Package, lead frame, and method for manufacturing package

Abstract

The present invention makes it possible to mount a chip on a package while reducing stress on the chip.　This package comprises: a chip; an inner lead having a tip end joined to the surface of the chip; an outer lead connected to the inner lead; a support part supporting the inner lead and the outer lead around the chip; and a lid disposed over the support part and spaced apart from the chip. The chip may be supported inside the support part on the basis of the tension applied to the inner leads. The tip end of the inner lead may be bonded to the surface of the chip by solder bonding.

Description

Package, lead frame and method for manufacturing package

[0001] The present technology relates to a package, a lead frame, and a method for manufacturing the package. More specifically, the present technology relates to a package capable of supporting a chip via terminals bonded to the chip, a lead frame, and a method for manufacturing the package.

[0002] To mount a chip in a package, there is a technique for die-bonding the chip inside the package. For example, a technique is disclosed in which a semiconductor chip is die-bonded to the front surface of a heat dissipation plate, a circuit board is attached to the back surface of the heat dissipation plate, and the semiconductor chip and the circuit board are wire-bonded through holes formed in the heat dissipation plate (see, for example, Patent Document 1).

[0003] International Publication No. 2020 / 26639

[0004] However, in the above-mentioned conventional technology, the semiconductor chip is die-bonded to the surface of the heat dissipation plate, which may increase the stress on the semiconductor chip due to the stress between the heat dissipation plate and the semiconductor chip.

[0005] This technology was developed in light of these circumstances, and aims to enable chips to be mounted in packages while suppressing the stress on the chips.

[0006] The present technology has been made to solve the above-mentioned problems, and a first aspect thereof is a package including a chip, inner leads having tips joined to surfaces of the chip, outer leads connected to the inner leads, a support portion that supports the inner leads and the outer leads around the chip, and a lid that is spaced apart from the chip and disposed on the support portion, thereby reducing stress applied to the chip accommodated in the package.

[0007] In addition, in the first aspect, the chip may be supported inside the support portion based on tension applied to the inner leads, thereby providing the effect of lifting the chip via the inner leads.

[0008] In addition, in the first aspect, the tip of the inner lead may be joined to the surface of the chip by soldering, thereby suppressing an increase in stress on the surface of the chip while joining the tip of the inner lead to the surface of the chip.

[0009] In the first aspect, the solder joint may further include a pad electrode made of aluminum to which a low-melting-point metal is added, the pad electrode being joined to the tip of the inner lead, thereby improving the stability of the solder joint between the tip of the inner lead and the pad electrode.

[0010] In the first aspect, the material of the support portion may be ceramic or resin, thereby providing the effect of sealing the chip in the package via the support portion.

[0011] In the first aspect, the lid may be a transparent member, thereby providing an effect of forming an optical path on the chip.

[0012] In addition, in the first aspect, a light-shielding layer may be formed on the transparent member so as to avoid the optical path on the chip, thereby reducing stray light that interferes with the optical path on the chip.

[0013] In addition, in the first aspect, the chip may further include a bottom plate portion disposed on the bottom of the chip, and the chip may be pressed against the bottom plate portion based on the tension of the inner leads, thereby suppressing an increase in stress on the chip and improving heat dissipation from the chip.

[0014] In addition, the first aspect may further include a fluid material disposed between the chip and the bottom plate and having a higher thermal conductivity than the bottom plate, thereby suppressing an increase in stress on the chip and improving heat dissipation from the chip.

[0015] The first side face may further include a thermally conductive layer embedded in the bottom plate portion and having a thermal conductivity higher than that of the bottom plate portion, thereby improving heat dissipation from the chip.

[0016] In addition, in the first side surface, the outer leads may reach the bottom surface via a side surface of the support portion and be bent inward at the bottom surface, thereby suppressing an increase in the planar size of the package and allowing the outer leads to be drawn out to the outside.

[0017] The first aspect may further include a frame positioned above the inner leads and to which the lid is attached, and a fastening portion extending horizontally from the frame, thereby providing the effect of fixing a package on which a chip is mounted via the fastening portion.

[0018] In the first aspect, the fastening portion may have the same optical accuracy as the chip, thereby providing an effect that the optical accuracy of the chip is ensured by mounting the package via the fastening portion.

[0019] In the first aspect, the inner edge of the frame may be disposed along the outer shape of the chip, thereby improving the light blocking effect through the frame.

[0020] In the first aspect, the frame may be made of a magnetic shielding material, whereby a magnetic shielding effect can be obtained by mounting the package via a fastening portion.

[0021] In the first aspect, the cross-sectional shape of the inner wall of the frame may be tapered, thereby reducing flare on the chip.

[0022] In the first aspect, the inner wall surface of the frame may have a textured surface or a recess, which reduces flare on the chip and forms a resin pool.

[0023] In the first aspect, the inner lead may be connected to the outer lead by penetrating the support portion, thereby providing an effect that the inner lead and the outer lead are supported by the support portion without being disposed on the support portion.

[0024] In the first aspect, the support portion may be a mold frame from which the inner lead is drawn out from an inner surface and the outer lead is drawn out from an outer surface, thereby providing the effect that the inner lead penetrates the support portion and is connected to the outer lead based on molding of the lead frame.

[0025] In addition, in the first aspect, a flexible printed circuit board may be provided, which is arranged along the inner leads, has its tip joined to the surface of the chip, and is supported by the support portion, thereby enabling high-speed data transmission between the chip and the flexible printed circuit board, and reducing stress on the chip accommodated in the package.

[0026] The second aspect is a lead frame including leads whose tips are arranged opposite each other with a space between them and a frame that supports the rear ends of the leads, thereby providing the effect of supporting the chip via the leads.

[0027] In addition, the second aspect may further include a first tie bar formed between adjacent first and second leads, and a second tie bar formed between the first and second leads at a distance from the first tie bar, thereby providing the effect of trapping the molding resin between the first tie bar and the second tie bar between the adjacent leads.

[0028] In addition, in the second aspect, the leads may be arranged in parallel at a first interval along an inner side of the frame, and a second interval larger than the first interval may be set between the leads arranged in parallel, thereby providing an effect that a transmission line can be arranged between the leads with the second interval set.

[0029] A third aspect is a method for manufacturing a package, comprising the steps of: joining a surface of a chip to the tip of an inner lead connected to a lead frame via an outer lead; forming a support portion that supports the inner lead and the outer lead around the chip; and arranging a lid on the support portion at a distance from the chip, thereby reducing stress on the chip while accommodating the chip in the package.

[0030] FIG. 1 is a cross-sectional view showing a configuration example of a package according to a first embodiment; FIG. 2 is a plan view showing a configuration example of a lead frame according to the first embodiment; FIG. 3 is a perspective view showing an external appearance example of a package according to the first embodiment; FIG. 4 is a perspective view showing an external appearance example of a package according to the first embodiment; FIG. 5 is a diagram showing a manufacturing method of the package according to the first embodiment; FIG. 6 is a cross-sectional view showing a manufacturing method of the package according to the first embodiment; FIG. 7 is a cross-sectional view showing a manufacturing method of the package according to the first embodiment; FIG. 8 is a cross-sectional view showing a manufacturing method of the package according to the first embodiment; FIG. 9 is a perspective view showing a manufacturing method of the package according to the first embodiment; FIG. 10 is a plan view showing a manufacturing method of the package according to the first embodiment; FIG. 11 is a cross-sectional view showing another configuration example of the package according to the first embodiment; FIG. 12 is a cross-sectional view showing a configuration example of a package according to the second embodiment; FIG. 13 is a cross-sectional view showing a manufacturing method of the package according to the second embodiment; FIG. 14 is a cross-sectional view showing a configuration example of a package according to the third embodiment; FIG. 15 is a cross-sectional view showing a configuration example of a package according to the fourth embodiment; FIG. 16 is a cross-sectional view showing a configuration example of a package according to the fifth embodiment; FIG. 17 is a cross-sectional view showing a configuration example of a package according to the sixth embodiment; FIG. 18 is a cross-sectional view showing a configuration example of a package according to the seventh embodiment; FIG. 19 is a cross-sectional view showing a configuration example of a package according to the eighth embodiment; FIG. 20 is a cross-sectional view showing a configuration example of a package according to the ninth embodiment. FIG. 13 is a plan view showing a configuration example of a lead frame according to a ninth embodiment. FIG. 14 is a cross-sectional view showing a manufacturing method of a package according to the ninth embodiment. FIG. 15 is a cross-sectional view showing a configuration example of a package according to a tenth embodiment. FIG. 16 is a cross-sectional view showing another configuration example of a package according to the tenth embodiment. FIG. 17 is a cross-sectional view showing yet another configuration example of a package according to the tenth embodiment. FIG. 18 is a perspective view showing an appearance example of a package according to the tenth embodiment. FIG. 19 is a diagram showing a manufacturing method of a package according to the tenth embodiment. FIG. 20 is a cross-sectional view showing a manufacturing method of a package according to the tenth embodiment. FIG. 21 is a cross-sectional view showing a manufacturing method of a package according to the tenth embodiment. FIG. 22 is a cross-sectional view showing yet another configuration example of a package according to the tenth embodiment.13A and 13B are cross-sectional views showing still another example of the configuration of the package according to the tenth embodiment; cross-sectional views showing still another example of the configuration of the package according to the tenth embodiment; views showing an example of the configuration of the package according to the eleventh embodiment; cross-sectional views showing a manufacturing method of the package according to the eleventh embodiment; cross-sectional views showing a manufacturing method of the package according to the eleventh embodiment; cross-sectional views showing a manufacturing method of the package according to the eleventh embodiment; plan views showing still another example of the configuration of the package according to the eleventh embodiment; plan views showing still another example of the configuration of the package according to the eleventh embodiment; plan views showing still another example of the configuration of the package according to the eleventh embodiment; cross-sectional views showing an example of a mounting of the package according to the eleventh embodiment; views showing an example of a configuration of the package according to the twelfth embodiment; views showing an example of a mounting method of the package according to the twelfth embodiment; cross-sectional views showing an example of a configuration of the package according to the thirteenth embodiment; cross-sectional views showing an example of a configuration of the package according to the fourteenth embodiment; cross-sectional views showing an example of a configuration of the package according to the fifteenth embodiment; views showing an example of a configuration of the package according to the sixteenth embodiment; cross-sectional views showing an example of a configuration of the package according to the seventeenth embodiment; plan views showing an example of a configuration of a lead frame applied to the package according to the seventeenth embodiment; perspective views showing an example of the appearance of the package according to the seventeenth embodiment. FIG. 20 is a cross-sectional view showing a configuration example of a flexible printed circuit board applied to a package according to a seventeenth embodiment. FIG. 21 is a cross-sectional view showing a manufacturing method of the package according to the seventeenth embodiment. FIG. 22 is a plan view showing a manufacturing method of the package according to the seventeenth embodiment. FIG. 23 is a cross-sectional view showing another configuration example of the package according to the seventeenth embodiment. FIG. 24 is a plan view showing another configuration example of a lead frame applied to the package according to the seventeenth embodiment. FIG. 25 is a cross-sectional view showing yet another configuration example of the package according to the seventeenth embodiment. FIG. 26 is a plan view showing yet another configuration example of a lead frame applied to the package according to the seventeenth embodiment. FIG. 27 is a cross-sectional view showing yet another configuration example of the package according to the seventeenth embodiment. FIG. 28 is a diagram showing yet another configuration example of the package according to the seventeenth embodiment.It is a block diagram showing a schematic configuration example of a vehicle control system.It is an explanatory diagram showing an example of an installation position of an imaging unit.

[0031] Modes for carrying out the present technology (hereinafter referred to as embodiments) will be described below. The description will be made in the following order: 1. First embodiment (an example in which a chip is supported inside a support portion based on tension applied to an inner lead, and the chip is pressed against a substrate) 2. Second embodiment (an example in which a chip is supported inside a support portion based on tension applied to an inner lead, and the chip is pressed against a substrate via a fluid material) 3. Third embodiment (an example in which a chip is supported inside a support portion based on tension applied to an inner lead, and the chip is pressed against a thermally conductive layer embedded in a substrate) 4. Fourth embodiment (an example in which a chip is supported inside a support portion based on tension applied to an inner lead, and the chip is pressed against a thermally conductive layer embedded in a substrate via a fluid material) 5. Fifth embodiment (an example in which a chip is supported inside a support portion based on tension applied to an inner lead, and the chip is pressed against a substrate, and the support portion is formed by a resin frame) 6. Sixth embodiment (an example in which a chip is supported inside a support portion based on tension applied to an inner lead, and the chip is pressed against a substrate via a fluid material, and the support portion is formed by a resin frame) 7. 7. Seventh embodiment (an example in which a chip is supported inside a support part based on tension applied to inner leads, the chip is pressed against a thermally conductive layer embedded in a substrate, and the support part is formed by a resin frame) 8. Eighth embodiment (an example in which a chip is supported inside a support part based on tension applied to inner leads, the chip is pressed against a thermally conductive layer embedded in a substrate via a fluid material, and the support part is formed by a resin frame) 9. Ninth embodiment (an example in which a chip is supported inside a support part based on tension applied to inner leads, the chip is pressed against a substrate, and the support part is formed by a molded resin) 10. Tenth embodiment (an example in which a chip is supported inside a support part based on tension applied to inner leads extended downward from the chip, and outer leads are penetrated through the support part and drawn out to the outside of the support part) 11. Eleventh embodiment (an example in which a frame having a fastening part extended horizontally to a base substrate is provided between a transparent substrate and inner leads) 12. Twelfth embodiment (an example in which a frame is formed by a magnetic shielding material)13. Thirteenth embodiment (an example in which the cross-sectional shape of the inner wall of the frame is tapered) 14. Fourteenth embodiment (an example in which a textured surface is provided on the inner wall surface of the frame) 15. Fifteenth embodiment (an example in which a recess is provided on the inner wall surface of the frame) 16. Sixteenth embodiment (an example in which a transparent substrate is attached to the underside of the frame) 17. Seventeenth embodiment (an example in which a flexible printed circuit board is provided that is supported by a support portion along the inner lead) 18. Application example to a moving body

[0032] 1. First embodiment

[0033] 1 is a cross-sectional view showing an example of the configuration of a package according to the first embodiment. Note that "a" in the figure is a cross-sectional view showing an example of the overall configuration of a package 100, and "b" in the figure is a cross-sectional view showing an enlarged view of a bonding portion of an inner lead 116A. The drawings used in the following explanation may differ in scale and shape from the actual structure to make each component easier to understand.

[0034] In the figure, the package 100 includes a base substrate 121, a chip 111, leads 116, and a transparent substrate 122. In this case, the package 100 can form a hollow package in which the chip 111 is mounted. The base substrate 121 is an example of a substrate as defined in the claims. The transparent substrate 122 is an example of a lid as defined in the claims.

[0035] The chip 111 is mounted on the base substrate 121. A cavity CAV is formed in the base substrate 121 to house the chip 111. In this case, the base substrate 121 may be provided with a bottom plate portion 121A and a support portion 121B. The bottom plate portion 121A is located at the bottom of the base substrate 121. The chip 111 may be placed on the bottom plate portion 121A. The support portion 121B is located around the periphery of the base substrate 121. In this case, the support portion 121B may surround the periphery of the cavity CAV. The support portion 121B may support the leads 116 around the chip. The base material of the base substrate 121 may be, for example, ceramic or resin. The materials of the bottom plate portion 121A and the support portion 121B may be the same. In this case, the bottom plate portion 121A and the support portion 121B may be integrally molded.

[0036] The chip 111 is mounted in a cavity CAV of the base substrate 121. Pad electrodes 113 to which the leads 116 are connected can be formed on the chip 111. The material of the pad electrodes 113 may be, for example, an Fe-Ni-Co alloy or a metal such as Al or Cu. A plating layer of Ni, Au, or the like may be formed on the pad electrodes 113. The material of the pad electrodes 113 may be primarily Al, with low-melting-point metals such as Bi, Pb, and Sn added. This can improve the stability of the solder joint between the tip of the inner lead 116A and the pad electrodes 113.

[0037] A semiconductor element, an optical element, or a MEMS (Micro Electro Mechanical Systems) may be formed on the chip 111. The substrate used for the chip 111 may be a semiconductor substrate, a dielectric substrate, or an organic substrate.

[0038] The light receiving element may be an image sensor such as a CCD (Charged Coupled Device) sensor, a CMOS (Complementary Metal-Oxide Semiconductor) sensor, or a SPAD (Single Photon Avalanche Diode) sensor. The light received by the image sensor may be visible light, near infrared light (NIR: Near Infrared), short wavelength infrared light (SWIR: Short Wavelength Infrared), ultraviolet light, or X-rays. The optical element may be a light receiving element such as a PD (Photo Diode), or a light emitting element such as an LD (Laser Diode), an LED (Light Emitting Diode), or a VCSEL (Vertical Cavity Surface Emitting Laser). The optical element may be an optical switch or a DMD (Digital Micromirror Device). The optical element may be a display element such as a liquid crystal element or an organic EL (Electro Luminescence) element. The material used for the optical element may be a semiconductor such as Si, GaAs, or InGaAs, or LiNbO ３ , or may be a dielectric material such as glass or transparent resin.

[0039] The semiconductor element may include a transistor, a resistor, a capacitor, etc. The semiconductor element may form a memory, a processor, a signal processing circuit, a data processing circuit, or an interface circuit. The semiconductor element may form a hardware circuit such as an FPGA (Field-Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit). The material used for the semiconductor element may be Si, GaAs, SiC, GaN, InGaAs, InP, InGaAsP, etc.

[0040] For example, an imaging element can be formed on the chip 111. The imaging element may be a CMOS image sensor, a CCD (Charge-Coupled Device), or an event-based vision sensor. In this case, a light-receiving region 112 is provided on the chip 111. Pixels and pixel transistors are arranged in a matrix along the row and column directions in the light-receiving region 112. Photodiodes or SPADs (Single Photon Avalanche Diodes) may be formed on the pixels.

[0041] A color filter 114 can be formed for each pixel on the light receiving region 112. An on-chip lens 115 can be formed for each pixel on the color filter 114. The material of the color filter 114 and the on-chip lens 115 is, for example, SiO ２ An insulating film such as SiN or SiCN, or a transparent resin such as acrylic or polycarbonate can be used. The color filter 114 may contain a pigment. The color filter 114 may have, for example, a Bayer array or a quad-Bayer array. The color filter 114 may include an RGB filter, a complementary color filter, or a white filter. A lens, a color splitter, or a deflector made of a metasurface may be formed on the light receiving region 112.

[0042] The leads 116 include an inner lead 116A and an outer lead 116B. The inner lead 116A and the outer lead 116B are connected to each other. The inner lead 116A is located inside the cavity CAV. The outer lead 116B is located outside the cavity CAV.

[0043] The tip of the inner lead 116A is bonded to the surface of the chip 111. At this time, as shown in b in the figure, the tip of the inner lead 116A may be bonded to the pad electrode 113 via a solder ball 117. By bonding the tip of the inner lead 116A to the pad electrode 113 via the solder ball 117, damage to the chip 111 when bonding the inner lead 116A can be suppressed.

[0044] The inner leads 116A extend obliquely upward from the surface of the chip 111 and then extend horizontally to connect to the outer leads 116B. At this time, the leads 116 can support the chip 111 within the cavity CAV based on the tension applied to the inner leads 116A. Furthermore, the leads 116 can press the chip 111 against the bottom plate portion 121A based on the tension of the inner leads 116A. At this time, the leads 116 can lift up the chip 111 while in contact with the bottom plate portion 121A.

[0045] The outer lead 116B can be bent downward at the outer peripheral surface of the support portion 121B and bent horizontally at the lower surface of the support portion 121B. In this case, the outer lead 116B may be bent inward in a J-shape at the lower surface of the support portion 121B. Here, the outer lead 116B may be bent inward in a J-shape at four side surfaces of the outer peripheral surface of the support portion 121B to form a QFJ (Quad Flat J-leaded package), or the outer lead 116B may be bent inward in a J-shape at two side surfaces of the outer peripheral surface of the support portion 121B to form a SOJ (Small Outline J-leaded package). The material of the lead 116 may be a 42 alloy or a metal such as Cu. The material of the lead 116 may be an elastically deformable metal or alloy. A light-shielding layer may be formed on surfaces of the lead 116 other than the bonding surface. The light-shielding layer may be an anti-reflective film formed of black paint or the like.

[0046] The transparent substrate 122 is disposed on the chip 111 via a cavity CAV. At this time, the transparent substrate 122 is supported on the chip 111 via a support portion 121B and bonded onto the support portion 121B. Here, the leads 116 can be drawn out from between the transparent substrate 122 and the support portion 121B to the outside of the support portion 121B. The transparent substrate 122 can be bonded onto the support portion 121B via the leads 116. The transparent substrate 122 may be a glass substrate, a quartz substrate, or a transparent resin substrate such as acrylic or polycarbonate. The transparent substrate 122 is made of Al, depending on the wavelength of light received by the chip 111. ２ O ３ , CaF ２ , MgF ２ Alternatively, LiF or the like may be used.

[0047] 2 is a plan view showing an example of the configuration of a lead frame according to the first embodiment. This figure shows an example of a lead frame RM1 in which three sub-frames SM1 are connected. While this figure shows an example of a lead frame RM1 in which leads 116 can be drawn out to four side surfaces of the package 100, a lead frame in which leads can be drawn out to two side surfaces of the package may also be used.

[0048] In the figure, the lead frame RM1 is composed of multiple connected sub-frames SM1. One package 100 can be assigned to one sub-frame SM1. Each sub-frame SM1 includes a unit frame FM1 and leads 116. The unit frame FM1 supports the leads 116 for each sub-frame SM1 in the lead frame RM1. The leads 116 extend inward from the four inner sides of the unit frame FM1. Tips TP1 and TP2 of the leads 116 extending from opposing inner sides of the unit frame FM1 are arranged opposite each other with a space between them. At this time, the die pad on which the chip 111 is mounted is removed from the unit frame FM1. Here, only the leads 116 of the sub-frame SM1 are attached to the package 100, and the unit frame FM1 is removed from the package 100 by lead cutting.

[0049] 3 is a perspective view showing an example of the appearance of the package according to the first embodiment. In the figure, "a" is a perspective view showing an example of the overall configuration of the upper surface side of the package 100, and "b" is a perspective view showing an example of the overall configuration of the lower surface side of the package 100. In addition, in the figure, an example is shown in which the package 100 is a QFJ.

[0050] In the figure, a QFJ is formed by bending outer leads 116B inward in a J-shape on the four outer side surfaces of a base substrate 121. In a QFJ, it is possible to prevent the outer leads 116B from protruding outside the package 100, thereby reducing the mounting area of ​​the package 100.

[0051] 4 is a perspective view showing an example of the appearance of the package according to the first embodiment, in which the package 100 is a QFJ.

[0052] 10A, the QFJ is formed by bending the outer leads 116B inward in a J-shape on the four side surfaces of the periphery of the base substrate 121. In this case, a transparent substrate 122 is used as the lid of the package 100.

[0053] In the diagram, a transparent substrate 122 is used as the lid of the package 100. At this time, a light-shielding layer 123 is formed around the periphery of the transparent substrate 122. The light-shielding layer 123 can be arranged so as to avoid over the chip 111, so that light incident on the light-receiving region 112 is not blocked. The light-shielding layer 123 may be formed by, for example, sputtering, coating, inkjet printing, or the like.

[0054] In FIG. 1C, an opaque substrate 122′ is used as the lid of the package 100. The material of the opaque substrate 122′ may be ceramic, metal, or resin. At this time, a chip 111′ can be mounted on the package 100. The chip 111′ may be a semiconductor chip such as a processor, or a power device such as an inverter chip.

[0055] Figures 5 to 12 are diagrams showing a method for manufacturing a package according to the first embodiment. Figures 5 to 9 show an excerpt of the manufacturing process for four packages, Figure 10 shows an excerpt of the manufacturing process for one package, and Figures 11 and 12 show an excerpt of the manufacturing process for three packages. Figure 11 is a perspective view showing the manufacturing process indicated by b in Figure 9, and Figure 12 is a plan view showing the package manufacturing process in the manufacturing process indicated by Figure 11. Figures 10 c to 10 f omit the substrate mounting jig 151 to make it easier to see the bent state of the leads 116 of the lead frame RM1.

[0056] 5A, a chip mounting jig 131 is provided with a storage section 132 for storing the chip 111, and is also formed with suction holes 133 for sucking the chip 111. Positioning pins 134 are also arranged on the chip mounting jig 131. The depth of the storage section 132 can be equal to the thickness of the chip 111. Then, the chip 111 is transported onto the chip mounting jig 131, and is stored in the storage section 132 while being sucked through the suction holes 133.

[0057] 5b, openings 136 are formed in the squeegee mask 135 in correspondence with the positions of the pad electrodes 113, and positioning holes 138 are formed in correspondence with the positions of the positioning pins 134. The inner diameter of the positioning holes 138 can be made to correspond to the outer diameter of the positioning pins 134. The squeegee mask 135 is then placed on the chip mounting jig 131. At this time, the positioning pins 134 are inserted into the positioning holes 138, so that the openings 136 can be positioned above the pad electrodes 113.

[0058] 5C and 5D, flux 139 is applied onto the squeegee mask 135. Then, the squeegee 137 is moved horizontally while being pressed against the squeegee mask 135, causing the flux 139 to drop into the openings 136 and be applied onto the pad electrodes 113.

[0059] 6A, the squeegee mask 135 is removed from the chip mounting jig 131. At this time, the flux 139 is left on the pad electrodes 113.

[0060] 6b, openings 142 are formed in the solder ball mask 141 corresponding to the positions of the pad electrodes 113, and positioning holes 143 are formed in the solder ball mask 141 corresponding to the positions of the positioning pins 134. The inner diameter of the positioning holes 143 can be made to correspond to the outer diameter of the positioning pins 134. The solder ball mask 141 is then placed on the chip mounting jig 131. At this time, the positioning pins 134 are inserted into the positioning holes 143, thereby positioning the openings 142 above the pad electrodes 113. The solder balls 117 are then placed on the solder ball mask 141. The squeegee 144 is then moved horizontally while being pressed against the solder ball mask 141, and the solder balls 117 are dropped into the openings 142 and placed on the pad electrodes 113. At this time, as shown in FIGS. 6b and 6c, flux 139 is placed between the solder balls 117 and the pad electrodes 113.

[0061] 6d, the solder ball mask 141 is removed from the chip mounting jig 131. At this time, the solder balls 117 are left on the pad electrodes 113.

[0062] 7A, positioning holes 145 can be formed in the lead frame RM1 to correspond to the positions of the positioning pins 134. The positioning holes 145 can be formed, for example, by punching. The inner diameter of the positioning holes 145 can correspond to the outer diameter of the positioning pins 134. Then, as shown in FIG. 7B, the lead frame RM1 is placed on the chip mounting jig 131.

[0063] Next, as shown in FIG. 7c, the positioning pins 134 are inserted into the positioning holes 145, and the tips of the inner leads 116A are brought into contact with the solder balls 117 for each unit frame FM1.

[0064] 7d and 7e, the tip of the inner lead 116A is irradiated with laser light LZ to join the tip of the inner lead 116A to the pad electrode 113 via the solder ball 117. Note that the tip of the inner lead 116A may also be joined to the pad electrode 113 based on solder reflow of the solder ball 117.

[0065] 8 a, substrate mounting jig 151 is provided with storage section 152 for storing base substrate 121, and is also formed with suction holes 153 for sucking base substrate 121. Substrate mounting jig 151 is also provided with openings 156 that allow leads 116 of lead frame RM1 to be bent, and positioning pins 154 are arranged on substrate mounting jig 151. Then, base substrate 121 is transported onto substrate mounting jig 151, and is stored in storage section 152 while being sucked through suction holes 153.

[0066] Next, as shown in FIG. 8B, adhesive 158 is applied onto the support portion 121B of the base substrate 121 using a dispenser 157.

[0067] Next, as shown in FIG. 8c, the lead frame RM1 is placed on the substrate mounting jig 151 on which the base substrate 121 coated with the adhesive 158 is placed.

[0068] 8d, the positioning pins 154 of the lead frame RM1 are inserted into the positioning holes 145, and the leads 116 between the inner leads 116A and the outer leads 116B are placed on the support portion 121B of the base substrate 121. Then, the leads 116 located on the support portion 121B are bonded to the support portion 121B via adhesive 158. At this time, the adhesive 158 can cover the leads 116 located on the support portion 121B.

[0069] Next, as shown in FIG. 9A, adhesive 160 is applied using a dispenser 159 so as to cover the leads 116 on the support portion 121B of the base substrate 121.

[0070] 9b and 11, the transparent substrate mounting unit 161 and the camera 162 are transported onto the substrate mounting jig 151 on which the base substrate 121 to which the lead frame RM1 is attached is placed. The transparent substrate mounting unit 161 and the camera 162 can be transported in units of sub-frames SM1 along the transport direction HR. The transport direction HR can be set along the lead frame RM1.

[0071] 12, an alignment mark 164 can be formed on the base substrate 121. The alignment mark 164 can be used to position the transparent substrate 122. The alignment mark 164 can be placed at a position that can be observed from above the substrate mounting jig 151 on which the base substrate 121 to which the lead frame RM1 is bonded is placed.

[0072] Then, after observing the alignment marks 164 on the base substrate 121 on which the transparent substrate 122 will currently be placed via the camera 162, the camera 162 is moved to the base substrate 121 on which the transparent substrate 122 will next be placed. The transparent substrate 122 is then transported via the transparent substrate mounting unit 161 onto the base substrate 121 on which the transparent substrate 122 will currently be placed, and the transparent substrate 122 is mounted on the base substrate 121. At this time, the transparent substrate mounting unit 161 can align the transparent substrate 122 in accordance with the alignment marks 164 observed by the camera 162.

[0073] 9c, a frame processing section 163 is disposed above the lead frame RM1 to which the base substrate 121 is adhered, and a frame processing section 165 is disposed below the frame processing section 163. The frame processing section 163 is provided with protrusions 167 that punch out the lead frame RM1 to separate the leads 116 from the unit frame FM1 and bend the leads 116. The frame processing section 165 is provided with recesses 166 that bend the outer leads 116B inward in a J-shape based on pressure from above by the frame processing section 163. The inner shape of the recesses 166 can correspond to the J-shape of the outer leads 116B.

[0074] 10A and 10B, for example, a space for bending the outer leads 116B from the horizontal direction to the vertical direction can be provided in the opening 156 of the substrate mounting jig 151. In this case, steps can be provided in the storage section 152 at the four corners of the base substrate 121.

[0075] 10(c) and 10(d), the outer leads 116B are pressed downward while the convex portions 167 of the substrate mounting jig 151 are pressed against the upper surfaces of the outer leads 116B, thereby bending the outer leads 116B from the horizontal direction to the vertical direction. At this time, the lower ends of the outer leads 116B can protrude downward from the lower surface of the base substrate 121, as shown in FIG.

[0076] Next, as shown in FIG. 10e, the frame processing portion 165 is pushed up so that the lower ends of the outer leads 116B come into contact with the recesses 166 of the frame processing portion 165.

[0077] 10F, the frame processing portion 165 is pushed up while the lower end of the outer lead 116B is brought into contact with the recess 166 of the frame processing portion 165. At this time, the outer lead 116B is bent along the recess 166 of the frame processing portion 165, and the outer lead 116B is curved inward in a J-shape.

[0078] FIG. 13 is a cross-sectional view showing another example of the configuration of the package according to the first embodiment.

[0079] In the figure, this package 100' has leads 116' instead of the leads 116 in Figure 1. The leads 116' have outer leads 116B' instead of the outer leads 116B in Figure 1. Other than that, the configuration of this package 100' is the same as the configuration of the package 100 in Figure 1.

[0080] The tips of the outer leads 116B' are bent outward from the base substrate 121. Here, the tips of the outer leads 116B' may be gull-wing shaped or L-shaped. In this case, the package 100' may constitute a QFP (Quad Flat Package) or an SOP (Small Outline Package).

[0081] In this way, in the first embodiment described above, the chip 111 is supported inside the support portion 121B of the base substrate 121 based on the tension applied to the inner leads 116A of the package 100. This makes it possible to mount the chip 111 on the package 100 while suppressing the stress applied to the chip 111. Here, suppressing the stress applied to the chip 111 makes it possible to suppress warping, cracks, and the like of the chip 111.

[0082] Furthermore, the chip 111 is pressed against the bottom plate portion 121A based on the tension of the inner leads 116A of the package 100. This allows the chip 111 to be in direct contact with the bottom plate portion 121A, eliminating the need for a die bond material between the chip 111 and the bottom plate portion 121A. This reduces the thermal resistance between the chip 111 and the bottom plate portion 121A, improving the heat dissipation of the chip 111.

[0083] Furthermore, Cu can be used as the material for the leads 116. This allows for improved electrical conductivity and thermal conductivity compared to Al or Au used for bonding wires, making it possible to improve the heat dissipation of the chip 111 and also speed up data transmission between the chip 111 and the outside.

[0084] 2. Second Embodiment In the first embodiment described above, the chip 111 is supported inside the support portion 121B of the base substrate 121 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the bottom plate portion 121A. In this second embodiment, the chip 111 is supported inside the support portion 121B of the base substrate 121 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the bottom plate portion 121A via a fluid material.

[0085] FIG. 14 is a cross-sectional view showing an example of the configuration of a package according to the second embodiment.

[0086] In the figure, this package 200 is the same as the package 100 of the first embodiment described above, except that a fluid material 201 is added. The other configuration of the package 200 of the second embodiment is the same as the configuration of the package 100 of the first embodiment described above.

[0087] The thermal conductivity of the fluid material 201 is higher than that of the base substrate 121. The fluid material 201 is located between the bottom plate portion 121A of the base substrate 121 and the chip 111. At this time, the chip 111 is pressed against the bottom plate portion 121A via the fluid material 201 based on the tension applied to the inner leads 116A. The fluid material 201 may be, for example, thermal grease. The thermal grease may be, for example, a silicon-free ester-based oil. At this time, the viscosity of the fluid material 201 can be set so that the fluid material 201 does not flow outside the chip 111. The fluid material 201 may be gelled. The fluid material 201 may be a heat dissipation sheet. The heat dissipation sheet may be configured with oriented carbon fibers.

[0088] 15 is a cross-sectional view showing a method for manufacturing a package according to the second embodiment, in which the manufacturing process for four packages is shown.

[0089] 5 to 8a are carried out. Then, as shown in Fig. 15a, adhesive 158 is applied onto support portion 121B of base substrate 121 using dispenser 157. Furthermore, fluid material 201 is applied onto bottom plate portion 121A of base substrate 121 at the arrangement position of chip 111 using dispenser 202.

[0090] Next, as shown in FIG. 15b, the lead frame RM1 is placed on the substrate mounting jig 151 on which the base substrate 121 coated with the adhesive 158 and the fluid material 201 is placed.

[0091] 15c, positioning pins 154 are inserted into positioning holes 145, and leads 116 between inner leads 116A and outer leads 116B are placed on support portion 121B of base substrate 121. Then, leads 116 located on support portion 121B are bonded to support portion 121B using adhesive 158, and chip 111 is pressed against bottom plate portion 121A using fluid material 201. Thereafter, the steps from FIGS. 9 to 12 are carried out.

[0092] In this way, in the second embodiment described above, the chip 111 is supported inside the support portion 121B of the base substrate 121 based on the tension applied to the inner lead 116A, and the chip 111 is pressed against the bottom plate portion 121A via the fluid material 201. This makes it possible to mount the chip 111 in the package 200 while suppressing the stress applied to the chip 111, and also improves the heat dissipation of the chip 111.

[0093] 3. Third Embodiment In the first embodiment described above, the chip 111 is supported inside the support portion 121B of the base substrate 121 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the bottom plate portion 121A. In this third embodiment, the chip 111 is supported inside the support portion of the base substrate based on the tension applied to the inner leads 116A, and the chip 111 is pressed against a thermally conductive layer embedded in the base substrate.

[0094] FIG. 16 is a cross-sectional view showing an example of the configuration of a package according to the third embodiment.

[0095] In the figure, this package 300 includes a base substrate 321 instead of the base substrate 121 of the first embodiment described above. The other configuration of the package 300 of the third embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0096] The base substrate 321 includes a bottom plate portion 321A instead of the bottom plate portion 121A of the first embodiment. The rest of the configuration of the base substrate 321 of the third embodiment is the same as the configuration of the base substrate 121 of the first embodiment.

[0097] The bottom plate portion 321A is located at the bottom of the base substrate 321. A thermally conductive layer 322 is embedded in the bottom plate portion 321A. The thermal conductivity of the thermally conductive layer 322 is higher than that of the base substrate 321. In this case, the thermally conductive layer 322 may be made of a metal such as Cu or Al. The thermally conductive layer 322 may be provided at the position where the chip 111 is to be disposed. The top and bottom surfaces of the thermally conductive layer 322 may be exposed from the bottom plate portion 321A. In this case, the thermally conductive layer 322 may penetrate the bottom plate portion 321A in the thickness direction. The chip 111 may be disposed on the thermally conductive layer 322. In this case, the chip 111 is pressed against the thermally conductive layer 322 by the tension applied to the inner leads 116A.

[0098] In this way, in the third embodiment described above, the chip 111 is supported inside the support portion 121B of the base substrate 321 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the thermally conductive layer 322 embedded in the bottom plate portion 321A. This makes it possible to mount the chip 111 in the package 300 while suppressing the stress applied to the chip 111, and also improves the heat dissipation of the chip 111.

[0099] Fin-shaped irregularities may be formed on the lower surface of the thermally conductive layer 322. A heat sink may be attached to the lower surface of the thermally conductive layer 322.

[0100] 4. Fourth Embodiment In the above-described third embodiment, the chip 111 is supported inside the support portion 121B of the base substrate 321 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the thermally conductive layer 322 embedded in the bottom plate portion 321A. In this fourth embodiment, the chip 111 is supported inside the support portion 121B of the base substrate 321 based on the tension applied to the inner leads 116A, and the chip 111 is pressed, via the fluid material 201, against the bottom plate portion 321A in which the thermally conductive layer 322 is embedded.

[0101] FIG. 17 is a cross-sectional view showing an example of the configuration of a package according to the fourth embodiment.

[0102] In the figure, this package 400 is the same as the package 300 of the third embodiment described above, except that a fluid material 201 is added. The other configuration of the package 400 of the fourth embodiment is the same as the configuration of the package 300 of the third embodiment described above.

[0103] The fluid material 201 is positioned between the thermally conductive layer 322 and the chip 111. At this time, the chip 111 is pressed against the thermally conductive layer 322 via the fluid material 201 based on the tension applied to the inner leads 116A.

[0104] In this way, in the fourth embodiment described above, the chip 111 is supported inside the support portion 121B of the base substrate 321 based on the tension applied to the inner lead 116A, and the chip 111 is pressed against the thermally conductive layer 322 embedded in the bottom plate portion 321A via the fluid material 201. This makes it possible to mount the chip 111 in the package 400 while suppressing the stress applied to the chip 111, and also improves the heat dissipation of the chip 111.

[0105] 5. Fifth Embodiment In the first embodiment described above, the base substrate 121 is provided with the bottom plate portion 121A on which the chip 111 is disposed and the support portions 121B that support the leads 116. In this fifth embodiment, support portions that support the leads 116 are provided on the bottom plate portion on which the chip 111 is disposed.

[0106] FIG. 18 is a cross-sectional view showing an example of the configuration of a package according to the fifth embodiment.

[0107] In the figure, this package 500 includes a bottom plate portion 521 and a support portion 522 instead of the base substrate 121 of the first embodiment described above. The other configuration of the package 500 of the fifth embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0108] The chip 111 can be placed on the bottom plate portion 521. The bottom plate portion 521 may be formed in a flat plate shape. At this time, the chip 111 is pressed against the bottom plate portion 521 due to the tension applied to the inner leads 116A.

[0109] The support portion 522 is located on the bottom plate portion 521 and supports the leads 116. The support portion 522 can be arranged around the bottom plate portion 521 so as to surround the periphery of the chip 111. The support portion 522 may be formed in a frame shape. In this case, the leads 116 are bonded onto the support portion 522 at a position between the inner leads 116A and the outer leads 116B.

[0110] The base material of the bottom plate portion 521 and the support portion 522 may be, for example, ceramic or resin. The materials of the bottom plate portion 521 and the support portion 522 may be different from each other. The bottom plate portion 521 and the support portion 522 may contain an inorganic or organic filler to improve reliability. The filler material may be glass. The bottom plate portion 521 and the support portion 522 may be blackened to reduce flare on the light receiving region 112. For example, the bottom plate portion 521 and the support portion 522 may contain a black pigment such as carbon black, or a filler such as carbon fiber.

[0111] As described above, in the fifth embodiment, the support portion 522 that supports the leads 116 is provided on the bottom plate portion 521 on which the chip 111 is disposed. This allows the chip 111 to be supported inside the support portion 522 based on the tension applied to the inner leads 116A, while separately optimizing the materials of the bottom plate portion 521 and the support portion 522. This makes it possible to mount the chip 111 in the package 500 while suppressing the stress applied to the chip 111, and also makes it possible to improve the reliability of the package 500 while suppressing an increase in the cost of the package 500.

[0112] 6. Sixth Embodiment In the above-described fifth embodiment, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the bottom plate portion 521. In this sixth embodiment, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the bottom plate portion 521 via the fluid material 201.

[0113] FIG. 19 is a cross-sectional view showing an example of the configuration of a package according to the sixth embodiment.

[0114] In the figure, this package is the same as the package 500 of the fifth embodiment described above, except that a fluid material 201 is added. The other configuration of the package 600 of the sixth embodiment is the same as the configuration of the package 500 of the fifth embodiment described above.

[0115] The fluid material 201 is positioned between the bottom plate portion 521 and the chip 111. At this time, the chip 111 is pressed against the bottom plate portion 521 via the fluid material 201 due to the tension applied to the inner leads 116A.

[0116] In this way, in the sixth embodiment described above, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner lead 116A, and the chip 111 is pressed against the bottom plate portion 521 via the fluid material 201. This makes it possible to mount the chip 111 in the package 600 while suppressing the stress applied to the chip 111, and also makes it possible to improve the heat dissipation of the chip 111 while suppressing an increase in the cost of the package 600.

[0117] 7. Seventh Embodiment In the above-described fifth embodiment, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the bottom plate portion 521. In this seventh embodiment, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the thermal conduction layer 322 embedded in the bottom plate portion.

[0118] FIG. 20 is a cross-sectional view showing an example of the configuration of a package according to the seventh embodiment.

[0119] In the figure, this package 700 has a bottom plate portion 721 instead of the bottom plate portion 521 of the fifth embodiment described above. The other configuration of the package 700 of the seventh embodiment is similar to the configuration of the package 500 of the fifth embodiment described above.

[0120] A thermally conductive layer 322 is embedded in the bottom plate portion 721. The chip 111 can be placed on the thermally conductive layer 322. At this time, the chip 111 is pressed against the thermally conductive layer 322 due to the tension applied to the inner leads 116A.

[0121] In this way, in the seventh embodiment described above, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the thermally conductive layer 322 embedded in the bottom plate portion 721. This makes it possible to mount the chip 111 in the package 700 while suppressing the stress applied to the chip 111, and also makes it possible to improve the heat dissipation performance of the chip 111 while suppressing an increase in the cost of the package 700.

[0122] 8. Eighth Embodiment In the seventh embodiment described above, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the thermally conductive layer 322 embedded in the bottom plate portion 722. In this eighth embodiment, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the thermally conductive layer 322 embedded in the bottom plate portion 721 via the fluid material 201.

[0123] FIG. 21 is a cross-sectional view showing an example of the configuration of a package according to the eighth embodiment.

[0124] In the figure, this package 800 is the same as the package 700 of the seventh embodiment described above, except that a fluid material 201 is added. The other configurations of the package 800 of the eighth embodiment are the same as the configurations of the package 700 of the seventh embodiment described above.

[0125] The fluid material 201 is positioned between the thermally conductive layer 322 and the chip 111. At this time, the chip 111 is pressed against the thermally conductive layer 322 via the fluid material 201 based on the tension applied to the inner leads 116A.

[0126] In this way, in the above-described eighth embodiment, the chip 111 is supported inside the support portion 522 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the thermally conductive layer 322 embedded in the bottom plate portion 721 via the fluid material 201. This makes it possible to mount the chip 111 in the package 800 while suppressing the stress applied to the chip 111, and also makes it possible to improve the heat dissipation performance of the chip 111 while suppressing an increase in the cost of the package 800.

[0127] 9. Ninth Embodiment In the fifth embodiment described above, support portions 522 for supporting leads 116 are provided on bottom plate portion 521 on which chip 111 is arranged, and chip 111 is supported inside support portions 522 based on tension applied to inner leads 116A. In this ninth embodiment, support portions to which a lead frame is joined are formed based on molding, and chip 111 is supported inside support portions based on tension applied to inner leads 116A.

[0128] FIG. 22 is a cross-sectional view showing an example of the configuration of a package according to the ninth embodiment.

[0129] In the figure, this package 900 includes a support portion 922 instead of the support portion 522 of the fifth embodiment described above. The rest of the configuration of the package 900 of the ninth embodiment is similar to the configuration of the package 500 of the fifth embodiment described above.

[0130] The support portion 922 is located on the bottom plate portion 521 and supports the leads 116. The support portion 922 can be arranged around the bottom plate portion 921 so as to surround the periphery of the chip 111. The support portion 922 may be formed in a frame shape. In this case, the leads 116 are bonded onto the support portion 922 at a position between the inner leads 116A and the outer leads 116B. The base material of the support portion 922 can be a mold resin.

[0131] 23 is a plan view showing an example of the configuration of a lead frame according to the ninth embodiment. This figure shows an example of a lead frame in which three subframes are connected. While this figure shows an example of a lead frame in which leads can be drawn out to four side surfaces of the package, a lead frame in which leads can be drawn out to two side surfaces of the package may also be used.

[0132] In the figure, the lead frame RM2 is composed of multiple connected sub-frames SM2. One sub-frame SM2 can be assigned to one package 900. Each sub-frame SM2 includes a unit frame FM2, leads 116, and tie bars 216A and 216B. The unit frame FM2 supports the leads 116 for each sub-frame SM2 in the lead frame RM2. The leads 116 extend inward from the four inner sides of the unit frame FM2. The die pad on which the chip 111 is mounted is removed from the unit frame FM2.

[0133] The tie bars 216A, 216B are connected to the leads 116 with a gap between them. The planar position of the tie bar 216A can correspond to the planar position of the inner surface of the support portion 922, and the position of the tie bar 216B can correspond to the planar position of the outer surface of the support portion 922. In this case, the support portion 922 can be enclosed between the tie bars 216A, 216B between the upper and lower surfaces of the lead frame RM2. Here, only the leads 116 of the subframe SM2 are attached to the package 900, and the unit frame FM2 and the tie bars 216A, 216B are removed from the package 900 by lead cutting.

[0134] 24 is a cross-sectional view showing a method for manufacturing a package according to the ninth embodiment, in which the manufacturing steps for three packages are shown.

[0135] As shown in FIG. 24A, molds 901 and 902 are placed above and below a lead frame RM2 on which a chip 111 is supported via the tips of its inner leads 116A. The mold 901 has spaces 931 and 932 for each subframe SM2. The space 932 can accommodate the chip 111 and inner leads 116A for each subframe SM2. The space 931 can accommodate the support portion 922 for each subframe SM2. The space 931 can be filled with molding resin that forms the support portion 922 from the outside. The spaces 931 and 932 can be separated by a partition 911. The partition 911 can be formed in the mold 901. The tip of the partition 911 can be positioned at the same height as the top surface of the mold 901. The planar position of the partition 911 can correspond to the planar position of the tie bar 216A. The planar position of the outer surface of the space 931 can correspond to the planar position of the tie bar 216B. The mold 902 can be formed in a flat plate shape.

[0136] Next, as shown in FIG. 24B, the molds 901 and 902 are moved up and down to sandwich the lead frame RM2 between them. Here, the upper surface of the mold 901 and the tip of the partition wall 911 can be brought into contact with the lower surface of the lead frame RM2. The lower surface of the mold 902 can be brought into contact with the upper surface of the lead frame RM2. At this time, a gap corresponding to the thickness of the lead frame RM2 is formed between the molds 901 and 902. Furthermore, the chip 111 and inner leads 116A can be housed in the space 932 for each subframe SM2.

[0137] 24c, molding resin is injected into space 931 and cured to form support portion 922 joined to lead frame RM2. By providing tie bars 216A and 216B on lead frame RM2, the molding resin injected into space 931 can be confined between tie bars 216A and 216B in the gap between molds 901 and 902 that corresponds to the thickness of lead frame RM2. This prevents the molding resin injected into space 931 from penetrating into space 932 through the gap between molds 901 and 902. Note that either transfer molding or compression molding may be used for molding.

[0138] Next, as shown in FIG. 24d, the support portion 922 joined to the lead frame RM2 is formed in one go by molding, and then the molds 901 and 902 are removed.

[0139] Next, as shown in FIG. 24e, the bottom plate portion 521 is joined to the lower surface of the support portion 922 so as to contact the bottom surface of the chip 111.

[0140] Next, as shown in Fig. 24f, the transparent substrate 122 is mounted on the support portion 922 via the lead frame RM2 in the same manner as in the steps a and b in Fig. 9. Thereafter, lead cutting and lead processing are carried out in the same manner as in the steps c in Fig. 9 and Fig. 10.

[0141] As described above, in the ninth embodiment, the support portion 922 to which the lead frame RM2 is bonded is formed by molding, and the chip 111 is supported inside the support portion 922 based on tension applied to the inner leads 116A. At this time, the support portions 922 of multiple packages 900 can be bonded to the lead frame RM2 at once. This simplifies the process of bonding the lead frame RM2 to the support portion 922 of the package 900, and allows the chip 111 to be supported inside the support portion 121B of the base substrate 121 based on tension applied to the inner leads 116A of the package 100.

[0142] In the above-mentioned ninth embodiment, an example is shown in which the chip 111 is in contact with the bottom plate portion 921, but in addition to this example, any of the configurations of the above-mentioned sixth to eighth embodiments may also be applied.

[0143] 10. Tenth Embodiment In the first embodiment described above, the inner leads 116A supporting the chip 111 inside the support portion 121B are bent above the chip 111. In this tenth embodiment, the inner leads supporting the chip 111 inside the support portion are bent below the chip 111 to penetrate the support portion and lead the outer leads to the outside of the support portion.

[0144] FIG. 25 is a cross-sectional view showing an example of the configuration of a package according to the tenth embodiment.

[0145] In the figure, this package 1000 includes leads 1016, a bottom plate portion 1021, and a support portion 1022 instead of the leads 116, the bottom plate portion 521, and the support portion 522 of the fifth embodiment described above. The rest of the configuration of the package 1000 of the tenth embodiment is the same as the configuration of the package 500 of the fifth embodiment described above.

[0146] The chip 111 can be placed on the bottom plate portion 1021. The bottom plate portion 1021 may be formed in a flat plate shape. At this time, the chip 111 is pressed against the bottom plate portion 1021 due to the tension applied to the inner leads 1016A.

[0147] The support portion 1022 is located on the bottom plate portion 1021 and supports the leads 1016. The support portion 1022 can be arranged around the bottom plate portion 1021 so as to surround the periphery of the chip 111. The support portion 1022 may be formed in a frame shape. In this case, the leads 1016 penetrate the support portion 1022 at a position between the inner lead 1016A and the outer lead 1016B. The base material of the bottom plate portion 1021 and the support portion 1022 may be, for example, ceramic or resin. The materials of the bottom plate portion 1021 and the support portion 1022 may be different from each other. The material of the support portion 1022 may be a molding material.

[0148] The lead 1016 includes an inner lead 1016A and an outer lead 1016B. The inner lead 1016A and the outer lead 1016B are connected to each other. The inner lead 1016A is located inside the support portion 1022. The outer lead 1016B is located outside the support portion 1022.

[0149] The tip of the inner lead 1016A is bonded to the surface of the chip 111. The inner lead 1016A can be extended horizontally from the surface of the chip 111, and then bent below the chip 111 to connect to the outer lead 1016B. At this time, the lead 1016 can support the chip 111 inside the support portion 1022 based on the tension applied to the inner lead 1016A. Furthermore, the lead 1016 can press the chip 111 against the bottom plate portion 1021 based on the tension of the inner lead 1016A. At this time, the chip 111 can be lifted by the lead 1016 while in contact with the bottom plate portion 1021.

[0150] Here, the leads 1016 can penetrate the support portion 1022. The inner leads 1016A are pulled out horizontally at the position of the inner peripheral surface of the support portion 1022 and can press down on the chip 111. Here, by using a molding material as the material for the support portion 1022, the leads 1016 can penetrate the support portion 1022 based on molding. Therefore, it is not necessary to drill holes in the support portion 1022 or insert the leads 1016 in order to penetrate the support portion 1022 into the leads 1016, and it is possible to suppress an increase in the number of steps in the manufacturing process.

[0151] The outer lead 1016B can be pulled downward at the outer peripheral surface of the support portion 1022 and bent horizontally at the lower surface of the support portion 1022. Here, the outer lead 1016B can be bent inward in a J-shape at the lower surface of the support portion 1022 to form a QFJ or SOJ.

[0152] FIG. 26 is a cross-sectional view showing another example of the structure of the package according to the tenth embodiment.

[0153] In the figure, this package 1001 has leads 1016' and inner leads 1016A' instead of the leads 1016 and inner leads 1016A in Fig. 25. Other configurations of the package 1001 in Fig. 26 are similar to those of the package 1000 in Fig. 25.

[0154] The lead 1016' includes an inner lead 1016A' and an outer lead 1016B. The inner lead 1016A' and the outer lead 1016B are connected to each other. The inner lead 1016A' is located inside the support portion 1022.

[0155] The tip of the inner lead 1016A' is bonded to the surface of the chip 111. The inner lead 1016A' can extend horizontally from the surface of the chip 111 and connect to the outer lead 1016B. At this time, the lead 1016' can support the chip 111 inside the support portion 1022 based on the tension applied to the inner lead 1016A'. Furthermore, the lead 1016' can press the chip 111 against the bottom plate portion 1021 based on the tension of the inner lead 1016A'. At this time, the chip 111 can be lifted by the lead 1016' while in contact with the bottom plate portion 1021.

[0156] Here, the lead 1016' can penetrate the support portion 1022 in the horizontal direction. The inner lead 1016A' can be pulled out horizontally at the position of the inner peripheral surface of the support portion 1022 and press down the chip 111.

[0157] Here, by making the lead 1016' penetrate the support portion 1022 in the horizontal direction, the inner lead 1016A' can be pulled out in the horizontal direction. This makes it possible to apply tension to the inner lead 1016A' without having to depress the inner lead 1016A'.

[0158] Furthermore, by having the leads 1016' penetrate the support portion 1022, it is no longer necessary to arrange the leads 1016' on the support portion 1022, and it is possible to prevent gaps between the leads 1016' from being formed between the support portion 1022 and the transparent substrate 122. As a result, it is possible to flatten the bonding surface between the support portion 1022 and the transparent substrate 122, and it is possible to prevent a decrease in sealing performance.

[0159] FIG. 27 is a cross-sectional view showing still another example of the structure of the package according to the tenth embodiment.

[0160] 27, this package 1002 has leads 1016" and inner leads 1016A" instead of the leads 1016 and inner leads 1016A of FIG. 25. The rest of the configuration of the package 1002 of FIG. 27 is the same as that of the package 1000 of FIG.

[0161] The lead 1016 ″ includes an inner lead 1016 A ″ and an outer lead 1016 B. The inner lead 1016 A ″ and the outer lead 1016 B are connected to each other. The inner lead 1016 A ″ is located inside the support portion 1022 .

[0162] The tip of the inner lead 1016A" is bonded to the surface of the chip 111. The inner lead 1016A" can be extended horizontally from the surface of the chip 111 and then bent upward to connect to the outer lead 1016B. At this time, the lead 1016" can support the chip 111 inside the support portion 1022 based on the tension applied to the inner lead 1016A". Furthermore, the lead 1016" can press the chip 111 against the bottom plate portion 1021 based on the tension of the inner lead 1016A". At this time, the chip 111 can be lifted by the lead 1016" while in contact with the bottom plate portion 1021.

[0163] Here, the lead 1016" can penetrate the support portion 1022 horizontally. The inner lead 1016A" is pulled out horizontally at the inner surface of the support portion 1022 and bent downward to press down the chip 111.

[0164] FIG. 28 is a perspective view showing an example of the appearance of a package according to the tenth embodiment.

[0165] In the figure, the package 1001 is configured as a QFJ by bending outer leads 1016B inward in a J-shape on the four side surfaces of the outer periphery of the support part 1022. At this time, inner leads 1016A' are pulled out horizontally from the four side surfaces of the inner periphery of the support part 1022, and the tips of the inner leads 1016A' are joined to the surface of the chip 111.

[0166] 29 and 30 are diagrams showing a method for manufacturing a package according to the tenth embodiment. While the figures show an example of a method for manufacturing package 1001 in FIG. 26, the same method is also used for manufacturing package 1000 in FIG. 25 and package 1002 in FIG. 27. Also, a1 in FIG. 29 is a plan view of lead frame RM10 on which supporting portions 1022 are formed, a2 in FIG. 29 is a side view of lead frame RM10 on which supporting portions 1022 are formed, and a3 in FIG. 29 is a cross-sectional view of lead frame RM10 on which supporting portions 1022 are formed.

[0167] As shown by a1 to a3 in FIG. 29 , positioning holes 145 can be formed in the lead frame RM10 to correspond to the positions of the positioning pins 134. The positioning holes 145 can be formed, for example, by punching. The inner diameter of the positioning holes 145 can correspond to the outer diameter of the positioning pins 134. Furthermore, a frame-shaped support portion 1022 can be formed in the lead frame RM10 by molding. The molding may be transfer molding, injection molding, or compression molding. At this time, the leads 1016′ can penetrate the support portion 1022 horizontally and protrude from the inner circumferential surface of the support portion 1022. After the steps of FIGS. 5 and 6 , the lead frame RM10 is placed on a chip mounting jig 131, as shown by b in FIG. 29 .

[0168] Next, as shown in FIG. 29C, the positioning pin 134 is inserted into the positioning hole 145, and the tip of the inner lead 1016A' is brought into contact with the solder ball 117.

[0169] 29d and 29e, the tip of the inner lead 1016A' is irradiated with laser light LZ to join the tip of the inner lead 1016A' to the pad electrode 113 via the solder ball 117. Note that the tip of the inner lead 1016A' may also be joined to the pad electrode 113 based on solder reflow of the solder ball 117.

[0170] Next, in FIG. 30A, the bottom plate portion 1021 is carried onto the substrate mounting jig 151 and stored in the storage portion 152 while being sucked through the suction holes 153 .

[0171] Next, as shown in FIG. 30B, adhesive 158 is applied to the periphery of bottom plate portion 1021 using dispenser 157, and die bond material 1058 is applied to the center of bottom plate portion 1021 using dispenser 1057.

[0172] Next, as shown in FIG. 30c, the lead frame RM10 is placed on the substrate mounting jig 151 on which the bottom plate portion 1021 to which the adhesive 158 and the die bonding material 1058 are applied is placed.

[0173] Next, as shown in FIG. 30 d, the positioning pins 154 of the lead frame RM10 are inserted into the positioning holes 145, and the support portions 1022 supporting the leads 1016′ bonded to the chip 111 are placed on the bottom plate portion 1021. Then, the support portions 1022 are bonded to the bottom plate portion 1021 via adhesive 158, and the chip 111 is bonded to the bottom plate portion 1021 via die bonding material 1058. Note that in the step shown in FIG. 30 d, the support portions 1022 are bonded to the bottom plate portion 1021 without solidifying the lead frame RM10 on a package 1002 basis. However, the lead frame RM10 may be solidified on a package 1002 basis and then the support portions 1022 may be bonded to the bottom plate portion 1021. This allows the support portions 1022 to be positioned on the bottom plate portion 1021 on a package 1002 basis, thereby improving the alignment accuracy between the support portions 1022 and the bottom plate portion 1021.

[0174] Next, as shown in FIG. 31A, adhesive 160 is applied onto the support portion 1022 using a dispenser 159.

[0175] 31 b, the transparent substrate mounting part 161 and the camera 162 are transported onto the substrate mounting jig 151 on which the bottom plate part 1021 to which the lead frame RM10 is adhered is placed. The transparent substrate mounting part 161 and the camera 162 can be transported along the transport direction HR.

[0176] Then, the bottom plate portion 1021 is observed via the camera 162, and the transparent substrate mounting portion 161 is moved onto the bottom plate portion 1021 on which the transparent substrate 122 is to be placed. Then, the transparent substrate 122 is transported via the transparent substrate mounting portion 161 onto the bottom plate portion 1021 on which the transparent substrate 122 is to be placed, and the transparent substrate 122 is mounted on the bottom plate portion 1021.

[0177] Next, as shown in c in FIG. 31, a frame processing section 163 is placed above the lead frame RM10 to which the bottom plate section 1021 has been attached, and a frame processing section 165 is placed below it, and the same processing as in FIG. 10 is carried out.

[0178] FIG. 32 is a cross-sectional view showing still another example of the structure of the package according to the tenth embodiment.

[0179] 32, this package 1004 has a bottom plate portion 1024 instead of the bottom plate portion 1021 of the package 1001 in Fig. 26. Furthermore, this package 1004 has a thermally conductive layer 1014 in addition to the package 1001 in Fig. 26. Other than that, the configuration of the package 1004 in Fig. 32 is the same as the configuration of the package 1001 in Fig. 26.

[0180] A thermally conductive layer 1014 is embedded in the bottom plate portion 1024. The chip 111 can be placed on the thermally conductive layer 1014. At this time, the chip 111 is pressed against the thermally conductive layer 1014 due to the tension applied to the inner leads 1016A'.

[0181] FIG. 33 is a cross-sectional view showing still another configuration example of the package according to the tenth embodiment.

[0182] 33, this package 1005 has a support portion 1025 instead of the support portion 1022 of the package 1001 in FIG. 26. Other configurations of the package 1005 in FIG. 33 are similar to those of the package 1001 in FIG.

[0183] The support portion 1025 is provided with a fastening portion 1035. The fastening portion 1035 extends horizontally from the support portion 1025. In this case, the fastening portion 1035 may be integrally molded with the support portion 1025. The fastening portion 1035 may be provided at a plurality of locations on the end portion of the support portion 1025. Here, the fastening portion 1035 may be provided on opposing sides of the support portion 1025. In this case, the upper and lower surfaces from the support portion 1025 to the fastening portion 1035 may be flat. The fastening portion 1035 is provided with an opening 1026. The opening 1026 may be a screw hole. A bolt or a screw can be passed through the opening 1026.

[0184] FIG. 34 is a cross-sectional view showing still another configuration example of the package according to the tenth embodiment.

[0185] 34, package 1006 is obtained by adding a fastening plate 1016 to package 1001 in FIG. 26. The rest of the configuration of package 1006 in FIG. 34 is similar to the configuration of package 1001 in FIG.

[0186] The fastening plate 1016 is disposed between the transparent substrate 122 and the support portion 1022. At this time, the fastening plate 1016 has an opening above the light receiving region 112. The fastening plate 1016 extends horizontally from the upper surface of the support portion 1025. Openings 1026 are provided in the fastening plate 1016. The openings 1026 can be provided at multiple locations on the end of the fastening plate 1016 outside the support portion 1022. The openings 1026 may be screw holes. Bolts or screws can be passed through the openings 1026.

[0187] As described above, in the tenth embodiment, the inner leads 1016A supporting the chip 111 inside the support portion 1022 penetrate the support portion 1022 and the outer leads 1016B are drawn out to the outside of the support portion 1022. This eliminates the need to arrange the leads 116 on the support portion 1022, and makes it possible to mount the chip 111 in the package 1000 while suppressing an increase in the length of the inner leads 1016A supporting the chip 111. This makes it possible to suppress stress on the chip 111 while increasing the speed of data transmission between the chip 111 and the outside.

[0188] In the above-mentioned tenth embodiment, an example is shown in which the chip 111 is in contact with the bottom plate portion 1021, but in addition to this example, any of the configurations of the above-mentioned sixth to eighth embodiments may also be applied.

[0189] 11. Eleventh Embodiment In the first embodiment described above, the inner leads 116A that support the chip 111 inside the support portions 121B are bent above the chip 111. In this eleventh embodiment, a frame 1101 having fastening portions 1102 that extend horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner leads 116A.

[0190] 35 is a diagram showing a configuration example of a package according to the eleventh embodiment. Note that "a" in the figure is a cross-sectional view showing the configuration example of the package 1100, and "b" in the figure is a plan view showing the configuration example of the package 1100. "a" in the figure shows the configuration example cut along line A1-A2 in "b" in the figure.

[0191] In the figure, this package 1100 is obtained by adding a frame 1101 to the package 100 of the first embodiment described above. The other configuration of the package 1100 of the eleventh embodiment is the same as the configuration of the package 100 of the first embodiment described above.

[0192] The frame 1101 supports the transparent substrate 122 on the chip 111 without blocking light incident on the chip 111. In this case, the frame 1101 can be located between the transparent substrate 122 and the inner leads 116A. The frame 1101 is provided with fastening portions 1102. The fastening portions 1102 extend horizontally from the frame 1101. In this case, the fastening portions 1102 may be integrally molded with the frame 1101. The fastening portions 1102 may be provided at multiple locations on the end of the frame 1101. In this case, the fastening portions 1102 may be provided on opposing sides of the frame 1101. Here, the fastening portions 1102 may be provided on opposing long sides of the frame 1101 or on opposing short sides of the frame 1101. For example, the fastening portions 1102 may be attached to both ends of one short side of the frame 1101 and the center of the other short side. The thickness of the fastening portion 1102 may be equal to the thickness of the frame 1101. In this case, the upper and lower surfaces from the frame 1101 to the fastening portion 1102 can be flattened. An opening 1103 is provided in the fastening portion 1102. The opening 1103 may be a screw hole. A bolt or a screw can be passed through the opening 1103.

[0193] The fastening portion 1102 can have the same optical accuracy as the chip 111. The optical accuracy includes the eccentricity accuracy and angular accuracy of the incident light. Here, the position of the chip 111 can be defined by defining the position of the fastening portion 1102. In this case, the distance from the end of the chip 111 to the opening 1103 may be standardized.

[0194] The inner edge of the frame 1101 is disposed along the outer shape of the chip 111. For example, in the cross section of the package 1100, the position of the inner edge of the frame 1101 may coincide with the position of the edge of the chip 111. Alternatively, the position of the inner edge of the frame 1101 may coincide with the position of the edge of the light receiving region 112.

[0195] The material of the frame 1101 may be resin, metal such as aluminum or stainless steel, or inorganic material such as ceramic. The resin is preferably black in order to provide light blocking properties.

[0196] 36 to 38 are cross-sectional views showing a method for manufacturing a package according to the eleventh embodiment.

[0197] 36A, a fastening portion 1102 is coupled to a frame 1101. Then, adhesive 1110 is applied by a dispenser 1111 to a position on the underside of the frame 1101 where the frame 1101 is to be joined to the support portion 121B.

[0198] Next, as shown in FIG. 36 b, the frame 1101 is supported via a mounter 1112, and the base substrate 121 on which the chip 111 is mounted is supported via a mounter 1113. At this time, the frame 1101 can be aligned via the mounter 1112. The mounter 1112 can have a six-axis correction function. Here, the mounter 1112 can position the frame 1101 so that the fastening portion 1102 is at a specified position relative to the position of the chip 111.

[0199] Next, as shown in FIG. 37A, the adhesive 1110 is hardened by a curing process, and the frame 1101 is fixed to the base substrate 121.

[0200] Next, as shown in FIG. 37B, the frame 1101 is removed from the mounter 1112 and the base substrate 121 is removed from the mounter 1113.

[0201] Next, as shown in FIG. 38A, adhesive 1130 is applied by a dispenser 1131 to the position on the upper surface of the frame 1101 where the transparent substrate 122 is to be joined.

[0202] Next, as shown in FIG. 38B, the transparent substrate 122 is positioned on the upper surface of the frame 1101.

[0203] Next, as shown in FIG. 35A, the transparent substrate 122 is placed on the upper surface of the frame 1101, and then the adhesive 1130 is hardened by a curing process, thereby fixing the transparent substrate 122 to the frame 1101.

[0204] FIG. 39 is a plan view showing another configuration example of the package according to the eleventh embodiment.

[0205] In the figure, a fastening portion 1102A is coupled to a frame 1101. In this case, the fastening portion 1102A may be coupled to the short side of each of the four corners of the frame 1101.

[0206] In FIG. 11B, fastening portions 1102B are coupled to the frame 1101. In this case, the fastening portions 1102B may be coupled to the four corners of the frame 1101 on the long side.

[0207] FIG. 40 is a plan view showing still another configuration example of the package according to the eleventh embodiment.

[0208] In the figure, fastening portions 1102C are coupled to a frame 1101. In this case, the fastening portions 1102C may be coupled to both ends of one long side of the frame 1101 and the center of the other long side.

[0209] FIG. 41 is a plan view showing still another configuration example of the package according to the eleventh embodiment.

[0210] In the figure, a fastening portion 1102D is coupled to a frame 1101. In this case, the fastening portion 1102D may be coupled to a diagonally opposite short side of the frame 1101.

[0211] In FIG. 11B, a fastening portion 1102E is coupled to the frame 1101. In this case, the fastening portion 1102E may be coupled to the diagonally opposite long side of the frame 1101.

[0212] FIG. 42 is a cross-sectional view showing an example of mounting of a package according to the eleventh embodiment.

[0213] In the same figure, a lens 1124 is fitted into a lens barrel 1121. A fastening portion 1122 is provided in the lens barrel 1121. The fastening portion 1122 extends horizontally from the lens barrel 1121. In this case, the fastening portion 1122 may be integrally molded with the lens barrel 1121. The fastening portion 1122 may be provided at multiple locations on the end of the lens barrel 1121. In this case, the fastening portion 1122 may be provided to correspond to the position of the fastening portion 1102. An opening 1123 is provided in the fastening portion 1122. In this case, the opening 1123 may be provided to correspond to the position of the opening 1103. The opening 1123 may be a screw hole. A bolt or screw can be passed through the opening 1123.

[0214] When mounting a lens 1124 on the chip 111, the lens barrel 1121 is placed on the frame 1101. At this time, the fastening portion 1122 is placed on the fastening portion 1102 so that the positions of the openings 1103 and 1123 are aligned. Then, bolts 1125 are inserted into the openings 1103 and 1123, and the fastening portions 1102 and 1122 are fastened together via the bolts 1125, thereby fixing the lens barrel 1121 on the frame 1101.

[0215] The fastening portion 1122 can have the same optical accuracy as the chip 111. Here, by defining the position of the fastening portion 1122, the position of the lens 1124 relative to the chip 111 can be defined. In this case, the distance from the center of the lens 1124 to the opening 1123 may be standardized.

[0216] Here, by fastening the fastening portions 1102 and 1122 together via the bolts 1125, the lens 1124 can be positioned in a self-aligned manner relative to the chip 111. This eliminates the need to align the lens 1124 while observing the chip 111.

[0217] As described above, in the eleventh embodiment, the frame 1101 having the fastening portion 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner lead 116A. This makes it possible to secure the package 1100 on which the chip 111 is mounted to the lens barrel 1121 while ensuring the optical accuracy of the chip 111 relative to the lens 1124. This reduces the load on the package 1100 when aligning the package 1100 to the lens barrel 1121.

[0218] 12. Twelfth Embodiment In the above-described eleventh embodiment, the frame 1101 having the fastening portion 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner lead 116A. In this twelfth embodiment, the frame having the fastening portion 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner lead 116A, and the frame is made of a magnetic shielding material.

[0219] 43 is a diagram showing a configuration example of a package according to the twelfth embodiment. Note that in the figure, "a" is a cross-sectional view showing the configuration example of the package 1200, and "b" in the figure is a plan view showing the configuration example of the package 1200. "a" in the figure shows the configuration example cut along line A1-A2 in "b" in the figure.

[0220] In the figure, this package 1200 includes a frame 1201 instead of the frame 1101 of the above-described eleventh embodiment. The other configuration of the package 1200 of the twelfth embodiment is similar to the configuration of the package 1100 of the above-described eleventh embodiment.

[0221] The frame 1201 is positioned between the transparent substrate 122 and the inner leads 116A. The frame 1201 is provided with a fastening portion 1202. The fastening portion 1202 extends horizontally from the frame 1201. In this case, the fastening portion 1202 may be integrally molded with the frame 1201. The fastening portion 1202 is provided with an opening 1203. A bolt or a screw can be passed through the opening 1203. The fastening portion 1202 can have the same optical precision as the chip 111. The inner end of the frame 1201 is arranged along the outer shape of the chip 111.

[0222] The frame 1201 can be made of a magnetic shielding material. In this case, a conductor such as a metal can be used as the material of the frame 1201. The surface of the frame 1201 may be coated with an insulator 1204 such as a resin. In this case, the insulator 1204 can be removed from the inner surface of the opening 1203. Here, by using a conductor such as a metal as the material of the frame 1201, the heat dissipation properties of the package 1200 can be improved.

[0223] FIG. 44 is a diagram showing an example of a method for mounting a package according to the twelfth embodiment.

[0224] In the figure, when the lens barrel 1121 is mounted on the frame 1201, a bolt 1205 is inserted into an opening 1203. At this time, the bolt 1205 can come into contact with the conductor of the frame 1201. By connecting the bolt 1205 to the ground potential, the frame 1201 can be set to the ground potential, and a magnetic shielding effect can be imparted to the frame 1201.

[0225] As described above, in the twelfth embodiment, the frame 1201 having the fastening portions 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner leads 116A, and the frame 1201 is made of a magnetic shielding material. As a result, a magnetic shielding effect can be obtained by mounting the package 1200 via the fastening portions 1202 extending horizontally from the frame 1201. This eliminates the need to place a magnetic shield outside the package 1200 to obtain the magnetic shielding effect, and it is possible to prevent the package 1200 from becoming larger while suppressing an increase in the number of steps in the assembly process.

[0226] 13. Thirteenth Embodiment In the above-described eleventh embodiment, a frame 1101 having fastening portions 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner leads 116A. In this thirteenth embodiment, a frame having fastening portions 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner leads 116A, and the cross-sectional shape of the inner wall of the frame is tapered.

[0227] 45 is a cross-sectional view showing a configuration example of a package according to the 13th embodiment, where "a" in the figure is a cross-sectional view showing a first configuration example of the package according to the 13th embodiment, and "b" in the figure is a cross-sectional view showing a second configuration example of the package according to the 13th embodiment.

[0228] In the figure, a package 1300 includes a frame 1301 instead of the frame 1101 of the eleventh embodiment. The other configuration of the package 1300 of the thirteenth embodiment is the same as the configuration of the package 1100 of the eleventh embodiment.

[0229] The frame 1301 has a tapered inner wall cross section. In this case, the tapered shape may have an acute angle on the upper surface side of the frame 1301 and an obtuse angle on the lower surface side of the frame 1301. The other configurations of the frame 1301 are the same as those of the frame 1101 of the eleventh embodiment described above.

[0230] In the figure, a package 1310 includes a frame 1311 instead of the frame 1101 of the eleventh embodiment. The other configuration of the package 1310 of the thirteenth embodiment is the same as the configuration of the package 1100 of the eleventh embodiment.

[0231] The frame 1311 has a tapered inner wall cross section. In this case, the tapered shape may have an obtuse angle on the upper surface side of the frame 1311 and an acute angle on the lower surface side of the frame 1311. The other configurations of the frame 1311 are the same as those of the frame 1101 of the eleventh embodiment described above.

[0232] As described above, in the thirteenth embodiment, frames 1301 and 1311 having fastening portions 1102 extending horizontally relative to base substrate 121 are provided between transparent substrate 122 and inner leads 116A, and the cross-sectional shape of the inner wall of each frame 1301 and 1311 is tapered. This makes it possible to reduce flare on chip 111 while suppressing an increase in the number of steps in the assembly process of each package 1300 and 1310.

[0233] 14. Fourteenth Embodiment In the eleventh embodiment described above, a frame 1101 having fastening portions 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner leads 116A. In this fourteenth embodiment, a frame having fastening portions 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner leads 116A, and a textured surface is provided on the inner wall surface of the frame.

[0234] 46 is a cross-sectional view showing a configuration example of a package according to the fourteenth embodiment, where a is a cross-sectional view showing the configuration example of a package 1400 according to the fourteenth embodiment, and b is a plan view showing the configuration example of an inner wall surface of a frame 1401 according to the fourteenth embodiment.

[0235] In the figure, this package 1400 includes a frame 1401 instead of the frame 1301 of the thirteenth embodiment described above. The other configuration of the package 1400 of the fourteenth embodiment is the same as the configuration of the package 1300 of the thirteenth embodiment described above.

[0236] The frame 1401 has a textured surface 1402 on its inner wall surface. The textured surface 1402 may be formed by texture processing the inner wall surface of the frame 1401. Alternatively, a textured surface may be formed on the mold surface when the frame 1401 is molded, and the textured surface of the mold surface may be transferred to the inner wall surface of the frame 1401. In this case, the textured surface 1402 may be formed on the entire inner wall surface of the frame 1401, or may be formed on only a part of the inner wall surface of the frame 1401. The rest of the configuration of the frame 1401 is the same as the configuration of the frame 1301 of the thirteenth embodiment described above.

[0237] As described above, in the fourteenth embodiment, the frame 1401 having the fastening portion 1102 extending horizontally relative to the base substrate 121 is provided between the transparent substrate 122 and the inner lead 116A, and the inner wall surface of the frame 1401 is provided with a textured surface 1402. This makes it possible to reduce flare on the chip 111 while suppressing an increase in the number of steps in the assembly process of the package 1400.

[0238] In the above-described fourteenth embodiment, an example has been shown in which the inner wall of the frame 1301 of the above-described thirteenth embodiment is provided with the textured surface 1402. In addition to this, the inner wall of the frame 1101 of the above-described eleventh embodiment may be provided with a textured surface, the inner wall of the frame 1201 of the above-described twelfth embodiment may be provided with a textured surface, or the inner wall of the frame 1311 of the above-described thirteenth embodiment may be provided with a textured surface.

[0239] 15. Fifteenth Embodiment In the above-described eleventh embodiment, frame 1101 having fastening portions 1102 extending horizontally relative to base substrate 121 is provided between transparent substrate 122 and inner lead 116A. In this fifteenth embodiment, a frame having fastening portions 1102 extending horizontally relative to base substrate 121 is provided between transparent substrate 122 and inner lead 116A, and a recess is provided on the inner wall surface of the frame.

[0240] FIG. 47 is a cross-sectional view showing a configuration example of a package according to the fifteenth embodiment.

[0241] In the figure, this package 1500 includes a frame 1501 instead of the frame 1301 of the thirteenth embodiment. The other configuration of the package 1500 of the fifteenth embodiment is the same as the configuration of the package 1300 of the thirteenth embodiment.

[0242] The frame 1501 has a recess 1503 on its inner wall surface. The recess 1503 can store a resin such as an adhesive. The recess 1503 can be arranged on the upper surface side of the frame 1501. The recess 1503 may also be arranged around an opening on the upper surface side of the frame 1501. The rest of the configuration of the frame 1501 is the same as the configuration of the frame 1301 of the thirteenth embodiment described above.

[0243] As described above, in the fifteenth embodiment, frame 1501 having fastening portion 1102 extending horizontally relative to base substrate 121 is provided between transparent substrate 122 and inner lead 116A, and recess 1503 is provided on the inner wall surface of frame 1501. This allows a resin reservoir to be formed on the inner wall surface of frame 1501, making it possible to prevent resin from dripping inside frame 1501.

[0244] In the above-described fifteenth embodiment, an example has been shown in which the recess 1503 is provided on the inner wall of the frame 1301 of the above-described thirteenth embodiment. In addition to this, a recess may be provided on the inner wall of the frame 1101 of the above-described eleventh embodiment, a recess may be provided on the inner wall of the frame 1201 of the above-described twelfth embodiment, or a recess may be provided on the inner wall of the frame 1311 of the above-described thirteenth embodiment.

[0245] 16. Sixteenth Embodiment In the eleventh embodiment described above, frame 1101 having fastening portions 1102 extending horizontally relative to base substrate 121 is provided between transparent substrate 122 and inner lead 116A. In this sixteenth embodiment, a frame having fastening portions 1102 extending horizontally relative to base substrate 121 is provided between transparent substrate 122 and inner lead 116A, and a transparent substrate is attached to the lower surface of the frame.

[0246] 48 is a diagram showing a configuration example of a package according to the sixteenth embodiment. Note that "a" in the figure is a cross-sectional view showing the configuration example of a package 1600, and "b" in the figure is a plan view showing the configuration example of the package 1600. "a" in the figure shows the configuration example cut along line A1-A2 in "b" in the figure.

[0247] In the figure, this package 1600 includes a transparent substrate 1601 instead of the transparent substrate 122 of the eleventh embodiment described above. The other configuration of the package 1600 of the sixteenth embodiment is similar to the configuration of the package 1100 of the eleventh embodiment described above.

[0248] The transparent substrate 1601 is attached to the lower surface of the frame 1101. At this time, the transparent substrate 1601 can be disposed inside the inner leads 116A. Other configurations of the transparent substrate 1601 of the sixteenth embodiment are similar to the configuration of the transparent substrate 122 of the above-described eleventh embodiment.

[0249] As described above, in the sixteenth embodiment, frame 1101 having fastening portions 1102 extending horizontally relative to base substrate 121 is provided between transparent substrate 122 and inner leads 116A, and transparent substrate 1601 is attached to the lower surface of frame 110. This makes it possible to prevent steps due to transparent substrate 1601 from being formed on frame 1101, ensure the flatness of the upper surface of frame 1101, and reduce the height of package 1600.

[0250] In the above-described sixteenth embodiment, an example has been shown in which the transparent substrate 1601 is attached to the lower surface of the frame 1101 of the above-described eleventh embodiment. In addition to this, a transparent substrate may be attached to the lower surfaces of the frames 1201, 1301, 1311, 1411, and 1511 of the above-described twelfth to fifteenth embodiments.

[0251] 17. Seventeenth Embodiment In the first embodiment described above, the chip 111 is supported inside the support portion 121B of the base substrate 121 based on the tension applied to the inner leads 116A, and the chip 111 is pressed against the bottom plate portion 121A. In this seventeenth embodiment, the chip 111 is supported inside the support portion 121B of the base substrate 121 based on the tension applied to the inner leads 116A, and a flexible printed circuit board supported by the support portion 121B is provided along the inner leads 116A.

[0252] FIG. 49 is a cross-sectional view showing a configuration example of a package according to the seventeenth embodiment.

[0253] In the figure, this package 1700 is obtained by adding a flexible printed circuit board 1710 to the package 100 of the first embodiment described above. At this time, the inner lead 116A and the outer lead 116B connected to the inner lead 116A are removed at the position of the flexible printed circuit board 1710. Other configurations of the package 1700 of the seventeenth embodiment are the same as those of the package 100 of the first embodiment described above.

[0254] The flexible printed circuit board 1710 is drawn inward and outward from between the support portion 121B and the transparent substrate 122. The tip of the flexible printed circuit board 1710 is bonded to the surface of the chip 111. At this time, the tip of the flexible printed circuit board 1710 may be bonded to the pad electrode 113 via a solder ball. The flexible printed circuit board 1710 may be drawn outward horizontally from between the support portion 121B and the transparent substrate 122. A transmission path is formed in the flexible printed circuit board 1710 to transmit data to the chip 111. The data transmission speed of this transmission path can be faster than the data transmission speed of the leads 116.

[0255] 50 is a plan view showing a configuration example of a lead frame applied to a package according to the seventeenth embodiment. Note that this figure shows a configuration example of one sub-frame SM3 of the lead frame.

[0256] In the diagram, one package 1700 can be assigned to the sub-frame SM3. The sub-frame SM3 includes a unit frame FM1 and leads 116. The leads 116 include inner leads 116A and outer leads 116B. The leads 116 are arranged in parallel along the inner edges of the unit frame FM1 at a distance DS1. The distance DS1 may become narrower from the base of the lead 116 to the tip. Furthermore, a distance DS2 larger than the distance DS1 is set between the leads 116 arranged in parallel along the inner edges of the unit frame FM1. This distance DS2 may be set on one of the four inner edges of the unit frame FM1, or on two or more inner edges.

[0257] As shown in FIG. 1B, a flexible printed circuit board 1710 is disposed in the space DS2 between the leads 116. A transmission path 1710A is formed on the flexible printed circuit board 1710. In this case, the flexible printed circuit board 1710 can be drawn outward across the unit frame FM1. The flexible printed circuit board 1710 can also be supported by the leads 116 adjacent to both sides of the flexible printed circuit board 1710. The position of the tip of the flexible printed circuit board 1710 can be aligned with the position of the tip of the inner lead 116A. The spacing between the transmission paths 1710A formed on the flexible printed circuit board 1710 can be made equal to the spacing DS1 between the leads 116. In this case, the position of the tip of the transmission path 1710A formed on the flexible printed circuit board 1710 can correspond to the position of the pad electrode 113 on the chip 111.

[0258] FIG. 51 is a perspective view showing an example of the appearance of a package according to the seventeenth embodiment.

[0259] In the figure, the package 1700 is configured as a QFJ by bending the outer leads 116B inward in a J-shape on the four side surfaces of the outer periphery of the support part 122. At this time, the inner leads 116A are drawn inward from the four side surfaces of the inner periphery of the support part 122, and the tips of the inner leads 116A are bonded to the surface of the chip 111.

[0260] Furthermore, flexible printed circuit board 1710 is drawn inward from one side surface of the inner periphery of support section 122 and bonded to the surface of chip 111. Furthermore, flexible printed circuit board 1710 is drawn horizontally outward from one side surface of the outer periphery of support section 122. Other than that, the configuration of package 1700 in Fig. 51 is the same as the configuration of the package in Fig. 4b.

[0261] FIG. 52 is a cross-sectional view showing an example of the configuration of a flexible printed circuit board applied to a package according to the seventeenth embodiment.

[0262] In the figure, a signal line L1 and ground lines L2 and L3 are formed on an insulating layer LZ, forming a coplanar line. The signal line L1 is disposed between the ground lines L2 and L3. This configuration can be applied to a single-sided flexible printed circuit board.

[0263] In the figure, at b, a signal line L1 is formed on the insulating layer LZ, and a ground line L0 is formed on the back surface of the insulating layer LZ, forming a microstrip line. The ground line L0 may be formed over the entire back surface of the insulating layer LZ. This configuration can be applied to double-sided flexible printed circuit boards and multilayer flexible printed circuit boards.

[0264] In the figure, a signal line L1 and ground lines L2 and L3 are formed on an insulating layer LZ, and a ground line L0 is formed on the back surface of the insulating layer LZ, forming a microstrip line. This configuration can be applied to double-sided flexible printed circuit boards and multilayer flexible printed circuit boards. This configuration can improve the electrical coupling between the signal and ground, and can be used as a high-speed transmission line.

[0265] FIG. 53 is a cross-sectional view showing a method for manufacturing a package according to the seventeenth embodiment, and FIG. 54 is a plan view showing the method for manufacturing a package according to the seventeenth embodiment.

[0266] In this figure, the lead frame RM1 in Fig. 7a is changed to a lead frame RM3. In the lead frame RM3, a flexible printed circuit board 1710 is provided for each sub-frame SM3 in Fig. 50. The rest of the manufacturing method of the package according to the seventeenth embodiment is the same as the manufacturing method of the package 100 according to the first embodiment.

[0267] FIG. 55 is a cross-sectional view showing another example of the structure of the package according to the seventeenth embodiment.

[0268] In the figure, this package 1701 includes a flexible printed circuit board 1711 instead of the flexible printed circuit board 1710 in Fig. 49. Other configurations of the package 1701 in Fig. 55 are the same as those of the package 1700 in Fig. 49.

[0269] In the package 1700 of FIG. 49, the flexible printed circuit board 1710 is arranged on one side of the package 1700, but in the package 1701 of FIG. 55, the flexible printed circuit boards 1711 are arranged on both sides of the package 1701.

[0270] 56 is a plan view showing another example of the configuration of the lead frame applied to the package according to the seventeenth embodiment. Note that this figure shows an example of the configuration of one sub-frame SM4 of the lead frame.

[0271] In the figure, one package 1701 can be assigned to the subframe SM4. Here, the spacing DS2 between the leads 116 arranged in parallel along the inner sides of the unit frame FM1 is set to two opposing inner sides out of the four inner sides of the unit frame FM1.

[0272] As shown in FIG. 1B, a flexible printed circuit board 1711 is disposed in the space DS2 between the leads 116. A transmission path 1711A is formed on the flexible printed circuit board 1711. In this case, the flexible printed circuit board 1711 can be drawn outward across the unit frame FM1. The flexible printed circuit board 1711 can be supported by the leads 116 adjacent to both sides of the flexible printed circuit board 1711. The position of the tip of the flexible printed circuit board 1711 can be aligned with the position of the tip of the inner lead 116A. The spacing between the transmission paths 1711A formed on the flexible printed circuit board 1711 can be made equal to the spacing DS1 between the leads 116. In this case, the position of the tip of the transmission path 1711A formed on the flexible printed circuit board 1711 can correspond to the position of the pad electrode 113 on the chip 111.

[0273] FIG. 57 is a cross-sectional view showing still another configuration example of the package according to the seventeenth embodiment.

[0274] In the figure, this package 1705 has leads 1716 and a flexible printed circuit board 1715 instead of the leads 116 and flexible printed circuit board 1710 of Fig. 49. Other than that, the configuration of the package 1705 of Fig. 57 is the same as the configuration of the package 1700 of Fig. 49.

[0275] The leads 1716 include outer leads 1716B in addition to the inner leads 116A and outer leads 116B of Fig. 49. The outer leads 1716B are arranged along and between the outer leads 116B on each side of the outline of the package 1702.

[0276] The flexible printed circuit board 1715 is drawn inward from between the support portion 121B and the transparent substrate 122. The tip of the flexible printed circuit board 1715 is bonded to the surface of the chip 111. At this time, the tip of the flexible printed circuit board 1715 may be bonded to the pad electrode 113 via a solder ball. Between the support portion 121B and the transparent substrate 122, the end of the flexible printed circuit board 1715 is bonded to the outer lead 1716B. At this time, between the support portion 121B and the transparent substrate 122, the end of the flexible printed circuit board 1715 may be disposed so as to overlap the end of the outer lead 1716B.

[0277] 58 is a plan view showing yet another example of the configuration of the lead frame applied to the package according to the seventeenth embodiment. Note that this figure shows an example of the configuration of one sub-frame SM5 of the lead frame.

[0278] In the figure, one package 1705 can be allocated to the subframe SM5. Here, a distance DS3 is set between the inner leads 116A arranged in parallel along the inner sides of the unit frame FM1. The distance DS3 is set on the four inner sides of the unit frame FM1.

[0279] As shown in FIG. 1B, a flexible printed circuit board 1715 is disposed in the space DS3 between the inner leads 116A. At this time, the inner leads 116A can be left on both sides of the flexible printed circuit board 1715. A transmission path 1715A is formed on the flexible printed circuit board 1715. The position of the tip of the flexible printed circuit board 1715 can be aligned with the position of the tip of the inner lead 116A. The spacing between the transmission paths 1715A formed on the flexible printed circuit board 1715 can be made equal to the spacing DS1 between the leads 116. At this time, the position of the tip of the transmission path 1715A formed on the flexible printed circuit board 1715 can be made to correspond to the position of the pad electrode 113 on the chip 111.

[0280] FIG. 59 is a cross-sectional view showing still another configuration example of the package according to the seventeenth embodiment.

[0281] In the figure, this package 1706 has a base substrate 1721 instead of the base substrate 121 of Fig. 49. The base substrate 1721 has a bottom plate portion 1721A instead of the bottom plate portion 121A of Fig. 49. Furthermore, this package 1706 has a thermally conductive layer 1711 added to the package 1700 of Fig. 49. Other than that, the configuration of the package 1706 of Fig. 59 is similar to the configuration of the package 1700 of Fig. 47.

[0282] A thermally conductive layer 1711 is embedded in the bottom plate portion 1721A. The chip 111 can be placed on the thermally conductive layer 1711. At this time, the chip 111 is pressed against the thermally conductive layer 1711 due to the tension applied to the inner leads 116A.

[0283] 60 is a diagram showing yet another example of the configuration of the package according to the seventeenth embodiment, where a is a cross-sectional view showing yet another example of the configuration of the package according to the seventeenth embodiment, and b is a plan view showing the configuration of the tips of the transmission paths 1717A and 1717B of the flexible printed circuit board 1717.

[0284] In the figure, this package 1707 includes a chip 1711 and a flexible printed circuit board 1717 instead of the chip 111 and the flexible printed circuit board 1710 in Fig. 49. Other configurations of the package 1707 in Fig. 60 are similar to those of the package 1700 in Fig. 49.

[0285] Chip 1711 includes pad electrodes 113A and 113B instead of pad electrode 113 in Fig. 49. Other configurations of chip 1711 are similar to those of chip 111 in Fig. 49. Pad electrodes 113A and 113B can be arranged in two rows along at least one side of chip 1711.

[0286] The flexible printed circuit board 1717 includes transmission paths 1717A and 1717B. The transmission paths 1717A and 1717B can be arranged alternately in parallel with each other. The tip of the transmission path 1717A is joined to the pad electrode 113A, and the tip of the transmission path 1717B is joined to the pad electrode 113B. In this case, a double-sided flexible printed circuit board or a multi-layer flexible printed circuit board can be used for the flexible printed circuit board 1717. Other configurations of the flexible printed circuit board 1717 are the same as those of the flexible printed circuit board 1710 in FIG. 49 .

[0287] As described above, in the seventeenth embodiment, the chip 111 is supported inside the support portion 121B of the base substrate 121 based on the tension applied to the inner leads 116A, and the flexible printed circuit board 1710 is provided along the inner leads 116A and supported by the support portion 121B. This enables faster data transmission between the chip 111 and reduces stress applied to the chip 111 housed in the package 1700. Furthermore, by drawing high-speed signal lines to the outside using a double-sided (or multi-layer) flexible printed circuit board, it is possible to reduce stress applied to the connection portions of the chip and improve noise resistance and crosstalk characteristics.

[0288] 18. Application Examples to Mobile Bodies The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0289] FIG. 61 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology of the present disclosure can be applied.

[0290] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 61 , the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0291] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0292] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0293] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0294] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0295] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0296] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0297] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0298] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0299] The audio / video output unit 12052 transmits at least one output signal of audio and / or video to an output device capable of visually or audibly notifying the passengers of the vehicle or the outside of the vehicle of information. In the example of Fig. 61, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0300] FIG. 62 is a diagram showing an example of the installation position of the imaging unit 12031.

[0301] In FIG. 62, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0302] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0303] 62 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0304] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0305] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which runs autonomously without relying on driver operation.

[0306] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0307] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0308] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 12031 of the above-described configuration. Specifically, for example, each of the packages 100 to 1000 according to the above-described embodiment can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the vehicle control system 12000, the reliability of the imaging unit 12031 can be improved.

[0309] Note that the above-described embodiment shows an example for realizing the present technology, and the matters in the embodiment and the matters specifying the invention in the claims correspond to each other. Similarly, the matters specifying the invention in the claims and the matters in the embodiment of the present technology with the same title correspond to each other. However, the present technology is not limited to the embodiment, and can be realized by applying various modifications to the embodiment within the scope of the gist. Furthermore, the effects described in this specification are merely examples and are not limited, and other effects may also be present.

[0310] The present technology may also be configured as follows: (1) A package comprising: a chip; inner leads having tips joined to a surface of the chip; outer leads connected to the inner leads; a support portion supporting the inner leads and the outer leads around the chip; and a lid arranged on the support portion and spaced apart from the chip. (2) The package according to (1), wherein the chip is supported inside the support portion based on tension applied to the inner leads. (3) The package according to (1) or (2), wherein tips of the inner leads are joined to the surface of the chip based on solder bonding. (4) The package according to any one of (1) to (3), further comprising a pad electrode to which tips of the inner leads are joined, the pad electrode being made of aluminum with a low-melting-point metal added. (5) The package according to any one of (1) to (4), wherein the support portion is made of ceramic or resin. (6) The package according to any one of (1) to (5), wherein the lid is a transparent member. (7) The package according to any one of (1) to (6), further comprising: a light-shielding layer formed on the transparent member so as to avoid an optical path on the chip. (8) The package according to any one of (1) to (7), further comprising: a bottom plate portion disposed on the bottom of the chip, wherein the chip is pressed against the bottom plate portion based on the tension of the inner leads. (9) The package according to any one of (1) to (9), further comprising: a fluid material disposed between the chip and the bottom plate portion, the fluid material having a higher thermal conductivity than the bottom plate portion. (10) The package according to (8), further comprising: a thermally conductive layer embedded in the bottom plate portion, the thermal conductivity of which is higher than that of the bottom plate portion. (11) The package according to any one of (1) to (10), wherein the outer leads reach the bottom surface via a side surface of the support portion and are bent inward at the bottom surface. (12) The package according to any one of (1) to (11), further comprising: a frame positioned on the inner leads, to which the lid is attached, and a fastening portion extending horizontally from the frame. (13) The package according to (12), wherein the fastening portion has the same optical precision as the chip.(14) The package according to (12) or (13), wherein the inner edge of the frame is arranged along the outer shape of the chip. (15) The package according to any of (12) to (14), wherein the frame is made of a magnetic shielding material. (16) The package according to any of (12) to (15), wherein the cross section of the inner wall of the frame is tapered. (17) The package according to any of (12) to (16), wherein the inner wall surface of the frame has a textured surface or a recess. (18) The package according to any of (1) to (17), wherein the inner lead penetrates the support portion and is connected to the outer lead. (19) The package according to (18), wherein the support portion is a mold frame from which the inner lead is drawn out from the inner surface and the outer lead is drawn out from the outer surface. (20) The package according to any of (1) to (19), wherein a flexible printed circuit board is arranged along the inner lead, whose tip is joined to the surface of the chip and supported by the support portion. (21) A lead frame comprising leads arranged with tips facing each other via a space, and a frame supporting rear ends of the leads. (22) The lead frame according to (21), further comprising: a first tie bar formed between first and second leads adjacent to each other; and a second tie bar formed between the first and second leads with a gap therebetween. (23) The lead frame according to (21), wherein the leads are arranged in parallel at a first interval along an inner side of the frame, and a second interval larger than the first interval is set between the leads arranged in parallel. (24) A method for manufacturing a package, comprising: joining a surface of a chip to tips of inner leads connected to the lead frame via outer leads; forming support portions that support the inner leads and the outer leads around the chip; and arranging a lid on the support portions at a distance from the chip.

[0311] 100 Package 111 Chip CAV Cavity 112 Light-receiving region 113 Pad electrode 114 Color filter 115 On-chip lens 116 Lead 116A Inner lead 116B Outer lead 117 Solder ball 121 Base substrate 121A Bottom plate portion 121B Support portion 122 Transparent substrate

Claims

1. A package comprising: a chip; inner leads whose tips are joined to the surface of the chip; outer leads connected to the inner leads; a support portion that supports the inner leads and outer leads around the chip; and a lid that is spaced apart from the chip and is positioned on the support portion.

2. The package according to claim 1, wherein the chip is supported inside the support portion by tension applied to the inner leads.

3. The package according to claim 1, wherein the tips of the inner leads are joined to the surface of the chip by soldering.

4. The package according to claim 1, further comprising a pad electrode to which the tip of the inner lead is joined, the pad electrode being made of aluminum to which a low-melting-point metal is added.

5. The package according to claim 1, wherein the material of the support is ceramic or resin.

6. The package according to claim 1, wherein the lid is a transparent member.

7. The package according to claim 1, further comprising a light-shielding layer formed on said transparent member to avoid an optical path on said chip.

8. The package according to claim 1, further comprising a bottom plate portion disposed on the bottom of the chip, wherein the chip is pressed against the bottom plate portion based on the tension of the inner leads.

9. The package according to claim 8, further comprising a fluid material disposed between said chip and said base plate, said fluid material having a higher thermal conductivity than said base plate.

10. The package according to claim 8, further comprising a thermally conductive layer embedded in said base plate portion and having a thermal conductivity higher than that of said base plate portion.

11. The package according to claim 1, wherein the outer leads reach the bottom surface via the side surfaces of the support portions and are bent inward at the bottom surface.

12. The package according to claim 1, comprising: a frame positioned on said inner leads and to which said lid is attached; and a fastening portion extending horizontally from said frame.

13. The package according to claim 12, wherein the fastening portion has the same optical precision as the chip.

14. The package according to claim 12, wherein the inner edge of the frame is positioned along the outline of the chip.

15. The package according to claim 12, wherein the frame is made of a magnetic shielding material.

16. The package according to claim 12, wherein the cross-sectional shape of the inner wall of the frame is tapered.

17. The package according to claim 12, wherein the inner wall surface of the frame has a textured surface or a recessed portion.

18. The package according to claim 1, wherein the inner lead passes through the support portion and is connected to the outer lead.

19. The package according to claim 18, wherein the support is a mold frame from which the inner leads extend and from which the outer leads extend.

20. The package according to claim 1, further comprising a flexible printed circuit board arranged along the inner leads, the tip of which is bonded to the surface of the chip, and which is supported by the support portion.

21. A lead frame comprising leads whose tips are arranged opposite each other with a space between them, and a frame that supports the rear ends of the leads.

22. The lead frame according to claim 21, further comprising: a first tie bar formed between adjacent first and second leads; and a second tie bar formed between the first and second leads and spaced apart from the first tie bar.

23. The lead frame according to claim 21, wherein the leads are arranged in parallel at first intervals along an inner side of the frame, and a second interval larger than the first interval is set between the leads arranged in parallel.

24. A method for manufacturing a package, comprising the steps of: joining the surface of a chip to the tip of an inner lead connected to a lead frame via an outer lead; forming a support portion that supports the inner lead and the outer lead around the chip; and arranging a lid on the support portion at a distance from the chip.

Images