Apparatus and method for high-frequency and high-quality preparation of uniform solder balls by electromagnetic disturbance

Abstract

Disclosed in the present invention are an apparatus and method for high-frequency and high-quality preparation of uniform solder balls by electromagnetic disturbance. The apparatus comprises a liquid storage chamber, a spheroidizing chamber arranged below the liquid storage chamber, a plurality of nozzles arranged at the top of the spheroidizing chamber and communicated with the liquid storage chamber, and two electrodes and two magnets arranged in each nozzle, wherein the magnets are perpendicular to the electrodes; a solder ball raw material in the liquid storage chamber is maintained in a liquid state by means of a heating mechanism; a low-oxygen state is maintained in the spheroidizing chamber, and the spheroidizing chamber is filled with a low-temperature gas; a pulse current is provided between the two electrodes by means of electrical components. In the present invention, under high temperature conditions, an electromagnetic force is used to apply disturbance, and micro-pump injection is employed to propel the molten solder ball raw material; the preparation apparatus controls a jet by means of micro-pump injection, and breaks the jet liquid column into uniform solder balls by means of an electromagnetic disturbance method; thus, efficient preparation of solder balls is achieved, the timeliness and reliability of solder ball preparation are enhanced, and the quality of solder ball products is improved.

Description

Device and method for preparing uniform solder balls by electromagnetic disturbance high frequency and high quality TECHNICAL FIELD

[0001] The present application relates to the technical field of microelectronic package solder ball preparation, and particularly relates to a device and method for preparing uniform solder balls by electromagnetic disturbance high frequency and high quality. BACKGROUND

[0002] In recent years, with the rapid development of laser ball planting technology, the demand for solder balls has increased rapidly, and the application market has been further expanded. Solder balls have a very broad development prospect in the fields of camera modules, VCM voice coil motors, CCMs, FPCs, connectors, antennas, sensors, etc. However, it is difficult to meet the demand for solder balls of various sizes in many fields according to the current solder ball preparation technology. To solve this problem, the present application proposes a new solder ball preparation device and method, which is the significance of the present application.

[0003] At present, the domestic and foreign solder ball preparation industry can prepare uniform solder balls suitable for advanced packaging technology, but the diameter of the solder ball has not been significantly broken through, and still remains between 0.2mm-0.8mm. There are few preparation devices and methods for larger solder balls above 1.0mm and fine solder balls below 0.2mm, but the demand for these sizes of solder balls is not low. When preparing larger solder balls above 1.0mm, a larger nozzle is selected, and the solder will flow out quickly from the nozzle under the action of its own gravity. It is difficult to match the disturbance frequency and flow rate. When preparing fine solder balls below 0.2mm, the nozzle size used is small, which leads to a larger resistance in the nozzle flow channel, and the jet instability phenomenon is easy to occur. Therefore, it is difficult to prepare successfully by using the existing technology. SUMMARY

[0004] The purpose of the present application is to provide a device and method for preparing uniform solder balls by electromagnetic disturbance high frequency and high quality, which is used for preparing solder balls of various sizes to meet the demand for solder balls of various sizes in many industries.

[0005] To solve the above technical problems, the present application adopts the following technical scheme:

[0006] The present application provides a device for preparing uniform solder balls by electromagnetic disturbance high frequency and high quality, which comprises a liquid storage cavity, a spheroidization cavity arranged below the liquid storage cavity, a plurality of nozzles arranged at the top of the spheroidization cavity and communicating with the liquid storage cavity, two electrodes arranged in the nozzles respectively, and two magnets perpendicular to the electrodes.

[0007] The solder ball raw material in the liquid storage cavity is kept in liquid state by a heating mechanism;

[0008] The spheroidization cavity is kept in a low-oxygen state and filled with low-temperature gas;

[0009] A pulse current is provided between the two electrodes through the electrical element.

[0010] The height of the spheroidizing cavity is between 8m and 12m, and the spheroidizing effect is relatively good in this range.

[0011] Further, a heating jacket one is arranged outside the liquid storage cavity;

[0012] The liquid storage cavity is also communicated with the syringe through a liquid guide pipe, and a heating jacket two is arranged outside the liquid guide pipe.

[0013] Still further, the syringe comprises a high-temperature-resistant shell and a high-temperature-resistant piston arranged in the high-temperature-resistant shell in a sealed manner;

[0014] One end of the high-temperature-resistant shell is provided with a liquid outlet communicated with the liquid storage cavity through the liquid guide pipe, a liquid inlet for injecting molten solder ball metal is arranged on the side wall, and a high-temperature-resistant shell hem is arranged at the other end.

[0015] A high-temperature-resistant core rod is further connected to the high-temperature-resistant piston, and a high-temperature-resistant handle is arranged at the end of the high-temperature-resistant core rod.

[0016] Still further, a heating jacket three and a temperature control device are arranged outside the high-temperature-resistant shell, and the high-temperature-resistant core rod is adjusted by an electric push rod and a pushing device to adjust the pushing amount of the high-temperature-resistant piston in the high-temperature-resistant shell.

[0017] Still further, a nozzle one, a nozzle two and a nozzle three are arranged at the bottom of the liquid storage cavity.

[0018] Each nozzle is internally provided with a disturbance cavity, and the side surface comprises two magnets and two electrodes, wherein the two magnets are opposite to each other, and the two electrodes are opposite to each other. In the process of preparing the solder ball, the liquid metal contained in the nozzle acts as a wire to connect the two electrodes. After the two electrodes are connected to an external electric signal source, a pulse current is generated between the two electrodes. At the same time, a magnetic field is generated between the two opposite magnets. At this time, the pulse current generates an electromagnetic force by cutting the magnetic induction lines, so as to disturb the liquid metal solder and make it break into uniform droplets.

[0019] The aperture range of the nozzle is 0.05mm-1.5mm, and the solder ball with a diameter range of 0.08-2.5mm is prepared.

[0020] Two opposite electrodes one and two opposite magnets one are arranged in the nozzle one, two opposite electrodes two and two opposite magnets two are arranged in the nozzle two, and two opposite electrodes three and two opposite magnets three are arranged in the nozzle three.

[0021] Further, the electrode one, the electrode two and the electrode three respectively provide pulse current through the electrical element; the electrical element includes a power amplifier and a signal generator;

[0022] The signal generator is used to output electrical signals with different frequencies, amplitudes and waveforms. A square wave electrical signal source with a frequency range of 100 Hz-10000 Hz is output. When the electromagnetic disturbance is performed within this frequency range, the ball forming effect is good. The power amplifier can adjust the current size, and the current should be controlled between 10A-40A. When the current is within this range, the ball forming effect of the embodiment is good.

[0023] Further, a gas hole is provided on the upper outer wall of the spheroidizing cavity, and the gas hole is communicated with a nitrogen storage device through a gas guide pipe. The nitrogen storage device stores nitrogen with a pressure not less than 1000kPa and a storage capacity not less than 20m³. The nitrogen storage device can provide 99.99% pure nitrogen, so as to provide a low-oxygen environment suitable for spheroidizing. When the gas pressure in the nitrogen storage device is lower than 500kpa, high-pressure nitrogen is filled through an external on-off valve.

[0024] Further, a discharge port is provided at the bottom of the spheroidizing cavity, and a collector is provided directly below the discharge port.

[0025] The embodiment also provides a method for preparing uniform solder balls by electromagnetic disturbance high frequency and high quality, which comprises the following steps:

[0026] Step 1: Reduce the oxygen content in the spheroidizing cavity

[0027] The nitrogen storage device is connected to the gas hole on the side of the spheroidizing cavity through a gas guide pipe. Nitrogen is introduced into the spheroidizing cavity through a precise gas pressure valve on the gas guide pipe. The nitrogen flows from the lower end of the spheroidizing cavity to the air. By continuously introducing nitrogen, the spheroidizing cavity is gradually filled with nitrogen. When the nitrogen flow rate reaches a stable value, the oxygen content in the gas medium in the spheroidizing cavity can be reduced to a suitable space environment for spheroidizing.

[0028] Step 2: Set the solder holding temperature

[0029] The temperature control device controls the heating of the heating jacket, so that the metal solder in the syringe always remains in a liquid state. Multiple adjustments are made to ensure that the temperature fluctuation amplitude is less than 1℃, meeting the requirements of the device. The temperature control device controls the heating of the heating jacket, ensuring that the metal solder in the liquid chamber and the liquid guide pipe is in a liquid state, so that electromagnetic disturbance can be added to the nozzles one, two and three for subsequent metal droplet spheroidizing treatment.

[0030] Step 3: Set the jet velocity

[0031] After the propulsion device is opened, the electric push rod on the device is adjusted to a proper position, the jet velocity indicated by the propulsion device is set, then the propulsion device is controlled to push the electric push rod at a constant speed to push the liquid metal after the metal solder is melted into the storage cavity, then the liquid metal flows into the new nozzle under the action of gravity;

[0032] Step 4: adjust the disturbance frequency

[0033] After the melting temperature of the metal solder is stable and the jet velocity is set, the power amplifier and the signal generator are turned on, the signal frequency of the signal generator is adjusted, the signal is amplified through the power amplifier, then electrode one, electrode two and electrode three are connected, the pulse current is generated under the action of the electric signal, the pulse current takes the solder as a carrier to form the pulse electromagnetic force in the nozzle, so that the liquid metal is disturbed, then the liquid metal micro-droplets are formed by the breaking of the jet liquid column end of each nozzle;

[0034] The uniform liquid metal micro-droplets are condensed into balls in the spheroidizing cavity, and finally fall into the collector vessel for collection, and then are cleaned and dried to prepare the required solder balls.

[0035] Compared with the prior art, the application has the beneficial technical effects that:

[0036] The technical scheme of the application can be used for preparing 0.2mm-0.8mm solder balls, and can also realize the preparation of 1.0mm or more solder balls, large-size metal micro-droplets, 0.2mm or less solder balls and fine metal micro-droplets;

[0037] The application uses a micro-injection pump and an injector to push the solder, the flow of the jet can be autonomously set, and the flow is easy to control in the solder ball preparation process; the liquid is metal solder, the electromagnetic disturbance method is adopted, the electric signal is output by the signal generator, is amplified by the power amplifier, is input to the electrode, the pulse current is generated, the magnet generates the magnetic field, the magnetic induction lines of the magnetic field are cut by the pulse current, so that the electromagnetic force is generated to form the disturbance. When the disturbance is transmitted to the surface of the jet liquid column, the disturbance frequency and the flow of the jet are reasonably adjusted, the jet liquid column end can be controlled to break to form the micro-droplets, then the micro-droplets are condensed and spheroidized to realize high-quality and high-efficiency balling.

[0038] The application uses the electromagnetic force as the disturbance under the condition of high temperature, uses the micro-pump injection to push the molten solder, the preparation device controls the jet by the micro-pump injection, the jet liquid column is broken into uniform solder balls by the electromagnetic disturbance method, the high-efficiency preparation of the solder balls is realized, the time efficiency and reliability of the solder ball preparation are enhanced, and the quality of the solder ball products is improved. BRIEF DESCRIPTION OF DRAWINGS

[0039] The application will be further described in combination with the drawings.

[0040] Figure 1 is a schematic diagram of the device structure for preparing uniform solder balls according to the present application.

[0041] Figure 2 is a schematic diagram of the injector structure in the device for preparing uniform solder balls according to the present application.

[0042] Figure 3 is a schematic diagram of the principle of preparing uniform solder balls according to the present application.

[0043] Figure 4 is a flow chart of preparing uniform solder balls according to the present application.

[0044] Reference signs:

[0045] Heating jacket 1, liquid storage chamber 2, electrode 1 3, electrode 2 4, electrode 3 5, nozzle 1 6, nozzle 2 7, nozzle 3 8, magnet 1 9, magnet 2 10, magnet 3 11, air hole 12, air guide pipe 13, precision air pressure valve 14, nitrogen storage device 15, on-off valve 16, spheroidizing chamber 17, collection vessel 18, heating jacket 2 19, liquid guide pipe 20, injector 21, heating jacket 3 22, temperature control device 23, electric push rod 24, propelling device 25, power amplifier 26, signal generator 27, liquid outlet 28, high-temperature-resistant shell 29, liquid inlet 30, high-temperature-resistant piston 31, high-temperature-resistant shell crimping 32, high-temperature-resistant core rod 33, high-temperature-resistant pressing hand 34. DETAILED DESCRIPTION

[0046] The present embodiment discloses a device for preparing uniform solder balls by electromagnetic disturbance high frequency and high quality, comprising a liquid storage chamber 2, a spheroidizing chamber 17 installed below the liquid storage chamber 2, a plurality of nozzles installed on the top of the spheroidizing chamber 17 and communicating with the liquid storage chamber 2, two electrodes respectively installed in the nozzles, and two magnets perpendicular to the electrodes.

[0047] The solder ball raw material in the liquid storage chamber is kept in liquid state by a heating mechanism.

[0048] The spheroidizing chamber 17 is kept in a low-oxygen state and filled with low-temperature gas.

[0049] The two electrodes are provided with pulse current by an electrical element.

[0050] As shown in Figure 1, a heating jacket 1 is installed outside the liquid storage chamber 2 to keep the solder ball raw material in the liquid storage chamber 2 in liquid state.

[0051] The liquid storage chamber 2 is also connected to an injector 21 through a liquid guide pipe 20, wherein a heating jacket 2 19 is installed outside the liquid guide pipe 20 to keep the solder ball raw material entering the liquid guide pipe 20 in liquid state.

[0052] The heating jacket 1, heating jacket 2 19, and heating jacket 3 22 are respectively one of an electric heating jacket or a heat-conducting oil heating jacket.

[0053] In the embodiment, the injector 21 comprises a high-temperature-resistant shell 29, a high-temperature-resistant piston 31 sealedly installed in the high-temperature-resistant shell 29;

[0054] One end of the high-temperature-resistant shell 29 is provided with a liquid outlet 28 connected with the liquid storage cavity 2 through the liquid guide pipe 20, and a liquid inlet 30 for injecting molten solder metal is formed in the side wall of the high-temperature-resistant shell 29, and a high-temperature-resistant shell crimping 32 is integrally designed on the outer wall of the other end of the high-temperature-resistant shell 29.

[0055] The high-temperature-resistant piston 31 is further connected with a high-temperature-resistant stem 33, and a high-temperature-resistant handle 34 is installed at the end of the high-temperature-resistant stem 33.

[0056] In the embodiment, a heating sleeve 22 and a temperature control device 23 are installed outside the high-temperature-resistant shell 29, the high-temperature-resistant stem 33 is adjusted by an electric push rod 24 and a pushing device 25 to control the pushing amount of the high-temperature-resistant piston 31 in the high-temperature-resistant shell 29, and the injector can control the pressure difference and prevent the solder in the multiple nozzles from freely falling, and can realize the preparation of solder balls of various sizes under the control of the pushing device.

[0057] In the embodiment, a nozzle one 6, a nozzle two 7 and a nozzle three 8 are installed at the bottom of the liquid storage cavity 2.

[0058] The liquid storage cavity 2 is filled with liquid metal solder, which is connected with the injector 21 through the liquid guide pipe 13 to receive the liquid metal solder from the injector 21, and as the liquid metal solder in the liquid storage cavity 2 continuously increases, the liquid metal solder will gradually flow into the nozzle one 6, the nozzle two 7 and the nozzle three 8.

[0059] The liquid metal solder will flow out of the nozzles to form a jet liquid column, and then will be broken into metal droplets under the disturbance of electromagnetic force.

[0060] Two opposite electrodes one 3 and two opposite magnets one 9 are installed in the nozzle one 6, two opposite electrodes two 4 and two opposite magnets two 10 are installed in the nozzle two 7, and two opposite electrodes three 5 and two opposite magnets three 11 are installed in the nozzle three 8.

[0061] In the embodiment, the electrodes one 3, the electrodes two 4 and the electrodes three 5 respectively provide pulse current through electrical elements, and the electrical elements comprise a power amplifier 26 and a signal generator 27.

[0062] After the electrodes one 3 receive the electrical signal from the power amplifier 26, the liquid metal solder in the nozzle one 6 acts as a wire to generate pulse current, the pulse current cuts the magnetic lines of the magnetic field generated by the magnets 9, and then the electromagnetic force generated by the pulse current acts as a disturbance on the liquid metal solder in the nozzle one 6.

[0063] Electrode two 4, electrode three 5 same reason;

[0064] Magnet one 9 for generating a magnetic field, the pulse current generated by electrode 3 cutting its magnetic field lines after generating electromagnetic force, in order to break into metal droplets under the disturbance of electromagnetic force, liquid metal jet;

[0065] Magnet two 10 and magnet three 11, same reason.

[0066] In the upper part of the spheroidization cavity 17 outer wall set a gas hole 12, the gas hole 12 through the gas pipe 13 is connected with the storage device 15. In the bottom of the spheroidization cavity 17 is provided with discharge port, and the discharge port is provided with collector 18 directly below.

[0067] The present application relates to the micro pump injection conditions under the electromagnetic disturbance high frequency high quality preparation of uniform solder ball device and method, in the high temperature condition combined with electromagnetic disturbance and micro pump injection, compared with the common electromagnetic disturbance technology preparation solder ball has the characteristics of adjustable flow rate and high temperature injection.

[0068] In which the jet disturbance technology is based on the jet instability theory, when the longitudinal disturbance is transmitted to the surface of the jet liquid column, by reasonably adjusting the electromagnetic disturbance frequency and air pressure, the end of the jet liquid column can be controlled to break and form uniform solder balls. At present, this technology can only be used for microelectronic packaging 0.2mm-0.8mm solder ball preparation, but in recent years, with the rapid development of precise laser soldering technology, the application market of solder ball has been further widened. Solder ball has very broad development prospects in the fields of camera module, VCM voice coil motor, CCM, FPC, connector, antenna, sensor and other fields. According to the current technology, it is difficult to meet the requirements of various industries, and the solder ball size required in special contact support and micro motor and other fields is more than 1.0mm. At present, it is difficult to solve the problem of preparation of larger solder ball above 1.0mm. At the same time, with the change of electronic packaging technology from BGA packaging to CSP and 3D packaging, the size of solder ball required is getting smaller (below 0.2mm), which is also a problem to be solved at present.

[0069] The principle of the embodiment is:

[0070] The syringe is provided with a liquid guide opening connected with the melting furnace, the metal solder is guided into the syringe after being melted, the syringe is pushed by the electric push rod controlled by the pushing device, the liquid metal solder is injected into the liquid storage cavity above the nozzle through the liquid guide pipe, the liquid metal solder in the liquid storage cavity flows into the nozzle under the action of gravity, the nozzle contains two electrodes and two magnets, the electrodes are connected with the electric signal source, the pulse current is generated in the nozzle under the conduction of the liquid metal solder, the electromagnetic force is generated in the nozzle by the magnetic induction of the current cutting the magnetic field generated by the magnet, the electromagnetic force is applied to the end of the liquid jet column of each nozzle as disturbance to break the liquid jet column to form uniform liquid metal micro-droplets, the nitrogen storage device is connected with the spheroidizing cavity below the nozzle, the nitrogen is continuously filled to make the uniform micro-droplets condense into balls under the oxygen-free condition, and finally fall into the collector.

[0071] The embodiment also provides a method for preparing uniform solder balls by electromagnetic disturbance high frequency and high quality, and the method is characterized by comprising the following steps.

[0072] Step 1: reducing the oxygen content in the spheroidizing cavity

[0073] The nitrogen storage device 15 is connected with the air hole 12 on the side surface of the spheroidizing cavity 17 through the air guide pipe 13, the nitrogen gas is introduced into the spheroidizing cavity 17 through the precise air pressure valve 14 on the air guide pipe 13, the nitrogen gas flows out from the lower end of the spheroidizing cavity 17 into the air from top to bottom, the nitrogen gas gradually fills the whole spheroidizing cavity 17 by continuously introducing the nitrogen gas, and the oxygen content in the gas medium in the spheroidizing cavity 17 is reduced to a space environment suitable for spheroidizing when the nitrogen gas flow reaches stability; in particular, the nitrogen storage device continuously provides normal-temperature or low-temperature nitrogen gas for the spheroidizing cavity 17 to ensure that the temperature in the spheroidizing cavity 17 is relatively constant; in particular, the nitrogen gas of the nitrogen storage device is communicated with the spheroidizing cavity 17 through the nitrogen gas input pipe and is discharged from the lower end of the spheroidizing cavity 17 from top to bottom.

[0074] Step 2: setting the solder holding temperature

[0075] The metal solder in the syringe 21 is always kept in liquid state by controlling the heating of the heating jacket 22 through the temperature control device 23, the temperature fluctuation amplitude is less than 1℃ by multiple adjustments, and the requirements of the device are met; the metal solder in the liquid storage cavity 2 and the liquid guide pipe 20 is kept in liquid state by controlling the heating of the heating jacket 1 and the heating jacket 19 through the temperature control device 23, so that the electromagnetic disturbance can be added in the nozzle one 6, the nozzle two 7 and the nozzle three 8 for subsequent spheroidizing treatment of the metal micro-droplets.

[0076] Step 3: setting the jet speed

[0077] After the propelling device 25 is opened, the electric push rod 24 on the device is adjusted to a proper position, the jet velocity indicated by the propelling device 25 is set, then the propelling device 25 is controlled to push the electric push rod 24 at a constant speed to push the liquid metal in the syringe 21 into the storage cavity 2, then the liquid metal will flow into the new nozzle under the action of gravity and wait for disturbance to be generated; wherein the electric push rod 24 is adjusted to a proper position specifically refers to adjusting the electric push rod 24 to a position where the high-temperature-resistant pressing hand 34 of the high-temperature-resistant core rod 33 is in contact, so as to facilitate pushing and pressurizing injection;

[0078] Step 4: Adjust the disturbance frequency

[0079] After the melting temperature of the metal solder is stable and the jet velocity is set, the power amplifier 26 and the signal generator 27 are opened, the signal frequency of the signal generator 27 is adjusted, after signal amplification by the power amplifier 26, the electrode one 3, the electrode two 4 and the electrode three 5 are connected, under the action of the electric signal, the pulse current is generated, the pulse current takes the solder as the carrier, the pulse electromagnetic force is formed in the nozzle, so as to apply disturbance to the liquid metal, then the jet liquid column end of each nozzle is broken to form uniform liquid metal droplets;

[0080] The uniform liquid metal droplets are condensed into balls in the spheroidizing cavity 17, and finally fall into the collector vessel 18 for collection, then after cleaning and drying, the required solder balls are prepared.

[0081] The above embodiment only describes the preferred mode of the present application, and does not limit the scope of the present application, and various modifications and improvements to the technical solutions of the present application made by those skilled in the art without departing from the design spirit of the present application shall fall within the protection scope determined by the claims of the present application.

Claims

1. A device for preparing uniform solder balls by electromagnetic disturbance high frequency high quality, characterized in that: The device comprises a liquid storage cavity (2), a spheroidization cavity (17) arranged below the liquid storage cavity (2), a plurality of nozzles arranged on the top of the spheroidization cavity (17) and communicating with the liquid storage cavity (2), two electrodes respectively arranged in the nozzles, and two magnets perpendicular to the electrodes; The solder ball raw material in the liquid storage cavity is kept in liquid state by a heating mechanism; The spheroidization cavity (17) is kept in a low-oxygen state and filled with low-temperature gas; Pulse current is provided between the two electrodes by an electrical element.

2. The device for preparing uniform solder balls by electromagnetic disturbance high frequency high quality according to claim 1, characterized in that: A heating jacket one (1) is arranged outside the liquid storage cavity (2); The liquid storage cavity (2) is also communicated with a syringe (21) through a liquid guide pipe (20), and a heating jacket two (19) is arranged outside the liquid guide pipe (20).

3. The device for preparing uniform solder balls by electromagnetic disturbance high frequency high quality according to claim 2, characterized in that: The syringe (21) comprises a high-temperature-resistant shell (29) and a high-temperature-resistant piston (31) arranged in the high-temperature-resistant shell (29); One end of the high-temperature-resistant shell (29) is provided with a liquid outlet (28) communicated with the liquid storage cavity (2) through the liquid guide pipe (20), a liquid inlet (30) for injecting molten solder ball metal is arranged on the side wall thereof, and a high-temperature-resistant shell hem (32) is arranged at the other end thereof; A high-temperature-resistant core rod (33) is further connected to the high-temperature-resistant piston (31), and a high-temperature-resistant handle (34) is arranged at the end of the high-temperature-resistant core rod (33).

4. The device for preparing uniform solder balls by electromagnetic disturbance high frequency high quality according to claim 3, characterized in that: A heating jacket three (22) and a temperature control device (23) are arranged outside the high-temperature-resistant shell (29), and the high-temperature-resistant core rod (33) is adjusted by an electric push rod (24) and a pushing device (25) to adjust the pushing amount of the high-temperature-resistant piston (31) in the high-temperature-resistant shell (29).

5. The apparatus for preparing uniform solder balls by electromagnetic disturbance high frequency high quality according to claim 1, characterized in that: A nozzle one (6), a nozzle two (7), and a nozzle three (8) are arranged at the bottom of the liquid storage cavity (2), the aperture of each nozzle ranges from 0.05 mm to 1.5 mm, and the nozzles are used for preparing solder balls with a diameter ranging from 0.08 mm to 2.5 mm; Two opposite electrode ones (3) and two opposite magnet ones (9) are arranged in the nozzle one (6), two opposite electrode twos (4) and two opposite magnet twos (10) are arranged in the nozzle two (7), and two opposite electrode threes (5) and two opposite magnet threes (11) are arranged in the nozzle three (8).

6. The apparatus for preparing uniform solder balls by electromagnetic disturbance high frequency high quality according to claim 5, characterized in that: The electrode one (3), the electrode two (4), and the electrode three (5) are respectively provided with pulse current by an electrical element; the electrical element comprises a power amplifier (26) and a signal generator (27); The signal generator (27) is used for outputting electrical signals with different frequencies, amplitudes, and waveforms, and a square wave electrical signal source with a frequency ranging from 100 Hz to 10,000 Hz should be outputted; the power amplifier (26) can adjust the current size, and the current should be controlled between 10 A and 40 A.

7. The apparatus for preparing uniform solder balls by electromagnetic disturbance high frequency high quality according to claim 1, characterized in that: A gas hole (12) is arranged on the upper outer wall of the spheroidization cavity (17), and the gas hole (12) is communicated with a nitrogen storage device (15) through a gas guide pipe (13).

8. The apparatus for preparing uniform solder balls by electromagnetic disturbance high frequency high quality according to claim 7, characterized in that: The bottom of the spheroidizing cavity (17) is provided with a discharge port, and a collector vessel (18) is arranged directly below the discharge port; the height of the spheroidizing cavity (17) is between 8m-12m, and the spheroidizing effect is relatively good when the height is in this interval.

9. A method for producing uniform solder balls by electromagnetic perturbation high frequency high quality, characterized by: It comprises the following steps: Step 1: reduce the oxygen content in the spheroidizing cavity The nitrogen storage device (15) is connected to the air hole (12) on the side of the spheroidizing cavity (17) through the air guide pipe (13), and the nitrogen gas is introduced into the spheroidizing cavity (17) through the precise air pressure valve (14) on the air guide pipe (13). The nitrogen gas flows out from the lower end of the spheroidizing cavity (17) into the air from top to bottom. By continuously introducing nitrogen, the nitrogen gas will gradually fill the entire spheroidizing cavity (17). When the nitrogen outflow reaches a stable state, the oxygen content in the gas medium in the spheroidizing cavity (17) can be reduced to a suitable space environment for spheroidizing; Step 2: set the solder holding temperature The heating sleeve (22) is controlled by the temperature control device (23) to heat, so that the metal solder in the syringe (21) always remains in a liquid state. Multiple adjustments are made to make the temperature fluctuation amplitude less than 1℃, meeting the requirements of the device. The heating sleeve (1) and the heating sleeve (19) are controlled by the temperature control device (23) to heat, ensuring that the metal solder in the liquid storage cavity (2) and the liquid guide pipe (20) is in a liquid state, so that subsequent electromagnetic disturbance can be added to the nozzle one (6), the nozzle two (7) and the nozzle three (8) for metal droplet spheroidizing treatment; Step 3: set the jet velocity Open the propulsion device (25), adjust the electric push rod (24) on the device to the appropriate position, set the jet velocity represented by the propulsion device (25), then control the propulsion device (25) to uniformly push the electric push rod (24) to push the liquid metal in the syringe (21) into the liquid storage cavity (2), and then the liquid metal will flow into the new nozzle under the action of gravity; Step 4: adjust the disturbance frequency After the metal solder melting temperature is stable and the jet velocity is set, open the power amplifier (26) and the signal generator (27), adjust the signal frequency of the signal generator (27), and after signal amplification by the power amplifier (26), connect the electrode one (3), the electrode two (4) and the electrode three (5), generate pulse current under the action of electric signal, and the pulse current takes the solder as carrier to form pulse electromagnetic force in the nozzle, thereby exerting disturbance on the liquid metal, and then breaking the jet liquid column end of each nozzle to form uniform liquid metal droplets; Uniform liquid metal droplets are condensed into balls in the spheroidizing cavity (17) and finally fall into the collector vessel (18) for collection. After cleaning and drying, the required solder balls are obtained.

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