Liquid cooling heat dissipation device

Abstract

A liquid cooling heat dissipation device, comprising a water cooling radiator, a water inlet pipe, a water outlet pipe, a water pump and a cold plate. The water pump is arranged on the cold plate and a liquid flow channel of the water pump is communicated with that of the cold plate; a water pump outlet is formed in the water pump; an inflow connector is arranged on the cold plate; a water inlet end of the water cooling radiator is connected to water pump outlet by means of the water inlet pipe; and a water outlet end of the water cooling radiator is connected to the inflow connector by means of the water outlet pipe. Unlike existing liquid cooling systems, the arrangement of the water pump on the cold plate structurally avoids the problems of insufficient space, structural instability and the like of a chassis caused by a water pump being mounted on a water cooling radiator or externally connected. In addition, the flow of a coolant can be increased, so that a heat source can be directly taken away from the cold plate, thereby effectively improving the working efficiency of cooling and the stability of water supply.

Description

Liquid cooling heat dissipation device TECHNICAL FIELD

[0001] The utility model relates to liquid cooling field especially liquid cooling heat dissipation device. BACKGROUND

[0002] With the continuous improvement of computer hardware, server big data, artificial intelligence application to chip performance, especially when processing high load task, the chip will produce a large amount of heat. If these heat cannot be discharged in time and effectively, it will cause the temperature of the chip to be too high, and then affect its performance and stability, and even may cause failure. In order to reduce the large amount of heat generated by the chip, by adopting liquid cooling system, the circulating water or other cooling liquid is used to absorb and take away the heat generated by hardware, and then the heat is dissipated to the air through the radiator.

[0003] In the liquid cooling system on the market, the water pump is generally connected to the water discharge and the liquid cooling plate by a water pipe. Because there is no fixed position, the water pump may affect normal installation in the narrow case space, and may also have the problem of unstable structure. The water pump will vibrate when working, which reduces the stability of water supply. Because of multi-section connection, the cooling liquid has poor passability, and increases the risk of liquid leakage of pipeline connection. Also, it cannot transport the cooling liquid to the water discharge in the first time when the cold plate absorbs heat, thereby reducing the working efficiency. UTILITY MODEL CONTENTS

[0004] To solve the above problems, the utility model provides a liquid cooling system.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: the utility model relates to a liquid cooling heat dissipation device, which comprises a water discharge, an inlet pipe, an outlet pipe, a water pump and a cold plate. The water pump is arranged on the cold plate, and the liquid flow channels of the water pump and the cold plate are through. A water outlet is arranged on the water pump, and an inflow joint is arranged on the cold plate. The inlet end of the water discharge is connected to the water outlet of the water pump through the inlet pipe, and the outlet end of the water discharge is connected to the inflow joint through the outlet pipe.

[0006] Preferably, the cold plate is fixed to the main plate by a fastener, and the fastener comprises a clamping cover plate and a clamping piece. A cold plate mounting groove for mounting the cold plate is arranged on the lower surface of the clamping cover plate. The cold plate is mounted in the cold plate mounting groove, and the clamping piece fastens the clamping cover plate to the main plate.

[0007] Preferably, the clamping piece comprises a stud and a spring sleeved on the stud.

[0008] Preferably, a first cooling fan is arranged above the cold plate, and the first cooling fan is fixed above the cold plate by a fan support.

[0009] Preferably, the water pump and the cold plate are detachably connected. The fastening cover plate is provided with a water pump mounting platform, the water pump mounting platform is provided with a water pump mounting hole, and the water pump is provided with a water pump assembly hole. The water pump is fixed to the water pump mounting platform by fasteners passing through the water pump assembly hole and the water pump mounting hole in sequence. The water pump includes an internal liquid flow channel, a water pump inlet, and a water pump outlet that are interconnected. The cold plate includes an internal liquid flow channel, an outflow connector, and an inflow connector that are interconnected. The water pump inlet and the outflow connector are plugged in and connected.

[0010] Preferably, the inflow connector and the outflow connector are respectively disposed on the top of the cold plate. The cold plate mounting groove is provided with a first connection port and a second connection port. When the cold plate is installed in the cold plate mounting groove, the first connection port corresponds to the position of the inflow connector, and the second connection port corresponds to the position of the outflow connector. The water outlet pipe is connected to the inflow connector through the first connection port, and the water pump inlet is connected to the outflow connector through the second connection port.

[0011] Preferably, the snap-fit ​​cover plate is provided with a plurality of second assembly holes, the second assembly holes penetrating through the snap-fit ​​cover plate, and the upper surface of the cold plate is provided with a plurality of third assembly holes that match the second assembly holes. The fasteners pass through the second assembly holes and the third assembly holes in sequence to fix the cold plate to the snap-fit ​​cover plate.

[0012] Preferably, the fastening cover plate is provided with a plurality of second assembly holes, the second assembly holes passing through the fastening cover plate, and the fan bracket is provided with a plurality of first assembly holes corresponding to the second assembly holes; the fasteners pass through the first assembly holes and the second assembly holes in sequence to install the fan bracket on the fastening cover plate.

[0013] Preferably, the water drain includes a front water tank, a first flow channel, a rear water tank, and a second flow channel. The front water tank is divided into an inlet chamber and an outlet chamber. The inlet chamber is connected to the rear water tank through the first flow channel, and the outlet chamber is connected to the rear water tank through the second flow channel. The inlet chamber is connected to the water pump outlet through an inlet pipe, and the outlet chamber is connected to the inlet connector through an outlet pipe. The water drain is equipped with several second cooling fans.

[0014] The beneficial effects of this utility model are as follows: This embodiment relates to a liquid cooling heat dissipation device. Unlike existing liquid cooling systems, in this embodiment, by placing the water pump on the cold plate, the problems of insufficient chassis space and structural instability caused by installing the water pump on the water drain or external connection are structurally avoided. At the same time, it can increase the flow rate of the coolant, directly removing the heat source from the cold plate, effectively improving cooling efficiency and water supply stability. Attached Figure Description

[0015] Figure 1 is a structure schematic diagram of the liquid cooling system of the utility model applied to INTEL chip mainboard.

[0016] Figure 2 is an explosion structure schematic diagram of the liquid cooling system of the utility model.

[0017] Figure 3 is an assembly structure schematic diagram of the fan support, the buckling cover plate and the cold plate of the utility model.

[0018] Figure 4 is a top structure schematic diagram of the buckling cover plate of the utility model.

[0019] Figure 5 is a bottom structure schematic diagram of the buckling cover plate of the utility model.

[0020] Figure 6 is a structure schematic diagram of the water pump of the utility model.

[0021] Figure 7 is an internal section structure schematic diagram of the water drain of the utility model.

[0022] Figure 8 is a structure schematic diagram of the liquid cooling system of the utility model applied to AMD chip mainboard.

[0023] Figure 9 is a use state schematic diagram of the embodiment three of the utility model assembled to computer mainboard.

[0024] Figure 10 is a structure schematic diagram of the cold head of the embodiment three of the utility model.

[0025] Figure 11 is a structure schematic diagram of the upper cover of the embodiment three of the utility model.

[0026] Figure 12 is a structure schematic diagram of the water inlet pipe joint, the water outlet pipe joint and the upper cover of the embodiment three of the utility model. DRAWINGS

[0027] 1, water drain; 11, front water tank; 111, water inlet chamber; 112, water outlet chamber; 12, first flow channel; 13, rear water tank; 14, second flow channel; 15, water inlet end; 16, water outlet end;

[0028] 2, water inlet pipe; 3, water outlet pipe; 4, fan support; 41, supporting leg; 42, first assembly hole;

[0029] 5, buckling cover plate; 51, buckling piece; 52, second assembly hole; 53, cold plate mounting groove; 54, first connecting port; 55, second connecting port; 56, water pump mounting table; 57, water pump mounting hole;

[0030] 6, first heat dissipation fan; 7, water pump; 71, water pump water inlet; 72, water pump water outlet; 73, water pump assembly hole;

[0031] 8, cold plate; 80, upper cover; 81, cooling plate; 800, cooling groove; 801, liquid inlet channel; 802, liquid outlet channel; 810, micro water channel; 803, positioning groove; 804, first mounting hole; 805, second mounting hole; 82, water inlet connector; 83, water outlet connector; 84, rivet; 85, third assembly hole;

[0032] 9. Second heat dissipation fan; 10. Assembly screw; 101. Heat dissipation fin. DETAILED DESCRIPTION Example one

[0033] Please refer to the drawings 1-8, the utility model relates to a kind of liquid cooling heat sink, including water row 1, water inlet pipe 2, water outlet pipe 3, water pump 7 and cold plate 8, the water pump 7 is located on cold plate 8 and the liquid flow channel of both is through, the water pump 7 is equipped with water pump water outlet 72, the cold plate 8 is equipped with water inlet connector 82, the water inlet end 15 of water row 1 is connected with water pump water outlet 72 by water inlet pipe 2, the water outlet end 16 of water row 1 is connected to water inlet connector 82 by water outlet pipe 3.Cold plate 8 absorbs heat in the cooling liquid by water pump 7, and is extracted from water pump water outlet 72, and is flowed to water row 1, and the cooling liquid cooled by water row 1 is returned to cold plate 8 by water inlet connector 82.

[0034] In the embodiment, the water pump 7 and the cold plate 8 are detachably connected, the water pump 7 includes a water pump inlet 71 and a water pump outlet 72 which are respectively connected with the liquid flow channel of the water pump 7, the cold plate 8 includes a water outlet connector 83 and a water inlet connector 82 which are respectively connected with the liquid flow channel of the cold plate 8, the water inlet connector 82 and the water outlet connector 83 are respectively arranged on the top of the cold plate 8, and the water pump inlet 71 is connected with the water outlet connector 83.

[0035] In the embodiment, in order to further improve the heat dissipation performance, the cold plate 8 is provided with a first heat dissipation fan 6, and the first heat dissipation fan 6 is fixed on the top of the cold plate 8 by a fan support 4.

[0036] In this embodiment, in order to realize the liquid cooling heat dissipation device fixed on the mainboard, the cold plate 8 is fixed on the mainboard through the buckle, in order to adapt to AMD mainboard or INTEL mainboard, the cold plate 8 is detachably connected with the buckle, the buckle includes the buckle cover plate 5 and the buckle piece 51, the lower surface of the buckle cover plate 5 is provided with the cold plate mounting groove 53 for mounting the cold plate 8, the cold plate 8 is mounted in the cold plate mounting groove 53, the first heat dissipation fan 6 is detachably mounted above the buckle cover plate 5, the first heat dissipation fan 6 is detachably arranged on the buckle cover plate 5 through the fan support 4, the first heat dissipation fan 6 is fixed on the fan support 4, the fan support 4 is fixed on the buckle cover plate 5 through the fastener, the water pump 7 is fixed on the buckle cover plate 5, the water pump inlet 71 penetrates through the buckle cover plate 5 and is connected with the cold plate 8. After the liquid cooling heat dissipation device is mounted on the mainboard through the buckle, the heat generated by the chip on the mainboard is conducted to the cold plate 8, the cooling liquid in the cold plate 8 absorbs the heat on the chip, the first heat dissipation fan 6 dissipates heat for the cold plate 8, and the cooling liquid absorbing heat is pumped into the water discharge 1 by the water pump 7, and the water discharge 1 conducts heat to the external air. The specific flow path of the cooling liquid absorbing heat is that the cooling liquid absorbing heat flows out of the cold plate 8 from the water outlet joint 83, enters the water pump 7 through the water pump inlet 71, enters the water inlet pipe 2 through the water pump outlet 72 and flows into the water discharge 1, the cooling liquid absorbing heat is cooled after circulating through the water discharge 1, and the cooling liquid after cooling flows to the cold plate 8 through the water outlet pipe 3 and enters the cold plate 8 through the water inlet joint 82, so that the effect of circulating cooling is achieved.

[0037] Further, the first connecting port 54 and the second connecting port 55 are arranged in the cold plate mounting groove 53. When the cold plate 8 is mounted in the cold plate mounting groove 53, the first connecting port 54 corresponds to the position of the water inlet joint 82, and the second connecting port 55 corresponds to the position of the water outlet joint 83. The water outlet pipe 3 is connected with the water inlet joint 82 through the first connecting port 54, and the water pump inlet 71 is connected with the water outlet joint 83 through the second connecting port 55.

[0038] In this embodiment, the first heat dissipation fan 6 is arranged above the water pump 7 and the cold plate 8, which can dissipate heat and cool in the first time when the water pump 7 and the cold plate 8 generate heat, and further improves the heat dissipation effect. In order to improve the cooling effect, a plurality of second heat dissipation fans 9 are arranged on the water discharge 1, and the second heat dissipation fans 9 are used for secondary cooling of the cooling liquid in the water discharge 1, so that the cooling liquid can be fully cooled.

[0039] In this embodiment, the water discharge 1 includes a front water tank 11, a first flow channel 12, a rear water tank 13 and a second flow channel 14. The front water tank 11 is divided into a water inlet chamber 111 and a water outlet chamber 112. The water inlet chamber 111 is connected to the rear water tank 13 through the first flow channel 12, and the water outlet chamber 112 is connected to the rear water tank 13 through the second flow channel 14. The water inlet chamber 111 is connected to the water pump outlet 72 through the water inlet pipe 2, and the water outlet chamber 112 is connected to the water inlet pipe joint 82 through the water outlet pipe 3.

[0040] When the cooling liquid inside the cold plate 8 takes away the heat generated by the heat-generating chip from the surface of the cold plate 8, the cooling liquid will enter the water pump inlet 71 through the water outlet pipe joint 83. The water pump 7 provides power to transport the cooling liquid from the water pump outlet 72 to the water inlet end of the water discharge 1 through the water inlet pipe 2, and then into the water discharge 1 for cooling. The cooling liquid will enter the rear water tank 13 from the water inlet chamber 111 through the first flow channel 12, and then enter the water outlet chamber 112 from the rear water tank 13 through the second flow channel 14, so that the cooling liquid achieves the cooling effect. Subsequently, the cooled cooling liquid will enter the water inlet pipe joint 82 from the water outlet end of the water discharge 1 through the water outlet pipe 3, and the cooling liquid will return to the cold plate 8 to cool the heat-generating chip, so that the cooling liquid realizes the circulation work.

[0041] Further, the upper surface of the buckling cover plate 5 is provided with a plurality of second assembly holes 52, which penetrate into the cold plate mounting groove 53. The upper surface of the cold plate 8 is provided with a plurality of third assembly holes 85 matched with the second assembly holes 52. The fan bracket 4 includes a pair of supporting legs 41, and the supporting legs 41 are provided with a plurality of first assembly holes 42 corresponding to the second assembly holes 52. The first assembly holes 42, the second assembly holes 52 and the third assembly holes 85 are aligned from top to bottom and connected by assembly screws 10, so that the fan bracket 4 is installed on the buckling cover plate 5, and the cold plate 8 is also fixedly installed on the bottom of the buckling cover plate 5.

[0042] Further, in order to further fix the water pump 7 on the buckling cover plate 5, the buckling cover plate 5 is provided with a water pump mounting table 56, and the second connecting port 55 penetrates the water pump mounting table 56. The water pump 7 is arranged on the water pump mounting table 56, and the water pump inlet 71 is arranged in the second connecting port 55 and connected with the water outlet pipe joint 83. The water pump mounting table 56 is provided with a water pump mounting hole 57 pre-fabricated to be suitable for different models of water pumps 7. The water pump 7 is provided with a water pump assembly hole 73, which is matched with the position of the water pump mounting hole 57. The water pump assembly hole 73 can be connected to the water pump mounting hole 57 by using a fastener, so that the water pump 7 is further fixed on the water pump mounting table 56.

[0043] The embodiment relates to a liquid cooling heat dissipation device, wherein, different from an existing liquid cooling system, a water pump 7 is arranged on a cold plate 8, so that the water pump 7 is structurally avoided from being installed on a water discharge 1 or an external connection, and problems such as insufficient space in a case and unstable structure are avoided. Embodiment two

[0044] Referring to Fig. 8, the liquid cooling heat dissipation device in the embodiment is assembled on an INTEL chip mainboard, and embodiment two is different from embodiment one in that a buckling piece 51 comprises a stud and a spring sleeved on the stud. Embodiment three

[0045] As shown in Figs. 9 to 12, the utility model provides a liquid cooling plate heat dissipation structure, which is applied to a water cooling radiator, and the water cooling radiator comprises a cold head, a water discharge 1 and a water pipe for connecting the cold head and the water discharge 1, the cold head comprises a cold plate 8, heat dissipation fins 101, a heat conduction medium and a first heat dissipation fan 6, the cold plate 8 comprises an upper cover 80 and a cooling plate 81, the upper cover 80 and the cooling plate 81 are formed into an integrated structure through friction welding or brazing, the cooling plate 81 is used for contacting and conducting heat with a CPU, the heat dissipation fins 101 are assembled on the upper cover 80, and the first heat dissipation fan 6 is connected to the heat dissipation fins 101.

[0046] The utility model adopts the integrated cold plate 8, and the upper cover 80 and the cooling plate 81 are formed into an integrated structure through friction welding or brazing, which is relative to a split type structure locked through a screw, the structure not only can guarantee the firmness of welding, and can reduce the welding cost, and further can guarantee the sealing property of the cold plate 8, increases the service life of the cold plate 8, the heat conduction effect is better, and the process forming step is also more simple and convenient, secondly, the utility model still adds the heat dissipation fin 101 and the first heat dissipation fan 6 on the basis of the cold plate 8, so as to further optimize the heat dissipation effect of the CPU.

[0047] Furthermore, the heat dissipation fins 101 between the upper covers 80 are provided with the heat conduction medium, and the heat conduction medium can be heat conduction paste or heat conduction paste.

[0048] Specifically, the upper cover 80 is formed with a cooling groove 800 and liquid inlet flow channels 801 and liquid outlet flow channels 802 communicated with the cooling groove 800 respectively, and the front surface of the cooling plate 81 is formed with a plurality of micro water channels 810 protruding into the cooling groove 800, the cold liquid in the cold discharge flows into the cooling groove 800 through the liquid inlet flow channels 801, and under the action of the micro water channels 810, the back surface of the cooling plate 81 contacts the CPU, so as to play a heat conduction role on the CPU, and the heat-exchanged hot water is discharged through the liquid outlet flow channels 802.

[0049] Specifically, the upper cover 80 is concave formed with a positioning groove 803, the cooling groove 800 is twice concave formed from the positioning groove 803, the cooling plate 81 is welded into the positioning groove 803, and the plate surface of the cooling plate 81 is flush with the groove surface of the positioning groove 803.

[0050] Specifically, the upper cover 80 is connected with the water inlet pipe joint 82 at the position of the liquid inlet flow channel 801, and the upper cover 80 is connected with the water outlet pipe joint 83 at the position of the liquid outlet flow channel 802, and the joints are connected by double sealing rings or directly welded.

[0051] In the feasible embodiment, as shown in Figure 4, the water inlet pipe joint 82 and the water outlet pipe joint 83 can also be assembled to the upper cover 80 by the rivet 84.

[0052] In the embodiment, the liquid inlet flow channel 801 and the liquid outlet flow channel 802 are respectively located on the left and right sides of the cooling groove 800, preferably, the liquid inlet flow channel 801 has a liquid inlet, and the liquid outlet flow channel 802 has a liquid outlet, the liquid inlet and the liquid outlet are located on the same side of the upper cover 80, and the liquid inlet flow channel 801, the liquid outlet flow channel 802 and the cooling groove 800 form a U-shaped water path; the U-shaped water path can prevent hot water from backflowing and causing heat exchange, and can ensure that the temperature of the cold liquid is low and the cooling effect is better.

[0053] Preferably, the upper cover 80 and the cooling plate 81 are copper products or aluminum products, so as to achieve the best heat conduction effect.

[0054] In the embodiment, the upper cover 80 is formed with a plurality of first mounting holes 804, and the first mounting holes 804 are used for assembling the heat dissipation fins 101.

[0055] The upper cover 80 is formed with a second mounting hole 805, and the second mounting hole 805 is used for connecting the cooling plate 8 to an external computer mainboard structural member.

[0056] The utility model discloses a liquid cooling plate of integral type, and the upper cover and the cooling plate are integrally connected through friction welding or brazing, which is better than the structure connected through screws, and has the advantages of good sealing effect, better heat conduction effect, simpler process forming steps, improved production efficiency, enhanced product stability and reliability, no leakage risk, no performance decline or failure in long-term use, and the like. The utility model also adds heat dissipation fins and a fan to the liquid cooling plate, so that the heat dissipation effect of the liquid cooling plate is further optimized, the heat of the liquid cooling plate is conducted out by the heat dissipation fins, and the fan accelerates the heat dissipation of the heat dissipation fins.

[0057] The above embodiments only describe the preferred embodiments of the utility model, and do not limit the scope of the utility model, and various deformations and improvements of the technical scheme of the utility model made by the ordinary engineering technicians in the art without departing from the design spirit of the utility model shall fall within the protection scope determined by the claims of the utility model.

Claims

1. A liquid cooling heat sink, characterized by: The water pump is arranged on the cold plate and the liquid flow channels of the two are through, the water pump is provided with a water outlet, the cold plate is provided with an inflow joint, the water inlet end of the water drain is connected with the water outlet of the water pump through the water inlet pipe, and the water outlet end of the water drain is connected with the inflow joint through the water outlet pipe.

2. The liquid cooling heat dissipation device according to claim 1, characterized in that: The cold plate is fixed on the main plate through a buckle, the buckle comprises a buckling cover plate and a buckling piece, the lower surface of the buckling cover plate is provided with a cold plate mounting groove for mounting the cold plate, and the cold plate is mounted in the cold plate mounting groove.

3. The liquid cooling heat dissipation device according to claim 2, characterized in that: The buckling piece comprises a stud and a spring sleeved on the stud.

4. The liquid cooling heat dissipation device according to claim 2, characterized in that: The first cooling fan is arranged above the cold plate and is fixed above the cold plate through a fan support.

5. The liquid cooling heat dissipation device according to claim 2, characterized in that: The water pump is detachably connected with the cold plate, the buckling cover plate is provided with a water pump mounting table, the water pump mounting table is provided with a water pump mounting hole, the water pump is provided with a water pump assembly hole, the water pump is fixed on the water pump mounting table by sequentially penetrating the water pump assembly hole and the water pump mounting hole through a fastener, the water pump comprises an internal liquid flow channel, a water inlet and a water outlet which are through each other, the cold plate comprises an internal liquid flow channel, an outflow joint and an inflow joint which are through each other, and the water inlet of the water pump is connected with the outflow joint in a plug-in manner.

6. The liquid cooling heat dissipation device according to claim 5, characterized in that: The inflow joint and the outflow joint are arranged on the top of the cold plate, the cold plate mounting groove is provided with a first connecting port and a second connecting port, when the cold plate is mounted in the cold plate mounting groove, the first connecting port corresponds to the position of the inflow joint, the second connecting port corresponds to the position of the outflow joint, the water outlet pipe is connected with the inflow joint through the first connecting port, and the water inlet of the water pump is connected with the outflow joint through the second connecting port.

7. The liquid cooling heat dissipation device according to claim 2, characterized in that: The buckling cover plate is provided with a plurality of second assembly holes which penetrate the buckling cover plate, the upper surface of the cold plate is provided with a plurality of third assembly holes which match the second assembly holes, and the fastener sequentially penetrates the second assembly holes and the third assembly holes to fix and mount the cold plate on the buckling cover plate.

8. The liquid cooling heat dissipation device of claim 5, wherein: The buckling cover plate is provided with a plurality of second assembly holes which penetrate the buckling cover plate, the fan support is provided with a plurality of first assembly holes which correspond to the second assembly holes. The fastener sequentially penetrates the first assembly holes and the second assembly holes to mount the fan support on the buckling cover plate.

9. The liquid cooling heat dissipation device of claim 1, wherein: The water drain comprises a front water tank, a first flow channel, a rear water tank and a second flow channel, the inside of the front water tank is divided into a water inlet chamber and a water outlet chamber, the water inlet chamber is connected with the rear water tank through the first flow channel, the water outlet chamber is connected with the rear water tank through the second flow channel, the water inlet chamber is connected with the water outlet of the water pump through the water inlet pipe, the water outlet chamber is connected with the inflow joint through the water outlet pipe, and the water drain is provided with a plurality of second cooling fans.

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