Mounting device

Abstract

A stage (30) has a support part (31) and a step part (32). The support part (31) supports a first member (10). The step part (32) is recessed more than the support part (31) away from the first member (10). The outer diameter (L) of the support part (31) is smaller than the outer diameter (L1) of the first member (10) when viewed from the pressing direction of a second member (20), and is larger than a pressing region (R1) pressed by the second member (20) in the first member (10).

Description

Onboard equipment

[0001] The present invention relates to a mounting device.

[0002] Patent Document 1 discloses a method for mounting electronic components, in which a bonding head is moved to a bonding stage and solder bumps are inserted with a predetermined pressure into protrusions on electrodes of a substrate (first member) that correspond to the solder bumps of the electronic component (second member), thereby connecting the electronic component and the substrate.

[0003] Japanese Patent Application Laid-Open No. 2007-043010

[0004] However, when the bonding head is pressed against the bonding stage, there is a risk that the substrate and the stage may be elastically deformed and bent.

[0005] Specifically, the load applied to the substrate and stage is large at the position corresponding to the center of the bonding head, and the amount of deflection of the substrate and stage increases. As a result, the load applied across the surface of the electronic component varies, which can cause the bumps to crush differently across the chip surface, resulting in variations in bump bonding strength.

[0006] The present invention has been made in view of the above points, and an object of the present invention is to suppress variations in the bonding strength between the first member and the second member.

[0007] A first invention is a mounting device that mounts a second member pressed toward a first member onto the first member, and includes a stage on which the first member is placed, the stage having a support portion that supports the first member at a position facing the second member, and a step portion that is recessed further than the support portion so as to move away from the first member, and the outer diameter of the support portion is smaller than the outer diameter of the first member when viewed from the pressing direction of the second member and larger than the pressing area of ​​the first member that is pressed by the second member.

[0008] In the first invention, the outer diameter of the support portion that supports the first member is smaller than the outer diameter of the first member when viewed from the pressing direction of the second member and larger than the pressing area of ​​the first member that is pressed by the second member.

[0009] This can prevent variations in the bonding strength between the first member and the second member.

[0010] Specifically, if the first member is supported on the entire surface of the stage without providing a step portion on the stage, when the first member and the stage are pressed by the second member, the entire surfaces of the first member and the stage will bend. In this case, the amount of bending of the first member and the stage will be greatest at the position corresponding to the second member. Therefore, at the position where the amount of bending of the first member and the stage is greatest, the bond between the first member and the second member will be weak, and there is a risk of variation in the bond strength between the first member and the second member.

[0011] In contrast, in the present invention, a support portion and a step portion are provided on the stage, and the first member is supported by the support portion. When the first member and the stage are pressed by the second member, the step portion elastically deforms, while the first member and the support portion move in the pressing direction while maintaining a flat surface.

[0012] This makes it possible to suppress deflection of the first member and the support portion, and to suppress variations in the bonding strength between the first member and the second member.

[0013] In a second aspect of the present invention, in the mounting device of the first aspect, the outer diameter of the support portion is larger than the outer diameter of the second member when viewed from the pressing direction of the second member.

[0014] In the second invention, the outer diameter of the support portion is larger than the outer diameter of the second member when viewed from the pressing direction of the second member.

[0015] A third invention is a mounting device according to the first or second invention, wherein the second member has a joining region having a plurality of joining portions joined to the first member, and the outer diameter of the support portion is smaller than the outer diameter of the second member and larger than the joining region when viewed from the pressing direction of the second member.

[0016] In the third aspect of the present invention, the outer diameter of the support portion is smaller than the outer diameter of the second member and larger than the joining region when viewed from the pressing direction of the second member.

[0017] A fourth invention is a mounting device according to the first or second invention, wherein the stage has an outer peripheral support part that extends along the outer peripheral edge of the first member and protrudes toward the first member beyond the step part to support the outer peripheral edge of the first member, and the stage is provided with an adsorption space defined by the first member, the support part, the step part, and the outer peripheral support part, and is equipped with a pump that sucks air out of the adsorption space to adsorb and hold the first member onto the support surfaces of the support part and the outer peripheral support part.

[0018] In the fourth aspect of the present invention, the outer peripheral support portion supports the outer peripheral edge of the first member, thereby enabling the first member to be stably supported. Furthermore, by using a pump to suck out air from the suction space, the first member can be suction-held onto the support surfaces of the support portion and the outer peripheral support portion.

[0019] A fifth invention is a mounting device according to the first or second invention, wherein the stage has an outer peripheral wall portion that extends along the outer peripheral edge of the first member, protrudes toward the first member beyond the step portion, and surrounds the outer peripheral surface of the first member; the stage is provided with an adsorption space defined by the first member, the support portion, the step portion, and the outer peripheral wall portion; and the stage is equipped with a pump that sucks air out of the adsorption space to adsorb and hold the first member on the support surface of the support portion.

[0020] In the fifth aspect of the present invention, the outer peripheral wall surrounds the outer peripheral surface of the first member, thereby preventing the first member from shifting. Also, the pump sucks air out of the suction space, thereby suctioning and holding the first member to the support surface of the support part.

[0021] In a sixth aspect of the present invention, in the mounting device of the first or second aspect of the present invention, the support portion is made of a member having higher rigidity than the step portion.

[0022] In the sixth aspect of the present invention, by configuring the support portion using a member having higher rigidity than the step portion, deformation and wear of the support portion, which is subjected to the pressing force of the second member, can be suppressed.

[0023] A seventh invention is a mounting device according to the sixth invention, wherein the support portion is placed on the step portion, and a suction hole is formed on the mounting surface of the support portion at the step portion, and a pump is provided which sucks air out of the suction hole to adsorb and hold the support portion to the mounting surface of the step portion.

[0024] In the seventh aspect of the present invention, by holding the support part at the step part by suction, even if the support part is deformed or worn, the support part can be removed from the step part and replaced by stopping the operation of the pump. Furthermore, even if the support part and the step part have different thermal expansion coefficients, the support part can be prevented from peeling off from the step part.

[0025] An eighth aspect of the present invention is the mounting device of the first or second aspect, wherein a plurality of the second members are mounted on the first member at intervals from one another.

[0026] In an eighth aspect of the present invention, a plurality of second members are mounted on the first member at intervals.

[0027] According to the present invention, it is possible to suppress variations in the bonding strength between the first member and the second member.

[0028] 12 is a side cross-sectional view showing a schematic configuration of a mounting device according to the first embodiment; FIG. 13 is a side cross-sectional view showing a state in which a pressing head has been moved to a bonding position; FIG. 14 is a side cross-sectional view showing a schematic configuration of a mounting device according to a comparative example; FIG. 15 is a side cross-sectional view showing a state in which a substrate and a stage are bent; FIG. 16 is a plan view showing a configuration of a stage; FIG. 17 is a side cross-sectional view taken along the arrows A-A in FIG. 5; FIG. 18 is a side cross-sectional view showing a configuration of a stage in which the outer diameter of a support portion is larger than the outer diameter of a semiconductor chip; FIG. 19 is a side cross-sectional view showing a configuration of a stage according to the second embodiment; FIG. 20 is a side cross-sectional view showing a state in which a substrate is placed on the stage; FIG. 21 is a plan view showing a configuration of a stage according to the third embodiment; FIG. 22 is a side cross-sectional view taken along the arrows B-B in FIG. 10; FIG. 23 is a plan view showing a configuration of a stage according to the fourth embodiment; FIG. 24 is a side cross-sectional view taken along the arrows C-C in FIG. 25; FIG. 26 is a side cross-sectional view showing a configuration of a stage according to the fifth embodiment; FIG. 27 is a side cross-sectional view showing a configuration of a stage according to the sixth embodiment; FIG. 28 is a side view showing a configuration of a mounting device; FIG. 29 is a side view showing a state in which a pressing head and a stage have been moved.

[0029] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following description of the preferred embodiments is merely exemplary in nature and is not intended to limit the present invention, its applications, or its uses.

[0030] First Embodiment As shown in FIGS. 1 and 2, a mounting device 1 mounts a semiconductor chip 20 as a second member on a substrate 10 as a first member.

[0031] A plurality of electrode pads 11 are provided on the bonding surface (top surface in FIG. 1 ) of the substrate 10. The electrode pads 11 are made of, for example, copper. The substrate 10 is provided with a pressing region R1 that is pressed by the semiconductor chip 20 when the semiconductor chip 20 is bonded.

[0032] A bonding region R2 having a plurality of bumps 21 (bonding portions) is provided on the bonding surface (the lower surface in FIG. 1) of the semiconductor chip 20. The bumps 21 are made of, for example, copper.

[0033] The mounting device 1 directly bonds the electrode pads 11 of the substrate 10 to the bumps 21 of the semiconductor chip 20 by so-called solid-phase diffusion bonding.

[0034] The mounting device 1 includes a stage 30 and a pressing head 40. The substrate 10 is placed on the stage 30. Details of the stage 30 will be described later.

[0035] The press head 40 is disposed above the stage 30. The press head 40 is configured to be movable in the up and down direction relative to the stage 30. A chip suction hole 41 is formed in the press head 40. The chip suction hole 41 opens below the press head 40. The press head 40 sucks air through the chip suction hole 41 using a pump (not shown), thereby suctioning and holding the semiconductor chip 20 at the lower end of the press head 40.

[0036] The pressing head 40 moves between a bonding position and a retracted position. The bonding position is a position where the bumps 21 of the semiconductor chip 20 are pressed against the electrode pads 11 of the substrate 10 to bond them (see FIG. 2). The retracted position is a position where the semiconductor chip 20 is separated from the substrate 10 (see FIG. 1).

[0037] The mounting device 1 applies a load and heat due to the pressure between the semiconductor chip 20 and the substrate 10 while pressing the bumps 21 of the semiconductor chip 20, which are held by suction with the pressing head 40, against the electrode pads 11 of the substrate 10 placed on the stage 30. This promotes plastic deformation of the bumps 21 and the electrode pads 11, and the bumps 21 of the semiconductor chip 20 and the electrode pads 11 of the substrate 10 are bonded together.

[0038] <Stage configuration> However, as shown in the comparative example of Figure 3, when the entire surface of the substrate 10 is supported by the stage 30, there is a risk that the substrate 10 and the stage 30 will elastically deform and bend when the pressing head 40 presses the semiconductor chip 20 toward the substrate 10.

[0039] 4, a large load is applied to the substrate 10 and the stage 30 at a position corresponding to the center of the pressing head 40, resulting in a large amount of deflection of the substrate 10 and the stage. In FIG. 4, the direction of the load is indicated by a white arrow, and the magnitude of the load is represented by the length of the white arrow.

[0040] In this way, variations in the load applied within the surface of the semiconductor chip 20 may cause the bumps 21 to collapse differently within the surface of the semiconductor chip 20, which may result in variations in the bump bonding strength.

[0041] Therefore, in this embodiment, the shape of the stage 30 is devised to suppress variations in the bonding strength between the substrate 10 and the semiconductor chip 20 .

[0042] 5 and 6, the stage 30 has a support portion 31, a step portion 32, and a peripheral support portion 33. The stage 30 is made of a material that is relatively easy to process, such as stainless steel (SUS303, SUS304) or aluminum steel (A5052).

[0043] The support portion 31 supports the substrate 10 at a position facing the semiconductor chip 20. The step portion 32 is formed in a shape that is recessed more than the support portion 31 so as to be spaced away from the substrate 10. In the example shown in Fig. 5, the step portion 32 is formed in a quadrangular shape, but this shape is not limited to this. For example, the step portion 32 may be formed in a substantially circular or polygonal shape.

[0044] The outer peripheral support portion 33 extends along the outer peripheral edge of the substrate 10 and protrudes toward the substrate 10 beyond the step portion 32 to support the outer peripheral edge of the substrate 10 .

[0045] As shown in FIG. 2, the outer diameter L of the support portion 31 is smaller than the outer diameter L1 of the substrate 10 when viewed from the pressing direction of the pressing head 40 and is larger than the pressing region R1 of the substrate 10 pressed by the semiconductor chip 20.

[0046] Furthermore, the outer diameter L of the support portion 31, when viewed from the pressing direction of the press head 40, is smaller than the outer diameter L2 of the semiconductor chip 20 and larger than the bonding region R2 of the semiconductor chip 20. In this case, the area of ​​the support portion 31 that is pressed down by the pressing force of the press head 40 can be set to a minimum.

[0047] 7, the outer diameter L of the support portion 31 may be larger than the outer diameter L2 of the semiconductor chip 20 when viewed from the pressing direction of the pressing head 40. In this case, there is no need to align the substrate 10 and the stage 30 with high precision.

[0048] As shown in FIG. 2, when the substrate 10 and the stage 30 are pressed by the pressing head 40, the step portion 32 is elastically deformed, while the substrate 10 and the support portion 31 move in the pressing direction while maintaining a flat surface.

[0049] This makes it possible to suppress the bending of the substrate 10 and the support portion 31 and to suppress variations in the bonding strength between the substrate 10 and the semiconductor chip 20 .

[0050] Furthermore, by making the outer diameter L of the support portion 31 smaller than the outer diameter L2 of the semiconductor chip 20 and larger than the bonding region R2 when viewed from the pressing direction of the pressing head 40, the difference in bonding height between the bumps 21 in the center of the semiconductor chip 20 and the bumps 21 in the outer edge portion can be reduced.

[0051] This prevents the bumps 21 on the outer edge of the semiconductor chip 20 from being significantly crushed and short-circuiting with adjacent bumps 21 .

[0052] The stage 30 is provided with a suction space 35. The suction space 35 is defined by the substrate 10, the support portion 31, the step portion 32, and the outer peripheral support portion 33. The step portion 32 has a substrate suction hole 36 formed therein, which communicates with the suction space 35.

[0053] 2, the substrate suction holes 36 are formed on the bottom surface of the stepped portion 32, but this is not limiting and the substrate suction holes 36 may be formed in an area that does not support the substrate 10, that is, in a surface that does not come into contact with the substrate 10. For example, the substrate suction holes 36 may be formed on the side surface of the outer periphery support portion 33.

[0054] In this way, forming the substrate suction hole 36 in an area that does not support the substrate 10 can suppress local deformation of the substrate 10. Furthermore, although the example shown in Fig. 2 has been described with a configuration in which one substrate suction hole 36 is provided, multiple substrate suction holes 36 may be provided to stably hold the substrate 10 by suction. Furthermore, the shape of the substrate suction hole 36 is not limited to a circular shape, and may be, for example, an elliptical or rectangular shape.

[0055] A pipe 37 is connected to the substrate suction hole 36. A pump 38 is connected to the pipe 37. The pump 38 sucks air out of the suction space 35. As a result, the substrate 10 is suction-held on the support surfaces of the support portion 31 and the outer peripheral support portion 33.

[0056] In this way, the support parts 31 support the center part of the substrate 10, and the peripheral support parts 33 support the peripheral edge part of the substrate 10, thereby enabling stable support of the substrate 10. Furthermore, by using the pump 38 to suck out air from the suction space 35, the substrate 10 can be suction-held onto the support surfaces of the support parts 31 and the peripheral support parts 33.

[0057] As described above, according to the mounting device 1 of this embodiment 1, when a load is applied while pressing a semiconductor chip 20 having a plurality of bumps 21 arranged thereon against a substrate 10, the applied load can be concentrated on the bonding region R2 of the semiconductor chip 20, and the substrate 10 outside the bonding region R2 of the semiconductor chip 20 can be prevented from being pressed down.

[0058] This reduces the difference in stress due to load between the central portion and the peripheral portion of the semiconductor chip 20, thereby reducing the difference in bonding height between the bumps 21 in the central portion and the bumps 21 in the peripheral portion of the semiconductor chip 20. As a result, it is possible to suppress variations in the bump bonding strength between the first member 10 and the second member 20.

[0059] Second Embodiment Hereinafter, the same parts as those in the first embodiment will be denoted by the same reference numerals, and only the differences will be described.

[0060] 8 and 9 , the stage 30 has a support portion 31, a step portion 32, and an outer peripheral wall portion 34. The support portion 31 supports the substrate 10 at a position facing the semiconductor chip 20. The step portion 32 is formed in a shape that is recessed more than the support portion 31 so as to be spaced apart from the substrate 10.

[0061] The outer peripheral wall portion 34 extends along the outer peripheral edge of the substrate 10, protruding toward the substrate 10 beyond the step portion 32 and surrounding the outer peripheral surface of the substrate 10. Specifically, the outer peripheral wall portion 34 protrudes by a height H beyond the support portion 31. In the example shown in Fig. 9, the height H is smaller than the thickness of the semiconductor chip 20. The inner diameter of the outer peripheral wall portion 34 is approximately the same as the outer diameter L1 of the substrate 10.

[0062] The stage 30 is provided with a suction space 35. The suction space 35 is defined by the substrate 10, the support portion 31, the step portion 32, and the outer peripheral wall portion 34. The step portion 32 has a substrate suction hole 36 formed therein, which communicates with the suction space 35.

[0063] A pipe 37 is connected to the substrate suction hole 36. A pump 38 is connected to the pipe 37. The pump 38 sucks air out of the suction space 35. As a result, the substrate 10 is held by suction on the support surface of the support portion 31.

[0064] As described above, according to the mounting device 1 of the second embodiment, the outer peripheral wall portion 34 surrounds the outer peripheral surface of the substrate 10, thereby preventing the substrate 10 from shifting.

[0065] Furthermore, by making the inner diameter of the outer peripheral wall portion 34 approximately the same as the outer diameter L1 of the substrate 10, it is possible to reduce the amount of air leaking from the gap between the outer peripheral surface of the substrate 10 and the inner peripheral surface of the outer peripheral wall portion 34 when air is sucked out through the substrate suction holes 36. This allows the substrate 10 to be stably held by suction on the stage 30.

[0066] 10 and 11 , the stage 30 has a support portion 31, a step portion 32, and an outer peripheral wall portion 34. The support portion 31 supports the substrate 10 at a position facing the semiconductor chip 20. The step portion 32 is formed in a shape that is recessed more than the support portion 31 so as to be spaced apart from the substrate 10.

[0067] The outer peripheral wall portion 34 extends along the outer peripheral edge of the substrate 10 , protrudes toward the substrate 10 beyond the step portion 32 , and surrounds the outer peripheral surface of the substrate 10 .

[0068] Here, the support portion 31 is made of a member separate from the step portion 32. Specifically, the support portion 31 is made of a member having higher rigidity than the step portion 32. The support portion 31 is placed on the step portion 32.

[0069] As the support portion 31, it is preferable to use, for example, a cemented carbide in which a metal carbide such as tungsten (W), chromium (Cr), molybdenum (Mo), titanium (Ti), zirconium (Zr), or the like is bonded (sintered) with an iron-based metal such as iron (Fe), cobalt (Co), or nickel (Ni), or sapphire, ceramic, or the like.

[0070] Support portion suction holes 39 are formed in the mounting surface of support portion 31 at step portion 32. Pipes 37 are connected to support portion suction holes 39. Pipes 37 are connected to pump 38. Pump 38 sucks air through support portion suction holes 39 to suction-hold support portion 31 onto the mounting surface of step portion 32. Note that support portion 31 is not limited to being suction-held by pump 38, and may be fixed by other fixing methods such as screwing.

[0071] As described above, according to the mounting device 1 of this embodiment 3, by constructing the support portion 31 using a material with higher rigidity than the step portion 32, deformation and wear of the support portion 31, on which the pressing force of the pressing head 40 acts, can be suppressed.

[0072] Furthermore, even if the support portion 31 is deformed or worn, the operation of the pump 38 can be stopped, allowing the support portion 31 to be removed from the step portion 32 and replaced.

[0073] Furthermore, even if the support portion 31 and the step portion 32 have different thermal expansion coefficients, the support portion 31 can be prevented from peeling off from the step portion 32 .

[0074] Fourth Embodiment As shown in FIGS. 12 and 13 , a stage 30 has a plurality of support portions 31 , a step portion 32 , and a peripheral support portion 33 .

[0075] A total of four support portions 31 are provided at intervals in the depth direction and the left-right direction in Fig. 12. In the example shown in Fig. 12, two support portions 31 are provided at intervals in the depth direction and two support portions 31 are provided at intervals in the left-right direction.

[0076] Four sets of electrode pads 11 for bonding the semiconductor chip 20 are provided at intervals on one substrate 10. The four sets of electrode pads 11 are provided at positions corresponding to the four support portions 31, respectively.

[0077] The number of electrode pads 11 provided on the substrate 10 is not limited to the example shown in Fig. 13. Furthermore, the shape of the substrate 10 is not limited to a square, and may be, for example, a substantially circular shape like a wafer.

[0078] Although not shown in the figure, four semiconductor chips 20 are provided. The four semiconductor chips 20 are bonded to the electrode pads 11 at positions corresponding to the four support portions 31. In this way, a plurality of semiconductor chips 20 are bonded to one substrate 10 with gaps between them.

[0079] Support portion 31 supports substrate 10 at a position facing semiconductor chip 20. Step portion 32 is formed in a shape that is recessed more than support portion 31 so as to be away from substrate 10. Peripheral support portion 33 extends along the outer peripheral edge of substrate 10 and protrudes toward substrate 10 beyond step portion 32 to support the outer peripheral edge of substrate 10.

[0080] The stage 30 is provided with a suction space 35. The suction space 35 is defined by the substrate 10, the support portion 31, the step portion 32, and the outer peripheral support portion 33. The step portion 32 has a substrate suction hole 36 formed therein, which communicates with the suction space 35.

[0081] In the example shown in Figure 12, a configuration in which one substrate suction hole 36 is provided is described, but multiple substrate suction holes 36 may be provided to ensure stable suction and holding of the substrate 10.

[0082] Fifth Embodiment As shown in FIG. 14, a stage 30 has a plurality of support portions 31, a step portion 32, and an outer peripheral wall portion .

[0083] As in the fourth embodiment, a total of four support portions 31 are provided at intervals in the depth direction and left-right direction of the page in Fig. 14. Four sets of electrode pads 11 for bonding the semiconductor chip 20 are provided at intervals on one substrate 10. The four sets of electrode pads 11 are provided at positions corresponding to the four support portions 31, respectively.

[0084] The support portion 31 supports the substrate 10 at a position facing the semiconductor chip 20. The step portion 32 is formed in a shape that is recessed more than the support portion 31 so as to be away from the substrate 10. The outer peripheral wall portion 34 extends along the outer peripheral edge of the substrate 10, protrudes toward the substrate 10 beyond the step portion 32, and surrounds the outer peripheral surface of the substrate 10.

[0085] The stage 30 is provided with a suction space 35. The suction space 35 is defined by the substrate 10, the support portion 31, the step portion 32, and the outer peripheral wall portion 34. The step portion 32 has a substrate suction hole 36 formed therein, which communicates with the suction space 35.

[0086] Sixth Embodiment As shown in Fig. 15 , four sets of electrode pads 11 for bonding a semiconductor chip 20 are provided on one substrate 10 at intervals from each other. In the example shown in Fig. 15 , two sets of electrode pads 11 are provided at intervals in the left-right direction. In addition, two sets of electrode pads 11 are provided at intervals in the depth direction of the paper surface of Fig. 15 .

[0087] Although not shown in the drawings, four semiconductor chips 20 are provided. The four semiconductor chips 20 are respectively bonded to four sets of electrode pads 11. In this way, a plurality of semiconductor chips 20 are bonded to one substrate 10 with gaps between them.

[0088] The stage 30 has a support portion 31, a step portion 32, and a peripheral support portion 33. The support portion 31 supports the substrate 10 at a position facing the semiconductor chip 20. The step portion 32 is formed in a shape that is recessed more than the support portion 31 so as to be away from the substrate 10. The peripheral support portion 33 extends along the outer periphery of a set of electrode pads 11 on the substrate 10, and protrudes toward the substrate 10 beyond the step portion 32 to support the substrate 10.

[0089] 16, a movement mechanism 50 is provided on the stage 30. The movement mechanism 50 moves the stage 30 in the X direction (left and right direction in FIG. 16) and the Y direction (depth direction on the paper in FIG. 16).

[0090] The movement mechanism 50 includes an X-direction ball screw 51 , an X-direction block 52 , a Y-direction ball screw 53 , a Y-direction block 54 , and a shaft 55 .

[0091] The stage 30 is supported by a shaft 55. The shaft 55 is attached to a Y-direction block 54. The Y-direction block 54 is movable in the Y direction by a Y-direction ball screw 53.

[0092] The Y-direction ball screw 53 is attached to the X-direction block 52. The X-direction block 52 is movable in the X direction by the X-direction ball screw 51.

[0093] The substrate 10 is supported by a substrate support mechanism 60. The substrate support mechanism 60 supports the substrate 10 so that it can move in the Z direction (the up and down direction in FIG. 16).

[0094] The substrate support mechanism 60 includes a Z-direction ball screw 61 , a Z-direction block 62 , and a support plate 63 .

[0095] The support plate 63 supports the substrate 10. The support plate 63 is attached to a Z-direction block 62. The Z-direction block 62 is movable in the Z direction by a Z-direction ball screw 61.

[0096] This allows the substrate 10 to be lifted by raising the support plate 63 .

[0097] When joining a semiconductor chip 20 to a set of electrode pads 11 on a substrate 10, the substrate 10 is lifted by a support plate 63, the stage 30 is moved, and the support portion 31 of the stage 30 is positioned at a position corresponding to the electrode pads 11 (see Figure 16).

[0098] In this state, the pressing head 40 is lowered to press the bumps 21 of the semiconductor chip 20 against the electrode pads 11 of the substrate 10, thereby bonding the bumps 21 of the semiconductor chip 20 and the electrode pads 11 of the substrate 10 together.

[0099] Thereafter, as shown in FIG. 17, the stage 30 is moved toward the electrode pads 11 to which the semiconductor chip 20 is not bonded, and the bonding operation of the semiconductor chip 20 and the substrate 10 is performed.

[0100] As described above, according to the mounting device 1 of the sixth embodiment, the stage 30 can be made smaller, and costs can be reduced.

[0101] As described above, the present invention has the highly practical effect of suppressing variations in the joining strength between the first member and the second member, and is therefore extremely useful and has high industrial applicability.

[0102] REFERENCE SIGNS LIST 1 Mounting device 10 Substrate (first member) 11 Electrode pad 20 Semiconductor chip (second member) 21 Bump (bonding portion) 30 Stage 31 Support portion 32 Step portion 33 Peripheral support portion 34 Peripheral wall portion 35 Suction space 38 Pump 39 Support portion suction hole (suction hole) R1 Pressing area R2 Bonding area

Claims

1. A mounting device that mounts a second member pressed against a first member onto the first member, comprising: a stage on which the first member is placed; the stage having a support portion that supports the first member at a position facing the second member; and a stepped portion that is recessed further than the support portion so as to be spaced away from the first member; and the outer diameter of the support portion, when viewed from the pressing direction of the second member, is smaller than the outer diameter of the first member and is larger than the pressing area of ​​the first member that is pressed by the second member.

2. A mounting device according to claim 1, wherein the outer diameter of said support part is larger than the outer diameter of said second member when viewed from the pressing direction of said second member.

3. A mounting device according to claim 1 or 2, wherein the second member is provided with a joining area having a plurality of joining parts to be joined to the first member, and the outer diameter of the support part is smaller than the outer diameter of the second member and larger than the joining area when viewed from the pressing direction of the second member.

4. A mounting device according to claim 1 or 2, wherein the stage has an outer peripheral support part that extends along the outer peripheral edge of the first member and protrudes further towards the first member than the step part to support the outer peripheral edge of the first member, and the stage is provided with an adsorption space defined by the first member, the support part, the step part and the outer peripheral support part, and the mounting device is equipped with a pump that sucks air out of the adsorption space to adsorb and hold the first member on the support surfaces of the support part and the outer peripheral support part.

5. A mounting device according to claim 1 or 2, wherein the stage has an outer peripheral wall portion that extends along the outer peripheral edge of the first member and protrudes further towards the first member than the step portion to surround the outer peripheral surface of the first member, and the stage is provided with an adsorption space defined by the first member, the support portion, the step portion and the outer peripheral wall portion, and the mounting device is equipped with a pump that sucks air out of the adsorption space to adsorb and hold the first member on the support surface of the support portion.

6. A mounting device according to claim 1 or 2, wherein the support portion is made of a material having higher rigidity than the step portion.

7. A mounting device according to claim 6, wherein the support part is placed on the step part, suction holes are formed in the mounting surface of the support part at the step part, and the mounting device comprises a pump that sucks air through the suction holes to suction and hold the support part to the mounting surface of the step part.

8. A mounting device according to claim 1 or 2, wherein a plurality of said second members are mounted on said first member at intervals from one another.

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