Package and method for manufacturing package

Abstract

The present invention makes it possible to mount a chip on a package while reducing stress borne by the chip.　The package comprises: a chip; a substrate on which the chip is mounted; a lid which is positioned above the chip so as to be separated from the chip; and a sealing material which is positioned on the substrate so as to be separated from the chip and which supports the lid. The lid may be a transparent member. The package may further comprise a rib which supports the lid. The rib and the sealing material may be separated from each other. The lid may be disposed inward of the sealing material.

Description

Package and method for manufacturing the package

[0001] The present technology relates to a package and a method of manufacturing the package. More particularly, the present technology relates to a package in which a lid is disposed over a chip and a method of manufacturing the package.

[0002] In the packaging of image sensors, there is a technology for bonding a cover glass and an image sensor via an adhesive disposed on the periphery. For example, a technology has been disclosed in which a spacer member made of a cured adhesive formed in a frame shape is provided at the adhesive portion that bonds the image sensor substrate and the cover glass (see, for example, Patent Document 1).

[0003] JP 2016-12695 A

[0004] However, in the above-mentioned conventional technology, the sealing material of the package comes into contact with the rib material and the die-bonding material, which can increase the stress on the image sensor substrate and the cover glass due to stress between the sealing material and the rib material and stress between the sealing material and the die-bonding material.

[0005] This technology was developed in light of these circumstances, and aims to enable chips to be mounted in packages while suppressing the stress on the chips.

[0006] The present technology has been made to solve the above-mentioned problems, and a first aspect thereof is a package including a chip, a substrate on which the chip is mounted, bonding wires connecting the chip and the substrate, a lid positioned on the chip and spaced apart from the chip, and an encapsulant positioned on the substrate and spaced apart from the chip, encapsulating a portion of the bonding wires on the substrate, thereby preventing stress from being applied to the chip from the encapsulant.

[0007] In the first aspect, the lid may be a transparent member, which provides an optical path on the chip while protecting the chip with the transparent member.

[0008] In addition, in the first aspect, the device may include a bonding pad formed on the substrate and connected to the bonding wire, and the encapsulant may encapsulate the junction between the bonding wire and the bonding pad, thereby preventing stress from being applied to the chip from the encapsulant and protecting the junction between the bonding wire and the bonding pad.

[0009] In the first aspect, the lid may be disposed inside the sealing material, thereby reducing the area of ​​the lid on the sealing material.

[0010] In the first aspect, the encapsulant may include a first resin layer located on the substrate and a second resin layer located on the first resin layer, thereby improving the suitability of the encapsulant and supporting the lid via the encapsulant.

[0011] In the first aspect, the second resin layer may have a lower elastic modulus than the first resin layer, thereby providing the effect of supporting the lid via the sealing material while alleviating stress applied to the lid.

[0012] In the first aspect, the first resin layer may have a lower coefficient of thermal expansion than the second resin layer, thereby reducing thermal stress applied to the substrate via the first resin layer.

[0013] In the first aspect, the thixotropy ratio of the sealing material may be equal to or greater than 1. This provides the effect of preventing the sealing material from spreading on the substrate while allowing the sealing material to be applied.

[0014] In addition, the first side surface may further include an opening provided on a side surface of the sealing material, thereby reducing the pressure difference between the inside and outside of the sealing material.

[0015] In addition, the first aspect may further comprise a rib positioned on the chip and supporting the lid, thereby providing the effect of supporting the lid so as to be spaced apart from the chip.

[0016] In the first aspect, the rib and the sealing material may be spaced apart, thereby preventing stress from being applied between the rib and the sealing material.

[0017] The first side surface may further include a first hollow portion formed inside the rib and a second hollow portion formed between the sealing material and the rib, thereby preventing stress from being applied between the rib and the sealing material while arranging the chip inside the sealing material.

[0018] In the first aspect, the chip may include a pad electrode formed on the chip and connected to the bonding wire, and the junction between the pad electrode and the bonding wire may be covered with the rib, thereby preventing stress from being applied to the rib from the sealing material and protecting the junction between the pad electrode and the bonding wire.

[0019] In addition, in the first aspect, the device may further include a die bond material that bonds the chip to the substrate, thereby providing the effect of mounting the chip on the substrate.

[0020] In the first aspect, the die bond material and the sealing material may be spaced apart, thereby preventing stress from being applied between the die bond material and the sealing material.

[0021] A second aspect of the present invention is a method for manufacturing a package, comprising the steps of: die-bonding a chip onto a substrate; connecting the chip and the substrate via bonding wires; forming a first resin layer on the substrate at a distance from the chip; forming a second resin layer on the first resin layer at a distance from the chip, the second resin layer having a lower elastic modulus than the first resin layer; forming a rib on the chip at a distance from the first resin layer and the second resin layer; and disposing a lid on the rib at a distance from the chip. This prevents stress from being applied to the chip and the rib via the first resin layer and the second resin layer while suppressing an increase in the number of steps.

[0022] FIG. 1 is a diagram showing an example of the configuration of a package according to a first embodiment. FIG. 2 is a diagram showing an example of a manufacturing method for a package according to the first embodiment. FIG. 3 is a diagram showing an example of a manufacturing method for a package according to the first embodiment. FIG. 4 is a diagram showing an example of a manufacturing method for a package according to the first embodiment. FIG. 5 is a diagram showing an example of the configuration of a package according to a second embodiment. FIG. 6 is a diagram showing an example of the configuration of a package according to a third embodiment. FIG. 7 is a diagram showing an example of the configuration of a package according to a fourth embodiment. FIG. 8 is a diagram showing an example of the configuration of a package according to a fifth embodiment. FIG. 9 is a diagram showing an example of the configuration of a package according to a sixth embodiment. FIG. 10 is a diagram showing an example of the configuration of a package according to a seventh embodiment. FIG. 11 is a diagram showing an example of the configuration of a package according to an eighth embodiment. FIG. 12 is a block diagram showing a schematic configuration example of a vehicle control system. FIG. 13 is an explanatory diagram showing an example of the installation position of an imaging unit.

[0023] Modes for carrying out the present technology (hereinafter referred to as embodiments) will be described below. The descriptions will be made in the following order: 1. First embodiment (an example in which the sealing material supporting the transparent substrate is spaced from the chip on the mounting substrate) 2. Second embodiment (an example in which the sealing material supporting the transparent substrate is spaced from the chip on the mounting substrate, and an opening is provided on the side of the support member) 3. Third embodiment (an example in which the transparent substrate is arranged inside the sealing material spaced from the chip on the mounting substrate) 4. Fourth embodiment (an example in which the sealing material supporting the transparent substrate is spaced from the chip on the mounting substrate, and the size of the transparent substrate is made equal to the size of the mounting substrate) 5. Fifth embodiment (an example in which the transparent substrate is supported via ribs on the chip, and the sealing material covering part of the bonding wires on the mounting substrate is spaced from the chip) 6. Sixth embodiment (an example in which the sealing material supporting the transparent substrate is spaced from the chip on the mounting substrate, and a step for positioning the sealing material is formed in the mounting substrate) 7. 7. Seventh embodiment (an example in which the sealing material supporting the transparent substrate is spaced apart from the chip on the mounting substrate, and the sealing material has a single-stage structure) 8. Eighth embodiment (an example in which the sealing material supporting the transparent substrate is spaced apart from the chip on the mounting substrate, and the upper end of the transparent substrate is covered with the sealing material) 9. Example of application to a moving body

[0024] 1 is a diagram showing an example of the configuration of a package according to a first embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of a package 100, and "b" is a plan view showing the example of the configuration of the package 100. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0025] Furthermore, the drawings used in the following description may differ in scale and shape from the actual structure in order to make each component easier to understand.

[0026] In the figure, the package 100 includes a mounting substrate 121, a chip 111, bonding wires 116, sealing materials 125 and 126, and a transparent substrate 127. In this case, the package 100 can form a hollow package in which the chip 111 is mounted. The mounting substrate 121 is an example of a substrate as defined in the claims. The transparent substrate 127 is an example of a lid as defined in the claims.

[0027] The chip 111 is mounted on the mounting substrate 121. The mounting substrate 121 may be a ball grid array (BGA), a pin grid array (PGA), or a land grid array (LGA). The base material of the mounting substrate 121 may be, for example, ceramic or resin. Bonding pads 122 and land electrodes 123 are formed on the mounting substrate 121. Wiring and vias may also be formed on the mounting substrate 121. The bonding pads 122 are arranged on the front surface of the mounting substrate 121. In this case, the bonding pads 122 can be arranged along the four sides of the mounting substrate 121. A bonding wire 116 can be connected to the bonding pads 122. The land electrodes 123 are arranged on the back surface of the mounting substrate 121. An external terminal such as a solder ball can be connected to the land electrodes 123.

[0028] The chip 111 is mounted face up on the mounting substrate 121. The chip 111 can be bonded to the mounting substrate 121 via a die bond material 128. The die bond material 128 may be a paste material such as Ag paste, or a solder material such as Sn.

[0029] The chip 111 is connected to the mounting substrate 121 via bonding wires 116. At this time, pad electrodes 113 to which the bonding wires 116 are connected can be formed on the chip 111. The bonding wires 116 can be made of a metal such as Au or Al.

[0030] A semiconductor element, an optical element, or a MEMS (Micro Electro Mechanical Systems) may be formed on the chip 111. The substrate used for the chip 111 may be a semiconductor substrate, a dielectric substrate, or an organic substrate.

[0031] The light receiving element may be an image sensor such as a CCD (Charged Coupled Device) sensor, a CMOS (Complementary Metal-Oxide Semiconductor) sensor, or an event-based vision sensor. The light received by the image sensor may be visible light, near infrared light (NIR), short wavelength infrared light (SWIR), ultraviolet light, or X-rays. The optical element may be a light receiving element such as a PD (Photo Diode), or a light emitting element such as an LD (Laser Diode), an LED (Light Emitting Diode), or a VCSEL (Vertical Cavity Surface Emitting Laser). The optical element may be an optical switch or a DMD (Digital Micromirror Device). The optical element may be a display element such as a liquid crystal element or an organic EL (Electro Luminescence) element. The material used for the optical element may be a semiconductor such as Si, GaAs, or InGaAs, or LiNbO ３, or may be a dielectric material such as glass or transparent resin.

[0032] The semiconductor element may include an IC (Integrated Circuit), a transistor, a resistor, a capacitor, etc. The semiconductor element may include a memory, a processor, a signal processing circuit, a data processing circuit, or an interface circuit. The semiconductor element may include a hardware circuit such as an FPGA (Field-Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit). Materials used for the semiconductor element may include Si, GaAs, SiC, GaN, InGaAs, InP, InGaAsP, etc.

[0033] For example, a CMOS image sensor can be formed on the chip 111. In this case, a light receiving region 112 is provided on the chip 111. In the light receiving region 112, pixels and pixel transistors are arranged in a matrix along the row and column directions. Photodiodes or SPADs (Single Photon Avalanche Diodes) may be formed on the pixels. A color filter 114 is formed on the light receiving region 112 for each pixel. An on-chip lens 115 is formed on the color filter 114 for each pixel. The color filter 114 and the on-chip lens 115 are made of a material such as SiO ２ An insulating film such as SiN or SiCN, or a transparent resin such as acrylic or polycarbonate can be used. The color filter 114 may contain a pigment. The color filter 114 may have, for example, a Bayer array or a quad-Bayer array. The color filter 114 may include an RGB filter, a complementary color filter, or a white filter. A lens, a color splitter, or a deflector made of a metasurface may be formed on the light receiving region 112.

[0034] The transparent substrate 127 is disposed on the chip 111. At this time, the transparent substrate 127 is supported on the mounting substrate 121 via the ribs 124 and is bonded to the mounting substrate 121. The transparent substrate 127 may be a glass substrate, a quartz substrate, or a transparent resin substrate such as acrylic or polycarbonate. The transparent substrate 127 is formed of Al or AlN, depending on the wavelength of light received by the chip 111. ２ O ３ , CaF ２ , MgF ２ Alternatively, LiF or the like may be used.

[0035] The ribs 124 are positioned between the chip 111 and the transparent substrate 127. In this case, the ribs 124 can support the transparent substrate 127 on the chip 111. The ribs 124 can be continuously arranged along the outer periphery of the mounting substrate 121. In this case, the ribs 124 can cover the bonded portions between the bonding wires 116 and the pad electrodes 113 on the chip 111. The material of the ribs 124 may be a thermosetting resin or an ultraviolet-curing resin. For example, the material of the ribs 124 may be a resin such as a siloxane-based resin, an acrylic-based resin, or an epoxy-based resin. The ribs 124 may contain an inorganic or organic filler to improve reliability. The filler material may be glass. The ribs 124 may be blackened to reduce flare on the light-receiving region 112. For example, the ribs 124 may contain a black pigment such as carbon black, or a filler such as carbon fiber.

[0036] The encapsulant 125 encapsulates a portion of the bonding wire 116 on the mounting substrate 121. In this case, the encapsulant 125 may encapsulate the joint between the bonding wire 116 and the bonding pad 122 on the mounting substrate 121. The encapsulant 125 is positioned on the mounting substrate 121 so as to be spaced apart from the chip 111, the rib 124, and the die bond material 128. The encapsulant 125 may be formed at a position lower than the lower surface of the transparent substrate 127. In this case, the top position of the encapsulant 125 may be lower than the top position of the bonding wire 116. The encapsulant 125 may be disposed continuously along the outer periphery of the mounting substrate 121. In this case, the encapsulant 125 may be formed in a frame shape around the chip 111 at a position spaced apart from the chip 111.

[0037] The encapsulant 126 can be positioned on the encapsulant 125 and adhered to the transparent substrate 127. The encapsulant 126 can cover the lower end of the transparent substrate 127. In this case, the encapsulant 126 may also cover the lower side of the transparent substrate 127. The encapsulant 126 is positioned on the encapsulant 125 so as to be spaced apart from the chip 111, the rib 124, and the die bond material 128. The encapsulant 126 can be disposed continuously along the outer periphery of the mounting substrate 121. In this case, a first hollow portion is formed inside the rib 124, and a second hollow portion is formed between the encapsulants 125, 126 and the rib 124. The first hollow portion and the second hollow portion are separated from each other.

[0038] The positions of the horizontal side surfaces of the sealing materials 125 and 126 can be aligned with the positions of the horizontal side surfaces of the mounting substrate 121. In this case, the horizontal side surfaces of the sealing materials 125 and 126 and the mounting substrate 121 can be configured as dicing surfaces.

[0039] The sealing materials 125 and 126 may be mold resin or potting resin. The material of the sealing materials 125 and 126 may be a thermosetting resin or an ultraviolet-curing resin. For example, the material of the sealing materials 125 and 126 may be a resin such as a silicone-based resin, a siloxane-based resin, an acrylic-based resin, or an epoxy-based resin. The sealing materials 125 and 126 may contain an inorganic or organic filler to improve reliability. The filler material may be glass. The sealing materials 125 and 126 may be blackened to reduce flare on the light-receiving region 112. For example, the sealing materials 125 and 126 may contain a black pigment such as carbon black or a filler such as carbon fiber.

[0040] In this case, the materials of the sealants 125 and 126 may be different from each other. For example, the sealant 125 may be made of an epoxy resin, and the sealant 126 may be made of a silicone resin.

[0041] Here, the elastic modulus of the sealing material 126 may be smaller than that of the sealing material 125. By making the elastic modulus of the sealing material 126 smaller than that of the sealing material 125, stress applied to the transparent substrate 127 can be reduced. Alternatively, the thermal expansion coefficient of the sealing material 125 may be lower than that of the sealing material 126. By making the thermal expansion coefficient of the sealing material 125 lower than that of the sealing material 126, stress applied to the mounting substrate 121 during reflow of the package 100 can be reduced. Alternatively, the moisture permeability of the sealing material 126 may be higher than that of the sealing material 125. By setting the moisture permeability of the sealing material 126 higher than that of the sealing material 125, an increase in internal pressure during reflow of the package 100 can be suppressed. The thixotropic ratios of the sealing materials 125 and 126 are preferably set to 1 or greater. By setting the thixotropy ratio of the sealing materials 125 and 126 to 1 or more, the fluidity of the sealing materials 125 and 126 during potting can be suppressed, and the height of the sealing materials 125 and 126 can be increased.

[0042] In the above embodiment, an example has been shown in which the transparent substrate 127 is supported via the ribs 124, but the transparent substrate 127 may also be supported via the sealing materials 125 and 126. In this case, the ribs 124 may be removed from the package 100.

[0043] 2 to 5 are diagrams showing an example of a method for manufacturing a package according to the first embodiment. Note that in Fig. 2 to 5, "a" is a cross-sectional view showing the method for manufacturing the package 100, and "b" in Fig. 2 to 5 is a plan view showing the method for manufacturing the package 100. Also, Fig. 2 to 5 show a method for manufacturing two packages 100.

[0044] 2, the aggregate substrate 121W is divided into partitioned regions RK. A mounting substrate 121 can be cut out from each partitioned region RK. Then, a chip 111 is mounted on the aggregate substrate 121W for each partitioned region RK. Then, the pad electrodes 113 and bonding pads 122 are connected to each other via bonding wires 116 for each partitioned region RK.

[0045] 3, the sealant 125 is applied to each partitioned region RK on the assembly substrate 121W using a dispenser. The sealant 125 is then cured by heat treatment or ultraviolet irradiation. At this time, the sealant 125 can seal the joints between the bonding wires 116 and the bonding pads 122 on the mounting substrate 121. The sealant 125 can be spaced apart from the chips 111, the ribs 124, and the die bond material 128.

[0046] Next, as shown in FIG. 4 , a rib material is applied to the chip 111 for each partition region RK using a dispenser, forming ribs 124 on the chip 111. At this time, the ribs 124 can seal the joints between the bonding wires 116 and the pad electrodes 113 on the chip 111. The ribs 124 can be separated from the sealing material 125. Furthermore, the sealing material 126 is applied to the sealing material 126 for each partition region RK using a dispenser. At this time, the sealing material 126 can be separated from the chip 111, the ribs 124, and the die bond material 128.

[0047] 5 , a transparent substrate 127 is placed for each divided region RK on the ribs 124 and the sealing material 126. Then, the ribs 124 and the sealing material 126 are hardened by heat treatment or ultraviolet light irradiation, and the transparent substrate 127 is bonded to the ribs 124 and the sealing material 126.

[0048] 1, the aggregate substrate 121W in which the chips 111 and the transparent substrates 127 are arranged in each partition region RK is separated into pieces to form the package 100. When separating the aggregate substrate 121W, the sealing materials 125 and 126 and the aggregate substrate 121W may be cut by dicing, for example.

[0049] As described above, in the first embodiment, the sealing materials 125 and 126 are disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128. This makes it possible to prevent stress from being applied from the sealing materials 125 and 126 to the chip 111, the rib 124, and the die bonding material 128. This makes it possible to prevent the chip 111, the rib 124, and the die bonding material 128 from peeling off from the sealing materials 125 and 126, and to prevent damage to the chip 111, the rib 124, and the die bonding material 128, thereby improving the reliability of the package 100.

[0050] Furthermore, by forming the sealing materials 125 and 126 in a two-stage structure, it is possible to use different materials for the sealing materials 125 and 126 at the bonding surface with the mounting substrate 121 and at the bonding surface with the transparent substrate 127. This makes it possible to select the materials for the sealing materials 125 and 126 so as to be compatible with the physical properties of the mounting substrate 121 and the transparent substrate 127, respectively, thereby improving the reliability of the package 100.

[0051] 2. Second Embodiment In the first embodiment described above, the sealing materials 125 and 126 are disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128, and are formed continuously. In this second embodiment, the sealing material is disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128, and an opening is formed on the side of the sealing material.

[0052] 6 is a diagram showing an example of the configuration of a package according to the second embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of the package 200, and "b" in the figure is a plan view showing the example of the configuration of the package 200. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0053] In the figure, this package 200 is provided with a sealing material 226 instead of the sealing material 126 of the first embodiment described above. The other configuration of the package 200 of the second embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0054] The sealing material 226 is located on the sealing material 125. An opening 201 is formed on the side of the sealing material 226. The opening 201 can vent the inside of the package 200. At this time, it is possible to suppress an increase in internal pressure during reflow of the package 200. The opening 201 needs to be located in at least one place on the side of the sealing material 226. Other configurations of the sealing material 226 of the second embodiment are similar to the configuration of the sealing material 126 of the first embodiment described above.

[0055] As described above, in the second embodiment, the opening 201 is formed on the side surface of the sealing material 226 that is disposed away from the chip 111, the rib 124, and the die bond material 128. This makes it possible to suppress an increase in internal pressure during reflow of the package 200, and reduce damage to the package 200 during reflow.

[0056] 3. Third Embodiment In the above-described first embodiment, the sealing materials 125 and 126 are disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128, and the transparent substrate 127 is disposed on the sealing material 126. In this third embodiment, the transparent substrate is disposed inside the sealing material at a distance from the chip 111, the rib 124, and the die bonding material 128.

[0057] 7 is a diagram showing an example of the configuration of a package according to the third embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of the package 300, and "b" is a plan view showing the example of the configuration of the package 300. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0058] In the figure, this package 300 includes a sealing material 326 and a transparent substrate 327 instead of the sealing material 126 and the transparent substrate 127 of the first embodiment described above. The other configuration of the package 300 of the third embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0059] The transparent substrate 327 is placed on the chip 111. At this time, the transparent substrate 327 is supported on the mounting substrate 121 via the ribs 124 and is bonded to the mounting substrate 121. The position of the outer peripheral surface of the transparent substrate 327 can be made equal to the position of the inner peripheral surface of the sealing material 326. The size of the transparent substrate 327 may be equal to the size of the chip 111. Other configurations of the transparent substrate 327 are the same as the configuration of the transparent substrate 127 of the first embodiment described above.

[0060] The sealing material 326 is located on the sealing material 125 and can be bonded to the side surface of the transparent substrate 327. The sealing material 326 is located on the sealing material 125 so as to be spaced apart from the chip 111, the rib 124, and the die bond material 128. The sealing material 326 can be disposed continuously along the outer periphery of the transparent substrate 327. Other configurations of the sealing material 326 are similar to those of the sealing material 126 of the first embodiment described above.

[0061] In this way, in the third embodiment described above, the transparent substrate 327 is supported via the side surface of the sealing material 326 that is spaced apart from the chip 111, the rib 124, and the die bond material 128. This eliminates the need to expand the transparent substrate 327 onto the sealing material 326, and allows the size of the transparent substrate 327 to be reduced.

[0062] In the package 300 of the third embodiment described above, the opening 201 of the second embodiment described above may be formed on a side surface of the sealing material 326. In addition, the package 300 of the third embodiment described above may not have the rib 124.

[0063] 4. Fourth Embodiment In the first embodiment described above, the sealing materials 125 and 126 are spaced apart from the chip 111, the rib 124, and the die bonding material 128 and are disposed on the mounting substrate 121, and the size of the transparent substrate 127 is made smaller than the size of the mounting substrate 121. In this fourth embodiment, the sealing materials 125 and 126 are spaced apart from the chip 111, the rib 124, and the die bonding material 128 and are disposed on the mounting substrate 121, and the size of the transparent substrate is made equal to the size of the mounting substrate 121.

[0064] 8 is a diagram showing an example of the configuration of a package according to the fourth embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of the package 400, and "b" in the figure is a plan view showing the example of the configuration of the package 400. "a" in the figure shows the example of the configuration cut along the A1-A2 line in "b" in the figure.

[0065] In the figure, this package 400 includes a transparent substrate 427 instead of the transparent substrate 127 of the first embodiment described above. The other configuration of the package 400 of the fourth embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0066] The transparent substrate 427 is disposed on the chip 111. At this time, the transparent substrate 427 is supported on the mounting substrate 121 via the ribs 124 and bonded to the mounting substrate 121. The positions of the horizontal side surfaces of the transparent substrate 427 can be aligned with the positions of the horizontal side surfaces of the mounting substrate 121. At this time, the horizontal side surfaces of the transparent substrate 427, the sealing materials 125 and 126, and the mounting substrate 121 can be configured as dicing surfaces. Here, the planar size of the transparent substrate 427 can be made equal to the planar size of the mounting substrate 121. Other configurations of the transparent substrate 427 are the same as the configuration of the transparent substrate 127 of the first embodiment described above.

[0067] As described above, in the fourth embodiment, the sealing materials 125 and 126 are disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bond material 128, and the size of the transparent substrate 427 is made equal to the size of the mounting substrate 121. This allows the transparent substrate 427 to be solidified together with the sealing materials 125 and 126 and the mounting substrate 121. This eliminates the need to dispose the transparent substrate 427 individually in the package 400, and the process of disposing the transparent substrate 427 can be made more efficient.

[0068] In the package 400 of the fourth embodiment, the opening 201 of the second embodiment may be formed on the side surface of the sealing material 126. In addition, the package 400 of the fourth embodiment may not have the rib 124.

[0069] 5. Fifth Embodiment In the above-described first embodiment, the sealing materials 125 and 126 are spaced apart from the chip 111, the rib 124, and the die bonding material 128 and are disposed on the mounting substrate 121. In this fifth embodiment, the sealing material 125 is spaced apart from the chip 111, the rib 124, and the die bonding material 128 and is disposed on the mounting substrate 121, and the sealing material 125 is also spaced apart from the transparent substrate 127.

[0070] 9 is a diagram showing an example of the configuration of a package according to the fifth embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of a package 500, and "b" is a plan view showing the example of the configuration of the package 500. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0071] In the figure, this package 500 includes a transparent substrate 527 instead of the transparent substrate 127 of the first embodiment described above. Furthermore, this package 500 is obtained by removing the sealing material 126 from the package 100 of the first embodiment described above. Other configurations of the package 500 of the fifth embodiment are similar to those of the package 100 of the first embodiment described above.

[0072] The transparent substrate 527 is disposed on the chip 111. At this time, the transparent substrate 527 is supported on the mounting substrate 121 via the ribs 124 and is bonded to the mounting substrate 121. The transparent substrate 527 is separated from the sealing material 125. At this time, the size of the transparent substrate 527 can be smaller than the size of the mounting substrate 121. The size of the transparent substrate 527 may be equal to the size of the chip 111. Other configurations of the transparent substrate 527 are the same as the configuration of the transparent substrate 127 of the first embodiment described above.

[0073] As described above, in the fifth embodiment, the sealing material 125 is disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bond material 128, and the sealing material 125 is also separated from the transparent substrate 127. This prevents stress from being applied to the transparent substrate 127 from the sealing material 125, reduces damage to the transparent substrate 127, and allows the step of forming the sealing material 126 to be omitted.

[0074] 6. Sixth Embodiment In the first embodiment described above, the sealing materials 125 and 126 are arranged on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128. In this sixth embodiment, the sealing materials 125 and 126 are arranged on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128, and a step for positioning the sealing material 125 is formed on the mounting substrate.

[0075] 10 is a diagram showing an example of the configuration of a package according to the sixth embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration of a package 600, and "b" in the figure is a plan view showing the example of the configuration of the package 600. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0076] In the figure, this package 600 includes a mounting substrate 621 instead of the mounting substrate 121 of the first embodiment described above. The other configuration of the package 600 of the sixth embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0077] The chip 111 is mounted on the mounting substrate 621. A step 601 is formed on the mounting substrate 621. The step 601 can position the sealing material 125. In this case, the step 601 can be formed on the outside of the chip 111 so as to surround the periphery of the chip 111. The bonding pad 122 can be arranged on the outside of the step 601.

[0078] The sealing material 125 can be formed from the step 601 to the outer edge of the mounting substrate 621. At this time, the step 601 can prevent the sealing material 125 from flowing toward the chip 111. The sealing material 125 may cover the step 601.

[0079] As described above, in the sixth embodiment, the sealing materials 125 and 126 are disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128, and the step 601 for positioning the sealing material 125 is formed on the mounting substrate 621. This makes it possible to prevent the sealing material 125 from shifting in position, and to reduce the distance for separating the sealing material 125 from the chip 111 and the die bonding material 128.

[0080] In the package 600 of the sixth embodiment, the opening 201 of the second embodiment may be formed on a side surface of the sealing material 125. In the package 600 of the sixth embodiment, the rib 124 may be omitted. In the package 600 of the sixth embodiment, the sealing material 126 and the transparent substrate 127 may be replaced by the sealing material 326 and the transparent substrate 327 of the third embodiment. In the package 600 of the sixth embodiment, the transparent substrate 127 may be replaced by the transparent substrate 427 of the fourth embodiment.

[0081] 7. Seventh Embodiment In the first embodiment described above, the two-stage sealing materials 125 and 126 are arranged on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128. In the seventh embodiment, the one-stage sealing material is arranged on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bonding material 128.

[0082] 11 is a diagram showing an example of the configuration of a package according to the seventh embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of the package 700, and "b" is a plan view showing the example of the configuration of the package 700. "a" in the figure shows the example of the configuration cut along the A1-A2 line in "b" in the figure.

[0083] In the figure, this package 700 includes a sealing material 725 instead of the sealing materials 125 and 126 of the first embodiment described above. The other configuration of the package 700 of the seventh embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0084] The encapsulant 725 encapsulates a portion of the bonding wire 116 on the mounting substrate 121. In this case, the encapsulant 725 may encapsulate the joint between the bonding wire 116 and the bonding pad 122 on the mounting substrate 121. The encapsulant 725 is positioned on the mounting substrate 121 so as to be spaced apart from the chip 111, the rib 124, and the die bond material 128. The encapsulant 726 may also be adhered to the transparent substrate 127. In this case, the encapsulant 726 may cover the lower side of the transparent substrate 127. The encapsulant 725 may be disposed continuously along the outer periphery of the mounting substrate 121. Other configurations of the encapsulant 725 are the same as those of the encapsulant 125 of the first embodiment described above.

[0085] As described above, in the seventh embodiment, the one-stage sealing material 725 is disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bond material 128. This simplifies the configuration of the sealing material 725 between the mounting substrate 121 and the transparent substrate 127, thereby reducing the cost of the package 700.

[0086] The package 700 of the seventh embodiment described above may not have the rib 124. Furthermore, in the package 700 of the seventh embodiment described above, the transparent substrate 127 may be replaced by the transparent substrate 327 of the third embodiment described above, and a sealing material 725 may be disposed on the side surface of the transparent substrate 327.

[0087] 8. Eighth Embodiment In the first embodiment described above, the sealing materials 125 and 126 are spaced apart from the chip 111, the rib 124, and the die bonding material 128 and are disposed on the mounting substrate 121, and the lower side of the side of the transparent substrate 127 is covered with the sealing material 126. In this eighth embodiment, the sealing material is spaced apart from the chip 111, the rib 124, and the die bonding material 128 and is disposed on the mounting substrate 121, and the upper end of the transparent substrate 127 is covered with the sealing material.

[0088] 12 is a diagram showing an example of the configuration of a package according to the eighth embodiment. In the figure, "a" is a cross-sectional view showing the example of the configuration of a package 800, and "b" is a plan view showing the example of the configuration of the package 800. "a" in the figure shows the example of the configuration cut along line A1-A2 in "b" in the figure.

[0089] In the figure, this package 800 includes a sealing material 826 instead of the sealing material 126 of the first embodiment described above. The other configuration of the package 800 of the eighth embodiment is similar to the configuration of the package 100 of the first embodiment described above.

[0090] The sealing material 826 can be positioned on the sealing material 125 and adhered to the transparent substrate 127. The sealing material 826 can cover the lower and upper ends of the transparent substrate 127. In this case, the sealing material 826 can extend from the side surfaces of the transparent substrate 127 onto the upper surface of the transparent substrate 127. The sealing material 826 is positioned on the sealing material 125 so as to be spaced apart from the chip 111, the rib 124, and the die bond material 128. The sealing material 826 can be disposed continuously along the outer periphery of the mounting substrate 121. Other configurations of the sealing material 826 are similar to those of the sealing material 126 of the first embodiment described above.

[0091] As described above, in the eighth embodiment, the sealing materials 125 and 826 are disposed on the mounting substrate 121 at a distance from the chip 111, the rib 124, and the die bond material 128, and the upper end of the transparent substrate 127 is covered with the sealing material 826. This makes it possible to protect the upper end of the transparent substrate 127 with the sealing material 826, thereby reducing cracks in the transparent substrate 127.

[0092] In the package 800 of the eighth embodiment, the opening 201 of the second embodiment may be formed on a side surface of the sealing material 826. In the package 800 of the eighth embodiment, the rib 124 may be omitted. In the package 800 of the eighth embodiment, the mounting substrate 621 of the sixth embodiment may be used instead of the mounting substrate 121. In the package 800 of the eighth embodiment, the sealing material 826 may be formed using the sealing material 125.

[0093] 9. Application Examples to Mobile Bodies The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0094] FIG. 13 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0095] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 13, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0096] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0097] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0098] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0099] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0100] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0101] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0102] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0103] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0104] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to vehicle occupants or the outside of the vehicle. In the example of Fig. 13, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0105] FIG. 14 is a diagram showing an example of the installation position of the imaging unit 12031.

[0106] In FIG. 14, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0107] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0108] 14 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0109] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0110] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which runs autonomously without relying on driver operation.

[0111] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0112] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0113] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 12031 of the above-described configuration. Specifically, for example, each of the packages 100 to 800 according to the above-described embodiment can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the vehicle control system 12000, the reliability of the imaging unit 12031 can be improved.

[0114] Note that the above-described embodiment shows an example for realizing the present technology, and the matters in the embodiment and the matters specifying the invention in the claims correspond to each other. Similarly, the matters specifying the invention in the claims and the matters in the embodiment of the present technology with the same title correspond to each other. However, the present technology is not limited to the embodiment, and can be realized by applying various modifications to the embodiment within the scope of the gist. Furthermore, the effects described in this specification are merely examples and are not limited, and other effects may also be present.

[0115] The present technology may also be configured as follows: (1) A package comprising: a chip; a substrate on which the chip is mounted; bonding wires connecting the chip to the substrate; a lid located on the chip and spaced apart from the chip; and an encapsulant located on the substrate and spaced apart from the chip, encapsulating a portion of the bonding wires on the substrate. (2) The package according to (1), wherein the lid is a transparent member. (3) The package according to (1) or (2), wherein the package comprises bonding pads formed on the substrate and to which the bonding wires are connected, the encapsulant encapsulating a joint between the bonding wires and the bonding pads. (4) The package according to any of (1) to (3), wherein the lid is disposed inside the encapsulant. (5) The package according to any of (1) to (4), wherein the encapsulant comprises: a first resin layer located on the substrate; and a second resin layer located on the first resin layer. (6) The package according to (5), wherein the second resin layer has a lower elastic modulus than the first resin layer. (7) The package according to (5), wherein the first resin layer has a lower thermal expansion coefficient than the second resin layer. (8) The package according to any one of (1) to (7), wherein the encapsulant has a thixotropy ratio of 1 or more. (9) The package according to any one of (1) to (8), further comprising: an opening provided on a side surface of the encapsulant. (10) The package according to any one of (1) to (9), further comprising: a rib positioned on the chip and supporting the lid. (11) The package according to (10), wherein the rib and the encapsulant are spaced apart. (12) The package according to (10) or (11), further comprising: a first hollow portion formed inside the rib; and a second hollow portion formed between the encapsulant and the rib. (13) The package according to any one of (10) to (12), further comprising a pad electrode formed on the chip and connected to the bonding wire, wherein the junction between the pad electrode and the bonding wire is covered with the rib.(14) The package according to any one of (1) to (13), further comprising a die bond material that bonds the chip to the substrate. (15) The package according to (14), wherein the die bond material and the sealing material are spaced apart. (16) A method for manufacturing a package, comprising: a step of die-bonding a chip onto a substrate, a step of connecting the chip and the substrate via a bonding wire, a step of forming a first resin layer on the substrate at a distance from the chip, a step of forming a second resin layer on the first resin layer at a distance from the chip, the second resin layer having a lower elastic modulus than the first resin layer, a step of forming a rib on the chip at a distance from the first resin layer and the second resin layer, and a step of disposing a lid on the rib at a distance from the chip.

[0116] REFERENCE SIGNS LIST 100 Package 111 Chip 112 Light receiving area 113 Pad electrode 114 Color filter 115 On-chip lens 116 Bonding wire 121 Mounting substrate 122 Bonding pad 123 Land electrode 124 Rib 125, 126 Sealing material 127 Transparent substrate 128 Die bond material

Claims

1. A package comprising: a chip; a substrate on which the chip is mounted; bonding wires connecting the chip and the substrate; a lid located on the chip and spaced apart from the chip; and an encapsulant located on the substrate and spaced apart from the chip, encapsulating a portion of the bonding wires on the substrate.

2. The package according to claim 1, wherein the lid is a transparent member.

3. The package according to claim 1, further comprising a bonding pad formed on the substrate and to which the bonding wire is connected, and the encapsulant encapsulates the junction between the bonding wire and the bonding pad.

4. The package according to claim 1, wherein the lid is disposed inside the encapsulant.

5. The package according to claim 1, wherein the sealing material comprises: a first resin layer positioned on the substrate; and a second resin layer positioned on the first resin layer.

6. The package according to claim 5, wherein the second resin layer has a lower modulus of elasticity than the first resin layer.

7. The package according to claim 5, wherein the first resin layer has a lower coefficient of thermal expansion than the second resin layer.

8. The package according to claim 1, wherein the thixotropy ratio of the encapsulant is 1 or greater.

9. The package of claim 1, further comprising an opening provided in a side surface of the encapsulant.

10. The package of claim 1, further comprising a rib located on the chip and supporting the lid.

11. The package of claim 10, wherein the rib and the sealing material are spaced apart.

12. The package according to claim 10, further comprising: a first hollow portion formed inside the rib; and a second hollow portion formed between the sealing material and the rib.

13. The package according to claim 10, further comprising a pad electrode formed on the chip and connected to the bonding wire, the junction between the pad electrode and the bonding wire being covered with the rib.

14. The package of claim 1, further comprising a die bond material bonding said chip to said substrate.

15. The package according to claim 14, wherein the die bond material and the encapsulant are spaced apart.

16. A method for manufacturing a package, comprising the steps of: die-bonding a chip onto a substrate; connecting the chip and the substrate via bonding wires; forming a first resin layer on the substrate at a distance from the chip; forming a second resin layer on the first resin layer at a distance from the chip, the second resin layer having a lower elastic modulus than the first resin layer; forming a rib on the chip at a distance from the first resin layer and the second resin layer; and positioning a lid on the rib at a distance from the chip.

Images