Optical device, board, and optical network

Abstract

Embodiments of the present application provide an optical device, a board, and an optical network. The optical device comprises optical modules, and can effectively reduce the power consumption of the optical modules and reduce the heat-dissipation difficulty of the optical modules. The optical device comprises a forwarding module, N processing modules, and M optical modules, where N and M are each any integer greater than 1. The forwarding module is connected to each of the N processing modules. The N processing modules comprise a target processing module, and the M optical modules comprise a target optical module. The target optical module comprises an optical modulator, and the optical modulator is connected to the target processing module via a first physical link, or, the target optical module comprises an optical detector, and the optical detector is connected to the target processing module via a second physical link.

Description

Optical device, single board and optical network

[0001] The present application claims priority to the Chinese patent application No. CN202410524820.4, filed on April 28, 2024, entitled "Optical device, single board and optical network", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of optical communication technology, and in particular, to an optical device, a single board and an optical network. BACKGROUND

[0003] An optical network provides a large-capacity, long-distance, high-reliability link transmission means, and has the characteristics of high transmission speed and long transmission distance. The optical network includes a plurality of optical devices. The existing optical device includes a device single board, and a processing chip is packaged on the device single board. The optical device also includes an optical module. The optical module is used for optical-electric conversion, and the processing chip is used for digital signal processing and switching forwarding. The optical module and the processing chip are connected through printed circuit board (PCB) wiring and a connector. The physical link length between the processing chip and the optical module is relatively long, and therefore, the transmission through the physical link will cause a large attenuation to the electrical signal.

[0004] In order to reduce the attenuation, a signal processor needs to be built in the optical module to perform attenuation compensation to suppress inter symbol interference (ISI). For example, the signal processor can be a digital signal processor (DSP) or a physical layer (PHY) chip, etc. However, the optical module performs attenuation compensation through the built-in signal processor, which will increase the power consumption of the optical module, resulting in a large difficulty in heat dissipation of the optical module. SUMMARY

[0005] Embodiments of the present application provide an optical device, a single board and an optical network, which can effectively reduce the power consumption of the optical module and reduce the difficulty of heat dissipation of the optical module.

[0006] In a first aspect, an optical device is provided, which includes a forwarding module, N processing modules, and M optical modules, where N and M are any integers greater than 1, the forwarding module is connected to each of the N processing modules, the N processing modules include a target processing module, and the M optical modules include a target optical module. The target optical module includes an optical modulator, the optical modulator is connected to the target processing module through a first physical link, the forwarding module is configured to forward first data to the target processing module, the target processing module is configured to perform digital signal processing on the first data to obtain a first electrical signal, the optical modulator is configured to perform electro-optical conversion on the first electrical signal to obtain a first optical signal, and the optical modulator is configured to emit the first optical signal. The target optical module does not include a module for compensating for attenuation of the first electrical signal transmitted through the first physical link. Alternatively, the target optical module includes an optical detector, the optical detector is connected to the target processing module through a second physical link, the optical detector is configured to perform photoelectric conversion on a second optical signal to obtain a second electrical signal, the target processing module is configured to perform digital signal processing on the second electrical signal to obtain second data, and the forwarding module is configured to forward the second data. The target optical module does not include a module for compensating for attenuation of the second electrical signal transmitted through the second physical link.

[0007] According to the present aspect, the processing module and the forwarding module are located separately, which helps to shorten the lengths of the first physical link and the second physical link connected between the processing module and the optical module, thereby effectively reducing the attenuation of the electrical signal transmitted between the optical module and the processing module through the physical link, suppressing ISI of the electrical signal, and improving the signal quality. The optical module does not need to be provided with a module for performing attenuation compensation, so that the optical modulator and the optical detector of the optical module are directly connected to the processing module through the physical link, effectively reducing the number of devices included in the optical module and improving the integration of the optical module. Since the optical module does not need to perform attenuation compensation of the electrical signal, the power consumption of the optical module is effectively reduced, and the heat dissipation difficulty of the optical module is reduced.

[0008] Based on the first aspect, in an optional implementation, the first physical link is not greater than 5 inches, and / or the length of the second physical link is not greater than 5 inches. According to the present implementation, the lengths of the first physical link and the second physical link connected between the processing module and the optical module are shortened, thereby effectively reducing the attenuation of the electrical signal transmitted between the optical module and the processing module through the physical link, suppressing ISI of the electrical signal, and improving the signal quality.

[0009] In an optional implementation of the first aspect, the N is 4 and the M is 16, and each of the 4 processing modules is connected to 4 optical modules. In this implementation, the positions of the processing modules and the forwarding module are separated, and the processing modules are located close to the optical modules, thereby shortening the lengths of the first physical link and the second physical link between the processing modules and the optical modules. Even the edge optical module (e.g., the last optical module) among the 16 optical modules can be connected to the closest processing module through the physical link, effectively shortening the length of the physical link between each optical module and the processing module.

[0010] In an optional implementation of the first aspect, the distance between the target optical module and the target processing module is smaller than the distance between the target optical module and the forwarding module, and the distance between the target optical module and the target processing module is smaller than or equal to the distance between the target optical module and any of the N processing modules. In this implementation, the distance between the target optical module and the target processing module is smaller than the distance between the target optical module and the forwarding module, which effectively shortens the distance between the target optical module and the target processing module, effectively shortens the length of the physical link between the target processing module and the target optical module in the connected state through the physical link, thereby reducing the attenuation of the electrical signal transmitted through the physical link, suppressing the ISI of the electrical signal, and improving the signal quality. Since the part performing digital signal processing is separated into multiple processing modules, the volume of a single processing module is effectively reduced, and the manufacturing difficulty of a single processing module is reduced.

[0011] In an optional implementation of the first aspect, the optical device further includes a circuit board, a surface of the circuit board includes the forwarding module, a first region, and a second region, the plurality of optical modules are arranged in a column in the first region, the plurality of processing modules are arranged in a column in the second region, and the second region is located between the first region and the forwarding module. In this implementation, the same circuit board includes the forwarding module, the plurality of optical modules, and the plurality of processing modules, the plurality of optical modules are arranged in a column in the first region, the plurality of processing modules are arranged in a column in the second region, and the second region is located between the first region and the forwarding module, thereby ensuring that the target processing module can be located close to the target optical module, thereby helping to shorten the lengths of the first physical link and the second physical link between the target processing module and the target optical module.

[0012] In an optional implementation of the first aspect, the plurality of optical modules in the first region, the plurality of processing modules in the second region, and the plurality of optical modules in the first region extend in the same direction relative to the circuit board. With this implementation, the target processing module can be located close to the target optical module, thereby helping to shorten the lengths of the first physical link and the second physical link connected between the target processing module and the target optical module.

[0013] In an optional implementation of the first aspect, the optical device includes a first single board and a second single board, the first single board includes the plurality of processing modules and the plurality of optical modules, and the second single board includes the forwarding module. With this implementation, the second single board where the forwarding module is located is different from the first single board where the plurality of processing modules and the plurality of optical modules are located. Then, because the plurality of processing modules and the plurality of optical modules are located on the same first single board, the lengths of the first physical link and the second physical link connected between the target processing module and the target optical module are shortened, thereby suppressing ISI of the electrical signal transmitted via the first physical link and the second physical link and improving signal quality.

[0014] In an optional implementation of the first aspect, the first single board includes a first circuit board, the second single board includes a second circuit board, a surface of the second circuit board is connected to the forwarding module, and a surface of the first circuit board includes a third region and a fourth region. The plurality of optical modules are arranged in a column in the third region, and the plurality of processing modules are arranged in a column in the fourth region. With this implementation, the target optical module and the target processing module are located on the same first single board, the forwarding module is located on the second single board, and the first single board is different from the second single board. Because the target processing module and the forwarding module are located on different single boards, the lengths of the physical links connected between the target processing module and the target optical module are effectively shortened.

[0015] In an optional implementation of the first aspect, the optical device has a housing, the forwarding module and the N processing modules are located in the housing, the housing includes a panel, the optical modules are plugged into the panel, and a spacing between the processing modules and the panel is smaller than a spacing between the forwarding module and the panel. With this implementation, the processing modules are located close to the panel, thereby helping to shorten the lengths of the physical links connected between the target processing module and the target optical module.

[0016] In an optional implementation of the first aspect, the target processing module includes a signal processor, and the signal processor is configured to perform at least one of the following:

[0017] amplify power, compensate for attenuation of the electrical signal transmitted by the first physical link, compensate for attenuation of the electrical signal transmitted by the second physical link, or compensate for attenuation of the optical signal transmitted between the optical device and another optical device.

[0018] According to the present implementation, the signal processor performing digital signal processing is arranged at a position separated from the forwarding module and the target optical module, respectively. Since the optical module does not need to be provided with a module for amplifying power, compensating for attenuation of the electrical signal transmitted by the first physical link, compensating for attenuation of the electrical signal transmitted by the second physical link, or compensating for attenuation of the optical signal transmitted between the optical device and another optical device, the optical modulator and the optical detector of the optical module are directly connected to the processing module through the physical link, which effectively reduces the number of devices included in the optical module, improves the integration of the optical module, effectively reduces the power consumption of the optical module, and reduces the heat dissipation difficulty of the optical module.

[0019] Based on the first aspect, in an optional implementation, the optical modulator is a low-driving-pressure optical modulator. According to the present implementation, the type of the optical modulator is a low-driving-pressure optical modulator. If the optical modulator is a low-driving-pressure optical modulator, the integration of the optical module is improved, and the cost is reduced.

[0020] Based on the first aspect, in an optional implementation, the target optical module further includes a driver connected between the optical modulator and the target processing module, the first physical link includes a physical link between the target processing module and the driver, and a physical link between the driver and the optical modulator. According to the present implementation, the optical module does not need to be provided with a module for compensating for attenuation of the electrical signal transmitted by the first physical link, compensating for attenuation of the electrical signal transmitted by the second physical link, or compensating for attenuation of the optical signal transmitted between the optical device and another optical device, which effectively reduces the number of devices included in the optical module, improves the integration of the optical module, effectively reduces the power consumption of the optical module, and reduces the heat dissipation difficulty of the optical module.

[0021] Based on the first aspect, in an optional implementation, the target optical module further includes an amplifier connected between the optical detector and the target processing module, the second physical link includes a physical link between the target processing module and the amplifier, and a physical link between the amplifier and the optical detector. For example, the amplifier can be a trans-impedance amplifier (TIA). For another example, the amplifier further includes a limiting amplifier connected to the TIA, to ensure that the amplitude of the second electrical signal sent to the processing module is within a limited range, to ensure the communication quality.

[0022] In an optional implementation of the first aspect, a modulation rate of the optical modulator is not less than a preset rate, and a detection rate of the optical detector is not less than the preset rate. The preset rate is 24 Gbps (Gigabits per second). In this implementation, the modulation rate of the optical modulator and the detection rate of the optical detector are not less than the preset rate, thereby ensuring the modulation rate of the optical modulator and the detection rate of the optical detector, and suppressing ISI and improving signal quality.

[0023] In an optional implementation of the first aspect, the optical device includes a circuit board, a surface of the circuit board includes the target processing module and a first connector, the target optical module is connected to the first connector in a plug-in manner, and the target optical module includes a bottom plate.

[0024] The surface of the bottom plate includes the optical modulator, the first physical link includes a wire of the circuit board connected between the target processing module and the first connector, and a wire of the bottom plate connected between the first connector and the optical modulator. The surface of the bottom plate includes the optical detector, and the second physical link includes a wire of the circuit board connected between the target processing module and the first connector, and a wire of the bottom plate connected between the first connector and the optical detector. In this implementation, the lengths of the first physical link and the second physical link are shortened, thereby suppressing ISI of electrical signals transmitted via the first physical link and the second physical link, and improving signal quality.

[0025] In an optional implementation of the first aspect, the optical device includes a circuit board, a surface of the circuit board includes the target processing module and a cable connector, the optical device further includes a second connector, the target optical module is connected to the second connector in a plug-in manner, and the target optical module includes a bottom plate. The surface of the bottom plate includes the optical modulator, the first physical link includes a wire of the circuit board connected between the target processing module and the cable connector, a first cable connected between the cable connector and the second connector, and a wire of the bottom plate connected between the second connector and the optical modulator. The surface of the bottom plate includes the optical detector, and the second physical link includes a wire of the circuit board connected between the target processing module and the cable connector, a second cable connected between the cable connector and the second connector, and a wire of the bottom plate connected between the second connector and the optical detector. In this implementation, the lengths of the first physical link and the second physical link are shortened, thereby suppressing ISI of electrical signals transmitted via the first physical link and the second physical link, and improving signal quality.

[0026] In a second aspect, the embodiments of the present application provide a single board, comprising N processing modules and M optical modules, wherein N and M are any integers greater than 1, the N processing modules comprise a target processing module, and the M optical modules comprise a target optical module; the target optical module comprises an optical modulator, the optical modulator is connected with the target processing module through a first physical link, the target processing module is configured to perform digital signal processing on first data to obtain a first electrical signal, and the optical modulator is configured to perform electro-optical conversion on the first electrical signal to obtain a first optical signal and emit the first optical signal; or, the target optical module comprises an optical detector, the optical detector is connected with the target processing module through a second physical link, the optical detector is configured to perform photoelectric conversion on a second optical signal to obtain a second electrical signal, and the target processing module is configured to perform digital signal processing on the second electrical signal to obtain second data. For the beneficial effects of the present aspect, please refer to the first aspect, and details are not described herein.

[0027] Based on the second aspect, in an optional implementation, the single board further comprises a forwarding module, the forwarding module is connected with each of the N processing modules, and the forwarding module is configured to forward the first data to the target processing module or forward the second data from the target processing module.

[0028] Based on the second aspect, in an optional implementation, the first physical link is not greater than 5 inches, and / or the length of the second physical link is not greater than 5 inches.

[0029] In the second aspect, the embodiments of the present application provide an optical network, comprising an optical device and at least one optical network terminal device, the optical device is as described in any one of the first aspect, and the beneficial effects of the present aspect are described in the first aspect, and details are not described herein.

[0030] In a third aspect, the embodiments of the present application provide an optical module, comprising at least one transmitting TX channel and at least one receiving RX channel, the TX channel comprises an optical modulator, and the RX channel comprises an optical detector. The optical module does not comprise a module for performing electrical signal attenuation compensation, and the specific structure of the optical module and the beneficial effects are described in the first aspect, and details are not described herein. BRIEF DESCRIPTION OF DRAWINGS

[0031] FIG. 1 is an example diagram of a structure of an optical network;

[0032] FIG. 2 is another example diagram of a structure of an optical network;

[0033] FIG. 3 is an example diagram of a structure of an existing optical device;

[0034] Fig. 4 is a first frame structure example of the light device provided by the present application;

[0035] Fig. 5a is a first embodiment structure example of the light device provided by the present application;

[0036] Fig. 5b is an application scenario structure example of the light device shown in Fig. 5a;

[0037] Fig. 6 is a connection example of the target processing module and the target light module shown in Fig. 5a;

[0038] Fig. 7 is a second embodiment structure example of the light device provided by the present application;

[0039] Fig. 8 is a first packaging structure example of the light device provided by the present application;

[0040] Fig. 9 is a second packaging structure example of the light device provided by the present application;

[0041] Fig. 10 is a second frame structure example of the light device provided by the present application;

[0042] Fig. 11 is a third frame structure example of the light device provided by the present application. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0044] Figure 1 is an example diagram of a structure of an optical network. For example, the type of the optical network 100 shown in the example is a passive optical network (PON). Then the optical network 100 includes an optical line termination device 101, an optical distribution network (ODN) 110, and at least one optical network termination device 102. The optical line termination device 101 is connected to the at least one optical network termination device 102 through the ODN 110. The example does not limit the number of the optical network termination devices 102 included in the optical network. The ODN 110 includes a passive splitter, a feeder fiber connected between the optical line termination device 101 and the passive splitter, and a drop fiber connected between the optical network termination device 102 and the passive splitter. The example does not limit the number of the passive splitters included in the ODN 110. Wherein the optical line termination device 101 sends an optical signal to the optical network termination device 102 through the ODN, which is called downstream, and the optical network termination device 102 sends an optical signal to the optical line termination device 101 through the ODN, which is called upstream. Specifically, when transmitting a first optical signal, the ODN 110 transmits the first optical signal from the optical line termination device 101 to each of the optical network termination devices 102 through the passive splitter. When transmitting a second optical signal, the ODN 110 combines multiple second optical signals from the multiple optical network termination devices 102 into one upstream optical signal in a time division multiplexing (TDM) manner, and sends the upstream optical signal to the optical line termination device 101. Each of the optical network termination devices 102 sends the upstream optical signal according to the time slot allocated by the optical line termination device 101, so as to avoid the conflict between the upstream optical signals sent by the optical network termination devices 102.

[0045] The optical network terminal device 102 shown in the example can be an optical network unit (ONU) or an optical network terminal (ONT), and the optical network terminal device 101 can be an optical line terminal (OLT). The optical network terminal device 101 is connected to an upper layer device. For example, the upper layer device can be a network device, such as a switch, a router, or the like. As shown in FIG. 1, the OLT can be located in a center office (CO), and the CO can further include the network device. For another example, the upper layer device can be an optical transport network (OTN). For yet another example, the upper layer device can be a server, such as a broadband remote access server (BRAS), or the like. The optical network terminal device 102 can be connected to a user side device. For example, the optical network terminal device 102 can provide an Ethernet user port or a plain old telephone service (POTS) user port to connect to the user side device. It should be noted that the description of the optical network type shown in FIG. 1 is an optional example, and is not limited. For example, the optical network can also be applied to an OTN, and the optical network terminal device 101 and the optical network terminal device 102 can be OTN devices. If the optical network 100 is applied to a mesh (Mesh) network, also referred to as a multi-hop network. The Mesh network includes a plurality of transmission devices with a Mesh function. The optical network terminal device 101 and the optical network terminal device 102 are any two of the plurality of transmission devices connected to each other.The optical network 100 shown in the example can also be applied to any one or a combination of data center networks (DCN), metropolitan area networks (MAN), optical access networks (OAN), city area networks (CAN), synchronous digital hierarchy (SDH), Gigabit-capable PON (GPON), Ethernet passive optical network (EPON), 10-Gigabit-capable symmetric passive optical network (XGS-PON), Ethernet, or flex Ethernet (FlexE), wavelength division multiplexing (WDM) network, etc., without limitation.

[0046] The example takes the type of the optical network terminal device 101 as an OLT without limitation. With different optical network application scenarios, the type of the optical network terminal device 101 can also be different. For example, the optical network terminal device 101 can be an optical transmission device, an optical access device, a router, a switch, a wireless base station, a wireless remote access device, a wireless baseband signal processing device, etc., or a computing server (usually referred to as a server), a high-performance computer (HPC), a storage server, or a memory resource pool, etc., as long as the optical network terminal device 101 has an optical module and an optical interface capable of connecting an optical fiber. The type of the optical network terminal device 102 is described in the description of the optical network terminal device 101, and is not described in detail.

[0047] Fiber to the home (FTTH) is a transmission mode of optical fiber communication. The access network part of the foregoing optical network can achieve wider coverage of the optical network through the FTTH mode. In addition, fiber to the office (FTTO), fiber to the building (FTTB), and the like are also proposed as the same or similar communication transmission modes. The example shown in FIG. 1 is exemplarily introduced based on FTTH.

[0048] On the basis of FTTH, in order to solve the problem of wireless fidelity (WIFI) coverage of home network, the optical fiber can be further extended to the room of the household. The optical terminal device providing WiFi access is installed in the room, so as to reduce the distance between the user terminal and the WiFi access point and improve the signal quality. This application scenario is called fiber to the room (FTTR).

[0049] FIG. 2 is another example diagram of the optical network, in particular, FIG. 2 is a schematic diagram of the system architecture of FTTR. The OLT in FTTH is deployed in the CO, and the ONU is deployed in the information box of the home. The master device in FTTR can replace the ONU in FTTH. The master device has similar functions to the OLT in the FTTH scenario, and also has similar functions to the ONU in the FTTH scenario. That is to say, the master device in FTTR is a device with OLT and ONU functions, which can be used as a network device between FTTH and FTTR. The slave device in FTTR can be deployed in each room of the home and used to connect with the user terminal. The slave device and the ONU in FTTH are similar network devices in nature. The slave gateway in FTTR enters each room and also has the function of an access point (AP) and can directly connect with the user terminal through WiFi. The user terminal can access the slave device and transmit data through the WiFi connection established with the slave device.

[0050] It should be understood that multiple slave devices can be deployed in FTTR, each slave device is connected with a corresponding downlink port of the master device, and the master device can realize unified management and configuration of all slave devices. It should be noted that the master device can also be referred to as a "master gateway", "master optical modem" or "master FTTR device", and the slave device can also be referred to as a "slave gateway", "slave optical modem" or "slave FTTR device". The specific name of the present application is not limited. The optical network terminal device shown in FIG. 1 can also be a master device under the FTTR architecture, and the optical network terminal device shown in FIG. 1 can also be a slave device under the FTTR architecture.

[0051] In combination with the architecture of the preceding FIG. 2, in some scenarios, when the slave device in FTTR provides services for the user terminal, the data transmission manner of the user terminal accessing the slave device can be different from the data transmission manner of the FTTH and the device in FTTR. For example, the FTTH or FTTR communicates internally through an optical fiber, and the slave device and the terminal can communicate through a wireless network, which can include but is not limited to WiFi, near field communication (NFC), infrared, Bluetooth, ZigBee, and the like.

[0052] It can be understood that FIG. 1 and FIG. 2 are only schematic diagrams, and the optical network can further include other devices, such as a wavelength division device, an optical amplifier device, more optical network terminal devices, and the like, which are not shown in FIG. 1 and FIG. 2.

[0053] The optical device provided in the present application is exemplified by the optical network terminal device corresponding to FIG. 1 or the master device shown in FIG. 2. In other examples, the optical device can also be the optical network terminal device corresponding to FIG. 1 or the slave device shown in FIG. 2, and the specific limitation is not made. In order to better understand the optical device provided in the present application, first, the structure of the existing optical device is described in combination with FIG. 3. FIG. 3 is a structural example diagram of the existing optical device. The optical device includes a device single board 300, the device single board 300 includes a processing chip 301 and a plurality of optical modules connected to the processing chip 301. For example, taking one of the plurality of optical modules 310 as an example, the optical module 310 can also be referred to as an optical transceiver module or an optical-electricity conversion module, and the like. The optical module 310 specifically includes an optical digital signal processor (oDSP) 311, and the optical module 310 further includes an optical modulator 312 and an optical detector 313 connected to the oDSP 311, respectively.

[0054] In the uplink direction, the optical detector 313 receives a second optical signal through the second optical fiber 321. The second optical signal can carry various types of services, such as SDH services, packet services, Ethernet services, FlexE, fronthaul services, OTN services, storage services, data center services, or supercomputing services, without limitation. The optical detector 313 performs photoelectric conversion on the second optical signal to obtain a second electrical signal. The oDSP 311 performs attenuation compensation on the second electrical signal to compensate for the attenuation of the electrical signal transmitted between the oDSP 311 and the processing chip 301. Specifically, the oDSP 311 compensates for the attenuation caused by the physical link transmission between the oDSP 311 and the processing chip 301 to suppress ISI and other distortions. The oDSP 311 can adjust the amplitude, phase, frequency, and other parameters of the second electrical signal to ensure that the processing chip 301 can accurately recover the original signal. The oDSP 311 can include a feed forward equalizer (FFE), a continuous time linear equalizer (CTLE), or a decision feedback equalizer (DFE), etc. The oDSP 311 can also perform MIMO equalization, etc. The processing chip 301 receives the compensated second electrical signal from the oDSP 311. The processing chip 301 performs digital signal processing on the received second electrical signal to complete the PON media access control (MAC) layer protocol processing function to obtain second data. For example, the frame format of the second electrical signal is a PON protocol frame, and the type of the PON protocol frame is not limited in this example, such as an OTN frame, an optical data unit (ODUk), an ODUCn, an ODU flex, or an optical transport unit k (OTUk), an OTUCn, or an OTN Flex, etc. Among them, k represents different rate levels, and Cn represents variable rates. The OTN frame can also be an optical service unit (OSU) frame. The frame format of the second data can be an Ethernet frame, so that the processing chip 301 can forward the Ethernet frame to an upper layer device.

[0055] Optionally, the processing chip 301 specifically comprises an analog to digital converter (ADC) for performing analog to digital conversion on the second electrical signal to obtain a digital signal. The processing chip 301 encapsulates the digital signal into second data conforming to an Ethernet protocol, for example, the second data can comprise a plurality of transmission frames, each transmission frame being an Ethernet frame. The embodiment is not limited to the specific process of the processing chip 301 for processing the digital signal, for example, the processing chip 301 can also perform hard decision forward error correction (FEC) processing, constellation demapping, etc. Optionally, the frame header of the second data at least comprises information of a target port. The target port refers to a port for receiving the second data, for example, the information of the target port can be a target port number of an optical network unit device or a media access control address (MAC) or an internet protocol address (IP) of a device receiving the second data. The description of the processing chip 301 is an optional example and is not limited, for example, the processing chip 301 can also perform clock recovery, carrier phase recovery, dispersion estimation, etc.

[0056] In the case where the processing chip 301 obtains the second data by processing the digital signal, the second data is forwarded by a local area network switch (LSW). For example, the processing chip 301 comprises a network processor (NP) and a traffic management (TM) module. The TM module mainly performs quality of service (QoS) control on service flows according to the transmission bandwidth of the network and the priority of the service flows. The NP mainly performs various forwarding processing tasks of services, such as packet processing of service data, protocol analysis, route lookup, etc. The processing chip 301 is used to send the second data to a corresponding upper layer device, such as a switch or other network device.

[0057] In the downstream direction, the processing chip 301 receives first data from an upper layer device, the first data carrying a description of a service, please refer to the description in the upstream direction, which is not described in detail. The frame format of the first data can be an Ethernet frame. The processing chip 301 performs digital signal processing on the first data to obtain a first electrical signal, the frame format of the first electrical signal being a PON protocol frame. The specific process of digital signal processing is not limited in this example, for example, the processing chip 301 can also perform constellation mapping, etc. The processing chip 301 includes a digital-to-analog converter (DAC). The DAC performs digital-to-analog conversion on the first electrical signal to obtain a converted first electrical signal, which is an analog signal. The processing chip 301 sends the converted first electrical signal to the oDSP 311 of the optical module. The oDSP 311 is used to compensate for the attenuation caused by the transmission of the first electrical signal between the processing chip 301 and the oDSP 311 in the physical link to suppress ISI and other distortions. The oDSP 311 transmits the compensated first electrical signal to the optical modulator 312, which can perform electro-optical conversion on the first electrical signal to obtain a first optical signal and transmit it to the optical network terminal device through the first optical fiber 322.

[0058] In the upstream direction and the downstream direction, due to the long length of the physical link between the oDSP of the optical module and the processing chip, the transmission of the electrical signal between the oDSP and the processing chip in the physical link causes large attenuation. In order to ensure signal quality, the optical module needs to compensate for the attenuation of the electrical signal, but the attenuation compensation of the optical module will increase the power consumption of the optical module, causing difficulty in heat dissipation of the optical module.

[0059] Therefore, the embodiment of the present application provides an optical device which can effectively reduce the power consumption of the optical module and reduce the difficulty of heat dissipation of the optical module. First, in combination with FIG. 4, the overall structure of the optical device is described. FIG. 4 is a first frame structure example of the optical device provided by the present application. The optical device shown in the embodiment includes a frame 400, which fixes a backboard 401, and the backboard 401 is connected to L single boards, for example, the backboard 401 is connected to single boards 411, 412, 413 to 41L, and the value of L is not limited in this embodiment. The frame 400 can also include a power supply 421, a heat dissipation system 422 and an auxiliary single board 423. The power supply 421 is used to power the optical device, which can include main and standby power supplies. The heat dissipation system 422 is used to dissipate heat for the optical device. The auxiliary single board 423 is used to provide external alarm or access external clock and other auxiliary functions.

[0060] Figure 5a is a structural diagram of a first embodiment of the optical device provided by the present application. The embodiment takes the optical network terminal device shown in the above as an example, and it is to be noted that the embodiment does not limit the type of the optical device, for example, if the optical network terminal device supports multiple optical modules, the optical network terminal device can also adopt the structure shown in the embodiment. The optical device shown in the embodiment specifically includes a forwarding module 500, N processing modules, and M optical modules. In combination with Figure 4 and Figure 5a, the forwarding module 500, the N processing modules, and the M optical modules shown in the embodiment are located on the same single board (for example, the single board 411) shown in Figure 4. The forwarding module 500 is a chip, a circuit, or an interface card for implementing the LSW forwarding shown in Figure 3, and the specific implementation is not limited. Each processing module is a chip, a circuit, or an interface card for implementing the digital signal processing shown in Figure 3, and the specific implementation is not limited. The embodiment does not limit the type of the forwarding module 500 and each processing module, for example, the processing module can be an oDSP, a DSP, a field-programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on chip (SoC), a central processor unit (CPU), a microcontroller unit (MCU), a programmable logic device (PLD), a MAC chip, or a physical layer chip (PHY) chip. The forwarding module 500 includes an NP and a TM module, and the specific implementation is not limited, for example, the forwarding module 500 can also be implemented by a DSP, an oDSP, an FPGA, an ASIC, a SoC, a CPU, an MCU, a PLD, and the like.

[0061] The forwarding module 500 shown in the embodiment is connected with each of the N processing modules, for example, as shown in Figure 5a, the processing module 511 of the N processing modules is connected with the forwarding module 500, and the processing module 51N of the N processing modules is connected with the forwarding module 500. Each processing module can be connected with one or more optical modules, for example, the processing module 511 is connected with four optical modules, that is, the optical module 521, the optical module 522, the optical module 523, and the optical module 524, and for another example, the processing module 51N is connected with the optical module 531, the optical module 532, the optical module 533, and the optical module 534.

[0062] In this embodiment, the forwarding module 500, the N processing modules and the M optical modules are located on the same single board 411 shown in FIG. 4, the single board 411 includes a circuit board 560, which can be a printed circuit board (PCB), then the forwarding module 500 and each processing module can be connected through circuit board wiring. For example, the forwarding module 500 and each processing module can be connected through a backplane, and the like, which is not limited. The circuit board wiring specifically refers to the structure, width and thickness of the signal line fixed on the circuit board. The N processing modules include a target processing module, which is any one of the N processing modules, for example, the target processing module can be the processing module 511 shown in FIG. 5a, which is connected to multiple target optical modules, and the target optical module is the optical module connected to the target processing module among the M optical modules of the optical device. For example, in the case of the target processing module being the processing module 511, the target optical module includes the optical module 521, the optical module 522, the optical module 523 and the optical module 524.

[0063] FIG. 5b is an example of a structure of an application scenario of the optical device shown in FIG. 5a. In the application scenario shown in FIG. 5b, N is 4 and M is 16. Then, the circuit board 560 of the optical device is connected to four processing modules, i.e., the processing module 511, the processing module 512, the processing module 513 and the processing module 514. In the case of N being 16, in order to ensure the balance of the load of different processing modules, each processing module is connected to four optical modules, and the connection of each processing module to four optical modules is described in the description of the connection of the processing module 511 to the optical module 521, the optical module 522, the optical module 523 and the optical module 524 shown in FIG. 5a, which is not repeated here.

[0064] The structure of the target optical module is described in combination with FIG. 6. FIG. 6 is an example diagram of connection between the target processing module and the target optical module shown in FIG. 5a. Take the optical module 521 as an example. The optical module 521 includes a bottom plate 600, and one or more transport (TX) channels, one or more receive (RX) channels, and one or more wavelength division multiplexers (WDM) 630 connected on the surface of the bottom plate 600. The bottom plate 600 shown in the embodiment can be a PCB. For details, refer to the description of the circuit board included in the single board 411, and details are not described herein again. The number of the TX channels, the RX channels, and the WDM 630 included in the optical module 521 is not limited in the embodiment. Take the TX channel 601 as an example. The TX channel 601 includes an optical modulator 602. The optical modulator 602 can be a direct modulation laser (DML), an electro-absorption modulated laser (EML), or a vertical cavity surface emitting laser (VCSEL). Alternatively, the optical modulator 602 can also be a structure of a laser and a modulator. The modulator can be a mach-zehnder modulator (MZM) or a miro ring modulator (MRM). The material for implementing the optical modulator 602 can be indium phosphide (InP) based semiconductor material, silicon based material, or thin film lithium niobate material. The optical modulator 602 is connected with a first optical fiber. Optionally, the TX channel 601 further includes a driver (DRV) 603 connected with the optical modulator 602. The driver 603 is used to send a driving signal to the optical modulator 602 to drive the optical modulator 602 to emit light. Alternatively, the TX channel 601 can not include the DRV 603. The processing module 511 includes the DRV. Alternatively, neither the TX channel 601 nor the processing module 511 includes the DRV. The type of the optical modulator 602 is a low driving pressure optical modulator. If the optical modulator 602 is a low driving pressure optical modulator, the integration of the optical module is improved, and the cost is reduced. The TX channel 601 shown in the embodiment does not include a module for performing attenuation compensation, for example, a DSP or a clock and data recovery (CDR) chip. The TX channel 601 is directly connected with an electrical interface of the processing module 511. The electrical interface 621 can be a serializer and deserializer (SerDes) interface.The SerDes interface includes a serializer (SER) and a deserializer (DES), and the SER is connected with the TX channel 601. For another example, the electrical interface 621 can be a high-speed DAC interface, which is used for digital-to-analog conversion while being connected with the TX channel 601. For details of the digital-to-analog conversion, refer to the description of FIG. 3.

[0065] The processing module 511 is connected with the optical modulator 602 through a first physical link, which can be a PCB trace. There are several optional examples as follows.

[0066] Example 1

[0067] The connector 640 is connected with the backboard 600, and the optical module 521 is connected with the connector 640 through plugging. The connector 640 can be a multi fiber push on (MPO) fiber connector, a ferrule connector (FC) fiber connector, a square connector (SC) fiber connector, a lucent connector (LC) fiber connector, a straight tip (ST) fiber connector, or a fiber distributed data interface (IFDD) fiber connector. The connector 640 includes a plurality of electrical interfaces.

[0068] If the TX channel 601 does not include the DRV 603, the first physical link includes a PCB trace connected between the electrical interface 621 and an electrical interface 631 of the connector 640, and a backboard trace connected between the electrical interface 631 of the connector 640 and the optical modulator 602. For details of the backboard trace, refer to the description of the PCB trace.

[0069] Example 2

[0070] If the TX channel 601 includes the DRV 603, the first physical link includes a PCB trace connected between the electrical interface 621 and an electrical interface 631 of the connector 640, a backboard trace connected between the electrical interface 631 of the connector 640 and the DRV 603, and a backboard trace connected between the DRV 603 and the optical modulator 602.

[0071] In combination with FIG. 5a and FIG. 6, the forwarding module 500 sends the first data to the processing module 511, and the processing module 511 is configured to perform digital signal processing on the first data to obtain a first electrical signal. In the downlink direction, the forwarding function implemented by the forwarding module 500 is described with reference to the description of the corresponding processing chip 301 in FIG. 3, and the process of performing digital signal processing by the processing module 511 is described with reference to the description of the corresponding processing chip 301 in FIG. 3, and details are not repeated. The optical modulator 602 performs electro-optical conversion on the first electrical signal to obtain a first optical signal, and sends the first optical signal to the WDM 630. The WDM 630 sends the first optical signal to the optical network terminal device through the optical cable 631. For a description of other arbitrary TX channel structures included in the optical module 521, refer to the description of the TX channel 601, and details are not repeated. The multiple TX channels included in the optical module 521 can be connected to one WDM 630, or connected to multiple WDMs, and details are not limited.

[0072] For example, the RX channel 611 includes an optical detector 612. The optical detector 612 can be a positive intrinsic-negative (PIN) photodiode, an avalanche photo diode (APD), or a silicon photomultiplier (SiPM). Optionally, the RX channel 611 further includes an amplifier 613 configured to amplify the power of the second electrical signal from the optical detector 612, and the amplifier 613 can be a trans-impedance amplifier (TIA). For example, the amplifier 613 further includes a limiting amplifier connected to the TIA, to ensure that the amplitude of the second electrical signal sent to the processing module 511 is within a limited range, to ensure communication quality. The RX channel 611 shown in the embodiment does not include a module for performing attenuation compensation, and the RX channel 611 is directly connected to the electrical interface 622 of the processing module 511. The electrical interface 622 can be a deserializer or an ADC interface.

[0073] The processing module 511 and the optical detector 612 are connected through a second physical link, which can be a PCB trace, and there are the following several optional examples:

[0074] Example 1

[0075] If the RX channel 611 does not include the amplifier 613, the second physical link includes the circuit board traces connected between the electrical interface 622 and the electrical interface 632 of the connector 640, and the backplane 600 traces connected between the electrical interface 632 of the connector 640 and the optical detector 612. For the description of the backplane 600 traces, please refer to the description of the PCB traces above, and no further description is given herein.

[0076] Example 2

[0077] If the RX channel 611 includes the amplifier 613, the second physical link includes the circuit board traces connected between the electrical interface 622 and the electrical interface 632 of the connector 640, the backplane 600 traces connected between the electrical interface 632 of the connector 640 and the amplifier 613, and the backplane 600 traces connected between the amplifier 613 and the optical detector 612.

[0078] As shown in FIGS. 5a and 6, the optical detector 612 receives the second optical signal through the WDM and performs photoelectric conversion on the second optical signal to obtain a second electrical signal. If the RX channel 611 includes the amplifier 613, the amplifier 613 amplifies the power of the second electrical signal to send the amplified second electrical signal to the processing module 511. If the RX channel 611 does not include the amplifier 613, the optical detector 612 directly sends the amplified second electrical signal to the processing module 511. The processing module 511 performs digital signal processing on the second electrical signal to obtain second data, and the forwarding module 500 is configured to emit the second data. In the uplink direction, for the description of the forwarding function implemented by the forwarding module 500, please refer to the description of the processing chip 301 in FIG. 3, and for the process of the digital signal processing implemented by the processing module 511, please refer to the description of the processing chip 301 in FIG. 3, and no further description is given herein. For the description of any optical module structure included in the optical device, please refer to the description of the optical module 521, and no further description is given herein. It should be noted that the present embodiment takes the optical module 521 including at least one RX channel and at least one TX channel as an example, and in other examples, the optical module 521 can include one of the RX channel or the TX channel. For example, the optical module 521 includes at least one TX channel, or the optical module 521 includes at least one RX channel.

[0079] With the existing optical device (for example, FIG. 3) and the optical device (for example, FIG. 5a, FIG. 5b and FIG. 6) provided by the embodiments of the present application, the existing processing chip 301 for implementing the forwarding function and the digital signal processing is connected with M optical modules. In the optical device shown in the embodiments of the present application, the part of the processing chip 301 for performing the digital signal processing is separated from the processing chip 301 and scattered into N processing modules. Each processing module is connected with at least one optical module. For example, as shown in FIG. 5b, the digital signal processing function is scattered into 4 processing modules, and each processing module is connected with 4 optical modules close to the position. Specifically, for example, the processing module 511 is used for performing digital signal processing on the first electrical signal to be sent to the optical module 521, the optical module 522, the optical module 523 and the optical module 524, or performing digital signal processing on the second electrical signal from the optical module 521, the optical module 522, the optical module 523 and the optical module 524. Similarly, the processing module 51N is used for performing digital signal processing on the first electrical signal to be sent to the optical module 531, the optical module 532, the optical module 533 and the optical module 534, or performing digital signal processing on the second electrical signal from the optical module 531, the optical module 532, the optical module 533 and the optical module 534. It can be understood that the positions between the processing modules and the forwarding modules shown in the embodiments are in a separated state. The distance between the target optical module and the target processing module is smaller than the distance between the target optical module and the forwarding module. Therefore, if the target processing module is integrated into the forwarding module, the distance between the target optical module and the target processing module is increased, and the length of the physical link connected between the target optical module and the target processing module is increased. In the embodiments, the target processing module is separated from the forwarding module and located close to the optical module, so that the distance between the target optical module and the target processing module is smaller than the distance between the target optical module and the forwarding module, and the length of the physical link between the target processing module and the target optical module in the connected state is effectively shortened. Specifically, in the case that the target optical module includes a TX channel and a RX channel, the length of the first physical link connected between the optical modulator and the target processing module is effectively shortened, and the length of the second physical link connected between the optical detector and the target processing module is effectively shortened, thereby effectively reducing the attenuation of the electrical signal transmitted between the target optical module and the target processing module through the physical link, suppressing the ISI of the electrical signal, and improving the signal quality.The part performing digital signal processing is separated from the processing chip and separated into multiple processing modules, effectively reducing the volume of a single processing module, reducing the manufacturing difficulty of a single processing module, and allowing the use of a lower-cost complementary metal oxide semiconductor (CMOS) process.

[0080] In combination with FIGS. 5a and 5b, the structure for shortening the length of the physical link between the target optical module and the target processing module is described. The surface of the circuit board 560 includes the forwarding module 500, a first area 561, and a second area 562. The M optical modules are arranged in a column in the first area 561, and the N processing modules are arranged in a column in the second area 562. The second area 562 is located between the first area 561 and the forwarding module 500. Moreover, with respect to the circuit board 560, the M optical modules in the first area 561 and the N processing modules in the second area 562 extend in the same direction. Specifically, the M optical modules in the first area 561 and the N processing modules in the second area 562 are arranged in the same direction. More specifically, the M optical modules in the first area 561 are arranged in a first direction 571, and the N processing modules in the second area 562 are arranged in a second direction 572. The first direction 571 and the second direction 572 are parallel to each other. In this embodiment, the first direction 571 and the second direction 572 are parallel to each other as an example, but are not limited thereto. For example, the first direction 571 and the second direction 572 can intersect to form a smaller angle, such as about 5 degrees, etc., as long as the N processing modules arranged in a column are located between the forwarding module 500 and the M optical modules arranged in a column. It should be noted that the arrangement of the N processing modules and the M optical modules in this embodiment is an optional example, and is not limited thereto. As long as the length of the physical link between the target optical module and the target processing module can be shortened, it is acceptable. For example, multiple optical modules are arranged around a processing module. As shown in FIG. 5b, because the four processing modules are arranged in a column in the second area 562, and the sixteen optical modules are arranged in a column in the first area 561, the second area 562 is located between the forwarding module 500 and the first area 651. Even the edge optical module (e.g., the last optical module 581 of the sixteen optical modules) can be connected to the closest processing module 514 through a physical link, effectively shortening the length of the physical link between each optical module and the processing module.

[0081] For example, as shown in FIG. 5a, in order to effectively shorten the length of the physical link connected between the target optical module and the target processing module, the distance between the target optical module and the target processing module is less than or equal to the distance between the target optical module and any of the N processing modules. For example, if the target optical module is optical module 534, the distance between the optical module 534 and the processing module 51N is less than the distance between the optical module 534 and the processing module 511, and therefore the processing module 51N is used as the target processing module to be connected to the optical module 534 through the first physical link and the second physical link. The length of the first physical link and the second physical link is not limited in the embodiment, for example, the first physical link is not greater than 5 inches, and / or the length of the second physical link is not greater than 5 inches. It should be noted that the length of the first physical link and the second physical link is not limited in the embodiment.

[0082] In addition, as the rate and scale of optical networks continue to increase, 8, 16 or 32 optical modules can be connected on the circuit board of each optical device to support more optical network terminal devices and higher bandwidth. Then, the embodiment shown effectively reduces the length of the physical link between the optical module and the processing module, thereby reducing signal attenuation, reducing the power consumption of the optical device as a whole, reducing the heat dissipation pressure of the optical device, and facilitating the demand for low carbon emissions. The mode of each optical module included in the optical device is not limited in the embodiment, and as the optical network develops, the mode type and number of optical modules included in the optical device will increase, for example, the mode of the optical module can be a Gigabit-capable PON (GPON) optical module, a three-module combination (XGS-PON Combo) optical module, a 50G PON three-module combination optical module, etc. Using the structure of the optical module shown in the embodiment, the optical module does not need to be provided with a module for performing attenuation compensation, so that the optical modulator and the optical detector of the optical module are directly connected with the processing module through the physical link, effectively reducing the number of devices included in the optical module, improving the integration of the optical module, and thereby reducing the overall size of the optical module, thereby improving the density of the optical modules connected by the circuit board and improving the integration of the optical device. The optical module shown in the embodiment does not need to be provided with a module for performing attenuation compensation, thereby reducing the cost of the optical module, thereby effectively supporting the continuous evolution and development of the access network.

[0083] The modulation rate of the optical modulator shown in the embodiment is not less than a preset rate, and the detection rate of the optical detector is not less than the preset rate. The preset rate is 24 gigabits per second (Gbps). The detection rate refers to the speed of the optical signal that can be processed or responded by the optical detector in a unit of time. The modulation rate of the optical modulator, also referred to as the modulation frequency or the symbol rate, refers to the number of symbols transmitted by the optical modulator per second, or the number of state changes of the optical modulator per second. The symbol herein can represent a bit or other more complex coding unit in communication. The modulation rate of the optical modulator and the detection rate of the optical detector are both not less than the preset rate. Therefore, the optical device improves the modulation rate of the optical modulator and the detection rate of the optical detector while suppressing ISI and improving signal quality. It should be noted that the modulation rate of the optical modulator of each TX channel in the same optical module shown in the embodiment can be not less than the preset rate, and the specific size of the modulation rate of each optical modulator is not limited. For example, the modulation rates of different optical modulators are different, and are all not less than the preset rate. For another example, the modulation rates of some optical modulators of the optical module are not less than the preset rate, and the modulation rates of the other optical modulators can be less than the preset rate. If the modulation rate of the optical modulator is less than the preset rate, the low-speed electrical signal does not need to be attenuated and compensated. Therefore, for the TX channel with the modulation rate of the optical modulator less than the preset rate, the oDSP for attenuating and compensating is not needed. The detection rates of the optical detectors of different RX channels in the same optical module shown in the embodiment can be all not less than the preset rate, and the specific size of the detection rate of each optical detector is not limited. For example, the detection rates of different optical detectors are different, and are all not less than the preset rate. For another example, the detection rates of some optical detectors of the optical module are not less than the preset rate, and the detection rates of the other optical detectors can be less than the preset rate. If the detection rate of the optical detector is less than the preset rate, the low-speed electrical signal does not need to be attenuated and compensated. Therefore, for the RX channel with the detection rate of the optical detector less than the preset rate, the oDSP for attenuating and compensating is not needed.

[0084] The above embodiment takes the example that the forwarding module, the N processing modules and the M optical modules are located on the same single board shown in FIG. 4. FIG. 7 is a structural diagram of a second embodiment of the optical device provided by the present application. In the embodiment, the forwarding module, the N processing modules and the M optical modules are located on different single boards. The optical device shown in the embodiment includes a first single board and a second single board. The first single board includes the forwarding module, and the second single board includes the N processing modules and the M optical modules. In combination with FIG. 4, the first single board can be any one of the L single boards, and the second single board can be any single board different from the first single board among the L single boards. For example, the second single board can be a backboard, and the specific limitation is not made. The embodiment takes the example that the first single board is the single board 411 and the second single board is the single board 412, and the specific limitation is not made. The first single board includes a first circuit board 710. The surface of the first circuit board 710 includes a third region 721 and a fourth region 722. The M optical modules are arranged in a column in the third region 721, and the N processing modules are arranged in a column in the fourth region 722. For the arrangement of the M optical modules in the first region 561 and the N processing modules in the second region 562, please refer to the description in FIG. 5a or FIG. 5b, and the specific description is not repeated. For the structure of the N processing modules and the M optical modules, please refer to the description of the structure of the N processing modules and the M optical modules in the above embodiment, and the specific description is not repeated. The second single board includes a second circuit board 700 and a forwarding module 701 connected to the surface of the second circuit board 700. For the description of the forwarding module, please refer to the description in the above embodiment, and the specific description is not repeated.

[0085] According to the embodiment, the target optical module and the target processing module are located on the same first single board, and the forwarding module is located on the second single board. The first single board is different from the second single board. Because the target processing module and the forwarding module are located on different single boards, the length of the physical link connected between the target processing module and the target optical module is effectively shortened.

[0086] The optical device shown in the embodiment includes a plurality of single boards. For the specific structure, please refer to the following examples. Example 1: Each single board included in the optical device includes the forwarding module, the processing module and the optical module shown in FIG. 5a. Example 2: The processing module and the optical module included in the optical device are located on the first single board, and the forwarding module is located on the second single board. Example 3: A part of the single boards included in the optical device are shown in the structure of Example 1, and the other part of the single boards are shown in Example 2.

[0087] Optionally, the target processing module shown in the embodiment includes a signal processor. In the downlink direction, the signal processor can be shown in at least one of the following examples.

[0088] Example 1: The signal processor is configured to compensate the attenuation of the first electrical signal transmitted by the first physical link.

[0089] For example, if it is determined in advance that the first electrical signal is transmitted by the processing module to the optical modulator of the target optical module via the first physical link, 12 decibels (dB) of attenuation is caused, and therefore the signal processor can compensate for the 12 dB of attenuation by using the CTLE, FFE or DFE to suppress ISI of the first electrical signal transmitted by the first physical link and improve signal quality.

[0090] Example 2, the signal processor is configured to compensate for attenuation of a first optical signal transmitted by the optical device to another optical device.

[0091] The TX channel of the target optical module is connected to another optical device through a first optical fiber, and then the signal processor can compensate for attenuation of a first optical signal transmitted by the TX channel to another optical device through the first optical fiber.

[0092] Example 3, the signal processor is configured to amplify power of a first electrical signal to be transmitted to the target optical module.

[0093] In this embodiment, the signal processor can include a DRV configured to amplify power of a first electrical signal to be transmitted to the target optical module.

[0094] The signal processor shown in this embodiment can only implement the above example 1. For example, the signal processor can implement the above example 1 and example 2. For example, the signal processor only implements the above example 2, and specifically, because the length of the first physical link is effectively shortened, the attenuation of the first electrical signal transmitted by the first physical link is reduced, and then the signal processor and the optical module do not include a module for compensating for the attenuation of the first electrical signal transmitted by the first physical link. For example, the signal processor can only implement the above example 3. For example, the signal processor can implement the above example 1 and example 3. For example, the signal processor can implement the above example 2 and example 3. For example, the signal processor can implement the above example 1, example 2 and example 3.

[0095] In the uplink direction, the signal processor can refer to at least one of the following examples:

[0096] Example 1, the signal processor is configured to compensate for attenuation of a second electrical signal transmitted by the second physical link.

[0097] For example, if it is determined in advance that the second electrical signal is transmitted by the optical detector of the optical module to the processing module via the second physical link, 12 dB of attenuation is caused, and therefore the signal processor can compensate for the 12 dB of attenuation by using the CTLE, FFE or DFE to suppress ISI of the second electrical signal transmitted by the second physical link and improve signal quality.

[0098] Example 2, the signal processor is configured to compensate for attenuation of the optical signal received by the optical device from another optical device.

[0099] The RX channel of the target optical module is connected to another optical device through a second optical fiber, and the RX channel receives a second optical signal from another optical device through the second optical fiber. The second optical signal transmitted through the second optical fiber will have a certain degree of attenuation. In order to suppress ISI and improve signal quality, the signal processor can compensate for the attenuation of the second optical signal transmitted through the second optical fiber.

[0100] Example 3, the signal processor is configured to amplify the power of the second electrical signal from the target optical module.

[0101] For example, the signal processor can integrate a level amplifier (LA), a load amplifier (LA), or an automatic gain control (AGC) to achieve power amplification.

[0102] The signal processor shown in the embodiment can only implement the above-mentioned example 1. For another example, the signal processor can implement the above-mentioned example 1 and example 2. For another example, the signal processor only implements the above-mentioned example 2. Specifically, because the length of the second physical link is effectively shortened, the attenuation of the second electrical signal transmitted by the second physical link is reduced, and the signal processor and the optical module do not include a module for compensating for the attenuation of the second electrical signal transmitted by the second physical link. For another example, the signal processor can only implement the above-mentioned example 3. For another example, the signal processor can implement the above-mentioned example 1 and example 3. For another example, the signal processor can implement the above-mentioned example 2 and example 3. For another example, the signal processor can implement the above-mentioned example 1, example 2, and example 3.

[0103] The following describes the structure of the optical device from the perspective of optical device packaging. FIG. 8 is an example diagram of a first packaging structure of an optical device provided by the present application. The outer housing 801 of the optical device shown in this example has a panel 802. A single board is fixed in the outer housing 801, which specifically includes a circuit board and a forwarding module, a processing module, and a connector, etc. packaged on the circuit board. The forwarding module and the processing module are described above in the embodiments, and will not be described in detail. One or more optical modules can be plugged into the panel 802, and the one or more optical modules are connected to the connector. The type of the connector is described in the corresponding description of FIG. 6, and will not be described in detail. The first physical link and the second physical link shown in this embodiment are described in the corresponding description of FIG. 6, and will not be described in detail. In this embodiment, the distance between the processing module and the panel 802 is less than the distance between the forwarding module and the panel 802, so that the length of the first physical link and the second physical link between the processing module and the optical module is effectively shortened. In this embodiment, the forwarding module, the processing module, the connector, and the optical module are all located on the same circuit board, as shown in the examples of FIGS. 5a and 5b. In other examples, the circuit board on which the forwarding module is located can be different from the circuit board on which the processing module, the connector, and the optical module are located, such as the example shown in FIG. 7.

[0104] FIG. 9 is an example diagram of a second packaging structure of an optical device provided by the present application. The outer housing 901 of the optical device shown in this example has a panel 902. A single board is fixed in the outer housing 901, which specifically includes a circuit board and a processing chip and a cable connector packaged on the circuit board. One or more optical modules can be plugged into the panel 902, and the one or more optical modules are connected to the connector. The type of the connector is described in the corresponding description of FIG. 6, and will not be described in detail. The cable connector packaged on the circuit board is used to connect the processing module and the connector, so that the electrical signals between the processing module and the connector are converted to the low-insertion-loss high-speed cable 903 for transmission. The high-speed cable 903 specifically includes a first cable and a second cable. Then, the first physical link includes the wiring of the circuit board connected between the processing module and the cable connector, the first cable connected between the cable connector and the connector, and the wiring of the backplane connected between the connector and the optical modulator. The backplane of the optical module is described in the corresponding description of FIG. 6, and will not be described in detail. The second physical link includes the wiring of the circuit board connected between the processing module and the cable connector, the second cable connected between the cable connector and the connector, and the wiring of the backplane connected between the connector and the optical detector.

[0105] This embodiment does not limit the packaging form of the optical module. For example, it can be an optical transceiver board (OTB), a near package optics (NPO), an on board optics (OBO), or a co-package optics (CPO).

[0106] Figure 10 is an example diagram of a second frame-type structure of the optical device provided in this application. The optical device shown in this embodiment includes a chassis 1000, which has a fixed backplane 1001. The backplane 1001 connects L single boards, for example, the backplane 1001 connects single boards 1011, 1012 to 101L respectively. In this embodiment, the value of L is not limited. The chassis 1000 may also include a power supply, a heat dissipation system, and auxiliary single boards. For details, please refer to the description corresponding to Figure 4, which will not be elaborated further. The backplane 1001 shown in this embodiment includes a forwarding module 1002. Taking single board 1011 as an example, single board 1011 includes a processing module 1003 and an optical module 1004. For a description of single board 1011, please refer to the descriptions corresponding to Figures 5a, 5b, 6, 8, and 9, which will not be elaborated further.

[0107] Figure 11 is an example diagram of the third frame-type structure of the optical device provided in this application. The optical device shown in this embodiment includes a chassis 1100, which has a fixed backplane 1101. The backplane 1101 is connected to L single boards, for example, the backplane 1101 connects single boards 1111, 1112 to single board 111L respectively. In this embodiment, the value of L is not limited. The chassis 1100 may also include a power supply, a heat dissipation system, and auxiliary single boards. For details, please refer to the description corresponding to Figure 4, which will not be repeated here. The single board 1112 shown in this embodiment includes a forwarding module 1123, and the single board 1111 includes a processing module 1121 and an optical module 1122. For descriptions of single boards 1111 and 1112, please refer to the description corresponding to Figure 7, which will not be repeated here. The forwarding module 1123 is connected to the processing module 1121 through the backplane 1101.

[0108] This application embodiment also provides a single board, which specifically includes a circuit board, and N processing modules and M optical modules connected to the surface of the circuit board. For details, please refer to the descriptions corresponding to Figures 7 and 11, which will not be repeated here.

[0109] This application embodiment also provides a single board, which specifically includes a circuit board, and a forwarding module, N processing modules and M optical modules connected to the surface of the circuit board. For details, please refer to the descriptions corresponding to Figures 5a, 5b, 6, 8, 9 and 10, which will not be elaborated further.

[0110] The embodiment of the present application further provides an optical module, which comprises at least one TX channel and at least one RX channel, the TX channel comprises an optical modulator, and the RX channel comprises an optical detector. The optical module does not comprise a module for performing electrical signal attenuation compensation. For details of the specific structure of the optical module, refer to the corresponding description of Fig. 6, and details are not described herein.

[0111] The embodiment of the present application further provides an optical network, which comprises an optical network terminal device and an optical network terminal device. For details of the structure of the optical network, refer to the corresponding description of Fig. 1 and Fig. 2, and details are not described herein.

[0112] Those skilled in the art can clearly understand that, in the several embodiments provided in the present application, it should be understood that the disclosed system, device and equipment can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or other forms.

[0113] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. According to actual needs, part or all of the units can be selected to achieve the purpose of the embodiment scheme.

[0114] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

Claims

1. A light device, characterized by The optical device comprises a forwarding module, N processing modules and M optical modules, wherein N and M are any integers greater than 1, the forwarding module is connected with each of the N processing modules, the N processing modules comprise a target processing module, and the M optical modules comprise a target optical module; The target optical module comprises an optical modulator, the optical modulator is connected with the target processing module through a first physical link, the forwarding module is configured to forward first data to the target processing module, the target processing module is configured to perform digital signal processing on the first data to obtain a first electrical signal, the optical modulator is configured to perform electro-optical conversion on the first electrical signal to obtain a first optical signal, and the first optical signal is emitted. Or, The target optical module comprises an optical detector, the optical detector is connected with the target processing module through a second physical link, the optical detector is configured to perform photoelectric conversion on a second optical signal to obtain a second electrical signal, the target processing module is configured to perform digital signal processing on the second electrical signal to obtain second data, and the forwarding module is configured to forward the second data.

2. The light device of claim 1, wherein, The first physical link is not greater than 5 inches in length, and / or the second physical link is not greater than 5 inches in length.

3. The light device according to claim 1 or 2, characterized in that, N is 4, and M is 16, wherein each of the 4 processing modules is connected with 4 optical modules.

4. The light device according to any one of claims 1 to 3, characterized in that, The distance between the target optical module and the target processing module is less than the distance between the target optical module and the forwarding module, and the distance between the target optical module and the target processing module is less than or equal to the distance between the target optical module and any of the N processing modules.

5. The light device according to any one of claims 1 to 4, characterized in that, The optical device further comprises a circuit board, a surface of the circuit board comprises the forwarding module, a first region and a second region, a plurality of the optical modules are arranged in a column in the first region, and a plurality of the processing modules are arranged in a column in the second region, wherein the second region is located between the first region and the forwarding module.

6. The light device of claim 5, wherein, With respect to the circuit board, the plurality of optical modules in the first region and the plurality of processing modules in the second region extend in the same direction.

7. The light device according to any one of claims 1 to 6, characterized in that, The optical device comprises a first single board and a second single board, the first single board comprises a plurality of the processing modules and a plurality of the optical modules, and the second single board comprises the forwarding module.

8. The light device of claim 7, wherein, The first single board comprises a first circuit board, the second single board comprises a second circuit board, a surface of the second circuit board comprises the forwarding module, a surface of the first circuit board comprises a third region and a fourth region, the plurality of optical modules are arranged in a column in the third region, and the plurality of processing modules are arranged in a column in the fourth region.

9. The light device according to any one of claims 1 to 8, characterized in that, The optical device has an outer shell, the forwarding module and the N processing modules are located in the outer shell, the outer shell comprises a panel, the optical modules are plugged into the panel, and the distance between the processing modules and the panel is less than the distance between the forwarding module and the panel.

10. The light device according to any one of claims 1 to 9, characterized in that, The target processing module comprises a signal processor configured to at least one of: amplify power, compensate for attenuation of electrical signals transmitted by the first physical link, compensate for attenuation of electrical signals transmitted by the second physical link, or compensate for attenuation of optical signals transmitted between the optical device and another optical device.

11. The light device according to any one of claims 1 to 10, characterized by The optical modulator is a low-driving-pressure optical modulator.

12. The light device according to any one of claims 1 to 10, characterized by The target optical module further comprises a driver connected between the optical modulator and the target processing module, the first physical link comprises a physical link between the target processing module and the driver, and a physical link between the driver and the optical modulator.

13. The light device according to any one of claims 1 to 12, characterized by The target optical module further comprises an amplifier connected between the optical detector and the target processing module, the second physical link comprises a physical link between the target processing module and the amplifier, and a physical link between the amplifier and the optical detector.

14. The light device according to any one of claims 1 to 13, characterized by The modulation rate of the optical modulator is not less than a preset rate, or the detection rate of the optical detector is not less than the preset rate, and the preset rate is 24 gigabits per second.

15. The light device according to any one of claims 1 to 14, characterized by The optical device comprises a circuit board, a surface of the circuit board comprises the target processing module and a first connector, the target optical module is connected to the first connector through plugging, and the target optical module comprises a bottom plate; The surface of the bottom plate comprises the optical modulator, the first physical link comprises a wire of the circuit board connected between the target processing module and the first connector, and a wire of the bottom plate connected between the first connector and the optical modulator; The surface of the bottom plate comprises the optical detector, the second physical link comprises a wire of the circuit board connected between the target processing module and the first connector, and a wire of the bottom plate connected between the first connector and the optical detector.

16. The light device according to any one of claims 1 to 14, characterized by The optical device comprises a circuit board, a surface of the circuit board comprises the target processing module and a cable connector, the optical device further comprises a second connector, the target optical module is connected to the second connector through plugging, and the target optical module comprises a bottom plate; The surface of the bottom plate comprises the optical modulator, the first physical link comprises a wire of the circuit board connected between the target processing module and the cable connector, a first cable connected between the cable connector and the second connector, and a wire of the bottom plate connected between the second connector and the optical modulator; The surface of the bottom plate comprises the optical detector, the second physical link comprises a wire of the circuit board connected between the target processing module and the cable connector, a second cable connected between the cable connector and the second connector, and a wire of the bottom plate connected between the second connector and the optical detector.

17. A veneer, characterized by The optical device comprises N processing modules and M optical modules, N and M are any integers greater than 1, the N processing modules comprise a target processing module, and the M optical modules comprise a target optical module; The target optical module comprises an optical modulator connected with the target processing module through a first physical link, the target processing module is configured to perform digital signal processing on the first data to obtain a first electrical signal, and the optical modulator is configured to perform electro-optical conversion on the first electrical signal to obtain a first optical signal and emit the first optical signal. Or, The target optical module comprises an optical detector connected with the target processing module through a second physical link, the optical detector is configured to perform photoelectric conversion on a second optical signal to obtain a second electrical signal, and the target processing module is configured to perform digital signal processing on the second electrical signal to obtain second data.

18. The veneer of claim 17, wherein, The single board further comprises a forwarding module connected with each of the N processing modules, the forwarding module is configured to forward the first data to the target processing module, or configured to forward the second data from the target processing.

19. The veneer according to claim 17 or 18, characterized in that The first physical link is not longer than 5 inches, and / or the second physical link is not longer than 5 inches.

20. An optical network, characterized by The optical device and at least one optical network terminal device are provided, and the optical device is as claimed in any one of claims 1 to 16.

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