Component mounting system, component mounting device, inspection server, and inspection method

Abstract

According to the present invention, the development efficiency of component mounting work is improved by eliminating the need for actual machine confirmation by developing software outside a component mounting device. A component mounting system (1) includes a component mounting device (M1) having a head camera, a communication network (2), a relay device (16), and an inspection server (3). An image of a planned mounting position on a substrate is captured by the head camera (S202) and transmitted to the relay device (16) (S203). The inspection server (3) acquires the image from the relay device (16) (S206), and transmits an inspection result regarding the presence or absence of a falling component or the like to the component mounting device (M1) (S208). The inspection server (3) is not restricted with respect to OS or hardware and the like, and thus development efficiency is good.

Description

Component mounting system, component mounting device, inspection server, and inspection method

[0001] The present disclosure relates to a component mounting system and the like.

[0002] Patent Document 1 discloses a component mounting system that can ensure the quality of a mounting board and improve the efficiency of component mounting work.

[0003] Japanese Patent Application Laid-Open No. 2021-52037

[0004] However, in the component mounting system disclosed in Patent Document 1, inspection of test objects such as circuit boards is performed by a controller within the component mounting device, resulting in the following problems: The controller within the component mounting device has limitations on its operating system (OS) and hardware, resulting in lower specifications than a typical personal computer (PC), making it difficult to keep up with the latest technology, and not being able to use commercially available software licenses. Since the controller within the component mounting device cannot easily upgrade its application software, it is necessary to consider matching application software versions between each component mounting device and simultaneously upgrading the application software for all component mounting devices. Developing software within a component mounting device ultimately requires testing on the actual device, resulting in poor development efficiency.

[0005] Therefore, the present disclosure provides a component mounting system and the like that can be further improved.

[0006] The component mounting system according to the present disclosure comprises a component mounting device that removes components and mounts them on a board, and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device comprises an imaging unit that images the object to be inspected, and an installation communication unit that transmits the image captured by the imaging unit to the inspection server, and the inspection server comprises an inspection communication unit that receives the image transmitted by the mounting communication unit, and an inspection processing unit that performs an inspection of the object to be inspected based on the image received by the inspection communication unit, and the inspection communication unit transmits the inspection results from the inspection processing unit to the component mounting device.

[0007] These comprehensive or specific aspects may be realized by a system, an apparatus, a method, a recording medium, or a computer program, or may be realized by any combination of a system, an apparatus, a method, a recording medium, and a computer program.

[0008] According to the component mounting system and the like according to the present disclosure, further improvements can be achieved.

[0009] FIG. 1 is a configuration diagram showing an example of a component mounting system according to an embodiment. FIG. 2 is a sequence diagram showing an example of the operation of the component mounting system according to an embodiment. FIG. 3 is a configuration diagram showing an example of a component mounting apparatus according to an embodiment. FIG. 4 is a diagram showing an example of a mounted board manufactured in the component mounting system according to an embodiment. FIG. 5 is a functional configuration diagram showing an example of a component mounting system according to an embodiment. FIG. 6 is a diagram showing an example of an inspection result display screen displayed on a touch panel of the component mounting apparatus according to an embodiment. FIG. 7 is a flowchart showing an example of the operation of the component mounting apparatus according to an embodiment. FIG. 8 is a configuration diagram showing an example of a component mounting system according to a modified example of an embodiment. FIG. 9 is a sequence diagram showing an example of the operation of the component mounting system according to a modified example of an embodiment. FIG. 10 is a flowchart showing an example of an inspection method according to another embodiment. FIG. 11 is a flowchart showing an example of an inspection method according to another embodiment.

[0010] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0011] The embodiments described below are all comprehensive or specific examples, and the numerical values, shapes, materials, components, arrangement and connection of the components, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure.

[0012] (Embodiment) Hereinafter, a component mounting system, a component mounting apparatus, and an inspection server according to an embodiment will be described with reference to Figs.

[0013] FIG. 1 is a configuration diagram showing an example of a component mounting system 1 according to an embodiment.

[0014] The component mounting system 1 includes a component mounting device that picks up components and mounts them on a board, and an inspection server 3 that performs inspections of inspection targets. While FIG. 1 shows an example in which the component mounting system 1 includes two component mounting devices M1 and M2, the component mounting system 1 may include only one component mounting device, or three or more. The following description focuses on the component mounting device M1 of the component mounting devices M1 and M2. The component mounting device M2 basically has the same configuration and functions as the component mounting device M1, and therefore will not be described here.

[0015] For example, the inspection target is a board during or before component mounting. For example, the inspection server 3 inspects whether other components have fallen onto the board at the component mounting position during component mounting. The inspection target may also be a tape feeder used for component mounting. For example, the inspection server 3 inspects whether there are any components at the component removal position of the tape feeder before component mounting, whether there are any incorrect components at the component removal position, or whether the orientation of the components at the component removal position is misaligned. An example in which the inspection target is a board will be described below. Component mounting devices M1 and M2 are connected to the inspection server 3 via a communication network 2 such as a LAN (Local Area Network).

[0016] Next, the operation of the component mounting system 1 will be described with reference to FIG.

[0017] FIG. 2 is a sequence diagram showing an example of the operation of the component mounting system 1 according to the embodiment.

[0018] The component mounting device M1 sets the lamp value of the camera for capturing an image of the inspection target (e.g., a circuit board) (step S101), captures the image of the inspection target (step S102), and transmits the image to the inspection server 3 (step S103). The component mounting device M1 also issues an inspection command (step S104). The inspection command includes an equipment number identifying the component mounting device M1, a transaction number (unique ID) specific to the currently issued inspection command, a command number indicating the type of inspection, a set of parameters specific to the command indicating the specific inspection content, and the full file path of the transmitted image. The transmitted image and the inspection command are associated with each other.

[0019] The inspection server 3 receives the image of the inspection target and the inspection command from the component mounting device M1 and executes the inspection command (step S105). For example, the inspection server 3 reads the image file based on the full file path of the image included in the inspection command, and executes the inspection process based on the command number and parameter group. The inspection server 3 then transmits the inspection results to the component mounting device M1 (step S106).

[0020] The component mounting device M1 receives the inspection result from the inspection server 3 and executes processing according to the inspection result (step S107).

[0021] Next, the configuration of the component mounting apparatus M1 will be described with reference to FIG.

[0022] FIG. 3 is a configuration diagram showing an example of a component mounting apparatus M1 according to an embodiment.

[0023] In component mounting device M1, a board transport mechanism 5 is installed in the X direction at the center of base 4. Board transport mechanism 5 transports board B carried in from the upstream side in the X direction, and positions and holds it at a mounting operation position by mounting head 10, which will be described below. In addition, board transport mechanism 5 transports board B downstream after component mounting operation is completed. In other words, board B carried out from component mounting device M1 is transported to component mounting device M2.

[0024] A component supply unit 6 is installed on each side (front and back) of the board transport mechanism 5. A plurality of tape feeders 7 are attached in parallel in the X direction to the component supply units 6 on both sides. The tape feeders 7 feed a carrier tape, on which pockets for storing components are formed, by pitch feed in a direction (tape feed direction) from the outside of the component supply unit 6 toward the board transport mechanism 5, thereby supplying components to a component removal position where the mounting head 10 picks up the components.

[0025] A Y-axis table 8 equipped with a linear drive mechanism is disposed at both ends in the X direction on the upper surface of the base 4. A beam 9 similarly equipped with a linear drive mechanism is coupled to the Y-axis table 8 so as to be freely movable in the Y direction. A mounting head 10 is attached to the beam 9 so as to be freely movable in the X direction. The mounting head 10 is equipped with multiple suction units (not shown) that can hold and elevate components and rotate around a vertical axis (Z axis). A suction nozzle (not shown) that suctions and holds the components is attached to the lower end of each suction unit. Note that, although both the Y-axis table 8 and the beam 9 are equipped with linear drive mechanisms in this example, this is not a limitation. For example, at least one of them may be a drive mechanism such as a ball screw.

[0026] The Y-axis table 8 and beam 9 constitute a mounting head moving mechanism 11 that moves the mounting head 10 horizontally (in the X and Y directions). The mounting head moving mechanism 11 and the mounting head 10 perform a component mounting operation in which components are taken from the component supply unit 6 and mounted at the mounting positions on the board B. During the component mounting operation, the mounting head 10 moves above the component supply unit 6, picks up predetermined components with each suction nozzle, moves above the board B, rotates the components held by each suction nozzle in a predetermined direction, and repeats a series of turns to mount the components at their respective mounting positions.

[0027] A head camera 12 is attached to the beam 9, positioned on the underside of the beam 9 and moving integrally with the mounting head 10. As the mounting head 10 moves, the head camera 12 moves above the board B positioned at the mounting work position of the board transport mechanism 5, and captures an image of a board mark (not shown) provided on the board B to recognize the position of the board B. The head camera 12 also captures an image of the area around the mounting position on the board B where components are to be mounted, and the state of the board B is recognized from the image capture result. The head camera 12 is an example of an imaging unit that captures an image of an inspection object.

[0028] A component recognition camera 13 is installed between the component supply unit 6 and the board transport mechanism 5. When the mounting head 10, which has picked up a component from the component supply unit 6, is positioned above the component recognition camera 13, the component recognition camera 13 captures an image of the component held by the suction nozzle from below. During component mounting work by the mounting head 10, the mounting position is corrected taking into account the recognition results of the board B by the head camera 12 and the recognition results of the component by the component recognition camera 13.

[0029] A touch panel 14 operated by the worker is installed in front of component mounting device M1 at the position where the worker works. Touch panel 14 displays various information on its display, and the worker inputs data and operates component mounting device M1 using operation buttons and the like displayed on the display. A component disposal unit 15 is installed next to component recognition camera 13. Components that are supplied from component supply unit 6 but not mounted on board B, such as components that fail to be picked up, are discarded in component disposal unit 15.

[0030] Next, an example of a mounting board manufactured by the component mounting system 1 will be described with reference to FIG.

[0031] 4A and 4B are diagrams showing an example of a mounted board manufactured by the component mounting system 1 according to the embodiment. Fig. 4A shows a portion of the board B before components D1 and D2 are mounted, and Fig. 4B shows a portion of the board B after components D1 and D2 are mounted. Component D1 is a small chip component or the like. Component D2 is a large BGA with bumps Da formed on its back surface.

[0032] 4A, a plurality of electrodes Ba electrically connected to the terminals of component D1 are formed on the upper surface of substrate B in correspondence with the positions of the terminals of component D1. Also, a plurality of electrodes Bb electrically connected to bumps Da formed on the back surface of component D2 are formed on the upper surface of substrate B in correspondence with the positions of the bumps Da. Component mounting apparatus M1 mounts components D1 and D2 on substrate B so that the terminals of component D1 and the bumps Da of component D2 are positioned on electrodes Ba and Bb on substrate B.

[0033] Next, the configuration of the component mounting system 1 will be described with reference to FIG.

[0034] 5 is a functional configuration diagram showing an example of a component mounting system 1 according to an embodiment. An inspection server 3 and a component mounting device M1 are connected to each other via a communication network 2.

[0035] The component mounting device M1 includes a mounting control device 20, a substrate transport mechanism 5, a component supply unit 6, a mounting head 10, a mounting head moving mechanism 11, a head camera 12, a component recognition camera 13, and a touch panel 14. The mounting control device 20 includes a mounting memory unit 21, an inspection request unit 22, a display processing unit 23, a mounting processing unit 24, and a mounting communication unit 25. The mounting communication unit 25 transmits and receives data between the component mounting device M1 and the inspection server 3 via the communication network 2. The mounting communication unit 25 transmits images captured by the head camera 12 to the inspection server 3. The inspection request unit 22, the display processing unit 23, and the mounting processing unit 24 are realized by a processor or the like that executes programs stored in memory.

[0036] The mounting storage unit 21 stores production data 21a, inspection results 21c, etc. The production data 21a stores the name of the production model of the mounting board, and the part name (type), part size, mounting position (XY coordinates), mounting order, etc. for each piece of information (part number) that identifies the part to be mounted on the board B.

[0037] The inspection request unit 22 generates an inspection command to request the inspection server 3 to inspect the inspection target. The mounting communication unit 25 transmits an image in association with identification information such as the inspection command. This allows the inspection server 3 to confirm, for example, from which component mounting device the received image was sent and what kind of inspection needs to be performed, based on the identification information.

[0038] The inspection server 3 is a server that performs inspections of inspection targets and includes an inspection processing unit 32, an input unit 33, a display unit 34, and an inspection communication unit 35. The input unit 33 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands and data. The display unit 34 is a display device such as a liquid crystal panel, and displays various data stored in the memory unit as well as various information such as an operation screen for operation by the input unit 33. The inspection communication unit 35 transmits and receives data to and from the component mounting devices M1 and M2 via the communication network 2. The inspection communication unit 35 receives images transmitted by the mounting communication unit 25. The inspection processing unit 32 is realized by a processor that executes a program stored in a memory, or the like.

[0039] The inspection processing unit 32 inspects the inspection target based on the image received by the inspection communication unit 35. Specifically, the inspection processing unit 32 inspects the inspection target based on an image obtained by capturing an image of the inspection target in the component mounting device M1. In the dropped component inspection, the inspection processing unit 32 compares the image received by the inspection communication unit 35 with a sample image of the inspection candidate component (image matching) to determine whether a foreign object such as another component may have fallen at the mounting position. For example, in the component mounting device M1, after an error occurs, a component disposal process is performed to discard the component held by the suction nozzle in the component disposal unit 15. However, the component may have been dropped onto the board B before that. Therefore, if an error such as a pickup error occurs during the component mounting operation, the inspection processing unit 32 determines that the component may have fallen.

[0040] Then, the inspection communication unit 35 transmits the inspection result 21c obtained by the inspection processing unit 32 to the component mounting device M1. For example, the inspection communication unit 35 transmits the inspection result 21c indicating that there is a possibility that a component has fallen onto the board B to the component mounting device M1. The inspection communication unit 35 determines the destination of the inspection result based on the identification information (inspection command). This allows the inspection server 3 to transmit the inspection result obtained by performing an inspection using the received image to the component mounting device M1 that transmitted the image.

[0041] The mounting communication unit 25 receives, from an external device (the inspection server 3 in the embodiment), the inspection result 21c of the inspection of the inspection target performed in the inspection server 3 based on the transmitted image. The component mounting device M1 stores the received inspection result 21c in the mounting storage unit 21.

[0042] The display processing unit 23 displays the inspection results on the touch panel 14 and displays an inspection result display image that allows the operator to select the next process. An example of an inspection result display screen 40 displayed on the touch panel 14 will now be described with reference to FIG. 6 .

[0043] FIG. 6 is a diagram showing an example of an inspection result display screen displayed on the touch panel 14 of the component mounting apparatus M1 according to the embodiment.

[0044] The inspection result display screen 40 displays an "Inspection result information" display frame 41, a "Captured image" display frame 42, a "Continue" button 43, and a "Remove" button 44. The "Inspection result information" display frame 41 displays a warning based on the inspection result by the inspection processing unit 32, to the effect that "there is a possibility that a component has fallen into the mounting position of component number (D0123)," and a work instruction to select the next process by operating a button.

[0045] The "Captured Image" display frame 42 displays a captured image of the mounting position of the inspection candidate component included in the inspection result 21c. In the example shown in Fig. 6, the inspection candidate component is component D2 shown in Fig. 4, and the image shows electrode Bb formed on board B as well as component D1, another component that has fallen into the mounting position. When the worker operates the "Continue" button 43 using the input function of touch panel 14, the component mounting work for the inspection candidate component (component to be mounted) continues. When the worker operates the "Remove" button 44, a series of processes for removing board B from component mounting device M1 is initiated.

[0046] The worker looks at the captured image in the "Captured Image" display frame 42, and if he determines that there is no problem with the mounting position, such as that there is no foreign object such as another component fallen thereon, he operates the "Continue" button 43. If he determines that there is a problem, he operates the "Remove" button 44 to execute the defect process of removing the board B from the component mounting device M1.

[0047] The mounting processing unit 24 controls each unit of the component mounting device M1 to perform component mounting work, which involves picking up components from the component supply unit 6 and mounting them at the mounting positions on the board B, based on the production data 21a. The mounting processing unit 24 performs the component mounting work when the inspection processing unit 32 determines that there is no possibility that other components have fallen. Furthermore, the mounting processing unit 24 performs the component mounting work when the worker operates the "Continue" button 43 on the inspection result display screen 40.

[0048] When the mounting processing unit 24 recognizes from the image of the component held by the suction nozzle captured by the component recognition camera 13 that a suction error has occurred, such as the suction nozzle not holding a component or suctioning in an abnormal position, it causes the component disposal unit 15 to execute a component disposal process to discard the component held by the suction nozzle. In addition, when the mounting processing unit 24 recognizes that a mounting failure has occurred, in which the suction nozzle brings back a component mounted on board B, it also causes the component disposal process to be executed. When the mounting processing unit 24 executes the component disposal process, it performs the component mounting work again for the component that could not be mounted.

[0049] Next, the operation of the component mounting apparatus M1 will be described with reference to FIG.

[0050] FIG. 7 is a flowchart showing an example of the operation of the component mounting apparatus M1 according to the embodiment.

[0051] The head camera 12 captures an image of the board (step S1) and sends the captured image to the inspection server 3 to request an inspection (step S2). The inspection is performed by the inspection server 3, the mounting communication unit 25 receives the inspection results from the inspection server 3 (step S3), and the inspection results are displayed on the touch panel 14 (step S4). The mounting processing unit 24 determines whether or not mounting of components on the board can be continued (step S5). If mounting can be continued (Yes in step S5), the mounting processing unit 24 mounts the components (step S6). If mounting cannot be continued (No in step S5), the mounting processing unit 24 executes defect processing (step S7).

[0052] As described above, images of the inspection target are transmitted from the component mounting device M1 to the inspection server 3, and the inspection server 3, which is external to the component mounting device M1, inspects the inspection target using the images transmitted from the component mounting device M1. Because the inspection server 3 has no OS or hardware restrictions, its specifications can be enhanced, it can keep up with the latest technology, and commercially available software licenses can be used. Furthermore, the inspection server 3 allows for easy version upgrades of application software, eliminating the need to consider matching application software versions between component mounting devices or simultaneous upgrades of application software for all component mounting devices. Furthermore, when developing software within the inspection server 3, development and operation verification can be performed using only a PC, as long as the communication IN / OUT remains unchanged, improving development efficiency. This provides a component mounting system 1 that allows for further improvements.

[0053] (Modification of the Embodiment) Next, a component mounting system according to a modification of the embodiment will be described with reference to FIGS. 8 and 9. FIG.

[0054] FIG. 8 is a configuration diagram showing an example of a component mounting system 1a according to a modified example of the embodiment.

[0055] The component mounting system 1a differs from the component mounting system 1 according to the embodiment in that it further includes a relay device 16, and the inspection server 3 is connected to component mounting devices M1 and M2 via the relay device 16. Since the other points are the same as those of the component mounting system 1 according to the embodiment, the following description will mainly focus on the differences.

[0056] The relay device 16 may be a management computer also called an LNB (Line Network Box), which not only performs integrated management of the production of mounted boards by the component mounting system 1a, but may also create various parameters used by the component mounting devices M1 and M2.

[0057] FIG. 9 is a sequence diagram showing an example of the operation of the component mounting system 1a according to the modified example of the embodiment.

[0058] The component mounting device M1 sets the lamp value of the camera for capturing an image of the inspection target (step S201) and captures the image of the inspection target (step S202). The component mounting device M1 (mounting communication unit 25) transmits the image captured by the imaging unit to an external device (relay device 16 in the modified embodiment) (step S203). The relay device 16 has an image storage unit, and the image storage unit stores the image transmitted by the mounting communication unit 25 (step S204). The component mounting device M1 also issues an inspection command (step S205). Specifically, the component mounting device M1 transmits the inspection command to the inspection server 3 via the relay device 16.

[0059] The inspection server 3 receives the inspection command and acquires the image stored in the image storage unit of the relay device 16 (step S206). The inspection server 3 (inspection processing unit 32) inspects the inspection target based on the image stored in the image storage unit of the relay device 16, specifically, executes the received inspection command (step S207). The inspection server 3 transmits the inspection results to the component mounting device M1 (step S208). Specifically, the inspection server 3 (inspection communication unit 35) transmits the inspection results from the inspection processing unit 32 to the component mounting device M1 via the relay device 16.

[0060] The component mounting device M1 receives the inspection result from the inspection server 3 via the relay device 16, and executes processing according to the inspection result (step S209).

[0061] In this way, an image of the inspection target may be transmitted from the component mounting device M1 to the relay device 16, and the inspection server 3 external to the component mounting device M1 may inspect the inspection target using the image stored in the relay device 16. In this case, too, as in the embodiment, a component mounting system 1a that can be further improved can be provided.

[0062] (Other Embodiments) The component mounting systems 1 and 1a, component mounting device M1, and inspection server 3 of the present disclosure have been described above based on the embodiments, but the present disclosure is not limited to the above-described embodiments. As long as they do not deviate from the spirit of the present disclosure, various modifications that a person skilled in the art can conceive of to the present embodiments, and forms constructed by combining components of different embodiments, are also included within the scope of the present disclosure.

[0063] For example, the present disclosure can be realized not only as the component mounting system 1 or 1a, but also as an inspection method including steps (processing) performed by the components that make up the component mounting system 1 or 1a.

[0064] 10 and 11 are flowcharts showing an example of an inspection method according to another embodiment.

[0065] The inspection method is an inspection method performed by a component mounting system 1 that includes a component mounting device M1 that removes components and mounts them on a board, and an inspection server 3 that performs inspection of the object to be inspected. As shown in FIG. 10, the component mounting device M1 captures an image of the object to be inspected (step S11) and transmits the captured image to the inspection server 3 (step S12). The inspection server 3 receives the image transmitted from the component mounting device M1 (step S13), performs inspection of the object to be inspected based on the received image (step S14), and transmits the inspection results of the object to the component mounting device M1 (step S15).

[0066] The inspection method is also an inspection method performed by a component mounting system 1a that includes a component mounting device M1 that removes components and mounts them on a board, a relay device 16, and an inspection server 3 that performs an inspection of the inspection object. As shown in FIG. 11, the component mounting device M1 captures an image of the inspection object (step S21) and transmits the captured image to the relay device 16 (step S22). The relay device 16 stores the image transmitted from the component mounting device M1 (step S23). The inspection server 3 performs an inspection of the inspection object based on the image stored in the relay device 16 (step S24) and transmits the inspection results of the inspection object to the component mounting device via the relay device 16 (step S25).

[0067] For example, the present disclosure can be realized as a program for causing a computer (processor) to execute steps included in the inspection method. Furthermore, the present disclosure can be realized as a non-transitory computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

[0068] For example, when the present disclosure is realized as a program (software), each step is performed by running the program using hardware resources such as a computer's CPU, memory, input / output circuits, etc. In other words, each step is performed by the CPU acquiring data from memory or input / output circuits, etc., performing calculations, and outputting the calculation results to memory or input / output circuits, etc.

[0069] In the above-described embodiment, each component included in the component mounting system 1 or 1a may be configured with dedicated hardware or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory.

[0070] Some or all of the functions of the component mounting system 1 or 1a according to the above-described embodiments are typically realized as an LSI, which is an integrated circuit. These may be individually integrated into single chips, or may be integrated into a single chip that includes some or all of the functions. Furthermore, the integrated circuit is not limited to an LSI, and may be realized using a dedicated circuit or a general-purpose processor. It is also possible to use an FPGA (Field Programmable Gate Array) that can be programmed after LSI manufacturing, or a reconfigurable processor that can reconfigure the connections and settings of circuit cells within the LSI.

[0071] Furthermore, if an integrated circuit technology that can replace LSI emerges due to advances in semiconductor technology or other derived technologies, that technology may naturally be used to integrate each component included in component mounting system 1 or 1a.

[0072] In addition, this disclosure also includes forms obtained by making various modifications to the embodiments that a person skilled in the art would think of, and forms realized by arbitrarily combining the components and functions in each embodiment within the scope that does not deviate from the intent of this disclosure.

[0073] (Additional Notes) The above description of the embodiments discloses the following techniques.

[0074] (Technology 1) A component mounting system comprising: a component mounting device that picks out components and mounts them on a board; and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device comprises an imaging unit that images the object to be inspected, and a mounting communication unit that transmits the image captured by the imaging unit to the inspection server, wherein the inspection server comprises an inspection communication unit that receives the image transmitted by the mounting communication unit, and an inspection processing unit that performs an inspection of the object to be inspected based on the image received by the inspection communication unit, and the inspection communication unit transmits the inspection results by the inspection processing unit to the component mounting device.

[0075] According to this system, images of the inspection target are sent from the component mounting device to the inspection server, and the external inspection server uses the images sent from the component mounting device to inspect the inspection target. Because the inspection server has no OS or hardware restrictions, it can enhance its specifications, keep up with the latest technology, and use commercially available software licenses. Furthermore, the inspection server allows for easy version upgrades of application software, eliminating the need to consider matching application software versions between component mounting devices or simultaneous upgrades of application software for all component mounting devices. Furthermore, when developing software within the inspection server, development and operation verification can be performed using only a PC, as long as the communication input / output remains unchanged, improving development efficiency. This provides a component mounting system that allows for further improvements.

[0076] (Technology 2) A component mounting system comprising: a component mounting device that picks out components and mounts them on a board; a relay device; and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device comprises an imaging unit that images the object to be inspected, and a mounting communication unit that transmits the images captured by the imaging unit to the relay device, the relay device comprises an image storage unit that stores the images transmitted by the mounting communication unit, and the inspection server comprises an inspection processing unit that performs an inspection of the object to be inspected based on the images stored in the image storage unit, and an inspection communication unit that transmits the inspection results by the inspection processing unit to the component mounting device via the relay device.

[0077] According to this system, images of the inspection target are sent from the component mounting device to the relay device, and an inspection server external to the component mounting device inspects the inspection target using the images stored in the relay device. Because the inspection server has no OS or hardware restrictions, the specifications of the inspection server can be improved, it can keep up with the latest technology, and commercially available software licenses can be used. The inspection server allows for easy version upgrades of application software, and there is no need to consider matching application software versions between component mounting devices or simultaneous version upgrades of application software for all component mounting devices. This provides a component mounting system that allows for further improvements.

[0078] (Technology 3) The component mounting system according to Technology 1 or 2, wherein the mounting communication unit transmits the image in association with identification information.

[0079] This allows the inspection server to check, for example, from which component mounting device the received image was sent and what kind of inspection needs to be performed, using the identification information.

[0080] (Technology 4) The component mounting system according to Technology 3, wherein the inspection communication unit determines a destination to which the inspection results are sent based on the identification information.

[0081] This allows the inspection server to transmit the inspection results obtained by performing an inspection using the received image to the component mounting device that transmitted the image.

[0082] (Technology 5) A component mounting device that removes components and mounts them on a board, the component mounting device comprising: an imaging unit that captures an image of an object to be inspected; and a mounting communication unit that transmits the image captured by the imaging unit to an external device, wherein the mounting communication unit receives from the external device inspection results of an inspection of the object to be inspected that is performed based on the image.

[0083] This makes it possible to provide a component mounting apparatus that can be further improved.

[0084] (Technology 6) An inspection server that performs an inspection of an object to be inspected, the inspection server comprising an inspection processing unit that performs the inspection of the object to be inspected based on an image obtained by capturing an image of the object to be inspected in a component mounting device that removes components and mounts them on a board, and the inspection server that transmits the inspection results from the inspection processing unit to the component mounting device.

[0085] This makes it possible to provide a test server that can be further improved.

[0086] (Technology 7) An inspection method performed by a component mounting system including a component mounting device that picks out components and mounts them on a board, and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device captures an image of the object to be inspected and transmits the captured image to the inspection server, and the inspection server receives the image transmitted from the component mounting device, inspects the object to be inspected based on the received image, and transmits the inspection results of the object to the component mounting device.

[0087] This makes it possible to provide an inspection method that can be further improved.

[0088] (Technology 8) An inspection method performed by a component mounting system including a component mounting device that picks up components and mounts them on a board, a relay device, and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device captures an image of the object to be inspected and transmits the captured image to the relay device, the relay device stores the image transmitted from the component mounting device, the inspection server inspects the object to be inspected based on the image stored in the relay device, and transmits the inspection results of the object to the component mounting device via the relay device.

[0089] This makes it possible to provide an inspection method that can be further improved.

[0090] The present disclosure can be applied to a component mounting system in which an inspection target is inspected in a component mounting device.

[0091] REFERENCE SIGNS LIST 1, 1a Component mounting system 2 Communication network 3 Inspection server 4 Base 5 Board transport mechanism 6 Component supply unit 7 Tape feeder 8 Y-axis table 9 Beam 10 Mounting head 11 Mounting head moving mechanism 12 Head camera 13 Component recognition camera 14 Touch panel 15 Component disposal unit 16 Relay device 20 Mounting control device 21 Mounting memory unit 21a Production data 21c Inspection results 22 Inspection request unit 23 Display processing unit 24 Mounting processing unit 25 Mounting communication unit 32 Inspection processing unit 33 Input unit 34 Display unit 35 Inspection communication unit 40 Inspection result display screen 41, 42 Display frame 43, 44 Button B Board Ba, Bb Electrode D1, D2 Component Da Bump M1, M2 Component mounting device

Claims

1. A component mounting system comprising: a component mounting device that picks out components and mounts them on a board; and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device comprises: an imaging unit that images the object to be inspected; and a mounting communication unit that transmits the images captured by the imaging unit to the inspection server, wherein the inspection server comprises: an inspection communication unit that receives the images transmitted by the mounting communication unit; and an inspection processing unit that performs an inspection of the object to be inspected based on the images received by the inspection communication unit, and the inspection communication unit transmits the inspection results by the inspection processing unit to the component mounting device.

2. A component mounting system comprising: a component mounting device that picks out components and mounts them on a board; a relay device; and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device comprises an imaging unit that captures an image of the object to be inspected; and an installation communication unit that transmits the image captured by the imaging unit to the relay device, the relay device comprises an image storage unit that stores the image transmitted by the installation communication unit, and the inspection server comprises: an inspection processing unit that performs an inspection of the object to be inspected based on the image stored in the image storage unit; and an inspection communication unit that transmits the inspection results by the inspection processing unit to the component mounting device via the relay device.

3. The component mounting system according to claim 1 or 2, wherein the mounting communication unit transmits the image in association with identification information.

4. The component mounting system according to claim 3, wherein the inspection communication unit determines a destination to which the inspection results are to be sent based on the identification information.

5. A component mounting device that picks up components and mounts them on a board, comprising: an imaging unit that images an object to be inspected; and a mounting communication unit that transmits the image captured by the imaging unit to an external device, wherein the mounting communication unit receives from the external device inspection results of an inspection of the object to be inspected that is performed based on the image.

6. An inspection server that performs an inspection of an object to be inspected, comprising: an inspection processing unit that performs the inspection of the object to be inspected based on an image obtained by capturing an image of the object to be inspected in a component mounting device that picks up components and mounts them on a board; and an inspection server that transmits the inspection results obtained by the inspection processing unit to the component mounting device.

7. An inspection method performed by a component mounting system comprising a component mounting device that picks up components and mounts them on a board, and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device takes an image of the object to be inspected and sends the captured image to the inspection server, and the inspection server receives the image sent from the component mounting device, inspects the object to be inspected based on the received image, and sends the inspection results of the object to the component mounting device.

8. An inspection method performed by a component mounting system including a component mounting device that picks up components and mounts them on a board, a relay device, and an inspection server that performs an inspection of an object to be inspected, wherein the component mounting device takes an image of the object to be inspected and sends the taken image to the relay device, the relay device stores the image sent from the component mounting device, the inspection server inspects the object to be inspected based on the image stored in the relay device, and sends the inspection results of the object to the component mounting device via the relay device.

Images