Optical module

Abstract

The present disclosure provides an optical module, comprising: a light emitting part, comprising an emitting housing, wherein a connecting through hole is embedded in the emitting housing, a laser assembly is arranged in the emitting housing, a first optical fiber fixing seat is located in the emitting housing, and a light exit end face of the laser assembly is close to a light incidence surface of the first optical fiber fixing seat. The laser assembly comprises: a second substrate, arranged in the emitting housing and located on the edge of a circuit board, the second substrate being electrically connected to the circuit board; and a laser chip, arranged on the second substrate and electrically connected to the second substrate, a plurality of modulation waveguides being formed side by side at a light exit end of the laser chip to output a plurality of light signals, each modulation waveguide comprising a deflection part, the included angle between the central axis of the deflection part and the normal line of the light exit end face of the laser chip being a first preset angle, and the first preset angle being not 0°. The deflection parts can prevent reflected light signals from being transmitted back to the modulation waveguides, thereby reducing the interference of the reflected light signals on optical signals generated in the modulation waveguides, and ensuring the quality of optical signals generated by the laser chip.

Description

optical module

[0001] This application claims priority to Chinese Patent Application No. 202411331778.0, filed on September 23, 2024; and priority to Chinese Patent Application No. 202410683508.X, filed on May 29, 2024; the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0003] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing.

[0004] Summary of the Invention

[0005] In some embodiments, an optical module is provided, comprising: a circuit board; an optical transmission component including an optical fiber and a first optical fiber holder, the first optical fiber holder being connected to the end of the optical fiber, the light-incident end face of the optical fiber being exposed on the light-incident surface of the first optical fiber holder; an optical emission component including a laser component, the laser component being located at the edge of the light-emitting end of the first optical fiber holder; a gap being formed between the light-emitting end face of the laser component and the light-emitting end of the first optical fiber holder, a matching layer being disposed within the gap; one side of the matching layer being connected to the first optical fiber holder, and the other side being connected to the laser component; wherein, the laser component includes: a second substrate located at the edge of the circuit board, the second substrate being electrically connected to the circuit board; a laser chip disposed on the second substrate and electrically connected to the second substrate; a modulation waveguide being formed at the light-emitting end of the laser chip; the modulation waveguide including a deflection portion. The angle between the central axis of the deflection portion and the normal of the light-emitting end face of the laser chip is a first preset angle, which is not 0°; the optical signal output by the laser chip is transmitted to the matching layer and then to the optical fiber; wherein, the laser chip includes: a chip body, including a first modulation waveguide and a second modulation waveguide arranged side by side, with a gap between the first modulation waveguide and the second modulation waveguide; a first modulation pad, disposed above the first modulation waveguide and extending to the top of the first modulation waveguide; a second modulation pad, disposed above the second modulation waveguide and extending to the top of the second modulation waveguide; wherein, the first modulation pad includes a first bonding portion, the second modulation pad includes a second bonding portion, and the first bonding portion and the second bonding portion are arranged side by side at the top of the gap between the first modulation waveguide and the second modulation waveguide.

[0006] In some embodiments, an optical module is provided, comprising: a circuit board having through holes; an optical transmission component including a first fiber array, a first fiber optic mount, a second fiber array, and a second fiber optic mount; the first fiber optic mount is connected to the end of the first fiber array, and the light-incident end face of the first fiber array is exposed on the light-incident surface of the first fiber optic mount; the second fiber optic mount is connected to the end of the second fiber array, and the light-incident end face of the second fiber array is exposed on the light-incident surface of the second fiber optic mount; and an optical emitting component including an emitting housing and two laser components disposed within the emitting housing, the emitting housing having a connecting through hole, the first fiber optic mount and the second fiber optic mount being located within the emitting housing, and the light-emitting end faces of the two laser components correspondingly connected to the light-incident surface of the first fiber optic mount and the light-incident surface of the second fiber optic mount. A gap is formed at the light-incident surface, and a matching layer is disposed within each gap. One side of the matching layer is connected to the fiber optic mounting base, and the other side is connected to the laser assembly. A first light-receiving component is located on one side of the light-emitting component. A second light-receiving component is located on the other side of the light-emitting component. The laser assembly includes: a second substrate disposed within the emitting housing and located at the edge of the circuit board; the second substrate is electrically connected to the circuit board; a laser chip is disposed on the second substrate and electrically connected to the second substrate; multiple modulation waveguides are formed side by side at the light-emitting end of the laser chip to output multiple light signals; the modulation waveguide includes a deflection portion, and the angle between the central axis of the deflection portion and the normal of the light-emitting end face of the laser chip is a first preset angle, which is not 0; the light signal output by the laser chip is transmitted to the matching layer and then transmitted to the corresponding fiber array via the matching layer.

[0007] In some embodiments, a laser chip is provided, comprising:

[0008] The chip body includes a first light-emitting waveguide and a second light-emitting waveguide arranged in a row, and a first modulation waveguide and a second modulation waveguide arranged side by side. There is a gap between the first light-emitting waveguide and the second light-emitting waveguide, and there is a gap between the first modulation waveguide and the second modulation waveguide. The output end of the first light-emitting waveguide is connected to the input end of the first modulation waveguide, and the output end of the second light-emitting waveguide is connected to the input end of the second modulation waveguide.

[0009] The first modulation pad is disposed above the first modulation waveguide and extends to the top of the first modulation waveguide;

[0010] The second modulation pad is disposed above the second modulation waveguide and extends to the top of the second modulation waveguide;

[0011] The first light-emitting pad is positioned above the first light-emitting waveguide;

[0012] The second light-emitting pad is positioned above the second light-emitting waveguide;

[0013] The first modulation pad includes a first wire bonding section, and the second modulation pad includes a second wire bonding section. The first wire bonding section and the second wire bonding section are located side by side at the top of the space between the first modulation waveguide and the second modulation waveguide. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of this disclosure;

[0016] Figure 2 is a partial structural diagram of a host computer according to some embodiments of this disclosure;

[0017] Figure 3 is a schematic diagram of the structure of an optical module according to some embodiments of the present disclosure;

[0018] Figure 4 is an exploded view of an optical module according to some embodiments of this disclosure;

[0019] Figure 5 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0020] Figure 6 is an exploded view of a light emitting component according to some embodiments of the present disclosure;

[0021] Figure 7A is a schematic diagram of the structure of a light emitting component according to some embodiments of the present disclosure;

[0022] Figure 7B is a schematic diagram of the structure of a light emitting component according to some embodiments of this disclosure;

[0023] Figure 7C is a partially exploded view of an optical module according to some embodiments of the present disclosure;

[0024] Figure 7D is a partial schematic diagram of an optical module according to some embodiments of the present disclosure;

[0025] Figure 8A is a schematic diagram of the structure of a laser component according to some embodiments of this disclosure;

[0026] Figure 8B is a schematic diagram of the structure of a laser component according to some embodiments of this disclosure;

[0027] Figure 9A is a schematic diagram of the structure of a laser chip according to some embodiments of this disclosure;

[0028] Figure 9B is an exploded view of a laser chip according to some embodiments of this disclosure;

[0029] Figure 9C is a partial schematic diagram of a laser chip according to some embodiments of this disclosure;

[0030] Figure 9D is a schematic diagram of the modulation pad structure in Figure 9C;

[0031] Figure 9E is a schematic diagram of the structure of another laser chip provided in some embodiments of this disclosure;

[0032] Figure 9F is a partial schematic diagram of a laser chip according to some embodiments of this disclosure;

[0033] Figure 10A is a schematic diagram of the structure of another laser chip according to some embodiments of this disclosure;

[0034] Figure 10B is a front view of another laser chip according to some embodiments of this disclosure;

[0035] Figure 10C is a schematic diagram of another laser chip structure without pads according to some embodiments of the present disclosure;

[0036] Figure 10D is a cross-sectional view of another laser chip according to some embodiments of this disclosure;

[0037] Figure 10E is a cross-sectional view of another laser chip according to some embodiments of this disclosure;

[0038] Figure 10F is a cross-sectional view three of another laser chip according to some embodiments of this disclosure;

[0039] Figure 10G is a cross-sectional view of another laser chip according to some embodiments of this disclosure;

[0040] Figure 10H is a partial schematic diagram of another laser chip according to some embodiments of this disclosure;

[0041] Figure 10I is a partial schematic diagram of another laser chip according to some embodiments of this disclosure;

[0042] Figure 11A is a schematic diagram of the structure of a second substrate according to some embodiments of the present disclosure;

[0043] Figure 11B is a schematic diagram of the structure of a second substrate according to some embodiments of the present disclosure;

[0044] Figure 11C is an enlarged view of point a in Figure 11B;

[0045] Figure 12 is a schematic diagram of the electrical connection between a laser chip and a second substrate according to some embodiments of the present disclosure;

[0046] Figure 13A is a schematic diagram of the electrical connection between a laser chip and a second substrate according to some embodiments of this disclosure;

[0047] Figure 13B is a schematic diagram of the electrical connection between another laser chip and a second substrate according to some embodiments of this disclosure;

[0048] Figure 14A is a partial schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0049] Figure 14B is an enlarged view of point b in Figure 14A;

[0050] Figure 14C is an enlarged view of point c in Figure 14A;

[0051] Figure 14D is an enlarged view of point d in Figure 14A;

[0052] Figure 15A is a schematic diagram of the internal structure of another optical module according to some embodiments of this disclosure;

[0053] Figure 15B is a schematic diagram of the internal structure of another optical module according to some embodiments of this disclosure;

[0054] Figure 16A is a schematic diagram of the structure of another light emitting component according to some embodiments of the present disclosure;

[0055] Figure 16B is a partially exploded view of an optical module according to some embodiments of this disclosure. Detailed Implementation

[0056] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0057] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0058] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0059] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0060] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0061] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0062] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103, wherein the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0063] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0064] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0065] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0066] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200. The host computer 100 also includes an external electrical interface that can be connected to an electrical signal network. In some embodiments, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0067] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0068] In some embodiments, a first optical signal from a remote information processing device 1000 propagates through an optical fiber 101, and is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. In some embodiments, the optical module is a tool for converting between optical signals and electrical signals. During the conversion process, the information itself does not change; only the encoding or decoding method of the information changes.

[0069] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0070] Figure 2 is a partial structural diagram of a host computer according to some embodiments of this disclosure. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in a receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0071] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0072] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0073] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0074] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0075] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0076] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, in some embodiments, the optical module 200 includes a shell, a circuit board 300 disposed within the shell, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500. The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 203 and 204, one of which is an electrical port, and the other is an optical port. In some embodiments, the shell forms one opening, which serves as both an electrical port and an optical port. The outer contour of the shell is generally rectangular.

[0077] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal, which facilitates electromagnetic shielding and heat dissipation. The assembly method using the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc., into the aforementioned housings, which encapsulate and protect these devices. Furthermore, the assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, promoting automated production.

[0078] The direction of the line connecting the two openings 203 and 204 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200 (right end in Figure 3), and opening 204 is also located at the end of the optical module 200 (left end in Figure 3). Alternatively, opening 203 is located at the end of the optical module 200, while opening 204 is located on the side of the optical module 200. Opening 203 is an electrical port, and the end of the circuit board 300 extends from opening 203 and is inserted into the electrical connector of the host computer 100; opening 204 is an optical port, configured to connect an external optical fiber 101 so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0079] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0080] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates 2012 located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates 2012 are combined with the two lower side plates 2022 to realize that the upper housing 201 covers the lower housing 202.

[0081] As shown in Figures 3 and 4, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0082] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as stably supporting the aforementioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100. In some embodiments, the circuit board also includes a flexible circuit board, which can be used independently or in conjunction with the rigid circuit board. In some embodiments, the circuit board also includes gold fingers formed on its end surfaces, the gold fingers consisting of multiple independent pins. In some embodiments, the gold fingers 310 are disposed on one side of the surface of the circuit board 300 (e.g., the upper surface shown in FIG. 4); in some embodiments, the gold fingers 310 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to applications requiring a large number of pins.

[0083] In some embodiments, the gold fingers of the circuit board extend from the electrical port 203 and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers 310 are connected to the electrical connector inside the cage 106. The gold fingers 310 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. At least one of the optical emitting component 400 or the optical receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0084] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0085] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0086] In some embodiments, the light emitting component 400 and the light receiving component 500 may be physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0087] In some embodiments, the optical module 200 may include an optical fiber adapter 700 and an optical transmission component 800. The optical fiber adapter 700 connects the optical transmitting component 400 and the optical receiving component 500 via the optical transmission component 800. The optical transmission component 800 includes multiple optical fibers. For example, the optical module 200 includes two optical fiber adapters 700 and the optical transmission component 800 includes 16 optical fibers; or, the optical module 200 includes one optical fiber adapter 700 and the optical transmission component 800 includes 16 optical fibers; or, the optical module 200 includes one optical fiber adapter 700 and the optical transmission component 800 includes eight optical fibers, etc.

[0088] In some embodiments, the light emitting component 400 and the light receiving component 500 may be located at one end of the circuit board 300 and outside the circuit board 300. In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0089] In some embodiments, the light emitting component 400 may include a cavity, in which an electrical device for generating emitted light signals and an optical device for transmitting emitted light signals are disposed; wherein the electrical device includes a laser, etc., and the optical device includes a collimating lens, etc.

[0090] In some embodiments, the light receiving component 500 may include a cavity, in which an optical device for transmitting received light signals and an electrical device for converting received light signals are disposed; wherein the optical device includes a converging lens, etc., and the electrical device includes a photodetector, etc.

[0091] In some embodiments, the light emitting component 400 and the light receiving component 500 may share a cavity, such as a double-layer cavity, with one layer for the light emitting component 400 and the other layer for the light receiving component 500.

[0092] In some embodiments, the light emitting component 400 and the light receiving component 500 may not share a cavity, and the light emitting component 400 and the light receiving component 500 may be independent of each other and may be disposed on the same side of the circuit board 300. Of course, in this embodiment of the present disclosure, the light emitting component 400 and the light receiving component 500 may also be disposed on different sides of the circuit board 300.

[0093] Figure 5 is a schematic diagram of the internal structure of an optical module according to some embodiments of this disclosure. As shown in Figure 5, in some embodiments, a through hole 301 is formed on the circuit board 300, and the bottom of the light emitting component 400 is embedded in the through hole 301. The light receiving component 500 is disposed on the surface of the circuit board 300.

[0094] As shown in Figure 5, the light emitting component 400 can be located near the front side of the circuit board 300, and the light receiving component 500 can be located near the rear side of the light emitting component 400. Alternatively, in this embodiment, the light receiving component 500 can be located near the rear side of the light emitting component 400, or it can be located at the left or right end of the light emitting component 400.

[0095] Figure 6 is an exploded view of a light emitting component provided in some embodiments of the present disclosure, showing a component that generates light signals of four wavelengths. Figure 7A is a structural schematic diagram of a light emitting component according to some embodiments of the present disclosure, and Figure 7B is a structural schematic diagram of a light emitting component according to some embodiments of the present disclosure.

[0096] As shown in Figure 6, in some embodiments, the light emitting component 400 includes four laser components 400a, which are arranged in an array. Each laser component 400a includes a substrate and a laser chip. The laser chip generates a light signal of a certain wavelength and is disposed on the substrate.

[0097] In some embodiments, a ceramic substrate is used as the substrate, and the laser chip is eutectic bonded to the ceramic substrate. Four laser components 400a are arranged in an array, and a preset spacing must be maintained between adjacent laser components 400a, which places high demands on the assembly of the laser components 400a.

[0098] In some embodiments, to ensure the coupling efficiency of the optical signal generated by the laser component 400a, a lens is provided in the output optical path of the laser component 400a, and the assembly accuracy of the lens is required to be high. To ensure the assembly accuracy of the lens, the lens is usually placed in the output optical path of the corresponding laser component 400a by active coupling.

[0099] In some embodiments, the light emitting component 400 includes an emitting housing 401, and a laser assembly 400a is disposed in the emitting housing 401. Exemplarily, an opening is provided on one side wall of the emitting housing 401 for insertion of a circuit board 300; the circuit board 300 extending into the cavity is electrically connected to the laser assembly 400a.

[0100] As shown in Figures 7A and 7B, in some embodiments, the light emitting component 400 further includes an emitting cover plate 402. The emitting cover plate 402 covers and connects to the emitting housing 401 to form an emitting cavity, which can be used to accommodate laser components, lenses, and other devices.

[0101] In some embodiments, the launch housing 401 includes a base plate and a side plate, the side plate being connected to the top edge of the base plate, the base plate and the side plate forming a housing with a top opening. The top of the side plate supports and connects to a launch cover 402.

[0102] In some embodiments, as shown in FIG7A, a first notch 4011 is formed on the side plate at the left end of the transmitting housing 401, and the first notch 4011 communicates with the inner cavity of the transmitting housing 401. The optical transmission assembly 800 may include a first optical fiber array 810, which passes through the first notch 4011, such that the end of the first optical fiber array 810 extends into the inner cavity of the transmitting housing 401. The first optical fiber array 810 may include multiple optical fibers, such as four optical fibers.

[0103] In some embodiments, as shown in FIG7B, a second notch 4012 is formed at the right end of the launch housing 401, the bottom of the second notch 4012 extends to the bottom plate of the launch housing 401, and the two sides of the second notch 4012 extend to the side plates on both sides of the launch housing 401.

[0104] In some embodiments, a first boss 4013 and a second boss 4014 are formed on the top of the launch housing 401. The first boss 4013 and the second boss 4014 are formed by the outer wall of the side plate of the launch housing 401 protruding outward from the launch housing 401. The right end of the first boss 4013 and the right end of the second boss 4014 extend beyond the right side of the second notch 4012.

[0105] Figure 7C is a partially exploded view of an optical module according to some embodiments of the present disclosure, and Figure 7D is a partially schematic view of an optical module according to some embodiments of the present disclosure. As shown in Figures 7C and 7D, the transmitting housing 401 is embedded in the through hole 301, and the edge of the second notch 4012 is close to the edge of the circuit board 300.

[0106] In some embodiments, the circuit board 300 at the edge of the through hole 301 supports and connects the first boss 4013 and the second boss 4014. Exemplarily, the first boss 4013 and the second boss 4014 are connected to the circuit board 300 by adhesive.

[0107] In some embodiments, a laser component 400a is disposed within the emitting housing 401; the laser component 400a is located at the edge of the second notch 4012 and the edge of the laser component 400a is close to the edge of the circuit board 300. Pads are formed on the edge of the circuit board 300, and the laser component 400a is wire-connected to the pads. The laser component 400a can generate multiple light signals.

[0108] In some embodiments, a first fiber optic mounting base 820 is provided at the end of the first fiber optic array 810. The end of the first fiber optic array 810 is embedded in the first fiber optic mounting base 820. The first fiber optic mounting base 820 covers the end of the fiber in the first fiber optic array 810 and exposes the light-incident end face of the fiber in the first fiber optic array 810 on the light-incident surface of the first fiber optic mounting base 820. The first fiber optic mounting base 820 is located inside the transmitting housing 401 to fix the first fiber optic array 810. The light-incident end face of the first fiber optic mounting base 820 is close to the light-outcident end face of the laser component 400a, which facilitates the coupling of the optical signal generated by the laser component 400a to the fiber in the first fiber optic array 810.

[0109] In some embodiments, the first fiber optic bracket 820 is inclinedly disposed within the transmitting housing 401, such that the extension direction of the optical fiber in the first fiber array 810 is not parallel to the central axis direction of the laser component 400a. This facilitates the prevention of the reflected optical signal from the laser component 400a returning along the direction of the output optical signal of the laser component 400a when the optical signal generated by the laser component 400a is coupled to the optical fiber in the first fiber array 810. For example, the inclination angle of the first fiber optic bracket 820 is 5-20°, such as 10-15°.

[0110] In some embodiments, the light emitting component 400 may include a first substrate 403, which is disposed on the bottom plate of the emitting housing 401. A laser component 400a may be disposed on the first substrate 403, so that the first substrate 403 supports and connects to the laser component 400a. The first substrate 403 can be used to adjust the relative height between the top surface of the laser component 400a and the top surface of the circuit board 300. A first fiber optic bracket 820 may be disposed on the first substrate 403 to adjust the relative height between the first fiber optic bracket 820 and the laser component 400a via the first substrate 403.

[0111] In some embodiments, the laser component 400a and the first fiber optic mount 820 may be disposed on the first substrate 403 to facilitate fixing the laser component 400a and the first fiber optic mount 820 inside the emitter housing 401.

[0112] Figure 8A is a schematic diagram of the structure of a laser component according to some embodiments of the present disclosure, and Figure 8B is a schematic diagram of the structure of a laser component according to some embodiments of the present disclosure. As shown in Figures 8A and 8B, the laser component 400a includes a laser chip 410, which can generate multiple light signals. For example, the laser chip 410 can generate 2, 3, or 4 light signals.

[0113] In some embodiments, the laser assembly 400a may include a second substrate 420, the surface of which is formed with circuit patterns. For example, transmission lines, pads, etc., are provided on the top surface of the second substrate 420. A laser chip 410 is disposed on the second substrate 420, and the laser chip 410 is correspondingly connected to the corresponding circuit patterns on the second substrate 420, so as to supply power to the laser chip 410 or input high-frequency signals, etc., through the second substrate 420.

[0114] In some embodiments, the laser component 400a can generate four light signals, and a first capacitor 430, a second capacitor 440, a third capacitor 450, and a fourth capacitor 460 are disposed on the second substrate 420. The first capacitor 430, the second capacitor 440, the third capacitor 450, and the fourth capacitor 460 are electrically connected to the laser chip 410.

[0115] Figure 9A is a schematic diagram of the structure of a laser chip according to some embodiments of the present disclosure, and Figure 9B is an exploded schematic diagram of a laser chip according to some embodiments of the present disclosure. The dashed arrows in the figures indicate the direction of light transmission. As shown in Figures 9A and 9B, in some embodiments, the laser chip 410 includes a chip body 411. The chip body 411 includes multiple ridge waveguides, etc., formed to generate optical signals; for example, the chip body 411 includes 2 ridge waveguides, 3 ridge waveguides, or 4 ridge waveguides, etc. Grooves are formed on both sides of the ridge waveguides. The ridge waveguides in the chip body 411 may include a lower confinement layer, an active layer, an upper confinement layer, or a grating layer, etc., stacked sequentially.

[0116] In some embodiments, a ridge waveguide includes a light-emitting waveguide and a modulation waveguide. The output end of the light-emitting waveguide is connected to the input end of the modulation waveguide, i.e., the correspondingly connected light-emitting waveguide and modulation waveguide form a ridge waveguide. The light-emitting waveguide is used to output light, and the modulation waveguide is used to modulate the light output by the light-emitting waveguide to output an optical signal.

[0117] In some embodiments, the chip body 411 includes a first light-emitting waveguide 4111 and a second light-emitting waveguide 4112, which are arranged side by side with a gap between them. The first light-emitting waveguide 4111 and the second light-emitting waveguide 4112 extend along the length of the chip body 4111. The first light-emitting waveguide 4111 and the second light-emitting waveguide 4112 are used to generate light, and form the light-emitting area of ​​the chip body 4111.

[0118] In some embodiments, the chip body 411 includes a first modulation waveguide 4113 and a second modulation waveguide 4114, which are arranged side by side with a gap between them. The first modulation waveguide 4113 and the second modulation waveguide 4114 extend along the length of the chip body 411. The first modulation waveguide 4113 is located at the light-emitting end of the first light-emitting waveguide 4111, and the second modulation waveguide 4114 is located at the light-emitting end of the second light-emitting waveguide 4112. For example, one end of the first modulation waveguide 4113 is connected to the light-emitting end of the first light-emitting waveguide 4111, and one end of the second modulation waveguide 4114 is connected to the light-emitting end of the second light-emitting waveguide 4112. The first modulation waveguide 4113 is used to modulate the light output from the first light-emitting waveguide 4111 to generate a light signal; the second modulation waveguide 4114 is used to modulate the light output from the second light-emitting waveguide 4112 to generate a light signal; the first modulation waveguide 4113 and the second modulation waveguide 4114 form the modulation area of ​​the chip body 411.

[0119] In some embodiments, a first modulation pad 412 and a second modulation pad 413 are disposed on the top of the chip body 411. The first modulation pad 412 is located above the first modulation waveguide 4113 and extends to the top of the first modulation waveguide; the second modulation pad 413 is located above the second modulation waveguide 4114 and extends to the top of the second modulation waveguide. The first modulation pad 412 is used to load a high-frequency modulation signal onto the first modulation waveguide 4113 so that the first modulation waveguide 4113 modulates the light output from the first light-emitting waveguide 4111; the second modulation pad 413 is used to load a high-frequency modulation signal onto the second modulation waveguide 4114 so that the second modulation waveguide 4114 modulates the light output from the second light-emitting waveguide 4112.

[0120] In some embodiments, the first modulation waveguide 4113 is located near the edge of the chip body 411, and the first modulation pad 412 and the second modulation pad 413 are disposed above the gap between the first modulation waveguide 4113 and the second modulation waveguide 4114.

[0121] In some embodiments, the first modulation pad 412 is closer to one end of the chip body 411 than the second modulation pad 413, that is, the first modulation pad 412 is closer to the light-emitting area of ​​the chip body 411 than the second modulation pad 413. Of course, in some embodiments, the second modulation pad 413 may be closer to one end of the chip body 411 than the first modulation pad 412.

[0122] Figure 9C is a partial schematic diagram of a laser chip according to some embodiments of the present disclosure, and Figure 9D is a structural schematic diagram of the modulation pad in Figure 9C. In some embodiments, the first modulation pad 412 includes a first bonding portion 4121, and the second modulation pad 413 includes a second bonding portion 4131. The first bonding portion 4121 and the second bonding portion 4131 are located above the gap between the first modulation waveguide 4113 and the second modulation waveguide 4114. The first bonding portion 4121 is used to facilitate bonding on the first modulation pad 412, and the second bonding portion 4131 is used to facilitate bonding on the second modulation pad 413. For example, the top of the first bonding portion 4121 is circular, elliptical, square, etc., and the top of the second bonding portion 4131 is circular, elliptical, square, etc.

[0123] In some embodiments, the first bonding portion 4121 and the second bonding portion 4131 are arranged side by side above the gap between the first modulation waveguide 4113 and the second modulation waveguide 4114, so that the distances from the first bonding portion 4121 and the second bonding portion 4131 to the edge of the chip body 411 are approximately equal and relatively short, so as to facilitate control of the bonding length.

[0124] In some embodiments, the first modulation pad 412 includes a first electrode portion 4122, which is located on top of the first modulation waveguide 4113 and is connected to the first bonding portion 4121. For example, the first electrode portion 4122 is a narrow strip structure laid on top of the first modulation waveguide 4113.

[0125] In some embodiments, the second modulation pad 413 includes a second electrode portion 4132, which is located on top of the second modulation waveguide 4114 and is connected to the second bonding portion 4131. Exemplarily, the second electrode portion 4132 is a narrow strip structure laid on top of the second modulation waveguide 4114.

[0126] In some embodiments, a first light-emitting pad 414 and a second light-emitting pad 415 are disposed on the top of the chip body 411. The first light-emitting pad 414 is located above the first light-emitting waveguide 4111, and the top of the first light-emitting waveguide 4111 is in contact with the first light-emitting pad 414. The second light-emitting pad 415 is located above the second light-emitting waveguide 4112, and the top of the second light-emitting waveguide 4112 is in contact with the second light-emitting pad 415.

[0127] In some embodiments, the first light-emitting pad 414 includes a first wire bonding area 4141, which is used for connecting wires to the first light-emitting pad 414. For example, one end of the first wire bonding area 4141 is close to the end face of one end of the chip body 411, and the width of the first wire bonding area 4141 is greater than the width of other areas on the first light-emitting pad 414 to facilitate wire bonding on the first light-emitting pad 414.

[0128] In some embodiments, the second light-emitting pad 415 includes a second wire bonding area 4151 for connecting wires to the second light-emitting pad 415. For example, one end of the second wire bonding area 4151 is close to the other end of the first wire bonding area 4141, and the other end of the second wire bonding area 4151 is far from the other end of the first wire bonding area 4141. The second wire bonding area 4151 and the first wire bonding area 4141 are arranged alternately, providing sufficient wire bonding space for the first light-emitting pad 414 and the second light-emitting pad 415, and fully utilizing the space at the top of one end of the chip body 411.

[0129] In some embodiments, the chip body 411 includes a third light-emitting waveguide 4115, which extends along the length of the chip body 411. The third light-emitting waveguide 4115 is disposed on the side of the second light-emitting waveguide 4112, away from the first light-emitting waveguide 4111, and there is a gap between the third light-emitting waveguide 4115 and the second light-emitting waveguide 4112. The third light-emitting waveguide 4115 is used to generate light.

[0130] In some embodiments, the chip body 411 includes a fourth light-emitting waveguide 4116, which extends along the length of the chip body 411. The fourth light-emitting waveguide 4116 is disposed on the side of the third light-emitting waveguide 4115, away from the second light-emitting waveguide 4112, and there is a gap between the fourth light-emitting waveguide 4116 and the third light-emitting waveguide 4115. The fourth light-emitting waveguide 4116 is used to generate light.

[0131] In some embodiments, the chip body 411 includes a third modulation waveguide 4117, which extends along the length of the chip body 411. The third modulation waveguide 4117 is disposed on the side of the second modulation waveguide 4114, away from the first modulation waveguide 4113, and is arranged side by side with the second modulation waveguide 4114, with a gap between them. One end of the third modulation waveguide 4117 is connected to the light-emitting end of the third light-emitting waveguide 4115, and the third modulation waveguide 4117 is used to modulate the light output from the third light-emitting waveguide 4115 to generate a light signal.

[0132] In some embodiments, the chip body 411 includes a fourth modulation waveguide 4118, which extends along the length of the chip body 411. The fourth modulation waveguide 4118 is disposed beside the third modulation waveguide 4117, away from the second modulation waveguide 4117, and is arranged side-by-side with a gap between them. One end of the fourth modulation waveguide 4118 is connected to the light-emitting end of the fourth light-emitting waveguide 4116, and the fourth modulation waveguide 4118 is used to modulate the light output from the fourth light-emitting waveguide 4116 to generate a light signal.

[0133] In some embodiments, a third modulation pad 416 and a fourth modulation pad 417 are disposed on the top of the chip body 411. The third modulation pad 416 is located above the third modulation waveguide 4117, and the fourth modulation pad 417 is located above the fourth modulation waveguide 4118. The third modulation pad 416 is used to load a high-frequency modulation signal onto the third modulation waveguide 4117, so that the third modulation waveguide 4117 modulates the light output from the third light-emitting waveguide 4115; the fourth modulation pad 417 is used to load a high-frequency modulation signal onto the fourth modulation waveguide 4118, so that the fourth modulation waveguide 4118 modulates the light output from the fourth light-emitting waveguide 4116.

[0134] In some embodiments, the fourth modulation waveguide 4118 is located near the edge of the chip body 411, and the third modulation pad 416 and the fourth modulation pad 417 are disposed above the gap between the third modulation waveguide 4117 and the fourth modulation waveguide 4118.

[0135] In some embodiments, the fourth modulation pad 417 is closer to one end of the chip body 411 than the third modulation pad 416, that is, the fourth modulation pad 417 is closer to the light-emitting area of ​​the chip body 411 than the third modulation pad 416. Of course, in some embodiments, the third modulation pad 416 may be closer to one end of the chip body 411 than the fourth modulation pad 417.

[0136] In some embodiments, the third modulation pad 416 includes a third bonding portion 4161, and the fourth modulation pad 417 includes a fourth bonding portion 4171. The third bonding portion 4161 and the fourth bonding portion 4171 are located above the gap between the third modulation waveguide 4117 and the fourth modulation waveguide 4118. The third bonding portion 4161 facilitates bonding of the third modulation pad 416, and the fourth bonding portion 4171 facilitates bonding of the fourth modulation pad 417. Exemplarily, the top of the third bonding portion 4161 is circular, elliptical, square, etc., and the top of the fourth bonding portion 4171 is circular, elliptical, square, etc.

[0137] In some embodiments, the third bonding portion 4161 and the fourth bonding portion 4171 are arranged side by side above the gap between the third modulation waveguide 4117 and the fourth modulation waveguide 4118, so that the distances from the third bonding portion 4161 and the fourth bonding portion 4171 to the edge of the chip body 411 are approximately equal and relatively short, so as to facilitate control of the bonding length.

[0138] In some embodiments, the third modulation pad 416 includes a third electrode portion 4162, which is located on top of the third modulation waveguide 4117 and is connected to the third bonding portion 4161. Exemplarily, the third electrode portion 4162 is a narrow strip structure laid on top of the third modulation waveguide 4117.

[0139] In some embodiments, the fourth modulation pad 417 includes a fourth electrode portion 4172, which is located on top of the fourth modulation waveguide 4118 and is connected to the fourth bonding portion 4171. Exemplarily, the fourth electrode portion 4172 is a narrow strip structure laid on top of the fourth modulation waveguide 4118.

[0140] In some embodiments, a third light-emitting pad 418 and a fourth light-emitting pad 419 are disposed on the top of the chip body 411. The third light-emitting pad 418 is located above the third light-emitting waveguide 4115, and the top of the third light-emitting waveguide 4115 is in contact with the third light-emitting pad 418. The fourth light-emitting pad 419 is located above the fourth light-emitting waveguide 4116, and the top of the third light-emitting waveguide 4115 is in contact with the fourth light-emitting pad 419.

[0141] In some embodiments, the third light-emitting pad 418 includes a third wire bonding area 4181, which is used for connecting wires to the third light-emitting pad 418. For example, the third wire bonding area 4181 is located on the side of the second wire bonding area 4151, and the width of the third wire bonding area 4181 is greater than the width of other areas on the third light-emitting pad 418 to facilitate wire bonding on the third light-emitting pad 418.

[0142] In some embodiments, the fourth light-emitting pad 419 includes a fourth wire bonding area 4191, which is used to connect wires to the fourth light-emitting pad 419. Exemplarily, one end of the fourth wire bonding area 4191 is close to the end face of one end of the chip body 411, and the other end of the fourth wire bonding area 4191 is close to one end of the third wire bonding area 4181. The fourth wire bonding area 4191 and the third wire bonding area 4181 are arranged alternately, providing sufficient wire bonding space for the third light-emitting pad 418 and the fourth light-emitting pad 419, and fully utilizing the space at the top of one end of the chip body 411.

[0143] Figure 9E is a schematic diagram of the structure of another laser chip provided according to some embodiments of the present disclosure. As shown in Figure 12, the first light-emitting pad 414 and the second light-emitting pad 415 have the same shape, and the first light-emitting pad 414 and the second light-emitting pad 415 are arranged side by side on the top of the light-emitting area of ​​the chip body 411.

[0144] In some embodiments, the third light-emitting pad 418 and the fourth light-emitting pad 419 have the same shape and are arranged side by side on the top of the light-emitting area of ​​the chip body 411.

[0145] In some embodiments, the first light-emitting pad 414 and the fourth light-emitting pad 419 are symmetrically arranged on the top of the chip body 411.

[0146] In some embodiments, the second light-emitting pad 415 and the third light-emitting pad 418 are symmetrically arranged on the top of the chip body 411.

[0147] Figure 9F is a partial schematic diagram of a laser chip according to some embodiments of this disclosure, showing the structure of the light-emitting end of the laser chip. In some embodiments, the other end of the first modulation waveguide 4113 is the light-emitting end, used to output an optical signal. For example, the other end of the first modulation waveguide 4113 includes a first deflection portion 4113a; the first deflection portion 4113a deflects the other end of the first modulation waveguide 4113 relative to one end of the first modulation waveguide 4113, thereby deflecting the optical axis of the output optical signal of the first modulation waveguide 4113, and further, the first deflection portion 4113a tilts the optical axis of the output optical signal of the first modulation waveguide 4113 relative to the optical axis of the input light of the first modulation waveguide 4113. When an optical device is provided at the light-emitting end of the laser chip 410, a portion of the optical signal output from the first modulation waveguide 4113 will be reflected by the optical device during its transmission. The first deflection portion 4113a can prevent the reflected optical signal from entering the first modulation waveguide 4113.

[0148] In some embodiments, the deflection angle of the first deflection portion 4113a is 5-10°, such as 6-9°.

[0149] In some embodiments, the other end of the second modulation waveguide 4114 is the light-emitting end, used to output an optical signal. The other end of the second modulation waveguide 4114 includes a second deflection portion 4114a, which deflects the other end of the second modulation waveguide 4114 relative to one end of the second modulation waveguide 4114, thereby deflecting the optical axis of the output optical signal of the second modulation waveguide 4114. Consequently, the second deflection portion 4114a tilts the optical axis of the output optical signal of the second modulation waveguide 4114 relative to the optical axis of the input light of the second modulation waveguide 4114. When an optical device is provided at the light-emitting end of the laser chip 410, a portion of the optical signal output from the second modulation waveguide 4114 will be reflected by the optical device during its transmission. The second deflection portion 4114a can prevent the reflected optical signal from entering the second modulation waveguide 4114.

[0150] In some embodiments, the deflection angle of the second deflection portion 4114a is 5-10°, such as 6-9°, 7-9°, etc.

[0151] In some embodiments, the other end of the third modulation waveguide 4117 is the light-emitting end, used to output an optical signal. The other end of the third modulation waveguide 4117 includes a third deflection portion 4117a, which deflects the other end of the third modulation waveguide 4117 relative to one end of the third modulation waveguide 4117, thereby deflecting the optical axis of the output optical signal of the third modulation waveguide 4117. Furthermore, the third deflection portion 4117a tilts the optical axis of the output optical signal of the third modulation waveguide 4117 relative to the optical axis of the input light of the third modulation waveguide 4117. When an optical device is provided at the light-emitting end of the laser chip 410, a portion of the optical signal output from the third modulation waveguide 4117 will be reflected by the optical device during its transmission. The third deflection portion 4117a can prevent the reflected optical signal from entering the third modulation waveguide 4117.

[0152] In some embodiments, the deflection angle of the third modulation waveguide 4117 is 5-10°, such as 6-9°, 7-9°, etc.

[0153] In some embodiments, the other end of the fourth modulation waveguide 4118 is the light-emitting end, used to output an optical signal. The other end of the fourth modulation waveguide 4118 includes a fourth deflection portion 4118a, which deflects the other end of the fourth modulation waveguide 4118 relative to one end of the fourth modulation waveguide 4118, thereby deflecting the optical axis of the output optical signal of the fourth modulation waveguide 4118. Furthermore, the fourth deflection portion 4118a tilts the optical axis of the output optical signal of the fourth modulation waveguide 4118 relative to the optical axis of the input light of the fourth modulation waveguide 4118. When an optical device is provided at the light-emitting end of the laser chip 410, a portion of the optical signal output from the fourth modulation waveguide 4118 will be reflected by the optical device during its transmission. The fourth deflection portion 4118a can prevent the reflected optical signal from entering the fourth modulation waveguide 4118.

[0154] In some embodiments, the deflection angle of the fourth modulation waveguide 4118 is 5-10°, such as 6-9°, 7-9°, etc. Figure 10A is a schematic diagram of the structure of another laser chip according to some embodiments of the present disclosure, and Figure 10B is a front view of another laser chip according to some embodiments of the present disclosure. Figures 10A and 10B show the structure of another laser chip. As shown in Figures 10A and 10B, in some embodiments, the laser chip 410 includes a first insulating layer 4101, which is disposed on the side of the first modulation waveguide 4113 and located below the first modulation pad 412.

[0155] In some embodiments, the laser chip 410 includes a second insulating layer 4102, which is disposed on the side of the second modulation waveguide 4114 and located below the second modulation pad 413.

[0156] In some embodiments, the laser chip 410 includes a third insulating layer 4103, which is disposed on the side of the third modulation waveguide 4117 and located below the third modulation pad 416.

[0157] In some embodiments, the laser chip 410 includes a fourth insulating layer 4104, which is disposed on the side of the fourth modulation waveguide 4118 and located below the fourth modulation pad 417.

[0158] In some embodiments, the first insulating layer 4101, the second insulating layer 4102, etc., are made of materials with low dielectric constants, such as PBO, PBI, etc., to reduce the parasitic capacitance effect of the first modulation pad 412, the second modulation pad 413, etc., and improve the bandwidth of the laser chip 410.

[0159] In some embodiments, the trenches on both sides of the first light-emitting waveguide 4111 are filled with a material with a low dielectric constant, such as PBO or PBI. The first light-emitting pad 414 covers the trenches on both sides of the first light-emitting waveguide 4111.

[0160] Figure 10C is a schematic diagram of another laser chip structure without pads according to some embodiments of the present disclosure. Figure 10C shows a state in which an insulating layer or the like is provided on a laser chip.

[0161] In some embodiments, the first insulating layer 4101 includes a first insulating layer 4101a and a first insulating layer 4101b, wherein the first insulating layer 4101a is located on one side of the first modulation waveguide 4113, and the first insulating layer 4101b is disposed on the other side of the first modulation waveguide 4113. Exemplarily, the first insulating layer 4101b supports and connects to the first bonding portion 4121. However, the structure of the first insulating layer 4101 is not limited to this in the embodiments of this disclosure.

[0162] In some embodiments, the second insulating layer 4102 includes a second insulating layer 4102a and a second insulating layer 4102b, with the second insulating layer 4102a located on one side of the second modulation waveguide 4114 and the second insulating layer 4102b disposed on the other side of the second modulation waveguide 4114. Exemplarily, the second insulating layer 4102a supports and connects to the second bonding portion 4131. However, the structure of the second insulating layer 4102 is not limited to this in the embodiments of this disclosure.

[0163] In some embodiments, the third insulating layer 4103 includes a third insulating layer 4103a and a third insulating layer 4103b, with the third insulating layer 4103a located on one side of the third modulation waveguide 4117 and the third insulating layer 4103b disposed on the other side of the third modulation waveguide 4117. Exemplarily, the third insulating layer 4103b supports and connects to the third bonding portion 4161. However, the structure of the third insulating layer 4103 is not limited to this in the embodiments of this disclosure.

[0164] In some embodiments, the fourth insulating layer 4104 includes a fourth insulating layer 4104a and a fourth insulating layer 4104b, with the fourth insulating layer 4104a located on one side of the fourth modulation waveguide 4118 and the fourth insulating layer 4104b disposed on the other side of the fourth modulation waveguide 4118. Exemplarily, the fourth insulating layer 4104a supports and connects to the fourth bonding portion 4131. However, the structure of the fourth insulating layer 4104 is not limited to this in the embodiments of this disclosure.

[0165] Figure 10D is a cross-sectional view of another laser chip according to some embodiments of the present disclosure, and Figure 10E is a cross-sectional view of another laser chip according to some embodiments of the present disclosure. Figures 10D and 10E show the cross-sectional structure of a laser chip in the modulation region. As shown in Figures 10D and 10E, in some embodiments, the etching depths of the first modulation waveguide 4113 and the second modulation waveguide 4114 extend through the quantum hydrazine layer, etc.

[0166] In some embodiments, the bottom of the first insulating layer 4101, etc., is lower than the bottom of the side trench of the first modulation waveguide 4113, etc.

[0167] Figure 10F is a cross-sectional view three of another laser chip according to some embodiments of the present disclosure, and Figure 10G is a cross-sectional view four of another laser chip according to some embodiments of the present disclosure. Figures 10F and 10G show the cross-sectional structure of a laser chip in the light-emitting region. As shown in Figures 10F and 10G, the etching depth of the first light-emitting waveguide 4111 and the second light-emitting waveguide 4112, etc., does not penetrate the quantum hydrazine layer, that is, the etching depth of the first light-emitting waveguide 4111 and the second light-emitting waveguide 4112, etc., is located above the quantum hydrazine layer.

[0168] Figure 10H is a partial schematic diagram of another laser chip according to some embodiments of the present disclosure, and Figure 10I is a partial schematic diagram of another laser chip according to some embodiments of the present disclosure. Figures 10H and 10I show the morphology of a connection region between a light-emitting waveguide and a modulation waveguide. As shown in Figures 10H and 10I, the chip body 411 includes a first connecting waveguide 4110. One end of the first connecting waveguide 4110 is connected to the output terminal of the first light-emitting waveguide 4111, and the other end of the first connecting waveguide 4110 is connected to the input terminal of the first modulation waveguide 4113. The first connecting waveguide 4110 is used for the transition from the first light-emitting waveguide 4111 to the first modulation waveguide 4113, so as to ensure the coupling efficiency of the output light from the first light-emitting waveguide 4111 to the first modulation waveguide 4113.

[0169] In some embodiments, the first connecting waveguide 4110 includes a first tapered portion 4110a and a second tapered portion 4110b. The width of one end of the first tapered portion 4110a is smaller than the width of the other end, and the width of one end of the second tapered portion 4110b is larger than the width of the other end. One end of the first tapered portion 4110a is connected to the output terminal of the first light-emitting waveguide 4111, and the other end of the first tapered portion 4110a is connected to one end of the second tapered portion 4110b. The other end of the second tapered portion 4110b is connected to the input terminal of the first modulation waveguide 4113. However, the structure of the first connecting waveguide 4110 in this embodiment is not limited to this.

[0170] In some embodiments, the chip body 411 includes a first gradient groove 411a and a second gradient groove 411b, which are located within a groove on the side of the first connecting waveguide 4110. For example, the first gradient groove 411a is disposed on one side of the first connecting waveguide 4110, and the second gradient groove 411b is disposed on the other side of the first connecting waveguide 4110.

[0171] In some embodiments, the width of one end of the first gradient groove 411a is smaller than the width of the other end of the first gradient groove 411a. For example, the other end of the first gradient groove 411a extends to the side of the first gradient portion 4110a.

[0172] In some embodiments, the width of one end of the second gradient groove 411b is smaller than the width of the other end of the second gradient groove 411b. For example, the other end of the second gradient groove 411b extends to the side of the first gradient portion 4110a.

[0173] In some embodiments, connecting portions may be provided between the second light-emitting waveguide 4112 and the second modulation waveguide 4114, or between the third light-emitting waveguide 4115 and the third modulation waveguide 4117, etc. The shape of the connecting portion can be referred to the shape of the first connecting waveguide 4110. A gradient groove may be provided on the side of the connecting portion, and the shape of the gradient groove can be referred to the shape of the first gradient groove 411a or the second gradient groove 411b.

[0174] Figure 11A is a schematic diagram of the structure of a second substrate according to some embodiments of the present disclosure, Figure 11B is a schematic diagram of the structure of a second substrate according to some embodiments of the present disclosure, and Figure 11C is an enlarged view of point a in Figure 11B. The second substrate 420 includes a substrate body 421, and a circuit pattern is provided on the surface of the substrate body 421. The substrate body 421 is a ceramic substrate body.

[0175] In some embodiments, an electrical connection area 422 is provided on the top surface of the substrate body 421, and the electrical connection area 422 is used to mount and connect the laser chip 410.

[0176] In some embodiments, the substrate body 421 includes a first side 4211 and a second side 4212, wherein the first side 4211 is located at one end of the substrate body 421, and the second side 4212 is located at the other end of the substrate body 421. One end of the electrical connection region 422 is spaced apart from one end of the substrate body 421, and the other end of the electrical connection region 422 is close to the end face of the other end of the substrate body 421. One end of the electrical connection region 422 is spaced apart from the first side 4211, and the other end of the electrical connection region 422 is close to the second side 4212.

[0177] In some embodiments, a solder mask bridge may be provided at the edge of the electrical connection area 422 to prevent solder flow during the process of soldering the laser chip 410 to the electrical connection area 422.

[0178] In some embodiments, a first high-frequency line 423 and a second high-frequency line 424 are disposed on the top surface of the substrate body 421, and the first end of the first high-frequency line 423 and the first end of the second high-frequency line 424 are located on one side of the electrical connection region 422. For example, the first end of the first high-frequency line 423 and the first end of the second high-frequency line 424 are disposed side by side on one side of the electrical connection region 422 and are as close as possible to the side of the electrical connection region 422.

[0179] In some embodiments, the second end of the first high-frequency line 423 and the second end of the second high-frequency line 424 are located at the top of the second side edge of the substrate body 421. The first end of the first high-frequency line 423 is smoothly connected to the second end of the first high-frequency line 423, and the first end of the second high-frequency line 424 is smoothly connected to the second end of the second high-frequency line 424.

[0180] In some embodiments, the second end of the first high-frequency line 423 and the second end of the second high-frequency line 424 are located at the top of one side edge of the substrate body 421. The first end of the first high-frequency line 423 is smoothly connected to the second end of the first high-frequency line 423, and the first end of the second high-frequency line 424 is smoothly connected to the second end of the second high-frequency line 424.

[0181] In some embodiments, a third high-frequency line 425 and a fourth high-frequency line 426 are disposed on the top surface of the substrate body 421, with the first ends of the third high-frequency line 425 and the fourth high-frequency line 426 located on the other side of the electrical connection region 422. For example, the first ends of the third high-frequency line 425 and the fourth high-frequency line 426 are disposed side-by-side on the other side of the electrical connection region 422, and are as close as possible to the side of the electrical connection region 422.

[0182] In some embodiments, the second end of the third high-frequency line 425 and the second end of the fourth high-frequency line 426 are located at the top of the second side edge of the substrate body 421. The second end of the third high-frequency line 425 is smoothly connected to the first end of the third high-frequency line 425, and the second end of the fourth high-frequency line 426 is smoothly connected to the first end of the fourth high-frequency line 426.

[0183] In some embodiments, the second end of the third high-frequency line 425 and the second end of the fourth high-frequency line 426 are located at the top of the other edge of the substrate body 421. The second end of the third high-frequency line 425 is smoothly connected to the first end of the third high-frequency line 425, and the second end of the fourth high-frequency line 426 is smoothly connected to the first end of the fourth high-frequency line 426.

[0184] In some embodiments, a ground layer 427 is provided on the top surface of the substrate body 421. The ground layer 427 is connected to the electrical connection region 422. The ground layer 427 surrounds the side of the first high-frequency line 423 and the like and is insulated from the first high-frequency line 423 and the like. In some embodiments, the ground layer 427 extends to the side or bottom surface of the substrate body.

[0185] In some embodiments, a first output pad 431 is provided on the top surface of the substrate body 421, and the first output pad 431 is disposed on the side of the first end of the first high-frequency line 423. Exemplarily, a first thin-film resistor 4311 is provided on the edge of the first output pad 431, one end of the first thin-film resistor 4311 is electrically connected to the first output pad 431, and the other end of the first thin-film resistor 4311 is electrically connected to the ground layer 427. The first thin-film resistor 4311 serves as a matching resistor for the first modulation output circuit. Of course, in this embodiment, the matching resistor for the first modulation output circuit is not limited to the first thin-film resistor 4311, and other types of resistors can also be used.

[0186] In some embodiments, a second output pad 432 is disposed on the top surface of the substrate body 421, and the second output pad 432 is disposed on the side of the first end of the second high-frequency line 424. Exemplarily, a second thin-film resistor 4321 is disposed on the edge of the second output pad 432, one end of the second thin-film resistor 4321 is electrically connected to the second output pad 432, and the other end of the second thin-film resistor 4321 is electrically connected to the ground layer 427. The second thin-film resistor 4321 serves as a matching resistor for the second modulation output circuit. Of course, in this embodiment, the matching resistor for the second modulation output circuit is not limited to the second thin-film resistor 4321, and other types of resistors can also be used.

[0187] In some embodiments, the first output pad 431 and the second output pad 432 are close to the electrical connection area 422. The first output pad 431 is located on the side of the first end of the first high-frequency line 423 and away from the first end of the second high-frequency line 424. The second output pad 432 is located on the side of the first end of the second high-frequency line 424 and away from the first end of the first high-frequency line 423. The first end of the first high-frequency line 423 and the first end of the second high-frequency line 424 are close to each other.

[0188] In some embodiments, a third output pad 433 is provided on the top surface of the substrate body 421, and the third output pad 433 is disposed on the side of the first end of the third high-frequency line 425. Exemplarily, a third thin-film resistor 4331 is provided on the edge of the third output pad 433, one end of the third thin-film resistor 4331 is electrically connected to the third output pad 433, and the other end of the third thin-film resistor 4331 is electrically connected to the ground layer 427. The third thin-film resistor 4331 serves as a matching resistor for the third modulation output circuit. Of course, in this embodiment, the matching resistor for the third modulation output circuit is not limited to the third thin-film resistor 4331, and other types of resistors can also be used.

[0189] In some embodiments, a fourth output pad 434 is disposed on the top surface of the substrate body 421, and the fourth output pad 434 is disposed on the side of the first end of the fourth high-frequency line 426. Exemplarily, a fourth thin-film resistor 4341 is disposed on the edge of the fourth output pad 434, one end of the fourth thin-film resistor 4341 is electrically connected to the fourth output pad 434, and the other end of the fourth thin-film resistor 4341 is electrically connected to the ground layer 427. The fourth thin-film resistor 4341 serves as a matching resistor for the fourth modulation output circuit. Of course, in this embodiment, the matching resistor for the fourth modulation output circuit is not limited to the fourth thin-film resistor 4341, and other types of resistors can also be used.

[0190] In some embodiments, the third output pad 433 and the fourth output pad 434 are close to the electrical connection area 422. The third output pad 433 is located on the side of the first end of the third high-frequency line 425 and away from the first end of the fourth high-frequency line 426. The fourth output pad 434 is located on the side of the first end of the fourth high-frequency line 426 and away from the first end of the third high-frequency line 425. The first ends of the third high-frequency line 425 and the first ends of the fourth high-frequency line 426 are close to each other.

[0191] In some implementations, the second output pad 432 is located at the edge of the other end of the substrate body 421, and the third output pad 433 is located at the edge of the other end of the substrate body 421.

[0192] In some embodiments, a first LD pad 435 is provided on the top surface of the substrate body 421, and the first LD pad 435 is located between the second end of the first high-frequency line 423 and the second end of the second high-frequency line 424.

[0193] In some embodiments, a second LD pad 436 is provided on the top surface of the substrate body 421, and the second LD pad 436 is located between the second end of the first high-frequency line 423 and the second end of the fourth high-frequency line 426.

[0194] In some embodiments, a third LD pad 437 is provided on the top surface of the substrate body 421, and the third LD pad 437 is located between the second end of the first high-frequency line 423 and the second end of the fourth high-frequency line 426.

[0195] In some embodiments, a fourth LD pad 438 is provided on the top surface of the substrate body 421, and the fourth LD pad 438 is located between the second end of the third high-frequency line 425 and the second end of the fourth high-frequency line 426.

[0196] In some embodiments, the second LD pad 436 and the third LD pad 437 are arranged side by side on one side of the electrical connection area 422.

[0197] Figure 12 is a schematic diagram of the electrical connection between a laser chip and a second substrate according to some embodiments of the present disclosure. A first modulation pad 412 is wire-connected to the first end of a first high-frequency line 423, a first output pad 431 is wire-connected to the first light-emitting pad 414 is wire-connected to a first LD pad 435. Exemplarily, the two wires connecting the first modulation pad 412 extend from the first modulation pad 412 toward the same side of the chip body 411. A second modulation pad 413 is wire-connected to the first end of a second high-frequency line 424, a second output pad 432 is wire-connected to the second light-emitting pad 415 is wire-connected to a second LD pad 436. Exemplarily, the two wires connecting the second modulation pad 413 extend from the second modulation pad 413 toward the same side of the chip body 411. The third modulation pad 416 is wired to the first end of the third high-frequency line 425, the third modulation pad 416 is wired to the third output pad 433, and the third light-emitting pad 418 is wired to the third LD pad 437. For example, the two wires connecting the third modulation pad 416 extend from the third modulation pad 416 to the same side of the chip body 411. The fourth modulation pad 417 is wired to the first end of the fourth high-frequency line 426, the fourth modulation pad 417 is wired to the fourth output pad 434, and the fourth light-emitting pad 419 is wired to the fourth LD pad 438. For example, the two wires connecting the fourth modulation pad 417 extend from the fourth modulation pad 417 to the same side of the chip body 411.

[0198] In the laser component 400a provided in this embodiment, the first modulation pad 412, the second modulation pad 413, the third modulation pad 416, and the fourth modulation pad 417 are all close to the edge of the laser chip 410 and are equidistant. Combined with the fact that the first ends of the first high-frequency line 423, the second high-frequency line 424, the third high-frequency line 425, and the fourth high-frequency line 426 on the second substrate 420 are located at the edge of the electrical connection area 422 and close to it, the wire bonding lengths of the first ends of the first high-frequency line 423 and the first modulation pad 412, the first ends of the second high-frequency line 424 and the second modulation pad 413, the first ends of the third high-frequency line 425 and the third modulation pad 416, and the first ends of the fourth high-frequency line 426 and the fourth modulation pad 417 can be effectively controlled to manage the parasitic inductance of the wire bonding. This ensures uniform high-frequency performance of the four channels on the laser component 400a, enabling the generation of four light signals. Therefore, the laser component 400a provided in this embodiment of the present disclosure is convenient to meet the requirements of optical module integration for multi-channel optical signal transmission.

[0199] In some embodiments, the length of each wire in the laser assembly 400a can be controlled to be around 260μm, such as 250-300μm.

[0200] In some embodiments, the light-emitting end of the laser chip 410 extends beyond the edge of the second side 4212, meaning that the light-emitting end of the laser chip 410 is not flush with the other end of the substrate body 421. The extension of the light-emitting end of the laser chip 410 to the second side 4212 facilitates the assembly of optical devices and the like at the light-emitting end of the laser chip 410. For example, the first deflection portion 4113a, etc., is located outside the substrate body 421.

[0201] In some embodiments, a first capacitor 430 is disposed on a first LD pad 435, a second capacitor 440 is disposed on a second LD pad 436, a third capacitor 450 is disposed on a third LD pad 437, and a fourth capacitor 460 is disposed on a fourth LD pad 438. The first capacitor 430 is wired to a first wire bonding area 4141 and a circuit board 300, the second capacitor 440 is wired to a second wire bonding area 4151 and a circuit board 300, the third capacitor 450 is wired to a third wire bonding area 4181 and a circuit board 300, and the fourth capacitor 460 is wired to a fourth wire bonding area 4191 and a circuit board 300.

[0202] Figure 13A is a schematic diagram of the electrical connection between a laser chip and a second substrate according to some embodiments of the present disclosure; Figure 13B is a schematic diagram of the electrical connection between a laser chip and a second substrate according to some embodiments of the present disclosure. As shown in Figures 13A and 13B, in some embodiments, the light-emitting end of the laser chip 410 extends beyond the edge of the second side 4212, that is, the light-emitting end of the laser chip 410 is not flush with the other end of the substrate body 421. The light-emitting end of the laser chip 410 extending beyond the second side 4212 facilitates the assembly of optical devices, etc., at the light-emitting end of the laser chip 410. For example, the first deflection portion 4113a, etc., is located outside the substrate body 421.

[0203] Figure 14A is a partial schematic diagram of a light emitting component according to some embodiments of this disclosure, and Figure 14B is an enlarged view of point b in Figure 14A. Figures 14A and 14B illustrate the assembly relationship between a laser component and a first fiber optic mounting base. As shown in Figures 14A and 14B, in some embodiments, the first fiber optic mounting base 820 is disposed on the light-emitting side of the laser component 400a. A gap exists between the light-incident end face of the first fiber optic mounting base 820 and the light-emitting end face of the laser chip 410. A matching layer 470 is formed within the gap. One side of the matching layer 470 is connected to the light-incident end face of the first fiber optic mounting base 820, and the other side of the matching layer 470 is connected to the light-emitting end face of the laser chip 410. The optical signal generated by the laser chip 410 is transmitted to the matching layer 470 and then to the first fiber optic mounting base 820, allowing the optical signal generated by the laser chip 410 to be directly transmitted to the optical fiber of the first fiber array 810 through the matching layer 470, thus shortening the distance from the output optical signal of the laser chip 410 to the end face of the optical fiber. The gap width is 2-10 μm, and the matching layer 470 thickness is 2-10 μm. For example, the gap width is 3-5 μm, and the matching layer 470 thickness is 3-5 μm. The matching layer 470 is used to reduce reflection at the light-incident end face of the first fiber optic mount 820.

[0204] The refractive index of the matching layer 470 is similar to or equal to the refractive index of the optical fiber in the first fiber array 810, so as to control the transmission direction of the output optical signal of the laser chip 410. For example, the refractive index of the matching layer 470 is equal to the refractive index of the optical fiber in the first fiber array 810. For instance, if the refractive index n3 of the optical fiber in the first fiber array 810 is 1.46, the refractive index n2 of the matching layer 470 is also 1.46. Thus, no refraction occurs at the interface between the matching layer 470 and the optical fiber, enabling the optical signal to be coupled into the optical fiber with high efficiency.

[0205] In some embodiments, the light-emitting end face of the laser chip 410 is parallel to the light-incident end face of the first optical fiber holder 820.

[0206] In some embodiments, the optical fiber in the first optical fiber array 810 includes an optical fiber core 811, the end of which may be located within the first optical fiber mounting base 820. The light-incident end face of the optical fiber core 811 extends out of the light-incident end face of the first optical fiber mounting base 820, and the light-incident end face of the optical fiber core 811 is located on the output optical path of the modulation waveguide.

[0207] In some embodiments, the angle between the normal of the light-emitting end face of the laser chip 410 and the modulation waveguide is a first preset angle θ1. θ1 is not 0°, and θ1 can be 5-10°, such as θ1 being 6°. When θ1 is less than 5°, the anti-emission capability of the light-emitting end face of the laser chip 410 is weakened; when θ1 is greater than 10°, the coupling efficiency of the optical signal from the laser chip 410 to the first fiber optic mounting base 820 is low, and it is easy to cause an increase in the size of the transmitting housing 401.

[0208] In some embodiments, the central axis of the optical fiber core 811 is not perpendicular to the light-incident end face of the first optical fiber holder 820, so that the central axis of the optical fiber core 811 is not parallel to the normal of the light-incident end face of the first optical fiber holder 820. For example, the angle between the normal of the light-incident end face of the first optical fiber holder 820 and the central axis of the optical fiber core 811 is a second preset angle θ3. θ3 is not 0°; θ3 can be 5-15°, such as θ3 being 13.3°. When θ3 is less than 5°, the anti-reflection capability of the light-incident end face of the first optical fiber holder 820 is reduced; when θ3 is greater than 15°, the coupling efficiency of the optical signal from the laser chip 410 to the first optical fiber holder 820 is reduced, and it easily leads to an increase in the size of the transmitting housing 401.

[0209] In some embodiments, the angle between the normal of the light-emitting end face of the laser chip 410 and the modulation waveguide, the refractive index of the modulation waveguide in the laser chip 410 and the refractive index of the matching layer 470, etc., can be designed to be the angle between the normal of the light-incident end face of the first optical fiber holder 820 and the central axis of the optical fiber core 811.

[0210] In some embodiments, the refractive index n1 of the modulation waveguide in the laser chip 410 is 3.27, the angle θ1 between the normal of the output end face of the laser chip 410 and the modulation waveguide is 6°, and the refractive index n2 of the matching layer 470 is 1.46. According to n1*sinθ1=n2*sinθ2, θ2=13.3°. When the angle θ3 between the normal of the input end face of the first fiber optic mount 820 and the central axis of the fiber core 811 is 13.3°, since n3=n2, the optical signal is incident into the fiber core 811 along the central axis of the fiber core 811. This can both prevent the optical signal reflected along the fiber core 811 from returning along the incident optical path and ensure the coupling efficiency of the optical signal to the fiber core 811.

[0211] In some embodiments, the spacing between adjacent modulation waveguides in the laser chip 410 is d1, and the spacing between adjacent fiber cores 811 in the first fiber optic mounting base 820 is d2, where d1 is greater than d2. For example, d1 is greater than 80 μm, and d2 is greater than 80 μm. In some embodiments, d1 is 120-150 μm, and d2 is greater than 125 μm; for example, d1 is 130 μm, and d2 is 127 μm, etc.

[0212] In some embodiments, an antireflection coating 480 is formed on the light-emitting surface of the laser chip 410, and the antireflection coating 480 is connected to the matching layer 470. The antireflection coating 480 reduces reflection at the light-emitting surface of the laser chip 410, thereby improving the coupling efficiency of the output optical signal from the laser chip 410 to the fiber core 811. The refractive index of the antireflection coating 480 is similar to or equal to the refractive index of the matching layer 470. For example, the refractive index of the antireflection coating 480 is equal to the refractive index of the matching layer 470, where the refractive index n2 of the matching layer 470 is 1.46, and the refractive index of the antireflection coating 480 is also 1.46.

[0213] In some embodiments, the mode field diameter of the modulation waveguide in the laser chip 410 is 6 μm. For example, a mode field converter is disposed on the modulation waveguide in the laser chip 410 to convert the mode field of the modulation waveguide. For instance, the mode field diameter of the modulation waveguide can be converted from 2 μm to 6 μm.

[0214] Figure 14C is an enlarged view of section c in Figure 14A. As shown in Figure 14C, the fiber core 811 includes a coupling portion 811a, a first connecting portion 811b, and a transition portion 811c. One end of the first connecting portion 811b is connected to the optical fiber in the first optical fiber array 810, and the other end of the first connecting portion 811b is connected to one end of the transition portion 811c. One end of the coupling portion 811a is connected to the other end of the transition portion 811c, and the other end of the coupling portion 811a extends to the light-incident end face of the first optical fiber holder 820. The coupling portion 811a is used for optical coupling connection to the laser chip 410. The mode field of the first connecting portion 811b is larger than that of the coupling portion 811a. The first connecting portion 811b is connected to the coupling portion 811a through the transition portion 811c, so that the mode field conversion from the coupling portion 811a to the first connecting portion 811b is realized through the transition portion 811c. The transition section 811c can achieve a smooth transition of the mode field from the coupling section 811a to the first connection section 811b, which helps to reduce the loss of optical signal from the coupling section 811a to the first connection section 811b.

[0215] In some embodiments, the mode field diameter of the coupling portion 811a is 6 μm, and the mode field diameter of the first connecting portion 811b is 9 μm. The mode field of the coupling portion 811a is consistent with the output mode field of the laser chip 410, and the mode field of the first connecting portion 811b is consistent with the mode field of the optical fiber in the first optical fiber array 810, so as to facilitate the adaptation of the first optical fiber array 810 to the laser chip 410 and ensure the coupling efficiency of the output optical signal of the laser chip 410 to the first optical fiber array 810.

[0216] In some embodiments, the end of the coupling portion 811a is connected to the end of the first connecting portion 811b, and the transition portion 811c is formed by tapered fiber bonding.

[0217] Figure 14D is an enlarged view of point d in Figure 14A. As shown in Figure 14D, in some embodiments, the optical fiber core 811 may include a second connecting portion 811d. One end of the second connecting portion 811d is connected to the optical fiber in the first optical fiber array 810, and the other end of the second connecting portion 811d is connected to the first connecting portion 811b. The spacing between adjacent second connecting portions 811d is greater than the spacing between adjacent first connecting portions 811b. The second connecting portions 811d are used to adjust the spacing between adjacent optical fiber cores 811, facilitating the adaptation of the coupling portion 811a to the laser chip 410 and ensuring the coupling efficiency of the optical signal generated by the laser chip 410 to the first optical fiber array 810.

[0218] Figure 15A is a schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure, and Figure 15B is a schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure. As shown in Figures 15A and 15B, the light emitting component 400 is assembled and connected to the through hole 301. Exemplarily, the light emitting component 400 is embedded in the through hole 301, with the top of the light emitting component 400 located above the through hole 301 and the bottom of the light emitting component 400 located below the through hole 301, such that the top of the light emitting component 400 is higher than the top surface of the circuit board 300 and the bottom of the light emitting component 400 is lower than the back surface of the circuit board 300.

[0219] In some embodiments, the light receiving component 500 includes a first light receiving component 510 and a second light receiving component 520, which may be disposed on the back side of the circuit board 300. The first light receiving component 510 and the second light receiving component 520 are respectively used to receive externally input optical signals. Of course, in some embodiments, the first light receiving component 510 and the second light receiving component 520 may be disposed on the top surface of the circuit board 300.

[0220] In some embodiments, the first light receiving component 510 is located on one side of the light emitting component 400 near the end of the gold finger 310, and the second light receiving component 520 is located on the other side of the light emitting component 400 near the end of the gold finger 310. For example, the first light receiving component 510 is located on one edge of the circuit board 300, and the second light receiving component 520 is located on the other edge of the circuit board 300.

[0221] In some embodiments, the optical transmission component 800 may include a first fiber array 810 and a second fiber array 830, which are connected to the optical emitting component 400. The optical signal generated by the optical emitting component 400 is transmitted to the optical fiber adapter 700 through the first fiber array 810 and the second fiber array 830.

[0222] In some embodiments, the optical transmission component 800 may include a third fiber array 850 and a fourth fiber array 860. The third fiber array 850 is connected to the first optical receiving component 510, and the fourth fiber array 860 is connected to the second optical receiving component 520. The third fiber array 850 transmits the received optical signal input through the fiber optic adapter 700 to the first optical receiving component 510, and the fourth fiber array 860 transmits the received optical signal input through the fiber optic adapter 700 to the second optical receiving component 520.

[0223] Figure 16A is a schematic diagram of another optical emitting component according to some embodiments of the present disclosure, and Figure 16B is a partially exploded schematic diagram of an optical module according to some embodiments of the present disclosure. As shown in Figures 16A and 16B, in some embodiments, a first notch 4011 and a third notch 4015 may be formed on the side plate at the left end of the emitting housing 401, and the first notch 4011 and the third notch 4015 communicate with the inner cavity of the emitting housing 401. A first optical fiber array 810 passes through the first notch 4011, so that the end of the first optical fiber array 810 extends into the inner cavity of the emitting housing 401. A second optical fiber array 830 passes through the third notch 4015, so that the end of the second optical fiber array 830 extends into the inner cavity of the emitting housing 401.

[0224] In some embodiments, a laser component 400b may be disposed within the emitting housing 401. The laser component 400b may be disposed within the emitting housing 401 shown in FIG. 16A, and the laser component 400b is located at the edge of the second notch 4012 with its edge close to the edge of the circuit board 300. The laser component 400b is located on the side of the laser component 400a. The structure of the laser component 400b is the same as that of the laser component 400a. Of course, in this embodiment of the present disclosure, the laser component 400b is not limited to being disposed in the emitting housing 401, but may also be disposed on the circuit board 300 or a support plate. In some embodiments, the laser component 400b may also be disposed on a TO tube socket.

[0225] In some embodiments, a second fiber optic mounting base 840 is provided at the end of the second fiber optic array 830. The end of the second fiber optic array 830 is embedded in the second fiber optic mounting base 840. The second fiber optic mounting base 840 covers the end of the optical fiber in the second fiber optic array 830 and exposes the light-incident end face of the optical fiber in the second fiber optic array 830 on the light-incident surface of the second fiber optic mounting base 840. The light-incident end face of the second fiber optic mounting base 840 is close to the light-outcident end face of the laser component 400b, which facilitates the coupling of the optical signal generated by the laser component 400b to the optical fiber in the second fiber optic array 830. The assembly of the second fiber optic mounting base 840 with the laser component 400b and the arrangement of the optical cores within the second fiber optic mounting base 840 can be found in the above description of the first fiber optic mounting base 820.

[0226] In some embodiments, the light emitting component 400 may include a second substrate 404 disposed on the bottom plate of the emitting housing 401. A laser component 400b may be disposed on the second substrate 404, such that the second substrate 404 supports and connects to the laser component 400b. The second substrate 404 can be used to adjust the relative height between the top surface of the laser component 400b and the top surface of the circuit board 300. A second fiber optic bracket 840 may be disposed on the second substrate 404 to adjust the relative height between the second fiber optic bracket 840 and the laser component 400b.

[0227] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, wherein, include: Circuit board; An optical transmission component includes an optical fiber and a first optical fiber holder, wherein the first optical fiber holder is connected to the end of the optical fiber, and the light-incident end face of the optical fiber is exposed on the light-incident surface of the first optical fiber holder. The light emitting component includes a laser assembly located at the edge of the light-emitting end of the first optical fiber holder; a gap is formed between the light-emitting end face of the laser assembly and the light-emitting end of the first optical fiber holder, and a matching layer is disposed within the gap; one side of the matching layer is connected to the first optical fiber holder, and the other side is connected to the laser assembly. The laser component includes: A second substrate is located at the edge of the circuit board and is electrically connected to the circuit board. A laser chip is disposed on and electrically connected to the second substrate; a modulation waveguide is formed at the light-emitting end of the laser chip; the modulation waveguide includes a deflection portion, and the angle between the central axis of the deflection portion and the normal of the light-emitting end face of the laser chip is a first preset angle, which is not 0°; The optical signal output by the laser chip is transmitted to the matching layer and then to the optical fiber via the matching layer; The laser chip includes: The chip body includes a first modulation waveguide and a second modulation waveguide arranged side by side, with a gap between the first modulation waveguide and the second modulation waveguide; The first modulation pad is disposed above the first modulation waveguide and extends to the top of the first modulation waveguide; The second modulation pad is disposed above the second modulation waveguide and extends to the top of the second modulation waveguide; The first modulation pad includes a first bonding portion, and the second modulation pad includes a second bonding portion. The first bonding portion and the second bonding portion are arranged side by side at the top of the space between the first modulation waveguide and the second modulation waveguide.

2. The optical module according to claim 1, wherein, The fiber has an optical fiber core at its end; the first optical fiber holder encloses the optical fiber core, and the light-incident end face of the optical fiber core is connected to the matching layer; The optical fiber core includes a coupling section, and the light-incident end face of the coupling section is optically coupled to the deflection section; the angle between the central axis of the coupling section and the normal of the light-incident surface of the first optical fiber holder is a second preset angle, which is not 0°; the refractive index of the matching layer is similar to that of the coupling section.

3. The optical module according to claim 1, wherein, The laser chip includes: The chip body also includes a third modulation waveguide and a fourth modulation waveguide arranged side by side with the first modulation waveguide and the second modulation waveguide at the light-emitting end; the light-emitting ends of the first modulation waveguide, the second modulation waveguide, the third modulation waveguide and the fourth modulation waveguide are all formed with deflection portions; The third modulation pad is disposed above the third modulation waveguide and extends to the top of the third modulation waveguide; A fourth modulation pad is disposed above the fourth modulation waveguide and extends to the top of the fourth modulation waveguide; The third modulation pad includes a third wire bonding section, and the fourth modulation pad includes a fourth wire bonding section; the third wire bonding section and the fourth wire bonding section are arranged side by side on the top of the space between the third modulation waveguide and the fourth modulation waveguide.

4. The optical module according to claim 1, wherein the optical transmission component comprises a plurality of optical fibers, each optical fiber having an optical fiber core formed at its end, and the optical fiber core further comprises a second connecting portion, a first connecting portion, a transition portion, and a coupling portion connected in sequence; the spacing between adjacent second connecting portions is greater than the spacing between adjacent first connecting portions; The transition section connects the first connecting section and the coupling section. The mold field diameter of the first connecting section is larger than that of the coupling section. The transition section is used for the transition of the mold field diameter from the first connecting section to the coupling section.

5. The optical module according to claim 1, wherein, The light emitting component includes an emitting housing and a first substrate, the first substrate being disposed inside the emitting housing, and the first substrate supporting and connecting the laser assembly and the first optical fiber holder; A first notch is formed on the transmitting housing, and the first optical fiber array passes through the first notch.

6. The optical module according to claim 1, wherein, An antireflection coating is formed on the light-emitting end face of the laser chip, and the refractive index of the antireflection coating is similar to that of the optical fiber; the refractive index of the matching layer is similar to that of the optical fiber.

7. The optical module according to claim 3, wherein, The chip body includes a first light-emitting waveguide, a second light-emitting waveguide, a third light-emitting waveguide, and a fourth light-emitting waveguide arranged side by side in sequence; the light-emitting end of the first light-emitting waveguide is connected to the light-input end of the first modulation waveguide, the light-emitting end of the second light-emitting waveguide is connected to the light-input end of the second modulation waveguide, the light-emitting end of the third light-emitting waveguide is connected to the light-input end of the third modulation waveguide, and the light-emitting end of the fourth light-emitting waveguide is connected to the light-input end of the fourth modulation waveguide. The laser chip includes: The first light-emitting pad is disposed above the first light-emitting waveguide; the first light-emitting pad includes a first wire bonding area, one end of which is close to the end face of the chip body. The second light-emitting pad is disposed above the second light-emitting waveguide; the second light-emitting pad includes a second wire bonding area, one end of the second wire bonding area being close to the other end of the first wire bonding area; The third light-emitting pad is disposed above the third light-emitting waveguide; the third light-emitting pad includes a third wire bonding area, which is located on the side of the second wire bonding area; A fourth light-emitting pad is disposed above the fourth light-emitting waveguide; the fourth light-emitting pad includes a fourth wire bonding area, one end of which is close to the end face of the chip body and the other end is close to one end of the third wire bonding area.

8. An optical module, wherein, include: The circuit board has through holes; An optical transmission component includes a first optical fiber array, a first optical fiber mount, a second optical fiber array, and a second optical fiber mount; the first optical fiber mount is connected to the end of the first optical fiber array, and the light-incident end face of the first optical fiber array is exposed on the light-incident surface of the first optical fiber mount. The second fiber optic bracket is connected to the end of the second fiber optic array, and the light-incident end face of the second fiber optic array is exposed on the light-incident surface of the second fiber optic bracket. An optical emitting component includes an emitting housing and two laser components disposed within the emitting housing. The emitting housing is embedded with a connecting through hole. A first optical fiber holder and a second optical fiber holder are located within the emitting housing. The light-emitting end faces of the two laser components form gaps with the light-incident surfaces of the first and second optical fiber holders, respectively. A matching layer is disposed within each gap. One side of the matching layer is connected to the optical fiber holder, and the other side is connected to the laser component. The first optical receiving component is located on one side of the optical emitting component; The second light receiving component is located on the other side of the light emitting component; The laser component includes: A second substrate is disposed within the transmitter housing and located at the edge of the circuit board; the second substrate is electrically connected to the circuit board. A laser chip is disposed on and electrically connected to the second substrate; multiple modulation waveguides are formed side by side at the light-emitting end of the laser chip to output multiple optical signals; the modulation waveguide includes a deflection portion, and the angle between the central axis of the deflection portion and the normal of the light-emitting end face of the laser chip is a first preset angle, which is not 0; the optical signals output by the laser chip are transmitted to a matching layer and then transmitted to the corresponding optical fiber array through the matching layer.

9. The optical module according to claim 8, wherein, The laser chip includes: The chip body includes a first light-emitting waveguide, a second light-emitting waveguide, a third light-emitting waveguide, and a fourth light-emitting waveguide arranged side by side, as well as a first modulation waveguide, a second modulation waveguide, a third modulation waveguide, and a fourth modulation waveguide arranged side by side; the output terminal of the first light-emitting waveguide is connected to the input terminal of the first modulation waveguide, the output terminal of the second light-emitting waveguide is connected to the input terminal of the second modulation waveguide, the output terminal of the third light-emitting waveguide is connected to the input terminal of the third modulation waveguide, and the output terminal of the fourth light-emitting waveguide is connected to the input terminal of the fourth modulation waveguide; The first modulation pad is disposed above the first modulation waveguide and extends to the top of the first modulation waveguide; The second modulation pad is disposed above the second modulation waveguide and extends to the top of the second modulation waveguide; The third modulation pad is disposed above the third modulation waveguide and extends to the top of the third modulation waveguide; A fourth modulation pad is disposed above the fourth modulation waveguide and extends to the top of the fourth modulation waveguide; The first light-emitting pad is disposed above the first light-emitting waveguide; The second light-emitting pad is disposed above the second light-emitting waveguide; The third light-emitting pad is disposed above the third light-emitting waveguide; The fourth light-emitting pad is disposed above the fourth light-emitting waveguide; Wherein, the first modulation pad includes a first bonding portion, the second modulation pad includes a second bonding portion, the third modulation pad includes a third bonding portion, and the fourth modulation pad includes a fourth bonding portion; the first bonding portion and the second bonding portion are arranged side by side at the top of the space between the first modulation waveguide and the second modulation waveguide, and the third bonding portion and the fourth bonding portion are arranged side by side at the top of the space between the third modulation waveguide and the fourth modulation waveguide.

10. The optical module according to claim 9, wherein, An electrical connection area is formed on the second substrate, and the laser chip is mounted on the electrical connection area; A first high-frequency line, a second high-frequency line, a first output pad, and a second output pad are formed on one side of the electrical connection area, and a third high-frequency line, a fourth high-frequency line, a third output pad, and a fourth output pad are formed on the other side of the electrical connection area. The first high-frequency line and the first output pad are wire-bonded to the first bonding section, the second high-frequency line and the second output pad are wire-bonded to the second bonding section, the third high-frequency line and the third output pad are wire-bonded to the third bonding section, and the fourth high-frequency line and the fourth output pad are wire-bonded to the fourth bonding section.

11. The laser chip according to claim 3, wherein, The first deflection portion is used to tilt the optical axis of the output light from the first modulation waveguide. The second deflection portion is used to tilt the optical axis of the output light from the second modulation waveguide; The third deflection section is used to tilt the optical axis of the output light of the third modulation waveguide. The fourth deflection section is used to tilt the optical axis of the output light from the fourth modulation waveguide.

12. The laser chip according to claim 7, wherein, One end of the first wire bonding area is close to the end face of the chip body, one end of the second wire bonding area is close to the other end of the first wire bonding area, the third wire bonding area is located on the side of the second wire bonding area, one end of the fourth wire bonding area is close to the end face of the chip body, and the other end of the fourth wire bonding area is close to one end of the third wire bonding area.

13. The laser chip according to claim 11 further includes a first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer; the first insulating layer is disposed on the side of the first modulation waveguide and supports the first modulation pad, the second insulating layer is disposed on the side of the second modulation waveguide and supports the second modulation pad, the third insulating layer is disposed on the side of the third modulation waveguide and supports the third modulation pad, and the fourth insulating layer is disposed on the side of the fourth modulation waveguide and supports the fourth modulation pad.

14. The laser chip according to claim 1, wherein the chip body further comprises a first connecting waveguide, the first connecting waveguide comprising a first gradient portion and a second gradient portion, wherein the width of one end of the first gradient portion is smaller than the width of the other end of the first gradient portion, and the width of one end of the second gradient portion is larger than the width of the other end of the second gradient portion; one end of the first gradient portion is connected to the output end of the first light-emitting waveguide, the other end of the first gradient portion is connected to one end of the second gradient portion, and the other end of the second gradient portion is connected to the input end of the first modulation waveguide.

15. The laser chip according to claim 14, wherein, The first connecting waveguide has a first gradient groove and a second gradient groove on its side. The first gradient groove is located on one side of the first connecting waveguide, and the second gradient groove is located on the other side of the first connecting waveguide. The width of one end of the first gradient groove is smaller than the width of the other end of the first gradient groove, and the width of one end of the second gradient groove is smaller than the width of the other end of the second gradient groove.

16. The laser chip according to claim 13, wherein, The first insulating layer is distributed on both sides of the first modulation waveguide, and the first insulating layer located on the side of the first modulation waveguide closer to the second modulation waveguide supports the first wire bonding portion.

17. An optical module, wherein, Includes a laser component, which is used to generate multiple light signals; The laser component includes a substrate and a laser chip, wherein the laser chip is disposed on the substrate; wherein the laser chip is the laser chip according to any one of claims 1 or 11 to 15.

18. A laser chip, wherein, include: The chip body includes a first light-emitting waveguide and a second light-emitting waveguide arranged in a row, and a first modulation waveguide and a second modulation waveguide arranged side by side. There is a gap between the first light-emitting waveguide and the second light-emitting waveguide, and there is a gap between the first modulation waveguide and the second modulation waveguide. The output terminal of the first light-emitting waveguide is connected to the input terminal of the first modulation waveguide, and the output terminal of the second light-emitting waveguide is connected to the input terminal of the second modulation waveguide. The first modulation pad is disposed above the first modulation waveguide and extends to the top of the first modulation waveguide; The second modulation pad is disposed above the second modulation waveguide and extends to the top of the second modulation waveguide; The first light-emitting pad is disposed above the first light-emitting waveguide; The second light-emitting pad is disposed above the second light-emitting waveguide; The first modulation pad includes a first bonding portion, and the second modulation pad includes a second bonding portion. The first bonding portion and the second bonding portion are arranged side by side at the top of the space between the first modulation waveguide and the second modulation waveguide.

19. The laser chip according to claim 18, wherein, The light-emitting end of the first modulation waveguide includes a first deflection portion, which is used to tilt the optical axis of the output light of the first modulation waveguide. The light-emitting end of the second modulation waveguide includes a second deflection portion, which is used to tilt the optical axis of the output light from the second modulation waveguide.

Images