laser emitter (100) is used for emitting first laser beams; the second laser emitter (200) is used for emitting second laser beams; the mirror assembly (400) is arranged corresponding to the first laser emitter (100) and the second laser emitter (200) and is used for receiving the first laser beams and the second laser beams and emitting same; and the galvanometer assembly (500) is arranged corresponding to the mirror assembly (400) and is used for receiving the first laser beams and the second laser beams and emitting same onto a workpiece for workpiece machining.

Description

Laser processing head and laser processing device

[0001] The present application claims priority to Chinese Patent Application No. 202420813684.6, filed on April 18, 2024, entitled "Laser processing head and laser processing device" and Chinese Patent Application No. 202520444406.2, filed on March 13, 2025, entitled "Laser processing head and laser processing device", the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of laser processing, in particular to a laser processing head and a laser processing device. BACKGROUND

[0003] The laser processing device uses a high-energy laser beam to cut, weld, engrave, heat treat, and perform other processing on a material or a material surface. Compared with traditional mechanical processing, the processing head of the laser processing device does not directly contact the workpiece, and the workpiece is not easily damaged. At the same time, the laser has high energy and a small spot, and the processing efficiency is high.

[0004] In related technologies, the laser processing head of the laser processing device includes a laser emitter and a galvanometer assembly. The laser emitter directly emits a laser beam to the galvanometer assembly, and the galvanometer assembly reflects the laser beam at a predetermined angle to the workpiece to process the workpiece. However, the current laser processing head cannot meet the user's demand for processing more different materials of workpieces, nor can it meet the user's demand for different power processing beams. SUMMARY

[0005] The present application provides a laser processing head and a laser processing device, which can emit different types of laser beams and / or generate laser beams with different powers, thereby better meeting the user's demand for processing more different materials of workpieces and the demand for different power processing beams.

[0006] In a first aspect, the present application provides a laser processing head, comprising:

[0007] a first laser emitter, configured to emit a first laser beam;

[0008] a second laser emitter, configured to emit a second laser beam;

[0009] a mirror assembly, corresponding to the first laser emitter and the second laser emitter, configured to receive the first laser beam and the second laser beam and emit them;

[0010] a galvanometer assembly, corresponding to the mirror assembly, configured to receive the first laser beam and the second laser beam and emit them to a workpiece to process the workpiece.

[0011] In the laser processing head, the mirror assembly comprises a first mirror and a first beam combiner, the first mirror is arranged in the emission light path of the first laser emitter and is configured to reflect the first laser beam to the first beam combiner.

[0012] The first beam combiner is configured to reflect the first laser beam reflected by the first mirror to the galvanometer assembly.

[0013] In the laser processing head, the mirror assembly further comprises a second mirror, the second mirror is arranged in the emission light path of the second laser emitter and is configured to reflect the second laser beam to the first beam combiner.

[0014] The first beam combiner is further arranged in the reflection light path of the second mirror, and the first beam combiner is further configured to transmit the second laser beam reflected by the second mirror to the galvanometer assembly.

[0015] In the laser processing head, the mirror assembly comprises a second beam combiner, the second beam combiner is arranged in the emission light paths of the first laser emitter and the second laser emitter, and the second beam combiner is configured to reflect the first laser beam to the galvanometer assembly and transmit the second laser beam emitted by the second laser emitter to the galvanometer assembly.

[0016] In the laser processing head, the galvanometer assembly comprises a first galvanometer and a second galvanometer, the first galvanometer is rotatable about a first axis, and the second galvanometer is rotatable about a second axis, the first axis and the second axis are perpendicular.

[0017] The first galvanometer is arranged in the output light path of the mirror assembly and is configured to receive the first laser beam and the second laser beam output by the mirror assembly and reflect them to the second galvanometer, and the second galvanometer is configured to receive the first laser beam and the second laser beam output by the first galvanometer and reflect them to output to the workpiece.

[0018] In the laser processing head, the galvanometer assembly further comprises a first driving member and a second driving member, the first driving member is connected with the first galvanometer and is configured to drive the first galvanometer to rotate about the first axis, and the second driving member is connected with the second galvanometer and is configured to drive the second galvanometer to rotate about the second axis.

[0019] In the laser processing head, the first laser beam and the second laser beam are beams of different types; and / or, the first laser beam and the second laser beam are beams of different powers.

[0020] In the laser processing head, the emission light path of the first laser emitter and the emission light path of the second laser emitter are perpendicular.

[0021] In the laser processing head, the laser processing head further comprises a beam adjusting assembly, the beam adjusting assembly is connected with the second laser emitter, and the beam adjusting assembly is used for adjusting the angle and / or spot size of the second laser beam.

[0022] In the laser processing head, the beam adjusting assembly comprises an angle adjusting component, the second laser emitter is supported and connected on the angle adjusting component, and the angle adjusting component is used for adjusting the exit angle of the second laser beam.

[0023] In the laser processing head, the second laser emitter has opposite front and tail ends along the laser exit direction, the angle adjusting component comprises a positioning seat and an adjusting seat, the front end of the second laser emitter is arranged on the positioning seat, the positioning seat is used for positioning the position of the front end of the second laser emitter in the front-rear direction, and the tail end of the second laser emitter is arranged on the adjusting seat, and the adjusting seat is used for adjusting the position of the tail end of the second laser emitter in a plane perpendicular to the front-rear direction.

[0024] In the laser processing head, the positioning seat comprises a first seat body and a positioning bolt arranged on the first seat body, the front end of the second laser emitter is arranged on the first seat body, and the front end of the second laser emitter is rotationally connected with the positioning bolt.

[0025] In the laser processing head, the adjusting seat comprises a second seat body and two groups of adjusting bolts, the two groups of adjusting bolts comprise two first adjusting bolts extending in the up-down direction and two second adjusting bolts extending in the left-right direction, the two first adjusting bolts and the two second adjusting bolts are rotationally installed on the second seat body, the two first adjusting bolts can move in the up-down direction relative to the second seat body, and the two second adjusting bolts can move in the left-right direction relative to the second seat body.

[0026] In the laser processing head, the beam adjusting assembly comprises a beam expanding component, the beam expanding component is connected at the exit end of the second laser emitter, and is used for adjusting the spot size of the second laser beam.

[0027] In the laser processing head, the beam expanding component comprises:

[0028] a first lens barrel;

[0029] a second lens barrel, the second lens barrel is connected at the exit end of the second laser emitter;

[0030] a first beam expanding lens, the first beam expanding lens is installed on the first lens barrel;

[0031] a second beam expanding lens, the second beam expanding lens is installed on the second lens barrel;

[0032] The first lens barrel and the second lens barrel are telescopically connected, so that the relative distance between the first beam expanding lens and the second beam expanding lens can be adjusted.

[0033] In the laser processing head, the beam adjusting assembly comprises an angle adjusting component, the second laser emitter has opposite front and rear ends in the laser emission direction, the angle adjusting component comprises a positioning seat and an adjusting seat, the front end of the second laser emitter is arranged on the positioning seat, the positioning seat is used to position the position of the front end of the second laser emitter in the front-rear direction, the rear end of the second laser emitter is arranged on the adjusting seat, the adjusting seat is used to adjust the position of the rear end of the second laser emitter in the plane perpendicular to the front-rear direction, and the second lens barrel is arranged on the positioning seat.

[0034] In the laser processing head, the laser processing head further comprises a dustproof cover and a focusing mirror, the focusing mirror is connected with the dustproof cover and surrounds a dustproof chamber, the galvanometer assembly is arranged in the dustproof chamber, and the focusing mirror is used to receive the laser beam output by the galvanometer assembly and focus.

[0035] In the laser processing head, the dustproof cover is provided with a light transmission hole, the light transmission hole is arranged on the output light path of the mirror assembly, so that the laser output by the mirror assembly can reach the galvanometer assembly.

[0036] In the laser processing head, the dustproof cover is provided with a light transmission hole, the light transmission hole is arranged on the output light path of the mirror assembly, so that the laser output by the mirror assembly can reach the galvanometer assembly.

[0037] In the laser processing head, the dustproof cover is provided with a light transmission hole, the light transmission hole is arranged on the output light path of the mirror assembly, so that the laser output by the mirror assembly can reach the galvanometer assembly.

[0038] The laser processing head and the laser processing equipment provided by the application, the laser processing head comprises a first laser emitter and a second laser emitter, by setting the type and / or power of the laser beams emitted by the first laser emitter and the second laser emitter, different types of laser beams and / or different power laser beams can be emitted by the laser processing head, so that the demand of the user for processing more different materials and the demand for different power processing beams can be better met.

[0039] Moreover, by arranging the mirror assembly, the light paths of the first laser emitter and the second laser emitter are combined, so that the laser beams output by the first laser emitter and the second laser emitter can be combined and output to the galvanometer assembly, and the galvanometer assembly outputs the combined laser to the workpiece to process the workpiece, so that the processing effect of the laser processing head can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0040] FIG. 1 is a schematic view of the internal structure of the laser processing head according to an embodiment of the application.

[0041] Fig. 2 is an exploded schematic view of the structure shown in Fig. 1.

[0042] Fig. 3 is a schematic view of trajectories of laser light emitted by two laser emitters in the structure shown in Fig. 1.

[0043] Fig. 4 is a schematic view of trajectories of laser light emitted by two laser emitters in another embodiment.

[0044] Fig. 5 is a schematic view of a structure of a galvanometer assembly in the structure shown in Fig. 1.

[0045] Fig. 6 is a schematic view of a light beam adjusting assembly connected to a second laser emitter in the structure shown in Fig. 1.

[0046] Fig. 7 is an exploded schematic view of a beam expander in the structure shown in Fig. 6.

[0047] Fig. 8 is a schematic view of a laser processing apparatus in an embodiment of the present application.

[0048] Reference signs are explained as follows: 10 - laser processing head; 20 - laser processing apparatus; 201 - worktable; 202 - support assembly; 100 - first laser emitter; 200 - second laser emitter; 300 - light beam adjusting assembly; 310 - angle adjusting component; 311 - positioning seat; 3111 - first seat body; 3112 - positioning bolt; 312 - adjusting seat; 3121 - second seat body; 3122 - first adjusting bolt; 3123 - second adjusting bolt; 320 - beam expander; 321 - first beam expander lens; 322 - second beam expander lens; 323 - first lens barrel; 324 - second lens barrel; 400 - mirror assembly; 410 - first mirror; 420 - first beam combiner; 430 - second mirror; 440 - second beam combiner; 500 - galvanometer assembly; 510 - first galvanometer; 520 - second galvanometer; 530 - first driving member; 540 - second driving member; 600 - focusing mirror; 700 - dust cover; 710 - light passage hole; 800 - mounting platform. DETAILED DESCRIPTION

[0049] The present application provides a laser processing head and a laser processing apparatus. To make the objectives, technical solutions and effects of the present application clearer and more explicit, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0050] Please refer to FIG. 1, the laser processing head 10 of the embodiment of the present application includes a first laser emitter 100 and a second laser emitter 200, and a mirror assembly 400 and a galvanometer assembly 500. The first laser emitter 100 is used for emitting a first laser beam, and the second laser emitter 200 is used for emitting a second laser beam. The mirror assembly 400 is correspondingly arranged with the first laser emitter 100 and the second laser emitter 200, and is used for receiving the first laser beam and / or the second laser beam and emitting. The galvanometer assembly 500 is correspondingly arranged with the mirror assembly 400, and is used for receiving the first laser beam and / or the second laser beam and emitting to a workpiece to process the workpiece.

[0051] Since the laser processing head 10 includes the first laser emitter 100 and the second laser emitter 200, by setting the type and / or power of the laser beams emitted by the first laser emitter 100 and the second laser emitter 200, the laser processing head 10 can emit laser beams of different types and / or laser beams of different powers, thereby better meeting the needs of users to process more different materials of workpieces and the needs of different power processing beams.

[0052] In addition, by setting the mirror assembly 400, the light paths of the first laser emitter 100 and the second laser emitter 200 are combined, so that the laser beams output by the first laser emitter 100 and the second laser emitter 200 can be combined and output to the galvanometer assembly 500, and the galvanometer assembly 500 then emits the combined laser to the workpiece to process the workpiece, thereby facilitating improvement of the processing effect of the laser processing head 10.

[0053] In addition, since the laser beams emitted by the laser emitters are not directly emitted to the galvanometer assembly 500, but are emitted to the galvanometer assembly 500 through the mirror assembly 400, due to the presence of the mirror assembly 400, when at least two laser emitters are arranged in the laser processing head 10, the arrangement of each laser emitter is more free and is not limited by the position of the galvanometer assembly 500. For example, as shown in FIG. 2, the emission light path of the first laser emitter 100 and the emission light path of the second laser emitter 200 are perpendicular. The mirror assembly 400 can combine the light paths of the first laser emitter 100 and the second laser emitter 200, so that the laser beams output by the first laser emitter 100 and the second laser emitter 200 can be combined and output to the galvanometer assembly 500, so that the structure layout is more compact.

[0054] In a possible embodiment of the present application, as shown in FIG. 1 and FIG. 2, the mirror assembly 400 includes a first mirror 410 and a first beam combiner 420, the first mirror 410 is arranged in the light path of the first laser emitter 100 and is used to reflect the first laser beam to the first beam combiner 420. The first beam combiner 420 is used to reflect the first laser beam reflected by the first mirror 410 to the galvanometer assembly 500.

[0055] The mirror assembly 400 further includes a second mirror 430, the second mirror 430 is arranged in the light path of the second laser emitter 200 and is used to reflect the second laser beam to the first beam combiner 420. The first beam combiner 420 is also arranged in the reflected light path of the second mirror 430, and the first beam combiner 420 is also used to transmit the second laser beam reflected by the second mirror 430 to the galvanometer assembly 500.

[0056] It can be understood that in the present embodiment, as shown in FIG. 3, the first laser beam emitted by the first laser emitter 100 is reflected to the galvanometer assembly 500 through the first mirror 410 and the first beam combiner 420, while the second laser beam emitted by the second laser emitter 200 is reflected by the second mirror 430 and transmitted by the first beam combiner 420 to exit to the galvanometer assembly 500. Since the first laser emitter 100 and the second laser emitter 200 share the first beam combiner 420, that is, both of them are arranged to exit the laser beams to the galvanometer assembly 500 through the first beam combiner 420, and the first beam combiner 420 can both reflect the first laser beam and transmit the second laser beam, the number of lenses can be reduced, the space volume required by the mirror assembly 400 can be saved, and the internal structure of the laser processing head 10 can be arranged more compactly.

[0057] In addition, when adjusting the beam angle of each laser emitter reflected to the galvanometer assembly 500, the beam angle of the first laser beam can be adjusted by adjusting the angle of the first mirror 410, and the beam angle of the second laser beam can be adjusted by adjusting the angle of the second mirror 430, that is, the first laser emitter 100 and the second laser emitter 200 do not share a mirror, and the light paths of the two are independent and do not interfere with each other, so the light exit angles of the two laser emitters at the galvanometer assembly 500 can be better adjusted.

[0058] In another possible embodiment of the present application, referring to FIG. 4, the mirror assembly 400 includes a second beam combiner 440, which is arranged in the light path of the first laser emitter 100 and the second laser emitter 200, and is configured to reflect the first laser beam to the galvanometer assembly 500 and transmit the second laser beam emitted by the second laser emitter 200 to the galvanometer assembly 500. It can be understood that in this embodiment, the second beam combiner 440 is located in the reflection path of the first laser emitter 100 and in the transmission path of the second laser emitter 200. Since the first laser emitter 100 and the second laser emitter 200 share the second beam combiner 440, i.e., the second beam combiner 440 can reflect the first laser beam and transmit the second laser beam, the number of lenses can be reduced. In this embodiment, only one lens is used to combine the beams of the two lasers and output to the galvanometer assembly 500, which saves the space volume required by the mirror assembly 400 and makes the internal structure of the laser processing head 10 more compact.

[0059] Referring to FIG. 5, in one possible embodiment of the present application, the galvanometer assembly 500 includes a first galvanometer 510 and a second galvanometer 520. The first galvanometer 510 can rotate around a first axis, and the second galvanometer 520 can rotate around a second axis. The first axis and the second axis are perpendicular. By designing the first galvanometer 510 and the second galvanometer 520 as structures with adjustable angles, different positions of the consumable can be processed. Specifically, by adjusting the angles of the first galvanometer 510 and the second galvanometer 520, the direction of the laser beam can be adjusted in the vertical direction and the horizontal direction, so that the laser beam acts on different positions of the consumable.

[0060] The first galvanometer 510 is arranged in the output light path of the mirror assembly 400, and is configured to receive the first laser beam and / or the second laser beam output by the mirror assembly 400 and reflect them to the second galvanometer 520. The second galvanometer 520 is configured to receive the first laser beam and / or the second laser beam output by the first galvanometer 510 and reflect them to output to the workpiece. Specifically, the first galvanometer 510 is configured to receive the first laser beam and / or the second laser beam reflected by the first beam combiner 420 and reflect the first laser beam and / or the second laser beam to the second galvanometer 520 at a predetermined angle. Alternatively, the first galvanometer 510 is configured to receive the first laser beam and / or the second laser beam reflected by the second beam combiner 440 and reflect the first laser beam and / or the second laser beam to the second galvanometer 520 at a predetermined angle. The deflection of the first galvanometer 510 can change the position of the laser beam output to the second galvanometer 520, so that the light spot output to the workpiece moves in a first direction. The deflection of the second galvanometer 520 can make the light spot output to the workpiece move in a second direction. The first direction and the second direction are perpendicular, and the first axis and the second axis are perpendicular.

[0061] Referring to FIG. 5, in order to conveniently adjust the angles of the first galvanometer 510 and the second galvanometer 520, the galvanometer assembly 500 further comprises a first driving member 530 and a second driving member 540, the first driving member 530 is connected with the first galvanometer 510 and used to drive the first galvanometer 510 to rotate around the first axis, and the second driving member 540 is connected with the second galvanometer 520 and used to drive the second galvanometer 520 to rotate around the second axis.

[0062] In order to improve the processing effect of the laser processing head 10, referring to FIG. 2, the laser processing head 10 further comprises a focusing mirror 600, the focusing mirror 600 is arranged in the output light path of the second galvanometer 520, and the focusing mirror 600 is used to receive the first laser beam and / or the second laser beam output by the second galvanometer 520 and focus the first laser beam and / or the second laser beam to be emitted to the workpiece. By arranging the focusing mirror 600, the laser beam can be focused, thereby improving the processing effect.

[0063] Referring to FIG. 2 and FIG. 5, in order to ensure the processing effect of the workpiece, it is necessary to ensure the intensity of the laser acting on the workpiece and prevent dust from covering the galvanometer assembly 500 during use, therefore the laser processing head 10 further comprises a dust cover 700, the focusing mirror 600 is connected with the dust cover 700 and encloses a dustproof chamber, and the first galvanometer 510 and the second galvanometer 520 are arranged in the dustproof chamber. It can be understood that, in order to ensure that the first driving member 530 and the second driving member 540 can smoothly drive the first galvanometer 510 and the second galvanometer 520, the dust cover 700 is further provided with a first through hole and a second through hole, the first driving member 530 passes through the first through hole and is connected with the first galvanometer 510, and the second driving member 540 passes through the second through hole and is connected with the second galvanometer 520.

[0064] Further, as shown in FIG. 2, the dust cover 700 is provided with a light passing hole 710, the light passing hole 710 is arranged on the output light path of the mirror assembly 400, and the light passing hole 710 is used for the mirror assembly 400 to output the laser beam to the first galvanometer 510. By arranging the light passing hole 710 on the dust cover 700, it can be ensured that the laser beam output by the mirror assembly 400 can be smoothly emitted to the first galvanometer 510.

[0065] In a possible embodiment of the present application, the first laser beam and the second laser beam are beams of different types. And / or, the first laser beam and the second laser beam are beams of different powers.

[0066] In the present application, the first laser emitter 100 and the second laser emitter 200 can emit different types of laser, i.e. the first laser beam and the second laser beam are different types of laser beams, for example, the first laser beam is blue light and the second laser beam is red light, since different types of laser beams are suitable for different types of consumables, the user can select the corresponding laser beam according to the type of consumables. Alternatively, the first laser beam is blue light and the second laser beam is infrared light.

[0067] Alternatively, the first laser emitter 100 and the second laser emitter 200 can emit the same type of laser, and the power of the first laser beam and the second laser beam can be the same or different, and the user can select laser beams with different processing power by respectively enabling the first laser emitter 100 or the second laser emitter 200 to process the workpiece, or the user can simultaneously enable the first laser emitter 100 and the second laser emitter 200, and the laser beams emitted by the two laser emitters can be superimposed to generate a laser with greater power, thereby meeting the user's demand for greater power laser.

[0068] In the present application, as shown in FIG. 2, in one embodiment, the first laser emitter 100 can be a ruby laser, a YAG laser, a semiconductor laser and the like commonly used for laser processing. The second laser emitter 200 can be a fiber laser, a semiconductor laser and the like. In one embodiment, the first laser emitter 100 is a semiconductor laser and the second laser emitter 200 is a fiber laser, and the laser output by the second laser emitter 200 can be transmitted through an optical fiber, so that the laser can be transmitted and applied over a longer distance, thereby making the internal structure of the laser processing head 10 more reasonable.

[0069] Referring to FIG. 2, in one embodiment of the present application, the laser processing head 10 further comprises a beam adjusting assembly 300, which is connected with the second laser emitter 200 and used for adjusting the angle and / or spot size of the second laser beam. In the present embodiment, by providing the beam adjusting assembly 300, the laser emission angle and / or spot size of one of the laser emitters can be adjusted to make the beam combination effect with the other laser emitter better, thereby improving the processing effect of the laser processing head 10.

[0070] As shown in FIG. 2, in one embodiment, the beam adjusting assembly 300 comprises an angle adjusting component 310, the second laser emitter 200 is supported and connected to the angle adjusting component 310, and the angle adjusting component 310 is used for adjusting the emission angle of the second laser beam, so as to make the optical path of the second laser beam and the first laser beam combined, so that they can better share the optical path and ensure the processing precision.

[0071] As shown in FIG. 6, for example, the second laser emitter 200 has opposite front and rear ends along the laser emission direction, and the angle adjusting component 310 includes a positioning seat 311 and an adjusting seat 312. The front end of the second laser emitter 200 is arranged at the positioning seat 311, and the positioning seat 311 is used to position the front end of the second laser emitter 200 in the front-rear direction. The rear end of the second laser emitter 200 is arranged at the adjusting seat 312, and the adjusting seat 312 is used to adjust the position of the rear end of the second laser emitter 200 in a plane perpendicular to the front-rear direction.

[0072] For ease of description, the laser emission direction of the second laser 200 is defined as the front-rear direction, and the laser emission end of the second laser emitter 200 is defined as the front, and vice versa, as shown in FIG. 6. In addition, each direction in the plane perpendicular to the front-rear direction is defined as the up-down, left-right direction.

[0073] When it is necessary to adjust the emission angle of the second laser beam of the second laser emitter 200, the positioning seat 311 fixes the position of the front end of the second laser emitter 200 in the front-rear direction, and the adjusting seat 312 adjusts the position of the rear end of the second laser emitter 200 in the up-down, left-right direction, so as to adjust the emission angle of the second laser beam emitted by the second laser emitter 200.

[0074] It can be understood that there are many ways to position the front end of the second laser emitter 200 in the front-rear direction by the positioning seat 311, which is not limited in the present application. For example, the positioning seat 311 can rotate the front end of the second laser emitter 200 and fix the position of the front end of the second laser emitter 200 in the front-rear direction. As shown in FIGS. 6 and 7, the positioning seat 311 includes a first seat body 3111 and a positioning bolt 3112 arranged on the first seat body 3111, the front end of the second laser emitter 200 is arranged on the first seat body 3111, and the front end of the second laser emitter 200 is rotationally connected with the positioning bolt 3112. The positioning bolt 3112 can be two, and the two positioning bolts 3112 extend in the up-down, left-right direction, respectively. Thus, the first seat body 3111 and the two positioning bolts 3112 thereon can rotate the front end of the second laser emitter 200 around the up-down, left-right direction, while the front end of the second laser emitter 200 cannot move in the front-rear direction. In this way, the position of the rear end of the second laser emitter 200 in the up-down, left-right direction can be moved, that is, the two positioning bolts 3112 act as fulcrums, so that the optical path of the second laser emitter 200 is not easily changed when the adjusting seat 312 adjusts the emission angle of the second laser emitter 200.

[0075] It can be understood that there are various ways to adjust the position of the tail end of the second laser emitter 200 in the up-down and left-right directions by adjusting the adjusting seat 312, which is not limited in the present application. For example, as shown in FIG. 2 and FIG. 6, the adjusting seat 312 can include a second seat body 3121 and two sets of adjusting bolts, i.e., two first adjusting bolts 3122 extending in the up-down direction and two second adjusting bolts 3123 extending in the left-right direction. The two first adjusting bolts 3122 and the two second adjusting bolts 3123 are rotatably mounted on the second seat body 3121, the two first adjusting bolts 3122 can move in the up-down direction relative to the second seat body 3121, and the two second adjusting bolts 3123 can move in the left-right direction relative to the second seat body 3121. The two first adjusting bolts 3122 and the two second adjusting bolts 3123 can respectively abut against the tail end of the second laser emitter 200 to drive the tail end of the second laser emitter 200 to move in the up-down and left-right directions.

[0076] When it is necessary to adjust the emission angle of the laser beam of the second laser emitter 200, the tail end of the second laser emitter 200 can be moved in the up-down direction by the two first adjusting bolts 3122, and the tail end of the second laser emitter 200 can be moved in the up-down and left-right directions by the two second adjusting bolts 3123, so that the tail end of the second laser emitter 200 can swing up-down and left-right relative to the front end, thereby realizing that the emission angle of the laser beam of the second laser emitter 200 can be adjusted up-down and left-right. Of course, in other embodiments, the number of adjusting bolts is not limited to the number shown in FIG. 2, and can be determined according to the specific situation.

[0077] In other embodiments, the adjusting seat 312 can also adopt other structures capable of adjusting the position of the tail end of the second laser emitter 200 in the up-down and left-right directions. For example, the position of the adjusting seat 312 can be adjusted up-down and left-right, and the tail end of the second laser emitter 200 is fixedly connected to the adjusting seat 312. Therefore, the adjusting seat 312 can adjust the position of the tail end of the second laser emitter 200 in the up-down and left-right directions. That is, the adjusting seat 312 can slide.

[0078] In some other embodiments, the positioning seat 311 can also adjust the front end of the second laser emitter 200, for example, adjust the height of the front end in the up-down direction and / or adjust the position of the front end in the left-right direction. The positioning seat 311 can include a seat body and adjusting bolts provided on the seat body, and the adjusting bolts can be two, which are provided on the left side and the bottom, respectively. The adjusting bolt on the left side is used to adjust the position of the front end of the second laser emitter 200 in the left-right direction, and the adjusting bolt on the bottom is used to adjust the position of the front end of the second laser emitter 200 in the up-down direction, thereby adjusting the angle of the second laser emitter 200.

[0079] Referring to FIGS. 6 and 7, in an embodiment, the light beam adjusting assembly 300 further comprises a beam expander 320 connected to the exit end of the second laser emitter 200 for adjusting the spot size of the second laser beam to reduce the difference between the first laser beam and the second laser beam. For example, as shown in FIG. 7, the beam expander 320 comprises a first beam expander lens 321 and a second beam expander lens 322, and a first lens barrel 323 for mounting the first beam expander lens 321 and a second lens barrel 324 for mounting the second beam expander lens 322. The second lens barrel 324 is connected to the exit end of the second laser emitter 200, and the first lens barrel 323 is telescopically connected to the second lens barrel 324 to enable adjustment of the relative distance between the first beam expander lens 321 and the second beam expander lens 322, thereby achieving adjustment of the spot size. In some embodiments, the second lens barrel 324 can be provided on the positioning seat 311. That is, the two positioning bolts 3112 on the first seat body 3111 can act on the second lens barrel 324 to enable the second lens barrel 324 to rotate about the up-down and left-right directions, thereby achieving rotation of the front end of the second laser emitter 200.

[0080] In an embodiment, the first beam expander lens 321 can be a convex lens, and the second beam expander lens 322 can be a concave lens. By adjusting the relative distance between the first beam expander lens 321 and the second beam expander lens 322, the beam expansion multiple of the second laser beam can be controlled. For example, increasing the relative distance between the first beam expander lens 321 and the second beam expander lens 322 increases the beam expansion multiple, and decreasing the relative distance between the first beam expander lens 321 and the second beam expander lens 322 decreases the beam expansion multiple, thereby enabling adjustment of the spot size.

[0081] Therefore, when it is necessary to adjust the spot size of the laser beam emitted by the second laser emitter 200, the first lens barrel 323 is telescopically moved relative to the second lens barrel 324 in the front-back direction, thereby enabling adjustment of the spot size of the laser beam emitted by the second laser emitter 200.

[0082] As shown in FIGS. 6 and 7, the first lens barrel 323 is telescopically connected to the end of the second lens barrel 324 away from the second laser emitter 200, that is, the first lens barrel 323 is telescopically connected to the front end of the second lens barrel 324. It can be understood that there can be various ways to telescopically move the first lens barrel 323 relative to the second lens barrel 324 in the front-back direction, which are not limited in the present application. For example, as shown in FIG. 7, the rear end of the first lens barrel 323 can be provided with external threads, and the front end of the second lens barrel 324 can be correspondingly provided with internal threads matching the external threads, so that the first lens barrel 323 and the second lens barrel 324 can be telescopically connected through the cooperation of the external threads and the internal threads. Of course, in other embodiments, other structures capable of telescopically connecting the first lens barrel 323 and the second lens barrel 324 can also be used, such as a sliding rail and sliding groove cooperation.

[0083] In some embodiments of the present application, the second laser emitter 200 is a fiber laser, and the beam adjusting assembly 300 is designed to adjust the angle and spot size of the laser beam emitted by the second laser emitter 200, so that the second laser emitter 200 and the first laser emitter 100 can be combined better, thereby improving the processing effect of the laser processing head 10.

[0084] Referring to FIG. 1, in a possible embodiment of the present application, the laser processing head 10 further comprises a mounting platform 800, and the first laser emitter 100, the second laser emitter 200, the mirror assembly 400 and the galvanometer assembly 500 are all mounted on the mounting platform 800. It should be noted that in the present embodiment, the second laser emitter 200 is movably mounted on the mounting platform 800 through the aforementioned angle adjusting component 310. The first laser emitter 100, the mirror assembly 400 and the galvanometer assembly 500 are all relatively fixedly mounted on the mounting platform 800.

[0085] Referring to FIG. 8, the present application further provides a laser processing device 20, comprising a workbench 201 and the laser processing head 10 as described in any one of the above, the workbench 201 is used to carry a workpiece, and the laser processing head 10 is used to process the workpiece on the workbench 201.

[0086] In an embodiment, as shown in FIG. 8, the laser processing device 20 further comprises a support assembly 202, one end of the support assembly 202 is connected to the laser processing head 10, and the other end of the support assembly 202 is connected to the workbench 201, and the laser processing head 10 and the workbench 201 are oppositely arranged; the laser processing head 10 is slidably arranged on the support assembly 202 to adjust the distance between the laser processing head 10 and the workbench 201. Since the laser processing head 10 can slide on the support assembly 202, the focal point position of the laser processing head 10 can be adjusted more conveniently, and the processing effect on the workpiece is better.

[0087] The laser processing device 20 can be a laser engraving machine, a laser welding machine, a laser cutting machine or the like, which is not specifically limited herein.

[0088] The specific implementation of each operation can refer to the previous embodiments, which will not be repeated here. It can be understood that for those skilled in the art, the technical solutions and application concepts of the present application can be replaced or changed equivalently, and all these changes or replacements shall fall within the protection scope of the claims attached herewith.

Claims

1. A laser processing head, comprising: a first laser emitter configured to emit a first laser beam; a second laser emitter configured to emit a second laser beam; a mirror assembly corresponding to the first laser emitter and the second laser emitter, configured to receive the first laser beam and the second laser beam and emit them; a galvanometer assembly corresponding to the mirror assembly, configured to receive the first laser beam and the second laser beam and emit them to a workpiece to process the workpiece.

2. The laser machining head of claim 1, wherein, The mirror assembly comprises a first mirror and a first beam combiner, the first mirror is arranged in a light path of the first laser emitter and configured to reflect the first laser beam to the first beam combiner. The first beam combiner is configured to reflect the first laser beam reflected by the first mirror to the galvanometer assembly.

3. The laser machining head of claim 2, wherein, The mirror assembly further comprises a second mirror, the second mirror is arranged in a light path of the second laser emitter and configured to reflect the second laser beam to the first beam combiner. The first beam combiner is further arranged in a light path of the second mirror, and the first beam combiner is further configured to transmit the second laser beam reflected by the second mirror to the galvanometer assembly.

4. The laser machining head of claim 1, wherein, The mirror assembly comprises a second beam combiner, the second beam combiner is arranged in the light paths of the first laser emitter and the second laser emitter, and the second beam combiner is configured to reflect the first laser beam to the galvanometer assembly and transmit the second laser beam emitted by the second laser emitter to the galvanometer assembly.

5. The laser machining head according to any one of claims 1 to 4, wherein, The galvanometer assembly comprises a first galvanometer and a second galvanometer, the first galvanometer is rotatable about a first axis, and the second galvanometer is rotatable about a second axis, the first axis and the second axis are perpendicular. The first galvanometer is arranged in an output light path of the mirror assembly and configured to receive the first laser beam and the second laser beam output by the mirror assembly and reflect them to the second galvanometer, and the second galvanometer is configured to receive the first laser beam and the second laser beam output by the first galvanometer and reflect them to output to the workpiece.

6. The laser machining head of claim 5, wherein, The galvanometer assembly further comprises a first driving member and a second driving member, the first driving member is connected to the first galvanometer and configured to drive the first galvanometer to rotate about the first axis, and the second driving member is connected to the second galvanometer and configured to drive the second galvanometer to rotate about the second axis.

7. The laser machining head of any one of claims 1 to 6, wherein, The first laser beam and the second laser beam are beams of different types; and / or The first laser beam and the second laser beam are beams of different powers.

8. The laser machining head according to any one of claims 1 to 7, wherein, The light path of the first laser emitter and the light path of the second laser emitter are perpendicular.

9. The laser machining head of any one of claims 1 to 8, wherein, The laser processing head further comprises a beam adjusting assembly, the beam adjusting assembly is connected to the second laser emitter, and the beam adjusting assembly is configured to adjust an angle and / or a spot size of the second laser beam.

10. The laser machining head of claim 9, wherein, The light beam adjusting assembly comprises an angle adjusting component, and the second laser emitter is supported and connected to the angle adjusting component, and the angle adjusting component is used to adjust the exit angle of the second laser beam.

11. The laser machining head of claim 10, wherein, The second laser emitter has opposite front and tail ends along the laser exit direction, and the angle adjusting component comprises a positioning seat and an adjusting seat, the front end of the second laser emitter is arranged in the positioning seat, the positioning seat is used to position the position of the front end of the second laser emitter in the front and back direction, the tail end of the second laser emitter is arranged in the adjusting seat, and the adjusting seat is used to adjust the position of the tail end of the second laser emitter in the plane perpendicular to the front and back direction.

12. The laser machining head of claim 11, wherein, The positioning seat comprises a first seat body and a positioning bolt arranged on the first seat body, the front end of the second laser emitter is arranged in the first seat body, and the front end of the second laser emitter is rotationally connected with the positioning bolt.

13. The laser machining head of claim 11, wherein, The adjusting seat comprises a second seat body and two groups of adjusting bolts, the two groups of adjusting bolts comprise two first adjusting bolts extending in the up and down direction and two second adjusting bolts extending in the left and right direction, the two first adjusting bolts and the two second adjusting bolts are rotationally mounted on the second seat body, the two first adjusting bolts can move in the up and down direction relative to the second seat body, and the two second adjusting bolts can move in the left and right direction relative to the second seat body.

14. The laser machining head of claim 9, wherein, The light beam adjusting assembly comprises a beam expanding component connected at the exit end of the second laser emitter, which is used to adjust the spot size of the second laser beam.

15. The laser machining head of claim 14, wherein, The beam expanding component comprises: A first lens barrel; A second lens barrel connected at the exit end of the second laser emitter; A first beam expanding lens mounted on the first lens barrel; A second beam expanding lens mounted on the second lens barrel; The first lens barrel and the second lens barrel are telescopically connected to adjust the relative distance between the first beam expanding lens and the second beam expanding lens.

16. The laser machining head of claim 15, wherein, The light beam adjusting assembly comprises an angle adjusting component, and the second laser emitter has opposite front and tail ends along the laser exit direction, and the angle adjusting component comprises a positioning seat and an adjusting seat, the front end of the second laser emitter is arranged in the positioning seat, the positioning seat is used to position the position of the front end of the second laser emitter in the front and back direction, the tail end of the second laser emitter is arranged in the adjusting seat, and the adjusting seat is used to adjust the position of the tail end of the second laser emitter in the plane perpendicular to the front and back direction, and the second lens barrel is arranged in the positioning seat.

17. The laser machining head of any one of claims 1 to 16, wherein, The laser processing head further comprises a dust cover and a focusing mirror, the focusing mirror is connected with the dust cover and surrounds a dustproof chamber, the galvanometer assembly is arranged in the dustproof chamber, and the focusing mirror is used to receive the laser beam output by the galvanometer assembly and focus.

18. The laser machining head of claim 17, wherein, The dust cover is provided with a light passing hole, and the light passing hole is arranged on the output light path of the mirror assembly, so that the laser output by the mirror assembly can reach the galvanometer assembly.

19. A laser processing apparatus, comprising a worktable for carrying a workpiece and the laser processing head according to any one of claims 1 to 18 for processing the workpiece on the worktable.

20. The laser processing apparatus according to claim 19, wherein, The laser processing apparatus further comprises a support assembly, one end of the support assembly being connected to the laser processing head and the other end of the support assembly being connected to the worktable, the laser processing head and the worktable being oppositely arranged; the laser processing head is slidably arranged on the support assembly to adjust the distance between the laser processing head and the worktable.

20. The laser processing apparatus according to claim 19, wherein the support assembly comprises a first support assembly and a second support assembly, the first support assembly being connected to the laser processing head and the second support assembly being connected to the worktable, the first support assembly and the second support assembly being oppositely arranged; the first support assembly and the second support assembly are connected to each other by a connecting assembly, the connecting assembly being arranged to adjust the distance between the first support assembly and the second support assembly.

21. The laser processing apparatus according to claim 20, wherein the first support assembly and the second support assembly are connected to each other by a connecting assembly, the connecting assembly being arranged to adjust the distance between the first support assembly and the second support assembly.

22. The laser processing apparatus according to claim 20, wherein the first support assembly and the second support assembly are connected to each other by a connecting assembly, the connecting assembly being arranged to

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