Heat dissipation structure and cleaning device

Abstract

Embodiments of the present application relate to the technical field of cleaning devices. Disclosed are a heat dissipation structure and a cleaning device. The heat dissipation structure comprises a housing, a heat conduction element, and a heat dissipation element. During use, a device to be cooled is arranged on an assembly position of the housing, heat generated by the device to be cooled can be transferred by means of the heat conduction element, and the heat can be transferred to an expected position by means of the heat conduction element, e.g., to the surface of the housing facing away from the assembly position, that is, the heat can be transferred outside the housing, and finally is dissipated by means of the heat dissipation element. Heat can be discharged to the expected position, and does not need to be accumulated in the housing, which can greatly improve the heat dissipation efficiency and ensure the working safety and stability of the device to be cooled.

Description

Heat dissipation structure and cleaning device

[0001] Cross-reference to Related Applications

[0002] This application claims priority to the Chinese Patent Application No. 202420803101.1, filed on April 17, 2024, and entitled “Heat dissipation structure and cleaning device”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] Embodiments of the present application relate to the technical field of cleaning devices, and in particular, to a heat dissipation structure and a cleaning device. BACKGROUND

[0004] With the increasing functionality of various cleaning products, the power of the chips is also increasing, which leads to a surge of heat near the mainboard of the entire machine. The excessive heat cannot meet the safety requirements and poses a certain safety hazard. How to dissipate heat more efficiently and protect the heat dissipation of key positions becomes a key problem.

[0005] SUMMARY

[0006] The present application aims to at least solve one of the problems in the prior art or related art.

[0007] To this end, a first aspect of embodiments of the present application provides a heat dissipation structure.

[0008] A second aspect of embodiments of the present application provides a cleaning device.

[0009] Therefore, according to the first aspect of embodiments of the present application, a heat dissipation structure is provided, comprising:

[0010] A housing, wherein a mounting position is formed on the housing, and the mounting position is used to arrange a device to be cooled;

[0011] A heat conduction member, wherein at least part of the heat conduction member is arranged in the housing, and one end of the heat conduction member is arranged close to the mounting position;

[0012] A heat dissipation member, wherein the heat dissipation member is arranged on the housing, and the heat dissipation member is connected to the heat conduction member.

[0013] In a feasible implementation, the other end of the heat conduction member extends out of the housing.

[0014] In a feasible implementation, the housing comprises:

[0015] A first housing;

[0016] A second housing, wherein the first housing is connected to the second housing, and the device to be cooled is arranged between the first housing and the second housing.

[0017] The heat-conducting member is arranged in the second housing, and the heat-dissipating member is connected to the second housing.

[0018] In an implementation, the second housing is formed with a device mounting position, the heat-conducting member is arranged on the inner wall of the device mounting position, and the device mounting position is arranged close to the assembly position.

[0019] In an implementation, the device to be cooled includes a mainboard.

[0020] The device mounting position includes a power supply mounting position.

[0021] In an implementation, the material for preparing the heat-conducting member includes a graphite sheet; and / or

[0022] The material for preparing the heat-dissipating member includes a metal member or a graphite sheet.

[0023] In an implementation, the heat-conducting member includes a plurality of bent segments, part of the bent segments is arranged to abut against the inner wall of the housing, and part of the bent segments is arranged to abut against the device arranged in the housing.

[0024] In an implementation, the heat-dissipating structure further includes:

[0025] A heat-conducting silica gel layer, the heat-dissipating member is connected to the heat-conducting member through the heat-conducting silica gel.

[0026] According to a second aspect of the embodiments of the present application, a cleaning device is provided, including:

[0027] The heat-dissipating structure according to any of the above technical solutions;

[0028] The heat-dissipating structure includes the housing, the heat-conducting member and the heat-dissipating member, the device to be cooled is arranged on the assembly position of the housing, the heat energy generated by the device to be cooled is transferred to a desired position through the heat-conducting member, and is dissipated through the heat-dissipating member.

[0029] In an implementation, the cleaning device further includes:

[0030] A mainboard, the mainboard is arranged on the assembly position;

[0031] A power supply, the power supply is arranged in the housing, and the heat-conducting member wraps part of the area of the power supply.

[0032] In an implementation, the cleaning device further includes:

[0033] A cover body is connected to the shell and covers the power supply member.

[0034] According to a third aspect of the present application, a heat dissipation structure is provided, comprising:

[0035] A shell is provided with a device to be cooled inside;

[0036] A heat dissipation part has a first end extending to the peripheral side of the device to be cooled and a second end extending to a desired position.

[0037] In an available embodiment, the heat dissipation part is of an integrated structure.

[0038] In an available embodiment, the first end of the heat dissipation part is in contact with the device to be cooled.

[0039] Alternatively, the first end of the heat dissipation part extends to the peripheral side of the device to be cooled and is arranged separately from the device to be cooled.

[0040] In an available embodiment, the second end of the heat dissipation part is attached to the surface of the shell.

[0041] In an available embodiment, the second end of the heat dissipation part is arranged separately from the outer wall of the shell.

[0042] In an available embodiment, the shell is provided with a cover body, and the second end of the heat dissipation part is in contact with the side of the cover body facing the shell.

[0043] In an available embodiment, the heat dissipation structure further comprises a silica gel heat conduction member, and the heat dissipation part is connected to the cover body through the silica gel heat conduction member.

[0044] In an available embodiment, the shell is formed with a device mounting position inside, and a part of the heat dissipation part is arranged in the device mounting position.

[0045] In an available embodiment, the heat dissipation part is arranged in attachment to the inner wall of the device mounting position.

[0046] In an available embodiment, at least a part of the heat dissipation part is bent so as to extend around the edge of the device mounting position.

[0047] In an embodiment, the heat dissipation part comprises a first segment and a second segment, the first segment is connected to the second segment and is arranged at an angle, the first segment is connected to the device to be cooled, the second segment extends to the edge of the shell from the end of the first segment, the first segment is arranged at a first side of the device mounting position, the second segment is arranged at a second side of the device mounting position, and the first side and the second side are adjacent sides.

[0048] In an embodiment, the heat dissipation part comprises a third segment, the first segment, the second segment and the third segment are connected in sequence at an angle, the third segment is arranged at a third side of the device mounting position, and the third segment is located at the edge of the shell.

[0049] In an embodiment, the heat dissipation part comprises a fourth segment, the fourth segment is connected to the first segment and the third segment respectively, so that at least a part of the heat dissipation part is enclosed into a ring, and the device mounting position is located inside the ring.

[0050] According to a fourth aspect of the embodiments of the present application, a cleaning device is provided, comprising the heat dissipation structure according to any of the above technical solutions.

[0051] The heat dissipation structure comprises the shell and the heat conduction part, the device to be cooled is arranged in the shell, and the heat generated by the device to be cooled is transferred to a desired position by the heat conduction part and dissipated.

[0052] In an embodiment, the cleaning device comprises:

[0053] A mainboard, which is arranged in the shell;

[0054] A power supply, which is arranged in the device mounting position when the device mounting position is formed in the shell, and the heat conduction part is in abutment with the power supply.

[0055] Compared with the prior art, the present application has at least the following beneficial effects:

[0056] The heat dissipation structure provided by the embodiment of the present application comprises a shell, a heat conduction member and a heat dissipation member. In use, the device to be cooled is arranged on the assembly position of the shell. The heat generated by the device to be cooled can be transferred through the heat conduction member. The heat can be transferred to the desired position through the heat conduction member, such as the surface of the shell away from the assembly position, that is, the heat can be transferred out of the shell. Finally, the heat is dissipated through the heat dissipation member, and the heat can be discharged to the desired position. The heat does not need to be stored in the shell, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the device to be cooled. For example, the heat dissipation structure provided by the embodiment of the present application is applied to a cleaning device. The mainboard of the cleaning device can be arranged on the assembly position. The heat generated by the mainboard during operation can be transferred to the heat dissipation member through the heat conduction member. The heat can be quickly discharged out of the shell, which can greatly improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0057] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The detailed description is made with reference to the accompanying drawings.

[0058] FIG. 1 is a schematic structural diagram of an exploded state of a heat dissipation structure according to an embodiment of the present application;

[0059] FIG. 2 is a schematic structural diagram of an exploded state of a cleaning device according to an embodiment of the present application;

[0060] FIG. 3 is a schematic structural diagram of a cleaning device according to an embodiment of the present application;

[0061] FIG. 4 is a top view of a cleaning device according to an embodiment of the present application;

[0062] FIG. 5 is a schematic structural diagram of another exploded state of a cleaning device according to an embodiment of the present application;

[0063] FIG. 6 is a schematic structural diagram of a heat dissipation part according to an embodiment of the present application;

[0064] FIG. 7 is a schematic structural diagram of a heat dissipation part according to another embodiment of the present application;

[0065] FIG. 8 is a schematic structural diagram of a heat dissipation part according to still another embodiment of the present application.

[0066] Correspondence between the reference signs and the component names in Figures 1 to 3 is as follows: 110, housing; 120, heat conduction member; 130, heat dissipation member; 140, heat conduction silica gel layer; 111, first housing; 112, second housing; 210, mainboard; 220, power supply member; 230, cover; 310, first section; 320, second section; 330, third section; 340, fourth section. DETAILED DESCRIPTION

[0067] In order to better understand the above technical solutions, the technical solutions of the embodiments of the present application will be described in detail below with the aid of the drawings and specific embodiments. It should be understood that the specific features in the embodiments of the present application and the specific embodiments are detailed descriptions of the technical solutions of the embodiments of the present application, and are not limitations of the technical solutions of the present application. In the case of no conflict, the technical features in the embodiments of the present application and the specific embodiments can be combined with each other.

[0068] The embodiments of the present application consider that in the conventional technology, the heat dissipation scheme of the mainboard of the automatic cleaning device including but not limited to the sweeping robot is basically to transmit the local heat to the heat dissipation aluminum extrusion through the heat conduction silica gel, and the heat dissipation aluminum extrusion spreads the heat through the high heat conduction and the larger cross-sectional area. In some schemes, the heat dissipation system includes an upper shell assembly, a heat dissipation aluminum extrusion, a shielding cover, a heat conduction silica gel, a mainboard and a lower shell assembly. The mainboard is locked on the lower shell assembly by screws, the heat conduction silica gel is pasted on the mainboard, the shielding cover is clamped on the mainboard by the clips on the mainboard and presses the heat conduction silica gel, the heat dissipation aluminum extrusion is also locked on the mainboard by screws and is directly above the shielding cover, and finally the upper shell assembly is locked on the lower shell assembly. In this way, the heat on the mainboard is spread through the heat conduction silica gel, the shielding cover and the heat dissipation aluminum extrusion in turn, but the heat dissipation aluminum extrusion is still inside the whole machine and has a gap with the upper shell assembly, and the heat is not directly conducted out of the whole machine, resulting in low heat dissipation efficiency. At the same time, the aluminum extrusion related heat dissipation scheme occupies a large space and has relatively large limitations.

[0069] As shown in Figure 1, in view of this, according to the first aspect of the embodiments of the present application, a heat dissipation structure is provided, which comprises: a housing 110, a mounting position is formed on the housing 110, and the mounting position is used to set a device to be cooled; a heat conduction member 120, at least part of the heat conduction member 120 is arranged in the housing 110, and one end of the heat conduction member 120 is arranged close to the mounting position; a heat dissipation member 130, the heat dissipation member 130 is arranged on the housing 110, and the heat dissipation member 130 is connected to the heat conduction member 120.

[0070] The heat dissipation structure provided by the embodiment of the present application comprises a shell 110, a heat conducting member 120 and a heat dissipating member 130. In use, the device to be cooled is arranged on the assembly position of the shell 110. The heat generated by the device to be cooled can be transferred through the heat conducting member 120. The heat can be transferred to the desired position, such as the surface of the shell 110 away from the assembly position, that is, the heat can be transferred out of the shell 110. Finally, the heat is dissipated through the heat dissipating member 130, which can discharge the heat to the desired position. The heat does not need to be stored in the shell 110, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the device to be cooled. For example, the heat dissipation structure provided by the embodiment of the present application is applied to a cleaning device. The mainboard 210 of the cleaning device can be arranged on the assembly position. The heat generated by the mainboard 210 during operation can be transferred to the heat dissipating member 130 through the heat conducting member 120. The heat can be quickly discharged out of the shell 110, which can greatly improve the heat dissipation efficiency.

[0071] It can be understood that the heat conducting member 120 is arranged close to the assembly position. The heat conducting member 120 can be in abutment with the assembly position, or part of the heat conducting member 120 can be located in the assembly position, or the heat conducting member 120 can be spaced apart from the assembly position. The present application aims to transfer the heat generated by the device to be cooled to the heat conducting member 120. The specific layout and distance between the heat conducting member 120 and the assembly position are not limited in the present application, as long as the heat generated by the device to be cooled can be transferred to the heat conducting member 120.

[0072] The heat dissipation structure provided by the embodiment of the present application can transfer the heat out of the shell 110, which can improve the heat dissipation efficiency. Meanwhile, the heat conducting member 120 can be located in the shell 110, and the heat dissipating member 130 is connected to the heat conducting member 120, which can reduce the space occupied by the heat dissipation component and facilitate the reduction of the volume of the heat dissipation structure and the electric appliance equipped with the heat dissipation structure.

[0073] As shown in FIG. 1, in a possible implementation, the other end of the heat conducting member 120 extends out of the shell 110.

[0074] In the technical solution, the layout of the heat conducting member 120 is further provided. One end of the heat conducting member 120 is arranged close to the assembly position, and the other end extends out of the shell 110. After the heat is generated by the device to be cooled, the heat can be first transferred to the heat conducting member 120, and then transferred out of the shell 110 through the heat conducting member 120, which can greatly improve the heat dissipation efficiency, avoid the accumulation of heat in the shell 110, and reduce the working temperature of the device to be cooled, thereby improving the performance and service life.

[0075] As shown in FIG. 1, in a possible implementation, the shell 110 comprises: a first shell 111; a second shell 112, the first shell 111 being connected to the second shell 112, the device to be cooled being arranged between the first shell 111 and the second shell 112; the heat-conducting member 120 being arranged in the second shell 112, and the heat-dissipating member 130 being connected to the second shell 112.

[0076] In the technical solution, the structure of the shell 110 is further provided, the shell 110 can comprise the first shell 111 and the second shell 112, the device to be cooled can be connected to the second shell 112 first, and then the first shell 111 is connected to the second shell 112, based on which the device to be cooled can be fixed between the first shell 111 and the second shell 112, so that the device to be cooled is packaged conveniently, and the fixing of the device to be cooled is more reliable.

[0077] In the technical solution, the heat-conducting member 120 is arranged in the second shell 112, and the heat-dissipating member 130 is connected to the second shell 112, based on which the heat energy can be transmitted to the expected area through the arrangement of the heat-conducting member 120 and the heat-dissipating member 130, so that the heat energy is avoided from being accumulated in the shell 110, especially in the first shell 111 and the second shell 112, and the heat dissipation efficiency is greatly improved.

[0078] In some examples, the heat-dissipating member 130 can be attached to the surface of the second shell 112, so that the heat energy can be transmitted to the outside of the second shell 112, the heat dissipation effect is further improved, and the heat dissipation area is larger, and the heat dissipation efficiency is improved.

[0079] In a possible implementation, the second shell 112 is formed with a device mounting position, the heat-conducting member 120 is arranged on the inner wall of the device mounting position, and the device mounting position is arranged close to the assembly position.

[0080] In the technical solution, considering that the heat-conducting member 120 is arranged in the second shell 112, which can have a certain processing difficulty, the heat-conducting member 120 can be arranged by using the current structure of the second shell 112, the second shell 112 can be provided with a device mounting position, and the device mounting position is used to arrange a device, in this case, the wall surface of the device mounting position can be used to fix the heat-conducting member 120, so that the heat-conducting member 120 is assembled conveniently, and the assembly difficulty and the production cost are reduced.

[0081] In the technical solution, considering that the second shell 112 can be provided with multiple device mounting positions to assemble different devices, in this case, the device mounting position closest to the assembly position among the multiple device mounting positions can be selected to fix the heat-conducting member 120, so that the heat energy generated by the device to be cooled can be transmitted to the heat-conducting member 120 as soon as possible.

[0082] As shown in FIG. 2 and FIG. 3, in a possible implementation, the device to be cooled includes a mainboard 210.

[0083] In this technical solution, the device to be cooled can include the mainboard 210, and this arrangement is made in consideration of the fact that the mainboard 210 will generate relatively high heat energy during operation, and the heat dissipation of the mainboard 210 by the heat-conducting member 120 and the heat-dissipating member 130 can guarantee the stability of the operation of the mainboard 210.

[0084] In a possible implementation, the device mounting position includes a power supply mounting position.

[0085] In this technical solution, the device mounting position can include the power supply mounting position, that is, the power supply mounting position is provided with the power supply 220, and the power supply 220 can be a battery. During use, the heat-conducting member 120 can also be arranged in abutment or adjacency with the battery, and based on this, the heat energy generated by the battery can also be transmitted through the heat-conducting member 120 and finally discharged through the heat-dissipating member 130, which can dissipate heat for the battery and guarantee the stability of the operation of the battery.

[0086] It is considered that heat will only conduct from high temperature to low temperature, and therefore, during the operation of the mainboard 210 and the power supply 220, the temperature of the battery will be higher than that of the heat-conducting member 120, and therefore, the heat energy of the battery will be transmitted to the heat-conducting member 120, so that the heat-conducting member 120 can dissipate heat for the battery and will not cause the temperature of the battery to rise.

[0087] In a possible implementation, the material for preparing the heat-conducting member 120 includes a graphite sheet. This arrangement is made in consideration of the fact that the graphite sheet has a unique grain orientation and uniformly conducts heat in two directions. Its sheet-like structure can well adapt to any surface, and the graphite sheet has an ultrahigh heat conductivity of 150-1500 W / m-K in the plane, is 25% lighter than aluminum and 75% lighter than copper. The high heat conductivity of the graphite sheet is mainly derived from its layered structure and the existence of covalent bonds and free electrons. This makes the graphite have a very high thermal conductivity in the layer, although the thermal conductivity perpendicular to the plane direction is low, but due to its small thickness, the heat conduction effect is not particularly poor. This characteristic makes the graphite sheet have a unique application advantage in the field of heat conduction and heat dissipation, can smooth out hot spots, and improve the heat dissipation efficiency. At the same time, it is easy to process, convenient to install, and can be smoothly attached to any plane and curved surface, and can be cut in any form according to the needs, so as to ensure that the heat-conducting member 120 can be better attached to the inner wall of the shell 110.

[0088] In a possible implementation, the material for preparing the heat-dissipating member 130 includes a metal member or a graphite sheet.

[0089] In the technical solution, the heat dissipation piece 130 can also be made of a graphite sheet material or a metal material, and such arrangement can also guarantee the heat dissipation efficiency.

[0090] In an available implementation, the heat conduction piece 120 includes a plurality of bent segments, part of the bent segments are used to abut against the inner wall of the shell 110, and part of the bent segments are used to abut against the device installed in the shell 110.

[0091] In the technical solution, the heat conduction piece 120 can include a plurality of bent segments, part of the bent segments are used to abut against the inner wall of the shell 110, and part of the bent segments are used to abut against the device installed in the shell 110, which can make the heat conduction piece 120 better fit the inner wall of the shell 110, make the heat conduction piece 120 have more contact area with the shell 110 and the heat dissipation piece 130, improve the heat dissipation efficiency, and make the heat conduction piece 120 profile-bonded with the device installation position on the second shell 112, so as to not occupy the device installation space as much as possible, make the heat dissipation structure more compact, and facilitate the size reduction.

[0092] As shown in FIG. 1, in an available implementation, the heat dissipation structure further includes a heat conduction silica gel layer 140, and the heat dissipation piece 130 is connected to the heat conduction piece 120 through the heat conduction silica gel.

[0093] In the technical solution, the heat dissipation structure can further include the heat conduction silica gel layer 140, and the heat dissipation piece 130 is connected to the heat conduction piece 120 through the heat conduction silica gel, which can connect the heat dissipation piece 130 to the heat conduction piece 120 through bonding, facilitate the establishment of the connection relationship between the heat dissipation piece 130 and the heat conduction piece 120, and improve the heat transfer efficiency between the heat conduction piece 120 and the heat dissipation piece 130, thereby improving the heat dissipation efficiency.

[0094] As shown in FIGS. 2, 3, 4 and 5, according to the second aspect of the embodiments of the present application, a cleaning device is provided, which includes the heat dissipation structure of any of the above technical solutions.

[0095] The cleaning device provided by the embodiments of the present application includes the heat dissipation structure of any of the above technical solutions, and therefore has all the beneficial effects of the heat dissipation structure.

[0096] The heat dissipation structure of the cleaning device provided in the embodiment of the present application comprises a shell 110, a heat conducting member 120 and a heat dissipating member 130. In use, the heat generating device is arranged on the assembly position of the shell 110. The heat generated by the heat generating device can be transferred through the heat conducting member 120. The heat can be transferred to the desired position through the heat conducting member 120, such as the surface of the shell 110 away from the assembly position, that is, the heat can be transferred out of the shell 110. Finally, the heat is dissipated through the heat dissipating member 130, and the heat can be discharged to the desired position. The heat does not need to be stored in the shell 110, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the heat generating device. For example, the heat dissipation structure provided in the embodiment of the present application is applied to the cleaning device. The mainboard 210 of the cleaning device can be arranged on the assembly position. The heat generated by the mainboard 210 during operation can be transferred to the heat dissipating member 130 through the heat conducting member 120. The heat can be quickly discharged out of the shell 110, which can greatly improve the heat dissipation efficiency.

[0097] As shown in FIGS. 2 and 3, in a possible implementation, the cleaning device further comprises a mainboard 210 arranged on the assembly position, and a power supply 220 arranged in the shell 110, wherein the heat conducting member 120 wraps part of the area of the power supply 220.

[0098] In the technical solution, the cleaning device can further comprise a mainboard 210 and a power supply 220. The power supply 220 can be a battery. During operation, the power supply 220 powers on the cleaning device, and the mainboard 210 controls. The mainboard 210 is arranged on the assembly position. The heat generated by the mainboard 210 can be transferred to the heat conducting member 120. The heat can be transferred to the desired position through the heat conducting member 120, such as the surface of the shell 110 away from the assembly position, that is, the heat can be transferred out of the shell 110. Finally, the heat is dissipated through the heat dissipating member 130, and the heat can be discharged to the desired position. The heat does not need to be stored in the shell 110, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the mainboard 210.

[0099] In the technical solution, the cleaning device can further comprise a power supply 220, and the heat conducting member 120 wraps part of the area of the power supply 220. Based on this, the heat generated by the power supply 220 can also be transferred through the heat conducting member 120, and finally discharged through the heat dissipating member 130, which can dissipate heat for the power supply 220 and ensure the stability of the power supply 220.

[0100] It can be understood that heat will only conduct from high temperature to low temperature, so during the working process of the main plate 210 and the power supply 220, the temperature of the power supply 220 will be higher than that of the heat conduction piece 120, and thus the heat energy of the power supply will be transmitted to the heat conduction piece 120, so that the heat conduction piece 120 can dissipate heat for the battery, and the temperature of the power supply 220 will not rise.

[0101] As shown in FIGS. 2 and 3, in a possible implementation, the cleaning device further comprises a cover 230 connected to the shell 110 and covering the power supply 220.

[0102] In the technical scheme, the cleaning device can further comprise the cover 230, and the power supply 220 can be stored by the cover 230, so that the power supply 220 is in a relatively closed environment, thereby protecting the power supply 220.

[0103] It can be understood that the heat dissipation piece 130 can be located between the cover 230 and the power supply 220, and thus the heat energy generated by the main plate 210 and the power supply 220 can be transmitted to the heat conduction piece 120, and then the heat conduction piece 120 transmits the heat energy through the heat dissipation piece 130, and finally the heat energy on the heat dissipation piece 130 can be transmitted to the outside of the cleaning device through the cover 230.

[0104] Embodiment

[0105] As shown in FIGS. 1 to 3, the cleaning device provided by the embodiment of the present application comprises a first shell 111, a main plate 210, a second shell 112, a power supply 220, a heat conduction piece 120, a heat conduction silica gel layer 140, a heat dissipation piece 130 and a cover 230.

[0106] The main plate 210 is locked on the second shell 112 by screws, and then the first shell 111 is locked together with the second shell 112 by screws. The heat conduction piece 120 comprises three bent parts A, B and C. The back glue of the A end and the B end of the heat conduction piece 120 is attached to the A end face and the B end face of the power supply mounting position of the second shell 112, and then the power supply 220 is also placed in the power supply mounting position of the second shell 112. The C end of the heat conduction piece 120 is folded back to cover the power supply 220 (the graphite sheet is a flexible material and is attached to the power supply mounting position in a shape), and the heat conduction silica gel layer 140 is naturally placed on the C end of the heat conduction piece 120. The heat dissipation piece 130 is attached to the cover 230 by back glue, and finally the assembly of the heat dissipation piece 130 and the cover 230 is locked on the second shell 112 by screws.

[0107] When the cleaning device is working, the mainboard 210 generates a large amount of heat, and the power supply 220 is directly below the mainboard 210, and only a wall thickness of the second shell 112 is between the power supply 220 and the mainboard 210, so that the heat of the mainboard 210 is transferred to the power supply 220 in a large amount, but a heat conduction piece 120 is designed here, the heat conduction piece 120 is made of graphite material, and the A end of the heat conduction piece 120 quickly transfers heat to the C end through the transverse heat conduction characteristics of the graphite sheet, and then the heat is transferred to the cover 230 through the heat conduction silica gel layer 140 and the heat dissipation piece 130, and finally the cover 230 dissipates the heat to the air outside the whole machine, thereby completing efficient heat dissipation and protecting the battery and other key components.

[0108] The cleaning device provided by the embodiment of the present application can transfer heat energy outside the cleaning device, improve heat dissipation efficiency, ensure the stability of the mainboard 210, and protect the power supply 220.

[0109] According to the third aspect of the embodiment of the present application, a heat dissipation structure is provided, which comprises: a shell 110, the shell 110 is provided with a to-be-cooled component; and a heat dissipation part, a first end of the heat dissipation part extends to the side of the to-be-cooled component, and a second end of the heat dissipation part extends to a desired position.

[0110] The heat dissipation structure provided by the embodiment of the present application comprises the shell 110 and the heat dissipation part, and the to-be-cooled component is arranged in the shell 110 during use. The heat energy generated by the to-be-cooled component can be transferred through the heat dissipation part, and the heat energy is transferred to the desired position. The desired position can be the inside or outside of the shell. For example, the desired position can be a position inside the shell and away from the heat generating component, so that the heat energy is discharged to a position away from the heat generating component, thereby avoiding the accumulation of heat energy near the to-be-cooled component. The desired position can also be located on the outside of the shell, for example, the edge of the shell, that is, the heat energy can be transferred to the edge of the shell 110 for heat dissipation. The heat energy does not need to be accumulated in the shell 110, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the to-be-cooled component. For example, the heat dissipation structure provided by the embodiment of the present application is applied to a cleaning device. The mainboard 210 of the cleaning device can be arranged in the shell 110, and the heat energy generated by the mainboard 210 during operation can be quickly discharged to the edge of the shell 110 through the heat dissipation part, thereby greatly improving the heat dissipation efficiency.

[0111] In the technical solution, the layout mode of the heat dissipation part is provided, the first end of the heat dissipation part extends to the to-be-cooled component, and the second end extends to the edge. In this way, when the to-be-cooled component generates heat energy, the heat energy can be transferred to the edge of the shell 110 through the heat dissipation part, that is, to the outside of the shell 110, which can greatly improve the heat dissipation efficiency, avoid the accumulation of heat energy in the shell 110, and reduce the working temperature of the to-be-cooled component, thereby improving the performance and service life.

[0112] The first end of the heat dissipation part extends to the device to be cooled, that is, the first end of the heat dissipation part extends to the periphery of the device to be cooled. The first end of the heat dissipation part can be in abutment with the device to be cooled, or can be spaced apart from the device to be cooled. The application is intended to enable the heat energy generated by the device to be cooled to be transferred to the heat dissipation part. The specific layout and distance between the heat dissipation part and the device to be cooled are not limited, as long as the heat energy of the device to be cooled can be transferred to the heat dissipation part.

[0113] The heat dissipation part is of an integrated structure.

[0114] In this technical solution, since the integrated structure does not have a splicing gap, the thermal resistance in the heat transfer process can be effectively reduced. After the device to be cooled generates heat energy, the heat energy can be more smoothly transferred to the outside of the shell 110 through the heat dissipation part, greatly improving the heat dissipation efficiency, ensuring that the device to be cooled works stably at a lower temperature, and protecting the performance and service life of the device to be cooled. For example, the heat energy of the mainboard 210 of the cleaning equipment can be quickly conducted out through the integrated heat dissipation part, avoiding the performance degradation of the mainboard 210 due to overheating.

[0115] The heat dissipation part is provided in an integrated structure, which makes the production and manufacturing of the heat dissipation part more convenient, without the need for a large amount of time and assembly and debugging of multiple components, reducing the error probability in the production process, improving the production efficiency, and also helping to reduce the production cost.

[0116] It should be noted that the heat dissipation part is of an integrated structure, which means that the entire heat dissipation part is a continuous whole without a splicing gap or a connecting interface. Specifically, the heat dissipation part can be made of a complete heat dissipation fin or a heat dissipation module through casting, forging, extrusion or other processes.

[0117] In one possible implementation, the first end of the heat dissipation part is in contact with the device to be cooled.

[0118] The first end of the heat dissipation part is connected to, in abutment with or in contact with the device to be cooled.

[0119] Specifically, the first end of the heat dissipation part can be fixed on the device to be cooled through heat-conducting silicone, or can be fixed on the device to be cooled through welding or screw connection or other fixed connection methods. The first end of the heat dissipation part can also be in abutment with the device to be cooled, that is, the end of the first end of the heat dissipation part is in abutment with the surface of the device to be cooled. The first end of the heat dissipation part can also be arranged in parallel with the surface of the device to be cooled and in contact with the surface of the device to be cooled.

[0120] In another possible implementation, the first end of the heat dissipation part extends to the outer periphery of the device to be cooled and is spaced apart from the device to be cooled.

[0121] The first end of the heat dissipation part is not in direct contact with the device to be cooled, and there is a spacing space between the first end of the heat dissipation part and the device to be cooled. The spacing space can be small. The heat generated by the device to be cooled is transmitted to the heat dissipation part through the air between the first end of the heat dissipation part and the device to be cooled, and then is conducted to the edge of the shell.

[0122] As a feasible implementation, the second end of the heat dissipation part is attached to the surface of the shell 110.

[0123] In this embodiment, the expected position is located on the surface of the shell 110, and the second end of the heat dissipation part is attached to the outer surface of the shell 110, that is, the second end extends and is fixed on the outer wall of the shell 110, so that the heat generated by the device to be cooled can be transmitted to the outside of the shell 110 through the heat dissipation part, thereby greatly improving the heat dissipation efficiency.

[0124] Specifically, the second end of the heat dissipation part can be fixed on the outer wall of the shell 110 by bonding, clamping or the like, thereby ensuring good connection strength and preventing the second end from falling off the outer wall of the shell 110.

[0125] As another feasible implementation, the second end of the heat dissipation part is spaced apart from the outer wall of the shell 110.

[0126] In this embodiment, the expected position is spaced apart from the outer wall of the shell 110, and the second end of the heat dissipation part is spaced apart from the outer wall of the shell 110, that is, the second end of the heat dissipation part is not in contact with the outer wall of the shell 110, and there is a certain spacing space between them. The expected position can be located on the outside of the shell 110, and the heat generated by the device to be cooled can also be transmitted to the edge of the shell 110 through the heat dissipation part, thereby greatly improving the heat dissipation efficiency.

[0127] The second end of the heat dissipation part can be connected to other components other than the shell 110, or can be suspended and not connected to any component.

[0128] In this embodiment, a cover 230 is provided outside the shell 110, and the second end of the heat dissipation part is in contact with the side of the cover facing the shell.

[0129] By making the second end of the heat dissipation part contact the cover 230, a stable setting position is provided for the second end, and at the same time, the heat generated by the device to be cooled is transmitted to the cover 230 through the heat dissipation part, and is transmitted to the outside of the cleaning equipment through the cover 230. The cover 230 has a large surface area, which can increase the heat dissipation area and accelerate the dissipation of heat to the surrounding environment. Taking the cleaning equipment as an example, the cover 230 is usually exposed to the outside, and the heat dissipation part is connected to the cover 230, so that the heat can be quickly dissipated to the air outside the equipment, thereby improving the heat dissipation efficiency and ensuring the stable operation of the internal components of the equipment.

[0130] The second end of the heat dissipation part can be fixedly connected to the side of the cover body facing the shell, or can be abutted or attached to the side of the cover body facing the shell.

[0131] The cover body 230 is arranged on the shell 110 and can provide protection for some components in the shell 110, for example, can be arranged on the outer side of the mainboard 210, thereby protecting the mainboard 210. The cover body 230 can also be arranged on the outer side of the power supply 220, thereby protecting the power supply 220. The power supply 220 can be a battery.

[0132] The heat dissipation structure further comprises a silica gel heat conduction member, and the heat dissipation part is connected to the cover body through the silica gel heat conduction member.

[0133] In this technical solution, the heat dissipation structure further comprises a silica gel heat conduction member, and the heat dissipation part is connected to the cover body through the silica gel heat conduction member. By arranging the silica gel heat conduction member, the gap and unevenness between the heat dissipation part and the cover body can be filled, the thermal resistance can be reduced, and the heat dissipation efficiency can be improved. The silica gel heat conduction member can be bonded to the heat dissipation part and the cover body respectively, which facilitates the establishment of the connection relationship between the heat dissipation part and the cover body, and at the same time can improve the heat transfer efficiency between the heat dissipation part and the cover body, thereby improving the heat dissipation efficiency.

[0134] The shell 110 is formed with a device mounting position, and a part of the heat dissipation part is arranged in the device mounting position.

[0135] In this technical solution, considering that it may have certain processing difficulty to arrange the heat dissipation part in the shell 110, the current structure of the shell 110 can be used to arrange the heat dissipation part. The shell 110 can be provided with a device mounting position for arranging devices. In this case, the wall surface of the device mounting position can be used to fix the heat dissipation part. This arrangement facilitates the assembly of the heat dissipation part and can reduce the assembly difficulty and production cost. By arranging a part of the heat dissipation part in the device mounting position, the space inside the shell 110 can be fully utilized. For example, in a cleaning device, the space layout is compact, and each component needs to be reasonably arranged. The heat dissipation part is combined with the device mounting position closely, without occupying too much space, thereby achieving efficient use of space and facilitating miniaturization and integration design of the device.

[0136] In this technical solution, considering that the shell 110 can have multiple device mounting positions for assembling different devices, in this case, the heat dissipation part can be fixed in the device mounting position closest to the device to be cooled, so that the heat generated by the device to be cooled can be quickly transferred to the heat dissipation part.

[0137] In the technical scheme, part of the heat dissipation part is arranged in the device mounting position, the heat dissipation part is closer to the device in the device mounting position, the heat transfer path is shortened, the heat generated by the device can be rapidly transferred to the heat dissipation part, the heat accumulation around the device is reduced, the heat dissipation speed is accelerated, the device working temperature is effectively reduced, the performance and stability of the device are guaranteed, and the service life is prolonged.

[0138] In the technical scheme, the cover 230 can be arranged on the device mounting position to close the device mounting position, so that the device mounting position becomes a relatively closed space, thereby providing protection for the device arranged in the device mounting position.

[0139] The heat dissipation part is arranged in abutment with the inner wall of the device mounting position.

[0140] In the technical scheme, the heat dissipation part is arranged in abutment with the inner wall of the device mounting position, so that the heat dissipation part is closer to the device in the device mounting position or directly abuts against the device in the device mounting position, the heat transfer path is further shortened, the heat transfer speed is accelerated, and the heat accumulation around the device is further reduced.

[0141] The housing 110 can be formed with a mounting groove, and the inner space of the groove is the device mounting position. The inner wall of the device mounting position is the groove wall of the mounting groove.

[0142] At least part of the heat dissipation part is bent to extend around the edge of the device mounting position.

[0143] In the technical scheme, the style of the heat dissipation part is further provided, and at least part of the heat dissipation part is bent. The bent structure is used to abut against the inner wall of the housing 110 and to abut against the device arranged in the housing 110. In this way, on the one hand, the heat dissipation part can better abut against the inner wall of the housing 110. On the other hand, the heat dissipation part can have more contact area with the housing 110, so that the heat dissipation efficiency can be improved. On the other hand, the heat dissipation part can be profiled and bonded with the device mounting position on the housing 110, so that the installation space of the device can be as much as possible, the heat dissipation structure is more compact, and the volume can be reduced.

[0144] As a feasible implementation manner, as shown in FIG. 6, the heat dissipation part includes a first segment 310 and a second segment 320, the first segment 310 is connected with the second segment 320 and is arranged at an angle, the first segment 310 is connected with the device to be cooled, the second segment 320 extends to the outside of the housing 110 away from one end of the first segment 310, the first segment 310 is arranged on a first side of the device mounting position, the second segment 320 is arranged on a second side of the device mounting position, and the first side and the second side are adjacent two sides.

[0145] In the technical solution, the heat dissipation part is provided as the first section 310 and the second section 320 which are connected at an angle, so that the heat dissipation part can better abut against the inner wall of the shell 110 and reduce the space occupation. The first section 310 is connected with the device to be cooled, so as to quickly absorb the heat generated by the device. The second section 320 extends to the outside of the shell 110, so as to directly dissipate the heat to the external environment, thereby ensuring good cooling speed. By arranging the first section 310 on the first side of the device mounting position and the second section 320 on the second side of the device mounting position, the heat dissipation part can better abut against or adjoin the device in the device mounting position in two different directions, thereby further improving the cooling speed.

[0146] In the technical solution, the heat dissipation part is provided as the first section 310 and the second section 320 which are connected at an angle, so that the heat dissipation part can better abut against the inner wall of the shell 110 and reduce the space occupation. The first section 310 is connected with the device to be cooled, so as to quickly absorb the heat generated by the device. The second section 320 extends to the outside of the shell 110, so as to directly dissipate the heat to the external environment, thereby ensuring good cooling speed. By arranging the first section 310 on the first side of the device mounting position and the second section 320 on the second side of the device mounting position, the heat dissipation part can better abut against or adjoin the device in the device mounting position in two different directions, thereby further improving the cooling speed.

[0147] Specifically, the angle between the first section 310 and the second section 320 can be 90°, that is, the first section 310 and the second section 320 are arranged perpendicularly. In this case, the heat dissipation part is approximately "L" shaped. Taking the device as a cuboid structure as an example, the first section 310 can abut against one outer wall surface of the device, and the second section 320 can abut against another adjacent outer wall surface of the device.

[0148] As another possible implementation, as shown in FIG. 7, the heat dissipation part includes a third section 330. The first section 310, the second section 320 and the third section 330 are sequentially connected at an angle. The third section 330 is arranged on the third side of the device mounting position and located on the outside of the shell 110.

[0149] In the technical solution, the heat dissipation part is provided as the first section 310 and the second section 320 which are connected at an angle, so that the heat dissipation part can better abut against the inner wall of the shell 110 and reduce the space occupation. The first section 310 is connected with the device to be cooled, so as to quickly absorb the heat generated by the device. The second section 320 extends to the outside of the shell 110, so as to directly dissipate the heat to the external environment, thereby ensuring good cooling speed. By arranging the first section 310 on the first side of the device mounting position and the second section 320 on the second side of the device mounting position, the heat dissipation part can better abut against or adjoin the device in the device mounting position in two different directions, thereby further improving the cooling speed.

[0150] The device in the device mounting position is generally a three-dimensional structure, such as a cuboid structure. By setting the heat dissipation part as the first segment 310, the second segment 320 and the third segment 330, the distance between the heat dissipation part and the device can be reduced in three directions in sequence, or the heat dissipation part can be directly attached to the device, thereby further increasing the contact area between the heat dissipation part and the device and improving the heat dissipation efficiency.

[0151] Specifically, the angle between the first segment 310 and the second segment 320 can be 90°, the angle between the second segment 320 and the third segment 330 can be 90°, and the first segment 310 is opposite and parallel to the third segment 330. At this time, the heat dissipation part is approximately "U" shaped. Taking the device as a cuboid structure as an example, the first segment 310 can be attached to one outer wall surface of the device, the second segment 320 can be attached to an adjacent outer wall surface, and the third segment 330 can be attached to another outer wall surface adjacent to the side wall corresponding to the second segment 320. That is, the outer wall surface corresponding to the first segment 310 is parallel to the outer wall surface corresponding to the third segment 330, and both are perpendicular to the outer wall surface corresponding to the second segment 320.

[0152] As another possible implementation, as shown in FIG. 8, the heat dissipation part includes a fourth segment 340 connected to the first segment 310 and the third segment 330, so that at least a part of the heat dissipation part is enclosed into a ring, and the device mounting position is inside the ring.

[0153] In this technical solution, by setting the heat dissipation part as at least a part of which is enclosed into a ring, the device mounting position is inside the ring, and the heat dissipation part is circumferentially attached to the inner wall of the shell 110, that is, attached to the wall surface of the device mounting position. While reducing the space occupation, the heat dissipation part can surround the device in the device mounting position, quickly absorb the heat generated by the device, and transfer the heat to the third segment 330 outside the shell 110, so that the heat can be directly dissipated to the external environment through the third segment 330, thereby ensuring good heat dissipation speed. By setting the first segment 310 at the first side of the device mounting position, the second segment 320 at the second side of the device mounting position, the third segment 330 at the third side of the device mounting position, and the fourth segment 340 at the fourth side of the device mounting position, the heat dissipation part can be better attached or adjacent to the device in the device mounting position in four different directions, thereby further accelerating the heat dissipation speed.

[0154] The device in the device mounting position is generally a three-dimensional structure, such as a cuboid structure. By setting the heat dissipation part as at least a part of which is enclosed into a ring, the heat dissipation part can surround the device in the circumferential direction, thereby further increasing the contact area between the heat dissipation part and the device and improving the heat dissipation efficiency.

[0155] Specifically, the first section 310, the second section 320, the third section 330 and the fourth section 340 are connected vertically in sequence to form a rectangular ring. At this time, the heat dissipation portion is roughly in the shape of a "mouth". Taking the device as a rectangular parallelepiped structure as an example, the heat dissipation portion surrounds the device in the circumferential direction. Among them, the first section 310 is also connected to the device to be dissipated, and the third section 330 is located on the outside of the shell 110. The heat generated by the device to be dissipated is transferred to the second section 320 and the fourth section 340 through the first section 310, and then transferred to the third section 330 located on the outside of the shell 110, dissipating the heat directly to the external environment.

[0156] According to a fourth aspect of an embodiment of the present application, a cleaning device is proposed, comprising a heat dissipation structure as in any of the above technical solutions, so that the cleaning device has all the beneficial effects of the above heat dissipation structure.

[0157] The heat dissipation structure includes a shell and a heat conducting part. The device to be dissipated is arranged in the shell. The heat energy generated by the device to be dissipated is transferred to the expected position through the heat conducting part and dissipated.

[0158] The cleaning device includes a mainboard 210 disposed in the housing and a power supply 220 disposed in the housing 110 , with the heat conducting portion contacting the power supply 220 .

[0159] In this technical solution, the power supply 220 can be a battery. During operation, the power supply 220 powers on the cleaning device, and the mainboard 210 performs control. The mainboard 210 is arranged in the shell. The generated heat energy can be transferred to the heat dissipation part. The heat energy can be transferred to the expected position through the heat dissipation part, such as to the edge of the shell 110. That is to say, the heat energy can be transferred to the outside of the shell 110. Finally, the heat is dissipated through the heat dissipation part, and the heat energy can be discharged to the expected position. The heat energy does not need to be stored in the shell 110, which can greatly improve the heat dissipation efficiency and ensure the safety and stability of the operation of the mainboard 210.

[0160] In this application, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless expressly limited otherwise. Terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; "connected" can mean a direct connection or an indirect connection through an intermediary. Those skilled in the art can understand the specific meanings of the above terms in this application based on the specific circumstances.

[0161] In the description of the present application, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or unit referred to must have a particular direction, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0162] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "a specific embodiment" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0163] The above is only the preferred embodiment of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipating structure, wherein, Comprise: a shell, a fitting site is formed on the shell, and the fitting site is used for setting a device to be cooled; a heat conduction piece, at least part of the heat conduction piece is arranged in the shell, and one end of the heat conduction piece is arranged close to the fitting site; a cooling piece, the cooling piece is arranged on the shell, and the cooling piece is connected to the heat conduction piece.

2. The cooling structure according to claim 1, wherein the other end of the heat conduction piece extends out of the shell.

3. The heat dissipation structure according to claim 1, wherein The shell comprises: a first shell; a second shell, the first shell is connected to the second shell, and the device to be cooled is arranged between the first shell and the second shell; the heat conduction piece is arranged in the second shell, and the cooling piece is connected to the second shell.

4. The cooling structure according to claim 3, wherein a device mounting site is formed in the second shell, the heat conduction piece is arranged close to the inner wall of the device mounting site, and the device mounting site is arranged close to the fitting site.

5. The cooling structure according to claim 4, wherein the device to be cooled comprises a mainboard; the device mounting site comprises a power supply mounting site.

6. The cooling structure according to any one of claims 1 to 5, wherein the material for preparing the heat conduction piece comprises a graphite sheet; and / or the material for preparing the cooling piece comprises a metal piece or a graphite sheet.

7. The cooling structure according to any one of claims 1 to 5, wherein the heat conduction piece comprises a plurality of bending segments, part of the bending segments is used for abutting against the inner wall of the shell, and part of the bending segments is used for abutting against the device mounted in the shell.

8. The heat dissipating structure according to any one of claims 1 to 5, wherein, Further comprise: a heat conduction silica gel layer, the cooling piece is connected to the heat conduction piece through the heat conduction silica gel.

9. A cleaning apparatus wherein, Comprise: the cooling structure according to any one of claims 1 to 8, wherein the cooling structure comprises the shell, the heat conduction piece and the cooling piece, the device to be cooled is arranged on the fitting site of the shell, the heat energy generated by the device to be cooled is transmitted to the expected position through the heat conduction piece, and the heat energy is cooled through the cooling piece.

10. The cleaning apparatus of claim 9, wherein, Further comprise: a mainboard, the mainboard is arranged on the fitting site; a power supply, the power supply is arranged in the shell, and the heat conduction piece wraps part of the area of the power supply.

11. The cleaning apparatus of claim 10, wherein, Further comprise: a cover, the cover is connected to the shell and covers the power supply.

12. A heat dissipating structure, wherein, Comprise: a shell, the shell is arranged with a device to be cooled; a cooling part, a first end of the cooling part extends to the peripheral side of the device to be cooled, and a second end of the cooling part extends to an expected position.

13. The heat dissipation structure according to claim 12, wherein, The cooling part is an integral structure.

14. The heat dissipation structure according to claim 12, wherein, The first end of the cooling part is in contact with the device to be cooled; or, the first end of the cooling part extends to the peripheral side of the device to be cooled and is arranged separately from the device to be cooled.

15. The heat dissipation structure according to claim 12, wherein, The second end of the cooling part is close to the surface of the shell.

16. The heat dissipation structure according to claim 12, wherein, The second end of the cooling part is arranged separately from the outer wall of the shell.

17. The heat dissipation structure according to claim 12, wherein, A cover is arranged outside the shell, and the second end of the cooling part is in contact with the side of the cover facing the shell.

18. The heat dissipation structure of claim 12, wherein, Further comprise: a silica gel heat conduction piece, the cooling part is connected to the cover through the silica gel heat conduction piece.

19. The heat dissipation structure of claim 12, wherein, A device mounting position is formed in the shell, and a part of the heat dissipation portion is arranged in the device mounting position.

20. The heat dissipating structure according to claim 19, wherein, The heat dissipation portion is arranged in abutment with the inner wall of the device mounting position.

21. The heat dissipating structure according to claim 19, wherein, At least a part of the heat dissipation portion is bent to extend around the edge of the device mounting position.

22. The heat dissipating structure according to claim 19, wherein, The heat dissipation portion comprises a first segment and a second segment, the first segment is connected with the second segment and arranged at an angle, the first segment is connected with the device to be cooled, the second segment extends to the edge of the shell from the end away from the first segment, the first segment is arranged on the first side of the device mounting position, the second segment is arranged on the second side of the device mounting position, and the first side and the second side are two adjacent sides.

23. The heat dissipating structure according to claim 22, wherein, The heat dissipation portion comprises a third segment, the first segment, the second segment and the third segment are connected at angles in sequence, the third segment is arranged on the third side of the device mounting position, and the third segment is located at the edge of the shell.

24. The heat dissipating structure according to claim 23, wherein, The heat dissipation portion comprises a fourth segment, the fourth segment is connected with the first segment and the third segment respectively, so that at least a part of the heat dissipation portion is enclosed into a ring, and the device mounting position is located on the inner side of the ring.

25. A cleaning apparatus wherein, Comprise: The heat dissipation structure according to any one of claims 12 to 24; The heat dissipation structure comprises the shell and the heat conduction portion, the device to be cooled is arranged in the shell, and the heat energy generated by the device to be cooled is transferred to a desired position through the heat conduction portion and dissipated.

26. The cleaning apparatus of claim 25, wherein, The cleaning device comprises: A mainboard arranged in the shell; A power supply arranged in the device mounting position when the device mounting position is formed in the shell, and the heat conduction portion is in abutment with the power supply.

Images