Electronic device, support structure, display module and hinge assembly

Abstract

A foldable electronic device (1), a support structure (30), a display module and a hinge assembly. The foldable electronic device (1) comprises a display panel (20), the support structure (30) and a hinge structure (12), which are stacked, wherein the display panel (20) comprises a bending area (201); the hinge structure (12) and the support structure (30) are correspondingly arranged in the bending area (201), the support structure (30) being located between the hinge structure (12) and the bending area (201); and the support structure (30) comprises a first tensile layer (32), which is used for reducing tensile deformation of the display panel (20).

Description

Electronic devices, support structures, display modules and hinge components

[0001] This application claims priority to Chinese Patent Application No. 202410696878.7, filed on May 30, 2024, entitled "Electronic Device, Support Structure, Display Module and Hinge Assembly," the entire contents of which are incorporated herein by reference. This application also claims priority to Chinese Patent Application No. 202411880396.3, filed on December 18, 2024, entitled "Electronic Device, Support Structure, Display Module and Hinge Assembly," the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, and in particular to electronic devices, support structures, display modules and hinge assemblies. Background Technology

[0003] In related technologies, foldable electronic devices often require frequent folding, which can cause the display panel to stretch and deform, resulting in black spots on the display panel. To solve this problem, a tensile-resistant layer is usually added to the entire screen during manufacturing. However, this results in an excessively thick display panel. Summary of the Invention

[0004] Embodiments of this application provide an electronic device, a support structure, a display module, and a hinge assembly to solve the problem of stretching and deformation of the display panel while achieving a thinner and lighter display panel.

[0005] In a first aspect, embodiments of this application provide a foldable electronic device. The electronic device includes a display panel, a support structure, and a hinge structure stacked together. The display panel includes a bending region, and the hinge structure is correspondingly disposed in the bending region. The support structure covers the bending region, and the area of ​​the portion of the support structure outside the bending region is smaller than the area of ​​the bending region. The support structure is located between the hinge structure and the bending region. The support structure includes a first tensile layer, which is used to reduce the amount of tensile deformation of the display panel. In this embodiment, because the first tensile layer has good rigidity and tensile strength, after the support structure is bonded to the display panel, the tensile layer can effectively reduce the tensile deformation of the display panel when it is bent, thereby effectively improving the black spot phenomenon on the display panel. In addition, the bending region of the display panel is most prone to tensile deformation because it needs to be bent frequently during use, while the flat region of the display panel usually does not bend, so there is no need to worry about tensile deformation. In this embodiment, since the display panel and the support structure are independently configured, and the support structure covers the bending area, with the area of ​​the portion of the support structure outside the bending area being smaller than the area of ​​the bending area, the support structure can be selectively placed between the bending area of ​​the display panel and the hinge structure during subsequent assembly. A large area of ​​support structure is not required in the flat area of ​​the display panel. This ensures that while the support structure enhances the display panel's resistance to tensile deformation, it effectively reduces the overall thickness of the electronic device, providing a slim and lightweight experience.

[0006] In some embodiments, all areas of the first tensile layer facing the display panel that correspond to the bending area are bonded to the bending area. Because all areas of the first tensile layer facing the display panel that correspond to the bending area are bonded to the bending area, the first tensile layer can provide better tensile resistance to the bending area of ​​the display panel, preventing the bending area of ​​the display panel from being stretched and deformed.

[0007] In some embodiments, the material modulus of the first tensile layer can be between 10 MPa and 500 GPa. In some specific embodiments, the material modulus of the first tensile layer can be between 10 GPa and 500 GPa, for example, the material modulus of the first tensile layer can be 20 GPa, 30 GPa, 40 GPa, 50 GPa, 60 GPa, 70 GPa, 100 GPa, 150 GPa, 200 GPa, 250 GPa, 300 GPa, 350 GPa, 400 GPa, or 450 GPa. A material modulus of the first tensile layer within this range can effectively reduce the tensile deformation of the display panel.

[0008] In some embodiments, the support structure further includes a first buffer layer with a material modulus lower than that of the first tensile layer, the first buffer layer being stacked between the hinge structure and the bending area. In this embodiment, the first buffer layer can provide effective cushioning for the display panel, effectively reducing the risk of the display panel breaking when the electronic device is subjected to impact, and can also effectively improve the problem of bright spots on the display panel.

[0009] The material modulus of the first buffer layer can be between 1 MPa and 10 GPa. For example, the material modulus of the first buffer layer can be 1 GPa, 2 GPa, 3 GPa, 4 GPa, 5 GPa, 6 GPa, 7 GPa, 8 GPa, or 9 GPa. Within this range, the material modulus of the first buffer layer can provide effective cushioning for the display panel, thereby effectively reducing the risk of the display panel breaking when the electronic device is subjected to impact.

[0010] In some embodiments, the support structure includes a first support structure and a second support structure. The first support structure includes a first tensile layer, and the second support structure includes a first buffer layer. When the display panel is in a flat state, the display panel, hinge structure, first support structure, and second support structure are stacked in a first direction. One of the first and second support structures is bonded to the bending area, and the other of the first and second support structures is connected to the hinge structure. The first or second support structure bonded to the hinge structure has a through hole extending through in the first direction. Adhesive is dispensed into the through hole to bond the first and second support structures. In this embodiment, by dispensing adhesive into the through hole, the connection stability and connection strength can be improved. The hinge structure and the first buffer layer can be directly connected by dispensing adhesive, and the thickness of the connection between the hinge structure and the first buffer layer can be minimized. Due to the through hole, the adhesive is applied at the through hole to bond the hinge structure and the first buffer layer, allowing them to adhere to each other without the need for other adhesive layers or intermediate layers. Therefore, this solution is beneficial for the design of thin electronic devices.

[0011] In some embodiments, one of the first and second support structures is welded to the hinge structure. In this embodiment, the welding connection eliminates the need for an optical adhesive layer between the other of the first and second support structures and the hinge structure, which helps to effectively reduce the overall thickness of the electronic device.

[0012] In some embodiments, the first support structure further includes a second buffer layer and a fourth optical adhesive layer stacked between the first tensile layer and the second buffer layer, with the first optical adhesive layer stacked between the first support structure and the display panel or hinge structure; the second support structure further includes a second tensile layer and a fifth optical adhesive layer stacked between the second tensile layer and the first buffer layer, with the second optical adhesive layer stacked between the second support structure and the hinge structure or display panel. In this embodiment, by adding a second tensile layer and a second buffer layer on top of the first tensile layer and the first buffer layer, the tensile strength of the support structure can be improved, effectively reducing the tensile deformation of the display panel and thus effectively improving the black spot phenomenon on the display panel. It can also improve the buffering capacity, effectively reducing the risk of display panel breakage when the electronic device is subjected to impact, and effectively improving the problem of bright spots on the display panel.

[0013] In some embodiments, the first support structure further includes a first optical adhesive layer for bonding the first tensile layer to the display panel or hinge structure; the second support structure further includes a second optical adhesive layer for bonding the first buffer layer to the hinge structure or display panel. In this embodiment, only one tensile layer and one buffer layer are used, which can effectively reduce the overall thickness of the electronic device. This is suitable for scenarios where the thickness of the electronic device is critical, but the requirements for the tensile and drop resistance of the display panel are relatively low.

[0014] In some embodiments, the first support structure further includes a first optical adhesive layer for bonding the first tensile layer to the display panel or hinge structure; the second support structure further includes a second tensile layer and a fifth optical adhesive layer stacked between the second tensile layer and the first buffer layer, with the second optical adhesive layer stacked between the second support structure and the hinge structure or display panel. Alternatively, the first support structure further includes a second buffer layer and a fourth optical adhesive layer stacked between the first tensile layer and the second buffer layer, with the first optical adhesive layer stacked between the first support structure and the display panel or hinge structure; the second support structure further includes a second optical adhesive layer for bonding the first buffer layer to the hinge structure or display panel. In this embodiment, adding a tensile layer or a buffer layer on top of a tensile layer and a buffer layer improves the tensile strength of the display panel of the electronic device in this embodiment by adding a tensile layer, and improves the drop resistance of the display panel of the electronic device in this embodiment by adding a buffer layer.

[0015] In some embodiments, the first support structure further includes a first optical adhesive layer for bonding the first tensile layer to the display panel or hinge structure; the second support structure further includes a second tensile layer, a second buffer layer, a second optical adhesive layer, and a third optical adhesive layer stacked together, the first buffer layer, the second tensile layer, and the second buffer layer being bonded together by a fourth optical adhesive layer and a fifth optical adhesive layer, and a second optical adhesive layer stacked between the second support structure and the hinge structure or display panel. Alternatively, the first support structure further includes a second tensile layer, a second buffer layer, a first optical adhesive layer, and a second optical adhesive layer stacked together, the first tensile layer, the second tensile layer, and the second buffer layer being bonded together by a fourth optical adhesive layer and a fifth optical adhesive layer, and a first optical adhesive layer stacked between the first support structure and the display panel or hinge structure; the second support structure further includes a second optical adhesive layer for bonding the first buffer layer to the hinge structure or display panel. In this embodiment, by adding a second tensile layer and a second buffer layer on top of the first tensile layer and the first buffer layer, the tensile strength of the support structure can be improved, effectively reducing the tensile deformation of the display panel and thus effectively improving the black spot phenomenon on the display panel. This solution can also improve the buffering capacity, effectively reducing the risk of display panel breakage when the electronic device is subjected to impact, and effectively improving the problem of bright spots on the display panel.

[0016] In some embodiments, the electronic device further includes a lubricating layer, which is stacked between the first and second support structures. In this embodiment, the first and second support structures can slide relative to each other at positions corresponding to the lubricating layer with low friction. The adhesive application ensures a stable connection, preventing significant bulging of the display panel during bending. The combination of the lubricating layer and the adhesive application protects the morphological stability of the bending area of ​​the screen display.

[0017] In some embodiments, one of the first and second support structures is connected to the display panel, and the other of the first and second support structures is connected to a hinge structure. A third optical adhesive layer is provided between the first and second support structures for bonding them. In this embodiment, because a third optical adhesive layer is provided between the first and second support structures, the first and second support structures can be connected together through the third optical adhesive layer. This solution provides a specific support structure connection scheme, in which the first and second support structures are bonded together using a third optical adhesive layer, which is easy to implement in terms of manufacturing process.

[0018] In some embodiments, a first support structure, a third optical adhesive layer, and a second support structure are stacked to form a support structure. The support structure is bonded to the bending area or hinge structure by the optical adhesive layer, and the support structure can be an integral modular structure. In this embodiment, the first and second support structures can be connected together to form the support structure first, and then the support structure can be connected to the display panel or hinge structure, which can save process steps.

[0019] In some embodiments, a third optical adhesive layer is provided between the first tensile layer and the first buffer layer; the optical adhesive layer is stacked on the side of the first tensile layer opposite to the first buffer layer, or the optical adhesive layer is stacked on the side of the first buffer layer opposite to the first tensile layer. In this embodiment, the first tensile layer and the first buffer layer can be bonded together by the third optical adhesive layer, and then the whole assembly can be connected to the display panel or hinge structure, which can save process steps.

[0020] In some embodiments, the first support structure further includes a second tensile layer or a second buffer layer stacked with the first tensile layer and the first buffer layer, and a fourth optical adhesive layer stacked between the first tensile layer and the second tensile layer or the second buffer layer, the fourth optical adhesive layer being stacked between the first tensile layer and the first buffer layer; a third optical adhesive layer is provided between the first support structure and the first buffer layer, the optical adhesive layer being stacked on the side of the first support structure opposite to the first buffer layer, or the optical adhesive layer being stacked on the side of the first buffer layer opposite to the first support structure. Alternatively, the second support structure further includes a second tensile layer or a second buffer layer stacked with the first tensile layer and the first buffer layer, and a fourth optical adhesive layer stacked between the first buffer layer and the second tensile layer or the second buffer layer, the fourth optical adhesive layer being stacked between the second support structure and the first tensile layer; a third optical adhesive layer is provided between the second support structure and the first tensile layer, the optical adhesive layer being stacked on the side of the second support structure opposite to the first tensile layer, or the optical adhesive layer being stacked on the side of the first tensile layer opposite to the second support structure. In this embodiment, the first support structure layer and the support structure layer can be bonded together using a third optical adhesive layer, and then the whole assembly can be connected to the display panel or hinge structure, which can save process steps. Furthermore, since a second tensile layer and a second buffer layer are added on top of the first tensile layer and the first buffer layer, the tensile strength of the support structure can be improved, effectively reducing the tensile deformation of the display panel and thus effectively improving the black spot phenomenon on the display panel. It can also improve the cushioning capacity, effectively reducing the risk of display panel breakage when the electronic device is subjected to impact, and effectively improving the problem of bright spot damage to the display panel.

[0021] In some embodiments, the first support structure further includes a second buffer layer, and the second support structure further includes a second tensile layer. The first tensile layer, the first buffer layer, the second buffer layer, and the second tensile layer are stacked. The first support structure also includes a fourth optical adhesive layer stacked between the first tensile layer and the second buffer layer, and the second support structure further includes a fifth optical adhesive layer stacked between the first buffer layer and the second tensile layer. In this embodiment, because a second tensile layer and a second buffer layer are added on top of the first tensile layer and the first buffer layer, the tensile strength of the support structure can be improved, thereby effectively reducing the tensile deformation of the display panel and thus effectively improving the black spot phenomenon on the display panel.

[0022] In some embodiments, the thickness of the first buffer layer can be 10μm-150μm, for example, the thickness of the first buffer layer can be 40μm, 70μm, 100μm, or 120μm, and the thickness of the first tensile layer can be 10μm-150μm, for example, the thickness of the first tensile layer can be 20μm, 40μm, 70μm, 100μm, 130μm, or 140μm. In this embodiment, within this thickness range, the first buffer layer can play a buffering role, and the first tensile layer can play a tensile resistance role.

[0023] Secondly, embodiments of this application provide a foldable support structure, the support structure including a first support structure and a second support structure, the first support structure including a first tensile layer, the second support structure including a first buffer layer, the first support structure and the second support structure being stacked in a first direction, one of the first support structure and the second support structure being used to be bonded to a display panel, the other of the first support structure and the second support structure being used to be connected to a hinge structure, the first support structure or the second support structure connected to the hinge structure having a through hole extending in the first direction, the through hole having adhesive applied to it, the adhesive being used to bond the first support structure and the second support structure.

[0024] In some embodiments, the first support structure further includes a second buffer layer and a fourth optical adhesive layer stacked between the first tensile layer and the second buffer layer, wherein the first optical adhesive layer is stacked between the first support structure and the display panel or the hinge structure;

[0025] The second support structure further includes a second tensile layer and a fifth optical adhesive layer stacked between the second tensile layer and the first buffer layer, wherein the second optical adhesive layer is stacked between the second support structure and the hinge structure or the display panel.

[0026] In some embodiments, the first support structure further includes a first optical adhesive layer for bonding the first tensile layer to the display panel or the hinge structure;

[0027] The second support structure further includes a second optical adhesive layer for bonding the first buffer layer to the hinge structure or the display panel.

[0028] In some embodiments, the first support structure further includes a first optical adhesive layer for bonding the first tensile layer to the display panel or the hinge structure; the second support structure further includes a second tensile layer and a fifth optical adhesive layer stacked between the second tensile layer and the first buffer layer, wherein the second support structure and the hinge structure or the display panel are stacked together with the second optical adhesive layer.

[0029] or,

[0030] The first support structure further includes a second buffer layer and a fourth optical adhesive layer stacked between the first tensile layer and the second buffer layer. The first optical adhesive layer is stacked between the first support structure and the display panel or the hinge structure. The second support structure further includes a second optical adhesive layer for bonding the first buffer layer to the hinge structure or the display panel.

[0031] In some embodiments, the first support structure further includes a first optical adhesive layer for bonding the first tensile layer to the display panel or the hinge structure; the second support structure further includes a second tensile layer, a second buffer layer, a second optical adhesive layer and a third optical adhesive layer stacked together, the first buffer layer, the second tensile layer and the second buffer layer being bonded together by a fourth optical adhesive layer and a fifth optical adhesive layer, and a second optical adhesive layer being stacked between the second support structure and the hinge structure or the display panel;

[0032] or,

[0033] The first support structure further includes a second tensile layer, a second buffer layer, a first optical adhesive layer, and a second optical adhesive layer stacked together. The first tensile layer, the second tensile layer, and the second buffer layer are bonded together by a fourth optical adhesive layer and a fifth optical adhesive layer. The first optical adhesive layer is stacked between the first support structure and the display panel or the hinge structure. The second support structure further includes a second optical adhesive layer for bonding the first buffer layer to the hinge structure or the display panel.

[0034] Thirdly, embodiments of this application provide a foldable display module. The display module includes a display panel and a support structure stacked together. The display panel includes a bending region, and the support structure covers the bending region. The area of ​​the portion of the support structure outside the bending region is smaller than the area of ​​the bending region. The support structure includes a first tensile layer, and the material modulus of the first tensile layer can be 10 GPa-500 GPa. The bending region of the display panel is used to assemble onto a mid-frame structure with a hinge structure. The hinge structure is correspondingly located in the bending region, and the support structure is stacked between the bending region of the display panel and the hinge structure.

[0035] Fourthly, embodiments of this application provide a foldable hinge assembly, the hinge assembly including a hinge structure and a support structure stacked on the hinge structure, the support structure including a first tensile layer, the material modulus of the first tensile layer being 10Gpa-500Gpa; the hinge assembly is used for assembly with a foldable display panel, the hinge structure and the support structure are correspondingly disposed in the bending area of ​​the display panel, the support structure is stacked between the bending area of ​​the display panel and the hinge structure, and the first tensile layer is used to reduce the tensile deformation of the display panel.

[0036] Fifthly, embodiments of this application provide a foldable mid-frame structure, the mid-frame structure including a shell, a hinge structure connected to the shell, and a support structure stacked on the hinge structure. The support structure includes a first tensile layer, the material modulus of which can be 10Gpa-500Gpa. The mid-frame structure is used for assembly with a foldable display panel. The hinge structure and the support structure are correspondingly located in the bending area of ​​the display panel. The support structure is stacked between the bending area of ​​the display panel and the hinge structure. The first tensile layer is used to reduce the tensile deformation of the display panel. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0038] Figure 1A illustrates a two-fold foldable electronic device provided in an embodiment of this application;

[0039] Figure 1B shows a three-fold foldable electronic device provided in an embodiment of this application;

[0040] Figure 2 is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0041] Figure 3 is a schematic diagram of the support structure of the display panel in Figure 2;

[0042] Figure 4 is a schematic diagram of a mid-frame structure provided in an embodiment of this application;

[0043] Figure 5 is a structural schematic diagram of a support structure provided in an embodiment of this application;

[0044] Figure 6A shows an implementation of the support structure in Figure 5 with a tensile layer and a buffer layer;

[0045] Figure 6B shows an implementation of the support structure in Figure 5 with a tensile layer and a buffer layer;

[0046] Figure 6C shows an implementation of the support structure in Figure 5 with a tensile layer and a buffer layer;

[0047] Figure 7A shows an implementation of the support structure in Figure 5 with two tensile layers and one buffer layer;

[0048] Figure 7B shows an implementation of the support structure in Figure 5 with two tensile layers and one buffer layer.

[0049] Figure 7C shows an implementation of the support structure in Figure 5 with two buffer layers and one tensile layer;

[0050] Figure 7D shows an implementation of the support structure in Figure 5 with two buffer layers and one tensile layer;

[0051] Figure 8A shows an implementation of the support structure in Figure 5 with two tensile layers and two buffer layers;

[0052] Figure 8B shows an implementation of the support structure in Figure 5 with two tensile layers and two buffer layers;

[0053] Figure 8C shows an implementation of the support structure in Figure 5 with two tensile layers and two buffer layers;

[0054] Figure 8D shows an implementation of the support structure in Figure 5 with two tensile layers and two buffer layers;

[0055] Figure 9A shows an implementation of the support structure in Figure 5 with two tensile layers and two buffer layers;

[0056] Figure 9B shows an implementation of the support structure in Figure 5 with two tensile layers and two buffer layers;

[0057] Figure 9C shows an implementation of the support structure in Figure 5 with two tensile layers and two buffer layers;

[0058] Figure 10 is a simplified schematic diagram of an electronic device provided in an embodiment of this application;

[0059] Figure 10A is a simplified schematic diagram of another electronic device provided in an embodiment of this application;

[0060] Figure 10B is a simplified schematic diagram of another electronic device provided in an embodiment of this application;

[0061] Figure 10C is a simplified schematic diagram of another electronic device provided in an embodiment of this application;

[0062] Figure 10D is a simplified schematic diagram of another electronic device provided in an embodiment of this application;

[0063] Figure 10E is a simplified schematic diagram of another electronic device provided in an embodiment of this application;

[0064] Figure 11A shows a specific embodiment of the electronic device provided in this application;

[0065] Figure 11B shows a specific embodiment of the electronic device provided in this application;

[0066] Figure 11C shows a specific embodiment of the electronic device provided in this application;

[0067] Figure 11D shows a specific embodiment of the electronic device provided in this application;

[0068] Figure 11E shows a specific embodiment of the electronic device provided in this application;

[0069] Figure 11F shows a specific embodiment of the electronic device provided in this application;

[0070] Figure 11G shows a specific embodiment of the electronic device provided in this application;

[0071] Figure 11H shows a specific embodiment of the electronic device provided in this application;

[0072] Figure 11I shows a specific embodiment of the electronic device provided in this application;

[0073] Figure 11J shows a specific embodiment of the electronic device provided in this application;

[0074] Figure 11K shows a specific embodiment of the electronic device provided in this application;

[0075] Figure 11L shows a specific embodiment of the electronic device provided in this application;

[0076] Figure 12 illustrates another embodiment of the electronic device provided in this application.

[0077] Figure 13 is a structural schematic diagram of another display module provided in an embodiment of this application;

[0078] Figure 14 is a structural schematic diagram of a hinge assembly provided in an embodiment of this application;

[0079] Figure 15 is a schematic diagram of another middle frame structure provided in the embodiment of this application.

[0080] Explanation of reference numerals in the attached drawings: Z, first direction; 1, electronic device; 10, mid-frame structure; 11, housing; 12, hinge structure; 20, display panel; 201, bending area; 202, straight area; 21, support layer; 22, display layer; 23, cover plate layer; 30, support structure; 301, tensile layer; 302, buffer layer; 303, through hole; 304, part of the support structure outside the bending area; 305, part of the support structure corresponding to the bending area; 31, first support structure; 32, first tensile layer; 33, second tensile layer; 34, second buffer layer; 35, second support structure; 36, first buffer layer; 41, first optical adhesive layer; 42, second optical adhesive layer; 43, third optical adhesive layer; 44, fourth optical adhesive layer; 45, fifth optical adhesive layer; 402, dispensing adhesive; 50, lubricating layer. Detailed Implementation

[0081] The following section will first explain some of the terms used in the embodiments of this application.

[0082] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0083] First, some terms in the embodiments of this application will be explained so that those skilled in the art can understand them.

[0084] Foldable electronic devices (hereinafter also referred to as "devices with foldable screens", "foldable screen devices" or "electronic devices", etc.) specifically refer to electronic devices with foldable display panels. The foldable display panel in the electronic device can be a single-piece flexible display panel, or a splicing display panel composed of multiple flexible display panels and hinges located between each two flexible display panels, or a splicing display panel composed of multiple rigid screens and a flexible screen located between each two rigid screens, or a splicing display panel composed of multiple rigid screens and hinges located between each two rigid screens, etc. The embodiments of this application do not limit this.

[0085] The folded state refers to the posture / shape of the display panel of an electronic device after it has been folded. The electronic device can control the display panel to display content using corresponding display strategies in different folded states, specifically including the folded state and the stand state. The unfolded state refers to the display panel being fully unfolded.

[0086] Users can adjust the angle between the folded screens by folding the display panel to form the folded state of the display panel. Therefore, the folded state of the display panel can be characterized by the angle between the folded screens. Optionally, the folded state of the display panel can be characterized by the angle between the folded screens and spatial information. The spatial information is used to indicate whether the folded screens are facing away from each other and / or facing each other.

[0087] Figure 1A shows a two-fold foldable electronic device 1 provided in an embodiment of this application, and Figure 1B shows a three-fold foldable electronic device 1 provided in an embodiment of this application.

[0088] Referring to Figures 1A and 1B, the embodiments of this application can refer to any electronic device 1 having a foldable screen. In the embodiments of this application, the electronic device 1 can be a portable electronic device 1, such as a mobile phone or tablet computer. Exemplary embodiments of the portable electronic device 1 include, but are not limited to, portable electronic devices 1 running or other operating systems. The aforementioned portable device can also be other portable devices, as long as it has a foldable touchscreen. It should also be understood that in some other embodiments of this application, the aforementioned electronic device 1 may not be a portable device, but rather a desktop computer with a foldable touchscreen.

[0089] To better understand the technical solutions provided in the embodiments of this application, the application scenarios of the embodiments of this application will be introduced first below.

[0090] The foldable electronic device 1 can provide service information through an application interface. It should be understood that the application interface refers to the interface related to the application, such as the interface of pre-installed system applications, third-party application interfaces, application icon interfaces, the interface after the application is opened, and notification message interfaces. The foldable electronic device 1 can achieve different functions by installing different applications. These applications can be one or more of the following: camera applications, instant messaging applications, etc. Instant messaging applications can be various, such as WeChat, Tencent QQ, WhatsApp Messenger, Line, Kakao Talk, DingTalk, etc. Users can send text, voice, images, video files, and other files to other contacts through instant messaging applications; or users can make voice and video calls with other contacts through instant messaging applications. The applications designed below can be applications that come pre-installed with the electronic device 1 at the factory, applications that the electronic device 1 downloads and installs from the network, or applications that the electronic device 1 receives from other electronic devices 1; this application embodiment does not limit the scope of these applications.

[0091] Currently, there is no reasonable solution for how foldable electronic devices 1 should display corresponding content in different states of the foldable screen (including folded state, stand state, and unfolded state).

[0092] Among them, the folded state can be understood as a fully folded state, the support state can be understood as a half-folded state or a partially folded state, and the unfolded state can be understood as a fully unfolded state.

[0093] Referring to Figures 1A and 1B, the electronic device 1 includes a mid-frame structure 10, a display panel 20, and a support structure 30 located between the display panel 20 and the mid-frame structure 10. The display panel 20 is used to display information such as text, images, or videos. Both the display panel 20 and the mid-frame structure 10 are foldable, having both a folded state and a displayed state. The support structure 30 is located between the display panel 20 and the mid-frame structure 10 to release stress when the electronic device 1 is subjected to impact, effectively reducing the probability of damage to the display panel 20 (such as black spots and bright spots).

[0094] It is understandable that the display panel 20 and the mid-frame structure 10 fold synchronously. For example, Figures 1A and 1B both show the display panel 20 in a half-folded state, at which time the mid-frame structure 10 is also in a half-folded state. It should be understood that when the display panel 20 is in a flattened state, the mid-frame structure 10 is also in a flattened state.

[0095] When the display panel 20 is exposed after folding, it is in an outward-folded posture; when the display panel 20 is hidden within the mid-frame structure 10 after folding, it is in an inward-folded posture. It can be understood that in some cases, such as multi-folded display panels 20, both outward and inward folds may exist simultaneously. In this embodiment, the display panel 20 can be outward-folded, inward-folded, or both simultaneously.

[0096] Figure 2 is a schematic diagram of the structure of a display panel 20 provided in an embodiment of this application; Figure 3 is a schematic diagram of the support structure of the display panel 20 in Figure 2. The display panel 20 in this embodiment can be applied to the electronic device 1 mentioned above.

[0097] Referring to Figures 2 and 3, the display panel 20 includes a bent region 201 and a straight region 202. The straight region 202 may be disposed at least on one side of the bent region 201. In this embodiment, the bent region 201 is disposed in the middle of the straight region 202, thereby allowing the straight region 202 to bend or fold relative to the bent region 201. It should be noted that the bent region 201 of the display panel 20 refers to the area where the display panel 20 undergoes a significant bend when the electronic device 1 is folded, while the area where no significant bend occurs is the straight region 202.

[0098] In some embodiments, the display panel 20 includes a support layer 21, a display layer 22 and a cover layer 23 stacked together, wherein the display layer 22 is located between the support layer 21 and the cover layer 23.

[0099] The main function of the support layer 21 is to provide the necessary support force to the display layer 22 to ensure the stability of the display layer 22 and to ensure the overall mechanical strength of the display panel 20.

[0100] The display layer 22 is the core component of the display panel 20. The display layer 22 is mainly responsible for receiving and processing signals and emitting images or information in the form of light. For example, in some embodiments, the display layer 22 typically includes a pixel definition layer, a planarization layer, and an organic light-emitting diode (OLED) layer.

[0101] The cover layer 23 covers the display layer 22 to protect the display layer 22 from external influences and improve the stability of the display layer 22.

[0102] In some embodiments, the display panel 20 further includes a protective film. The display panel 20 is mounted on the mid-frame structure 10, and the protective film is attached to the display surface of the display panel facing away from the mid-frame structure 10. The size and shape of the protective film are adapted to the size and shape of the display surface of the display panel 20. The protective film is completely adhered to the display surface, and the edges of the protective film are aligned with the edges of the display surface. The protective film provides all-around protection for the display panel 20, preventing it from breaking due to drops, and is less prone to scratches during use, thus improving the user experience.

[0103] Figure 4 is a schematic diagram of a mid-frame structure 10 provided in an embodiment of this application. The mid-frame structure 10 in this embodiment can be applied to the electronic device 1 mentioned above.

[0104] Referring to Figure 4, in some embodiments, the mid-frame structure 10 includes a housing 11 and a hinge structure 12. The hinge structure 12 is located at the position where the housing 11 needs to be folded, so that the housing 11 can be folded through the hinge structure 12. The display panel 20 is assembled onto the housing 11, and the hinge structure 12 corresponds to the bending area 201 of the display panel 20, so that the display panel 20 and the housing 11 can be bent or unfolded synchronously.

[0105] Figure 5 is a structural schematic diagram of a support structure 30 provided in an embodiment of this application.

[0106] Referring to Figure 5, the support structure 30 includes a tensile layer 301. The material modulus of the tensile layer 301 can be greater than 10 MPa. For example, the material modulus of the tensile layer 301 can be between 10 GPa and 500 GPa. Specifically, the material modulus of the tensile layer 301 can be 10 GPa, 20 GPa, 30 GPa, 40 GPa, 50 GPa, 60 GPa, 70 GPa, 80 GPa, 100 GPa, 150 GPa, 200 GPa, 250 GPa, 300 GPa, 350 GPa, 400 GPa, 450 GPa, or 500 GPa. Within this range, the tensile layer 301 has good stiffness and tensile strength. Therefore, after the support structure 30 is bonded to the display panel 20, when the display panel 20 is bent, the tensile layer 301 can effectively reduce the tensile deformation of the display panel 20, thereby effectively improving the black spot phenomenon on the display panel 20.

[0107] In some embodiments, the tensile layer 301 may be made of materials such as stainless steel, titanium alloy, aluminum alloy, copper foil, or even ultra-thin glass.

[0108] In some embodiments, the support structure 30 further includes a buffer layer 302 stacked with the tensile layer 301. The material modulus of the buffer layer 302 can be between 1 MPa and 10 GPa, for example, the material modulus of the buffer layer 302 can be 1 GPa, 2 GPa, 3 GPa, 4 GPa, 5 GPa, 6 GPa, 7 GPa, 8 GPa, or 9 GPa. With the material modulus of the buffer layer 302 within this range, the buffer layer 302 can provide effective cushioning for the display panel 20, effectively reducing the risk of the display panel 20 breaking when the electronic device 1 is subjected to impact. Furthermore, it can effectively improve the problem of bright spots on the display panel 20.

[0109] It is understood that the number of tensile layers 301 in the support structure 30 in this embodiment can also be multiple, such as two tensile layers 301, three tensile layers 301, etc. The number of buffer layers 302 can also be multiple, such as two or three buffer layers 302.

[0110] Figures 6A-6C show implementations of the support structure 30 in Figure 5, which has a tensile layer 301 and a buffer layer 302.

[0111] Referring to Figures 6A-6C, in some embodiments, the support structure 30 includes a first support structure 31 and a second support structure 35. The first support structure 31 and the second support structure 35 are bonded together, for example, by using an optical adhesive layer to bond the first support structure 31 and the second support structure 35 together, or by applying adhesive 402 (which cures after cooling) to bond the first support structure 31 and the second support structure 35 together.

[0112] The first support structure 31 includes a first tensile layer 32, the material modulus of which can be greater than 10 MPa. In some embodiments, the material modulus of the first tensile layer 32 is between 10 MPa and 500 GPa. For example, the material modulus of the first tensile layer 32 can be between 10 GPa and 500 GPa, specifically 20 GPa, 30 GPa, 40 GPa, 50 GPa, 60 GPa, 70 GPa, 100 GPa, 150 GPa, 200 GPa, 250 GPa, 300 GPa, 350 GPa, 400 GPa, or 450 GPa. With the material modulus of the first tensile layer 32 within this range, the tensile deformation of the display panel 20 can be effectively reduced.

[0113] The second support structure 35 includes a first buffer layer 36, the material modulus of which can be 1 MPa-10 GPa. For example, in some embodiments, the material modulus of the first buffer layer 36 can be 1 MPa-10 GPa, such as 1 GPa, 2 GPa, 3 GPa, 4 GPa, 5 GPa, 6 GPa, 7 GPa, 8 GPa, or 9 GPa. Within this range, the material modulus of the first buffer layer 36 can provide effective cushioning for the display panel 20, thereby effectively reducing the risk of the display panel 20 breaking when the electronic device 1 is subjected to impact.

[0114] The first tensile layer 32 and the first buffer layer 36 are stacked.

[0115] In this embodiment, the support structure 30 can effectively reduce the tensile deformation of the display panel 20 through the tensile layer 301, thereby effectively improving the black spot phenomenon on the display panel 20. The buffer layer 302 can also provide effective cushioning for the display panel 20, effectively reducing the risk of breakage when the electronic device 1 is subjected to impact. Furthermore, it can effectively improve the problem of bright spots on the display panel 20. In addition, since the first buffer layer 36 is made of a low-modulus material and the first tensile layer 32 is made of a high-modulus material, when the first tensile layer 32 and the first buffer layer 36 are stacked, the elasticity of the first buffer layer 36 can release the stress of the first tensile layer 32 during bending, reducing stress concentration and effectively improving the service life and stability of the first tensile layer 32.

[0116] Referring to FIG6A, in some embodiments, a first optical adhesive layer 41 is stacked on the side of the first tensile layer 32 opposite to the first buffer layer 36, and the first optical adhesive layer 41 is used to bond to the display panel 20 or the hinge structure 12.

[0117] A second optical adhesive layer 42 is stacked on the side of the first buffer layer 36 away from the first tensile layer 32. The second optical adhesive layer 42 is used to bond to the display panel 20 or the hinge structure 12.

[0118] It is understandable that when one of the first optical adhesive layer 41 and the second optical adhesive layer 42 is bonded to the hinge structure 12, the other is bonded to the display panel 20.

[0119] For ease of description, the stacking direction of the first tensile layer 32 and the first buffer layer 36 when the display panel 20 is in the unfolded state is defined as the first direction Z. When the first direction Z is used below, it refers to the situation when the display panel 20 is in the unfolded state.

[0120] In some embodiments, the first tensile layer 32 has a through hole 303 penetrating through the first tensile layer 32 in the first direction Z. The first optical adhesive layer 41 has a through hole 303 at a position corresponding to the through hole 303 on the first tensile layer 32, so as to communicate with the through hole 303 of the first tensile layer 32. The through holes 303 of the first tensile layer 32 and the first optical adhesive layer 41 are used to accommodate the dispensing adhesive 402 (which cures after cooling), so that the dispensing adhesive 402 can be directly applied into the through hole 303, preventing the dispensing adhesive 402 from overflowing. In this embodiment, the first tensile layer 32 is connected to the hinge structure 12. By providing the dispensing adhesive 402 in the through hole 303, the hinge structure 12 and the first buffer layer 36 can be directly connected by the dispensing adhesive 402. The connection through the dispensing adhesive 402 can improve the connection stability and connection strength. Furthermore, by applying adhesive 402, the hinge structure 12 can be directly connected to the first buffer layer 36, and the thickness of the connection between the first tensile layer 32 and the first buffer layer 36 can be minimized. Due to the setting of the through hole 303, the adhesive 402 bonds the hinge structure 12 and the first buffer layer at the position of the through hole 303, which can realize that the first tensile layer 32 and the first buffer layer 36 can be directly bonded without the need for other adhesive layers or intermediate layers. Therefore, this solution is beneficial to the design of thin electronic device 1.

[0121] Referring to Figure 6B, in some embodiments, a second optical adhesive layer 42 is stacked on the side of the first buffer layer 36 opposite to the first tensile layer 32. The second optical adhesive layer 42 is used to bond to the display panel 20. Compared to the embodiment in Figure 6A, in the embodiment in Figure 6B, the first tensile layer 32 does not have a first optical adhesive layer 41 on the side opposite to the first buffer layer 36. In this embodiment, the first tensile layer 32 can be connected to the hinge structure 12 by welding. This method reduces one optical adhesive layer, thereby effectively reducing the overall thickness of the electronic device 1.

[0122] It is understood that in some other embodiments, the first tensile layer 32 may have a first optical adhesive layer 41 on the side opposite to the first buffer layer 36, but the first buffer layer 36 may not have a second optical adhesive layer 42 on the side opposite to the first tensile layer 32. In this case, the first buffer layer 36 is welded to the hinge structure 12, and the first tensile layer is welded to the display panel 20 through the first optical adhesive.

[0123] Referring to FIG6C, in some embodiments, a first optical adhesive layer 41 is stacked on the side of the first tensile layer 32 opposite to the first buffer layer 36, and the first optical adhesive layer 41 is used to bond to the display panel 20 or the hinge structure 12.

[0124] A second optical adhesive layer 42 is stacked on the side of the first buffer layer 36 away from the first tensile layer 32. The second optical adhesive layer 42 is used to bond to the display panel 20 or the hinge structure 12.

[0125] A third optical adhesive layer 43 is provided between the first tensile layer 32 and the first buffer layer 36, and the first buffer layer 36 and the second buffer layer 34 are bonded together by the third optical adhesive layer 43. The support structure 30 can be an integrated modular structure. In this embodiment, the support structure 30 can be formed by first connecting the first support structure 31 and the second support structure 35 together, and then connecting the support structure 30 to the display panel 20 or the hinge structure 12, which can save process steps.

[0126] It is understood that in some embodiments, the first tensile layer 32 or the first buffer layer 36 may be connected to the hinge structure 12 by welding, without the first optical adhesive layer 41 or the second optical adhesive layer 42.

[0127] Figures 7A and 7B illustrate an embodiment of the support structure 30 in Figure 5, which has two tensile layers 301 and one buffer layer 302. Figures 7A and 7B further illustrate the support structure 30 in the embodiments of Figures 6A and 6C with an additional tensile layer 301. To avoid repetition, content identical to that in Figures 6A and 6C will not be repeated.

[0128] Referring to Figures 7A-7B, in some embodiments, the first support structure 31 includes a first tensile layer 32.

[0129] The second support structure 35 includes a first buffer layer 36 and a second tensile layer 33 stacked together. The material modulus of the first buffer layer 36 is 1 MPa-10 GPa, and the material modulus of the second tensile layer 33 can be greater than 10 MPa. For example, in some embodiments, the material modulus of the second tensile layer 33 can be 10 MPa-500 GPa, such as 10 GPa-500 GPa. Specifically, the material modulus of the second tensile layer 33 can be 10 GPa, 20 GPa, 30 GPa, 40 GPa, 50 GPa, 60 GPa, 70 GPa, 80 GPa, 100 GPa, 150 GPa, 200 GPa, 250 GPa, 300 GPa, 350 GPa, 400 GPa, 450 GPa, or 500 GPa.

[0130] The first tensile layer 32, the first buffer layer 36, and the second tensile layer 33 are stacked together.

[0131] In this embodiment, since a second tensile layer 33 is added on top of the first tensile layer 32 and the first buffer layer 36, the tensile strength of the support structure 30 can be improved, thereby effectively reducing the stretching deformation of the display panel 20 and thus effectively improving the black spot phenomenon on the display panel 20.

[0132] Referring to FIG7A, in some embodiments, a first optical adhesive layer 41 is stacked on the side of the first tensile layer 32 opposite to the first buffer layer 36, and the first optical adhesive layer 41 is used to bond to the display panel 20 or the hinge structure 12.

[0133] The second support structure 35 also includes a fifth optical adhesive layer 45 stacked between the first buffer layer 36 and the second tensile layer 33.

[0134] The second support structure 35 has a second optical adhesive layer 42 stacked on the side opposite to the first tensile layer 32. The second optical adhesive layer 42 is used to bond to the display panel 20 or the hinge structure 12.

[0135] It is understandable that when one of the first optical adhesive layer 41 and the second optical adhesive layer 42 is bonded to the hinge structure 12, the other is bonded to the display panel 20.

[0136] In some embodiments, the first buffer layer 36 is located between the first tensile layer 32 and the second tensile layer 33. Because the first buffer layer 36 is located between the first tensile layer 32 and the second tensile layer 33, it can simultaneously provide stress relief for both the first tensile layer 32 and the second tensile layer 33, thereby improving both the service life and stability of the first tensile layer 32 and the second tensile layer 33. It is understood that in other embodiments, the second tensile layer 33 may also be located between the first buffer layer 36 and the first tensile layer 32.

[0137] In some embodiments, the first tensile layer 32 has a through-hole 303 extending through the first tensile layer 32 in a first direction Z. The first optical adhesive layer 41 has a through-hole 303 at a position corresponding to the through-hole 303 on the first tensile layer 32, so as to communicate with the through-hole 303 of the first tensile layer 32. The through-holes 303 of the first tensile layer 32 and the first optical adhesive layer 41 are used to accommodate the dispensing adhesive 402 (which cures after cooling), preventing the dispensing adhesive 402 from overflowing. In this embodiment, the first tensile layer 32 is connected to the hinge structure 12 so as to connect the second support structure 35 and the hinge structure 12 by dispensing adhesive 402 in the through-hole 303.

[0138] It is understood that in some other embodiments, the second support structure 35 and the second optical adhesive layer 42 may also have a through hole 303 extending through the second support structure 35 and the second optical adhesive layer 42 along the first direction Z. In this case, the second support structure 35 is connected to the hinge structure 12.

[0139] It is understood that in some other embodiments, the first optical adhesive layer 41 can be removed from the embodiment of FIG. 7A, and the first tensile layer 32 can be connected to the hinge structure 12 by welding. Alternatively, the second optical adhesive layer 42 can be removed from the embodiment of FIG. 7A, and the second support structure 35 can be connected to the hinge structure 12 by welding, for example, welding the second tensile layer 33 to the hinge structure 12.

[0140] Referring to FIG7B, in some embodiments, a first optical adhesive layer 41 is stacked on the side of the first tensile layer 32 opposite to the first buffer layer 36, and the first optical adhesive layer 41 is used to bond to the display panel 20 or the hinge structure 12.

[0141] The second support structure 35 also includes a fifth optical adhesive layer 45 stacked between the first buffer layer 36 and the second tensile layer 33.

[0142] The second support structure 35 has a second optical adhesive layer 42 stacked on the side opposite to the first tensile layer 32. The second optical adhesive layer 42 is used to bond to the display panel 20 or the hinge structure 12.

[0143] A third optical adhesive layer 43 is provided between the first tensile layer 32 and the second support structure 35, and the first tensile layer 32 and the second support structure 35 are bonded together by the third optical adhesive layer 43. It can be understood that the first tensile layer 32 and the second support structure 35 can also be connected by applying adhesive 402, for example, applying adhesive 402 to the first tensile layer 32, and bonding the first tensile layer 32 and the second support structure 35 after the adhesive 402 has cured.

[0144] It is understood that in some other embodiments, the first support structure 31 may also include a second tensile layer 33. A fourth optical adhesive layer 44 is stacked between the first tensile layer 32 and the second tensile layer 33, and the first optical adhesive layer 41 is located on the side of the first support structure 31 opposite to the second support structure 35.

[0145] Figures 7C-7D show embodiments of the support structure 30 in Figure 5 with two buffer layers 302 and one tensile layer 301. Figures 7C-7D are embodiments of the support structure 30 in Figures 6A-6C with an additional buffer layer 302. To avoid repetition, the same content as in Figures 6A-6C will not be repeated.

[0146] Referring to Figures 7C-7D, in some embodiments, the first support structure 31 includes a first tensile layer 32 and a second buffer layer 34. The material modulus of the second buffer layer 34 can be 1 MPa to 10 GPa. For example, the material modulus of the second buffer layer 34 can specifically be 100 MPa, 1 GPa, 2 GPa, 3 GPa, 4 GPa, 5 GPa, 6 GPa, 7 GPa, 8 GPa, or 9 GPa.

[0147] The second support structure 35 includes a first buffer layer 36 stacked on top of each other.

[0148] The first tensile layer 32, the second buffer layer 34, and the first buffer layer 36 are stacked together.

[0149] In this embodiment, since a second buffer layer 34 is added on top of the first tensile layer 32 and the first buffer layer 36, the first buffer layer 36 and the second buffer layer 34 can provide effective cushioning for the display panel 20, thereby effectively reducing the risk of the display panel 20 breaking when the electronic device 1 is subjected to impact. Furthermore, it can effectively improve the problem of bright spots on the display panel 20.

[0150] In some embodiments, the first tensile layer 32 is stacked between the first buffer layer 36 and the second buffer layer 34, so that stress can be released on both sides of the first tensile layer 32 through the first buffer layer 36 and the second buffer layer 34, thereby improving the service life and stability of the first tensile layer 32.

[0151] It is understood that in some other embodiments, the second buffer layer 34 may be disposed between the first tensile layer 32 and the first buffer layer 36.

[0152] Referring to FIG7C, in some embodiments, a first optical adhesive layer 41 is stacked on the side of the first support structure 31 opposite to the first buffer layer 36, and the first optical adhesive layer 41 is used to bond to the display panel 20 or the hinge structure 12.

[0153] A fourth optical adhesive layer 44 is provided between the first tensile layer 32 and the second buffer layer 34 to bond the first tensile layer 32 and the second buffer layer 34 together.

[0154] A second optical adhesive layer 42 is stacked on the side of the first buffer layer 36 away from the first support structure 31. The second optical adhesive layer 42 is used to bond with the display panel 20 or the hinge structure 12.

[0155] In some embodiments, the first support structure 31 and the second support structure 35 are connected by dispensing adhesive 402, which stably bonds the first support structure 31 and the second support structure 35 after the adhesive 402 cools. For example, the adhesive 402 is applied to the first support structure 31, such as to the first tensile layer 32 or the second buffer layer 34, and then the first support structure 31 and the second support structure 35 are bonded together.

[0156] Referring to Figure 7D, compared to Figure 7C, in this embodiment, the first support structure 31 and the second support structure 35 are not connected by dispensing adhesive 402. In this embodiment, a third optical adhesive layer 43 is stacked between the first support structure 31 and the second support structure 35, and the first tensile layer 32 and the second support structure 35 are bonded together by the third optical adhesive layer 43.

[0157] It is understood that in some other embodiments, the first optical adhesive layer 41 can be removed from the embodiments of FIG. 7C and FIG. 7D, and the first tensile layer 32 can be connected to the hinge structure 12 by welding. Alternatively, the second optical adhesive layer 42 can be removed from the embodiments of FIG. 7C and FIG. 7D, and the second support structure 35 can be connected to the hinge structure 12 by welding, for example, welding the second tensile layer 33 to the hinge structure 12.

[0158] Figures 8A-8D show embodiments of the support structure 30 in Figure 5 with two tensile layers 301 and two buffer layers 302. Figures 8A-8D are embodiments of the support structure 30 based on Figures 6A-6C, with an additional tensile layer 301 and a buffer layer 302. To avoid repetition, content identical to that in Figures 6A-6C will not be repeated.

[0159] Referring to Figures 8A-8D, in some embodiments, the first support structure 31 includes a first tensile layer 32 and a second buffer layer 34. The second support structure 35 includes a first buffer layer 36 and a second tensile layer 33 stacked together. The material moduli of the second buffer layer 34 and the second tensile layer 33 are the same as those in the previous embodiments, and will not be repeated here.

[0160] The first tensile layer 32, the first buffer layer 36, the second tensile layer 33, and the second buffer layer 34 are stacked together.

[0161] In this embodiment, by adding a second tensile layer 33 and a second buffer layer 34 on top of the first tensile layer 32 and the first buffer layer 36, the tensile strength of the support structure 30 can be improved, effectively reducing the tensile deformation of the display panel 20 and thus effectively improving the black spot phenomenon on the display panel 20. It also improves the buffering capacity, effectively reducing the risk of the display panel 20 breaking when the electronic device 1 is subjected to impact. Furthermore, it effectively improves the problem of bright spots on the display panel 20.

[0162] In some embodiments, a fourth optical adhesive layer 44 is provided between the first tensile layer 32 and the second buffer layer 34, and the first optical adhesive layer 41 is stacked between the first support structure 31 and the display panel 20 or the hinge structure 12, so as to bond the first support structure 31 and the display panel 20 or the hinge structure 12 through the first optical adhesive layer 41.

[0163] A fifth optical adhesive layer 45 is provided between the second tensile layer 33 and the first buffer layer 36, and a second optical adhesive layer 42 is stacked between the second support structure 35 and the hinge structure 12 or the display panel 20, so as to bond the second support structure 35 and the hinge structure 12 or the display panel 20 through the second optical adhesive layer 42.

[0164] It is understandable that when one of the first optical adhesive layer 41 and the second optical adhesive layer 42 is bonded to the hinge structure 12, the other is bonded to the display panel 20.

[0165] In some embodiments, the first support structure 31 and the second support structure 35 can be bonded by an optical adhesive layer or by applying adhesive 402 (which cures after cooling).

[0166] Referring to FIG8A, in some embodiments, the first buffer layer 36 and the second buffer layer 34 are stacked between the first tensile layer 32 and the second tensile layer 33.

[0167] Referring to FIG8B, in some embodiments, the first tensile layer 32 and the first buffer layer 36 are stacked between the second tensile layer 33 and the second buffer layer 34.

[0168] Referring to FIG8C, in some embodiments, the first tensile layer 32 and the second tensile layer 33 are stacked between the first buffer layer 36 and the second buffer layer 34.

[0169] Referring to FIG8D, in some embodiments, the second tensile layer 33 and the second buffer layer 34 are stacked between the first tensile layer 32 and the first buffer layer 36.

[0170] Figures 9A-9C illustrate embodiments of the support structure 30 in Figure 5, which have two tensile layers 301 and two buffer layers 302. Figures 9A-9C further illustrate the support structure 30 in the embodiments of Figures 6A-6C by adding one tensile layer 301 and one buffer layer 302. To avoid repetition, content identical to that in Figures 6A-6C will not be repeated.

[0171] Referring to Figures 9A-9C, in some embodiments, the first support structure 31 includes a first tensile layer 32, and the second support structure 35 includes a first buffer layer 36, a second buffer layer 34, and a second tensile layer 33 stacked together. The material moduli of the second buffer layer 34 and the second tensile layer 33 are the same as those in the previous embodiments, and will not be repeated here.

[0172] The first tensile layer 32, the first buffer layer 36, the second tensile layer 33, and the second buffer layer 34 are stacked together.

[0173] In this embodiment, by adding a second tensile layer 33 and a second buffer layer 34 on top of the first tensile layer 32 and the first buffer layer 36, the tensile strength of the support structure 30 can be improved, effectively reducing the tensile deformation of the display panel 20 and thus effectively improving the black spot phenomenon on the display panel 20. It also improves the buffering capacity, effectively reducing the risk of the display panel 20 breaking when the electronic device 1 is subjected to impact. Furthermore, it effectively improves the problem of bright spots on the display panel 20.

[0174] In some embodiments, the first support structure 31 further includes a first optical adhesive layer 41 for bonding the first tensile layer 32 to the display panel 20 or the hinge structure 12; the second support structure 35 further includes a second tensile layer 33, a second buffer layer 34, a fourth optical adhesive layer 44 and a fifth optical adhesive layer 45 stacked together, the first buffer layer 36, the second tensile layer 33 and the second buffer layer 34 are bonded together by the fourth optical adhesive layer 44 and the fifth optical adhesive layer 45, and the second optical adhesive layer 42 is stacked between the second support structure 35 and the hinge structure 12 or the display panel 20.

[0175] It is understandable that when one of the first optical adhesive layer 41 and the second optical adhesive layer 42 is bonded to the hinge structure 12, the other is bonded to the display panel 20.

[0176] In some other embodiments, the first support structure 31 further includes a second tensile layer 33, a second buffer layer 34, a fourth optical adhesive layer 44, and a fifth optical adhesive layer 45 stacked together. The first tensile layer 32, the second tensile layer 33, and the second buffer layer 34 are bonded together by the fourth optical adhesive layer 44 and the fifth optical adhesive layer 45. The first optical adhesive layer 41 is stacked between the first support structure 31 and the display panel 20 or the hinge structure 12. The second support structure 35 further includes a second optical adhesive layer 42 for bonding the first buffer layer 36 to the hinge structure 12 or the display panel 20.

[0177] Referring to FIG9A, in some embodiments, the first buffer layer 36 and the second buffer layer 34 are stacked between the first tensile layer 32 and the second tensile layer 33.

[0178] In some embodiments, a fourth optical adhesive layer 44 is stacked between the first buffer layer 36 and the second buffer layer 34, and a fifth optical adhesive layer 45 is stacked between the second buffer layer 34 and the second tensile layer 33. It is understood that the positions of the first buffer layer 36 and the second buffer layer 34 are interchangeable.

[0179] Referring to FIG9B, in some embodiments, the first buffer layer 36 and the second tensile layer 33 are stacked between the first tensile layer 32 and the second buffer layer 34.

[0180] In some embodiments, a fourth optical adhesive layer 44 is stacked between the first buffer layer 36 and the second tensile layer 33, and a fifth optical adhesive layer 45 is stacked between the second tensile layer 33 and the second buffer layer 34. It is understood that the positions of the second buffer layer 34 and the second tensile layer 33 can be interchanged.

[0181] Referring to FIG9C, in some embodiments, the second buffer layer 34 and the second tensile layer 33 are stacked between the first tensile layer 32 and the first buffer layer 36.

[0182] In some embodiments, a fourth optical adhesive layer 44 is stacked between the second buffer layer 34 and the second tensile layer 33, and a fifth optical adhesive layer 45 is stacked between the second tensile layer 33 and the first buffer layer 36. It is understood that the positions of the second buffer layer 34 and the second tensile layer 33 can be interchanged.

[0183] It should be noted that the first buffer layer 36 and the second buffer layer 34 in the above embodiments can be made of materials such as PET, TPU, GPU or CPI.

[0184] In some implementations, the thickness of the first buffer layer 36 can be 1μm-300μm, for example, 10μm-150μm.

[0185] In some embodiments, the thickness of the first tensile layer 32 can be 1μm-300μm, for example, 10μm-150μm.

[0186] In some implementations, the thickness of the second buffer layer 34 can be 1μm-300μm, for example, 10μm-150μm.

[0187] In some embodiments, the thickness of the second tensile layer 33 can be 1μm-300μm, for example, 10μm-150μm.

[0188] It is understandable that when the number of layers in the support structure 30 is greater, the thickness of the first buffer layer 36, the first tensile layer 32, the second buffer layer 34, and the second tensile layer 33 can be relatively thinner, and vice versa.

[0189] Figure 10 is a simplified schematic diagram of an electronic device 1 provided in an embodiment of this application. The display panel 20, support structure 30, and hinge structure 12 are the same as those mentioned above.

[0190] Referring to Figures 3-10, in some embodiments, the electronic device 1 includes a display panel 20, a support structure 30, and a hinge structure 12 stacked together. The display panel 20 includes a bending region 201, the hinge structure 12 is correspondingly disposed in the bending region 201, and the support structure 30 covers the bending region 201. The area of ​​the portion 304 of the support structure 30 outside the bending region 201 is smaller than the area of ​​the bending region 201. It should be noted that the bending region 201 of the display panel 20 refers to the area where the display panel 20 undergoes a significant bend when the electronic device 1 is folded. It should also be noted that the portion of the support structure 30 covering the bending region 201 is the portion 305 of the support structure 30 corresponding to the bending region 201. It can be understood that the portion 305 of the support structure 30 corresponding to the bending region 201 can completely cover the bending region 201 or only partially cover it. For example, the support structure 30 can cover most of the area of ​​the bending region 201, such as more than 60% of the bending region 201 being covered by the support structure 30. It is understandable that the support structure 30 can also be completely located within the bending region 201, in which case the area of ​​the part 304 of the support structure 30 outside the bending region is 0.

[0191] The support structure 30 is located between the hinge structure 12 and the bending region 201, and the support structure 30 includes at least a first tensile layer 32. Because the first tensile layer 32 has excellent rigidity and tensile strength, after the support structure 30 is bonded to the display panel 20, the tensile layer 301 can effectively reduce the tensile deformation of the display panel 20 when it is bent, thereby effectively improving the black spot phenomenon on the display panel 20. Furthermore, the bending region 201 of the display panel 20 is most prone to tensile deformation because it is frequently bent during use, while the straight region 202 of the display panel 20 is usually not bent and therefore does not require attention to tensile deformation. In this embodiment, since the display panel 20 and the support structure 30 are independently configured, the support structure 30 covers the bending region 201, and the area of ​​the portion 304 of the support structure 30 outside the bending region 201 is smaller than the area of ​​the bending region 201. Therefore, during subsequent assembly, the support structure 30 can be selectively placed between the bending area 201 of the display panel 20 and the hinge structure 12. However, a large area of ​​the support structure 30 does not need to be placed in the flat area 202 of the display panel 20. This ensures that the support structure 30 improves the tensile deformation resistance of the display panel 20 while effectively reducing the overall thickness of the electronic device 1, thus providing a slim and lightweight experience.

[0192] In some embodiments, all areas of the surface of the first tensile layer 32 facing the display panel 20 corresponding to the bending region 201 are bonded to the bending region 201. Because all areas of the surface of the first tensile layer 32 facing the display panel 20 corresponding to the bending region 201 are bonded to the bending region 201, the first tensile layer 32 can provide better tensile resistance to the bending region 201 of the display panel 20, preventing the bending region 201 of the display panel 20 from being stretched and deformed. It is understood that in other embodiments, the portion 305 of the surface of the first tensile layer 32 facing the display panel 20 corresponding to the bending region 201 may also be bonded to the bending region 201. For example, when the first tensile layer 32 is connected to the bending region 201 of the display panel 20 using adhesive 402.

[0193] It is understood that the display panel 20 in this embodiment can be any of the display panels 20 shown in Figures 5-9C above.

[0194] In some embodiments, the support structure 30 further includes a second support structure 35, which includes at least a first buffer layer 36. The first buffer layer 36 can provide effective cushioning for the display panel 20, thereby effectively reducing the risk of the display panel 20 breaking when the electronic device 1 is subjected to impact. It can also effectively improve the problem of bright spots on the display panel 20.

[0195] In some embodiments, the first support structure 31 is connected to the display panel 20, and the second support structure 35 is connected to the hinge structure 12.

[0196] In some embodiments, the first support structure 31 is bonded to the display panel 20 by means of an optical adhesive layer or adhesive 402, and the second support structure 35 and the hinge structure 12 are bonded by means of an optical adhesive layer or adhesive 402.

[0197] In some embodiments, when the display panel 20 is in a flat state, the display panel 20, hinge structure 12, first support structure 31, and second support structure 35 are stacked in a first direction Z. One of the first support structure 31 and the second support structure 35 is bonded to the bending region 201, and the other of the first support structure 31 and the second support structure 35 is connected to the hinge structure 12. The first support structure 31 or the second support structure 35 bonded to the hinge structure 12 has a through hole 303 extending in the first direction Z. Adhesive 402 is provided in the through hole 303 for bonding the first support structure 31 and the second support structure 35. By using the through hole 303, the adhesive 402 can be directly applied into the through hole 303, preventing overflow during application.

[0198] For example, as shown in Figure 10A, in some embodiments, the first support structure 31 and the second support structure 35 are bonded together with an optical adhesive layer. The first support structure 31 is bonded to the display panel 20 with an optical adhesive layer, and the second support structure 35 and the hinge structure 12 are connected by dispensing adhesive 402.

[0199] For example, as shown in Figure 10B, in some embodiments, the first support structure 31 and the second support structure 35 are bonded together by dispensing adhesive 402. The first support structure 31 is bonded to the optical adhesive layer of the display panel 20, and the second support structure 35 is bonded to the optical adhesive layer of the hinge structure 12.

[0200] It is understood that in some other embodiments, the first support structure 31 and the second support structure 35 may be bonded together with an optical adhesive layer. The first support structure 31 is bonded to the display panel 20 with an optical adhesive layer, and the second support structure 35 and the hinge structure 12 are bonded together by dispensing adhesive 402.

[0201] In some embodiments, the first support structure 31 is connected to the hinge structure 12, and the second support structure 35 is connected to the display panel 20.

[0202] In some embodiments, the first support structure 31 is bonded to the hinge structure 12 by an optical adhesive layer or by applying adhesive 402, or by welding, and the second support structure 35 is bonded to the hinge structure 12 by an optical adhesive layer or by applying adhesive 402.

[0203] For example, as shown in Figure 10C, in some embodiments, the first support structure 31 and the second support structure 35 are bonded together with optical adhesive layers. The first support structure 31 is connected to the hinge structure 12 by dispensing optical adhesive 402, and the second support structure 35 is bonded to the display panel 20 with optical adhesive layers.

[0204] For example, as shown in Figure 10D, in some embodiments, the first support structure 31 and the second support structure 35 are bonded together by dispensing adhesive 402. The first support structure 31 is bonded to the optical adhesive layer of the hinge structure 12, and the second support structure 35 is bonded to the optical adhesive layer of the display panel 20.

[0205] For example, in Figure 10E, the first support structure 31 and the second support structure 35 are bonded together by applying adhesive 402. The first support structure 31 is welded to the optical adhesive layer of the hinge structure 12, and the second support structure 35 is bonded to the optical adhesive layer of the display panel 20. The first support structure 31 has a through hole 303 extending in the first direction Z. Adhesive 402 is applied inside the through hole 303 to bond the first support structure 31 and the second support structure 35, and to the hinge structure 12. By applying adhesive 402 directly into the through hole 303, it is possible to prevent the adhesive 402 from overflowing during application.

[0206] In some other embodiments, the first support structure 31 and the second support structure 35 may be bonded together with an optical adhesive layer. The first support structure 31 is bonded to the hinge structure 12 with an optical adhesive layer, and the second support structure 35 is connected to the display panel 20 by applying adhesive 402.

[0207] Figures 11A-11L below show various specific embodiments of the electronic device 1 provided in this application.

[0208] Referring to Figures 11A-11C, in some embodiments, the support structure 30 in the embodiments of Figures 6A-6C is assembled with the display panel 20 and the hinge structure 12. In this embodiment, only one tensile layer 301 and one buffer layer 302 are used, which can effectively reduce the overall thickness of the electronic device 1. This is suitable for scenarios where the thickness requirement of the electronic device 1 is high, but the tensile and drop resistance of the display panel 20 is low.

[0209] Referring to Figure 11A, in some embodiments, the first tensile layer 32 is bonded to the bending region 201 of the display panel 20 via a first optical adhesive layer 41, and the first buffer layer 36 is bonded to the chain structure via a second optical adhesive layer 42 or by dispensing adhesive 402, or by welding to the hinge structure 12. The first tensile layer 32 and the first buffer layer 36 are bonded together via a third optical adhesive layer 43. In this embodiment, the first tensile layer 32 is bonded to the display panel 20 and is closer to the display panel 20 than the first buffer layer 36, thereby providing the display panel 20 with more effective tensile strength.

[0210] Referring to Figure 11B, in some embodiments, the first tensile layer 32 is bonded to the bending area 201 of the display panel 20 by means of a first optical adhesive layer 41 or adhesive application 402, the first buffer layer 36 is bonded to the chain structure by means of a second optical adhesive layer 42, and the first tensile layer 32 and the first buffer layer 36 are bonded by means of a third optical adhesive layer 43. In this embodiment, since the first buffer layer 36 is closer to the display panel 20, it can provide the display panel 20 with more effective drop protection.

[0211] Referring to Figure 11C, in some embodiments, the first tensile layer 32 is bonded to the bending area 201 of the display panel 20 via a first optical adhesive layer 41, the first buffer layer 36 is bonded to the chain structure via a second optical adhesive layer 42, and the first tensile layer 32 and the first buffer layer 36 are bonded via a third optical adhesive layer 43 or by dispensing adhesive 402. In this embodiment, the first tensile layer 32 can be connected to the display panel 20 separately, and the first buffer layer 36 can be connected to the hinge structure 12 separately, and then assembled as a whole, which can simplify the assembly process.

[0212] It is understood that in some other embodiments, the first tensile layer 32 may be connected to the hinge structure 12, while the first buffer layer 36 may be bonded to the display panel 20.

[0213] Referring to Figures 11D-11G, in some embodiments, the support structure 30 in the embodiments of Figures 7A-7D is assembled with the display panel 20 and the hinge structure 12. In this embodiment, an additional tensile layer 301 or a buffer layer 302 is added on top of a tensile layer 301 and a buffer layer 302. Adding a tensile layer 301 can improve the tensile strength of the display panel 20 of the electronic device 1 in this embodiment, and adding a buffer layer 302 can improve the drop resistance of the display panel 20 of the electronic device 1 in this embodiment.

[0214] Referring to FIG11D, in some embodiments, the second support structure 35 adds a second tensile layer 33 or a second buffer layer 34 on the basis of the first buffer layer 36. The first tensile layer 32 is bonded to the bending area 201 of the display panel 20 through the first optical adhesive layer 41. The second support structure 35 is bonded to the chain structure through the second optical adhesive layer 42 or by dispensing adhesive 402, or by welding to the hinge structure 12. The first tensile layer 32 and the second support structure 35 are bonded through the third optical adhesive layer 43. The first buffer layer 36 and the second tensile layer 33 or the second buffer layer 34 are bonded through the fifth optical adhesive layer 45.

[0215] For example, a third optical adhesive layer 43 is provided between the first tensile layer 32 and the first buffer layer 36, and the first buffer layer 36 and the second tensile layer 33 or the second buffer layer 34 are bonded together by a fifth optical adhesive layer 45. It is understood that the third optical adhesive layer 43 may also be provided between the first tensile layer 32 and the second tensile layer 33 or the second buffer layer 34.

[0216] Referring to FIG11E, in some embodiments, unlike FIG11D, the first tensile layer 32 is bonded to the bending area 201 of the display panel 20 by means of the first optical adhesive layer 41 or the dispensing adhesive 402, and the second support structure 35 is bonded to the chain structure by means of the second optical adhesive layer 42.

[0217] Referring to Figure 11F, in some embodiments, unlike Figure 11D, the second support structure 35 is bonded to the chain structure via the second optical adhesive layer 42, and the first tensile layer 32 and the second support structure 35 can also be bonded by dispensing adhesive 402. In this embodiment, the first tensile layer 32 can be connected to the display panel 20 separately, and the second support structure 35 can be connected to the hinge structure 12 separately, and then assembled as a whole, which can simplify the assembly process.

[0218] Referring to Figure 11G, in some embodiments, the first support structure 31 is supplemented with a second tensile layer 33 or a second buffer layer 34 on the basis of the first tensile layer 32. The first support structure 31 is bonded to the bending area 201 of the display panel 20 through the first optical adhesive layer 41. The second support structure 35 is bonded to the hinge structure 12 through the second optical adhesive layer 42. The first buffer layer 36 and the first support structure 31 are bonded through the third optical adhesive layer 43. The first tensile layer 32 and the second tensile layer 33 or the second buffer layer 34 are bonded through the fourth optical adhesive layer 44.

[0219] For example, a third optical adhesive layer 43 is provided between the second tensile layer 33 or the second buffer layer 34 and the first buffer layer 36, and the first tensile layer 32 and the second tensile layer 33 or the second buffer layer 34 are bonded together by the fourth optical adhesive layer 44. It is understood that the third optical adhesive layer 43 may also be provided between the first buffer layer 36 and the first tensile layer 32.

[0220] It is understood that in some other embodiments, the first tensile layer 32 may be connected to the hinge structure 12, while the first buffer layer 36 may be bonded to the display panel 20.

[0221] Referring to Figures 11H-11J, in some embodiments, the support structure 30 in the embodiments of Figures 8A-8D is assembled with the display panel 20 and the hinge structure 12. In this embodiment, an additional tensile layer 301 and a buffer layer 302 are added on top of a tensile layer 301 and a buffer layer 302. Adding a tensile layer 301 improves the tensile strength of the display panel 20 of the electronic device 1 in this embodiment, and adding a buffer layer 302 improves the drop resistance of the display panel 20 of the electronic device 1 in this embodiment.

[0222] Referring to FIG11H, in some embodiments, the first support structure 31 is bonded to the bending area 201 of the display panel 20 by the first optical adhesive layer 41, the second support structure 35 is bonded to the chain structure by the second optical adhesive layer 42, and the first support structure 31 and the second support structure 35 are bonded by the third optical adhesive layer 43 or by dispensing adhesive 402.

[0223] For example, in some specific embodiments, the first tensile layer 32 is bonded to the display panel 20 through the first optical adhesive layer 41, the first buffer layer 36 is bonded to the hinge structure 12 through the second optical adhesive layer 42, the second buffer layer 34 and the first tensile layer 32 are bonded through the fourth optical adhesive layer 44, and the second tensile layer 33 and the first buffer layer 36 are bonded through the fifth optical adhesive layer 45.

[0224] It is understood that, in some other embodiments, the positions of the first tensile layer 32 and the second buffer layer 34 can be interchanged. The positions of the first buffer layer 36 and the second tensile layer 33 can also be interchanged.

[0225] Referring to FIG11I, in some embodiments, the first support structure 31 is bonded to the bending area 201 of the display panel 20 by a first optical adhesive layer 41, the second support structure 35 is bonded to the chain structure by a second optical adhesive layer 42 or by dispensing adhesive 402, or by welding to the hinge structure 12, and the first support structure 31 and the second support structure 35 are bonded by a third optical adhesive layer 43.

[0226] Referring to FIG11J, in some embodiments, the first support structure 31 is bonded to the bending area 201 of the display panel 20 by means of a first optical adhesive layer 41 or dispensing adhesive 402, the second support structure 35 is bonded to the chain structure by means of a second optical adhesive layer 42, and the first support structure 31 and the second support structure 35 are bonded by means of a third optical adhesive layer 43.

[0227] It is understood that in some other embodiments, the first tensile layer 32 may be connected to the hinge structure 12, while the first buffer layer 36 may be bonded to the display panel 20.

[0228] Referring to Figures 11K-11L, in some embodiments, the support structure 30 in the embodiments of Figures 9A-9C is assembled with the display panel 20 and the hinge structure 12. In this embodiment, an additional tensile layer 301 and a buffer layer 302 are added on top of a tensile layer 301 and a buffer layer 302. Adding a tensile layer 301 improves the tensile strength of the display panel 20 of the electronic device 1 in this embodiment, and adding a buffer layer 302 improves the drop resistance of the display panel 20 of the electronic device 1 in this embodiment.

[0229] Referring to Figure 11K, in some embodiments, the first support structure 31 is supplemented with a second tensile layer 33 and a second buffer layer 34 on the basis of the first tensile layer 32. The first support structure 31 is bonded to the bending area 201 of the display panel 20 by a first optical adhesive layer 41. The first buffer layer 36 is bonded to the hinge structure 12 by the second optical adhesive layer 42 or by applying adhesive 402, or by welding to the hinge structure 12. The first buffer layer 36 and the first support structure 31 are bonded by a third optical adhesive layer 43. The first tensile layer 32, the second tensile layer 33 and the second buffer layer 34 are bonded by a fourth optical adhesive layer 44 and a fifth optical adhesive layer 45.

[0230] For example, a third optical adhesive layer 43 is provided between the second tensile layer 33 and the first buffer layer 36; the first tensile layer 32 and the second buffer layer 34 are bonded together by a fourth optical adhesive layer 44; and the second tensile layer 33 and the second buffer layer 34 are bonded together by a fifth optical adhesive layer 45. It is understood that in some other embodiments, the positions of the first tensile layer 32, the second tensile layer 33, and the second buffer layer 34 can be arbitrarily interchanged.

[0231] Referring to Figure 11L, in some embodiments, the second support structure 35 adds a second tensile layer 33 and a second buffer layer 34 on the basis of the first buffer layer 36. The first tensile layer 32 is bonded to the bending area 201 of the display panel 20 by means of a first optical adhesive layer 41 or dispensing adhesive 402. The second support structure 35 is bonded to the hinge structure 12 by the second optical adhesive layer 42. The first tensile layer 32 and the second support structure 35 are bonded by a third optical adhesive layer 43. The second buffer layer 34, the second tensile layer 33 and the second buffer layer 34 are bonded by a fourth optical adhesive layer 44 and a fifth optical adhesive layer 45.

[0232] For example, a third optical adhesive layer 43 is provided between the first tensile layer 32 and the first buffer layer 36; the first buffer layer 36 and the second buffer layer 34 are bonded together by a fourth optical adhesive layer 44; and the second tensile layer 33 and the second buffer layer 34 are bonded together by a fifth optical adhesive layer 45. It is understood that in some other embodiments, the positions of the second buffer layer 34, the second tensile layer 33, and the second buffer layer 34 can be arbitrarily interchanged.

[0233] It is understood that in some other embodiments, the first tensile layer 32 may be connected to the hinge structure 12, while the first buffer layer 36 may be bonded to the display panel 20.

[0234] Figure 12 illustrates another embodiment of the electronic device 1 provided in this application. The electronic device 1 in Figure 12 is an extension of any of the electronic devices 1 described in the preceding embodiments.

[0235] Referring to Figure 12, in some embodiments, when the first support structure 31 and the second support structure 35 are bonded together by adhesive 402, a lubricating layer 50 is provided between the first support structure 31 and the second support structure 35. The lubricating layer 50 can be located at the position where the first support structure 31 and the second support structure 35 are not bonded by adhesive 402. Through the cooperation of the lubricating layer 50 and the adhesive 402, the first support structure 31 and the second support structure 35 can slide relative to each other at the position corresponding to the lubricating layer 50 with low friction, while a stable connection can be achieved at the position where adhesive 402 is applied, thus preventing large bulges in the display panel 20 when bent.

[0236] In some embodiments, when the first support structure 31 and the second support structure 35 are bonded together with an optical adhesive layer, a lubricating layer 50 may also be provided between the display panel 20 and the support structure 30, or between the hinge structure 12 and the support structure 30. Furthermore, the lubricating layer 50 may be located at a position on the display panel 20 or the hinge structure 12 that is not bonded with adhesive 402.

[0237] In some implementations, the lubricating layer 50 may be made of a material such as Teflon.

[0238] Figure 13 is a schematic diagram of another display module provided in an embodiment of this application.

[0239] Referring to Figure 13, in some embodiments, the display module in this embodiment is based on the display panel 20 in the embodiments of Figures 2 and 3, with a support structure 30 provided in the bending area 201 (see above).

[0240] Specifically, the display module includes a display panel 20 and a support structure 30 stacked together. The display panel 20 includes a bending region 201. The support structure 30 covers the bending region 201, and the area of ​​the portion 304 of the support structure 30 outside the bending region 201 is smaller than the area of ​​the bending region 201. The support structure 30 includes a first tensile layer 32, and the material modulus of the first tensile layer 32 is the same as that of the first tensile layer 32 in the previous embodiment, which will not be repeated here. The bending region 201 of the display panel 20 is used to assemble onto the middle frame structure 10 with a hinge structure 12. The hinge structure 12 is correspondingly disposed in the bending region 201. The support structure 30 is stacked between the bending region 201 and the hinge structure 12 of the display panel 20.

[0241] The display panel 20 in this embodiment can be manufactured and sold independently to facilitate subsequent assembly.

[0242] Figure 14 is a schematic diagram of a hinge assembly provided in an embodiment of this application.

[0243] Referring to Figure 14, in some embodiments, the hinge assembly includes a hinge structure 12 and a support structure 30 stacked on the hinge structure 12. The support structure 30 includes a first tensile layer 32, the material modulus of which is the same as that of the first tensile layer 32 in the previous embodiments, and will not be described again here. The hinge assembly is used to assemble with a foldable display panel 20. The hinge structure 12 and the support structure 30 are correspondingly disposed in the bending region 201 of the display panel 20, and the support structure 30 is stacked between the bending region 201 of the display panel 20 and the hinge structure 12.

[0244] The area of ​​the support structure 30 can be slightly larger than the area of ​​the hinge structure 12.

[0245] The hinge assembly in this embodiment can be manufactured and sold independently to facilitate subsequent assembly.

[0246] Figure 15 is a structural schematic diagram of another type of middle frame structure 10 provided in the embodiments of this application.

[0247] Referring to FIG15, in some embodiments, the display panel 20 in this embodiment is based on the middle frame structure 10 in FIG4 embodiment, with a support structure 30 provided in the bending area 201 (see above).

[0248] The mid-frame structure 10 includes a housing 11, a hinge structure 12 connected to the housing 11, and a support structure 30 stacked on the hinge structure 12. The support structure 30 includes a first tensile layer 32, the material modulus of which is the same as that of the first tensile layer 32 in the previous embodiment, and will not be described again here. The mid-frame structure 10 is used to assemble with the foldable display panel 20. The hinge structure 12 and the support structure 30 are correspondingly disposed in the bending area 201 of the display panel 20, and the support structure 30 is stacked between the bending area 201 of the display panel 20 and the hinge structure 12.

[0249] The middle frame structure 10 in this embodiment can be manufactured and sold independently to facilitate subsequent assembly.

[0250] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A foldable electronic device, characterized by, The electronic device comprises a display panel, a support structure and a hinge structure arranged in layers, the display panel comprises a bending area, the hinge structure is arranged corresponding to the bending area, the support structure covers the bending area, and the area of the part of the support structure outside the bending area is smaller than the area of the bending area, and the support structure is located between the hinge structure and the bending area; the support structure comprises a first tensile-resistant layer for reducing the tensile deformation of the display panel.

2. The electronic device of claim 1, wherein, The surface of the first tensile-resistant layer facing the display panel is bonded to all areas of the bending area corresponding to the bending area.

3. The electronic device of claim 1 or 2, wherein, The material modulus of the first tensile-resistant layer is 10Gpa-500Gpa.

4. The electronic device according to any one of claims 1-3, characterized in that, The support structure further comprises a first buffer layer with a material modulus smaller than that of the first tensile-resistant layer, the first buffer layer is arranged in layers between the hinge structure and the bending area, and the material modulus of the first buffer layer is 1Mpa-10Gpa.

5. The electronic device of claim 4, wherein, The support structure comprises a first support structure and a second support structure, the first support structure comprises the first tensile-resistant layer, the second support structure comprises the first buffer layer, when the display panel is in a flat state, the display panel, the hinge structure, the first support structure and the second support structure are arranged in layers in a first direction, one of the first support structure and the second support structure is bonded to the bending area, the other of the first support structure and the second support structure is connected to the hinge structure, the first support structure or the second support structure connected to the hinge structure is provided with a through hole penetrating in the first direction, and the through hole is provided with a point glue for bonding the first support structure and the second support structure.

6. The electronic device of claim 5, wherein, The other of the first support structure and the second support structure is welded to the hinge structure.

7. The electronic device of claim 5, wherein, The first support structure further comprises a second buffer layer and a fourth optical glue layer arranged in layers between the first tensile-resistant layer and the second buffer layer, and a first optical glue layer is arranged in layers between the first support structure and the display panel or the hinge structure; The second support structure further comprises a second tensile-resistant layer and a fifth optical glue layer arranged in layers between the second tensile-resistant layer and the first buffer layer, and a second optical glue layer is arranged in layers between the second support structure and the hinge structure or the display panel.

8. The electronic device of claim 5, wherein, The first support structure further comprises a first optical glue layer for bonding the first tensile-resistant layer and the display panel or the hinge structure; The second support structure further comprises a second optical glue layer for bonding the first buffer layer and the hinge structure or the display panel.

9. The electronic device of claim 5, wherein, The first support structure further comprises a first optical glue layer for bonding the first tensile-resistant layer and the display panel or the hinge structure; the second support structure further comprises a second tensile-resistant layer and a fifth optical glue layer arranged in layers between the second tensile-resistant layer and the first buffer layer, and a second optical glue layer is arranged in layers between the second support structure and the hinge structure or the display panel; Or, The first support structure further comprises a second buffer layer and a fourth optical adhesive layer stacked between the first tensile-resistant layer and the second buffer layer, and a first optical adhesive layer is stacked between the first support structure and the display panel or the hinge structure; and the second support structure further comprises a second optical adhesive layer for bonding the first buffer layer to the hinge structure or the display panel.

10. The electronic device of claim 5, wherein, The first support structure further comprises a first optical adhesive layer for bonding the first tensile-resistant layer to the display panel or the hinge structure; the second support structure further comprises a second tensile-resistant layer, a second buffer layer, a second optical adhesive layer and a third optical adhesive layer stacked together, the first buffer layer, the second tensile-resistant layer and the second buffer layer are bonded together by a fourth optical adhesive layer and a fifth optical adhesive layer, and a second optical adhesive layer is stacked between the second support structure and the hinge structure or the display panel; Alternatively, The first support structure further comprises a second tensile-resistant layer, a second buffer layer, a first optical adhesive layer and a second optical adhesive layer stacked together, the first tensile-resistant layer, the second tensile-resistant layer and the second buffer layer are bonded together by a fourth optical adhesive layer and a fifth optical adhesive layer, a first optical adhesive layer is stacked between the first support structure and the display panel or the hinge structure; and the second support structure further comprises a second optical adhesive layer for bonding the first buffer layer to the hinge structure or the display panel.

11. The electronic device of any of claims 7-10, wherein, A lubricating layer is further included, which is arranged at a peripheral area of the through hole and stacked between the first support structure and the second support structure.

12. The electronic device of claim 4, wherein, The support structure comprises a first support structure and a second support structure, one of the first support structure and the second support structure is connected to the display panel, the other of the first support structure and the second support structure is connected to the hinge structure, and a third optical adhesive layer is arranged between the first support structure and the second support structure for bonding the first support structure and the second support structure.

13. The electronic device of claim 12, wherein, The third optical adhesive layer is arranged between the first tensile-resistant layer and the first buffer layer; The optical adhesive layer is stacked on a side of the first tensile-resistant layer away from the first buffer layer, or the optical adhesive layer is stacked on a side of the first buffer layer away from the first tensile-resistant layer.

14. The electronic device of claim 12, wherein The first support structure further comprises a second tensile-resistant layer or a second buffer layer stacked with the first tensile-resistant layer and the first buffer layer, a fourth optical adhesive layer is stacked between the first tensile-resistant layer and the second tensile-resistant layer or the second buffer layer, the fourth optical adhesive layer is stacked between the first tensile-resistant layer and the first buffer layer, the third optical adhesive layer is arranged between the first support structure and the first buffer layer, and the optical adhesive layer is stacked on a side of the first support structure away from the first buffer layer, or the optical adhesive layer is stacked on a side of the first buffer layer away from the first support structure; Alternatively, The second support structure further comprises a second tensile-resistant layer or a second buffer layer arranged in a stack with the first tensile-resistant layer and the first buffer layer, and a fourth optical adhesive layer arranged in a stack between the first buffer layer and the second tensile-resistant layer or the second buffer layer, and the fourth optical adhesive layer is arranged in a stack between the second support structure and the first tensile-resistant layer; the third optical adhesive layer is arranged between the second support structure and the first tensile-resistant layer, and the optical adhesive layer is arranged in a stack on a side of the second support structure away from the first tensile-resistant layer, or the optical adhesive layer is arranged in a stack on a side of the first tensile-resistant layer away from the second support structure.

15. The electronic device of claim 12, wherein, The first support structure further comprises a second buffer layer, and the second support structure further comprises a second tensile-resistant layer, and the first tensile-resistant layer, the first buffer layer, the second buffer layer and the second tensile-resistant layer are arranged in a stack, and the first support structure further comprises a fourth optical adhesive layer arranged in a stack between the first tensile-resistant layer and the second buffer layer, and the second support structure further comprises a fifth optical adhesive layer arranged in a stack between the first buffer layer and the second tensile-resistant layer.

16. The electronic device of any of claims 1-14, wherein, The thickness of the first buffer layer is 10 μm-150 μm, and the thickness of the first tensile-resistant layer is 10 μm-150 μm.

17. A foldable support structure, characterized by The support structure comprises a first support structure and a second support structure, the first support structure comprises a first tensile-resistant layer, the second support structure comprises a first buffer layer, the stacking direction of the first support structure and the second support structure is a first direction, one of the first support structure and the second support structure is used for bonding to a display panel, and the other of the first support structure and the second support structure is used for connecting with a hinge structure, the first support structure or the second support structure connected with the hinge structure is provided with a through hole penetrating in the first direction, and the through hole is provided with a point glue, and the point glue is used for bonding the first support structure and the second support structure.

18. The support structure of claim 17, wherein, The first support structure further comprises a second buffer layer and a fourth optical adhesive layer arranged in a stack between the first tensile-resistant layer and the second buffer layer, and a first optical adhesive layer is arranged in a stack between the first support structure and the display panel or the hinge structure; The second support structure further comprises a second tensile-resistant layer and a fifth optical adhesive layer arranged in a stack between the second tensile-resistant layer and the first buffer layer, and a second optical adhesive layer is arranged in a stack between the second support structure and the hinge structure or the display panel.

19. The support structure of claim 17, wherein, The first support structure further comprises a first optical adhesive layer used for bonding the first tensile-resistant layer and the display panel or the hinge structure; The second support structure further comprises a second optical adhesive layer used for bonding the first buffer layer and the hinge structure or the display panel.

20. The support structure of claim 17, wherein, The first support structure further comprises a first optical adhesive layer used for bonding the first tensile-resistant layer and the display panel or the hinge structure; the second support structure further comprises a second tensile-resistant layer and a fifth optical adhesive layer arranged in a stack between the second tensile-resistant layer and the first buffer layer, and a second optical adhesive layer is arranged in a stack between the second support structure and the hinge structure or the display panel; Or, The first support structure further comprises a second buffer layer and a fourth optical adhesive layer stacked between the first tensile-resistant layer and the second buffer layer, and a first optical adhesive layer is stacked between the first support structure and the display panel or the hinge structure; and the second support structure further comprises a second optical adhesive layer for bonding the first buffer layer to the hinge structure or the display panel.

21. The support structure of claim 17, wherein, The first support structure further comprises a first optical adhesive layer for bonding the first tensile-resistant layer to the display panel or the hinge structure; the second support structure further comprises a second tensile-resistant layer, a second buffer layer, a second optical adhesive layer and a third optical adhesive layer stacked together, the first buffer layer, the second tensile-resistant layer and the second buffer layer are bonded together by a fourth optical adhesive layer and a fifth optical adhesive layer, and a second optical adhesive layer is stacked between the second support structure and the hinge structure or the display panel; Alternatively, The first support structure further comprises a second tensile-resistant layer, a second buffer layer, a first optical adhesive layer and a second optical adhesive layer stacked together, the first tensile-resistant layer, the second tensile-resistant layer and the second buffer layer are bonded together by a fourth optical adhesive layer and a fifth optical adhesive layer, a first optical adhesive layer is stacked between the first support structure and the display panel or the hinge structure, and the second support structure further comprises a second optical adhesive layer for bonding the first buffer layer to the hinge structure or the display panel.

22. A foldable display module, comprising: The display module comprises a display panel and a support structure stacked together, the display panel comprises a bending area, the support structure covers the bending area, and the area of the part of the support structure outside the bending area is smaller than the area of the bending area, the support structure comprises a first tensile-resistant layer; The bending area of the display panel is used to be assembled to a middle frame structure with a hinge structure, the hinge structure is arranged corresponding to the bending area, the support structure is stacked between the bending area of the display panel and the hinge structure, and the first tensile-resistant layer is used to reduce the tensile deformation of the display panel.

23. A hinge assembly comprising: The hinge assembly comprises a hinge structure and a support structure stacked on the hinge structure, and the support structure comprises a first tensile-resistant layer; The hinge assembly is used to be assembled to a foldable display panel, the hinge structure and the support structure are arranged corresponding to the bending area of the display panel, the support structure is stacked between the bending area of the display panel and the hinge structure, and the first tensile-resistant layer is used to reduce the tensile deformation of the display panel.

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