Heat dissipation device and heat dissipation module including same

Abstract

The present invention relates to a heat dissipation device and a heat dissipation module including same, the device comprising: a heat accommodation unit for collecting the heat generated by heating elements; and a heat emission unit having at least a front end that extends to the outside of a housing body having the heating elements so as to diffuse and exchange the heat collected in the heat accommodation unit, thereby occupying a part of a heat exchange area, wherein the heat accommodation unit is coupled by a welding coupling method after passing through a slit hole-type fixing slit, which is formed in a coupling heat transfer body that mediates coupling to the housing body, and a reinforcing fixing clip, which reinforces an end portion of the fixing slit, such that product reliability can be improved.

Description

Heat dissipation device and heat dissipation module including the same

[0001] The present invention relates to a heat dissipation device and a heat dissipation module including the same, and more particularly, to a heat dissipation device and a heat dissipation module including the same that can improve the heat dissipation performance of an electronic device that generates a lot of heat during operation, including an antenna device.

[0002] Wireless communication technology, for example, MIMO (Multiple Input Multiple Output) technology is a technology that dramatically increases data transmission capacity by using multiple antennas. It is a spatial multiplexing technique in which the transmitter transmits different data through each transmission antenna, and the receiver distinguishes the transmission data through appropriate signal processing.

[0003] Therefore, by simultaneously increasing the number of transmit and receive antennas, channel capacity increases, enabling the transmission of more data. For example, increasing the number of antennas to 10 would secure approximately 10 times the channel capacity using the same frequency band compared to the current single-antenna system.

[0004] 4G LTE-advanced uses up to eight antennas, and products equipped with 64 or 128 antennas have already been developed in the pre-5G stage. 5G will use base station equipment with even more antennas, and this is called Massive MIMO technology. While current cell operation is 2-dimensional, the introduction of Massive MIMO technology enables 3D beamforming, so it is also called FD-MIMO (Full Dimension).

[0005] In Massive MIMO technology, as the number of ANTs increases, the number of transmitters and filters also increases.

[0006] However, considering the lease cost and space constraints of the installation site, it is necessary to make RF components (Antenna / Filter / Power Amplifier / Transceiver, etc.) small, light, and cheap. However, when manufacturing with high output such as 320W or 640W to expand the coverage of Massive MIMO, the power consumption and heat generation due to the high-output components (RF components) are negative factors in reducing the weight and size.

[0007] Accordingly, research is being actively conducted recently to reduce the weight of the antenna unit, which is the target of tilting or steering operation for adjusting the radiation direction of the radiation beam at the site where the antenna device is installed, by separately separating it, and to concentrate the heating element on the radio unit (RU) fixed to a fixed structure such as a support pole, and to focus on improving its heat dissipation performance.

[0008]

[0009] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide a heat dissipation mechanism and a heat dissipation module including the same, which can effectively dissipate heat generated from an electronic device such as an antenna device, while preventing an increase in the weight of an antenna unit requiring directionality adjustment, thereby improving workability in the field.

[0010] In addition, another object of the present invention is to provide a heat dissipation mechanism and a heat dissipation module including the same, which overcome the limitation of increasing the heat dissipation surface area due to the thermal conductivity of the material itself and enable the design of various types of heat dissipation structures.

[0011] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0012]

[0013] A heat dissipation device according to one embodiment of the present invention receives heat generated from heating elements in the form of a gaseous refrigerant that has been phase-changed into a gaseous state, and includes a heat receiving portion that is connected to a housing body equipped with the heating elements via a heat transfer body for coupling, and a heat dissipation portion that is a refrigerant flow space in which the gaseous refrigerant received through the heat receiving portion diffuses and then phase-changes into a liquid refrigerant, and the heat receiving portion is connected by welding to a fixed slit that is provided in the form of a slit hole in the heat transfer body for coupling.

[0014] Here, the heat receiving portion can be welded to the fixed slit via a reinforcing fixing clip that reinforces the edge portion of the fixed slit.

[0015] In addition, the heat dissipation portion may have a shape in which at least the upper portion extends directly above the housing body when the heat receiving portion on the relatively lower side is connected to the front or rear of the housing body.

[0016] In addition, the reinforcing fixing clip can increase the welding joint area for the fixing slit of the heat receiving portion in the thickness direction.

[0017] Additionally, the reinforcing fixing clip may have a clip penetration hole having the same shape as the fixing slit.

[0018] In addition, the slit hole shape of the above-mentioned fixed slit, the clip penetration hole of the above-mentioned reinforcing fixed clip, and the shape of the vertical cross-section of the above-mentioned heat receiving portion can be formed to have the same shape.

[0019] In addition, the reinforcing fixing clip may be fixed to the inner portion of the heat transfer body for bonding in which the fixing slit is formed, and may be fixed such that the fixing slit and the clip penetration hole are aligned in the thickness direction.

[0020] In addition, the heat transfer body for bonding is provided in the form of a vapor chamber in which a phase-changeable refrigerant is filled inside, and the heat receiving portion is welded via the fixing slit and the reinforcing fixing clip, but can be waterproof welded to prevent leakage of the refrigerant.

[0021] In addition, the reinforcing fixing clip is welded to the edge of the fixing slit on the inside of the heat transfer body for bonding, and the heat receiving portion can be welded to the inner peripheral end of the fixing slit and the inner peripheral end of the reinforcing fixing clip after penetrating the fixing slit and the reinforcing fixing clip.

[0022] Additionally, the reinforcing fixing clip and the heat receiving portion can be welded together using a brazing welding method.

[0023] In addition, the coupling heat transfer body is provided in the form of a vapor chamber in which a phase-changeable refrigerant is filled therein, and the heat receiving portion is formed along the inner end of the fixing slit for the purpose of installing the reinforcing fixing clip in the correct position, and can be welded to an inwardly protruding installation rib in which the refrigerant is provided. A heat dissipation module including a heat dissipation mechanism according to one embodiment of the present invention includes a plurality of heat dissipation mechanisms including a heat receiving portion that receives heat generated from heating elements in the form of a gaseous refrigerant that has been phase-changed into a gaseous state, and a heat dissipation portion that diffuses the heat received through the heat receiving portion for heat exchange, and a heat collecting portion that includes a board receiving portion formed on one surface to receive a PA board on which the heating elements are mounted, and a plurality of fixing slits formed on the other surface so that the plurality of heat dissipation mechanisms are installed, and a coupling heat transfer body filled with a phase-changeable refrigerant therein, and the heat collecting portion is disposed inside the coupling heat transfer body filled with the refrigerant, and an absorber that diffuses and moves a liquid refrigerant among the refrigerants to the surroundings. Includes more sheets.

[0024] Here, the absorbent sheet can receive heat transferred from the heating elements and evaporate the liquid refrigerant into a gaseous refrigerant while raising the liquid refrigerant in a direction opposite to the direction of gravity.

[0025] In addition, the heat collection unit further includes a shielding cover that is arranged between the combined heat transfer body and the PA board to prevent leakage of the refrigerant, and the absorbent sheet can be arranged in close contact with the inner surface of the shielding cover.

[0026] Additionally, the absorbent sheet may be made of a ceramic fiber material or a non-woven material having a large number of micropores.

[0027] In addition, the vaporized refrigerant by the absorbent sheet can be received through the heat receiving portion of each of the plurality of heat dissipation devices and then diffused to the heat dissipation portion.

[0028]

[0029] According to a heat dissipation device and a heat dissipation module including the same according to one embodiment of the present invention, heat generated from an electronic device including an antenna device can be effectively dissipated while preventing an increase in the weight of the entire product, thereby improving workability in the field.

[0030] In addition, according to a heat dissipation device and a heat dissipation module including the same according to one embodiment of the present invention, it has the effect of suppressing the expansion of the size of the product by overcoming the limitation of the thermal conductivity of the material itself and designing to increase the heat dissipation surface area.

[0031]

[0032] FIG. 1a and FIG. 1b are front and rear perspective views showing an example of a heat dissipation mechanism and a heat dissipation module including the same according to one embodiment of the present invention.

[0033] Figure 2 is a front view of Figures 1a and 1b,

[0034] Figure 3 is a side view of Figures 1a and 1b,

[0035] Figures 4a and 4b are front and rear perspective views showing the state in which the rear clamping part is mounted.

[0036] Figures 5a and 5b are exploded perspective views of the rear clamping part of Figures 4a and 4b.

[0037] Figure 6 is a perspective view showing a state in which a side clamping part is installed.

[0038] Figures 7a and 7b are exploded perspective views of Figures 1a and 1b,

[0039] Figure 8 is an exploded perspective view of the finger guard panel assembly of Figure 1a.

[0040] Figure 9 is a front and rear perspective view showing the arrangement of a heat dissipation mechanism according to one embodiment of the present invention.

[0041] Figures 10a and 10b are exploded perspective views of the front and rear sides of Figure 9,

[0042] Fig. 11 is an exploded perspective view showing a heat dissipation mechanism according to another embodiment of the present invention, and Fig. 12 is a cross-sectional view taken along line AA of Fig. 11.

[0043]

[0044] <Explanation of symbols>

[0045] 1: Radio unit 10: Finger guard panel assembly

[0046] 20: Back mounting bracket 20h-1: Screw fastening hole

[0047] 25: Screw through hole 27: Fixing screw

[0048] 30: Clamping part 30R: Back clamping part

[0049] 30S: Side clamping part 31: First fixed plate part

[0050] 32: Second fixed plate 33: Clamping bar

[0051] 34: Stud bolt 35: Bolt guide rod

[0052] 40: Finger guard panel assembly 41: Guide slit

[0053] 50: Heat exchange area 100: Housing body

[0054] 110C: Center housing 110F: Front heat dissipation housing

[0055] 110R: Rear heat dissipation housing 120: RF filter section

[0056] 121: Filter body 122: Resonator

[0057] 123: Filter tuning cover 124: Stamping part

[0058] 130F: Front board (PSU board) 130R: Rear board (PBA)

[0059] 140A: Front board installation groove 140B: Rear board installation groove

[0060] 200: Heat dissipation module 200A: Front heat dissipation module

[0061] 200B: Rear heat dissipation module 205: Refrigerant flow space

[0062] 210: Heat dissipation device 210-1: One-sided heat-conducting panel

[0063] 210-2: Other side heat conduction panel 210-F1: First refrigerant passage

[0064] 210-F2: Second refrigerant path 210-F3: Inclined guide

[0065] 210-F4: Joint 211: Heat receiving section

[0066] 212: Heat dissipation section 220: Heat collection section

[0067] 221: Heat transfer material for bonding 222: Shielding cover

[0068] 223: PA board 227: Reinforcement fixing clip

[0069] 227h: Clip penetration hole 280: Absorbent sheet

[0070]

[0071] Hereinafter, a heat dissipation mechanism and a heat dissipation module including the same according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0072] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0073] When describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and do not limit the nature, order, or sequence of the components. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0074]

[0075] FIG. 1A and FIG. 1B are front and rear perspective views showing an example of a heat dissipation mechanism and a heat dissipation module including the same according to one embodiment of the present invention, FIG. 2 is a front view of FIG. 1A and FIG. 1B, FIG. 3 is a side view of FIG. 1A and FIG. 1B, FIG. 4A and FIG. 4B are front and rear perspective views showing a state in which a rear clamping part is mounted, FIG. 5A and FIG. 5B are exploded perspective views of the rear clamping part of FIG. 4A and FIG. 4B, and FIG. 6 is a perspective view showing a state in which a side clamping part is mounted.

[0076] A heat dissipation mechanism (210) according to one embodiment of the present invention is applied to a base station antenna device among examples of electronic devices, as shown in FIGS. 1 to 6, and more specifically, it is provided inside a radio unit (1) among the components of a base station antenna device including a radio unit (RU), a digital unit (DU), and an antenna unit, and thereby operates to receive heat from a heating element (not shown) that generates system heat and performs a function of dissipating heat.

[0077] Here, the electronic device is a concept that includes any type of device as long as it has an internal configuration similar to the above-described heating element, but below, for the convenience of explanation, an antenna device (or radio unit (1)), which is an important product among the businesses operated by the applicant of the present invention, will be described as an application example.

[0078] In particular, before describing one embodiment of the present invention, a combination of a plurality of heat dissipation devices (210) described below is defined as a 'heat dissipation module (200)', and a product in which a plurality of such heat dissipation devices (210) and a plurality of heat dissipation modules (200) are applied and installed is defined as an 'antenna device (or radio unit (1))'. However, the antenna device (1) here can be understood to refer only to a radio unit excluding a digital unit and an antenna unit, which are a collection of antenna radiating elements.

[0079] In addition, the types of heating elements that are electrically driven and installed inside electronic devices include, but are not limited to, semiconductors, RF components of antenna devices for communication, displays, energy storage systems (ESS), artificial intelligence (AI), and other internal driving elements of other electrical and electronic devices.

[0080] An electronic device to which a heat dissipation mechanism (210) according to one embodiment of the present invention is applied is adopted as a radio unit (1) which is one of the components of a base station antenna device. As described below, the heating element is adopted as a PA element (223a) mounted on a PA board (223).

[0081] The radio unit (11) to which the heat dissipation mechanism (210) according to one embodiment of the present invention is applied is a configuration that performs the role of a repeater in a base station antenna device, and can improve the working environment in the field by reducing the weight of a single product by separating the antenna unit (Antenna Unit) equipped with antenna radiating elements that substantially form and radiate an antenna beam.

[0082] Here, the radio unit (1) provides an advantage in that, unlike the antenna unit not shown, tilting or steering adjustment for setting the direction of the radiation beam is unnecessary, and only stable fixation to a structure such as a support pole (P) described later is required, thereby enabling lightweight manufacturing of the antenna unit that requires installation at a higher location reflectively.

[0083] Such a radio unit (1) may further include a finger guard panel assembly (10) that is provided to surround a heat dissipation mechanism (210) according to an embodiment of the present invention described below, as referenced in FIGS. 1A to 2, to prevent injuries such as burns to the operator. The specific configuration and coupling structure of the finger guard panel assembly (10) will be described in more detail later.

[0084] Meanwhile, the radio unit (1) may include an RF filter unit (120), a housing body (100) that mediates fixation of the RF filter unit (120), and a heat dissipation mechanism (210) according to one embodiment of the present invention that is coupled to the housing body (100), as referenced in FIGS. 1 to 6.

[0085] Here, the radio unit (1) can be stably mounted on the support pole (P) via the clamping member (30) as referenced in FIGS. 4a to 5b and FIG. 6.

[0086] The clamping part (30) may include a rear clamping part (30R) provided on the rear surface of the radio unit (1) to mount the radio unit (1) on the support pole (P), as shown in FIGS. 4A to 5B, and a side clamping part (30S) provided on the side surface of the radio unit (1) to mount the radio unit (1) on the support pole (P).

[0087] Here, the rear clamping portion (30R) is provided with a rear installation bracket (20) so that the rear portion of the housing body (100) is not exposed to the outside by the finger guard panel assembly (10), and thus the installation can be mediated to the left and right sides of the housing body (100) that are also exposed to the outside by the finger guard panel assembly (10).

[0088] For reference, the side clamping portion (30S) can be directly connected to either the left or right side of the housing body (100) without the above-described intermediate configuration, which is not hidden by the direct finger guard panel assembly (10) but is exposed.

[0089] The rear mounting bracket (20) can be fixed to the radio unit (1) by extending horizontally in parallel to the left and right sides of the rear surface of the radio unit (1) as shown in FIG. 5a, with both ends bent forward, and a clamp fixing screw (27) passing through a screw through hole (25) formed at both ends and fastening it to a screw fastening hole (117) formed on both left and right sides of the housing body (100).

[0090] Meanwhile, the rear clamping portion (30R) and the side clamping portion (30S) are all identical in their configurations, except for whether or not they mediate the rear installation bracket (20) described above. Therefore, with reference to FIGS. 5A and 5B, only the rear clamping portion (30R) will be specifically described, and the description of the side clamping portion (30S) will be replaced with a description of the configuration of the rear clamping portion (30R).

[0091] The rear clamping portion (30R), as shown in FIGS. 5A and 5B, may include a first fixed plate portion (31) fixed to the rear installation bracket (20), a second fixed plate portion (32) tightly coupled to the rear surface of the first fixed plate portion (31), and a clamping bar (33) coupled to a pair of left and right boss portions (32a) among four boss portions (32a) formed at the square corner portions of the rear surface of the second fixed plate portion (32) via a pair of stud bolts (34) and provided to surround the support pole (P).

[0092] The first fixed plate part (31) is manufactured to a single standard that can be installed on the rear mounting bracket (20) provided on the rear surface of the radio unit (1) or on the side surface (in the case of the side clamping part (30S)) of the radio unit (1), and can universally fix the second fixed plate part (32) manufactured to various standards to the radio unit (1) regardless of the size (diameter, etc.) of the support pole (P).

[0093] Unlike the first fixed plate part (31) manufactured to a single standard, the second fixed plate part (32) is manufactured to various standards according to the size (diameter, etc.) of the support pole (P) to be installed, as described above, and can be selected according to the specifications of the support pole (P) and combined with the first fixed plate part (31).

[0094] Here, at least one pair of screw penetration holes (31h-1) are formed in the upper and lower portions of the first fixed plate portion (31), and the first fixed plate portion (31) can be fixed to the rear installation bracket (20) by an operation of fastening a plurality of assembly screws (37s-1) through the screw penetration holes (31h-1) to the screw fastening holes (20h-1) formed in the rear installation bracket (20).

[0095] Meanwhile, a molding groove (31a) is formed on the left and right ends of the back surface of the first fixed plate part (31), respectively, into which a molding rib (32b) protruding forward from the second fixed plate part (32) is molded, and the second fixed plate part (32) can be firmly fixed to the first fixed plate part (31) through a plate assembly screw (37s-2) in a state where the molding rib (32b) is molded into the molding groove (31b).

[0096] To this end, a screw penetration hole (31h-2) through which a plate assembly screw (37s-2) passes may be formed in the upper portion of the first fixed plate portion (31) where a molded groove (31a) is formed, and a screw fastening hole (32h-2) through which a plate assembly screw (37s-2) is fastened may be formed in the upper portion of the molded rib (32b) of the second fixed plate portion (31).

[0097] Here, even if the second fixed plate part (32) is manufactured in various specifications according to the size of the support pole (P), the above-described molded rib (32b) and molded groove (31a) are formed in the same specifications, so that the first fixed plate part (31) can be universally coupled to the second fixed plate part (32) of various specifications.

[0098] Meanwhile, the clamping bar (33) may include an upper clamping bar (30U) positioned relatively upward and a lower clamping bar (30D) positioned relatively downward.

[0099] Here, the upper clamping bar (30U) and the lower clamping bar (30D) are formed in a roughly 'ㄷ' shape with one side open, and a stud bolt (34) that surrounds one side of the outer surface of the support pole (P) and penetrates both ends in the front-back direction can be bolt-fastened to the bolt fastening boss (32a) formed at each corner end of the rear surface side of the second fixed plate portion (32) by means of a bolt guide rod (35) that can be inserted into the connecting boss (33a) provided at both ends of the clamping bar (33).

[0100] The upper and lower portions of the rear surface of the second fixed plate (32) and the upper clamping bar (30U) and the lower clamping bar (30D) may be provided with clamping gears (36) for clamping the outer surface of the support pole (P) so that the amount of protrusion to the outside can be adjusted.

[0101] The clamping gears (36) are provided in pairs spaced apart from each other vertically, so that they can be clamped at four locations on the outer surface of at least one support pole (P).

[0102] Meanwhile, as already explained, the side clamping portion (30S) differs from the rear clamping portion (30R) in that the configuration corresponding to the first fixed plate portion (31), as shown in FIG. 6, is fastened using an assembly screw (27) to the screw fastening holes (117) formed on the left and right sides of the housing body (100) without an intermediate configuration such as a rear installation bracket (20).

[0103] Figures 7a and 7b are exploded perspective views of the entire components of Figures 1a and 1b, and Figure 8 is an exploded perspective view of the finger guard panel assembly of Figure 1a.

[0104] The housing body (100) may include a center housing (110C) having an installation space in which an RF filter unit (120) described later is installed, as shown in FIGS. 7A and 7B, a front heat dissipation housing (110F) provided on the front side of the center housing (110C) and mediating the installation of a front heat dissipation module (200A) provided with a plurality of heat dissipation devices (210) in a module form combined according to an embodiment of the present invention, and a rear heat dissipation housing (110R) provided on the rear side of the center housing (110C) and mediating the installation of a rear heat dissipation module (200B) provided with a plurality of heat dissipation devices (210) in a module form combined according to an embodiment of the present invention.

[0105] That is, the radio unit (1) includes a housing body (100), a front heat dissipation module (200A) arranged at the front of the housing body (100), and a rear heat dissipation module (200B) arranged at the rear of the housing body (100), as referenced in FIGS. 7A and 7B, and it can be seen that the front heat dissipation module (200A) and the rear heat dissipation module (200B) are a plurality of heat dissipation mechanisms (210) according to one embodiment of the present invention combined in a module form.

[0106] In addition, the radio unit (1) may further include an RF filter section (120), as referenced in FIGS. 7a and 7b.

[0107] Here, the RF filter unit (120) may include a filter body (121) of a cavity filter type having a plurality of resonators (not shown) provided therein. However, the RF filter unit (120) is not necessarily limited to a cavity filter type, and may be provided as a waveguide filter type.

[0108] For reference, the filter body (121) can be shielded by a filter tuning cover (123) which is formed so that one side where a cavity is formed is open, and on the opened side, a number of angular parts (124) for fine frequency tuning are provided.

[0109] The housing body (100) is formed in a square frame shape and may include a center housing (110C) formed to penetrate in the front-back direction so that an RF filter unit (120) can be installed, and a front heat dissipation housing (110F) and a rear heat dissipation housing (110R) that are respectively coupled to the front and rear surfaces of the center housing (110C).

[0110] The front heat dissipation housing (110F) and the rear heat dissipation housing (110R) are respectively connected to the front and rear surfaces of the center housing (110C) in which the RF filter unit (120) is installed, and a plurality of heat dissipation fins (115F, 115R) for external heat dissipation through heat exchange with the outside air can be integrally formed on the front surface of the front heat dissipation housing (110F) and the rear surface of the rear heat dissipation housing (110R).

[0111] The front heat dissipation housing (110F) and the rear heat dissipation housing (110R) are provided in the form of panels having approximately the same size as the center housing (110C), but can be formed in a size that can cover the entire front and back surfaces of the center housing (110C) that are penetrated in the front-back direction.

[0112] A plurality of heat dissipation fins (115F, 115R) may be integrally formed on the lower portions of the front surface of the front heat dissipation housing (110F) and the back surface of the rear heat dissipation housing (110R).

[0113] Here, a plurality of heat dissipation fins (115F, 115R) formed on the front surface of the front heat dissipation housing (110F) and the back surface of the rear heat dissipation housing (110R) can be formed to be long in the vertical direction so that when the heat dissipation forms an upward airflow, it is not interfered with by adjacent heat dissipation fins (115F, 115R) and flow resistance is not generated.

[0114] Additionally, the plurality of heat dissipation fins (115F, 115R) may include a front heat dissipation fin (115F) protruding forward from the front surface of a panel-shaped front heat dissipation housing (110F) and a rear heat dissipation fin (115F) protruding rearward from the back surface of a panel-shaped rear heat dissipation housing (110R).

[0115] Here, the front heat dissipation housing (110F) and the rear heat dissipation housing (110R) are made of a heat-conductive material (metal material) capable of transferring a certain amount of heat, and it is natural that the front heat dissipation fins (115F) and the rear heat dissipation fins (115R) are also made of a heat-conductive material since they are formed as one piece.

[0116] However, even if the front heat dissipation fins (115F) and rear heat dissipation fins (115R) are made of a metal material with excellent thermal conductivity, it is difficult to extend them infinitely far from the point where the heating element is installed in order to increase the surface area for heat dissipation due to the limitations of the thermal conductivity of the material itself. Therefore, the design of the front end position or the rear end position and the bottom position must be optimally designed according to the surrounding environment.

[0117] A plurality of module coupling grooves (113A, 113B) may be formed in the front heat dissipation housing (110F) and the rear heat dissipation housing (110R) to mediate coupling of a front heat dissipation module (200A) and a rear heat dissipation module (200B) in a module form in which a plurality of heat dissipation devices (210) according to one embodiment of the present invention are combined.

[0118] A plurality of module coupling grooves (113A, 113B) are provided in the form of square through holes in the upper portions of the front heat dissipation housing (110F) and the rear heat dissipation housing (110R), as shown in FIGS. 7A and 7B, and a plurality of them can be formed spaced apart from each other in the left and right directions.

[0119] Here, a plurality of module coupling grooves (113A, 113B) are formed to penetrate the front and rear heat dissipation housing (110F) and the rear heat dissipation housing (110R) in the front and rear directions, but the clamshell cover (114) described later is coupled to shield the front and rear directions, and thus the component name 'coupling groove' rather than 'coupling hole' is given.

[0120] For example, a front heat dissipation housing (110F) and a rear heat dissipation housing (110R) may be provided with a plurality of module coupling grooves (113A, 113B) in which four front heat dissipation modules (200A) and four rear heat dissipation modules (200B) each having a heat dissipation mechanism (210) in a combined form according to an embodiment of the present invention described below are installed at the front and rear, respectively.

[0121] In addition, when the installation of the front heat dissipation module (200A) and the rear heat dissipation module (200B), which are formed by combining the heat dissipation mechanism (210) according to one embodiment of the present invention in the front heat dissipation housing (110F) and the rear heat dissipation housing (110R), is completed, a finger guard panel assembly (10) for preventing burns of workers or outsiders due to high temperature heat emitted from the heat dissipation mechanism (210) can be installed to cover the entire heat dissipation mechanism (210) and the heat dissipation modules (200A, 200B).

[0122] In the finger guard panel assembly (10), a number of air flow holes (15) can be formed in a grill shape to ensure smooth inflow and outflow of air into and out of the heat exchange area (50) described later.

[0123] The finger guard panel assembly (10) may be arranged to cover the entirety or the upper portion of the heat dissipation mechanism (210) and the heat dissipation module (200) according to an embodiment of the present invention, which are installed in each of the center housing (110C), the front heat dissipation housing (110F), and the rear heat dissipation housing (110R) among the configurations of the radio unit (1), as described later, as shown in FIGS. 7A to 8.

[0124] More specifically, the finger guard panel assembly (10) may include a front finger guard panel (10A) coupled to the front portion of the front heat dissipation housing (110F) and a rear finger guard panel (10B) coupled to the rear portion of the rear heat dissipation housing (110R).

[0125] The front finger guard panel (10A) has a rectangular parallelepiped shape with the back and bottom sides open, and the rear finger guard panel (10B) has a rectangular parallelepiped shape with the front and bottom sides open. A plurality of air flow holes (15) can be formed in the front finger guard panel (10A) and the rear finger guard panel (10B) to enable heat exchange between external air and the heat dissipation mechanism (210) according to one embodiment of the present invention.

[0126] The front finger guard panel (10A) is screw-fixed to a plurality of heat dissipation fins (115F) integrally formed at the lower end of the front heat dissipation housing (110F) to be described later by a lower fixing screw (11s-1), and the left and right ends can be screw-fixed to the screw fastening holes (110h-2) provided at the left and right side ends of the center housing (110C) and the screw fastening holes (40h-3) provided at the left and right side ends of the guide panel (40) to be described later by a first side fixing screw (11s-2) and a second side fixing screw (11s-3), respectively. To this end, a screw fastening hole (115h) to which the lower fixing screw (11s-1) is fixed can be integrally formed at the upper end of at least one of the plurality of heat dissipation fins (115F), and a lower screw through which the lower fixing screw (11s-1) penetrates the lower end of the front finger guard panel (10A). Through holes (11h-1) can be formed in multiple locations.

[0127] In addition, a plurality of screw penetration holes (11h-4) are formed to penetrate in the upper and lower directions at the upper rear end of the front finger guard panel (10A), and a screw fastening hole (40h-4) is formed at the upper end of the guide panel (40) described later, into which upper fixing screws (11s-4) are fastened after penetrating through the plurality of screw penetration holes (11h-4), and can be screw-fastened by the plurality of upper fixing screws (11s-4).

[0128] The joint structure of the rear heat dissipation housing (110R) and the guide panel (40) of the unexplained rear finger guard panel (10B) is completely identical to that of the front finger guard panel (10A) described above, and therefore, its description will be replaced.

[0129] Meanwhile, as shown in FIGS. 7A and 7B, a front board (130F, for example, a PSU board (Power Supply Unit Board), etc.) on which heating elements (heat generating elements) that generate a predetermined amount of driving heat are mounted can be placed between the front portion of the RF filter unit (120) and the front heat dissipation housing (110F), and the heat generated by the heating elements (for example, PSU elements, etc.) mounted on the front board (130F) can be dissipated through the front heat dissipation fins (115F) described above.

[0130] In addition, as referenced in FIGS. 7a and 7b, a rear board (130R, e.g., PBA (Printed Board Assembly)) may be placed between the rear surface of the RF filter unit (120) and the rear heat dissipation housing (110R), and heat generated by heat generating elements (e.g., FPGA elements) mounted on the rear board (130R) may be dissipated through the rear heat dissipation fins (115R) described above.

[0131] Here, a front board installation groove (140A) may be formed on the back surface of the front heat dissipation housing (110F) to stack and install a front board (130F) (PSU board), as shown in FIG. 7B. A plurality of PSU components may be mounted on the front surface of the PSU board, which is the front board (130F), and the heat-generating surface of the PSU components may be installed in close contact with the inner surface (front) of the front board installation groove (140A), so that heat exchange with the outside air using the front heat dissipation fins (115F) is achieved through surface thermal contact of the front heat dissipation housing (110F), thereby achieving front heat dissipation.

[0132] In addition, a rear board installation groove (140B) for stacking and installing a rear board (130R) (or PBA) may be formed on the front side of the rear heat dissipation housing (110R), as shown in FIG. 7A. A plurality of FPGA elements may be mounted and arranged on the front side of the PBA, which is the rear board (130R), and the heat-generating surface of the FPGA element may be installed in close contact with the inner surface (rear surface) of the rear board installation groove (140B), so that heat exchange with the outside air using the rear heat dissipation fin (115R) is achieved through surface thermal contact of the rear heat dissipation housing (110R), thereby achieving rear heat dissipation.

[0133] FIG. 9 is a front and rear perspective view showing the arrangement of a heat dissipation mechanism according to one embodiment of the present invention, and FIGS. 10a and 10b are front and rear exploded perspective views of FIG. 9.

[0134] A heat dissipation device (210) according to one embodiment of the present invention can form a plurality of front heat dissipation modules (200A) installed on the front of a front heat dissipation housing (110F) and a plurality of rear heat dissipation modules (200B) installed on the front of a rear heat dissipation housing (110R) by combining at least two or more of them, as shown in FIGS. 7A and 7B.

[0135] Here, the front heat dissipation module (200A) and the rear heat dissipation module (200B) are identical in their detailed configurations and connection relationships, except for the difference in whether the installation location is the front heat dissipation housing (110F) or the rear heat dissipation housing (110R). Therefore, the following description will focus on the front heat dissipation module (200A), and the rear heat dissipation housing (110R) will be replaced with the description of the front heat dissipation housing (200A).

[0136] Meanwhile, as referenced in FIGS. 7A and 7B, the antenna device (radio unit) (1) according to one embodiment of the present invention may further include a guide panel (40) that supports the upper portion of each heat dissipation mechanism (210) of the front heat dissipation module (200A) and the rear heat dissipation module (200B).

[0137] The guide panel (40) is provided in a roughly square frame shape, is formed to penetrate in the front-back direction to form a heat exchange area (50) described later, and can be screw-assembled using a number of panel assembly screws (43) on the upper end of the center housing (110C).

[0138] In addition, screw fastening holes (40h-3) may be formed on the left and right side portions of the guide panel (40) to provide a fastening portion for a second side fixing screw (11s-3) that is screw-assembled through the side portions of the front finger guard panel (10A) and the rear finger guard panel (10B).

[0139] In addition, the upper part of the guide panel (40) is provided in the form of a grill so that at least outside air can be smoothly ventilated to the heat exchange area (50), and a guide slit (41) may be formed in the front and rear parts of the upper part, into which the upper part of each heat dissipation device (210) is inserted when the front heat dissipation module (200A) and the rear heat dissipation module (200B) are coupled to the housing body (100).

[0140] The guide slit (41) of the guide panel (40) serves to prevent the heat dissipation mechanism (210) from being damaged by limiting the left-right shaking (clearance) of the upper portion of a plurality of heat dissipation mechanisms (210) that extend beyond the upper portion of the center housing (110C) of the housing body (100).

[0141] Additionally, the guide panel (40) can provide a screw assembly portion for stably connecting the finger guard panel assembly (10).

[0142] The front heat dissipation module (200A) may include a heat transfer body (221) for coupling, as referenced in FIG. 9, and at least two heat dissipation mechanisms (210) coupled to the heat transfer body (221). In the embodiment of the present invention, six heat dissipation mechanisms (210) are horizontally spaced apart from each other in the left-right direction, but the present invention is not limited thereto.

[0143] A front heat dissipation module (200A) having such a configuration can be connected to a front heat dissipation housing (110F) by inserting a heat transfer body (221) for connection into each of a plurality of module connection grooves (113A, 113B) formed in a front heat dissipation housing (110F) (or a rear heat dissipation housing (110R)).

[0144] At this time, a substrate receiving portion (222h) in which a PA board (223) is mounted separately from the front board (130F) and the rear board (130R), and in which a heating element (e.g., a PA element (223a) having a somewhat large heating amount among RF components) having different properties from the heating elements mounted on the front board (130F) and the heating elements mounted on the rear board (130R) described above is built in can be formed in a groove shape.

[0145] In particular, the heat transfer body (221) for bonding may be provided in the form of a vapor chamber in which a refrigerant is filled inside and the refrigerant is phase-changed by heat transferred from a heating element and flows to transfer heat.

[0146] In general, a vapor chamber is a heat transfer means that functions as a medium to transfer heat from one side to the other side by repeatedly causing the liquid refrigerant to evaporate into a gaseous refrigerant and flow through a wick structure formed to include a number of pores inside when heat is transferred from the outside, and then condense in a low-temperature area and change into a liquid refrigerant again, with the liquid refrigerant filled inside.

[0147] However, it is not necessary that the heat transfer body (221) for bonding be provided in the form of a vapor chamber. That is, the heat transfer body (221) for bonding may be provided in the form of a simple panel made of a metal material (heat-conducting material) as long as it can transfer heat generated from the heating element to the heat dissipation mechanism (210) according to one embodiment of the present invention.

[0148] However, in the case of one embodiment of the present invention, it is preferable that the heat transfer body (221) for coupling be adopted in the form of a vapor chamber, since the heat dissipation characteristic of high heat transfer rate for transferring heat using a phase-changeable refrigerant is more suitable for a high-power radio unit (1).

[0149] A plurality of screw fastening grooves (225h-1, 225h-2) are formed in a semicircular cut shape at the left and right ends of each edge of the heat transfer body (221) for bonding and the shielding cover (222) described later, and a plurality of module assembly screws (225s) having flat heads are connected to the screw fastening holes (not indicated in the drawing symbol) formed corresponding to the edge ends of the module bonding grooves (113A, 113B) of the front heat dissipation housing (110F) and the rear heat dissipation housing (110R) in a screw-bonding manner, so that the front heat dissipation module (200A) and the rear heat dissipation module (200B) can be stably fixed to the front heat dissipation housing (110F) and the rear heat dissipation housing (110R), respectively.

[0150] Meanwhile, one surface of the bonding heat transfer body (221) is formed to face the heating element (i.e., PA element (223a)) of the PA board (223), and a plurality of fixed slits (221a) in the form of slit holes can be formed on the other surface of the bonding heat transfer body (221) so that a heat dissipation device (210) according to an embodiment of the present invention can be installed. That is, the heat dissipation device (210) according to an embodiment of the present invention can receive heat from the heating element via the bonding heat transfer body (221).

[0151] On the other side of the heat transfer body (221) for bonding, at least two (six in this embodiment) heat dissipation mechanisms (210) according to one embodiment of the present invention can be bonded orthogonally to the other side of the heat transfer body (221) for bonding.

[0152] Here, one side of the coupling heat transfer body (221) may be arranged so that the heating body (PA element (223a)) of the PA board (223) is placed separately from the front board (130F) and the rear board (130R) as the front or rear side of the RF filter unit (120) and is in surface thermal contact with it, and preferably, as shown in FIGS. 9 and 10A, when the shielding cover (222) constitutes one side of the coupling heat transfer body (221), the heating body (PA element (223a)) of the PA board (223) accommodated in the substrate accommodation portion (222h) of the shielding cover (222) may be in surface thermal contact with it.

[0153] More specifically, a number of heating elements are mounted on the front surface of the front board (130F) and the back surface of the rear board (130R). In the case of the radio unit (1), the front board (130F) may be a PSU board, and the rear board (130R) may be a PBA type main board. Typically, various types of heating elements, such as digital driving elements such as the FPGA element described above and analog driving elements such as the PA element (223a), may be centrally mounted on the main board.

[0154] Among these heating elements, the PA element (223a) operates while consuming relatively large power and thus belongs to a heating element with a relatively large amount of heat generation. In order to mount only the PA elements (223a), each PA board (223) is manufactured separately from the main board, which is the rear board (130R), and inserted into the substrate receiving portion (222h) provided in the heat transfer body (221) for coupling a plurality of front heat dissipation modules (200A) and rear heat dissipation modules (200B), and the PA board (223) is received and arranged in the substrate receiving portion (222h) on one surface of the heat transfer body (221) for coupling, so that the heat generated from the PA elements (223a) can be directly transferred and dissipated to the heat dissipation mechanism (210) according to one embodiment of the present invention through the heat transfer body (221) for coupling.

[0155] The heat transfer body (221) for bonding and the substrate receiving portion (222h) can be partitioned by a shielding cover (222), and the shielding cover (222) can play a role in transferring the heat generated by the heating body to the heat transfer body (221).

[0156] Meanwhile, a plurality of fixed slits (221a) are cut and formed spaced apart from each other on the other surface of the heat transfer body (221) for coupling so that a plurality of heat dissipation devices (210) according to one embodiment of the present invention can be coupled, and thus the rigidity of the other surface portion of the heat transfer body (221) for coupling may be reduced.

[0157] In order to prevent the self-rigidity of the heat transfer body (221) for bonding from being lowered, a plurality of support pins (226) may be further provided, one end of which is supported by a shielding cover (222) and the other end of which is supported between adjacent fixed slits (221a).

[0158] A plurality of support pins (226) serve to reinforce the rigidity of the heat transfer body (221) by preventing it from being pressed by external force transmitted from one side and the other side, and also prevents the refrigerant filled inside from leaking.

[0159] The interior of the combined heat transfer body (221) configured in this manner can be formed so that a plurality of refrigerant flow spaces (205) formed inside a plurality of heat dissipation devices (210) are mutually connected through a plurality of fixed slits (221a) so that the refrigerant is shared.

[0160] Meanwhile, the PA board (223) is shielded by a clamshell cover (114) that covers the substrate receiving portion (222h) of the heat transfer body (221) for bonding, and the intrusion and interference of external radio waves can be blocked.

[0161] Here, the clamshell cover (114) may be coupled to the heat transfer body (221) for coupling so as to cover the entire PA board (223) accommodated in the substrate receiving portion (222h) of the heat transfer body (221) for coupling, although not shown in the drawing, and may also be provided in a state of being coupled to the module coupling grooves (113A, 113B) of the front heat dissipation housing (110F) and the rear heat dissipation housing (110R), as referenced in FIGS. 7A and 7B.

[0162] In this way, the heat dissipation mechanism (210) according to one embodiment of the present invention is manufactured as a front heat dissipation module (200A) or a rear heat dissipation module (200B) that is modularized by combining a plurality of PA boards (223) coupled to one side of a heat transfer body (221) for bonding, and thus has the advantage of being able to be easily installed and applied to a product after actively changing the design to suit a variable design environment according to the heat generation amount of the heating body, etc.

[0163] Here, the heat transfer body (221) for bonding, the PA board (223), and the clamshell cover (114) (limited to the case where the clamshell cover (114) is not provided in a state of being bonded to the module bonding grooves (113A, 113B) of the front heat dissipation housing (110F) and the rear heat dissipation housing (110R)) can be manufactured in a modular manner, and can be defined as a heat collection unit (220) corresponding to the heat dissipation mechanism (210) according to one embodiment of the present invention.

[0164] A heat dissipation device (210) according to one embodiment of the present invention may include, as referenced in FIGS. 9 to 12, a heat receiving portion (211) that receives heat generated from heating elements (particularly, PA elements (223a)) in the form of a gaseous refrigerant phase-changed into a gaseous state, and a heat dissipation portion (212) in which a refrigerant flow space (205) is formed in which the gaseous refrigerant received through the heat receiving portion (211) diffuses and then phase-changes into a liquid refrigerant.

[0165] Here, the heat receiving portion (211) can be coupled to the housing body (100) equipped with heating elements (223a) via a heat transfer member (221). In addition, the heat dissipation portion (212) can have a shape in which at least the upper portion extends directly above the housing body (100) when the heat receiving portion (211) on the relatively lower side is coupled to the front or rear of the housing body (100).

[0166] That is, in the heat dissipation mechanism (210) according to one embodiment of the present invention, even when the heat receiving portion (211) is arranged to overlap in the front-back direction with respect to the front portion of the front heat dissipation housing (110F) or the rear portion (back portion) of the rear heat dissipation housing (110R) among the housing main body (100), the heat dissipation portion (212) is formed to extend upwards more than the upper end of the housing main body (100), and at this time, the heat dissipation portion (212) can be arranged so as to occupy at least a part of the heat exchange area corresponding to the direct upper portion in the front-back thickness direction of the housing main body (100).

[0167] According to the heat dissipation mechanism (210) according to one embodiment of the present invention, even when the heat dissipation area of ​​the heat radiating portion (212) that performs the actual heat dissipation function is increased, the heat dissipation area can be increased to a heat exchange area corresponding to the direct upper portion in the front-back thickness direction of the housing body (100) without volume expansion in the front-back thickness direction of the housing body (100), thereby providing an advantage of avoiding the design of an enlarged product size.

[0168] Here, the heat receiving portion (211) and the heat dissipating portion (212) should not be interpreted as having a physically complete partition line (T point), but it is desirable to understand them as functionally distinct.

[0169] For example, the heat receiving portion (211) and the heat dissipating portion (212) may be manufactured as a single piece. In this case, the boundaries between the heat receiving portion (211) and the heat dissipating portion (212) are not physically distinct. However, it is preferable to interpret the heat dissipating portion (212) as meaning a portion that protrudes and extends into the heat exchange area corresponding to the upper portion of the housing body (100), as described above.

[0170] Here, the heat receiving portion (211) can be joined by welding to a fixed slit (221a) provided in the form of a slit hole on the other surface of the heat transfer body (221) for bonding. Therefore, it is preferable that the heat receiving portion (211) be formed to have a thickness and length that can be inserted into the fixed slit (221a). That is, it is sufficient to understand that the thickness and length of the heat receiving portion (211) are formed so that they can be easily temporarily fixed to the fixed slit (221a) by force-fitting or press-fitting without going through a separate welding process.

[0171] In particular, the heat receiving portion (211) may be formed with an insertion end (211a) protruding toward the fixed slit (221a) of a predetermined length based on the same imaginary straight line (B) as the end of the neck portion (211b) as the lower portion of the virtual boundary point (T) corresponding to the starting point from which the heat dissipation portion (212) extends so that a portion thereof is inserted into the fixed slit (221a), as referenced in FIG. 11.

[0172] Here, a heat dissipation device (210) according to one embodiment of the present invention is provided to form a refrigerant flow space (205) in which a refrigerant is filled therein, as shown in FIG. 11, and the filled refrigerant is evaporated by heat and changes into a gaseous refrigerant and then diffuses, or the diffused gaseous refrigerant condenses and changes into a liquid refrigerant and then flows in the direction of gravity.

[0173] In this case, the heat dissipation device (210) can be manufactured by preparing a single metal panel member having a predetermined thermal conductivity in advance through a press process using a sheet metal mold, and then forming a sealed refrigerant flow space (205) by bending at least one side and joining the edge ends, or by separately manufacturing two metal panel members having a predetermined thermal conductivity through a press process and then joining them along the edge ends so that a sealed refrigerant flow space (205) is formed inside.

[0174] At this time, the part forming one side of the refrigerant flow space (205) is called a 'one-side heat conduction panel', and the part forming the other side of the refrigerant flow space (205) is called a 'other-side heat conduction panel'.

[0175] When the heat dissipation device (210) according to one embodiment of the present invention is vertically arranged in the up-down direction with respect to the direction of gravity, the liquid refrigerant is stored toward the heat receiving portion (211) in which the fitting end (211a) is formed to be inserted and fixed into the fixed slit (221a) corresponding to the heat collecting portion (220) and the evaporated gaseous refrigerant is diffused to the heat dissipating portion (212) corresponding to the upper portion with respect to the remaining upper boundary point (T) and condensed into the liquid refrigerant through heat exchange with the outside air in the heat exchange area (50).

[0176] Fig. 11 is an exploded perspective view showing a heat dissipation mechanism according to another embodiment of the present invention, and Fig. 12 is a cross-sectional view taken along line AA of Fig. 11.

[0177] A heat dissipation mechanism (210) according to another embodiment of the present invention can be welded to a plurality of fixed slits (221a) formed in a heat transfer body (221) for bonding among the configurations of a single heat collecting unit (220), as shown in FIGS. 11 and 12.

[0178] However, as described above, the connection of the heat receiving portion (211) among the components of the heat dissipation mechanism (210) to the plurality of fixed slits (221a) can be made by a forced fit method, but a welding connection method may be preferred to the extent that airtightness is required to prevent internal pressure changes and external leakage of the refrigerant that occur during the phase change process of the refrigerant filled inside the heat transfer body (221) for connection.

[0179] More specifically, the heat receiving portion (211) can be joined by a welding method after passing through a fixed slit (221a) in the form of a slit hole formed in a heat transfer member (221) for joining to the housing body (100) and a reinforcing fixed clip (227) that reinforces the end of the fixed slit (221a).

[0180] Here, the reinforcing fixing clip (227) is formed with a relatively thin thickness and increases the thickness of the fixing slit (221a), which is the portion where the heat receiving portion (211) is welded, and is joined along the edge end corresponding to the inner circumference of the slit hole of the fixing slit (221a), thereby reinforcing the strength when the internal pressure changes due to the phase change of the refrigerant.

[0181] That is, the reinforcing fixing clip (227) is integrally fixed so as to be added to the inner side edge end corresponding to the inner circumference among the areas where the fixing slit (221a) is formed, thereby artificially increasing the material thickness of the heat transfer body (221) for bonding, thereby reinforcing the strength.

[0182] In addition, the reinforcing fixing clip (227) may be formed with a clip through hole (227h) corresponding to the slit hole of the fixing slit (221a). Here, the shape of the slit hole of the fixing slit (221a), the shape of the clip through hole (227h) of the reinforcing fixing clip (227) and the shape of the vertical cross section of the fitting end (211a) of the heat receiving portion (211) may be formed to have the same shape.

[0183] At this time, the reinforcing fixing clip (227) is welded to the edge of the fixing slit (221a) on the inside of the heat transfer body (221) for bonding, and the heat receiving portion (211) can pass through the fixing slit (221a) and the clip penetration hole (227h) of the reinforcing fixing clip (227) and then be welded to the inner circumference of the fixing slit (221a) and the inner circumference of the reinforcing fixing clip (227). The reinforcing fixing clip (227) and the heat receiving portion (211) can be welded together using a brazing welding method.

[0184] When the heat receiving portion (211) is welded by sequentially penetrating the slit hole of the fixing slit (221a) and the clip penetration hole (227h) of the reinforcing fixing clip (227) on the outer portion of the heat transfer body (221) for bonding, the welded joint area bonded by the solder material such as solder can be increased by the thickness of the reinforcing fixing clip (227), thereby enabling the welded joint to be welded with a higher bonding force.

[0185] Here, in order to weld-join via the fixing slit (221a) and the reinforcing fixing clip (227) of the heat receiving portion (211), it is preferable that the slit hole of the fixing slit (221a) and the clip penetration hole (227h) of the reinforcing fixing clip (227) are formed to match in the thickness direction and fixed.

[0186] Meanwhile, the heat transfer body (211) for bonding may be provided in the form of a vapor chamber in which a phase-changeable refrigerant is filled inside, as shown in FIGS. 11 and 12.

[0187] More specifically, the heat transfer body (211) for bonding is formed in a thin body shape that is formed to be approximately elongated in the vertical direction, and a space for filling or flowing the phase-changeable refrigerant described above is formed in a very thin thickness range in the front-back direction, and the filling space of the refrigerant described above can be sealed by a shielding cover (222) provided in the form of a metal panel made of a heat-conductive material.

[0188] On the outer surface of the shielding cover (222), a substrate receiving portion (222h) that receives a PA board (223) equipped with heating elements such as the PA element (223a) described above can be formed in a groove shape.

[0189] Here, the heat receiving portion (211) is welded via a fixed slit (221a) and a reinforcing fixed clip (227), and may be waterproof welded to prevent leakage of refrigerant.

[0190] However, it is not necessary to utilize the reinforcing fixing clip (227) as an intermediate component for waterproof welding of the heat receiving portion (211), and as shown in the enlarged view of Fig. 12, in the case where an inwardly protruding installation rib (221b) equipped with a refrigerant is provided, which is formed along the inner end of the fixing slit (221a) for installation of the reinforcing fixing clip (227), the heat receiving portion (211) can be joined by a welding joint at a portion that comes into contact with the inner circumference of the installation rib (221b).

[0191] In addition, a heat dissipation module (1200) including a heat dissipation mechanism (210) according to another embodiment of the present invention may further include an absorbent sheet (280) that is disposed inside a heat transfer body (221) filled with a refrigerant and diffuses and moves liquid refrigerant among the refrigerants to the periphery, as referenced in FIGS. 11 and 12. The absorbent sheet (280) may receive heat transferred from heating elements while causing the liquid refrigerant to rise in a direction opposite to the direction of gravity and evaporate it into a gaseous refrigerant.

[0192] Here, the absorbent sheet (280) may be placed in close contact with the inner surface of the shielding cover (222). However, it is not necessary for the absorbent sheet (280) to be formed to have a thickness so thin that it must be placed in close contact with the shielding cover (222), and it will be understood that it may be formed to have a thickness greater than the thickness of the space in which the refrigerant is filled, as long as a large number of micropores are secured through which the phase-changed gaseous refrigerant can easily diffuse.

[0193] Such an absorbent sheet (280) performs the role of changing the phase of the liquid refrigerant absorbed by the heat transferred from the PA elements (223a), which are the heating elements of the PA board (223), into a gaseous refrigerant, and allowing the gaseous refrigerant to diffuse and exchange heat through the opposite surface of the combined heat transfer body (221) to which a plurality of heat receiving portions (211) are combined.

[0194] The absorbent sheet (280) may be formed of a ceramic fiber material or a non-woven material having a large number of micropores. When the absorbent sheet (280) is formed to a thin thickness as shown in FIG. 12, it may be supported in close contact with the inner surface of the shielding cover (222) by a large number of support pins (226).

[0195] The vaporized refrigerant evaporated by the absorbent sheet (280) is received through the heat receiving portion (211) of each of a plurality of heat dissipation devices (210) and then diffuses to the heat dissipation portion (212). The vaporized refrigerant diffused to the heat dissipation portion (212) is condensed again through heat exchange with the outside air, changes into a liquid refrigerant, and then falls and flows in the direction of gravity, thereby repeating the phase change cycle of the refrigerant.

[0196]

[0197] Hereinafter, the heat dissipation mechanism and the heat dissipation module including the same according to embodiments of the present invention have been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described single embodiment, and it will be understood that various modifications and equivalent implementations are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims set forth below.

Claims

1. A heat receiving unit that receives heat generated from heating elements in the form of a gaseous refrigerant that has been phase-changed into a gaseous state, and is connected to a housing body equipped with the heating elements through a heat transfer material for connection; and A heat dissipation unit is formed in which a refrigerant flow space is formed in which the gaseous refrigerant received through the heat receiving unit is diffused and then phase-changed into a liquid refrigerant; A heat dissipation mechanism in which the above heat receiving portion is welded to a fixed slit provided in the form of a slit hole in the above heat transfer body for bonding.

2. In claim 1, A heat dissipation mechanism in which the above heat receiving portion is welded to the above fixed slit via a reinforcing fixing clip that reinforces the edge portion of the above fixed slit.

3. In claim 1, The heat dissipation unit is a heat dissipation mechanism having a shape in which at least the upper part extends directly above the housing body when the heat receiving part on the relatively lower side is connected to the front or rear of the housing body.

4. In claim 2, The above reinforcing fixing clip is a heat dissipation mechanism that increases the welding joint area for the fixing slit of the heat receiving portion in the thickness direction.

5. In claim 2, A heat dissipation mechanism in which a clip penetration hole having the same shape as the above-mentioned fixing slit is formed in the above-mentioned reinforcing fixing clip.

6. In claim 5, A heat dissipation mechanism in which the slit hole shape of the above-mentioned fixed slit, the clip penetration hole of the above-mentioned reinforcing fixed clip, and the shape of the vertical cross-section of the above-mentioned heat receiving portion are formed to have the same shape.

7. In claim 5, A heat dissipation mechanism in which the above reinforcing fixing clip is fixed to the inner portion of the heat transfer body for bonding in which the fixing slit is formed, and the fixing slit and the clip penetration hole are fixed so as to match in the thickness direction.

8. In claim 2, The above-mentioned heat transfer material for bonding is provided in the form of a vapor chamber in which a phase-changeable refrigerant is filled inside, A heat dissipation device in which the above heat receiving portion is welded via the above fixing slit and the above reinforcing fixing clip, and is waterproof welded to prevent leakage of the refrigerant.

9. In claim 8, The above reinforcing fixing clip is welded to the edge of the fixing slit on the inside of the above bonding heat transfer body, A heat dissipation mechanism in which the heat receiving portion penetrates the fixed slit and the reinforcing fixed clip and is welded to the inner circumference of the fixed slit and the inner circumference of the reinforcing fixed clip.

10. In claim 9, A heat dissipation device in which the above-mentioned reinforcing fixing clip and the above-mentioned heat receiving portion are welded together using a brazing welding method.

11. In claim 2, The above-mentioned heat transfer material for bonding is provided in the form of a vapor chamber in which a phase-changeable refrigerant is filled inside, A heat dissipation device in which the above heat receiving portion is formed along the inner end of the above fixing slit for the purpose of installing the above reinforcing fixing clip in the correct position, and is welded to the inwardly protruding installation rib provided with the above refrigerant.

12. A plurality of heat dissipation mechanisms including a heat receiving unit that receives heat generated from heating elements in the form of a gaseous refrigerant that has been phase-changed into a gaseous state, and a heat dissipation unit that diffuses the heat received through the heat receiving unit for heat exchange; and A heat collecting unit including a heat transfer body for bonding, in which a substrate receiving portion is formed on one side to receive a PA board on which the heating elements are mounted, a plurality of fixed slits are formed on the other side to install the plurality of heat dissipation devices, and a phase-changeable refrigerant is filled therein; A heat dissipation module, wherein the heat collection unit is disposed inside the combined heat transfer body filled with the refrigerant, and further includes an absorbent sheet that diffuses and moves liquid refrigerant among the refrigerants to the surroundings.

13. In claim 12, The above absorbent sheet is a heat dissipation module that receives heat transferred from the heating elements and evaporates the liquid refrigerant into a gaseous refrigerant while causing the liquid refrigerant to rise in a direction opposite to the direction of gravity.

14. In claim 12, The above heat collection unit further includes a shielding cover arranged between the bonding heat transfer body and the PA board to prevent leakage of the refrigerant; The above absorbent sheet is a heat dissipation module that is placed in close contact with the inner surface of the shielding cover.

15. In claim 12, The above absorbent sheet is a heat dissipation module made of a ceramic fiber material or non-woven material having a large number of micropores.

16. In claim 13, A heat dissipation module in which the vaporized refrigerant evaporated by the above absorbent sheet is received through the heat receiving portion of each of the plurality of heat dissipation devices and then diffuses to the heat dissipation portion.

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