Method for manufacturing plate body for carrier plate, and carrier plate

Abstract

Disclosed is a method for manufacturing a plate body for a carrier plate. The present invention may comprise the steps of: preparing a first plate body having formed therein a plurality of first through-holes formed by removing, by a predetermined thickness, one surface of a first molded plate body which has recessed in the other surface thereof a plurality of first blind holes each having one end open, and thus opening the respective closed ends of the plurality of first blind holes; preparing a second plate body having formed therein a plurality of second through-holes formed by removing, by a predetermined thickness, one surface of a second molded plate body which has recessed in the other surface thereof a plurality of second blind holes each having one end open, and thus opening the respective closed ends of the plurality of second blind holes; and forming a joined plate body having the first plate body joined to the second plate body by insertedly arranging the first plate body into a joining recess recessed in the one surface of the second plate body corresponding to the first plate body so as to have a plurality of through-holes formed by positioning the plurality of first and second through-holes on the same perpendicular line as each other.

Description

Method for manufacturing a plate body for a carrier plate and a carrier plate

[0001] The present invention relates to a method for manufacturing a plate body for a carrier plate and a carrier plate, and more particularly, to a method for manufacturing a plate body for a carrier plate capable of manufacturing a plate body for a carrier plate having a plurality of through holes formed therein at low cost by post-processing a molded plate body precision-cast by a die-casting process, and to a carrier plate manufactured thereby.

[0002] In general, in order to apply external electrodes to the outer surface of the ends of small chip components such as MLCC (Multi-layer Ceramic Capacitor), inductors, varistors, and condensers, a separate carrier plate is used to apply electrodes to a large number of chip components simultaneously and evenly.

[0003] These carrier plates are plate-shaped structures used to perform electrode application work, which applies electrode material to both ends of chip components while each chip component is positioned in a plurality of support holes formed through the carrier plate using vacuum pressure or a vibrator.

[0004] The basic structure of the carrier plate is that through holes are formed in a plurality of rows and columns in the plate body, and the inner surface of the through holes is coated with a resin material such as silicone to form a support hole that fixes and supports the chip to ensure smooth transport and restraint of the chip component.

[0005] A conventional method of manufacturing a carrier plate may be accomplished by first processing a rectangular plate made of aluminum into a shape, then machining a plurality of through holes, and finally applying a resin such as silicone to the machined through holes to form a support hole.

[0006] Meanwhile, as a processing method for forming a through hole in the plate body, a high-speed processing machine is used to process the hole using one or at most several dozen spindles, and the processing precision of the through hole is determined by the precision of the machine equipment and the degree of the tool guide bushing. In addition, the process of forming hundreds to thousands of through holes in one plate body is very cumbersome, and problems arise in terms of quality assurance of the through hole formed and work productivity.

[0007] (Patent Document 1) KR10-0401068 B1

[0008] The present invention is intended to solve the above-mentioned problem, and the purpose of the present invention is to provide a method for manufacturing a carrier plate body and a carrier plate capable of manufacturing a carrier plate body in which a plurality of through holes are formed by post-processing a molded plate body precision-cast by a die-casting casting process at a low cost.

[0009] The technical tasks to be achieved in the present invention are not limited to the technical tasks mentioned above, and other technical tasks not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0010] According to one aspect of the present invention, there is provided a method for manufacturing a plate body for a carrier plate having a plurality of through holes, comprising: a step of preparing a first plate body having a plurality of first through holes, wherein sealed ends of the plurality of first blind holes are opened, by removing a predetermined thickness from the other surface of a first molded plate body having a plurality of first blind holes recessed into one surface thereof; a step of preparing a second plate body having a plurality of second through holes, wherein sealed ends of the plurality of second blind holes are opened, by removing a predetermined thickness from the other surface of a second molded plate body having a plurality of second blind holes recessed into one surface thereof; and a step of forming a combined plate body in which the first plate body and the second plate body are combined by inserting and arranging the first plate body into a combined groove recessed into the other surface of the second plate body corresponding to the first plate body so as to have a plurality of through holes formed such that the plurality of first and second through holes are positioned on the same vertical line. A method for manufacturing a plate body for a carrier plate, including:

[0011] At this time, the step of forming the combined plate body may include a step of integrating the first plate body and the second plate body by a welding line formed along the outer edge of the first plate body combined with the second plate body.

[0012] At this time, the step of forming the combined plate body may include a step of integrating the first plate body and the second plate body by a bonding material interposed between the inner surface of the combined groove and the outer surface of the first plate body.

[0013] At this time, the step of forming the combined plate body may include a step of integrating the first plate body and the second plate body by at least one fastening member that penetrates one of the first plate body and the second plate body and is fastened to the other plate body.

[0014] At this time, the step of forming the combined plate body may include a step of integrating the first plate body and the second plate body by a close bonding force generated by the outer surface of the first plate body being forcibly fitted to the inner surface of the combined groove.

[0015] At this time, after the step of forming the combined plate body, a resin molding step of forming a support hole for fixing and supporting the chip component by a resin material molded to a certain thickness on the inner surface of the plurality of through holes may be additionally included.

[0016] At this time, the first plate body can form a recessed groove for positioning on the outer edge of each side, and the second plate body can form a positioning member that is inserted corresponding to the positioning groove when combined with the first plate body by protruding on the inner surface of the combined groove.

[0017] According to another aspect of the present invention, a method for manufacturing a plate body for a carrier plate having a plurality of through holes formed therethrough is provided, the method comprising: a step of preparing a pair of laminated plate bodies having a plurality of blind holes formed recessed in one surface of a pair of laminated plate bodies having a plurality of blind holes, one end of which is open, by removing a predetermined thickness from each other surface, thereby forming a pair of laminated plate bodies having a plurality of molding holes formed therethrough, the sealed ends of the plurality of blind holes being open; and a step of forming a laminated plate body by laminating and fixing the pair of laminated plate bodies so that the plurality of molding holes have a plurality of through holes formed such that they are positioned on the same vertical line.

[0018] At this time, the step of forming the laminated plate body may include a step of integrating the pair of laminated plate bodies by at least one fastening member that penetrates one of the pair of laminated plate bodies and is fastened to the other plate body.

[0019] At this time, the step of forming the laminated plate body may include a step of integrating the pair of laminated plates by a welding line formed along a boundary line where the pair of laminated plates are laminated and in contact.

[0020] At this time, the step of forming the laminated plate body may include a step of integrating a pair of laminated plates that are laminated by a bonding material interposed between the pair of laminated plates.

[0021] At this time, after the step of forming the laminated plate body, a resin molding step of forming a support hole for fixing and supporting the chip component by a resin material molded to a certain thickness on the inner surface of the plurality of through holes may be additionally included.

[0022] According to one aspect of the present invention, a first plate body having a plurality of first blind holes formed on one surface thereof, the other surface thereof being removed by a predetermined thickness to form a plurality of first through holes in which the sealed ends of the plurality of first blind holes are opened; a second plate body having a plurality of second through holes in which the sealed ends of the plurality of second blind holes are opened by removing a predetermined thickness to form a plurality of second blind holes on one surface thereof; And a combined plate body in which the first plate body and the second plate body are combined by inserting and arranging the first plate body into a combined groove formed in the other surface of the second plate body corresponding to the first plate body; a carrier plate including a plurality of through holes provided such that the plurality of first through holes and the plurality of second through holes are positioned on the same vertical line, a plurality of support holes formed from a resin material on the inner circumferential surface of each of the plurality of through holes to fix and support a chip component, and a rubber resin layer formed from a resin material on both surfaces of the combined plate body so as to be connected to the plurality of support holes.

[0023] According to another aspect of the present invention, a carrier plate is provided, comprising: a pair of laminated plate bodies having a plurality of molding holes formed by recessing a plurality of blind holes on one surface thereof, by removing a predetermined thickness from each other surface of a pair of laminated plate bodies, thereby forming a plurality of molding holes in which sealed ends of the plurality of blind holes are opened; a laminated plate body in which the pair of laminated plate bodies are laminated and fixed; and a plurality of through holes formed such that the plurality of molding holes of the pair of laminated plate bodies are positioned on the same vertical line, a plurality of support holes formed from a resin material on each inner circumferential surface of the plurality of through holes to fix and support a chip component, and a rubber resin layer formed from a resin material on both surfaces of the laminated plate body so as to be connected to the plurality of support holes.

[0024] According to the above configuration, the method for manufacturing a plate body for a carrier plate according to the present invention comprises a first molding process for forming a molded plate body as a cast product by a die-casting process, a second processing process for polishing the surface of the molded plate body, and an assembly process for integrating or laminating the plates, thereby replacing the machining process using a plurality of drill tools requiring high precision with a casting process and a polishing process or a cutting process, thereby manufacturing a plate body for a carrier plate in which a plurality of through holes are formed through, and a carrier plate using the same, thereby reducing the manufacturing cost and securing price competitiveness.

[0025] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0026] FIG. 1 is a perspective view and a cross-sectional view illustrating a first molded plate body applied to a method for manufacturing a plate body for a carrier plate according to a first embodiment of the present invention.

[0027] FIG. 2 is a perspective view and a cross-sectional view illustrating a first plate body applied to a method for manufacturing a plate body for a carrier plate according to a first embodiment of the present invention.

[0028] FIG. 3 is a perspective view and a cross-sectional view illustrating a second molded plate body applied to a method for manufacturing a plate body for a carrier plate according to the first embodiment of the present invention.

[0029] FIG. 4 is a perspective view and a cross-sectional view illustrating a second plate body applied to a method for manufacturing a plate body for a carrier plate according to the first embodiment of the present invention.

[0030] FIG. 5 is a perspective view and a cross-sectional view showing a state in which a first plate body and a second plate body are arranged in a one-to-one correspondence manner applied to a method for manufacturing a plate body for a carrier plate according to a first embodiment of the present invention.

[0031] FIG. 6 is a perspective view and a cross-sectional view showing a composite plate manufactured in a method for manufacturing a plate for a carrier plate according to a first embodiment of the present invention.

[0032] FIG. 7 is a perspective view and a cross-sectional view of a carrier plate in which a rubber resin layer and a support hole are formed on a composite plate manufactured in a method for manufacturing a plate for a carrier plate according to a first embodiment of the present invention.

[0033] FIGS. 8a and 8b are cross-sectional views illustrating a process for forming a first molded plate body applied to a method for manufacturing a plate body for a carrier plate according to a first embodiment of the present invention.

[0034] FIGS. 9a and 9b are cross-sectional views illustrating a process for forming a second molded plate body applied to a method for manufacturing a plate body for a carrier plate according to the first embodiment of the present invention.

[0035] Fig. 10 is a perspective view showing a method for manufacturing a plate body for a carrier plate according to a first embodiment of the present invention, in which a positioning member is applied.

[0036] FIG. 11 is a perspective view and a cross-sectional view illustrating a laminated molded plate body applied to a method for manufacturing a plate body for a carrier plate according to a second embodiment of the present invention.

[0037] FIG. 12 is a perspective view and a cross-sectional view illustrating a laminated plate body applied to a method for manufacturing a plate body for a carrier plate according to a second embodiment of the present invention.

[0038] FIG. 13 is a perspective view and a cross-sectional view showing a laminated plate body by laminating a pair of laminated plates applied to a method for manufacturing a plate body for a carrier plate according to a second embodiment of the present invention.

[0039] FIG. 14 is a perspective view and a cross-sectional view of a carrier plate in which a rubber resin layer and a support hole are formed on a laminated plate manufactured in a method for manufacturing a plate for a carrier plate according to a second embodiment of the present invention.

[0040] FIG. 15a and FIG. 15b are cross-sectional views illustrating a process for forming a laminated molded plate body applied to a method for manufacturing a plate body for a carrier plate according to a second embodiment of the present invention.

[0041] Hereinafter, a method for manufacturing a plate body for a carrier plate according to an embodiment of the present invention will be described with reference to the drawings.

[0042] <First Embodiment>

[0043] A method for manufacturing a plate body for a carrier plate according to a first embodiment of the present invention may include a step of preparing a first plate body (10) so as to be able to manufacture a plate body for a carrier plate having a plurality of through holes, a step of preparing a second plate body (20), and a step of forming a combined plate body (100) in which the first plate body (10) and the second plate body (20) are combined.

[0044] Referring to FIGS. 1 and 2, the step of preparing the first plate body (10) is to prepare a first molded plate body (10a) in which a plurality of first blind holes (11a) are formed by recessing one side thereof into a lower surface, which is an opening directly below the first surface in the direction of self-weight.

[0045] This first molded plate body (10a) is a roughly square plate-shaped cast molded product in which a plurality of first blind holes (11a) are formed to a certain depth by a die casting process, with one end closed and the other end open.

[0046] And, by polishing the upper surface of the first molded plate body (10a) by a grinding process or cutting process using an abrasive such as a grinder to remove a certain thickness so that the sealed ends of the plurality of first blind holes (11a) are opened, a first plate body (10) having a substantially square plate shape and a plurality of first through holes (11) corresponding one-to-one to a plurality of second through holes (21) described later can be manufactured.

[0047] This first plate body (10) can be prepared by a casting process such as die casting that precisely molds the first molded plate body, a polishing process that polishes the surface of the first molded plate body with an abrasive, or a cutting process that cuts the surface of the first molded plate body with a cutting material.

[0048] At this time, a polishing process or a cutting process can be additionally performed on the lower surface of the first molded plate (10a) corresponding to the opening end of the first blind hole according to the thickness of the first plate (10) set in advance.

[0049] Referring to FIGS. 3 and 4, the step of preparing the second plate body (20) is similar to the step of preparing the first plate body, in that a second molded plate body (20a) is prepared by forming a plurality of second blind holes (21a) in the lower surface, which are opened at one end in the direction of self-weight.

[0050] This second molded plate body (20a) is a roughly square plate-shaped cast molded product in which a plurality of second blind holes (21a) are formed to a certain depth by a die casting process, with one end closed and the other end open.

[0051] And, by polishing the upper surface of the second molded plate body (20a) by a polishing process using an abrasive such as a grinder or cutting the surface by a cutting process using a cutting material to remove a certain thickness so that the sealed ends of the plurality of second blind holes (21a) are opened, a second plate body (20) having a substantially square plate shape and a plurality of second through holes (21) corresponding one-to-one to the plurality of first through holes (11) can be manufactured.

[0052] Here, a square-shaped joining groove (25) corresponding to the first plate body (10) having the plurality of first through holes (11) can be sunken into the upper surface of the second molded plate body (20a) corresponding to the sealed end of the plurality of second blind holes (21a) so that the first plate body (10) having the plurality of first through holes (11) can be inserted and joined.

[0053] At this time, the depth of the above-mentioned combined groove (25) may be set to a size approximately equal to the thickness of the first plate body (10) or may be adjusted according to the casting formability or processing method. The depth of this combined groove (25) may be strictly and precisely regulated by a grinding process or cutting process that removes a certain thickness of the other surface of the second molded plate body so as to open the sealed ends of the plurality of second blind holes (21a) formed in the second molded plate body (20a).

[0054] This second plate body (20) can be prepared by a casting process such as die casting that precisely molds the second molded plate body, a polishing process that polishes the surface of the second molded plate body with an abrasive, or a cutting process that cuts the surface of the second molded plate body with a cutting material.

[0055] At this time, a polishing process or a cutting process can be additionally performed on the lower surface of the second molded plate (20a) corresponding to the opening end of the second blind hole according to the thickness of the second plate (20) set in advance.

[0056] Here, the plate thickness of the second plate body (20) through which the plurality of second through holes (21) are formed is shown and described as being surface-processed to have the same size as the plate thickness of the first plate body (10) through which the plurality of first through holes (11) are formed, but it is not limited thereto, and the plate thickness of the first plate body (10) and the plate thickness of the second plate body (20) can be surface-processed to have different sizes according to the conditions of the die-casting forming process.

[0057] Referring to FIGS. 5 and 6, the step of forming a combined plate body (100) in which the first plate body (10) and the second plate body (20) are combined is as follows: first, the first plate body (10) having the plurality of first through holes (11) is formed as an upper part, and the second plate body (20) having the plurality of second through holes (21) is formed as a lower part, and the first through holes (11) and the second through holes (21) are arranged vertically so that they correspond one-to-one on a vertical line.

[0058] In this state, the first plate body (10) is inserted into the combined groove (25) formed in the upper surface of the second plate body (20) corresponding to the first plate body (10), thereby assembling the first plate body (10) and the second plate body (20) as one plate body to form a combined plate body (100).

[0059] In this composite plate body (100), a plurality of first through holes (11) formed in the first plate body (10) and a plurality of second through holes (21) formed in the second plate body (20) can be positioned on the same vertical line and vertically aligned to form a plurality of through holes (H).

[0060] At this time, it is preferable that the outer edge of the first plate body (10) and the inner edge of the joining groove (25) into which the first plate body (10) is inserted are sized by being polished or cut so that the joining process can be smoothly performed without any gaps or interference between the plates when the first plate body and the second plate body are joined and assembled.

[0061] And, when the first plate body (10) and the second plate body (20) are combined, the upper surface of the first plate body (10) is positioned lower than the upper surface of the second plate body (20) to form a step, but it is not limited thereto, and it is preferable that the upper surface of the first plate body (10) and the bottom surface of the combination groove are dimensionally controlled by polishing or cutting so that the upper surface of the first plate body (10) is positioned on a parallel line with the upper surface of the second plate body (20).

[0062] Meanwhile, in a state where the first plate body (10) and the second plate body (20) are combined and assembled into a combined plate body (100), an additional process can be performed to integrate the first plate body and the second plate body so that they are not separated from each other by external force.

[0063] That is, the integration process of this composite plate body (100) can be performed by a welding process in which the first plate body (10) and the second plate body (20) are assembled and combined with each other, as shown in FIG. 6.

[0064] A welding line (W) or a welding spot can be formed entirely or partially along the outer edge of the first plate (10) combined with the second plate (20) using a welding machine (not shown) such as a laser welder or a spot welder.

[0065] In this case, the first plate body (10) and the second plate body (20) are integrated into one configuration through the welding line (W) or welding spot, and a combined plate body (100) having a plurality of through holes (H) formed by vertically arranging the plurality of first and second through holes (11, 21) in a one-to-one correspondence can be manufactured.

[0066] In addition, the first plate body and the second plate body can be bonded together as one body by using a bonding material applied so as to be interposed between the inner surface of the combined groove (25) provided in the second plate body (20) and the outer surface of the first plate body (10) corresponding thereto.

[0067] In this case, the first plate body (10) and the second plate body (20) are integrated into one configuration by using the bonding material as a medium, and a combined plate body (100) having a plurality of through holes (H) formed by vertically arranging the plurality of first and second through holes (11, 21) in a one-to-one correspondence can be manufactured.

[0068] And, by having at least one end of a fastening member screw-fastened to the other plate through one of the first plate body (10) and the second plate body (20) to generate a fastening force, the first plate body (10) and the second plate body (20) can be maintained as a single unit without being separated from each other by the fastening force of the fastening member.

[0069] In addition, in the process of the first plate body (10) being inserted into the joining groove (25) formed in the second plate body (20) and joined, the outer surface of the first plate body (10) is forcibly fitted into the inner surface of the joining groove by an external force, thereby generating a close bonding force therebetween, so that the first plate body (10) and the second plate body (20) can be maintained in a state of being joined as one piece without being separated from each other by the close bonding force between the members without the need for a welding process, a bonding process, or a fastening process.

[0070] At this time, the vertical outer surface of the first plate body (10) and the vertical inner surface of the combination groove (25) can be in surface contact as a whole to generate a close bonding force, but this is not limited thereto, and the close bonding force can be generated by partial contact through at least one embossing portion protrudingly formed on either the vertical outer surface of the first plate body (10) or the vertical inner surface of the combination groove (25).

[0071] Meanwhile, the combined plate body (100) in which the first plate body (10) and the second plate body (20) are combined is formed by applying a resin material to the inner circumferential surface of the through hole (H) through a resin molding process described later, and the first plate body and the second plate body can be more stably maintained in a state in which they are combined as one body without being separated from each other by the support hole (H1) connected to the rubber resin layer (R) applied to the upper and lower surfaces of the combined plate body (100).

[0072] Referring to FIG. 7, a support hole (H1) having an inner diameter smaller than the inner diameter of the through hole (H) is formed inside the through hole (H) to generate a supporting force that fixes and supports both ends of the chip component (200) so that they are exposed to the outside, and a resin molding process is additionally performed to form a rubber resin layer (R) on both sides of the combined plate body (100) by molding a resin material such as silicone resin to a certain thickness on both sides of the combined plate body and the inner surface of the through hole, thereby manufacturing and completing a carrier plate (P) used to form an electrode on the chip component (200).

[0073] That is, the rubber resin layer (R) and the support hole (H1) may be formed of a resin material that is formed to a certain thickness on both sides of the combined plate body (100) and the inner surface of the through hole (H) by an injection resin molding process that forcibly injects liquid silicone resin into the cavity between the upper and lower molds for molding while the combined plate body (100) is horizontally placed between the upper and lower molds for molding (not shown).

[0074] And, the support hole (H1) formed as a resin material inside each of the plurality of through holes (H) can be formed by a core pin separated from the through hole after an injection molding process in which silicone resin is filled in the gap between the inner surface of the through hole and the outer surface of the core pin while arranging the core pin (not shown) at the center of each through hole so as not to come into contact with the inner surface of the through hole.

[0075] At this time, it is preferable that the center of the through hole (H) be formed to approximately coincide with the center of the support hole (H1).

[0076] Referring to FIGS. 8a and 8b, the process of forming the first molding plate body (10a) prepares a first upper mold (1) having a cavity groove (1a) open toward the lower side, and a first lower mold (2) having a plurality of first molding pins (2a) formed to protrude at a certain height on the upper surface to form the first blind hole (11a).

[0077] A die casting process is performed by combining the first upper mold (1) and the first lower mold (2) and injecting molten aluminum material through an injection port (G) formed in the combined mold body, thereby filling the internal cavity (C) of the first upper and lower molds with the molten metal and forming the mold.

[0078] Then, after a certain period of time, when the molten metal filled in the inner cavity is solidified and the first upper mold (1) and the first lower mold (2) are separated from each other, a first molded plate body (10a) having a plurality of first blind holes (11a) opened in the direction of self-weight and sunken into one surface can be manufactured by molding.

[0079] And, it is desirable to perform a finishing process on the outer surface of the first molded plate body (10a), which is a cast molded product removed from the separated first upper and lower molds.

[0080] Referring to FIGS. 9a and 9b, the process of forming the second molding plate body (20a) prepares a second upper mold (5) having a protrusion (5a) formed on the lower surface for forming the joining groove (25), and a second lower mold (6) having a plurality of second molding pins (6a) formed on the upper surface to protrude at a certain height for forming the second blind hole (21a).

[0081] A die casting process is performed by combining the second upper mold (5) and the second lower mold (6) and injecting molten aluminum material through an injection port (G) formed in the combined mold body to fill the internal cavities of the second upper and lower molds with the molten metal and form the mold.

[0082] Then, after a certain period of time, when the molten metal filled in the inner cavity is solidified and the second upper mold (5) and the second lower mold (6) are separated from each other, a plurality of second blind holes (21a) opened in the direction of self-weight are formed on one surface, and a second molded plate body (20a) having the joining groove (25) formed on the upper surface can be formed and manufactured.

[0083] And, it is desirable to perform a finishing process on the outer surface of the second molded plate body (20a), which is a cast molded product that has been removed from the separated second upper and lower molds.

[0084] Referring to Fig. 10, the first plate body (10) preferably has a recessed groove (16) for positioning formed on the outer edge of each side, and the second plate body (20) preferably has a positioning member (26) that is inserted corresponding to the positioning groove (16) when combined with the first plate body, so as to protrude on the inner surface of the combined groove (25).

[0085] In this case, in the process of joining the first plate body (10) and the second plate body (20) by correspondingly inserting the first plate body into the joining groove (25) formed in the upper surface of the second plate body (20), the corresponding position between the positioning groove (16) of the first plate body (10) and the positioning member (26) of the second plate body (20) is confirmed before joining, so that the worker can easily and accurately perform the joining process of joining the first through hole (11) of the first plate body and the second through hole (21) of the second plate body in a vertical line without interfering with each other and always in one-to-one correspondence.

[0086] <Second Embodiment>

[0087] A method for manufacturing a plate body for a carrier plate according to a second embodiment of the present invention may include a step of preparing a pair of laminated plates (30) and a step of forming a laminated plate body (100a) so as to be able to manufacture a plate body for a carrier plate having a plurality of through holes.

[0088] Referring to FIGS. 11 and 12, the step of preparing a pair of laminated plate bodies (30) is to prepare a pair of laminated molded plate bodies (30a) in which a plurality of blind holes (31a) are formed by recessing one side, i.e., the lower side, with one side opened in the direction of self-weight.

[0089] This pair of laminated molded plates (30a) is a roughly square plate-shaped cast molded product in which a plurality of blind holes (31a) are formed to a certain depth, with one end closed and the other end open, through a die casting process.

[0090] And, by polishing the upper surface of the other surface of the pair of laminated molding plates (30a) by a polishing process using an abrasive such as a grinder or cutting the surface by a cutting process using a cutting material to remove a certain thickness so that the sealed ends of the plurality of blind holes (31a) are opened, a laminated plate (30) having a substantially square plate shape and a plurality of molding holes (31) corresponding one-to-one to the plurality of molding holes of one of the pair of laminated plates described later can be manufactured.

[0091] This laminated plate body (30) can be prepared by a casting process such as die casting to precisely mold the laminated molded plate body (30a), a polishing process to polish the surface of the laminated molded plate body with an abrasive, or a cutting process to cut the surface of the laminated molded plate body with a cutting material.

[0092] At this time, a polishing process or a cutting process can be additionally performed on the lower surface, which is one side of the laminated molding plate (30a), according to the thickness of the laminated plate (30) set in advance.

[0093] Referring to Fig. 13, the step of forming the laminated plate body (100a) is to first, among a pair of laminated plates (30) having a plurality of forming holes (31), one laminated plate body (30) is made as an upper part, and the remaining laminated plates (30) are made as lower parts, and are arranged vertically, and the plurality of forming holes (31) formed in each of the pair of laminated plates (30) arranged vertically correspond to each other.

[0094] At this time, a pair of laminated plates (30) must be arranged so that their processing surfaces, which are surfaces to be processed so that the sealed end of the blind hole (31a) is opened, face each other.

[0095] In this state, the pair of laminated plates (30) are laminated one above the other so that the facing processing surfaces of the pair of laminated plates face each other and come into contact, thereby forming a laminated plate body (100a).

[0096] In the above laminated plate body (100a), a plurality of forming holes (31) formed in the upper laminated plate body (30) and a plurality of forming holes (31) formed in the lower laminated plate body (30) are aligned and positioned on the same vertical line to form a plurality of vertical through holes (H).

[0097] Meanwhile, a process of integrating a pair of laminated plates (30) that are laminated one above the other to form the laminated plate body (100a) so that they do not separate from each other due to external force can be additionally performed.

[0098] That is, the integration process of the laminated plate body (100a) can be performed by a fastening process of a fastening member that is performed in a state where the pair of laminated plates (30) are laminated, as shown in FIG. 13.

[0099] By generating a fastening force by fastening the end of at least one fastening member (38) to a fastening hole (37) formed in the outer edge of one of the pair of laminated plates (30) through a fastening hole (37) formed in the outer edge of the other plate body using a screw fastening method, the pair of laminated plates (30) can be maintained as a single unit without being separated from each other by the fastening force of the fastening member.

[0100] In addition, the integration process of the laminated plate body (100a) can be performed by a welding process performed while the pair of laminated plates (30) are laminated.

[0101] The above pair of laminated plates can be laminated and a welding line or welding spot can be formed, in whole or in part, along the boundary line where they come into contact, using a welding machine (not shown) such as a laser welder or a spot welder.

[0102] In this case, the pair of laminated plates (30) are integrated into one configuration by means of the welding line or welding spot, and a laminated plate (100) having a plurality of through holes (H) formed by vertically arranging the plurality of forming holes (31) in a one-to-one correspondence can be manufactured.

[0103] In addition, the integration process of the laminated plate body (100a) can be performed by a bonding process using a bonding material.

[0104] The pair of laminated plates (30) can be integrally joined by using a bonding material applied between the processing surfaces where the pair of laminated plates (30) face each other.

[0105] In this case, the pair of laminated plates (30) are integrated into one configuration by means of the bonding material, and a laminated plate (100a) having a plurality of through holes (H) formed by vertically arranging the plurality of forming holes (31) in a one-to-one correspondence can be manufactured.

[0106] Meanwhile, the laminated plate body (100a) in which the pair of laminated plates (30) are laminated is formed by applying a resin material to the inner circumferential surface of the through hole (H) through a resin molding process, and the pair of laminated plates can be more stably maintained in a laminated state without being separated from each other by the support hole (H1) connected to the rubber resin layer (R) applied to the upper and lower surfaces of the laminated plate body (100a).

[0107] Referring to FIG. 14, in the same manner as the resin molding process applied to the composite plate body, a support hole (H1) having an inner diameter smaller than the inner diameter of the through hole (H) is formed inside the through hole (H) to generate a supporting force that fixes and supports both ends of the chip component (200) so that they are exposed to the outside, and a resin molding process is additionally performed to form a rubber resin layer (R) on both sides of the laminated plate body (100a) by molding a resin material such as silicone resin to a certain thickness on both sides of the laminated plate body and the inner surface of the through hole, thereby manufacturing and completing a carrier plate (P1) used to form an electrode on the chip component.

[0108] That is, these rubber resin layers (R) and support holes (H1) are formed of a resin material that is formed to a certain thickness on both sides of the laminated plate body (100a) and the inner surface of the through hole (H) by an injection resin molding process that forcibly injects liquid silicone resin into the cavity between the upper and lower molds for molding while the laminated plate body (100a) is horizontally placed between the upper and lower molds for molding (not shown).

[0109] And, the support hole (H1) formed as a resin material inside each of the plurality of through holes (H) can be formed by a core pin separated from the through hole after an injection molding process in which silicone resin is filled in the gap between the inner surface of the through hole and the outer surface of the core pin while arranging the core pin (not shown) at the center of each through hole so as not to come into contact with the inner surface of the through hole.

[0110] At this time, it is preferable that the center of the through hole (H) be formed to approximately coincide with the center of the support hole (H1).

[0111] It is preferable to form support holes by applying a resin material to the inner surface of the plurality of through holes on the upper outer edge and the lower outer edge of the laminated plate body (100a), and to form a step (35) that serves as a blocking function to prevent the liquid resin material from overflowing to the outside during the resin molding process in which the resin material is applied to the upper and lower surfaces of the laminated plate body to form a resin layer.

[0112] These protrusions (35) can be formed during casting or can be formed after casting by an additional polishing or cutting process on the flat surface of the molded plate.

[0113] Referring to FIGS. 15a and 15b, the process of forming the laminated molded plate body (30a) comprises preparing a third upper mold (3) having a recessed groove (3a) open downwardly formed on the lower surface, and a third lower mold (4) having a plurality of third molding pins (4a) protruding to a certain height on the upper surface to form the blind hole (31a).

[0114] A die casting process is performed by combining the third upper mold (3) and the third lower mold (4) and injecting molten aluminum material through an injection port (G) formed in the combined mold body to fill the internal cavities of the third upper and lower molds with the molten metal and form the mold.

[0115] Then, after a certain period of time, when the molten metal filled in the internal cavity is solidified and the third upper mold (3) and the third lower mold (4) are separated from each other, a laminated molding plate body (30a) having a plurality of blind holes (31a) opened in the direction of self-weight and sunken into one surface can be manufactured by molding.

[0116] And, it is desirable to perform a finishing process on the outer surface of the laminated molded plate body (30a), which is a cast molded product that has been removed from the separated third-phase lower mold.

[0117] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

[0118] [Explanation of symbols]

[0119] 10: First plate 10a: First molded plate

[0120] 11: First through hole 11a: First blind hole

[0121] 20: Second plate body 20a: Second molded plate body

[0122] 21: Second through hole 21a: Second blind hole

[0123] 25: Combined home 26: Positioning member

[0124] 30: Laminated plate body 30a: Molded plate body for lamination

[0125] 100: Combined plate body 100a: Laminated plate body

[0126] H: Through hole H1: Support hole

[0127] R: Rubber resin layer P, P1: Carrier plate

Claims

1. A method for manufacturing a plate body for a carrier plate having a plurality of through holes, A step of preparing a first plate body in which a plurality of first blind holes are formed by recessing a first molded plate body on one side to a predetermined thickness, thereby forming a plurality of first through holes in which the sealed ends of the plurality of first blind holes are opened; A step of preparing a second plate body in which a plurality of second blind holes are formed by recessing a second molded plate body on one side to a predetermined thickness, thereby forming a second plate body in which a plurality of second through holes are formed through the sealed ends of the plurality of second blind holes; and A method for manufacturing a plate for a carrier plate, comprising: a step of forming a combined plate body in which the first plate body and the second plate body are combined by inserting and arranging the first plate body into a combined groove formed in the other surface of the second plate body corresponding to the first plate body so that the plurality of first and second through holes are formed on the same vertical line, thereby forming a combined plate body.

2. In paragraph 1, The step of forming the above composite plate body is: A method for manufacturing a plate for a carrier plate, comprising a step of integrating the first plate body and the second plate body by a welding line formed along the outer edge of the first plate body combined with the second plate body.

3. In paragraph 1, The step of forming the above composite plate body is: A method for manufacturing a plate for a carrier plate, comprising a step of integrating the first plate body and the second plate body by a bonding material interposed between the inner surface of the above-mentioned combined groove and the outer surface of the first plate body.

4. In paragraph 1, The step of forming the above composite plate body is: A method for manufacturing a plate for a carrier plate, comprising a step of integrating the first plate body and the second plate body by at least one fastening member that penetrates one of the first plate body and the second plate body and is fastened to the other plate body.

5. In paragraph 1, The step of forming the above composite plate body is: A method for manufacturing a plate for a carrier plate, comprising a step of integrating the first plate and the second plate by a close bonding force generated by forcefully fitting the outer surface of the first plate to the inner surface of the joining groove.

6. In any one of paragraphs 1 to 5, After the step of forming the above composite plate body, A method for manufacturing a plate body for a carrier plate, further comprising a resin molding step of forming a support hole for fixing and supporting a chip component by a resin material molded to a certain thickness on the inner surface of the plurality of through holes.

7. In any one of paragraphs 1 to 5, A method for manufacturing a plate for a carrier plate, wherein the first plate body has a recessed groove formed on the outer edge of each side for positioning, and the second plate body has a positioning member that is inserted corresponding to the positioning groove when combined with the first plate body, and protrudes on the inner surface of the combined groove.

8. A method for manufacturing a plate body for a carrier plate having a plurality of through holes formed therethrough, A step of preparing a pair of laminated molded plates in which a plurality of blind holes are formed on one side by removing a certain thickness from each other surface of a pair of laminated molded plates in which a plurality of blind holes are formed on one side, thereby forming a pair of laminated plates in which the sealed ends of the plurality of blind holes are formed through a plurality of molded holes; and A method for manufacturing a plate for a carrier plate, comprising: a step of forming a laminated plate by laminating and fixing a pair of laminated plates so that the plurality of forming holes have a plurality of through holes formed in the same vertical line; 9. In paragraph 8, The step of forming the above laminated plate body is: A method for manufacturing a plate body for a carrier plate, comprising a step of integrating a pair of laminated plates by at least one fastening member that penetrates one of the pair of laminated plates and is fastened to the other plate body.

10. In paragraph 8, The step of forming the above laminated plate body is: A method for manufacturing a plate for a carrier plate, comprising a step of integrating the pair of laminated plates by a welding line formed along a boundary line where the pair of laminated plates are laminated.

11. In paragraph 8, The step of forming the above laminated plate body is: A method for manufacturing a plate body for a carrier plate, comprising a step of integrating a pair of laminated plates by a bonding material interposed between the pair of laminated plates.

12. In any one of paragraphs 8 to 11, After the step of forming the above laminated plate body, A method for manufacturing a plate body for a carrier plate, further comprising a resin molding step of forming a support hole for fixing and supporting a chip component by a resin material molded to a certain thickness on the inner surface of the plurality of through holes.

13. A first plate body having a plurality of first blind holes formed on one side thereof, the other side of which is formed by removing a certain thickness, thereby forming a plurality of first through holes in which the sealed ends of the plurality of first blind holes are opened; A second plate body having a plurality of second blind holes formed on one side thereof, the other side of which is formed by removing a certain thickness of the other side thereof, thereby forming a plurality of second through holes in which the sealed ends of the plurality of second blind holes are opened; and A combined plate body in which the first plate body and the second plate body are combined by inserting and arranging the first plate body into a combined groove formed in the opposite surface of the second plate body corresponding to the first plate body; A carrier plate comprising a plurality of through holes provided such that the plurality of first through holes and the plurality of second through holes are positioned on the same vertical line, a plurality of support holes formed of a resin material on the inner surface of each of the plurality of through holes to fix and support a chip component, and a rubber resin layer formed of a resin material on both sides of the combined plate body so as to be connected to the plurality of support holes.

14. A pair of laminated plate bodies having a plurality of blind holes formed on one side thereof, each side of which is formed by removing a certain thickness, thereby forming a plurality of molded holes in which the sealed ends of the plurality of blind holes are opened; A laminated plate body comprising a pair of laminated plates laminated and fixed; A carrier plate comprising a plurality of through holes formed by positioning a plurality of molding holes of a pair of laminated plates on the same vertical line, a plurality of support holes formed of a resin material on the inner surface of each of the plurality of through holes to fix and support chip components, and a rubber resin layer formed of a resin material on both sides of the laminated plates so as to be connected to the plurality of support holes.

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