Metal foil, method of manufacturing same, and deposition mask using same

Abstract

The present invention provides a metal foil comprising: an alloy base material containing iron (Fe) and nickel (Ni); and a coating layer formed on the alloy base material, wherein the coating layer is paramagnetic.

Description

Metal foil, its manufacturing method and deposition mask using the same

[0001] The present invention relates to a metal foil, a method for manufacturing the same, and a deposition mask using the same. More specifically, the present invention relates to an alloy metal foil, a deposition mask for depositing an OLED organic light-emitting layer, and a method for manufacturing the same.

[0002]

[0003] Typically, an organic light-emitting diode (OLED) is a thin-film light-emitting diode (LED) whose light-emitting layer is composed of an organic compound. OLEDs are manufactured by laminating a substrate, an organic light-emitting layer, a protective layer, and a window. The organic light-emitting layer is formed by depositing organic materials through a deposition process using a patterned deposition mask (FMM).

[0004] The deposition mask mainly uses a metal plate to form patterned through holes, and since it must be manufactured into a thin film for vaporized organic substances to pass through and be deposited on the substrate, an iron (Fe)-nickel (Ni) Invar alloy metal foil with high elongation and low coefficient of thermal expansion is mainly used.

[0005] Invar alloy metal foil is mainly made by rolling iron-nickel alloy to make a thin sheet and then etching it, but due to limitations in the rolling process, it is difficult to manufacture masks smaller than 7 ㎛, and it is not suitable for the production of recent high-resolution OLED displays.

[0006] Recently, a bottom-up electroplating technique, rather than the conventional top-down method, has been introduced, and research is actively underway to manufacture an invar sheet using electroplating and use it as a deposition mask. However, a method for controlling the thermal properties of a metal foil by forming an additional coating layer on a plated invar metal foil has not been disclosed.

[0007] As a background technology of the present invention, a deposition mask, a deposition mask preparation body, a method for manufacturing a deposition mask, and a method for manufacturing an organic semiconductor device are disclosed in Korean Patent Publication No. 10-2418817.

[0008]

[0009] The purpose of the present invention is to form a coating layer containing a magnetic metal on an alloy metal foil manufactured by plating invar, thereby changing the thermal characteristics of the base material itself and increasing the usability of the metal foil, thereby utilizing the metal foil as a deposition mask for OLED.

[0010] Another object of the present invention is to provide a method for manufacturing an alloy metal foil having a coating layer formed thereon that can change the thermal properties of a plating invar.

[0011] Another object of the present invention is to provide a mask for deposition of an organic light-emitting device including the metal foil.

[0012] The above and other objects of the present invention can all be achieved by the present invention described below.

[0013]

[0014] 1. One aspect of the present invention relates to a metal foil.

[0015] The above metal foil includes an alloy base material containing iron (Fe) and nickel (Ni); and a coating layer formed on the alloy base material; and the coating layer is a paramagnetic material.

[0016] 2. In the above 1 specific example, the alloy base material can be formed as a plating layer having a thickness of 1.0 µm to 50 µm.

[0017] 3. In the above 1 or 2 specific examples, the alloy base material may be composed of 35 wt% to 45 wt% of nickel (Ni) and the remainder of iron (Fe).

[0018] 4. In any one of the above embodiments 1 to 3, the alloy base material may further include phosphorus (P), chromium (Cr), or both.

[0019] 5. In any one of the specific examples 1 to 4 above, the coating layer may include at least one of iron (Fe), aluminum (Al), nickel (Ni), molybdenum (Mo), tungsten (W), chromium (Cr), and an alloy containing these.

[0020] 6. In any one of the specific examples 1 to 5 above, the thickness of the coating layer may be 0.1 µm to 5.0 µm.

[0021] 7. In any one of the specific examples 1 to 6 above, the coating layer may be formed on one or both sides of the alloy base material.

[0022] 8. In any one of the specific examples 1 to 7 above, the coating layer may have a multilayer structure in which an outer layer is formed on the surface.

[0023] 9. In any one of the above 1 to 8 specific examples, the metal foil may satisfy the following equation 1:

[0024] [Formula 1]

[0025] α= C - a Х T

[0026] In the above equation 1, α is the thermal expansion coefficient of the metal foil after the coating layer is formed, C is the initial thermal expansion coefficient of the alloy base material, a is a conversion constant of 0.001 to 0.009, and T is the thickness of the coating layer (nm).

[0027] 10. Another aspect of the present invention relates to a mask for deposition of an organic light-emitting device including the metal foil.

[0028] 11. Another aspect of the present invention relates to a method for manufacturing a metal foil.

[0029] The above metal foil manufacturing method comprises the steps of forming a base material by electroplating an alloy plating solution containing nickel (Ni) and iron (Fe) on a substrate;

[0030] (b) a step of forming a coating layer on the upper surface of the base material; and characterized in that the coating layer contains 35 wt% to 45 wt% of nickel with respect to the entire base material, and is a paramagnetic material.

[0031] 12. In the above 11 specific examples, the alloy plating solution may further include phosphorus (P), chromium (Cr), or both.

[0032] 13. In the above 11 or 12 specific examples, the thickness of the base material may be 1.0 µm to 50 µm.

[0033] 14. In any one of the specific examples 11 to 13 above, the thickness of the coating layer may be 0.1 μm to 5.0 μm.

[0034] 15. In any one of the specific examples 11 to 14 above, the coating layer may be formed by one of the metal deposition methods among electroplating, electroless plating, and spraying, or one of the deposition methods among CVD, PVD, and PECVD.

[0035]

[0036] The metal foil according to the present invention can increase the usability of the metal foil by changing the thermal properties of the base material, particularly the coefficient of thermal expansion (CTE), depending on the formation of the coating layer. The metal foil is formed by electroplating, allowing for free determination of the pattern and thickness. With the formation of the coating layer and improved thermal properties, it can be utilized as a mask for deposition of organic light-emitting devices.

[0037] The present invention provides a new perspective that can change the thermal properties of an alloy base material when a magnetic coating layer is formed on the alloy base material with a certain thickness.

[0038] A method for manufacturing a metal foil according to another aspect of the present invention can increase manufacturing efficiency by manufacturing a base material by electroplating and forming a magnetic coating layer through a consistent process, and can effectively change the thermal properties of the base material.

[0039] According to another aspect of the present invention, a deposition mask has an increased degree of freedom in determining patterns and thicknesses, and can be used for deposition of high-resolution organic light-emitting devices.

[0040]

[0041] Figure 1 is a cross-sectional side view of a metal foil according to one specific example of the present invention.

[0042] FIG. 2 is a cross-sectional side view of a metal foil having a coating layer formed over the entire pattern hole according to one specific example of the present invention.

[0043] FIG. 3 is a cross-sectional side view of a metal foil having a pattern hole formed therein and a coating layer formed on one surface of a base material according to one specific example of the present invention.

[0044] FIG. 4 is a side cross-sectional view of a metal foil having a pattern hole formed therein and a coating layer formed on both sides of a base material according to one specific example of the present invention.

[0045] FIG. 5 is a cross-sectional side view of a multilayer metal foil having an outer surface formed on a coating layer surface according to one specific example of the present invention.

[0046] FIG. 6 is a cross-sectional side view of a metal foil in which a pattern hole is formed according to one specific example of the present invention, a coating layer is formed, and then a plating layer is formed.

[0047] FIG. 7 is a plan view of a deposition mask stick including a metal foil according to another specific example of the present invention.

[0048] Figure 8 is a process flow diagram of a method for manufacturing a metal foil according to another aspect of the present invention.

[0049] Figure 9 is a graph showing changes in the coefficient of thermal expansion according to changes in the thickness of the coating layer of a metal foil according to one specific example of the present invention.

[0050]

[0051] Hereinafter, the present invention will be described in more detail with reference to the attached drawings. However, the drawings are provided solely to aid understanding of the present invention and are not intended to limit the present invention. Furthermore, the shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings are exemplary and the present invention is not limited to the details depicted.

[0052] Throughout the specification, identical reference numerals designate identical components. Furthermore, in describing the present invention, detailed descriptions of related known technologies are omitted if they are deemed to unnecessarily obscure the gist of the present invention.

[0053] In the specification, when "includes," "has," and "consists of" are used, other parts may be added unless "only" is used. When a component is expressed in the singular, it includes cases where the plural is included unless there is a special explicit description.

[0054] When interpreting a component, it is interpreted as including the error range even if there is no separate explicit description.

[0055] When the positional relationship between two parts is described as 'on top of', 'upper part of', 'lower part of', 'next to', etc., one or more other parts can be located between the two parts unless 'right away' or 'directly' is used.

[0056] Positional relationships such as "upper," "top surface," "lower surface," and "lower surface" are merely described based on the drawing and do not represent absolute positional relationships. In other words, depending on the viewing position, the positions of "upper" and "lower" or "upper surface" and "lower surface" may change.

[0057] In this specification, “a to b” indicating a numerical range is defined as “홢 and 헰”.

[0058]

[0059] The inventor of the present invention confirmed that when a metal coating layer is formed on the surface of an Invar alloy metal foil manufactured by a galvanizing method, the thermal characteristics of the entire metal foil change, and in particular, when a paramagnetic metal is coated to a certain thickness, the thermal characteristics of the entire metal foil can change, thereby completing the present invention.

[0060] In the present invention, 'paramagnetic' is a material that has magnetic properties when an external magnetic field is present, but loses its magnetic properties again when the external magnetic field disappears, and has a magnetic susceptibility (Xe) of 10 -5 10 inland -2 It refers to a material that is human. Examples of the above 'paramagnetic material' include, but are not limited to, iron (Fe), aluminum (Al), nickel (Ni), cobalt (Co), molybdenum (Mo), tungsten (W), chromium (Cr), cesium (Cs), tin (Sn), manganese (Mn), vanadium (V), or alloys thereof, and may include all known paramagnetic materials.

[0061] Hereinafter, a metal foil according to one specific example of the present invention will be described in detail with reference to the drawings.

[0062] FIG. 1 is a side cross-sectional view of a metal foil according to one specific example of the present invention, FIG. 2 is a side cross-sectional view of a metal foil having a coating layer formed over the entire pattern hole according to one specific example of the present invention, FIG. 3 is a side cross-sectional view of a metal foil having a pattern hole formed thereon and a coating layer formed on one surface of a base material according to one specific example of the present invention, FIG. 4 is a side cross-sectional view of a metal foil having a pattern hole formed thereon and a coating layer formed on both surfaces of a base material according to one specific example of the present invention, FIG. 5 is a side cross-sectional view of a metal foil having a multilayer structure in which an outer side is formed on the surface of a coating layer according to one specific example of the present invention, and FIG. 6 is a side cross-sectional view of a metal foil having a pattern hole formed thereon and a plating layer formed thereon after the coating layer is formed according to one specific example of the present invention.

[0063] Referring to FIGS. 1 to 6, the metal foil (1000) includes an alloy base material (100) and a coating layer (200).

[0064] The above alloy base material (100) is an alloy that contains iron (Fe) and nickel (Ni) and is formed by a plating method.

[0065] The above alloy base material (100) contains nickel, so that the thermal expansion rate can be reduced and the thermal shrinkage according to temperature can be reduced.

[0066] When the above alloy base material (100) is a plated Invar alloy, the alloy base material (100) can be formed by easily controlling the alloy thickness in a bottom-up manner on the substrate, and for example, by forming a base material of 20 ㎛ or less (1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, or 20 ㎛), preferably 7 ㎛ or less (1, 2, 3, 4, 5, 6, or 7 ㎛), it is possible to design deposition masks of various thicknesses that cannot be manufactured by a rolling method, and it is also possible to manufacture an alloy base material (100) in which pattern holes are formed in various patterns.

[0067] In one specific example, the alloy base material (100) has a thickness of 1.0 μm to 50 μm (e.g., 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, 4.0, 4.1, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7, 4.8, 4.9, 5.0, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, or 50 μm in thickness.

[0068] The above plating layer can be formed by electroplating the plating solution.

[0069] Electroforming is a metal forming process that uses the principle of electroplating to plate a base material (mandrel or master) and then separate the plated layer to manufacture and replicate parts.

[0070] The above alloy base material (100) may be manufactured by a plating method and formed as a plating layer on a substrate, and then obtained by separating it from the substrate.

[0071] The thermal characteristics of the entire alloy base material (100) may change due to the influence of the coating layer laminated on the base material.

[0072] The above alloy base material (100) may include 35 wt% to 45 wt% of nickel (Ni) and the remainder of iron (Fe).

[0073] Within the above range, an alloy base material (100) can be manufactured by electroplating including nickel, and if it is outside the above range, it is difficult to manufacture an alloy base material (100) by electroplating.

[0074] In one specific example, the alloy base material (100) may further include phosphorus (P), chromium (Cr), or both. The alloy base material (100) may be a binary alloy including nickel and iron, FeNi, or a ternary alloy base material (100) including phosphorus and chromium, FeNi-X, for example, FeNi-Cr or FeNi-P. Even in the case of a ternary alloy base material (100) including FeNi-X, a coating layer may be formed to change the thermal characteristics.

[0075] The above coating layer (200) is formed on the alloy base material (100).

[0076] The above coating layer (200) can be formed on one side, both sides, or all sides forming the surface of the alloy base material (100).

[0077] The above coating layer (200) is paramagnetic.

[0078] If the coating layer (200) is a paramagnetic material, the thermal characteristics of the alloy base material (100) may be changed, and thus the thermal characteristics of the entire metal foil may be changed. For example, if the coating layer (200) is formed of a paramagnetic material, a thermal shrinkage characteristic may appear due to a magnetic volume effect as the temperature increases.

[0079] More specifically, the thermal expansion coefficient of the alloy base material (100) can be determined according to Equation 2 below.

[0080] [Formula 2]

[0081] α=tan δ - K(σs / Tc)

[0082] Here, α is the coefficient of thermal expansion (CTE), tan δ is a constant representing the magnetic material expansion, K is a conversion factor, δs is the saturation magnetization value, and Tc is the Curie temperature.

[0083] When a coating layer (200) is formed on the above alloy base material (100), the saturation magnetization value can be increased, and when the saturation magnetization value is increased, the thermal expansion coefficient of the metal foil can be decreased. In particular, when the coating layer (200) is formed using a paramagnetic material, the saturation magnetization value is significantly increased, and the thermal expansion coefficient of the entire metal foil (1000) can be decreased.

[0084] In one specific example, the coating layer may be one or more of iron (Fe), aluminum (Al), nickel (Ni), molybdenum (Mo), tungsten (W), chromium (Cr), and alloys thereof. For example, the coating layer may include one or more of iron, aluminum, nickel, molybdenum, tungsten, and chromium, or one or more alloys thereof.

[0085] The above metals can exhibit paramagnetism, and in particular, molybdenum (Mo), tungsten (W), and chromium (Cr) are preferable because they have large molecular weights and can effectively increase the saturation magnetization value of the metal foil by forming a coating layer when the alloy base material (100) is made of Fe-Ni.

[0086] In one specific example, the thickness of the coating layer (200) is 0.1 ㎛ to 5.0 ㎛ (e.g., 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, 4.0, 4.1, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7, 4.8, 4.9 or 5.0 μm).

[0087] Within the above range, the coefficient of thermal expansion can be linearly reduced, and the effect of thermal characteristic changes can be exhibited. In addition, within the above range, the influence of the coefficient of thermal expansion of the metal itself included in the coating layer (200) can be excluded, and the problem of the coefficient of thermal expansion of the metal foil (1000) increasing can be prevented.

[0088] Referring to FIGS. 2 to 4, in one specific example, the coating layer (200) may be formed on one or both sides of the alloy base material (100).

[0089] Since the above coating layer (200) can be formed by an electrodeposition or deposition method, it can be selectively formed on one or both sides of the alloy base material (100).

[0090] When the above coating layer (200) is formed on one or both sides, the thermal characteristics of the metal foil (1000) can be changed.

[0091] In one specific example, the alloy base material (100) may have a pattern hole (300) formed therein.

[0092] Since the above alloy base material (100) is formed by a plating method, pattern holes (300) can be formed in various patterns.

[0093] The above pattern hole (300) is formed by fine penetration holes according to a certain pattern. While it is difficult to form various patterns using the rolling casting method, various pattern designs are possible when forming the alloy base material (100) using the electroplating method.

[0094] Specifically, the pattern hole (300) can be formed by applying photoresist to a substrate, depositing an optical mask having a certain pattern, exposing the substrate to light to form a plating layer by electroplating on the patterned substrate, and then removing the photoresist.

[0095] The diameter of the above pattern hole (300) may be 30 ㎛ or less (1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 or 30 ㎛), and for example, may be 10 ㎛ or more and 25 ㎛ or less (15, 16, 17, 18, 19, 20, 21, 22, 23, 24 or 25 ㎛). When a pattern hole (300) is formed within the above range, the metal foil (1000) can be used as a mask for deposition of an organic light-emitting element, and high-temperature organic substances can smoothly pass through and be deposited on a substrate, which is advantageous for forming high-resolution pixels. Within the above range, a high resolution can be maintained, and the organic substance can be prevented from remaining within the pattern hole (300) while passing through the pattern hole (300) and affecting the quality of the pixels.

[0096] In one specific example, a multilayer structure with an outer surface formed on the surface of the coating layer (200) can be formed. For example, after the coating layer (200) is formed, a plating layer (110) can be further formed by electroplating.

[0097] Referring to FIGS. 5 and 6, the plating layer (110) is formed by electroplating and can be additionally formed without being restricted by the shape of the coating layer (200). The coating layer (200) is formed and then the plating layer (110) is laminated again to form a multilayer structure. In this case, the thermal characteristics of the metal foil (1000) can also be effectively changed.

[0098] In one specific example, the coating layer (200) may have a coefficient of thermal expansion of the alloy base material that can be changed according to Equation 1 below.

[0099] [Formula 1]

[0100] α= C - a ХT

[0101] In the above equation 1, α is the thermal expansion coefficient of the metal foil (1000) after the formation of the coating layer (200), C is the initial thermal expansion coefficient of the alloy base material (100), a is a conversion constant of 0.001 to 0.009, and T is the thickness (nm) of the coating layer (200).

[0102] When the above coating layer (200) is formed, the thermal characteristics of the metal foil (1000) change, and a linear decrease in thermal expansion coefficient according to thickness may be exhibited.

[0103] Accordingly, according to one specific example of the present invention, the metal foil is a plated invar and has a magnetic coating layer, so that the thermal properties of the metal foil itself can be changed. In particular, it provides a new perspective in which the coefficient of thermal expansion can be reduced depending on the thickness of the coating layer, which is a paramagnetic substance.

[0104] Another aspect of the present invention provides a mask for deposition of an organic light-emitting device including the metal foil.

[0105] FIG. 7 is a plan view of a deposition mask stick including a metal foil according to another specific example of the present invention.

[0106] Referring to FIG. 7, the deposition mask is formed with a metal foil (1000) in a certain pattern and fixed to a metal stick (500), so that an organic material can pass through it during the organic material deposition process during OLED manufacturing to be deposited on a substrate to form high-resolution pixels.

[0107] Another aspect of the present invention relates to a method for manufacturing a deposition mask.

[0108] Figure 8 is a process flow diagram of a method for manufacturing a metal foil according to another aspect of the present invention.

[0109] Referring to Fig. 8, first, an alloy plating solution containing nickel and iron is electroplated onto a substrate to form a base material (S100).

[0110] In one specific example, the alloy plating solution may be a plating solution for forming an Fe-Ni binary alloy including nickel (Ni) and iron (Fe), or for forming an Fe-Ni-X ternary alloy including nickel, iron, phosphorus, and chromium.

[0111] The base material manufactured with the above alloy plating solution may contain nickel in an amount of 35 wt% to 45 wt% of the total content.

[0112] When nickel in the above range is included, the plating layer formed by electroplating can exhibit a low coefficient of thermal expansion, can change the thermal properties of the base material itself formed by the plating layer, and can also increase mechanical strength.

[0113] A coating layer is formed on the upper part of the above-mentioned base material (S200).

[0114] The above coating layer is a paramagnetic material, and when the above coating layer is a paramagnetic material, the thermal properties of the metal foil change, and in particular, the thermal expansion coefficient can be linearly reduced within a certain thickness.

[0115] In one specific example, the parent material has a thickness of 1.0 μm to 50 μm (e.g., 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, 4.0, 4.1, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7, 4.8, 4.9, 5.0, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, or 50 μm).

[0116] Within the above range, a base material can be formed by electroplating and used as a mask for deposition of organic light-emitting devices, and the mechanical properties can be improved so that a coating layer can be formed on top.

[0117] In one specific example, the thickness of the coating layer is 0.1 ㎛ to 5.0 ㎛ (e.g., 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, 4.0, 4.1, 4.2, 4.3, 4.4, 4.5, 4.6, 4.7, 4.8, 4.9 or 5.0 μm).

[0118] When the thickness of the above-mentioned base material is formed within the above range and the coating layer is formed on top of the above-mentioned base material within the above range, the thermal characteristics of the metal foil change, thereby achieving the effects of the present invention. In particular, the coefficient of thermal expansion decreases linearly within the thickness range of the coating layer, thereby allowing prediction of changes in the thermal characteristics of the metal foil.

[0119] In one specific example, the formation of the metal coating layer may be performed by deposition of one of CVD, PVD, and PECVD, or the formation of the metal coating layer may be performed by metal deposition of one of electroplating, electroless plating, and thermal spraying.

[0120] The above type of deposition method can increase the area of ​​coating layer formation and form a uniform thickness. The above type of electrodeposition method can increase the surface area by varying the roughness.

[0121]

[0122] Hereinafter, preferred examples are presented to help understand the present invention, but the following examples are only to illustrate the present invention and the scope of the present invention is not limited to the following examples.

[0123]

[0124] Example 1

[0125] A Fe-36Ni alloy containing 36 wt% nickel and 50 μm in thickness was prepared as a base material by electroplating a substrate with an alloy plating solution containing nickel and iron, and molybdenum (Mo) was vacuum-deposited as a metal precursor to form a 100 nm thick coating layer on the entire surface of the base material to manufacture a metal foil.

[0126]

[0127] Example 2

[0128] A metal foil was manufactured using the same method as Example 1, but the metal foil was manufactured with a coating layer thickness of 200 nm.

[0129]

[0130] Example 3

[0131] A metal foil was manufactured using the same method as Example 1, but the metal foil was manufactured with a coating layer thickness of 400 nm.

[0132]

[0133] Comparative Example 1

[0134] An alloy base material was manufactured using the same electroforming method as in Example 1, and the metal foil was recovered after washing without forming a coating layer.

[0135]

[0136] Comparative examples 2 to 4

[0137] An alloy base material was manufactured using the same electroforming method as in Example 1, and titanium (Ti) powder as a metal precursor was vacuum-deposited to form a coating layer with a thickness of 100 nm to 300 nm over the entire surface of the base material, and the metal foil was recovered.

[0138]

[0139] Comparative examples 5 to 7

[0140] An alloy base material was manufactured using the same electroforming method as in Example 1, and cobalt (Co) powder as a metal precursor was vacuum-deposited to form a coating layer with a thickness of 100 nm to 300 nm over the entire surface of the base material, and the metal foil was recovered.

[0141]

[0142] Comparative examples 8 to 10

[0143] An alloy base material was manufactured using the same electroforming method as in Example 1, and aluminum oxide (Al2O3) powder as a metal precursor was vacuum-deposited to form a coating layer with a thickness of 100 nm to 300 nm over the entire surface of the base material, and the metal foil was recovered.

[0144]

[0145] Thermal property evaluation

[0146] The thermal expansion coefficient of the recovered metal foil was measured.

[0147] 1. Experimental conditions

[0148] Analysis equipment: TMA equipment_Film / Fiber mode (TA, Q400 model)

[0149] Sample length: 16mm

[0150] Measurement load: 0.05N

[0151] Measurement temperature range: RT~63℃ Heating rate: 5℃ / min

[0152] The analysis data acquisition range was limited to 35-60℃, and the two repeated (1st / 2nd) measurement values ​​and their average values ​​were obtained.

[0153] 2. Analysis results

[0154] Figure 9 is a graph showing changes in the coefficient of thermal expansion according to changes in the thickness of the coating layer of a metal foil according to one specific example of the present invention.

[0155] Coating layer thickness (nm) 1st measurement (ppm / ℃) 2nd measurement (ppm / ℃) Average (ppm / ℃) Comparative example 104.544.574.56 Example 11004.43.994.195 Example 22003.113.213.16 Example 34002.912.812.86

[0156] Table 1 above shows the measured values ​​of the coating layer thickness and the corresponding thermal expansion coefficient.

[0157] Referring to FIG. 10 and Table 1, it can be seen that the coefficient of thermal expansion linearly decreases depending on the thickness of the coating layer within the scope of the embodiment of the present invention, and it was confirmed that when a paramagnetic coating layer is formed on a plated Invar alloy base material within a certain thickness range, the thermal characteristics change and the coefficient of thermal expansion decreases.

[0158] Coating materialCoating layer thickness (nm)1st measurement (ppm / ℃)2nd measurement (ppm / ℃)Average (ppm / ℃)Comparative example 1-04.544.574.56Comparative example 2Ti1004.964.464.71Comparative example 3Ti2004.944.884.91Comparative example 4Ti3005.014.914.96Comparative example 5Co1005.135.115.12Comparative example 6Co2006.156.106.13Comparative example 7Co3006.886.856.87Comparative example 8Al2O31004.484.384.43Comparative example 9Al2O32004.554.694.62Comparative example 10Al2O33004.574.784.68

[0159] Table 2 above shows the change in the coefficient of thermal expansion according to the thickness of the coating layer in Comparative Examples 1 to 10 when the coating layer is not a paramagnetic metal. Referring to Table 2, it was confirmed that the coefficient of thermal expansion of materials other than paramagnetic metals does not decrease even when a coating layer is formed, and that the effect of decreasing the coefficient of thermal expansion according to an increase in thickness is not exhibited.

[0160] The present invention has been described above, focusing on specific embodiments. Those skilled in the art will appreciate that the present invention can be implemented in modified forms without departing from its essential characteristics. Therefore, the disclosed embodiments should be considered illustrative rather than limiting. The scope of the present invention is set forth in the claims, not the foregoing description, and all differences within the scope equivalent thereto should be construed as being encompassed by the present invention.

Claims

1. An alloy base material containing iron (Fe) and nickel (Ni); and A coating layer formed on the above alloy base material; The above coating layer is a paramagnetic material, Metal foil.

2. In the first paragraph, the alloy base material is a metal foil having a thickness of 1.0 ㎛ to 50 ㎛.

3. A metal foil according to claim 1 or 2, wherein the alloy base material is composed of 35 wt% to 45 wt% of nickel (Ni) and the remainder of iron (Fe).

4. A metal foil according to any one of claims 1 to 3, wherein the alloy base material further contains phosphorus (P), chromium (Cr), or both.

5. A metal foil according to any one of claims 1 to 3, wherein the coating layer comprises at least one of iron (Fe), aluminum (Al), nickel (Ni), molybdenum (Mo), tungsten (W), chromium (Cr), and an alloy containing these.

6. A metal foil according to any one of claims 1 to 5, wherein the thickness of the coating layer is 0.1 µm to 5.0 µm.

7. A metal foil according to any one of claims 1 to 7, wherein the coating layer is formed on one or both sides of the alloy base material.

8. A metal foil having a multilayer structure in which an outer layer is formed on the surface of the coating layer according to any one of claims 1 to 7.

9. In any one of the first to eighth clauses, a metal foil satisfying the following formula 1: [Formula 1] α= C - a Х T In the above equation 1, α is the thermal expansion coefficient of the metal foil after the coating layer is formed, C is the initial thermal expansion coefficient of the alloy base material, a is a conversion constant of 0.001 to 0.009, and T is the thickness (nm) of the coating layer.

10. A mask for deposition of an organic light-emitting device comprising a metal foil according to any one of claims 1 to 9. 11.(a) A step of forming a base material by electroplating an alloy plating solution containing nickel (Ni) and iron (Fe) on a substrate; (b) a step of forming a coating layer on the upper surface of the above-mentioned parent material; The above-mentioned base material contains nickel in an amount of 35 wt% to 45 wt%, A method for manufacturing a metal foil, wherein the above coating layer is a paramagnetic material.

12. A method for manufacturing a metal foil in claim 11, wherein the alloy plating solution further contains phosphorus (P), chromium (Cr), or both.

13. A method for manufacturing a metal foil according to claim 11 or 12, wherein the thickness of the base material is 1.0 µm to 50 µm.

14. A method for manufacturing a metal foil according to any one of claims 11 to 13, wherein the thickness of the coating layer is 0.1 µm to 5.0 µm.

15. A method for manufacturing a metal foil according to any one of claims 11 to 14, wherein the coating layer is formed by one of the metal deposition methods of electroplating, electroless plating, and spraying, or one of the deposition methods of CVD, PVD, and PECVD.

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