Machining device comprising at least one machining unit, in particular a laser drilling unit, and method for operating such a device

Abstract

The invention relates to a machining device (10) comprising: at least one machining unit (12), in particular a laser drilling unit, which comprises a laser element (18) and at least one optical element (22), wherein the machining unit (12) is designed to introduce at least one recess into a substrate for an electrochemical cell (16) in at least one operating state; and at least one holding unit (24) which comprises at least one coupling element (50), wherein the at least one coupling element (50) is designed to receive at least one substrate for an electrochemical cell (16). According to the invention, the holding unit (24) has at least one rotatably mounted rotation element (52) which is connected to the at least one coupling element (50).

Description

[0001] Description

[0002] PROCESSING DEVICE WITH AT LEAST ONE PROCESSING UNIT, IN PARTICULAR A LASER DRILLING UNIT, AND METHOD FOR OPERATING SUCH DEVICE

[0003] State of the art

[0004] A processing device has already been proposed comprising at least one processing unit, in particular a laser drilling unit, which includes a laser element and at least one optical element, wherein the processing unit is configured in at least one operating state to create at least one recess in a substrate for an electrochemical cell, and comprising at least one holding unit, which includes at least one coupling element, wherein the at least one coupling element is configured to receive at least one substrate for an electrochemical cell.

[0005] Disclosure of the invention

[0006] The invention relates to a processing device with at least one processing unit, in particular a laser drilling unit, which comprises a laser element and at least one optical element, wherein the processing unit is configured in at least one operating state to create at least one recess in a substrate for an electrochemical cell, and with at least one holding unit, which comprises at least one coupling element, wherein the at least one coupling element is configured to receive at least one substrate for an electrochemical cell.

[0007] It is proposed that the holding unit has at least one rotatably mounted rotating element connected to the at least one coupling element. In this context, a "machining device" is understood to mean, in particular, a device configured for machining a substrate. Specifically, the machining device is configured to machine a substrate for an electrochemical cell. Preferably, the machining device is designed in multiple parts. Preferably, a non-cutting machining process is carried out with the machining device. Furthermore, the machining device preferably has a holder for the substrate for an electrochemical cell. Preferably, direct machining of the substrate is carried out in one machining step. Alternatively, indirect machining of the substrate by the machining device is also conceivable.The processing device is particularly preferably configured to perform all necessary steps, such as the supply of process gas and / or a processing step. The fact that an object is configured for a specific function means, in particular, that the object fulfills and / or performs this specific function in at least one application and / or operating state.

[0008] In this context, a "substrate for an electrochemical cell" preferably refers to a substrate intended for use in a fuel cell. Preferably, the substrate for an electrochemical cell is designed as a sheet. Preferably, the substrate is intended for use in an electrolyte cell. Particularly preferably, the substrate for an electrochemical cell is used in a solid-state fuel cell. Preferably, the substrate for an electrochemical cell is configured to provide a base for the electrolyte. Furthermore, a substrate made of pre-sintered ceramic is conceivable. Other materials that would appear suitable to a person skilled in the art are also conceivable.In this context, a non-shrinking material is understood to mean materials which do not shrink further during a shrinkage process, such as a sintering process, and / or which have already been shrunk beforehand, for example by a sintering process.

[0009] In this context, a "processing unit" is understood to mean, in particular, a unit designed to process a substrate. Preferably, the processing unit is configured to create recesses, especially through-holes, in the substrate. Preferably, the processing unit creates a plurality of through-holes in a substrate for an electrochemical cell. In particular, the substrate for an electrochemical cell absorbs the thermal energy introduced by the processing unit. Specifically, the creation of multiple through-holes leads to an accumulation of thermal energy in the substrate for an electrochemical cell. Preferably, the processing unit includes, in particular, at least one non-cutting tool for creating recesses. Preferably, the processing unit is designed in multiple parts.Preferably, the processing unit comprises at least one laser element. In this context, a "laser element" is understood to be, in particular, an element configured to generate a laser beam. A "laser beam" is understood to be, in particular, a light beam with an opening angle of less than 2 degrees, advantageously less than 1 degree, and most advantageously less than 0.5 degrees. Preferably, the light beam has at least 75% of its emitted energy within the opening angle. Preferably, the laser beam generated by the laser element is composed of a plurality of laser pulses. Preferably, the laser element is configured to generate a single laser pulse. More preferably, the laser element is configured to generate a single laser pulse and / or several successive laser pulses. The laser element is particularly preferably configured as a laser drill.In particular, the processing unit is configured to process at least one surface of the substrate for an electrochemical cell. Preferably, energy is introduced locally by the laser pulse generated by the laser element. The energy is particularly preferably locally high enough that the surface of the substrate is at least substantially partially, preferably largely, and most preferably completely melted and / or vaporized. Alternatively, complete melting combined with at least substantial vaporization is also conceivable. Preferably, the processing of the surface of the substrate for an electrochemical cell creates at least one recess in the substrate.Particularly preferably, a through-hole is formed in the substrate for an electrochemical cell by processing its surface. Preferably, the through-hole is arranged perpendicular to a principal plane of extension of the substrate for an electrochemical cell. A "principal plane of extension" of a component is understood to be, in particular, a plane that is parallel to a major side face of the smallest imaginary cuboid that just completely encloses the component, and especially one that passes through the center of the cuboid. Preferably, the processing unit focuses the laser pulse. Preferably, the processing unit includes an optical element. In this context, an "optical element" is understood to be, in particular, an element configured to deflect a laser beam.Preferably, the optical element is configured to deflect a laser beam generated by the laser element onto a substrate for an electrochemical cell. Preferably, the optical element is arranged between a substrate for an electrochemical cell and a laser element. In particular, it is conceivable that the optical element is designed as a mirror. Preferably, the optical element is arranged at least substantially perpendicular to a principal plane of extension of the substrate for an electrochemical cell. Alternatively, any other arrangement of the optical element that appears sensible to a person skilled in the art is conceivable. In this context, "at least substantially" means, in particular, that a deviation from a predetermined value is less than 10%, preferably less than 5%, and most preferably less than 3% of the predetermined value.

[0010] In this context, a "holding unit" is understood to mean, in particular, a unit configured to hold a substrate for an electrochemical cell. Preferably, the holding unit is configured to hold a substrate for an electrochemical cell during a processing step. Preferably, the holding unit is multi-part. Preferably, the holding unit is arranged parallel to a processing unit. Preferably, in a processing step, the substrate for an electrochemical cell is positioned at least substantially perpendicular to a processing unit by means of the holding unit. In this context, "perpendicular" means a direction perpendicular to a principal plane of extension of the substrate for an electrochemical cell. Preferably, the holding unit includes at least one coupling element.In this context, a "coupling element" is understood to mean, in particular, an element designed for the direct reception of the substrate for an electrochemical cell. Preferably, the coupling element is arranged at least substantially perpendicular to an optical element. Preferably, the substrate for an electrochemical cell is detachably arranged within the coupling element. Preferably, the coupling element is designed to form a detachable connection with the substrate for an electrochemical cell. Preferably, the coupling element has a coupling point with the substrate for an electrochemical cell. In this context, "detachable" is understood to mean, in particular, "non-destructively separable." It is especially conceivable that the coupling point is designed as a force-fit and / or form-fit connection.Preferably, the substrate for an electrochemical cell is permanently attached to the coupling element in a single processing step. "At least substantially permanently attached" here refers in particular to a connection of at least two elements that can only be separated from each other with the aid of cutting tools, such as a saw, especially a mechanical saw, etc., and / or chemical separating agents, such as solvents, etc. Preferably, the coupling element is configured to form a detachable connection after a processing step. Preferably, the coupling element is configured to connect a substrate for an electrochemical cell to a rotating element. In this context, a "rotating element" refers in particular to an element that is movably mounted. Preferably, the rotating element is movably mounted about an axis of rotation.Preferably, the rotating element is spaced apart from an axis of rotation. Preferably, the rotating element is configured to movably mount a substrate for an electrochemical cell. Particularly preferably, the rotating element is configured to movably mount a substrate for an electrochemical cell on a circular path. Preferably, the rotating element is designed to be driven. Preferably, the rotating element is configured to movably mount a substrate for an electrochemical cell that is attached in a coupling element. The term "movably mounted" here is intended to define, in particular, a mounting of an element wherein the element, in particular decoupled from any elastic deformation of the element, has the capability of movement about at least one axis by an angle greater than 270°, preferably greater than 305°, and particularly preferably greater than 360°.Preferably, the rotating element is configured to movably mount a holding unit on a circular path. Preferably, the rotating element is configured to movably mount a substrate for an electrochemical cell, which is attached in a coupling element, on a circular path. Preferably, the rotating element is designed along a circular path. Preferably, the rotating element is arranged parallel to a processing unit. Preferably, the rotating element has a connection point with a coupling element. Preferably, the connection point is designed as a detachable connection. Furthermore, it is conceivable that the coupling elements are only partially connected to the rotating element. Alternatively, a permanent connection point is also conceivable. In particular, it is conceivable that the connection point is designed as a locking element.Furthermore, it is conceivable that the connection point is designed as a screw connection and / or as another force-fit and / or form-fit connection that would appear sensible to a person skilled in the art. In this context, a "detent element" is understood to mean, in particular, a spring-elastic means for creating a detent connection, which is designed to be elastically deflected during assembly.

[0011] The inventive design of the processing device provides advantageous properties with regard to thermal energy dissipation. In particular, it provides advantageous properties with regard to the removal of material removal products. Specifically, active cooling is achieved by moving the substrate for an electrochemical cell in a circular path. This results in particularly advantageous properties with regard to cooling the substrate for the electrochemical cell. It also provides particularly advantageous properties with regard to production quality and quantity. In particular, the variable adjustment of the laser beam via the optical element and the rotating element allows for variable adjustment of the position and angle of the through-hole.This allows for particularly advantageous properties with regard to process variability.

[0012] Furthermore, it is proposed that the machining device includes a drive unit by means of which the rotatably mounted rotating element of the holding unit can be driven in a rotating manner. In this context, a "drive unit" is understood to be, in particular, a unit configured to generate kinetic energy from electrical energy. Preferably, the drive unit is configured to convert electrical energy into kinetic energy. Preferably, the drive unit transmits the kinetic energy to the rotatably mounted rotating element. Preferably, the kinetic energy is converted into a rotational speed by the rotating element. Preferably, the kinetic energy is variably controllable via a processing unit. Preferably, the drive unit is controlled by a processing unit.In particular, it is conceivable that the drive unit transmits a constant kinetic energy to the rotating element during a machining step. Preferably, the drive unit is configured to drive the rotating element in a circular path. Preferably, the drive unit is configured to drive the rotating element in a circular path regardless of direction. Preferably, the drive unit drives the rotating element by means of a mechanical power transmission. In this context, "mechanical power transmission" is understood to mean, in particular, the transmission of kinetic energy from a drive unit to a rotating element using, for example, a toothed belt pulley, a toothed belt, a flat belt, a round belt, a chain, and / or a deflection pulley. Alternatively, any other transmission of kinetic energy from a drive unit to a rotating element that would be considered sensible by a person skilled in the art is also conceivable.This allows for particularly advantageous properties with regard to a rotatably mounted, driven rotating element. In particular, it allows for the advantageous provision of a coupling element moving on a circular path.

[0013] Furthermore, it is proposed that the holding unit has several coupling elements, each of which is connected to the rotating element at a distance from an axis of rotation of the rotating element. Preferably, the coupling elements are arranged on the rotating element on a side facing the processing unit. Preferably, the coupling elements are formed in contact with a surface of the rotating element. Preferably, the coupling elements are arranged uniformly around an axis of rotation on the rotating element. Alternatively, it is conceivable that the coupling elements are arranged unevenly around an axis of rotation on the rotating element. It is also conceivable that the coupling elements are arranged at a variable, defined distance around an axis of rotation on the rotating element. Preferably, the coupling elements are arranged on a side of the rotating element opposite the axis of rotation.Preferably, the coupling elements are individually connected to the rotating element. Furthermore, it is conceivable that a defined number of, for example, two coupling elements form a group with a single coupling point. This allows for particularly advantageous properties with regard to production quality and quantity. In particular, advantageous properties can be achieved with regard to energy input per unit time and substrate for an electrochemical cell.

[0014] Furthermore, it is proposed that the rotating element has a polygonal cross-section, in particular a polygonal outer contour, in a plane perpendicular to an axis of rotation of the rotating element. Preferably, the rotating element has a polygonal cross-section, in particular a polygonal outer contour, in a plane perpendicular to an axis of rotation of the rotating element in an at least substantially oval arrangement. Preferably, the outer contour and an inner contour are identical. Alternatively, other cross-sections of the rotating element perpendicular to an axis of rotation of the rotating element that appear useful to a person skilled in the art, for example, a circular shape and / or an oval shape, are also conceivable. Preferably, the rotating element has a polygonal cross-section, in particular a polygonal outer contour, with a uniform edge length in a plane perpendicular to an axis of rotation of the rotating element.Preferably, the rotating element has the same number of corners as the coupling elements. Preferably, a coupling element is arranged along each edge. Furthermore, it is conceivable that two or more coupling elements are arranged along one edge. This allows for particularly advantageous properties with regard to production quality and production quantity.

[0015] Furthermore, it is proposed that the optical element includes a scanner configured for vertical movement of the laser beam without a mechanical axis. Preferably, the scanner is configured to move a laser beam in a single processing step parallel to a principal extension plane of the substrate for an electrochemical cell and in a principal extension direction of the substrate for an electrochemical cell. Preferably, the scanner is configured to move a laser beam vertically in a single processing step perpendicular to a principal extension plane of the rotating element. A "principal extension direction" of an object is understood to be, in particular, a direction that runs parallel to the longest edge of the smallest geometric cuboid that just completely encloses the object. Preferably, the scanner is configured as a mirror.Preferably, in a processing step, a laser beam is deflected at least substantially completely by means of the scanner designed as a mirror. "At least substantially" in this context means a maximum loss of deflection of the laser beam of preferably a maximum of 15%, more preferably a maximum of 10%, and particularly preferably a maximum of 5%. Alternatively, it is also conceivable that the laser beam generated by the processing unit is partially deflected. Particularly preferably, in a processing step, a laser beam is reflected at least substantially completely onto the substrate for an electrochemical cell by means of the scanner designed as a mirror. Preferably, in a processing step, a laser beam is reflected according to the law of reflection by means of the scanner designed as a mirror.Preferably, in one processing step, the laser beam generated by the processing unit is deflected by preferably a maximum of 120°, more preferably at least 105°, and more preferably a maximum of 90°. Preferably, in one processing step, the laser beam generated by the processing unit is deflected by preferably at least 45°, more preferably at least 60°, and more preferably a minimum of 75°. More preferably, in one processing step, the laser beam generated by the processing unit is deflected by at least substantially 90°. In this context, "at least substantially" means a maximum percentage deviation of preferably a maximum of 5%, more preferably a maximum of 3%, and more preferably a maximum of 1%. For example, the scanner is designed as a plane mirror. Alternatively, any other mirror shape that would be considered useful by a person skilled in the art, such as rectangular mirrors, concave mirrors, and other special shapes, is conceivable.Preferably, the mirror is designed as a laser mirror, specifically for use in laser applications. Preferably, the mirror, especially the laser mirror, has excellent surface qualities. Preferably, the mirror, especially the laser mirror, exhibits minimal scattering for beam guidance applications. For example, the mirror, especially the laser mirror, is designed with a surface coated with a dielectric laser mirror coating. This allows for higher reflections compared to a metallic coating. Preferably, the mirror, especially the laser mirror, has a high damage threshold, which is designed for the laser application. This allows for particularly advantageous properties with regard to guiding the laser beam using the scanner.In particular, advantageous properties can be provided with regard to lossless guidance of the laser beam.

[0016] Furthermore, it is proposed that the processing device includes a computing unit configured to adjust the repetition rate of the laser element depending on the position of the recess to be created. Preferably, the computing unit is configured to adjust both the rotational speed of the rotating element and the repetition rate of the laser element depending on the position of the recess to be created. Preferably, the rotating element has a constant rotational speed, with the computing unit adjusting the repetition rate of the laser element depending on the position of the recess to be created. Alternatively, it is conceivable that the repetition rate of the laser element is constant and the rotational speed of the rotating element is adjusted depending on the position of the recess to be created.Preferably, the repetition rate of the laser element is adjusted by means of the computing unit depending on the vertical position of the recess to be created. A "computing unit" is understood to be, in particular, a unit that can be formed by an evaluation unit and / or a control unit, wherein the computing unit can be formed by a processor alone or, in particular, by a processor and other electronic components, such as a storage device. This allows for particularly advantageous properties with regard to production quality and production quantity. It also allows for particularly advantageous properties with regard to the positioning of the recess on a substrate for an electrochemical cell.

[0017] Furthermore, the invention relates to a method for operating a processing device according to the invention. It is proposed that, in at least one adjustment step, the repetition rate of the laser element and the rotational speed of the holding unit are coordinated. Preferably, in an adjustment step, a rotational speed of the holding unit or the rotating element and / or the repetition rate of the laser element are preset by means of a processing unit. Preferably, an adjustment step is performed before a processing step. In particular, it is conceivable that an adjustment step overlaps at least substantially with a processing step. Preferably, the rotating element has a constant rotational speed, with the processing unit adjusting the repetition rate of the laser element depending on the position of the recess to be created.Alternatively, it is conceivable that the repetition rate of the laser element is constant and the rotational speed of the rotating element is adjusted depending on the position of the recess to be created. In this context, a "setting step" refers specifically to a process step in which process parameters are preset and / or controlled by a computing unit. This allows for particularly advantageous properties with regard to production quality and quantity. Specifically, it allows for advantageous properties regarding the positioning of the recess on a substrate for an electrochemical cell.

[0018] Furthermore, it is proposed that in at least one processing step, the holding unit has a rotational speed that is at least substantially constant. Preferably, the rotating element of the holding unit has a constant rotational speed. Preferably, the rotating element accelerates to a constant rotational speed in a setting step. Preferably, in a setting step, a drive unit accelerates the rotating element linearly to a defined constant speed. Preferably, the holding unit or the rotating element has a constant rotational speed of preferably a maximum of 100 m / s, more preferably a maximum of 50 m / s, and particularly preferably a maximum of 25 m / s in a processing step. Preferably, the rotational speed is reduced linearly to 0 m / s after a processing step.In this context, a "processing step" is understood to mean, in particular, a process step in which processing is carried out using the processing unit. Preferably, thermal energy is introduced into the substrate for an electrochemical cell in the processing step. Particularly preferably, a recess is created in the substrate for an electrochemical cell in the at least one processing step. Particularly preferably, a through-hole is created in the substrate for an electrochemical cell in the at least one processing step. This allows for particularly advantageous properties with regard to production quality and production quantity.

[0019] Furthermore, it is proposed that in at least one setting step, the position of the recess, in particular the laser recess, is determined by the repetition rate of the laser element, the rotation speed of the holding unit, and the orientation of the optical element. Preferably, in one setting step, a horizontal position on the substrate for an electrochemical cell is defined by the repetition rate of the laser element and the rotation speed of the holding unit. Preferably, the rotating element has a constant rotation speed, with the processing unit adjusting the repetition rate of the laser element depending on the horizontal position of the recess to be created. Alternatively, it is conceivable that the repetition rate of the laser element is constant and the rotation speed of the rotating element is adjusted depending on the horizontal position of the recess to be created.Preferably, in a setting step, the vertical position of the recess is defined by the orientation of the optical element. Preferably, in a setting step, the repetition rate of the laser element or the rotational speed of the holding unit is kept constant. Preferably, in a setting step, the repetition rate of the laser element is configured to bridge a gap between different substrates for an electrochemical cell. Preferably, the repetition rate of the laser element, the rotational speed of the holding unit, and the orientation of the optical element are controlled by a processing unit to automatically determine the position of the at least one recess on a substrate for an electrochemical cell.Preferably, the processing unit is configured to simultaneously form a plurality of recesses on several substrates for an electrochemical cell in a single setup step. Preferably, in a single setup step, the processing unit determines the position of a plurality of recesses on several substrates for an electrochemical cell by adjusting the repetition rate of the laser element, the rotation speed of the holding unit, and the orientation of the optical element. This allows for particularly advantageous properties with regard to production quality and quantity. In particular, advantageous properties with regard to the positioning of the recess on a substrate for an electrochemical cell can be provided.

[0020] Furthermore, it is proposed that in at least one processing step, an airflow is generated on the at least one substrate for an electrochemical cell by the rotational speed of the holding unit, which is configured for active cooling of the at least one substrate for an electrochemical cell. Preferably, in one processing step, an airflow is generated on the surface of the substrate for an electrochemical cell by the rotational speed of the holding unit. Preferably, in one processing step, the airflow generated by the rotational speed is used to dissipate thermal energy. Preferably, in one processing step, the thermal energy generated on the substrate for an electrochemical cell by the processing unit is absorbed by the airflow generated by the rotational speed.Preferably, in a processing step, the constant absorption of thermal energy minimizes, and particularly preferably prevents, the accumulation of thermal energy in a substrate for an electrochemical cell. This allows for advantageous properties regarding thermal energy dissipation. In particular, active cooling is achieved by moving the substrate for the electrochemical cell in a circular path. This allows for particularly advantageous properties regarding the cooling of the substrate for the electrochemical cell.

[0021] Furthermore, it is proposed that in at least one processing step, a centrifugal force is generated by the rotational speed of the holding unit, which is configured to impart additional momentum to the ablation products. Preferably, momentum is transferred to the ablation products by the centrifugal force. Preferably, in one processing step, the centrifugal force acts as an additional acceleration for an ablation product. Preferably, in one processing step, a melt generated by the processing unit is driven out of the recess by the centrifugal force. In this context, "ablation products" are understood to mean, in particular, particles and / or melt and / or contaminants that arise during processing of the substrate for an electrochemical cell by a processing unit.Preferably, the centrifugal force is greater than the frictional force of the erosion products on the substrate of an electrochemical cell. This allows for particularly advantageous properties with regard to the removal of erosion products.

[0022] Furthermore, a solid-state fuel cell with a substrate for an electrochemical cell, produced by a method and / or device according to the invention, is proposed. Preferably, the solid-state fuel cell has an anode and a cathode. Preferably, the substrate for an electrochemical cell is configured to provide a base for the electrolyte. Preferably, the solid-state fuel cell is configured to convert the chemical reaction energy of a continuously supplied fuel and an oxidizing agent into electrical energy. For example, hydrogen is used as the fuel and oxygen as the oxidizing agent. Alternatively, other fuels that would appear suitable to a person skilled in the art, such as methanol, butane, and / or natural gas, are also conceivable.Preferably, in a process step of the solid-state fuel cell, electrical energy is generated between the anode and the cathode. Preferably, the anode releases electrons from the fuel. Preferably, the electrons are guided to the cathode via a connecting element. In particular, the electrical energy is generated by this movement of electrons from the anode to the cathode. Preferably, the electrons in the cathode are transferred to the oxidizing agent and split the oxidizing agent. The negatively charged oxidizing agent is attracted, in particular, by the substrate for an electrochemical cell to the positively charged protons of the fuel. Preferably, water and exhaust air are formed as end products of the chemical reaction. This allows for the provision of a particularly advantageous solid-state fuel cell.

[0023] The processing device according to the invention is not intended to be limited to the application and embodiment described above. In particular, the processing device according to the invention may, to achieve a functionality described herein, have a different number of individual elements, components, units, and process steps than those specified herein. Furthermore, values ​​within the specified limits of the value ranges stated in this disclosure are also considered disclosed and freely usable.

[0024] drawing

[0025] Further advantages will become apparent from the following description of the drawing. The drawing illustrates an embodiment of the invention. The drawing, the description, and the claims contain numerous features in combination. A person skilled in the art will expediently consider the features individually and combine them into meaningful further combinations.

[0026] They show:

[0027] Fig. 1 shows a solid-state fuel cell with a substrate for an electrochemical cell, produced using a method and / or device according to the invention, in a schematic representation; Fig. 2 shows a processing device in a schematic representation and

[0028] Fig. 3 shows a schematic flowchart of a method for operating a machining device according to the invention.

[0029] Description of the exemplary embodiment

[0030] Fig. 1 shows a solid-state fuel cell 26 with a substrate for an electrochemical cell 16, produced by a method and / or a processing device 10 according to the invention. The solid-state fuel cell 26 has an anode 28 and a cathode 30. An electrolyte 76 is arranged between the anode 28 and the cathode 30. The substrate for an electrochemical cell 16 is configured to provide a base for the electrolyte 76. The solid-state fuel cell 26 is configured to convert the chemical reaction energy of a continuously supplied fuel 32 and an oxidizing agent 34 into electrical energy. Hydrogen is used as the fuel 32 and oxygen as the oxidizing agent 34. Alternatively, other fuels 32 that would be suitable to a person skilled in the art, for example methanol, butane, and / or natural gas, are also conceivable.In a process step of the solid-state fuel cell 26, electrical energy is generated between the anode 28 and the cathode 30. The anode 28 releases an electron 36 from the fuel 32. The electrons 36 are conducted to the cathode 30 via a connecting element 38. This movement of the electrons 36 from the anode 28 to the cathode 30 generates the electrical energy. The electrons 36 in the cathode 30 are transferred to the oxidizing agent 34 and split the oxidizing agent 3. The negatively charged oxidizing agent 34 is attracted by the positively charged protons 40 of the fuel 32 through the substrate for an electrochemical cell 16a. The end products of the chemical reaction include, for example, water 42 and exhaust air 44.

[0031] Fig. 2 shows a machining device 10 for carrying out a method according to the invention. The machining device 10 is configured to machine a substrate for an electrochemical cell 16. The machining device 10 is designed in multiple parts. A non-cutting machining process is carried out with the machining device 10. Furthermore, the machining device 10 has a holder for the substrate for an electrochemical cell 16. In a machining step 46, direct machining of the substrate 16 is carried out. Alternatively, indirect machining of the substrate 16 by the machining device 10 is also conceivable. The machining device 10 is configured to carry out all necessary steps, for example, a setup step 48 and / or a machining step 46.

[0032] The processing device 10 comprises a processing unit 12, which transfers thermal energy into the substrate for an electrochemical cell 16 during processing. The processing unit 12 includes a non-cutting tool. The processing unit 12 is designed in multiple parts. The processing unit 12 includes at least one laser element 18. The laser element 18 is configured to generate a laser beam 60. The laser beam 60 generated by the laser element 18 is formed by a plurality of laser pulses 20. The laser element 18 is configured to generate a single laser pulse 20 and / or several successive laser pulses 20. The laser element 18 is configured as a laser drill. The processing unit 12 is configured to perform processing of at least one surface 54 of the substrate for an electrochemical cell 16.The processing unit 12 is configured to create a through-hole 14 in a substrate for an electrochemical cell 16. Energy is locally introduced into the substrate for an electrochemical cell 16 by the laser pulse 20 generated by the processing unit 12. The processing unit 12 forms a through-hole 14 in the surface 54 of the substrate for an electrochemical cell 16. The through-hole 14 is arranged perpendicular to a principal plane of extension of the substrate for an electrochemical cell 16. The processing unit 12 focuses the laser pulse 20. The substrate for an electrochemical cell 16 is used for an electrochemical cell in the solid oxide fuel cell 26. Alternatively, the substrate 16 is intended for use in an electrolyte cell. Furthermore, the substrate 16 is intended for use in a battery.Substrate 16 forms the electrolyte of a solid-state fuel cell 26. Substrate 16 is made of a metallic material. Alternatively, another non-shrinking material is also conceivable. Furthermore, a substrate 16 made of a pre-sintered ceramic is conceivable.

[0033] The processing unit 12 includes an optical element 22. The optical element 22 is configured to deflect the laser beam 60 generated by the laser element 18 onto a substrate for an electrochemical cell 16. The optical element 22 is arranged between the substrate for the electrochemical cell 16 and the laser element 18. In particular, it is conceivable that the optical element 18 is configured as a mirror. The optical element 22 is arranged at least substantially perpendicular to a principal plane of extension of the substrate for the electrochemical cell 16.

[0034] The processing device 10 has a holding unit 24. The holding unit 24 is configured to hold a substrate for an electrochemical cell 16 during a processing step 46. The holding unit 24 is multi-part. The holding unit 24 is arranged parallel to a processing unit 12. In a processing step 46, the substrate for an electrochemical cell 16 is positioned at least substantially perpendicular to a processing unit 12 by means of the holding unit 24. The holding unit 24 has at least one coupling element 50. The coupling element 50 is arranged at least substantially perpendicular to an optical element 22. The substrate for an electrochemical cell 16 is detachably arranged in a coupling element 50. The coupling element 50 is configured to form a detachable connection with the substrate for an electrochemical cell 16.The coupling element 50 has a coupling point 72 with the substrate for an electrochemical cell 16. In particular, it is conceivable that the coupling point 72 is designed as a force-fit and / or form-fit connection. The substrate for an electrochemical cell 16 is permanently arranged in the coupling element 50 in a processing step 46. The coupling element 50 is configured to form a detachable connection after a processing step 46. The coupling element 50 is configured to connect a substrate for an electrochemical cell 16 with a rotating element 52. The holding unit 24 has a rotatably mounted rotating element 52. Preferably, the rotating element 52 is spaced apart from an axis of rotation 58. The rotating element 52 is connected to a coupling element 50. The rotating element 52 is designed along a circular path.The rotating element 52 is arranged at least substantially parallel to a machining unit 12. The rotating element 52 has a connection point 74 with a coupling element 50. The connection point 74 is designed as a detachable connection. It is also conceivable that the coupling element 50 is only partially connected to the rotating element 52. Alternatively, a permanent connection point 74 is also conceivable. In particular, it is conceivable that the connection point 74 is designed as a locking element. Furthermore, it is conceivable that the connection point 74 is designed as a screw connection and / or as another force-fit and / or form-fit connection that would appear sensible to a person skilled in the art.

[0035] The machining device 10 has a drive unit 56 by means of which the rotatably mounted rotating element 52 of the holding unit 24 can be driven in rotation. The drive unit 56 is arranged in contact with the rotatably mounted rotating element 52. Alternatively, it is conceivable that the drive unit 56 is arranged at a distance from a rotating element 52, with the kinetic energy being transferred from the drive unit 56 to the rotating element 52 via a transmission element. The drive unit 56 is configured to convert electrical energy into kinetic energy. The drive unit 56 transfers the kinetic energy to the rotatably mounted rotating element 52. The kinetic energy is converted into a rotational speed by the rotating element 52. The kinetic energy is variably controllable via a computing unit 62. The drive unit 56 is controlled by a computing unit 62.In particular, it is conceivable that the drive unit 56 transmits a constant kinetic energy to the rotating element 52 during a machining step 46. The drive unit 56 is configured to drive the rotating element 52 in a circular path. The drive unit 56 is configured to drive the rotating element 52 in a circular path regardless of direction. The drive unit 56 drives the rotating element 52 by means of a mechanical force transmission. The holding unit 24 has several coupling elements 50, each of which is connected to the rotating element 52 at a distance from a rotation axis 58 of the rotating element 52. The coupling elements 50 are arranged on the rotating element 52 on a side facing the machining unit 12. The coupling elements 50 are in contact with a surface of the rotating element 52. The coupling elements 50 are arranged evenly around a rotation axis 58 on the rotating element 52.Alternatively, the coupling elements 50 could be arranged unevenly around a rotation axis 58 on the rotating element 52. Furthermore, the coupling elements 50 could be arranged at a defined variable distance around a rotation axis 58 on the rotating element 52. The coupling elements 50 are arranged on the side of the rotating element 52 opposite the rotation axis 58. The coupling elements 50 are individually connected to the rotating element 52. Finally, a defined number of, for example, two coupling elements 50 could form a group with a coupling point 72.

[0036] The rotating element 52 has a polygonal cross-section, in particular a polygonal outer contour, in a plane perpendicular to an axis of rotation 58 of the rotating element 52. The rotating element 52 has a polygonal cross-section, in particular a polygonal outer contour, in a plane perpendicular to an axis of rotation 58 of the rotating element 52 in an arrangement that is at least substantially oval. The outer contour and an inner contour are identical. Alternatively, other cross-sections of the rotating element 52 perpendicular to an axis of rotation 58 of the rotating element 52, for example a circular shape and / or an oval shape, which would appear sensible to a person skilled in the art, are also conceivable. The rotating element 52 has a polygonal cross-section, in particular a polygonal outer contour, with a uniform edge length in a plane perpendicular to an axis of rotation 58 of the rotating element 52.The rotating element 52 has an identical number of corners relative to the coupling elements 50. One coupling element 50 is arranged along each edge. It is also conceivable that two or more coupling elements 50 are arranged along one edge. The optical element 22 has a scanner configured for vertical movement of the laser beam 60 without a mechanical axis. The scanner is configured to move a laser beam 60 in a processing step 46 parallel to a principal extension plane of the substrate for an electrochemical cell 16 and vertically in a principal extension direction of the substrate for an electrochemical cell 16. The scanner is configured to move a laser beam 60 vertically in a processing step 46 perpendicular to a principal extension plane of the rotating element 52. The scanner is designed as a mirror.In processing step 46, a laser beam 60 is deflected at least substantially completely by means of the scanner, which is designed as a mirror. Alternatively, it is also conceivable that the laser beam 60 generated by the processing unit 12 is partially deflected. In processing step 46, a laser beam 60 is reflected at least substantially completely onto the substrate for an electrochemical cell 16 by means of the scanner, which is designed as a mirror. In processing step 46, a laser beam 60 is reflected by means of the scanner, which is designed as a mirror, according to the law of reflection. For example, the scanner is designed as a plane mirror. Alternatively, any other mirror shape that would appear useful to a person skilled in the art is conceivable, for example, rectangular mirrors, concave mirrors, and other special shapes. The mirror is designed as a laser mirror, specifically for use in laser applications.The mirror, especially a laser mirror, has excellent surface qualities. The mirror, especially a laser mirror, exhibits minimal scattering for beam guidance applications. For example, the mirror, especially a laser mirror, is designed with a surface coated with a dielectric laser mirror coating.

[0037] The processing device 10 has a computing unit 62, which is configured to adjust the repetition rate of the laser element 18 depending on the position of a recess 64 to be created. The computing unit 62 is configured to adjust the rotational speed 68 of the rotating element 52 and the repetition rate of the laser element 18 depending on the position of the recess 64 to be created. The rotating element 52 has a constant rotational speed 68, with the computing unit 62 adjusting the repetition rate of the laser element 18 depending on the position of the recess 64 to be created. Alternatively, it is conceivable that the repetition rate of the laser element 18 is constant and the rotational speed 68 of the rotating element 52 is adjusted depending on the position of the recess 64 to be created.By means of the computing unit 16, a repetition rate of the laser element 18 is adjusted depending on the vertical position of the recess 64 to be made.

[0038] Fig. 3 shows a schematic flowchart of a method for operating a processing device 10 according to the invention. In at least one adjustment step 48, the repetition rate of the laser element 18 and the rotational speed 68 of the holding unit 24 are adjusted. In an adjustment step 48, a rotational speed 68 of the holding unit 25 or the rotating element 52 and / or the repetition rate of the laser element 18 are preset by means of a computing unit 62. An adjustment step 48 takes place before a processing step 46. In particular, it is conceivable that an adjustment step 48 overlaps at least substantially with a processing step 46. The rotating element 52 has a constant rotational speed 68, with the computing unit 62 adjusting a repetition rate of the laser element 18 depending on the position of the recess 64 to be created.Alternatively, it is conceivable that the repetition rate of the laser element 18 is constant and a rotation speed 68 of the rotation element 52 is adjusted depending on the position of the recess 64 to be made.

[0039] In at least one processing step 46, the holding unit 24 has a rotational speed 68 that is at least substantially constant. The rotating element 52 of the holding unit 24 has a constant rotational speed 68. In a setting step 48, the rotating element 52 is accelerated to a constant rotational speed 68. In a setting step 48, a drive unit 56 accelerates the rotating element 52 linearly to a constant, defined speed. After a processing step 46, the rotational speed 68 is linearly reduced to 0 m / s.

[0040] In at least one setting step 48, the position of the recess 64, in particular the laser recess, is determined by the repetition rate of the laser element 18, the rotation speed 68 of the holding unit 24, and the orientation of the optical element 22. In a setting step 48, a horizontal position on the substrate for an electrochemical cell 16 is defined by the repetition rate of the laser element 18 and the rotation speed 68 of the holding unit 24. The rotating element 52 has a constant rotation speed 68, with the processing unit 62 adjusting the repetition rate of the laser element 18 depending on the horizontal position of the recess 64 to be created. Alternatively, it is conceivable that the repetition rate of the laser element 18 is constant and the rotation speed 68 of the rotating element 52 is adjusted depending on the horizontal position of the recess 64 to be created.In setting step 48, the vertical position of the recess 64 is defined by the orientation of the optical element 22. In setting step 48, the repetition rate of the laser element 18 or the rotational speed 68 of the holding unit 24 is set to a constant. In setting step 48, the repetition rate of the laser element 18 is configured to bridge a gap between different substrates for an electrochemical cell 16. The repetition rate of the laser element 18, the rotational speed 68 of the holding unit 24, and the orientation of the optical element 22 are controlled by a processing unit 62 to automatically determine the position of at least one recess 64 on a substrate for an electrochemical cell 16.The computing unit 62 is configured to simultaneously form a plurality of recesses 64 on several substrates for an electrochemical cell 16 in a setting step 48. In a setting step 48, the computing unit 62 determines the position of a plurality of recesses 64 on several substrates for an electrochemical cell 16 by adjusting the repetition rate of the laser element 18, the rotation speed 68 of the holding unit 24, and the orientation of the optical element 22.

[0041] In at least one processing step 46, the rotational speed of the holding unit 24 generates an airflow on the at least one substrate for an electrochemical cell 16, which is designed for active cooling of the at least one substrate for an electrochemical cell 16. In a processing step 46, the rotational speed 68 of the holding unit 24 generates an airflow on the surface 54 of the substrate for an electrochemical cell 16. In a processing step 46, the airflow generated by the rotational speed 68 is used to dissipate thermal energy.In a processing step 46, the thermal energy generated on the substrate for an electrochemical cell 16 by the processing unit 12 is absorbed by the airflow generated by the rotational speed 68. In a processing step 46, the constant absorption of the thermal energy minimizes, and preferably prevents, the accumulation of thermal energy in the substrate for an electrochemical cell 16. In at least one processing step 46, the rotational speed 68 of the holding unit 24 generates a centrifugal force 66, which is configured to impart additional momentum to the ablation products 70. Momentum is transferred to the ablation products 70 by the centrifugal force 66. In a processing step 46, the centrifugal force is used as additional acceleration for an ablation product 70.In processing step 46, the melt produced by the processing unit 12 is driven out of the recess 64 by the centrifugal force 66. The centrifugal force 66 is greater than the frictional force of the ablation products 70 on the substrate for an electrochemical cell 16.

Claims

Claims 1. Machining device (10), comprising at least one machining unit (12), in particular a laser drilling unit comprising a laser element (18) and at least one optical element (22), wherein the processing unit is configured in at least one operating state to create at least one recess in a substrate for an electrochemical cell (16), and with at least one holding unit (24) comprising at least one coupling element (50), wherein the at least one coupling element (50) is configured to receive at least one substrate for an electrochemical cell (16), characterized in that the holding unit (24) has at least one rotatably mounted rotational element (52) which is connected to the at least one coupling element (50).

2. Machining device (10) according to claim 1 , characterized by a drive unit (56) by means of which the rotatably mounted rotating element (52) of the holding unit (24) can be driven in a rotating manner.

3. Machining device (10) according to claim 1 or 2, characterized in that the holding unit (24) has several coupling elements (50) which are each spaced apart from an axis of rotation (58) of the rotating element (52) and connected to the rotating element (52).

4. Machining device (10) according to one of the preceding claims, characterized in that the rotating element (52) has a polygonal cross-section, in particular a polygonal outer contour, in a plane perpendicular to an axis of rotation (58) of the rotating element (52).

5. Processing device (10) according to one of the preceding claims, characterized in that the optical element (22) has a scanner which is configured for a vertical movement of a laser beam (60) without a mechanical axis.

6. Processing device (10) according to one of the preceding claims, characterized by a computing unit (62) which is configured to adjust a repetition rate of the laser element (18) depending on the position of a recess (64) to be made.

7. Method for operating a processing device (10) according to one of the preceding claims, characterized in that in at least one setting step (48) a coordination is carried out between the repetition rate of the laser element (18) and a rotation speed (68) of the holding unit (24).

8. Method according to claim 7, characterized in that in at least one processing step (46) the holding unit (24) has a rotational speed (68) that is at least substantially constant.

9. Method according to claim 7 or 8, characterized in that in at least one setting step (48) the position of the recess (64), in particular laser recess, is determined by the repetition rate of the laser element (18), the rotation speed (68) of the holding unit (24) and the alignment of the optical element (22).

10. Method according to one of claims 7 to 9, characterized in that in at least one processing step (46) an airflow is generated on the at least one substrate for an electrochemical cell (16) by the rotational speed (68) of the holding unit (24), which is designed to actively cool the at least one substrate for an electrochemical cell (16).

11. Method according to one of claims 7 to 10, characterized in that in at least one processing step (46) a centrifugal force (66) is generated by the rotational speed (68) of the holding unit (24), which is configured to give an additional impulse to ablation products (70).

12. Solid-state fuel cell (26) with a substrate for an electrochemical cell (16), manufactured by means of a processing device (10) according to one of claims 1 to 6 and / or a method according to one of claims 7 to 11.

Images