Photovoltaic backplane processing apparatus and method, and photovoltaic backplane manufacturing method and apparatus

Abstract

Provided in the present application are a photovoltaic backplane processing apparatus and method, and a photovoltaic backplane manufacturing method and apparatus. The photovoltaic backplane processing apparatus comprises: a carrying table with a transfer surface, and a stripping mechanism and a laminating mechanism which are disposed on the carrying table. The transfer surface of the carrying table is used for transferring a conductive layer to sequentially pass by the stripping mechanism and the laminating mechanism, the stripping mechanism is used for stripping off an area to be stripped off in the conductive layer, and the laminating mechanism is used for laminating the conductive layer after stripping and a backplane provided with a bonding layer. The present application solves the problems in the prior art that during stripping of areas to be stripped off, said areas are prone to breakage and difficult to strip off, thereby improving product quality and production efficiency.

Description

Photovoltaic back plate processing equipment and method, and photovoltaic back plate preparation method and equipment

[0001] Cross-reference to Related Applications

[0002] The present disclosure claims priority to Chinese Patent Application No. 202410480484.8, filed on April 19, 2024, entitled "Photovoltaic Back Plate Processing Equipment and Method", Chinese Patent Application No. 202411356400.6, filed on September 26, 2024, entitled "Photovoltaic Back Plate Processing Equipment and Method", and Chinese Patent Application No. 202411868653.1, filed on December 17, 2024, entitled "Photovoltaic Back Plate Preparation Method and Equipment", all of which are incorporated by reference in their entirety in the present disclosure. TECHNICAL FIELD

[0003] The present application relates to the field of photovoltaic technology, in particular to a photovoltaic back plate processing equipment and method. BACKGROUND

[0004] In the production process of a photovoltaic back plate, a conductive layer is needed to be arranged on one side of the back plate, and a pattern structure for electrical isolation is needed to be drawn on the conductive layer to avoid short circuit when the photovoltaic back plate contacts the cell piece. After the pattern structure is drawn, some areas in the pattern structure of the conductive layer need to be peeled off.

[0005] At present, the complete conductive layer can be first bonded and hot-pressed with the back plate, and then a pattern structure is prepared on the conductive layer, and the excess area in the pattern structure is peeled off, so as to obtain a photovoltaic back plate for connecting with the cell piece.

[0006] However, since the conductive layer is bonded with the back plate firmly, part of the excess area is prone to breakage and difficult to peel off when the excess area in the pattern structure of the conductive layer is peeled off, which reduces the product quality and production efficiency.

[0007] When the cell piece in a photovoltaic module adopts a back contact cell piece, the cell pieces can be electrically connected through a conductive back plate. The conductive back plate usually includes a metal conductive layer, an adhesive film and a back plate.

[0008] In the related art, the preparation process of the conductive back plate includes: first, hot-pressing and laminating the complete metal conductive layer, the adhesive film and the back plate together, then preparing a pattern structure on the metal conductive layer, and finally peeling off the excess area in the pattern structure.

[0009] However, since the metal conductive layer is bonded with the back plate firmly, the excess area is prone to breakage and difficult to peel off when the excess area in the pattern structure is peeled off. SUMMARY

[0010] The application provides a photovoltaic backboard processing device and method to solve the problem of easy breakage and difficulty in peeling of the excess area in the conductive layer in the prior art, thereby reducing product quality and production efficiency.

[0011] To solve the above problems, the application is implemented as follows:

[0012] In a first aspect, the application provides a photovoltaic backboard processing device, comprising:

[0013] a carrier with a conveying surface, and a peeling mechanism and a compounding mechanism arranged on the carrier;

[0014] The conveying surface of the carrier is used to convey the conductive layer, so that the conductive layer passes through the peeling mechanism and the compounding mechanism in turn.

[0015] The peeling mechanism is used to peel the area to be peeled in the conductive layer, and the compounding mechanism is used to press the conductive layer after peeling and the backboard provided with an adhesive layer.

[0016] Optionally, the surface of the conductive layer is formed with a pattern structure, and the pattern structure has the area to be peeled; and the conveying surface of the carrier is provided with an adsorption device, and the adsorption device is used to adsorb the conductive layer.

[0017] Optionally, the pattern structure comprises: a plurality of areas arranged side by side along the width direction of the conductive layer, each of the areas comprises a plurality of spaced sub-areas connected in sequence at the head and tail, and the plurality of sub-areas are arranged in a bending manner in the area; and the sub-areas of the plurality of areas constitute the area to be peeled.

[0018] When the vacuum adsorption carrier adsorbs the conductive layer, a first adsorption hole arranged at intervals is arranged at a position corresponding to the outside of the long side of each area in the vacuum adsorption carrier, and a second adsorption hole arranged at intervals is arranged at a position corresponding to at least one group of adjacent sub-areas in each area.

[0019] The size of the second adsorption hole is smaller than the size of the first adsorption hole.

[0020] Optionally, the arrangement direction of the second adsorption hole is perpendicular to the arrangement direction of the first adsorption hole, and the interval distance between the second adsorption holes is smaller than the interval distance between the first adsorption holes.

[0021] Optionally, when the vacuum adsorption carrier adsorbs the conductive layer, the minimum distance between the edge of the second adsorption hole and the edge of the area to be peeled is 0.1mm to 2mm.

[0022] Optionally, the conveying surface of the carrier is provided with an adsorption device, which is used for adsorbing the conductive layer.

[0023] The peeling mechanism comprises a turnover device and a peeling device.

[0024] After the adsorption device adsorbs the conductive layer, the adsorption device moves to the turnover device, and the turnover device turns the adsorption device over for the first time, so that the side of the conductive layer away from the adsorption device faces the direction of gravity. After the adsorption device is turned over for the first time, the peeling device is located on the side of the conductive layer away from the adsorption device.

[0025] The peeling device is used to contact the side of the conductive layer away from the adsorption device after the adsorption device is turned over for the first time, so that the to-be-peeled area in the conductive layer is separated.

[0026] Optionally, the peeling mechanism further comprises:

[0027] a conveying device;

[0028] After the peeling device works, the turnover device turns the adsorption device over again, so that the side of the conductive layer away from the adsorption device faces away from the direction of gravity.

[0029] After the adsorption device is turned over again, the conveying device is used to grab the backboard provided with an adhesive layer placed on the feeding table, and to make the side of the backboard provided with the adhesive layer contact the side of the conductive layer away from the adsorption device.

[0030] Optionally, the peeling device comprises a hair dryer.

[0031] The air outlet direction of the hair dryer faces the side of the conductive layer away from the adsorption device, and the air outlet width of the hair dryer is greater than or equal to the width of the pattern structure in the conductive layer.

[0032] Optionally, the peeling device comprises a brush.

[0033] The brush is used to contact the side of the conductive layer away from the adsorption device, and the width of the brush is greater than or equal to the width of the pattern structure in the conductive layer.

[0034] Optionally, the peeling device comprises a roller.

[0035] The roller is used to contact the side of the conductive layer away from the adsorption device, and the width of the roller is greater than or equal to the width of the pattern structure in the conductive layer.

[0036] Optionally, the surface of the roller is provided with a flexible contact layer.

[0037] The flexible contact layer is provided with flexible convex structures at intervals.

[0038] Optionally, the photovoltaic backboard processing equipment further comprises a feeding and cutting device and a laser plate making device arranged on the loading platform.

[0039] The feeding and cutting device is arranged at a feeding end of the loading platform, and the laser plate making device is arranged between the feeding and cutting device and the peeling mechanism.

[0040] The feeding and cutting device is provided with a conductive layer roll, and the feeding and cutting device is used to lead one end of the conductive layer roll to the adsorption device on the transmission surface and cut the conductive layer.

[0041] The laser plate making device is used to laser draw the passing conductive layer to form the pattern structure on the surface of the conductive layer.

[0042] Optionally, the adsorption device is a vacuum adsorption plate.

[0043] The vacuum adsorption plate is provided with adsorption holes, and when the vacuum adsorption plate adsorbs the conductive layer, the positions of the adsorption holes and the to-be-peeled areas in the conductive layer do not overlap.

[0044] Optionally, the photovoltaic backboard processing equipment further comprises a visual detection device and a cleaning device.

[0045] The visual detection device and the cleaning device are arranged at a position behind the composite mechanism in the loading platform.

[0046] The visual detection device is used to collect and identify images of the conductive layer and the backboard after being compressed.

[0047] The cleaning device is used to remove residues when the residues are found in the to-be-peeled areas of the conductive layer.

[0048] In a second aspect, the embodiments of the present application provide a photovoltaic backboard processing method, comprising:

[0049] Obtaining a conductive layer with a pattern structure on the surface, the pattern structure having to-be-peeled areas;

[0050] Peeling the to-be-peeled areas in the conductive layer;

[0051] Compressing the conductive layer after peeling and a backboard provided with an adhesive layer to obtain a photovoltaic backboard.

[0052] Optionally, the peeling the to-be-peeled areas in the conductive layer comprises:

[0053] The conductive layer is turned over, and the side of the conductive layer provided with the pattern structure faces the direction of gravity.

[0054] The peeling device is controlled to contact the side of the conductive layer provided with the pattern structure, so that the to-be-peeled area in the conductive layer is separated.

[0055] Optionally, the conductive layer provided with the pattern structure comprises the following steps:

[0056] A continuous conductive layer is drawn from one end of a conductive layer roll and cut to form the conductive layer.

[0057] The conductive layer is laser-engraved to form the pattern structure on the surface of the conductive layer.

[0058] Optionally, the pressing of the conductive layer after peeling and the back plate provided with the adhesive layer comprises the following steps:

[0059] The back plate provided with the adhesive layer is laminated with the conductive layer after peeling to form a workpiece to be processed, and the adhesive layer is located between the back plate and the conductive layer after peeling.

[0060] The workpiece to be processed is pressed.

[0061] Optionally, after the pressing of the conductive layer after peeling and the back plate provided with the adhesive layer, the method further comprises the following steps:

[0062] The conductive layer and the back plate after pressing are subjected to image acquisition and image recognition.

[0063] When it is identified that there is residue in the to-be-peeled area of the conductive layer, the residue is removed.

[0064] In a third aspect, an embodiment of the present application provides an adsorption device, comprising:

[0065] A vacuum adsorption carrier plate;

[0066] First adsorption holes are arranged on the vacuum adsorption carrier plate at intervals along a first direction, and second adsorption holes are arranged on the vacuum adsorption carrier plate at intervals along a second direction, the first direction intersects the second direction, and the first adsorption holes and the second adsorption holes are different in size.

[0067] When the vacuum adsorption carrier plate adsorbs a conductive layer, the positions of the first adsorption holes and the second adsorption holes do not overlap with a to-be-peeled area in the conductive layer.

[0068] The application can first remove the to-be-stripped region on the conductive layer, and then perform hot pressing on the back plate provided with the adhesive layer and the conductive layer after the stripping is completed, to obtain the photovoltaic back plate. Compared with the related art, the application does not need to first hot-press the back plate and the conductive layer, and then remove the to-be-stripped region on the conductive layer. In this way, when the to-be-stripped region is removed, the inconvenience caused by the firm adhesion between the to-be-stripped region and the back plate can be eliminated. Since the conductive layer is not yet adhered to the back plate when the to-be-stripped region is stripped, the stripping is relatively simple, thereby solving the problem that part of the to-be-stripped region is prone to breakage and difficult to strip in the related art, and improving the product quality and production efficiency.

[0069] The application provides a photovoltaic back plate preparation method and device, and aims to at least solve the technical problem that the excess region in the pattern structure is prone to breakage and difficult to strip in the prior art.

[0070] In a fourth aspect, the application provides a photovoltaic back plate preparation method, comprising:

[0071] obtaining at least a conductive layer having a pattern structure on a surface, wherein the pattern structure has a to-be-separated part, and at least the to-be-separated part of the conductive layer is not connected to a back plate;

[0072] blowing the to-be-separated part of the conductive layer;

[0073] separating the to-be-separated part of the conductive layer.

[0074] Optionally, the blowing of the to-be-separated part of the conductive layer comprises:

[0075] blowing the to-be-separated part of the conductive layer by an oscillating blowing assembly;

[0076] The oscillating blowing assembly comprises a blowing nozzle capable of periodic reciprocating motion.

[0077] Optionally, the separating of the to-be-separated part of the conductive layer comprises:

[0078] picking up the to-be-separated part of the conductive layer that is blown away;

[0079] moving the to-be-separated part relative to a to-be-kept part of the conductive layer, so as to separate the to-be-separated part of the conductive layer.

[0080] Optionally, the moving of the to-be-separated part relative to the to-be-kept part of the conductive layer comprises:

[0081] transmitting the to-be-separated part in a direction away from the to-be-kept part of the conductive layer.

[0082] Optionally, the at least obtaining the conductive layer with the surface having the pattern structure comprises:

[0083] only obtaining the conductive layer with the surface having the pattern structure;

[0084] After the separating the part of the conductive layer to be separated, the method further comprises:

[0085] pressing the conductive layer after the separating and the back plate provided with the adhesive layer to obtain the photovoltaic back plate.

[0086] Optionally, before the at least obtaining the conductive layer with the surface having the pattern structure, the method comprises:

[0087] partially pressing the part of the conductive layer to be reserved and the back plate provided with the adhesive layer;

[0088] the at least obtaining the conductive layer with the surface having the pattern structure comprises:

[0089] obtaining the conductive layer, the adhesive layer and the back plate after the partial pressing;

[0090] forming the pattern structure on the surface of the conductive layer.

[0091] In a fifth aspect, an embodiment of the present application provides a photovoltaic back plate preparation device, comprising:

[0092] a blowing device, the blowing device being configured to blow on the part of the pattern structure to be separated in the conductive layer, wherein at least the part of the conductive layer to be separated is not connected with the back plate;

[0093] a separating device, the separating device being configured to separate the part of the conductive layer to be separated.

[0094] Optionally, the blowing device comprises an oscillating blowing assembly, and the oscillating blowing assembly comprises a nozzle capable of periodic reciprocating motion.

[0095] Optionally, along the thickness direction of the conductive layer, the distance between the blowing device and the conductive layer is greater than or equal to 55 mm.

[0096] Optionally, the flow rate of the airflow blown by the blowing device is greater than or equal to 600 L / min and less than or equal to 750 L / min.

[0097] Optionally, the photovoltaic back plate preparation device further comprises a first carrier, and the first carrier is configured to at least adsorb the conductive layer, and the conductive layer is located below the first carrier.

[0098] Optionally, the separating device comprises a clamping separating assembly, and the clamping separating assembly is located below the first carrier.

[0099] The clamping and separating assembly comprises two clamping rollers arranged oppositely and rotating towards each other.

[0100] Optionally, along the thickness direction of the conductive layer, the distance between the clamping and separating assembly and the conductive layer is greater than the length of the finger-shaped conductive part in the pattern structure.

[0101] Optionally, the clamping and separating assembly further comprises an anti-winding mechanism.

[0102] The anti-winding mechanism comprises two auxiliary rollers and two transmission belts, and each of the transmission belts is arranged around the auxiliary roller and the clamping roller located on the same side of the clamping and separating assembly along the arrangement direction of the two clamping rollers.

[0103] Optionally, the separating device comprises a clamping assembly located below the first carrier, and the clamping assembly is used for clamping the separated part of the conductive layer blown away.

[0104] The separating device further comprises a separating driving member used for driving the clamping assembly to move, and / or the first carrier comprises a transmission assembly used for transmitting and adsorbing the conductive layer.

[0105] Optionally, the clamping assembly comprises a first clamping strip and a second clamping strip.

[0106] The clamping assembly further comprises a clamping driving member used for driving the first clamping strip or the second clamping strip to move along the length direction of the first clamping strip.

[0107] The first clamping strip and the second clamping strip are arranged in a stack, the first clamping strip is provided with a plurality of clamping grooves along the length direction of the first clamping strip, and the second clamping strip comprises a plurality of clamping hooks arranged at intervals along the length direction of the first clamping strip.

[0108] Alternatively, the first clamping strip and the second clamping strip respectively comprise a plurality of first clamping claws and a plurality of second clamping claws arranged at intervals along the length direction of the first clamping strip, and the first clamping claws and the second clamping claws are arranged alternately along the length direction of the first clamping strip.

[0109] Optionally, the separating device comprises a rolling brush used for contacting the side of the conductive layer away from the first carrier.

[0110] Optionally, the photovoltaic backboard preparation equipment further comprises a local pressing device used for locally pressing the conductive layer and the backboard provided with the adhesive layer.

[0111] The local pressing device comprises an upper pressing plate and a lower pressing plate, the upper pressing plate is provided with a first avoiding groove, and / or the lower pressing plate is provided with a second avoiding groove.

[0112] In the embodiment of the present application, the part to be separated in the conductive layer is blown, and the part to be separated in the conductive layer is separated. The part to be separated is not connected to the back plate, which is easy to blow away and separate, and the part to be separated is not easy to break, which can improve the efficiency of waste removal, and can avoid the breakage of the excess area in the stripping pattern structure due to the firm adhesion of the metal conductive layer to the back plate. In addition, in the embodiment, since the part to be separated is not easy to break, the width of the part to be separated can be reduced, and after the width of the part to be separated is reduced, the resistivity of the photovoltaic back plate can be reduced, and the conductivity of the photovoltaic back plate can be improved, thereby improving the power of the photovoltaic module comprising the photovoltaic back plate.

[0113] The above description is only a summary of the technical solutions of the present application. In order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described below. BRIEF DESCRIPTION OF DRAWINGS

[0114] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the description of the embodiments of the present application will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0115] Fig. 1 is a structural schematic diagram of a photovoltaic back plate processing equipment according to an embodiment of the present application;

[0116] Fig. 2 is a structural schematic diagram of an adsorption device carrying a conductive layer according to an embodiment of the present application;

[0117] Fig. 3 is a step flow schematic diagram of a photovoltaic back plate processing method according to an embodiment of the present application;

[0118] Fig. 4 is a cross-sectional structural schematic diagram of a stripping mechanism according to an embodiment of the present application;

[0119] Fig. 5 is a structural schematic diagram of a stripping device according to an embodiment of the present application;

[0120] Fig. 6 is a structural schematic diagram of another stripping device according to an embodiment of the present application;

[0121] Fig. 7 is a structural schematic diagram of another stripping device according to an embodiment of the present application;

[0122] Fig. 8 is a schematic structural view of another adsorption device carrying a conductive layer according to an embodiment of the present application;

[0123] Fig. 9 is a schematic structural view of a partial structure of an adsorption device carrying a conductive layer according to an embodiment of the present application;

[0124] Fig. 10 is a schematic structural view of a partial structure of an adsorption device carrying a conductive layer according to an embodiment of the present application;

[0125] Fig. 11 is a flow chart of a method for preparing a photovoltaic back sheet according to an embodiment of the present application;

[0126] Fig. 12 is a schematic structural view of a conductive layer according to an embodiment of the present application;

[0127] Fig. 13 is a flow chart of another method for preparing a photovoltaic back sheet according to an embodiment of the present application;

[0128] Fig. 14 is a flow chart of still another method for preparing a photovoltaic back sheet according to an embodiment of the present application;

[0129] Fig. 15 is a schematic structural view of an oscillating air blowing assembly and a clamping assembly in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0130] Fig. 16 is a schematic structural view of an oscillating air blowing assembly and a clamping assembly in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0131] Fig. 17 is a schematic structural view of an oscillating air blowing assembly and a clamping assembly in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0132] Fig. 18 is a schematic structural view of a partial structure of a first clamping strip and a second clamping strip in another clamping assembly in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0133] Fig. 19 is a schematic structural view of a first carrier and a conductive layer in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0134] Fig. 20 is a schematic structural view of a clamping and separating assembly in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0135] Fig. 21 is a schematic structural view of another clamping and separating assembly in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0136] Fig. 22 is a schematic structural view of a rolling brush in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0137] Fig. 23 is a schematic structural view of a partial pressing device in a photovoltaic back sheet preparation apparatus according to an embodiment of the present application;

[0138] FIG. 24 is a schematic view of an upper pressing plate of a partial pressing device in a photovoltaic backsheet preparation apparatus according to an embodiment of the present application;

[0139] FIG. 25 is a schematic view of a lower pressing plate of a partial pressing device in a photovoltaic backsheet preparation apparatus according to an embodiment of the present application;

[0140] FIG. 26 is a schematic view of a second carrier and a suction cover according to an embodiment of the present application;

[0141] FIG. 27 is a schematic view of a suction nozzle assembly and a second carrier according to an embodiment of the present application.

[0142] Wherein: 10 - carrier; A - conveying surface; 20 - peeling mechanism; 30 - compounding mechanism; 40 - suction device; 41 - suction hole; 411 - first suction hole; 412 - second suction hole; 42 - vacuum generating mechanism; 50 - conductive layer; 51 - pattern structure; 60 - backsheet; 21 - turnover device; 22 - peeling device; 23 - conveying device; 70 - feeding table; 80 - cross beam; 221 - air blower; 222 - brush; 223 - roller; 224 - flexible contact layer; 225 - flexible protruding structure; 90 - feeding and cutting device; 100 - laser plate making device; 91 - conductive layer roll; 1 - conductive layer, 11 - part to be separated, 12 - part to be retained, 121 - finger-shaped conductive part, 2 - first carrier, 3 - oscillating air blowing assembly, 31 - blowing nozzle, 32 - blowing nozzle fixing block, 33 - first support, 34 - air blowing driving member, 35 - second support, 36 - first guide rail sliding block mechanism, 4 - roller brush, 5 - clamping assembly, 55 - first clamping strip, 511 - clamping groove, 52 - second clamping strip, 521 - clamping hook, 53 - clamping driving member, 54 - second guide rail sliding block mechanism, 6 - second carrier, 7 - clamping and separating assembly, 71 - clamping roller, 72 - auxiliary roller, 73 - conveying belt, 74 - driving motor, 75 - transmission mechanism, 8 - partial pressing device, 81 - upper pressing plate, 811 - first avoiding groove, 812 - protruding part, 82 - lower pressing plate, 821 - lower pressing surface, 822 - second avoiding groove, 9 - suction cover, 110 - suction nozzle assembly. DETAILED DESCRIPTION

[0143] Exemplary embodiments of the present application will be described herein below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it is understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0144] In a first aspect, as shown in FIG. 1, the application provides a photovoltaic backboard processing device, which comprises a carrier 10 having a transmission surface A, and a stripping mechanism 20 and a laminating mechanism 30 arranged on the carrier 10; the transmission surface A of the carrier 10 is used to transmit an electrically conductive layer 50 so that the electrically conductive layer 50 passes through the stripping mechanism 20 and the laminating mechanism 30 in sequence.

[0145] Optionally, the transmission surface A of the carrier 10 is provided with an adsorption device 40, which is used to adsorb the electrically conductive layer 50 and move on the transmission surface A. Further referring to FIG. 2, which shows a structural schematic view of an adsorption device carrying an electrically conductive layer, the surface of the electrically conductive layer 50 is formed with a pattern structure 51, and the pattern structure 51 has a region to be stripped (i.e. a region where a line is located, for example, a region where a black continuous curved line of the electrically conductive layer 50 in FIG. 2 is located); the stripping mechanism 20 is used to strip the region to be stripped in the electrically conductive layer 50, and the laminating mechanism 30 is used to press the electrically conductive layer 50 after stripping and a backboard 60 provided with an adhesive layer. It should be noted that the adhesive layer provided on the backboard 60 can be formed by coating or other methods, or the backboard 60 itself is provided with an adhesive layer when it is delivered, which is not limited here.

[0146] Specifically, before pressing, the stripping mechanism 20 can stack the backboard 60 provided with the adhesive layer and the electrically conductive layer 50 after stripping to form a workpiece, and the adhesive layer is located between the backboard 60 and the electrically conductive layer 50; then the laminating mechanism 30 can press the workpiece to obtain a photovoltaic backboard.

[0147] In the embodiment of the application, the electrically conductive layer provided on the backboard has a pattern structure, which is to make the backboard contact the electrode on the back of the back contact type cell through the pattern structure of the electrically conductive layer when the backboard contacts the back contact type cell.

[0148] Referring to FIG. 2, the pattern style of the pattern structure 51 provided on the electrically conductive layer 50 can be designed based on the electrode structure on the back of the back contact type cell, and the pattern style is a pattern capable of forming electrical isolation, which can avoid the short circuit phenomenon during interconnection. The specific design style of the pattern structure is not limited in the embodiment of the application. After the pattern structure 51 is drawn, the excess region to be stripped (the region where the black continuous curved line of the electrically conductive layer 50 in FIG. 2 is located) needs to be stripped from the electrically conductive layer 50, so as to form a pattern structure that can be used for subsequent electrical connection.

[0149] Specifically, the embodiment of the present application can realize the automatic processing of the photovoltaic backboard by using a complete set of photovoltaic backboard processing equipment. Referring to FIG. 1, the carrier table 10 of the photovoltaic backboard processing equipment is used to transmit the elements through the transmission surface A, the transmission direction is X, and the stripping mechanism 20 and the composite mechanism 30 are arranged in sequence on the carrier table 10 along the transmission direction X. The adsorption device 40 is placed on the transmission surface A, and the adsorption device 40 can adsorb the conductive layer 50 with the pattern structure 51. The pattern structure 51 provided on the conductive layer 50 is provided on the side of the conductive layer 50 away from the transmission surface A. The conductive layer can be a conductive metal material.

[0150] The transmission surface A can drive the adsorption device 40 to move along the transmission direction X and pass through the stripping mechanism 20 and the composite mechanism 30 in sequence. When passing through the stripping mechanism 20, the stripping mechanism 20 can strip and remove the to-be-stripped area in the pattern structure 51 of the conductive layer 50. Specifically, since the to-be-stripped area is in a state of being separated or close to being separated after the pattern structure 51 is engraved on the conductive layer 50, the stripping mechanism 20 has multiple ways to strip and remove the to-be-stripped area: way 1, the adsorption device 40 carrying the conductive layer 50 with the pattern structure 51 can be turned over by 180°, so that the side of the conductive layer 50 away from the adsorption device 40 faces the direction of gravity, and the to-be-stripped area is guided to be separated based on gravity. Way 2, the stripping mechanism 20 can apply a force to the side of the conductive layer 50 away from the adsorption device 40 (such as using a roller or a brush to contact the surface to apply the force), so that the to-be-stripped area is separated under the action of the force.

[0151] After the to-be-stripped area is separated, the backboard 60 provided with the adhesive layer can be stacked with the conductive layer 50 after stripping, and the adhesive layer is located between the backboard 60 and the conductive layer 50 to form the to-be-processed piece carried on the adsorption device 40. Then, under the transmission of the transmission surface A, the adsorption device 40 can adsorb the to-be-processed piece and continue to move along the transmission direction X. When moving to the composite mechanism 30, the composite mechanism 30 can press the to-be-processed piece to obtain the photovoltaic backboard and output, thereby completing the processing and preparation of the photovoltaic backboard. Specifically, the pressing method can include a hot pressing operation.

[0152] Based on the above description of the photovoltaic backboard processing equipment, referring to FIG. 3, the embodiment of the present application provides a photovoltaic backboard processing method, which comprises the following steps:

[0153] Step 101, obtaining a conductive layer with a pattern structure on the surface, the pattern structure having a to-be-stripped area.

[0154] Step 102, stripping the to-be-stripped area in the conductive layer.

[0155] Step 103, pressing the conductive layer after stripping and the backboard provided with the adhesive layer.

[0156] Optionally, step 101 can specifically include:

[0157] Sub-step 1011, leading out a continuous conductive layer from one end of the conductive layer roll and cutting to form the conductive layer.

[0158] Sub-step 1012, laser engraving the conductive layer to form the pattern structure on the surface of the conductive layer.

[0159] In the embodiment of the present application, referring to FIG. 1, automatic feeding and cutting can be realized by the feeding and cutting device 90. Specifically, the feeding and cutting device 90 is placed with the conductive layer roll 91 and a cutter, one end of the conductive layer roll 91 is led out to the adsorption device 40 on the transmission surface A, when the length of the continuous conductive layer reaches the requirement, the cutter can work to cut off a certain length of the continuous conductive layer to form the conductive layer 50 adsorbed on the adsorption device 40 for subsequent laser engraving.

[0160] The laser plate making device 100 has a plurality of laser generators for releasing laser to the surface of the conductive layer 50 to prepare a pattern structure on the surface of the conductive layer 50 in a laser engraving manner, and some excess areas need to be removed after laser engraving, i.e. the peeling area to be peeled in the embodiment of the present application.

[0161] Optionally, step 102 can specifically include:

[0162] Sub-step 1021, turning over the conductive layer to make the side of the conductive layer provided with the pattern structure face the direction of gravity to guide at least part of the peeling area to be peeled in the conductive layer to separate.

[0163] Sub-step 1022, controlling the peeling device to contact the side of the conductive layer provided with the pattern structure to make the remaining peeling area to be peeled in the conductive layer separate.

[0164] In the embodiment of the present application, referring to FIG. 4, the removal of the peeling area to be peeled can be realized in a combination of mode 1 and mode 2. Mode 1 can turn over the adsorption device 40 carrying the conductive layer 50 provided with the pattern structure 51 by 180° through the turning over device 21 to make the side of the conductive layer 50 away from the adsorption device 40 face the direction of gravity to guide the peeling area to be peeled to separate based on gravity. Mode 2 can apply a force to the side of the conductive layer 50 away from the adsorption device 40 through the peeling device 22 to make the peeling area to be peeled separate under the force.

[0165] Optionally, step 103 can specifically include:

[0166] Sub-step 1031, laminating the back plate provided with the adhesive layer and the conductive layer after peeling to form a workpiece to be processed; the adhesive layer is located between the back plate and the conductive layer after peeling.

[0167] Sub-step 1032, laminating the piece to be processed.

[0168] It should be noted that in one implementation, one side of the incoming back plate 60 can be pre-coated with an adhesive layer. Referring to FIG. 1, the stripping mechanism 20 can also have a carrying function. Based on the carrying function, the stripping mechanism 20 can carry the back plate 60 coated with the adhesive layer and stack it with the conductive layer 50 after stripping to form a piece to be processed, and then laminate the piece to be processed by the laminating mechanism 30 to obtain the photovoltaic back plate.

[0169] In another implementation, referring to FIG. 1, the stripping mechanism 20 can also have a coating function and a carrying function. Based on the coating function, the stripping mechanism 20 can first coat one side of the incoming back plate 60 with an adhesive layer, and then based on the carrying function, carry the back plate 60 coated with the adhesive layer and stack it with the conductive layer 50 after stripping to form a piece to be processed, and then laminate the piece to be processed by the laminating mechanism 30 to obtain the photovoltaic back plate.

[0170] Optionally, after step 103, the method further comprises:

[0171] Step 104, image acquisition and image recognition are performed on the laminated conductive layer and back plate.

[0172] Step 105, when it is identified that there is residue in the area to be stripped of the conductive layer, the residue is removed.

[0173] In the embodiments of the present application, for steps 104-105, after the area to be stripped in the conductive layer in the photovoltaic back plate processing method is stripped, and the conductive layer after stripping and the back plate provided with the adhesive layer are laminated, an operation of detecting the stripping effect of the area to be stripped can be performed again. At this time, there can still be small residue of the area to be stripped in the conductive layer. The operation of detecting the stripping effect of the area to be stripped aims to detect and remove the residue of the area to be stripped.

[0174] In a related technology, an electrical detection method can be used to detect the residue of the area to be stripped. The detection method can place two probes on opposite sides of the area to be stripped. If there is residue connecting the opposite sides of the area to be stripped, it will cause the two probes to be short-circuited. Therefore, detecting a short-circuit state means detecting residue in the area to be stripped. However, if there is only one side edge connecting residue in the area to be stripped, the residue does not contact the opposite side edge. At this time, the electrical detection method cannot detect the short-circuit phenomenon, and the detection of the residue is missed.

[0175] The embodiment of the present application can adopt a visual detection method, first, the conductive layer and the back plate after pressing are photographed to obtain a photographed image, then image recognition can be performed on the photographed image to identify the characteristics of the to-be-stripped area in the conductive layer, if residue characteristics are found in the to-be-stripped area, it is confirmed that residue is identified, then the residue removal operation can be performed, which can be realized by manual or machine.

[0176] It should be noted that the embodiment of the present application can also perform residue detection and removal operation when the to-be-stripped area in the conductive layer is stripped; or both residue detection and removal operation when the to-be-stripped area in the conductive layer is stripped and after the conductive layer after stripping and the back plate provided with the adhesive layer are pressed.

[0177] Optionally, after step 103, the method further comprises:

[0178] Step 106, separate the adsorption device from the photovoltaic back plate, and at the same time, complete the turning over of the photovoltaic back plate through the back plate turning over machine, so that the conductive layer faces upwards.

[0179] Step 107, transmit the turned over photovoltaic back plate to a punching station to punch at the bus bar leading-out position.

[0180] Step 108, sequentially pass through a bus bar welding machine, a bus bar bending machine and a bus bar shaping machine to weld the bus bar to the conductive layer of the photovoltaic back plate, and after welding, perform bending and shaping treatment on the bus bar.

[0181] Step 109, hot-press the photovoltaic back plate after bus bar welding, bending and shaping with the insulating film to form a final integrated back plate.

[0182] The embodiment of the present application provides a photovoltaic back plate processing method based on a photovoltaic back plate processing device. In the method, the to-be-stripped area of the conductive layer is first stripped and removed, and finally the back plate provided with the adhesive layer is laminated with the conductive layer after stripping and then hot-pressed to obtain the photovoltaic back plate. Compared with the related art, the embodiment of the present application does not need to first hot-press and composite the back plate with the conductive layer and then remove the to-be-stripped area on the conductive layer. When the to-be-stripped area is removed, the inconvenience caused by the firm adhesion of the to-be-stripped area to the back plate can be eliminated. Since the conductive layer has not been adhered to the back plate when the to-be-stripped area is stripped, the stripping is relatively simple, thereby solving the problem that part of the to-be-stripped area is easily broken and difficult to strip in the related art, and improving the product quality and production efficiency.

[0183] Optionally, as shown in FIG. 1 and FIG. 4, the peeling mechanism 20 comprises a turnover device 21 and a peeling device 22; the adsorption device 40 moves to the turnover device 21 after adsorbing the conductive layer 50, the turnover device 21 turns over the adsorption device 40 for the first time by rotating, so that the side of the conductive layer 50 away from the adsorption device 40 faces the gravity direction Y; after the adsorption device 40 is turned over for the first time, the peeling device 22 is located at the side of the conductive layer 50 away from the adsorption device 40; the peeling device 22 is used to contact the side of the conductive layer 50 away from the adsorption device 40 after the adsorption device 40 is turned over for the first time, so that the to-be-peeled region in the conductive layer 50 is separated.

[0184] In the embodiment of the present application, the peeling mechanism 20 can adopt the mode of turning over the adsorption device 40 (preferably 180°), so that at least part of the to-be-peeled region in the conductive layer 50 is automatically guided to separate by gravity in the case that the side of the conductive layer 50 away from the adsorption device 40 faces the gravity direction Y, and this peeling mode is simple and efficient. It should be noted that under the action of gravity, there may be a phenomenon that part of the to-be-peeled region in the conductive layer 50 is removed, and there may also be a phenomenon that all of the to-be-peeled region in the conductive layer 50 is removed.

[0185] Specifically, the turnover device 21 can replace the transmission function of the transmission surface in this section where the peeling mechanism 20 is located (the surface can transmit objects when the turnover device 21 is not turned over), that is, when the turnover device 21 is not turned over, its bearing surface is flush with the transmission surface A, and the bearing surface of the turnover device 21 can carry and transmit the adsorption device 40, and the turnover device 21 can further rotate itself to turn over the carried adsorption device 40, so that the side of the conductive layer 50 away from the adsorption device 40 faces the gravity direction Y.

[0186] Further, after at least part of the to-be-peeled region in the conductive layer 50 is separated by gravity, there may be another part of the to-be-peeled region that has not been separated from the conductive layer 50 or the to-be-peeled region that has not been removed by gravity, in order to ensure that the to-be-peeled region is separated as much as possible, the peeling device 22 can be further introduced to realize the peeling of the remaining to-be-peeled region or the to-be-peeled region that has not been removed by gravity, that is, the peeling device 22 can contact the side of the conductive layer 50 away from the adsorption device 40 and apply a force, so that the to-be-peeled region is separated under the action of the force.

[0187] Optionally, referring to FIG. 1, the peeling mechanism 20 further comprises a carrying device 23; after the peeling device 22 works, the turnover device 21 turns the adsorption device 40 again by rotation, so that the side of the conductive layer 50 away from the adsorption device 40 is away from the direction of gravity; after the adsorption device 40 is turned over again, the carrying device 23 is used to grab the back plate 60 provided with an adhesive layer placed on the feeding table 70, and the side of the back plate 60 provided with the adhesive layer is stacked in contact with the side away from the adsorption device.

[0188] In the embodiment of the present application, after the peeling mechanism 20 realizes peeling, the turnover device 21 turns the adsorption device 40 again by rotation, so that the side of the conductive layer 50 away from the adsorption device 40 is away from the direction of gravity. Then the carrying device 23 provided in the peeling mechanism 20 is further used to automatically realize the carrying and placing of the back plate 60. Specifically, a cross beam 80 can be provided at the peeling mechanism 20, and the carrying device 23 can move on the cross beam 80. The carrying device 23 includes but is not limited to a device with adsorption function (as shown in FIG. 1) or a mechanical claw. The carrying device 23 moves to the position of the feeding table 70 on the cross beam 80, and grabs the back plate 60 provided with an adhesive layer placed on the feeding table 70. Then the carrying device 23 moves to the position of the adsorption device 40 on the cross beam 80, and places the grabbed back plate 60, so that the side of the back plate 60 provided with the adhesive layer is in contact with the side of the conductive layer 50 away from the adsorption device 40, forming a workpiece to be processed. The workpiece to be processed is still adsorbed by the adsorption device 40, and is continuously transmitted to the compounding mechanism 30 by the transmission surface A.

[0189] The compounding mechanism 30 can heat at least one surface (the surface where the conductive layer is located, the surface where the back plate is located) of the workpiece to be processed, and apply pressure, so that the back plate 60 is hot-pressed with the conductive layer 50 through the adhesive layer to form firm adhesion. For example, the compounding mechanism 30 can include two oppositely arranged heat-conducting plates, which realize heating by contacting the surface of the workpiece to be processed, and the two oppositely arranged heat-conducting plates can be close to each other, so as to realize the application of pressure to the surface of the workpiece to be processed. It should be noted that hot pressing is the preferred embodiment, and in other embodiments, the compounding mechanism 30 can also not have a heating function, that is, the preferred embodiment of the pressure bonding step is hot pressing.

[0190] Optionally, referring to FIG. 5, the peeling device 22 comprises a blower 221; the air outlet direction of the blower 221 faces the side of the conductive layer 50 away from the adsorption device; the air outlet width H1 of the blower 221 is greater than or equal to the width h of the graphic structure 51 in the conductive layer 50; the blower 221 is used to move along the length direction of the conductive layer 50 under the driving.

[0191] Specifically, in one implementation, the peeling device 22 can include a blower 221, i.e. by blowing the side of the conductive layer 50 facing away from the adsorption device with the blower 211, the force is applied to the area to be peeled off in the conductive layer 50, so that the area to be peeled off falls off. Wherein, the blower 221 has a long strip-shaped air outlet, the blower 221 moves along the length direction of the conductive layer 50 under the drive, the air outlet width H1 of the blower 221 is greater than or equal to the width h of the pattern structure 51 in the conductive layer 50, i.e. it can be moved from one short side of the conductive layer 50 to the other short side, forming an action force covering all the pattern structures 51 in the conductive layer 50, ensuring the application of the action force to all the areas to be peeled off, so as to remove all the areas to be peeled off as much as possible.

[0192] Optionally, referring to FIG. 6, the peeling device 22 includes a brush 222; the brush 222 is used to contact the side of the conductive layer 50 facing away from the adsorption device; the width H2 of the brush 222 is greater than or equal to the width h of the pattern structure in the conductive layer 50; the brush 222 is used to move along the length direction of the conductive layer 50 under the drive.

[0193] Specifically, in another implementation, the peeling device 22 can include a brush 222, i.e. by contacting the side of the conductive layer 50 facing away from the adsorption device with the brush 222, the force is applied to the area to be peeled off in the conductive layer 50, so that the area to be peeled off falls off. Wherein, the brush 222 moves along the length direction of the conductive layer 50 under the drive, the width H2 of the brush 222 is greater than or equal to the width h of the pattern structure in the conductive layer 50, i.e. it can be moved from one short side of the conductive layer 50 to the other short side, forming an action force covering all the pattern structures 51 in the conductive layer 50, ensuring the application of the action force to all the areas to be peeled off, so as to remove all the areas to be peeled off as much as possible. The bristles of the brush can adopt soft bristles with elasticity, which can apply force and not scratch the surface of the conductive layer.

[0194] Optionally, referring to FIG. 7, the peeling device 22 includes a roller 223; the roller 223 is used to contact the side of the conductive layer 50 facing away from the adsorption device; the width H3 of the roller 223 is greater than or equal to the width h of the pattern structure in the conductive layer 50; the roller 223 is used to move along the length direction of the conductive layer 50 under the drive.

[0195] Specifically, in another implementation form, the stripping device 22 can include a roller 223, that is, by rolling contact of the roller 223 with the side of the conductive layer 50 away from the adsorption device, an action force is applied to the region to be stripped in the conductive layer 50, so that the region to be stripped falls off. Wherein, the roller 223 is driven to move along the length direction of the conductive layer 50, and the width H3 of the roller 223 is greater than or equal to the width h of the pattern structure in the conductive layer 50, that is, it can be moved from one short side of the conductive layer 50 to the other short side, forming an action force covering all the pattern structures 51 in the conductive layer 50, ensuring the application of the action force to all the regions to be stripped, so as to remove as many regions to be stripped as possible.

[0196] Optionally, referring to FIG. 7, the surface of the roller is provided with a flexible contact layer 224; the surface of the flexible contact layer 224 is provided with flexible protruding structures 225 at intervals.

[0197] In the embodiment of the present application, the surface of the roller is provided with a flexible contact layer 224 (such as a silica gel layer), which can apply an action force without scratching the surface of the conductive layer. Further, the surface of the flexible contact layer 224 is provided with flexible protruding structures 225 at intervals, so that the flexible protruding structures 225 can increase the action force applied to the region to be stripped in the pattern structure 51 without scratching the surface of the conductive layer, thereby further improving the stripping effect of the region to be stripped.

[0198] Optionally, referring to FIG. 1, the photovoltaic backboard processing equipment further includes a feeding and cutting device 90 and a laser plate making device 100 arranged on the loading table 10; the feeding and cutting device 90 is located at the feeding end of the loading table 10, and the laser plate making device 100 is located between the feeding and cutting device 90 and the stripping mechanism 20; the feeding and cutting device 90 is provided with a conductive layer roll 91; the feeding and cutting device 90 is used to lead one end of the conductive layer roll 91 to the adsorption device 40 on the transmission surface A and cut to form the conductive layer 50; the laser plate making device 100 is used to perform laser drawing on the passing conductive layer 50 to form a pattern structure on the surface of the conductive layer 50.

[0199] In the embodiment of the present application, automatic feeding and cutting can be realized by the feeding and cutting device 90, and automatic drawing of the pattern structure in the conductive layer 50 can be realized by the laser plate making device 100, thereby improving the automation degree of the overall process and the production efficiency.

[0200] Specifically, the feeding and cutting device 90 is provided with a conductive layer roll 91 and a cutter. One end of the conductive layer roll 91 is led out to the adsorption device 40 on the transmission surface A. As the transmission surface A drives the adsorption device 40 to move, more and more continuous conductive layers are led out from the conductive layer roll 91. When the length of the continuous conductive layers led out reaches a requirement, the cutter can work to cut off the continuous conductive layers of a certain length, thereby forming the conductive layer 50 adsorbed on the adsorption device 40 for subsequent laser engraving.

[0201] The laser plate making device 100 has a plurality of laser generators for emitting laser to the surface of the conductive layer 50, so as to prepare a pattern structure on the surface of the conductive layer 50 in a laser engraving manner. After laser engraving, some excess areas need to be removed, that is, the peeling area to be peeled in the embodiment of the present application.

[0202] In one implementation, the laser plate making device 100 can be fixed. The adsorption device 40 carrying the conductive layer 50 on the transmission surface A can pass through the laser plate making device 100 during movement. The laser plate making device 100 works to realize laser engraving during the process that the conductive layer 50 enters the laser plate making device 100 to the process that the conductive layer 50 leaves the laser plate making device 100.

[0203] In another implementation, the laser plate making device 100 can be placed on a track, so that the position of the laser plate making device 100 can be moved. The position of the adsorption device 40 carrying the conductive layer 50 on the transmission surface A can be stationary. The laser plate making device 100 prepares a pattern structure on the surface of the conductive layer 50 by moving, thereby realizing laser engraving. After preparation, the transmission surface A continues to transmit the adsorption device 40.

[0204] Optionally, referring to FIGS. 2 and 4, the adsorption device 40 is a vacuum adsorption carrier plate. The vacuum adsorption carrier plate is provided with adsorption holes 41. When the vacuum adsorption carrier plate adsorbs the conductive layer 50, the positions of the adsorption holes 41 (the adsorption holes 41 in the dashed box in FIG. 2 are perspective structures, that is, the adsorption holes 41 are actually on the surface of the vacuum adsorption carrier plate) and the peeling area to be peeled in the conductive layer 50 do not overlap.

[0205] In the embodiment of the present application, the adsorption device 40 is a vacuum adsorption carrier plate, and a vacuum adsorption effect is generated by a vacuum generating mechanism 42, so as to firmly adsorb the conductive layer 50. The vacuum adsorption carrier plate and the transmission surface of the carrier can be fixed by using pins, but are not limited thereto. Specifically, the vacuum adsorption carrier plate adsorbs the conductive layer 50 through the adsorption holes 41, and the positions of the adsorption holes 41 and the peeling area to be peeled in the conductive layer 50 do not overlap, thereby avoiding the phenomenon that the peeling area to be peeled cannot be separated due to the adsorption of the vacuum adsorption to the peeling area to be peeled.

[0206] Optionally, referring to FIG. 8, the graphic structure 51 comprises a plurality of regions 511 arranged side by side along the width direction of the conductive layer 50. Further referring to FIG. 9, each region 511 comprises a plurality of spaced sub-regions 5111 connected in sequence. The plurality of sub-regions 5111 are arranged in a meandering manner in the region 511. The sub-regions 5111 of the plurality of regions 511 constitute the regions to be peeled. When the vacuum adsorption plate adsorbs the conductive layer 50, a plurality of first adsorption holes 411 are arranged in a spaced manner at positions corresponding to the long side outer side of each region 511 in the vacuum adsorption plate. A plurality of second adsorption holes 412 are arranged in a spaced manner at positions corresponding to at least one group of adjacent sub-regions 5111 in each region. The size of the second adsorption hole 412 is smaller than the size of the first adsorption hole 411. It should be noted that the meandering arrangement may, for example, be an S-shaped arrangement, but is not limited thereto.

[0207] Optionally, referring to FIGS. 8 and 9, the arrangement direction of the second adsorption hole 412 is perpendicular to the arrangement direction of the first adsorption hole 411. The spacing distance between the second adsorption holes 412 is smaller than the spacing distance between the first adsorption holes 411.

[0208] In the embodiments of the present application, referring to FIG. 8, the graphic structure 51 can specifically comprise a plurality of regions 511 arranged side by side along the width direction of the conductive layer 50. Four laterally spaced regions 511 are shown in FIG. 8. Each region 511 comprises a plurality of vertically spaced sub-regions 5111. The adjacent sub-regions 5111 are connected in sequence. The connection position is in an arc shape. The plurality of sub-regions 5111 of each region 511 are arranged in an S-shaped manner (from a top view).

[0209] Specifically, the adsorption hole 41 comprises the first adsorption hole 411 arranged in a spaced manner at positions corresponding to the long side outer side of each region 511, and the second adsorption hole 412 arranged in a spaced manner at positions corresponding to at least one group of adjacent sub-regions 5111 in each region. The arrangement direction of the first adsorption hole 411 can be perpendicular to the arrangement direction of the second adsorption hole 412. The size of the second adsorption hole 412 is smaller than the size of the first adsorption hole 411. This is because the area of the arrangement region of the first adsorption hole 411 is larger than the area of the arrangement region of the second adsorption hole 412. Therefore, the size of the first adsorption hole 411 can be relatively large, and the gap between the first adsorption holes 411 can be relatively wide. The size of the second adsorption hole 412 can be relatively small, and the gap between the second adsorption holes 412 can be relatively narrow. That is, the adsorption holes are arranged in different manners in different non-peeling regions to achieve better adsorption effect without affecting the peeling effect. In other words, through the cooperation of the first adsorption hole 411 and the second adsorption hole 412 in the above form, better adsorption effect can be achieved for the conductive layer after peeling, and the peeling of the regions to be peeled is not affected.

[0210] Optionally, referring to FIG. 10, when the vacuum adsorption plate adsorbs the conductive layer, the minimum distance L between the edge of the second adsorption hole 412 and the edge of the to-be-peeled region is 0.1 mm to 2 mm.

[0211] In the embodiment of the present application, the position of the second adsorption hole 412 needs to be close to the to-be-peeled region, but not too close. Therefore, the minimum distance L between the edge of the second adsorption hole 412 and the edge of the to-be-peeled region is set to 0.1 mm to 2 mm in the embodiment of the present application. In this way, the second adsorption hole 412 can fix the periphery of the to-be-peeled region as much as possible when adsorbing, so as to facilitate the peeling of the to-be-peeled region. However, the second adsorption hole 412 cannot be too close to the to-be-peeled region. Considering that there will be a positioning error when the vacuum adsorption plate adsorbs the conductive layer, if the second adsorption hole 412 is too close to the to-be-peeled region, the second adsorption hole 412 may not be well positioned and overlap with the to-be-peeled region, which affects the subsequent peeling operation. Therefore, the distance range of 0.1 mm to 2 mm is adopted to take into account the above two aspects.

[0212] Optionally, the photovoltaic backboard processing equipment further comprises a visual detection device and a cleaning device. The visual detection device and the cleaning device are arranged at a position after the laminating mechanism in the table. The visual detection device is used for image acquisition and image recognition of the conductive layer and the backboard after lamination. The cleaning device is used for removing residues when residues are found in the to-be-peeled region of the conductive layer.

[0213] The embodiment of the present application can use a visual detection method. First, the visual detection device photographs the conductive layer and the backboard after lamination to obtain a photographed image. Then, the photographed image can be recognized to identify the characteristics of the to-be-peeled region in the conductive layer. If residues are found in the to-be-peeled region, it is confirmed that residues are identified. Then, the residues can be removed. The removal operation can be realized by manual operation or the cleaning device.

[0214] It should be noted that the embodiment of the present application can also perform residue detection and removal operation when the to-be-peeled region in the conductive layer is peeled off. The residue detection and removal operation can also be performed after the conductive layer after peeling and the backboard provided with the adhesive layer are laminated.

[0215] Referring to FIG. 2, the application further provides an adsorption device 40, which comprises a vacuum adsorption plate. Further referring to FIG. 8, first adsorption holes 411 are arranged on the vacuum adsorption plate in a first direction P, and second adsorption holes 412 are arranged on the vacuum adsorption plate in a second direction Q. The first direction P intersects the second direction Q, and the first adsorption holes 411 and the second adsorption holes 412 are different in size. When the vacuum adsorption plate adsorbs the conductive layer 50, the positions of the first adsorption holes 411 and the second adsorption holes 412 do not overlap with the regions to be peeled in the conductive layer 50. Preferably, the first direction P is perpendicular to the second direction Q.

[0216] In the application, the adsorption device 40 is a vacuum adsorption plate, and a vacuum adsorption effect is generated by a vacuum generating mechanism 42, so that the conductive layer 50 can be firmly adsorbed. The vacuum adsorption plate and the transmission surface of the stage can be fixed to each other by using pins, for example. Specifically, the vacuum adsorption plate is better adsorbed to the conductive layer 50 after peeling by arranging adsorption holes of different sizes in two different directions, and the positions of the adsorption holes 41 do not overlap with the regions to be peeled in the conductive layer 50, thereby avoiding the phenomenon that the regions to be peeled cannot be separated due to the adsorption of the vacuum adsorption to the regions to be peeled.

[0217] Optionally, referring to FIG. 8, the pattern structure 51 comprises a plurality of regions 511 arranged side by side in the width direction of the conductive layer 50. Further referring to FIG. 9, each region 511 comprises a plurality of spaced sub-regions 5111 connected in sequence, and the plurality of sub-regions 5111 are arranged in a bending manner in the region 511. The sub-regions 5111 of the plurality of regions 511 constitute the regions to be peeled. When the vacuum adsorption plate adsorbs the conductive layer 50, the positions corresponding to the outer sides of the long sides of each region 511 in the vacuum adsorption plate are provided with the first adsorption holes 411 arranged in a spacing manner, and the positions between at least one group of adjacent sub-regions 5111 in each region are provided with the second adsorption holes 412 arranged in a spacing manner. The size of the second adsorption holes 412 is smaller than the size of the first adsorption holes 411. It should be noted that the bending arrangement can be S-shaped arrangement, but is not limited thereto.

[0218] Optionally, referring to FIGS. 8 and 9, the arrangement direction of the second adsorption holes 412 is perpendicular to the arrangement direction of the first adsorption holes 411, and the spacing distance between the second adsorption holes 412 is smaller than the spacing distance between the first adsorption holes 411.

[0219] In the embodiment of the present application, referring to FIG. 8, the graphic structure 51 can specifically include a plurality of regions 511 arranged side by side along the width direction of the conductive layer 50, and FIG. 8 shows four regions 511 arranged transversely at intervals, each region 511 including a plurality of sub-regions 5111 arranged vertically at intervals, the adjacent sub-regions 5111 being connected end to end in sequence, and the connection position being arc-shaped, so that the plurality of sub-regions 5111 of each region 511 are arranged in an S shape (from a top view).

[0220] Specifically, the adsorption holes 41 include first adsorption holes 411 arranged at intervals at positions corresponding to the long sides of each region 511, and second adsorption holes 412 arranged at intervals at positions corresponding to at least one group of adjacent sub-regions 5111 in each region. The arrangement direction of the first adsorption holes 411 can be perpendicular to the arrangement direction of the second adsorption holes 412, and the size of the second adsorption holes 412 is smaller than the size of the first adsorption holes 411. This is because the area of the arrangement region of the first adsorption holes 411 is larger than the area of the arrangement region of the second adsorption holes 412, so the size of the first adsorption holes 411 can be relatively large, the gap between the first adsorption holes 411 can be relatively wide, while the size of the second adsorption holes 412 can be relatively small, and the gap between the second adsorption holes 412 can be relatively narrow, that is, the adsorption holes are arranged in different non-stripping regions in different ways to achieve better adsorption effect without affecting the stripping effect. In other words, through the cooperation of the first adsorption holes 411 and the second adsorption holes 412 in the above form, better adsorption effect can be achieved on the conductive layer after stripping, and the stripping of the region to be stripped is not affected.

[0221] Optionally, referring to FIG. 10, when the vacuum adsorption plate adsorbs the conductive layer, the minimum distance L between the edge of the second adsorption hole 412 and the edge of the region to be stripped is 0.1 mm to 2 mm.

[0222] In the embodiment of the present application, the position of the second adsorption hole 412 needs to be close to the region to be stripped, but not too close, therefore, the minimum distance L between the edge of the second adsorption hole 412 and the edge of the region to be stripped can be set to 0.1 mm to 2 mm in the embodiment of the present application, so that the second adsorption hole 412 can fix the periphery of the region to be stripped as much as possible during adsorption, to facilitate the stripping of the region to be stripped; but the second adsorption hole 412 cannot be too close to the region to be stripped, considering that there will be a positioning error when the vacuum adsorption plate and the conductive layer are adsorbed, if it is too close, the second adsorption hole 412 can not be well positioned and can overlap with the region to be stripped, affecting the subsequent stripping operation. Therefore, the distance range of 0.1 mm to 2 mm is adopted to take into account the above two aspects.

[0223] In the embodiment of the present application, the pattern structure can be prepared on the conductive layer first, then the to-be-peeled region in the pattern structure is removed by peeling, and finally the back plate provided with the adhesive layer is laminated with the conductive layer after the peeling is completed, and then hot pressing is performed to obtain the photovoltaic back plate. Compared with the related art, the embodiment of the present application does not need to first hot press the back plate and the conductive layer, then prepare the pattern structure on the conductive layer and remove the to-be-peeled region. In this way, when the to-be-peeled region is removed, the inconvenience caused by the firm adhesion between the to-be-peeled region and the back plate can be eliminated. Since the conductive layer is not yet adhered to the back plate when the to-be-peeled region is peeled, the peeling is relatively simple, thereby solving the problem that part of the to-be-peeled region is prone to breakage and difficult to peel in the related art, and improving the product quality and production efficiency.

[0224] In a second aspect, referring to FIG. 11, the present application discloses a photovoltaic back plate preparation method, which comprises:

[0225] Step 101: obtaining at least a conductive layer with a pattern structure on the surface.

[0226] Referring to FIG. 12, the surface of the conductive layer 1 has a pattern structure, and the pattern structure has a to-be-separated part 11. At least the to-be-separated part 11 in the conductive layer 1 is not connected with the back plate. The to-be-separated part 11 is also the excess part of the pattern structure that needs to be removed. The material of the conductive layer 1 is determined according to the requirements of the material cost and the conductive ability. The material of the conductive layer 1 can be a pure conductive material or a composite conductive material formed by electroplating, evaporation, chemical plating and the like. Based on the cost and the conductive ability, the thickness of the conductive layer 1 can be 0.01 mm-50 mm.

[0227] The pattern style of the pattern structure in the conductive layer can be designed based on the electrode structure on the back surface of the back contact cell, and the pattern style is a pattern capable of forming electrical isolation, so as to avoid the short circuit phenomenon during interconnection. The specific design style of the pattern structure is not limited in the embodiment of the present application. After the pattern structure is drawn, the excess to-be-separated part 11 needs to be separated from the conductive layer, so as to form a pattern structure that can be used for subsequent electrical connection.

[0228] In one embodiment, obtaining at least a conductive layer with a pattern structure on the surface can comprise: obtaining only a conductive layer with a pattern structure on the surface. In another embodiment, obtaining at least a conductive layer with a pattern structure on the surface can comprise: obtaining a conductive layer, an adhesive layer and a back plate after local pressing; and forming a pattern structure on the surface of the conductive layer.

[0229] Step 102: blowing air to the to-be-separated part in the conductive layer.

[0230] The blowing device can be used to blow the separated part 11 in the conductive layer 1. The blowing device can blow air in a direction from bottom to top. When the separated part 11 in the conductive layer 1 is blown, the conductive layer 1 can be adsorbed on the first carrier 2, the conductive layer 1 is below the first carrier 2, and the blowing device is below the first carrier 2.

[0231] In step 103, the separated part in the conductive layer is separated.

[0232] The separated part in the conductive layer can be separated by the separating device. The separating device can include any one of the clamping assembly 5, the clamping separating assembly 7, and the brush roller 4.

[0233] The photovoltaic backboard manufacturing process includes a waste removal process, that is, a process of removing the separated part 11 in the conductive layer 1. In this embodiment, the waste removal process can include blowing the separated part in the conductive layer and separating the separated part 11 in the conductive layer 1. The separated part 11 is usually a fine filament, so the separated part 11 can also be called a waste filament. The thinner the width of the separated part 11, the better the conductivity of the photovoltaic backboard. The width of the separated part 11 can be 0.05mm-10mm.

[0234] In this embodiment, the separated part 11 in the conductive layer 1 is blown and separated. The separated part 11 is not connected to the backboard, which is easy to blow and separate the separated part 11, and the separated part 11 is not easy to break, which can improve the waste removal efficiency and avoid the problem that the excess area is easy to break and difficult to peel off when peeling off the excess area in the pattern structure because the metal conductive layer is firmly bonded to the backboard. In addition, in this embodiment, the separated part 11 is not easy to break, so the width of the separated part 11 can be reduced. After the width of the separated part 11 is reduced, the resistivity of the photovoltaic backboard can be reduced, the conductivity of the photovoltaic backboard can be improved, and thus the power of the photovoltaic module including the photovoltaic backboard can be improved.

[0235] In an optional embodiment of the present application, step 101 includes blowing the separated part in the conductive layer by oscillating the blowing assembly.

[0236] The oscillating blowing assembly 3 comprises a plurality of blow nozzles 31, and the plurality of blow nozzles 31 are connected to the first support 33 through a plurality of blow nozzle fixing blocks 32 respectively. The blow nozzles 31 are capable of reciprocating along the length direction of the first support 33. In this embodiment, the blowing is performed by the blow nozzles 31 capable of reciprocating, so that the blowing effect is enhanced, the separated part 11 is more easily blown away, and the separated part 11 is prevented from being adhered to the retained part 12.

[0237] In an optional embodiment of the present application, the step 103 of separating the separated part in the conductive layer comprises: clamping the separated part in the conductive layer blown away; and moving the separated part relative to the retained part in the conductive layer to separate the separated part in the conductive layer.

[0238] The retained part 12 of the conductive layer 1 is the part that needs to be retained in the conductive layer 1. The separated part in the conductive layer blown away can be clamped by the clamping assembly 5 and the clamping and separating assembly 7. The separated part can be moved, or the conductive layer 1 itself can be moved, to move the separated part relative to the retained part in the conductive layer. After the separated part 11 is blown away by the blowing device, the end of the separated part 11 can be adhered to the retained part 12. By clamping and separating the separated part 11 after blowing, the separated part 11 and the retained part 12 can be completely separated, and the overall waste removal rate is improved.

[0239] In an optional embodiment of the present application, the moving of the separated part relative to the retained part in the conductive layer comprises: transmitting the separated part away from the retained part in the conductive layer.

[0240] The separating device comprises the clamping and separating assembly 7, and the clamping and separating assembly 7 is located below the first carrier 2. The clamping and separating assembly 7 comprises two clamping rollers 71 oppositely arranged and rotating towards each other. The clamping and separating assembly further comprises an anti-winding mechanism, and the anti-winding mechanism comprises two auxiliary rollers 72 and two transmission belts 73. Each transmission belt 73 is wound around the auxiliary roller 72 and the clamping roller 71 located on the same side of the clamping and separating assembly 7 along the arrangement direction of the two clamping rollers 71. Specifically, the separated part 11 can be transmitted away from the retained part 12 in the conductive layer 1 by the transmission belt 73, so as to prevent the separated part 11 from winding around the clamping roller 71.

[0241] In an optional embodiment of the present application, referring to FIG. 13, the present application discloses another method for preparing a photovoltaic backboard, and the method comprises the following steps:

[0242] In step 201, only a conductive layer with a surface having a graphic structure is obtained.

[0243] Step 202, blowing the part to be separated in the conductive layer;

[0244] Step 203, separating the part to be separated in the conductive layer;

[0245] Step 204, laminating the conductive layer after separation and the back plate provided with the adhesive layer to obtain the photovoltaic back plate.

[0246] In the embodiment, the conductive layer with the surface provided with the pattern structure can be obtained by leading out the continuous conductive layer from one end of the conductive layer roll and cutting to form the conductive layer, and performing laser engraving on the conductive layer to form the pattern structure on the surface of the conductive layer. It should be noted that the pattern structure can also be formed on the surface of the conductive layer by other physical or chemical methods. The other physical methods can be cutting by a cutter, one-piece stamping, etc. The chemical methods can be chemical liquid corrosion, etc.

[0247] The feeding and cutting device can be used to realize automatic feeding and cutting. The feeding and cutting device can be provided with the conductive layer roll and the cutter. One end of the conductive layer roll is led out. When the length of the continuous conductive layer reaches the requirement, the cutter can work to cut off the continuous conductive layer with a certain length to form the conductive layer 1. The laser engraving device can be used to perform laser engraving on the conductive layer 1. The laser engraving device can include a plurality of laser generators. The laser generators are used to release laser to the surface of the conductive layer 1 to prepare the pattern structure on the surface of the conductive layer 1 in the laser engraving mode. After the laser engraving, some excess parts need to be removed. The area is the part to be separated in the embodiment.

[0248] One side of the back plate can be provided with an adhesive layer in advance. The adhesive layer can be a film. The film can be an EVA (Ethylene Vinyl Acetate) film, a POE (Polyolefin Elastomer) film, etc. The physical form of the film can be a solid state or a liquid glue state. The back plate provided with the adhesive layer and the conductive layer 1 after separation can be laminated to form a first laminated workpiece. Then, the first laminated workpiece is placed on the laminating device to laminate the conductive layer after separation and the back plate provided with the adhesive layer. In the first laminated workpiece, the adhesive layer is located between the conductive layer 1 and the back plate.

[0249] In the embodiment, the pattern structure is formed on the surface of the separate conductive layer first. Then, the part to be separated 11 in the separate conductive layer 1 is removed. Finally, the conductive layer after separation and the back plate provided with the adhesive layer are laminated. In the embodiment, the conventional laminating device can be used to laminate the conductive layer after separation and the back plate provided with the adhesive layer, and no special laminating device needs to be additionally configured.

[0250] In an optional embodiment of the present application, referring to FIG. 14, the present embodiment discloses another method for preparing a photovoltaic backboard, which comprises the following steps:

[0251] In step 301, the part of the conductive layer to be reserved and the backboard provided with the adhesive layer are locally laminated.

[0252] In step 302, the conductive layer, the adhesive layer and the backboard after local lamination are obtained.

[0253] In step 303, a pattern structure is formed on the surface of the conductive layer.

[0254] In step 304, the part of the conductive layer to be separated is blown.

[0255] In step 305, the part of the conductive layer to be separated is separated.

[0256] The part of the conductive layer to be reserved and the backboard provided with the adhesive layer can be locally laminated by the local lamination device 8. The backboard provided with the adhesive layer can be stacked with the conductive layer 1 to form a second workpiece to be laminated, and then the second workpiece to be laminated is placed on the lower pressing plate 82 in the local lamination device 8, so that the part of the conductive layer to be reserved and the backboard provided with the adhesive layer are locally laminated by the local lamination device 8. In the second workpiece to be laminated, the adhesive layer is located between the conductive layer 1 and the backboard.

[0257] Forming the pattern structure on the surface of the conductive layer can include laser engraving the conductive layer to form the pattern structure on the surface of the conductive layer. In the present embodiment, the part of the conductive layer 1 to be separated is blown, and the entire process of separating the part of the conductive layer 1 to be separated. The part of the conductive layer 1 to be reserved is adhered to the backboard through the adhesive layer, so that the finger-shaped conductive part 121 in the part of the conductive layer 1 to be reserved will not be blown away during the entire process of removing the part to be separated 11, thereby avoiding the risk of clamping the finger-shaped conductive part 121 when clamping the part to be separated 11.

[0258] After the preparation of the photovoltaic backboard, the busbar is first welded on the photovoltaic backboard, then the photovoltaic backboard and the insulating film are hot-pressed together, then the cells are placed on the photovoltaic backboard provided with the insulating film through the layout technology, then the adhesive film and the glass are laid, and finally the glass, the adhesive film, the cells and the photovoltaic backboard provided with the insulating film are laminated to obtain a photovoltaic laminated part.

[0259] The main function of the insulating film is insulation and thermal pressure bonding. The surface of the insulating film is formed with a hole pattern by physical or chemical methods. The hole pattern can be any pattern such as a circle, a triangle, a square, etc. The hole pattern is set according to the size and position of the conductive part required by the battery piece. The hole pattern is preferably a circular pattern, which can be used for circular pad points, square pad points, or other patterned pad points in the battery piece. The material of the insulating film can be a single material, or multiple materials combined together, such as EVA, POE, PET (Polyethylene Terephthalate), etc.

[0260] In a third aspect, referring to FIGS. 15-22, the present application discloses a photovoltaic backsheet preparation device, comprising a blowing device and a separation device, the blowing device is used for blowing the separation required part 11 in the pattern structure of the conductive layer 1, at least the separation required part 11 in the conductive layer 1 is not connected with the backsheet, and the separation device is used for separating the separation required part 11 in the conductive layer 1.

[0261] The direction of the airflow blown by the blowing device can be from bottom to top. When the separation required part 11 in the conductive layer 1 is blown, the conductive layer 1 can be adsorbed on the first carrier 2, the conductive layer 1 is located below the first carrier 2, and the blowing device is located below the first carrier 2. The separation device can include any one of the clamping assembly 5, the clamping separation assembly 7, and the rolling brush 4.

[0262] In the present application, the separation required part 11 in the conductive layer 1 is blown and separated, and the separation required part 11 is not connected with the backsheet, which is easy to blow away and separate, and the separation required part 11 is not easy to break, which can improve the waste removal efficiency and avoid the breakage and difficulty of peeling off the excess area in the pattern structure due to the firm adhesion of the metal conductive layer and the backsheet.

[0263] In an optional embodiment of the present application, referring to FIGS. 15-17, the blowing device comprises an oscillating blowing assembly 3, and the oscillating blowing assembly 3 comprises a blow nozzle 31 that can periodically reciprocate.

[0264] The oscillating blowing assembly 3 comprises a plurality of blow nozzles 31, and the plurality of blow nozzles 31 are connected to the first support 33 through a plurality of blow nozzle fixing blocks 32, respectively. The blow nozzle 31 specifically moves periodically and reciprocally along the length direction of the first support 33. In the present embodiment, the blow nozzle 31 that can periodically reciprocate is used for blowing, which can enhance the blowing effect and more easily blow away the separation required part 11, avoiding the adhesion of the separation required part 11 and the separation required part 12.

[0265] The oscillating blowing assembly 3 further comprises a blowing driving member 34 and a second support 35, wherein the blowing driving member 34 is connected with the first support 33, and the blowing driving member 34 is used to drive the first support 33 to reciprocate along the length direction of the first support 33. The blowing driving member 34 can be a pneumatic cylinder. The first support 33 is connected with the second support 35 through a first guide rail sliding block mechanism 36. The first guide rail sliding block mechanism 36 can comprise a first sliding block and a first guide rail. The first guide rail can be arranged on the second support 35, and the first sliding block is slidingly connected with the first guide rail. The first sliding block is connected with the first support 33. The first guide rail sliding block mechanism 36 plays a guiding role.

[0266] During the blowing process of the oscillating blowing assembly 3, the second support 35 can be fixed, or the second support 35 can move along a first direction. The first direction is perpendicular to the length direction of the second support 35 and perpendicular to the height direction of the second support 35. The first direction can be parallel to the length direction of the finger-shaped conductive part 121 in the conductive layer 1. The length direction of the finger-shaped conductive part 121 in the conductive layer 1 can refer to the direction shown by the arrow B in FIG. 12.

[0267] In an optional embodiment of the present application, the distance between the blowing device and the conductive layer 1 along the thickness direction of the conductive layer 1 is greater than or equal to 55 mm. If the blowing device is too close to the conductive layer 1, there is a risk of blowing the conductive layer 1 to wrinkle, which can easily cause the battery piece to crack. In the present embodiment, when the distance between the blowing device and the conductive layer 1 is within the above range, the risk of blowing the conductive layer 1 to wrinkle due to the blowing device being too close to the conductive layer 1 can be avoided.

[0268] In an optional embodiment of the present application, the flow rate of the airflow blown by the blowing device is greater than or equal to 600 L / min and less than or equal to 750 L / min. The flow rate of the airflow blown by the blowing device can be 600 L / min, 620 L / min, 650 L / min, 700 L / min, 750 L / min, etc. When the flow rate of the airflow blown by the blowing device is within the above range, the blowing effect can be ensured, and the conductive layer 1 can be prevented from being damaged.

[0269] In an optional embodiment of the present application, referring to FIG. 19, the photovoltaic backboard preparation equipment further comprises a first carrier 2, and the first carrier 2 is used to at least adsorb the conductive layer 1. The conductive layer 1 is located below the first carrier 2.

[0270] In an optional embodiment of the present application, referring to FIGS. 20 and 21, the separating device comprises a clamping and separating assembly 7 located below the first carrier 2; the clamping and separating assembly 7 comprises two oppositely arranged and oppositely rotating clamping rollers 71. After the blowing device blows the separated part 11 away, the end of the separated part 11 can be adhered to the retained part 12. After blowing, the clamping and separating assembly 7 clamps and separates the separated part 11, which can ensure the complete separation of the separated part 11 from the retained part 12 and improve the overall waste removal rate.

[0271] In an optional embodiment of the present application, the distance between the clamping and separating assembly 7 and the conductive layer 1 along the thickness direction of the conductive layer 1 is greater than the length of the finger-shaped conductive part 121 in the pattern structure. The length direction of the finger-shaped conductive part 121 can refer to the direction shown by the arrow B in FIG. 12, and the length of the finger-shaped conductive part 121 can refer to L1 shown in FIG. 12. When the blowing device blows, the finger-shaped conductive part 121 has the risk of being blown away. In this embodiment, by setting the distance between the clamping and separating assembly 7 and the conductive layer 1 to be greater than the length of the finger-shaped conductive part 121 in the pattern structure, even if the finger-shaped conductive part 121 is blown away, the clamping and separating assembly 7 will not clamp the finger-shaped conductive part 121.

[0272] In an optional embodiment of the present application, referring to FIG. 20, the clamping and separating assembly 7 further comprises an anti-winding mechanism; the anti-winding mechanism comprises two auxiliary rollers 72 and two transmission belts 73, and each transmission belt 73 is wound around the auxiliary roller 72 and the clamping roller 71 located on the same side of the clamping and separating assembly 7 along the arrangement direction of the two clamping rollers 71.

[0273] The two auxiliary rollers 72 are located below the two clamping rollers 71, respectively. The arrangement direction of the two clamping rollers 71 is the direction from one clamping roller 71 to the other clamping roller 71. The clamping and separating assembly 7 further comprises a driving motor 74 connected to the clamping roller 71 through a transmission mechanism 75, and the driving motor 74 is used to drive the clamping roller 71 to rotate through the transmission mechanism 75. The transmission mechanism 75 can be a belt transmission mechanism, which can comprise a belt pulley and a belt. When the clamping roller 71 rotates, it drives the transmission belt 73 wound thereon to move, so that the transmission belt 73 transmits the separated part 11 away from the retained part 12 of the conductive layer 1. In this embodiment, the transmission belt 73 can transmit the separated part 11 away from the retained part 12 of the conductive layer 1, so as to avoid the winding of the separated part 11 on the clamping roller 71.

[0274] It should be noted that in FIG. 21, when the clamping and separating assembly 7 includes the clamping roller 71 and does not include the conveying belt 73, a scraping mechanism and a protective cover need to be installed on both sides and above the clamping roller 71. The scraping mechanism can scrape the separated part 11 wound on the clamping roller 71, so as to avoid the separated part 11 from being wound on the clamping roller 71 again through the rotation of the clamping roller 71. The protective cover can avoid the separated part 11 from hanging on the shaft of the clamping roller 71.

[0275] In an optional embodiment of the present application, referring to FIG. 15 and FIG. 18, the separating device includes the clamping assembly 5 located below the first carrier 2, the clamping assembly 5 being used for clamping the separated part 11 in the blown-off conductive layer 1; the separating device further includes a separating driving member used for driving the clamping assembly 5 to move; and / or, the first carrier 2 includes a conveying assembly used for conveying and adsorbing the conductive layer.

[0276] In the optional embodiment, the clamping assembly 5 can be integrated with the oscillating blowing assembly 3. The clamping assembly 5 can be installed on the second support 35. Preferably, the first carrier 2 includes the conveying assembly, and the separating device further includes the separating driving member. It should be noted that when the separating driving member drives the clamping assembly 5 to move, the conveying assembly can not work. The separating driving member is specifically used for driving the clamping assembly 5 to move along the length direction of the second support 35. After the blowing device blows the separated part 11 away, the end of the separated part 11 can be adhered to the retained part 12. After blowing, the clamping assembly 5 clamps and separates the separated part 11, so as to ensure the complete separation of the separated part 11 from the retained part 12 and improve the overall waste removal rate.

[0277] In an optional embodiment of the present application, referring to FIG. 15 and FIG. 18, the clamping assembly 5 includes a first clamping strip 55 and a second clamping strip 52; the clamping assembly 5 further includes a clamping driving member 53 used for driving the first clamping strip 55 or the second clamping strip 52 to move along the length direction of the first clamping strip 55; the first clamping strip 55 and the second clamping strip 52 are stacked, the first clamping strip 55 is provided with a plurality of clamping grooves 511 along the length direction of the first clamping strip 55, and the second clamping strip 52 includes a plurality of clamping hooks 521 arranged at intervals along the length direction of the first clamping strip 55; or, the first clamping strip 55 and the second clamping strip 52 respectively include a plurality of first clamping claws and a plurality of second clamping claws arranged at intervals along the length direction of the first clamping strip, and the first clamping claws and the second clamping claws are alternately arranged along the length direction of the first clamping strip 55.

[0278] The clamping driving member 53 is specifically configured to directly drive the second clamping strip 52 to move, so as to drive the second clamping strip 52 to move relative to the first clamping strip 55. The clamping driving member 53 can be a pneumatic cylinder. Preferably, the clamping driving member 53 is configured to drive the second clamping strip 52 to move along the length direction of the first clamping strip 55, and the first clamping strip 55 is fixed on the second support 35. The length direction of the first clamping strip 55 can be parallel to the arrangement direction of the finger-shaped conductive part 121 in the conductive layer 1, and the length direction of the first clamping strip 55 can refer to the direction shown by the C arrow in FIG. 15 and FIG. 18, and the arrangement direction of the finger-shaped conductive part 121 in the conductive layer 1 can refer to the direction shown by the A arrow in FIG. 12.

[0279] When the clamping assembly 5 is integrated with the oscillating air blowing assembly 3, the first clamping strip 55 is connected with the second support 35 through the second guide rail sliding block mechanism 54. The second guide rail sliding block mechanism 54 can include a second sliding block and a second guide rail, the second guide rail can be arranged on the second support 35, and the second sliding block is slidingly connected with the second guide rail, and the second sliding block is connected with the first clamping strip 55.

[0280] The second clamping strip 52 moves specifically reciprocatingly along the length direction of the first clamping strip 55. In this embodiment, the first clamping strip 55 and the second clamping strip 52 respectively include a plurality of first clamping claws and a plurality of second clamping claws. Initially, the first clamping claws and the second clamping claws have a certain gap therebetween, and the separated part 11 is blown off and falls between the first clamping claws and the second clamping claws, and then the second clamping strip 52 moves to drive the second clamping claws to move towards the first clamping claws, so as to clamp the separated part 11.

[0281] The shape of the clamping hook 521 can be L-shaped. In this embodiment, the first clamping strip 55 is provided with a plurality of clamping grooves 511, and the second clamping strip 52 includes a plurality of clamping hooks 521. The separated part 11 is blown off and falls into the clamping grooves 511, and then the second clamping strip 52 moves to realize clamping of the separated part 11 under the cooperation of the clamping hooks 521 and the clamping grooves 511.

[0282] The shape of the clamping groove 511 can be V-shaped, so that the separated part 11 can better enter the clamping groove 511. It should be noted that, since the width of the clamping groove 511 or the distance between the first clamping claws and the second clamping claws is small, even if the finger-shaped conductive part 121 is blown off, it will not fall into the clamping groove 511 or between the first clamping claws and the second clamping claws. Therefore, the distance between the clamping assembly 5 and the conductive layer 1 can not be limited.

[0283] In an optional embodiment of the present application, referring to Fig. 22, the separating device comprises a rolling brush 4, which is used to contact the side of the conductive layer 1 facing away from the first carrier 2. The surface of the rolling brush 4 is provided with a row of bristles, by which the separated parts 11 in the conductive layer 1 can be scraped off. During the process of scraping off the separated parts 11 in the conductive layer 1 by the rolling brush 4, the rolling brush 4 rotates and moves at the same time, so as to scrape off the separated parts 11 in the whole conductive layer 1.

[0284] In an optional embodiment of the present application, referring to Figs. 23-25, the photovoltaic backboard manufacturing device further comprises a local pressing device 8, which is used to locally press the separated parts of the conductive layer 1 and the backboard provided with the adhesive layer; the local pressing device 8 comprises an upper pressing plate 81 and a lower pressing plate 82, the upper pressing plate 81 is provided with a first avoiding groove 811, and / or the lower pressing plate 82 is provided with a second avoiding groove 822.

[0285] The upper pressing plate 81 comprises a protruding part 812, which has an upper pressing surface, and the protruding part 812 can be a long strip-shaped protrusion, the length direction of the long strip-shaped protrusion is parallel to the width direction of the upper pressing plate 81. The lower pressing plate 82 has a lower pressing surface 821, and during hot pressing, the upper pressing surface of the protruding part 812 cooperates with the lower pressing surface 821 to locally press the separated parts 12 of the conductive layer 1 and the backboard provided with the adhesive layer. The shape and size of the first avoiding groove 811 and the second avoiding groove 822 can match the separated parts 11. In this embodiment, by the cooperation of the first avoiding groove 811 and the second avoiding groove 822, the separated parts 11 in the conductive layer 1 can be prevented from being adhered to the backboard during hot pressing.

[0286] Referring to Figs. 26 and 27, the present application further discloses a second carrier 6 and a suction device, the second carrier 6 is used to suck the conductive layer 1, and the conductive layer 1 is located on the upper surface of the second carrier 6.

[0287] In an embodiment, the suction device comprises a suction cover 9, which is located above the second carrier 6, and the suction cover 9 sucks the separated parts 11 in the conductive layer 1 one by one into the collecting device.

[0288] In another embodiment, the suction device comprises a suction nozzle assembly 110, which is located above the second carrier 6. The suction nozzle assembly 110 can comprise a suction nozzle fixing support and a plurality of suction nozzles, the suction nozzle fixing support can move up and down and left and right, and the suction nozzles can be connected to the suction nozzle fixing support by elastic members, and the suction nozzles are used to suck the separated parts 11 in the conductive layer 1. The size of the suction nozzles can be consistent with the size of the separated parts 11.

[0289] It should be noted that the suction nozzle assembly 110 can be used in cooperation with two oppositely arranged and oppositely rotating clamping rollers. After the suction nozzle assembly 110 first lowers to suck the separation part 11, the separation part 11 is lifted upward to a certain height, and then the two clamping rollers clamp the separation part 11 and lift the separation part 11 upward as a whole. When the separation part 11 is separated from the retained part 12, the separation part 11 is removed to the collecting device.

[0290] It should be noted that in this document, the terms "comprise", "comprising", or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements recited, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, an element defined by the statement "comprising a" does not exclude the existence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0291] The terms "first", "second", and the like in the description and claims of this application are used for distinguishing between similar objects and are not necessarily used in a sequence, unless explicitly stated that the sequence is intended. It should be understood that the data used in the description and claims of this application can be interchanged, where appropriate, so that the embodiments of this application can be carried out in other sequences than those described or illustrated herein. The objects distinguished by "first", "second", etc. are generally a class, and the number of objects is not limited, for example, the first object can be one or more.

[0292] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium; it can be internal connection of two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0293] The above only describes the preferred embodiments of the present application, and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application is included in the protection scope of the present application.

Claims

1. A photovoltaic backsheet processing apparatus, wherein, The photovoltaic backboard processing equipment comprises: a carrier table with a conveying surface, and a stripping mechanism and a laminating mechanism arranged on the carrier table; the conveying surface of the carrier table is used for conveying the conductive layer so that the conductive layer sequentially passes through the stripping mechanism and the laminating mechanism; the stripping mechanism is used for stripping the to-be-stripped area in the conductive layer, and the laminating mechanism is used for laminating the conductive layer after stripping and the backboard provided with the adhesive layer.

2. The photovoltaic backsheet processing apparatus of claim 1, wherein, a pattern structure is formed on the surface of the conductive layer, and the pattern structure has the to-be-stripped area; and the conveying surface of the carrier table is provided with an adsorption device used for adsorbing the conductive layer.

3. The photovoltaic backsheet processing apparatus of claim 2, wherein, the adsorption device is a vacuum adsorption carrier plate; the vacuum adsorption carrier plate is provided with adsorption holes, and when the vacuum adsorption carrier plate adsorbs the conductive layer, the positions of the adsorption holes do not overlap with the to-be-stripped area.

4. The photovoltaic backsheet processing apparatus of claim 3, wherein, the pattern structure comprises: a plurality of areas arranged side by side along the width direction of the conductive layer, each of the areas comprises a plurality of spaced sub-areas connected in sequence, and the plurality of sub-areas are arranged in a bending manner in the area; and the sub-areas of the plurality of areas constitute the to-be-stripped area; when the vacuum adsorption carrier plate adsorbs the conductive layer, the positions corresponding to the long sides outside each of the areas in the vacuum adsorption carrier plate are provided with first adsorption holes arranged at intervals, and the positions between at least one group of adjacent sub-areas in each of the areas are provided with second adsorption holes arranged at intervals; the size of the second adsorption hole is smaller than the size of the first adsorption hole.

5. The photovoltaic backsheet processing apparatus of claim 4, wherein, the arrangement direction of the second adsorption hole is perpendicular to the arrangement direction of the first adsorption hole, and the interval distance between the second adsorption holes is smaller than the interval distance between the first adsorption holes.

6. The photovoltaic backsheet processing apparatus of claim 4 or 5, wherein, when the vacuum adsorption carrier plate adsorbs the conductive layer, the minimum distance between the edge of the second adsorption hole and the edge of the to-be-stripped area is 0.1mm to 2mm.

7. The photovoltaic backboard processing equipment according to claim 2, wherein the stripping mechanism comprises: a turnover device and a stripping device; after the adsorption device adsorbs the conductive layer, the adsorption device moves to the turnover device, the turnover device first turns over the adsorption device by rotating so that the side of the conductive layer away from the adsorption device faces the direction of gravity; after the first turning over of the adsorption device, the stripping device is located at the position of the side of the conductive layer away from the adsorption device; the stripping device is used for contacting the side of the conductive layer away from the adsorption device after the first turning over of the adsorption device, so that the to-be-stripped area in the conductive layer is separated.

8. The photovoltaic backsheet processing apparatus of claim 7, wherein, the stripping mechanism further comprises: a conveying device; after the stripping device works, the turnover device turns over the adsorption device again by rotating so that the side of the conductive layer away from the adsorption device faces away from the direction of gravity; after the second turning over of the adsorption device, the conveying device is used for grabbing the backboard provided with the adhesive layer placed on the feeding table and laminating the side of the backboard provided with the adhesive layer and the side of the conductive layer away from the adsorption device.

9. The photovoltaic backsheet processing apparatus of claim 7 or 8, wherein, The peeling device comprises: a blower; the air outlet direction of the blower faces the side of the conductive layer away from the adsorption device; the air outlet width of the blower is greater than or equal to the width of the pattern structure in the conductive layer; Or, the peeling device comprises: a brush; the brush is used to contact the side of the conductive layer away from the adsorption device; the width of the brush is greater than or equal to the width of the pattern structure in the conductive layer; Or, the peeling device comprises: a roller; the roller is used to contact the side of the conductive layer away from the adsorption device; the width of the roller is greater than or equal to the width of the pattern structure in the conductive layer; the surface of the roller is provided with a flexible contact layer; the surface of the flexible contact layer is provided with flexible protruding structures at intervals.

10. The photovoltaic backsheet processing apparatus of claim 2, wherein, The photovoltaic backboard processing equipment further comprises: a feeding and cutting device and a laser plate making device arranged on the loading platform; The feeding and cutting device is located at the feeding end of the loading platform, and the laser plate making device is located between the feeding and cutting device and the peeling mechanism; The feeding and cutting device is provided with a conductive layer roll; the feeding and cutting device is used to lead out one end of the conductive layer roll to the conveying surface and cut to form the conductive layer; The laser plate making device is used to perform laser drawing on the passing conductive layer to form the pattern structure on the surface of the conductive layer.

11. The photovoltaic backsheet processing apparatus of claim 1, wherein, The photovoltaic backboard processing equipment further comprises: a visual detection device and a cleaning device; The visual detection device and the cleaning device are arranged at a position behind the laminating mechanism in the loading platform; The visual detection device is used to perform image acquisition and image recognition on the laminated conductive layer and backboard; The cleaning device is used to remove residues when it is identified that there are residues in the to-be-peeled area of the conductive layer.

12. A method of processing a photovoltaic backsheet, wherein, It comprises: Obtaining a conductive layer with a pattern structure on the surface, the pattern structure having a to-be-peeled area; Peeling the to-be-peeled area in the conductive layer; Laminating the conductive layer after peeling and a backboard provided with an adhesive layer to obtain a photovoltaic backboard.

13. The photovoltaic backsheet processing method of claim 12, wherein, The peeling of the to-be-peeled area in the conductive layer comprises: Turning over the conductive layer to make the side of the conductive layer provided with the pattern structure face the direction of gravity; Controlling a peeling device to contact the side of the conductive layer provided with the pattern structure to make the to-be-peeled area in the conductive layer separate.

14. The photovoltaic backsheet processing method of claim 12, wherein, The obtaining of the conductive layer with a pattern structure on the surface comprises: Leading out a continuous conductive layer from one end of a conductive layer roll and cutting to form the conductive layer; Performing laser drawing on the conductive layer to form the pattern structure on the surface of the conductive layer.

15. The photovoltaic backsheet processing method of claim 12, wherein, The laminating of the conductive layer after peeling and the backboard provided with an adhesive layer comprises: Stacking the backboard provided with an adhesive layer and the conductive layer after peeling to form a to-be-processed piece; the adhesive layer is located between the backboard and the conductive layer after peeling; Laminating the to-be-processed piece.

16. The photovoltaic backsheet processing method of claim 12, wherein, After laminating the conductive layer after peeling and the backboard provided with an adhesive layer, the method further comprises: Performing image acquisition and image recognition on the laminated conductive layer and backboard; Removing residues when it is identified that there are residues in the to-be-peeled area of the conductive layer.

17. An adsorption device, wherein, The adsorption device comprises: a vacuum adsorption carrier plate; a first adsorption hole is arranged on the vacuum adsorption carrier plate in a first direction, and a second adsorption hole is arranged on the vacuum adsorption carrier plate in a second direction, the first direction intersects the second direction, the first adsorption hole and the second adsorption hole are different in size; when the vacuum adsorption carrier plate adsorbs the conductive layer, the positions of the first adsorption hole and the second adsorption hole do not overlap with the region to be peeled in the conductive layer.

18. A method of making a photovoltaic backsheet, wherein, comprise: at least obtaining a conductive layer with a surface having a pattern structure, wherein the pattern structure has a part to be separated, and at least the part to be separated in the conductive layer is not connected with a back plate; blowing on the part to be separated in the conductive layer; separating the part to be separated in the conductive layer.

19. The photovoltaic backsheet preparation method according to claim 18, wherein, The blowing on the part to be separated in the conductive layer comprises: blowing on the part to be separated in the conductive layer by an oscillating blowing assembly; wherein the oscillating blowing assembly comprises a blowing nozzle capable of periodic reciprocating motion.

20. The photovoltaic backsheet preparation method according to claim 18, wherein, The separating the part to be separated in the conductive layer comprises: picking up the part to be separated in the conductive layer blown away; causing relative motion between the part to be separated and the part to be retained in the conductive layer to separate the part to be separated in the conductive layer.

21. The photovoltaic backsheet preparation method according to claim 20, wherein, The causing relative motion between the part to be separated and the part to be retained in the conductive layer comprises: transmitting the part to be separated in a direction away from the part to be retained in the conductive layer.

22. The photovoltaic backsheet preparation method of any one of claims 18-21, wherein, The at least obtaining a conductive layer with a surface having a pattern structure comprises: only obtaining a conductive layer with a surface having a pattern structure; after the separating the part to be separated in the conductive layer, further comprising: pressing the conductive layer after separation and a back plate provided with an adhesive layer to obtain a photovoltaic back plate.

23. The photovoltaic backsheet preparation method of any of claims 18-21, wherein, Before the at least obtaining a conductive layer with a surface having a pattern structure, comprising: partially pressing the part to be retained in the conductive layer and the back plate provided with the adhesive layer; The at least obtaining a conductive layer with a surface having a pattern structure comprises: obtaining the conductive layer, the adhesive layer and the back plate after partial pressing; forming a pattern structure on the surface of the conductive layer.

24. An apparatus for the production of a photovoltaic backsheet, wherein, comprise: a blowing device for blowing on a part to be separated in a pattern structure in a conductive layer, wherein at least the part to be separated in the conductive layer is not connected with a back plate; a separating device for separating the part to be separated in the conductive layer.

25. The photovoltaic backsheet production apparatus of claim 24, wherein, The blowing device comprises an oscillating blowing assembly, and the oscillating blowing assembly comprises a blowing nozzle capable of periodic reciprocating motion.

26. The photovoltaic backsheet production apparatus of claim 24 or 25, wherein, The distance between the blowing device and the conductive layer in the thickness direction of the conductive layer is greater than or equal to 55 mm.

27. The photovoltaic backsheet production apparatus of claim 24 or 25, wherein, The flow rate of the airflow blown by the blowing device is greater than or equal to 600 L / min and less than or equal to 750 L / min.

28. The photovoltaic backsheet production apparatus of claim 24, wherein, The photovoltaic back plate preparation equipment further comprises a first carrier, and the first carrier is used at least for adsorbing the conductive layer, and the conductive layer is located below the first carrier.

29. The photovoltaic backsheet production apparatus of claim 28, wherein, The separating device comprises a picking-up and separating assembly, and the picking-up and separating assembly is located below the first carrier; The picking-up and separating assembly comprises two oppositely arranged and oppositely rotating nip rollers.

30. The photovoltaic backsheet production apparatus of claim 29, wherein, The distance between the pinch-off assembly and the conductive layer is greater than the length of the finger-shaped conductive part in the pattern structure along the thickness direction of the conductive layer.

31. The photovoltaic backsheet production apparatus of claim 29, wherein, The pinch-off assembly further comprises an anti-winding mechanism. The anti-winding mechanism comprises two auxiliary rollers and two transmission belts, and each of the transmission belts is arranged around the auxiliary roller and the clamp roller on the same side of the pinch-off assembly along the arrangement direction of the two clamp rollers.

32. The photovoltaic backsheet preparation apparatus of claim 28, wherein, The separation device further comprises a separation driving member for driving the pinch-off assembly to move. The first carrier comprises a transmission assembly for transmitting and adsorbing the conductive layer. The pinch-off assembly comprises a first clamp strip and a second clamp strip.

33. The photovoltaic backsheet production apparatus of claim 32, wherein, The pinch-off assembly further comprises a clamp driving member for driving the first clamp strip or the second clamp strip to move along the length direction of the first clamp strip. The first clamp strip and the second clamp strip are arranged in a stack, the first clamp strip is provided with a plurality of clamp grooves along the length direction of the first clamp strip, and the second clamp strip comprises a plurality of clamp hooks arranged at intervals along the length direction of the first clamp strip. Alternatively, the first clamp strip and the second clamp strip respectively comprise a plurality of first clamp claws and a plurality of second clamp claws arranged at intervals along the length direction of the first clamp strip, and the first clamp claws and the second clamp claws are arranged alternately along the length direction of the first clamp strip. The separation device comprises a rolling brush for contacting the side of the conductive layer away from the first carrier.

34. The photovoltaic backsheet production apparatus of claim 28, wherein, The photovoltaic backboard preparation equipment further comprises a local pressing device for locally pressing the conductive layer and the backboard provided with the adhesive layer.

35. The photovoltaic backsheet preparation apparatus of claim 24, wherein, The local pressing device comprises an upper pressing plate and a lower pressing plate, the upper pressing plate is provided with a first avoiding groove, and / or the lower pressing plate is provided with a second avoiding groove. ​

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