Electronic apparatus comprising cover glass

Abstract

An electronic device according to various embodiments comprises: a display panel; a cover glass including a first surface facing the front of the electronic device and a second surface opposite to the first surface, the second surface including a first portion disposed on at least a portion of the display panel and a second portion formed to be inclined with respect to the first portion; a molding part formed below the second portion of the second surface of the cover glass and surrounding a rim portion of the display panel; and a support member including a support portion for supporting at least a portion of the display panel, a first recessed portion in which the molding part is accommodated, and a protruding portion protruding toward the front of the electronic device, wherein the molding part may include a third surface facing the rear of the electronic device and a fourth surface opposite to the third surface, and the third surface may be configured to be attached to the first recessed portion of the support member.

Description

Electronic device including cover glass

[0001] The present disclosure relates to an electronic device including a cover glass.

[0002] As the hardware / software gap between electronic device manufacturers narrows, interest is growing not only in improving the performance of electronic devices but also in enhancing their emotional appeal and differentiating them through design. For example, an increasing number of electronic devices are adopting full-screen displays to maximize the display area. These devices utilize cover glass to protect the display surface. Glass, in particular, is used to protect the display surface due to its strong surface hardness and superior optical performance. However, the properties of glass and the printing method used to print the full-screen display present design limitations.

[0003] Accordingly, in implementing a cover glass with a full-screen display design in an electronic device, a method is needed to introduce a new type of design while protecting the cover glass.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device may include a display panel, a cover glass including a first side facing the front of the electronic device, and a second side opposite the first side. The second side may include a first portion disposed on at least a portion of the display panel and a second portion formed to be inclined with respect to the first side. The cover glass may include a molding portion formed below the second side of the second side of the second side and surrounding a rim portion of the display panel, and a support member including a support portion supporting at least a portion of the display panel, a first recessed portion in which the molding portion is received, and a protruding portion protruding toward the front of the electronic device. The molding portion may include a third side facing the rear of the electronic device and a fourth side opposite the third side, and the third side may be attached to the first recessed portion of the support member.

[0006] A method for arranging a display of an electronic device according to one embodiment of the present disclosure may include an operation of providing a display panel, and an operation of providing a cover glass including a first side facing the front of the electronic device and a second side opposite the first side, wherein the second side includes a first portion disposed on at least a portion of the display panel and a second portion formed to be inclined with respect to the first portion. The method may include an operation of forming a molding part disposed below the second portion of the cover glass and surrounding an edge of the display panel. A support member may be disposed below the molding part and the display panel.

[0007] FIG. 1 is a drawing for explaining an overview of the structure of an electronic device according to various embodiments of the present disclosure.

[0008] FIG. 2 is a perspective view illustrating a front side of an electronic device according to one embodiment.

[0009] FIG. 3 is a perspective view illustrating a rear side of an electronic device according to one embodiment.

[0010] FIG. 4 is a drawing illustrating a portion of a cross-section of a cover glass according to one embodiment.

[0011] FIG. 5 is a cross-sectional view of an electronic device according to one embodiment of the present invention, to illustrate the extent to which a cover glass protrudes.

[0012] FIG. 6 is a cross-sectional view of an electronic device to illustrate the arrangement between an edge of a cover glass and a support member according to one embodiment.

[0013] FIG. 7 is a cross-sectional view of an electronic device to explain the arrangement of a molding portion according to one embodiment.

[0014] FIG. 8 is a drawing illustrating a cross-section of an electronic device formed by a method in which a molding part is formed and then placed on an electronic device, according to one embodiment, and a method for manufacturing the same.

[0015] FIG. 9 is a drawing for explaining a molding part formed using a mold according to one embodiment.

[0016] FIG. 10 is a drawing for explaining a molding part formed by a material injected through an injection port of a support member according to one embodiment.

[0017] FIG. 11 is a drawing for comparing cross-sections of an electronic device formed by a plurality of methods for forming a molding portion according to one embodiment.

[0018] FIG. 12 is a drawing showing a cross-section of a film portion and an electronic device including the same according to one embodiment.

[0019] FIG. 13 is a drawing illustrating a portion of a cross-section of an electronic device including a film portion and the electronic device according to one embodiment.

[0020] FIG. 14 is a drawing illustrating a portion of a cross-section of an electronic device including a film portion and the electronic device according to one embodiment.

[0021] FIG. 15 is a flowchart illustrating a process of forming an electronic device by arranging components of the electronic device according to one embodiment.

[0022] FIG. 16 is a block diagram of an electronic device within a network environment according to various embodiments.

[0023] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0024] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0025] FIG. 1 is a drawing for explaining an overview of the structure of an electronic device (200) according to various embodiments of the present disclosure.

[0026] An electronic device (200) according to one embodiment may include a display (201).

[0027] A display (201) of an electronic device (200) according to one embodiment may include a display panel (120).

[0028] A display (201) of an electronic device (200) according to one embodiment may include a cover glass (110). The cover glass (110) according to the present disclosure may be configured in various shapes and methods. For example, the cover glass (110) may be configured in the shape of the cover glass (410, 420) of FIG. 4.

[0029] In one embodiment, the cover glass (110) may include a first side (111) facing the front (e.g., +z direction) of the electronic device (200) and a second side (112) opposite the first side (111). In one embodiment, the second side (112) may include a first portion (113) disposed on at least a portion of the display panel (120) and a second portion (114) formed to be inclined with respect to the first portion.

[0030] According to one embodiment, in the cover glass (110), the thickness of the cover glass (110) corresponding to the second portion (114) of the second surface (112) may decrease as it gets closer to the edge of the cover glass (110). According to one embodiment, the first surface (111) of the cover glass (110) may protrude further toward the front of the electronic device (200) than the protruding portion (141) of the support member (140) by a predetermined length (d1). In one embodiment, the predetermined length (d1) by which the first surface (111) of the cover glass (110) protrudes further toward the front (180) of the electronic device (200) than the protruding portion (141) of the support member (140) may be set to a designated length to prevent the cover glass (110) from being damaged when the electronic device (200) is dropped. In one embodiment, the first side (111) of the cover glass (110) protrudes further toward the front of the electronic device (200) than the protruding portion (141) of the edge of the support member (140), thereby increasing the depth of the display (201) visually perceived by the user.

[0031] An electronic device (200) according to one embodiment may include a molding part (130). The molding part (130) according to the present disclosure may be configured in various shapes and methods. For example, the molding part (130) may be configured in the shape or manufacturing method of the molding part (730, 780) of FIG. 7, the molding part (830) of FIG. 8, the molding part (930) of FIG. 9, the molding part (1030) of FIG. 10, and the molding parts (1130, 1138) of FIG. 11.

[0032] In one embodiment, the molding portion (130) may be formed under the second portion (114) of the second surface (112) of the cover glass (110). According to one embodiment, the molding portion (130) may be formed to surround a rim portion of the display panel (120). In one embodiment, since the molding portion (130) surrounds the rim portion of the display panel (120), when an impact is applied to the electronic device (200), the rim portion of the display panel (120) may not be directly impacted. In this case, since the molding portion (130) absorbs a portion of the impact applied to the electronic device (200) before the display panel (120), the amount of impact applied to the display panel (120) may be reduced. Through this, the risk of damage to the display panel (120) may be reduced.

[0033] According to one embodiment, the molding portion (130) may be placed on the electronic device (200) by being attached to the recessed portion (145) of the support member (140) through the sealing portion. For example, the molding portion (130) may be formed to be attached to the display panel (120) and the cover glass (110) using a mold surrounding the cover glass (110) and the display panel (120) before being placed on the electronic device (200), and then may be placed on the electronic device (200) by being attached to the recessed portion (145) of the support member (140). For example, in a state where the cover glass (110) and the display panel (120) of the electronic device (200) are coupled to the support member (140), the material of the molding part (130) is injected through an injection hole (not shown) formed in the support member (140) toward the space between the second part (114) of the second surface (112) of the cover glass (110) of the electronic device (200) and the recessed part (145) of the support member (140), thereby allowing the molding part (130) to be placed on the electronic device (200).

[0034] An electronic device (200) according to one embodiment may include a support member (140). In one embodiment, the support member (140) may include a support portion (142) that supports at least a portion of a display panel (120), a recessed portion (145) in which a molding portion (130) is received, and a protruding portion (141) that protrudes toward the front of the electronic device (200).

[0035] According to one embodiment, the protruding portion (141) may be positioned spaced apart from the cover glass (110). According to one embodiment, the protruding portion (141) may be positioned so as to minimize an area in contact with the cover glass (110). For example, the edge of the cover glass (110) may be formed at a position equal to or higher than the height of the protruding portion (141) of the support member (140) when the electronic device (200) is viewed from the side (e.g., +x direction, +y direction) of the electronic device (200). In this case, even if the electronic device (200) receives an impact through the protruding portion (141) of the support member (140), the protruding portion (141) of the support member (140) and the cover glass (110) do not directly contact each other, or even if they do, the area in which they contact each other is minimized, thereby reducing the amount of impact applied to the cover glass (110).

[0036] According to one embodiment, the molding portion (130) may include a third surface (133) facing the rear (e.g., -z direction) of the electronic device (200), a fourth surface (134) opposite the third surface (133), and a fifth surface (135) facing the protruding portion (141) of the support member (140). In one embodiment, the third surface (133) may be attached to the recessed portion (145) of the support member (140). In one embodiment, the fifth surface (135) of the molding portion (130) may be disposed to be spaced apart from the protruding portion (141) of the support member (140). In one embodiment, the fifth surface (135) of the molding portion (130) may be disposed to contact the protruding portion (141) of the support member (140).

[0037] FIG. 2 illustrates a perspective view showing the front side of an electronic device (200) according to one embodiment. FIG. 3 illustrates a perspective view showing the rear side of an electronic device (200) according to one embodiment.

[0038] Referring to FIGS. 2 and 3, an electronic device (200) according to one embodiment may include a housing (210, e.g., the support member (141) of FIG. 1) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing may refer to a structure forming a portion of the first side (210A) of FIG. 1, the second side (210B) of FIG. 2, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) of which at least one portion is substantially transparent (e.g., a glass plate including various coating layers as a front plate, or a polymer plate). In another embodiment, the front plate (202) may be coupled to the housing (210) to form an internal space together with the housing (210). In various embodiments, the term “internal space” may mean an internal space of the housing (210) that accommodates at least a portion of the display (201).

[0039] According to various embodiments, the second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In various embodiments, the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0040] In the illustrated embodiment, the front plate (202) may include two first regions (210D) (e.g., curved regions) extending seamlessly from the first surface (210A) toward the rear plate (211) at both ends of a long edge of the front plate (202). In the illustrated embodiment, the rear plate (211) may include two second regions (210E) (e.g., curved regions) extending seamlessly from the second surface (210B) toward the front plate (202) at both ends of a long edge. In various embodiments, the front plate (202) (or the rear plate (211)) may include only one of the first regions (210D) (or the second regions (210E)). In other embodiments, some of the first areas (210D) or second areas (210E) may not be included. In the embodiments, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on a side that does not include the first area (210D) or the second area (210E) (e.g., a side where the connector hole (208) is formed), and may have a second thickness that is thinner than the first thickness on a side that includes the first area (210D) or the second area (210E) (e.g., a side where the key input device (217) is arranged).

[0041] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204), a camera module (205, 255), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In various embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0042] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In various embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). In various embodiments, the corners of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In other embodiments (not shown), the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially identical in order to expand the area to which the display (201) is exposed.

[0043] In another embodiment (not shown), a recess or opening may be formed in a portion of a screen display area (e.g., an active area) or an area outside the screen display area (e.g., an inactive area) of the display (201), and at least one of an audio module (214), a sensor module (204), a camera module (205, 255), and a light-emitting element (206) may be aligned with the recess or opening. In another embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205, 255), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In another embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (210E).

[0044] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sounds, and in various embodiments, multiple microphones may be disposed to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In various embodiments, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0045] The sensor module (204) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or another sensor module (not shown) (e.g., an HRM sensor or a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) (e.g., the display (201)) of the housing (210) as well as the second surface (210B). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0046] The camera module (205, 255) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), and a second camera device (255) disposed on a second side (210B). The camera module (205, 255) may include one or more lenses, an image sensor, and / or an image signal processor. A flash (not shown) may be disposed on the second side (210B). The flash may include, for example, a light-emitting diode or a xenon lamp. In various embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0047] The key input device (217) may be positioned on the side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0048] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0049] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0050] However, the configuration of the electronic device (200) illustrated in FIGS. 2 and 3 is merely an example and is not limited thereto. For example, some of the components of the electronic device (200) illustrated in FIGS. 2 and 3 may be omitted, the locations of the components may be changed, or they may be replaced with other components.

[0051] FIG. 4 is a drawing illustrating a portion of a cross-section of a cover glass according to one embodiment.

[0052] Referring to the identification number 40 of FIG. 4, in one embodiment, the cover glass (110) of the electronic device (200) may include a first side (411) and a second side (412) opposite to the first side (411). In the cover glass (110) of the electronic device (200) according to one embodiment, the second side (412) may include a first portion (413) disposed on at least a portion of a display panel of the electronic device (200) and a second portion (414) formed to be inclined with respect to the first portion (413). In one embodiment, the first side (411) may be disposed toward the front of the electronic device (200). In one embodiment, the

[0053] The first portion (413) of the second surface (413) may be positioned toward the rear of the electronic device (200). In one embodiment, the inclination of the second portion (414) may be formed to be constant.

[0054] According to one embodiment, in the cover glass (410), the thickness of the cover glass (410) corresponding to the second portion (414) of the second surface (412) may decrease as it gets closer to the edge of the cover glass (410). In one embodiment, based on the distance (d1) from the first surface (411) of the cover glass (410) to the first portion (413) of the second surface (412), the distance (d2) from the portion corresponding to the edge of the second portion (414) of the second surface (412) to the portion corresponding to the edge of the first surface (411) may be a smaller value.

[0055] In one embodiment, the slope of the second portion (414) of the cover glass (410) can be formed to be constant. In one embodiment, the length (d3) in the direction parallel to d1 from an arbitrary point (416) on the second portion (414) of the cover glass (410) to the first surface (411) can decrease by a constant length as the distance from the arbitrary point (416) on the second portion (414) to the edge of the cover glass (410) decreases.

[0056] Referring to identification number 42 of FIG. 4, in one embodiment, the slope of the second portion (424) may be formed to be irregular. In one embodiment, the slope of the second portion (424) may be formed to increase as it approaches the edge of the second portion (424). In one embodiment, the slope of the second portion (424) may be formed to decrease as it approaches the edge of the second portion (424). In one embodiment, the slope of the second portion (424) may decrease without regularity.

[0057] In one embodiment, the distance (d5) from the edge of the second part (424) of the second part (422) to the edge of the first part (421) of the second part (422) may be a smaller value than the distance (d4) from the first side (421) of the cover glass (420) to the first part (423) of the second side (422). In one embodiment, the length (d6) in the direction parallel to d4 from an arbitrary point (426) on the second part (424) of the cover glass (410) to the first side (411) may decrease more as the distance from an arbitrary point (426) on the second part (424) to the edge of the cover glass (420) decreases. Of course, the method for forming the slope of the second part (414, 424) of the cover glass is not limited to the embodiment described above.

[0058] FIG. 5 is a drawing showing a cross-section of an electronic device (100) to explain the extent to which the cover glass protrudes in an electronic device (100) according to one embodiment.

[0059] In an electronic device (200) according to one embodiment, a first surface (111) of a cover glass (110) may protrude a predetermined length (d1) further toward the front (540) of the electronic device (200) than a protruding portion (141) of a support member (140). In an electronic device (200) according to one embodiment, a predetermined length (d1) by which the first surface (111) of the cover glass (110) protrudes a predetermined length (d1) further toward the front (540) of the electronic device (200) than a protruding portion (141) of a support member (140) may be set so that, when the electronic device (200) is dropped in a predetermined direction (530), a portion (543) of the protruding portion (141) of the support member (140) touches the horizontal plane (520) before an edge (513) of a border surface of the cover glass (110).

[0060] For example, when the electronic device (200) is dropped and collides with the horizon (520) such that the angle (550) between the first surface (111) of the cover glass (110) and the horizon (520) is a predetermined angle, the protruding height (d1) of the first surface (111) of the cover glass (110) may be determined so that the cover glass (110) of the electronic device (200) does not collide with the horizon (520) first. In this case, even if the electronic device (200) is dropped and collides with the horizon (520) such that the first surface (111) of the cover glass (110) forms a predetermined angle with the horizon (520), the protruding portion (141) of the support member (140) may collide with the horizon (520) before the cover glass (110). In this case, compared to the case where the cover glass (110) collides with the horizontal plane (520) before the protruding portion (141) of the support member (140), the amount of impact applied to the cover glass (110) can be reduced, and the cover glass (110) can be protected from impact.

[0061] FIG. 6 is a cross-sectional view of an electronic device (200) to explain the arrangement between the edge of a cover glass (110) and a support member (140) according to one embodiment.

[0062] In an electronic device (200) according to one embodiment, a first surface (111) of a cover glass (110) may protrude further toward the front (640) of the electronic device (200) than a protruding portion (141) of a support member (140). In one embodiment, the cover glass (110) may be disposed spaced apart from the protruding portion (141) of the support member (140). In one embodiment, the cover glass (110) may be disposed spaced apart from the protruding portion (141) of the support member (140), so that a predetermined space (650) may be formed between the cover glass (110) and the protruding portion (141) of the support member (140). In this case, due to the space (650) formed between the protruding portion (141) of the support member (140) and the cover glass (110), even if the electronic device (200) receives an impact through the support member (140), the protruding portion (141) of the support member (140) and the cover glass (110) do not directly contact each other, thereby reducing the amount of impact applied to the cover glass (110). For example, when viewed from the side of the electronic device (200) (e.g., in the +x, +y, -x, -y directions of FIG. 1), the end of the second portion (114) of the second surface (112) of the cover glass (110) may be formed at a position equal to or higher than the height of the protruding portion (141) of the support member (140).

[0063] According to one embodiment, a space may exist between the second portion (114) of the second surface (112) of the cover glass (110), the recessed portion (145) of the support member (140), and the protruding portion (141) of the support member (140). In this case, a molding portion (130) may be arranged in the space formed. In one embodiment, the molding portion (130) may be arranged to be spaced apart from the protruding portion (141) of the support member (140). In one embodiment, the molding portion (130) may be arranged to be in contact with the protruding portion (141) of the support member (140).

[0064] FIG. 7 is a cross-sectional view of an electronic device (200) for explaining the arrangement of a molding portion (e.g., 130 in FIG. 1, 730, 780 in FIG. 7) according to one embodiment.

[0065] According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be formed to surround a rim portion of the display panel (120). According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) formed to surround a rim portion of the display panel (120) may prevent the rim portion of the display panel (120) from directly contacting the support member (140). According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) formed to surround a rim portion of the display panel (120) may prevent the rim portion of the display panel (120) from directly contacting the cover glass (110). Through this, when the electronic device (200) receives an impact through the support member (140) or the cover glass (110), the edge of the display panel (120) can be prevented from receiving the impact directly from the support member (140) or the cover glass (110).

[0066] According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be made of a material having higher ductility than the display panel (120). According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be made of a material having higher ductility than the cover glass (110). According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) made of a material having higher ductility than the display panel (120) or the cover glass (110) may absorb the impact before the display panel (120) when the electronic device (200) receives an impact through the support member (140) or the cover glass (110). In this case, since the display panel (120) receives only a reduced shock by having the shock first absorbed by the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7), the risk of damage to the display panel (120) upon impact can be reduced. In one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) made of a material more ductile than the display panel (120) or the cover glass (110) can absorb the shock before the cover glass (110) when the electronic device (200) receives an impact through the support member (140). In this case, the cover glass (110) receives only a reduced impact by having the impact first absorbed by the molding portion (e.g., 130 in FIG. 1, 730, 780 in FIG. 7), so the risk of damage to the cover glass (110) upon impact can be reduced.

[0067] According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be disposed spaced apart from the protruding portion (141) of the support member (140). In one embodiment, the fifth surface (135) of the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be formed spaced apart from the protruding portion (141) of the support member (140). In this case, an air gap may be formed between the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) and the protruding portion (141) of the support member (140).

[0068] According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be arranged without being spaced apart from the support member (140). In one embodiment, the fifth surface (135) of the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be configured in a form attached to the protruding portion (141) of the support member (140). In one embodiment, the third surface (133) of the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be configured in a form attached to the recessed portion (145) of the support member (140).

[0069] According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be formed of a material having a waterproof function. In this case, since the edge portion of the display panel (120) is surrounded by the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7), even if the electronic device (200) is exposed to moisture, the display panel (120) may not be directly exposed to moisture.

[0070] According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be manufactured using an adhesive material. For example, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be manufactured using an epoxy material. According to one embodiment, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be manufactured using a non-adhesive material. In this case, the molding portion (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) may be attached to the support member (140) via a sealing portion (750).

[0071] In the identification number 710, the molding portion (730) can be bonded to the support member (140) through the sealing portion (750). In one embodiment, the molding portion (730) can be disposed in a space formed between the second portion (114) of the second surface (112) of the cover glass (110), the recessed portion (145) of the support member (140), and the protruding portion (141) of the support member (140) by bonding to the recessed portion (145) of the support member through the sealing portion (750).

[0072] According to one embodiment, the molding part (730) may be placed on the electronic device (200) by manufacturing the molding part (730) and then attaching the manufactured molding part (730) to the recessed portion (145) of the support member (140) through a sealing part (750). In one embodiment, when the molding part (730) is attached to the recessed portion (145) of the support member (140) through the sealing part (750), a second recessed portion (147) for placing the sealing part (750) may be formed in the recessed portion (145) of the support member (140). In one embodiment, the second recessed portion (147) may be formed in the recessed portion (145). In one embodiment, the second recessed portion (147) may be formed to be more recessed than the recessed portion. In this case, a sealing portion (750) is attached to the second recessed portion (147), and an additional recessed portion (147) and a molding portion (730) can be attached through the sealing portion (750). Hereinafter, a description of a method in which the molding portion (730) is formed in advance and then placed on the electronic device (200) will be described in detail with reference to FIG. 8.

[0073] In the identification number 760, the molding portion (780) can be formed by injecting a material for forming the molding portion (780) through an injection port (790) formed in a direction (770) from the rear of the electronic device (200) toward the front. For example, in a state where the cover glass (110) and the display panel (120) of the electronic device (200) are coupled to the support member (140), the material for the molding portion (780) is injected through the injection port (790) formed in the support member (140) toward the space between the second part (114) of the second surface (112) of the cover glass (110) of the electronic device (200) and the recessed portion (145) of the support member (140), thereby allowing the molding portion (780) to be placed on the electronic device (200).

[0074] In one embodiment, the material of the molding part (780) injected through the injection port (790) may be a material having adhesiveness to the surface. In this case, the molding part (780) may be attached to the cover glass (110) or the support member (140) through the surface that comes into contact with the cover glass (110) and the support member (140). In this case, even without a sealing part (e.g., 750 of FIG. 7), the molding part (780) may be attached to the cover glass (110) and the support member (140). Hereinafter, a description of a method in which the molding part (780) is placed on the electronic device (200) by being injected through the support member (140) will be described in detail with reference to FIGS. 9 and 10. Of course, the method of forming the molding part (e.g., 130 of FIG. 1, 730, 780 of FIG. 7) is not limited to the above embodiment.

[0075] FIG. 8 is a drawing illustrating a cross-section of an electronic device (200) formed by a method in which a molding portion (830) is formed and then placed on an electronic device (200) according to one embodiment, and a method for manufacturing the same.

[0076] According to one embodiment, the molding part (830) may be manufactured using a mold before being placed on the electronic device (200). According to one embodiment, the molding part (830) may be manufactured and then attached to the cover glass (110). According to one embodiment, the attachment of the molding part (130) to the cover glass (110) may include attaching the molding part (130) to the cover glass (110) via a film part (e.g., 1210 of FIG. 12) formed on at least a portion of the second surface (112) of the cover glass (110). According to one embodiment, the molding part (830) may be manufactured and then coupled to the cover glass (110) and the display panel (120) so as to surround an edge portion of the display panel (120). According to one embodiment, a molding portion (830) may be attached to a cover glass (110) and a display panel (120), and then attached to a support member (140) to be placed in an electronic device (200).

[0077] According to one embodiment, the molding part (830) may be formed in a state in which it is combined with the cover glass (110) and the display panel (120) before being placed on the electronic device (200). In one embodiment, the molding part (830) may be formed to be combined with the cover glass (110) and the display panel (120) using a mold before being placed on the electronic device (200), while the cover glass (110) and the display panel (120) are placed thereon. In this case, the molding part (830) may be placed on the electronic device (200) by being combined with the support member (140) while being combined with the cover glass (110) and the display panel (120).

[0078] In one embodiment, the molding portion (830) may be disposed by being bonded to the recessed portion (145) of the support member (140) through a sealing portion (850) in a space formed between the second portion (114) of the second surface (112) of the cover glass (110), the recessed portion (145) of the support member (140), and the protruding portion (141) of the support member (140). In one embodiment, the molding portion (830) may be bonded to the support member (140) through the sealing portion (850).

[0079] According to one embodiment, after forming the molding portion (830) to surround the edge of the display panel (120), the molding portion (830) formed through the sealing portion (850) may be attached to the recessed portion (145) of the support member (140) so as to be placed on the electronic device (200). In one embodiment, when the molding portion (830) is attached to the recessed portion (145) of the support member (140) through the sealing portion (850), a second recessed portion (147) for placing the sealing portion (850) may be formed in the recessed portion (145) of the support member (140). In one embodiment, the second recessed portion (147) may be formed in the recessed portion (145). In one embodiment, the second recessed portion (147) may be formed to be more recessed than the recessed portion. In this case, a sealing portion (850) is attached to the second recessed portion (147), and the second recessed portion (147) and the molding portion (830) can be attached through the sealing portion (850).

[0080] FIG. 9 is a drawing for explaining a molding part (930) formed using a mold according to one embodiment.

[0081] According to one embodiment, the molding portion (930) may be formed to surround a rim portion of the display panel (120). In one embodiment, the molding portion (930) may be manufactured through a mold including a space (940) surrounding the rim portion of the display panel (120). In one embodiment, the molding portion (930) may be manufactured to be attached to the cover glass (110). In one embodiment, the molding portion (930) may be formed in a state in which it is combined with the cover glass (110) and the display panel (120).

[0082] According to the identification number 910, the molding part (930) can be manufactured by injecting a material (932) forming the molding part (930) into a mold (920) before being placed on the electronic device (200). In one embodiment, the mold (920) for manufacturing the molding part (930) can include a recessed portion (940) into which the material forming the molding part (930) is injected. In one embodiment, the mold (920) for manufacturing the molding part (930) can further include a recessed portion for placing the cover glass (110) and the display panel (120).

[0083] In one embodiment, a mold (920) for manufacturing a molding portion (930) may include an injection port portion (945) for injecting a material (932) forming the molding portion (930). According to one embodiment, the injection port portion (945) may be formed from an outer surface of the mold (920) to a space (940) for injecting a material forming the molding portion (930).

[0084] According to one embodiment, a material (932) forming a molding portion (930) may be injected through an injection port portion (945) from the outside of the mold (920) toward a space (940) into which a material forming a molding portion (930) is to be injected. According to one embodiment, the material (932) forming the molding portion (930) may be injected in a liquid state. In this case, when the material (932) forming the molding portion (930) hardens or solidifies, the molding portion (930) may be formed.

[0085] According to one embodiment, while the cover glass (110) and the display panel (120) are placed in the recessed portion of the mold (920) for placing the cover glass (110) and the display panel (120), the material (932) forming the molding portion (930) may be injected into the space (940) for injecting the material (932) forming the molding portion (930). In one embodiment, the material (932) forming the molding portion (930) may be a material that creates adhesiveness on the surface when the molding portion (930) is formed. In this case, the molding portion (930) may be formed by being combined with the cover glass (110) and the display panel (120), as shown in identification number 960. In this case, the electronic device (200) can be formed by combining a molding part (930), a cover glass (110), and a display panel (120), and a support member (e.g., 140 in FIG. 1).

[0086] In one embodiment, the material (932) forming the molding portion (930) may be injected while the rim portion of the display panel (120) is positioned in a space (940) into which the material (932) forming the molding portion (930) is to be injected. In this case, when the molding portion (930) is formed, the molding portion (930) may be formed to surround the display panel (120). In one embodiment, the material (932) forming the molding portion (930) may be a material that creates adhesiveness on the surface when the molding portion (930) is formed. In this case, the molding portion (930) may be formed by being combined in a state of surrounding the display panel (120), as in identification number 960.

[0087] FIG. 10 is a drawing for explaining a molding part (1030) formed by a material injected through an injection port (1045) of a support member (140) according to one embodiment.

[0088] According to identification number 1010, in the electronic device (200), a display panel (120) is disposed on a support portion (142) of a support member (140), and a cover glass (110) is disposed on the display panel (120), and a space (1040) may be formed between a protruding portion (141) of the support member (140), the cover glass (110), and a recessed portion (145) of the support member (140). In one embodiment, a material (1032) forming a molding portion (1030) may be injected into the formed space (1040). In one embodiment, the material (1032) forming the molding portion (1030) may be injected in a direction (1070) from the rear of the electronic device toward the front. According to one embodiment, the electronic device (200) may include an injection port portion (1045) for injecting a material (1032) forming the molding portion (1030). In one embodiment, the support member (140) may include an injection port portion (1045) connecting the exterior of the electronic device (200) and the space (1040). According to one embodiment, the injection port portion (1045) may be formed from an outer surface of the support member (140) to a recessed portion (145) for injecting a material forming the molding portion (1030).

[0089] According to one embodiment, the material (1032) forming the molding portion (1030) may be injected through the injection port portion (1045) from the outside of the support member (140) toward the space (1040) for injecting the material (1032) forming the molding portion (1030). According to one embodiment, the material (1032) forming the molding portion (1030) may be injected in a liquid state. In this case, when the material (1032) forming the molding portion (103) hardens or solidifies, the molding portion (1030) may be formed.

[0090] According to identification number 1060, in an electronic device (200), when a display panel (120) is placed on a support portion (142) of a support member (140), and a cover glass (110) is placed on the display panel (120), and a material (1032) forming a molding portion (1030) is injected into a space (1040) formed to form a molding portion (1030), the formed molding portion (1030) can form an adhesive layer (1038) on a surface. In this case, the adhesive layer (1038) formed on the surface of the molding portion (1030) can be formed on the fourth surface (134) of the molding portion (1030), the fifth surface (135) of the molding portion (1030), and the third surface (133) of the molding portion (1030). In this case, the fourth side (134) of the molding part (1030) can be attached to the second part (114) of the second side (112) of the cover glass (110) through the adhesive layer (1038) formed on the surface of the molding part (1030). In this case, the fifth side (135) of the molding part (1030) can be attached to the protruding part (141) of the support member (140) through the adhesive layer (1038) formed on the surface of the molding part (1030). In this case, the third side (133) of the molding part (1030) can be attached to the recessed part (145) of the support member (140) through the adhesive layer (1038) formed on the surface of the molding part (1030). In this case, the molding part (1030) can be attached to the edge portion of the display panel (120) through the adhesive layer (1038) formed on the surface of the molding part (1030).

[0091] According to identification number 1060, in an electronic device (200), when a display panel (120) is placed on a support portion (142) of a support member (140), and a material (1032) forming a molding portion (1030) is injected into a space (1040) formed in a state where a cover glass (110) is placed on the display panel (120), the protruding portion (141) of the support member (140) and the molding portion (1030) can be formed to be in contact with each other.

[0092] FIG. 11 is a drawing for comparing cross-sections of an electronic device (200) formed by a plurality of methods for forming a molding portion (130) according to one embodiment.

[0093] When viewing the electronic device (200) according to one embodiment in a direction from the front to the rear of the electronic device (200) (e.g., the -z direction in FIG. 1), light may not be emitted from a portion of the display panel (120) where pixels do not emit light, a portion of the display panel (120) that is covered by another configuration, and a protruding portion (141) of the support member (140). In one embodiment, when viewing the electronic device (200) in a direction from the front to the rear of the electronic device (200), an area where light is not emitted may be referred to as a bezel area. In one embodiment, the bezel area may include an edge portion of the display panel (120) surrounded by the molding portions (1130, 1138) and a protruding portion (141) of the support member (140), which are areas observed when viewing the electronic device (200) in a direction from the front to the rear. In one embodiment, the bezel area may appear black because no light is emitted.

[0094] In the identification number 1110, the molding part (1130) according to one embodiment can be manufactured, and then coupled to the cover glass (110) and the display panel (120), and then coupled to the support member (140), thereby being placed on the electronic device (100). In this case, the cover glass (110) and the molding part (1130) can be attached using a sealing member (1115). For example, the cover glass (110) and the molding part (1130) can be attached using a sealing member for waterproofing. For example, the sealing member for waterproofing can be a waterproof sealing tape. In one embodiment, when the cover glass (110) and the molding part (1130) are attached using the sealing member (1115), a space may be required between the cover glass (110) and the molding part (1130) for the sealing member (1115) to be placed.

[0095] In the identification number 1160, in an electronic device (100) according to one embodiment, a display panel (120) is disposed on a support portion (142) of a support member (140), and a material for forming a molding portion (1138) is injected into a space formed in a state where a cover glass (110) is disposed on the display panel (120), so that the molding portion (1138) can be formed and disposed. In this case, the formed molding portion (1138) can form an adhesive layer (1115) on a surface. In this case, the molding portion (1138) can be attached to the cover glass (110) through the adhesive layer (1115) formed on the surface of the molding portion (1138). In this case, the molding portion (1138) can be attached to the recessed portion of the support member (140) through the adhesive layer (1115) formed on the surface of the molding portion (1138). In this case, the molding part (1138) may be bonded to the cover glass (110), and a sealing member to prevent moisture from entering may not be required. In this case, the sealing member (1115) in the identification number 1110 may not be placed. In this case, a space for placing the sealing member (1115) may not be required.

[0096] Accordingly, according to the embodiment of the identification number 1110, when the molding portion (1130) is disposed in the electronic device (100) by being manufactured and then coupled to the cover glass (110) and the display panel (120) and then coupled to the support member (140), a space for the sealing member (1115) to be disposed is required, and thus the area including this space may become the bezel area. On the other hand, according to the embodiment of the identification number 1160, when the display panel (120) is disposed on the support portion (142) of the support member (140) in the electronic device (100), and the cover glass (110) is disposed on the display panel (120), a material for forming the molding portion (1138) is injected into the space formed, and the molding portion (1138) is formed and disposed, the sealing member may not be required, and thus the width of the bezel area may be reduced. Accordingly, compared to the width (d1) of the bezel area according to the embodiment of identification number 1110, the width (d2) of the bezel area according to the embodiment of identification number 1160 can be reduced by a predetermined length (d3).

[0097] FIG. 12 is a drawing showing a cross-section of a film portion (1210) according to one embodiment and a cross-section of an electronic device (200) including the same.

[0098] In an electronic device (200) according to one embodiment, a film portion (1210) may be disposed between a second portion (114) of a second surface (112) of a cover glass (110) and a fourth surface (134) of a molding portion (130). In one embodiment, the film portion (1210) may include at least one layer. For example, the film portion (1210) may include a single layer or may include a plurality of layers (1201, 1203, 1205, 1207, 1209, 1211). In one embodiment, when the film portion (1210) includes a plurality of layers (1201, 1203, 1205, 1207, 1209, 1211), the plurality of layers (1201, 1203, 1205, 1207, 1209, 1211) may be arranged to be sequentially stacked. For example, the single or multiple layers (1201, 1203, 1205, 1207, 1209, 1211) included in the film portion (1210) may be arranged by a laminating method. However, the number and types of layers included in the film portion (1210) are not limited thereto.

[0099] According to one embodiment, the film portion (1210) may be positioned under at least a portion of the second surface (112) of the cover glass (110) after the second surface (112) of the cover glass (110) is processed. For example, the film portion (1210) may be positioned so as to be attached to the second surface (112) of the cover glass (110) after the second surface (112) of the cover glass (110) is polished.

[0100] In an electronic device (200) according to one embodiment, a second portion (114) of a second surface (112) of a cover glass (110) and a fourth surface (134) of a molding portion (130) may be attached via a film portion (1210). For example, the film portion (1210) may include an optical adhesive material. For example, the film portion (1210) may include an optically clear adhesive (OCA) film. For example, the film portion (1210) may include a gradient film layer. For example, the gradient film layer may be a film layer having a gradient pattern formed thereon. For example, the gradient film layer may be a film layer having a gradient pattern printed thereon. For example, the film portion (1210) may include a film layer that provides a light-reflecting effect. For example, the film portion (1210) may include a film that reflects light to provide a mirror effect.

[0101] In one embodiment, the film portion (1210) may include a film that absorbs light. For example, the film portion (1210) may include a film printed in black. In one embodiment, the film portion (1210) may include a film that blocks light. For example, the film portion (1210) may be printed in black, thereby blocking the color of the molding portion (130) from being visible when viewed from the front toward the rear of the electronic device (200).

[0102] In an electronic device (200) according to one embodiment, the film portion (1210) may include a colored film. The film portion (1210) according to one embodiment may include a layer printed with a pattern or color. For example, the film portion (1210) may include a PET film. For example, the film portion (1210) may include a transparent plastic film for a display.

[0103] In one embodiment, the film portion (1210) may be formed by sequentially stacking a plurality of layers (1201, 1203, 1205, 1207, 1209, 1211). For example, the film portion (1210) may be formed by sequentially stacking an OCA film layer, a PET film layer, a gradient pattern printing layer, a light-reflecting printing film layer, and a light-blocking black color printing film layer from a direction closer to the cover glass (110). However, the types and stacking order of the layers included in the film portion (1210) are not limited thereto.

[0104] FIG. 13 is a drawing illustrating a portion of a cross-section of an electronic device including a film portion and the electronic device according to one embodiment.

[0105] In one embodiment, the film portion may be formed by sequentially stacking a plurality of layers (1301, 1303, 1305, 1307, 1309). For example, the film portion may be formed by sequentially stacking an OCA film layer (1301), a PET film layer (1303), a gradient film layer (1305), a light-reflecting mirror film layer (1307), and a light-blocking black film layer (1309) from a direction closer to the cover glass (110). In this case, when viewing the electronic device (200) from the front of the electronic device (200), an effect may be generated in which the thickness of the cover glass (110) appears thicker than the actual thickness of the cover glass (110) at a portion (1350) where the film portion is arranged due to the plurality of layers included in the film portion.

[0106] FIG. 14 is a drawing illustrating a portion of a cross-section of an electronic device including a film portion and the electronic device according to one embodiment.

[0107] In one embodiment, the film portion may be formed by sequentially stacking a plurality of layers (1401, 1403, 1405, 1407, 1409, 1411). For example, the film portion may be formed by sequentially stacking an OCA film layer (1401), a PET film layer (1403), a gradient pattern printing layer (1405), a color-printed translucent film layer (1407), a light-reflecting printing film layer (1409), and a light-blocking black printing film layer (1411) from a direction closer to the cover glass (110). In this case, when viewing the electronic device (200) from the front of the electronic device (200), an effect of generating light of a predetermined color without power by the plurality of layers included in the film portion may be generated at a portion (1450) where the film portion is arranged.

[0108] FIG. 15 is a flowchart illustrating a process in which an electronic device (200) is formed by arranging components of an electronic device (200) according to one embodiment.

[0109] In operation 1505, a display panel (120) may be provided. The display panel (120) may be provided to be included in a display (201) disposed on the front side of an electronic device (200) according to one embodiment.

[0110] In operation 1510, a cover glass (110) may be processed. According to one embodiment, a cover glass (110) for protecting a display panel (120) of an electronic device (200) may be processed. According to one embodiment, the cover glass (110) may be positioned to come into contact with the display panel (120).

[0111] The cover glass (110) according to the present disclosure can be manufactured and processed in various shapes and methods. For example, the cover glass (110) can be manufactured to have the shape of the cover glass (410, 420) of FIG. 4.

[0112] In one embodiment, the cover glass (110) may be processed to include a first side (111) facing the front (e.g., +z direction) of the electronic device (200) and a second side (112) opposite the first side (111). In one embodiment, the second side (112) may be processed to include a first portion (113) disposed on at least a portion of the display panel (120) and a second portion (114) formed to be inclined with respect to the first portion.

[0113] According to one embodiment, in the cover glass (110), the thickness of the cover glass (110) corresponding to the second portion (114) of the second surface (112) may be processed to decrease as it approaches the edge of the cover glass (110). According to one embodiment, the first surface (111) of the cover glass (110) may be processed to protrude further toward the front of the electronic device (200) by a predetermined length (e.g., d1 in FIG. 1) than the protruding portion (141) of the support member (140). In one embodiment, a predetermined length (e.g., d1 in FIG. 1) by which the first side (111) of the cover glass (110) protrudes further toward the front (180) of the electronic device (200) than the protruding portion (141) of the support member (140) may be set to a predetermined length to prevent the cover glass (110) from being broken when the electronic device (200) is dropped. In one embodiment, by manufacturing the first side (111) of the cover glass (110) to protrude further toward the front of the electronic device (200) than the protruding portion (141) of the edge of the support member (140), the depth of the display (201) visually perceived by the user may be increased.

[0114] According to one embodiment, the step (1510) of processing the cover glass (110) may include the step of polishing the second portion (114) of the second surface (112) of the cover glass (110).

[0115] According to one embodiment, a film portion (e.g., 1210 of FIG. 12) may be attached to at least a second portion (114) of the second surface (112) of the cover glass (110). Referring to FIG. 12, in an electronic device (200) according to one embodiment, the film portion (1210) may be disposed between the second portion (114) of the second surface (112) of the cover glass (110) and the fourth surface (134) of the molding portion (130). In one embodiment, the film portion (1210) may include at least one layer. For example, the film portion (1210) may include a single layer or may include a plurality of layers. In one embodiment, when the film portion (1210) includes a plurality of layers, the plurality of layers may be arranged to be sequentially stacked.

[0116] In operation 1520, a support member (140) for supporting the display panel (120) may be formed. A support member (140) for supporting the display (210) of the electronic device (200) according to one embodiment may be formed. In one embodiment, the support member (140) may be formed to include a support portion (142) for supporting at least a portion of the display panel (120), a recessed portion (145) for receiving the molding portion (130), and a protruding portion (141) for protruding toward the front of the electronic device (200).

[0117] According to one embodiment, the protruding portion (141) may be positioned to be spaced apart from the cover glass (110). According to one embodiment, the protruding portion (141) may be positioned so as to minimize an area in contact with the cover glass (110). For example, the edge of the cover glass (110) may be manufactured to be formed at a position equal to or higher than the height of the protruding portion (141) of the support member (140) when the electronic device (200) is viewed from the side (e.g., +x direction, +y direction) of the electronic device (200). In this case, even if the electronic device (200) receives an impact through the protruding portion (141) of the support member (140), the protruding portion (141) of the support member (140) and the cover glass (110) do not directly contact each other, or even if they do, the area in which they contact each other is minimized, thereby reducing the amount of impact applied to the cover glass (110).

[0118] In operation 1525, a cover glass (110) may be placed. According to one embodiment, the cover glass (110) may be placed to protect the display panel (120) of the electronic device (200). According to one embodiment, the cover glass (110) may be placed so as to be in contact with the display panel (120).

[0119] In operation 1530, a molding member (130) may be disposed. In one embodiment, the molding member (130) may be disposed below the second portion (114) of the second surface (112) of the cover glass (110) to surround the edge of the display panel (120). According to one embodiment, the molding member (130) may be manufactured to include a third surface (133) facing the rear (e.g., in the -z direction) of the electronic device (200), a fourth surface (134) opposite to the third surface (133), and a fifth surface (135) facing the protruding portion (141) of the support member (140). In one embodiment, the third surface (133) may be attached to the recessed portion (145) of the support member (140). In one embodiment, the fifth surface (135) of the molding portion (130) may be positioned to be spaced apart from the protruding portion (141) of the support member (140). In one embodiment, the fifth surface (135) of the molding portion (130) may be positioned to be in contact with the protruding portion (141) of the support member (140).

[0120] According to one embodiment, the molding portion (730) can be bonded to the support member (140) through the sealing portion (750). In one embodiment, the molding portion (730) can be disposed in a space formed between the second portion (114) of the second surface (112) of the cover glass (110), the recessed portion (145) of the support member (140), and the protruding portion (141) of the support member (140) by bonding to the recessed portion (145) of the support member through the sealing portion (750).

[0121] According to one embodiment, the molding part (730) can be placed in the electronic device (200) by attaching the molding part (730) manufactured to the recessed portion (145) of the support member (140) through the sealing part (750) after the molding part (730) is manufactured. In one embodiment, when the molding part (730) is attached to the recessed portion (145) of the support member (140) through the sealing part (750), a second recessed portion (147) for placing the sealing part (750) can be formed in the recessed portion (145) of the support member (140). The electronic device (200) according to one embodiment can be manufactured so that the second recessed portion (147) is formed in the first recessed portion (145). In one embodiment, the second recessed portion (147) may be manufactured to be more recessed than the first recessed portion (145). In this case, a sealing portion (750) may be attached to the second recessed portion (147), and an additional recessed portion (147) and a molding portion (730) may be attached through the sealing portion (750).

[0122] Referring to FIG. 7, in one embodiment, the molding portion (780) can be manufactured by injecting a material for forming the molding portion (780) through an injection port (790) formed in a direction (770) from the rear of the electronic device (200) toward the front. For example, when the cover glass (110) and the display panel (120) of the electronic device (200) are coupled to the support member (140), the material for the molding portion (780) can be injected through the injection port (790) formed in the support member (140) toward the space between the second part (114) of the second surface (112) of the cover glass (110) of the electronic device (200) and the recessed portion (145) of the support member (140), thereby allowing the molding portion (780) to be placed on the electronic device (200).

[0123] Referring to FIG. 10, when a display panel (120) is placed on a support portion (142) of a support member (140) and a cover glass (110) is placed on the display panel (120), and a material (1032) forming a molding portion (1030) is injected into a space (1040) formed by the molding portion (1030) to form the molding portion (1030), the formed molding portion (1030) can form an adhesive layer (1038) on the surface. In this case, the adhesive layer (1038) formed on the surface of the molding portion (1030) can be formed on the fourth surface (134) of the molding portion (1030), the fifth surface (135) of the molding portion (1030), and the third surface (133) of the molding portion (1030). In this case, the fourth side (134) of the molding part (1030) can be attached to the second part (114) of the second side (112) of the cover glass (110) through the adhesive layer (1038) formed on the surface of the molding part (1030). In this case, the fifth side (135) of the molding part (1030) can be attached to the protruding part (141) of the support member (140) through the adhesive layer (1038) formed on the surface of the molding part (1030). In this case, the third side (133) of the molding part (1030) can be attached to the recessed part (145) of the support member (140) through the adhesive layer (1038) formed on the surface of the molding part (1030). In this case, the molding part (1030) can be attached to the edge portion of the display panel (120) through the adhesive layer (1038) formed on the surface of the molding part (1030).

[0124] According to one embodiment, the molding part (130) may be manufactured, and then placed on the electronic device (100) by being coupled to the cover glass (110) and the display panel (120), and then coupled to the support member (140). In this case, the cover glass (110) and the molding part (130) may be attached using a sealing member. For example, the cover glass (110) and the molding part (130) may be attached using a sealing member for waterproofing. For example, the sealing member for waterproofing may be a waterproof sealing tape. In one embodiment, when the cover glass (110) and the molding part (130) are attached using a sealing member, a space may be required between the cover glass (110) and the molding part (130) for the sealing member to be placed.

[0125] In an electronic device (100) according to one embodiment, a display panel (120) is disposed on a support portion (142) of a support member (140), and a molding member (130) may be formed and disposed by injecting a material for forming a molding member (130) into a space formed in a state where a cover glass (110) is disposed on the display panel (120). In this case, the formed molding member (130) may form an adhesive layer on its surface. In this case, the molding member (130) may be attached to the cover glass (110) through the adhesive layer formed on the surface of the molding member (1138). In this case, the molding member (130) may be attached to the recessed portion of the support member (140) through the adhesive layer formed on the surface of the molding member (130). In this case, a sealing member for adhering the molding member (130) to the cover glass (110) and preventing moisture from entering may be unnecessary. In this case, a sealing member may not be placed between the molding part (130) and the cover glass (110). In this case, a space for placing the sealing member (1115) may not be required.

[0126] Accordingly, in the electronic device (100), when a material for forming a molding part (130) is injected into a space formed in a state where a display panel (120) is placed on a support portion (142) of a support member (140) and a cover glass (110) is placed on the display panel (120), and the molding part (130) is formed and placed, a sealing member for attaching the molding part (130) and the cover glass (110) may not be required, and thus the width of the bezel area can be reduced. Accordingly, the width of the bezel area can be reduced by a predetermined length.

[0127] FIG. 16 is a block diagram of an electronic device (1601) within a network environment (1600) according to various embodiments. Referring to FIG. 16, in the network environment (1600), the electronic device (1601) may communicate with the electronic device (1602) via a first network (1698) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1604) or the server (1608) via a second network (1699) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1601) may communicate with the electronic device (1604) via the server (1608). According to one embodiment, the electronic device (1601) may include a processor (1620), a memory (1630), an input module (1650), an audio output module (1655), a display module (1660), an audio module (1670), a sensor module (1676), an interface (1677), a connection terminal (1678), a haptic module (1679), a camera module (1680), a power management module (1688), a battery (1689), a communication module (1690), a subscriber identification module (1696), or an antenna module (1697). In some embodiments, the electronic device (1601) may omit at least one of these components (e.g., the connection terminal (1678)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1676), camera module (1680), or antenna module (1697)) may be integrated into a single component (e.g., display module (1660)).

[0128] The processor (1620) may control at least one other component (e.g., a hardware or software component) of the electronic device (1601) connected to the processor (1620) by executing, for example, software (e.g., a program (1640)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1620) may store commands or data received from other components (e.g., a sensor module (1676) or a communication module (1690)) in a volatile memory (1632), process the commands or data stored in the volatile memory (1632), and store result data in a non-volatile memory (1634). According to one embodiment, the processor (1620) may include a main processor (1621) (e.g., a central processing unit or an application processor) or an auxiliary processor (1623) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1621). For example, when the electronic device (1601) includes the main processor (1621) and the auxiliary processor (1623), the auxiliary processor (1623) may be configured to use less power than the main processor (1621) or to be specialized for a given function. The auxiliary processor (1623) may be implemented separately from the main processor (1621) or as a part thereof.

[0129] The auxiliary processor (1623) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1660), the sensor module (1676), or the communication module (1690)) of the electronic device (1601), for example, on behalf of the main processor (1621) while the main processor (1621) is in an inactive (e.g., sleep) state, or together with the main processor (1621) while the main processor (1621) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1623) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1680) or a communication module (1690)). In one embodiment, the auxiliary processor (1623) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1601) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1608)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0130] The memory (1630) can store various data used by at least one component (e.g., the processor (1620) or the sensor module (1676)) of the electronic device (1601). The data can include, for example, software (e.g., the program (1640)) and input data or output data for commands related thereto. The memory (1630) can include volatile memory (1632) or non-volatile memory (1634).

[0131] The program (1640) may be stored as software in memory (1630) and may include, for example, an operating system (1642), middleware (1644), or an application (1646).

[0132] The input module (1650) can receive commands or data to be used in a component of the electronic device (1601) (e.g., a processor (1620)) from an external source (e.g., a user) of the electronic device (1601). The input module (1650) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0133] The audio output module (1655) can output audio signals to the outside of the electronic device (1601). The audio output module (1655) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0134] The display module (1660) can visually provide information to an external party (e.g., a user) of the electronic device (1601). The display module (1660) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1660) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0135] The audio module (1670) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (1670) can acquire sound through the input module (1650), output sound through the sound output module (1655), or an external electronic device (e.g., electronic device (1602)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1601).

[0136] The sensor module (1676) can detect the operating status (e.g., power or temperature) of the electronic device (1601) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1676) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0137] The interface (1677) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1601) with an external electronic device (e.g., the electronic device (1602)). In one embodiment, the interface (1677) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0138] The connection terminal (1678) may include a connector through which the electronic device (1601) may be physically connected to an external electronic device (e.g., the electronic device (1602)). In one embodiment, the connection terminal (1678) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0139] The haptic module (1679) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1679) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0140] The camera module (1680) can capture still images and videos. In one embodiment, the camera module (1680) may include one or more lenses, image sensors, image signal processors, or flashes.

[0141] The power management module (1688) can manage the power supplied to the electronic device (1601). According to one embodiment, the power management module (1688) can be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

[0142] A battery (1689) may power at least one component of the electronic device (1601). In one embodiment, the battery (1689) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0143] The communication module (1690) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1601) and an external electronic device (e.g., electronic device (1602), electronic device (1604), or server (1608)), and the performance of communication through the established communication channel. The communication module (1690) may operate independently from the processor (1620) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1690) may include a wireless communication module (1692) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1694) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1604) via a first network (1698) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1699) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1692) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1696) to identify or authenticate the electronic device (1601) within a communication network such as the first network (1698) or the second network (1699).

[0144] The wireless communication module (1692) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1692) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1692) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1692) may support various requirements specified in the electronic device (1601), an external electronic device (e.g., the electronic device (1604)), or a network system (e.g., the second network (1699)). According to one embodiment, the wireless communication module (1692) may support a peak data rate (e.g., 20 Gbps or more) for eMBB implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

[0145] The antenna module (1697) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1697) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1697) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1698) or the second network (1699), may be selected from the plurality of antennas by, for example, the communication module (1690). A signal or power may be transmitted or received between the communication module (1690) and the external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1697).

[0146] According to various embodiments, the antenna module (1697) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0147] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0148] According to one embodiment, commands or data may be transmitted or received between the electronic device (1601) and an external electronic device (1604) via a server (1608) connected to a second network (1699). Each of the external electronic devices (1602 or 1604) may be the same or a different type of device as the electronic device (1601). According to one embodiment, all or part of the operations executed in the electronic device (1601) may be executed in one or more of the external electronic devices (1602, 1604, or 1608). For example, when the electronic device (1601) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1601) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1601). The electronic device (1601) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1601) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1604) may include an Internet of Things (IoT) device. The server (1608) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1604) or server (1608) may be included within the second network (1699). The electronic device (1601) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0149] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0150] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0151] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0152] Various embodiments of the present document may be implemented as software (e.g., a program (1640)) including one or more instructions stored in a storage medium (e.g., an internal memory (1636) or an external memory (1638)) readable by a machine (e.g., an electronic device (1601)). For example, a processor (e.g., a processor (1620)) of the machine (e.g., an electronic device (1601)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0153] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0154] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0155] According to one embodiment of the present disclosure, an electronic device may include a display panel, a cover glass including a first side facing the front of the electronic device, and a second side opposite the first side. The second side may include a first portion disposed on at least a portion of the display panel and a second portion formed to be inclined with respect to the first side. The cover glass may include a molding portion formed below the second side of the second side of the second side and surrounding a rim portion of the display panel, and a support member including a support portion supporting at least a portion of the display panel, a first recessed portion in which the molding portion is received, and a protruding portion protruding toward the front of the electronic device. The molding portion may include a third side facing the rear of the electronic device and a fourth side opposite the third side, and the third side may be attached to the first recessed portion of the support member.

[0156] According to one embodiment of the present disclosure, the electronic device may have the first surface of the cover glass protrude further toward the front of the electronic device than the protruding portion.

[0157] According to one embodiment of the present disclosure, the second side of the cover glass may be disposed on an area of ​​the display panel excluding an area of ​​the display panel surrounded by the molding part.

[0158] According to one embodiment of the present disclosure, the cover glass corresponding to the second portion may be arranged spaced apart from the protruding portion of the support member.

[0159] According to one embodiment of the present disclosure, the edge portion of the cover glass may be positioned at a higher position than the protruding portion of the support member when the electronic device is viewed from the side of the electronic device.

[0160] According to one embodiment of the present disclosure, the thickness of the cover glass corresponding to the second portion may decrease as it gets closer to the edge of the cover glass.

[0161] According to one embodiment of the present disclosure, the molding part may include a fifth surface facing the protruding portion of the support member. According to one embodiment of the present disclosure, the fifth surface may be arranged to be spaced apart from the protruding portion of the support member.

[0162] An electronic device according to one embodiment of the present disclosure may further include a sealing portion accommodated in the first recessed portion. The molding portion may be attached to the support member through the sealing portion.

[0163] According to one embodiment of the present disclosure, the first recessed portion of the support member may further include a second recessed portion that is recessed further than the first recessed portion and accommodates the sealing portion.

[0164] According to one embodiment of the present disclosure, the sealing portion may be positioned at a position within the first recessed portion that does not overlap the display panel.

[0165] According to one embodiment of the present disclosure, the ductility of the material forming the molding portion may be greater than the ductility of the material of the cover glass and the ductility of the material of the support member.

[0166] According to one embodiment of the present disclosure, the electronic device may further include a film portion disposed between the second portion of the cover glass and the fourth surface of the molding portion.

[0167] According to one embodiment of the present disclosure, the molding portion can be attached to the second portion of the cover glass through the film portion.

[0168] According to one embodiment of the present disclosure, the film portion may include a plurality of sequentially stacked layers.

[0169] According to one embodiment of the present disclosure, the plurality of sequentially stacked layers may include a first layer that provides a gradient effect for light incident on the film portion, a second layer that provides a mirror effect for the light, and a third layer that blocks the light from transmitting to the support member.

[0170] According to one embodiment of the present disclosure, the plurality of sequentially stacked layers may include a first layer that provides a gradient effect to light incident on the film portion, a translucent second layer having a predetermined color, a third layer that provides a mirror effect to the light, and a fourth layer that blocks the light from transmitting to the support member.

[0171] A method for arranging a display of an electronic device according to one embodiment of the present disclosure may include an operation of providing a display panel, and an operation of providing a cover glass including a first side facing the front of the electronic device and a second side opposite the first side, wherein the second side includes a first portion disposed on at least a portion of the display panel and a second portion formed to be inclined with respect to the first portion. The method may include an operation of forming a molding part disposed below the second portion of the cover glass and surrounding an edge of the display panel. A support member may be disposed below the molding part and the display panel.

[0172] A method for arranging a display of an electronic device according to one embodiment of the present disclosure may further include an operation of arranging the cover glass, the film portion, and the display panel on the support member. The operation of forming the molding portion may be an operation of forming the molding portion by injecting a material for forming the molding portion through an injection hole formed in the support member.

[0173] In a method for arranging a display of an electronic device according to one embodiment of the present disclosure, the injection port may be formed as a space surrounded by the film portion, the display panel, and the support member.

[0174] A method for arranging a display of an electronic device according to one embodiment of the present disclosure may further include providing a support member including a support portion that supports at least a portion of the display panel, a first recessed portion in which the molding portion is received, and a protruding portion that protrudes toward the front of the electronic device. An edge portion of the cover glass may be arranged to be higher than the protruding portion of the support member when the electronic device is viewed from the side.

[0175] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0176] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to the embodiments described in the claims or specification of the present disclosure.

[0177] In the present disclosure, a function or operation performed by an electronic device may be performed by one or more processors executing one or more instructions stored in a memory. The function or operation of the electronic device mentioned in the present disclosure may be performed by one processor executing one or more instructions, or may be performed by a combination of multiple processors executing one or more instructions. The processor mentioned in the present disclosure may be understood to include a circuit for performing an operation or controlling other components of the electronic device. For example, the one or more processors may include at least one of a central processing unit (CPU), a microprocessor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on chip (SoC), an application-specific integrated circuit (ASIC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operations of the electronic device described above.

[0178] In the present disclosure, a program (software module, software) may be stored in a non-volatile memory including a random access memory (RAM), a flash memory, a read only memory (ROM), an electrically erasable programmable read only memory (EEPROM), a magnetic disc storage device, a compact disc ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, a magnetic cassette. Or, it may be stored in a memory formed by a combination of some or all of these. The memory may be formed by a single storage medium, or may be formed by a combination of a plurality of storage media. The one or more commands may be stored in a single storage medium, or may be distributed and stored in a plurality of storage media.

[0179] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device performing an embodiment of the present disclosure.

[0180] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0181] Additionally, in the present disclosure, terms such as “part”, “module”, etc. may refer to a hardware component such as a processor or circuit, and / or a software component executed by a hardware component such as a processor.

[0182] A "component" or "module" may be implemented by a program stored in an addressable storage medium and executed by a processor. For example, a "component" or "module" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables.

[0183] The specific implementations described in this disclosure are merely exemplary and do not limit the scope of the present disclosure in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted.

[0184] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, including only b, including only c, or including a combination of two or more (including a and b, including b and c, including a and c, or including all of a, b, and c).

[0185] While the detailed description of this disclosure has described specific embodiments, it should be understood that various modifications are possible without departing from the scope of this disclosure. Therefore, the scope of this disclosure should not be limited to the described embodiments, but should be defined not only by the scope of the claims described below, but also by equivalents thereof.

Claims

1. In electronic devices, display panel; A cover glass comprising a first side facing the front of the electronic device and a second side opposite to the first side, the second side comprising a first portion disposed on at least a portion of the display panel and a second portion formed to be inclined with respect to the first portion; A molding portion formed below the second portion of the second surface of the cover glass and surrounding the rim portion of the display panel; and A support member including a support portion that supports at least a portion of the display panel, a first recessed portion in which the molding portion is received, and a protruding portion that protrudes toward the front of the electronic device; Includes, An electronic device, wherein the molding portion includes a third surface facing the rear of the electronic device and a fourth surface opposite to the third surface, wherein the third surface is attached to the first recessed portion of the support member.

2. In claim 1, The first surface of the cover glass protrudes further toward the front of the electronic device than the protruding portion. Electronic devices.

3. In claim 1, The second side of the cover glass is disposed on an area of ​​the display panel excluding an area of ​​the display panel surrounded by the molding part. Electronic devices.

4. In claim 1, The cover glass corresponding to the second part is arranged spaced apart from the protruding part of the support member. Electronic devices.

5. In claim 1, The edge portion of the cover glass is positioned higher than the protruding portion of the support member when looking at the electronic device from the side of the electronic device. Electronic devices.

6. In claim 1, The thickness of the cover glass corresponding to the second part decreases as it gets closer to the edge of the cover glass. Electronic devices.

7. In claim 1, The molding portion includes a fifth surface facing the protruding portion of the support member, The fifth surface is arranged spaced apart from the protruding portion of the support member. Electronic devices.

8. In claim 1, It further includes a sealing portion accommodated in the first depressed portion, The above molding part is attached to the support member through the sealing part. Electronic devices.

9. In claim 8, The first sunken portion of the above support member, Further comprising a second recessed portion that is more recessed than the first recessed portion and accommodates the sealing portion. Electronic devices.

10. In claim 1, The ductility of the material forming the molding part is greater than the ductility of the material of the cover glass and the ductility of the material of the support member. Electronic devices.

11. In claim 1, Further comprising a film portion disposed between the second portion of the cover glass and the fourth surface of the molding portion. Electronic devices.

12. A method for manufacturing an electronic device including a cover glass, Steps for preparing the display panel; A step of processing the second side of the cover glass, which includes a first side facing the front of the electronic device and a second side opposite to the first side, such that a second portion of the second side is formed to be inclined with respect to a first portion of the second side; A step of forming a support member including a support portion supporting at least a portion of the display panel, a first recessed portion, and a protruding portion protruding toward the front of the electronic device; A step of placing the cover glass on the display panel such that the first portion of the cover glass is placed on at least a portion of the display panel; and A step of arranging a molding part surrounding a rim portion of the display panel in a space formed by the second part of the second surface of the cover glass, the first recessed part of the support member, and the protruding part; including, method.

13. In claim 12, The step of placing the above molding part is: A step of placing the molding part by injecting an adhesive material through an injection port formed in the support member. method.

14. In claim 12, In the cover glass, a step of polishing the second portion of the second surface formed to be inclined; and A step of attaching a film portion to at least the second portion of the cover glass; including more, method.

15. In claim 12, The step of placing the above cover glass is: A step of arranging the edge portion of the cover glass so that it is positioned higher than the protruding portion of the support member when looking at the electronic device from the side of the electronic device. method.

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