Laser processing apparatus

Abstract

A laser processing apparatus, comprising a base (100), a laser processing head (200) and a second laser emitter (400). The laser processing head is arranged on the base and comprises a first laser emitter (300) and an optical module (220). The first laser emitter is configured to emit a first laser beam, and the optical module is configured to receive the first laser beam and output the first laser beam to a workpiece. The second laser emitter is at least partially arranged on the base and configured to output a second laser beam, and the optical module is configured to receive the second laser beam and output the second laser beam to the workpiece. The laser processing apparatus has a simplified internal structure of laser processing, and improves the structural stability of the whole apparatus.

Description

Laser processing equipment

[0001] This application claims priority to Chinese Patent Application No. 202510300930.7, filed on March 13, 2025, entitled "Laser Processing Equipment", and Chinese Patent Application No. 202410498032.2, filed on April 24, 2025, entitled "Laser Processing Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of laser processing technology, specifically to a laser processing device. Background Technology

[0003] Laser processing equipment uses high-energy laser beams to cut, weld, engrave, and heat-treat materials or their surfaces. The processing head of a laser processing machine does not directly contact the workpiece, minimizing damage. Furthermore, the high energy and small spot size of the laser result in high processing efficiency.

[0004] Portable laser processing equipment in related technologies uses a laser processing head to emit a laser beam onto the work area. The laser processing head is usually attached to the upper part of the base and generally includes many components such as a laser emitter and a heat dissipation structure. Therefore, the size and weight of the laser processing head are often relatively large, which makes the equipment prone to instability. Summary of the Invention

[0005] To address the aforementioned technical problems, one objective of this application is to overcome the shortcomings of existing technologies and provide a laser processing device that simplifies the internal structure of the processing head, reduces its weight, and makes the overall structure more stable. To solve the aforementioned technical problems, this application adopts the following technical solution:

[0006] A laser processing apparatus includes: a base, a laser processing head, and a second laser emitter. The laser processing head is disposed on the base and includes a first laser emitter and an optical module. The first laser emitter emits a first laser beam, and the optical module receives the first laser beam and outputs it to a workpiece. The second laser emitter is at least partially disposed on the base and outputs a second laser beam. The optical module receives the second laser beam and outputs it to the workpiece.

[0007] In some embodiments, the base includes a worktable and a support frame connected to each other, the worktable being used to carry a workpiece; a laser processing head is connected to the support frame and disposed opposite to the worktable; and at least a portion of a second laser emitter is mounted on the support frame.

[0008] In some embodiments, the second laser emitter includes a laser emitting body, a laser output head, and an optical fiber. The laser emitting body is mounted on a support frame, the laser output head is mounted inside a laser processing head, and the laser emitting body is connected to the laser output head via an optical fiber.

[0009] In some embodiments, the laser processing head is slidable relative to the support frame, the laser emitting body is disposed on the support frame and can slide relative to the support frame, and the laser processing head and the laser emitting body can slide synchronously relative to the support frame.

[0010] In some embodiments, the laser processing head further includes a mounting platform, on which the first laser emitter, the laser output head, and the optical module are mounted; the laser processing equipment further includes a mounting base, which is slidably disposed on a support frame, the laser emitting body is mounted on the mounting base, and the mounting platform is fixedly connected to the mounting base.

[0011] In some embodiments, the mounting base includes a mounting plate and two sliding plates respectively connected to both sides of the mounting plate. The laser emitting body is mounted on the mounting plate, and the two sliding plates are slidably connected to the support frame.

[0012] In some embodiments, the mounting platform is provided with two connecting plates corresponding to the two sliding plates, and each connecting plate is detachably connected to the corresponding sliding plate.

[0013] In some embodiments, a stepped surface is formed at the middle position of the connecting plate, and the stepped surface abuts against the upper end surface of the sliding plate.

[0014] In some embodiments, the mounting plate has a groove, and the upper portion of the connecting plate engages with the groove.

[0015] In some embodiments, the mounting platform includes a main board body and a vertical plate connected to the edge of the main board body, the connecting plate being disposed on one side of the vertical plate and perpendicular to the vertical plate.

[0016] In some embodiments, there is a gap between the connecting plate and the vertical plate, and the upper end of the mounting plate is engaged in the gap.

[0017] In some embodiments, the support frame forms an accommodating space, the mounting base is slidably connected to the support frame and can be accommodated within the accommodating space, and the laser emitting body is mounted on the mounting base and can be accommodated within the accommodating space.

[0018] In some embodiments, the laser processing equipment further includes a drive assembly disposed on a support frame and drivenly connected to a mounting base to drive the mounting base to slide relative to the support frame.

[0019] In some embodiments, the drive assembly includes a drive motor and a lead screw. The drive motor is located at the bottom of the support frame, the extension direction of the lead screw is parallel to the sliding direction of the mounting base, and one end of the lead screw is connected to the drive shaft of the drive motor. The mounting base is provided with a sliding sleeve that is threadedly connected to the lead screw.

[0020] In some embodiments, the optical module includes a reflector assembly and a galvanometer assembly. The reflector assembly is configured corresponding to the first laser emitter and the laser output head, and is used to receive the first laser beam and / or the second laser beam and reflect it to the galvanometer assembly. The galvanometer assembly is configured corresponding to the reflector assembly, and is used to receive the first laser beam and / or the second laser beam output by the reflector assembly, and deflect the first laser beam and / or the second laser beam before outputting it to the workpiece, so that the first laser beam and / or the second laser beam can move on the workpiece.

[0021] In some embodiments, the reflector assembly includes a first reflector, a second reflector, and a beam combiner. The first reflector is disposed corresponding to the first laser emitter and is used to reflect a first laser beam to the beam combiner. The second reflector is disposed corresponding to the second laser emitter and is used to reflect a second laser beam to the beam combiner. The beam combiner is used to reflect the first laser beam reflected by the first reflector to the galvanometer assembly and to transmit the second laser beam reflected by the second reflector to the galvanometer assembly.

[0022] In some embodiments, the first laser beam and the second laser beam are different types of beams; and / or, the first laser beam and the second laser beam are beams with different powers.

[0023] In some embodiments, the first laser emitter is a semiconductor laser, and the second laser emitter is a fiber laser.

[0024] In some embodiments, the laser processing equipment further includes a control device, which includes a display screen, a first button, a second button, and a third button. The first button is used to control the laser processing head to rise, the second button is used to control the laser processing head to fall, and the third button is used to control the laser processing head to start or pause processing.

[0025] In some embodiments, the laser processing equipment further includes an outer cover slidably connected to the base, the outer cover being capable of filtering the first laser beam and the second laser beam.

[0026] As can be seen from the above technical solution, this application has at least the following advantages and positive effects:

[0027] In this application, the laser processing equipment includes a first laser emitter and a second laser emitter. By setting the type and / or power of the laser beams emitted by the first and second laser emitters, the laser processing equipment can emit different types of laser beams and / or laser beams of different powers, thereby better meeting the user's needs for processing workpieces of more diverse materials and for processing beams of different powers. Mounting the first laser emitter on the laser processing head and at least partially mounting the second laser emitter on the base reduces the weight of the laser processing head, simplifies its internal structure, frees up space, and facilitates the layout of internal heat dissipation, wiring, and other structures. Simultaneously, mounting the second laser emitter at least partially on the base shifts the center of gravity of the entire equipment downwards from the laser processing head, improving the stability of the overall structure. Attached Figure Description

[0028] Figure 1 is a schematic diagram of the structure of a laser processing device according to an embodiment of this application.

[0029] Figure 2 is a schematic diagram of the laser processing equipment shown in Figure 1 without its outer casing.

[0030] Figure 3 is a side view of the structure shown in Figure 2.

[0031] Figure 4 is a schematic diagram of the internal structure of the laser processing head and support frame in the structure shown in Figure 3.

[0032] Figure 5 is a schematic diagram of the installation of the first laser emitter and the second laser emitter in the structure shown in Figure 4.

[0033] Figure 6 is an exploded view of the structure shown in Figure 5.

[0034] Figure 7 is a schematic diagram of the galvanometer assembly in the structure shown in Figure 6.

[0035] Figure 8 is a schematic diagram of the connection between the mounting base and the support frame in the structure shown in Figure 4.

[0036] Figure 9 is a schematic diagram showing the connection between the mounting base and the mounting platform in the structure shown in Figure 6.

[0037] Figure 10 is an exploded view of the connection between the mounting base and the mounting platform in the structure shown in Figure 9.

[0038] Figure 11 is a three-dimensional schematic diagram of the control device in the structure shown in Figure 1.

[0039] Figure 12 is a front view of the control device shown in Figure 11.

[0040] The reference numerals in the attached drawings are explained as follows: 100-Base; 110-Worktable; 120-Support frame; 121-Accommodation space; 130-Mounting base; 131-Mounting plate; 131a-Groove; 132-Sliding plate; 133-Sliding sleeve; 200-Laser processing head; 210-Mounting platform; 211-Connecting plate; 211a-Upper part; 211b-Lower part; 211c-Step surface; 212-Main body; 213-Vertical plate; 220-Optical module; 221-Reflector assembly; 221a-First reflector; 221b-Second reflector; 221c-Beam combiner; 222-Galvanometer assembly; 222a-First galvanometer; 222b-Second galvanometer; 222c-First drive component; 222d-Second drive component; 300-First laser emitter; 400 - Second laser emitter; 410 - Laser emitting body; 420 - Laser output head; 430 - Optical fiber; 500 - Drive assembly; 510 - Drive motor; 520 - Lead screw; 600 - Outer casing; 700 - Control device; 710 - Display screen; 720 - First button; 730 - Second button; 740 - Third button. Detailed Implementation

[0041] Typical embodiments embodying the features and advantages of this application will be described in detail in the following description. It should be understood that this application can have various variations in different embodiments, all of which do not depart from the scope of this application, and the descriptions and illustrations therein are for illustrative purposes only and not intended to limit this application.

[0042] In the description of this application, it should be understood that, in the embodiments shown in the accompanying drawings, the indications of direction or positional relationships (such as up, down, left, right, front, and back) are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the accompanying drawings. If the description of the positions of these elements changes, these directional indications also change accordingly.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] Please refer to Figures 1 to 4. The laser processing equipment of this application embodiment includes a base 100, a laser processing head 200 disposed on the base 100, a first laser emitter 300 and an optical module 220 disposed within the laser processing head 200, and a second laser emitter 400 at least partially disposed on the base 100. The first laser emitter 300 is used to emit a first laser beam, and the optical module 220 is used to receive the first laser beam and output it to the workpiece. The second laser emitter 400 is used to output a second laser beam, and the optical module 220 is also used to receive the second laser beam and output it to the workpiece.

[0045] By setting the type and / or power of the laser beams emitted by the first laser emitter 300 and the second laser emitter 400, the laser processing equipment can emit different types of laser beams and / or laser beams of different powers, thereby better meeting the user's needs for processing more workpieces of different materials and for processing beams of different powers.

[0046] Furthermore, mounting the first laser emitter 300 on the laser processing head 200 and at least partially mounting the second laser emitter 400 on the base 100 effectively reduces the weight of the laser processing head 200, simplifies its internal structure, and frees up space for the layout of internal heat dissipation, wiring, and other structures. Simultaneously, mounting the second laser emitter 400 at least partially on the base 100 lowers the center of gravity of the entire device, improving the overall stability of the machine's architecture.

[0047] In some embodiments, the first laser beam and the second laser beam are different types of beams. That is, the first laser emitter 300 and the second laser emitter 400 can emit different types of laser beams respectively. For example, the first laser beam can be blue light with a wavelength range of 400nm to 500nm; the second laser beam can be red light with a wavelength range of 620nm to 760nm. As another example, the second laser beam can be infrared light. Since different types of laser beams are suitable for processing different types of consumables, the user can select the corresponding laser beam according to the type of consumable.

[0048] In some embodiments, the first laser emitter 300 and the second laser emitter 400 can also emit the same type of laser beam, and the power of the first laser beam and the second laser beam can be the same or different. Users can select laser beams with different processing powers to process workpieces by separately activating the first laser emitter 300 or the second laser emitter 400. Alternatively, users can simultaneously activate the first laser emitter 300 and the second laser emitter 400; the superposition of the laser beams emitted by the two laser emitters can generate a higher-power laser, thereby meeting the user's need for a higher-power laser.

[0049] In some embodiments, the first laser beam and the second laser beam are beams with different powers. For example, the power of the first laser beam is less than the power of the second laser beam. It is understood that lasers with higher power are generally larger and more complex in structure. Therefore, partially mounting the second laser emitter 400, which emits a higher power laser beam, on the base 100 can effectively reduce the weight of the laser processing head 200 and simplify its structure.

[0050] In some embodiments, the first laser emitter 300 can be a commonly used laser suitable for laser processing, such as a ruby ​​laser, a YAG laser, or a semiconductor laser. The second laser emitter 400 can be a fiber laser. Since fiber lasers are generally large in size and weight, placing at least part of the fiber laser structure on the base 100 can effectively reduce the weight of the laser processing head 200, which is beneficial for the miniaturization and lightweight design of the laser processing head 200.

[0051] Please refer to Figures 3 and 4. In some embodiments, the machine base 100 includes a worktable 110 and a support frame 120 connected together. The worktable 110 is used to support the workpiece to be processed. The support frame 120 may be integrally formed with the worktable 110, or the support frame 120 may be fixedly connected to the worktable 110 by screws.

[0052] The laser processing head 200 is connected to the support frame 120, and the laser processing head 200 is disposed opposite to the worktable 110. At least a portion of the second laser emitter 400 is mounted on the support frame 120. In this embodiment, mounting at least a portion of the second laser emitter 400 on the support frame 120 allows this portion of the second laser emitter 400 to be closer to the laser processing head 200, facilitating the output of the second laser beam from the second laser emitter 400 through the optical module 220 within the laser processing head 200 to the workpiece on the worktable 110.

[0053] Referring to Figures 4 and 5, in some embodiments, the second laser emitter 400 includes a laser emitting body 410, a laser output head 420, and an optical fiber 430. The laser emitting body 410 is mounted on a support frame 120, and the laser output head 420 is mounted inside the laser processing head 200. The laser emitting body 410 is connected to the laser output head 420 via the optical fiber 430. The laser emitting body 410 is the energy source for the fiber laser and mainly includes a light source generator (used to generate laser light), a laser circuit control module, and a laser amplification module. Because the laser emitting body 410 integrates most of the functional components of the second laser emitter 400, its volume is relatively large and its weight is relatively heavy. The main function of the optical fiber 430 is to provide laser gain, allowing photons to undergo multiple reflections and interference amplification within the fiber, ultimately forming a monochromatic, high-brightness, high-energy, and high-power laser beam. The laser emitter head 420 is connected to the end of the optical fiber 430. It can be a laser output coupler, or the laser emitter head 420 can include an optical isolator for outputting the laser beam, as well as a beam expander module, etc. The laser emitter head 420 is mainly used to isolate, expand, and modulate the laser output from the laser emitting body 410, and then output it to improve the quality of the laser output from the second laser emitter 400.

[0054] In this embodiment, by mounting the laser emitting body 410 on the support frame 120, the large weight and volume of the fiber laser can be avoided from occupying the internal space of the laser processing head 200 and increasing the weight of the laser processing head 200. Therefore, only the laser emitting head 420, which is smaller in weight and volume, needs to be arranged inside the laser processing head 200, resulting in a lighter laser processing head 200 and making it easier to arrange other internal components, which is beneficial to the miniaturization and lightweight design of the laser processing head 200.

[0055] Referring to Figure 1, in some embodiments, the laser processing equipment further includes an outer cover 600, which is slidably connected to the base 100. The outer cover 600 is used to filter the laser beam reflected by the laser processing head 200 during processing of the workpiece. The outer cover 600 can be made of aluminum alloy, stainless steel, carbon fiber composite material, or glass fiber reinforced plastic, etc., which can isolate the outward dispersion of the laser beam, ensuring the safety and stability of the laser processing process.

[0056] In this embodiment, by setting an outer cover 600, during processing, the outer cover 600 can block the laser beam reflected by the laser processing head 200 when processing the workpiece, so that the laser processing equipment is self-protected when used. Therefore, users do not need to wear goggles to effectively prevent laser damage to their eyes, which greatly improves the convenience of using the laser processing equipment. At the same time, the outer cover 600 can also isolate the smoke generated during laser processing to avoid pollution of the processing environment.

[0057] Referring to Figure 6, in some embodiments of this application, the optical module 220 includes a reflector assembly 221 and a galvanometer assembly 222. The reflector assembly 221 is correspondingly configured with the first laser emitter 300 and the laser output head 420, and is used to receive the first laser beam and / or the second laser beam and reflect it to the galvanometer assembly 222. The galvanometer assembly 222 is correspondingly configured with the reflector assembly 221, and is used to receive the first laser beam and / or the second laser beam output from the reflector assembly 221, and deflect the first laser beam and / or the second laser beam before outputting it to the workpiece, so that the first laser beam and / or the second laser beam can move on the workpiece, thereby realizing the processing of different positions of the workpiece.

[0058] For example, as shown in Figure 6, the reflector assembly 221 may include a first reflector 221a, a second reflector 221b, and a beam combiner 221c. The first reflector 221a is correspondingly disposed with the first laser emitter 300 and is used to reflect the first laser beam to the beam combiner 221c. The second reflector 221b is correspondingly disposed with the laser output head 420 and is used to reflect the second laser beam to the beam combiner 221c. The beam combiner 221c is used to reflect the first laser beam reflected by the first reflector 221a to the galvanometer assembly 222, and to transmit the second laser beam reflected by the second reflector 221b to the galvanometer assembly 222. Since the first laser emitter 300 and the laser output head 420 share the beam combiner 221c, the laser beams emitted by the two are combined through the beam combiner 221c and can be output to the galvanometer assembly 222. Therefore, the number of mirrors can be reduced, saving the space required for the reflector assembly 221, making the internal structure of the laser processing head 200 more compact.

[0059] For example, as shown in FIG7, the galvanometer assembly 222 may include a first galvanometer 222a and a second galvanometer 222b, which are respectively rotatable about two mutually perpendicular axes. The first galvanometer 222a is used to receive a first laser beam and / or a second laser beam output from the reflector assembly 221 and reflects the first laser beam and / or the second laser beam to the second galvanometer 222b at a predetermined angle. The second galvanometer 222b reflects the first laser beam and / or the second laser beam received from the first galvanometer 222a onto the workpiece at a predetermined angle.

[0060] In some embodiments, the galvanometer assembly 222 may further include a first driving member 222c and a second driving member 222d. The first driving member 222c is connected to the first galvanometer 222a, and the second driving member 222d is connected to the second galvanometer 222b. The first driving member 222c drives the first galvanometer 222a to deflect around a first axis, and the second driving member 222d drives the second galvanometer 222b to deflect around a second axis. Therefore, in this embodiment, by adjusting the angles of the first galvanometer 222a and the second galvanometer 222b, the position of the output laser beam can be adjusted in the horizontal X and Y directions, thereby allowing the laser beam to act on different positions of the workpiece. For example, deflecting the first galvanometer 222a can change the position of the laser beam output to the second galvanometer 222b, causing the light spot output to the workpiece to move along a first direction, and deflecting the second galvanometer 222b can cause the light spot output to the workpiece to move along a second direction. The first and second directions are perpendicular, and the first axis and the second axis are perpendicular.

[0061] Referring to Figures 4 and 5, in some possible embodiments of this application, the laser processing head 200 can slide relative to the support frame 120, and the laser emitting body 410 is disposed on the support frame 120 and can slide relative to the support frame 120. Furthermore, the laser processing head 200 and the laser emitting body 410 can slide synchronously relative to the support frame 120. By slidably connecting the laser processing head 200 to the support frame 120, the distance between the laser processing head 200 and the worktable 110 can be easily adjusted, thereby allowing for more convenient adjustment of the focal position of the laser processing head 200 and improving the processing effect on the workpiece. By sliding the laser emitting body 410 to the support frame 120 and making the laser emitting body 410 and the laser processing head 200 slide synchronously, it can be ensured that the laser emitting body 410 can move up and down relative to the support frame 120 together with the laser processing head 200. This allows the laser emitting body 410 and the laser output head 420 to move synchronously, thereby ensuring the reliable use of the optical fiber 430, avoiding the pulling of the optical fiber 430, effectively extending the service life of the second laser emitter 400, and improving the overall reliability of the machine.

[0062] As shown in Figure 6, in some embodiments, the laser processing head 200 includes a mounting platform 210, on which the first laser emitter 300, the laser output head 420, and the optical module 220 are all mounted. The laser processing equipment also includes a mounting base 130, which is slidably disposed on the support frame 120. The laser emitting body 410 is mounted on the mounting base 130, and the mounting platform 210 is fixedly connected to the mounting base 130. In this embodiment, when the mounting base 130 slides on the support frame 120, the mounting platform 210 moves up and down with the mounting base 130. Therefore, the first laser emitter 300, the laser output head 420 mounted on the mounting platform 210, and the laser emitting body 410 mounted on the mounting base 130 can move up and down synchronously. This avoids pulling on the optical fiber 430, effectively extends the service life of the second laser emitter 400, and improves the overall reliability of the machine.

[0063] It is understood that in other embodiments, the mounting platform 210 of the laser processing head 200 may be slidably connected to the support frame 120, and the mounting base 130 may be fixedly connected to the mounting platform 210. When the mounting platform 210 moves up and down relative to the support frame 120, the mounting base 130 moves along with the up and down movement of the mounting platform 210.

[0064] As shown in Figure 8, in some possible embodiments of this application, the support frame 120 forms an accommodating space 121, the mounting base 130 is slidably connected to the support frame 120 and can be accommodated within the accommodating space 121, and the laser emitting body 410 is mounted on the mounting base 130 and can be accommodated within the accommodating space 121. By making the support frame 120 hollow to form the accommodating space 121 for accommodating the mounting base 130 and the laser emitting body 410, both the mounting base 130 and the laser emitting body 410 can be hidden inside the support frame 120, thereby effectively reducing the overall size of the device and making the overall structure of the support frame 120 more compact.

[0065] Referring to Figure 8, the laser processing equipment also includes a drive assembly 500, which is disposed on the support frame 120. In some embodiments, the drive assembly 500 may be disposed within the accommodating space 121 of the support frame 120. The drive assembly 500 is drivenly connected to the mounting base 130 for driving the mounting base 130 to slide relative to the support frame 120. For example, the drive assembly 500 may include a drive motor 510 and a lead screw 520. The drive motor 510 is disposed at the bottom position within the support frame 120, and the length direction of the lead screw 520 is parallel to the length direction of the support frame 120. That is, the extension direction of the lead screw 520 is parallel to the sliding direction of the mounting base 130. One end of the lead screw 520 is connected to the drive shaft of the drive motor 510, and the mounting base 130 is provided with a sliding sleeve 133 that is threadedly connected to the lead screw 520. The drive motor 510 drives the lead screw 520 to rotate so that the sliding sleeve 133 moves up and down along the length of the lead screw 520, thereby enabling the mounting base 130 to move up and down along the length of the support frame 120.

[0066] In some embodiments, considering the reliability of the sliding of the mounting base 130 relative to the support frame 120, the support frame 120 is further provided with a guide optical shaft extending along its own length direction. A guide pulley is provided on the mounting base 130 corresponding to the guide optical shaft, and the guide pulley is slidably connected to the guide optical shaft. By providing the guide pulley and guide optical shaft in sliding engagement, guidance is provided for the movement of the mounting base 130 along the length direction of the support frame 120. This improves the smoothness and accuracy of the linear movement of the mounting base 130 and the mounting platform 210 along the length direction of the support frame 120, and reduces wear between the support frame 120 and the mounting base 130.

[0067] As shown in Figure 9, in some embodiments, the mounting base 130 includes a mounting plate 131 and two sliding plates 132 respectively connected to both sides of the mounting plate 131. The laser emitting body 410 is mounted on the mounting plate 131, and the two sliding plates 132 are slidably connected to the support frame 120. In some embodiments, both the mounting plate 131 and the sliding plates 132 can be made of sheet metal. Sheet metal parts are lightweight and have high strength, which helps to improve the strength and rigidity of the mounting base 130.

[0068] As shown in Figure 9, the laser emitting body 410 can be detachably fixed to the mounting plate 131 using fasteners such as screws. Each sliding plate 132 can also be detachably connected to the mounting plate 131 using fasteners such as screws.

[0069] The aforementioned sliding sleeve 133 can be two, with the two sliding sleeves 133 respectively fixed on the two sliding plates 132. Thus, the two sliding plates 132 can be driven to slide up and down along the support frame 120 by the drive motor 510, the lead screw 520 and the sliding sleeve 133, thereby achieving the purpose of the mounting base 130 sliding up and down along the support frame 120.

[0070] The aforementioned guide optical shafts can be two, with each guide optical shaft located on one side of the support frame 120. Correspondingly, two sets of guide pulleys are provided, each set being located on one of the two sliding plates 132, to guide the movement of the two sliding plates 132 relative to the support frame 120, thereby achieving the purpose of guiding the sliding of the mounting base 130 relative to the support frame 120.

[0071] In this embodiment, by mounting the laser emitting body 410 on the mounting plate 131, the installation reliability of the laser emitting body 410 is increased, and the strength and rigidity of the main body of the second laser emitter 400 are improved. In order to reduce the weight of the whole machine, the mounting plate 131 can be provided with weight-reducing holes, thereby reducing the structural weight as much as possible while ensuring structural strength.

[0072] It is understood that in other embodiments, the mounting plate 131 may be omitted. Alternatively, multiple spaced mounting beams may be used to connect the two sliding plates 132, and the laser emitting body 410 may be fixedly connected to the multiple mounting beams.

[0073] Referring to Figure 9, in some embodiments, the mounting platform 210 is provided with two connecting plates 211 corresponding to the two sliding plates 132, and each connecting plate 211 is detachably connected to the corresponding sliding plate 132. Each connecting plate 211 can be detachably connected to the corresponding sliding plate 132 using fasteners such as screws.

[0074] In some embodiments, as shown in FIG10, the connecting plate 211 has an upper portion 211a and a lower portion 211b, wherein the thickness of the lower portion 211b is less than the thickness of the upper portion 211a, such that a stepped surface 211c can be formed at the middle position of the connecting plate 211. The lower portion 211b of the connecting plate 211 is used to connect with the sliding plate 132, and its stepped surface 211c can abut against the upper end surface of the sliding plate 132, thereby improving the connection reliability between the connecting plate 211 and the sliding plate 132.

[0075] In some embodiments, as shown in Figures 9 and 10, the mounting platform 210 includes a main board body 212 and a vertical plate 213 vertically connected to the edge of the main board body 212. A connecting plate 211 protrudes outward and is disposed on one side of the vertical plate 213, and the connecting plate 211 is perpendicular to the vertical plate 213. In some embodiments, the upper portion 211a of the connecting plate 211 is vertically connected to the vertical plate 213, and its lower portion 211b is spaced apart from the vertical plate 213. When the mounting platform 210 is connected and fixed to the mounting base 130, the lower portions 211b of the two connecting plates 211 are connected to the upper ends of the two sliding plates 132 in a one-to-one correspondence. At this time, the stepped surface 211c of each connecting plate 211 can abut against the upper surface of the corresponding sliding plate 132, the upper end of the mounting plate 131 is inserted into the gap between the lower part 211b of the connecting plate 211 and the vertical plate 213, and the outer side of the vertical plate 213 can abut against the mounting plate 131, thereby making the connection between the mounting platform 210 and the mounting base 130 more reliable and less prone to loosening.

[0076] As shown in Figure 10, the upper end of the mounting plate 131 may also be provided with a groove 131a. When the mounting platform 210 is connected and fixed to the mounting base 130, the groove 131a can be used to engage with the lower edge of the upper part 211a of the connecting plate 211.

[0077] To reduce the weight of the laser processing head 200, a weight-reducing hole can be provided on the main body 212, thereby reducing the structural weight as much as possible while ensuring structural strength.

[0078] Referring to Figure 1, in one possible embodiment of this application, the laser processing equipment further includes a control device 700. The control device 700 is used to control the laser processing process of the laser processing equipment. In some embodiments, the control device 700 and the laser processing equipment can be connected via a power cord. For example, the control device 700 and the laser processing equipment are respectively provided with corresponding connection interfaces, and a wired connection is achieved by plugging a power cord into the interface.

[0079] Alternatively, the control device 700 and the laser processing equipment can also be wirelessly connected via WIFI, Bluetooth, or other means.

[0080] In some embodiments, the control device 700 includes a notification module. The notification module may include a buzzer and / or an indicator light. For example, when the control device 700 and the laser processing equipment are successfully connected, the buzzer in the control device 700 sounds to notify the user that the connection has been established.

[0081] Referring to Figure 11, the control device 700 can be a control panel, which includes control buttons and a display screen. It is understood that in other embodiments, the control device 700 can be a touch-screen control display. Alternatively, the control device 700 can be a purely button-based control device.

[0082] For example, as shown in Figure 12, the control panel includes a display screen 710 located on the upper left, a first button 720 and a second button 730 located on the upper right, and a third button 740 located at the bottom. The first button 720 and the second button 730 can be arranged vertically.

[0083] In this embodiment, the control panel includes a display screen 710 located on the upper left, a first button 720 and a second button 730 located on the upper right, and a third button 740 located at the bottom. However, it is not limited to this; the number of buttons on the control panel can be one, two, or more. The display screen and the positions of the buttons on the control panel can also have other arrangements.

[0084] For example, the first button 720 and the second button 730 on the right side of the control panel can be used to control the movement of the laser processing head 200. The first button 720 can be used to control the laser processing head 200 to rise, and the second button 730 can be used to control the laser processing head 200 to fall. The third button 740 on the bottom side of the control panel can be used to send "start processing" or "pause processing" commands to control the laser processing head 200 to start or pause processing.

[0085] The display screen 710 can be a touch screen. In some embodiments, after the control device 700 is successfully connected to the laser processing equipment, the touch screen can display basic information about the laser processing equipment, including the equipment model, machine code, and laser power. The touch screen can also display the current status of the laser processing equipment as online standby or offline standby. Online standby indicates that the laser processing equipment is in a ready state and can start processing at any time; offline standby indicates that the laser processing equipment is in a dormant state and needs to be activated before processing can begin.

[0086] During laser processing, the touchscreen display shows a preview of the pattern being processed. The touchscreen also displays the type of laser being used (blue light or infrared light), the total processing time, and the current processing progress.

[0087] The alert module on the control unit 700 includes indicator lights. These lights flash slowly when the laser processing equipment is in operation.

[0088] When the laser processing equipment detects an internal hardware malfunction, it retrieves a file from its internal memory and sends it to the control device 700. At this time, the touch screen displays a corresponding text message to the user indicating the malfunction, which may include issues such as motor malfunction, laser malfunction, camera malfunction, communication malfunction, cooling fan malfunction, etc.

[0089] In some embodiments, the laser processing equipment also includes a vision acquisition device, such as a camera or a miniature industrial camera. During the laser processing process, the camera can monitor whether the workpiece catches fire. If a fire is detected, the laser processing equipment sends an alarm message to the control device 700, and the touch screen displays an alarm pop-up to alert the user. Simultaneously, the buzzer of the control device 700 emits an audible alert, and the indicator light on the control device 700 flashes rapidly. In this application, the use of the laser processing equipment is made more convenient by setting up the control device 700. The control device 700 allows the user to observe and understand the equipment status and operating conditions of the laser processing equipment in real time. When the equipment status is abnormal, the control device 700 can also issue a timely warning, improving the safety of equipment use.

[0090] The above embodiments are merely illustrative examples of structures. The structures in each embodiment are not fixed combinations. In the absence of structural conflicts, the structures in multiple embodiments can be arbitrarily combined and used.

[0091] Although this application has been described with reference to several typical embodiments, it should be understood that the terminology used is descriptive and exemplary, and not restrictive. Since this application can be embodied in many forms without departing from the spirit or substance of the application, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A laser processing device, comprising: Base; A laser processing head is disposed on the machine base. The laser processing head includes a first laser emitter and an optical module. The first laser emitter is used to emit a first laser beam, and the optical module is used to receive the first laser beam and output it to the workpiece. A second laser emitter is at least partially disposed on the base, the second laser emitter is used to output a second laser beam, and the optical module is used to receive the second laser beam and output it to the workpiece.

2. The laser processing equipment according to claim 1, wherein, The machine base includes a worktable and a support frame connected together, and the worktable is used to support the workpiece; The laser processing head is connected to the support frame and is positioned opposite the worktable, and at least a portion of the second laser emitter is mounted on the support frame.

3. The laser processing equipment according to claim 2, wherein, The second laser emitter includes a laser emitting body, a laser output head, and an optical fiber. The laser emitting body is mounted on the support frame, the laser output head is mounted inside the laser processing head, and the laser emitting body is connected to the laser output head through the optical fiber.

4. The laser processing equipment according to claim 3, wherein, The laser processing head is slidable relative to the support frame, the laser emitting body is disposed on the support frame and can slide relative to the support frame, and the laser processing head and the laser emitting body can slide synchronously relative to the support frame.

5. The laser processing equipment according to claim 4, wherein, The laser processing head also includes a mounting platform, on which the first laser emitter, the laser output head, and the optical module are mounted; The laser processing equipment also includes a mounting base, which is slidably disposed on the support frame. The laser emitting body is mounted on the mounting base, and the mounting platform is fixedly connected to the mounting base.

6. The laser processing equipment according to claim 5, wherein, The mounting base includes a mounting plate and two sliding plates respectively connected to both sides of the mounting plate. The laser emitting body is mounted on the mounting plate, and the two sliding plates are slidably connected to the support frame.

7. The laser processing equipment according to claim 6, wherein, The installation platform is provided with two connecting plates corresponding to the two sliding plates, and each connecting plate is detachably connected to the corresponding sliding plate.

8. The laser processing equipment according to claim 7, wherein, A stepped surface is formed at the middle position of the connecting plate, and the stepped surface abuts against the upper end surface of the sliding plate.

9. The laser processing equipment according to claim 7, wherein, The mounting plate has a groove, and the upper part of the connecting plate is engaged with the groove.

10. The laser processing equipment according to claim 7, wherein, The installation platform includes a main board and a vertical plate connected to the edge of the main board. The connecting plate is disposed on one side of the vertical plate and is perpendicular to the vertical plate.

11. The laser processing equipment according to claim 10, wherein, There is a gap between the connecting plate and the vertical plate, and the upper end of the mounting plate is inserted into the gap.

12. The laser processing equipment according to claim 5, wherein, The support frame forms an accommodating space, the mounting base is slidably connected to the support frame and can be accommodated within the accommodating space, and the laser emitting body is mounted on the mounting base and can be accommodated within the accommodating space.

13. The laser processing equipment according to claim 5, wherein, The laser processing equipment also includes a drive assembly, which is disposed on the support frame and is drivenly connected to the mounting base to drive the mounting base to slide relative to the support frame.

14. The laser processing equipment according to claim 13, wherein, The drive assembly includes a drive motor and a lead screw. The drive motor is located at the bottom of the support frame. The extension direction of the lead screw is parallel to the sliding direction of the mounting base, and one end of the lead screw is connected to the drive shaft of the drive motor. The mounting base is provided with a sliding sleeve that is threadedly connected to the lead screw.

15. The laser processing equipment according to claim 3, wherein, The optical module includes a reflector assembly and a galvanometer assembly. The reflector assembly is configured to correspond to the first laser emitter and the laser output head, and is used to receive the first laser beam and / or the second laser beam and reflect it to the galvanometer assembly. The galvanometer assembly is configured correspondingly to the reflector assembly, and is used to receive the first laser beam and / or the second laser beam output by the reflector assembly, and deflect the first laser beam and / or the second laser beam before outputting it onto the workpiece, so that the first laser beam and / or the second laser beam can move on the workpiece.

16. The laser processing equipment according to claim 15, wherein, The reflector assembly includes a first reflector, a second reflector, and a beam combiner. The first reflector is correspondingly disposed to the first laser emitter and is used to reflect a first laser beam to the beam combiner. The second reflector is correspondingly disposed to the second laser emitter and is used to reflect a second laser beam to the beam combiner. The beam combiner is used to reflect the first laser beam reflected by the first reflector to the galvanometer assembly and to transmit the second laser beam reflected by the second reflector to the galvanometer assembly.

17. The laser processing apparatus according to any one of claims 1 to 16, wherein, The first laser beam and the second laser beam are different types of beams; and / or, The first laser beam and the second laser beam are beams with different powers.

18. The laser processing apparatus according to any one of claims 1 to 16, wherein, The first laser emitter is a semiconductor laser, and the second laser emitter is a fiber laser.

19. The laser processing apparatus according to any one of claims 1 to 16, wherein, The laser processing equipment also includes a control device, which includes a display screen, a first button, a second button, and a third button. The first button is used to control the laser processing head to rise, the second button is used to control the laser processing head to fall, and the third button is used to control the laser processing head to start or pause processing.

20. The laser processing apparatus according to any one of claims 1 to 16, wherein, The laser processing equipment also includes an outer cover, which is slidably connected to the base, and the outer cover can filter the first laser beam and the second laser beam.

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