Ultrasound probe

Abstract

The present description relates to an ultrasound probe (200) extending in a longitudinal direction (Z), the ultrasound probe comprising: - a mechanical support (210) extending in the longitudinal direction and comprising at least three lateral faces; - an array of ultrasound transducers (220) positioned above a first lateral face (211) of the lateral faces of the mechanical support; - and at least one integrated control circuit (230) positioned above at least one other lateral face (212) of the lateral faces of the mechanical support, the at least one other lateral face being different from the first lateral face.

Description

DESCRIPTION TITLE: Ultrasonic Probe This application is based on, and claims priority from, French patent application FR2405441 filed on May 28, 2024 and entitled "Ultrasonic Probe", which is considered to be an integral part of this description within the limits provided by law. technical field

[0001] This description generally relates to ultrasonic probes comprising ultrasonic transducers and transducer control circuits.

[0002] This description may relate, in particular, to ultrasonic probes integrated into catheters, which may be referred to as ultrasound catheters.

[0003] An example of the application of such ultrasound probes concerns intracardiac echocardiography, or ICE, where an ultrasound probe is integrated into a catheter which is directed towards the heart to produce images of the cardiovascular system from inside the heart. Previous technique

[0004] It has already been proposed to integrate a small ultrasound probe into a catheter, which can then be called an ultrasound catheter. The ultrasound catheter can be used to insert it into a patient's anatomical region, particularly for imaging that region.

[0005] Ultrasound catheters have been designed for use in many anatomical regions, for example, for diagnostic, therapeutic, and / or surgical purposes. Among the known techniques is imaging by Intravascular ultrasound (IVUS) and intracardiac echocardiography (ICE) are two main techniques. In both, a transducer array, or array of transducers, is typically positioned at one end of a catheter to emit ultrasound waves. This is usually referred to as the distal end of the catheter, through which the catheter is guided into the area of ​​the body to be examined. The transducers can then be used to receive ultrasound waves reflected back from specific structures within the anatomical region. These reflected ultrasound waves can be transmitted to a processing device designed to process them and produce an image of the area of ​​the body where the catheter is located.

[0006] The generated image can be an image of a surface, for example a section, or an image of a volume.

[0007] An IVUS catheter is typically used in a blood vessel (artery or vein) and is usually associated with a guidewire that has a flexible tip to guide the catheter into the vessel.

[0008] An ICE catheter is typically used in a region of the heart, or even a surrounding structure, to image that region, for example, to prepare, guide, and / or facilitate medical procedures. An ICE catheter is not generally designed to be used with a guidewire, but rather typically includes a distal end that can be articulated by a guiding mechanism located in a handle at a proximal end of the catheter. The distal end can be connected to a flexible coupler located at one end of a flexible tubular element.

[0009] An example of an ultrasound probe 100 is described in relation to Figures IA and IB. This ultrasound probe is intended to be integrated into a catheter, at the end distal to the catheter, to form an ultrasound catheter, for example an ICE catheter. The ultrasound probe 100 comprises an array of ultrasound transducers 101 arranged on a transducer control circuit 102, in a vertically integrated configuration. The control circuit 102 can be an application-specific integrated circuit, known by the acronym AS IC, for Application Specific Integrated Circuit. The control circuit 102 can be arranged on a flexible interconnect substrate 103, itself arranged on an elongated parallelepiped-shaped support 104. The interconnect substrate 103 can be folded under the support 104 to be connected to electronic components 105, for example passive electronic components, positioned under the support 104. All these elements can be integrated inside a 106 duct made of an acoustically transparent material.Since the sheath 106 is intended to be in contact with the tissues of the anatomical region into which the catheter is inserted, it is preferably biocompatible. Furthermore, since the ultrasound probe 100 is intended to be inserted, along with the catheter, into a small anatomical space, its external diameter is generally a few millimeters, for example, less than 5 mm, or even 3 mm.

[0010] By positioning the transducer array 101 on the control circuit 102, in order to connect the transducers to different electronic circuits of the control circuit, it is generally necessary to match the pitch of the connection pads 107 of the transducer array 101 with the pitch of the connection pads 108 of the control circuit 102, as can be seen in Figure IB (a connection pad 107 of the transducer array can be coupled with one or more transducers of the transducer array). In other words, the pad array of the The control circuit 102 is identical or nearly identical to the pad array of the transducer array 101. An interposer can be inserted between the two to match and connect the connection pads 107 of the transducer array 101 with the connection pads 108 of the control circuit 102 when their respective pitches are different. However, even with an interposer, this pitch matching can impose a constraint on the choice of the control circuit, for example, the ASIC. Furthermore, an interposer generally increases the overall thickness of the components thus stacked.

[0011] Furthermore, the positioning of several active components one on top of the other, as in Figures IA and IB—the control circuit 102 and the transducers of the transducer array 101—can be a source of heat, which may be difficult to dissipate in the configuration shown in Figures IA and IB. This can lead to a malfunction of the ultrasonic probe 100. Moreover, the diameter constraint of the ultrasonic probe 100 limits the available, or usable, surface area within the probe for positioning multiple electronic components and control circuits, for example, to integrate more electronic functionalities. In the example of Figures IA and IB, only two usable surfaces are available, provided that the transducer array 101 is positioned on top of the control circuit 102.

[0012] Furthermore, the control circuit, such as an ASIC, is typically silicon-based. This creates a silicon-based structure, which is not an acoustically attenuating material, beneath the transducer array 101, potentially causing unwanted reflections of the ultrasonic wave propagating from the array. transducers 101 to the control circuit 102, and can degrade the quality of the image produced.

[0013] It would be desirable to have an ultrasonic probe that at least partially overcomes some of the drawbacks of known ultrasonic probes.

[0014] In particular, there is a need for an ultrasound probe, for example an ultrasound probe intended to be integrated into a catheter, for example an ICE catheter, that can integrate several electronic functionalities, including several control circuits and electronic components, within a limited diameter, while maintaining efficient assembly, interconnection and operation of the ultrasound probe.

[0015] It would be advantageous if such an ultrasonic probe could efficiently dissipate heat. Summary of the invention

[0016] One embodiment overcomes all or part of the disadvantages of known ultrasonic probes.

[0017] One embodiment provides for an ultrasonic probe extending along a longitudinal direction, the ultrasonic probe comprising: a mechanical support extending in the longitudinal direction and comprising at least three lateral faces; - an array of ultrasonic transducers positioned above a first lateral face among the lateral faces of the mechanical support; - at least one integrated control circuit positioned above at least one other side face among the side faces of the mechanical support, at least one other side face being distinct from the first side face.

[0018] According to one embodiment, the mechanical support is devoid of electrical connections.

[0019] According to one embodiment, the ultrasonic probe further comprises an interconnection substrate positioned on the mechanical support, the ultrasonic transducer array and at least one control integrated circuit being electrically connected to said interconnection substrate.

[0020] According to one embodiment, the ultrasonic transducer network and at least one control integrated circuit are positioned on a first face of the interconnection substrate, a second face of the interconnection substrate opposite to the first face being positioned on the mechanical support.

[0021] According to another embodiment, the ultrasonic transducer array is positioned on a first face of the interconnection substrate and at least one control integrated circuit is positioned on a second face of the interconnection substrate opposite the first face, said second face also being positioned on the mechanical support.

[0022] According to one embodiment, at least one other side face each has a recess, at least one control integrated circuit being positioned in said at least one recess.

[0023] According to one embodiment, the mechanical support includes a triangular-based prism, for example is a triangular-based prism.

[0024] According to one embodiment, the at least one other side face comprises a second side face and a third side face, and the at least one control integrated circuit comprises a first control integrated circuit positioned above the second side face and a second control integrated circuit positioned above the third side face.

[0025] According to one embodiment, the mechanical support is a prism whose base comprises a first part of triangular cross-section including the first lateral face and a second part of rectangular cross-section, for example the second part extending to the right of the first lateral face, each of the first and second parts extending in the longitudinal direction.

[0026] According to one embodiment: - at least one other lateral face comprises a second lateral face connected to the first lateral face, a third lateral face connected to the first lateral face opposite the second lateral face, a fourth lateral face connected to the second lateral face, and a fifth lateral face connected to the third lateral face; and - at least one control integrated circuit comprises a first control integrated circuit positioned above the second side face, a second control integrated circuit positioned above the third side face, a third control integrated circuit positioned above the fourth side face, and a fourth control integrated circuit positioned above the fifth side face

[0027] In one embodiment, the mechanical support comprises, or is made up of: - a thermally conductive material, for example a glass fiber reinforced epoxy resin, aluminum oxide, alumina, aluminum, or stainless steel; and / or - a sound-dampening material, for example an epoxy resin, a silicone, or an epoxy resin or silicone matrix.

[0028] In one embodiment, the mechanical support comprises: - a first portion made of a first material, said first portion including the first lateral face and being under the transducer array; and a second portion in a second material, said second portion including at least partially at least one other lateral face; each of the first and second portions extending in the longitudinal direction; for example the first material is an acoustic attenuation material and the second material is a thermally conductive material.

[0029] According to one embodiment, the ultrasonic probe further comprises electronic components mounted above the first lateral face of the mechanical support and / or above all or part of at least one other lateral face of the mechanical support, for example the electronic components are positioned on either side of the transducer array and / or on either side of at least one control integrated circuit.

[0030] According to one embodiment, the ultrasonic probe further comprises a sheath made of an acoustically transparent material, the sheath being all around the mechanical support, the ultrasonic transducer array, at least one control integrated circuit, and for example electronic components mounted above said mechanical support.

[0031] According to one embodiment, the ultrasonic probe further comprises a support frame, the frame being formed so as to receive and retain the mechanical support and being open at the transducer array.

[0032] According to one embodiment, the support frame: - forms a mechanical interface between the mechanical support and a mechanical linking element; - comprises, or is made of, a thermally conductive material.

[0033] According to one embodiment, the ultrasound probe is integrated into a catheter, for example a catheter for intracardiac echocardiography.

[0034] According to one embodiment, the first lateral face is substantially flat and the transducer array is substantially flat. Brief description of the drawings

[0035] These features and advantages, as well as others, will be described in detail in the following non-limiting description of particular embodiments in relation to the accompanying figures, among which:

[0036] Figure IA is a three-dimensional longitudinal view representing an example of an ultrasonic probe;

[0037] Figure IB is a partial longitudinal cross-sectional view of the ultrasonic probe in Figure IA;

[0038] Figure 2A is a three-dimensional longitudinal view representing an ultrasonic probe according to one embodiment;

[0039] Figure 2B is another three-dimensional longitudinal view of the ultrasonic probe in Figure 2A;

[0040] Figure 2C is a cross-sectional view of the ultrasonic probe in Figure 2A;

[0041] Figure 2D is another cross-sectional view of the ultrasonic probe in Figure 2A;

[0042] Figure 3A is a cross-sectional view representing an ultrasonic probe according to one embodiment; and

[0043] Figure 3B is another cross-sectional view of the ultrasonic probe according to the variant of Figure 3A;

[0044] Figure 4A is a cross-sectional view representing an ultrasonic probe according to one embodiment; and

[0045] Figure 4B is another cross-sectional view of the ultrasonic probe according to the variant of Figure 4A;

[0046] Figure 5A is a top view showing the interconnect substrate of an ultrasonic probe before being bent and mounted on the mechanical support;

[0047] Figure 5B is a three-dimensional view of the interconnecting substrate of Figure 5A;

[0048] Figure 6A is a three-dimensional longitudinal view representing an ultrasonic probe according to another embodiment;

[0049] Figure 6B is a three-dimensional longitudinal view representing the mechanical support of the ultrasonic probe in Figure 6A;

[0050] Figure 6C is a cross-sectional view of the ultrasonic probe in Figure 6A;

[0051] Figure 7A is a three-dimensional longitudinal view representing an ultrasonic probe according to another embodiment;

[0052] Figure 7B is a cross-sectional view of the ultrasonic probe in Figure 7A;

[0053] Figure 7C is another cross-sectional view of the ultrasonic probe in Figure 7A;

[0054] Figure 8A is a three-dimensional longitudinal view representing an ultrasonic probe according to another embodiment; and

[0055] Figure 8B is a side view of the ultrasonic probe in Figure 8A. Description of the implementation methods

[0056] The same elements have been designated by the same reference numerals in the different figures. In particular, structural and / or functional elements common to the different embodiments may have the same reference numerals and may have identical structural, dimensional and material properties.

[0057] For clarity, only the steps and elements necessary for understanding the described embodiments have been shown and detailed. In particular, the ultrasonic transducers of the described ultrasonic probes have not been detailed, as the described embodiments are compatible with all or most known ultrasonic transducer designs. Furthermore, the control circuits of the described ultrasonic probes have not been detailed, as the described embodiments are compatible with all or most common control circuits for ultrasonic transducers.

[0058] Unless otherwise specified, when referring to two connected elements, this means directly connected without any intermediate elements other than conductors, and when referring to two coupled elements, this means that these two elements can be connected or linked through one or more other elements.

[0059] Unless otherwise specified, when referring to two elements mounted, or positioned, one on top of the other, this does not necessarily mean that these two elements are mounted directly on top of each other; one or more other elements may be positioned between these two elements.

[0060] In the description that follows, when referring to absolute position qualifiers, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative position qualifiers, such as the terms "above", "below", "superior", "inferior", etc., or to orientation qualifiers, such as the terms "horizontal", "vertical", etc., unless otherwise specified, reference is made to the orientation of the figures or to an ultrasonic probe in a normal operating position.

[0061] Unless otherwise specified, the expressions "approximately", "roughly", "about", and "on the order of" mean within 10% or 10°, preferably within 5% or 5°.

[0062] In the following description, when referring to a longitudinal direction, we are referring to a direction parallel to the axis of the ultrasonic probe. This can also be called an axial direction. The longitudinal direction corresponds to the Z direction shown in the figures. A lateral face is a face extending in a direction parallel to the longitudinal direction. A transverse direction is a direction in a plane transverse to the longitudinal direction. The figures illustrate two transverse directions, X and Y. A section is a shape defined in a plane transverse to the longitudinal direction.

[0063] In this description, two distinct lateral faces mean two lateral faces that are separated from each other in a transverse direction, that is, perpendicular to the longitudinal direction. Thus, two portions of the same lateral face separated in the longitudinal direction do not constitute two distinct lateral faces.

[0064] In the following description, when referring to a transducer, unless otherwise specified, it refers to an ultrasonic transducer, and when referring to a probe, unless otherwise specified, it refers to an ultrasonic probe. Furthermore, when referring to a control integrated circuit, or control circuit, the term "control" should be understood in a general sense, encompassing both the sending of signals, particularly for controlling electronic components, and the receiving and processing of signals. The term "control integrated circuit" may also be used.

[0065] In the following description, when referring to a catheter, it is understood, broadly speaking, as a thin, usually flexible, hollow or solid rod-shaped device intended for insertion into a region of a human or animal body (e.g., a cavity, a lumen, a duct, etc.), generally for the purpose of injecting fluid and / or draining its contents. An ultrasound catheter is defined as a catheter equipped with an ultrasound probe, generally intended for imaging a region of a human or animal body.

[0066] In the following description, a distal end refers to the end through which an ultrasound probe, or catheter, is introduced into the medium to be analyzed, and a proximal end refers to the end opposite the distal end. The proximal end typically corresponds to the electrical connection, or wiring, end of the ultrasound probe, or catheter.

[0067] Figure 2A is a three-dimensional longitudinal view of an ultrasonic probe according to one embodiment. Figure 2B is another longitudinal view. Figure 2A shows a three-dimensional view of the ultrasonic probe. Figure 2C is a cross-sectional view of the ultrasonic probe shown in Figure 2A. Figure 2D is another cross-sectional view of the ultrasonic probe shown in Figure 2A. The cross-sectional view in Figure 2C is taken along the section plane AA identified in Figure 2A. The cross-sectional view in Figure 2D is taken along the section plane BB identified in Figure 2B.

[0068] The 200 ultrasound probe can be integrated into a catheter (not shown), forming an ultrasound catheter, for example an ICE catheter. The 200 ultrasound probe can be positioned at a distal end of the ultrasound catheter.

[0069] The ultrasound probe 200 extends along a longitudinal direction Z and around an axis 201, although this axis is not necessarily an axis of symmetry. To allow insertion into a space with a small cross-section or diameter, the outer diameter DI of the ultrasound probe 200 can be less than 15 French (Fr), i.e., less than 5 millimeters (mm), or even less than 9 French, i.e., less than 3 mm. This can correspond to the outer diameter of an ultrasound catheter into which the ultrasound probe 200 is integrated.

[0070] The 200 ultrasonic probe has a distal end 200A and a proximal end 200B.

[0071] The ultrasonic probe 200 includes a mechanical support 210, which can be referred to as a stiffener. The mechanical support 210 provides mechanical support and secures / mounts ultrasonic transducers, ensuring their flatness and correct positioning. The mechanical support 210 can also provide rigidity to the ultrasonic probe 200. The mechanical support 210 is preferably free of electrical connection functions. It can be manufactured using any technique for manufacturing a mechanical part with a thickness of millimeters, for example by mechanical forming, injection, 3D printing, or even molding, the manufacturing technique being able to vary depending on the material.

[0072] To ensure good mechanical strength and / or rigidity, the 210 mechanical support is preferably solid, i.e. not entirely hollow.

[0073] The mechanical support 210 extends along the longitudinal direction Z of the ultrasonic probe 200 and has a length L1 greater than the length L2 of a transducer array 220, described later, and greater than the length L3 of the control integrated circuits 230, described later. To ensure good mounting flatness for the transducer array 220 and the control integrated circuits 230, the mechanical support 210 preferably has a width 11 greater than the width 12 of the transducer array 220 and the width 13 of the control integrated circuits 230.

[0074] The length L1 of the mechanical support 210 can advantageously be maximized, so as to be able to position the maximum number of elements on it, preferably in an automated manner.

[0075] As an example, the length L1 is between 15 and 40 mm, for example equal to about 20 mm, and the width 11 is between 1.5 and 5 mm, for example equal to about 2.5 mm.

[0076] The mechanical support 210 may include, or be made of, a sound-dampening material, which may be known by the English term "backing". The sound-dampening material may have the advantage of attenuating the ultrasonic waves emitted by the transducers, particularly on the rear face of the transducers.

[0077] The mechanical support 210 may include, or be made of, a thermally conductive material, forming in particular a heat sink.

[0078] The mechanical support 210 may include, or consist of: - an epoxy resin; - a glass fiber reinforced epoxy resin, for example an FR4 type material, which can be reinforced with carbon tubes; - a silicone; - an aluminum oxide, or alumina; a thermoplastic material, or a thermosetting material; a machinable material such as aluminum, stainless steel, or a plastic; or - a combination of several of the materials listed above.

[0079] In the example shown in Figures 2A to 2D, the mechanical support 210 is a single unit, that is, a single piece made of one material. This is not a limiting factor, and the mechanical support may consist of several parts made of different materials, performing different functions, assembled together, as in the example described later in connection with Figures 4A and 4B.

[0080] In the example shown in Figures 2A to 2D, the mechanical support 210 has a closed triangular cross-section, the triangle in Figures 2A to 2D being substantially regular. In other words, the mechanical support 210 has a prismatic shape with a triangular base, meaning it has three faces lateral. The width 11 of the mechanical support then corresponds to the length of each side Cl of the triangle.

[0081] As can be seen in Figures 2A to 2D, all or part of the corners of the triangle can be advantageously rounded (upper corners) or even truncated (lower corner). In other words, the lateral edges of the prism can be rounded (upper edges) or even truncated to form a flat surface (lower edge). The rounded upper edges, for example, allow a radius of curvature to be imposed on the interconnecting substrate 240 described later, and the lower edge can be truncated as long as the interconnecting substrate does not wrap around it.

[0082] The example in Figures 2A to 2D is a non-limiting example, and the mechanical support can have a prismatic shape with an irregular triangular base, or a non-triangular base, as described later. All cross-sectional shapes of the mechanical support can be considered insofar as the mechanical support has at least three lateral faces, with a length and width of each lateral face sufficient for the transducer array and control circuits to be mounted on it without overlapping, and that it can fit into a constrained cross-section, such as a millimeter-sized cylindrical duct.

[0083] The ultrasonic probe 200 includes a transducer array 220, or acoustic component, comprising an array of ultrasonic transducers adapted to emit and receive ultrasonic waves.

[0084] All or part of the ultrasonic waves emitted by the transducers of the transducer array 220 may be reflected by particular elements of the medium into which the ultrasonic probe 200 is introduced, for example specific features of a region of a core or surrounding structure are detected by the ultrasonic probe. Reflected ultrasonic waves can be received by the transducers. These reflected ultrasonic waves can be processed by a processing device to produce an image of the medium in which the ultrasonic probe is placed, for example, to visualize specific features. The processing device can be located, in whole or in part, within all or part of the control circuits described later.

[0085] An ultrasonic transducer is a transducer designed to convert an electrical signal into an ultrasonic wave, and conversely, to convert an ultrasonic wave into an electrical signal. Depending on the type of transducer, the electrical signal can be a voltage, a current, or an electrical charge.

[0086] The transducer network can include any type of ultrasonic transducer, or even several types of ultrasonic transducers.

[0087] Ultrasonic transducers can consist of a layer of single-crystal or polycrystalline piezoelectric material, such as PZT (lead zirconia titanate), or a composite structure comprising at least one layer of piezoelectric material, for example, a PZT layer with polymer-filled grooves. The resting thickness of the piezoelectric material layer can be, for example, between 0.1 and 0.3 mm, although this thickness changes when a voltage is applied. The thickness of an ultrasonic transducer, including electrodes and other layers, can be between 0.2 and 1 mm.

[0088] Ultrasonic transducers can be microelectromechanical systems, or MEMS, from the English Micro- Electro-Mechanical System, implementing microelectronic production technologies. A MEMS-type transducer generally consists of a deformable membrane suspended above a cavity. In one embodiment, the deformable membrane is displaced or deformed by capacitive force using an electrode attached to the membrane and a separate electrode separated by the cavity. This type of ultrasonic transducer is known by the acronym CMUT, for Capacitive Micro-machined Ultrasonic Transducer, i.e., a micro-machined ultrasonic capacitive transducer, or membrane capacitive transducer. In another embodiment, the deformable membrane is displaced or deformed by piezoelectric force using a layer of piezoelectric material equipped with two electrodes attached to the membrane.This type of ultrasonic transducer is known by the acronym EMUT, from the English Piezoelectric Micro-machined Ultrasonic Transducer, i.e. a micro-machined piezoelectric ultrasonic transducer, or membrane piezoelectric transducer.

[0089] The transducer network 220 is positioned above a first lateral face 211 of the mechanical support 210.

[0090] The 220 transducer array can include any number of ultrasonic transducers, for example between 50 and 400 transducers aligned along the longitudinal Z direction. The 220 transducer array can be a matrix consisting of several dozen rows and columns, i.e. several hundred or even thousands of transducers, for example a matrix of 12x64 transducers, i.e. 768 transducers.

[0091] The 220 transducer array has a length L2 and a width 12. The length and width L2 and 12 depend on the number of transducers and the array pitch. The size of the network itself depends on the center frequency of the ultrasonic signals. For example, the length L2 is between 10 and 15 mm, for example equal to about 12 mm, and the width 12 is between 1.5 and 4 mm, for example equal to about 2 mm.

[0092] The ultrasonic probe 200 also includes several control integrated circuits 230, or control circuits. Each control integrated circuit 230 can be an application-specific integrated circuit, known by the acronym ASIC (Application Specific Integrated Circuit), or any other integrated circuit suitable for controlling several ultrasonic transducers.

[0093] Each 230 control integrated circuit is configured to control multiple transducers, for example between 100 and 1200 transducers, for example 768 transducers.

[0094] Each control integrated circuit 230 can include several electronic circuits enabling the control integrated circuit to perform different functions, the electronic circuits being able to be grouped into several cells, each associated with one or more transducers of the transducer network 220.

[0095] Each 230 control integrated circuit can be configured to select certain transducers from the 220 transducer array for use in transmitting / receiving ultrasonic waves, to transmit control signals to the selected transducers to generate and transmit ultrasonic waves, and / or to accept or even amplify return signals from the selected transducers when they receive reflected ultrasonic waves, or even to perform operations on the return signals, such as beamforming and scanning. More generally, several types of signals, such as control, power and / or data signals can be exchanged between the transducers of the transducer network 220 and the control integrated circuits 230.

[0096] Each 230 control integrated circuit has a length L3 and a width 13. As an example, the length L3 is between 10 and 30 mm, for example equal to about 15 mm, and the width 13 is between 1 and 4 mm, for example equal to about 2 mm.

[0097] In the example shown, the ultrasonic probe 200 has two control integrated circuits 231, 232, for example two ASICs: a first control integrated circuit 231 is positioned above a second lateral face 212 of the mechanical support 210, and a second control integrated circuit 232 is positioned above a third lateral face 213 of the mechanical support 210.

[0098] The ultrasonic probe 200 also includes an interconnection substrate 240.

[0099] The interconnecting substrate 240 can in particular be configured to provide an electrical connection between the transducers of the transducer array 220 and the control integrated circuits 230, as well as with circuits, connectors, cables and / or components external or internal to the ultrasonic probe 200.

[0100] The interconnection substrate 240 is positioned on the lateral faces of the mechanical support 210.

[0101] In the example shown in Figures 2A to 2D, the interconnecting substrate 240 is located between the mechanical support 210 and the transducer array / control circuits. The transducer array 220 and the control integrated circuits 230 are on the same face 240A (outer face) of the interconnecting substrate 240. This is not exhaustive, and other examples of mounting the transducer array and the circuits are shown. Integrated control on the interconnecting substrate can be considered, as described later in connection with Figures 6A to 6C.

[0102] The interconnecting substrate 240 comprises several portions, each extending in the longitudinal direction Z, and connected to each other.

[0103] In the example illustrated in Figures 2A to 2D, the 240 interconnect substrate comprises: - a first portion 241 positioned between the first lateral face 211 of the mechanical support 210 and the transducer network 220; - a second portion 242 positioned between the second lateral face 212 of the mechanical support 210 and the first integrated control circuit 231; and - a third portion 243 positioned between the third lateral face 213 of the mechanical support 210 and the second control integrated circuit 232.

[0104] The first, second and third portions 241, 242, 243 of the interconnecting substrate 240 are substantially the same length, and are joined together along longitudinal edges.

[0105] The 240 interconnect substrate generally comprises a set of conductive tracks insulated from one another and arranged in, and / or on, an insulating support, or dielectric support. The dielectric support is, for example, in the form of a polymer film, such as polyimide. Several other materials are suitable for a flexible dielectric support, for example, polyester, polyethylene polynaphthalate, or polyetherimide. The interconnect tracks are, for example, metallic tracks, advantageously made of a malleable material, such as gold or copper.

[0106] Some of these conductive tracks can connect connection pads 225 of the transducer array 220 to connection pads 235 of the control circuits 230, for example to carry control, power and / or data signals between the control circuits 230 and the transducers of the transducer array 220. Other conductive tracks can allow the control circuits 230 to be connected to circuits, connectors and / or components external or internal to the ultrasonic probe 200, for example to another interconnection substrate, to a flexible or rigid printed circuit board, for example via cables.

[0107] It is noted that, according to the embodiments, it is not necessary to match the connection pads 225 of the transducer network 220 to the connection pads 235 of the control circuits 230, unlike vertically integrated ultrasonic probes.

[0108] The interconnect substrate 240 can advantageously have a high density of interconnections, for example, equipped with conductive traces approximately 5 µm apart, spaced approximately 5 µm apart, located on 1 to 10 interconnection layers on and / or within the dielectric support. The traces of the different interconnection layers can be connected to each other by vertical connections called "vias," also a few µm in size. This allows, for example, the connection of a very large number of transducers, typically more than 100, to the control integrated circuits 230.

[0109] The interconnecting substrate 240 is preferably flexible enough to be folded over the lateral faces of the mechanical support 210, as described later in connection with Figures 5A and 5B. To limit stresses in the interconnecting substrate 240, the areas Folding methods preferably respect a minimum radius of curvature of a few micrometers.

[0110] The 240 interconnect substrate can be a flexible printed circuit board, or "FPCB".

[0111] At the distal end 200A of the probe 200, the interconnecting substrate 240 has fourth portions 244 that extend from each of the second and third portions 242, 243, each fourth portion 244 being folded back onto one of the control circuits 230 towards the proximal end 200B. These fourth portions 244 can be referred to as "flatbreads". These flatbreads 244 are shown in Figure 2B, but not in Figure 2A, to allow the control circuit 231 and the adjacent components 250 to remain visible. The fourth portions 244 cover the control integrated circuits 230. Thus, the interconnection substrate 240 is found on both the lower and upper faces of each of the control integrated circuits 230. This makes it possible to increase by a factor of about 2 the number of connections between the inputs / outputs of each control circuit to the proximal part of the probe.

[0112] As can be seen in Figure 2C, the first control integrated circuit 231 is on the second portion 242 and under one of the fourth portions 244, and the second control integrated circuit 232 is on the third portion 243 and under one of the fourth portions 244.

[0113] The interconnecting substrate 240 can be extended at the proximal end 200B of the probe 200 by connecting tabs, blades, or strips 245. The connecting strips 245 extend from each of the first, second, and third portions 241, 242, 243, and are separated from each other by slots 246. The connecting strips 245 can be used to couple the interconnecting substrate 240 to circuits, cables, connectors and / or components external or internal to the ultrasonic probe 200.

[0114] The ultrasonic probe 200 may include electronic components 250, for example passive electronic components, which may be selected from one or more of the following: a capacitor, a resistor, a thermistor, an inductor. The electronic components 250 may be arranged axially at a distance from the transducer array 220 and the control integrated circuits 230.

[0115] The electronic components 250 can be mounted on one or more side faces of the mechanical support 210, preferably in regions of these side faces not covered by the transducer network 220 and the control integrated circuits 230.

[0116] In the example shown in figures 2A to 2D: - a first region 251 of electronic components 250 is positioned on the first portion 241 of the interconnecting substrate 240 (above the first lateral face 211 of the mechanical support 210) and between the transducer network 220 and the connecting strips 245 (at the proximal end 200B of the probe 200); - a second region 252 of electronic components 250 is positioned on the first portion 241 of the interconnect substrate 240 (above the first lateral face 211 of the mechanical support 210) and between the transducer network 220 and the distal end 200A of the probe 200; - a third region 253 of electronic components 250 is positioned on the second portion 242 of the interconnect substrate 240 (above the second lateral face 212 of the mechanical support 210) and between the first control circuit 231 and the connecting strips 245 (at the end proximal 200B of probe 200); and - a fourth region 254 of electronic components 250 is positioned on the second portion 242 of the interconnecting substrate 240 (above the second lateral face 212 of the mechanical support 210) and between the first control circuit 231 and the distal end 200A of the probe 200.

[0117] As can be seen in Figures 5A and 5B described later, symmetrically to the third and fourth regions, fifth and sixth regions 255, 256 of electronic components 250 can be had on the third portion 243 of the interconnecting substrate 240 (above the third lateral face 213 of the mechanical support 210), on either side of the second control integrated circuit 232. Other configurations can also be considered, without all or part of the first, second, third, fourth, fifth and sixth regions of electronic components 250.

[0118] Thus, we see that the shape of the mechanical support 210, as well as its dimensions (length and width), allow for the positioning of a large number of electronic components, in addition to the transducer network 220 and the control integrated circuits 230.

[0119] All the elements mentioned above can be integrated inside a sheath 202 made of an acoustically transparent material. Since the sheath 202 is intended to be in contact with the tissues of the anatomical region into which the catheter is inserted, it is preferably biocompatible.

[0120] In the example shown, the duct 202 is cylindrical with a circular cross-section, and it comprises: - a closed and rounded distal end 202A, for example globe-shaped; a proximal end 202B adapted for the passage of electrical connections; and an elongated cylindrical portion between the distal end 202A and proximal end 202B, this cylindrical portion being opposite the transducer array 220, the volume between the transducer array 220 and the sheath 202 preferably being made of a material transparent to ultrasonic waves, forming for example an acoustic lens.

[0121] The proximal end 202B is seen open in figure 2B but it is usually closed with the catheter sheath to form a sealed assembly.

[0122] The sheath 202 can take other forms, such as for example, a cylindrical shape with a flat opposite the transducer array 220. The sheath 202 can follow the outer casing of the components located inside this sheath.

[0123] The outer diameter of the sheath corresponds to the outer diameter DI of the ultrasonic probe 200, while the inner diameter of the sheath defines an inner diameter dl of the ultrasonic probe.

[0124] For example, the outer diameter Dl is approximately 3.3 mm. For example, the inner diameter dl is approximately 2.7 mm.

[0125] Figure 3A is a cross-sectional view of an ultrasonic probe 300 according to one embodiment. Figure 3B is another cross-sectional view of the ultrasonic probe according to the embodiment shown in Figure 3A. The cross-sectional view in Figure 3A is taken along the section plane AA identified in Figure 2A. The cross-sectional view in Figure 3B is taken along the section plane BB identified in Figure 2B.

[0126] The 300 ultrasonic probe in Figures 3A and 3B has many features in common with the 200 ultrasonic probe in Figures 2A to 2D, and only the differences between the two Ultrasonic probes 200 and 300 are detailed in the following description.

[0127] The ultrasonic probe 300 of figures 3A and 3B differs from the ultrasonic probe 200 of figures 2A to 2D mainly in that the mechanical support 310 has a non-regular triangular cross-section.

[0128] Thus, the cross-section of the mechanical support can be adapted. In the case of Figures 3A and 3B, the length of the sides and the angles of the triangle can vary. This allows, for example, the mechanical support to be adapted to the dimensions of the different control integrated circuits and / or the transducer network, or even to the number of electronic components to be mounted on the different lateral faces of the mechanical support. The control integrated circuits do not necessarily all have the same dimensions.

[0129] Figure 4A is a cross-sectional view of an ultrasonic probe 400 according to one embodiment. Figure 4B is another cross-sectional view of the ultrasonic probe according to the embodiment shown in Figure 4A. The cross-sectional view in Figure 4A is taken along the section plane AA identified in Figure 2A. The cross-sectional view in Figure 4B is taken along the section plane BB identified in Figure 2B.

[0130] The 400 ultrasonic probe in Figures 4A and 4B has many elements in common with the 200 ultrasonic probe in Figures 2A to 2D and only the differences between the two 400 and 200 ultrasonic probes are detailed in the description that follows.

[0131] The ultrasonic probe 400 in Figures 4A and 4B differs from the ultrasonic probe 200 in Figures 2A to 2D primarily in that the mechanical support 410 comprises first and second portions 414, 415 made of two materials different, each of the first and second portions extending in the longitudinal direction Z and being joined to each other along this longitudinal direction, as well as in the transverse direction X in the example shown.

[0132] The first portion 414 is positioned below the transducer array 220. The first portion 414 includes the first side face 411. Preferably, the first portion 414 comprises, or is made of, a sound-attenuating material (first material), which may be known by the English term "backing." The sound-attenuating material may have the advantage of attenuating the ultrasonic waves emitted by the transducers, particularly on the rear face of the transducers, that is, the faces oriented towards the mechanical support.

[0133] The first portion 414 may comprise, or be made of, an epoxy resin, silicone, an epoxy resin or silicone matrix, which may be filled, or any other material suitable for attenuating acoustic waves.

[0134] The second portion 415 is positioned beneath the first portion 414 against the control integrated circuits 231, 232. The second portion 415 includes all or part of each of the second and third lateral faces 412, 413; in the example shown, between approximately two-thirds and three-quarters of each of the second and third lateral faces 412, 413, with the remaining third or quarter forming part of the first portion 414. Preferably, the second portion 415 comprises, or is made of, a thermally conductive material (second material), thus forming a heat sink. The second portion 415 may also reinforce the mechanical rigidity of the mechanical support 410.

[0135] The second portion 415 may comprise, or be composed of, a glass fiber reinforced epoxy resin, for example a material of type FR4, which can be reinforced with carbon tubes, aluminum oxide, alumina, aluminum, stainless steel, or any other material suitable for dissipating heat and / or mechanically reinforcing the mechanical support 410.

[0136] Thus, the 410 mechanical support allows several different functions to be combined, improving the operation of the ultrasonic probe.

[0137] Figure 5A is a top view showing the interconnect substrate of an ultrasonic probe before it is mounted and bent onto the mechanical support. Figure 5B is a three-dimensional view of the interconnect substrate shown in Figure 5A.

[0138] Figures 5A and 5B illustrate a step in a manufacturing process for an ultrasonic probe according to one embodiment. For example, one manufacturing process begins with a flat interconnect substrate 540, onto which the transducer array 220, the control integrated circuits 231, 232, and the electronic components 250 distributed across the various regions 251, 252, 253, 254, 255, 256 described later are assembled. The entire assembly of components can, for example, be assembled by a component placement process, known as "pick and place," onto the interconnect substrate 540. The component mounting sites on the substrate are first coated with solder paste, and the assembly is then placed in a reflow oven to solder the components onto the interconnect substrate.The flat interconnect substrate 540 comprises the first, second, and third portions 241, 242, 243 described above, as well as the flats 244 and the connecting strips 245 also described above. The flats 244 are not yet folded over the control integrated circuits 231, 232.

[0139] The flat interconnect substrate 540 includes bend lines 541 between the first and second portions 241, 242 and between the first and third portions 241, 243.

[0140] The flat interconnect substrate 540 can then be assembled, for example glued, to the mechanical support, for example one of the mechanical supports 210, 310, 410 of Figures 2A to 2D, 3A, 3B, 4A, 4B, and be folded around the fold lines 541 to come against the lateral faces of the mechanical support. The flats 244 can then be folded over the control integrated circuits 231, 232

[0141] A person in the trade will be able to adapt the manufacturing process for other mechanical supports, such as those described in the following description.

[0142] Figure 6A is a three-dimensional longitudinal view of an ultrasonic probe according to another embodiment. Figure 6B is a three-dimensional longitudinal view of the mechanical support for the ultrasonic probe of Figure 6A. Figure 6C is a cross-sectional view of the ultrasonic probe of Figure 6A. The cross-sectional view of Figure 6C is taken along the section plane AA identified in Figure 6B.

[0143] The 600 ultrasonic probe in Figures 6A to 6C has many elements in common with the 200 ultrasonic probe in Figures 2A to 2D and only the differences between the two 600 and 200 ultrasonic probes are detailed in the description that follows.

[0144] The ultrasonic probe 600 of Figures 6A to 6C differs from the ultrasonic probe 200 of Figures 2A to 2D primarily in that the second and third lateral faces of the mechanical support 610 each have a recess 616. The first and second control integrated circuits 231, 232 are positioned in these recesses 616.

[0145] Furthermore, the control integrated circuits 231 and 232 are assembled on the inner face 640B (second face) of the interconnect substrate 640, while the transducer array 220 is assembled on the outer face 640A (first face) of the interconnect substrate 640. This contrasts with other embodiments in which the control integrated circuits 231 and 232 and the transducer array 220 are assembled on the same face, in the examples on the outer face 240A, of the interconnect substrate 240. It should be noted in Figure 6A that the interconnect substrate 640 is not shown in its entirety. In particular, the folded portion (flattened) 244 over the control circuit 231 and the adjacent components 250 has not been fully shown to allow the latter to remain visible. These folded portions 244 can be seen in Figure 60.

[0146] This embodiment makes it possible to reduce the size of the control integrated circuits in the ultrasonic probe, also making it possible to reduce the diameter of the ultrasonic probe, while maintaining overall rigidity.

[0147] Although sheath 202 is not shown in figures 6A and 60, it is generally present.

[0148] Figure 7A is a three-dimensional longitudinal view of an ultrasonic probe according to another embodiment. Figure 7B is a cross-sectional view of the ultrasonic probe shown in Figure 7A. Figure 70 is another cross-sectional view of the ultrasonic probe shown in Figure 7A. The cross-sectional view in Figure 7B is taken along the section plane AA identified in Figure 7A. The cross-sectional view in Figure 70 is taken along the section plane BB identified in Figure 7.

[0149] Although duct 202 is not shown in Figure 7A, it is generally present, as shown in the cross-sectional view in Figure 7C.

[0150] The 700 ultrasonic probe in Figures 7A to 7C has many elements in common with the 200 ultrasonic probe in Figures 2A to 2D, and only the differences between the two 700 and 200 ultrasonic probes are detailed in the following description.

[0151] The ultrasonic probe 700 of Figures 7A to 7C differs from the ultrasonic probe 200 of Figures 2A to 2D primarily in that the mechanical support 710 has a flat Y-shaped or T-shaped cross-section at the top. In other words, the mechanical support 710 is in the form of a prism comprising an upper part 710A (first part) with a triangular cross-section having a horizontal side 711 at the top, and a lower part 710B (second part) with a rectangular cross-section, for example oriented vertically, facing the horizontal side of the upper part 710A. Thus, the number of lateral faces of the mechanical support 710 is greater than 3.

[0152] The transducer array 220 is positioned on a first lateral face 711 of the mechanical support 710, corresponding to the horizontal side of the upper part 710A. The lower part 710B, rectangular in cross-section, extends to, or faces, the first lateral face 711.

[0153] Since there are more than two lateral faces remaining, once the first lateral face 711 is occupied by the transducer array 220, the ultrasonic probe 700 can include more than two control integrated circuits 730 mounted on the mechanical support 710.

[0154] In the example shown in Figures 7A to 7C, the 700 ultrasonic probe comprises four integrated circuits of command 730, for example four ASICs: - a first integrated control circuit 731 is mounted on a second side face 712 of the mechanical support 710, connected to the first side face 711; - a second integrated control circuit 732 is mounted on a third side face 713 of the mechanical support 710, connected to the first side face 711 (opposite the second side face 712); - a third integrated control circuit 733 is mounted on a fourth side face 714 of the mechanical support 710, connected to the second side face 712; and - a fourth control integrated circuit 734 is mounted on a fifth side face 715 of the mechanical support 710, connected to the third side face 713.

[0155] The first, second and third lateral faces 711, 712, 713 correspond to the upper triangular part 710A of the mechanical support 710. The fourth and fifth lateral faces 714, 715 correspond to the lower rectangular part 710B, and face each other.

[0156] The interconnecting substrate 740 rests on the mechanical support 710; for example, an inner face 740B (second face) of the interconnecting substrate 740 is in contact with the mechanical support 710, with the transducer array 220 and the control integrated circuits 730 mounted on an outer face 740A (first face) of the interconnecting substrate 740

[0157] In the example shown in Figures 7A to 7C, the 740 interconnect substrate comprises: - a first portion 741 positioned between the first lateral face 711 and the transducer network 220; - a second portion 742, connected to the first portion 741, positioned between the second side face 712 and the first control integrated circuit 731; - a third portion 743, connected to the first portion 741, positioned between the third lateral face 713 and the second control integrated circuit 732; - a fourth portion 744, connected to the second portion 742, positioned between the fourth lateral face 714 and the third control integrated circuit 733; and - a fifth portion 745, connected to the third portion 743, positioned between the fifth lateral face 715 and the fourth control integrated circuit 734.

[0158] In the example shown in Figures 7A to 7C, the ultrasonic probe 700 further includes several electronic components 250, such as passive electronic components, similar to the electronic components of the previous ultrasonic probes. The electronic components 250 are mounted on each of the first through fifth lateral faces of the mechanical support 710, on either side of the transducer array 220 and / or each of the control integrated circuits 730. Other configurations and positions of electronic components may be considered.

[0159] The sixth lateral face 716 of the mechanical support 710, or lower face, could also serve as a support for another control integrated circuit, and / or other electronic components.

[0160] The control integrated circuits 731, 732, 733, and 734 may be of similar or different sizes. The control integrated circuits 730 in Figures 7A to 7C may be of similar or different sizes, for example, smaller sizes, than the control integrated circuits 230 in the preceding figures.

[0161] The example in Figures 7A to 7C is a non-limiting example of another prismatic shape with a non-fully triangular cross-section for mechanical support. Other Various shapes of the mechanical support can be considered, provided that the support has at least three lateral faces of sufficient dimensions (length and width) to accommodate the transducer array and control circuits, as well as potentially electronic components. Other shapes are also suitable for the mechanical support, with the components mounted on its lateral faces, to fit inside a duct. Alternatively, other shapes of the mechanical support can be chosen to maximize the surface area available for mounting the components while maintaining good overall mechanical rigidity.

[0162] Figure 8A is a three-dimensional longitudinal view of an 800 ultrasonic probe according to another embodiment. Figure 8B is a side view of the ultrasonic probe of Figure 8A.

[0163] The 800 ultrasonic probe in Figures 8A and 8B has many elements in common with the 200 ultrasonic probe in Figures 2A to 2D, and only the differences between the two 800 and 200 ultrasonic probes are detailed in the description that follows.

[0164] The ultrasonic probe 800 of figures 8A and 8B differs from the ultrasonic probe 200 of figures 2A to 2D mainly in that it also includes a chassis 810, or mount, forming a mechanical retaining piece for the mechanical support 210.

[0165] The chassis 810 is designed to, that is to say, it has a shape and dimensions adapted to, receive and hold the mechanical support 210 while leaving at least the transducer array 220 exposed. Indeed, the chassis 810 must not form an acoustic screen in front of the transducers.

[0166] In addition, the chassis 810 can form an interface between the mechanical support 210 and a mechanical linking element 820 at the proximal end 810B of the probe 800. The linking element 820 can be part of the ultrasound probe 800, and can in particular serve as a mechanical link with an ultrasound catheter.

[0167] Preferably, chassis 810 is not electrically conductive.

[0168] The chassis 810 may include, or be made of, a thermally conductive material, forming in particular a heat sink. For example, the chassis 810 provides thermal transfer to the mechanical support 210. The chassis 810 may include, or be made of, a glass fiber reinforced epoxy resin, for example a material of type FR4, aluminum oxide, alumina, aluminum, stainless steel, or any other material suitable for dissipating heat while maintaining its mechanical support function.

[0169] Although the sheath 202 has not been shown in Figures 8A and 8B, it is generally present, and it can rest on, and around, the second end 814 described below.

[0170] In the example of figures 8A and 8B, the chassis 810 comprises a main body 811, which can form a shell, which has a substantially hemispherical shape whose outer diameter can be adjusted relative to the outer diameter of the sheath 202.

[0171] The main body 811 extends by a first end 812 to the distal end 800A of the probe 800 and by a second end 814 to the proximal end 800B of the probe 800.

[0172] The interior of the first end 812 has a first triangular counter-form 813 adapted to hold in place the mechanical support 210, and for example also to form a point of contact with the mechanical support 210 in order to promote heat exchange.

[0173] The interior of the second end 814 has a second triangular counter-form 815 adapted to hold the mechanical support 210 in place, and for example also to form a point of contact with the mechanical support 210 in order to promote heat exchange.

[0174] The first and second ends 812, 814, and in particular the first and second counter forms 813, 815, can be assembled to the mechanical support 210 by gluing.

[0175] The main body 811 may include a recess 816 in its lower part, for example opposite the control integrated circuits 230, in order to lighten the structure without impacting the mechanical strength of the mechanical support 210. Alternatively, the main body may not include a recess in its lower part.

[0176] The 810 chassis can be manufactured using any manufacturing technique for a mechanical part of millimeter thickness, for example by mechanical forming, injection, molding, 3D printing, the manufacturing technique may vary depending on the material and / or shape of the chassis.

[0177] In the embodiments described above, each lateral face of the mechanical support is substantially flat, and the transducer array is substantially flat. Similarly, each control integrated circuit is substantially flat. These embodiments are advantageous because they allow for simple fabrication of the ultrasonic probe; in particular, the interconnect substrate can be easily shaped to match the form of the mechanical support. However, as an alternative, a mechanical support with at least a partially curved cross-section, with at least one lateral face, can be considered. The curve on which the transducer array and / or at least one control integrated circuit would be positioned. Thus, the transducer array could be substantially curved. Similarly, at least one control integrated circuit could be substantially curved.

[0178] The embodiments allow for several different mounting faces to accommodate various elements such as a transducer array, control integrated circuits, and electronic components. These different mounting faces are provided by the lateral faces of the mechanical support. This enables what is called "horizontal" integration (referring to integration on the interconnect substrate before folding), meaning that the elements are not mounted one on top of the other, unlike vertical integration, as described previously, with its associated drawbacks, also described previously.Indeed, the lateral faces of the mechanical support are sufficiently long and wide to accommodate either the transducer array or one of the control integrated circuits, such as ASICs, or even electronic components like passive electronics. The interconnect substrate positioned on the mechanical support allows the transducers of the transducer array to be connected to the control integrated circuits. In other words, these embodiments increase the available surface area within the ultrasonic probe to accommodate more components and interconnect them without the need for vertical integration, while still ensuring the overall stability of the assembly. For example, the mounting surface is not limited to the internal diameter and / or length of the ultrasonic probe. For instance, it is possible to have 1.5 to 2 times more mounting surface area than with a rectangular support. for the same internal diameter. Moreover, the embodiments make it possible not to increase, or even to reduce, the length of the ultrasonic probe, since it is not necessary to add the length L2 of the transducer network and the length L3 of at least one control circuit.

[0179] Furthermore, the triangular cross-section of the mechanical support, or the Y- or T-shaped cross-section, is designed to fit into a small-diameter cylindrical sheath, which corresponds approximately to the internal diameter dl of the 200 ultrasonic probe, typically less than 5 mm, or even less than 3 mm. This contrasts with an elongated parallelepiped support, which would need to be quite thick if it were to provide more than two usable mounting faces. A thin elongated parallelepiped support could not provide more than two lateral faces large enough to accommodate all the components, and moreover, excessive thickness would result in a loss of mechanical strength. In contrast, the mechanical support in these embodiments provides good mechanical strength, secure mechanical retention, and a flat surface for mounting and positioning the components.The mechanical support can provide the ultrasonic probe with up to six times greater rigidity than a rectangular-section mechanical support. Depending on the embodiment, the mechanical support can also provide good resistance to the stresses involved in integrating the ultrasonic probe components.

[0180] Thus, the embodiments allow for the insertion and interconnection of numerous elements in a restricted space, while ensuring high mechanical strength of an ultrasonic probe, and without the disadvantages associated with vertical integration.

[0181] The ultrasound probe, according to the embodiments, can find applications in the field of intracardiac echocardiography (ICE), or even in the field of intravascular ultrasound imaging (IVUS), or even in the field of high-intensity ultrasound therapy (HIFU), the ultrasound probe being integrated into a catheter.

[0182] Various embodiments and variations have been described. A person skilled in the art will understand that some features of these various embodiments and variations could be combined, and other variations will become apparent to a person skilled in the art.

[0183] Finally, the practical implementation of the described methods and variants is within the reach of the person in the trade, based on the functional indications given above.

Claims

DEMANDS 1. Ultrasonic probe (200; 300; 400; 600; 700; 800) extending along a longitudinal direction (Z), the ultrasonic probe comprising: a mechanical support (210; 310; 410; 610; 710) extending in the longitudinal direction and comprising at least three lateral faces; - an array of ultrasonic transducers (220) positioned above a first lateral face (211; 411; 611; 711) among the lateral faces of the mechanical support; - at least one control integrated circuit (230; 730) positioned above at least one other side face (212, 213; 412, 413; 612, 613; 712, 713, 714, 715) among the lateral faces of the mechanical support, at least one other lateral face being distinct from the first lateral face.

2. Ultrasonic probe (200; 300; 400; 600; 700; 800) according to claim 1, wherein the mechanical support (210; 310; 410; 610; 710) is devoid of electrical connections.

3. Ultrasonic probe (200; 300; 400; 600; 700; 800) according to claim 1 or 2, further comprising an interconnection substrate (240; 640; 740) positioned on the mechanical support (210; 310; 410; 610; 710), the ultrasonic transducer array (220) and at least one control integrated circuit (230; 730) being electrically connected to said interconnection substrate.

4. Ultrasonic probe (200; 300; 400; 700; 800) according to claim 3, wherein the ultrasonic transducer array (220) and at least one control integrated circuit (230; 730) are positioned on a first face (240A; 740A) of the interconnecting substrate (240; 740), a second face (240B; 740B) of the interconnect substrate opposite to the first face being positioned on the mechanical support (210; 310; 410; 710).

5. Ultrasonic probe (600) according to claim 3, wherein the ultrasonic transducer array (220) is positioned on a first face (640A) of the interconnecting substrate (640) and at least one control integrated circuit (230) is positioned on a second face (640B) of the interconnecting substrate (640) opposite the first face, said second face also being positioned on the mechanical support (610).

6. Ultrasonic probe (600) according to any one of claims 1 to 5, wherein at least one other side face (612; 613) each has a recess (616), at least one control integrated circuit (230) being positioned in said at least one recess.

7. Ultrasonic probe (200; 300; 400; 600; 700; 800) according to any one of claims 1 to 6, wherein the mechanical support (210; 310; 410; 610; 710) comprises a triangular-based prism, for example is a triangular-based prism.

8. Ultrasonic probe (200; 300; 400; 600; 700; 800) according to any one of claims 1 to 7, wherein at least one other side face comprises a second side face (212; 412; 612; 712) and a third side face (213; 413; 613; 713), and at least one control integrated circuit (230) comprises a first control integrated circuit (231) positioned above the second side face and a second control integrated circuit (232) positioned above the third side face.

9. Ultrasonic probe (700) according to any one of claims 1 to 8, wherein the mechanical support (710) is a prism whose base comprises a first part (710A) of triangular section including the first lateral face (711) and a second part (710B) of rectangular section, for example the second part extending to the right of the first lateral face (711), each of the first and second parts extending in the longitudinal direction.

10. Ultrasonic probe (700) according to claim 9, wherein: - at least one other lateral face comprises a second lateral face (712) connected to the first lateral face (711), a third lateral face (713) connected to the first lateral face opposite the second lateral face, a fourth lateral face (714) connected to the second lateral face, and a fifth lateral face (715) connected to the third lateral face; and - at least one control integrated circuit (730) comprises a first control integrated circuit (731) positioned above the second side face (712), a second control integrated circuit (732) positioned above the third side face (713), a third control integrated circuit (733) positioned above the fourth side face (714) and a fourth control integrated circuit (734) positioned above the fifth side face (715).

11. Ultrasonic probe (200; 300; 400; 600; 700; 800) according to any one of claims 1 to 10, wherein the mechanical support comprises, or is made of: - a thermally conductive material, for example a glass fiber reinforced epoxy resin, an oxide of aluminium, alumina, aluminium, or stainless steel; and / or - a sound-dampening material, for example an epoxy resin, a silicone, or an epoxy resin or silicone matrix.

12. Ultrasonic probe (400) according to any one of claims 1 to 11, wherein the mechanical support (410) comprises: - a first portion (414) made of a first material, said first portion including the first lateral face (411) and being under the transducer array (211); and - a second portion (415) of a second material, said second portion including at least partially at least one other lateral face; each of the first and second portions extending in the longitudinal direction; for example the first material is an acoustic attenuation material and the second material is a thermally conductive material.

13. Ultrasonic probe (200; 300; 400; 600; 700; 800) according to any one of claims 1 to 12, further comprising electronic components (250) mounted above the first lateral face (211; 411; 611; 711) of the mechanical support (210; 310; 410; 610; 710) and / or above all or part of at least one other lateral face (212, 213; 412, 413; 612, 613; 712, 713, 714, 715) of the mechanical support, for example the electronic components (250) are positioned on either side of the transducer array (220) and / or on either side of at least one control integrated circuit (230; 14. Ultrasonic probe (200; 300; 400; 600; 700; 800) according to any one of claims 1 to 13, further comprising a sheath (202) of an acoustically transparent material, the sheath being all around the mechanical support, the array of ultrasonic transducers (220), at least one integrated control circuit (230; 730), and for example electronic components mounted above said mechanical support.

15. Ultrasonic probe (800) according to any one of claims 1 to 14, further comprising a support frame (810), the frame being formed so as to receive and retain the mechanical support (210) and being open at the transducer array (220).

16. Ultrasonic probe (800) according to claim 15, wherein the retaining frame (810): - forms a mechanical interface between the mechanical support (210) and a mechanical linking element (820); - comprises, or is made of, a thermally conductive material.

17. Ultrasound probe according to any one of claims 1 to 16, the ultrasound probe being integrated into a catheter, for example a catheter for intracardiac echocardiography.

18. Ultrasonic probe according to any one of claims 1 to 17, wherein the first lateral face is substantially flat and the transducer array is substantially flat.

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