Vision based position feedback for substrate handlers

Abstract

A substrate processing apparatus including a frame and a substrate transport apparatus having a body supported above the frame and an end effector. The body has a size and shape, and the substrate transport apparatus has a predetermined reference plane, straight line, or point with a predetermined relationship to the body and the size and shape of the body. A distributed reflective feature connected to the substrate transport apparatus is deterministic of a pose of the predetermined reference plane, straight line, or point. At least one camera images the distributed reflective feature. A controller is connected to the at least one camera and receives the image, and resolves from the distributed reflective feature embodied in the image a pose of the predetermined reference plane, straight line, or point, which pose informs feedback data defining a position of the body, wafer holding station, or wafer relative to the frame.

Description

Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 VISION BASED POSITION FEEDBACK FOR SUBSTRATE HANDLERS CROSS-REFERENCE TO RELATED APPLICATION(S)

[0001] This application is a non-provisional of, and claims the benefit of, United States provisional patent application number 63 / 636,349 filed on April 19, 2024, the disclosure of which is incorporated herein by reference their entireties. BACKGROUND 1. Field

[0002] The present disclosure generally relates to substrate processing equipment, and more particularly, to electromagnetically levitated substrate transports of the substrate processing equipment. 2. Brief Description of Related Developments

[0003] Semiconductor automation generally comprises a series of building blocks that are required to support the implementation of processes to ultimately achieve predetermined levels of quality and reproducibility in semiconductor chip manufacturing. One component of semiconductor automation is the wafer (also referred to as a substrate) handler that transports the wafer or substrate between load locks and process modules and / or between process modules (e.g., in the case of sequential process tool architectures).

[0004] Conventional wafer handlers employed in semiconductor automation generally comprise multi-link robotic manipulators. The multi-link robotic manipulators have end effectors that hold and transport wafers or substrates from one location to another location. To determine the positionAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 of an end effector in space, a set of position feedback sensors is employed. The set of position feedback sensors is generally mounted, at least in part, to shafts of actuators that drive the links of the multi-link robotic manipulator. Robotic kinematic errors, such as mechanical hysteresis, vibration, and thermal expansion can significantly contribute to accuracy errors with respect to the actual location of the end effector in space.

[0005] As an alternative to the wafer handlers noted above, magnetically or electro-dynamically levitated wafer conveyors may be employed where an alternating current magnetic floating apparatus for floating and conveying a conductive floating body or paramagnetic or nonmagnetic metallic material above a line of alternating current coil actuators is provided. The position of these levitated wafer conveyors is determined by using a network of distributed sensors collocated within the tool that the levitated wafer conveyor operates. This network of distributed sensors and the respective wiring harnesses compete with the coil elements for space within the tool increasing at least the footprint of the tool. It is further noted that the network of sensors dedicated to position feedback of the floating body has a cost associated therewith that serves to increase the overall cost of the tool.

[0006] Integration of cameras into a vacuum substrate transport chamber may result in substrate handlers being disposed outside a field of view of the cameras.

[0007] Accordingly, the present disclosure addresses a number of those issues. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The foregoing aspects and other features of the present disclosure are explained in the following description, taken in connection with the accompanying drawings, wherein:

[0009] Figs. 1 is exemplary substrate processing apparatus in accordance with the present disclosure;Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0010] Fig. 2 is an exemplary substrate processing apparatus in accordance with the present disclosure;

[0011] Fig. 3A is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0012] Fig.3B is a schematic elevation view of the substrate processing apparatus of Fig. 3A in accordance with the present disclosure;

[0013] Fig. 4A is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0014] Fig.4B is a schematic elevation view of the substrate processing apparatus of Fig. 4A in accordance with the present disclosure;

[0015] Fig.5 is a schematic perspective illustration of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0016] Fig. 6 is a schematic plan view of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0017] Figs.6A-6D are schematic illustrations of exemplary camera fields of view in a portion of the substrate processing apparatus in accordance with the present disclosure;

[0018] Fig.6E is a schematic illustration of an exemplary camera field of view in a portion of the substrate processing apparatus in accordance with the present disclosure;

[0019] Fig. 7 is an exemplary schematic electric circuit diagram of an coil actuator of a substrate processing apparatus in accordance with the present disclosure;

[0020] Figs. 8A, 8B, and 8C are schematic illustrations portions of a transport chamber in accordance with the present disclosure;Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0021] Fig. 9 is a schematic illustration of an coil actuator control system and coil actuator array of a substrate processing apparatus in accordance with the present disclosure;

[0022] Fig. 10A is a schematic illustration of the coil actuator control system and coil actuator array of Fig.9 in accordance with the present disclosure;

[0023] Fig. 10B is a schematic illustration of the coil actuator control system and coil actuator array of Fig.9 in accordance with the present disclosure;

[0024] Fig. 11 is a bock diagram of an exemplary wafer handler of the substrate processing apparatus described herein in accordance with the present disclosure;

[0025] Fig.12 is an exemplary illustration of the wafer handler of Fig.11 in accordance with the present disclosure;

[0026] Fig. 12A is an exemplary illustration of a portion of the wafer handler of Fig. 11 in accordance with the present disclosure;

[0027] Fig. 13 is an exemplary illustration of a portion of the substrate processing apparatus described herein in accordance with the present disclosure;

[0028] Fig.14 is exemplary illustration of a portion of the substrate processing apparatus described herein in accordance with the present disclosure;

[0029] Figs. 15 and 16 are exemplary flow diagrams of method in accordance with the present disclosure;

[0030] Fig. 17 is an exemplary illustration of a portion of the substrate processing apparatus in accordance with the present disclosure;

[0031] Fig.17A is an exemplary illustration of a portion of the substrate processing apparatus in accordance with the present disclosure;Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0032] Figs.18A-18J are respective exemplary illustrations of portions of the substrate processing apparatus in accordance with the present disclosure;

[0033] Fig. 19 is an exemplary illustration of a portion of the substrate processing apparatus in accordance with the present disclosure;

[0034] Fig. 20 is an exemplary illustration of a portion of the substrate processing apparatus in accordance with the present disclosure

[0035] Fig. 21 is an exemplary illustration of a portion of the substrate processing apparatus in accordance with the present disclosure; and

[0036] Fig. 22 is an exemplary illustration of a portion of the substrate processing apparatus in accordance with the present disclosure; and

[0037] Fig. 23 is a schematic plan view of a portion of a substrate processing apparatus in accordance with the present disclosure. DETAILED DESCRIPTION

[0038] The following detailed description is meant to assist the understanding of one skilled in the art, and is not intended in any way to unduly limit claims connected or related to the present disclosure.

[0039] The following detailed description references various figures, where like reference numbers refer to like components and features across various figures, whether specific figures are referenced, or not.

[0040] The word “each” as used herein refers to a single object (i.e., the object) in the case of a single object or each object in the case of multiple objects. The words “a,” “an,” and “the” as usedAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 herein are inclusive of “at least one” and “one or more” so as not to limit the object being referred to as being in its “singular” form.

[0041] Spatial terms such as “left,” “right,” “top,” “bottom,” “upper,” “lower,” “front,” “back,” “vertical,” and “horizontal” as may be used herein are by way of example and illustration only are not meant to limit the description and may be exchanged in position and orientation.

[0042] The terms “substantially” and “about” as may be used herein refer to a feature that may be varied within an acceptable manufacturing tolerance for a given application.

[0043] Fig. 1 illustrates an exemplary processing apparatus 100 employing electro-dynamically levitated transports in accordance with the present disclosure, however the present disclosure may be applied to linkage based substrate handling applications. Although the present disclosure will be described with reference to the drawings, it should be understood that the present disclosure can be embodied in many forms. In addition, any suitable size, shape or type of elements or materials could be used. Further, the word “each” as used herein refers to a single object (i.e., the object) in the case of a single object or each object in the case of multiple objects.

[0044] Based on the problems and limitations of conventional substrate processing apparatus noted above, it is desirable to have a wafer (or substrate) handler 1500 that operates within a sealed environment (e.g., a vacuum environment, inert gas environment, atmospheric environment, or any other suitable sealed environmental condition), such as the substrate processing apparatus 100, 200, 300, 400 (see also, at least, Figs. 2-4B and the portions of which illustrated in the other figures) described herein, where an absolute position of a levitating body or base 1510 (also referred to as a reaction platen) of the wafer (or substrate) handler 1500 (and a location of a substrate / wafer holding station SHS of the wafer handler 1500) is tracked with a feedback apparatus that does not employ computer models of the levitation drive system, that does not compete with actuator elements of the wafer handler 1500 for space within the substrate processing apparatus, and reduces the cost of the wafer handler / substrate processing apparatus compared toAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 substrate processing apparatus noted above that employ tracking the position of the wafer handler with dedicated position feedback sensors.

[0045] The present disclosure may provide for the substrate processing apparatus 100, 200, 300, 400 having a frame 118M, a substrate transport apparatus (also referred to as an electrical machine 1599, 1599R), a distributed reflective feature 1222, at least one (e.g., one or more) camera 1112, and a controller 199. The substrate transport apparatus may include a body 1510, the frame 118M and an end effector 1520 with a wafer holding station SHS. The end effector is configured to hold a wafer S at the wafer holding station SHS and transport the wafer S within the substrate processing apparatus 100, 200, 300, 400. The body 1510 is supported above the frame 118M and has a size and shape. The substrate transport apparatus has a predetermined reference plane, straight line, or point REF (see Figs. 5 and 12 – the reference plane, straight line, or point is a reference or base from which the features of the wafer handler 1500 are measured / located from / relative to, and at which a coordinate origin of the wafer handler 1500 is located) with a predetermined relationship to the body 1510 and the size and shape of the body 1510. The distributed reflective feature 1222 is connected to the substrate transport apparatus (as described herein) with a predetermined configuration deterministic of a pose of the predetermined reference plane, straight line, or point REF, the pose being characterized with one, two, three, four, five or six degrees of freedom, the size and shape, or a dimension of the size and shape, or a variance therein. The at least one camera 1112 may be connected to the frame 118M and is configured to image the distributed reflective feature 1222. The at least one camera 1112 may be separated from the distributed reflective feature 1222 by a transparent isolation wall SW. The controller 199 is communicably connected (e.g., in any suitable manner such as wired or wireless) to the at least one camera 1112. The controller 199 is configured to receive the image (from the at least one camera 1112) and resolve from the distributed reflective feature embodied in the image a pose of the predetermined reference plane, straight line, or point. As may be realized from the description herein, the pose informs feedback data to the controller 199 that defines a position, characterized with one, two, three, four, five, or six degrees of freedom, of one or more of the body 1510, the wafer holding station SHS, and theAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 wafer S relative to the frame 118M. The controller 199 is configured to generate from the feedback data control inputs to a drive section or system DS (see, e.g., at least, Figs. 7 and 9-10B), coupled to the body 1510, so as to control, with one, two, three, four, five, or six degrees of freedom, position trajectory and attitude of the body 1510, and hence, the wafer holding station SHS, and / or the wafer S (i.e., control of one or more of the body 1510, the wafer holding station SHS, and or the wafer S) of the substrate transport apparatus 1599, 1599R, relative to the frame 118M. The controller is configured to resolve from the distributed reflective feature 1222 in the image the variance in the size and shape, and / or the variance in the dimension of the size and shape of the body 1510.

[0046] The present disclosure may provide for the substrate processing apparatus 100, 200, 300, 400 having a frame 118M, the substrate transport apparatus, a reflective pattern 1222RP (see Fig. 12), at least one camera 1112, and a controller 199. The substrate transport apparatus (as described herein) includes a body 1510 supported above the frame 118M and an end effector 1520 with a wafer holding station SHS. The end effector is configured to hold a wafer S at the wafer holding station SHS and transport the wafer S within the substrate processing apparatus 100, 200, 300, 400. The body 1510 has a predetermined size and shape. The reflective pattern 1222RP is connected to the substrate transport apparatus. The reflective pattern 1222RP may have a unique configuration so as to uniquely identify the substrate transport apparatus (e.g., a wafer handler 1500 thereof), from each other different substrate transport apparatus (e.g., different wafer handlers 1500 of the same or different substrate transport apparatus) with a different unique identity, and the configuration characterizes a pose of the body 1510 and / or a dimension of the size and shape of the body 1510. The at least one camera 1112 may be connected to the frame 118M and is configured to image the reflective pattern 1222RP, where the at least one camera 1112 may be separated from the reflective pattern 1222RP by a transparent isolation wall SW. The controller 199 is communicably connected to the at least one camera 1112 to register (such as in a memory accessible by the controller) the image and may be configured to resolve, from the reflective pattern 1222RP embodied in the image, the pose of the body 1510 (and hence a pose ofAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 the end effector 1520 wafer holding stations SHS and any wafer S held thereon), the dimension(s) of the body 1510, or a variance in the dimension, the size or shape of the body 1510, and / or the unique identity of the substrate transport apparatus 1599, 1599R (or the body or each body thereof). That can be done based on a common image of the reflective pattern 1222RP registered by the controller 199.

[0047] The substrate processing apparatus 100, 200, 300, 400 of the present disclosure has a levitated wafer handler 1500, a controller 199, and a magnetic circuit to generate a suitable magnetic field pattern that levitates and propels, in a controlled way, the wafer handler 1500. A position feedback system locates the wafer handler where a feedback apparatus at the processing station locates the wafer / substrate and end effector in space relative to the processing station. Such substrate processing apparatus of the present disclosure may be capable of locating and positioning the wafer / substrate at a desired location within the processing station with a precision better than ± 25 microns within a vacuum chamber environment with dimensions and travel ranges typically in excess of 2 meters in length subjected to dimensional changes in the order of several hundreds of microns across all directions due to thermal and pressure environmental effects. The apparatus 100, 200, 300, 400 present disclosure may be capable of positioning wafers / substrates across long distances with precision better than 0.002% compared to its typical form factor sizes.

[0048] The present disclosure will be described herein with respect to induction based electro- dynamic levitation substrate transport apparatus such as described in United States patent number 11,476,139 issued on October 18, 2022, United States patent application number 18 / 050,300 filed on October 27, 2022 and published as United States pre-grant publication number 2023 / 0143307, and United States Provisional Patent Application number 63 / 597,250 filed on November 8, 2023, the disclosures of which are incorporated herein by reference in their entireties. However, the present disclosure may be employed for any other type of levitation applications and / or distributed controls applications where high network traffic may arise from employment and control of many actuators.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0049] Fig.1 shows a schematic plan view of a substrate processing apparatus 100. The substrate processing apparatus 100 (and the other substrate processing apparatus described herein) may be vacuum substrate transport apparatus or atmospheric (non-vacuum) substrate transport apparatus. The substrate processing apparatus 100 may be connected to an environmental front end module (EFEM) 114 which has a number of load ports 112. The load ports 112 may be capable of supporting a number of substrate storage canisters 171 such as conventional FOUP canisters; though any other suitable type may be provided. The EFEM 114 communicates with the processing apparatus through load locks 116, which are connected to the processing apparatus as will be described herein. The EFEM 114 (which may be open to atmosphere) has a substrate transport apparatus (not shown – but may be similar to a substrate transport apparatus of a transport / transfer chamber 118 in the form of an electrical machine 1599 (referred to herein as substrate transport apparatus 1599) as described herein, e.g., the substrate transport apparatus 1599 described herein may be employed in vacuum environments and atmospheric environments) capable of transporting substrates from load ports 112 to load locks 116. The EFEM 114 may include substrate alignment capability, batch handling capability, substrate and carrier identification capability or otherwise. The load locks 116 may interface directly with the load ports 112 as in the case where the load locks have batch handling capability or in the case where the load locks have the ability to transfer wafers directly from the FOUP to the lock. Some examples of such apparatus are disclosed in US patent numbers 6,071,059, 6,375,403, 6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,954,472, 6,120,229, and 6,869,263 all of which are incorporated by reference herein in their entirety. Other load lock options may be provided.

[0050] The processing apparatus 100 may be used for processing semiconductor substrates (e.g. 200 mm, 300 mm, 450 mm, or other suitably sized wafers), panels for flat panel displays, or any other desired kind of substrate under vacuum and / or atmospheric conditions. The processing apparatus 100 generally comprises transfer or transport chamber 118 (which may also be referred to as processing chamber, and which may hold a sealed atmosphere or processing environment therein), processing modules 120, and at least one substrate transport apparatus 1599. TheAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 substrate transport apparatus 1599 may be integrated with and supported in the chamber 118 by way of electromagnetic levitation as described herein. Processing modules 120 may be mounted on both sides of the chamber 118 as illustrated in Fig. 1 or processing modules 120 may be mounted on one side of the chamber 118 as shown for example in Fig. 2. In Fig. 1, processing modules 120 are mounted opposite each other in rows Y0, Y1, Y2 or vertical planes. The processing modules 120 may be staggered from each other on the opposite sides of the transfer chamber 118 or stacked in a vertical direction relative to each other. Referring also to Figs. 5, 6, and 9-10B, the substrate transport apparatus 1599 has at least one wafer handler 1500 that is moved in the chamber 118 to transport substrates between load locks 116 and the processing modules 120. As shown, only one wafer handler 1500 is provided; however, more than one wafer handler 1500 may be provided. The transfer chamber 118 (which is subjected to vacuum or an inert atmosphere or simply a clean environment or a combination thereof in its interior) employs the substrate transport apparatus 1599, that allows the processing modules 120 to be mounted to the chamber 118 in a Cartesian arrangement with processing modules 120 arrayed in substantially parallel vertical planes or rows. This may result in the processing apparatus 100 having a more compact footprint than a comparable conventional processing apparatus, such as those having a clustered arrangement. The transfer chamber 118 may be capable of being provided with any desired length (i.e., the length is scalable where transfer chambers 118 may be coupled to each other end-to-end to the desired length) to add any desired number of processing modules 120 in order to increase throughput. The transfer chamber 118 may also be capable of supporting any desired number of substrate transport apparatus 1599 therein and allowing the substrate transport apparatus 1599 to reach any desired processing module 120 coupled to the transfer chamber 118 without interfering with each other. This in effect may decouple the throughput of the processing apparatus 100 from the handling capacity of the substrate transport apparatus 1599, and hence the processing apparatus 100 throughput may become processing limited rather than handling limited. Accordingly, throughput can be increased as desired by adding processing modules 120 and corresponding handling capacity on the same platform.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0051] Still referring to Fig. 1, the transfer chamber 118 has a general rectangular shape though the chamber may have any other suitable shape. The transfer chamber 118 has a slender shape (i.e. length much longer than width) and defines a generally linear transport path for the substrate transport apparatus 1599 therein. The chamber 118 has longitudinal side walls 118S. The side walls 118S have transport openings or ports 118O (also referred to as substrate pass through openings) formed therethrough. The transport ports 118O are sized large enough to allow substrates to pass through the ports (which ports can be sealable by valves) into and out of the transfer chamber 118. The processing modules 120 may be mounted outside the side walls 118S with each processing module 120 being aligned with a corresponding transport port 118O in the transfer chamber 118. Each processing module 120 may be sealed against the sides 118S of the chamber 118 around the periphery of the corresponding transport aperture to maintain the vacuum in the transfer chamber. Each processing module 120 may have a valve (e.g., a slot valve), controlled by any suitable means, such as controller 199, to close the transport port 118O when desired. The transport ports 118O may be located in the same horizontal plane. Accordingly, the processing modules on the chamber are also aligned in the same horizontal plane. The transport ports 118O may be disposed in different horizontal planes. As seen in Fig. 1, the load locks 116 are mounted to the chamber sides 118S at the two front-most transport ports 118O. This allows the load locks 116 to be adjacent the EFEM 14 at the front of the processing apparatus. The load locks 116 may be located at any other transport ports 118O on the transfer chamber 118 such as shown for example in Fig.2. The hexahedron shape of the transfer chamber 118 allows the length of the chamber to be selected as desired (as noted above) in order to mount as many rows of processing modules 120 as desired.

[0052] The transfer chamber 118 shown in Fig. 1 has a substrate transport apparatus 1599 having a single wafer handler 1500, although there may be more than the single substrate handler as illustrated in Fig. 6. The substrate transport apparatus 1599 is integrated with the chamber 118 to translate wafer handler 1500 back and forth in the chamber 118 at least between a front 118F and a back 118R of the chamber 118 (and, such as illustrated in Fig. 6, between the sides 118S of theAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 transfer chamber 118). As also illustrated in Fig. 1 the processing apparatus 100 (and the other processing apparatus described herein) may include a wafer handler service lock SL configured to introduce (e.g., insert) and remove wafer handlers 1500 to and from the processing apparatus in a manner substantially similar to that described in United States provisional patent application number 63 / 594,743 filed on October 31, 2023, the disclosure of which is incorporated herein by reference in its entirety. The substrate transport apparatus 1599 (and substrate transport apparatus 1599R described herein) is configured to translate wafer handlers 1500 between the wafer handler service lock SL and the transfer chamber 118. The wafer handler service lock SL may provide for a “cold start” of a wafer handler 1500 entered into the processing apparatus 100 where at least one camera(s) 1112 of the vision system 1111 are positioned to view the wafer handler 1500 within the wafer handler service lock SL to effect, with the controller 199, identification determination (as described herein) of the wafer handler 1500 and / or determination of a pose (as described herein) of the wafer handler 1500 (and hence the end effector 1520 wafer holding station SHS and any wafer S held thereon) with the wafer handler 1500 in the wafer handler service lock SL. The pose of the wafer handler 1500 in the service lock (e.g., on placement of the wafer handler into the processing apparatus 100 via the wafer handler service lock SL) may be employed by the controller 199 to refine the pose of the wafer handler 1500 for entry of the wafer handler into the transfer chamber 118 (e.g., the wafer holder may be placed in the wafer handler service lock in an unknown pose that is corrected / refined to a predetermined pose by the pose determination effected by the vision system 1111 and controller 199. The identification of the wafer handler 1500 on entry of the wafer handler 1500 into the processing apparatus 100 via the wafer handler service lock SL is registered (i.e., in any suitable memory accessible by the controller 199) so that the wafer handler is known to the controller 199 as being within the processing apparatus 100, where such identity is employed for motion control and tracking which wafer W is handled by which wafer handler 1500. Similarly, on removal of a substrate handler 1500 from the processing apparatus 100, the controller 199 determines the identity of the wafer handler 1500 leaving the processing apparatus 100 and de-registers the wafer handler from the processing apparatus 100.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0053] The wafer handler 1500 of the substrate transport apparatus 1599 has at least one end effector 1520 for holding one or more (e.g., at least one) substrates. The end effector 1520 has the wafer holding station SHS, where a predetermined center SHSC (indicated by the cross illustrated at the wafer holding station SHS in the figures, see in particular Fig.5) of the wafer holding station SHS is in a predetermined spatial relationship with the predetermined reference plane, straight line, or point REF.

[0054] The substrate transport apparatus 1599, shown in Fig. 1 (also referring to Figs. 8A-8C), is a representative substrate transport apparatus and includes the wafer handler 1500 (a portion of which is illustrated in Figs. 8B, 8C for clarity) which is electro-dynamically supported / levitated by a drive section or system DS (see, e.g., at least, Figs. 7 and 9-10B) of the substrate transport apparatus 1599, 1599R, which drive section DS includes linear tracks 1550 formed by an array of coil actuators 1700. The drive section DS is drivingly coupled to the base 1510 of the wafer handler 1500 to drive the base 1510 (and the entirety of the wafer handler 1500) so the wafer holding station SHS is transported throughout a wafer transport plane 1290 (see Fig. 5) of the frame 118M. For example, the wafer handler 1500 is electro-dynamically supported / levitated from and driven along the linear tracks 1550. As described herein, the controller 199 is connected to the drive section DS (see Figs. 9-10B) and configured to provide a signal to the drive section DS identifying at least one of a resolved pose (as described herein) of the predetermined reference plane, straight line, or point REF and the variance of the size and shape (or variance of the dimension of the size and shape) of the base 1510 so as to position the wafer holding station SHS with the drive section DS based on the resolved pose and / or variance of the size and shape (and / or variance of the dimension of the size and shape) of the base 1510. It should be understood that the pose of the base 1510 (and hence the end effector 1520 wafer holding station SHS and any wafer S held thereon) may be substantially continuously imaged / tracked by at least one camera(s) 1112 of the vision system 1111 so that the controller 199 continuously updates the position of each wafer handler 1500, 1500A, 1500B (and the respective body 1510 and / or the end effector 1520 wafer holding station SHS thereof or any wafer S held thereon - i.e., the position being unique toAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 each unique wafer handler by virtue of substantially continuously resolving the identity of each unique wafer handler) for effecting motion control of each wafer handler 1500, 1500A, 1500B. Tracking each unique position unique to each wafer handler may effect tracking which wafer W is handled by which wafer handler 1500, 1500A, 1500B within the processing apparatus 100. As may be realized from the above (and further description herein), with imaging of the base 1510, the end effector 1520 substrate holding station SHS and any wafer thereon may also be imaged / tracked and the trajectory thereof determined by the controller 199 with the feedback from the vision system 1111.

[0055] The transfer chamber 118 is defined by a frame 118M (see Fig. 1) with a level reference plane 1299, e.g., that defines or otherwise corresponds (e.g., is substantially parallel) with a wafer transport plane 1290 (see Figs. 5, 8A, and 8C). The frame 118M defines the transfer (e.g., processing) chamber 118 holding a sealed processing environment (as described herein), where the base 1510 (and the wafer handler 1500 of which the base 1510 is a part) is located in the transfer chamber 118. The linear tracks 1550 formed by array of coil actuators 1700 may be mounted to the side walls 118S or floor 118L of the transfer chamber 118 (where the floor 118L forms a non-magnetic isolation wall between the array of coil actuators 170 and the wafer handler 1500) and may extend the length of the chamber 118. This allows the wafer handler 1500 to traverse the length of the chamber 118. The array of coil actuators 1700 (also referred to herein as actuators 1700) form the linear tracks 1550 of Fig. 1, where each of linear tracks 1550 includes a respective array of coil actuators 1700A-1700n (see Fig. 5). The array of coil actuators 1700A- 1700n are referred to herein as a network of actuators as in Figs. 5, and 6 (e.g., that form at least one linear induction motor stator 1560 - noting that each drive line 177-184 may be provided with two, or more than two, rows of coil actuators as illustrated in Figs. 5 and 6 (see also Figs.8A-8C), where one or more (e.g., at least one) coil actuators are common to more than one drive line), connected to the transfer chamber 118 to form a drive plane 1598 at a predetermined height H relative to the reference plane 1299 (see Fig.8C), the array of coil actuators 1700 (see also Fig.5) being arranged so that a series of the coil actuators 1700A-1700n define at least one drive lineAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 within the drive plane 1598, and each of the coil actuators 1700A-1700n (see Fig. 5) in the array of coil actuators 1700 being coupled to an alternating current (AC) power source 1585 energizing each coil actuator 1700A-1700n, where the alternating power source is a three phase (or more) alternating current power source.

[0056] The base or reaction platen 1510 has a predetermined size and shape (see, e.g., Figs. 1-6E and 8B-10B, 12, and 12A) and is formed of a paramagnetic, diamagnetic, or non-magnetic conductive material disposed to cooperate with the coil actuators 1700A-1700n of the array of coil actuators 1700 so that excitation of the coil actuators 1700A-1700n with alternating current from the alternating current source 1585 generates levitation forces FZ and propulsion forces FP (see Fig. 5, where the propulsion forces are in any suitable direction X and / or Y direction, e.g., in the drive plane 1598) against the base 1510 that controllably levitate and propel the base 1510 along the at least one drive line 177-184, in a controlled attitude (e.g., in six degrees of freedom motion, X, Y, Z, Rx, Ry, Rz) relative to the drive plane 1598.

[0057] The chamber floor 118L forms a non-magnetic isolation wall 4400 (see Figs. 8A-8C) between the array of coil actuators 1700 and the wafer handler 1500. Here the array of coil actuators 1700 is disposed in an atmospheric environment while the wafer handler 1500 is disposed in a vacuum environment of the transfer chamber 118. The non-magnetic isolation wall 4400 (and the chamber floor 118L) is selected so as to have a low electrical conductivity and a high resistivity to minimize the occurrence of Eddy Currents (and minimize magnetic field losses due to the Eddy Currents) while allowing a magnetic field to pass through the non-magnetic isolation wall 4400 to establish a magnetic circuit between the (e.g., coils / poles) of the coil actuators in the array of coil actuators 1700 and the base 1510 of the wafer handler 1500. Suitable examples of materials from which the non-magnetic isolation wall 4400 (and the floor 118L) include materials that are vacuum compatible and have a high resistivity, high stiffness, high yield strength, and high thermal conductivity such as, for example, 300-Series Stainless Steel that conforms with the electrical and magnetic (e.g., non-magnetic) properties noted above. A suitable example of the 300-series Stainless Steel includes, but is not limited to, 304 Stainless Steel. The chamber floor 118L aAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 separate (i.e., different) material than that of the frame 118M such as to reduce costs of the transfer chamber 118 structure. The frame 118M may be constructed of aluminum (or other suitable material) while the floor 118L is constructed of stainless steel (or other suitable material). Other suitable examples of material from which the non-magnetic isolation wall 4400 (and the floor 118L) may be constructed includes, but is not limited to, low conductivity aluminum such as a 6061 series aluminum (e.g., 6061-F, 6061-0, 6061-O, 6061-T4, 6061-T6, and 6061-T9).

[0058] With respect to the magnetic circuit formed between the (e.g., coils / poles of the) coil actuators in the array of coil actuators 1700 and the base 1510 of the wafer handler 1500, the base 1510 is constructed of any suitable paramagnetic material. The paramagnetic material of the base 1510 may have a low resistivity so as to maximize induction of Eddy Currents, a low mass density to minimize weight of the base 1510, and be inert so as to be vacuum compatible and resistant at high temperatures (e.g., such as about 100°C or more). Suitable examples of materials from which the base 1510 may be constructed include, but are not limited to, 1100 series Aluminum Alloy (such as the 1100, 1100-O, and 1100-H18 Aluminum Alloys), and 6101 series Aluminum Alloy (such as the 6101-T6, 6101-T61, 6101-T63, 6101-T64, and 6101-T65 Aluminum Alloys). It is noted that for atmospheric applications of the transport described herein, the base 1510 may be constructed of copper or any of the other materials described herein for the base 1510.

[0059] The poles (see, e.g., Fig. 8C) of the coil actuators 1700 and the coil base plate may be ferromagnetic and have a high magnetic permeability, high magnetic saturation, and high electrical resistivity (e.g., so as to minimize Eddy Currents) so as to maximize levitation efficiency for levitating the base 1510. The poles and the coil base plate may be constructed of any suitable soft magnetic composite (SMC) material with a magnetic saturation reaching about two Tesla. A suitable example of a soft magnetic composite material being, but not limited to, Hoganas’ 700HR 5P.

[0060] Referring to Figs. 3A, 3B, 4A, 4B, while the transfer chamber 118 has been described above as a longitudinally extended chamber that forms part of a linear processing tool however,Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 the transfer chamber may have a cluster tool configuration. Referring to Figs.3A and 3B, a transfer chamber 118T1, of a processing apparatus 300 is illustrated and is similar to (or the same as) processing apparatus 100, 200 but for the transfer chamber shape. The transfer chamber 118T1 has a substantially square configuration (although the transfer chamber may have any suitable shape such as hexagonal, octagonal, etc. – see for example transfer chamber 118T2 of processing apparatus 400 in Figs. 4A and 4B, where processing apparatus 400 is similar to or the same as processing apparatus 100, 200 but for the transfer chamber shape). An electrical machine 1599R (referred to herein as substrate transport apparatus 1599R, and being substantially similar to the substrate transport apparatus 1599) of transfer chamber 118T1 is configured as a side-by-side substrate transport apparatus that includes at least two side-by-side wafer handlers 1500A, 1500B that are substantially similar to wafer handler 1500 described herein. The array of coil actuators 1700 is configured to move the wafer handlers 1500A, 1500B so that the wafer handlers 1500A, 1500B rotate about common axis of rotation 1277 (such axis being akin to a θ axis of, for example, a conventional SCARA type robot) for changing a direction of “extension and retraction” (the terms extension and retraction are being used herein for convenience noting that the extension and retraction is effected by linear propulsion movement of the wafer handler 1500, 1500A, 1500B along a respective drive line) of the side-by-side substrate transport apparatus. For example, the array of coil actuators 1700 has an arrangement that forms drive lines 177, 178, 179, 180. Drive lines 177, 178 are spaced from one another and substantially parallel to one other so as to be substantially aligned with a respective transport openings 1180A, 1180F and 1180B, 1180E. The drive lines 179, 180 are substantially orthogonal to drive lines 177, 178 and are spaced from one another and substantially parallel to one other so as to be substantially aligned with a respective transport openings 1180C, 1180H and 1180D, 1180G. The drive lines can be in any suitable pattern (such as arced or curved segments with constant or varying radii) and orientation and the description that follows is for exemplary purposes. The coil actuators 1700A-1700N (illustrated in Fig. 3A but not numbered for clarity of the figure) provide for at least linear propulsion of the wafer handlers 1500A, 1500B through the transport openings 1180A-1180H. The array of coil actuators 1700 also includes rotational coil actuator sub-arrays 1231-1234 that effect, under controlAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 of controller 199, with the coil actuators that form the drive lines 177-180 the rotation of the wafer handlers 1500A, 1500B about the common axis of rotation 1277. Alternatively, the coil actuators may form a dense enough and large enough grid without being specifically designated for propulsion or rotation and can perform that function based on the base’s 1510 position and the control law of the controller 199. While the wafer handlers 1500A, 1500B may rotate about the common axis of rotation 1277 at the same time, extension and retraction of the wafer handler 1500A, 1500B may be independent of extension and retraction of the other one of the wafer handler 1500A, 1500B. In general, the motion of the wafer handler 1500A, 1500B is independent of each other and the complexity of that motion can range from one degree of freedom to six degrees of freedom.

[0061] Referring now to Figs. 1-6, 11 and 12, the substrate transport apparatus 1599 will be described in greater detail (again noting that the substrate transport apparatus 1599R is substantially similar to the substrate transport apparatus 1599). Generally, the substrate transport apparatus 1599 includes a structure (e.g., wafer handler) 1500 without magnets and without any moving parts such as bearings, revolute or prismatic joints, metal bands, pulleys, steel cables or belts. The wafer handler 1500 includes the base 1510 and at least one end effector 1520, 1520D.

[0062] Each wafer handler 1500 of the substrate transport apparatus 1599 is configured for at least optical detection that effects spatial position determination by the controller 199. Based on the spatial position determination the controller 199 actuates only the coils of the substrate transport apparatus 1599 that generate levitation and propulsion forces (inclusive of stabilization forces) on a respective wafer handler 1500 for effecting at least substrate transport. For example, each substrate transport apparatus 1599, 1599R includes a distributed reflective feature 1222 (also referred to as a fiducial or marker 1222). The distributed reflective feature 1222 (and other distributed reflective features described herein) is located in the transfer chamber 118, 118T1, 118T2.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0063] The distributed reflective feature 1222 is connected to the substrate transport apparatus 1599, 1599R, such as disposed on the wafer handler 1500. The distributed reflective feature 1222 may be unique to the wafer handler 1500. The distributed reflective feature 1222 of the wafer handler 1500 and the vision system 1111 effect position tracking of the wafer handler 1500 (e.g., in one or more degrees of freedom of six degrees of freedom of the wafer handler) and effect a position feedback loop to the controller 199 for positional control of the wafer handler 1500, such as by controller 199. The position feedback loop may be similar to that of an encoder such that the vision system 1111 and distributed reflective feature 1222 may be referred to as an optical encoder. As may be realized from the description herein, the controller 199 may be configured so as to control, via feedback data from images registered by the vision system 1111, the substrate transport apparatus 1599, 1599R guiding the end effector 1520 so as to move a wafer S carried by the end effector 1520 relative to the transfer chamber 118, and place the wafer W through a substrate transport opening 118O, of the transfer chamber 118, in a processing module 120 communicating with the transfer chamber 118 via the substrate transport opening 118O.

[0064] The distributed reflective feature 1222 includes characteristics that are detected by the vision system 1111 where the vision system 1111 is configured (e.g., via any suitable known non- transitory computer vision / optical recognition and tracking program) to identify, from the distributed reflective feature 1222 one or more of: a position of the wafer handler 1500 (i.e., inclusive of the base 1510, the end effector 1520 wafer holding station SHS, and any wafer S held thereon) within the processing apparatus 100, 200, 300, 400 in one or more of six degrees of freedom X, Y, Z, Rx, Ry, Rz (see Fig. 5) relative to a reference frame EREF of the substrate transport apparatus 1599 (see Fig. 5) and / or the level reference plane 1299 (see Figs. 3B, 4B, 5, and 8); thermal expansion of at least the end effector 1520, 1520D; and vibration of at least the end effector 1520, 1520D.

[0065] The vision system 1111 is coupled to the controller 199 (or forms a part of controller 199) to provide the controller 199 with a position feedback loop PFBL (see also Figs. 9-10B), e.g., effected by the detection of the distributed reflective feature(s) 1222 of each wafer handler 1500Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 within the processing apparatus 100, 200, 300, 400. The position feedback loop PFBL is configured in any suitable manner to operate at about a 1 KHz or faster sampling rate that is fast enough to be able to control motion of the levitating wafer handlers 1500 described herein. The sampling rate of the vision system 1111 (and, e.g., the position feedback loop formed thereby) is synchronized to the operational rate of the substrate transport apparatus 1599. The controller 199 may control (e.g., trajectory generation and positioning loops) the coils of the substrate transport apparatus 1599 at an operational control loop speed of about 1 KHz where the position feedback loop PFBL formed by the vision system is configured to operate at a speed (e.g., about 1 KHz) that is synchronized with the operation control loop speed of the substrate transport apparatus trajectory generation and positioning loops.

[0066] The base 1510 is formed of a paramagnetic material, diamagnetic material, or a non- magnetic conductive material. The base 1510 may have any suitable size and shape (such as, for example, described in United States patent number 11,476,139 issued on October 18, 2022, United States patent application number 18 / 050,300 filed on October 27, 2022 and published as United States pre-grant publication number 2023 / 0143307, and United States Provisional Patent Application number 63 / 597,250 filed on November 8, 2023, the disclosures of which were previously incorporated herein by reference in their entireties) for cooperating with the coil actuators 1700A-1700n of the array of coil actuators 1700 so as to stably transport wafers or substrates S in the manner described herein.

[0067] The end-effector 1520, 1520D may be substantially similar to conventional end effectors and, as described herein, the end effector is rigidly coupled to the base 1510. The end effector may have any suitable configuration, including but not limited to a single sided / ended (see end effector 1520) with a single substrate holding location 1520A, a double sided / ended (see end effector 1520D) with two longitudinally spaced apart substrate holding locations 1520A, 1520B, a side-by-side configuration where multiple substrate holding locations are arranged side-by-side (e.g., laterally spaced apart) and supported from a common base so as to extend through side-by- side substrate transport openings, a stacked configuration were multiple substrate holding locationsAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 are arranged in a stack one above the other and supported from a common base so as to extend through vertically arrayed substrate transport openings. The end effector 1520, 1520D may be made of materials that can one or more of withstand high temperatures, have low mass density, have low thermal expansion, have low thermal conductivity, and have low outgassing. A suitable material from which the end effector 1520, 1520D may be constructed is Alumina Oxide (A12O3), although any suitable material may be used.

[0068] As illustrated in Figs.11 and 12, the end effector 1520, 1520D may include the distributed reflective feature 1222 for effecting at least position determination of the wafer holding station(s) SHS of the end effector 1520, 1520D (and hence any wafer S held thereon). Positioning or otherwise disposing the distributed reflective features 1222 on the end effector provides for determination of expansion and contraction of the end effector 1520, 1520D. Positioning the distributed reflective feature 1222 on the end effector provides for vibration of the distributed reflective feature 1222 with the end effector 1520, 1520D effecting the vibration determination of the end effector 1520, 1520D. The distributed reflective feature 1222 may be disposed on the base 1510 effecting at least determination of the wafer holding station(s) SHS of the end effector 1520, 1520D (and hence a trajectory thereof).

[0069] The distributed reflective feature 1222 (see, e.g., distributed reflective features 1222A- 1222E of Figs. 12 and 12A) includes one or more features 1225, 1225S configured for detection and identification by the vision system 1111. The one or more features 1225, 1225S described herein are comprised of any suitable material that is compatible with the environment in which the one or more features 1225, 1225S are located. For example, where the one or more features 1225, 1225S are disposed in a vacuum environment, the one or more features 1225, 1255S are constructed of a vacuum compatible material so as to substantially eliminate outgassing. Suitable examples of vacuum compatible materials of the one or more features 1225, 1225S of the distributed reflective feature 1222 (and reflective pattern 1222RP) include but are not limited to stainless steel, stainless steel alloys, copper, copper alloys, aluminum, aluminum alloys, and glass, where the surfaces of these material are finished so as to be reflective, retro-reflective, orAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 directionally reflective. A suitable non-limiting example of the one or more features 1225, 1225S is / are high index ball lenses and high index half-ball lenses. The distributed reflective feature 1222 may be unique to a respective wafer handler 1500, 1500A, 1500B so that the controller 199, based on detection of the distributed reflective feature 1222 by the vision system, uniquely identifies each wafer handler 1500, 1500A, 1500B for independent control each wafer handler 1500, 1500A, 1500B. The one or more features may be one or more of: a single feature 1225S having any suitable uniquely identifiable shape (e.g., with a sufficient number of facets (e.g., three or more) for uniquely identifying the respective wafer handler and determining a position and orientation of the respective wafer handler 1500 in the six degrees of freedom X, Y, Z, Rx, Ry, Rz), non- limiting examples of which are illustrated in Fig. 12A; a group of at least three features 1222AF, 1222BF, 1222CF arranged in a uniquely identifiable and predetermined reflective pattern 1222RP (see Fig. 12 - the number of features 1225 in the group being sufficient for uniquely identifying (e.g., enable rigid body model definition) the respective wafer handler and determining a position and orientation of the respective wafer handler 1500 in the six degrees of freedom X, Y, Z, Rx, Ry, Rz); and a combinations thereof. The features 1225 in the group of features 1222AF, 1222BF, 1222CF are arranged in the uniquely identifiable and predetermined reflective pattern 1222RP to form a respective distributed reflective feature 1222A, 1222B, 1222C (generally referred to as distributed reflective feature 1222), where each feature 1225 may be any suitable geometric shape, such as a sphere (such features 1225 may be referred to as passive marking spheres / balls or marker spheres / balls).

[0070] The distributed reflective feature 1222 may be disposed on the wafer handler 1500 (such as on the base 1510 and / or end effector 1520) in a predetermined spatial relationship with one or more of the base 1510 and wafer holding station(s) SHS (e.g., in the reference frame REF (X, Y, Z, Rx, Ry, Rz) of the respective wafer handler 1500). For example, feature(s) of the distributed reflective feature 1222 may have a known spatial relationship (e.g., in the six degrees of freedom X, Y, R, Rx, Ry, Rz) to one or more of the base 1510 and wafer holding station SHS so that with detection of the distributed reflective feature 1222 by the vision system 1111 the controller 199Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 effects the position determination (and hence trajectory determination) of one or more of the base 1510 and wafer holding station(s) SHS, in the reference frame EREF of the processing apparatus 100, 200, 300, 400, that can enable pick, place, and transport of wafers S to and from different holding stations (e.g., load locks 116, processing modules, etc.) of the processing apparatus 100, 200, 300, 400. Each of the distributed reflective feature(s) 1222 may uniquely identify the respective wafer handler 1500 (see, e.g., Figs. 3A and 6) so that where the processing apparatus 100, 200, 300, 400 includes more than one wafer handler 1500A, 1500B the controller 199 effects control of each wafer handler 1500A, 1500B independent of control of each other wafer handler 1500A, 1500B, based on the position determination of the respective wafer handler effected with the vision system 1111 and the respective distributed reflective feature 1222.

[0071] The features 1225, 1225S may be disposed on, or otherwise coupled directly to, the end effector 1520, 1520D (see, for example features 1222CF of distributed reflective feature 1222C) in a known spatial relationship to each other (e.g., known spatial relationship being predetermined at a reference / baseline temperature) so that as the end effector 1520, 1520D thermally expands and contracts, a spacing between features 1225, 1225S of a group of features 1222AF, 1222BF, 1222CF increases and decreases . The change in spacing between features 1225, 1225S may then be compared to the known predetermined (e.g., baseline at a known temperature) spacing of the features 1225, 1225S to determine changes in dimension (and / or a temperature) of the end effector 1520, 1520D from a thermal expansion or contraction of the end effector 1520, 1520D. A baseline dimension between features 1225, 1225S in the Y direction of the wafer handler 1500 reference frame REF may be dimension D1 and a baseline dimension between the reference frame REF and the wafer holding station SHS in the Y direction may be D2. With operation of the wafer handler 1500 the dimension D1 thermally expands to dimension D1’ and upon detection of the features 1225, 1225S by the vision system 1111, the controller 199 determines the difference between dimensions D1 and D1’ such that the thermal expansion (i.e., the change of dimension D2 to dimension D2’) of the end effector can be determined by the controller 199 based on the change between dimensions D1 and D1’. The features 1225, 1225S in a group of features may beAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 constructed of any suitable thermally stable material so that the dimensions of the individual features 1225 remains substantially constant with operation of the wafer handler 1500. Where the single feature 1225S is not part of a group of features, the single feature 1225S may be formed of the same material as the end effector so that a change in dimension of the feature 1225S is correlated (e.g., in any suitable manner, such as a lookup table, etc. stored in a memory of or accessible by the controller 199) with a corresponding change in dimension of the end effector 1510, 1520.

[0072] The features 1225, 1225S may be disposed on a plate or mount 1222M that is constructed of the same material as the end effector 1520, 1520D so that the plate 1222M and end effector 1520, 1520D thermally expand and contract at the same rate. The features 1225, 1225S in the group of features may be constructed of the thermally stable material and disposed on the plate 1222M in a known spatial relationship to each other (e.g., known spatial relationship being predetermined at a reference / baseline temperature) so that as the plate 1222M and end effector 1520, 1520D thermally expand and contract (e.g., expansion / contraction of the plate 1222M and end effector 1520, 1520D occurs at substantially the same rate as they are constructed of the same material), a spacing between features 1225, 1225S of the group of features 1222AF, 1222BF, 1222CF increases (with thermal expansion) and decreases (with thermal contraction) so that the change in spacing between features 1225, 1225S is compared to the known predetermined (e.g., baseline at a known temperature) spacing of the features 1225, 1225S to determine changes in dimension (and / or a temperature) of the end effector 1520, 1520D from a thermal expansion or contraction of the end effector 1520, 1520D (in the manner noted above).

[0073] The wafer holding station SHS of the end effector 1520 may have a reference location (e.g., the wafer holding station center SHSC) with respect to which reference location a wafer W is held at the wafer holding station. The wafer holding station center SHSC has a predetermined location with respect to the predetermined reference plane, straight line, or point REF of the body 1510. The thermal expansion identified from the features 1225, 1225S of the distributed reflective feature 1222, 1222A-1222E, and with respect to the predetermined reference plane, straight line, or pointAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 REF, may be employed by the controller 199 to determine changes to the wafer holder 1500, 1500A, 1500B pose and determine pose correction factors accounting for the thermal expansion, such as for / when positioning the wafer handler 1500, 1500A, 1500B to pick and place wafers W.

[0074] The thermal expansion identified from the features 1225, 1225S of the distributed reflective feature 1222, 1222A-1222E may be employed by the controller 199 to determine a temperature of the wafer handler 1500, 1500A, 1500B so as to determine whether the wafer handler 1500, 1500A, 1500B is operating within a predetermined temperature range. Where it is determined, based on the thermal expansion, that the wafer handler 1500, 1500A, 1500B is too hot, the controller 199 may direct the wafer handler 1500, 1500A, 1500B to the wafer handler service lock SL (or other suitable location) for cooling of the wafer handler 1500, 1500A, 1500B.

[0075] A change of dimension within the shape / pattern (see reflective pattern 1222RP) of the distributed reflective feature 1222, 1222A-1222E (i.e., an intra-distributed reflective feature change) indicates a variance of the predetermined size and shape (or variance of the dimension of the size and shape) of the wafer handler 1500, (e.g., such as thermal growth / contraction change of at least a portion of the wafer handler 1500, such as the base 1510 and / or end effector 1520). The variance in the predetermined size and shape (or variance of the dimension of the size and shape) may be characterized in at least one degree of freedom of the wafer handler (see Fig. 12, such as along the X, Y, and / or Z axis / axes). A change in position of the shape / pattern (see reflective pattern 1222RP) of the distributed reflective feature 1222, 1222A-1222E relative to the reference frame EREF (i.e., an inter-distributed reflective feature change) of the substrate transport apparatus 1599 indicates one or more of a positional change of the base 1510 and wafer holding station SHS of the wafer handler 1500 and vibration of the end effector 1520, 1520D / wafer handler 1500.

[0076] A stationary distributed reflective feature 1222PM (see Figs. 6, 6E, 13, 14, and 19) may also be disposed within the transfer chamber 118, 118T1, 118T2 or process module 120 so as to uniquely identify a location (e.g., a substrate holding station location of the process module, a substrate holding station of the transfer chamber (such as an aligner or buffer), a slit valve such asAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 for accessing a load lock or process module, etc.) within the transfer chamber 118, 118T1, 118T2 or process module 120. The stationary distributed reflective feature(s) 1222PM disposed within the transfer chamber 118, 118T1, 118T2 may prevent wafer handler 1500, 1500A, 1500B tracking errors due to, for example drift in camera 1112 or base 1510 location over time and / or changes in substrate holding and transfer chamber locations due to, for example thermal effects. The stationary reflective feature(s) 1222PM may be employed by the controller 199 to re-calibrate (so as to eliminate drift in) the position of the cameras 1112 and / or base 1510 of the wafer hander 1500, 1500A, 1500B. The stationary distributed reflective feature(s) 1222PM is / are disposed at a predetermined stationary location(s) within the process module 120 or transfer chamber 118, 118T1, 118T2 with a known spatial relationship to other features of the process module 120 or transfer chamber 118, 118T1, 118T2 so that the vision system 1111 and controller 199 may track a position of the wafer handler 1500 (such as on the base 1510 and / or end effector 1520) relative to the stationary distributed reflective feature 1222PM of the process module 120 or transfer chamber 118, 118T1, 118T2, which may improve positioning accuracy of the wafer handler 1500 and minimize effects of thermal expansion of the frame 118M. The stationary distributed reflective feature 1222PM may be disposed in front of (i.e., adjacent an access port to) a process module or load lock (see Fig.19) such as adjacent or along a side wall of the transfer chamber 118, 118T1, 118T2 and / or on a bottom / floor of the transfer chamber (e.g., on the non-magnetic isolation wall 4400 – see also Figs. 8A-8C) and / or at any suitable location within the process module 120 (see Fig. 14). The stationary distributed reflective feature 1222PM of the process module 120 or transfer chamber 118, 118T1, 118T2 may be similar to the distributed reflective feature 1222 of the wafer handler 1500, or may be any suitable stationary reflective indicia such as a reflective strip or other pattern, ArUco markers, reflective spheres, or any other suitable shape for reflection or image pattern recognition that may be employed to determine a spatial location of the stationary distributed reflective feature 1222PM in the reference frame EREF of the processing apparatus 100, 200, 300, 400. The stationary reflective feature 1222PM may be configured such that a wafer holder 1500 passing over the stationary reflective pattern, blocks a portion of the stationaryAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 reflective feature 1222PM to reveal (via image processing) the wafer holder 1500 pose, size and shape.

[0077] The features 1225, 1225S may be configured for detection by the vision system 1111 in any suitable reflective and / or non-reflective manner. The features 1225, 1225S may include a surface that is reflective, retro-reflective, or directionally reflective of a discrete illumination spectrum. The features 1225, 1225S may be reflective, retro-reflective, or directionally reflective (so as to reflect light in a non-diffuse and non-scattered manner and direct the reflected light in a predetermined direction that may be different than the source of the light and / or reflect light unique to a particular direction) in response to illumination by infrared light, monochromatic light, or light having any suitable wavelength so that the features 1225, 1225S are passively illuminated in the field(s) of view of at least one camera(s) 1112 of the vision system 1111. The chamber 118, 118T1, 118T2 in which the wafer handler(s) 1500 operate includes, or has coupled thereto, at least one illumination source for illuminating the features 1225, 1225S and effecting detection of the features 1225, 1225S by the vision system 1111.

[0078] Referring also to Fig. 21, the features 1225, 1225S may include surface(s) that is non- reflective (i.e., not reflective / retro-reflective / directionally reflective, which non-reflective surfaces may be referred to as “dark” or “black” surfaces) and the vision system 1111 is configured to detect and track the non-reflective surface(s) and the respective feature 1225, 1225S thereof. For example, the transfer chamber 118, 118T1, 118T2 may be flooded (i.e., completely filled) with illumination from the illumination source(s) 666. As noted herein, a wavelength of the illumination may be selected so as to not interfere with wafer processing within the substrate processing apparatus 100, 200, 300, 400. The camera(s) 1112 of the vision system 1111 are configured (e.g., through any suitable non-transitory program of the vision system 1111 and / or controller 199) to identify the dark or black surfaces of the features 1225, 1225S, while ignoring the illuminated portions / features of the transfer chamber 118, 118T1, 118T2.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0079] The at least one camera(s) 1112 are configured to image the distributed reflective feature 1222 (and the features 1225, 1225S thereof) and provide a signal to the controller 199. Such signal may be included in the position feedback signal PFBS and the controller 199 is configured to receive and register (e.g., store in a memory accessible by the controller) such signal. The signal includes the image embodying the distributed reflective feature 1222 (and the features 1225, 1225S thereof). The at least one camera(s) 1112 are configured to image the distributed reflective feature 1222 on the fly, with the substrate transport apparatus (e.g., the body 1510 and wafer handler 1500 thereof) in motion relative to the frame 118M.

[0080] The end-effector 1520, 1520D may be coupled to the base 1510 with any suitable end effector support 1510S, such as for example one or more stanchions 1510SS so as to set the end- effector 1520, 1520D at a suitable nominal height H2 relative to the level reference plane 1299. The wafer handler 1500 may be moved in space (in at least three degrees of freedom) using any suitable electro-dynamic levitation principles. The actuation elements (e.g., the array of coil actuators 1700), as shown in Fig.5 include independently controlled coil actuators 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 (also referred to herein as coil segments) that generate desired magnetic field that induces thrust and lift force vectors in the base 1510. The independently controlled coil actuators 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 also effect self-deterministic absolute wafer handler position feedback for each wafer handler(s) 1500 as described in United States patent application number 18 / 050,300, previously incorporated herein by reference in its entirety.

[0081] As shown in Figs. 5, 6, and 7, the controller 199 is operably coupled to the array of coil actuators 1700 and the alternating current power source 1585. The controller 199 may be configured to sequentially excite the independently controlled coil actuators 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 with multiphase alternating current with a predetermined excitation characteristic (such as, e.g., inductance, a phase lag / amplitude, and / or power factor) so that each reaction platen or base 1510Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 (of the wafer handler 1500) is levitated and propelled with one, two, three, four, five or six degrees of freedom. The array of coil actuators 1700 is configured to produce levitation and propulsion forces that drive, under control of controller 199, the wafer handler 1500 along a predetermined trajectory. The controller 199 may be configured so as to determine reaction platen position feedback, in at least one degree of freedom from the one, two, three, four, five or six degrees of freedom, in any suitable manner. For example, the controller 199 may be configured to determine reaction platen (wafer handler) position feedback (i.e., referred to herein as a position feedback signal PFBS) from one or more of a variance in a predetermined excitation characteristic (e.g., changes in inductance, impedance, phase lag / amplitude, and / or power factor signature) of the alternating current of at least one independently controlled coil actuator 1700A-1700n, 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 effecting levitation or propulsion of the base 1510 (as described in United States patent application number 18 / 050,300, previously incorporated herein by reference in its entirety). The vision system 1111 may be configured to track movement (and hence effect trajectory determination) of the reaction platen and / or wafer holding station SHS (e.g., of a respective wafer handler 1500, 1500A, 1500B - see also Figs.1, 6, and 12 noting the vision system 1111 may be included in any of the processing apparatus described herein, where the vision system 1111 includes any suitable camera(s), scanner(s), etc. configured to determine, through machine vision and suitable machine vision algorithms of the controller 199, the location of the substrate handler(s) and provide the position feedback signal PFBS obtained from a feedback position loop effected by the vision system 1111 detection of the distributed reflective feature 1222. The vision system 1111 may form, with distributed reflective features 1222 (described herein) of the wafer handler 1500, 1500A, 1500B, an optical tracking system (e.g., optical encoder) 1111TS (see also Fig.22) for tracking a position of the wafer handler 1500, 1500A, 1500B within the processing apparatus 100 in, for example, six-degrees of freedom X, Y, Z, Rx, Ry, Rz.

[0082] Referring also to Fig. 22, the wafer handler position feedback may be obtained by the controller 199 from a combination of the optical tracking system and the variance in theAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 predetermined excitation characteristic. For example, the variance in the predetermined excitation characteristic may be employed by the controller 199 to grossly or coarsely locate / position the wafer handler 1500, 1500A, 1500B within the transfer chamber 118, 118T1, 118T2 and / or relative to a substrate holding location of the substrate processing apparatus 100, 200, 300, 400. The optical tracking system 1111TS may be employed by the controller 199 to fine tune the location / position of the wafer handler 1500, 1500A, 1500B within the transfer chamber 118, 118T1, 118T2 and / or relative to a substrate holding location of the substrate processing apparatus 100, 200, 300, 400 in a region of interest, such as a wafer pick / place location (e.g., of a process module, load lock, or other suitable wafer holding location). The positioning effected by the combination of the predetermined excitation characteristic and the optical tracking system 111TS may narrow the image processing search to locate the distributed reflective features 1222 of the wafer handler 1500, 1500A, 1500B to the region of interest so as to reduce image processing time and expedite wafer handler position determination.

[0083] Still referring to Figs. 5, 6 and also to Figs. 9 and 10B, as described herein, the linear electric machine 1599 includes a matrix of independently controlled coil actuators 1700A-1700n, that when energized induce a levitation field on a predetermined one or more of the wafer handler 1500. To control all six degrees of freedom of the wafer handler 1500 a determination is made, such as by master controller 199 and based on a position of a respective wafer handler 1500, 1500A, 1500B (such position being determined by the vision system 1111 and / or the variance in the predetermined excitation characteristic), as to which coil actuators 1700A-1700n can contribute to forces and moments on wafer handler 1500 where these determined coil actuators 1700A-1700n are energized to generate desired propulsion and levitation forces on the wafer handler 1500 that produce a desired motion path of the wafer handler 1500.

[0084] As described herein, the master controller 199 is configured to receive the position feedback signal PFBS that is inclusive of image(s) captured by the at least one camera(s) 1112, where the images embody the distributed reflective feature 1222 of (each of) the wafer handler(s) 1500. The controller 199 is programmed or otherwise configured to determine (i.e., resolve) fromAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 the distributed reflective feature embodied in the image a pose of the predetermined reference plane, straight line, or point REF of the base 1510, where the “pose” is a position and orientation of a coordinate frame (such as the predetermined reference plane, straight line, or point REF) of the wafer handler 1500, which is characterized in one, two, three, four, five or six degrees of freedom (see Fig. 12, where the six degrees of freedom are translation in the X direction, translation in the Y direction, translation in the Z direction, roll or rotation Ry about the Y axis, pitch or rotation Rx about the X axis, and yaw or rotation Rz about the Z axis – see Fig.5). The controller 199 may be configured to determine kinematic motion of the base 1510 (and hence the end effector 1520 wafer holding station SHS and any wafer S held thereon) from an initial substrate handler pose to a final substrate handler pose. The master controller 199 may be programmed or otherwise configured to determine (e.g., resolve) the kinematics of attitude / yaw control (in three degrees of freedom – pitch, roll, and yaw) related to the determined kinematic motion. The kinematic motion and kinematics of attitude / yaw (i.e., control variable values) may be determined, using one or more of a dynamic model and a form factor in combination with a predetermined substrate processing recipe (e.g., where and when the substrate is to be transferred and what process is to be performed on the substrate) in a manner substantially similar to that described in United States patent application number 18 / 050,300 previously incorporated by reference herein in its entirety. The kinematic motion and kinematics of attitude / yaw (i.e., the control variable values) may be determined using a neural network 199N in combination with a predetermined substrate processing recipe (e.g., the substrate processing recipe defining where and when the substrate is to be transferred and what process is to be performed on the substrate).

[0085] Fig.9 illustrates a distributed network of drive or coil controllers 1750A-1750n where each coil controller 1750A-1750n is communicably coupled (e.g., through a wired or wireless connection) to a respective matrix or group of coil actuators 1700G1-1700Gn. Each (or all) of the coil controllers 1750A-1750n (and the vision system 1111) may be communicably coupled (e.g., through any suitable wired or wireless connection) to the master controller 199 through the data network (which may be any suitable wired or wireless network, including but not limited toAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 EtherCAT). Power may be provided to each coil controller 1750A-1750n and the master controller 199 in any suitable manner, such as by independent power lines or by power transmitted through the data network cable (such as, or in a manner similar to, power over Ethernet). The master controller 199 may be configured as described below with respect to Figs.10A and 10B.

[0086] Fig.9 illustrates two wafer handlers 1500A, 1500B that may be simultaneously controlled with any suitable control algorithm (such as of the master controller 199) which configures the master controller 199 to send commands to each of the coil controllers 1750A-1750n. The coil controllers 1750A-1750n employ the commands to effect generation of the desired forces and moments on each wafer handler 1500A, 1500B so that the wafer handlers 1500A, 1500B travel along a desired motion path in space (i.e., within the transfer chamber 118). The data network traffic propagates in a deterministic real time execution where the data network traffic is collected and processed (such as described with respect to Figs.10A and 10B) within tight execution time constraints (such as at about 1KHz or faster) in order to maintain stability of each wafer handler 1500A, 1500B motion in space.

[0087] Fig.10A illustrates a motion control architecture operating in the data network. The master controller 199 includes a processor and operating system that configure the controller 199 (e.g., with any suitable non-transitory computer program code) to effect (or run thereon) a deterministic position feedback control loop PFBL at a sampling rate (e.g., such as about 1 KHz or more) that is fast enough to be able to control the motion of the levitating wafer handlers 1500, 1500A, 1500B. The controller 199 may include a path planning module PPM that is configured to define a set of desired trajectories for each of the levitating wafer handlers 1500A, 1500B (and hence of the end effector 1520 wafer holding station SHS and any wafer held thereon). The controller 199 may also include a path planning module similar to that described in United States patent application number 18 / 050,300 filed on October 27, 2022, the disclosure of which was previously incorporated herein by reference in its entirety. The local drive controller 1750A-1750n (or the controller 199, such as where the local drive controller 1750A-1750n conveys the voltage and current to theAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 controller 199 for position determination) may be configured with any suitable strategy for position determination of the wafer handler(s) 1500 within the transfer chamber 118.

[0088] A position feedback signal PFBS of the position feedback control loop PFBL, may be received by (in the case of, e.g., vision system or other sensor feedback) or generated by (in the case of variance in predetermined excitation characteristics of the alternating current of at least one coil actuator) the controller 199, where the position feedback signal PFBS includes or otherwise embodies a six degree of freedom vector for each levitating wafer handler 1500A, 1500B. The controller 199 may also include a control law module CLM that is configured to receive the actual trajectories (e.g., from position feedback) and desired trajectories of the wafer handlers 1500A, 1500B and calculate (or otherwise determine) a set of control signal outputs for each coil actuator 1700A-1700n in the network of coil controllers 1750A-1750n. The control law of the control law module CLM can be a set of six proportional-Integral-Derivative (PID) control equations associated with the tracking errors of each degree of freedom (e.g., such as X, Y, Z, roll, pitch, and Yaw) respectively of each wafer handler 1500A, 1500B. For induction based levitation of the wafer handlers 1500 as described herein, the control output variables associated with the respect coil actuators 1700A-1700n may be a desired alternating current amplitude and alternating current phase angle between neighboring coil actuators 1700-1700n or relative to a reference coil actuator of the array of coil actuators 1700. The notation of such variables is illustrated in Fig. 10A as Magijk and Phijk, for alternating current (AC) current magnitude and phase angle, respectively.

[0089] Referring to Figs.1, 2, 3A-4B, 5, 6A-6E, 11, 12, 17, 17A, and 23, the processing apparatus 100, 200, 300, 400 may have longitudinally extended transfer chambers 118 (see Figs. 1, 2, and 30) or cluster tool configuration transfer chambers 118T1, 118T2 (see also processing apparatus 300, 400 in Figs. 3A-4B). The longitudinally extended transfer chambers 118 may comprise transfer chamber modules 118TCM that are coupled to each other to form the longitudinally extended transfer chambers 118 having any desired length. Adjacent transfer chamber modules 118TCM may be coupled to each other with or without isolation therebetween. For example, Figs.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 6-6E illustrate a longitudinally extended transfer chamber 118 having adjacent transfer chamber modules 118TCM coupled to each other without isolation therebetween, while Fig. 23 illustrates a longitudinally extended transfer chamber 118 having adjacent transfer chamber modules 118TCM coupled to each other with isolation (e.g., a pass-through slot valve 3001). Providing isolation, such as the pass-through slot valve 3001 or other suitable selectively sealed valve / member, between the adjacent transfer chamber modules 118TCM may provide for each transfer chamber having a different or the same atmosphere therein. The pass-through slot valve 3001 is sized and shaped to allow the wafer handler(s) 1500 passage through the pass-through slot valve (when open) between the adjacent transfer chamber modules 118TCM.

[0090] The transfer chambers 118, 118T1, 118T2 may include any suitable number of illumination sources 666 disposed at any suitable location(s) within or outside (or a combination of light sources within and outside), or otherwise coupled to the transfer chamber 118, 118T1, 118T2 so as to illuminate the features 1225, 1225S of the distributed reflective features 1222 of the respective wafer handler 1500, 1500A, 1500B for detection by the vision system 1111. The illumination sources 666 may be disposed inside and / or outside the transfer chamber 118, 118T1, 118T2 so as to illuminate the features 1225, 1225S of the distributed reflective features 1222 within the interior of the transfer chamber 118, 118T1, 118T2.

[0091] Where the illumination sources 666 are disposed outside the transfer chamber 118, 118T1, 118T2, the illumination sources may illuminate the features 1225, 1225S through any suitable sealed window or transparent isolation wall SW (see Figs. 14 and 17) disposed on a side or top of transfer chamber 118, 118T1, 118T2. The sealed window SW may be transparent (i.e., transparent to the illumination or light beam 666LB of a predetermined wavelength of the illumination source) and separates the illumination sources 666 from one or more of the distributed reflective feature 1222, the reflective pattern 1222RP, and the sealed processing environment (i.e., the sealed processing environment within the transfer chamber 118, 118T1, 118T2 or process module 120). The sealed window SW may be constructed of any suitable material that allows maximum refraction of a type of light / illumination (i.e., the transparency results in minimum reflection ofAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 returning rays off the transparency) between the at least one camera(s) 1112 and the features 1225, 1225S. For example, the sealed window SW may be constructed of glass, quartz, Germanium, Zinc Selenide, or any other suitable material. The sealed window SW may be hermetically sealed against a wall 118W of the transfer chamber 118, 118T1, 118TW by a static seal 1701 such as an O-ring or other suitable seal.

[0092] The illumination sources 666 may be disposed adjacent to an upper portion of the transfer chamber 118, 118T1, 118T2 so as to illuminate the features 1225, 1225S from above the features 1225, 1225S. The illumination sources 666 may be disposed at or adjacent a wafer transfer plane 1290 (see Fig. 5) so as to illuminate a side of the features 1225, 1225S from any suitable angle. The features 1225, 1225S of the distributed reflective features 1222 may be configured so as to reflect the illumination (i.e., cast onto the features from above the features) in a substantially 360º pattern (such as where the features 1225, 1225S includes a spherical, conical, pyramidal, etc. shape) so that each feature 1225, 1225S is visible or otherwise detectable by at least one of the camera(s) 1112 of the vision system 1111 (e.g., regardless of where the illumination sources 666 are disposed to illuminate the features 1225, 1225S). The features 1225, 1225S may be configured to reflect the illumination from the illumination source(s) 666 in any suitable direction effecting detection of the respective feature 1225, 1225S by at least one of the camera(s) 1112.

[0093] The illumination sources 666 may be configured to provide a discrete illumination spectrum, such as infrared light, monochromatic light, or any other suitable wavelength of light that is reflected by the features 1225, 1225S of the distributed reflective features 1222 (e.g., the features 1225, 1225S are illuminated by the illumination sources 666) when the distributed reflective features are imaged by the vision system 1111. The illumination sources 666 may be configured to provide any suitable illumination spectrum for illuminating the features 1225, 1225S so as to effect detection of the features 1225, 1255S.

[0094] The illumination sources 666 may be separate and distinct from the at least one camera(s) 1112 of the vision system 1111 and are located in and / or on the transfer chamber 118, 118T1,Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 118T2 at any suitable locations (e.g., on the tops / ceilings of the transfer chamber, on one or more sides of the transfer chambers, etc.) so that features 1225, 1225S of the distributed reflective features 1222 within the field(s) of view FOV of the at least one camera(s) 1112 are illuminated to the at least one camera(s) 1112 (illumination is reflected towards the cameras from the features) without direct illumination of and / or from the at least one camera(s) 1112.

[0095] The illumination sources 666 may be integral to the at least one camera(s) 1112 or camera bodies, such as in the form of a light-emitting diode (LED) ring disposed around the camera lens / sensing element (see Figs.17 and 17A) or any other suitable form so that features 1225, 1225S of the distributed reflective features 1222 within the field(s) of view FOV of the at least one camera(s) 1112 are illuminated (illumination is reflected towards the respective camera lens / sensing element from the features) without direct illumination of the at least one camera(s) 1112. Each camera 1112 may operate with a “self-illuminating” illumination source with a unique and narrow wavelength (such as an infrared or other suitable wavelength described herein that may not interfere with processing of the wafers S) and with a respective bandpass filter 1711 (see Figs. 1 and 17) tuned for the unique and narrow wavelength installed on or adjacent the camera lens / sensing element. The unique and narrow wavelength of one camera 1112 may be different from the unique and narrow wavelength of another camera 1112 where the bandpass filters 1711 for each camera 1112 only allow the illumination from the respective camera’s light illumination source 666 to enter the camera lens / sensing element of that respective camera 1112. This may enable facing one camera 1112 towards another camera 1112 substantially without blinding or obfuscating imaging of the features 1225, 1225S by the another camera 1112.

[0096] A combination of on-board camera (illumination sources are integral with the camera / camera body) and off-board camera (illumination sources are separate and distinct from the camera / camera body) illumination may be employed.

[0097] The vision system 1111 may include at least one camera(s) 1112 disposed within or outside (or a combination of cameras within and outside) the transfer chamber 118, 118T1, 118T2 (orAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 otherwise coupled to the transfer chamber 118, 118T1, 118T2) so as to image at least the distributed reflective features 1222 and the features 1225, 1225S thereof to effect position detection and control of the wafer handler(s) 1500, 1500A, 1500B. The at least one camera(s) 1112 may be disposed outside the transfer chamber 118, 118T1, 118T2 (i.e., separated from the sealed processing environment) so as to image the interior of the transfer chamber 118, 118T1, 118T2 (and at least the distributed reflective features 1222 therein) such as through a sealed window or transparent isolation wall SW (see Fig. 14) to effect position detection and control of the wafer handler(s) 1500, 1500A, 1500B. The at least one camera(s) 1112 is / are disposed so as to image the distributed reflective feature 1222 in each position of the base 1510 of the wafer handler 1500 throughout the transfer chamber 118, 118T1, 118T2. The sealed window SW may be transparent (i.e., transparent to the illumination of the illumination source) and separates the at least one camera(s) 1112 from one or more of the distributed reflective feature 1222, the reflective pattern 1222RP, and the sealed processing environment (i.e., the sealed processing environment within the transfer chamber 118, 118T1, 118T2 or process module 120). The sealed window SW may be constructed of any suitable material as described herein that allows maximum refraction of a type of light / illumination (i.e., the transparency results in minimum reflection of returning rays off the transparency) between the at least one camera(s) 1112 and the features 1225, 1225S.

[0098] Referring also to Figs. 18A-18J and 23, the at least one camera(s) 1112 is / are positioned on or about the transfer chamber 118, 118T1, 118T2 to maximize a visible volume within the transfer chamber 118, 118T, 118T2 and minimize an impact (e.g., of the at least one camera) on the volume of the transfer chamber 118, 118T1, 118T2.

[0099] The at least one camera(s) 1112 may be any suitable camera(s), such as any suitable high- definition camera (e.g., with high definition being an image sensor resolution of about 2048 pixels by about 1088 pixels or greater, although the image resolution may be lower) having any suitable field of view FOV such that when positioned relative to other camera(s) 1112 of the vision system 1111 substantially the entire interior (or at least the portions in / along which the wafer handlersAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 1500, 1500A, 1500B traverse) of the transfer chamber 118, 118T1, 118T2 is imaged by the vision system 1111.

[0100] As illustrated in Figs. 6-6E and 18A-18I, the at least one camera(s) 1112 may be disposed at any suitable position(s) within the transfer chamber, outside the transfer chamber, or a combination of cameras within and outside the transfer chamber. The at least one camera(s) 1112 may be disposed for viewing high density linear tools, such as the processing apparatus 100, 200, 300, 400, with the at least one camera(s) 1112 disposed near or otherwise adjacent the wafer transport plane 1290 (see, e.g., Figs. 5 and 18A-18C), although the at least one camera(s) 1112 may be disposed any suitable distance from the wafer transport plane 1290 (see Figs. 18D-18J).

[0101] The at least one camera(s) 1112 may be placed in one or more corners of the transfer chamber 118, 118T1, 118T2 (see Figs.6 and 18A-18C), along a side 118S of the transfer chamber 118, 118T1, 118T2 (see Fig. 6), on or at / adjacent a top wall of the transfer chamber 118, 118T1, 118T2 (see Figs. 18D-18J), or any other suitable location(s) (which may be any combination of those locations noted above) of the transfer chamber 118, 118T1, 118T2 so that where there are more than one cameras 1112 a respective field of view FOV of the cameras 1112 overlap one another (such as where a field of view of single camera is not large enough to image the entire traverse area of the wafer handler(s) 1500, 1500A, 1500B within the transfer chamber 118, 118T1, 118T2) to provide the maximized imaging coverage of substantially the entire interior (or at least the portions in / along which the wafer handlers 1500, 1500A, 1500B traverse) of the transfer chamber 118, 118T1, 118T2. It is noted that while Figs. 6-6D and 18A-18J illustrate the cameras 1112 within and / or outside the linearly elongated transfer chamber 118, the cameras 1112 may be positioned within and / or outside the transfer chambers 118T1, 118T2 in the same or similar manner.

[0102] Referring to Figs. 6 and 18A-18J, the vision system 1111 includes one camera 1112 or more than one (e.g., a set of) cameras (where the set includes two or more cameras, such as two or more of cameras 1112A-1112H) positioned to image substantially the entire traverse area of theAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 wafer handler(s) 1500, 1500A, 1500B within the transfer chamber 118, 118T1, 118T2 (the number of cameras 1112 in each chamber may depend on the respective fields of view of the cameras and may be chosen to ensure imaging substantially the entire traverse area of the wafer handler(s) 1500, 1500A, 1500B within the transfer chamber).

[0103] Referring to Figs. 6A-6D, cameras 1112A, 1112B, 1112E, 1112F may be disposed in respective corners of the transfer chamber 118 while cameras 1112C, 1112D, 1112G, 1112H may be disposed between the longitudinal ends of the transfer chamber 118 so as to image areas of the transfer chamber 118 outside the fields of view of cameras 1112A, 1112B, 1112E, 1112F. Cameras 1112A, 1112B, 1112C, 1112H may face each with overlapping fields of view FOV1, FOV2, FOV3, FOV8 (see Figs. 6A-6D) so as to image substantially the entire traverse area of the wafer handler(s) 1500, 1500A, 1500 in a first portion P1 of the transfer chamber (e.g., the first portion extending from transfer chamber end TCE1 to about a midline ML between transfer chamber ends TCE1, TCE2). Cameras 1112D, 1112E, 1112F, 1112G face each with overlapping fields of view FOV4, FOV5, FOV6, FOV7 (see Figs. 6A-6D) so as to image substantially the entire traverse area of the wafer handler(s) 1500, 1500A, 1500 in a second portion P2 of the transfer chamber (e.g., the second portion extending from transfer chamber end TCE2 to about a midline ML between transfer chamber ends TCE1, TCE2). As illustrated in Figs.6A and 6C, the fields of view FOV1, FOV2, FOV5, FOV6 overlap across and adjacent the midline ML so as to provide imaging of the wafer handler traverse area at and adjacent the midline ML of the transfer chamber 118. There may be any suitable number of cameras 1112 disposed at any suitable positions within / on the transfer chamber 118 with the fields of view arranged in any suitable manner for imaging the distributed reflective features 1222 of the wafer handler 1500, 1500A, 1500B within the transfer chamber 118.

[0104] Each of the cameras 1112 may be configured for three-dimensional position detection / acquisition of an illuminated object (such as of the distributed reflective feature 1222). Suitable examples of cameras that may be employed include, but are not limited to infrared cameras, time-of-flight cameras, range-finding cameras, etc. Each of or one or more of theAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 cameras 1112 may be a three-dimensional or stereo vision camera, and / or two or more of the cameras 1112A-1112H may be two-dimensional or mono-cameras that are paired to provide stereo vision. For example, cameras 1112A, 1112B may be paired to form a stereo vision camera set, cameras 1112C, 1112H may be paired to form a stereo vision camera set, etc. where the cameras are paired in any suitable manner to form one or more stereo vision camera sets and / or where a camera 1112A-1112H may be a part of more than one stereo vision camera set (e.g., cameras 1112B, 1112C may form a stereo vision camera set where camera 1112B is common or shared with camera set 1112A, 1112B and 1112B, 1112C). The cameras 1112 may be ultra-wide / field angle cameras, wide-angle / field cameras, omnidirectional camera, or have any suitable field of view for viewing some, or all, of the interior of the transfer chamber 118.

[0105] Referring to Figs.18A-18C, the cameras 1112A-112D are disposed at the four corners of the transfer chamber 118 so that the fields of view FOV1-FOV4 of the cameras 1112A-1112D encompass or otherwise cover substantially the entire interior (i.e., the entire area PE of the interior where the wafer handler(s) 1500, 1500A, 1500B traverse). The cameras 1112A-1112D may be ultra-wide / field angle cameras, wide-angle / field cameras, or omnidirectional camera having a field of view that images the entire area PE of the interior of the transfer chamber 118 where the wafer handler(s) 1500, 1500A, 1500B traverse.

[0106] Referring to Fig.6E, a single camera 1112 is disposed at or on a top wall of the transfer chamber 118 (or at any other suitable location of the transfer chamber 118) so that a field of view of the camera 1112 encompasses or otherwise covers the entire interior (i.e., the entire area PE of the interior where the wafer handler(s) 1500, 1500A, 1500B traverse). The camera 1112 may be an ultra-wide / field angle camera, a wide-angle / field camera, or omnidirectional camera having a field of view that images the entire area PE of the interior of the transfer chamber 118 where the wafer handler(s) 1500, 1500A, 1500B traverse. One or more illumination sources 666 may be provided integral to the camera 1112 or separate and distinct from the camera 1112. The camera 1112 is configured for three-dimensional position detection / acquisition of the illuminated object (such as of the distributed reflective feature 1222).Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0107] Referring to Figs.18D and 18E four cameras 1112A-1112D (although there may be more or less than four cameras) are illustrated as being disposed mounted to a lid 118LID of the transfer chamber 118, 118T1, 118T2 on one side of the transfer chamber 118, 118T1, 118T2. The cameras 1112A-1112D are generally facing the opposite side of the transfer chamber 118, 118T1, 118T2 so as to not face each other and so that the respective fields of view FOV1-FOV4 overlap to encompass or otherwise cover the entire interior (i.e., the entire area PE of the interior where the wafer handler(s) 1500, 1500A, 1500B traverse). The arrangement of the cameras 1112A-1112D generally facing in a same direction may prevent image obfuscation due to camera illumination sources 666 and may reduce camera sensitivity to reflections (such as of the distributed reflective features 1222) back to the camera 1112A-1112D sensing elements.

[0108] Referring to Figs. 18F-18J, four cameras 1112A-1112D (although there may be more or less than four cameras) are illustrated as being disposed mounted to a lid 118LID of the transfer chamber 118, 118T1, 118T2 in a dome shaped arrangement. The cameras 1112A-1112D are disposed on a virtual surface 1801 of a virtual dome 1800 so that each camera field of view faces a center point 1802 of the virtual dome 1800. The cameras 1112A-1112D are generally arranged on the virtual surface 1801 in one or more of an inline arrangement when viewed from above (see Fig.18G) and an elliptical arrangement when viewed from above (see Fig.18H), facing the center point 1802 so as to not face each other and so that the respective fields of view FOV1-FOV4 overlap to encompass or otherwise cover the entire interior (i.e., the entire area PE of the interior where the wafer handler(s) 1500, 1500A, 1500B traverse). The arrangement of the cameras 1112A-1112D generally facing in a same direction may prevent image obfuscation due to camera illumination sources 666 and may reduce camera sensitivity to reflections (such as of the distributed reflective features 1222) back to the camera 1112A-1112D sensing elements. Placing the cameras 1112A-1112D on the virtual surface 1801 of the virtual dome 1800 as described above may be effected by shaping the lid 118LID (see Figs. 18I and 18J) so that camera mounting positions of the lid 118LID structurally define portions of the virtual surface 1801 (i.e., the virtual surface 1801 is no longer virtual in at these structurally defined portions of the lid 118LID) toAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 which the cameras 1112A-1112D are physically mounted to. Fig.18I illustrates an arrangement of the transfer chamber 118, 118T1, 118T2 being sized so as to have a single lid 118LID, while Fig.18J illustrates an arrangement of the transfer chamber 118, 118T1, 118T2 being sized so as to have two lids 118LID.

[0109] As illustrated in Figs. 17A and 23, the transfer chamber 118 may include an aperture or through bore 1776 and an annularly / radially sealed hollow tube 1770 to embed sensors (e.g., such as cameras 1112) for effecting measurement / tracking of at least the distributed reflective features 1222 of the substrate handlers 1500 and / or the measurement of the side profile of the end effector 1520 and / or substrate S as the end effector 1520 and / or substrate S passes through the transport opening 118O in the side wall 118S of the transfer chamber 118. A camera 1112 and respective illumination source 666 may be disposed in a common hollow tube 1770 that separates / isolates the camera 1112 and respective illumination source 666 from an interior of the transfer chamber 118; although the camera 1115 and illumination source 666 may be disposed in different hollow tubes 1770. For exemplary purposes only, the camera 1112 and illumination source 666 are illustrated as being disposed on a common printed circuit board 1789 where ends of the printed circuit board 1789 may be configured to engage the hollow tube 1770 in any suitable manner so as to provide for setting an orientation of and servicing of the camera 1112 and illumination source 666. The hollow tube 1770 may be constructed of glass, quartz, Germanium, Zinc Selenide, or any other suitable material. Each hollow tube 1770 may employ one or more radial (or annular) seal(s) 1775 (such as an O-ring or other suitable seal) that may provide for locating the camera 1112 and / or respective illumination source 666, disposed therein, for in-line optical sensing of the distributed reflective features 1222 from multiple direction and with multiple configurations in a vacuum system. For example, transfer chamber 118 may include apertures or through bores 1776, each aperture 1776 being configured to receive therein a hollow tube 1770. Each aperture may include one or more viewing ports 1776VP configured to allow illumination and a field of view of the camera 1112 to pass through the viewing port 1776VP into the transfer chamber 118 interior. A hermetic seal is provided, or otherwise effected, between the hollow tube 1770 and the apertureAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 1776 (such as on either side / end of the viewing port 1776VP) by the one or more seals 1775 so as to seal the interior of the transfer chamber 118. The hollow tube 1770 may be inserted into the aperture 1776 in an insertion direction 1777 and secured therein by one or more end caps 1778 (or other fasteners) coupled to the transfer chamber 118. The end caps 1778 may be a part of or be coupled to a fluid conduit 1780 configured to circulate cooling fluid (from a cooling fluid source) through an interior of the hollow tube 1770 for cooling the camera 1112 and / or illumination source 666 within the hollow tube 1770.

[0110] The apertures 1776 may be located on the transfer chamber 118 so that the hollow tubes 1770 (with a respective camera 1112 and / or illumination source 666 therein) may be located adjacent to an interior surface 118SC of the transfer chamber 118 side walls 118S. For example, as illustrated in Fig. 23, the apertures 1776 (and hollow tubes 1770 with the camera 1112 and / or illumination source 666 therein) may be disposed in one or more of the following locations on the transfer chamber: oriented across a slot valve SV opening (e.g., transport port 118O) to sense the end effector 1520 and / or substrate S elevation profile as the end effector 1520 and / or substrate S pass through the transport port 118O; oriented towards the transfer chamber 118 interior to sense location(s) of one or more substrate handlers 1500 (e.g., by sensing the respective distributed reflective features 1222) as the one or more substrate handlers 1500 move throughout the transfer chamber 118; and any other suitable location of the transfer chamber 118 for sensing one or more of the substrate handler 1500, a portion of the substrate handler 1500, and / or the substrate S.

[0111] Locating the cameras 1112 and / or illumination sources 666 within the respective hollow tubes 1770 in the respective apertures 1776 may provide for position tracking of the substrate handlers 1500 as they move throughout the transfer chamber (see, e.g., Fig.23) while, one or more of: substantially eliminating overlapping or blocking of the distributed reflected features 1222 of a respective substrate handler 1500 from view of the cameras 1112; providing a field of view of the distributed reflected features 1222 of the substrate handlers 1500 moving throughout the transfer chamber 118 substantially without increasing a height of the transfer chamber 118; and providing tracking positions of the substrate handlers 1500 with the substrate handlers 1500Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 passing between transfer chamber modules 118TCM or between the transfer chamber 118 and a service lock SL. Locating the cameras 1112 and / or illumination sources 666 within the respective hollow tubes 1770 in the respective apertures 1776 may provide for directly tracking the substrate handlers 1500 as the substrates S are entering / exiting a transport port 118O so that the position tracking of the substrate handlers 1500 is localized and more precise than tracking of substrate handlers from greater distances. Locating the cameras 1112 and / or illumination sources 666 within the respective hollow tubes 1770 in the respective apertures 1776 may provide for alternative and distal positioning of opposing cameras 1112, which may prevent camera to camera imaging distractions and provide for continuity of image connection / stitching.

[0112] Fig. 23 illustrates maintaining constant visual contact with substrate handlers 1500 as the substrate handlers 1500 move throughout the transfer chamber 118, where the distributed camera 1112 topology located at each station facet (e.g., adjacent the transport openings 118O) provides for the multiplexing each of the camera sensor data with the sensor data of one or more other cameras to establish connectivity between cameras 1112 and the substrate handlers 1500 to maintain substantially constant visual contact with the substrate handlers 1500. Fig. 23 illustrates localization of the cameras 1112 relative to the substrate handlers 1500 extended through the transport ports 118O (and respective process modules 120 connected thereto) so as to optimize visual connectivity between the process module 120 and the substrate handlers 120. Fig. 23 illustrates sensing of the substrate handlers 1500 with the cameras 1112 (in substantially constant visual contact) as the substrate handler 1500 passes through the pass-through slot valve 3001 between transfer chamber modules 118TCM and / or between the transfer chamber 118 and service lock SL.

[0113] Configuring the transfer chamber 118 to include the apertures 1776 as described may provide for employment of any suitable automated wafer centering and / or automated thermal expansion correction sensors 1785 adjacent the transport port 118O. The automated wafer centering and / or automated thermal expansion correction sensors 1785 adjacent the transport port 118O may effect accurate substrate S placement at the holding stations of the process modulesAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 120, where the positional and supporting controls interaction between the substrate handler 1500 and the substrate S leverages the automated wafer centering and / or automated thermal expansion correction sensors 1785 for fine position feedback to the substrate handler 1500 feedback controls.

[0114] Referring also to Fig.13, the at least one camera(s) 1112 may be pre-calibrated so that the camera 1112 (in the case of one camera) or each of the cameras 1112 (in the case of more than one camera) have a camera reference frame CRF (see FIG. 6E - i.e., a coordinate system (CX, CY, CZ) origin) located at the center of the camera lens. The camera reference frame CRF may be calibrated to a global reference frame (such as the reference frame EREF) of substrate transport apparatus 1599 (or a reference frame of the transfer chamber 118, 118T1, 118T2) in any suitable manner (such manners of calibration are known and need not be described in detail herein). The cameras 1112 and markers CM (similar to features 1225, 1225S) may be disposed within the transfer chamber 118, 118T1, 118T2 at predetermined known locations in the global reference frame GRF. These markers CM may be imaged by the at least one camera(s) 1112 and any suitable controller (such as controller 199) is configured to apply any suitable coordinate transformation (given the known positions of the at least one camera(s) 1112 and markers CM in the global reference frame GRF) to the camera reference frame CRF (for each camera) to calibrate the camera reference frame CRF to the global reference frame GRF.

[0115] The distributed reflective feature 1222 (and the reflective pattern 1222RP formed by the features 1225, 1225S) of each wafer handler 1500, 1500A, 1500B is calibrated to the camera reference frame CRF for each camera 1112. The distributed reflective feature 1222 of each wafer handler 1500, 1500A, 1500B is imaged by each camera 1112 at the predetermined reference / baseline temperature so that the spatial relationship between the features 1225, 1225S of the distributed reflective feature 1222 of each wafer handler 1500, 1500A, 1500B is known in the camera reference frame CRF. The calibration of the distributed reflective feature 1222 of each wafer handler 1500, 1500A, 1500B provides for one or more of identification of each wafer handler 1500, 1500A, 1500B, effecting control of each wafer handler independent of control of each other wafer handler, determination of changes in spatial relationship between the featuresAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 1225, 1225S (i.e., the intra-distributed reflective feature change) effecting determination of a variance of the size and shape (or variance of the dimension of the size and shape) of the wafer handler 1500, 1500A, 1500B (e.g., a thermal growth / shrinkage of at least a portion of the wafer handler 1500, 1500A, 1500B, such as the base 1510 and / or end effector 1520), and positional changes of the distributed reflective feature 1222 within the camera reference frame CRF (e.g., the inter-distributed reflective feature change) effecting position tracking, path planning, and / or trajectory generation for wafer / substrate transport). The controller 199 may be configured to receive the position feedback signal PFBS that is inclusive of image(s) captured by the at least one camera(s) 1112, where the images embody the distributed reflective feature 1222 of (each of) the wafer handler(s) 1500. The controller 199 may be configured to determine (i.e., resolve) from the distributed reflective features embodied in the image the variance in the size and shape (or variance of the dimension of the size and shape) of a portion of the wafer handler (such as of the base 1510 and / or end effector 1520).

[0116] Referring to Fig.14, the present disclosure may be applied to any suitable substrate holding location of the processing apparatus 100, 200, 300, 400. For example, the at least one camera(s) 1112 of the vision system 1111 may be disposed on a processing module 120 (in a known location relative to the global reference frame, such as the reference frame EREF of the substrate transport apparatus 1599) so as to view an interior of the processing module through, for example, a sealed window SW. Disposing the at least one camera(s) 1112 outside the processing module 120 may prevent exposure of the at least one camera(s) 1112 to the environment within the processing module 120. The at least one camera(s) may be disposed within the processing module 120. The processing module 120 may include a wafer holding station PSHS having a known location relative to the global reference frame (such as the reference frame EREF of the substrate transport apparatus 1599). The wafer holding station PSHS may include a distributed reflective feature 1222P having features 1225 similar to those described herein. The distributed reflective feature 1222P may form a part of the wafer holding station PSHS such as the features 1225 may form substrate supports (on which a substrate / wafer is placed) of the wafer holding station PSHS. TheAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 features 1225 may be arranged in a known spatial relationship and are calibrated to the at least one camera(s) 1112 (in the manner described herein or any other suitable manner) on the processing module 120, where the at least one cameras 1112 on the processing module are calibrated to the reference frame EREF (e.g., in the manner described herein or any other suitable manner). As a temperature within the processing module 120 increases or decreases, the position of the wafer holding station PSHS (as determined by optically monitoring the distributed reflective feature 1222P with the vision system) and / or position of the supports (e.g., formed by the features 1225) may change such that the controller 199 controls movement of the wafer handlers 1500, 1500A, 1500B to pick and place substrates / wafers to the process module 120 based on the location of the wafer holding station PSHS detected / determined by the vision system. The controller 199 may also control the wafer handlers 1500, 1500A, 1500B based on the detected location of the wafer holding station SHS of the wafer handlers 1500, 1500A, 1500B as detected by the vision system 1111.

[0117] Referring to Fig.20, the wafer handler 1500, 1500A, 1500B may be configure to harvest energy from vibration induced in the wafer handler 1500, 1500A, 1500B from the electro-dynamic levitation of the wafer hander handler 1500, 1500A, 1500B. The end effector 1520, 1520D may be mechanically suspended on the base 1510, such as described in United States provisional patent application number 63 / 632,308 filed April 10, 2024 titled “Substrate Handler End Effector Vibration Isolation and Method Therefor,” the disclosure of which is incorporated herein by reference in its entirety. The mechanical suspension of the end effector 1520, 1520D from the base 1510 may damp vibrations induced from electro-dynamically levitation to at least avoid wafer slippage relative to the end effector 1520, 1520D. The base 1510 may include a piezoelectric (or other suitable) energy harvester 2010 mounted to the base so that the piezoelectric energy harvester 2010 generates electrical energy from the vibration induced to the base 1510. The electrical energy may be stored in any suitable energy storage (e.g., capacitor) or fed directly to a powered device on the wafer handler 1500, 1500A, 1500B. The powered devices on the wafer handler 1500, 1500A, 1500B, powered by the energy harvester 2010 include, but are not limited to, one orAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 more of active distributed features 1222ACTIV, active damper(s) 2015, Peltier array(s) 2020, and active position sensor(s) 2025. The active distributed features 1222ACTIV are similar to the distributed reflective features 1222 described above however, rather than being reflective the active distributive features 1222ACTIV emit light (e.g., such as from encapsulated light emitting diodes). The active distributed features may simplify optical detection by eliminating illumination sources 666 and reflections caused thereby. The active damper(s) 2015 may be disposed on one or more of the base 1510 and end effector 1520, 1520D and may reduce vibration of the base 1510 and / or end effector 1520, 1520D (although some vibration of the base may be allowed so that electrical energy may be harvested by the energy harvester 2010). The Peltier array(s) 2020 may be coupled to base 1510 for cooling the base 1510 (as the base increases in temperature due to the electro-dynamic levitation of the base 1510). The active position sensor(s) 2025 may be a beacon of an indoor positioning system 2050 (such as of a Wi-Fi based position system, ultra wide-band positioning system, acoustic positioning system, and infrared positioning system) that sends a signal to a receiver 2050R (e.g., located at one or more positions of the transfer chamber 118, 118T1, 118T2, load lock 116, or process module 120) where the controller 199 is coupled to the receiver 2050R and configured to determine the location of the wafer handler 1500, 1500A, 1500B based on signals received by the receiver 2050 from the beacon. The position of the beacon and receiver 2050R may be reversed such that the beacons are disposed at one or more positions of the transfer chamber 118, 118T1, 118T2, load locks 116, and process modules 120 and the receiver is disposed on the wafer handler 1500, 1500A, 1500B (the receiver being wireless connected to the controller 199). The indoor positioning system 2050 may effect an auto-teach process effected by the controller 199 that automatically teaches the substrate transport apparatus 1599 the pick / place locations of the processing apparatus 100, 200, 300, 400.

[0118] Referring to Figs. 1-15, an exemplary method may include providing the substrate processing apparatus 100, 200, 300, 400 (Fig. 15, Block 15000). The substrate processing apparatus 100, 200, 300, 400 has a frame 118M, the substrate transport apparatus (also referred to as an electrical machine 1599, 1599R), a distributed reflective feature 1222, at least one camera(s)Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 1112, and a controller 199. The substrate transport apparatus 1599, 1599R includes a body 1510 supported above the frame 118M and an end effector 1520 with a wafer holding station SHS. The end effector is configured to hold a wafer S at the wafer holding station SHS and transport the wafer S within the substrate processing apparatus 100, 200, 300, 400. The body 1510 may have a size and shape, and the substrate transport apparatus 1599, 1599R may have a predetermined reference plane, straight line, or point REF (see Figs.5 and 12) with a predetermined relationship to the body 1510 and the size and shape of the body 1510. The method may include providing a distributed reflective feature 1222 (Fig.15, Block 15010). The distributed reflective feature 1222 may be connected to the substrate transport apparatus 1599, 1599R (as described herein) with a predetermined configuration deterministic of a pose of the predetermined reference plane, straight line, or point REF, the pose being characterized with one, two, three, four, five or six degrees of freedom, the size and shape or the dimension of the size and shape, or the variance therein. The distributed reflective feature 1222 may be imaged (Fig. 15, Block 15020) with at least one camera(s) 1112 connected to the frame 118M, where the at least one camera 1112 may be separated from the distributed reflective feature 1222 by a transparent isolation wall SW. The image may be received (Fig. 15, Block 15030) by the controller 199, where the controller 199 is communicably connected to the at least one camera(s) 1112. The controller 199 resolves from the distributed reflective feature embodied in the image a pose of the predetermined reference plane, straight line, or point, which pose informs feedback data to the controller 199 that defines a position, characterized with one, two, three, four, five or six degrees of freedom, of the body 1510, wafer holding station SHS or the wafer S relative to the frame 118M, wherein the controller 199 generates from the feedback data control inputs to the drive system DS, coupled to the body 1510, so as to control, with one, two, three, four, five or six degrees of freedom, position, trajectory and attitude of the body 1510, the wafer holding station SHS, or the wafer S, of the substrate transport apparatus 1599, 1599R, relative to the frame 118M (Fig.15, Block 15040).

[0119] In accordance with the present disclosure, the method includes one or more of the following, individually, in any combination with each other, and / or in any combination with theAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 features described above: resolving, with the controller 199, from the distributed reflective feature 1222 in the image, the variance in the size and shape (and / or variance of the dimension of the size and shape) of the body 1510; the substrate transport apparatus 1599, 1599R is a vacuum substrate transport apparatus; the frame 118M defines a transfer chamber 118 holding a vacuum environment (or any suitable sealed processing environment), and the body 1510 is located in the transfer chamber 118; the distributed reflective feature 1222 is located in the transfer chamber 118 and the at least one camera 1112 is: located in the transfer chamber 118, or separated from the vacuum environment by the transparent isolation wall SW; the at least one camera(s) 1112 is disposed so as to image the distributed reflective feature 1222 in each position of the body 1510 throughout the transfer chamber 118; driving the body 1510, with the drive section DS of the substrate transport apparatus 1599, 1599R, so the wafer holding station SHS is transported throughout the wafer transport plane 1290 of the frame 118M; providing, with the controller 199 connected to the drive section DS, a signal to the drive section DS identifying the resolved pose of the predetermined reference plane, straight line, or point REF and / or the variance of the size and shape (and / or variance of the dimension of the size and shape) of the body 1510; the pose of the predetermined reference plane, straight line, or point REF resolved from the image is characterized with one, two, three, four, five or six degrees of freedom, and / or the variance in size and shape (and / or variance of the dimension of the size and shape); the wafer holding station SHS has a predetermined center SHSC (see, e.g., at least Fig. 5) in a predetermined relationship to the predetermined reference plane, straight line, or point REF; the at least one camera(s) 1112 images the distributed reflective feature 1222 on the fly, with the substrate transport apparatus 1599, 1599R (e.g., wafer handler 1500 thereof) in motion relative to the frame 118M; imaging, with the at least one camera, at least another distributed reflective feature disposed at a stationary location within the frame, and determining, with the controller, a location of the body relative to the at least another distributed reflective feature; and the frame defines a transfer chamber, and the controller 199 controls, via the feedback data from the registered image, the substrate transport apparatus guiding the end effector so as to move the wafer relative to the transfer chamber, and place theAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 wafer through a substrate transport opening, of the transfer chamber, in a processing module communicating with the transfer chamber via the substrate transport opening.

[0120] Referring to Figs. 1-14 and 16, an exemplary method includes providing a substrate processing apparatus 100, 200, 300, 400 (Fig.16, Block 16000) having a frame 118M, the substrate transport apparatus (as described herein). For example, the substrate transport apparatus includes a body 1510 supported above the frame 118M and an end effector 1520 with a wafer holding station SHS. The end effector is configured to hold a wafer S at the wafer holding station SHS and transport the wafer S within the substrate processing apparatus 100, 200, 300, 400. The body 1510 may have a size and shape. The method may include providing the reflective pattern 1222RP (Fig. 16, Block 16010) connected to the substrate transport apparatus (such as to the body 1510 and / or end effector 1520). The reflective pattern 1222RP has an unique configuration so as to uniquely identify the substrate transport apparatus (e.g., a wafer handler 1500 thereof), from each other different substrate transport apparatus (e.g., different wafer handlers 1500 of the same or different substrate transport apparatus) with a different unique identity, and the configuration of the reflective pattern 1222RP characterizes a pose of the body 1510 or a dimension of the size and shape of the body 1510. The reflective pattern 1222RP is imaged (Fig.16, Block 16020) with the at least one camera(s) 1112, which at least one camera(s) 1112 may be connected to the frame 118M and the at least one camera 1112 may be separated from the reflective pattern 1222RP by a transparent isolation wall SW. The controller 199 is communicably connected to the at least one camera(s) 1112 and registers (such as in a memory accessible by the controller) the image (Fig. 16, Block 16030). The controller resolves, from the reflective pattern 1222RP embodied in the image, the pose of the body 1510, and the unique identity of the substrate transport apparatus 1599, 1599R (or the body or each body thereof) from a common image of the reflective pattern 1222RP registered by the controller 199, wherein the pose informs feedback data to the controller 199 that defines a position, characterized with one, two, three, four, five or six degrees of freedom, of the body 1510 or wafer holding station SHS of the identified substrate transport apparatus 1599, 1599R, or the wafer S transported by the identified substrate transport apparatus 1599, 1599R,Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 relative to the frame 118M, and wherein the controller 199 is configured generate from the feedback data control inputs to the drive system DS, coupled to the body 1510, so as to control, with one, two, three, four, five or six degrees of freedom, position, trajectory and attitude of the body 1510, the wafer holding station SHS, or the wafer S relative to the frame 118M (Fig. 16, Block 16040).

[0121] In accordance with the present disclosure, the method includes one or more of the following, individually, in any combination with each other, and / or in any combination with the features described above: resolving, with the controller 199, from the reflective pattern embodied in the image, a variance in the dimension from an intrinsic change in the size and shape of the body 1510; the pose is characterized with one, two, three, four, five or six degrees of freedom, and the variance in dimension is characterized in at least one degree of freedom; the substrate transport apparatus 1599, 1599R is a vacuum substrate transport apparatus; the frame 118M defines a transport chamber 118 holding a vacuum environment (or any sutiable sealed processing environment), and the body 1510 is located in the transfer chamber 118; the reflective pattern 1222RP is located in the transfer chamber 118 and the at least one camera 1112 is: located in the transfer chamber 118, or separated from the vacuum environment by the transparent isolation wall SW; the at least one camera(s) 1112 images the reflective pattern 1222RP in each position of the body 1510 throughout the transfer chamber 118; driving the body 1510, with a drive section DS of the substrate transport apparatus1599, 1599R, so the wafer holding station SHS is transported throughout a wafer transport plane 1290 of the frame 118M; providing, with the controller 199 connected to the drive section DS, a signal to the drive section DS identifying the resolved pose of a predetermined reference plane, straight line, or point REF of the body 1510 and / or the variance of the size and shape (and / or variance of the dimension of the size and shape) of the body 1510; the wafer holding station SHS has a predetermined center SHSC (see, e.g., at least Fig. 5) in a predetermined relationship to the predetermined reference plane, straight line, or point REF; the at least one camera(s) 1112 is configured to image the reflective pattern 1222RP on the fly, with the substrate transport apparatus 1599, 1599R (e.g., wafer handler 1500 thereof) in motion relativeAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 to the frame 118M; and imaging, with the at least one camera, at least another reflective pattern disposed at a stationary location within the frame, and determining, with the controller, a location of the body relative to the at least another reflective pattern.

[0122] The following are provided in accordance with the present disclosure and may be employed individually, in any combination with each other, and / or in any combination with the features described above.

[0123] A substrate processing apparatus includes: a frame; a substrate transport apparatus that has: a body supported above the frame, and an end effector with a wafer holding station, the end effector being configured to hold a wafer at the wafer holding station and transport the wafer within the substrate processing apparatus, where the body has a size and shape, and the substrate transport apparatus has a predetermined reference plane, straight line, or point with a predetermined relationship to the body and the size and shape of the body; a distributed reflective feature connected to the substrate transport apparatus with a predetermined configuration deterministic of a pose of the predetermined reference plane, straight line, or point, characterized with one, two, three, four, five or six degrees of freedom, the size and shape, or a dimension of the size and shape, or a variance therein; at least one camera connected to the frame and being configured to image the distributed reflective feature, where the at least one camera is separated from the distributed reflective feature by a transparent isolation wall; and a controller communicably connected to the at least one camera and configured to: receive the image, resolve from the distributed reflective feature embodied in the image the pose of the predetermined reference plane, straight line, or point, which pose informs feedback data to the controller that defines a position, characterized with one, two, three, four, five or six degrees of freedom, of the body, wafer holding station or the wafer relative to the frame, and generate from the feedback data control inputs to a drive system, coupled to the body, so as to control, with one, two, three, four, five or six degrees of freedom, position, trajectory and attitude of the body, the wafer holding station, or the wafer, of the substrate transport apparatus, relative to the frame.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287

[0124] The substrate processing apparatus may include one or more of the following, employed individually or in any combination thereof or in any combination with the features described herein: the controller is configured to resolve, from the distributed reflective feature in the image, the variance in the size and shape, and / or variance of the dimension of the size and shape; the substrate transport apparatus is a vacuum substrate transport apparatus; the frame defines a transfer chamber holding a vacuum environment, and the body is located in the transfer chamber; the distributed reflective feature is located in the transfer chamber and the at least one camera is located in the transfer chamber, or separated from the vacuum environment by the transparent isolation wall; the at least one camera is disposed so as to image the distributed reflective feature in each position of the body throughout the transfer chamber; the distributed reflective feature comprises a vacuum compatible material; the substrate transport apparatus has a drive section drivingly coupled to the body to drive the body so the wafer holding station is transported throughout a wafer transport plane of the frame; the controller is connected to the drive section and configured to provide a signal to the drive section identifying the resolved pose of the predetermined reference plane, straight line, or point, the variance of the size and shape, and / or variance of the dimension of the size and shape of the body; the pose of the predetermined reference plane, straight line, or point resolved from the image is characterized with one, two, three, four, five or six degrees of freedom, the size and shape, or the dimension of the size and shape, or the variance therein; the wafer holding station has a predetermined center in a predetermined relationship to the predetermined reference plane, straight line, or point; the at least one camera is configured to image the distributed reflective feature on the fly, with the substrate transport apparatus in motion relative to the frame; the substrate processing apparatus further comprises at least another distributed reflective feature disposed at a stationary location within the frame so as to be imaged by the at least one camera, where the controller is configured to determine a location of the body relative to the at least another distributed reflective feature; and the frame defines a transfer chamber, and the controller is configured so as to control, via the feedback data from the registered image, the substrate transport apparatus guiding the end effector so as to move the wafer relative to the transfer chamber, and place the wafer through a substrate transport opening, of the transferAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 chamber, in a processing module communicating with the transfer chamber via the substrate transport opening.

[0125] A substrate processing apparatus includes: a frame; a substrate transport apparatus that has a body, supported above the frame, and has an end effector with a wafer holding station, the end effector being configured to hold a wafer at the wafer holding station and transport the wafer within the substrate processing apparatus, and the body has a size and shape, a reflective pattern connected to the substrate transport apparatus, the reflective pattern has an unique configuration so as to uniquely identify the substrate transport apparatus, from each other different substrate transport apparatus with a different unique identity, and the configuration characterizes a pose of the body or a dimension of the size and shape of the body; at least one camera connected to the frame and being configured to image the reflective pattern, where the at least one camera is separated from the reflective pattern by a transparent isolation wall; and a controller communicably connected to the at least one camera to register the image and configured to resolve, from the reflective pattern embodied in the image, the pose of the body, and the unique identity of the substrate transport apparatus from a common image of the reflective pattern registered by the controller, wherein the pose informs feedback data to the controller that defines a position, characterized with one, two, three, four, five or six degrees of freedom, of the body or wafer holding station of the identified substrate transport apparatus, or the wafer transported by the identified substrate transport apparatus, relative to the frame; and wherein the controller is configured generate from the feedback data control inputs to a drive system, coupled to the body, so as to control, with one, two, three, four, five or six degrees of freedom, position, trajectory and attitude of the body, the wafer holding station, or the wafer relative to the frame.

[0126] The substrate processing apparatus may include one or more of the following, employed individually or in any combination thereof or in any combination with the features described herein: the controller is configured to resolve, from the reflective pattern embodied in the image, a variance in the dimension from an intrinsic change in the size and shape of the body; the pose is characterized with one, two, three, four, five or six degrees of freedom, and the variance inAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 dimension is characterized in at least one degree of freedom; the substrate transport apparatus is a vacuum substrate transport apparatus; the frame defines a transfer chamber holding a vacuum environment, and the body is located in the transfer chamber; the reflective pattern is located in the transfer chamber and the at least one camera is: located in the transfer chamber, or separated from the vacuum environment by the transparent isolation wall; the at least one camera is disposed so as to image the reflective pattern in each position of the body throughout the transfer chamber; the reflective pattern comprises a vacuum compatible material; the substrate transport apparatus has a drive section drivingly coupled to the body to drive the body so the wafer holding station is transported throughout a wafer transport plane of the frame; the controller is connected to the drive section and configured to provide a signal to the drive section identifying the resolved pose of the predetermined reference plane, straight line, and / or point, the variance of the size and shape, and / or the variance of the dimension of the size and shape; the wafer holding station has a predetermined center in a predetermined relationship to the predetermined reference plane, straight line, or point; the at least one camera is configured to image the reflective pattern on the fly, with the substrate transport apparatus in motion relative to the frame and the substrate processing apparatus further comprises at least another reflective pattern disposed at a stationary location within the frame so as to be imaged by the at least one camera, where the controller is configured to determine a location of the body relative to the at least another reflective pattern.

[0127] A method includes: providing a substrate processing apparatus having: a frame, and a substrate transport apparatus that has: a body supported above the frame, and an end effector with a wafer holding station, the end effector being configured to hold a wafer at the wafer holding station and transport the wafer within the substrate processing apparatus, where the body has a size and shape, and the substrate transport apparatus has a predetermined reference plane, straight line, or point with a predetermined relationship to the body and the size and shape of the body; providing a distributed reflective feature connected to the substrate transport apparatus with a predetermined configuration deterministic of a pose of the predetermined reference plane, straight line, or point, characterized with one, two, three, four, five or six degrees of freedom, the size and shape, or aAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 variance therein; imaging the distributed reflective feature with at least one camera connected to the frame, where the at least one camera is separated from the distributed reflective feature by a transparent isolation wall; receiving the image with a controller, the controller being communicably connected to the at least one camera; resolving, with the controller, from the distributed reflective feature embodied in the image the pose of the predetermined reference plane, straight line, or point, which pose informs feedback data to the controller that defines a position, characterized with one, two, three, four, five or six degrees of freedom, of the body, wafer holding station or the wafer relative to the frame, and generate from the feedback data control inputs to a drive system, coupled to the body, so as to control, with one, two, three, four, five or six degrees of freedom, position, trajectory and attitude of the body, the wafer holding station, or the wafer, of the substrate transport apparatus, relative to the frame.

[0128] The method may include one or more of the following, employed individually or in any combination thereof or in any combination with the features described herein: resolving, with the controller, from the distributed reflective feature in the image, the variance in the size and shape, and / or variance of the dimension of the size and shape of the body; the substrate transport apparatus is a vacuum substrate transport apparatus; the frame defines a transfer chamber holding a vacuum environment, and the body is located in the transfer chamber; the distributed reflective feature is located in the transfer chamber and the at least one camera is: located in the transfer chamber, or separated from the vacuum environment by the transparent isolation wall; the at least one camera is disposed so as to image the distributed reflective feature in each position of the body throughout the transfer chamber; the distributed reflective feature comprises a vacuum compatible material; driving the body, with a drive section of the substrate transport apparatus, so the wafer holding station is transported throughout a wafer transport plane of the frame; providing, with the controller connected to the drive section, a signal to the drive section identifying the resolved pose of the predetermined reference plane, straight line, or point, the size and shape, and / or the variance therein; the pose of the predetermined reference plane, straight line, or point resolved from the image is characterized with one, two, three, four, five or six degrees of freedom, and the varianceAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 in size and shape is characterized in at least one degree of freedom; the wafer holding station has a predetermined center in a predetermined relationship to the predetermined reference plane, straight line, or point; the at least one camera images the distributed reflective feature on the fly, with the substrate transport apparatus in motion relative to the frame; imaging, with the at least one camera, at least another distributed reflective feature disposed at a stationary location within the frame, and determining, with the controller, a location of the body relative to the at least another distributed reflective feature; and the frame defines a transfer chamber, and the controller controls, via the feedback data from the registered image, the substrate transport apparatus guiding the end effector so as to move the wafer relative to the transfer chamber, and place the wafer through a substrate transport opening, of the transfer chamber, in a processing module communicating with the transfer chamber via the substrate transport opening.

[0129] A method includes: providing a substrate processing apparatus having: a frame, and a substrate transport apparatus that has a body, supported above the frame, and has an end effector with a wafer holding station, the end effector being configured to hold a wafer at the wafer holding station and transport the wafer within the substrate processing apparatus, and the body has a size and shape; providing a reflective pattern connected to the substrate transport apparatus, the reflective pattern has an unique configuration so as to uniquely identify the substrate transport apparatus, from each other different substrate transport apparatus with a different unique identity, and the configuration characterizes a pose of the body or a dimension of the size and shape of the body; imaging the reflective pattern with at least one camera connected to the frame, where the at least one camera is separated from the reflective pattern by a transparent isolation wall; registering the image with a controller communicably connected to the at least one camera; and resolving, with the controller from the reflective pattern embodied in the image, the pose of the body, and the unique identity of the substrate transport apparatus from a common image of the reflective pattern registered by the controller, wherein the pose informs feedback data to the controller that defines a position, characterized with one, two, three, four, five or six degrees of freedom, of the body or wafer holding station of the identified substrate transport apparatus, or the waferAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 transported by the identified substrate transport apparatus, relative to the frame; and wherein the controller is configured generate from the feedback data control inputs to a drive system, coupled to the body, so as to control, with one, two, three, four, five or six degrees of freedom, position, trajectory and attitude of the body, the wafer holding station, or the wafer relative to the frame.

[0130] The method may include one or more of the following, employed individually or in any combination thereof or in any combination with the features described herein: resolving, with the controller, from the reflective pattern embodied in the image, a variance in the dimension from an intrinsic change in the size and shape of the body; the pose is characterized with one, two, three, four, five or six degrees of freedom, and the variance in dimension is characterized in at least one degree of freedom; the substrate transport apparatus is a vacuum substrate transport apparatus; the frame defines a transfer chamber holding a vacuum environment, and the body is located in the transfer chamber; the reflective pattern is located in the transfer chamber and the at least one camera is: located in the transfer chamber, or separated from the vacuum environment by the transparent isolation wall; the at least one camera images the reflective pattern in each position of the body throughout the transfer chamber; the reflective pattern comprises a vacuum compatible material; driving the body, with a drive section of the substrate transport apparatus, so the wafer holding station is transported throughout a wafer transport plane of the frame; providing, with the controller connected to the drive section, a signal to the drive section identifying the resolved pose of a predetermined reference plane, straight line, or point, the size and shape, and / or the variance therein; the wafer holding station has a predetermined center in a predetermined relationship to the predetermined reference plane, straight line, or point; the at least one camera is configured to image the reflective pattern on the fly, with the substrate transport apparatus in motion relative to the frame; and imaging, with the at least one camera, at least another reflective pattern disposed at a stationary location within the frame, and determining, with the controller, a location of the body relative to the at least another reflective pattern.

[0131] It should be understood that the foregoing description is only illustrative of the present disclosure. Various alternatives and modifications can be devised by those skilled in the artAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 without departing from the present disclosure. Accordingly, the present disclosure is intended to embrace all such alternatives, modifications and variances that fall within the scope of any claims appended hereto. Further, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be advantageously used, such a combination remaining within the scope of the present disclosure.

[0132] What is claimed is:

Claims

Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 CLAIMS 1. A substrate processing apparatus comprising: a frame; a substrate transport apparatus that has: a body supported above the frame, and an end effector with a wafer holding station, the end effector being configured to hold a wafer at the wafer holding station and transport the wafer within the substrate processing apparatus, where the body has a size and shape, and the substrate transport apparatus has a predetermined reference plane, straight line, or point with a predetermined relationship to the body and the size and shape of the body; a distributed reflective feature connected to the substrate transport apparatus with a predetermined configuration deterministic of a pose of the predetermined reference plane, straight line, or point, characterized with one, two, three, four, five or six degrees of freedom, the size and shape, or a dimension of the size and shape, or a variance therein; at least one camera connected to the frame and being configured to image the distributed reflective feature, where the at least one camera is separated from the distributed reflective feature by a transparent isolation wall; and a controller communicably connected to the at least one camera and configured to: receive the image, resolve from the distributed reflective feature embodied in the image the pose of the predetermined reference plane, straight line, or point, which pose informs feedback data to the controller that defines a position, characterized with one, two, three, four, five or sixAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 degrees of freedom, of the body, wafer holding station or the wafer relative to the frame; and generate from the feedback data control inputs to a drive system, coupled to the body, so as to control, with one, two, three, four, five or six degrees of freedom, position, trajectory and attitude of the body, the wafer holding station, or the wafer, of the substrate transport apparatus, relative to the frame.

2. The substrate processing apparatus of claim 1, wherein the controller is configured to resolve, from the distributed reflective feature in the image, the variance in the size and shape, and / or variance of the dimension of the size and shape.

3. The substrate processing apparatus of claim 1, wherein the substrate transport apparatus is a vacuum substrate transport apparatus.

4. The substrate processing apparatus of claim 1, wherein the frame defines a transfer chamber holding a vacuum environment, and the body is located in the transfer chamber.

5. The substrate processing apparatus of claim 4, wherein the distributed reflective feature is located in the transfer chamber and the at least one camera is located in the transfer chamber, or separated from the vacuum environment by the transparent isolation wall.

6. The substrate processing apparatus of claim 4, wherein the at least one camera is disposed so as to image the distributed reflective feature in each position of the body throughout the transfer chamber.

7. The substrate processing apparatus of claim 1, wherein the distributed reflective feature comprises a vacuum compatible material.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 8. The substrate processing apparatus of claim 1, wherein the substrate transport apparatus has a drive section drivingly coupled to the body to drive the body so the wafer holding station is transported throughout a wafer transport plane of the frame.

9. The substrate processing apparatus of claim 8, wherein the controller is connected to the drive section and configured to provide a signal to the drive section identifying the resolved pose of the predetermined reference plane, straight line, or point, the variance of the size and shape, and / or variance of the dimension of the size and shape of the body.

10. The substrate processing apparatus of claim 1, wherein the pose of the predetermined reference plane, straight line, or point resolved from the image is characterized with one, two, three, four, five or six degrees of freedom, the size and shape, or the dimension of the size and shape, or the variance therein.

11. The substrate processing apparatus of claim 1, wherein the wafer holding station has a predetermined center in a predetermined relationship to the predetermined reference plane, straight line, or point.

12. The substrate processing apparatus of claim 1, wherein the at least one camera is configured to image the distributed reflective feature on the fly, with the substrate transport apparatus in motion relative to the frame.

13. The substrate processing apparatus of claim 1, further comprising at least another distributed reflective feature disposed at a stationary location within the frame so as to be imaged by the at least one camera, where the controller is configured to determine a location of the body relative to the at least another distributed reflective feature.

14. The substrate processing apparatus of claim 1, wherein the frame defines a transfer chamber, and the controller is configured so as to control, via the feedback data from the registered image, the substrate transport apparatus guiding the end effector so as to move the wafer relativeAtty. Docket No.390P017142-WO (EQV) / BR3076,3287 to the transfer chamber, and place the wafer through a substrate transport opening, of the transfer chamber, in a processing module communicating with the transfer chamber via the substrate transport opening.

15. A substrate processing apparatus comprising: a frame; a substrate transport apparatus that has: a body, supported above the frame, and an end effector with a wafer holding station, the end effector being configured to hold a wafer at the wafer holding station and transport the wafer within the substrate processing apparatus, and the body has a size and shape, a reflective pattern connected to the substrate transport apparatus, the reflective pattern has an unique configuration so as to uniquely identify the substrate transport apparatus, from each other different substrate transport apparatus with a different unique identity, and the configuration characterizes a pose of the body or a dimension of the size and shape of the body; at least one camera connected to the frame and being configured to image the reflective pattern, where the at least one camera is separated from the reflective pattern by a transparent isolation wall; and a controller communicably connected to the at least one camera to register the image and configured to resolve, from the reflective pattern embodied in the image, the pose of the body, and the unique identity of the substrate transport apparatus from a common image of the reflective pattern registered by the controller; wherein:Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 the pose informs feedback data to the controller that defines a position, characterized with one, two, three, four, five or six degrees of freedom, of the body or wafer holding station of the identified substrate transport apparatus, or the wafer transported by the identified substrate transport apparatus, relative to the frame, and the controller is configured generate from the feedback data control inputs to a drive system, coupled to the body, so as to control, with one, two, three, four, five or six degrees of freedom, position, trajectory and attitude of the body, the wafer holding station, or the wafer relative to the frame.

16. The substrate processing apparatus of claim 15, wherein the controller is configured to resolve, from the reflective pattern embodied in the image, a variance in the dimension from an intrinsic change in the size and shape of the body.

17. The substrate processing apparatus of claim 15, wherein the pose is characterized with one, two, three, four, five or six degrees of freedom, and the variance in dimension is characterized in at least one degree of freedom.

18. The substrate processing apparatus of claim 15, wherein the substrate transport apparatus is a vacuum substrate transport apparatus.

19. The substrate processing apparatus of claim 15, wherein the frame defines a transfer chamber holding a vacuum environment, and the body is located in the transfer chamber.

20. The substrate processing apparatus of claim 19, wherein the reflective pattern is located in the transfer chamber and the at least one camera is: located in the transfer chamber, or separated from the vacuum environment by the transparent isolation wall.Atty. Docket No.390P017142-WO (EQV) / BR3076,3287 21. The substrate processing apparatus of claim 19, wherein the at least one camera is disposed so as to image the reflective pattern in each position of the body throughout the transfer chamber.

22. The substrate processing apparatus of claim 15, wherein the reflective pattern comprises a vacuum compatible material.

23. The substrate processing apparatus of claim 15, wherein the substrate transport apparatus has a drive section drivingly coupled to the body to drive the body so the wafer holding station is transported throughout a wafer transport plane of the frame.

24. The substrate processing apparatus of claim 23, wherein the controller is connected to the drive section and configured to provide a signal to the drive section identifying the resolved pose of the predetermined reference plane, straight line, and / or point, the variance of the size and shape, and / or the variance of the dimension of the size and shape.

25. The substrate processing apparatus of claim 15, wherein the wafer holding station has a predetermined center in a predetermined relationship to the predetermined reference plane, straight line, or point.

26. The substrate processing apparatus of claim 15, wherein the at least one camera is configured to image the reflective pattern on the fly, with the substrate transport apparatus in motion relative to the frame and the substrate processing apparatus further comprises at least another reflective pattern disposed at a stationary location within the frame so as to be imaged by the at least one camera, where the controller is configured to determine a location of the body relative to the at least another reflective pattern.

Images