Thermal management device and manufacturing method therefor

Abstract

Provided in the present disclosure is a thermal management device, which is used for distributing a heat transfer fluid. The thermal management device comprises: a flow channel plate, which is provided with a mounting cavity and a cavity flow channel, wherein the cavity flow channel is provided with proximal openings, and the proximal openings are formed on an inner wall of the mounting cavity; and a multi-way valve, which comprises a valve core and a valve cover assembly, wherein the valve core is arranged in the mounting cavity, the valve cover assembly is mounted on the flow channel plate and closes the mounting cavity, the valve core is provided with a valve core channel, and the valve core channel is configured to be in fluid communication with the two proximal openings, respectively. Further provided in the present disclosure is a manufacturing method for the thermal management device.

Description

Thermal management device and method for manufacturing thermal management device Technical Field

[0001] This disclosure relates to a thermal management device and a method for manufacturing the thermal management device. Background Technology

[0002] Currently, the application of new energy vehicles is becoming increasingly widespread in order to protect the environment. In electric vehicles, which are considered new energy vehicles, the electric drive mechanism generates a large amount of heat when supplying power, leading to increased resistance. This reduces discharge and charging efficiency, thus shortening battery life. Prolonged exposure to high temperatures can cause batteries to explode. Furthermore, prolonged exposure to low temperatures results in unnecessary energy loss. Therefore, electric vehicles require additional consideration of battery and motor cooling, making their thermal management systems more complex and involving more piping than those of traditional gasoline vehicles. However, the limited space in a vehicle's overall layout presents challenges and difficulties in designing the thermal management system for new energy vehicles.

[0003] Typically, thermal management integrated modules are used to address these issues, integrating various thermal management components and valves onto a manifold. For example, in known thermal management integrated modules, commonly used multi-way valves are large and complex, requiring additional assembly steps when mounting them onto the manifold. Therefore, known thermal management integrated modules still suffer from low integration levels, complex assembly processes, and high costs. Summary of the Invention

[0004] Therefore, the purpose of this disclosure is to provide a thermal management device and a method for manufacturing the thermal management device, which has a high degree of integration, simple assembly process, and low cost.

[0005] The above objectives are achieved by the thermal management device described below.

[0006] This disclosure provides a thermal management device for distributing heat transfer fluid. The thermal management device includes: a flow channel plate having a mounting cavity and a cavity flow channel; the cavity flow channel having a proximal opening; the proximal opening being formed in the inner wall of the mounting cavity; and a multi-way valve including a valve core and a valve cover assembly; the valve core being disposed in the mounting cavity; the valve cover assembly being mounted on the flow channel plate and closing the mounting cavity; the valve core having a valve core channel for fluid communication with two of the proximal openings respectively.

[0007] The thermal management device according to this disclosure may also have one or more of the following features, individually or in combination.

[0008] In one embodiment, the inner wall of the mounting cavity includes a sidewall and a bottom wall; the proximal opening is formed in the bottom wall; the sidewall surrounds the proximal opening; the sidewall defines the mounting cavity opening, and the valve cover assembly covers the mounting cavity opening to close the mounting cavity.

[0009] In one embodiment, the thermal management device further includes a sealing seat; the proximal opening includes a main opening; the sealing seat is inserted into the cavity flow channel from the main opening; wherein the sealing seat has a main body portion located within the cavity flow channel and a protrusion portion located outside the cavity flow channel; the protrusion portion protrudes from the bottom wall; the axially oriented lower surface of the valve core abuts against the protrusion portion to define a first lateral clearance between the lower surface and the bottom wall; the inlet and outlet of the valve core channel are respectively formed on the lower surface; the inner wall of the sealing seat defines a fluid channel; the fluid channel extends through the protrusion portion and the main body portion; the first lateral clearance surrounds the protrusion portion, and the protrusion portion separates the first lateral clearance from the fluid channel; the valve core channel is in fluid communication with the main opening through the fluid channel.

[0010] In one embodiment, the proximal opening further includes a secondary opening; the first lateral gap is configured to extend between the secondary opening and the lower surface to allow fluid communication between the valve core passage and the secondary opening.

[0011] In one embodiment, the secondary opening is the inlet for the heat transfer fluid to flow into the mounting cavity.

[0012] In one embodiment, the upper surface of the valve core in the axial direction defines a second lateral clearance with the valve cover assembly; the side surface of the valve core in the radial direction defines a longitudinal clearance with the valve cover assembly or the sidewall; the longitudinal clearance communicates with the first lateral clearance and the second lateral clearance.

[0013] In one embodiment, one of the main openings is an inlet for the heat transfer fluid to flow into the mounting cavity.

[0014] In one embodiment, the valve core is provided with a balancing through hole, and the heat transfer fluid flows through the balancing through hole, the second transverse gap, the longitudinal gap and the first transverse gap in sequence after flowing in through the inlet.

[0015] In one embodiment, the flow channel plate has a first portion extending along a first direction and a second portion extending along a second direction transverse to the first direction, and the mounting cavity is disposed on the second portion.

[0016] In one embodiment, the main opening includes a first opening, a second opening, a third opening, and a fourth opening; the valve core channel includes a first valve core channel and a second valve core channel; the valve core has a first position and a second position within the mounting cavity; in the first position, the first valve core channel is fluidly connected to the secondary opening and the first opening, the second valve core channel is fluidly connected to the third opening and the fourth opening, and the valve core blocks the second opening; in the second position, the first valve core channel is fluidly connected to the secondary opening and the fourth opening, the second valve core channel is fluidly connected to the first opening and the second opening, and the valve core blocks the third opening.

[0017] In one embodiment, the flow channel plate includes a plate body and a cover plate; one side of the plate body is provided with the mounting cavity, and the other side is provided with a groove; a portion of the cavity flow channel is an internal channel of the plate body, and another portion of the cavity flow channel is defined by the groove and the cover plate, wherein the cover plate covers the groove and is sealed to the groove.

[0018] In one embodiment, the cavity flow channel further has a distal opening; the cavity flow channel is formed between the proximal opening and the distal opening; wherein the distal opening includes a fifth opening, a sixth opening, a seventh opening, an eighth opening, and a ninth opening; the cavity flow channel includes a first flow channel, a second flow channel, a third flow channel, a fourth flow channel, and a fifth flow channel; wherein the first flow channel is formed between the secondary opening and the fifth opening, the second flow channel is formed between the first opening and the sixth opening, the third flow channel is formed between the seventh opening and the third opening, the fourth flow channel is formed between the fourth opening and the eighth opening, and the fifth flow channel is formed between the second opening and the ninth opening.

[0019] In one embodiment, the thermal management device further includes a one-way valve disposed within the fifth flow channel; the one-way valve allows the heat transfer fluid to flow unidirectionally from the second opening to the ninth opening.

[0020] In one embodiment, the inner wall of the fifth flow channel is provided with a stepped portion; the lower end of the one-way valve abuts against the stepped portion, and the upper end of the one-way valve abuts against the sealing seat; the sealing seat is configured to press the one-way valve onto the stepped portion.

[0021] In one embodiment, the thermal management device includes a drying bottle disposed at the end of the first portion away from the second portion.

[0022] In one embodiment, the thermal management device further includes a one-way valve; the one-way valve is disposed within the cavity flow channel; the inner wall of the cavity flow channel is provided with a stepped portion; wherein the valve core is configured to press the one-way valve onto the stepped portion.

[0023] In one embodiment, the thermal management device further includes a sealing seat; the sealing seat is disposed between the valve core and the check valve; the valve core is configured to press the sealing seat axially downward so that the sealing seat can press the check valve onto the stepped portion.

[0024] In one embodiment, the axis of the one-way valve is parallel to the axis of the multi-way valve.

[0025] In one embodiment, the valve cover assembly is configured to press the valve core downward along the axial direction.

[0026] The above objective is achieved by the manufacturing method of the thermal management device described below.

[0027] This disclosure provides a method for manufacturing a thermal management device, the method comprising the step of inserting a one-way valve into a cavity flow channel from a proximal opening; wherein the one-way valve abuts against a stepped portion within the cavity flow channel.

[0028] The method for manufacturing the thermal management device according to this disclosure may also have one or more of the following features, either individually or in combination.

[0029] In one embodiment, the manufacturing method further includes the step of inserting a sealing seat into a cavity flow channel from the proximal opening; wherein the sealing seat abuts against the end of the one-way valve away from the stepped portion.

[0030] In one embodiment, the manufacturing method further includes the step of pressing the valve core of the multi-way valve down onto the sealing seat.

[0031] In one embodiment, the manufacturing method further includes the following steps: first connecting the valve cover assembly of the multi-way valve and the valve core into one unit, and then installing the valve cover assembly onto the flow channel plate, thereby allowing the valve core to enter the mounting cavity of the flow channel plate; wherein, the valve cover assembly is configured to press the valve core axially downward so that the valve core abuts against the sealing seat.

[0032] The advantages of this disclosed technical solution are as follows: by placing the valve cavity on the flow channel plate, at least part of the valve body structure is eliminated, improving integration, simplifying the assembly process, reducing the device size, and lowering costs; different types of flow channels can be used, improving the flexibility of processing and assembly; the flow channels mainly extend in two directions, making the flow channel plate structure easy to process and compact. Furthermore, the thermal management device of this disclosure also has advantages such as simple flow path and simple connection. The manufacturing method of the thermal management device of this disclosure has corresponding advantages. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments of this disclosure will be briefly described below. The drawings are merely illustrative of some embodiments of this disclosure and are not intended to limit the scope of all embodiments of this disclosure. In the drawings:

[0034] Figure 1 shows a schematic diagram of a vehicle thermal management device according to an embodiment of the present disclosure;

[0035] Figure 2 shows a plan view of the flow channel plate of a vehicle thermal management device according to an embodiment of the present disclosure;

[0036] Figure 3 shows a perspective view of the flow channel plate of a vehicle thermal management device according to an embodiment of the present disclosure;

[0037] Figure 4 shows a cross-sectional view of the flow channel plate of a vehicle thermal management device according to an embodiment of the present disclosure;

[0038] Figure 5 shows a schematic diagram of the back side of the flow channel plate of a vehicle thermal management device according to an embodiment of the present disclosure;

[0039] Figure 6 shows a schematic diagram of the groove of the flow channel plate of a vehicle thermal management device according to an embodiment of the present disclosure;

[0040] Figure 7 shows a partial cross-sectional view of a vehicle thermal management device according to an embodiment of the present disclosure;

[0041] Figure 8 shows a partial cross-sectional view of a vehicle thermal management device according to an embodiment of the present disclosure;

[0042] Figure 9 shows another partial cross-sectional view of a vehicle thermal management device according to an embodiment of the present disclosure;

[0043] Figure 10 shows an internal schematic diagram of a multi-way valve of a vehicle thermal management device according to an embodiment of the present disclosure;

[0044] Figure 11 shows a partial cross-sectional view of a vehicle thermal management device according to another embodiment of the present disclosure;

[0045] Figure 12 shows a partial cross-sectional view of a vehicle thermal management device according to another embodiment of the present disclosure;

[0046] Figure 13 shows a schematic diagram of a vehicle thermal management device according to another embodiment of the present disclosure;

[0047] Figure 14 shows a schematic diagram of a vehicle thermal management device according to another embodiment of the present disclosure;

[0048] Figure 15 shows a schematic diagram of a vehicle thermal management device according to another embodiment of the present disclosure;

[0049] Figure 16 shows a schematic diagram of fluid flow in AC mode of a vehicle's thermal management device according to an embodiment of the present disclosure;

[0050] Figure 17 shows a schematic diagram of fluid flow in AC+Chiller mode of a vehicle thermal management device according to an embodiment of the present disclosure;

[0051] Figure 18 shows a schematic diagram of fluid flow in the Chiller mode of a vehicle's thermal management device according to an embodiment of the present disclosure;

[0052] Figure 19 shows a schematic diagram of fluid flow in heat pump mode of a vehicle thermal management device according to an embodiment of the present disclosure;

[0053] Figure 20 illustrates a schematic diagram of fluid flow in heat pump dehumidification mode of a vehicle's thermal management device according to an embodiment of the present disclosure; and

[0054] Figure 21 shows a schematic diagram of fluid flow in the heat pump dehumidification + waste heat recovery mode of a vehicle thermal management device according to an embodiment of the present disclosure. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0056] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not necessarily indicate a quantity limitation. The terms “comprising,” “including,” or “having,” and similar terms mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. The terms “connected” or “connected,” and similar terms are not limited to the physical or mechanical connection or connection shown in the drawings, but may include equivalent connections or connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, which may change accordingly when the absolute position of the described object changes.

[0057] The following describes in detail various embodiments of a thermal management device for a vehicle according to embodiments of the present disclosure with reference to Figures 1 to 21. The thermal management device according to the present disclosure is used to distribute a heat transfer fluid, which may be, for example, a refrigerant as described below. The thermal management device may be mounted on the vehicle body. For example, the vehicle body includes a frame, and the thermal management device may be mounted on the frame. The thermal management device according to the present disclosure can be used in new energy vehicles, such as electric vehicles, hybrid vehicles, etc. The thermal management device includes a refrigerant circuit for refrigerant flow and a coolant circuit for coolant flow. The refrigerant may be, for example, Freon or propane, and the coolant may be, for example, a mixture of water and ethylene glycol.

[0058] As shown in Figure 1, the thermal management device may include a flow channel plate 1 and a multi-way valve 100. The multi-way valve 100 may be mounted on the flow channel plate 1 to improve integration and reduce material and assembly costs. The flow channel plate 1 may also be referred to as a manifold plate.

[0059] For example, the flow channel plate 1 can be a refrigerant plate, on one side of which thermal management elements for the refrigerant circuit of the thermal management device are mounted. Furthermore, various thermal management elements can be mounted on the flow channel plate 1, such as a dryer flask 120, a heat exchanger 121, expansion valves 122 and 123, etc. Expansion valves 122 and 123 are, for example, electronic expansion valves. As shown in Figure 1, the dryer flask 120 is positioned adjacent to the multi-way valve 100. This allows for greater integration of the thermal management device and simplifies installation.

[0060] In other examples, the flow channel plate 1 can be a coolant plate, and the heat transfer fluid can be coolant.

[0061] As shown in Figures 2 and 3, the flow channel plate 1 has a mounting cavity 10 and a cavity flow channel 70. The cavity flow channel 70 has a proximal opening 80, which is formed on the inner wall of the mounting cavity 10. For example, as shown in Figures 3 and 7, the inner wall of the mounting cavity 10 includes a side wall 110 and a bottom wall 111, with the proximal opening 80 formed on the bottom wall 111 and the side wall 110 surrounding the proximal opening 80. For example, the mounting cavity 10 has a cylindrical shape.

[0062] As shown in Figures 8 to 12, the multi-way valve 100 includes a valve core 101 and a valve cover assembly 102. The valve core 101 is disposed in a mounting cavity 10. The valve cover assembly 102 is mounted on a flow channel plate 1 and closes the mounting cavity 10. The valve cover assembly 102 is connected to the valve core 101. The valve core 101 has a valve core channel 103 located within the mounting cavity 10. The valve core channel 103 is in fluid communication with two proximal openings 80, respectively. The valve core 101 being disposed in the mounting cavity 10 includes at least a portion of the valve core 101 being disposed in the mounting cavity 10. For example, when the valve core 101 has a large dimension along the axial direction of the multi-way valve 100, the end of the valve core 101 away from the flow channel plate 1 in the axial direction of the multi-way valve 100 protrudes from the mounting cavity 10 and extends into the internal space 1022 of the valve cover assembly 102, as shown in Figure 9. However, along the radial direction of the multi-way valve 100, the valve core 101 is always located within the mounting cavity 10. In this article, "axial" refers to the direction along the axis 1000 of the multi-way valve, and "radial" refers to the direction perpendicular to the axial direction.

[0063] For example, as shown in Figure 10, the valve cover assembly 102 is mounted on the flow channel plate 1 by multiple threaded fasteners. After the valve cover assembly 102 is fixedly connected to the flow channel plate 1, the internal space 1022 of the valve cover assembly 102 and the mounting cavity 10 together form a working cavity for the multi-way valve 100.

[0064] As shown in Figures 8 to 12, the valve cover assembly 102 includes a valve cover body 1021 and a rotating shaft 1020, the direction of which is axial with that of the multi-way valve 100. The valve cover body 1021 is preferably mounted on the flow channel plate 1 by a plurality of threaded fasteners, defining the internal space 1022 of the valve cover assembly 102. The rotating shaft 1020 is rotatably mounted on the valve cover body 1021 and extends into the working cavity, being fixedly connected to the valve core 101, thereby enabling the valve core 101 to rotate. More specifically, the rotating shaft 1020 can drive the valve core 101 to rotate between a first position and a second position mentioned below. In a more specific embodiment, the valve cover body 1021 includes a motor for driving the rotating shaft 1020 to rotate.

[0065] Furthermore, as shown in Figures 3 and 7, the sidewall 110 defines a mounting cavity opening 112, and the valve cover assembly 102 covers the mounting cavity opening 112 to close the mounting cavity 10.

[0066] Referring again to Figures 3, 7 to 12, the thermal management device also includes a sealing seat 40, with a proximal opening 80 including a main opening 81 through which the sealing seat 40 is inserted into the cavity flow channel 70. The sealing seat 40 has a main body portion 41 located within the cavity flow channel 70 and a protrusion 42 located outside the cavity flow channel 70. The protrusion 42 protrudes from the bottom wall 111, as shown by the dashed line in Figure 9. The axially oriented lower surface 104 of the valve core 101 abuts against the protrusion 42, such that the lower surface 104 and the bottom wall 111 define a first lateral clearance 51. The inlet and outlet of the valve core passage 103 are formed on the lower surface 104, respectively. In one embodiment, the height of the protrusion 42 protruding from the bottom wall 111 can be between 0.3 mm and 0.6 mm.

[0067] As shown in Figure 8, the inner wall of the sealing seat 40 defines a fluid channel 60, which extends through the protrusion 42 and the main body 41. A first lateral gap 51 surrounds the protrusion 42, separating the first lateral gap 51 from the fluid channel 60. The valve core channel 103 is in fluid communication with the main opening 81 through the fluid channel 60.

[0068] As shown in Figure 2, the proximal opening 80 also includes a secondary opening 82. Referring to Figures 8 and 9, the first lateral gap 51 described above is configured to extend between the secondary opening 82 and the lower surface 104 of the valve core 101, allowing fluid communication between the valve core passage 103 and the secondary opening 82. For example, the secondary opening 82 serves as an inlet for heat transfer fluid to flow into the mounting cavity 10.

[0069] Referring again to Figures 8 and 9, the axial upper surface 105 of the valve core 101 defines a second lateral clearance 52 with the valve cover assembly 102. The radial side surface 106 of the valve core 101 defines a longitudinal clearance 50 with the valve cover assembly 102 or the sidewall 110. In Figure 8, the radial side surface 106 of the valve core 101 defines a longitudinal clearance 50 with the valve cover assembly 102. In Figure 9, the radial side surface 106 of the valve core 101 defines a longitudinal clearance 50 with the sidewall 110. The longitudinal clearance 50 connects the first lateral clearance 51 and the second lateral clearance 52, respectively. Heat transfer fluid can flow from the secondary opening 82 to the aforementioned clearances and fill the remaining space in the mounting cavity 10. This helps to achieve pressure balance between the axial upper and lower surfaces of the valve core 101, reducing the torque required for the rotation of the valve core 101.

[0070] In the example shown in Figure 11, the proximal opening 80 does not include the secondary opening 82, but only the main opening 81. One of the main openings 81 serves as an inlet for the heat transfer fluid to flow into the mounting cavity 10, as indicated by the arrow in Figure 11. A balancing through-hole 107 is provided on the valve core 101, which can be at least partially aligned with the main opening 81 serving as the inlet and is in fluid communication with the main opening 81 through the fluid passage 60 of the corresponding sealing seat 40, to achieve pressure balance between the upper and lower surfaces of the valve core 101 in the axial direction. After flowing in through the inlet, the heat transfer fluid flows sequentially through the balancing through-hole 107, the second transverse gap 52, the longitudinal gap 50, and the first transverse gap 51. That is, the heat transfer fluid first passes through the balancing through-hole 107 through the valve core 101 and enters the second transverse gap 52, and then flows downwards into the first transverse gap 51 through the longitudinal gap 50. After this, the heat transfer fluid can flow out through the other main openings 81. Specifically, the number of main openings 81 shown in Figure 11 can be at least four. It should be understood that the thermal management device shown in Figure 11 may have the features described above with respect to other examples, which will not be repeated here.

[0071] To ensure a seal, a sealing element, such as an O-ring, is provided between the sealing seat 40 and the corresponding cavity flow channel 70. Additionally, another sealing element, such as an O-ring, is provided between the valve cover assembly 102 and the side wall 110 of the mounting cavity 10.

[0072] As shown in Figures 1 and 2, the flow channel plate 1 has a first portion 2 extending along a first direction D1 and a second portion 3 extending along a second direction D2 transverse to the first direction D1, with a mounting cavity 10 disposed on the second portion 3. For example, the first direction D1 is perpendicular to the second direction D2. The flow channel plate 1 may have a generally L-shaped shape. The cavity flow channel 70 may extend along the first direction D1 and the second direction D2. This makes the thermal management device more compact.

[0073] As shown in Figure 2, the main opening 81 includes a first opening 11, a second opening 12, a third opening 13, and a fourth opening 14. Therefore, the multi-way valve 100 can be a five-way valve. However, in other examples, the multi-way valve 100 can also be a four-way valve, in which case the main opening 81 may include only three openings. Each of the first opening 11, the second opening 12, the third opening 13, and the fourth opening 14 has a corresponding cavity flow channel and a corresponding sealing seat. In still other examples, the multi-way valve 100 can be a four-way valve with only four main openings 81.

[0074] As shown in Figure 10, the valve core channel 103 includes a first valve core channel 1031 and a second valve core channel 1032. The valve core 101 can have a first position and a second position within the mounting cavity 10. In the first position, the first valve core channel 1031 is fluidly connected to the secondary opening 82 and the first opening 11, the second valve core channel 1032 is fluidly connected to the third opening 13 and the fourth opening 14, and the valve core 101 blocks the second opening 12. In the second position, the first valve core channel 1031 is fluidly connected to the secondary opening 82 and the fourth opening 14, the second valve core channel 1032 is fluidly connected to the first opening 11 and the second opening 12, and the valve core 101 blocks the third opening 13.

[0075] As shown in Figures 5 and 6, the flow channel plate 1 includes a plate body 113 and a cover plate 114. A mounting cavity 10 is provided on one side of the plate body 113, and a groove 115 is provided on the other side. A portion of the cavity flow channel 70 is an internal channel of the plate body 113, and another portion of the cavity flow channel 70 is defined by the groove 115 and the cover plate 114. The cover plate 114 covers the groove 115 and is sealed to it. For example, the internal channel and the groove 115 are integrally formed with the plate body 113. By providing different types of cavity flow channels, installation flexibility can be improved. In a specific embodiment, the internal channel is a channel formed by drilling holes in the plate body 113.

[0076] Opposite to the proximal opening 80 located within the mounting cavity 10, the cavity flow channel 70 also has a distal opening 90, as schematically shown in FIG2. The cavity flow channel 70 is formed between the proximal opening 80 and the distal opening 90. The proximal opening 80 and the distal opening 90 are formed on the flow channel plate 1 and integrally formed therewith.

[0077] As shown in Figures 2 and 3, the distal opening 90 may include the fifth opening 5, the sixth opening 6, the seventh opening 7, the eighth opening 8, and the ninth opening 9.

[0078] In addition, the thermal management device may also include auxiliary openings for fluid communication or engagement with the thermal management element. These auxiliary openings may be formed on and integrally molded with the flow channel plate 1. As shown in Figures 3 and 4, the auxiliary openings may include a tenth opening 21, an eleventh opening 22, a twelfth opening 23, a thirteenth opening 29, a fourteenth opening 30, a fifteenth opening 31, a sixteenth opening 32, etc.

[0079] For example, the fifth opening 5 can be connected to the outlet of the internal condenser via a pipe, the sixth opening 6 can be connected to the inlet or outlet of the evaporator-condenser via a pipe, the seventh opening 7 can be connected to the inlet or outlet of the evaporator-condenser via a pipe, and the ninth opening 9 can be connected to the inlet of the compressor via a pipe.

[0080] Referring to Figure 1, the eighth opening 8 and the tenth opening 21 are in fluid communication with the drying bottle 120. For example, a mounting part 33 for mounting the drying bottle 120 is provided at the eighth opening 8 and the tenth opening 21. This part can be integrally formed with the flow channel plate 1 or be a separate component, and has channels communicating with the eighth opening 8 and the tenth opening 21 respectively. The upper end of the drying bottle 120 can be fixedly connected to and communicate with the mounting part 33. The thirteenth opening 29 and the sixteenth opening 32 are in fluid communication with and engaged with the heat exchanger 121. The fifteenth opening 31 is engaged with the expansion valve 122. The fourteenth opening 30 is engaged with the expansion valve 123. For example, the expansion valve can be inserted into the corresponding opening. The eleventh opening 22 is in fluid communication with the inlet of the evaporator, and the twelfth opening 23 is in fluid communication with the outlet of the evaporator.

[0081] For example, the cavity flow channel 70 includes a first flow channel 16, a second flow channel 17, a third flow channel 18, a fourth flow channel 19, and a fifth flow channel 20. The first flow channel 16 is formed between the secondary opening 82 and the fifth opening 5. The second flow channel 17 is formed between the first opening 11 and the sixth opening 6. The third flow channel 18 is formed between the seventh opening 7 and the third opening 13. The fourth flow channel 19 is formed between the fourth opening 14 and the eighth opening 8. The fifth flow channel 20 is formed between the second opening 12 and the ninth opening 9. In other examples, the cavity flow channel 70 may include more or fewer flow channels, depending on the specific application, such as the number of ports in a multi-way valve or the connection between the multi-way valve and a thermal management element.

[0082] The aforementioned thirteenth opening 29 can be located on the fifth flow channel 20, between the second opening 12 and the ninth opening 9.

[0083] As shown in Figure 4, the first flow channel 16 and the second flow channel 17 can extend along the second direction D2. As shown in Figure 6, the third flow channel 18 can extend approximately along the second direction D2; a portion of the fourth flow channel 19 extends approximately along the first direction D1, and another portion extends approximately along the second direction D2; a portion of the fifth flow channel 20 extends approximately along the first direction D1, and another portion extends approximately along the second direction D2. Furthermore, the portion of the fifth flow channel 20 extending along the first direction D1 extends from one end of the flow channel plate 1 to the other end. This flow channel arrangement makes the flow channel plate structure easy to manufacture and compact.

[0084] In addition, other flow channels may be provided on the flow channel plate 1 of the thermal management device. As shown in FIG6, the other flow channels may include a sixth flow channel 25, a seventh flow channel 26, an eighth flow channel 27, a ninth flow channel 28, etc., which are integrated on the flow channel plate 1. The sixth flow channel 25 is formed between the seventh opening 7 and the fourteenth opening 30, and extends mainly along the first direction D1. The seventh flow channel 26 is formed between the tenth opening 21 and the eleventh opening 22. The eighth flow channel 27 is formed between the ninth opening 9 and the twelfth opening 23, and extends along the second direction D2. The ninth flow channel 28 is formed between the fifteenth opening 31 and the sixteenth opening 32.

[0085] The fifth flow channel 20 and the eighth flow channel 27 are connected to each other near the ninth opening 9 by a three-way structure.

[0086] The aforementioned flow channels mainly extend along the first direction D1 and the second direction D2, thus making the flow channel structure of the flow channel plate simple and the flow resistance small.

[0087] Referring again to Figure 1, the thermal management device also includes a one-way valve 200. As shown in Figures 6 and 7, the one-way valve 200 is disposed within the fifth flow channel 20, for example, in the portion of the fifth flow channel 20 extending along the second direction D2. The one-way valve 200 allows the heat transfer fluid to flow unidirectionally from the second opening 12 to the ninth opening 9. In other words, the one-way valve 200 does not allow the heat transfer fluid to flow from the second opening 12 into the mounting cavity 10. For example, the one-way valve 200 can be inserted into the fifth flow channel 20 perpendicular to the extension plane of the flow channel plate 1. The insertion of the one-way valve 200 into the flow channel further improves the integration of the thermal management device and simplifies the assembly process.

[0088] In another embodiment shown in Figure 12, the one-way valve 200 is further positioned adjacent to the multi-way valve 100. A stepped portion 201 is provided on the inner wall of the fifth flow channel 20. The lower end of the one-way valve 200 abuts against the stepped portion 201, and the upper end of the one-way valve 200 abuts against the sealing seat 40, which is configured to press the one-way valve 200 against the stepped portion 201. Seals are provided between the lower end of the one-way valve 200 and the stepped portion 201, and between the upper end of the one-way valve 200 and the sealing seat 40. For example, the one-way valve 200 can be inserted into the fifth flow channel 20 in the vertically downward direction shown in Figure 12, as described in the manufacturing method below. This configuration further improves the integration of the thermal management device, reduces the system size, and lowers assembly costs. It should be understood that the thermal management device shown in Figure 12 may have the features described above with respect to other examples, which will not be repeated here.

[0089] In some examples, the one-way valve 200 of the thermal management device is disposed within a cavity flow channel 70, and the inner wall of the cavity flow channel 70 is provided with a stepped portion 201. The valve core 101 of the multi-way valve 100 is configured to press the one-way valve 200 against the stepped portion 201. In other words, the valve core 101 of the multi-way valve 100 directly contacts the one-way valve 200, and there is no sealing seat between them.

[0090] In an example where the thermal management device includes a sealing seat, the sealing seat 40 is disposed between the valve core 101 and the one-way valve 200; the valve core 101 is configured to press the sealing seat 40 downward along the axial direction so that the sealing seat 40 can press the one-way valve 200 onto the step portion 201. In other words, the valve core 101 of the multi-way valve 100 indirectly presses the one-way valve 200 onto the step portion 201 through the sealing seat, as shown in FIG12.

[0091] Referring again to Figure 12, the axis 2000 of the one-way valve 200 is parallel to the axis 1000 of the multi-way valve 100, which also applies to the examples shown in Figures 1 to 11. The axis referred to herein refers to the central axis of the valve, but it can also be the axis of rotation.

[0092] In the above configuration, the valve cover assembly 102 of the multi-way valve is configured to press the valve core 101 downward along the axial direction.

[0093] In another embodiment shown in Figure 15, the drying bottle 120 included in the thermal management device is disposed at the end of the first part 2 away from the second part 3. In this way, the drying bottle 120 and the multi-way valve 100 are located at opposite ends of the flow channel plate 1, which is beneficial for the balance of the flow channel plate and facilitates the assembly of the thermal management device.

[0094] As shown in Figure 13, the eleventh opening 22 and the twelfth opening 23 are integrated on the first part 2 of the flow channel plate 1, specifically at the end of the first part 2 away from the second part. The end faces of the eleventh opening 22 and the twelfth opening 23 form the first mounting surface S1 of the thermal management device, which is perpendicular to the extension plane of the flow channel plate 1. The fifth opening 5 and the sixth opening 6 are integrated on the second part 3 of the flow channel plate 1 and are in fluid communication with the mounting cavity 10 through the first flow channel 16 and the second flow channel 17 extending along the second direction D2, respectively. The end faces of the fifth opening 5 and the sixth opening 6 form the second mounting surface S2 of the thermal management device, which is perpendicular to the extension plane of the flow channel plate 1. The extension plane is the plane formed by the extension of the first direction D1 and the second direction D2. The first direction D1 can also be referred to as the length direction of the flow channel plate 1, and the second direction D2 can also be referred to as the height direction of the flow channel plate 1. The eleventh opening 22 and the twelfth opening 23, as well as the fifth opening 5 and the sixth opening 6, are located at the ends and edges, thus allowing the mounting points for external piping and / or thermal management components to be moved from the side mounting area of ​​the flow channel plate to the ends and edges of the flow channel plate. This improves the compactness of the thermal management device and eliminates the need for additional process holes for machining the flow channels. Furthermore, the eleventh opening 22 and the twelfth opening 23, as well as the fifth opening 5 and the sixth opening 6, open in the same direction, which facilitates the connection with external piping and / or thermal management components.

[0095] The first flow channel 16 and the second flow channel 17 mentioned above are internal channels of the plate body 113 of the flow channel plate 1, and are integrally formed with the plate body 113. Furthermore, the eighth flow channel 27 can also be an internal channel of the plate body 113 of the flow channel plate 1, integrally formed with the plate body 113. This configuration eliminates the need for additional process holes, simplifying the processing of the channels.

[0096] Referring again to Figure 13, the thermal management device further includes first connecting portions 125 and 126 and a second connecting portion 127. The first connecting portions 125 and 126 are located at both ends of the flow channel plate 1 and at its lower edge. The second connecting portion 127 is located in the central portion of the flow channel plate 1 and at its upper edge. The flow channel plate 1 is mounted on the vehicle body via the first connecting portions 125 and 126 and the second connecting portion 127. The first connecting portions 125 and 126 and the second connecting portion 127 may include mounting holes. The central axis of the mounting holes of the first connecting portions 125 and 126 (shown by the dashed line in Figure 13) is parallel to the second direction D2, and the central axis of the mounting hole of the second connecting portion 127 is perpendicular to the extending plane of the flow channel plate 1, thereby fixing the flow channel plate in different directions. The aforementioned connecting portions can be integrally formed with the flow channel plate.

[0097] As shown in Figure 14, the thermal management device also includes a bracket 128. The flow channel plate 1 is fixed to the bracket 128, which is mounted on the vehicle body. This makes the device more flexible and easier to disassemble.

[0098] Figures 16 to 21 illustrate the fluid flow in different modes of the thermal management device of this disclosure, where different arrows indicate fluids at different temperatures and pressures. Generally, thicker white arrows represent high-temperature, high-pressure fluids, thinner white arrows represent medium-temperature, high-pressure fluids, and black arrows represent low-temperature, low-pressure fluids. The highly integrated thermal management device of this disclosure can implement multiple thermal management modes.

[0099] As shown in Figure 16, the thermal management device is in AC mode, and valve core 101 is in the first position. High-temperature, high-pressure fluid from the compressor flows through the internal condenser, then through the fifth opening 5 and the first flow channel 16, entering through the secondary opening 82. It then flows through the first opening 11, the second flow channel 17, and the sixth opening 6 to the inlet of the evaporator-condenser, where it condenses and cools. Fluid from the evaporator-condenser outlet flows through the seventh opening 7 and the third flow channel 18, entering through the third opening 13, then through the fourth opening 14, the fourth flow channel 19, and the eighth opening 8 into the drying bottle 120. Fluid from the drying bottle 120 flows through the tenth opening 21, the seventh flow channel 26, and the eleventh opening 22, then to the evaporator. Fluid from the evaporator flows through the twelfth opening 23 and the eighth flow channel 27, then through the ninth opening 9 to the compressor.

[0100] As shown in Figure 17, the thermal management device is in AC+Chiller mode, with valve core 101 in the first position. Unlike the fluid flow in Figure 14, a portion of the fluid from the dryer bottle 120 expands and cools via expansion valve 122 at the fifteenth opening 31, then flows through the sixteenth opening 32 to the heat exchanger (e.g., the chiller) 121. After exchanging heat with the coolant circuit at the heat exchanger 121, the fluid flows out through the thirteenth opening 29, passes through a portion of the fifth flow channel 20, and then flows to the compressor through the ninth opening 9.

[0101] As shown in Figure 18, the thermal management device is in Chiller mode, and valve core 101 is in the first position. Unlike the fluid flow in Figure 17, the fluid from the dryer bottle 120 no longer flows to the evaporator, but instead flows to the heat exchanger 121 via the expansion valve 122.

[0102] As shown in Figure 19, the thermal management device is in heat pump mode, with valve core 101 in the second position. High-temperature, high-pressure fluid from the compressor flows through the internal condenser, then through the fifth opening 5 and the first flow channel 16, entering through the secondary opening 82, and then through the fourth opening 14, the fourth flow channel 19, and the eighth opening 8 into the dryer bottle 120. Fluid from the dryer bottle 120 flows through the tenth opening 21 and a portion of the seventh flow channel 26, reaching the expansion valve 123 at the fourteenth opening 30, where it expands and cools. Fluid from the expansion valve 123 flows through the sixth flow channel 25 and the seventh opening 7, then to the inlet of the evaporator-condenser, where it evaporates and absorbs heat. Fluid from the outlet of the evaporator-condenser flows through the sixth opening 6 and the second flow channel 17, entering the multi-way valve through the first opening 11, and then through the second opening 12 to the fifth flow channel 20. Within the fifth flow channel 20, the fluid flows through the one-way valve 200 to the ninth opening 9, and then to the compressor.

[0103] As shown in Figure 20, the thermal management device is in heat pump dehumidification mode, and valve core 101 is in the second position. Unlike the fluid flow in Figure 19, a portion of the fluid from the desiccant bottle 120 flows out from the eleventh opening 22 after passing through the seventh channel 26, and then flows to the evaporator. Furthermore, after passing through the evaporator, it flows into the eighth channel 27 from the twelfth opening 23, and then flows out to the compressor from the ninth opening 9.

[0104] As shown in Figure 21, the thermal management device is in heat pump dehumidification + waste heat recovery mode, and valve core 101 is in the second position. Unlike the fluid flow in Figure 20, another portion of the fluid from the dryer bottle 120 flows through a portion of the seventh channel 26 to the expansion valve 122 at the fifteenth opening 31, where it expands and cools. The fluid from the expansion valve 122 flows through the ninth channel 28 and the sixteenth opening 32, and then to the heat exchanger 121. After exchanging heat with the coolant circuit at the heat exchanger 121, the fluid flows out through the thirteenth opening 29, flows through a portion of the fifth channel 20, and then flows to the compressor from the ninth opening 9.

[0105] In one example of a method for manufacturing a thermal management device disclosed herein, the method includes the step of inserting a one-way valve 200 into a cavity flow channel 70 through a proximal opening 80. The one-way valve 200 abuts against a stepped portion 201 within the cavity flow channel 70. As shown in FIG12, the cavity flow channel 70 may be the fifth flow channel 20 described above, and the proximal opening 80 may be the second opening 12 described above.

[0106] In one example, the manufacturing method further includes the step of inserting a sealing seat 40 into a cavity flow channel 70 through the proximal opening 80, the sealing seat 40 abutting against the end of the one-way valve 200 away from the stepped portion 201. The manufacturing method also includes the step of pressing the sealing seat 40 down with the valve core 101 of the multi-way valve 100.

[0107] The manufacturing method further includes the following steps: first, connecting the valve cover assembly 102 and the valve core 101 of the multi-way valve 100 into a single unit, and then installing the valve cover assembly 102 onto the flow channel plate 1, thereby allowing the valve core 101 to enter the mounting cavity 10 of the flow channel plate 1. The valve cover assembly 102 is configured to press the valve core 101 downward along the axial direction so that the valve core 101 abuts against the sealing seat 40, as shown in Figure 12.

[0108] As described above, the thermal management device of this disclosure improves integration, simplifies assembly processes, reduces device size, and lowers costs. Furthermore, the thermal management device of this disclosure also has advantages such as simple flow paths and easy connections. It should be understood that the manufacturing method of the thermal management device of this disclosure also possesses the various advantages described regarding the thermal management device, such as simple assembly processes and low cost.

[0109] The technical features disclosed above are not limited to the combinations of the disclosed features with other features. Those skilled in the art may also make other combinations of the technical features according to the purpose of the disclosure in order to achieve the purpose of this disclosure.

Claims

1. A thermal management device for distributing a heat transfer fluid, characterized in that, The thermal management device includes: A flow channel plate (1) having a mounting cavity (10) and a cavity flow channel (70); the cavity flow channel (70) having a proximal opening (80); the proximal opening (80) being formed on the inner wall of the mounting cavity (10); and A multi-way valve (100) includes a valve core (101) and a valve cover assembly (102); the valve core (101) is disposed in the mounting cavity (10); the valve cover assembly (102) is mounted on the flow channel plate (1) and closes the mounting cavity (10); The valve core (101) has a valve core channel (103); the valve core channel (103) is in fluid communication with the two proximal openings (80) respectively.

2. The thermal management device of claim 1, wherein, The inner wall of the mounting cavity (10) includes a side wall (110) and a bottom wall (111); the proximal opening (80) is formed in the bottom wall (111); the side wall (110) surrounds the proximal opening (80); The sidewall (110) defines a mounting cavity opening (112), and the valve cover assembly (102) covers the mounting cavity opening (112) to close the mounting cavity (10).

3. The thermal management device of claim 2, wherein, The thermal management device further includes a sealing seat (40); the proximal opening (80) includes a main opening (81); the sealing seat (40) is inserted into the cavity flow channel (70) from the main opening (81); The sealing seat (40) has a main body (41) located inside the cavity flow channel (70) and a protrusion (42) located outside the cavity flow channel (70); the protrusion (42) protrudes from the bottom wall (111); the lower surface (104) of the valve core (101) in the axial direction abuts against the protrusion (42) so that the lower surface (104) and the bottom wall (111) define a first lateral gap (51); the inlet and outlet of the valve core channel (103) are respectively formed on the lower surface (104); The inner wall of the sealing seat (40) defines a fluid channel (60); the fluid channel (60) passes through the protrusion (42) and the main body (41); the first transverse gap (51) surrounds the protrusion (42), and the protrusion (42) separates the first transverse gap (51) and the fluid channel (60); the valve core channel (103) is in fluid communication with the main opening (81) through the fluid channel (60).

4. The thermal management device of claim 3, wherein, The proximal opening (80) further includes a secondary opening (82); the first lateral gap (51) is configured to extend between the secondary opening (82) and the lower surface (104) to allow fluid communication between the valve core passage (103) and the secondary opening (82).

5. The thermal management device of claim 4, wherein, The secondary opening (82) is the inlet for the heat transfer fluid to flow into the mounting cavity (10).

6. The thermal management device of claim 5, wherein, The upper surface (105) of the valve core (101) in the axial direction and the valve cover assembly (102) define a second lateral clearance (52); The radial side surface (106) of the valve core (101) defines a longitudinal clearance (50) with the valve cover assembly (102) or the side wall (110); The longitudinal gap (50) connects the first transverse gap (51) and the second transverse gap (52) respectively.

7. The thermal management device according to claim 3, characterized in that, One of the main openings (81) is an inlet for the heat transfer fluid to flow into the mounting cavity (10).

8. The thermal management device of claim 7, wherein, The valve core (101) is provided with a balance through hole (107). After the heat transfer fluid flows in through the inlet, it flows sequentially through the balance through hole (107), the second transverse gap (52), the longitudinal gap (50) and the first transverse gap (51).

9. The thermal management device of claim 1, wherein, The flow channel plate (1) has a first portion (2) extending along a first direction (D1) and a second portion (3) extending along a second direction (D2) transverse to the first direction (D1), and the mounting cavity (10) is disposed on the second portion (3).

10. The thermal management device of claim 5, wherein, The main opening (81) includes a first opening (11), a second opening (12), a third opening (13), and a fourth opening (14); the valve core channel (103) includes a first valve core channel (1031) and a second valve core channel (1032); the valve core (101) has a first position and a second position in the mounting cavity (10); In the first position, the first valve core channel (1031) is in fluid communication with the secondary opening (82) and the first opening (11), the second valve core channel (1032) is in fluid communication with the third opening (13) and the fourth opening (14), and the valve core (101) blocks the second opening (12); In the second position, the first valve core channel (1031) is in fluid communication with the secondary opening (82) and the fourth opening (14), the second valve core channel (1032) is in fluid communication with the first opening (11) and the second opening (12), and the valve core (101) blocks the third opening (13).

11. The thermal management device of claim 1, wherein, The flow channel plate (1) includes a plate body (113) and a cover plate (114); the plate body (113) has the mounting cavity (10) on one side and a groove (115) on the other side; One part of the cavity flow channel (70) is an internal channel of the plate (113), and another part of the cavity flow channel (70) is defined by the groove (115) and the cover plate (114), wherein the cover plate (114) covers the groove (115) and is sealed to the groove (115).

12. The thermal management device of claim 10, wherein, The cavity flow channel (70) also has a distal opening (90); the cavity flow channel (70) is formed between the proximal opening (80) and the distal opening (90); wherein the distal opening (90) includes a fifth opening (5), a sixth opening (6), a seventh opening (7), an eighth opening (8) and a ninth opening (9); the cavity flow channel (70) includes a first flow channel (16), a second flow channel (17), a third flow channel (18), a fourth flow channel (19) and a fifth flow channel (20); The first flow channel (16) is formed between the secondary opening (82) and the fifth opening (5), the second flow channel (17) is formed between the first opening (11) and the sixth opening (6), the third flow channel (18) is formed between the seventh opening (7) and the third opening (13), the fourth flow channel (19) is formed between the fourth opening (14) and the eighth opening (8), and the fifth flow channel (20) is formed between the second opening (12) and the ninth opening (9).

13. The thermal management device of claim 12, wherein, The thermal management device further includes a one-way valve (200); the one-way valve (200) is disposed in the fifth flow channel (20); the one-way valve (200) allows the heat transfer fluid to flow unidirectionally from the second opening (12) to the ninth opening (9).

14. The thermal management device according to claim 13, characterized in that, The inner wall of the fifth flow channel (20) is provided with a stepped portion (201); the lower end of the one-way valve (200) abuts against the stepped portion (201), and the upper end of the one-way valve (200) abuts against the sealing seat (40); The sealing seat (40) is configured to press the one-way valve (200) onto the step portion (201).

15. The thermal management device according to claim 1, characterized in that, The thermal management device includes a drying bottle (120) disposed at the end of the first part (2) away from the second part (3).

16. The thermal management device according to claim 1, characterized in that, The thermal management device further includes a one-way valve (200); the one-way valve (200) is disposed in the cavity flow channel (70); the inner wall of the cavity flow channel (70) is provided with a stepped portion (201); The valve core (101) is configured to press the one-way valve (200) onto the stepped portion (201).

17. The thermal management device according to claim 16, characterized in that, The thermal management device further includes a sealing seat (40); the sealing seat (40) is disposed between the valve core (101) and the one-way valve (200); the valve core (101) is configured to press the sealing seat (40) axially downward so that the sealing seat (40) can press the one-way valve (200) onto the step portion (201).

18. The thermal management device according to claim 16, characterized in that, The axis (2000) of the one-way valve (200) is parallel to the axis (1000) of the multi-way valve (100).

19. The thermal management device according to claim 16, characterized in that, The valve cover assembly (102) is configured to press the valve core (101) downward along the axial direction.

20. A method for manufacturing a thermal management device, characterized in that, The manufacturing method includes the step of inserting a one-way valve (200) into a cavity flow channel (70) from a proximal opening (80); wherein the one-way valve (200) abuts against a step portion (201) within the cavity flow channel (70).

21. The method for manufacturing the thermal management device according to claim 20, characterized in that, The manufacturing method further includes the step of inserting a sealing seat (40) into the cavity flow channel (70) from the proximal opening (80); wherein the sealing seat (40) abuts against the end of the one-way valve (200) away from the stepped portion (201).

22. The method for manufacturing the thermal management device according to claim 21, characterized in that, The manufacturing method further includes the step of pressing the valve core (101) of the multi-way valve (100) down the sealing seat (40).

23. The method for manufacturing the thermal management device according to claim 22, characterized in that, The manufacturing method further includes the following steps: first, connecting the valve cover assembly (102) of the multi-way valve (100) and the valve core (101) into one unit, and then installing the valve cover assembly (102) onto the flow channel plate (1), so that the valve core (101) enters the mounting cavity (10) of the flow channel plate (1); The valve cover assembly (102) is configured to press the valve core (101) downward along the axial direction so that the valve core (101) abuts against the sealing seat (40).

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