Magnetron sputtering device and vacuum cavity

Abstract

Disclosed in the present invention are a magnetron sputtering device and a vacuum cavity. The magnetron sputtering device comprises a base for bearing a substrate, and a sputtering source and a first electromagnetic coil located above the substrate, and the substrate is located in the vacuum cavity. The magnetron sputtering device further comprises a second electromagnetic coil located below the substrate. The second electromagnetic coil and the substrate are coaxially arranged, the second electromagnetic coil is at least partially located outside a radial area of the base, and the first electromagnetic coil and the second electromagnetic coil jointly act on the position of the substrate to form a uniform perpendicular magnetic field. The uniformity of deposition on a surface of the substrate by means of magnetron sputtering is improved.

Description

Magnetron sputtering device and vacuum chamber TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor devices, in particular to a magnetron sputtering device and a vacuum chamber. BACKGROUND

[0002] Magnetron sputtering is a kind of physical vapor deposition (PVD). The general sputtering method can be used to prepare metal, semiconductor, insulator and other materials, and has the advantages of simple equipment, easy control, large plating area and strong adhesion.

[0003] The electromagnetic coil near the substrate of the current magnetron sputtering device is located on one side of the substrate, generally above the substrate. The magnetic lines of force generated by the electromagnetic coil do not reach the surface of the substrate perpendicularly to the magnetic field but exist curvature. This affects the uniformity of the deposition of sputtering ions on the substrate. SUMMARY

[0004] In order to improve the uniformity of the deposition of magnetron sputtering on the surface of the substrate, according to one aspect of the present application, a magnetron sputtering device is provided, which includes a susceptor for carrying a substrate, and a sputtering source and a first electromagnetic coil located above the substrate, the substrate is located in a vacuum chamber, and further includes a second electromagnetic coil located below the substrate, the second electromagnetic coil is coaxially arranged with the substrate, and the second electromagnetic coil is at least partially located outside the radial area of the susceptor, the first electromagnetic coil and the second electromagnetic coil jointly act on the substrate to form a uniform vertical magnetic field.

[0005] Optionally, a chamber wall is further included, which is arranged around the susceptor, and the chamber wall is radially outwardly convex with an annular table, and the second electromagnetic coil is sealed in the annular table.

[0006] Optionally, a first magnetic shielding plate is arranged on the chamber wall.

[0007] Optionally, an annular groove is arranged on the annular table, the second electromagnetic coil is arranged in the annular groove, and the annular groove is airtight isolated from the vacuum chamber via a sealing plate.

[0008] Optionally, the annular groove has a through hole in communication with the atmosphere, and the second electromagnetic coil is electrically connected with an external power supply via the through hole.

[0009] Optionally, the sealing plate and the groove wall of the annular groove are detachably fixedly connected, and the sealing plate and the annular groove are sealed by a sealing ring arranged in a first sealing ring groove.

[0010] Optionally, the annular table has an exhaust port below, and the annular table is suspended above the exhaust port.

[0011] Optionally, the first electromagnetic coil is located outside the vacuum cavity, above the substrate, the chamber wall has a platform extending radially inward, the platform is provided with a mounting portion of the first electromagnetic coil, and the first electromagnetic coil is mounted on the mounting portion.

[0012] Optionally, the first electromagnetic coil is coaxially arranged with the second electromagnetic coil.

[0013] Optionally, the base has a support portion connected with the bottom surface of the vacuum cavity, and the support portion has an exhaust passage between the inner side wall and the bottom surface of the ring table.

[0014] Optionally, the vacuum cavity has a plurality of vacuum cavities, and a second magnetic shielding plate is arranged between adjacent two vacuum cavities.

[0015] Optionally, the adjacent two vacuum cavities are symmetrically arranged relative to the second magnetic shielding plate therebetween.

[0016] Optionally, the second magnetic shielding plate is embedded in the chamber wall between the adjacent two vacuum cavities, the chamber wall has an embedded groove for mounting the second magnetic shielding plate, and the embedded groove is throughly arranged.

[0017] Optionally, the first electromagnetic coil and the second electromagnetic coil are of equal size and arranged in the same direction.

[0018] Optionally, the first electromagnetic coil and the second electromagnetic coil are symmetrically arranged relative to the distance of the substrate.

[0019] Optionally, the exhaust port is arranged close to the middle of the adjacent two vacuum cavities, and a plurality of exhaust ports are commonly connected to one vacuum pump.

[0020] Optionally, the first electromagnetic coil and the second electromagnetic coil jointly form a Helmholtz coil structure.

[0021] Optionally, the second electromagnetic coil is located outside the radial area of the base.

[0022] Optionally, the minimum radius of the ring table is greater than the maximum radius of the base, so as to form a through molecular flow channel between the ring table and the base towards the exhaust port.

[0023] Optionally, the platform is provided with a second sealing ring groove, and the mounting portion and the platform are sealingly and detachably fixedly connected through the sealing ring of the second sealing ring groove.

[0024] Optionally, the second electromagnetic coil is mounted on the sealing plate.

[0025] Optionally, the second electromagnetic coil is mounted on the sealing plate via a fixing part, the fixing part having a cooling channel, the cooling channel being connected to an external cooling source through a through hole communicating with the atmosphere.

[0026] Optionally, the fixing part forms an "I" or "L" ring structure, the fixing part is fixedly connected to the sealing plate, the fixing part includes an axially extending fixing body and a support base located below the fixing body, the second electromagnetic coil can be wound around the fixing body and fixed, and the bottom of the second electromagnetic coil is supported by the support base, and the upper end of the fixing body is fixedly connected to the sealing plate.

[0027] Optionally, the support base and / or the fixing body are provided with cooling channels.

[0028] Optionally, the support base is provided with a cooling channel, and the radial thickness of the fixing body is less than the radial thickness of the support base.

[0029] Optionally, the mounting portion includes a connecting portion that is sealed to the platform and a cylindrical wall portion connected to the radially inner side of the connecting portion. The connecting portion extends radially inward, such that the outer diameter of the cylindrical wall portion is smaller than the inner diameter of the platform, and the first electromagnetic coil is mounted on the cylindrical wall portion.

[0030] Optionally, multiple vacuum chambers share a single vacuum gauge, which is located above the center of the chamber wall between the multiple vacuum chambers. The chamber wall has a detection channel that communicates with each vacuum chamber, and the vacuum gauge communicates with each vacuum chamber through the detection channel.

[0031] According to another aspect of the present invention, a vacuum chamber is provided, including a chamber wall that surrounds and forms a vacuum chamber for physical vapor deposition of a substrate. A support portion is provided within the vacuum chamber, and a base is fixed above the support portion. The base supports the substrate. One end of the vacuum chamber has an evacuation port for evacuating the vacuum chamber. A truncated ring extends radially inward from the chamber wall, surrounding the support portion. An annular groove is formed on the truncated ring, which is hermetically isolated from the vacuum environment within the vacuum chamber via a sealing plate. A second electromagnetic coil can be disposed within the annular groove, which is located below the substrate.

[0032] Optionally, the annular groove does not coincide with the radial position of the base.

[0033] Optionally, the annular platform is integrally formed with the chamber wall.

[0034] Optionally, the annular groove is provided with a first sealing ring groove, and a sealing ring can be provided in the first sealing ring groove to make the sealing plate and the annular groove airtightly installed.

[0035] Optionally, a through hole is formed in the annular groove and is in communication with the atmosphere.

[0036] Optionally, a base is arranged below the vacuum cavity, the base constitutes the bottom of the vacuum cavity, and the base is integrally arranged with the surrounding cavity wall and the support portion in the middle of the base.

[0037] Optionally, an air exhaust port is formed in the base, and the annular platform is suspended above the air exhaust port.

[0038] Optionally, the inner side of the annular platform has an inner side surface, the air exhaust port is formed close to one side of the cavity wall, and the end of the air exhaust port away from the cavity wall has an air exhaust boundary on the base, and the maximum radius of the air exhaust boundary is smaller than the minimum radius of the inner side surface.

[0039] Optionally, the radius of the annular platform at the minimum radius is greater than the radius of the base at the maximum radius.

[0040] Optionally, the cavity wall on one side of the air exhaust port has an extension wall, the extension wall defines a side boundary of the air exhaust port, and the thickness of the extension wall is smaller than the thickness of the cavity wall.

[0041] Optionally, the cavity wall above the base has a radially inwardly extending platform, the radially inner side of the platform has a second sealing ring groove for mounting a mounting portion of the first electromagnetic coil, and the mounting portion of the first electromagnetic coil is sealingly mounted on the platform through the second sealing ring groove to jointly form an outer wall of the vacuum cavity.

[0042] Optionally, the vacuum cavity forms a plurality of vacuum cavities, the cavity wall between two adjacent vacuum cavities constitutes a partition wall, and the air exhaust port is arranged close to one side of the partition wall.

[0043] Optionally, the partition wall is provided with an embedded groove, and a magnetic shielding plate can be inserted into the embedded groove.

[0044] Optionally, the embedded groove extends through the partition wall.

[0045] Optionally, the partition wall has an extension wall below, the extension wall separates a plurality of air exhaust ports, the thickness of the extension wall is smaller than the thickness of the partition wall, and the embedded groove is partially arranged in the extension wall.

[0046] Optionally, the partition wall has a vacuum gauge mounting structure, which comprises a vacuum gauge mounting hole and a detection channel communicated with the vacuum gauge mounting hole, the vacuum gauge mounting hole is used for mounting a vacuum gauge and making the vacuum gauge communicated with the detection channel, and the detection channel is located in the partition wall and communicated with each vacuum cavity respectively. The magnetic force lines formed by the first electromagnetic coil and the second electromagnetic coil acting on the substrate position are uniform and perpendicular to the substrate. Therefore, the uniformity of the sputtering ions deposited on the substrate is significantly improved.

[0047] The second electromagnetic coil is coaxially arranged with the substrate and at least partially located outside the radial area of the base. The first electromagnetic coil and the second electromagnetic coil jointly act on the substrate position to form a uniform and perpendicular magnetic field. The uniformity of the magnetron sputtering deposition on the substrate surface is improved. BRIEF DESCRIPTION OF DRAWINGS

[0048] Fig. 1 is a schematic structural diagram of a magnetron sputtering device according to the present application;

[0049] Fig. 2 is a schematic diagram of magnetic force lines of a comparative example;

[0050] Fig. 3 is a schematic diagram of magnetic force density of different substrate and coil diameter ratios;

[0051] Fig. 4 is a schematic diagram of magnetic force lines of an embodiment of the present application;

[0052] Fig. 5 is a schematic diagram of a chamber wall profile of a magnetron sputtering device according to the present application;

[0053] Fig. 6 is a schematic diagram of a second electromagnetic coil mounting structure of an embodiment of the present application;

[0054] Fig. 7 is a schematic structural diagram of another magnetron sputtering device according to the present application;

[0055] Fig. 8 is a schematic diagram of a vacuum pumping structure of an embodiment of the present application;

[0056] Fig. 9 is a schematic diagram of a vacuum cavity profile of an embodiment of the present application;

[0057] Fig. 10 is a schematic diagram of another vacuum cavity profile of an embodiment of the present application;

[0058] Fig. 11 is a schematic diagram of still another vacuum cavity profile of an embodiment of the present application. DETAILED DESCRIPTION

[0059] The technical solutions of the present application will be described clearly and completely in combination with the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0060] In order to improve the uniformity of the deposition on the substrate surface by magnetron sputtering, according to one aspect of the present application, a magnetron sputtering device is provided, as shown in Figure 1 (simplified representation of the upper structure by dashed lines), comprising a susceptor 110 for carrying a substrate W, and a sputter source 130 and a first electromagnetic coil 150 located above the substrate W, the substrate W being located in a vacuum chamber 100, and further comprising a second electromagnetic coil 140 located below the substrate W, the second electromagnetic coil 140 being coaxial with the substrate W and at least partially located outside the radial area of the susceptor 110, the first electromagnetic coil 150 and the second electromagnetic coil 140 jointly acting on the substrate W to form a uniform vertical magnetic field.

[0061] Wherein, considering that the substrate W is generally located in the central area of the susceptor 110, the susceptor 110 is generally a circular table, therefore, the coaxial arrangement of the second electromagnetic coil 140 with the substrate W can also be understood as the coaxial arrangement of the second electromagnetic coil 140 with the susceptor 110, so as to determine the installation position of the second electromagnetic coil 140.

[0062] The at least partial location of the second electromagnetic coil 140 outside the radial area of the susceptor 110 can be understood as that the axial projection area of the second electromagnetic coil 140 is outside the axial projection area of the susceptor 110 or only partially coincides with the projection area of the susceptor 110 rather than completely coincides, i.e. the second electromagnetic coil 140 is not located or not completely located in or directly below the susceptor 110, or can be understood as that the maximum coil radius in the radial direction of the second electromagnetic coil 140 is greater than the maximum radius of the susceptor 110. Since the magnetic force lines generated by the coil form an arc-shaped magnetic force line around the coil in the area close to the coil, as shown in Figure 2, when the radial position of the second electromagnetic coil 140 coincides with the susceptor 110, the magnetic force line M formed by the second electromagnetic coil 140 on the substrate W cannot be uniform and perpendicular to the substrate W, and in the edge area close to the substrate W, the magnetic force line M will be bent.

[0063] The second electromagnetic coil 140 is located at least partially outside the radial area of the base 110, so that the second electromagnetic coil 140 is relatively far away from the radial area of the substrate W, and the magnetic force lines of the second electromagnetic coil 140 at the edge area of the substrate W are not deflected due to being too close. In addition, since the coil is located far away from the substrate, the vertical magnetic force lines generated on the substrate W are not too concentrated in the central area of the substrate, but are dispersed to the entire substrate W, and the density distribution of the magnetic force lines falling on the substrate W is closer to the distribution peak area, and the density distribution is more uniform, thereby significantly improving the uniformity of the magnetic force lines on the substrate. As shown in FIG. 3, the magnetic force strength generated by the coil is a normal distribution, the magnetic force at the center of the coil is the strongest, which is M0, and the magnetic force decreases outward from the center. For ease of understanding, it is assumed that the substrate W is coaxially placed at the center of the coil, and then D1 and D2 in the figure can be simplified to the ratio of the radius R of the substrate W to the radius of the coil. It can be easily understood that when the radius of the coil is constant, the larger the radius of the substrate W, the larger the range of the magnetic force received by the substrate W. Conversely, when the radius of the substrate W is constant, the larger the radius of the coil, the smaller the range of the magnetic force on the substrate W, and the more concentrated the magnetic force strength at the center of the coil. Since the radius of the substrate W is generally constant in the embodiment, the comparison is the influence of different coil radii on the uniformity of the magnetic force distribution on the substrate W, that is, in the figure, the coil radius of D2 is smaller than that of D1, and then the magnetic force distribution range on the substrate W in D2 is M2 to M0, and the magnetic force distribution range on the substrate W in D1 is M1 to M0. It can be found that the difference between M0 and M1 is smaller than the difference between M0 and M2, and it can be understood that the uniformity of the magnetic force density on the substrate W of D1 is significantly better than that of D2.

[0064] Therefore, the first electromagnetic coil 150 and the second electromagnetic coil 140 above and below the substrate W jointly act on the magnetic force lines M formed on the entire substrate W to make the magnetic force lines M perpendicular to the substrate W and more uniform.

[0065] Preferably, the second electromagnetic coil 140 is completely located outside the radial area of the base 110, as shown in FIG. 4, to cooperate with the first coil 150 to form uniform and vertical magnetic force lines on the entire substrate W. In addition, since the second electromagnetic coil 140 is completely not coincident with the base 110 in the radial direction, the second electromagnetic coil 140 can be placed outside the base 110, and since the base 110 needs to be connected to the radio frequency in the magnetron sputtering, the mutual interference between the radio frequency and the second electromagnetic coil 140 can be avoided.

[0066] In one embodiment, the magnetron sputtering device further comprises a chamber wall 160, and the chamber wall 160 is arranged around the base 110.

[0067] In one embodiment, the chamber wall 160 is provided with a first magnetic shielding plate 171. Through the first magnetic shielding plate 171, the magnetic field can be constrained from spreading outward.

[0068] In one embodiment, as shown in FIG. 5, the chamber wall 160 is radially inwardly convex with a ring platform 161, and the second electromagnetic coil 140 is sealed in the ring platform 161. By arranging the radially inwardly convex ring platform 161, the second electromagnetic coil 140 can be arranged in the vacuum chamber 100, so that the second electromagnetic coil 140 can be arranged relatively close to the substrate W, the utilization rate of the magnetic field is improved, the electromagnetic coil can operate at a lower power under the condition of meeting the process requirements, space is saved, there is no need to expand the space outside the vacuum chamber 100, which is beneficial to integration and miniaturization, and facilitates the application scene of multiple cavities in parallel, and since the second electromagnetic coil 140 is located in the vacuum chamber 100 as a whole, it can be magnetically shielded by the first magnetic shielding plate 171, and has no interference effect on the space devices outside the vacuum chamber 100.

[0069] In addition, since there is radio frequency and plasma effect in the vacuum chamber 100 during the process, the ring platform 161 arranged integrally with the chamber wall 160 can be directly grounded through the chamber wall 160, and the ring platform 161 and the chamber wall 160 are at the same potential, without potential difference, thereby effectively preventing problems such as arc discharge and sparking caused by the installation structure of the second electromagnetic coil 140, which cannot effectively be at the same potential with the chamber wall 160, and the potential difference between the internal components of the vacuum chamber 100 in the vacuum environment, thereby ensuring the stability and safety of the process.

[0070] Further, the ring platform 161 is provided with an annular groove 162, the second electromagnetic coil 140 is arranged in the annular groove 162, and the annular groove 162 is airtightly isolated from the vacuum chamber 100 through the sealing plate 141. Thus, the annular groove 162 and the vacuum chamber 100 can be relatively airtightly isolated during work, so that the second electromagnetic coil 140 in the annular groove 162 does not have to work in a high vacuum environment.

[0071] Since magnetron sputtering needs to be operated in a high vacuum or even ultra-high vacuum environment, we find that in this environment, some devices such as the outer insulating layer of the coil have micro pores on the surface due to their surface density being not as high as that of metal, and the micro pores can store air, volatile organic compounds, etc. in the atmospheric environment. When the coil is placed in the vacuum chamber 100 in a high vacuum or ultra-high vacuum environment, the surface of the outer insulating layer of the coil will continuously release gas molecules, water vapor, etc. to the vacuum environment, which will pollute the environment of the vacuum chamber 100 and is not conducive to surface degassing and vacuum pumping.

[0072] Therefore, by relatively airtightly isolating the annular groove 162 and the vacuum chamber 100 during work, the second electromagnetic coil 140 in the annular groove 162 does not have to work in a high vacuum environment, thereby avoiding the release of gas molecules, water vapor, etc. to the vacuum environment to pollute the vacuum chamber 100.

[0073] In one embodiment, the annular groove 162 has a through-hole (not shown) communicating with the atmosphere, through which the second electromagnetic coil 140 is electrically connected to an external power source (not shown). This through-hole allows the air pressure inside the annular groove 162 to communicate with the atmosphere, rather than creating a vacuum environment. This avoids contaminant buildup on the surface of the second electromagnetic coil 140 and potential arcing risks, while also facilitating the power distribution and installation of the second electromagnetic coil 140.

[0074] In one embodiment, the sealing plate 141 is detachably fixedly connected to the wall of the annular groove 162, and the sealing plate 141 and the annular groove 162 are sealed by a sealing ring provided in the first sealing ring groove 163. This enhances the airtightness between the sealing plate 141 and the annular groove 162 while facilitating the installation, disassembly, and maintenance of the second electromagnetic coil 140 within the annular groove 162.

[0075] In particular, in one embodiment, the second electromagnetic coil 140 is mounted on the sealing plate 141, so that the second electromagnetic coil 140 can be disassembled, assembled, and centered simultaneously by disassembling and assembling the sealing plate 141.

[0076] Preferably, the second electromagnetic coil 140 is mounted on the sealing plate 141 via a fixing part 142. The fixing part 142 has a cooling channel 143, which is connected to an external cooling source through a through hole communicating with the atmosphere. This allows the temperature of the second electromagnetic coil 140 to be regulated through the cooling channel 143.

[0077] In one embodiment, as shown in FIG6, the fixing part 142 forms an "I" or "L" ring structure. The fixing part 142 can be fixedly connected to the sealing plate 141. The fixing part 142 includes an axially extending fixing body 1421 and a support base 1422 located below the fixing body 1421. The second electromagnetic coil 140 can be fixed by winding it around the fixing body 1421 and the bottom of the second electromagnetic coil 140 is supported by the support base 1422. The upper end of the fixing body 1421 is fixedly connected to the sealing plate 141. Thus, the sealing plate 141 and the fixing part 142 form an overall hoisting structure for the second electromagnetic coil 140, which is conducive to the quick assembly and disassembly of the second electromagnetic coil 140.

[0078] Meanwhile, in order to make the magnetic lines M formed by the second electromagnetic coil 140 and the first electromagnetic coil 150 acting on the substrate W position uniform and perpendicular to the substrate W, it is possible to fine-tune the installation position of the second electromagnetic coil 140, i.e. the radial width and depth of the annular groove 162 is greater than the radial width and height of the second electromagnetic coil 140 and / or the fixing portion 142. After the position of the second electromagnetic coil 140 is determined, it is not desirable to have a deviation. Since the installation position of the sealing plate 141 is relatively fixed and accurate, the second electromagnetic coil 140 fixed on the sealing plate 141 can complete the centering work at the time of installation, and the second electromagnetic coil 140 is limited and fixed by the fixing portion 142 to prevent position deviation.

[0079] In one embodiment, a cooling channel 143 is arranged in the support seat 1422 and / or the fixing body 1421 to protect the second electromagnetic coil 140 from temperature control. Preferably, the cooling channel 143 is arranged in the support seat 1422, and the radial thickness of the fixing body 1421 is less than the radial thickness of the support seat 1422. The support seat 1422 provides sufficient arrangement space for the cooling channel 143, and at the same time, the fixing body 1421 forms a heat exchange fin relative to the support seat 1422, which is beneficial to improve the heat exchange efficiency of the cooling channel 143 to the second electromagnetic coil 140. In this way, the fixing portion 142 has the dual functions of integrated disassembly, fixation and limitation of the second electromagnetic coil 140 and temperature control protection, improves the space utilization, and saves a separate external cooling module, thereby reducing the cost.

[0080] In one embodiment, the annular table 161 has an air outlet 120 below, and the annular table 161 is suspended above the air outlet 120. As shown in FIG. 5, the annular table 161 has a bottom surface which is higher than the position of the air outlet 120, i.e. the annular table 161 is suspended above the air outlet 120. Thus, there is an additional exhaust space between the bottom surface of the annular table 161 and the air outlet 120, which can make the oblique molecular flow F hit into the air outlet 120 to improve the vacuum efficiency. The second electromagnetic coil 140 can be arranged in a region closer to the substrate W, which improves the electromagnetic efficiency, can improve the uniformity of the magnetic field distribution near the substrate W, and can maintain the magnetic field strength at a lower power consumption, guide the target ions to move towards the substrate W, and improve the uniformity and deposition rate of the thin film deposition. At the same time, the overall structure can be more compact in the radial direction (or can be understood as the horizontal direction), which is beneficial to the intensification and multi-cavity combination arrangement.

[0081] In one embodiment, the base 110 has a support portion 111 connected to the bottom surface of the vacuum chamber 100, and the outer side wall of the support portion 111 is connected to the inner side wall and the bottom surface of the ring platform 161 via an exhaust passage. Thus, a continuous exhaust passage is formed from the outer side wall of the support portion 111 to the inner side wall of the ring platform 161, and from the bottom surface of the ring platform 161 to the exhaust port 120, so that the gas around the base 110 can be vertically downwardly introduced into the exhaust pump 210, thereby improving the vacuum pumping efficiency. The improved vacuum pumping efficiency further makes the overall structure more compact in the radial direction (or horizontally), which is conducive to the intensification and multi-chamber combination.

[0082] In particular, in one embodiment, the minimum radius of the ring platform 161 is greater than the maximum radius of the base 110, so that a through molecular flow channel is formed from the ring platform 161 to the base 110 towards the exhaust port, thereby forming a through gas passage from the edge of the substrate W to the exhaust port 120, which can significantly improve the vacuum pumping efficiency.

[0083] In one embodiment, the first electromagnetic coil 150 is located outside the vacuum chamber 100. As shown in FIGS. 4 and 5, above the substrate W, the chamber wall 160 has a radially inwardly extending platform 165, and the first electromagnetic coil 150 is mounted on the mounting portion 151 provided on the platform 165. The mounting portion 151 isolates the first electromagnetic coil 150 from the atmosphere outside the vacuum chamber 100, thereby avoiding contamination of the vacuum environment by the first electromagnetic coil 150. At the same time, the radially inwardly extending platform 165 allows the first electromagnetic coil 150 to be arranged close to the second electromagnetic coil 140 in the radial direction, which facilitates the first electromagnetic coil 150 and the second electromagnetic coil 140 to jointly generate magnetic lines M that are uniform and perpendicular to the substrate W.

[0084] In one embodiment, the platform 165 is provided with a second sealing ring groove 166, and the mounting portion 151 is detachably fixedly connected to the platform 165 via a sealing ring in the second sealing ring groove 166. Thus, the mounting portion 151 can form part of the chamber wall of the vacuum chamber 100, and the detachable structure facilitates the assembly and maintenance of the structure inside the vacuum chamber 100, and facilitates the disassembly and assembly of the first electromagnetic coil 150.

[0085] Preferably, the mounting portion 151 comprises a connecting portion 1511 sealingly connected with the platform 165 and a cylindrical wall portion 1512 connected to the radially inner side of the connecting portion 1511, the connecting portion 1511 extends radially inwardly, the outer diameter of the cylindrical wall portion 1512 is smaller than the inner diameter of the platform 165, and the first electromagnetic coil 150 is mounted on the cylindrical wall portion 1512. Further, the first electromagnetic coil 150 is arranged further radially close to the second electromagnetic coil 140 and / or the substrate W, so that the uniformity of the magnetic field distribution near the substrate W is improved, the magnetic field strength is maintained at a lower power consumption, the target ions are guided to move toward the substrate W, and the uniformity and deposition rate of the thin film deposition are improved.

[0086] In one embodiment, the first electromagnetic coil 150 is coaxially arranged with the second electromagnetic coil 140. This facilitates the magnetic lines M formed by the first electromagnetic coil 150 and the second electromagnetic coil 140 to be uniform and perpendicular to the substrate W at the position of the substrate W, thereby improving the uniformity of the sputtering ions deposited on the substrate W.

[0087] Preferably, the first electromagnetic coil 150 and the second electromagnetic coil 140 are coaxially arranged with the substrate W. This facilitates the magnetic lines M formed by the first electromagnetic coil 150 and the second electromagnetic coil 140 to be uniform and perpendicular to the substrate W at the position of the substrate W.

[0088] In one embodiment, there are multiple vacuum chambers 100, and a second magnetic shielding plate 172 is arranged between adjacent two vacuum chambers 100. As shown in FIG. 7, the second magnetic shielding plate 172 is embedded in the chamber wall 160 between the adjacent two vacuum chambers 100, and the chamber wall 160 has an embedded groove 164 for mounting the second magnetic shielding plate 172. The embedded groove 164 can be throughly arranged, so that the second magnetic shielding plate 172 can be inserted or extracted from outside the vacuum chamber 100, or the position of the second magnetic shielding plate 172 can be adjusted. The second magnetic shielding plate 172 can suppress the magnetic field interference between the adjacent two vacuum chambers 100, and make the magnetic field converge in each vacuum chamber 100. Further, the distance between the adjacent two vacuum chambers 100 can be closer, thereby avoiding the problem of mutual interference of adjacent electromagnetic coils, and the multiple vacuum chambers 100 can be more compactly arranged as a whole.

[0089] In one embodiment, the adjacent two vacuum chambers 100 are symmetrically arranged relative to the second magnetic shielding plate 172 therebetween. As shown in FIG. 7, it can be understood that the adjacent two vacuum chambers 100 of this embodiment have consistent structural layout, and the second magnetic shielding plate 172 is located in the central region of the two vacuum chambers 100, thereby forming a relatively uniform magnetron strength in each vacuum chamber 100.

[0090] In one embodiment, the coils of the first electromagnetic coil 150 and the second electromagnetic coil 140 are of equal size, and the currents are set in the same direction. This facilitates the magnetic lines M formed by the first electromagnetic coil 150 and the second electromagnetic coil 140 acting together to be uniform and perpendicular to the substrate W, thereby improving the uniformity of the deposition of sputtering ions on the substrate W.

[0091] In one embodiment, the first electromagnetic coil 150 and the second electromagnetic coil 140 are symmetrically arranged relative to the distance of the substrate W. That is, the substrate W is located in the central region of the distance between the first electromagnetic coil 150 and the second electromagnetic coil 140, which facilitates the magnetic lines M formed by the first electromagnetic coil 150 and the second electromagnetic coil 140 acting together to be uniform and perpendicular to the substrate W, thereby improving the uniformity of the deposition of sputtering ions on the substrate W.

[0092] In one embodiment, the first electromagnetic coil 150 and the second electromagnetic coil 140 together form a Helmholtz coil structure. The first electromagnetic coil 150 and the second electromagnetic coil 140 are arranged as coaxial identical circular coils with a spacing equal to the radius of the coils. The first electromagnetic coil 150 and the second electromagnetic coil 140 are connected in series and have the same current direction, so that the magnetic lines M formed by the first electromagnetic coil 150 and the second electromagnetic coil 140 acting together are uniform and perpendicular to the substrate W, thereby improving the uniformity of the deposition of sputtering ions on the substrate W.

[0093] In one embodiment, as shown in FIG. 8, the exhaust ports 120 are arranged near the middle of the adjacent two vacuum chambers 100, and the plurality of exhaust ports 120 are connected together to a vacuum pump 210.

[0094] It can be understood that the meaning of "through" in the embodiment is that there is no obstruction or deflection in the gas passage between the exhaust port 120 and the vacuum pump 210 in the direction towards the vacuum pump 210, so that the gas molecules passing through the exhaust port 120 have a straight and unobstructed gas molecule flow channel directly into the vacuum pump 210, as shown by the vertical arrow G in Figure 8. Thus, it is avoided that there is an obstruction or pipeline in the gas path from the exhaust port 120 to the vacuum pump 210 that deviates the direction of movement of the gas molecules from the direction, so as to ensure that the gas molecules moving in the direction can directly enter the vacuum pump 210 to be captured and adsorbed. Compared with the case where there is a bend, a hole or no through gas path due to an obstruction in the gas path, the arrangement can greatly improve the capture efficiency of the vacuum system for gas molecules, that is, improve the vacuum pumping efficiency, so that a plurality of processing cavities can share a set of vacuum system, greatly saving the cost while improving the vacuum pumping efficiency. In particular, when considering that the arrangement of the ring table 161 and / or the second magnetic shielding plate 172 can make the overall structure of the single vacuum cavity 100 more compact in the radial (or can be understood as the horizontal direction) range, it is beneficial to intensive and multi-cavity combination arrangement, the plurality of vacuum cavities 100 can be made closer to each other, and / or when considering that the ring table 161 and the base 110 form a straight gas pumping channel, a straight through molecular flow channel can be formed from the edge of the base 110 to the vacuum pump 210, which can improve the effective through section of the shared vacuum pump 210 and improve the pumping efficiency.

[0095] Preferably, a plurality of vacuum cavities 100 can share a vacuum gauge 220, and the vacuum gauge 220 is located above the center of the cavity wall between the plurality of vacuum cavities 100. By opening a detection channel in the cavity wall that communicates with each vacuum cavity 100, the vacuum gauge 220 can communicate with each vacuum cavity 100 through the detection channel, and then detect the vacuum degree. Since a plurality of vacuum cavities 100 share a vacuum pump 210, the plurality of vacuum cavities 100 are in communication with each other and can be regarded as a large vacuum environment cavity as a whole, and each vacuum cavity 100 corresponds to a vacuum processing cavity separated by the cavity wall between the large vacuum environment cavity for processing the substrate respectively. Therefore, by sharing a vacuum gauge 220 by a plurality of vacuum cavities 100, the detection channel can be communicated with each vacuum cavity 100 to collect gas molecules in each vacuum cavity 100, improve the collection accuracy of the overall vacuum degree of the large vacuum environment cavity, and then facilitate more accurate vacuum degree control.

[0096] Based on the design requirements of the present application, considering that the prior art lacks a vacuum cavity that meets the design requirements, the present application needs to propose a vacuum cavity to meet the setting position of the second electromagnetic coil and the vacuum pumping requirements.

[0097] As shown in FIGS. 9-11, according to another aspect of the present application, a vacuum chamber is provided, comprising a chamber wall 160 enclosing a vacuum cavity for physical vapor deposition processing of a substrate, a support portion 111 is provided in the vacuum chamber, above which a pedestal 110 is fixed for carrying the substrate, and a vacuum pumping port 120 is provided at one end of the vacuum chamber for evacuating the vacuum cavity.

[0098] The chamber wall 160 extends radially inwardly to form a ring platform 161, which is arranged around the support portion 111, and a ring groove 162 is formed in the ring platform 161, which can be hermetically sealed from the vacuum environment in the vacuum chamber by a sealing plate, and a second electromagnetic coil can be arranged in the ring groove 162, which is located below the substrate.

[0099] Therefore, by arranging the ring groove 162, the second electromagnetic coil can be arranged in the vacuum cavity, and the ring groove 162 can be hermetically sealed from the vacuum environment in the vacuum chamber by a sealing plate, so that the second electromagnetic coil in the ring groove 162 does not have to work in a high vacuum environment, avoiding the generation of gas molecules, water vapor, etc. in the vacuum cavity. And the ring platform 161 extends radially inwardly from the chamber wall 160, and the ring groove 162 is formed in the ring platform 161, so that the second electromagnetic coil can be located entirely in the vacuum chamber, and relatively close to the substrate, which can improve the electromagnetic efficiency of the electromagnetic coil, thereby improving the uniformity of the magnetic field distribution near the substrate W and guiding the target ions to move in the direction of the substrate W, improving the uniformity and deposition rate of thin film deposition. At the same time, the overall structure can be more compact in the radial direction (or can be understood as the horizontal direction), which is beneficial to the intensification and multi-cavity combination.

[0100] In one embodiment, the ring groove 162 and the pedestal 110 do not coincide in radial position. Therefore, the second electromagnetic coil 140 is located outside the radial area of the pedestal 110, and the second electromagnetic coil 140 is relatively far away from the radial area of the substrate W, so that the magnetic lines of force of the second electromagnetic coil 140 at the edge area of the substrate W will not be bent and deflected due to being too close, and since the coil position is far away from the substrate, the vertical magnetic lines generated on the substrate W will not be too concentrated in the central area of the substrate, but will be dispersed to the entire substrate W, and the magnetic line density distribution on the substrate W is closer to the distribution peak area, and the density distribution is more uniform, so that the uniformity and perpendicularity of the magnetic lines on the substrate can be significantly improved.

[0101] In one embodiment, the ring table 161 is integrally arranged with the chamber wall 160. Due to the radio frequency and plasma effect in the vacuum chamber during the process, the ring table 161 integrally arranged with the chamber wall 160 can be directly grounded through the chamber wall 160, and the ring table 161 and the chamber wall 160 are at the same potential, without potential difference, thereby effectively preventing the problems such as arc discharge and sparking between the internal components of the vacuum chamber due to the potential difference in the vacuum environment caused by the installation structure of the second electromagnetic coil 140, which cannot effectively be at the same potential with the chamber wall 160, thereby ensuring the stability and safety of the process.

[0102] In one embodiment, the annular groove 162 is provided with a first sealing ring groove 163, and a sealing ring can be arranged in the first sealing ring groove 163 to achieve airtight installation between the sealing plate and the annular groove 162. Thus, the airtightness between the sealing plate and the annular groove 162 is strengthened, and the installation, disassembly and maintenance of the second electromagnetic coil in the annular groove 162 are facilitated.

[0103] In one embodiment, a through hole is formed in the annular groove 162 and is in communication with the atmosphere, so that the annular groove 162 can maintain an atmospheric environment, avoiding coil pollution or arc discharge in a vacuum environment. In addition, the through hole can facilitate circuit connection and the access of a heat exchange channel.

[0104] In one embodiment, the vacuum chamber has a base 167 below, and the base 167 constitutes the bottom of the vacuum chamber and is integrally arranged with the chamber wall 160 around it and the support portion 111 in the middle. The support portion 111 is used to support and fix the base 110. Through integral arrangement, the internal components of the vacuum chamber can be at the same potential, without potential difference, thereby effectively preventing the problems such as arc discharge and sparking between the internal components of the vacuum chamber due to the poor electrical conductivity between the components, which can cause a potential difference in the vacuum environment, thereby ensuring the stability and safety of the process.

[0105] In one embodiment, the base 167 is provided with an exhaust port 120, and the ring table 161 is suspended above the exhaust port 120. As shown in FIG. 9, the ring table 161 has a bottom surface 1611 which is higher than the base 167, i.e. the ring table 161 is suspended above the exhaust port 120. Thus, there is an additional exhaust space between the bottom surface 1611 of the ring table 161 and the base 167, which can make the oblique molecular flow F hit the exhaust port 120, so as to improve the vacuum pumping efficiency, as shown in FIG. 9. Thus, while reducing the influence of the setting of the ring table 161 on the exhaust, the ring table 161 can be arranged closer to the substrate in the radial direction, i.e. the second electromagnetic coil can be arranged closer to the substrate, so as to improve the electromagnetic efficiency, maintain the magnetic field strength at a lower power consumption, improve the uniformity of the magnetic field distribution near the substrate W, guide the target ions to move towards the substrate, and improve the uniformity and deposition rate of the thin film deposition. At the same time, the overall structure can be more compact in the radial direction (or can be understood as the horizontal direction), which is beneficial to the intensification and multi-chamber combination arrangement.

[0106] In one embodiment, the ring table 161 has an inner side surface 1612 on the inner side thereof, the exhaust port 120 is arranged close to one of the chamber walls 160, and the end of the exhaust port 120 away from the chamber wall 160 has an exhaust boundary 121 on the base 167, the maximum radius of the exhaust boundary 121 is smaller than the minimum radius of the inner side surface 1612, so that in the radial direction, the exhaust boundary 121 and the inner side surface 1612 have a spacing area, which is beneficial to form a straight-through molecular flow channel towards the exhaust port 120, and improve the vacuum pumping efficiency.

[0107] In one embodiment, the radius of the ring table 161 at the minimum radius is greater than the radius of the base 110 at the maximum radius. Thus, a straight-through exhaust channel is formed between the ring table 161 and the base 110, so that a through air path is formed between the edge of the base 110 and the exhaust port 120, which can significantly improve the vacuum pumping efficiency.

[0108] In one embodiment, one of the chamber walls 160 on the side of the exhaust port 120 has an extension wall 1601 which defines a side boundary of the exhaust port 120. The thickness of the extension wall 1601 is smaller than the thickness of the chamber wall 160, so as to provide more exhaust space for the exhaust port 120 and improve the exhaust efficiency.

[0109] In one embodiment, the chamber wall 160 above the ring table 161 is provided with a wafer transfer port 168, and wafer transfer is performed through the wafer transfer port 168.

[0110] In one embodiment, the chamber wall 160 above the base 110 has a radially inwardly extending platform 165, the radially inner side of the platform 165 has a second sealing ring groove 166 for mounting the mounting portion of the first electromagnetic coil, the mounting portion of the first electromagnetic coil is mounted on the platform 165 through the second sealing ring groove 166 to jointly form the outer wall of the vacuum chamber. The first electromagnetic coil can be mounted on the mounting portion 151, which isolates the first electromagnetic coil from the atmosphere outside the vacuum chamber to prevent the first electromagnetic coil from polluting the vacuum environment. At the same time, the radially inwardly extending platform 165 can make the radial position of the first electromagnetic coil close to the second electromagnetic coil, which is beneficial to realize that the magnetic lines of force formed by the first electromagnetic coil and the second electromagnetic coil jointly acting on the substrate position are uniform and perpendicular to the substrate. The uniformity of sputtering ions deposited on the substrate is improved.

[0111] In one embodiment, the vacuum chamber forms multiple vacuum chambers, as shown in FIG. 10, which shows a double-chamber structure. The difference is that in the double-chamber or even multi-chamber structure, the chamber wall between the adjacent two vacuum chambers constitutes a partition wall 1602, and the exhaust port 120 is arranged close to one side of the partition wall 1602. Therefore, multiple exhaust ports 120 are arranged close to each other, which is beneficial to make multiple exhaust ports 120 share a set of vacuum systems, and multiple exhaust ports 120 can be connected to one vacuum pump. In this way, the vacuum efficiency is ensured, and the cost of vacuum equipment and operation and maintenance is reduced.

[0112] In one embodiment, the partition wall 1602 is provided with an embedded groove 164, and a magnetic shielding plate can be inserted into the embedded groove 164 to suppress the magnetic field interference between the adjacent two vacuum chambers and make the magnetic field converge in each vacuum chamber. Further, the distance between the adjacent two vacuum chambers can be closer, which avoids the problem of mutual interference of adjacent electromagnetic coils, so that the multiple vacuum chambers can be arranged more compactly as a whole. Therefore, it is beneficial to space utilization, and importantly, the exhaust ports 120 can be more concentrated in the vacuum system area, improving the vacuum efficiency.

[0113] In one embodiment, the embedded groove 164 extends through the partition wall 1602, so that the magnetic shielding plate can be inserted or extracted from outside the vacuum chamber, or the position of the magnetic shielding plate can be adjusted.

[0114] In one embodiment, the partition wall 1602 is provided with an extension wall 1601 below, and the extension wall 1601 separates multiple exhaust ports 120. The thickness of the extension wall 1601 is smaller than the thickness of the partition wall 1602, and part of the embedded groove 164 is located in the extension wall 1601. Therefore, more space is provided for the exhaust ports 120 to improve the exhaust efficiency, and space is provided for the embedded groove 164, so that the magnetic shielding plate can extend to the vicinity of the exhaust port 120 to better shield the magnetic field between the multiple chambers and prevent crosstalk.

[0115] In one embodiment, as shown in FIG. 11, the partition wall 1602 has a vacuum gauge mounting structure 169 including vacuum gauge mounting holes for mounting a vacuum gauge and connecting the vacuum gauge with detection channels, and the detection channels are in communication with each of the vacuum cavities.

[0116] Therefore, the plurality of vacuum cavities can share one vacuum gauge, and the vacuum gauge is located above the partition wall 1602 between the plurality of vacuum cavities. By opening detection channels in communication with each of the vacuum cavities on the partition wall 1602, the vacuum gauge 220 can be in communication with each of the vacuum cavities through the detection channels, and the vacuum degree can be detected. Since the plurality of vacuum cavities share one vacuum pump, the plurality of vacuum cavities are in communication with each other, and the whole can be regarded as a large vacuum environment cavity. Each vacuum cavity is equivalent to a vacuum processing cavity separated by the cavity wall in the large vacuum environment cavity for processing the substrate. Therefore, by sharing one vacuum gauge through the plurality of vacuum cavities, the vacuum degree acquisition cost can be reduced while simplifying the structure. Through the detection channels, the gas molecules in each vacuum cavity can be collected, the acquisition accuracy of the overall vacuum degree of the large vacuum environment cavity can be improved, and the vacuum degree control can be more accurate.

[0117] Through the vacuum cavity body of the embodiment, the electromagnetic coil can be installed below the periphery of the substrate W, which is conducive to forming uniform and vertical magnetic lines on the substrate. At the same time, the annular table 161 and the base 110 form a through molecular flow channel to the exhaust port 120, which significantly improves the vacuum efficiency. The multi-cavity exhaust ports 129 are arranged adjacent to each other, so that the multi-cavities can share one vacuum pump for vacuum pumping, and the vacuum efficiency can be ensured.

[0118] It should be noted that in the embodiment, although the second electromagnetic coil is arranged close to the substrate to improve the electromagnetic efficiency of the electromagnetic coil, "close" does not mean that the second electromagnetic coil is completely coincident with the radial position of the substrate. According to the general inventive concept, it is not difficult to understand that "close" means limited close, i.e. limited to the radial outer edge position of the base, and should not be completely inserted into the base below or embedded in the base.

[0119] It can be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for description purposes and cannot be understood as indicating or implying relative importance, nor having the meaning of sequence. The terms "radius", "diameter", "radial" are easily understood with the center of the vacuum chamber, substrate or base as the reference coordinate center.

[0120] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0121] In the present application, "high vacuum", "ultra-high vacuum", "medium vacuum", "low vacuum" are general concepts of special terms in the field, which correspond to different pressure ranges, and the following table takes nitrogen molecules as an example for illustration:

[0122] It should be noted that the values in the above table are only for indicating the pressure range of different vacuum degrees, and are not accurate values, and the values of different molecules are slightly different, and should not be interpreted as limiting the content of the present application.

[0123] In the present application, the upper dashed line in the drawing is a structure omission indication, and the dashed box is inside the vacuum chamber, and the dashed box is outside the vacuum chamber. The dashed part is only used to divide the inside and outside of the vacuum chamber, and has no special limitation, which will not be described here.

[0124] Although the content of the present application has been described in detail by the above preferred embodiments, it should be recognized that the above description should not be considered as limiting the present application. After reading the above content, various modifications and alternatives of the present application will be obvious to those skilled in the art. Therefore, the protection scope of the present application should be defined by the appended claims.

Claims

1. A magnetron sputtering apparatus, comprising a base for supporting a substrate, a sputtering source and a first electromagnetic coil located above the substrate, the substrate being situated within a vacuum cavity, characterized in that, It also includes a second electromagnetic coil located below the substrate, the second electromagnetic coil being coaxially arranged with the substrate, and the second electromagnetic coil being at least partially located outside the radial region of the base, the first electromagnetic coil and the second electromagnetic coil working together to form a uniform vertical magnetic field at the location on the substrate.

2. The magnetron sputtering apparatus as described in claim 1, characterized in that, It also includes a chamber wall, which is arranged around the base, and the chamber wall has a radially inwardly protruding annular platform, and the second electromagnetic coil is sealed inside the annular platform.

3. The magnetron sputtering apparatus as described in claim 2, characterized in that, A first magnetic shielding plate is provided on the wall of the chamber.

4. The magnetron sputtering apparatus as described in claim 2, characterized in that, The ring platform is provided with an annular groove, and the second electromagnetic coil is disposed in the annular groove. The annular groove is airtightly isolated from the vacuum chamber by a sealing plate.

5. The magnetron sputtering apparatus as described in claim 4, characterized in that, The annular groove has a through hole that communicates with the atmosphere, and the second electromagnetic coil is electrically connected to an external power source through the through hole.

6. The magnetron sputtering apparatus as described in claim 4, characterized in that, The sealing plate is detachably fixed to the wall of the annular groove, and the sealing plate and the annular groove are sealed by a sealing ring provided in the first sealing ring groove.

7. The magnetron sputtering apparatus as described in claim 2, characterized in that, The ring platform has an air extraction port below it, and the ring platform is suspended above the air extraction port.

8. The magnetron sputtering apparatus as described in claim 2, characterized in that, The first electromagnetic coil is located outside the vacuum cavity, above the substrate. The cavity wall has a platform extending radially inward, and the platform is provided with a mounting part for the first electromagnetic coil, which is mounted on the mounting part.

9. The magnetron sputtering apparatus as described in claim 1, characterized in that, The first electromagnetic coil and the second electromagnetic coil are arranged coaxially.

10. The magnetron sputtering apparatus as described in claim 7, characterized in that, The base has a support portion, which is connected to the bottom surface of the vacuum chamber, and an exhaust passage is provided between the support portion and the inner wall and bottom surface of the ring platform.

11. The magnetron sputtering apparatus as described in claim 2, characterized in that, There are multiple vacuum chambers, and a second magnetic shielding plate is provided between two adjacent vacuum chambers.

12. The magnetron sputtering apparatus as described in claim 11, characterized in that, The two adjacent vacuum chambers are symmetrically arranged with respect to the second magnetic shielding plate between them.

13. The magnetron sputtering apparatus as described in claim 11, characterized in that, The second magnetic shielding plate is embedded in the chamber wall between two adjacent vacuum chambers. The chamber wall has an embedding groove for installing the second magnetic shielding plate, and the embedding groove is through-hole.

14. The magnetron sputtering apparatus as described in claim 1, characterized in that, The first electromagnetic coil and the second electromagnetic coil are of the same size and the current is set in the same direction.

15. The magnetron sputtering apparatus as described in claim 1, characterized in that, The first electromagnetic coil and the second electromagnetic coil are symmetrically arranged with respect to the substrate.

16. The magnetron sputtering apparatus as described in claim 11, characterized in that, The extraction port is located near the middle of two adjacent vacuum chambers, and multiple extraction ports are connected together in a vacuum pump.

17. The magnetron sputtering apparatus as described in claim 1, characterized in that, The first electromagnetic coil and the second electromagnetic coil together form a Helmholtz coil structure.

18. The magnetron sputtering apparatus as described in claim 1, characterized in that, The second electromagnetic coil is located entirely outside the radial region of the base.

19. The magnetron sputtering apparatus as described in claim 7, characterized in that, The minimum radius of the ring stage is greater than the maximum radius of the base, so as to form a through molecular flow channel between the ring stage and the base, which faces the exhaust port.

20. The magnetron sputtering apparatus as described in claim 8, characterized in that, The platform is provided with a second sealing ring groove, and the mounting part is sealed to the platform through the sealing ring of the second sealing ring groove and is detachably fixedly connected.

21. The magnetron sputtering apparatus as described in claim 6, characterized in that, The second electromagnetic coil is mounted on the sealing plate.

22. The magnetron sputtering apparatus as described in claim 21, characterized in that, The second electromagnetic coil is mounted on the sealing plate by a fixing part, the fixing part having a cooling channel, and the cooling channel being connected to an external cooling source through a through hole communicating with the atmosphere.

23. The magnetron sputtering apparatus as described in claim 22, characterized in that, The fixing part forms an "I" or "L" ring structure. The fixing part is fixedly connected to the sealing plate. The fixing part includes an axially extending fixing body and a support base located below the fixing body. The second electromagnetic coil can be wound around the fixing body and fixed, and the bottom of the second electromagnetic coil is supported by the support base. The upper end of the fixing body is fixedly connected to the sealing plate.

24. The magnetron sputtering apparatus as described in claim 23, characterized in that, The support base and / or the fixed body are provided with cooling channels.

25. The magnetron sputtering apparatus as described in claim 24, characterized in that, The support base is provided with a cooling channel, and the radial thickness of the fixed body is less than the radial thickness of the support base.

26. The magnetron sputtering apparatus as described in claim 8, characterized in that, The mounting portion includes a connecting portion that is sealed to the platform and a cylindrical wall portion connected to the radially inner side of the connecting portion. The connecting portion extends radially inward, such that the outer diameter of the cylindrical wall portion is smaller than the inner diameter of the platform. The first electromagnetic coil is mounted on the cylindrical wall portion.

27. The magnetron sputtering apparatus as described in claim 11, characterized in that, Multiple vacuum chambers share a single vacuum gauge, which is located above the center of the chamber wall between the multiple vacuum chambers. The chamber wall has a detection channel that communicates with each vacuum chamber, and the vacuum gauge communicates with each vacuum chamber through the detection channel.

28. A vacuum cavity, comprising a chamber wall enclosing a vacuum cavity, the vacuum cavity being used for physical vapor deposition of a substrate, characterized in that, The vacuum chamber is provided with a support portion, and a base is fixed above the support portion. The base is used to support the substrate. One end of the vacuum chamber has an air extraction port to evacuate the vacuum chamber. The chamber wall extends radially inward with an annular platform, which surrounds the support portion. An annular groove is formed on the annular platform. The annular groove can be airtightly isolated from the vacuum environment inside the vacuum chamber by a sealing plate. A second electromagnetic coil can be placed in the annular groove, which is located below the substrate.

29. The vacuum cavity as described in claim 28, characterized in that, The annular groove does not coincide with the radial position of the base.

30. The vacuum cavity as described in claim 28, characterized in that, The ring platform is integrally formed with the chamber wall.

31. The vacuum cavity as described in claim 28, characterized in that, The annular groove is provided with a first sealing ring groove, and a sealing ring can be installed in the first sealing ring groove to make the sealing plate and the annular groove airtightly installed.

32. The vacuum cavity as described in claim 28, characterized in that, The annular groove has a through hole that communicates with the atmosphere.

33. The vacuum cavity as described in claim 28, characterized in that, The vacuum chamber has a base at its bottom, which forms the bottom of the vacuum chamber. The base is integrally formed with the chamber walls around it and the support portion in its middle.

34. The vacuum cavity as described in claim 33, characterized in that, An air extraction port is provided on the base, and the annular platform is suspended above the air extraction port.

35. The vacuum cavity as described in claim 34, characterized in that, The annular platform has an inner surface on its radially inner side. The air extraction port is opened near one side of the chamber wall, and the end of the air extraction port away from the chamber wall has an air extraction boundary on the base. The maximum radius of the air extraction boundary is smaller than the minimum radius of the inner surface.

36. The vacuum cavity as described in claim 35, characterized in that, The radius at the minimum radius of the ring platform is greater than the radius at the maximum radius of the base.

37. The vacuum cavity as described in claim 35, characterized in that, The chamber wall on one side of the air extraction port has an extension wall that defines one side boundary of the air extraction port, and the thickness of the extension wall is less than the thickness of the chamber wall.

38. The vacuum cavity as described in claim 28, characterized in that, The cavity wall above the base has a platform extending radially inward. The platform has a second sealing ring groove on its radially inner side, which seals the mounting part of the first electromagnetic coil on the platform, so as to form the outer wall of the vacuum cavity.

39. The vacuum cavity as described in claim 34, characterized in that, The vacuum chamber forms multiple vacuum chambers, and the chamber walls between two adjacent vacuum chambers form a partition wall. The air extraction port is located on the side close to the partition wall.

40. The vacuum cavity as described in claim 39, characterized in that, The partition wall is provided with an embedding groove, into which a magnetic shielding plate can be inserted.

41. The vacuum cavity as described in claim 40, characterized in that, The embedded groove is provided through the partition wall.

42. The vacuum cavity as described in claim 40, characterized in that, Below the partition wall is an extension wall that divides multiple air extraction ports. The thickness of the extension wall is less than the thickness of the partition wall, and the embedded groove portion is located within the extension wall.

43. The vacuum cavity as described in claim 39, characterized in that, The partition wall has a vacuum gauge mounting structure, which includes a vacuum gauge mounting hole and a detection channel communicating with the vacuum gauge mounting hole. The vacuum gauge mounting hole is used to install a vacuum gauge and to connect the vacuum gauge with the detection channel. The detection channel is located inside the partition wall and is connected to each vacuum chamber.

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